Optical module

Abstract

An optical module comprises a circuit board (300) provided with a through hole (301), an optical emitting assembly (310) for generating optical signals, a driver (330) located at the side of the optical emitting assembly (310), the driver (330) being electrically connected to the optical emitting assembly (310), a lens assembly (400) connected to the bottom of the circuit board (300) and covering the optical emitting assembly (310), the lens assembly (400) being used for changing the transmission direction of the optical signals generated by the optical emitting assembly (310), a supporting component (700) comprising a supporting part (711) and a connecting part (712), the supporting part (711) being located in the through hole (301), the connecting part (712) being connected to the circuit board (300), one side of the supporting part (711) being formed with a missing corner (718), and the top of the supporting part (711) supporting the driver (330), and a temperature adjusting mechanism (500) located below the lens assembly (400) and connected to the bottom of the supporting component (700), the temperature adjusting mechanism (500) being located below the optical emitting assembly (310) or arranged at the side of the optical emitting assembly (310), and the temperature adjusting mechanism (500) being used for maintaining the working temperature of the optical emitting assembly (310).

Description

optical modules

[0001] This application claims the priority of application number 202410208556.3 filed on February 26, 2024 with the China Patent Office; the priority of application number 202410208801.0 filed on February 26, 2024 with the China Patent Office; and the priority of application number 202420351756.X filed on February 26, 2024 with the China Patent Office; all contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, video, and artificial intelligence, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals. They are key components in optical communication equipment and sit at the heart of optical communications. Optical modules contain optical chips such as optical transmitters (OTAs), which generate optical signals. The performance of some OTAs is sensitive to operating temperature. To ensure stable performance, the operating temperature of these OTAs must be kept within a certain range.

[0004] Summary of the Invention

[0005] The present disclosure provides an optical module, comprising: a circuit board, a light emitting assembly, a lens assembly, a supporting component and a temperature regulating mechanism. The circuit board is provided with a through hole. The light emitting assembly is electrically connected to the circuit board and is used to generate an optical signal. The driver is electrically connected to the circuit board and is located on the side of the light emitting assembly, and the driver is electrically connected to the light emitting assembly. The lens assembly is connected to the circuit board at the bottom and covers the light emitting assembly, and the lens assembly is used to change the transmission direction of the optical signal generated by the light emitting assembly. The supporting component includes a supporting part and a connecting part, the supporting part is located in the through hole, and the connecting part is connected to the circuit board; the thermal conductivity coefficient of the supporting component is greater than or equal to the thermal conductivity coefficient of the circuit board. The temperature regulating mechanism is located below the lens assembly and is connected to the supporting component at the bottom; the temperature regulating mechanism is located below the light emitting assembly or is provided on the side of the light emitting assembly, and the temperature regulating mechanism is used to maintain the operating temperature of the light emitting assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0007] FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0008] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0009] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0010] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0011] FIG5 is an exploded schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0012] FIG6 is a partial enlarged view of point A in FIG5 ;

[0013] FIG7 is a schematic structural diagram of a first heater according to some embodiments of the present disclosure;

[0014] FIG8 is a diagram illustrating a supporting component in use according to some embodiments of the present disclosure;

[0015] FIG9 is a first assembly diagram of a support component according to some embodiments of the present disclosure;

[0016] FIG10 is a second assembly diagram of a support component according to some embodiments of the present disclosure;

[0017] FIG11 is a schematic diagram of the internal structure of another optical module provided according to an embodiment of the present disclosure;

[0018] FIG12 is an exploded schematic diagram of the internal structure of another optical module provided according to an embodiment of the present disclosure;

[0019] FIG13 is a partial enlarged schematic diagram of point B in FIG12;

[0020] FIG14 is a schematic structural diagram of a circuit board provided according to some embodiments of the present disclosure;

[0021] FIG15 is a schematic structural diagram of another supporting component provided according to some embodiments of the present disclosure;

[0022] FIG16 is a diagram showing another supporting component in use according to some embodiments of the present disclosure;

[0023] FIG17 is a partial diagram 1 of an assembly diagram of another supporting component provided according to some embodiments of the present disclosure;

[0024] FIG18 is a second schematic partial diagram of the assembly of another supporting component according to some embodiments of the present disclosure;

[0025] FIG19 is a cross-sectional view of another optical module according to some embodiments of the present disclosure;

[0026] FIG20 is an exploded schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0027] FIG21 is a second exploded schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0028] FIG22 is a schematic structural diagram of another supporting component provided according to some embodiments of the present disclosure;

[0029] FIG23 is a partial enlarged view of another supporting component provided according to some embodiments of the present disclosure;

[0030] FIG24 is a second structural diagram of another supporting component provided according to some embodiments of the present disclosure;

[0031] FIG25 is a diagram illustrating another supporting component in use according to some embodiments of the present disclosure;

[0032] FIG26 is a schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure;

[0033] FIG27 is an exploded schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure;

[0034] FIG28 is a partial schematic diagram of the internal structure of yet another optical module provided according to some embodiments of the present disclosure;

[0035] FIG29 is a second exploded schematic diagram of the internal structure of yet another optical module provided according to some embodiments of the present disclosure;

[0036] FIG30 is a first structural diagram of another supporting component provided according to some embodiments of the present disclosure;

[0037] FIG31 is a second structural diagram of yet another supporting component provided according to some embodiments of the present disclosure;

[0038] FIG32 is a third structural diagram of yet another supporting component provided according to some embodiments of the present disclosure;

[0039] FIG33 is a diagram showing another supporting component in use according to some embodiments of the present disclosure;

[0040] FIG34 is a partial enlarged view of another supporting component in use according to some embodiments of the present disclosure;

[0041] FIG35 is a first cross-sectional view of an assembly of another supporting component and a circuit board according to some embodiments of the present disclosure;

[0042] FIG36 is a second cross-sectional view of an assembly of another supporting component and a circuit board according to some embodiments of the present disclosure;

[0043] FIG37 is a partial schematic diagram of another lower shell provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0045] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0046] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0047] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0048] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0049] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0050] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0051] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0052] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0053] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0054] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0055] Figure 3 is a structural diagram of an optical module according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, and a lens assembly 400.

[0056] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 203 and 204 . The outer contour of the housing is generally a square.

[0057] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0058] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates 2012 located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates 2012 are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0059] The direction of the line connecting the two openings 203 and 204 can be consistent with the length of the optical module 200, or inconsistent with the length of the optical module 200. For example, opening 203 is located at the end of the optical module 200 (the right end in Figure 3), and opening 204 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 203 is located at the end of the optical module 200, while opening 204 is located on the side of the optical module 200. Opening 203 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the host computer (for example, the optical network terminal 100); opening 204 is an optical port, configured to receive the optical fiber 101, so that the optical fiber 101 is connected to the optical module 200.

[0060] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of components such as the circuit board 300 and the lens assembly 400 into the housing, with the upper housing 201 and the lower housing 202 providing encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300 and the lens assembly 400, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0061] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0062] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0063] For example, the unlocking member 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes engaging components that mate with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the engaging components of the unlocking member 600 secure the optical module 200 within the cage 106. When the unlocking member 600 is pulled, the engaging components of the unlocking member 600 move accordingly, thereby changing the connection between the engaging components and the host computer, releasing the optical module 200 from the host computer and allowing the optical module 200 to be removed from the cage 106.

[0064] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, lasers, photodetectors, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LAs), clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0065] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0066] The circuit board 300 also includes a gold finger formed on the surface of its end, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0067] In some embodiments, the bottom of the lens assembly 400 is connected to the circuit board 300 and covers the top of the optical chip. The optical chip includes an optical transmitting component and / or an optical receiving component, and the optical transmitting component and the optical receiving component are electrically connected to the circuit board 300. The lens assembly 400 has optical surfaces such as a transmissive surface and a reflective surface. The transmission direction of the transmitted optical signal and / or the received optical signal is adjusted by combining the transmissive surface and the reflective surface, so that the transmitted optical signal generated by the optical transmitting component can be output from the optical module, and the optical signal input to the optical module can be transmitted to the optical receiving component. The optical transmitting component includes a laser, and the optical receiving component includes a photodetector. In some embodiments, a matching chip can also be provided below the lens assembly 400. The matching chip includes a driver and / or a TIA, etc.

[0068] In some embodiments, the lens assembly 400 is connected to the optical fiber ribbon 410. The optical signal generated by the optical transmitter is transmitted to the optical fiber ribbon 410 through the lens assembly 400. Alternatively, the optical signal input through the optical fiber ribbon 410 is transmitted to the lens assembly 400 and then transmitted to the optical receiver through the lens assembly 400. In some embodiments, the lens assembly 400 is disposed on the side of the optical port of the optical module 200 and is directly connected to an external optical fiber.

[0069] Fiber optic connectors are provided at the ends of optical fiber ribbon 410 for optically connecting optical fiber ribbon 410 to external optical fibers. In some embodiments, the fiber optic connector is positioned horizontally within the optical port, with the major plane of the fiber optic connector parallel or approximately parallel to the bearing plane of the optical port. In some embodiments, the fiber optic connector is positioned vertically within the optical port, with the major plane of the fiber optic connector perpendicular or approximately perpendicular to the bearing plane of the optical port. Figure 4 illustrates a horizontal fiber optic connector configuration.

[0070] Figure 5 is an exploded schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure, and Figure 6 is a partial enlarged view of point A in Figure 5. As shown in Figures 5 and 6, a light emitting assembly 310 is disposed below the lens assembly 400, and the light emitting assembly 310 is electrically connected to the circuit board 300. The optical signal generated by the light emitting assembly 310 is transmitted to the lens assembly 400, transmitted through the lens assembly 400 to the optical fiber ribbon 410, and then transmitted to the outside of the optical module through the optical fiber ribbon 410. In some embodiments, the light emitting assembly 310 can be disposed on the circuit board 300, with the top surface of the light emitting assembly 310 being higher than the top surface of the circuit board 300.

[0071] In some embodiments, a driver 330 is disposed below the lens assembly 400 and is disposed on the side of the light emitting assembly 310. The driver 330 is electrically connected to the circuit board 300 and the driver 330 is electrically connected to the light emitting assembly 310. The driver 330 can be disposed on the circuit board 300, with the top surface of the driver 330 being higher than the top surface of the circuit board 300. The light emitting assembly 310 can be wired to the driver 330, and the driver 330 can be wired to the circuit board 300.

[0072] In some embodiments, a light receiving assembly 320 is disposed below the lens assembly 400. Optical signals transmitted to the lens assembly 400 via the optical fiber ribbon 410 are then transmitted to the light receiving assembly 320 via the lens assembly 400. The light receiving assembly 320 can be disposed on the side of the light transmitting assembly 310. The light receiving assembly 320 can be disposed on the circuit board 300, with the top surface of the light receiving assembly 320 being higher than the top surface of the circuit board 300.

[0073] In some embodiments, a TIA 340 is disposed below the lens assembly 400 and is disposed on a side of the optical receiving assembly 320. The TIA 340 is electrically connected to the circuit board 300 and the TIA 340 is electrically connected to the optical receiving assembly 320. The TIA 340 can be disposed on the circuit board 300, with the top surface of the TIA 340 being higher than the top surface of the circuit board 300. The optical receiving assembly 320 can be wire-bonded to the TIA 340, and the TIA 340 can be wire-bonded to the circuit board 300.

[0074] In some embodiments, the light receiving assembly 320 is located at a side of the light emitting assembly 310. For example, the light receiving assembly 320 and the light emitting assembly 310 are arranged side by side along the width direction of the circuit board 300.

[0075] In some embodiments, the optical transmission component 310 is packaged with multiple lasers. The optical transmission component 310 can be packaged with 4 VCSEL lasers. Of course, in the embodiment of the present disclosure, the optical transmission component 310 is not limited to being packaged with 4 VCSEL lasers. In some embodiments, the transmission rate of the VCSEL laser is 50Gb / s, 100Gb / s, 200Gb / s, etc. The higher the transmission rate of the VCSEL laser in the optical transmission component 310, the more sensitive the high-frequency performance of the VCSEL laser is to the operating temperature of the laser. For example, its high-frequency performance can only be maintained within a very small temperature range. Therefore, in order to meet the requirements of the optical module 200 to operate in an ambient temperature range of 0°C-70°C, it is necessary to maintain the operating temperature of the optical transmission component 310 within a certain temperature range to reduce the impact of the ambient temperature on its operating temperature.

[0076] In some embodiments, the light receiving assembly 320 is packaged with a plurality of light detectors. The light receiving assembly 320 may be packaged with four light detectors. Of course, the light receiving assembly 320 in the embodiment of the present disclosure is not limited to being packaged with four light detectors.

[0077] In some embodiments, the optical module 200 includes a temperature regulating mechanism 500, which is located below the lens assembly 400 and electrically connected to the circuit board 300. The temperature regulating mechanism 500 can generate or absorb heat to maintain the operating temperature of the optical transmission assembly 310 within a relatively constant range, thereby stabilizing the operating temperature of the optical transmission assembly 310 within a preset range and ensuring the high-frequency performance of the optical transmission assembly 310. The optical transmission assembly 310 can be disposed on the temperature regulating mechanism 500 or on the side of the temperature regulating mechanism 500. The temperature regulating mechanism 500 can include a heating device or a thermoelectric cooler (TEC).

[0078] In some embodiments, the optical module 200 includes a support component 700, which is located below the lens assembly 400. The support component 700 supports and connects to the optical transmitter assembly 310 or the optical receiver assembly 320. For example, a through hole 301 is provided on the circuit board 300, and the through hole 301 is located below the lens assembly 400. The support component 700 is connected to the through hole 301, so that a portion of the support component 700 is located within the through hole 301. For example, the top of the support component 700 is embedded in the through hole 301.

[0079] In some embodiments, the thermal conductivity of the support component 700 is greater than or equal to that of the circuit board 300. The support component 700 facilitates heat dissipation of components such as optical chips, thereby stabilizing the operating temperature of the optical chips within a preset range.

[0080] In some embodiments, the support component 700 can be made of a metal or other material with good thermal conductivity, such as tungsten copper. This facilitates heat dissipation for the optical chip mounted thereon, helping to maintain a relatively constant operating temperature for the optical chip mounted thereon. The shape and size of the through hole 301 are determined based on the dimensions of the lens assembly 400, the space on the circuit board 300, and the dimensions of the optical chip.

[0081] In some embodiments, the support member 700 can support and connect the light emitting assembly 310 .

[0082] In some embodiments, the support member 700 may be supported and connected to the temperature adjustment mechanism 500 . For example, the bottom of the temperature adjustment mechanism 500 is connected to the top of the support member 700 .

[0083] In some embodiments, as shown in FIG. 6 , the light emitting assembly 310 and the heating device 500 a are disposed on the top of the supporting component 700 , and the light receiving assembly 320 , the driver 330 , and the TIA 340 are located outside the supporting component 700 .

[0084] In some embodiments, the support component 700 may be fixedly connected to the circuit board 300 by means of thermal conductive gel or the like.

[0085] In some embodiments, the support member 700 may support and connect the optical receiving assembly 320 , the driver 330 , and / or the TIA 340 .

[0086] In some embodiments, the temperature adjustment mechanism 500 includes a heater 500a, which is disposed on the side or below the optical transmission assembly 310. The heater 500a is electrically connected to the circuit board 300. When the heater 500a is powered, it generates heat, which increases the temperature of the optical transmission assembly 310 and its surroundings, stabilizing the operating temperature of the optical transmission assembly 310 within a certain range and thereby ensuring the stability of the performance of the optical transmission assembly 310.

[0087] In some embodiments, the heating device 500 a is disposed below the light emitting assembly 310 , that is, the heating device 500 a supports and connects to the light emitting assembly 310 .

[0088] In some embodiments, the support component 700 supports and connects the heating device 500 a , and the support component 700 is used to assist the heating device 500 a in maintaining the operating temperature of the light emitting assembly 310 .

[0089] In some embodiments, the light emitting assembly 310 is disposed on the heater 500a, and the light receiving assembly 320 is disposed on the circuit board 300 and is located to the side of the light emitting assembly 310, so that the light receiving assembly 320 and the light emitting assembly 310 are arranged side by side along the width of the circuit board 300. The TIA 340 is located to the side of the light receiving assembly 320 and the driver 330, so that the TIA 340 and the driver 330 are arranged side by side along the width of the circuit board 300, thereby fully utilizing the space below the lens assembly 400 and facilitating control of the size of the lens assembly 400.

[0090] In some embodiments, a gap is provided between the light receiving assembly 320 and the heating device 500 a to reduce the influence of the heat generated by the heating device 500 a on the light receiving assembly 320 .

[0091] FIG7 is a schematic diagram of the structure of a heating device provided according to some embodiments of the present disclosure. As shown in FIG7 , the heating device 500a includes a substrate 511 and a heating layer 512. The heating layer 512 is disposed on the substrate 511. The heating layer 512 is electrically connected to the circuit board 300. When the heating layer 512 is energized, it generates heat. The heating layer 512 can be disposed on the top surface of the substrate 511. The substrate 511 can be a ceramic substrate, but is not limited to a ceramic substrate. The heating layer 512 can optionally use a resistance wire or a circuit pattern formed on the substrate 511.

[0092] In some embodiments, the heating layer 512 can be disposed on the top edge of the substrate 511 so that when the heating device 500a is supported and connected to the light emitting assembly 310, the heating layer 512 is located on the side of the light emitting assembly 310. This ensures that the heat generated by the heating device 500a is evenly transmitted to the light emitting assembly 310, thereby stabilizing the operating temperature of each laser in the light emitting assembly 310. In some embodiments, the heating layer 512 is disposed on the top edge of the substrate 511 away from the driver 330.

[0093] In some embodiments, the heating layer 512 extends from one end of the light emitting component 310 to the other end of the light emitting component 310, that is, the length of the heating layer 512 is greater than or equal to the length of the light emitting component 310, so that the heat generated by the heating layer 512 can be transmitted to the light emitting component 310 more evenly.

[0094] In some embodiments, the heating device 500a further includes a first solder pad 513 and a second solder pad 514. The first solder pad 513 is electrically connected to one end of the heating layer 512, and the second solder pad 514 is electrically connected to the other end of the heating layer 512. The first solder pad 513 and the second solder pad 514 are used to facilitate the electrical connection of the heating layer 512 to the circuit board 300.

[0095] The first solder pad 513 and the second solder pad 514 can be disposed on the top surface of the substrate 511, with the first solder pad 513 located at one end of the heating layer 512 and the second solder pad 514 located at the other end of the heating layer 512. The first solder pad 513 and the second solder pad 514 can also be disposed on the side surface of the substrate 511, with the heating layer 512 extending from the top surface of the substrate 511 to the side surface of the substrate 511.

[0096] Figure 8 illustrates a support component in use according to some embodiments of the present disclosure. As shown in Figure 8 , the support component 700 includes a support portion 711 and a connecting portion 712. The top of the support portion 711 supports and connects to the bottom of the heating device 500a, while the bottom of the support portion 711 connects to the connecting portion 712. The connecting portion 712 is used to connect to the circuit board 300, while the support portion 711 is embedded in the through hole 301.

[0097] In some embodiments, the top of the support portion 711 may directly support the light emitting assembly 310 , that is, the bottom of the light emitting assembly 310 is connected to the top of the support portion 711 .

[0098] In some embodiments, the cross-sectional dimensions of the connecting portion 712 are larger than those of the supporting portion 711, forming a stepped surface 713 on the side edge of the bottom of the supporting portion 711. The stepped surface 713 facilitates the connection of the supporting component 700 to the circuit board 300 and adjusts the relative height between the top of the supporting portion 711 and the surface of the circuit board 300. The supporting component 700 can be connected to the circuit board 300 by applying glue to the stepped surface 713. In some embodiments, the stepped surface 713 is connected to the back surface of the circuit board 300.

[0099] FIG9 is a first schematic diagram of an assembly of a support component provided according to some embodiments of the present disclosure. As shown in FIG9 , the support portion 711 of the support component 700 is located within the through hole 301. The top of the support portion 711 is connected to the bottom of the support-connected heating device 500a, and the light-emitting assembly 310 is disposed on the top of the heating device 500a. The top surface of the support portion 711 is lower than the top surface 300a of the circuit board 300 to facilitate controlling the height of the top of the light-emitting assembly 310. The connecting portion 712 is located on the other side of the circuit board 300 away from the top surface 300a. The connecting portion 712 is connected to the circuit board 300 via a thermally conductive gel. For example, the thermally conductive gel wraps around the side edges of the connecting portion 712 and the back of the circuit board 300. In this way, the support component 700 can not only facilitate the installation of the heating device 500a and the light emitting component 310, but also facilitate the connection of the circuit board 300, and can also facilitate the transfer of excess heat to the back of the circuit board 300, thereby reducing the concentration of heat transferred to the top surface 300a of the circuit board 300, thereby reducing the adverse effects of excessive heat on the devices set on the top surface 300a.

[0100] In some embodiments, the height of the supporting portion 711 is higher than the height of the connecting portion 712 , so that when the supporting component 700 is connected to the circuit board 300 , the top of the supporting portion 711 passes through the through hole 301 .

[0101] In some embodiments, the side wall of the through hole 301 includes two arc surfaces, and the two arc surfaces are located at both ends of the side wall of the through hole 301 to facilitate the assembly and connection between the through hole 301 and the supporting component 700.

[0102] In some embodiments, the bottom of the connecting portion 712 does not contact the housing of the optical module, such as the lower housing 202, to reduce the heat generated by the heating device 500a from being directly transferred from the support component 700 to the housing of the optical module, thereby ensuring the utilization rate of the heat generated by the heating device 500a. Moreover, when the heating device 500a is not working, the support component 700 can also help dissipate heat from the optical transmission assembly 310 to a certain extent, effectively preventing the performance of the optical transmission assembly 310 from being affected by high temperature.

[0103] In some embodiments, the bottom of the connection portion 712 contacts the lower housing 202 to facilitate the transfer of heat generated by the optical emission assembly 310 and the like to the lower housing 202 through the support component 700 , thereby ensuring the stability of the operating temperature of the optical emission assembly 310 .

[0104] In some existing technologies, a metal support block is placed beneath the chip, primarily for heat dissipation and chip height adjustment. For example, the top of the support block supports the chip, while the bottom of the support block contacts the housing of the optical module. This allows heat generated by the chip to be directly transferred to the housing through the support block, improving heat dissipation efficiency. Alternatively, the support block supports the chip so that the top surface of the chip is flush with the top surface of the circuit board, making it easier to control the bonding length between the chip and the circuit board.

[0105] In some embodiments, the stepped surface 713 supports the back of the circuit board 300, facilitating the connection of the connecting portion 712 to the circuit board 300. For example, thermal conductive gel connects the stepped surface 713 and the back of the circuit board 300, and the thermal conductive gel also wraps the side of the connecting portion 712.

[0106] FIG10 is a second schematic diagram of the assembly of a support component according to some embodiments of the present disclosure. As shown in FIG10 , a support portion 711 is located within a through-hole 301. The top of the support portion 711 connects and supports the bottom of the heater 500a and the bottom of the optical emission assembly 310. The optical emission assembly 310 is located between the heater 500a and the driver 330. The top surface of the support portion 711 is flush with the top surface 300a of the circuit board 300 to facilitate controlling the height of the top of the optical emission assembly 310. The connecting portion 712 is located on the back side of the circuit board 300. The connecting portion 712 is assembled and connected to the back side of the circuit board 300 via a stepped surface 713. In some embodiments, the connecting portion 712 is connected to the back side of the circuit board 300 via a thermally conductive gel. The thermally conductive gel wraps around the side of the connecting portion 712 and connects to the circuit board 300.

[0107] Figure 11 is a schematic diagram of the internal structure of another optical module provided according to an embodiment of the present disclosure. Figure 12 is an exploded schematic diagram of the internal structure of another optical module provided according to an embodiment of the present disclosure. Figure 13 is a partially enlarged schematic diagram of point B in Figure 12. Figure 11 shows a fiber optic connector in a vertical position. As shown in Figures 11-13, a TEC 500b is positioned below the lens assembly 400. The top support of the TEC 500b is connected to the optical transmission assembly 310, and the TEC 500b is electrically connected to the circuit board 300. When powered, the TEC 500b can release or absorb heat, thereby adjusting the temperature around the optical transmission assembly 310 to maintain the operating temperature of the optical transmission assembly 310 within a relatively stable range.

[0108] In some embodiments, a temperature detection device is provided on the TEC 500b, and the temperature detection device is used to detect the temperature around the light emitting assembly 310. The temperature detection device can be a thermistor or the like.

[0109] In some embodiments, the support member 700 supports and connects the TEC 500b, with the top of the support member 700 connected to the bottom of the TEC 500b and the top of the TEC 500b supporting and connecting the light emitting assembly 310. The support member 700 is connected to the circuit board 300 so that the TEC 500b is located in the through hole 301.

[0110] In some embodiments, the light emitting assembly 310 is disposed at the top edge of the TEC 500b, and the driver 330 is disposed on the circuit board 300, to the side of the light emitting assembly 310. The top surface of the TEC 500b can be lower than the top surface of the circuit board 300, or the top surface of the TEC 500b can be flush with the top surface of the circuit board 300, thereby facilitating control of the relative heights of the top surfaces of the light emitting assembly 310 and the driver 330.

[0111] In some embodiments, the light emitting assembly 310 is disposed at the top edge of the TEC 500b, and the light receiving assembly 320 is disposed to the side of the light emitting assembly 310, at the edge of the through hole 301, so that the light receiving assembly 320 and the light emitting assembly 310 are disposed side by side along the width of the circuit board 300. The TIA 340 is located to the side of the light receiving assembly 320 and the driver 330, so that the TIA 340 and the driver 330 are disposed side by side along the width of the circuit board 300, thereby fully utilizing the space below the lens assembly 400 and facilitating control of the size of the lens assembly 400.

[0112] In some embodiments, the driver 330 may be disposed on the top of the TEC 500 b , and the driver 330 is located on the side of the light emitting assembly 310 .

[0113] Figure 14 is a schematic diagram of the structure of a circuit board provided according to some embodiments of the present disclosure. As shown in Figure 14 , a relief portion 3011 is provided on the sidewall of through-hole 301. This relief portion 3011 is used to allow through-hole 301 to clear the TEC 500b, facilitating assembly of the TEC 500b. In some embodiments, through-hole 301 is a prismatic through-hole, with relief portions 3011 provided at the corners of through-hole 301. These relief portions 3011 are fillets, which relatively enlarge the size of through-hole 301 at these corners. This facilitates assembly of the TEC 500b while effectively controlling the overall size of through-hole 301 and preventing it from being excessively large.

[0114] Figure 15 is a schematic diagram of the structure of another support component provided according to some embodiments of the present disclosure, and Figure 16 is a diagram of another support component in use according to some embodiments of the present disclosure. As shown in Figure 15, support component 700 includes a support portion 711 and a connecting portion 712. The top of support portion 711 supports and connects to TEC 500b, and the top of support portion 711 is connected to connecting portion 712, which is used to connect to circuit board 300.

[0115] In some embodiments, the height of the support portion 711 is lower than the height of the connection portion 712 , which can facilitate the connection between the support component 700 and the circuit board 300 and the height adaptation of the TEC 500 b.

[0116] In some embodiments, the cross-sectional dimensions of the connecting portion 712 are larger than those of the supporting portion 711, forming a stepped surface 713 on the side edge of the bottom of the supporting portion 711. The stepped surface 713 facilitates connection of the supporting component 700 to the circuit board 300 and adjusts the height of the top surface of the TEC 500b relative to the surface of the circuit board 300. The stepped surface 713 can be glued to the bottom surface of the circuit board 300.

[0117] Figure 17 is a partial diagram illustrating the assembly of another support component according to some embodiments of the present disclosure, and Figure 18 is a partial diagram illustrating the assembly of another support component according to some embodiments of the present disclosure. As shown in Figure 17, the top of the support portion 711 is located within the through-hole 301, while the bottom of the support portion 711 is located outside the through-hole 301. This ensures that the top surface of the TEC 500b is flush with or lower than the top surface of the circuit board 300, thereby ensuring that the top surface of the optical emitting assembly 310 is flush with the top surface of the driver 330. As shown in Figure 18, thermal conductive gel 01 surrounds the sides of the connecting portion 712, which is connected to the circuit board 300 via the thermal conductive gel 01.

[0118] Figure 19 is a cross-sectional view of another optical module according to some embodiments of the present disclosure. As shown in Figure 19, the base plate 2021 is formed with a support platform 2023. The top of the support platform 2023 contacts the bottom of the connecting portion 712 to facilitate heat transfer to the lower housing 202 via the support member 700. The top of the support platform 2023 can be connected to the connecting portion 712 via thermally conductive grease or gel.

[0119] FIG20 is a first exploded schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure, and FIG21 is a second exploded schematic diagram of the internal structure of another optical module provided according to some embodiments of the present disclosure. As shown in FIG20 and FIG21, an optical emitting assembly 310, an optical receiving assembly 320, a driver 330, a TIA 340, and a support component 700 are disposed below the lens assembly 400. The support component 700 is connected to the circuit board 300, and the top support component 700 connects the optical emitting assembly 310, the optical receiving assembly 320, the driver 330, and the TIA 340. The support component 700 can be made of a material with good thermal conductivity, such as metal, such as tungsten copper, etc. The support component 700 can effectively stabilize the operating temperature of the optical emitting assembly 310, the optical receiving assembly 320, the driver 330, and the TIA 340.

[0120] In some embodiments, the top of the support component 700 is located in the through hole 301 , a pad is provided at the edge of the through hole 301 , and the driver 330 and the TIA 340 are respectively connected to the pads at the edge of the through hole 301 by wire bonding.

[0121] Figure 22 is a schematic diagram of the structure of another support component provided according to some embodiments of the present disclosure, Figure 23 is a partially enlarged view of another support component provided according to some embodiments of the present disclosure, and Figure 24 is a second schematic diagram of the structure of another support component provided according to some embodiments of the present disclosure. As shown in Figures 22-24, in some embodiments, the support component 700 includes a support portion 711 and a connecting portion 712. The connecting portion 712 is located at the bottom of the support portion 711, and a step surface 713 is formed on the top of the connecting portion 712. The step surface 713 surrounds the side of the bottom of the support portion 711; the step surface 713 is used to connect to the circuit board 300.

[0122] A glue dispensing groove 714 is formed on the connecting portion 712 and is located at the bottom edge of the supporting portion 711. The top surface of the connecting portion 712 is sunken to form the glue dispensing groove 714, so that the bottom surface of the glue dispensing groove 714 is lower than the stepped surface 713. The glue dispensing groove 714 is used for glue dispensing and positioning during assembly of the supporting component 700, facilitating glue dispensing and facilitating the support component 700 to carry glue.

[0123] In some embodiments, the width of the glue dispensing groove 714 is greater than or equal to 1 / 3 of the width of the step surface 713, and the width of the glue dispensing groove 714 is less than or equal to 1 / 2 of the width of the step surface 713. For example, the width of the glue dispensing groove 714 is greater than 1 / 3 of the width of the step surface 713 and less than 1 / 2 of the width of the step surface 713, such as the width of the glue dispensing groove 714 is 2 / 5 of the width of the step surface 713. This facilitates coordinated control of the glue dispensing amount of the glue dispensing groove 714 to control the assembly of the support component 700 and the circuit board 300.

[0124] In some embodiments, four glue dispensing grooves 714 are formed on the connecting portion 712, and the four glue dispensing grooves 714 are distributed at the bottom of the four corners of the supporting portion 711. Of course, in the disclosed embodiment, the step surface 713 is not limited to being provided with four glue dispensing grooves 714 on the connecting portion 712, and two, three, etc. can also be provided.

[0125] In some embodiments, a dispensing groove 714 is provided with a dispensing positioning groove 715 on its bottom surface. The dispensing positioning groove 715 is used to assist in positioning the dispensing groove 714 so that the dispensing machine can accurately dispense glue into the dispensing groove 714 when dispensing glue into the dispensing groove 714. The bottom surface of the dispensing positioning groove 715 is lower than the bottom surface of the dispensing groove 714. In some embodiments, the dispensing groove 714 may be provided with a positioning protrusion for positioning the dispensing.

[0126] In some embodiments, a drainage groove 716 is provided on the connection portion 712. The drainage groove 716 is connected to the glue dispensing groove 714. The drainage groove 716 is used to drain the glue, effectively reducing the poor assembly precision of the support component 700 and the circuit board 300 caused by excessive glue dispensing. Exemplarily, the drainage groove 716 is provided between two adjacent glue dispensing grooves 714. One end of the drainage groove 716 is connected to the edge of one glue dispensing groove 714, and the other end of the drainage groove 716 is connected to the edge of the other glue dispensing groove 714.

[0127] In some embodiments, the glue dispensing groove 714 is a substantially cubic structure, and the drainage groove 716 extends along a side of the glue dispensing groove 714 away from the support portion 711 .

[0128] In some embodiments, a mounting positioning groove 717 is provided at the bottom of the connecting portion 712 . The mounting positioning groove 717 is used for assembling and positioning the supporting component 700 and the circuit board 300 , so as to facilitate the assembly of the supporting component 700 and the circuit board 300 .

[0129] Figure 25 illustrates another support component in use according to some embodiments of the present disclosure. As shown in Figure 25 , in some embodiments, the optical transmitter assembly 310 and the optical receiver assembly 320 are arranged side by side on top of the support component 700 along the width direction of the support component 700, the driver 330 is arranged on a side of the optical transmitter assembly 310 away from the optical port of the optical module 200, and the TIA 340 and the driver 330 are arranged side by side on top of the support component 700 along the width direction of the support component 700.

[0130] The support portion 711 is located in the through hole 301, so that the light receiving component 320 and the light emitting component 310 are arranged side by side along the width direction of the circuit board 300; the TIA 340 is located on the side of the light receiving component 320 and the driver 330, so that the TIA 340 and the driver 330 are arranged side by side along the width direction of the circuit board 300, so as to make full use of the space on the top of the support portion 711; it is also convenient to make full use of the space below the lens assembly 400, so as to control the size of the lens assembly 400.

[0131] Figure 26 is a schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure, Figure 27 is a first exploded schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure, Figure 28 is a partial schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure, and Figure 29 is a second exploded schematic diagram of the internal structure of another optical module according to some embodiments of the present disclosure. As shown in Figures 26-29, in some embodiments, a light emitting assembly 310, a light receiving assembly 320, a driver 330, a TIA 340, a TEC 500b, and a support component 700 are disposed below the lens assembly 400. The support component 700 supports and connects the light receiving assembly 320, the driver 330, the TIA 340, and the TEC 500b, and the TEC 500b supports and connects the light emitting assembly 310.

[0132] When the transmission rate of the laser in the optical transmitter assembly 310 is no less than 200 Gb / s, to ensure laser performance, the operating temperature of the optical transmitter assembly 310 must be stabilized within a range of ±1°C from the preset temperature. The support component 700 is made of materials with excellent heat dissipation capabilities, such as tungsten copper. Combined with the TEC500b, the support component 700 precisely maintains the operating temperatures of the optical transmitter assembly 310, optical receiver assembly 320, driver 330, and TIA 340 within a certain range. This reduces thermal crosstalk between the optical transmitter assembly 310, optical receiver assembly 320, driver 330, and TIA 340, effectively maintaining the operating temperature of the optical transmitter assembly 310 and ensuring the stability of the optical transmitter assembly's performance.

[0133] In some embodiments, the circuit board 300 includes a first edge 3012, a second edge 3013, a third edge 3014 and a fourth edge 3015, and the first edge 3012, the second edge 3013, the third edge 3014 and the fourth edge 3015 are connected in sequence around the edges of the through hole 301, the first edge 3012 is located on the side of the through hole 301 close to the optical port of the optical module 200, the third edge 3014 is located on the side of the through hole 301 away from the optical port of the optical module 200, and the second edge 3013 and the fourth edge 3015 extend along the length direction of the circuit board 300.

[0134] The optical transmitter assembly 310 is wired to the driver 330, which is wired to the circuit board 300. The optical receiver assembly 320 is wired to the TIA 340, which is wired to the circuit board 300. The TEC 500b is wired to the circuit board 300. For example, the driver 330 is wired to the second edge 3013 and the third edge 3014, the TIA 340 is wired to the third edge 3014 and the fourth edge 3015, and the TEC 500b is wired to the second edge 3013. Multiple solder pads are provided on each of the second edge 3013, the third edge 3014, and the fourth edge 3015.

[0135] In some embodiments, a thermistor assembly 350 may be disposed below the lens assembly 400. The thermistor assembly 350 is disposed on the TEC 500b and is located to the side of the light emitting assembly 310. Of course, in some embodiments, the support member 700 supports and connects the thermistor assembly 350, meaning that the thermistor assembly 350 is directly disposed on the support member 700. The thermistor assembly 350 is used to detect the operating temperature of the light emitting assembly 310, providing a reference for controlling the TEC 500b.

[0136] FIG30 is a first schematic diagram of the structure of another support component provided according to some embodiments of the present disclosure, FIG31 is a second schematic diagram of the structure of another support component provided according to some embodiments of the present disclosure, and FIG32 is a third schematic diagram of the structure of another support component provided according to some embodiments of the present disclosure. As shown in FIG30-32, in some embodiments, the support component 700 includes a support portion 711 and a connecting portion 712. The connecting portion 712 is located at the bottom of the support portion 711. The top of the connecting portion 712 and the support portion 711 form a stepped surface 713. The stepped surface 713 surrounds the side of the bottom of the support portion 711. A notch 718 is formed on the edge of one side of the support portion 711, and the notch 718 extends in the direction of the connecting portion 712.

[0137] In some embodiments, a mounting groove 719 is provided at the top of the connecting portion 712, the bottom surface of the mounting groove 719 is lower than the step surface 713 and the step surface 713 surrounds the side of the mounting groove 719, and the other side of the mounting groove 719 extends to the bottom of the missing corner 718, so that the mounting groove 719 is surrounded by the supporting portion 711 and the step surface 713.

[0138] In some embodiments, a glue dispensing groove 714 is provided on the edge of the connection portion 712. One edge of the glue dispensing groove 714 extends to the bottom of the support portion 711 and the other edge extends to the edge of the connection portion 712. The bottom of the glue dispensing groove 714 is lower than the stepped surface 713. The glue dispensing groove 714 is used to hold glue to facilitate glue dispensing. In some embodiments, the glue dispensing groove 714 is not provided on the edge of the mounting slot 719 to reduce the risk of glue contamination of the TEC 500b.

[0139] In some embodiments, three glue dispensing grooves 714 are formed on the connecting portion 712 , and the three glue dispensing grooves 714 are distributed at the bottoms of the three corners of the supporting portion 711 .

[0140] In some embodiments, a glue dispensing positioning groove 715 is provided on the bottom surface of the glue dispensing groove 714. The glue dispensing positioning groove 715 is used to assist in positioning the glue dispensing groove 714 so that the glue dispensing machine can accurately dispense glue into the glue dispensing groove 714 when dispensing glue into the glue dispensing groove 714.

[0141] In some embodiments, a mounting positioning groove 717 is provided at the bottom of the connecting portion 712 , and the mounting positioning groove 717 is used for assembling and positioning the support component 700 and the circuit board 300 , so as to facilitate the assembly and fixation of the support component 700 and the circuit board 300 .

[0142] Figure 33 illustrates another support component in use according to some embodiments of the present disclosure, and Figure 34 illustrates a partially enlarged view of another support component in use according to some embodiments of the present disclosure. As shown in Figures 33 and 34, the TEC 500b is positioned within the notch 718, with the bottom surface of the mounting slot 719 supporting and connecting the bottom of the TEC 500b. The top of the TEC 500b supports and connects the thermistor assembly 350 and the optical transmitter assembly 310, with the thermistor assembly 350 positioned to the side of the optical transmitter assembly 310. The optical receiver assembly 320, driver 330, and TIA 340 are positioned at the top of the support portion 711, with the driver 330 positioned on the side of the optical transmitter assembly 310 away from the thermistor assembly 350.

[0143] In some embodiments, one side of the driver 330 is flush with one side of the support portion 711, and the TIA 340 is disposed on the other side of the driver 330. A gap is provided between one side of the TIA 340 and the other side of the driver 330, and the width of the gap is less than or equal to the width of the optical transmitter 310. The other side of the TIA 340 is flush with the other side of the support portion 711, and the optical receiver 320 is located on the side of the TIA 340. The gap between the TIA 340 and the driver 330 is used to reduce thermal crosstalk between the TIA 340 and the driver 330.

[0144] In some embodiments, thermistor assembly 350 includes a thermistor 351 and a thermistor substrate 352. A first metal layer 353 and a second metal layer 354 are disposed on the top surface of the thermistor substrate 352. The first and second metal layers 353 and 354 form a circuit pattern on the top of the thermistor substrate 352. The top of the thermistor substrate 352 is connected to the TEC 500b. Thermistor 351 is mounted on and electrically connected to the first metal layer 353. Thermistor 351 is also wire-bonded to the second metal layer 354. The first and second metal layers 353 and 354 are also wire-bonded to the circuit board 300.

[0145] In some embodiments, a laser substrate 311 is disposed beneath the optical transmitter assembly 310. The bottom of the laser substrate 311 is connected to the top of the TEC 500b, and the top of the laser substrate 311 is connected to the optical transmitter assembly 310. The thermal expansion coefficient of the laser substrate 311 is similar to that of the top of the TEC 500b. This helps buffer the stress generated by the thermal expansion and contraction of the TEC 500b, thereby reducing the adverse effects of this expansion and contraction on the optical transmitter assembly 310. A ceramic substrate can be used for the laser substrate 311.

[0146] In some embodiments, the width of the laser substrate 311 is greater than the width of the light emitting assembly 310 , and the length of the laser substrate 311 is greater than the length of the light emitting assembly 310 , so that the laser substrate 311 can balance the temperature of various locations on the light emitting assembly 310 .

[0147] In some embodiments, TEC 500b includes a first electrode 521 and a second electrode 522. First electrode 521 is located on the side of one end of laser substrate 311, and second electrode 522 is located on the side of one end of optical emission assembly 310. The cold surface of TEC 500b supports and connects thermistor assembly 350 and optical emission assembly 310, facilitating the maintenance of the operating temperature of optical emission assembly 310 within a relatively stable range, thereby ensuring the operating performance of optical emission assembly 310.

[0148] Figure 35 is a first cross-sectional view of another support component and circuit board assembly according to some embodiments of the present disclosure, and Figure 36 is a second cross-sectional view of another support component and circuit board assembly according to some embodiments of the present disclosure. As shown in Figures 35 and 36, the support portion 711 is located within the through hole 301, the connecting portion 712 is located below the circuit board 300, and the stepped surface 713 is connected to the bottom surface of the circuit board 300.

[0149] In some embodiments, the top surface of the support portion 711 is flush with the top surface of the circuit board 300, and the top surface of the laser substrate 311 is flush with the top surface of the circuit board 300. This facilitates controlling the arc height of the bonding wires of the optical emitting assembly 310 to the driver 330, the bonding wires of the optical receiving assembly 320 to the TIA 340, and the bonding wires of the driver 330 and TIA 340 to the circuit board 300, thereby ensuring high-frequency signal transmission performance for bonding wires used to transmit high-frequency signals. Of course, in some embodiments, the top surface of the support portion 711 may be lower than the top surface of the circuit board 300, and the top surface of the laser substrate 311 may be lower than the top surface of the circuit board 300, so that the top surfaces of the optical emitting assembly 310, the optical receiving assembly 320, the driver 330, and the TIA 340 are respectively flush with the top surface of the circuit board 300.

[0150] Figure 37 is a partial schematic diagram of another lower housing provided according to some embodiments of the present disclosure. As shown in Figure 37, a receiving groove 2024 is provided on the bottom plate 2021. The receiving groove 2024 is used to hold thermal grease or thermal adhesive, etc. The thermal grease or thermal adhesive connects the bottom plate 2021 and the bottom of the connecting portion 712. The thermal grease or thermal adhesive enables contact and connection between the connecting portion 712 and the lower housing 202, thereby facilitating heat transfer between the connecting portion 712 and the lower housing 202.

[0151] In some embodiments, a protrusion 2025 is provided within the receiving groove 2024. A gap is formed between the edge of the protrusion 2025 and the edge of the receiving groove 2024 to contain any overflowing thermal grease or adhesive, allowing the protrusion 2025 to support the bottom of the connecting portion 712. The combination of the receiving groove 2024 and the protrusion 2025 can improve the heat transfer efficiency between the connecting portion 712 and the lower housing 202, thereby ensuring sufficient heat dissipation of the support component 700.

[0152] In some embodiments, the number of lens assemblies 400 in the optical module 200 is not limited to one, and may also be two. When two lens assemblies 400 are provided in the optical module 200, the arrangement of components below the two lens assemblies 400 can refer to the arrangement of components below the optical module 200 provided with one lens assembly 400.

[0153] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: A circuit board is provided with a through hole; An optical transmitting component for generating an optical signal; A driver, electrically connected to the circuit board, located on a side of the light emitting assembly, and electrically connected to the light emitting assembly; A lens assembly, the bottom of which is connected to the circuit board and covers the light emitting assembly, and the lens assembly is used to change the transmission direction of the light signal generated by the light emitting assembly; The supporting component includes a supporting portion and a connecting portion, wherein the supporting portion is located in the through hole and the connecting portion is connected to the circuit board; the thermal conductivity of the supporting component is greater than or equal to the thermal conductivity of the circuit board; A temperature regulating mechanism is located below the lens assembly and has its bottom connected to the supporting component; the temperature regulating mechanism is located below the light emitting assembly or is arranged on the side of the light emitting assembly, and is used to maintain the operating temperature of the light emitting assembly.

2. The optical module according to claim 1, wherein: A notch is formed on one side of the support portion, and the top support of the support portion is connected to the driver; The temperature regulating mechanism includes a TEC, which is arranged on the notch. The top support of the TEC is connected to the light emitting assembly. The TEC is electrically connected to the circuit board and is used to maintain the operating temperature of the light emitting assembly.

3. The optical module according to claim 2, further comprising a light receiving assembly and a TIA, wherein the light receiving assembly and the TIA are located below the lens assembly and are disposed on top of the supporting member; The light receiving component and the driver are respectively located on the sides of the notched corner, and the TIA is located on the sides of the driver and the light receiving component; The optical transmitting component is connected to the driver by wire bonding, and the driver is connected to the circuit board by wire bonding; the receiving chip is connected to the TIA by wire bonding, and the TIA is connected to the circuit board by wire bonding.

4. The optical module according to claim 2, wherein: The top of the connecting portion is formed with a stepped surface and a glue dispensing groove; the stepped surface surrounds the side of the bottom of the supporting portion, and the stepped surface is connected to the circuit board; The glue dispensing groove is located at the edge of the bottom of the support part, and the bottom surface of the glue dispensing groove is lower than the step surface; the glue dispensing groove is used to set a glue dispensing positioning groove in the glue dispensing groove, and the bottom surface of the glue dispensing positioning groove is lower than the bottom surface of the glue dispensing groove.

5. The optical module according to claim 4, wherein: The glue dispensing groove is located at the edge of the corner of the support part, and the side of the glue dispensing groove extends to the edge of the connecting part; the bottom of the connecting part is provided with an installation positioning groove, and the installation positioning groove is used to position and install the supporting component; A mounting groove is provided at the bottom of the notched corner, and the bottom surface of the mounting groove supports and connects to the TEC.

6. The optical module according to claim 2, wherein: A thermistor component is also provided on the top of the TEC, and the thermistor component is located on a side of the light emitting component away from the driver; wherein: The thermistor assembly includes a thermistor and a thermistor substrate; a first metal layer and a second metal layer are provided on the top surface of the thermistor substrate, the thermistor is mounted on the first metal layer, and the thermistor is connected to the second metal layer by wire bonding; The first metal layer and the second metal layer are respectively connected to the circuit board by wire bonding.

7. The optical module according to claim 6, wherein: A laser substrate is also provided on the top of the TEC, the bottom of the laser substrate is connected to the TEC, and the top of the laser substrate is supported and connected to the light emitting assembly; The width of the laser substrate is greater than the width of the light emitting component, and the length of the laser substrate is greater than the length of the light emitting component; there is a gap between the laser substrate and the thermistor substrate.

8. The optical module according to claim 3, wherein: The light receiving assembly and the light emitting assembly are arranged side by side along the width direction of the circuit board, and the TIA and the driver are arranged side by side along the width direction of the circuit board; One side of the driver is flush with one side of the support portion, one side of the TIA is spaced apart from the other side of the driver, and the other side of the TIA is flush with the other side of the support portion.

9. The optical module according to claim 1 further includes a lower shell, a receiving groove is provided on the bottom plate of the lower shell, a protrusion is provided in the receiving groove, and the protrusion supports and connects the bottom of the connecting part; the space between the receiving groove and the protrusion is filled with thermal grease or thermal glue.

10. The optical module according to claim 1, wherein: The temperature regulating mechanism includes a TEC, which is arranged on the top of the supporting portion; the top of the TEC is supported and connected to the light emitting assembly.

11. The optical module according to claim 10, wherein: The driver is arranged on the circuit board and is located at a side of the through hole. The driver is connected to the light emitting component by wire bonding.

12. The optical module according to claim 10, wherein: The height of the supporting portion is lower than that of the connecting portion; and a relief portion is provided on the side wall of the through hole, and the relief portion is located at the corner of the through hole. 13 . The optical module according to claim 10 , further comprising a lower housing, wherein a support platform is provided on a bottom plate of the lower housing, and the support platform is connected to the bottom of the supporting component via thermally conductive grease or thermally conductive gel.

14. The optical module according to claim 10, wherein: The top support of the TEC is connected to the driver, and the driver is connected to the circuit board by wire bonding; The top surface of the TEC is lower than the top surface of the circuit board or the top surface of the TEC is flush with the top surface of the circuit board.

15. The optical module according to claim 10, further comprising a light receiving assembly and a TIA, wherein the light receiving assembly and the TIA are located below the lens assembly, and the light receiving assembly and the TIA are disposed on the circuit board and located on a side of the through hole; The light receiving component and the light emitting component are arranged side by side along the width direction of the circuit board; The TIA is located at a side of the driver, and the TIA and the driver are arranged side by side along a width direction of the circuit board.

16. The optical module according to claim 10, further comprising a light receiving assembly and a TIA, wherein the light receiving assembly and the TIA are located below the lens assembly; The light receiving assembly and the TIA are respectively located on top of the supporting portion.

17. The optical module according to claim 1, wherein: The temperature adjustment mechanism includes a heating device, which is arranged on the top of the supporting component and the heating device is arranged on the side of the light emitting assembly or below the light emitting assembly.

18. The optical module according to claim 17, wherein: The heating device includes a substrate, on which a heating layer, a first solder pad and a second solder pad are provided, one end of the heating layer is connected to the first solder pad, the other end of the heating layer is connected to the second solder pad, and the heating layer extends from one end of the light emitting component to the other end of the light emitting component; the first solder pad and the second solder pad are electrically connected to the circuit board.

19. The optical module according to claim 17, wherein: The supporting component is connected to the circuit board by glue, and the bottom of the supporting component does not contact the housing of the optical module.

20. The optical module according to claim 18, wherein The driver is arranged on the side of the through hole; The heating layer is arranged at the edge of the top of the substrate and is located at the side of the substrate away from the driver; the bottom of the light emitting component is connected to the substrate.

21. The optical module according to claim 3, wherein: The circuit board includes a first edge, a second edge, a third edge, and a fourth edge, wherein the first edge, the second edge, the third edge, and the fourth edge surround the side of the through hole in sequence; the first edge is located on a side of the through hole close to the optical port of the optical module, and the third edge is located on a side of the through hole away from the optical port of the optical module; The second edge, the third edge, and the fourth edge are respectively provided with pads, the driver bonding wire connects the second edge and the third edge, and the TIA bonding wire connects the third edge and the fourth edge.

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