A bottom heat sink structure

Abstract

A bottom heat sink structure is provided with an air flow channel with Venturi effect inside the base, the air inlet of the air flow channel is arranged on the bottom surface of the base, and the air outlet is arranged on the side surface of the base. During operation, the heat conducted to the base by the chip can quickly heat the air in the air flow channel, and the hot air is quickly discharged to the air outlet on the side surface along the air flow channel, effectively avoiding the defect that the hot air of the traditional down heat sink is retained and accumulated. At the same time, a stable negative pressure can be formed at the air outlet during the high-speed discharge of the air flow. By using the layout structure that the air outlet is adjacent to the heat dissipation fin, the hot air accumulated in the upper part of the fin gap is continuously sucked by the negative pressure, thereby solving the problem of air convection stagnation, accelerating the flow of air in the fin gap, forming a continuous and efficient dynamic convection heat exchange cycle, thereby improving the heat dissipation efficiency and ensuring the safety and stability of the equipment operation.

Description

Technical Field

[0001] This invention relates to radiators, and more particularly to a radiator structure with fins facing downwards. Background Technology

[0002] During operation, various electromechanical equipment and electronic instruments generate heat and rapidly increase their internal electrical components. Chips, as core components in computers, digital instruments, smart home appliances, industrial control equipment, and other electronic instruments, are extremely sensitive to temperature. High-temperature environments not only reduce the chip's operational accuracy and efficiency but also accelerate chip aging and wear, significantly shortening the lifespan of both the chip and the entire equipment. In severe cases, this can lead to safety hazards such as chip burnout, equipment downtime, and short circuits. Therefore, equipping chips and other core heat-generating components with heat dissipation devices is a crucial means of ensuring the safe operation of equipment.

[0003] Currently, finned heat sinks are the most widely used heat dissipation devices in the field of heat dissipation. They mainly consist of a base plate and several heat dissipation fins arranged side by side on the base plate. Heat is dissipated by the base plate being in contact with the heat source for heat conduction, the fins increasing the heat dissipation area, and air convection heat transfer. Finned heat sinks are mostly installed above heat sources such as chips. Through the contact between the base plate and the upper surface of the chip, the heat generated by the chip's operation is conducted upwards to the heat sink base plate, and then dispersed to the heat dissipation fins. Utilizing the physical property of hot air naturally flowing upwards, the air convection around the fins is accelerated, thereby quickly dissipating the heat to the external environment, thus achieving chip cooling.

[0004] However, in the assembly structure of some special electronic devices, due to limitations imposed by the overall structural layout, internal space constraints, and circuit board mounting methods, the circuit board must adopt an inverted mounting structure. The chip is fixedly mounted on the lower end face of the circuit board, and the corresponding heat sink must be adapted to be mounted on the bottom of the chip. That is, the heat sink base plate is attached to the lower surface of the chip, and the heat sink fins extend downward from the base plate to form a bottom-mounted heat dissipation structure. Although existing finned heat sinks adapted to this mounting method can expand the heat dissipation area through the fins and have basic heat conduction and heat dissipation functions, they are limited by the thermodynamic properties of air. Hot air is less dense than cold air, and the hot airflow always has the characteristics of upward floating and gathering. In this bottom-mounted heat sink, the heat sink fins extend downward, forming a gap structure that is open downward and closed above. The hot airflow formed by the heat conducted from the chip to the heat sink cannot diffuse downward quickly and will accumulate in large quantities in the upper area of ​​the fin gaps, making it difficult to form a smooth air convection circulation.

[0005] When hot air stagnates and accumulates within the gaps between the fins, it significantly reduces the heat exchange efficiency between the heat sink and the outside air. This prevents the heat generated by the chip from dissipating quickly and promptly, causing heat to accumulate continuously in the area where the chip and heat sink are in contact. It also creates localized high-temperature thermal zones and heat dissipation dead zones. Under long-term operating conditions, the problem of delayed and insufficient heat dissipation will continue to exacerbate the high-temperature load on the chip, failing to meet the efficient heat dissipation requirements of highly integrated, high-power chips. This can easily lead to equipment malfunctions, indicating significant shortcomings in both compatibility and heat dissipation performance. Summary of the Invention

[0006] The purpose of this invention is to provide a heat sink structure that is adapted to the bottom mounting condition of chips, can solve the problem of heat flow accumulation, and improve heat dissipation efficiency, so as to ensure the safety and stability of the equipment operation.

[0007] The bottom heat sink structure of the present invention includes a base and several fins extending downward from the bottom of the base; the base is provided with an airflow channel for air circulation, the air inlet of the airflow channel is located on the bottom surface of the base, and the air outlet of the airflow channel is located on the side of the base, adjacent to the fins.

[0008] The bottom heat sink structure described in this invention features an airflow channel within the base. The air inlet of the airflow channel is located on the bottom surface of the base, and the outlet is located on the side surface. This creates a rising structure from the inlet to the outlet, fully adapting to the thermodynamic characteristics of upward-floating hot air and structurally suiting the special operating conditions of bottom-mounted chip heat dissipation. During operation, the heat conducted from the chip to the base rapidly heats the air within the airflow channel. The hot air then autonomously and rapidly exits along the airflow channel to the side outlet, effectively avoiding the stagnation and accumulation of hot air in traditional bottom-mounted heat sinks. Simultaneously, the high-speed airflow creates a stable negative pressure at the outlet. Utilizing the adjacent layout of the outlet and the heat sink fins, this negative pressure continuously draws in the hot air accumulated in the upper part of the fin gaps, solving the problem of stagnant air convection and accelerating the flow of air within the fin gaps. This forms a continuous and efficient dynamic convection heat exchange cycle, thereby improving heat dissipation efficiency and ensuring the safety and stability of the equipment.

[0009] Preferably, the air inlet of the airflow channel is located in the middle of the bottom surface of the base, and the base is provided with a first channel plate and a second channel plate extending downward on both sides of the air inlet; the fins include a first fin disposed between the first channel plate and the bottom surface of the base, and a second fin disposed between the second channel plate and the bottom surface of the base.

[0010] Preferably, the air outlet is located on the side of the base adjacent to the first fin, and the gap between the air inlet and the bottom of the second fin is connected.

[0011] Preferably, the airflow channel is located at the bottom of the air outlet and has an air vent that connects to the gap between the fins.

[0012] Preferably, the airflow channel is provided with a throat whose cross-sectional area is smaller than that of the air inlet and the air outlet, thereby creating a Venturi effect in the airflow channel.

[0013] Preferably, the bottom surface of the second channel plate and the bottom of the second fin are both inclined downwards.

[0014] Preferably, the bottom surface of the base is inclined on both sides adjacent to the first channel plate and the second channel plate.

[0015] Preferably, the airflow channel extends and connects to the top surface of the base, the circuit board is mounted above the base, and a heat dissipation pad covering the top surface of the airflow channel is provided between the circuit board and the base, and the chip is mounted between the circuit board and the heat sink, above the air inlet.

[0016] Alternatively, the airflow channel extends and connects to the top surface of the base, the circuit board is mounted above the base, and a heat dissipation pad covering the top surface of the airflow channel is provided between the circuit board and the base. The chip is mounted between the circuit board and the heat sink, above the air inlet; the middle part of the heat dissipation pad protrudes into the airflow channel, and the chip is connected to the protruding part of the heat dissipation pad.

[0017] The aforementioned bottom radiator structure further accelerates airflow and improves heat dissipation efficiency. Attached Figure Description

[0018] Figure 1 , 2 This is a structural diagram of the bottom heat sink.

[0019] Figure 3 This is an exploded structural diagram of the bottom heat sink.

[0020] Figure 4 This is a cross-sectional view of the bottom heat sink structure. Detailed Implementation

[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0023] If the embodiments of this invention involve descriptions such as "first" or "second," such descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0024] This invention proposes a bottom heat sink structure.

[0025] The bottom heat sink structure of this embodiment includes a base 1 and several fins extending downward from the bottom of the base; the base is provided with an airflow channel 3 for air circulation, the air inlet 4 of the airflow channel is located on the bottom surface of the base, and the air outlet 5 of the airflow channel is located on the side of the base, adjacent to the fins.

[0026] like Figure 1-4 As shown, an airflow channel is set inside the base, with the air inlet located on the bottom surface and the air outlet on the side. This creates a rising structure from the inlet to the outlet, fully adapting to the thermodynamic characteristics of hot air rising upwards. This structural design also accommodates the special operating conditions of bottom-mounted chip cooling. During operation, the heat conducted from the chip to the base quickly heats the air within the airflow channel. The hot air then autonomously and rapidly exits along the channel to the side outlet, effectively avoiding the stagnation and accumulation of hot air in traditional bottom-mounted heat sinks. Simultaneously, the high-speed airflow creates a stable negative pressure at the outlet. Utilizing the adjacent layout of the outlet and the heat sink fins, this negative pressure continuously draws in the hot air accumulated in the upper part of the fin gaps, solving the problem of stagnant air convection and accelerating the airflow within the fin gaps, forming a continuous and efficient dynamic convection heat exchange cycle.

[0027] The bottom heat sink structure has an air inlet 4 of the airflow channel 3 located in the middle of the bottom surface of the base 1. The base has a first channel plate 6 and a second channel plate 7 extending downwards on both sides of the air inlet. The fins include a first fin 21 disposed between the first channel plate and the bottom surface of the base, and a second fin 22 disposed between the second channel plate and the bottom surface of the base, i.e., as shown... Figure 2 , 4 The left and right fins are shown; the air outlet 5 is located on the side of the base adjacent to the first fin, and the gap between the air inlet and the bottom of the second fin is connected. This divides the fins into left and right parts, avoiding the situation where the width of the fins is too large or the gap is too deep, which would prevent the negative pressure at the air outlet from driving the hot air flow in the gap between the fins; at the same time, the first channel plate isolates the air inlet and the first fin, ensuring the negative pressure at the air outlet, thereby smoothly driving the hot air flow between the first fins; on the other side, when air enters from the air inlet, it can drive the air flow between the second fins, so that the fins on both sides can smoothly achieve air convection.

[0028] The airflow channel 3 has a throat with a cross-sectional area smaller than that of the inlet 4 and outlet 5, creating a Venturi effect and increasing the airflow velocity. This is existing technology and will not be elaborated here. Furthermore, the bottom surface of the second channel plate 7 and the bottom surface of the second fin 22 are both inclined downwards, allowing airflow to enter the airflow channel more smoothly and quickly, further increasing the ventilation rate. Moreover, the bottom surfaces of the base 1, adjacent to both the first channel plate 6 and the second channel plate 7, are also inclined, which can further improve the airflow velocity.

[0029] like Figure 3 , 4 As shown, the airflow channel 3 is located at the bottom of the air outlet 5 and has an air vent 8 connecting the gap between the fins 2, so that the negative pressure at the air outlet can more accurately and stably drive the flow of hot air between the fins. On the other hand, the airflow channel 3 extends and connects to the top surface of the base 1. The circuit board 9 is installed above the base 1, and a heat dissipation pad 10 covering the top surface of the airflow channel is provided between the circuit board and the base. The chip 11 is installed between the circuit board and the heat sink, above the air inlet 4, so that the airflow flows through the heat dissipation pad at the same time, accelerating heat dissipation. In addition, the middle part of the heat dissipation pad 10 protrudes into the airflow channel 3, and the chip 11 is connected to the protruding part of the heat dissipation pad. The heat dissipation pad and the chip can form the throat required for the Venturi effect, which not only simplifies the structure of the heat sink and reduces the manufacturing difficulty, but also allows the fast-flowing air in the Venturi effect to flow through the heat dissipation pad and the chip, thereby accelerating the heat dissipation of the chip.

[0030] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A bottom heat sink structure, comprising a base (1) and a plurality of fins extending downward from the bottom of the base, characterized in that: The base has an airflow channel (3) for air circulation inside. The air inlet (4) of the airflow channel is located on the bottom surface of the base, and the air outlet (5) of the airflow channel is located on the side of the base, adjacent to the fins.

2. The bottom heat sink structure according to claim 1, characterized in that: The air inlet (4) of the airflow channel (3) is located in the middle of the bottom surface of the base (1). The base is provided with a first channel plate (6) and a second channel plate (7) extending downward on both sides of the air inlet. The fins include a first fin (21) disposed between the first channel plate and the bottom surface of the base, and a second fin (22) disposed between the second channel plate and the bottom surface of the base.

3. The bottom heat sink structure according to claim 2, characterized in that: The air outlet (5) is located on the side of the base (1) adjacent to the first fin (21), and the gap between the air inlet (4) and the bottom of the second fin (22) is connected.

4. The bottom heat sink structure according to claim 3, characterized in that: The airflow channel (3) is located at the bottom of the air outlet (5) and has an air vent (8) that connects the gap between the fins (2).

5. The bottom heat sink structure according to claim 1, characterized in that: The airflow channel (3) is located at the bottom of the air outlet (5) and has an air vent (8) that connects the gap between the fins (2).

6. The bottom heat sink structure according to any one of claims 1-5, characterized in that: The airflow channel (3) is provided with a throat with a cross-sectional area smaller than that of the inlet (4) and the outlet (5), which makes the airflow channel form a Venturi effect.

7. The bottom heat sink structure according to claim 6, characterized in that: The bottom surface of the second channel plate (7) and the bottom of the second fin (22) are both inclined downwards.

8. The bottom heat sink structure according to claim 6, characterized in that: The bottom surface of the base (1) is inclined on both sides adjacent to the first channel plate (6) and the second channel plate (7).

9. The bottom heat sink structure according to any one of claims 1-5, characterized in that: The airflow channel (3) extends and connects to the top surface of the base (1). The circuit board (9) is installed above the base (1), and a heat dissipation pad (10) covering the top surface of the airflow channel is provided between the circuit board and the base. The chip (11) is installed between the circuit board and the heat sink, above the air inlet (4).

10. The bottom heat sink structure according to claim 6, characterized in that: The airflow channel (3) extends and connects to the top surface of the base (1). The circuit board (9) is installed above the base (1), and a heat dissipation pad (10) covering the top surface of the airflow channel is provided between the circuit board and the base. The chip (11) is installed between the circuit board and the heat sink, above the air inlet (4). The middle part of the heat dissipation pad (10) protrudes into the airflow channel (3), and the chip (11) is connected to the protruding part of the heat dissipation pad.

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