Cooling device and liquid-cooled power electronics assembly comprising such cooling device

Abstract

A cooling device (1) for use with a liquid-cooled power electronic (20) is disclosed. The cooling device (1) is configured to transfer heat from a heat generating source (20) to a coolant (30). The cooling device (1) comprises a surface (26) comprising a plurality of heat-conducting needles (4, 4', 4'') extending substantially perpendicular to the surface (26). The needles (4, 4', 4'') are arranged and configured to transfer heat from the heat generating source (20) to the coolant (30). The surface (26) comprises a first side (6) and an opposite second side (8), wherein the needles (4, 4', 4'') are arranged in an area extending between the first side (6) and the opposite second side (8). The needles (4', 4'') in a first outermost area (50) at the first side (6) and a second outermost area (50') at the second side (8) are rotated relative to the needles (4) arranged between said outermost areas (50, 50').

Description

Technical Field

[0001] This invention relates to a cooling device for use with liquid-cooled power electronic devices. The invention also relates to a liquid-cooled power electronic assembly including the cooling device according to the invention. Background Technology

[0002] Cooling devices with pins for liquid cooling applications, particularly power electronics (such as substrates), are a proven thermal management solution. These cooling devices are typically designed to enhance heat dissipation from electronic components by improving the interaction between the cooling fluid and the heat source.

[0003] The needles are integrated or attached to the cooling device and arranged in various geometries. Common arrangements include square grids, staggered patterns, and radial layouts, depending on the heat source and fluid flow requirements.

[0004] The needles can be cylindrical, square, conical, or finned. The height, diameter, and spacing of the needles are optimized to balance pressure drop and heat transfer efficiency.

[0005] Compared to flat plates, needles significantly increase the surface area available for heat transfer. Furthermore, the presence of needles disrupts the laminar flow of the coolant, generating localized turbulence, thereby improving the heat transfer coefficient. Additionally, needles guide the coolant closer to the heat source, thus reducing thermal resistance. Therefore, using needles is a practical method for improving the thermal performance of a substrate.

[0006] Cooling devices such as substrates are well-suited for liquid cooling of power electronic modules, such as IGBTs (Insulated Gate Bipolar Transistors), MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistors), and diodes. Applications may include central processing units, graphics processing units in high-performance computing systems, cooling systems in electric vehicles, and thermal management in renewable energy inverters.

[0007] Cooling devices, such as substrates, are typically made of thermally conductive materials such as aluminum, copper, or alloys thereof. Some designs include surface treatments or coatings (e.g., nickel plating) to prevent corrosion and improve durability in liquid environments. A typical way to provide a coating to prevent corrosion is nickel plating, in which the substrate is immersed in a nickel plating bath. If the cooling structure of such a substrate has recessed geometry, bubbles may form during the plating process, or liquid residue left in the recessed geometry when the substrate is removed from the plating bath may interfere with the formation of a sufficient nickel layer. Therefore, providing an alternative that reduces the amount of such residue would be significantly advantageous.

[0008] Therefore, there is a need for a cooling device (e.g., a substrate) that reduces or even eliminates the aforementioned drawbacks of the prior art. Summary of the Invention

[0009] The object of the present invention can be achieved by the cooling device and liquid-cooled power electronic components described below. Preferred embodiments are explained in the following description and shown in the accompanying drawings.

[0010] The cooling device according to the invention is a cooling device for use with liquid-cooled power electronic devices, wherein the cooling device is configured to transfer heat from a heat source to a coolant, wherein the cooling device includes a surface including a plurality of heat-conducting needles extending substantially perpendicular to the surface, wherein the needles are arranged and configured to transfer heat from the heat source to the coolant, wherein the surface includes a first side and an opposing second side, wherein the needles are arranged in a region extending between the first side and the opposing second side, wherein the needles in a first outermost region on the first side and a second outermost region on the second side rotate relative to the needles arranged between the outermost regions.

[0011] Therefore, an alternative solution can be provided in which the quality of nickel plating can be avoided. The cooling device according to the invention is suitable for use with various types of liquid-cooled power electronic devices, including power electronic modules such as IGBTs, MOSFETs, and diodes.

[0012] The needles in the first outermost region on the first side and in the second outermost region on the second side rotate relative to the needles arranged between the outermost regions.

[0013] In one embodiment, the needles in the first outermost region on the first side and the second outermost region on the second side are rotated relative to all the needles arranged between the outermost regions.

[0014] In one embodiment, the needles in the first outermost region on the first side and the second outermost region on the second side rotate relative to the majority of needles arranged between the outermost regions. In this embodiment, it is still possible for one or more needles to: A) be arranged between the outermost regions; or B) not rotate relative to the needles in the first outermost region on the first side and the second outermost region on the second side. Even though one or more needles arranged between the outermost regions do not rotate relative to the needles in the first outermost region on the first side and the second outermost region on the second side, the "reflection effect" of the needles in the first outermost region and the needles in the second outermost region is still maintained.

[0015] In one embodiment, the needles in the first outermost region on the first side and the second outermost region on the second side rotate relative to a subset of the needles arranged between the outermost regions. In this embodiment, the needles in the remaining subset arranged between the outermost regions do not rotate relative to the needles in the first outermost region on the first side and the second outermost region on the second side. Even though the remaining subset arranged between the outermost regions does not rotate relative to the needles in the first outermost region on the first side and the second outermost region on the second side, the "reflection effect" of the needles in the first outermost region and the second outermost region is still maintained.

[0016] Thermally conductive pins that extend substantially perpendicular to the second surface typically have a shape that can be made in the following ways:

[0017] - Ingot casting, - Forging, - Machining, or - Sintering.

[0018] Needles typically have a cross-section that is uniform or slightly reduced along the length of the needle.

[0019] In one embodiment, the needles have the same cross-section.

[0020] In one embodiment, the needles in the first outermost region have the same cross-section.

[0021] In one embodiment, the needles in the second outermost region have the same cross-section.

[0022] In one embodiment, the needles arranged between the outermost regions have two different cross-sections. In another embodiment, the needles arranged between the outermost regions are arranged along a line, wherein needles on adjacent lines have different cross-sections.

[0023] In one embodiment, the needle has an elliptical cross-section having a major axis ranging from 2.0 mm to 3.0 mm and a minor axis ranging from 0.8 mm to 1.2 mm. In one embodiment, the major axis is ranging from 2.4 mm to 2.6 mm and the minor axis is ranging from 0.9 mm to 1.1 mm. In one embodiment, the major axis is 2.5 mm and the minor axis is ranging from 1.0 mm. In one embodiment, the needle has an elliptical cross-section, wherein the ratio between the major axis and the minor axis is in the range of 2:1 to 3:1.

[0024] In one embodiment, the cross-section of the needle is racetrack-shaped (a two-dimensional geometry consisting of a rectangle and semicircles on a pair of opposite sides). The cross-section of the additional needle (arranged outside the outermost region) has a longitudinal axis extending parallel to the transverse axis of the substrate.

[0025] In one embodiment, the needles in the first outermost region on the first side and the second outermost region on the second side have cross sections, the longitudinal axis of which forms an angle α with the transverse axis of the substrate, which is 10 to 80 degrees, preferably 20 to 70 degrees.

[0026] In one embodiment, the outermost needles arranged along the first side and along the second side are rotated relative to the needles arranged adjacent to the outermost needles.

[0027] In one embodiment, the substrate is rectangular.

[0028] In one embodiment, the substrate is square.

[0029] In one embodiment, the first outermost region is divided into a plurality of spaced-out outermost region portions.

[0030] In one embodiment, the second outermost region is divided into a plurality of spaced-out outermost region portions.

[0031] In one embodiment, the outermost needle is rotated relative to all the remaining needles.

[0032] In one embodiment, all remaining needles have the same rotation angle and orientation.

[0033] In one embodiment, all needles have the same geometry and size.

[0034] In one embodiment, the outermost needle is rotated 10 to 80 degrees relative to the needles arranged adjacent to it.

[0035] In one embodiment, the outermost needle is rotated 20 to 60 degrees relative to the needles arranged adjacent to it.

[0036] In one embodiment, the needles in the first outermost region on the first side and the second outermost region on the second side are rotated 10 to 80 degrees relative to the needles arranged between the outermost regions.

[0037] In one embodiment, the needles in the first outermost region on the first side and the second outermost region on the second side are rotated 20 to 60 degrees relative to the needles arranged between the outermost regions.

[0038] In one embodiment, the needles in the first outermost region on the first side and the second outermost region on the second side are rotated 30 to 50 degrees relative to the needles arranged between the outermost regions.

[0039] In one embodiment, the needle has a cross-section that is symmetrical about the longitudinal axis of the cross-section.

[0040] The substrate according to the invention is a substrate for use with liquid-cooled power electronic devices, wherein the substrate is configured to transfer heat from a heat source to a coolant, and wherein the substrate includes a plate structure having: - The first surface is configured to be thermally connected to a heat source. - A second surface, comprising a plurality of heat-conducting pins extending substantially perpendicular to the second surface, wherein the pins are arranged and configured to transfer heat from a heat source to a coolant. The plate structure includes a first side and an opposite second side, wherein a needle is arranged in a region extending between the first side and the opposite second side. In this context, the needles in the first outermost region on the first side and the second outermost region on the second side rotate relative to the needles arranged between the outermost regions.

[0041] Therefore, an alternative substrate can be provided in which the quality of nickel plating can be avoided.

[0042] In one embodiment: - The first (reinforcing) wall extends between the first side and the opposite second side. - A second (reinforcing) wall, spaced apart from the first wall, extends between the first side and the opposite second side. The first wall and the second wall extend substantially perpendicular to the second surface.

[0043] In one embodiment, the first wall is parallel to the second wall.

[0044] In one embodiment, the length L of the first wall is shorter than the width M of the region with the needle.

[0045] In one embodiment, the length L of the second wall is shorter than the width M of the region with the needle.

[0046] In one embodiment, a minimum distance is provided between the needles, wherein the minimum distance is in the range of 0.4 mm to 2.0 mm.

[0047] In one embodiment, the minimum distance is in the range of 0.5 mm to 1.5 mm.

[0048] In one embodiment, the minimum distance is in the range of 0.6 mm to 1.2 mm.

[0049] In one embodiment, the minimum distance is in the range of 0.8 mm to 1.0 mm.

[0050] In one embodiment, the minimum distance is 0.9 mm.

[0051] In one embodiment, the needles are arranged in rows, wherein every other row has the same number of needles and is oriented in the same direction, wherein the outermost row has one more needle than the second outermost row.

[0052] In one embodiment, the needles in each row are evenly distributed.

[0053] In one embodiment, the needles are arranged in columns, wherein adjacent columns are offset relative to each other.

[0054] In one embodiment, every other column has the same number of needles and they are oriented in the same direction.

[0055] In one embodiment, the number of needles in the outermost column on the first side and the opposite second side is one more than the number of needles in the second outermost column.

[0056] In one embodiment, the needles in each column are evenly distributed.

[0057] In one embodiment, the needle has an elliptical cross-section, wherein the semi-major axis is in the range of 1 mm to 3 mm.

[0058] In one embodiment, the needle has an elliptical cross-section, wherein the minor axis is in the range of 0.3 mm to 0.8 mm.

[0059] In one embodiment, the semi-major axis is in the range of 1.2 mm to 1.3 mm.

[0060] In one embodiment, the short half-axis is in the range of 0.4 mm to 0.6 mm.

[0061] In one embodiment, the semi-major axis is 1.25 mm.

[0062] In one embodiment, the semi-minor axis is 0.5 mm.

[0063] In one embodiment, the needle has a geometric shape selected from square, triangle, circle, rhombus, rectangle and ellipse.

[0064] In one embodiment, the substrate has a variable needle density (number of needles per unit area). Therefore, a higher needle density can be provided in areas with higher heat flux, and a lower density can be provided in areas with lower heat flux.

[0065] In one embodiment, the substrate has a rectangular shape having two short edges and two long edges, wherein an angled needle in a first outermost region on a first side extends along one of the long edges.

[0066] In one embodiment, the substrate has a rectangular shape having two short edges and two long edges, wherein an angled needle in the second outermost region on the second side extends along one of the long edges.

[0067] Cooling devices (e.g., designed as substrates) can be made in a variety of ways, including stamping, forging, machining or metal sintering, 3D printing, or molding (a manufacturing process in which molten or semi-molten metal is poured or injected into a pre-designed mold cavity to form a specific configuration. This process cools and solidifies the metal, thereby forming a part with the desired shape and size).

[0068] The term "molded" is also associated with the molded package 72 on page 15, which refers to the electrically insulating package structure surrounding the electronic components and the top of the substrate. The term "molded" needs to be clearly defined in the specification.

[0069] In one embodiment, the substrate includes two spaced-apart reinforcing walls, wherein the pin is disposed between the reinforcing walls.

[0070] In one embodiment, a reinforcing wall is provided and the reinforcing wall extends along the short edge of the substrate.

[0071] In one embodiment, a reinforcing wall is provided and the reinforcing wall extends along the long edge of the substrate.

[0072] The reinforced walls are configured to increase stiffness and reduce warping.

[0073] In one embodiment, a first group of needles arranged between the outermost regions has a first size, and a second group of needles arranged between the outermost regions has a second size.

[0074] In one embodiment, a first group of needles arranged between the outermost regions has a first orientation, and a second group of needles arranged between the outermost regions has a second orientation.

[0075] In one embodiment, the substrate includes a first outermost region, in which a plurality of pins are arranged, wherein the pins are arranged along two parallel lines extending parallel to the transverse axis of the substrate. In another embodiment, adjacent pins in two rows are offset from each other along the longitudinal axis and the transverse axis of the substrate.

[0076] The liquid-cooled power electronic component according to the present invention is a liquid-cooled power electronic component, comprising: - The cooling device according to the present invention, - A cooler, including an external inlet for receiving coolant and an external outlet for discharging coolant, wherein the cooler includes a cooling tray defining an enclosed volume, the cooling tray having an internal inlet and an internal outlet for guiding coolant flow through the enclosed volume and into contact with the needle of the cooling device; - A power electronics module is arranged on top of the cooler, wherein a substrate is sandwiched between the cooler and the power electronics module.

[0077] In one embodiment, the liquid-cooled power electronics assembly includes a seal disposed in a cooling tray, wherein the seal surrounds a needle and seals against the cooling device to prevent coolant from escaping from the cooling tray without flowing through the internal inlet or internal outlet.

[0078] In one embodiment, the power electronics module is mounted using two brackets extending along both sides of the substrate, wherein the walls extend perpendicularly to the brackets.

[0079] In one embodiment, the internal inlet and internal outlet are formed as slots extending parallel to the wall. Attached Figure Description

[0080] The invention will be more fully understood from the detailed description given below. The accompanying drawings are given by way of illustration only and therefore do not limit the invention. In the drawings: Figure 1 A schematic side view of the substrate according to the present invention is shown; Figure 2 An exploded view of the power electronics module according to the present invention is shown; Figure 3 The coolant flow pattern in the substrate according to the present invention is shown; Figure 4A A cross-sectional view of a portion of the substrate according to the present invention is shown; Figure 4B A cross-sectional view of a portion of another substrate according to the present invention is shown; Figure 5A A top view of the substrate according to the present invention is shown; Figure 5B It shows Figure 5A A cross-sectional view of the substrate shown; Figure 6A A top view of the substrate according to the present invention is shown; Figure 6B A top view of another substrate according to the present invention is shown; Figure 7A A top view of another substrate according to the present invention is shown; Figure 7B A top view of yet another substrate according to the present invention is shown; Figure 8A A top view of another substrate according to the present invention is shown; Figure 8B A top view is shown of a cooler adapted to accommodate three substrates according to the invention; Figure 9A A perspective view is shown of a cooler configured to house a substrate according to the invention; Figure 9B It shows Figure 9A The cooler shown is a top view; Figure 10A A schematic cross-sectional view of the cooling device according to the present invention is shown; Figure 10B A schematic cross-sectional view of another cooling device according to the present invention is shown; Figure 10C It shows Figure 10A A schematic exploded perspective view of the cooling device shown; Figure 10D It shows Figure 10B A schematic exploded perspective view of the cooling device shown; Figure 11A A top view of the substrate according to the present invention is shown; and Figure 11B A top view of another substrate according to the present invention is shown. Detailed Implementation

[0081] Preferred embodiments of the invention will now be described in detail with reference to the accompanying drawings. Figure 1 The substrate 2 of the present invention is shown in the figure.

[0082] Figure 1 A schematic side view of a substrate 2 according to the invention is shown. The substrate 2 is designed for use with liquid-cooled power electronics. The substrate 2 includes a first surface (not shown) configured to be thermally connected to a heat source (not shown); and an opposing second surface 26 including a plurality of heat-conducting pins 4, 4', 4'' extending substantially perpendicular to the plane of the second surface 26. The pins 4, 4', 4'' are arranged and configured to transfer heat from the heat source to a coolant (not shown) surrounding the pins 4, 4', 4''.

[0083] The substrate 2 includes a first side 6 and an opposite second side 8, wherein pins 4, 4', 4'' are arranged in a region extending between the first side 6 and the opposite second side 8.

[0084] The substrate 2 includes a first outermost region 50 disposed on a first side 6. A first segment of the pin 4' is disposed in the first outermost region 50.

[0085] The substrate 2 includes a second outermost region 50' disposed on the second side 8. A second segment of the pin 4'' is disposed in the second outermost region 50'.

[0086] The needle 4' in the first outermost region 50 rotates relative to the additional needle 4 arranged outside the outermost regions 50, 50'.

[0087] The needle 4'' in the second outermost region 50' rotates relative to the additional needle 4 arranged outside the outermost regions 50, 50'.

[0088] The term "rotation relative to" means that the needle rotates about its own longitudinal axis (the axis perpendicular to the second surface 26). Rotation can also be referred to as angular displacement.

[0089] In one embodiment, the longitudinal axes of all needles 4, 4', 4'' are parallel.

[0090] In one embodiment, the rotation angle is in the range of 10 degrees to 70 degrees. In one embodiment, the rotation angle is in the range of 20 degrees to 60 degrees. In one embodiment, the rotation angle is in the range of 30 degrees to 50 degrees. In one embodiment, the rotation angle is in the range of 35 degrees to 45 degrees.

[0091] The second surface 26 extends along a plane that crosses the first (longitudinal) axis N1 and the second (transverse) axis N2. The normal axis N3 of the second surface 26 is... Figure 1 As shown in the diagram, it can be seen that the longitudinal axes of all needles 4, 4', and 4'' extend along the normal axis N3 of the second surface 26. Therefore, all needles 4, 4', and 4'' extend perpendicularly from the second surface 26.

[0092] Therefore, while extending perpendicularly to the second surface 26, the needle 4' in the first outermost region 50 rotates by a specified angle about its own axis relative to the additional needle 4 arranged outside the outermost regions 50, 50'. Similarly, while extending perpendicularly to the second surface 26, the needle 4'' in the second outermost region 50 rotates by a specified angle about its own axis relative to the additional needle 4 arranged outside the outermost regions 50, 50'.

[0093] Additional needles 4, located outside the outermost regions 50 and 50', are arranged along alternating rows R1 and R2, which are offset along both the longitudinal axis N1 and the transverse axis N2.

[0094] Additional needles 4, located outside the outermost regions 50 and 50', are arranged along alternating columns C1 and C2, which are offset along both the longitudinal axis N1 and the transverse axis N2.

[0095] The substrate 2 includes a first reinforcing wall 10 disposed next to the additional pin 4, which is located outside the outermost regions 50 and 50'. The substrate 2 also includes a second reinforcing wall 12 disposed next to the additional pin 4, which is located outside the outermost regions 50 and 50'. The second reinforcing wall 12 is positioned on the second surface 26 of the substrate 2 at the end opposite to the first reinforcing wall 10.

[0096] In one embodiment, the substrate 2 is used in a configuration in which coolant enters through an inlet disposed between the first reinforcing wall 10 and adjacent additional pins 4 disposed outside the outermost regions 50, 50', and exits through an outlet disposed between the second reinforcing wall 12 and adjacent additional pins 4 disposed outside the outermost regions 50, 50'.

[0097] In one embodiment, the substrate 2 is configured such that coolant enters through an inlet disposed between the second reinforcing wall 12 and adjacent additional pins 4 disposed outside the outermost regions 50, 50', and exits through an outlet disposed between the first reinforcing wall 10 and adjacent additional pins 4 disposed outside the outermost regions 50, 50'.

[0098] In one embodiment, the substrate 2 is configured such that coolant enters between the first reinforcing wall 10 and the adjacent additional pins 4 arranged outside the outermost regions 50, 50'.

[0099] The second surface 26 of the substrate 2 includes a pinless region surrounding an area where pins 4, 4', 4'' are arranged. The pinless region is arranged and configured to accommodate a seal (e.g., as shown in the image). Figure 2 (The washer shown).

[0100] Figure 2 An exploded view of a power electronic assembly including a power electronic module 20 according to the present invention is shown. The power electronic module 20 includes a substrate 2 according to the present invention.

[0101] The power electronics assembly includes a cooler 32 configured to be attached to the power electronics module 20. The power electronics assembly includes two clamping brackets 46, 48 configured to be attached to the cooler 32 by inserting screws 52 into holes in the clamping brackets 46, 48 and screwing the screws 52 into holes 62 (preferably threaded holes) provided in the cooler 32. The clamping brackets 46, 48 serve to attach the power electronics module 20 to the cooler 32 and to ensure that the power electronics module 20 has sufficient rigidity when attached to the cooler 32.

[0102] It may be advantageous to arrange clamping brackets 46, 48 on the unreinforced wall of the power electronics module 20 (see...). Figure 1The reinforcing walls provide stiffness in one direction (e.g., the lateral direction of the power electronics module 20), while the clamping brackets 46, 48 provide stiffness in another direction (e.g., the longitudinal direction of the power electronics module 20).

[0103] In one embodiment, the power electronics module 20 is provided with a plurality of spaced-apart clamping regions 44, which are arranged and configured to accommodate corresponding clamping structures of clamping brackets 46, 48.

[0104] The power module 20 includes a molded package 72 forming a housing, in which a substrate and electronic components attached to the substrate are integrated. The term "molded package" refers to the electrically insulating package structure surrounding the electronic components and the top of the substrate 2. The power module 20 includes a phase terminal 64 extending from a first side of the package 72 and a plurality of low-current connections 70. The power module 20 includes a positive DC terminal 68 disposed between and spaced apart from two negative DC terminals 66 extending from opposite sides of the package 72.

[0105] The cooler 32 includes a cooling tray 42 arranged and configured to receive a portion of a substrate according to the invention. The cooler 32 includes a seal 14 formed as a sealing gasket having a frame structure designed to fit into and be received by the cooling tray 42.

[0106] The cooler 32 is provided with two guide portions 56, which are designed to accommodate corresponding guide structures (not shown) of the substrate 2. Figure 2 In the middle, the guide portion 56 is a hole. In one embodiment, the guide portion may be designed as a protruding (convex) structure.

[0107] The cooler 32 is provided with an internal inlet 34 having an elongated geometry. The internal inlet 34 extends along one of the longest sides of the cooler 32.

[0108] The cooler 32 is provided with an internal outlet 36 having an elongated geometry. The internal outlet 36 extends along the relatively long side of the cooler 32. The internal inlet 34 and the internal outlet 36 extend parallel to each other.

[0109] The cooler 32 includes an external inlet / outlet 38 for the coolant.

[0110] Figure 3 The substrate 2 (which corresponds to) is shown. Figure 1 As shown and referenced Figure 1 The coolant flow pattern in the substrate (illustrated). The coolant enters the substrate 2 near the upper part of the reinforcing wall 10. Once the coolant has entered the substrate 2, a portion of it flows towards the second reinforcing wall 12. This is indicated by arrow 60.

[0111] Another portion of the coolant flows to the sides 6 and 8 of substrate 2. This is indicated by arrow 61.

[0112] The technical effect of the rotating needle 4' in the first outermost region 50 is to establish an inwardly guided flow 54. Similarly, the technical effect of the rotating needle 4'' in the second outermost region 50' is to establish an inwardly guided flow 54'.

[0113] The bypass is located between needles 4', 4'' and the seal (see...) Figure 5B However, rotating needles 4' and 4'' prevent a large amount of coolant from flowing through the bypass. This is a significant advantage because coolant flowing through the bypass does not contribute to cooling.

[0114] Therefore, flow 61 experiences higher fluid resistance and is guided downwards as indicated by arrows 58 and 58'. Tests show that the present invention can reduce thermal resistance and improve module performance.

[0115] Figure 4A A cross-sectional view of a portion of a substrate 2 according to the invention is shown. The substrate 2 includes a first outermost region 50, which includes a needle 4'. The needle 4' in the first outermost region 50 is rotated relative to an additional needle 4 disposed outside the outermost regions 50, 50'.

[0116] All needles 4 and 4' have the same elliptical cross-section. The additional needle 4 (located outside the outermost regions 50 and 50') has a cross-section with a semi-major axis extending parallel to the indicated X-axis. The X-axis corresponds to... Figure 1 As shown and referenced Figure 1 The described transverse axis N2. The Y-axis corresponds to Figure 1 As shown and referenced Figure 1 The longitudinal axis N1 is described. Therefore, the additional pin 4 of the semi-major axis extends perpendicular to the longitudinal axis Y of the substrate 2.

[0117] The cross-section of needle 4' in the first outermost region 50 has a semi-major axis extending parallel to the indicated Z-axis. Due to the rotation of needle 4' in the first outermost region 50, a non-zero angle α exists between X and Z. This angle α is approximately 40 degrees.

[0118] The distance d1 between adjacent needles 4 in the same row arranged outside the outermost region 50 is shown. Similarly, the distance d2 between adjacent needles 4 arranged in adjacent rows is shown. In one embodiment, the minimum distance between adjacent needles 4 is in the range of 0.5 mm to 1.5 mm. In one embodiment, the minimum distance between adjacent needles 4 is in the range of 0.7 mm to 1.2 mm. In one embodiment, the minimum distance between adjacent needles 4 is in the range of 0.8 mm to 1.0 mm. In one embodiment, the minimum distance between adjacent needles 4 is 0.9 mm.

[0119] In one embodiment, needles 4 and 4' have the same elliptical cross-section, the ellipse having a major axis ranging from 2.0 mm to 3.0 mm and a minor axis ranging from 0.8 mm to 1.2 mm. In one embodiment, the major axis is ranging from 2.4 mm to 2.6 mm and the minor axis is ranging from 0.9 mm to 1.1 mm. In one embodiment, the major axis is 2.5 mm and the minor axis is in the range of 1.0 mm.

[0120] Figure 4B A cross-sectional view of a portion of another substrate 2 according to the invention is shown. The substrate 2 includes a first outermost region 50, which includes a needle 4'. The needle 4' in the first outermost region 50 is rotated relative to an additional needle 4 disposed outside the outermost region 50.

[0121] All needles 4 and 4' have the same racetrack-shaped cross-section (a two-dimensional geometry consisting of a rectangle and semicircles on its opposite sides). The additional needle 4 (located outside the outermost regions 50 and 50') has a cross-section with a longitudinal axis extending parallel to the X-axis shown. The X-axis corresponds to... Figure 1 As shown and referenced Figure 1 The described transverse axis N2. The Y-axis corresponds to Figure 1 As shown and referenced Figure 1 The longitudinal axis N1 is described. Therefore, the additional pin 4 of the semi-major axis extends perpendicular to the longitudinal axis Y of the substrate 2.

[0122] The cross-section of needle 4' in the first outermost region 50 has a longitudinal axis extending parallel to the indicated Z-axis. Due to the rotation of needle 4' in the first outermost region 50, a non-zero angle α exists between X and Z. Angle α is approximately 40 degrees.

[0123] The distance d4 between adjacent needles 4 arranged outside the outermost region 50 in the same row is shown. Similarly, the distance d3 between adjacent needles 4 arranged in adjacent rows is shown. In one embodiment, the minimum distance between adjacent needles 4 is in the range of 0.5 mm to 1.5 mm. In one embodiment, the minimum distance between adjacent needles 4 is in the range of 0.7 mm to 1.2 mm. In one embodiment, the minimum distance between adjacent needles 4 is in the range of 0.8 mm to 1.0 mm. In one embodiment, the minimum distance between adjacent needles 4 is 0.9 mm.

[0124] Figure 5A A top view of substrate 2 according to the present invention is shown. Substrate 2 substantially corresponds to Figure 1 As shown and referenced Figure 1 The substrate described. However, the seal 14 surrounds the first outermost region 50, the second outermost region 50', and the first reinforcing wall 10 and the second reinforcing wall 12 extending between the end portions of the outermost regions 50, 50'. The seal 14 is arranged and configured to restrict coolant from entering the surrounding structure.

[0125] The width L of the first reinforcing wall 10 corresponds to the width L of the second reinforcing wall 12. The width M of the region defined by the first outermost region 50 and the second outermost region 50' and extending between the first outermost region and the second outermost region is greater than the width L of the reinforcing walls 10 and 12.

[0126] The additional pin 4 (arranged outside the outermost regions 50, 50') has a cross-section having a longitudinal axis extending perpendicular to the longitudinal axis N1 of the substrate 2. The pins 4, 4', 4'' are arranged symmetrically with respect to the longitudinal axis N1 of the substrate 2.

[0127] The needle 4' in the first outermost region 50 is rotated approximately 40 degrees clockwise relative to the additional needle 4, while the needle 4'' in the second outermost region 50' is rotated approximately 40 degrees counterclockwise relative to the additional needle 4.

[0128] The additional needles 4 have the same dimensions. However, in another embodiment, the additional needles 4 may have different dimensions.

[0129] Figure 5B It shows Figure 5A The cross-sectional view of substrate 2 shown. The cut surface is at... Figure 5A The center is indicated by line A. The substrate 2 is part of a power electronic assembly 20 (e.g., a power electronic module) that includes electronic components 16, 16', 16'', 16''' disposed on the substrate 18. In one embodiment, the substrate 18 is a direct copper-clad substrate.

[0130] Substrate 18 is disposed on the heat-receiving surface 24 of substrate 2. Substrate 2 includes a heat-dissipating surface 26 in contact with coolant 30. Coolant 30 is filled into a coolant space 28 defined by the heat-dissipating surface 26, the seal 14, and the bottom surface of the cooling tray of the cooler (see [link]). Figure 2 ).

[0131] The needle 4' of the first outermost region 50 and the needle of the second outermost region 50' are shown. The first outermost region 50 includes a first bypass region 22 disposed between the needle 4' and the seal 14, and the second outermost region 50' includes a second bypass region 22' disposed between the needle 4'' and the seal 14. Rotating the needles 4', 4'' prevents a large amount of coolant 30 from flowing through the bypasses 22, 22'.

[0132] While existing solutions typically include a frame surrounding the entire needle region, the substrate according to the present invention does not have a frame surrounding the entire needle region. Instead of a frame surrounding the entire needle region, the substrate according to the present invention includes reinforcing walls.

[0133] It is advantageous to avoid using a frame that surrounds the entire needle area, as this would create a spoon-shaped structure. Typically, the substrate is made of bare copper, which is then nickel-plated in a plating bath (to prevent corrosion). When the substrate is removed from the nickel-plating bath, residue remains on it because the substrate cannot be completely drained through the frame.

[0134] The substrate according to the present invention has improved thermal performance compared with the substrate of the prior art.

[0135] In addition, the substrate has been optimized to reduce yield loss during the nickel plating process.

[0136] Figure 6A A top view of substrate 2 according to the present invention is shown. Substrate 2 and Figure 1 The substrates shown are almost identical. Substrate 2 includes a first outermost region 50, wherein a plurality of pins 4' are arranged along a line extending parallel to the longitudinal axis N1 of substrate 2. Substrate 2 includes a second outermost region 50', wherein a plurality of pins 4'' are arranged along a line extending parallel to the longitudinal axis N1. The width M of the region including pins 4, 4', 4'' is greater than the length F of the region including pins 4, 4', 4'' and the first reinforcing wall 10 and the second reinforcing wall 12.

[0137] The needle 4' in the first outermost region 50 is rotated approximately 40 degrees clockwise relative to the additional needle 4. The needle 4'' in the second outermost region 50' is rotated approximately 40 degrees counterclockwise relative to the additional needle 4. A needleless region 63 is provided around the region with needles.

[0138] Figure 6B A top view of another substrate 2 according to the present invention is shown. Figure 6AAs shown and referenced Figure 6A Compared to the substrate 2 described, Figure 6B The substrate 2 includes pins 4' disposed in a first outermost region 50, which extends only a portion of a first side of the region having pins 4, 4', 4''. Similarly, Figure 6B The substrate 2 includes needles 4'' arranged in a second outermost region 50', which extends only a portion of the second side of the region having needles 4, 4', 4''.

[0139] The needle 4' in the first outermost region 50 is rotated approximately 40 degrees clockwise relative to the additional needle 4. The needle 4'' in the second outermost region 50' is rotated approximately 40 degrees counterclockwise relative to the additional needle 4. A needleless region 63 is provided around the region with needles.

[0140] Figure 7A A top view of another substrate 2 according to the invention is shown. The substrate 2 includes a first outermost region 50, in which a plurality of pins 4' are arranged along a first line Q, a second line Q', and a third line Q''. Lines Q, Q', Q'' are offset relative to each other along a longitudinal axis N1. Lines Q, Q', Q'' extend parallel to and parallel to the transverse axis N2 of the substrate 2. However, in another embodiment, these lines may be slightly angled relative to each other.

[0141] Compared to the rightmost group of pins 4' extending along line Q, the leftmost group of pins 4' extending along line Q'' is positioned closer to the top of substrate 2. The middle group of pins 4' extending along line Q' is positioned between the leftmost and rightmost group of pins 4'. The middle group of pins 4' is positioned closer to the top of substrate 2 than the rightmost group of pins 4'. The leftmost group of pins 4' is positioned closer to the top of substrate 2 than the middle group of pins 4'.

[0142] The substrate 2 includes a second outermost region 50', in which a plurality of pins 4' are arranged along a first line R, a second line R', and a third line R''. The lines R, R', R'' are offset relative to each other along the longitudinal axis N1. The lines R, R', R'' extend parallel to and parallel to the transverse axis N2 of the substrate 2. However, in another embodiment, these lines may be slightly angled relative to each other.

[0143] Compared to the rightmost group of pins 4' extending along line Q, the leftmost group of pins 4' extending along line R'' is positioned closer to the top of substrate 2. The middle group of pins 4' extending along line R' is positioned between the leftmost and rightmost group of pins 4'. The middle group of pins 4' is positioned closer to the top of substrate 2 than the rightmost group of pins 4'. The leftmost group of pins 4' is positioned closer to the top of substrate 2 than the middle group of pins 4'.

[0144] In one embodiment, the first outermost region 50 and the second outermost region 50' are arranged symmetrically about the transverse axis N2 of the substrate 2.

[0145] The substrate 2 includes a first reinforcing wall 10 and a second reinforcing wall 12. The two reinforcing walls 10 and 12 extend parallel to the longitudinal axis N1 of the substrate 2. The substrate 2 includes a plurality of additional pins 4 disposed in the region between the reinforcing walls 10 and 12. The additional pins 4 are arranged along lines extending parallel to the longitudinal axis N1 of the substrate 2. The pins 4 in every other line are smaller (have a smaller cross-section) than the pins 4 in the adjacent row.

[0146] The needle 4' in the first outermost region 50 is clockwise relative to the additional needle 4. The needle 4'' in the second outermost region 50' is rotated counterclockwise relative to the additional needle 4 at a similar angle. The needleless region is arranged around the region with needles.

[0147] Figure 7B A top view of another substrate 2 according to the invention is shown. The substrate 2 includes a first outermost region 50, in which a plurality of pins 4' are arranged in three spaced-apart outermost region portions P. Three pins 4' are arranged in the leftmost outermost region portion P. Four pins 4' are arranged in the rightmost outermost region portion P. Three pins 4' are arranged in the middle outermost region portion P, which is positioned between the leftmost and rightmost outermost region portions P. The pins 4' are positioned along a single line that extends parallel to the transverse axis N2 of the substrate 2 (and therefore perpendicular to the longitudinal axis N1 of the substrate 2).

[0148] The substrate 2 includes a second outermost region 50', wherein a plurality of pins 4'' are arranged in three spaced-apart outermost region portions P'. Three pins 4'' are located in the leftmost outermost region portion P'. Four pins 4'' are located in the rightmost outermost region portion P'. Three pins 4'' are located in the middle outermost region portion P', which is positioned between the leftmost and rightmost outermost region portions P'. The pins 4' are positioned along a single line extending parallel to the transverse axis N2 of the substrate 2.

[0149] However, in another embodiment, the needles 4' in the different outermost region portions P can extend along lines offset relative to each other along the longitudinal axis N1. Similarly, the needles 4'' in the different outermost region portions P' can extend along lines offset relative to each other along the longitudinal axis N1.

[0150] In one embodiment, the needles 4', 4'' in the different outermost region portions P, P' can extend along lines that are slightly angled relative to each other.

[0151] In one embodiment, the first outermost region 50 and the second outermost region 50' are arranged symmetrically about the transverse axis N2 of the substrate 2.

[0152] The substrate 2 includes a first reinforcing wall 10 and a second reinforcing wall 12. The two reinforcing walls 10 and 12 extend parallel to the longitudinal axis N1 of the substrate 2. The substrate 2 includes a plurality of additional pins 4 disposed in the region between the reinforcing walls 10 and 12. The additional pins 4 may have different sizes.

[0153] In one embodiment, the additional pins 4 are arranged along lines extending parallel to the longitudinal axis N1 of the substrate 2. The pins 4 in every other line are smaller (have a smaller cross-section) than the pins 4 in the adjacent row.

[0154] The needle 4' in the first outermost region 50 is clockwise relative to the additional needle 4. The needle 4'' in the second outermost region 50' is rotated counterclockwise relative to the additional needle 4 at a similar angle. The needleless region is arranged around the region with needles.

[0155] Figure 8A A top view of another substrate 2 according to the present invention is shown. The substrate 2 includes a first outermost region 50, in which a plurality of pins 4' are arranged along two parallel lines extending parallel to the transverse axis N2 of the substrate 2. Adjacent pins 4' in the two rows are offset relative to each other along both the longitudinal axis N1 and the transverse axis N2.

[0156] The substrate 2 includes a second outermost region 50', in which a plurality of pins 4'' are arranged along two parallel lines extending parallel to the transverse axis N2 of the substrate 2. Adjacent pins 4'' in the two rows are offset relative to each other along the longitudinal axis N1 and the transverse axis N2.

[0157] In one embodiment, the pins 4' of the first outermost region 50 and the pins 4'' of the second outermost region 50' are arranged symmetrically about the transverse axis N2 of the substrate 2.

[0158] The substrate 2 includes a first reinforcing wall 10 and a second reinforcing wall 12, both extending parallel to the longitudinal axis N1 of the substrate 2. The substrate 2 includes a plurality of additional pins 4 arranged along lines (parallel to the longitudinal axis N1) in the region between the reinforcing walls 10 and 12. The additional pins 4 have two different sizes, with smaller additional pins 4 arranged every other line, and larger additional pins 4 arranged along the remaining lines. Adjacent rows of additional pins 4 are offset along the longitudinal axis N1.

[0159] The needle 4' in the first outermost region 50 rotates (counterclockwise) relative to the additional needle 4 arranged outside the first outermost region 50. Similarly, the needle 4' in the second outermost region 50' rotates (clockwise) relative to the additional needle 4 arranged outside the second outermost region 50'.

[0160] Figure 8B A top view is shown of a cooler 32 adapted to accommodate three substrates 2 according to the invention. The cooler 32 is configured to be attached to three power electronic modules (e.g., [missing information]) by means of a clamping bracket (not shown). Figure 2 As shown and referenced Figure 2 The power electronics module described herein is attached to the cooler 32 by inserting a screw into a hole in the clamping bracket and then screwing the screw into a hole 62 provided in the cooler 32. It may be advantageous that the hole 62 is a threaded hole configured to receive a corresponding threaded screw or bolt. Attaching the power electronics module to the cooler 32 using the clamping bracket ensures that each power electronics module has sufficient rigidity when attached to the cooler 32.

[0161] The clamping brackets are preferably arranged along both sides of the power electronics module where the unreinforced walls are not provided. This is done so that the reinforcing walls provide stiffness in one direction (e.g., the lateral direction of the power electronics module), while the clamping brackets provide stiffness in another direction (e.g., the longitudinal direction of the power electronics module).

[0162] The cooler 32 includes three spaced-apart cooling trays 42, each arranged and configured to accommodate a portion of the substrate according to the invention. A closed gasket-type seal (not shown) with a frame structure is designed to fit and be accommodated by each cooling tray 42, and is typically placed in each cooling tray 42.

[0163] The cooler 32 is provided with a plurality of guide portions 56 designed to accommodate corresponding guide structures of the substrate 2. Each of the cooling trays 42 is provided with an internal inlet 34 having an elongated geometry. The internal inlet 34 extends along an elongated inlet region 35 through which coolant is guided after being received by the external inlet 38 of the cooler 32.

[0164] Each of the cooling trays 42 is provided with an internal outlet 36 having an elongated geometry. The internal outlet 36 extends along an elongated outlet region 37, through which coolant is received after being received by the internal outlet 36, guided, and then guided out of the elongated outlet region via the external outlet 39 of the cooler 32.

[0165] Internal exit 36 ​​and internal exit 36 ​​extend parallel to each other.

[0166] Figure 9A A perspective view is shown of a cooler 32 configured to accommodate a substrate according to the invention, and Figure 9B It shows Figure 9A The top view of the cooler 32 shown.

[0167] The cooler 32 includes an external inlet 38 through which coolant enters the cooler 32. The cooler 32 also includes a cooling tray 42 with an internal inlet through which coolant received by the external inlet 38 enters the cooling tray 42.

[0168] The cooling tray 42 is provided with an internal outlet through which coolant leaving the cooling tray 42 is guided away via an external outlet 39.

[0169] Figure 10A A schematic cross-sectional view of a cooling device 1 according to the invention is shown. The cooling device 1 is designed to include a substrate 2 with a plate structure. The plate structure has a first surface that is thermally connected to a substrate 18, to which a plurality of electronic components 16, 16' are attached. The electronic components 16, 16' constitute a heat source. The plate structure has a second surface that includes a plurality of heat-conducting pins 4 extending substantially perpendicular to the second surface. The pins 4 are arranged and configured to transfer heat from the electronic components 16, 16', 16'' to a coolant (not shown) that circulates through a cooler 32 having a cooling tray into which the pins 4 extend.

[0170] Figure 10B A schematic cross-sectional view of another cooling device 1 according to the invention is shown. The cooling device 1 includes a plate structure having a first surface that abuts against the bottom surface of a cooling tray of a cooler 32. The plate structure has a second surface including a plurality of heat-conducting pins 4 extending substantially perpendicular to the second surface. The pins 4 are in thermal contact with the bottom side of a substrate 2. A substrate 18 is placed on the substrate 2, and a plurality of electronic components 16, 16' are attached to the substrate. Therefore, heat generated by the electronic components 16, 16' can be transferred through the substrate 2 and further through the pins 4 to a coolant (not shown), which circulates through the cooler 32, to which the pins 4 extend, and to the cooling tray.

[0171] Figure 10C It shows Figure 10A As shown and referenced Figure 10AA schematic exploded perspective view of the cooling device 1. The cooling device 1 is a substrate 2. A first substrate 18 and a second substrate 17 are placed on the substrate 2. A plurality of electronic components 16, 16', 16'' are placed on the first substrate 18. Wire bonds 74 are electrically connected to the electronic components 16, 16', 16'' and the second substrate 17. The bottom surface of the substrate 2 includes a plurality of heat-conducting pins 4 extending substantially perpendicular to the bottom surface. The pins 4 are arranged and configured to transfer heat from the electronic components 16, 16', 16'' to a coolant (not shown), which circulates through a cooler 32 having a cooling tray 42 into which the pins 4 are designed to extend. The cooler 32 includes an external inlet 38 for receiving the coolant and an external outlet 39 for guiding the coolant away.

[0172] Figure 10D It shows Figure 10B A schematic exploded perspective view of the cooling device 1 is shown. A substrate 2 is placed above the cooling device 1. The substrate 2 includes a first substrate 18 and a second substrate 17. Electronic components 16, 16', and 16'' are placed on the first substrate 18, and wire bonding members 74 are electrically connected to the electronic components 16, 16', and 16'' and the second substrate 17. The cooling device 1 is designed to be inserted into the cooling tray 42 of a cooler 32. When the cooling device 1 is positioned in the cooling tray 42, the pins 4 of the cooling device 1 are configured to be thermally connected to the underside of the substrate 2. The cooler 32 is provided with an external inlet 38 for receiving coolant and an external outlet 39 for guiding the coolant away.

[0173] Figure 11A A top view of substrate 2 according to the present invention is shown. Substrate 2 and Figure 6A As shown and referenced Figure 6A The substrates described are almost identical. However, substrate 2 includes a centrally arranged pin 5, which differs from the additional pin 4. Even though the centrally arranged pin 5 does not rotate relative to the pins in the first outermost region on the first side and the pins in the second outermost region on the second side, the pins 4' and 4'' in the first outermost region 50 and the second outermost region 50' are still maintained. The centrally arranged pin 5 has a circular cross-section. However, the cross-section of the centrally arranged pin 5 can be different (e.g., oval or elliptical). The centrally arranged pin 5 does not affect the "reflection effect" of the pins 4' and 4' in the first outermost region 50 and the second outermost region 50'.

[0174] Figure 11B A top view of another substrate according to the present invention is shown. Substrate 2 and Figure 7B As shown and referenced Figure 7BThe substrates described are almost identical. However, substrate 2 includes a centrally arranged pin 5, which differs from the additional pin 4. Even though the centrally arranged pin 5 does not rotate relative to the pins in the first outermost region on the first side and the second outermost region on the second side, the pins 4' and 4'' in the first outermost region 50 and the second outermost region 50' are still maintained. The centrally arranged pin 5 has a circular cross-section. However, the cross-section of the centrally arranged pin 5 can be oval, elliptical, or have another shape. The centrally arranged pin 5 does not affect the "reflection effect" of the pins 4' and 4' in the first outermost region 50 and the second outermost region 50'.

[0175] List of reference numerals 1 Cooling device 2 substrates 4 needles 4', 4'' outermost needle 5 needles 6 First side 8 Second side 10 walls 12 walls 14 seals 16, 16', 16'', 16''' electronic components 17. Substrate (e.g., direct copper-clad substrate) 18 Substrates (e.g., direct copper-clad substrates) 20 Power electronic components (e.g., power electronic modules) 22, 22' Bypass Area 24 heating surfaces 26 heat dissipation surfaces 28 Coolant Space 30 coolant 32 Cooler 34 internal entrance 35 Entrance Area 36 Internal Exits 37 Export Area 38, 39 External entrances / exits 42 Cooling Tray 44 clamping area 46 clamping bracket 48 clamping bracket 50 First outermost region 50' Second outermost region 52 screws 54, 54' flow 56. Guiding Section 58, 58' flow 60 streams 61 streams 62 holes 63 needle-free areas 64-phase terminals 66 negative DC terminal 68 positive DC terminal 70 Low Current Connector 72 package 74-lead wire bond α angle β angle Distance between d1 and d2 d3 and d4 distances Column C1 Column C2 R1 row R2 row Q, Q', Q'' lines R, R', R'' lines S-shaped cross section The outermost region of P, P' L, M, F lengths N1, N2, N3 axes.

Claims

1. A cooling device (1) for use with liquid-cooled power electronic devices (20), wherein, The cooling device (1) is configured to transfer heat from a heat source (20) to a coolant (30), wherein the cooling device (1) includes a surface (26) having a plurality of heat-conducting pins (4, 4', 4'') extending substantially perpendicular to the surface (26), wherein the pins (4, 4', 4'') are arranged and configured to transfer heat from the heat source (20) to the coolant (30). The surface (26) includes a first side (6) and an opposing second side (8), wherein the needles (4, 4', 4'') are arranged in a region extending between the first side (6) and the opposing second side (8). The needle (4', 4'') in the first outermost region (50) on the first side (6) and in the second outermost region (50') on the second side (8) is rotated relative to the needle (4) arranged between the outermost regions (50, 50').

2. The cooling device (1) according to claim 1, wherein, A minimum distance (d1, d2) is set between the needles (4, 4', 4''), wherein the minimum distance (d1, d2) is in the range of 0.4 mm to 2.0 mm.

3. The cooling device (1) according to any one of the preceding claims, wherein, The needles (4, 4', 4'') are arranged in rows (R1, R2), wherein every other row (R1, R2) has the same number of needles (4, 4', 4'') and is oriented in the same direction, wherein the number of needles (4, 4', 4'') in the outermost row is one more than the number of needles (4, 4', 4'') in the second outermost row.

4. The cooling device (1) according to claim 1 or 2, wherein, The needles (4, 4', 4'') are arranged in columns (C1, C2), wherein the columns (C1, C2) are offset relative to each other, wherein every other column (C1, C2) has the same number of needles (4, 4', 4'') and is oriented in the same direction, wherein the number of needles (4, 4', 4'') in the outermost columns (C1, C2) on the first side (6) and the opposite second side (8) is one more than the number of needles (4, 4', 4'') in the second outermost column (C1, C2).

5. The cooling device (1) according to claim 1 or 2, wherein, The geometry of the needles (4, 4', 4'') is selected from square, triangle, circle, rhombus, rectangle and ellipse.

6. The cooling device (1) according to claim 1 or 2, wherein, The first group of needles (4) arranged between the outermost regions (50, 50') has a first size, and the second group of needles (4) arranged between the outermost regions (50, 50') has a second size.

7. The cooling device (1) according to claim 1 or 2, wherein, The first group of needles (4) arranged between the outermost regions (50, 50') has a first orientation, and the second group of needles (4) arranged between the outermost regions (50, 50') has a second orientation.

8. The cooling device (1) according to claim 1 or 2, wherein the cooling device (1) is a substrate (2) for use with liquid-cooled power electronic devices (20), wherein, The substrate (2) includes a plate structure having: - The first surface (24) is configured to be thermally connected to the heat source (20). - The second surface (26) includes a plurality of heat-conducting pins (4, 4', 4'') extending substantially perpendicular to the second surface (26), wherein the pins (4, 4', 4'') are arranged and configured to transfer heat from the heat source (20) to the coolant (30). The plate structure includes a first side (6) and an opposite second side (8), wherein the needles (4, 4', 4'') are arranged in a region extending between the first side (6) and the opposite second side (8).

9. The cooling device (1) according to claim 8, wherein: - The first wall (10) extends between the first side (6) and the opposite second side (8). - A second wall (12) spaced apart from the first wall (10) extends between the first side (6) and the opposite second side (8). The first wall (10) and the second wall (12) extend substantially perpendicular to the second surface (26).

10. The cooling device (1) according to claim 8, wherein, The substrate (2) includes two spaced-apart reinforcing walls (10, 12), wherein pins (4, 4', 4'') are disposed between the reinforcing walls (10, 12).

11. A liquid-cooled power electronic component (20), comprising: - The cooling device (1) according to any one of the preceding claims. - A cooler (32) includes an external inlet (38) for receiving coolant (30) and an external outlet for discharging coolant (30), wherein the cooler (32) includes a cooling tray (42) defining an enclosed volume, the cooling tray (42) having an internal inlet (34) and an internal outlet (36) for guiding coolant (30) through the enclosed volume and into contact with the needles (4, 4', 4'') of the cooling device (1); - A power electronics module (20) is arranged on top of the cooler (32), wherein a substrate (2) is sandwiched between the cooler (32) and the power electronics module (20).

12. The liquid-cooled power electronics assembly (20) according to claim 11, comprising a seal (14) disposed in the cooling tray (42), wherein, The seal (14) surrounds the needle (4, 4', 4'') and seals against the cooling device (1) to prevent the coolant (30) from escaping from the cooling tray (42) without flowing through the internal inlet (34) or the internal outlet (36).

13. The liquid-cooled power electronics assembly (20) according to claim 11 or 12, wherein, The power electronics module (20) is mounted by using two brackets (46, 48) extending along both sides (6, 8) of the substrate (2), wherein the walls (10, 12) extend perpendicularly to the brackets (46, 48).

14. The liquid-cooled power electronics assembly (20) according to claim 11 or 12, wherein, The internal inlet (34) and the internal outlet (36) are formed as slots extending parallel to the walls (10, 12).

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