Cooling base for substrate support

Abstract

In one example, a substrate support assembly has a cooling base that facilitates temperature uniformity. In one implementation, the cooling base has a top plate. The top plate has a cooling channel formed therein. The cooling base has a middle plate. The middle plate has a cooling return plenum disposed on a middle layer. A plurality of islands are disposed in the cooling return plenum. The middle plate has a cooling supply plenum disposed below the middle layer. A plurality of cooling inlets are disposed through the islands and couple the cooling supply plenum to the cooling channel. A cooling outlet fluidly couples the cooling channel to the cooling return plenum. The cooling base has a bottom plate. The bottom plate has a cooling inlet fluidly coupled to a cooling supply plenum and a cooling outlet fluidly coupled to the cooling return plenum.

Description

background Technical Field

[0001] The embodiments described herein generally relate to semiconductor manufacturing, and more specifically, to a substrate support assembly suitable for high-temperature semiconductor manufacturing. Background Technology

[0002] Reliably fabricating nanometer-sized and smaller features is one of the key technological challenges for next-generation Very Large Scale Integration (VLSI) and Ultra Large Scale Integration (ULSI) semiconductor devices. However, as limitations in circuit technology drive progress, the shrinking size of VLSI and ULSI interconnect technologies places additional demands on processing power. Reliably forming gate structures on the substrate is crucial for the success of VLSI and ULSI, as well as for continuing efforts to increase circuit density and the quality of individual substrates.

[0003] To reduce manufacturing costs, integrated chip (IC) manufacturers demand higher throughput and better device yield and performance for each silicon substrate processed. Improving the temperature uniformity of electrostatic chucks has been identified as an area where device yield can be improved. Conventional electrostatic chucks are typically bonded to cooling plates in substrate support assemblies. Conventional electrostatic chucks utilize multiple heaters and cooling plates to maintain temperature control along the surface of the silicon substrate during processing. However, conventional cooling bases do not always have rotational or azimuthal temperature symmetry. Currently, the cooling base allows coolant to flow through a gas chamber, which cannot consistently prevent higher temperatures in certain areas due to the heat flux from the chuck heaters and the plasma generated within the chamber. Additionally, cold spots are often associated with sections of the cooling base through which lifting rods, thermocouples, power lines, and He supply lines pass. Temperature non-uniformity across the substrate support can deviate from the processing results of substrates being processed on it. Therefore, correcting the temperature non-uniformity of the substrate support reduces throughput and decreases device yield and performance in the processing chamber.

[0004] Therefore, an improved substrate support assembly is needed. Summary of the Invention

[0005] In one example, a cooling base is provided to promote temperature uniformity. In one embodiment, the cooling base has a top plate. The top plate has cooling channels formed therein. The cooling base has an intermediate plate disposed below the top plate. The intermediate plate has a cooling return air chamber disposed on the intermediate layer. A plurality of islands are disposed in the cooling return air chamber. The intermediate plate has a cooling supply air chamber disposed below the intermediate layer. A plurality of cooling inlets are disposed through the islands and couple the cooling supply air chamber to the cooling channels. A cooling outlet fluidly couples the cooling channels to the cooling return air chamber. The cooling base has a bottom plate disposed below the intermediate plate. The bottom plate has cooling inlets fluidly coupled to the cooling supply air chamber and cooling outlets fluidly coupled to the cooling return air chamber.

[0006] In another example, a substrate support assembly with a cooling base that promotes temperature uniformity is provided. The substrate support assembly has a substrate support and a cooling base coupled to the substrate support. The cooling base has a top plate. The top plate has cooling channels formed therein. The cooling base has an intermediate plate disposed below the top plate. The intermediate plate has a cooling return air chamber disposed on an intermediate layer. A plurality of islands are disposed in the cooling return air chamber. The intermediate plate has a cooling supply air chamber disposed below the intermediate layer. A plurality of cooling inlets are disposed through the islands and couple the cooling supply air chamber to the cooling channels. A cooling outlet fluidly couples the cooling channels to the cooling return air chamber. The cooling base has a bottom plate disposed below the intermediate plate. The bottom plate has cooling inlets fluidly coupled to the cooling supply air chamber and cooling outlets fluidly coupled to the cooling return air chamber.

[0007] In another example, a method for regulating the temperature of a substrate support disposed on a cooling base is provided. The method begins by allowing cooling fluid to flow into a cooling fluid inlet chamber in an intermediate plate of the cooling base. The cooling fluid flows from the cooling fluid inlet chamber to one of a plurality of cooling channels in a top plate of the cooling base. Then, the cooling fluid from the cooling channels is allowed to flow through a cooling fluid outlet to a cooling fluid return chamber disposed in the intermediate plate, wherein the cooling fluid return chamber is perpendicular to a cooling fluid supply chamber adjacent to it. Attached Figure Description

[0008] To provide a more detailed understanding of the features and methods described above in this disclosure, a more specific description of the disclosure, which has been briefly summarized above, can be made with reference to the embodiments, some of which are illustrated in the accompanying drawings. However, it should be noted that the drawings only illustrate typical embodiments of this disclosure and should therefore not be considered as limiting the scope of this disclosure, as other equally effective embodiments are permissible.

[0009] Figure 1This is a schematic side view of a cross-section of a processing chamber having a substrate support assembly in one embodiment.

[0010] Figure 2 This is a top plan view of a conventional cooling base used in substrate support assemblies.

[0011] Figures 3A to 3B It is applicable Figure 1 An isometric cross-sectional view of the modified cooling base in the processing chamber 100.

[0012] Figure 4 It is a side view of the cooling base that exposes all cooling channels.

[0013] Figure 5 This is a top plan view of the intermediate plate in the cooling base, which exposes all cooling inlet and outlet holes.

[0014] Figure 6 Describes a method using Figures 3A to 3B A method for cooling substrate support members using a cooling base.

[0015] For clarity, the same reference numerals have been used where applicable to designate common elements between the figures. Furthermore, elements of one embodiment may be advantageously adapted to other embodiments described herein. Detailed Implementation

[0016] The embodiments described herein provide a substrate support assembly that enhances temperature uniformity during operation. The substrate support assembly has a substrate support bonded to a cooling base. The cooling base has cooling zones adjacent to the substrate support. The cooling base is provided with shortened cooling paths within the cooling zones adjacent to the substrate support. These cooling paths each have an inlet and an outlet for delivering coolant flow to different zones (e.g., five different concentric zones) in the same or different manner as needed, ensuring heat removal from each different zone. The cooling base plate is constructed of multiple layers to facilitate multiple cooling fluid inlets from the inlets to the top surface of the cooling base. The cooling base outlet provides a closely adjacent exit path for the cooling fluid from the top surface, shortening the cooling fluid path and time in the hot zones, thereby enhancing cooling across the entire cooling zone. The shorter travel distance of the cooling fluid within the cooling zone ensures that the cooling efficiency remains consistent across the entire cooling zone.

[0017] Figure 1This is a schematic cross-sectional view of an exemplary plasma processing chamber 100, shown as an etching chamber, which includes a substrate support assembly 172. The substrate support assembly 172 can be used in other types of plasma processing chambers, such as plasma processing chambers, annealing chambers, physical vapor deposition chambers, chemical vapor deposition chambers, and ion implantation chambers, as well as other systems where it is desirable to control the uniformity of processing across a surface or workpiece (such as a substrate).

[0018] The plasma processing chamber 100 includes a chamber body 102 having sidewalls 104, a bottom 106, and a cover 108, which enclose a processing area 110. An injection device 112 is coupled to the sidewalls 104 and / or the cover 108 of the chamber body 102. A gas panel 114 is coupled to the injection device 112 to allow process gases to be supplied to the processing area 110. The injection device 112 may be one or more nozzles or inlet ports, or alternatively, spray heads. Process gases and any processing byproducts are removed from the processing area 110 through an exhaust port 128 formed in the sidewalls 104 or bottom 106 of the chamber body 102. The exhaust port 128 is coupled to a pumping system 132, which includes a throttle valve and a pump for controlling the vacuum level within the processing area 110.

[0019] The process gas can be excited to form plasma within the processing zone 110. The process gas can be excited by coupling an RF power capacitor or an inductive coupler to it. Figure 1 In the illustrated embodiment, a plurality of coils 116 are positioned above the cover 108 of the plasma processing chamber 100 and coupled to the RF power supply 120 via a matching circuit 118 to inductively couple the RF power to the processing gas.

[0020] A substrate support assembly 172 is disposed in the processing area 110 below the injection device 112. The substrate support assembly 172 may include a substrate support 174, a cooling base 126, a facility plate 145, and a base plate 176. If degraded cooling is acceptable, a conventional cooling base 130 may be used instead of the cooling base 126 in the substrate support assembly 172. The base plate 176 is supported by either a sidewall 104 or a bottom 106 of the processing chamber. The substrate support assembly 172 may additionally include a heater assembly (not shown). Additionally, the substrate support assembly 172 may include an insulating plate (not shown) disposed between the conventional cooling base 130 and the base plate 176.

[0021] The substrate support 174 may be a heater, an electrostatic chuck (ESC), or other suitable structure for supporting the substrate 124 during processing in the plasma processing chamber 100. The substrate support 174 has a dielectric body 175. The dielectric body 175 has a workpiece support surface 137 and a bottom surface 133 opposite to the workpiece support surface 137. The substrate support 174 may also include a lifting rod hole for receiving a lifting rod (not shown) to raise the substrate 124 above the workpiece support surface 137, thereby facilitating robotic transport in and out of the plasma processing chamber 100.

[0022] The workpiece support surface 137 may include a gas passage 194. The gas passage 194 is coupled to a back-side gas source 192. The back-side gas source 192 supplies inert gas through the gas passage 194 to the gap space defined between the workpiece support surface 137 of the substrate 124 and the substrate support 174 to provide heat transfer and cool the substrate 124. The gas passage 194 may be arranged in one or more regions. For example, the gas passage 194 may be arranged in three independently controlled concentric regions to better control the azimuth temperature of the workpiece support surface 137. In another example, the substrate support 174 has gas passages 194 arranged in four independently controllable concentric regions.

[0023] When the substrate support 174 is configured as an electrostatic chuck, the substrate support 174 may include a clamping electrode 186 embedded in the dielectric body 175. The clamping electrode 186 may be configured as a unipolar or bipolar electrode, or other suitable arrangement. The clamping electrode 186 is coupled to a clamping power supply 187 via an RF filter, the clamping power supply 187 providing RF or DC power to electrostatically clamp the substrate 124 to the workpiece support surface 137 of the substrate support 174.

[0024] The dielectric body 175 may also include one or more resistance heaters 188 embedded therein. The resistance heaters 188 may be configured to raise the temperature of the workpiece support surface 137 to a temperature suitable for processing the substrate 124 disposed thereon. The resistance heaters 188 are coupled to a heater power supply 189 via a facility plate 145 for energizing and controlling the resistance heaters 188.

[0025] Cooling base 126 is supported by base plate 176. Cooling base 126 may include cooling features 190 formed therein. Cooling features 190 may be connected to heat transfer fluid source 122. Heat transfer fluid source 122 provides a heat transfer fluid, such as a liquid, gas, or a combination thereof, which circulates through one or more cooling features 190 disposed in cooling base 126. In one embodiment, heat transfer fluid source 122 may provide approximately 4 gallons per minute of perfluoropolyether cooling fluid at approximately 40 degrees Celsius. Fluid flowing through adjacent cooling features 190 may be isolated to achieve regional control of heat transfer between different areas of substrate support 174 and cooling base 126, which helps control the lateral temperature distribution of substrate 124. In one embodiment, the heat transfer fluid circulating through cooling features 190 of cooling base 126 maintains cooling base 126 at a temperature between approximately 90 degrees Celsius and approximately 80 degrees Celsius, or below 90 degrees Celsius.

[0026] The substrate support 174 can be mounted on the cooling base 126. The cooling base 126 can be bonded to the substrate support 174 by an adhesive layer. The adhesive layer can have a thermal conductivity between about 0.1 W / mK and about 1 W / mK, such as about 0.17 W / mK. Multiple fluid passages can be formed in the upper surface of the cooling base 126 to regulate the temperature between the substrate support 174 and the cooling base 126. The lower surface of the cooling base 126 can be mounted on the facility plate 145, the heater, or the base plate 176.

[0027] Figure 2 This is a top plan view of a conventional cooling base 130, with the cover removed to expose one of the plurality of cooling channels 210 disposed therein. If degraded cooling is acceptable, the conventional cooling base 130 can be used instead of the cooling base 126 in the processing chamber 100. The conventional cooling base 130 has a top surface, a bottom surface, and an outer periphery 234. The top surface is disposed below the substrate support 174. The bottom surface is disposed above the facility plate 145 of the substrate support assembly 172. The conventional cooling base 130 has multiple cooling features, such as the plurality of cooling channels 210.

[0028] Multiple cooling channels 210 may be formed in the body 230. The cooling channels 210 are configured to carry cooling fluid through them. The cooling fluid regulates the temperature of the conventional cooling base 130. The cooling channels 210 have a spiral array of poles and extend between the inner annular channel 214 and the outer annular channel 212.

[0029] The conventional cooling base 130 has equidistant cooling channels 210. The cooling channels 210 may have a spiral shape to allow coolant to flow through them. The cooling channels 210 are rotationally symmetrical with respect to each other and have a constant pitch. The number of cooling channels 210 is typically made in multiples of three to easily accommodate three lifting rods between the cooling channels 210. Each cooling channel 210 terminates with inlet and outlet holes and is divided into several sections.

[0030] Fluid flows through the first cooling channel 200 to regulate the temperature of the conventional cooling base 130. The features disclosed in the description of the first cooling channel 200 can also be found in each of the other cooling channels 222. Therefore, unless otherwise stated, each cooling channel 210 is substantially similar to the first cooling channel 200.

[0031] The first cooling passage 200 may have an inlet 240 and an outlet 280. The inlet 240 is configured to provide cooling fluid to the first cooling passage 200. The inlet 240 may be fluidly connected to an external cooling fluid source, such as... Figure 1 The heat transfer fluid source 122 is illustrated. Cooling fluid flows from inlet 240 through first cooling channel 200 to outlet 280. As heat is transferred from conventional cooling base 130 to the cooling fluid, the fluid temperature may increase from inlet 240 to outlet 280. Outlet 280 receives cooling fluid from first cooling channel 200. The heat transfer fluid flows through first cooling channel 200 to regulate the temperature of conventional cooling base 130. The heat transfer fluid exits first cooling channel 200 at outlet 280.

[0032] The first cooling channel 200 has a generally spiral geometry, winding around an inner annular channel 214 at the center of the conventional cooling base 130, wherein as the first cooling channel 200 rotates around the inner annular channel 214, individual sections gradually move away from or towards the inner annular channel 214. In the conventional cooling base 130, the cooling fluid entering from the inlet 240 travels a long distance along each cooling channel 210 before exiting from the outlet 280, which leads to temperature uniformity problems due to the increase in cooling fluid temperature from the inlet 240 to the outlet 280. Compared to the conventional cooling base 130, the cooling base 126 has a shorter path along each cooling channel.

[0033] Figures 3A to 3BThis is an isometric cross-sectional view of the appropriately modified cooling base 126. As discussed above, the cooling base 126 has a shortened cooling path in the hot zone adjacent to the substrate support 174, achieved through a chamber design for discretely distributing the cooling fluid. The shorter cooling path in the hot zone reduces the temperature variation of the cooling fluid along the cooling path, thereby better maintaining the temperature uniformity of the substrate support 174. The cooling base 126 relies on a chamber type configuration that provides improved thermal uniformity. In this configuration, the cooling base 126 is made of multiple plates to facilitate multiple cooling fluid inlets along the top surface and an adjacent exit path of the cooling fluid from the top surface, thereby shortening the cooling fluid time in the hot zone (i.e., the top surface) adjacent to the substrate support 174. Minimizing the travel distance of the fluid in the hot zone maintains the cooling efficiency of the entire cooling zone. This ensures that the heat removal in different areas of the hot zone is substantially the same, which provides improved thermal uniformity on the substrate support 174 mounted on the cooling base 126.

[0034] The cooling base 126 has a top plate 310 and a bottom plate 340. The top plate 310 is configured to be disposed adjacent to the substrate support 174. The cooling base 126 has one or more intermediate plates. A first intermediate plate 320 is disposed adjacent to and below the top plate 310. A second intermediate plate 330 is disposed between the first intermediate plate 320 and the bottom plate 340. It is conceivable that the bottom plate 340 and the second intermediate plate 330 may be formed of one or more layers.

[0035] In the following discussion, reference will be made to Figure 4 and Figure 5 Additional discussion on cooling base 126. Figure 4 This is a side view of the cooling base 126. Figure 5 This is a top plan view of the intermediate plate in the cooling base, which exposes all cooling inlet and outlet holes.

[0036] The top plate 310 has a top surface 301 and a bottom surface 302. The top surface 301 and the bottom surface 302 are opposite to each other. The lifting rod hole 391 is positioned to pass through the top surface 301 and extend through the bottom surface 302. Figure 4 As shown, the top plate 310 may have an outer flange 311, depending on the situation. The outer flange 311 may extend below the bottom surface 302. Alternatively, the top plate 310 may not have an outer flange 311 extending below the bottom surface 302. That is, the bottom surface 302 of the top plate 310 is the lowest surface of the top plate 310.

[0037] The top plate 310 has a cooling channel 350 opening into the bottom surface 302 of the top plate 310. If one is present, an outer flange 311 extends beyond and below the bottom surface 302. The cooling channel 350 is configured to prevent cooling fluid from flowing from the center of the top plate 310 to the edge. The cooling channel 350 is configured to maintain the cooling fluid in the top plate for the shortest possible duration and length. Therefore, cooling fluid entering the cooling channel 350 will immediately exit from the same cooling channel to maintain the cooling efficiency of the entire top plate 310.

[0038] Cooling passage 350 can be reduced to a concentric ring or region 380. For example, a fifth cooling passage region 385 can have a first passage 388 and a second passage 389. Coolant is supplied to the fifth cooling passage region 385 through the first passage 388, and the coolant exits the fifth cooling passage region 385 through the second passage 389. The first passage 388 and the second passage 389 are adjacent to each other to minimize coolant exposure heat from the top plate 310. In one example, the second passage 389 is disposed adjacent to the outside of the first passage 388. In another example, the first passage 388 is disposed adjacent to the outside of the second passage 389. Alternatively, the second passage 389 and the first passage 388 can be radially adjacent. A fourth cooling passage region 384 is fluidly isolated from the fifth cooling passage region 385. Similarly, the first cooling passage 381, the second cooling passage region 382, ​​and the third cooling passage region 383 are fluidly isolated from each other and from both the fifth cooling passage region 385 and the fourth cooling passage region 384. Although five cooling channel zones are shown, the top plate 310 can have any number of zones, including three concentric zones. Furthermore, it should be understood that the cooling channel zones can be further subdivided into multiple sub-zones. For example, the fifth cooling channel can have 10 sub-zones.

[0039] The first intermediate plate 320 has an upper surface 321 and a lower surface 322 opposite to the upper surface 321. The upper surface 321 is configured to contact the bottom surface 302 of the top plate 310. The first intermediate plate 320 has an outer edge 323. In one embodiment, the outer edge 323 is adjacent to the outer flange 311 of the top plate 310. The outer flange 311 of the top plate 310 extends downward to the bottom surface 322 of the first intermediate plate 320 and has a bottom that is coplanar with the bottom surface 322 of the first intermediate plate 320. In another embodiment, the outer edge 323 of the first intermediate plate 320 extends to the outer periphery of the cooling base 126.

[0040] like Figure 5As can also be seen, the upper first intermediate plate 320 has multiple fluid inlets 342 and fluid outlets 348. The fluid inlets 342 are configured to supply cooling fluid to the cooling channels 350 of the top plate 310. The fluid outlets 348 are configured to discharge cooling fluid from the cooling channels 350. It is conceivable that each fluid inlet 342 can have a one-to-one relationship with a corresponding fluid outlet 348. In this way, the flow of cooling fluid to the cooling channels 350 is not obstructed by either the fluid inlet 342 or the fluid outlet 348. In one example, the fifth channel of the cooling channel 350 located in the fifth channel region 385 has three or more fluid inlets 342 and fluid outlets 348. That is, a single cooling channel of the cooling channel 350 can have more than one fluid inlet 342 and an equal number of more than one fluid outlet 348. The fluid inlets 342 and fluid outlets 348 for the corresponding cooling areas are balanced to accommodate the same flow. Alternatively, the cooling zone may have sub-regions each containing a single cooling channel 350, which has a single fluid inlet 342 coupled to a corresponding fluid outlet 348. In this way, the cooling fluid flowing into the cooling channel 350 can better maintain a constant temperature across the top surface 301 of the top plate 310.

[0041] The second intermediate plate 330 has a top surface 331 and a bottom surface 332. The second intermediate plate 330 has an intermediate layer 337 disposed between the bottom surface 332 and the top surface 331. The second intermediate plate 330 has a plurality of islands 338 extending upward from the intermediate layer 337. Each island 338 has a top 339. The top 339 of the island coincides with the top surface 331 of the second intermediate plate 330. Each of the plurality of islands 338 has a corresponding inlet port 462 disposed to pass through the island from the top surface 331. The inlet port 462 is configured to align with the fluid inlet 342 of the first intermediate plate 320. That is, the inlet port 462 is fluidly coupled to the fluid inlet 342. In this way, cooling fluid is supplied to the top plate 310 by moving only through the inlet port 462 of the second intermediate plate 330 and the fluid inlet 342 of the first intermediate plate 320.

[0042] The island 338 forms a return air chamber 460 in the second intermediate plate 330. The return air chamber 460 is formed between the intermediate layer 337 of the second intermediate plate 330, the side of the island 338, and the lower surface 322 of the first intermediate plate 320. The return air chamber 460 is fluidly coupled to the fluid outlet 348. The return air chamber 460 collects used cooling fluid that returns from the cooling channel 350 in the top plate 310 through the fluid outlet in the first intermediate plate 320.

[0043] A supply air chamber 480 is disposed in a second intermediate plate 330 below the return air chamber 460. The supply air chamber 480 is formed between the intermediate layer 337 and the top surface 341 of the bottom plate 340. The supply air chamber 480 is fluidly coupled to an inlet port 462 disposed in a plurality of islands 338. The supply air chamber 480 is configured to supply cooling fluid through the inlet port 462 and the fluid inlet 342 to a cooling channel 350 for regulating the temperature of the top plate 310. The intermediate layer 337 may be formed of an insulating material to reduce heat transfer between the supply air chamber 480 and the return air chamber 460. Alternatively, the supply air chamber 480 and the return air chamber 460 may be reversed. For example, the supply air chamber may be located at item 460, and the return air chamber may be located at item 480.

[0044] The supply air chamber 480 allows for the supply of cooling fluid at a constant temperature across the entire top plate 310. The return air chamber 460 ensures that used cooling fluid is rapidly removed to increase the thermal uniformity of the top plate 310. The second intermediate plate 330 is coupled to the first intermediate plate 320 to minimize the time the cooling fluid spends in the top plate 310.

[0045] The base plate 340 has a bottom surface 343 opposite to the top surface 341. The top surface 341 supports a second intermediate plate 330 of the cooling base 126. The bottom surface 343 is the bottom surface 302 of the cooling base 126. A coolant supply passage 373 is configured to pass through the base plate 340. The coolant supply passage 373 fluidly couples the supply chamber 480 to a coolant supply source 370, such as a heat transfer fluid source 122. In one example, such as Figure 3B As shown, the base plate 340 has a plurality of coolant supply channels 373 arranged radially around the center of the base plate 340.

[0046] The coolant return channel 393 is configured to pass through the base plate 340. The coolant return channel 393 is fluidly coupled to the return passage 392, which is disposed together with the base plate 340, to the return gas chamber 460. The coolant return channel 393 couples the return passage 392 to the coolant heat exchanger 390, or externally to the base plate 340, back to the coolant supply source 370. In one example, such as... Figure 3B As shown, the base plate 340 has a plurality of coolant return channels 393 arranged radially around the center of the base plate 340. In one example, the coolant return channels 393 are located outside the coolant supply channel 373. Alternatively, in other words, the coolant return channels 393 surround the coolant supply channel 373.

[0047] The described coolant structure for cooling base 127 enhances the temperature uniformity of substrate support assembly 172 during operation. Cooling base 127 has a cooling zone in top plate 310 adjacent to substrate support 174. Cooling base 127 is configured with cooling channels 350 having one or more fluid inlets 342 and fluid outlets 348. Fluid inlets 342 and fluid outlets 348 provide coolant flow to different fluid isolation zones of cooling channel 350. Cooling base 127 provides an adjacent exit path for cooling fluid in fluid outlets 348 to shorten the cooling fluid path and time in the hot zone adjacent to substrate support 174. The shortened cooling fluid path provides enhanced cooling capacity throughout the cooling zone in the hot zone. The shorter travel distance of cooling fluid in cooling channel 350 ensures that cooling efficiency remains consistent across the entire upper surface 301 of top plate 310.

[0048] Figure 6 Describes a method using Figure 3A and Figure 3B A method 600 for cooling a substrate support using a cooling base. Method 600 begins at operation 610, in which cooling fluid flows into a cooling fluid inlet chamber disposed in an intermediate plate of the cooling base. At operation 620, cooling fluid flows from the cooling fluid inlet chamber into one of a plurality of cooling channels in a top plate of the cooling base. The cooling channel has a cooling fluid inlet and a cooling fluid outlet. In one example, the cooling fluid channel has three or more cooling fluid inlets and corresponding cooling fluid outlets. At operation 630, cooling fluid from the cooling channel flows through the cooling fluid outlet into a cooling fluid return chamber. The cooling fluid return chamber is disposed in the cooling base, perpendicularly adjacent to the cooling fluid supply chamber. The cooling fluid return chamber has a plurality of islands through which cooling fluid is supplied to the cooling channels.

[0049] Advantageously, the shortened cooling channel in the top plate, coupled to the supply and return air chamber below the top plate, along the top surface of the cooling plate, achieves enhanced temperature control and uniformity.

[0050] While the foregoing describes a specific implementation, other and further implementations may be designed without departing from its basic scope, the scope of which is defined by the following claims.

Claims

1. A cooling base, the cooling base comprising: A top plate having cooling channels formed therein; An intermediate plate, wherein the intermediate plate is disposed below the top plate, the intermediate plate comprising: A cooling return air chamber is disposed on the intermediate layer; A cooling supply air chamber is disposed below the intermediate layer; Multiple islands are disposed in the cooling return air chamber on the intermediate layer; Multiple cooling inlets are arranged to pass through the multiple islands and couple the cooling supply air chamber to the cooling channel; as well as Multiple cooling outlets, wherein the multiple cooling outlets fluidly couple the cooling channel to the cooling return gas chamber; as well as A base plate is disposed below the intermediate plate, and the base plate has a cooling inlet that is fluidly coupled to the cooling supply air chamber and a cooling outlet that is fluidly coupled to the cooling return air chamber.

2. The cooling base as claimed in claim 1, wherein the top plate further comprises: Multiple zones, wherein the cooling channels are arranged in the multiple zones, wherein each zone is fluidly isolated from all other zones and fluidly coupled to two or more of the multiple cooling inlets.

3. The cooling base as claimed in claim 2, wherein each region is fluidly coupled to two or more of the plurality of cooling outlets.

4. The cooling base as claimed in claim 3, wherein the plurality of regions are concentric with each other.

5. The cooling base as claimed in claim 3, wherein the first number of cooling outlets in the first region is less than the second number of cooling outlets in the second region.

6. The cooling base as claimed in claim 1, wherein the cooling base further comprises: A first insert is disposed in one or more of the plurality of cooling inlets, wherein the first insert determines fluid flow through the cooling inlet.

7. The cooling base as claimed in claim 1, wherein the cooling base further comprises: A second insert is disposed in one or more of the plurality of cooling outlets, wherein the second insert determines fluid flow through the cooling inlet.

8. The cooling base of claim 2, wherein a first fluid inlet disposed in a first region of the plurality of regions has a first opening size for fluid flow, the first opening size being different from that of a second fluid inlet disposed in a second region of the plurality of regions.

9. The cooling base as claimed in claim 2, wherein the cooling fluid flow through the first region of the plurality of regions is different from the cooling fluid flow through the second region of the plurality of regions.

10. A substrate support assembly, the substrate support assembly comprising: Substrate support; A cooling base, coupled to the substrate support, the cooling base comprising: A top plate having cooling channels formed therein; An intermediate plate, wherein the intermediate plate is disposed below the top plate, the intermediate plate comprising: A cooling return air chamber is disposed on the intermediate layer; A cooling supply air chamber is disposed below the intermediate layer; Multiple islands are disposed in the cooling return air chamber on the intermediate layer; Multiple cooling inlets are arranged to pass through the multiple islands and couple the cooling supply air chamber to the cooling channel; as well as Multiple cooling outlets, wherein the multiple cooling outlets fluidly couple the cooling channel to the cooling return gas chamber; as well as A base plate is disposed below the intermediate plate, and the base plate has a cooling inlet that is fluidly coupled to the cooling supply air chamber and a cooling outlet that is fluidly coupled to the cooling return air chamber.

11. The substrate support assembly of claim 10, wherein the top plate further comprises: Multiple zones, wherein the cooling channels are arranged in the multiple zones, wherein each zone is fluidly isolated from all other zones and fluidly coupled to two or more of the multiple cooling inlets.

12. The substrate support assembly of claim 11, wherein each region is fluidly coupled to two or more of the plurality of cooling outlets.

13. The substrate support assembly of claim 12, wherein the plurality of regions are concentric with each other.

14. The substrate support assembly of claim 13, wherein the first number of cooling outlets in the first region is less than the second number of cooling outlets in the second region.

15. The substrate support assembly of claim 10, wherein the substrate support assembly further comprises: A first insert is disposed in one or more of the plurality of cooling inlets, wherein the first insert determines fluid flow through the cooling inlet.

16. The substrate support assembly of claim 10, wherein the substrate support assembly further comprises: A second insert is disposed in one or more of the plurality of cooling outlets, wherein the second insert determines fluid flow through the cooling inlet.

17. The substrate support assembly of claim 11, wherein a first fluid inlet disposed in a first region of the plurality of regions has a first opening size for fluid flow, the first opening size being different from a second fluid inlet disposed in a second region of the plurality of regions.

18. The cooling base of claim 11, wherein the cooling fluid flow through the first region of the plurality of regions is different from the cooling fluid flow through the second region of the plurality of regions.

19. A method for regulating the temperature of a substrate support disposed on a cooling base, the method comprising: The cooling fluid is directed to the cooling fluid supply chamber located in the intermediate plate of the cooling base; The cooling fluid flows from the cooling fluid supply chamber to one of the plurality of cooling channels in the top plate of the cooling base; and The cooling fluid flows from the cooling channel through the cooling fluid outlet to the cooling fluid return chamber located in the intermediate plate, wherein the cooling fluid return chamber is perpendicular to the adjacent cooling fluid supply chamber.

20. The method of claim 19, wherein the cooling channel has three or more cooling fluid inlets and corresponding cooling fluid outlets, and the cooling fluid return chamber is disposed in the cooling base, perpendicularly adjacent to the cooling fluid supply chamber.

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