Electronic module for contact smart cards

Abstract

An electronic module (10) for a contact smart card is provided. The electronic module (10) includes a printed circuit (12) having a plurality of first pads (16) and one or more first reinforcement pads (18). The electronic module (10) also includes a contact plate (20) having a plurality of second pads (24) opposite the first pads (16) and one or more second reinforcement pads (26) opposite and supporting the first reinforcement pads (18). The electronic module (10) also includes an anisotropic conductive film (28) electrically connecting the plurality of first pads (16) to the plurality of second pads (24).

Description

Technical Field

[0001] This invention relates to an electronic module for a smart card and a method for assembling the electronic module. Background Technology

[0002] Smart cards are well-known and widely used, such as for SIM cards, bank cards, and smart cards used for personal identification or authentication.

[0003] A contact smart card includes an electronic module with contact plates that enable the smart card to interface with external components, such as a card reader. These contact plates are electrically connected to the smart card's internal circuitry.

[0004] Traditionally, assembling the contact plate and internal circuitry within a card involves soldering the contact plate to the internal circuitry. Due to variations in solder thickness, the final thickness of the electronic module cannot be precisely controlled, which can lead to problems when the electronic module is embedded in the smart card and potentially cause performance degradation.

[0005] Furthermore, during the embedding process, the solder paste may melt a second time, causing a short circuit, rendering the card malfunctioning, and potentially damaging components.

[0006] The purpose of this invention is to reduce or substantially eliminate the aforementioned problems. (AskExplain) Summary of the Invention According to a first aspect of the present invention, an electronic module for a contact smart card is provided, the electronic module comprising: a printed circuit including: a plurality of first pads and one or more first reinforcing pads; a contact plate including: a plurality of second pads opposite to the first pads and one or more second reinforcing pads opposite to and supporting the first reinforcing pads; and an anisotropic conductive film electrically connecting the plurality of first pads to the plurality of second pads.

[0007] This electronic module offers several advantages. The first and second reinforcing pads support the structure of the electronic module during lamination, making it less prone to peeling and deformation, thus improving the performance and aesthetics of the final product.

[0008] Preferably, the printed circuit can be a flexible printed circuit.

[0009] The advantage of flexible printed circuits is that they can be bent and flexed without damaging the circuit and maintaining their function, thereby improving availability.

[0010] Optionally, the anisotropic conductive film can physically connect the first reinforcing pad and the second reinforcing pad.

[0011] The anisotropic conductive film provides a physical connection between the first and second reinforcing pads to bond the printed circuit and the contact plate. Furthermore, using the anisotropic conductive film, rather than a separate adhesive, to physically connect the first and second reinforcing pads simplifies the manufacturing process.

[0012] Optionally, a tape or adhesive may be provided between the printed circuit and the contact plate, the tape or adhesive surrounding the first and second pads and the first and second reinforcing pads to provide physical adhesion of the electronic module.

[0013] Wrapping tape or adhesive around the first and second pads, as well as the first and second reinforcing pads, can provide a stronger physical connection between the printed circuit and the contact plate.

[0014] Optionally, the first reinforcing pad and the second reinforcing pad are physically connected by an adhesive, wherein the adhesive is non-conductive.

[0015] Compared to using only anisotropic conductive films, adhesives can provide a stronger physical connection between the first and second reinforcing pads, and since they do not need to be conductive, the cost of adhesives can be significantly lower than that of anisotropic conductive films.

[0016] Preferably, the adhesive can be bonded to the anisotropic conductive film.

[0017] Attaching the adhesive to the anisotropic conductive film helps to fix the anisotropic conductive film in place, preventing it from slipping and disconnecting the electrical connection between the first pad and the second pad.

[0018] Optionally, the first pad can form a first pad region, the second pad can form a second pad region, and the first reinforcing pad and the second reinforcing pad are respectively arranged adjacent to the first pad region and the second pad region.

[0019] The outermost pads are most easily separated under external force. Positioning the first and second reinforcing pads adjacent to their corresponding first and second pad regions helps protect the structure of the electronic module and reduces the risk of the first and second pads becoming disconnected.

[0020] Optionally, the plurality of first pads and the plurality of second pads may be evenly distributed in the corresponding first pad area and second pad area, respectively.

[0021] The uniform distribution of the first and second pads can provide a uniform force distribution in subsequent processes (such as laminating or embedding electronic modules into smart cards) and during the use of the smart card.

[0022] In a preferred embodiment, the first reinforcing pad may be symmetrically distributed about the first pad region, and the second reinforcing pad may be symmetrically distributed about the second pad region.

[0023] Symmetrically distributed reinforcing pads provide balanced support to both sides of the structure, which helps to form electronic modules of uniform thickness and extends the service life of the electronic modules.

[0024] According to a second aspect of the present invention, a contact smart card is provided, wherein the contact smart card includes the electronic module described in the first aspect of the present invention.

[0025] Optionally, the contact smart card can be a SIM card or a bank card.

[0026] SIM cards are widely used in the communications field, and the performance improvements provided by this invention significantly benefit them. Bank cards also benefit from the improved performance and aesthetics offered by this invention. Furthermore, SIM cards and bank cards are typically subjected to stress due to repeated use and wear; therefore, this invention extends the lifespan of SIM cards or bank cards due to the additional support provided by the reinforced solder pads.

[0027] According to a third aspect of the present invention, a method for assembling an electronic module for a smart card is provided, the method comprising the steps of: a] providing a printed circuit comprising: a plurality of first pads; and one or more first reinforcing pads; b] providing a contact plate comprising: a plurality of second pads opposite to the first pads; and one or more second reinforcing pads opposite to the first reinforcing pads; and c] electrically connecting the plurality of first pads to the plurality of second pads via an anisotropic conductive film, and physically supporting the first reinforcing pads on the second reinforcing pads.

[0028] This method provides an electronic module with superior performance and appearance. Furthermore, due to its relative simplicity, it is easily automated and enables the large-scale manufacture of electronic modules at low cost.

[0029] Preferably, the method may further include step d]: physically connecting the first reinforcing pad to the second reinforcing pad by means of an adhesive or by means of the anisotropic conductive film.

[0030] The physical connection between the first and second reinforcing pads can be achieved using an adhesive or an anisotropic conductive film, thereby bonding the contact plate and the printed circuit. Compared to using only anisotropic conductive film, adhesive can provide a stronger physical connection between the first and second reinforcing pads, and its cost is significantly lower than that of anisotropic conductive film; while using anisotropic conductive film to physically connect the first and second reinforcing pads can simplify the manufacturing process.

[0031] Preferably, the printed circuit can be provided as one of a plurality of printed circuits included on a printed circuit strip, and the contact plate can be provided as one of a plurality of contact plates included on a contact plate strip.

[0032] Printed circuit strips and / or contact strips are an effective way to mass-produce printed circuits and / or contact strips, and allow for subsequent roll-to-roll processing.

[0033] In a preferred embodiment, the electronic module can be assembled using a roll-to-roll assembly process.

[0034] Roll-to-roll assembly enables the mass production of the electronic modules at low cost and is well-suited for automated production. Attached Figure Description

[0035] To better understand the present invention and to more clearly illustrate how it is implemented, it will now be described by way of example only with reference to the accompanying drawings, in which: Figure 1 A schematic diagram of a first embodiment of an electronic module for a contact smart card according to a first aspect of the present invention is shown; Figure 2 It shows Figure 1 A plan view of the printed circuit of the electronic module shown. Figure 3 It shows Figure 1 A plan view of the contact plate of the electronic module shown; Figure 4 It shows multiple Figure 2 The printed circuit strip shown is a printed circuit board. Figure 5 It shows multiple Figure 3 The contact plate strip shown; and Figure 6 A schematic diagram of a second embodiment of an electronic module for a contact smart card according to a first aspect of the present invention is shown. Detailed Implementation

[0036] First refer to Figure 1The figure shows an electronic module 10 for a contact smart card, generally indicated by reference numeral 10. The electronic module 10 includes a printed circuit 12, which includes a first pad region 14 having a plurality of first pads 16, and a plurality of first reinforcing pads 18 adjacent to the first pad region 14. The electronic module 10 also includes a contact plate 20, which includes a second pad region 22 having a plurality of second pads 24, and a plurality of second reinforcing pads 26 adjacent to the second pad region 22.

[0037] The printed circuit 12 and contact plate 20 shown in the figure are aligned in an unconnected state. The printed circuit 12 has a number of first pads 16 and first reinforcing pads 18 corresponding to the second pads 24 and second reinforcing pads 26 of the contact plate 20, and has corresponding sizes and spacing to maximize the surface area for connection. Alternatively, the number of first reinforcing pads 18 may differ from the number of second reinforcing pads 26; for example, a large first reinforcing pad 18 may correspond to two or more small second reinforcing pads 26, and vice versa.

[0038] The first pads 16 are coplanar with each other and have substantially similar heights, and the second pads 24 are coplanar with each other and have the same or substantially the same height. Each first pad 16 and each second pad 24 is planar or substantially planar, thus forming a flat surface. This improves the quality of electrical connections between pads and reduces the thickness variation of the electronic module 10.

[0039] The electronic module 10 is formed by connecting the printed circuit 12 to the contact plate 20. The electrical connection is provided by the anisotropic conductive film 28, and the physical connection is provided by the adhesive 30.

[0040] The anisotropic conductive film 28 is conductive in the axial direction from the printed circuit 12 to the contact plate 20, thereby enabling an electrical connection between the first pad 16 and the corresponding second pad 24. The anisotropic conductive film 28 is not conductive in a direction parallel to the plane of the printed circuit 12 and the contact plate 20, thereby preventing unintended connections from forming between misaligned first pads 16 and second pads 24.

[0041] The adhesive 30 connects the first reinforcing pad 18 to the second reinforcing pad 26. Since the first reinforcing pad 18 and the second reinforcing pad 26 are not electrically connected, the adhesive 30 is not required to be conductive, which helps reduce costs. The adhesive 30 can be a thermoplastic or thermosetting adhesive, and may be provided, for example, in the form of a paste or tape.

[0042] The first reinforcing pad 18 and the second reinforcing pad 26 are located at the outer edges of the corresponding first pad area 14 and second pad area 22. This means that in subsequent processes, such as when the electronic module 10 is laminated or embedded in a smart card, when shear force is applied to the electronic module 10, most of the load will be applied to the reinforcing pads 18 and 26.

[0043] Due to the connection between the first reinforcing pad 18 and the second reinforcing pad 26, even if the electronic module 10 is bent, the first pad 16 and the second pad 24 can maintain a stable electrical connection. Even if the first reinforcing pad 18 and the second reinforcing pad 26 lose their connection, the electrical connection between the first pad 16 and the second pad 24 can still be maintained, thereby maintaining the function of the smart card.

[0044] Reference Figure 2 It shows a plan view of the printed circuit 12, in which the structure of the first pad 16 and the first reinforcing pad 18 can be seen more clearly.

[0045] The first pads 16 of the printed circuit 12 are evenly spaced within the first pad area 14, which can evenly distribute stress generated in subsequent processes, such as embedding or lamination.

[0046] However, the first pads 16 of the printed circuit 12 may also be arranged non-uniformly, depending on the layout of the printed circuit 12. The number of first pads 16 of the printed circuit may also be less than the number of second pads 24. In this case, the first pads 16 may be arranged irregularly to be opposite a specific second pad 24.

[0047] The first pad 16 is made of one or more conductive materials. The first pad 16 may be made of a single conductive material or may be formed of multiple conductive layers. Although not essential, but preferably, the first pad 16 is plated with a noble metal or a composition containing a noble metal to achieve corrosion resistance and take advantage of the excellent conductivity of such metals.

[0048] As can be seen, each of the plurality of first pads 16 is connected to a printed circuit trace 32. The printed circuit trace 32 is shown as an example only and is not intended to represent any particular printed circuit 12. Obviously, the structure of such printed circuit traces 32 can vary depending on the specific function that the printed circuit 12 is required to perform.

[0049] The shape of the first pad 16 can be determined according to the structure of the printed circuit trace 32 to avoid the first pad 16 covering the printed circuit trace 32. In addition, the first pad 16 can also be shaped to avoid covering the existing circuit on the contact plate 20.

[0050] Printed circuit traces 32, first pads 16, and first reinforcing pads 18 are disposed on a printed circuit board 34. The printed circuit traces 32 can be formed by any suitable means, such as, but not limited to, printing, etching, or electroplating; the first pads 16 and / or the first reinforcing pads 18 can be formed together with the printed circuit board 34 during the manufacturing process, or they can be processed onto the printed circuit board 34 by, for example, electrodeposition.

[0051] The printed circuit board 34 is a flexible printed circuit made of flexible plastic material, such as PET or PI film, but non-flexible printed circuits, such as multilayer thin epoxy glass (e.g., FR4) printed circuits, can also be used.

[0052] The printed circuit 12 can be configured to perform different functions as needed, such as, but not limited to, user identification or user data storage, and can be electrically connected to other electronic components via the printed circuit traces 32 or other means, depending on the requirements of the smart card. The printed circuit 12 has a double-sided or multi-layer structure, with multiple sides or layers electrically connected through vias 36 connecting the printed circuit traces 32. Obviously, a single-sided printed circuit 12 can also be used instead.

[0053] As shown in the figure, the first reinforcing pad 18 is positioned adjacent to the first pad region 14 of the printed circuit 12. Here, "adjacent" means that the first reinforcing pad is located next to the first pad region 14, and no electronic components are disposed in the gap between the first reinforcing pad 18 and the plurality of first pads 16.

[0054] In the illustrated embodiment, the printed circuit 12 has four first reinforcing pads 18, which are symmetrically distributed on both sides of the first pad region 14 and parallel to the first pads 16. The first reinforcing pads 18 and the first pads 16 are coplanar and have substantially the same height.

[0055] The reinforcing pads are located at opposite ends of the first pad region 14 and are parallel to the first pad 16. Of course, the number and arrangement of the first reinforcing pads 18 can be varied as needed. For example, although in Figure 2 The first reinforcing pad is disposed on the left and right sides of the first pad area 14, but it may also be disposed above and / or below the first pad area 14, or located on each side of the first pad area 14, or embedded within the first pad area 14.

[0056] In some cases, only one first reinforcing pad 18 may be provided. The first reinforcing pad 18 may cover one side or a portion of the first pad region 14. One or more first reinforcing pads 18 may also be adjacent to more than one side of the first pad region 14, or even completely surround the first pad region 14.

[0057] One or more of the first reinforcing pads 18 may be designed based on the layout of the printed circuit 12, for example by using different shapes or sizes to avoid covering the printed circuit traces.

[0058] The first reinforcing pad 18 is narrower than each of the first pads 16, and its surface area is smaller than that of each of the first pads 16, thus saving material costs. Of course, if a stronger physical connection is required, the first reinforcing pad 18 can also be wider than the first pads 16 and have a larger surface area. It is anticipated that in most arrangements, the total surface area of ​​each of the first pads 16 will be significantly larger than the total surface area of ​​each of the first reinforcing pads 18. In a preferred embodiment, the total surface area of ​​the first reinforcing pads 18 is less than half the total surface area of ​​the first pads 16.

[0059] The first reinforcing pad 18 is made of the same material as the first pad 16, which allows it to be formed or applied to the printed circuit board 34 simultaneously with the first pad 16, thereby improving manufacturing convenience. Furthermore, the fact that the first pad 16 and the first reinforcing pad 18 are made of the same material means that they have the same thermal expansion properties, thus eliminating potential stress caused by uneven expansion.

[0060] Alternatively, the first reinforcing pad 18 may be made of a different material than the first pad 16. For example, to save costs, the first reinforcing pad 18 may be made of a different metal or metal composition than the first pad 16. Since the first reinforcing pad 18 does not participate in the electrical connection, it is not required to be made of a conductive material, which helps to reduce costs and also allows the use of materials with higher strength and / or materials that can bond better to the adhesive 30.

[0061] Figure 3 The structure of the contact plate 20 is shown in more detail, including a plan view of the contact surface of the printed circuit 12. It can be seen that the second pad 24 of the contact plate 20 has a matching shape and spacing with the first pad 16 of the printed circuit 12; the second pad 24 is also equally spaced and has the same width as the first pad 16. The length of the second pad 24 is less than the length of the first pad. In the connected state, the entire surface of the second pad 24 is covered by the first pad 16.

[0062] One or more of the second pads 24 may have different sizes and / or shapes from one another. The second pads 24 may be designed to avoid the printed circuit traces 32 on the printed circuit 12 when the printed circuit 12 is connected to the contact plate 20, thereby avoiding unintended electrical connections.

[0063] While it is preferred that the first pad 16 and the second pad 24 have similar shapes and sizes, it is generally not required that the first pad 16 and the second pad 24 have similar shapes and / or sizes, as long as at least a portion of the first pad 16 is aligned with at least a portion of the second pad 24.

[0064] Furthermore, the number of second pads 24 may differ from the number of first pads 16. For example, in some cases, the printed circuit 12 may not need to be fully connected to each second pad 24. In such cases, it is preferable that the printed circuit 12 has fewer first pads 16 than second pads 24. Although not strictly necessary, it is generally preferred that each first pad 16 is connected to exactly one second pad 24.

[0065] The second pad 24 is made of one or more conductive materials and may have the same or substantially the same material composition as the first pad 16. Like the first pad 16, the second pad 24 is preferably plated with a noble metal or a composition containing a noble metal to improve corrosion resistance.

[0066] The second reinforcing pad 26 is made of the same material as the second pad 24, which allows it to be formed or applied to the contact plate 20 simultaneously with the second pad 24, thereby improving manufacturing convenience. Alternatively, the second reinforcing pad 26 may be made of a metal or metal composition that is less expensive than the second pad 24, or of a non-conductive material to reduce costs, or may be made of a higher strength material and / or a material that bonds better with the adhesive 30.

[0067] The second reinforcing pad 26 is coplanar with the second pad 24 and has a basically the same height, which is also to enable precise control of the product thickness.

[0068] The contact plate 20 includes a reader contact element disposed on the side opposite to the contact surface of the printed circuit 12, which allows the electronic module 10 to make electrical connections and communication with external devices such as a card reader.

[0069] The card reader contact element includes a plurality of card reader contacts, each second pad 24 being electrically connected to one or more card reader contacts. The card reader contact element may be a six-pin or eight-pin interface conforming to the international standard ISO / IEC 7816.

[0070] The contact plate 20 includes a contact plate substrate 38 for carrying the second pad 24, the second reinforcing pad 26, and the reader contact element, as well as any circuitry connecting the reader contact element to the second pad 24. The contact plate substrate 38 is made of a flexible plastic material, such as polyimide film or PET, but a non-flexible contact plate substrate may also be used.

[0071] Manufacturing the electronic module 10 using a roll-to-roll process has advantages. See also Figure 4 and Figure 5 , Figure 4 A printed circuit strip 40 with multiple printed circuits 12 is shown. Figure 5 A contact plate strip 42 with multiple contact plates 20 is shown.

[0072] The printed circuit strip 40 and the contact plate strip 42 are made of flexible carrier tape using a roll-to-roll process. The flexible carrier tape is fed into a roll-to-roll conveyor system in which the printed circuit 12 and the contact plate 20 are applied to the corresponding carrier tape.

[0073] In the roll-to-roll manufacturing process, the printed circuit strip 40 is aligned with the contact plate strip 42, and an anisotropic conductive film 28 and adhesive 30 are placed between them. Subsequently, the printed circuit strip 40 and the contact plate strip 42 are pressed together, the first pad 16 and the second pad 24 are electrically connected by the anisotropic conductive film 28, and the first reinforcing pad 18 and the second reinforcing pad 26 are physically connected by the adhesive 30, thereby forming an electronic module strip with multiple electronic modules 10.

[0074] The electronic module 10 is then heated to promote the curing of the adhesive 30 and / or the anisotropic conductive film 28. During roll-to-roll assembly, the adhesive 30 bonds with the anisotropic conductive film 28 to prevent the anisotropic conductive film 28 from slipping or falling off, thereby maintaining a stable electrical connection between the contact plate 20 and the printed circuit 12.

[0075] The electronic module 10 can then be separated from the electronic module belt by means of, for example, stamping or cutting.

[0076] Although the printed circuit strip 40 shown in the figure has two rows of parallel printed circuits 12 and the contact plate strip 42 has two rows of parallel contact plates 20, the contact plates 20 or the printed circuits 12 can be arranged in any number and any manner. Preferably, the printed circuit strip 40 corresponds to the contact plate strip 42 to simplify manufacturing, but other arrangements are also possible.

[0077] Alternatively, the printed circuit 12 and the contact plate 20 can be removed from the corresponding printed circuit strip 40 and contact plate strip 42 by means of, for example, stamping, and then connected by anisotropic conductive film 28 and adhesive 30 to form electronic module 10.

[0078] Once the electronic module 10 is formed, it can be installed on a suitable carrier according to the type of the target smart card, such as a SIM card or a bank card, thereby creating a contact smart card.

[0079] Figure 6A second embodiment of an electronic module for a smart card is shown. The same or similar reference numerals will be used to denote the same or similar parts, and will not be repeated for the sake of brevity.

[0080] exist Figure 6 In the illustrated embodiment, the printed circuit 112 further includes a first external reinforcing element 144, and the contact plate 120 further includes a second external reinforcing element 146, wherein the second external reinforcing element 146 is disposed opposite to the first external reinforcing element 144. The first external reinforcing element 144 and the second external reinforcing element 146 are physically connected by an adhesive 130, thereby firmly bonding the printed circuit 112 to the contact plate 120.

[0081] Although external reinforcing elements 144, 146 can provide improved physical adhesion between the printed circuit 112 and the contact plate 120, the first external reinforcing element 144 and the second external reinforcing element 146 can also be omitted, and the printed circuit 112 and the contact plate 120 can be directly bonded by adhesive.

[0082] It should be noted that although the above description is made with reference to printed circuits 12; 112, those skilled in the art will clearly understand that any suitable substrate suitable for carrying the circuit can be used. Therefore, other methods such as etching, electroplating, dry or wet imaging, and / or screen printing can be used to form deposited printed circuit traces on printed circuits 12; 112. It is conceivable that since the anisotropic conductive films 28 and 128 themselves have adhesive properties, the adhesives 30 and 130 can be omitted. While this approach is not preferred due to increased material costs and lower connection quality, it simplifies the assembly process.

[0083] Therefore, the present invention provides a contact smart card having electronic modules 10 and 110, which maintains functionality even under stress due to the support of reinforcing pads 18, 26, 118, and 126. Furthermore, since the thickness of the electronic module can be more precisely controlled, the present invention provides a contact smart card with improved performance and aesthetics.

[0084] The terms “comprising / including” and “having / including” as used in reference to this invention are used to indicate the presence of the stated feature, integral, step or component, but do not exclude the presence or addition of one or more other features, integrals, steps, components or combinations thereof.

[0085] It should be understood that certain features of the invention described in the context of different embodiments for clarity may also be combined in a single embodiment. Conversely, various features of the invention described in the context of a single embodiment for brevity may also be provided individually or in any suitable sub-combination.

[0086] The above embodiments are provided by way of example only, and various changes and modifications will be apparent to those skilled in the art without departing from the scope of the invention as defined by the appended claims.

Claims

1. An electronic module (10) for contact smart cards; 110), the electronic module (10) includes: A printed circuit (12; 112) comprising: Several first pads (16; 116); and One or more first reinforcing pads (18; 118); A contact plate (20; 120) comprising: A plurality of second pads (24; 124) opposite to the first pads (16; 116); and One or more second reinforcing pads (26; 126) opposite to and supporting the first reinforcing pad (18; 118); and It electrically connects the plurality of first pads (16; 116) to an anisotropic conductive film (28; 128) of the plurality of second pads (24; 124).

2. The electronic module (10; 110) as described in claim 1, characterized in that, The printed circuits (12; 112) are flexible printed circuits.

3. The electronic module (10; 110) as described in claim 2, characterized in that, The anisotropic conductive film (28; 128) physically connects the first reinforcing pad (18; 118) to the second reinforcing pad (26; 126).

4. The electronic module (10; 110) as described in claim 2, characterized in that, A tape or adhesive (130) is provided between the printed circuit (12; 112) and the contact plate (20; 120), the tape or adhesive (130) surrounding the first and second pads (16, 24; 116, 124) and the first and second reinforcing pads (18, 26; 118, 126) to provide physical adhesion of the electronic module (10; 110).

5. The electronic module (10) as described in claim 2, characterized in that, The first reinforcing pad (18) and the second reinforcing pad (26) are physically connected by an adhesive (30), wherein the adhesive (30) is non-conductive.

6. The electronic module (10; 110) as described in claim 4 or 5, characterized in that, The adhesive (30; 130) is bonded to the anisotropic conductive film (28; 128).

7. The electronic module (10; 110) as described in claim 2, characterized in that, The first pad (16; 116) forms a first pad region (14; 114), the second pad (24; 124) forms a second pad region (22; 122), and the first reinforcing pad (18; 118) and the second reinforcing pad (26; 126) are respectively arranged adjacent to the first pad region (14; 114) and the second pad region (22; 122).

8. The electronic module (10; 110) as described in claim 7, characterized in that, The plurality of first pads (16; 116) and the plurality of second pads (24; 124) are evenly distributed in the corresponding first pad area (14; 114) and second pad area (22; 122), respectively.

9. The electronic module (10; 110) as claimed in claim 7 or claim 8, characterized in that, The first reinforcing pads (18; 118) are symmetrically distributed with respect to the first pad region (14; 114), and the second reinforcing pads (26; 126) are symmetrically distributed with respect to the second pad region (22; 122).

10. A contact smart card, characterized in that, The contact smart card includes the electronic module (10; 110) as described in any of the preceding claims.

11. The contact smart card as described in claim 10, characterized in that, The contact smart card can be a SIM card or a bank card.

12. An electronic module for assembling smart cards (10; The method of 110) includes the following steps: a] Provides a printed circuit (12; 112) comprising: Several first pads (16; 116); and One or more first reinforcing pads (18; 118); b] Provide a contact plate (20; 120) comprising: A plurality of second pads (24; 124) opposite to the first pads (16; 116); and One or more second reinforcing pads (26; 126) opposite to the first reinforcing pads (18; 118); and c] The plurality of first pads (16; 116) are electrically connected to the plurality of second pads (24; 124) through an anisotropic conductive film (28; 128), and the first reinforcing pads (18; 118) are supported on the second reinforcing pads (26; 126).

13. The method of assembling the electronic module (10; 110) as claimed in claim 12, further comprising step d]: physically connecting the first reinforcing pad to the second reinforcing pad by means of an adhesive (30) or by means of the anisotropic conductive film (28; 128).

14. The method of assembling the electronic module (10; 110) as described in claim 12 or 13, characterized in that, The printed circuit (12; 112) is provided as one of a plurality of printed circuits (12; 112) included on a printed circuit strip (40), and the contact plate (20; 120) is provided as one of a plurality of contact plates (20; 120) included on a contact plate strip (42).

15. The method for assembling the electronic module (10; 110) as described in claim 14, characterized in that, The electronic modules (10; 110) are assembled using a roll-to-roll assembly process.

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