Connector assembly

Abstract

This invention relates to a connector assembly for connecting an electronic device. The connector assembly includes: a support member having a ridge; and a flexible planar circuit having an entry portion parallel to a longitudinal axis of the support member and a connection portion. The flexible planar circuit includes a first dielectric layer having a first signal line disposed on a first side of the first dielectric layer opposite to the support member in a first direction transverse to the ridge. The connection portion includes a first portion of the signal line. The ridge is arranged such that the connection portion of the planar flexible circuit deforms transversely to the entry portion of the flexible planar circuit at the ridge to connect the first portion of the first signal line to a first contact of the electronic device when the connector assembly is connected to the electronic device.

Description

Technical Field

[0001] This invention relates to a connector assembly for connecting electronic devices. Background Technology

[0002] Known connector assemblies can be used to connect external electronic control devices to cryogenic electronic systems. Cryogenic electronic systems can include, for example, qubit devices, quantum processors, sensing and detector systems, quantum internet devices, medical devices, cryptographic devices, classical computing processors, and any other electronic devices.

[0003] However, there are many other applications that use cryogenic electronic circuits, such as multi-pixel superconducting photon detectors used in astronomy and quantum communication applications.

[0004] Cryogenic cooling systems are designed to maintain cryogenic electronic circuits at desired operating temperatures close to zero Kelvin. Such systems typically consist of a stack of separate temperature stages, each cooled to an even lower temperature. Due to fundamental thermodynamic principles, the power required to cool progressively lower temperatures increases exponentially. For example, a typical cryogenic cooling system consumes 20 to 30 kW at 100 mK to manage a heat load of 12 to 18 μW.

[0005] Electronic control units are typically placed outside the cryogenic equipment to prevent their power dissipation from heating up the entire cryogenic equipment and thus the cryogenic circuitry. Therefore, a communication path is needed between the cryogenic circuits at the end of the cryogenic equipment, through the top of the equipment, to the external control electronics to exchange signals. This path is typically constructed of cascaded semi-rigid transmission lines (usually coaxial cables) to bridge the distance and intercept mechanical stress and vibration during cooling procedures and operation.

[0006] Cryogenic circuits (such as qubit devices) need to communicate with external control devices to control the qubits and send signals back to the control device about the actual state of each qubit. This also requires high-frequency (HF) analog signals. Typically, these signals can range from low frequencies or DC to ultra-high frequencies down to infrared or visible light wavelengths.

[0007] The latest cryogenic qubit devices feature an increased number of qubits. Each qubit needs to communicate individually with external control devices. This individual communication requires an increased number of transmission lines for the qubits. For example, a qubit device may contain 96 qubits and require at least 288 individual transmission lines, which should be guided to the outside via subsequent thermal stages. These transmission lines may include coaxial connectors, for example, for bridging successive stages of the cryogenic equipment. Therefore, as the number of transmission lines increases, the total number of coaxial connectors bridging each stage also increases, requiring relatively more space in subsequent stages to accommodate this increased number of coaxial connectors, potentially limiting further increases in the number of qubits. Coaxial cables can be replaced by flexible planar circuits to reduce connector size. For example, eight coaxial cables can be replaced by a flexible planar circuit comprising a dielectric layer with eight channels or signal lines and a conductive or ground layer disposed on one or opposite sides of the dielectric layer. Flexible planar circuits can be connected to cryogenic devices via known connectors such as Miniature A-Type (SMA), Miniature Push-In (SMP), or Miniature Miniature Push-In (SMPM) connectors. The size of connectors with multiple SMAs or SMPMs increases with the number of channels or signal lines, potentially causing problems. Furthermore, reducing connector size can lead to signal degradation and crosstalk between signal lines. Another issue is that the characteristics of the signal lines may not be constant due to temperature variations in the connector assembly. Summary of the Invention

[0008] Therefore, the object of the present invention is to alleviate the aforementioned problems. According to the present invention, this and other objects are achieved by a connector assembly for connecting an electronic device, the connector assembly comprising: a support member having a ridge; a flexible planar circuit having an entry portion and a connection portion arranged parallel to the longitudinal axis of the support member, and including a first dielectric layer; a first signal line arranged in a first direction transverse to the ridge at a first side of the first dielectric layer opposite to the orientation of the support member; wherein the connection portion of the flexible planar circuit has a first portion of the signal line, and the ridge is arranged such that the connection portion of the flexible planar circuit deforms transversely to the entry portion of the flexible planar circuit at the ridge to connect the first portion of the first signal line to a first contact of the electronic device when the connector assembly is connected to the electronic device. This arrangement allows for a compact, flexible, and robust connection between the first signal line and the electronic device. In this arrangement, the ridge can be shaped such that the connection portion of the flexible planar circuit folds around the ridge, such that the first signal line is located outside the flexible planar circuit relative to the ridge and connects to the first contact of the electronic device. This arrangement allows the connector assembly to be arranged perpendicularly to the plane of the electronic device including the first contact. Furthermore, when multiple flexible planar circuits are stacked and / or when the flexible planar circuits include multiple first signal lines, this arrangement allows for a compact expansion of the number of signal lines in the connector assembly. For example, the connector assembly can be used to connect an 8 x 8 contact array of a 64-channel qubit device or a 32 x 32 contact array of a 1k-channel qubit device.

[0009] In a further embodiment of the connector assembly, the flexible planar circuit further includes a second dielectric layer at the first signal line and on a first side of the first dielectric layer, wherein the flexible planar circuit has a first opening through the second dielectric layer at the connection portion, the first opening being arranged to open a first portion of the first signal line. In this arrangement, the first signal line is covered on both sides by the first and second dielectric layers.

[0010] In a further embodiment of the connector assembly, the first opening is provided with a first via, which is arranged to connect the first portion to a first contact of the electronic device. In this arrangement, the contact surfaces of the electronic device can be at approximately the same height or level. The first via can be a so-called buried via. The advantage of using a first via is that it prevents delamination of the flexible planar circuitry.

[0011] In a further embodiment of the connector assembly, the flexible planar circuit further includes a first conductive layer on a first side of the second dielectric layer facing away from the first dielectric layer, with ridges arranged to connect the first conductive layer to a second contact of the electronic device when the connector assembly is connected to the electronic device. In this arrangement, the flexible planar circuit, including a microstrip formed by the first conductive layer and the first and / or second dielectric layers, is capable of transmitting high-frequency signals up to the infrared and visible light wavelength range. The connector assembly connects the microstrip to the electronic device and enables the transmission of high-frequency signals up to the infrared and visible light wavelength range.

[0012] In a further embodiment of the connector assembly, the flexible planar circuit includes a second conductive layer on a second side of the first dielectric layer opposite to the first side, and a second via through the first dielectric layer in a connection portion of the flexible planar circuit. The second via is arranged to connect the second conductive layer to a second contact of the electronic device when the connector assembly is connected to the electronic device. In this arrangement, the flexible planar circuit, including a microstrip formed by the second conductive layer, the first dielectric layer, and / or the second dielectric layer, is capable of transmitting high-frequency signals up to microwave frequencies.

[0013] Furthermore, the presence of both a first and a second conductive layer allows for the formation of striplines. Striplines also enable the transmission of high-frequency signals up to the infrared and visible light wavelength range. They further improve transmission characteristics. The advantage of the second via is that it also reduces the layering of flexible planar circuits.

[0014] In a further embodiment of the connector assembly, a first signal line is disposed in a first end portion of the first dielectric layer, the first portion of which is the end portion of the first signal line at the connection portion. A second signal line (15) is disposed on a first side of the first dielectric layer, in a second direction transverse to the ridge, at another end portion of the first dielectric layer opposite to the first end portion. The end portion of the second signal line is disposed in the connection portion, and the end portion of the second signal line is separated from the end portion of the first signal line by a distance d. The ridge is further arranged to connect the end portion of the second signal line (15) to a third contact (16) of the electronic device when the connector assembly is connected to the electronic device. In this arrangement, the first and second signal lines begin at opposite ends of the flexible planar circuit. In this arrangement, the number of signal lines in the connector assembly can be further increased. In an embodiment, the opening is arranged to leave the end portion of the second signal line open.

[0015] In a further embodiment, the flexible planar circuit has a third via in the second dielectric layer. The third via connects to the end portion of the second signal line, and the ridge is further arranged such that when the connector assembly is connected to the electronic device, the second signal line is connected to a third contact of the electronic device through the third via. The third via may also be a buried via.

[0016] In a further embodiment of the connector assembly, a second via is located between an end portion of the first signal line and an end portion of the second signal line. One or more second vias may be located between corresponding end portions of the first and second signal lines. The second via may be located on a line perpendicular to the line between the end portions of the first and second signal lines.

[0017] This arrangement of the second via reduces electromagnetic interference between the first signal line and the second signal line.

[0018] In a further embodiment of the connector assembly, the ridge includes an elastic member disposed between the ridge and the flexible planar circuit. The elastic member may be a spring, such as a flat spring, leaf spring, or spring-loaded pin or spring needle. Advantageously, the ridge and the spring may be made of metal (e.g., a beryllium copper alloy).

[0019] In a further embodiment, the connection portion of the flexible planar circuit has two slots on the lateral side of the first portion of the first signal line, and a slit is provided on the ridge. The slit is arranged to receive the first portion of the signal line when the connector assembly is connected to the electronic device. In this arrangement, the lateral dimension of the first portion matches the lateral dimension of the slit. The advantage of this arrangement is that the first signal line is shielded from radiation intrusion.

[0020] In a further embodiment, the flexible planar circuit is provided with additional signal lines parallel to the first signal line. The connection portion includes a second portion of the additional signal line arranged next to the second slot. The connection portion is further provided with a third slot on the other side of the second portion of the additional signal line. This other side is the side not pointing towards the second slot. Furthermore, the ridge is provided with a second slit arranged parallel to the first slit, and the second slit is further arranged to receive the second portion of the additional signal line when the connector assembly is connected to the electronic device. In this arrangement, the size of the portion of the ridge between the two slits matches the size of the second slot. In this embodiment, the flexible planar circuit is provided with multiple signal lines, and the ridge is provided with multiple slits, wherein the number of slits corresponds to the number of signal lines. The advantage of this arrangement is that the first signal line is shielded from radiation from other signal lines and intrusive radiation.

[0021] In a further embodiment of the connector assembly, the connector assembly further includes a shielding element comprising an absorbing material to absorb radiation from external sources ranging from DC to frequencies exceeding visible light. This arrangement reduces intrusive radiation that may enter the electronic device.

[0022] In a further embodiment of the connector assembly, the connector assembly is provided with a photonic barrier arranged to reduce photon transmission through the flexible planar circuit. Photons can enter electronic circuitry including qubits through the flexible planar circuit. The transmitted photons may negatively affect the qubits in the electronic device. The photonic barrier reduces the number of photons transmitted to the qubits in the electronic device through the flexible planar circuit, and thus can increase the coherence time of the qubits. The photonic barrier may include a curved portion of the flexible planar substrate. The curved portion transmits only a portion of the photons through the planar flexible transmission line, and multiple curves or arches further reduce the amount of transmitted photons. The connector assembly may be provided with channels to allow the flexible planar circuitry to bend.

[0023] The present invention further relates to an electronic device including a connector assembly. The electronic device may include electronic control circuitry and cryogenic electronic circuitry. The connector assembly can be used for communication between the electronic control circuitry and the cryogenic circuitry.

[0024] These and other features and effects of the invention will now be explained in more detail with reference to the accompanying drawings, in which preferred and illustrative embodiments of the invention are shown. Those skilled in the art will recognize that other alternatives and equivalent embodiments of the invention can be conceived and practiced without departing from the scope of the invention. Attached Figure Description

[0025] Figure 1A A bottom view of a connector assembly according to an embodiment of this disclosure is shown; Figure 1B A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 1C A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 1D A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 1E A schematic view of the ridge-facing side of the connection portion of a flexible planar substrate according to an embodiment of this disclosure is shown. Figure 1F The diagram illustrates the following based on Figure 1E A view of the ridge of the connection portion of the support member facing the flexible planar substrate in the embodiment mentioned above; Figure 2A A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 2B A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 2C A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 3A A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 3B A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 4A A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 4B A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 5 A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 6 A cross-section of a connector assembly according to an embodiment of this disclosure is shown; Figure 7 A cross-section of a connector assembly according to an embodiment of this disclosure is shown; and Figure 8 A cross-section of a connector assembly according to an embodiment of this disclosure is shown. Detailed Implementation

[0026] In the diagram, similar numbers refer to similar components. Refer to Figures 1 to 12. Figure 8 This invention will be explained below.

[0027] Connector assemblies can be used to connect flexible planar circuits to cryogenic devices, such as cryogenic electronic circuits with a temperature of about 1 mK.

[0028] Low-temperature electronic circuits can be quantum bit devices, astronomical electronic circuits, or other scientific instruments.

[0029] Figure 1A A bottom view of a connector assembly 1 according to an embodiment of this disclosure is illustrated. The bottom view shows a support member 2, a ridge 3, a flexible planar circuit 4, and a first signal line 6 of the connector assembly 1. The flexible planar circuit includes a first dielectric layer 5 (not shown), an entry portion 41, and a connection portion 42.

[0030] Figure 1B The connector assembly is illustrated along... Figure 1AThe support member 2 is a cross-section in a plane perpendicular to line A-A' of ridge 3. The support member 2 can be made of a polyethylene block. In an embodiment, the polyethylene block can be coated with a conductive layer. In an embodiment, the support member can be made of a metal (e.g., copper (Cu)). In an embodiment, the support member contains a superconducting material, such as aluminum (Al). The dimensions of the support member can be, for example, 4 x 1 x 0.2 cm (L x W x T). Ridge 3 can be machined into the short edge of the block. The support member 2 has a longitudinal axis 21. The ridge can have a semi-circular or rectangular cross-section and can be adjusted to a shape that facilitates assembly and sufficient electrical contact. In an embodiment, the outer surface of the support member 2 and the ridge 3 can be provided with a metal layer, such as aluminum or silver. In an embodiment, the support member can be made of a metal (e.g., beryllium copper).

[0031] The first signal line 6 is disposed on a first side of the first dielectric layer 5 facing away from the support member 2 in a first direction transverse to the ridge 3 (e.g., along the longitudinal axis of the flexible planar circuit). The first signal line 6 has a width of, for example, 0.15 mm and a thickness of 0.002 mm. The first signal line 6 is made of silver (Ag). Gold (Au), copper (Cu), aluminum (Al), or platinum (Pt) may also be used. The first signal line may also include additional layers, such as an adhesion layer, a barrier layer, an adhesive layer, or a surface treatment layer.

[0032] The first signal line may also contain a superconducting material, such as niobium (Nb), niobium titanium (NbTi), or niobium titanium nitride (NbTiN). The entrance portion 41 of the flexible planar circuit 4 is arranged along the longitudinal axis 21 at the support member 2. The connection portion 42 of the flexible planar circuit 4 is arranged at the ridge 3 in a direction perpendicular to or transverse to the entrance portion 41 of the flexible planar circuit. In this embodiment, the connection portion 42 of the flexible planar circuit 4 is partially bent around the ridge 3, such that the first signal line 6 is away from the ridge 3 and transverse to the entrance portion 41 of the flexible planar circuit 4. In this disclosure, the connection portion is the part of the flexible planar circuit that can be bent around the ridge 3 when the connector assembly is connected to the electronic device. In the connected state, when the connector assembly 1 is connected to the electronic device 8, the ridge 3 connects a first portion of the first signal line 6 to the first contact 7 of the electronic device 8.

[0033] Those skilled in the art will understand that electrical connections can be formed through capacitive coupling, inductive coupling, or current coupling. In this embodiment, the flexible planar circuit 4 is folded around the ridge 3.

[0034] In one embodiment, multiple first signal lines 6 may be arranged next to each other on the first side of the first dielectric layer 5, with a distance between them ranging from 300 µm to 1 mm, for example, 350 µm.

[0035] In this embodiment, the flexible planar circuit 4 may be provided with a second dielectric layer 9. In this arrangement, a first opening through the second dielectric layer 9 is provided at the connection portion 42. The first opening is arranged to open a first portion of the first signal line 6. The size of the opening allows the first signal line 6 to be connected to the first contact 7 of the electronic device 8. Moreover, in this embodiment, the connection portion 42 of the flexible planar circuit 4 is folded transversely to the entrance portion 41 of the flexible planar circuit around the ridge 3.

[0036] Furthermore, in an embodiment, the connector assembly includes a shield (not shown) comprising an absorbing material to absorb externally intruding radiation ranging from DC to frequencies exceeding visible light.

[0037] In an embodiment, the connector assembly may include a magnetic field shield (not shown) to shield a portion of the connector assembly. The magnetic field shield may include a µ-metal or a superconductor. The superconductor may be, for example, niobium (Nb), niobium titanium (NbTi), niobium titanium nitride (NbTiN), or indium (In). The planar flexible circuit 4 may have a rectangular geometry with a length of, for example, 100 mm, 200 mm, or 500 mm and a width of, for example, 4 mm. The first dielectric layer 5 may be, for example, polyimide or polytetrafluoroethylene (PTFE), or ethylene-tetrafluoroethylene copolymer (ETFE). The thickness of the first dielectric layer may be, for example, 0.15 mm.

[0038] Figure 1C The diagram illustrates the connection to... Figure 1B The described embodiment is a cross-section of a connector assembly similar to those of other embodiments. Additionally, in this embodiment, the ridge includes an elastic member 31 disposed between the ridge and the flexible planar substrate to generate a dynamic force toward the flexible planar substrate 4 and the first contact 7. The elastic member 31 may be a spring, such as a flat spring, leaf spring, spring-loaded pin, or spring pin, disposed at the apex of the ridge 3 facing the planar flexible circuit 4. An advantage of the elastic member 31 is that it compensates for mechanical stresses that may degrade a reliable connection between the first portion of the first signal line and the contacts of the electronic device when the external electronic device operates at low temperatures (e.g., 4K), due to different coefficients of thermal expansion. Furthermore, the elastic member 31 compensates for mechanical stresses caused by assembling the connector assembly onto the external device and compensates for mechanical tolerances in the manufacturing of the connector assembly. Those skilled in the art can determine the dimensions of the elastic member based on the specific application and the stresses occurring. Advantageously, the ridge and spring pin may be made of metal, such as a beryllium copper alloy.

[0039] Figure 1D A connector assembly according to an embodiment of this disclosure is illustrated along... Figure 1BA cross-section in the plane perpendicular to line A-A' of ridge 3. In this embodiment, a first via 12 is provided in the connection portion 41 of the flexible planar circuit 4. In this embodiment, ridge 3 is arranged to deform the connection portion of the flexible planar circuit, such that the connection portion 42 folds along a line perpendicular to the entrance portion 41 of the flexible planar circuit, and the signal line 6 is connected to the first contact 7 through the first via 12.

[0040] Figure 1E The diagram illustrates a view of the connection portion 42 of the flexible planar substrate 1 facing the ridge 3 according to an embodiment of the present disclosure.

[0041] Figure 1F The diagram illustrates the following based on Figure 1E The image shows a view of the ridge 3 of the connection portion 42 of the support member facing the flexible planar substrate in the embodiment mentioned above. In this embodiment, the ridge is made of metal (e.g., copper (Cu)). Furthermore, the connection portion of the flexible planar circuit has two slots 60, 60' on the side facing the first signal line 6. The flexible planar circuit further includes another signal line 6' parallel to the first signal line 6 and a third slot 60'' on the other side of the other signal line 6' that does not point to the second slot 60'.

[0042] Furthermore, ridge 3 is provided with two parallel slits 60, 60'. The lateral dimensions of slits 61, 61' correspond to the lateral dimensions of signal lines 6, 6 at the connection portion. The depth of slits 60, 60' is equal to the thickness of the first dielectric layer and the thickness of the first signal line 6' or another signal line 6'. Slits 61, 61' are arranged to receive the connection portion of the flexible planar circuit, including the first signal line 6 and the other signal line 6', when the connector assembly is connected to the electronic device. An advantage of this embodiment is that the first signal line 6 and the other signal line 6' are now shielded by the walls of slits 60, 61 to prevent radiation intrusion.

[0043] Figure 2A A connector assembly according to an embodiment of this disclosure is illustrated in the diagram. Figure 1B The cross-section is located in a plane along line A-A' perpendicular to ridge 3. In this embodiment, the first dielectric layer 5 and the first signal line 6 of the flexible planar circuit 4 are similar to the reference. Figure 1BThe flexible planar circuit described includes a first dielectric layer and a first signal line. Furthermore, a second dielectric layer 9 is disposed at the first signal line 6 and the first dielectric layer 5. The second dielectric layer 9 may be similar to the first dielectric layer 5. Additionally, a first conductive layer 10 is disposed on the opposite side of the second dielectric layer 9 from the first side facing away from the first dielectric layer 5. The first conductive layer 10 is made of silver (Ag). Gold (Au), copper (Cu), aluminum, or platinum (Pt) may also be used. The thickness of the first conductive layer 10 is in the range of 100 nm to 18 µm, for example, 2 µm for a silver layer. In an embodiment, the first conductive layer 10 includes a superconductor, such as one of niobium (Nb), niobium titanium (NbTi), niobium titanium nitride (NbTiN), and indium (In). In an embodiment, the first conductive layer includes a resistive film, such as one of nickel-chromium alloy (NiCr), carbon (C), or indium tin oxide (ITO). A first opening in the second dielectric layer 9 is not covered by the first conductive layer 10. In this embodiment, the flexible planar circuit 4 is partially bent around the ridge 3, such that the connection portion 42 is transverse to the entry portion 41 of the flexible planar circuit, and when the connector assembly is connected to the electronic device, the first signal line 6 and the first conductive layer 10 are away from the ridge. When the connector assembly is connected to the electronic device, the ridge 3 of the connector assembly connects the first end portion 61 of the first signal line 6 to the first contact 7 of the electronic device 8, and connects the first conductive layer 10 to the second contact 11 of the electronic device. Moreover, in this embodiment, the flexible planar circuit 4 is folded around the ridge 3.

[0044] In one embodiment, multiple first signal lines 6 may be arranged side-by-side on a first side of the first dielectric layer 5, with a distance between them between 300 µm and 1 mm, for example, 350 µm. In this embodiment, the flexible planar circuit includes a microstrip formed by a first dielectric layer, first signal lines, a second dielectric layer, and a first conductive layer. A connector assembly connects the microstrip to an electronic device and enables the transmission of high-frequency signals up to the infrared and visible light range. The multiple first signal lines may serve as signal lines or ground lines. In one embodiment, the signal lines are separated by ground lines.

[0045] Figure 2B A cross-section of a connector assembly according to an embodiment of this disclosure is illustrated in a plane along line A-A' perpendicular to ridge 3. In this embodiment, the first dielectric layer 5, second dielectric layer 9, first conductive layer 10, and first signal line 6 of the flexible planar circuit are similar to those in the reference design. Figure 2AThe flexible planar circuits described herein. In this embodiment, the first opening in the flexible planar circuit 4 includes a first via 12 passing through the second dielectric layer 9 at the connection portion 42 of the flexible planar circuit and connecting to the first signal line 6. This first via can be a well-known buried via. The diameter of the first via 12 can be in the range of 10 µm to 100 µm, for example, 50 µm. In this embodiment, the flexible planar circuit 4 is partially bent around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. When the connector assembly is connected to the electronic device, the ridge 3 connects the first signal line 6 to the first contact 7 via the first via 12 and connects the first conductive layer 10 to the second contact 11. In this arrangement, the microstrip is formed by the first conductive layer 10, the signal line 6, and the first dielectric layer 5 and the second dielectric layer 9. The connector assembly connects the microstrip to the electronic device and enables the transmission of high-frequency signals up to the infrared and visible light wavelength range. An advantage of this arrangement is that the contact surfaces of the contacts 7 and 11 of the electronic device 8 can be at approximately the same height or level. In this embodiment, multiple first signal lines 6 may be arranged side by side on the first side of the first dielectric layer 5, with a distance between them of 300 µm and 1 mm. For example, the number of signal lines may be 8, 16 or more.

[0046] In an embodiment, the flexible planar circuit may have multiple first dielectric layers and second dielectric layers, wherein first signal lines are respectively arranged between the first dielectric layers and the second dielectric layers.

[0047] Figure 2C A cross-section of a connector assembly according to an embodiment of this disclosure is illustrated in a plane along line A-A' perpendicular to ridge 3. In this embodiment, the first dielectric layer 5, the second dielectric layer 9, and the first signal line 6 of the flexible planar circuit are similar to those in the reference diagram. Figure 2A The flexible planar circuits described herein. In this embodiment, the flexible planar circuit 4 has a second conductive layer 13 disposed on a second side of the first dielectric layer 5 opposite to the first side. Furthermore, the flexible planar circuit includes a second via 14 located in the first dielectric layer 5 and the second dielectric layer 9 in the connection portion 42 of the flexible planar circuit. The second via 14 is connected to the second conductive layer 13. When the connector assembly is connected to the electronic device, the ridge 3 connects the first signal line 6 to the first contact 7 through the first opening, and connects the second conductive layer 13 to the second contact 11 through the second via 14. Moreover, in this embodiment, the flexible planar circuit 4 is folded around the ridge 3.

[0048] In this arrangement, the microstrip is formed by a second conductive layer 13, a signal line 6, a first dielectric layer 5, and a second dielectric layer 9. A connector assembly connects the microstrip to an electronic device, enabling the transmission of high-frequency signals up to the infrared and visible light wavelength range.

[0049] In this embodiment, multiple first signal lines 6 may be arranged side by side on the first side of the first dielectric layer 5, with a distance between them of 300 µm and 1 mm. For example, the number of signal lines may be 8, 16 or more.

[0050] Figure 2D A cross-section of a connector assembly according to an embodiment of this disclosure is illustrated in a plane along line A-A' perpendicular to ridge 3. In this embodiment, the first dielectric layer 5, second dielectric layer 9, first signal line 6, second conductive layer 13, and second via 14 of the flexible planar circuit are similar to those in the reference design. Figure 2C Those described are flexible planar circuits. Furthermore, in this embodiment, the flexible planar circuit 4 includes a first conductive layer 10. In this embodiment, the first opening includes a first via 12 disposed in the second dielectric layer 9 at the connection portion of the flexible planar circuit. The second conductive layer 13 is connected to the first conductive layer 10 through a second via 14. In this embodiment, the flexible planar circuit 4 is partially bent around the ridge 3 such that the connection portion 42 is transverse to the entry portion 41 of the flexible planar circuit. When the connector assembly is connected to an electronic device, the ridge 3 connects the first signal line 6 to the first contact 7 via the first via 12 and connects the second conductive layer 13 to the second contact 11 via the second via 14.

[0051] The advantage of this arrangement is that the contact surfaces of the contacts 7 and 11 of the electronic device 8 can be at approximately the same height or level.

[0052] In one embodiment, multiple first signal lines 6 may be arranged side-by-side on a first side of the first dielectric layer 5, with a distance between them between 300 µm and 1 mm, for example, 350 µm. In this embodiment, the flexible planar circuit includes a microstrip formed by the first dielectric layer, the first signal lines, the second dielectric layer, and the first conductive layer. A connector assembly connects the microstrip to an electronic device and enables the transmission of high-frequency signals up to the infrared and visible light wavelength range. The first signal lines may be used as signal lines or ground lines. In one embodiment, the signal lines are separated by ground lines.

[0053] Figure 3A A cross-section of a connector assembly according to an embodiment of this disclosure is illustrated in a plane along line A-A' perpendicular to ridge 3. In this embodiment, the first dielectric layer 5, the second dielectric layer 9, the second conductive layer 13, the signal line 6, and the second via 14 are similar to those in the reference numeral. Figure 2CThe flexible planar circuits described herein. Furthermore, in this embodiment, the flexible planar circuit 4 also has a first conductive layer 10 disposed on a first side of the second dielectric layer 9 facing away from the orientation of the first dielectric layer 5. The first opening in the second dielectric layer 9 at the connection portion is not covered by the first conductive layer 10. In this embodiment, the flexible planar circuit 4 is partially bent around the ridge 3, such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. When the connector assembly is connected to the electronic device, the ridge 3 connects the first signal line 6 to the first contact 7 of the electronic device 8, and connects the first conductive layer 10 and the second conductive layer 13 to the second contact 11 of the electronic device through the second via 14.

[0054] In this embodiment, the flexible planar circuit includes a stripline formed by two conductive layers 10 and 13, signal lines 6, and a first dielectric layer 5 and a second dielectric layer 9. This stripline is capable of transmitting high-frequency signals up to the infrared and visible light wavelength range. Furthermore, in this embodiment, multiple first signal lines 6 can be arranged side-by-side on the first side of the first dielectric layer 5, with a distance between them ranging from 300 µm to 1 mm, for example, 350 µm. The multiple first signal lines can be used as signal lines or ground lines. In this embodiment, signal lines and ground lines are arranged alternately side-by-side.

[0055] Figure 3B A cross-section of a connector assembly according to an embodiment of this disclosure is illustrated in a plane along line A-A' perpendicular to ridge 3. In this embodiment, the first dielectric layer 5, the second dielectric layer 9, the first conductive layer 10, the second conductive layer 13, the signal line 6, and the second via 14 are similar to those in the reference numeral. Figure 3A Those that describe flexible planar circuits.

[0056] Furthermore, a first opening in the second dielectric layer 9 provides a first via 12 in the connection portion. In this embodiment, the flexible planar circuit 4 is partially bent around the ridge 3, such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. When the connector assembly is connected to the electronic device, the ridge 3 connects the first signal line 6 to the first contact 7 of the electronic device 8 through the first via 12, and connects the first conductive layer 10 and the second conductive layer 13 to the second contact 11 of the electronic device through the second via 14. Moreover, in this embodiment, the flexible planar circuit includes a stripline formed by the two conductive layers 10 and 13, the signal line 6, and the first dielectric layer 5 and the second dielectric layer 9. The connector assembly connects the stripline to the electronic device and enables the transmission of high-frequency signals up to the infrared and visible light wavelength range.

[0057] The advantage of this arrangement is that the contact surfaces of the contacts 7 and 11 of the electronic device 8 can be at approximately the same height or level. Furthermore, in an embodiment, multiple first signal lines 6 can be arranged side-by-side on the first side of the first dielectric layer 5, with a distance between them ranging from 300 µm to 1 mm, for example, 350 µm. The multiple first signal lines can be used as signal lines or ground lines. In an embodiment, signal lines and ground lines are arranged alternately side-by-side.

[0058] Figure 4A A cross-section of a connector assembly according to an embodiment of this disclosure is illustrated in a plane along line A-A' perpendicular to ridge 3. In this embodiment, the first dielectric layer 5 is similar to that in the reference... Figure 1B The first dielectric layer is described. Furthermore, in this embodiment, a first signal line 6 is disposed on a first side of the first dielectric layer, in a first end portion of the first dielectric layer 5. Additionally, a second signal line 15 is disposed on the first side of the first dielectric layer 5 along a second direction transverse to the ridge 3 at an end portion opposite to the first end portion on the first side of the first dielectric layer. In this embodiment, the first signal line 6 and the second signal line 15 are aligned. The end portion of the first signal line 6 is located in the connection portion of the flexible planar circuit, and the end portion of the second signal line 15 is also located in the connection portion. The end portion of the second signal line 15 is separated from the end portion of the first signal line 6 by a distance d. Furthermore, when the connector assembly is connected to the electronic device 8, the ridge 3 connects the first signal line 6 to the first contact 7 and the second signal line 15 to the third contact 16 of the electronic device. Moreover, in this embodiment, the flexible planar circuit 4 is partially folded around the ridge 3, such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. The advantage of this arrangement is that the number of signal lines on the flexible substrate can be further increased.

[0059] Figure 4B A cross-section of a connector assembly according to an embodiment of this disclosure is illustrated in a plane along line A-A' perpendicular to ridge 3. In this embodiment, the first dielectric layer 5, the first signal line 6, and the second signal line 15 are similar to those in the reference numeral. Figure 4A Those that describe flexible planar circuits.

[0060] Furthermore, in this embodiment, the flexible planar circuit has a second dielectric layer 9 disposed on a first side of the first dielectric layer, and the second dielectric layer 9 has a first opening in the connection portion. Additionally, a first conductive layer 10 is disposed on the second dielectric layer at a first side opposite to the first dielectric layer 9, a second conductive layer 13 is disposed on a second side of the first dielectric layer 5 opposite to the first side, and a second via 14 is configured to pass through the first dielectric layer 5 and the second dielectric layer 9. The second via connects the first conductive layer 10 and the second conductive layer 13. The first opening in the connection portion of the second dielectric layer 9 includes a first via 12 and a third via 17. The third via 17 can be a buried via.

[0061] In this embodiment, when the connector assembly is connected to the electronic device, the ridge 3 connects the first signal line 6 to the first contact 7 via the first via 12, connects the second signal line 15 to the third contact 16 of the electronic device 8 via the third via 17, and connects the first conductive layer 10 and the second conductive layer 13 to the second contact 11 via the second via 14. Furthermore, in this embodiment, the flexible planar circuit 4 is folded around the ridge 3 such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. In this embodiment, the flexible planar circuit includes two striplines formed by the two conductive layers 10 and 13, the signal lines 6 and 15, and the first dielectric layer 5 and the second dielectric layer 9, respectively. The connector assembly connects the striplines to the electronic device and enables the transmission of high-frequency signals up to the infrared and visible light wavelength range.

[0062] In an embodiment, multiple (e.g., eight) first signal lines 6 and second signal lines 15 may be arranged side-by-side on a first side of the first dielectric layer 5, with a distance between them ranging from 300 µm to 1 mm, for example, 350 µm. The multiple first signal lines 6 and second signal lines 15 may be used as signal lines or ground lines. In an embodiment, signal lines and ground lines are arranged alternately side-by-side.

[0063] Figure 5 A bottom view of the flexible planar circuit 4 is illustrated in the diagram. In this embodiment, the flexible plane is similar to a reference plane. Figure 4B The described flexible planar circuit includes a first signal line 6 and a second signal line 15. A first via 12 is connected to the end of the first signal line 6, and a third via 17 is connected to the end of the second signal line 15. Furthermore, the flexible planar circuit has a second via 14 on the side of both the ends of the first signal line 6 and the second signal line 15, which passes through the first and second dielectric layers at the connection point. The second via 14 connects the first conductive layer 12 and the second conductive layer 13. In this embodiment, the flexible planar circuit 4 is folded around the ridge 3, such that the connection portion 42 is transverse to the entrance portion 41 of the flexible planar circuit. This arrangement of the second via reduces electromagnetic interference to the first signal line.

[0064] Figure 6 A bottom view of a flexible planar circuit 4 according to an embodiment of this disclosure is illustrated. In this embodiment, the flexible planar circuit is similar to a reference circuit. Figure 5 The described flexible planar circuit. Furthermore, in this embodiment, the flexible planar circuit is provided with four first signal lines 6 and four second signal lines 15. In the connection portion, a first via 12 is provided at the end of each of the first signal lines 6, and a third via 17 is provided at the end of each of the second signal lines 15. Furthermore, a second via 14 is provided between the ends of the first signal lines 6 and the second signal lines 15 to connect the first conductive layer 10 and the second conductive layer 13. This arrangement of the second via reduces crosstalk between the first and second signal lines.

[0065] Figure 7 A side view of a connector assembly according to an embodiment of this disclosure is illustrated. In this embodiment, the support member 2 is provided with four ridges 3 and four flexible planar circuits 4. The flexible planar circuits are stacked next to each other in the connector assembly. The flexible planar circuits 4 are bent into loops such that the connecting portions bend around the ridges 3. The ends of the first signal lines and the ends of the second signal lines of the flexible planar circuits 4 can be connected to a control device or other peripheral device. Furthermore, each flexible planar circuit can be provided with multiple first signal lines and multiple second signal lines. The number of first signal lines is, for example, eight, and the number of second signal lines is, for example, eight. In this embodiment, each flexible planar circuit includes 16 signal lines, and the connector assembly has a total of 64 signal lines. The number of signals in the connector assembly can be further expanded by increasing the number of flexible planar circuits or increasing the number of signal lines in each flexible planar circuit.

[0066] In one embodiment, the connector assembly is provided with a shield 19 comprising an absorbing material arranged to absorb externally intruding radiation ranging from DC to frequencies exceeding visible light. The absorbing material may be conductive particles, resistive particles, or carbon powder in an adhesive or thermosetting material.

[0067] In one embodiment, the connector assembly is provided with a magnetic field shield 20, which is arranged to magnetically shield the connector assembly. The magnetic field shield comprises a superconducting material or a µ-metal. The superconducting material may be one of niobium (Nb), niobium titanium (NbTi), niobium titanium nitride (NbTiN), and indium (In).

[0068] Figure 8A side view of a connector assembly according to an embodiment of this disclosure is illustrated. The connector assembly 1 includes a support member 2 with a ridge 3 and a flexible planar circuit 4. Furthermore, the support member 2 includes a photonic barrier. The photonic barrier is provided with a channel 18. The channel has four corners. Additionally, the flexible planar circuit 4 is folded into the channel 18 and folded around the ridge 3. In this embodiment, the photonic barrier reduces EM radiation that may enter the flexible planar circuit 4 from the outside of the connector assembly and be transmitted to the electronic device through the flexible planar circuit. This EM radiation can have wavelengths up to the infrared and visible light ranges.

[0069] Although illustrative embodiments of the invention have been described with reference to the accompanying drawings, it should be understood that the invention is not limited to these embodiments. Various changes or modifications can be made by those skilled in the art without departing from the scope or spirit of the invention as defined in the claims. Therefore, throughout this specification, references to "an embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is included in at least one embodiment of the invention. Thus, the phrases "in one embodiment" or "in an embodiment" appearing in various places throughout this specification do not necessarily refer to the same embodiment. Furthermore, it should be noted that these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

Claims

1. A connector assembly (1) for connecting to an electronic device, comprising: Support member (2), the support member is provided with a ridge (3); The flexible planar circuit (4) is provided with an entrance portion (41) and a connection portion (42) arranged parallel to the longitudinal axis (21) of the support member, and includes a first dielectric layer (5). The first signal line (6) is arranged in a first direction transverse to the ridge on the first side of the first dielectric layer facing away from the support member (2); The connection portion (42) of the flexible planar circuit includes a first portion of the signal line (6), and the ridge (3) is arranged such that the connection portion (42) of the planar flexible circuit deforms laterally to the entrance portion (41) of the flexible planar circuit (4) at the ridge, so as to connect the first portion of the first signal line (6) to the first contact (7) of the electronic device when the connector assembly is connected to the electronic device (8).

2. The connector assembly as claimed in claim 1, wherein, The flexible planar circuit (4) further includes a second dielectric layer (9) at the first signal line (6) and on a first side of the first dielectric layer (5), the second dielectric layer having a first opening through the second dielectric layer at the connection portion, the first opening being arranged to open a first portion of the first signal line.

3. The connection component as claimed in claim 2, wherein, The first opening includes a first through hole (12) which is arranged to connect the first portion to a first contact (7) of the electronic device (8).

4. The connector assembly as claimed in claim 2 or 3, wherein, The flexible planar circuit includes a first conductive layer (10) on a first side of the second dielectric layer (9) that is oriented away from the first dielectric layer (5), and the ridge (3) is arranged to connect the first conductive layer (10) to a second contact (11) of the electronic device when the connector assembly is connected to the electronic device.

5. The connector assembly as claimed in any one of claims 1 to 4, wherein, The flexible planar circuit includes a second conductive layer (13) on a second side of the first dielectric layer (5) opposite to the first side, and a second via (14) passing through the first dielectric layer (5) in the connection portion of the flexible planar circuit. The second via is arranged to connect the second conductive layer (13) to a second contact (11) of the electronic device through the second via (14) when the connector assembly is connected to the electronic device.

6. The connector assembly as claimed in claims 1 to 5, wherein, The first signal line (6) is disposed in the first end portion of the first dielectric layer (5), the first part of the first signal line is the end portion of the first signal line at the connection portion, the second signal line (15) is disposed on the first side of the first dielectric layer (5) in a second direction transverse to the ridge at the other end portion of the first dielectric layer opposite to the first end portion, the end portion of the second signal line is disposed in the connection portion, the end portion of the second signal line is separated from the end portion of the first signal line by a certain distance, and the ridge is further arranged to connect the end portion of the second signal line (15) to the third contact (16) of the electronic device when the connector assembly is connected to the electronic device.

7. The connector assembly as described in claim 6 when referring to claims 2 to 5, wherein, The flexible planar circuit is provided with a third via (17) through the second dielectric layer, the third via being arranged to connect the end portion of the second signal line to the third contact (16).

8. The connector assembly as claimed in claim 5 when referencing claim 5, wherein, The second via (14) is located between the end portion of the first signal line (6) and the end portion of the second signal line (15).

9. The connector assembly as claimed in any one of claims 1 to 8, comprising a resilient member (31) disposed between the ridge and the connection portion of the flexible planar circuit.

10. The connector assembly of claim 1, wherein, The connection portion of the flexible planar circuit has two slots on the lateral side of the first portion of the first signal line, the ridge has a slit, and the slit is arranged to receive the first portion of the signal line when the connector assembly is connected to the electronic device.

11. The connector assembly of claim 10, wherein, The flexible planar circuit is provided with an additional signal line parallel to the first signal line. The connection portion includes a second portion of the additional signal line arranged next to the second slot. The connection portion is further provided with a third slot on the side of the second portion on the second signal line side that does not point to the second slot. The ridge is provided with a second slit parallel to the first slit. The second slit is arranged to receive the second portion of the additional signal line when the connector assembly is connected to the electronic device.

12. The connector assembly of any one of claims 1 to 11, further comprising a shielding element, the shielding element comprising an absorbing material arranged to absorb externally intruding radiation ranging from DC to frequencies exceeding visible light frequencies.

13. The connector assembly of any one of claims 1 to 12, further comprising a photonic barrier (18) arranged to reduce photonic transmission to the electronic device.

14. An electronic system comprising a connector assembly according to any one of claims 1 to 13.

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