Magnetic levitation system for substrate support apparatus

Abstract

A substrate support apparatus is provided. The substrate support apparatus includes a base fixed to a processing chamber. The base includes a stator configured to generate a first magnetic field, a second magnetic field, and a third magnetic field. The substrate support apparatus further includes a substrate support above the base for supporting a substrate. The substrate support includes a rotor having a first reactive region that interacts with the first magnetic field to control a vertical position of the substrate support and that interacts with the second magnetic field to center the substrate support to the base. The substrate support includes a second reactive region that interacts with the third magnetic field to rotate the substrate support. The first magnetic field and the first reactive region selectively levitate the substrate support to any distance in a range from 0 mm to 6 mm above a rest position.

Description

Technical Field

[0001] Embodiments of this disclosure generally relate to a substrate support device incorporating magnetic levitation functionality, and more particularly to a substrate support device incorporating magnetic levitation functionality for intracavitary processing. Background Technology

[0002] Rapid thermal processing (RTP) chambers are specialized devices used in substrate fabrication, such as semiconductor manufacturing. The primary function of an RTP chamber is to expose the substrate to rapid temperature changes for processes such as doping, oxidation, or annealing. RTP chambers typically achieve this by using high-intensity heat sources, such as heating lamps. These sources can rapidly raise the substrate temperature to hundreds or even thousands of degrees Celsius. This rapid heating is followed by a rapid cooling phase, making RTP a faster alternative to conventional processes.

[0003] As mentioned, temperature control within the RTP chamber is typically achieved through a combination of heating elements (such as halogen lamps or other high-intensity heat sources) and complementary cooling mechanisms (such as forced air or water cooling systems). Summary of the Invention

[0004] The following is a brief overview of this disclosure in order to provide a basic understanding of some aspects of this disclosure. This overview is not an exhaustive summary of this disclosure. It is not intended to identify any important or key elements of this disclosure, nor is it intended to depict any category of particular embodiments of this disclosure or any category of the claims. Its sole purpose is to present some concepts of this disclosure in a concise form as a prelude to the more detailed description that follows.

[0005] In some aspects, a substrate support device is provided. In some aspects, the substrate support device includes a substrate fixed to a processing chamber, the substrate including a stator configured to generate a first magnetic field, a second magnetic field, and a third magnetic field. In some aspects, the substrate support device further includes a substrate support member positioned on the substrate and configured to support the substrate. In some aspects, the substrate support member includes a rotor including a first reactive region configured to interact with the first magnetic field to magnetically control the vertical position of the substrate support member and to interact with the second magnetic field to magnetically center the substrate support member on the substrate. In some aspects, the rotor further includes a second reactive region configured to interact with the third magnetic field to magnetically rotate the substrate support member. In some aspects, the first magnetic field and the first reactive region are configured to selectively suspend the substrate support member above a stationary position at any distance ranging from 0 mm to 6 mm.

[0006] In some aspects, a system is provided. In some aspects, the system includes a processing chamber and a base disposed within the processing chamber and fixed to a bottom plate of the processing chamber. In some aspects, the base includes a stator configured to generate a first magnetic field, a second magnetic field, and a third magnetic field. In some aspects, the system further includes a substrate support positioned on the substrate and configured to support the substrate. In some aspects, the substrate support includes a rotor including a first reactive region configured to interact with the first magnetic field to magnetically control the vertical position of the rotor and to interact with the second magnetic field to magnetically center the substrate support on the substrate. In some aspects, the rotor further includes a second reactive region configured to interact with the third magnetic field to magnetically rotate the rotor. In some aspects, the first magnetic field and the first reactive region are used to selectively suspend the substrate support above a stationary position at any distance ranging from 0 mm to 6 mm.

[0007] In some aspects, a method is provided. In some aspects, the method includes generating a first magnetic field through the stator of a substrate support assembly to cause a first magnetic interaction with a first iron ring of a rotor of a substrate support member attached to the substrate support assembly. In some aspects, the first magnetic interaction controls the vertical position of the substrate support member. In some aspects, the method further includes selectively suspending the substrate support member above a rest position by any vertical distance ranging from 0 mm to 6 mm using the first magnetic field, and generating a second magnetic field through the stator to cause a second magnetic interaction with the first iron ring of the rotor. In some aspects, the second magnetic interaction centers the substrate support member relative to the substrate. In some aspects, the method further includes centering the substrate support member relative to the substrate within a vertical range by the second magnetic interaction, and generating a third magnetic field through the stator to cause a third magnetic interaction with a second iron ring of the rotor attached to the substrate support member. In some aspects, the third magnetic interaction rotates the substrate support member and rotates the support assembly within a vertical distance by the third magnetic interaction. A first magnetic field is generated by the stator of a support device configured to support a substrate within a processing chamber. The rotor of the support device is displaced in a first direction by the interaction between the first reactive portion of the rotor and the generated first magnetic field. A second magnetic field is generated by the stator. The rotor is centered relative to the support device by the interaction between the second reactive portion of the rotor and the generated second magnetic field. A third magnetic field is generated by the stator. The rotor of the support device is displaced in a rotational direction by the interaction between the third reactive portion of the rotor and the generated third magnetic field. Attached Figure Description

[0008] The aspects and embodiments of this disclosure will be more fully understood from the detailed description and accompanying drawings given below, which are intended to illustrate the aspects and embodiments by way of example and without limitation.

[0009] Figure 1 A cross-sectional side view of a processing chamber according to some embodiments of the present disclosure is shown.

[0010] Figure 2A Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of an exemplary substrate support device.

[0011] Figure 2B Some embodiments according to this disclosure are shown. Figure 1 A top-to-bottom view of an exemplary substrate support device.

[0012] Figure 3 Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of a portion of an exemplary substrate support device.

[0013] Figure 4 Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of a portion of an exemplary substrate support device.

[0014] Figure 5A Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of an exemplary axial suspension mechanism of an exemplary substrate support device.

[0015] Figure 5B Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of an exemplary axial suspension mechanism of an exemplary substrate support device.

[0016] Figure 6A Some embodiments according to this disclosure are shown. Figure 1 A partial view of an exemplary radial positioning mechanism of an exemplary substrate support device.

[0017] Figure 6B Some embodiments according to this disclosure are shown. Figure 1 A partial view of an exemplary radial positioning sensing mechanism for a substrate support device.

[0018] Figure 7 This is an operation according to one embodiment of the present disclosure. Figure 1 A flowchart of an exemplary method for a substrate support device.

[0019] Figure 8 This is a diagram of a computing device according to one embodiment of the present disclosure. Detailed Implementation

[0020] Controlling the position of the substrate relative to the heating and cooling elements within the RTP chamber ensures uniform temperature distribution and consistent processing. For example, if the substrate is not optimally positioned, it can lead to uneven heating or cooling. This can result in inhomogeneous material properties across the substrate. For instance, areas closer to the heat source may receive more heat and experience chemical reactions at different rates compared to areas placed further away. This can lead to significant inconsistencies that can affect uniformity across the substrate, as well as process performance and yield.

[0021] One strategy for addressing inconsistencies and increasing uniformity is to rotate the substrate within the RTP chamber as it is processed. As the substrate rotates, it moves through different hot zones within the chamber, ensuring that all portions of the substrate are exposed to the same thermal environment over time. Therefore, this rotation overcomes any inherent inconsistencies in the heating element or chamber design.

[0022] The position (and orientation) of the substrate in the RTP chamber is typically controlled by a mechanical system. Such systems often include robotic arms or precision mechanical stages that can move the substrate in various directions and angles.

[0023] Current methods for controlling substrate position and orientation face several challenges. As mentioned, accuracy is an issue; even slight inaccuracies in the mechanical positioning system can lead to significant variations in heat treatment across the substrate. Additionally, the maximum achievable movement distance and rotation angle of the mechanical system are limited, which can restrict the processing uniformity of larger substrates. Furthermore, the mechanical system itself can introduce contaminants or vibrations, which can affect process quality.

[0024] Therefore, the embodiments described herein address the above and other challenges by introducing a modified substrate support device incorporating a novel magnetic levitation mechanism and a configuration that enhances vertical controllability. Magnetic levitation, or "maglev" for short, uses an induced magnetic field to suspend and manipulate the substrate and / or substrate stage without physical contact. This type of magnetic levitation can be used to position and rotate substrates within an RTP chamber. This reduced physical contact lowers the risk of contamination and mechanical stress.

[0025] The proposed system and configuration can further provide a mechanism for enhancing the overall vertical operating range of the levitation component (which holds the substrate). This extended operating range can be achieved through the specific geometry and configuration of the system components. Therefore, the magnetic levitation mechanism disclosed herein allows for enhanced accuracy and control over the position and orientation of the substrate.

[0026] The advantages of this disclosure and the embodiments discussed herein include enhanced accuracy and controllability. By incorporating additional rotation and suspension sensors into the system, the design aims to achieve a higher level of operational accuracy. These sensors can provide real-time feedback on various parameters, thereby allowing for minute adjustments and more precise control of the processes involved.

[0027] Additionally, the systems and methods described in this disclosure include improvements to the vertical positioning range of the rotor relative to the processing chamber (and other components therein, such as heat sources). This is achieved by enhancing the achievable axial clearance of the rotor, the range and controllability of the vertical field of rotor positioning. This enhancement allows for more general and precise positioning of the rotor along the vertical axis. This advancement enables precise and further-range positioning relative to other components of the processing chamber, such as heat sources. By achieving greater axial movement, the provided system can adjust the position of the substrate (relative to the heat source) with greater accuracy, thereby ensuring that the substrate is placed at an optimal distance from the heat source. Therefore, processes such as RTP, which rely on the uniformity and controllability of heat exposure of the substrate, can be controlled with greater precision.

[0028] The ability to finely adjust the substrate's positioning relative to the heat source means that the required precise heat can be applied. This precision in heating control results in more uniform heat treatment. This level of control also allows for additional customization of the heating profile for different substrates.

[0029] The improvements offered by this system directly impact the overall quality and efficiency of production. The added functionality contributes to the uniformity of product yield. By ensuring that each unit produced meets desired standards, the system effectively minimizes defects and inconsistencies. This enhanced uniformity leads to improved final product quality, resulting in more reliable and satisfactory final products. Furthermore, the system's finer control and precision directly translate into faster throughput times; operations can be performed more quickly without sacrificing quality. Reduced waste and defective product cycles also mean less waste and rework. This lowers material costs and contributes to more sustainable production practices.

[0030] Figure 1 A cross-sectional view of an exemplary processing chamber 100 (e.g., an RTP chamber) of a substrate manufacturing system according to some embodiments of the present disclosure is shown.

[0031] In some embodiments, the processing chamber 100 may perform thermal processes. In some embodiments, the processing chamber 100 may perform plasma-based processes. Alternatively, the processing chamber may perform non-plasma processes. In some cases, the processing chamber 100 may be suitable for thermal processes (e.g., RTP), etching operations, deposition operations, chamber cleaning operations, plasma processing operations, or any other type of operation common in semiconductor manufacturing facilities. In one embodiment, one or more substrates (e.g., wafers) 102 may be provided within the processing chamber.

[0032] In some embodiments, chamber 100 may include thermal energy source 130, which may be a continuous energy source. In some embodiments, thermal energy source 130 may be thermal energy source such as: one or more heating lamps, one or more infrared (IR) sources (e.g., which can guide IR light onto a region of the substrate via optical fiber), one or more resistance heating elements, one or more convection heaters, one or more microwave energy sources, etc. In some embodiments, thermal energy source 130 may be any energy source capable of delivering heat energy to the substrate (i.e., heating the substrate).

[0033] As can be seen, the processing chamber 100 may include a chamber body 112. The chamber body 112 at least partially defines the processing volume 110. In some embodiments, the chamber body 112 includes a top wall 112A (e.g., a ceiling or cover), a bottom wall 112B (e.g., a base plate) opposite the top wall 112A, a first side wall 112C coupling the top wall 112A and the bottom wall 112B, and a second side wall 112D opposite the first side wall 112C. The chamber body 112 may be or include any material suitable for the process performed in the processing chamber 100. For example, suitable materials for the fortress chamber body 112 include aluminum, stainless steel, ceramic materials, or combinations thereof.

[0034] At least one substrate support device 104 may be disposed in the processing volume 110 to support one or more substrates 102 thereon during processing. In some embodiments, the substrate support device 104 may include a base 116, which may be part of a substrate support base (which may be or include a stator 120, a housing 140, and a rotor 160) attached to a shaft 124. In some embodiments, the base 116 includes a cooling plate having one or more cooling channels through which coolant can flow. In some embodiments, the base 116 includes one or more heating elements. The substrate support device 104 may include a substrate support member 158, which may rest on and / or be positioned on the base 116. The substrate support member 158 may support the substrate during processing (e.g., RTP). In embodiments, the substrate support member 158 includes one or more clamping electrodes, one or more heating electrodes, one or more radio frequency (RF) electrodes, etc. In some embodiments, the substrate support member 158 is powered. In some implementations, the substrate support is not powered (and may not include any electrodes, depending on the circumstances).

[0035] In one embodiment, substrate 102 may be brought into processing volume 110 through loading port 121. Substrate 102 may include a surface 103 on which means and / or processing are performed. Substrate support 158 ​​and / or base 116 may include components for physically positioning and holding substrate, such as electrostatic chucks, clamps, edge rings, guide pins, or the like.

[0036] In some embodiments, the substrate support device 104 may be configured to rotate the substrate 102 during processing. In some embodiments, the substrate support device 104 may include a magnetic levitation mechanism for supporting and rotating the substrate 102 during processing. This mechanism will be discussed below and in relation to... Figures 2A to 6B Detailed description.

[0037] In some embodiments, chamber 100 may further include one or more substrate temperature sensors 117. The substrate temperature sensor 117 may be embedded in the chamber body 112, the substrate support base (which may be or include a stator 120, a housing 140, and a rotor 160), and / or any other suitable location. In some embodiments, the substrate temperature sensor 117 may measure the temperature of the substrate 102 and transmit the temperature measurement result to a hub / data processing unit (not shown) and / or a controller 152. In some embodiments, the substrate temperature sensor 117 may be a pyrometer. In some embodiments, the substrate temperature sensor may be any suitable temperature sensor. For example, the substrate temperature sensor 117 may be at least one of a thermocouple, a resistance temperature detector, a thermistor, an infrared temperature sensor, a semiconductor temperature sensor, a fiber optic temperature sensor, etc. In embodiments, multiple substrate temperature sensors 117 may be used, which may be positioned within the substrate support 158, within the substrate 116, within the walls, top, and / or bottom of the processing chamber 100, etc.

[0038] During the manufacturing process (e.g., RTP), the conditions in the processing chamber 100 can be monitored by sensors (e.g., temperature sensor 117). Data indicating the measurements taken by the sensors can be provided to the system controller 152.

[0039] The processing system 100 may further include a thermal energy source 130. In some embodiments, the thermal energy source 130 may be, but is not limited to, microwave energy, optical radiation sources (e.g., lasers or flash lamps), electron beam sources, resistance heating sources, and / or ion beam sources. The thermal energy source 130 may provide heating in a continuous or pulsed manner. In some embodiments, the thermal energy source 130 may be a microwave energy source. In some embodiments, the thermal energy source 130 may be coupled to the cavity body 112 via a waveguide.

[0040] The heat generated by thermal energy source 130 can be supplied to the processing volume 110 from the topmost position within chamber 100 (e.g., from top wall 112A). Although Figure 1 The illustration shows a heat source positioned along the top wall 112A of the chamber body 112, but the heat source can also be placed in other locations, such as the bottom wall 112B, the first side wall 112C, the second side wall 112D, or a combination of different locations. In embodiments, it is feasible to use more than one heat source at more than one location.

[0041] In some embodiments, the thermal energy source 130 is positioned to heat the entire substrate 102. The thermal energy source 130 can be positioned to deliver emitted heat 190 perpendicular to the main surface 103 of the substrate 102, which is positioned on a substrate support base (which may be or include a stator 120, a housing 140, and a rotor 160), and / or at different angles. The thermal energy source 130 can be a continuous or pulsed source. In a particular embodiment, the thermal energy source 130 is a continuous source. In a particular embodiment, the thermal energy source 130 is microwave energy (e.g., continuous microwave energy).

[0042] In some embodiments, the thermal energy source 130 is a microwave generator. The microwave generator can produce microwaves of a fixed frequency or microwaves of a variable frequency.

[0043] In some embodiments, the processing system 100 further includes a gas supplier 150. The gas supplier 150 may be fluidly coupled to the processing volume via a gas inlet port 151. The gas supplier 150 may be coupled to the processing chamber body 112 at any suitable location for supplying gas to the processing volume 110, such as along the first sidewall 112C of the chamber body 112, as shown. For example, depending on the chamber design and process gas flow considerations, the gas inlet port 151 may be located at any suitable location in the processing chamber 100, such as in the first sidewall 112C, the second sidewall 112D of the processing chamber 100, above or below the surface of the substrate support base (which may be or include the stator 120, the housing 140, and the rotor 160), in the top wall 112A of the processing chamber 100, in the bottom wall 112B of the processing chamber 100, or in any other suitable location. In some embodiments, the gas supply 150 may include one or more pumps and valves for regulating the pressure of the processing volume 110 of the processing chamber 100. In embodiments, the gas supply may provide one or more gases to the processing volume 110 during processing. In some embodiments, the gas may be or include at least one of helium, nitrogen, oxygen, argon, carbon dioxide, carbon monoxide, ammonia, hydrogen sulfide, fluorine, chlorine, or combinations thereof. Examples of processing gases that can be used to process substrates in the processing chamber 100 include halogen-containing gases such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, F2, Cl2, CCl4, BCl3, and SiF4, etc., as well as other gases such as O2 or N2O. Examples of carrier gases include N2, He, AR, and other gases that are inert to process gases (e.g., non-reactive gases).

[0044] In some embodiments, the gas supply 150 may provide one or more suitable process gases for processing the substrate 102 and / or for maintaining the process volume 110 (such as annealing gases, deposition gases, etching gases, cleaning gases, or the like). For example, embodiments of this disclosure may be used for annealing, deposition, or implantation processes that use certain gases supplied to the process volume 110. The gases may be reactive, such as precursors for deposition processes, or non-reactive, such as inert gases typically used in conventional thermal processes.

[0045] For simplicity, other components used to control the flow rate of gas to the processing volume 110, such as flow controllers, valves, or the like, are not shown.

[0046] In some embodiments, the substrate support 158 ​​may expose a portion of the surface region (e.g., surface 103) of the substrate 102 to the processing volume 110, and gas and / or plasma may circulate within the processing volume 110 during processing.

[0047] In some embodiments, the processing system 100 further includes an exhaust system 170. In one embodiment, the exhaust system 170 is coupled to the processing chamber body 112 via an exhaust port 172. The exhaust system 170 may be coupled to the processing chamber body 112 at any suitable location for discharging the processing volume 110, such as along the bottom wall 112B of the chamber body 112, as shown. For example, depending on the chamber design and process gas flow considerations, the exhaust port 172 may be located at any suitable location in the processing chamber 100, such as in the first sidewall 112C, the second sidewall 112D of the processing chamber 100, above or below the surface of the substrate support base (which may be or include the stator 120, the housing 140, and the rotor 160), in the top wall 112A of the processing chamber 100, in the bottom wall 112B of the processing chamber 100, or in any other suitable location. In some embodiments, the exhaust system 170 may include one or more pumps and valves for evacuating and regulating the pressure of the processing volume 110 of the processing chamber 100.

[0048] In some embodiments, the exhaust system 170 may include or be a pump system, which may include one or more pumps, valves, lines, manifolds, tanks, etc., for evacuating and regulating the pressure of the internal volume 110. One or more other pressure sensors and / or flow sensors may be located within the processing chamber, at the exhaust port, and / or other locations.

[0049] In some embodiments, the processing chamber 100 may be a batch processing chamber having a substrate support assembly for supporting a plurality of substrates. In one embodiment, the processing chamber 100 may include a single chamber and / or a single substrate support assembly (e.g., a single substrate support device 104).

[0050] In some embodiments, each chamber may contain one or more substrates supported by one or more substrate support devices 104. The substrate support device 104 of the RTP chamber generally refers to a structure or means for holding the substrate in place. Each substrate support device 104 may be designed to securely hold the substrate during processing while ensuring that the substrate can be easily and undamagedly moved into and out of the RTP chamber. In some embodiments, the substrate support device may be or include a flat platform or tray on which the substrate 102 rests. These may be static or include mechanisms for rotation or other movement, such as vertical movement. In some embodiments, the substrate support device 104 may also include clamping (e.g., electrodes for electrostatic clamping) or other securing mechanisms to hold the substrate in place, particularly during any movement.

[0051] In some embodiments, one or more portions of the substrate support 104 may be configured to move within their respective processing chambers 100. For example, in some embodiments, the substrate support 104 may each be attached to an indexer ( Figure 1 (Not shown in the figure), the indexer is configured to raise or lower, or otherwise move the substrate support 104 relative to the processing chamber 100 (independent of the magnetic levitation mechanism described below). In some embodiments, the substrate support 104 can be laterally displaced to securely receive the substrate. For example, in some embodiments, the lateral position of the substrate support 104 can be calibrated to properly interact with the system's end actuators. Thus, in some embodiments, the position of the substrate support 104 can be adjusted in any dimension relative to the processing chamber 100.

[0052] As mentioned, in some embodiments, the substrate support device 104 may include a magnetic levitation mechanism, which may include a base 116 and a substrate support 158, the base including a stator 120 and the substrate support including a rotor 160 (which will be described below). Figures 2A to 6B (As described further below). In some embodiments, stator 120 may include one or more motors (as will be discussed later). Figures 2A to 6B The stator 120 and / or the base 116 may further include one or more sensors for generating one or more magnetic fields to engage and / or control the levitation, stability, and / or rotation of the rotor 160 (and the base plate support 158 ​​and the base plate 102 it supports).

[0053] In one embodiment, the base 116 may include a housing 140, which can serve as a structural component of the magnetic levitation system. In another embodiment, the housing may isolate a portion of the internal rotor 160 from the external stator. In yet another embodiment, the housing may be constructed of a material selected for strength and transmission of magnetic properties. The housing may be designed to shield components of the system from external magnetic interference and / or environmental factors. In some embodiments, the housing may include a stator or stator functionality.

[0054] The rotor 160 may include a magnetic material or region (e.g., such a ferromagnetic, antimagnetic, or paramagnetic material or region) that interacts with the magnetic field generated by the stator 120.

[0055] In some implementations, the stator can be driven by a motor ( Figure 1 (Not illustrated) generates a magnetic field. In some cases, this can be a switched reluctance motor (SR motor or SRM). In other cases, this can be any other type of motor capable of generating a magnetic field, including permanent magnet motors and induction motors (see below). Figure 3 (C is described further). This interaction allows the rotor to levitate and / or rotate with minimal friction.

[0056] In some embodiments, the magnetic levitation system (e.g., stator 120) can raise and lower the rotor 160 (and the substrate support 158 ​​and the supported substrate 102) during processing. For example, in some embodiments, the stator 120 can be energized to raise and lower the rotor 160 (and the substrate support 158 ​​and the substrate 102) by a vertical distance 106 (as per the description of...). Figures 5A to 5B (Further description). In an embodiment, the magnetic levitation system and stator 120 can raise the rotor 160 by generating a controlled magnetic field.

[0057] In some embodiments, the rotor 160 may rest within a well 146 or gap within the housing 140 and / or the base 116. In some embodiments, upon elevation, the rotor 160 (and the substrate support 158 ​​and the substrate 102) may be suspended, and a portion of the rotor 160 may be retained within the well 146. When the substrate support 158 ​​is suspended a distance above the base 116, the stator 120 may induce or cause the rotor 160 (and therefore the substrate support 158) to rotate, thereby rotating the supported substrate 102. In embodiments, the rotor 160 may rotate while the stator 120 and the base 116 remain stationary. In some embodiments, the rotation and vertical displacement of the rotor 160 and the substrate support 158 ​​can be precisely measured and controlled (e.g., regarding...). Figure 3 A to Figure 6B (Described). In some embodiments, when the magnetic levitation system is not powered, the base plate support 158 ​​can be placed in a resting position by physically contacting the housing.

[0058] The processing chamber and / or thermal energy source can be connected to a controller 152, which controls processing parameters of the thermal energy source, processing chamber, etc. (e.g., by controlling setpoints, loading recipes, etc.). In some embodiments, one or more flow sensors and / or pressure sensors can be connected to gas lines (e.g., at ports 151, 172) to detect gas flow characteristics. In embodiments, the controller 152 can receive data from one or more flow sensors and / or pressure sensors, as well as temperature sensors and / or other sensors within the processing chamber 100. Based on the measurement results (e.g., temperature measurements of one or more areas of the substrate support 104 and / or substrate 102), the controller 152 can adjust one or more processing parameters, such as the distance between the substrate 102 and the thermal energy source 130, the rotational rate of the substrate 102, the temperature setpoint of the cooling lines within the thermal energy source 130 and / or substrate 116, etc.

[0059] System controller 152 can control one or more parameters and / or setpoints of processing chamber 100 and / or support device 104. Such controller 152 may be and / or include computing devices, such as personal computers, server computers, programmable logic controllers (PLCs), microcontrollers, etc. Such controllers may include one or more processing devices, which may be general-purpose processing devices, such as microprocessors, central processing units, or the like. More specifically, the processing device may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor implementing other instruction sets or combinations of instruction sets. The processing device may also be one or more special-purpose processing devices, such as application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), digital signal processors (DSPs), network processors, or the like. Such a controller may include a data storage device (e.g., one or more disks and / or solid-state drives), main memory, static memory, a network interface, and / or other components.

[0060] This controller can execute instructions to perform any one or more of the methodologies and / or implementations described herein. The instructions can be stored on a computer-readable storage medium, which may include main memory, static memory, secondary storage, and / or processing devices (during instruction execution).

[0061] In this implementation, such a controller can receive measurements of flow and / or pressure parameters (e.g., pressure, flow rate, etc.) from one or more flow sensors and / or pressure sensors. This controller can adjust one or more properties or settings of the processing chamber 100 (e.g., plasma power, temperature, plasma frequency, pump rate, gas flow rate of one or more gases, etc.). For example, the controller can also be configured to allow human operators to input and display data, operating commands, and the like.

[0062] In some embodiments, the controller 152 may engage and adjust any operations associated with the substrate support 104. Such operations may include levitation, rotation, and position adjustment in any direction (vertical, horizontal, rotating, etc.). In some embodiments, the controller 152 may receive sensor measurements from sensors associated with the substrate support 104 and / or the substrate 102 and / or any sensors associated with the magnetic levitation mechanism (e.g., rotational position sensors or encoder mechanisms and sensors). In embodiments, the controller 152 may use this data to adjust or change the output of the control magnetic levitation mechanism. In embodiments, this may form a closed loop or feedback loop. For example, the controller 152 may determine the temperature of one or more regions of the substrate 104, the temperature of the substrate 116, and / or the temperature of the heat source 130, and may adjust the height and / or rotational speed of the substrate support 158 ​​based on this data.

[0063] Figure 2A Some embodiments according to this disclosure are shown. Figure 1 A side cross-sectional view of an exemplary substrate support device.

[0064] from Figure 2A The parts and features seen and described in the document may correspond to or be similar to those described in the document. Figure 1 Similar parts have been seen and described. Therefore, regarding Figure 2A The implementation methods discussed can be combined and expanded upon at least regarding Figure 1 The described implementation method.

[0065] In one embodiment, the substrate support device 200A includes a base 118 fixed to a processing chamber and a substrate support member 268 disposed on the base 118. The base 118 may include a stator 220, and the substrate support member 268 may include a rotor 260 of the substrate support device 200A. The base 118 and the substrate support member 268 may be arranged concentrically, such as... Figures 2A to 2B Seen in [the text]. For example, regarding... Figure 1 In some embodiments, at least a portion of the substrate 218 and / or stator 220 may reside outside the chamber housing 240 (e.g., outside the chamber walls, and, where appropriate, in an atmospheric environment), while the substrate support 268 may be disposed within the internal volume of the processing chamber. In some embodiments, a portion of the rotor 260 may reside within a well portion of the substrate 218 and / or housing 240.

[0066] In one embodiment, the stator 220 may include various types of actuating components for generating a magnetic field and applying force to the rotor 260. In another embodiment, the stator 220 may include three types of actuating components: axial lifting components (e.g., components 222A-222B), radial moving components (e.g., components 226A-226B), and centering components (e.g., components 230A-230B). In one embodiment, the axial lifting components 222A-222B may provide a vertical force to lift or suspend the rotor 260 and the substrate support 268. In another embodiment, once suspended, the radial moving components 226A-226B may provide a radial force to cause the rotor 260 and the substrate support 268 to rotate. In another embodiment, the centering components 230A-230B may provide a radially inward or outward force to cause the rotor 260 and the substrate support 268 to be centered relative to the base 218. In yet another embodiment, the rotor 260 may also be centered to fit uniformly within a well (e.g., well 246) of the housing.

[0067] In one embodiment, the actuating element of stator 220 may apply magnetic or locating forces to corresponding reactive regions or portions of rotor 260. For example, rotor 260 may include various types of reactive regions that respond to the magnetic field generated by the element, and thus cause the rotor to levitate, translate, rotate, center, or otherwise move. In another embodiment, such regions of the rotor may be designed or fabricated using specific materials (e.g., ferrous materials, such as iron) to engage with the magnetic field generated by the actuating element.

[0068] In one embodiment, the rotor 260 may include two types of reactive regions: an actuator ring 262 and a motor ring (e.g., a motor ring 266). These reactive regions of the rotor can respond to or react to a magnetic field generated by the actuator components. In one embodiment, the actuator ring 262 may be disposed on the lower portion, annular portion, and / or the lowermost portion of the rotor 260, or may be a part of the lower portion, annular portion, and / or the lowermost portion of the rotor. In another embodiment, the motor ring 266 may similarly be annular and disposed on the upper portion and / or annular portion of the rotor 260, or may be a part of the upper portion and / or annular portion of the rotor.

[0069] In one embodiment, actuator ring 262 is responsive to a magnetic field applied by both axial lifting members (e.g., members 222A to 222B) and centering members (e.g., members 230A to 230B). In another embodiment, a single ring (actuator ring 262) is used for axial lifting (e.g., vertical movement) and centering of the substrate support 268. In another embodiment, actuator ring 262 is responsive to a magnetic field generated by axial lifting members 222A to 222B and can therefore be used to provide a vertical force to lift or levitate the rotor. In another embodiment, actuator ring 262 and axial lifting members 222A to 222B are configured such that the substrate support 268 has a vertical movement range of 3 mm, 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, or greater. In one embodiment, the actuator ring can also respond to the magnetic field generated by the centering members 230A to 230B within the vertical range of motion of the substrate support 268, and can therefore be used to provide radially inward or outward forces to cause the rotor 260 to be centered relative to the substrate 218 throughout the entire vertical range of motion. In another embodiment, the actuator ring can also be centered to fit uniformly within a well (e.g., well 246) of the housing.

[0070] In one embodiment, the motor ring 266 may respond to a magnetic field applied by the radial movement members 226A to 226B. In another embodiment, the motor ring 266 may respond to a magnetic field generated by the radial movement members 226A to 226B, and can therefore be used to provide a radial force to cause the rotor to rotate (e.g., once suspended). Specifically, the motor ring 266 may include discrete protrusions or points that engage or interact with the generated magnetic field. In another embodiment, the motor ring 266 includes gears or teeth that enable the substrate support to rotate by adjusting the magnetic field of the radial movement members 226A to 226B.

[0071] Through this pairing (or three pairs, or more groups) of stator 220 and rotor 260, stator 220 can cause rotor 260 to levitate, translate, rotate, center, or otherwise move. In embodiments, to perform this action, axial lifting members 222A to 222B may be positioned perpendicular to the actuator ring 262 in a straight line (e.g., in a straight line in the Y direction) or approximately perpendicular to it. Similarly, centering members 230A to 230B may be positioned at the same height as the actuator ring or approximately at the same height (e.g., in a straight line in the X direction). In some embodiments, rotary moving members 226A to 226B may be positioned at the same height as the motor ring 266 (e.g., in a straight line in the X direction).

[0072] In some embodiments, the axial lifting components (e.g., components 222A to 222B) may be located below and / or on the side of the base 218. In one embodiment, the axial lifting components 22A to 22B may be below the well of the base 218 and below the rotor 260. In another embodiment, the rotary moving components (e.g., components 226A to 226B) may be positioned at the top relative to the other actuating components of the stator 220. In yet another embodiment, the centering components (e.g., components 230A to 230B) may be positioned at a height between the axial lifting components 222A to 222B and the rotary moving components 226A to 226B.

[0073] In embodiments, the stator 220, rotor 260, base 218, and / or base plate support 268 may have a circular body shape. In embodiments, such a circular stator 220 may include any number of such actuating components placed around the outer periphery of the base 218. For example, any number or type of the aforementioned actuating components may be placed along the periphery or outer diameter of the base. In some embodiments, any number and / or type of the mentioned actuating components may be placed along the outer surface or bottom of the base. In embodiments, such components may be placed at any height or distance, or along the outer circumference or bottom. For example, in embodiments, the stator may include any number of actuating components (e.g., 3, 4, or 5, etc.) placed uniformly or non-uniformly around the outer diameter of the stator.

[0074] Similar to components 226A to 226B and 230A to 230B, the stator may include rotation sensors 232A to 232B. In one embodiment, the rotation sensor may correspond to and interact with the encoder ring 264 of the rotor.

[0075] In one embodiment, the encoder ring may be positioned between the motor ring and the actuator ring (e.g., relative to the Y-axis). Rotation sensors 232A to 232B may be magnetic sensors and may detect the encoder ring. Based on the encoder ring detected by the rotation sensors 232A to 232B, the controller 152 may determine the rotational position of the base plate support 268, the rotational speed of the base plate support 268, etc. In one embodiment, the encoder ring may be located at the center or middle portion of the rotor, or a portion thereof. In one embodiment, the encoder ring may include a series of protrusions (as known about encoder rings), which the rotation sensors may sense or interact with to generate data indicating the real-time rotational position of the rotor. This data can be used to generate a closed feedback loop and monitor the real-time rotational position of the rotor (this component will be relevant to...). Figures 6A to 6B (Further description).

[0076] In embodiments, the stator may also include or incorporate an axial sensor for sensing the axial position of the rotor. Figure 2A Not illustrated in the image, and regarding Figures 5A to 5B (Further description). In one embodiment, the axial sensor may interact with or engage with the actuator ring and may sense the distance between the actuator ring and the rotor. In another embodiment, the axial sensor may sense a distance associated with or indicating the rotor's levitation level. Thus, the axial sensor may generate data indicating the real-time vertical displacement (e.g., levitation) of the rotor. The axial sensor-B may be a magnetic sensor and may detect the encoder ring and / or the substrate support 268 and / or other areas or components of the rotor 260. Based on the rotor 260 detected by the axial sensor-B, the controller 152 may determine the vertical position of the substrate support 268. This data may be used to generate a closed feedback loop and monitor the real-time vertical displacement of the rotor.

[0077] Figure 2B Some embodiments according to this disclosure are shown. Figure 1 A top-to-bottom view of an exemplary substrate support device.

[0078] like Figure 2B The parts and features seen and described in the document may correspond to or be similar to those described in the document. Figures 1 to 2A Similar named components were observed and described. Therefore, regarding... Figure 2B The implementation methods discussed can be combined and expanded upon at least regarding Figures 1 to 2A The described implementation method.

[0079] In the implementation, Figure 2B The substrate support device 200B may include working areas 202, 204, and 206. In embodiments, areas 202, 204, and 206 may correspond to actuating components and reactive components (as per relevant information). Figure 2A (Description) and the working area of ​​the support device 200A or 200B. For example, in an embodiment, the axial lifting area 202 may include axial lifting components 222A to 222B of the device that causes rotor lifting and actuator ring 262 (as described above). Figures 5A to 5B (To be further discussed). The radial centering region 204 of the device may include centering components 230A to 230B of the device and actuator ring 262, which causes the rotor to be radially centered, for example, relative to the substrate, well 246, stator, and the entire device. The radial actuation region 206 may include radially moving components 226A to 226B of the device and motor ring 266, which causes the rotor of the substrate support to rotate as about Figures 6A to 6B (Further discussion). In the implementation, such a component may be as described regarding... Figure 2A The described function and execution (and at least in conjunction with and expand upon the implementation methods discussed therein).

[0080] Despite Figure 2B Each region of device 200B, such as regions 202, 204, and 206, is seen along a single plane in this simplified and illustrative top-down view. Figure 2A As seen in the diagram, in applications, this region and its corresponding components can be positioned at any height relative to each other and relative to the stator, rotor, and housing of the substrate support assembly. Furthermore, although each partition is illustrated as having a limited number of components, positioned on one side or part of the circumference of the device, this view is simplified and illustrative. In applications, this region and its components can include any number of components. This region typically extends or traverses the entire circumference of the rotor, stator, housing, and device. In embodiments, as per [reference to...] Figure 2B Each area 202, 204 and 206 that is seen and described may include as many components as needed.

[0081] In some implementations, in Figure 2B The visible portions of the motor ring 266 and actuator ring 262 may correspond to such components or protrusions or discrete points of such components. For example, the rotor 260 may have any circumference and diameter to support the substrate of the substrate manufacturing system 100 (as per relevant information). Figure 1 (See). In some embodiments, rotor 260 may have an inner diameter ranging from 10 inches to 14 inches. In some embodiments, rotor 260 may have an outer diameter ranging from 12 inches to 16 inches. In embodiments, the visible portion or point of motor ring 266 may actually be a point (e.g., a tooth or gear) where the extension of the rotor's motor ring passes through the inner and / or outer diameter of rotor 260. Therefore, as seen, rotor 260 may include any number of discrete points as needed to aid in driving, controlling, and / or maintaining the stability of rotor rotation. This configuration will be relevant to... Figure 3Further description.

[0082] Although Figure 2B Not visible in the top-to-bottom view, rotor 260 may also include an encoder ring and / or an actuator ring, which similarly includes points extending radially from the inner circumference of the rotor. Particularly referring to the encoder ring, which may include different and protruding points as discussed with respect to the rotor. Such elements will be visible, and regarding... Figure 3 Further description. In an embodiment, any of the reactive regions or portions may include any number of protrusions (e.g., teeth, gears, etc.) to aid and enhance the response to forces from the actuating component as needed.

[0083] In an embodiment, device 200B may include axial and rotation sensors ( Figure 2B (not shown in the image), as for... Figure 2A Described.

[0084] like Figure 2B Seen in and as about Figure 2A As discussed, the rotor, stator, substrate, and base plate support components can be concentrically placed or arranged. For example, housing 240 may include inner wall 242 and outer wall 244. Rotor 260 (as per...) Figure 2A A portion of the rotor (described) may rest between the walls of the substrate in well 246. The rotor may be configured to be suspended (e.g., in the direction of entering and leaving the page) and rotate (e.g., clockwise or counterclockwise) relative to the stator and substrate, which may be stationary.

[0085] In one embodiment, the rotor 260 may be part of the substrate support and reside inside the processing chamber, while the stator 220 may reside outside the processing chamber. In another embodiment, the stator 220 and its components may be integrated into the substrate, the processing chamber wall, and / or the housing. In yet another embodiment, the stator 220 may apply a magnetic field or force to the rotor 260, which transmits through the walls of the chamber wall, the housing, and / or the substrate. In yet another embodiment, this magnetic force may control the translation and rotation of the rotor. In yet another embodiment, the movement of the rotor may be correlated with the movement of the substrate supported by the rotor.

[0086] In one implementation, the substrate may define a portion of the internal space or chamber, which is maintained at a pressure different from that outside the internal space. For example, the interior of the substrate of the rotor may be maintained at a vacuum or near-vacuum pressure, while the exterior of the chamber may be unregulated or at atmospheric temperature.

[0087] Figure 3 Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of a portion of an exemplary substrate support device.

[0088] Such as about Figure 3 The parts and features seen and described may correspond to or be similar to those described in relation to... Figures 1 to 2B Similar parts have been seen and described. Therefore, regarding Figure 3 The implementation methods discussed can be combined and expanded upon at least regarding Figures 1 to 2B The described implementation method. For example... Figure 3 As seen in the description, in this embodiment, the substrate support device 300 may include a stator 320, a housing 340 (e.g., a portion of a substrate), and a rotor 360 (which may be part of the substrate support). Such components may correspond to, as per the description of... Figures 1 to 2B The stator, substrate, and rotor (as well as the substrate support) are visible. These components can be combined with and expanded upon at least the embodiments described herein.

[0089] As previously discussed, stator 320 may include an actuating portion and a sensing portion. Stator 320 may include an axial lifting component (which will, regarding...) Figure 4 (Illustrations and discussion), radial movement components (e.g., component 326), and centering components (e.g., component 330). The stator 320 may further include an axial sensor (e.g., sensor 338) and a rotation sensor (e.g., sensor 332).

[0090] The stator 320 can generate various forces and magnetic fields for interacting with the rotor 360. As previously discussed, the rotor 360 can be housed within a well 346 of the housing 340 (e.g., between the outer wall 348 and the inner wall 342). The rotor 360 can be circular in shape and includes reactive regions such as actuator rings 362 and motor rings 366. Figure 3 As seen, the motor ring may include radial protrusions or different portions or points (e.g., point 367, such as teeth or gears). As can be seen, point 367 of the motor ring 366 may include an enlarged portion, the thickness of which varies with the point in the radial direction from the center of the rotor (e.g., as shown in the image). Figure 3 The negative X direction (as seen in the image) extends further and increases. This expansion extends the distance at point 367 of the expandable motor ring, enabling it to interact and engage with the magnetic field established by the radially moving member 326. This expansion allows for an extension of the axial clearance (e.g., increased vertical movement of the rotor and base plate support). This feature will be discussed further below. In embodiments, the full range of vertical movement of the rotor (and therefore the base plate support and the supported base plate) is achieved by magnetic levitation. Thus, in some embodiments, mechanical lifting devices are not used to change the distance between the supported base plate and the heat source disposed on the base plate.

[0091] The rotor 360 may further include an encoder ring 364. For example... Figure 3 As seen in the image, the encoder ring may include radial protrusions or different sections or points (e.g., point 365). Figure 3As seen in the limited and illustrative views, radial protrusions can mean in the negative X direction.

[0092] In embodiments, one or more different portions or points of the encoder ring and / or motor ring may contribute to an integral gear structure or be a ring comprising one or more gears. Therefore, in embodiments, the encoder ring and / or motor ring may be a ring comprising multiple gears.

[0093] like Figure 4 As seen in the previous embodiments, the axial lifting member 422 may include one or more motors (e.g., motors 436A to 436B) for generating a magnetic field. As previously discussed with respect to the previous figures, such motors within the axial lifting member can generate a magnetic field that can interact or engage with a portion of the rotor to provide a levitation force. In this embodiment, such a force can raise the rotor (and any supported substrate) from the bottom of the well 450 (e.g., from a rest position) by a distance D1. In some embodiments, the stator and devices can levitate the actuator ring and rotor (and therefore the substrate support and the supported substrate) at any position from 0 mm to 6 mm (e.g., D1 can be any position from 0 mm to 6 mm). In other embodiments, the actuator ring and rotor (and therefore the substrate support and the supported substrate) have a vertical range of motion up to 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc.

[0094] In one embodiment, the actuation ring 462 (and / or motor ring 466) may be made of a material exhibiting high permeability or magnetizability (e.g., iron or another ferrous material), thereby allowing it to interact effectively with the magnetic field. The actuation ring 462 may be configured such that it surrounds the rotor but does not make physical contact with the stator 420, thus allowing levitation. When the magnetic field is generated by the stator 420, the magnetic field lines may penetrate the housing wall and the actuation ring 462, thereby generating an upward magnetic force that counteracts the gravity acting on the rotor 460.

[0095] refer to Figures 3 to 4 In some embodiments, the housing or base of the substrate support device may be used to delineate the interior of the processing chamber from the outside of the processing chamber. For example, in some embodiments, the rotor and its substrate support portion may be inside the processing chamber, while the stator and stator components may be located outside the processing chamber. For example, in embodiments, actuation components and sensors associated with the stator (e.g., radial movement component 326, centering component 330, radial sensor 332, axial sensor 338, axial lifting component, etc.) may be disposed on the outer surface of the processing chamber. Similarly, in embodiments, reactive regions associated with the rotor (e.g., motor ring 366, encoder ring 364, and / or actuation ring 362, etc.) may be disposed within the corresponding internal volume of the processing chamber.

[0096] In implementations, the axial lifting and / or radial moving components of the mechanism may be or include any component capable of generating a magnetic field. In some cases, such components may be motors. In some cases, they may be switched reluctance motors (SR motors or SRMs). In some cases, they may be any other type of motor capable of generating a magnetic field, such as permanent magnet synchronous motors (PMSMs), brushless DC motors (BLDCs), induction motors, reluctance synchronous motors, etc. This interaction allows the stator to generate one or more magnetic fields, and the rotor to levitate and / or rotate with minimal friction.

[0097] In some embodiments, the axial sensor (e.g., sensor 338) may be or include any component capable of measuring the distance the rotor is lifted. Therefore, in some cases, such a component may be or include a Hall effect sensor. In other cases, the component may be or include an optical sensor (e.g., a laser sensor, an IR sensor, etc.), an ultrasonic sensor, a camera or image sensor, a capacitive sensor, etc. In some embodiments, sensor 338 may be embedded in or extend through the bottom of the well 350. In some embodiments, the sensor may rest on the outer wall of the bottom of the well (and not enter or penetrate the outer wall).

[0098] In an embodiment, the radially moving component (e.g., component 326) and the centering component (e.g., component 330) may include operating zones based on the specific permissible axial clearance of the actuating component (e.g., axial clearance 327 for component 326; axial clearance 331 for component 330). In an embodiment, the axial clearance may be a vertical distance that can be used to define the vertical distance at which a reactive region or component should be maintained if it will be affected by the corresponding actuating component. The effectiveness of a component may be reduced or lost if the reactive component of the rotor moves axially to exceed or fail to reach its operating zone (e.g., through weak or over-delivered suspension). In other words, if a reactive component is to be affected by the generated magnetic field, it should be vertically positioned within the corresponding distance of the axial clearance and the operating zone of the corresponding actuating component. Therefore, in an embodiment, this axial clearance of the actuating component can be used to characterize the amount of axial movement or change in rotor height at which the system can still function.

[0099] In a specific instance focusing on the centering component 330, the axial clearance 331 can be used to define the operating band of component 330. In an implementation, if the actuator ring 362 rises or falls outside the permissible axial clearance 331 or operating band of component 330, that part of the system may fail, become unstable, or otherwise become ineffective. Similarly, with respect to the axial clearance 327, when the rotor is suspended, the radial moving component 326 and the motor ring 366 can function or function more effectively when the motor ring can be vertically aligned or fall within the operating band of the radial moving component 326.

[0100] A separate way to construct the concept of axial clearance is that axial clearance can indicate the area, distance, or space in which the magnetic field or force generated by the corresponding actuating component of the stator can exert an effective force on the corresponding reactive region of the rotor.

[0101] Therefore, considering the enhanced capability for vertical motion provided by robust axial clearance values ​​and robust operating areas, it may be beneficial to have increased axial clearance for each actuating component, leading to a more robust and precise system. Increasing the thickness of protruding regions or points (e.g., such as point 367) facing the corresponding actuating component can also help increase the possible axial movement of the rotor, as the possible axial movement can be greater, and the increased protruding regions or points may still be within the operating band or distance of the axial clearance associated with the actuating component. Thus, increased protruding portions or points in the rotor's reactive region (as seen in point 367) can also enhance the system's capabilities by allowing additional axial movement of the rotor. Therefore, by increasing the space, volume, and / or intensity of the reactive region, the opportunity to interact with the generated magnetic field can be increased without changing the parameters or type of the actuating component.

[0102] In this embodiment, a larger working band allows for additional versatility in the vertical movement of the rotor. For example, the rotor can be raised and lowered to greater distance variations (e.g., D1) while still maintaining rotational and centering capabilities. This additional versatility will have a direct impact on any supported substrate and the distance from such substrate to the heat source within the chamber where device 300 is located. In this case, increased controllability may be advantageous because it allows for increased precision and controllability regarding the heating process and the heat delivered to the substrate. Additionally, in this embodiment, the increased vertical movement range of the substrate support via magnetic levitation makes it possible to omit the mechanical lifting mechanism used for mechanically lifting the substrate support.

[0103] In one embodiment, the axial clearance 327 and working belt of component 326 can span a vertical distance of 2 to 10 mm, and still rest adjacent to the radially moving component. In another embodiment, the working belt can rest adjacent to the radially moving component inside the housing (while the radially moving component is outside the housing). In another embodiment, the axial clearance 331 and working belt of component 330 can span a vertical distance of 2 to 10 mm. In another embodiment, the belt can rest adjacent to the central component inside the housing (while the central component is outside the housing).

[0104] In embodiments, any of the radial protrusions or points (e.g., points 367, 365, and / or portions of ring 362) may be or include discrete (or in some cases, continuous) radially extending operating or actuating points. For example, in an embodiment, motor ring 366 includes 24 discrete radially extending portions or points identical to point 367. Such additional points may be evenly spaced at the same height around the outer circumference of the motor ring.

[0105] In embodiments, any of the discrete points (or continuous regions) of the actuator ring, encoder ring, and / or motor ring may protrude radially from the inner diameter of the rotor by between 2 and 3 inches. In embodiments, any of the discrete points of the actuator ring, encoder ring, and / or motor ring may include any number of radially extending points or portions. In embodiments of a “continuous” ring or structure, the space between the discrete operating points or actuated portions of the motor ring 466B may be filled with an ineffective material (e.g., a nonferrous material) so that the ring may appear continuous but is not responsive to a magnetic field. For example, in embodiments, the motor ring 366 may be a continuous ring. For example, the space between the different points 367 as described above may be filled with a different material that is not responsive to a magnetic field. In embodiments, any of the actuator ring, encoder ring, and / or motor ring may include any number of discrete points or a continuous ring made of different materials. In embodiments, any of the actuator ring, encoder ring, and / or motor ring may be a continuous ring made of a uniform or invariant material.

[0106] In one embodiment, the housing 340 may include an outer wall 348, an inner wall 342, and a well 346 and a well bottom 350 formed between the two walls. As previously mentioned, in one embodiment, a portion of the rotor 360 may reside within the well 346.

[0107] In one embodiment, the inner and outer walls can be located anywhere between 1 mm and 3 mm (inclusive) in the X dimension (e.g., thickness). In another embodiment, the inner and outer walls can be greater than 3 mm in the X dimension.

[0108] In one embodiment, an air gap may exist between the actuator ring and the bottom and side walls of the well. In another embodiment, the air gap between the actuator ring and either the bottom or side walls of the well may be between 0.5 mm and 1.0 mm.

[0109] Figure 4 Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of a portion of an exemplary substrate support device. Figure 3 and Figure 4 The illustration shows cross-sectional side views of different regions of the same substrate support device in the embodiment.

[0110] Such as about Figure 3 The parts and features seen and described may correspond to or be similar to those described in relation to... Figures 1 to 2B And specifically regarding Figure 3 Similar parts have been seen and described. Therefore, regarding Figure 4 The implementation methods discussed can be combined and expanded upon at least regarding Figures 1 to 3 The described implementation method. For example... Figure 4 As seen in the description, in this embodiment, the substrate support device 400 may include a stator 420, a housing 440, and a rotor 460 (which may be part of the substrate support member). Such components may correspond to, as per the description of... Figures 1 to 3 The stator, substrate, and rotor (as well as the substrate support) are visible. These components can be combined with and expanded upon at least the embodiments described herein.

[0111] As previously discussed, stator 420 may include an actuating portion and a sensing portion. Stator 420 may include an axial lifting component (e.g., component 422), a radial moving component (e.g., component 426), and a centering component (not specified). Figure 4 (See illustration). The stator 420 may further include an axial sensor (e.g., sensor 438) and a rotation sensor (e.g., sensor 432).

[0112] The stator can generate various forces and magnetic fields for interacting with the rotor 460. As previously discussed, the rotor 460 can be housed within a well 446 of the housing 440 (e.g., between the outer wall 448 and the inner wall 442). The rotor 460 can be circular in shape and includes reactive regions such as actuator rings 462 and motor rings 466. Figure 4 As seen, the motor ring may include radial protrusions or different portions or points (e.g., point 467, such as teeth or gears). As can be seen, point 467 of the motor ring 466 may include an enlarged portion, the thickness of which varies with the point in the radial direction from the center of the rotor (e.g., as shown). Figure 4 The negative X direction (as seen in the image) extends further and increases. For example, regarding... Figure 3As discussed, this enlarged, expandable motor ring at point 467 allows for interaction and engagement with the magnetic field established by the radially moving member 426. This enlargement allows for an extension of the axial clearance (e.g., increased vertical movement of the rotor and base plate support). This feature will be discussed further below. In embodiments, the full range of vertical movement of the rotor (and therefore the base plate support and the supported base plate) is achieved via magnetic levitation. Thus, in some embodiments, mechanical lifting devices are not used to change the distance between the supported base plate and the heat source disposed on the base plate.

[0113] Rotor 460 may further include encoder ring 464. (See also: Regarding...) Figure 3 Similarly, the encoder ring may include radial protrusions or different sections or points (e.g., point 465). Figure 4 As seen in the limited and illustrative views, radial protrusions can mean in the negative X direction.

[0114] In embodiments, one or more different portions or points of the encoder ring and / or motor ring may contribute to an integral gear structure or be a ring comprising one or more gears. Therefore, in embodiments, the encoder ring and / or motor ring may be a ring comprising multiple gears.

[0115] like Figure 4 As seen in the embodiments, the axial lifting member 422 may include one or more motors (e.g., motors 436A to 436B) for generating a magnetic field. Such motors within the axial lifting member 422 can generate a magnetic field that can interact or engage with a portion of the rotor to provide a levitation force. In embodiments, this force can raise the rotor (and any supported substrate) from the bottom of the well 450 (e.g., from a rest position) by a distance D1. In some embodiments, the stator and devices can levitate the actuator ring and rotor (and therefore the substrate support and the supported substrate) at any position from 0 mm to 6 mm (e.g., D1 can be any position from 0 mm to 6 mm). In other embodiments, the actuator ring and rotor (and therefore the substrate support and the supported substrate) have a vertical movement range of up to 4 mm, 5 mm, 6 mm, 7 mm, 8 mm, 9 mm, 10 mm, etc.

[0116] In one embodiment, the actuation ring 462 (and / or motor ring 466) may be made of a material exhibiting high permeability or magnetizability (e.g., iron or another ferrous material), thereby allowing it to interact effectively with a magnetic field. The actuation ring 462 may be configured such that it surrounds the rotor but does not make physical contact with the stator 420, thus allowing levitation. When field 439 is generated by the stator 420, magnetic field lines may penetrate the housing wall and the actuation ring 462, thereby generating an upward magnetic force that counteracts the gravitational force acting on the rotor 460.

[0117] Such as about Figure 3 In this embodiment, the axial lifting and / or radial moving components of the mechanism may be or include any component capable of generating a magnetic field. In some cases, such components may be motors. In some cases, they may be switched reluctance motors (SR motors or SRMs). In some cases, they may be any other type of motor capable of generating a magnetic field, such as permanent magnet synchronous motors (PMSMs), brushless DC motors (BLDCs), induction motors, reluctance synchronous motors, etc. This interaction allows the stator to generate one or more magnetic fields, and the rotor to levitate and / or rotate with minimal friction.

[0118] In some embodiments, the axial sensor (e.g., sensor 438) may be or include any component capable of measuring the distance the rotor is lifted. Therefore, in some cases, such a component may be or include a Hall effect sensor. In other cases, the component may be or include an optical sensor (e.g., a laser sensor, an IR sensor, etc.), an ultrasonic sensor, a camera or image sensor, a capacitive sensor, etc. In some embodiments, sensor 438 may be embedded in or extend through the bottom of the well 450. In some embodiments, the sensor may rest on the outer wall of the bottom of the well (and not enter or penetrate the outer wall).

[0119] Such as about Figure 3 As discussed, in the implementation, the radially moving component (e.g., component 426) and the centering component ( Figure 3 Seen in; not about Figure 4 (Illustrated) may include a working zone based on a specific permissible axial clearance for the actuating component (e.g., axial clearance 427 for component 426; axial clearance 431 for the centering component). In embodiments, the axial clearance may be a vertical distance that can be used to define the working zone or vertical distance of effectiveness for a corresponding actuating component. This working zone, derived from the permissible axial clearance, can be used to define a vertical distance that a reactive region or component should maintain if it will be affected by the corresponding actuating component. The effectiveness of a component may be reduced or lost if the reactive component of the rotor moves axially to exceed or fail to reach the component's working zone (e.g., through weak or over-delivered suspension). In other words, if a reactive component is to be affected by the generated magnetic field, the reactive component should be vertically located within the corresponding distance of the axial clearance and the working zone of the corresponding actuating component. Therefore, in embodiments, this axial clearance can be used to characterize the amount of axial movement or change in rotor height at which the system can still function.

[0120] Focusing on the centered component (not about) Figure 4In a specific example (shown), axial clearance 431 can be used to define the working band of the component. In an implementation, if the actuator ring 462 rises or falls outside the permissible axial clearance or working band of the component, that part of the system may fail, become unstable, or otherwise become ineffective. Similarly, with respect to axial clearance 427, when the rotor is suspended, the radial moving component 426 and the motor ring 466 can function or function more effectively when the motor ring can be vertically aligned or fall within the working band of the radial moving component 426.

[0121] A separate way to construct the concept of axial clearance is that axial clearance can indicate the area, distance, or space in which the magnetic field or force generated by the corresponding actuating component of the stator can exert an effective force on the corresponding reactive region of the rotor.

[0122] As previously discussed, given the enhanced capability for vertical motion provided by robust axial clearance values ​​and robust operating areas, it may be beneficial to have increased axial clearance for each actuating component, leading to a more robust and precise system. Increasing the thickness of protruding regions or points (e.g., such as point 467) facing the corresponding actuating component can also help increase the possible axial movement of the rotor, as the possible axial movement can be greater, and the increased protruding regions or points may still be within the operating band or distance of the axial clearance associated with the actuating component. Therefore, increased protruding portions or points in the rotor's reactive region (as seen in point 467) can also enhance the system's capabilities by allowing additional axial movement of the rotor. Thus, by increasing the space, volume, and / or intensity of the reactive region, the opportunity to interact with the generated magnetic field can be increased without changing the parameters or type of the actuating component.

[0123] In this embodiment, a larger working band allows for additional versatility in the vertical movement of the rotor. For example, the rotor can be raised and lowered to greater distance variations (e.g., D1) while still maintaining rotational and centering capabilities. This additional versatility will have a direct impact on any supported substrate and the distance from such substrate to the heat source within the chamber where device 400 is located. In this case, increased controllability can be advantageous because it allows for increased precision and controllability regarding the heating process and the heat delivered to the substrate. Additionally, in this embodiment, the increased vertical movement range of the substrate support via magnetic levitation makes it possible to omit the mechanical lifting mechanism used for mechanically lifting the substrate support.

[0124] In one embodiment, the axial clearance 427 and working belt of component 426 can span a vertical distance of 2 to 10 mm, and still rest adjacent to the radially moving component. In another embodiment, the working belt can rest adjacent to the radially moving component inside the housing (while the radially moving component is outside the housing). In another embodiment, the axial clearance 431 and working belt of the centering component can span a vertical distance of 2 to 10 mm. In another embodiment, the belt can rest adjacent to the centering component inside the housing (while the centering component is outside the housing).

[0125] In embodiments, any of the radial protrusions or points (e.g., points 467, 465, and / or portions of ring 462) may be or include discrete (or in some cases, continuous) radially extending operating or actuating points. For example, in an embodiment, motor ring 466 includes 24 discrete radially extending portions or points identical to point 467. Such additional points may be evenly spaced at the same height around the outer circumference of the motor ring.

[0126] In embodiments, any of the discrete points (or continuous regions) of the actuator ring, encoder ring, and / or motor ring may protrude radially from the inner diameter of the rotor by between 2 and 3 inches. In embodiments, any of the discrete points of the actuator ring, encoder ring, and / or motor ring may include any number of radially extending points or portions. In embodiments of a “continuous” ring or structure, the space between the discrete operating points or actuated portions of the motor ring 466B may be filled with inactive material, such that the ring may appear continuous but is not responsive to the magnetic field. For example, in embodiments, the motor ring 466 may be a continuous ring. For example, the space between the different points 467 as described above may be filled with a different material that is not responsive to the magnetic field. In embodiments, any of the actuator ring, encoder ring, and / or motor ring may be any number of discrete points or a continuous ring made of different materials. In embodiments, any of the actuator ring, encoder ring, and / or motor ring may include a continuous ring made of a uniform or invariant material.

[0127] In one embodiment, the housing 440 may include an outer wall 448, an inner wall 442, and a well 446 and a well bottom 450 formed between the two walls. As previously mentioned, in one embodiment, a portion of the rotor 460 may reside within the well 446.

[0128] In one embodiment, the inner and outer walls can be located anywhere between 1 mm and 3 mm (inclusive) in the X dimension (e.g., thickness). In another embodiment, the inner and outer walls can be greater than 3 mm in the X dimension.

[0129] In one embodiment, an air gap may exist between the actuator ring and the bottom and side walls of the well. In another embodiment, the air gap between the actuator ring and either the bottom or side walls of the well may be between 0.5 mm and 1.0 mm.

[0130] For example, regarding Figures 5A to 6B Further discussion reveals that the axial lifting component generates a magnetic field to interact with and lift the rotor through the rotor's actuator ring. The radial moving component generates a magnetic field to interact with and rotate the rotor through the rotor's motor ring. All such movements can be programmed and controlled by a controller (as discussed in...). Figure 1 (See and describe).

[0131] In the context of Figures 5A to 6B In a further described embodiment, the axial sensor 438 may interact with the actuator ring 462 to generate data reflecting the distance D1 or axial position of the actuator ring and rotor. Similarly, the radial sensor 432 may interact with the encoder ring 464 and / or point 465 to generate data reflecting the movement, speed, or rotational position of the encoder ring and rotor. All such data and measurements can be transmitted through the system and devices (as per [reference to...]). Figure 1 The controller (described) receives and thus forms feedback or a closed loop. The controller can make any adjustments or updates to the lifting and rotation of the rotor based on this feedback from radial or axial sensors.

[0132] Figures 5A to 5B A view and embodiment of an exemplary axial suspension mechanism of an exemplary substrate support device according to some embodiments of the present disclosure are shown in FIG2.

[0133] Figures 5A to 5B The components may correspond to or be similar to those shown in Figure 2 to 1. Figure 4 Similar components seen and described in C. Therefore, regarding... Figures 5A to 5B The components and implementation methods discussed can be combined with and expanded upon similar components and implementation methods discussed in Figure 2.

[0134] although Figures 5A to 5B Cross-sectional views of components (e.g., sensors, motors, etc.) of the stator, housing, and rotor are shown, as follows: Figures 5A to 5B Many and any number of such components and examples of the configuration seen in the diagram may be included along the circumference of the stator, housing and rotor, and the entire substrate support assembly.

[0135] Figure 5A Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of an exemplary axial suspension mechanism of an exemplary substrate support device.

[0136] Such as about Figure 5AThe parts and features seen and described may correspond to or be similar to those described in relation to... Figures 1 to 3 Similar parts have been seen and described. Therefore, regarding Figure 5A The implementation methods discussed can be combined and expanded upon at least regarding Figure 3 The described implementation method.

[0137] In one embodiment, the rotor 560A may be housed within a well 546A formed by the housing 540A. In another embodiment, when the system is not actively engaged (e.g., the motors 530A and 532A of the axial lifting components 522A are off), levitation may not occur, and the rotor and actuation ring 562A may be in their lowest vertical position. In yet another embodiment, the actuation ring 562A may physically contact the bottom surface of the well 546A.

[0138] Figure 5B Some embodiments according to this disclosure are shown. Figure 1 A cross-sectional view of an exemplary axial suspension mechanism of an exemplary substrate support device of B.

[0139] Such as about Figure 5B The parts and features seen and described may correspond to or be similar to those described in relation to... Figures 1 to 5A Similar parts have been seen and described. Therefore, regarding Figure 5B The implementation methods discussed can be combined and expanded upon at least regarding Figures 1 to 5A The described implementation method.

[0140] In one embodiment, rotor 560B may be placed within well 546B formed by housing 540. As previously mentioned, levitation may not occur when the system is not actively engaged, and rotor and actuation ring 562B may be in a minimum vertical position or a stationary position. In one embodiment, actuation ring 562B may physically contact the bottom surface of well 546B.

[0141] In the implementation, when motors 530B and 532B are engageable (e.g.) Figure 5B As seen in the diagram, this type of motor in the axial lifting member 522B can provide a magnetic field 534B. In an embodiment, once the motors 530B and 532B are engaged, the field can cause the actuator ring 562B to be vertically aligned with the flux field. In this way, the axial lifting member 522B can levitate the actuator ring 562B and the rotor 560B (as well as the substrate support surface and any supported substrate).

[0142] In the implementation, motors 530B and 532B can provide magnetic force to make the rotor magnetically levitate, as shown in the following... Figure 5BIllustration. In this embodiment, motors 530B and 532B may be switched reluctance motors (SR motors or SRMs), specifically designed for magnetic levitation purposes. In this embodiment, SR motors 530B and 532B may be embedded within stator 520B. In this embodiment, levitation may be achieved through the interaction between excitation motors 530B and 532B and actuation ring 562B to raise rotor 560B.

[0143] In this implementation, the stator and SR motor components may be equipped with a series of electromagnets. These electromagnets can be positioned to generate a controlled magnetic field. For example, when current passes through such electromagnets, a field 534B can be generated. By controlling the current, the intensity and spatial orientation of the field generated by the motor can be modulated and controlled. (Regarding the control system...) Figure 1 (As described in Figure 2) can be used to manage current, thus modulating or changing the characteristics of field 534B.

[0144] In one embodiment, the actuation ring 562B may be made of a material exhibiting high permeability or magnetizability, thereby allowing it to interact effectively with a magnetic field. The actuation ring 562B may be configured such that it surrounds the rotor but does not make physical contact with the stator 520B, thus allowing levitation. When the field 534B is generated by the stator 520B, magnetic field lines can penetrate the actuation ring 562B, thereby generating an upward magnetic force that counteracts the gravitational force acting on the rotor 560B.

[0145] In this implementation, the axial sensor 524B is used to measure and adjust the suspension height D1, as well as to regulate the motor. The axial sensor 524B (which can be integrated into the system) provides real-time feedback on the rotor's suspension position. This feedback can then be used to adjust the current in the electromagnets of the SR motors 530B and 532B, thus continuously controlling the field 534B. By fine-tuning the magnetic field in response to the rotor's movement, the system can maintain a constant suspension height and stabilize the rotor during operation.

[0146] In an embodiment, the axial sensor 524B may be or include any axial sensor (i.e., a sensor) capable of sensing the movement and / or position of the actuator ring. For example, the axial sensor 524 may be a Hall effect sensor.

[0147] In one embodiment, the system can suspend the actuator ring and rotor by a distance D1. In another embodiment, the system can suspend the actuator ring and rotor at any position from 0 mm to 6 mm.

[0148] In one embodiment, an air gap may exist between the actuator ring and the bottom and side walls of the well. In another embodiment, the air gap between the actuator ring and either the bottom or side walls of the well may be between 0.5 mm and 1.0 mm.

[0149] Figures 6A to 6B A partial top-to-bottom view of an exemplary substrate support device according to some embodiments of the present disclosure is shown in FIG2.

[0150] Figures 6A to 6B The components may correspond to or be similar to those shown in Figure 2 to 1. Figure 5B Similar components seen and described in [the text]. Therefore, regarding... Figures 6A to 6B The components and implementation methods discussed can be combined and expanded with respect to Figures 2 to 3. Figure 5B The discussion covers similar components and implementation methods.

[0151] Figure 6A A partial view of an exemplary radial positioning mechanism of an exemplary substrate support device according to some embodiments of the present disclosure is shown in FIG2.

[0152] Such as about Figure 6A The parts and features seen and described may correspond to or be similar to those described in relation to... Figures 1 to 5B Similar parts have been seen and described. Therefore, regarding Figure 6A The implementation methods discussed can be combined and expanded upon at least regarding Figures 1 to 5B The described implementation method.

[0153] As you can see, Figure 6A An illustrative top-to-bottom view of the upper left portion of a substrate support device 600A including a rotor 660, a stator 620, and a housing 640 is shown. Figure 6A The view seen in the image can be considered a top-down view, corresponding to approximately 9:00 on the analog clock and 12:00 on the analog clock. (This is in contrast to the view about...) Figure 2B The way it is seen is similar to the way it is seen. Figure 6A The views shown are highly simplified and are embodiments of the components illustrated for illustrative purposes.

[0154] like Figure 6A As seen in the figure, the rotor 660 may include a motor ring 666, which includes different points 667A to 667B, as previously shown in the figure. Figures 1 to 5B The description and observation (and in conjunction with and expand upon the embodiments described herein) show that the motor ring 666 and rotor 660 can be seen within a well 646A of a housing 640 including an outer wall 648 and an inner wall 642. In one embodiment, radially moving parts 626A to 626B of the stator 620 can be positioned on an outer portion of the stator 620.

[0155] Such as about Figure 5B As seen and described in the motor, the radially moving parts 626A to 626B can similarly generate a magnetic field and apply an attractive (or repulsive) force at points 667A to 667B of the motor ring of the rotor 660. When the rotor is suspended (as per [reference to...]), Figure 5B(As described), the stator can thus cause the rotor to rotate. For example, in a simplified embodiment that causes the rotor to rotate clockwise, radial moving member 626A can first be switched to generate a field and apply an attractive force at point 667A. Once the rotor has rotated so that point 667A aligns with radial moving member 626A, the member can be switched so that no field is generated and no rotational force is applied. In series, radial moving member 626B can be switched to generate a field and apply an attractive force at point 6667A. This can then cause the rotor to rotate so that point 667A aligns with radial moving member 656B. The above description is illustrative. This pattern and process can continue for many radial moving members and corresponding different points within the motor ring and rotor. In this way, the electrical current passing through the components of the stator can be controlled to generate a magnetic flux field, which can then be used to rotate the rotor. Figure 6A The rotor is 660.

[0156] Although a method for use has been described Figure 6A The strategy for rotating the motor of the component. Note that this example is non-limiting, and any such control strategy can be applied to the component where feasible.

[0157] Figure 6B A partial view of an exemplary radial positioning sensing mechanism of the substrate support device of FIG2 according to some embodiments of the present disclosure is shown.

[0158] Such as about Figure 6B The parts and features seen and described may correspond to or be similar to those described in relation to... Figures 1 to 6A Similar parts have been seen and described. Therefore, regarding Figure 6B The implementation methods discussed can be combined and expanded upon at least regarding Figures 1 to 6A The described implementation method.

[0159] As you can see, Figure 6B An illustrative top-to-bottom view of the upper left portion of a substrate support device 600B including a rotor 660, a stator 620, and a housing 640 is shown. Figure 6B The view seen in the image can be considered as a top-down view, corresponding to approximately 9:00 on the analog clock and 12:00 on the analog clock. Figure 6B The views shown are highly simplified and are embodiments of the components illustrated for illustrative purposes.

[0160] like Figure 6B As seen in the image, the rotor 660 includes an encoder ring 664 with different points 665A to 665B. The rotor 660 and the encoder ring can be seen within a well 646 of a housing 640, which includes an outer wall 648 and an inner wall 642. In one embodiment, the stator rotation sensors 630A to 630B can be positioned on the outer portion of the outer wall.

[0161] Such as about Figure 5B The axial sensors, as seen and described, allow the rotary sensors 630A to 630B to similarly sense the passage of points on the encoder ring (e.g., points 665A to 665B). Therefore, as the rotor rotates, the encoder ring and rotary sensors, in combination, can be used to generate data indicating the rotor's speed and / or rotational position relative to the stator. This allows for the establishment of a feedback loop and the measurement of rotational data, such as the rotor's movement, position, and speed during rotation. This data can be processed by the controller to more accurately determine the rotor's real-time position and make adjustments.

[0162] Figure 7 This is an operation according to one embodiment of the present disclosure. Figure 1 A flowchart of an exemplary method for a substrate support device.

[0163] Method 700 can be executed by processing logic, which may include hardware (circuit systems, dedicated logic, etc.), software (e.g., instructions running on a processing device), or a combination thereof. In one embodiment, some or all of the operations of method 700 can be performed by... Figure 1 The system 100 is executed by one or more components.

[0164] At block 710, the processing logic can generate a first magnetic field. In some embodiments, the processing logic can generate the first magnetic field through the stator of the substrate support device's base to cause a first magnetic interaction with a first iron ring of the rotor of the substrate support member attached to the substrate support device, wherein the first magnetic interaction controls the vertical position of the substrate support member.

[0165] At frame 720, the processing logic can selectively suspend the substrate support. In some embodiments, the processing logic can use a first magnetic field to selectively suspend the substrate support above the rest position at any vertical distance ranging from 0 mm to 6 mm.

[0166] At block 730, the processing logic can generate a second magnetic field. In some embodiments, the processing logic can generate a second magnetic field via the stator to result in a second magnetic interaction with the first iron ring of the rotor, wherein the second magnetic interaction centers the substrate support on the substrate.

[0167] At box 740, the processing logic can center the rotor. In some embodiments, the processing logic can center the substrate support relative to the substrate within a vertical range through a second magnetic interaction.

[0168] At block 750, the processing logic can generate a third magnetic field. In some embodiments, the processing logic can generate a third magnetic field via the stator to cause a third magnetic interaction with a second iron ring of a rotor attached to a substrate support, wherein the third magnetic interaction rotates the substrate support.

[0169] At frame 760, the processing logic rotatable substrate support is located. In some embodiments, the processing logic can rotate the support via a third magnetic interaction within a vertical distance.

[0170] Throughout this specification, references to "one embodiment" or "an embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of this disclosure. Therefore, the phrase "in one embodiment" or "in an embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any suitable manner in one or more embodiments.

[0171] In the foregoing description, detailed description has been given with reference to specific exemplary embodiments. However, it will be apparent that various modifications and alterations can be made thereto without departing from the broader spirit and scope of this disclosure as set forth in the appended claims. The description and drawings are therefore to be regarded as illustrative rather than restrictive. Furthermore, the foregoing use of the terms "implementation," "implementation," and / or other illustrative language do not necessarily refer to the same implementation or the same instance, but may refer to different and dissimilar implementations, as well as potentially similar implementations.

[0172] The terms “example” or “illustrative” are used herein to mean as an example, instance, or illustration. Any aspect or design described herein as “example” or “illustrative” is not to be construed as superior or advantageous over other aspects or designs. Rather, the use of the terms “example” or “illustrative” is intended to provide a concept in a specific manner. As used in this application, the term “or” is intended to mean an inclusive “or” rather than an exclusive “or.” That is, unless otherwise stated or clear from the context, “X includes A or B” is intended to mean any naturally inclusive arrangement. That is, “X includes A or B” is satisfied in any of the foregoing cases if X includes A; X includes B; or X includes both A and B. Furthermore, the articles “a” and “an” as used in this application and the appended claims should generally be construed as meaning “one or more” unless otherwise stated or clear from the context involving the singular form. Furthermore, the use of the terms "one embodiment" or "one implementation" throughout the text is not intended to imply the same implementation or implementation method unless so described. Additionally, as used herein, the terms "first," "second," "third," "fourth," etc., are designations for distinguishing different elements and do not necessarily have ordinal meaning based on their numerical designation.

[0173] A digital computer program (also referred to or described as a program, software, software application, module, software module, script, or code) can be written in any form of programming language, including compiled or interpreted languages ​​or declarative or procedural languages; and it can be deployed in any form, including as a standalone program or as a module, component, subroutine, or other unit suitable for use in a digital computing environment. The basic elements of a digital computer include a central processing unit (CPU) for making or executing instructions and one or more memory devices for storing instructions and digital data. The CPU and memory may be supplemented by or incorporated into a dedicated logic circuit system or quantum simulator. Typically, a digital computer will also include one or more mass storage devices (e.g., magnetic disks, magneto-optical disks, optical disks, or systems suitable for storing information) for storing digital data, or operatively coupled to receive digital data from or transfer digital data to such mass storage devices or both. However, a digital computer does not necessarily need to have such devices.

[0174] Digital computer readable media suitable for storing digital computer program instructions and digital data include all forms of non-volatile digital memory, media and memory devices, including, by way of example, semiconductor memory devices, such as EPROM, EEPROM and flash memory devices; disks, such as internal hard disks or removable disks; magneto-optical disks; CD ROMs and DVD-ROMs.

[0175] Control of the various systems or portions thereof described in this specification can be implemented in a digital computer program product including instructions stored on one or more non-transitory machine-readable storage media and executable on one or more digital processing devices. The systems or portions thereof described in this specification can each be implemented as an apparatus, method, or system, which may include one or more digital processing devices and memory for storing executable instructions to perform the operations described in this specification.

[0176] Although this specification contains numerous details of specific embodiments, these should not be construed as limiting the scope of the claims, but rather as descriptions of features specific to particular embodiments. Certain features described herein in the context of separate embodiments may also be implemented in combination in a single embodiment. Conversely, individual features described in the context of a single embodiment may also be implemented separately in multiple embodiments or in any suitable sub-combination. Furthermore, although features may be described above as functioning in certain combinations and even initially claimed in this way, in some cases, one or more features from the claimed combination may be removed from that combination, and the claimed combination may be for sub-combinations or variations thereof.

[0177] Similarly, although the operations are depicted in a specific order in the accompanying drawings, this should not be construed as requiring such operations to be performed in the specific or sequential order shown, or to perform all the operations shown, in order to achieve the desired result. In some cases, multitasking and parallel processing may be advantageous. Furthermore, the separation of the various system modules and components in the embodiments described above should not be construed as requiring such separation in all embodiments, and it should be understood that the described program components and systems can generally be integrated together in a single software product or packaged into multiple software products.

[0178] Specific implementations of the objective have been described. Other implementations are within the scope of the above claims. For example, the actions described in the claims can be performed in different orders and still achieve the desired result. As an example, the process depicted in the drawings does not necessarily depend on the specific or sequential order shown to achieve the desired result. In some cases, multitasking and parallel processing may be advantageous.

Claims

1. A substrate support device, the substrate support device comprising: A substrate, the substrate being fixed to a processing chamber, the substrate comprising a stator configured to generate a first magnetic field, a second magnetic field, and a third magnetic field; and A substrate support member, positioned on and configured to support the substrate, the substrate support member including a rotor, the rotor comprising: a first reactive zone configured to interact with the first magnetic field to magnetically control a vertical position of the substrate support and to interact with the second magnetic field to magnetically center the substrate support to the base; as well as A second reactive region is configured to interact with the third magnetic field to magnetically rotate the substrate support. The first magnetic field and the first reactive region are configured to selectively suspend the substrate support above a stationary position at any distance ranging from 0 mm to 6 mm.

2. The substrate support device of claim 1, wherein the first reactive region and the second reactive region of the rotor are configured to effectively interact with the second magnetic field and the third magnetic field of the stator at any vertical position ranging from 0 mm to 6 mm above the rest position of the substrate support.

3. The substrate support device of claim 1, wherein the stator includes a first actuation member for generating the first magnetic field, a second actuation member for generating the second magnetic field, and a third actuation member for generating the third magnetic field, wherein at least one of the second actuation member or the third actuation member allows an axial clearance distance between 2 mm and 10 mm.

4. The substrate support device of claim 3, wherein the third actuating member has a first height, and wherein the second reactive region has a second height greater than the first height.

5. The substrate support device of claim 3, wherein the second actuating member has a first height, and wherein the first reactive region has a second height less than the first height.

6. The substrate support device of claim 1, wherein the first reactive region includes a first iron ring and the second reactive region includes a second iron ring, the second iron ring including a plurality of gears.

7. The substrate support apparatus of claim 1, wherein the processing chamber is a rapid thermal processing (RTP) chamber configured to apply a thermal process to the substrate by means of thermal energy.

8. The substrate support device of claim 1, wherein the substrate support is disposed within a cavity, and wherein the stator includes a magnetic rotation sensor disposed outside the cavity, the magnetic rotation sensor being configured to interact with an encoder ring of the stator through the wall of the cavity to generate data indicating the rotational position of the rotor.

9. The substrate support device of claim 1, wherein the substrate support is disposed within a cavity, and wherein the stator includes a magnetic axial sensor configured to interact with the first reactive region of the stator through the wall of the cavity to generate data indicating the vertical position of the rotor.

10. A system comprising: Processing chamber; a base disposed within the processing chamber and fixed to a floor of the processing chamber, the base including a stator configured to generate a first magnetic field, a second magnetic field, and a third magnetic field; as well as A substrate support member, positioned on and configured to support the substrate, the substrate support member including a rotor, the rotor comprising: A first reactive region is configured to interact with the first magnetic field to magnetically control the vertical position of the substrate support, and to interact with the second magnetic field to magnetically center the substrate support on the substrate. as well as A second reactive region is configured to interact with the third magnetic field to magnetically rotate the rotor; The first magnetic field and the first reactive region are used to selectively suspend the substrate support above a stationary position at any distance ranging from 0 mm to 6 mm.

11. The system of claim 10, wherein the first and second reactive regions of the rotor are configured to effectively interact with the second and third magnetic fields of the stator at any vertical position ranging from 0 mm to 6 mm above the rest position of the substrate support.

12. The system of claim 10, wherein the stator includes a first actuation member for generating the first magnetic field, a second actuation member for generating the second magnetic field, and a third actuation member for generating the third magnetic field, wherein at least one of the second actuation member or the third actuation member allows an axial clearance distance between 2 mm and 10 mm.

13. The system of claim 12, wherein the third actuating member has a first height, and wherein the second reactive region has a second height greater than the first height.

14. The system of claim 12, wherein the second actuating member has a first height, and wherein the first reactive region has a second height less than the first height.

15. The system of claim 10, wherein the first reactive region comprises a first iron ring and the second reactive region comprises a second iron ring, the second iron ring comprising a plurality of gears.

16. The system of claim 10, wherein the processing chamber is a rapid thermal processing (RTP) chamber configured to apply a thermal process to the substrate by means of thermal energy.

17. The system of claim 10, wherein the substrate support is disposed within the cavity, and wherein the stator includes a magnetic rotation sensor disposed outside the cavity, the magnetic rotation sensor being configured to interact with an encoder ring of the stator through the wall of the cavity to generate data indicating the rotational position of the rotor.

18. The system of claim 10, wherein the substrate support is disposed within the cavity, and wherein the stator includes a magnetic axial sensor configured to interact with the first reactive region of the stator through the wall of the cavity to generate data indicating the vertical position of the rotor.

19. A method comprising: A first magnetic field is generated by the stator of the substrate of the substrate support device to cause a first magnetic interaction with a first iron ring of the rotor of the substrate support member attached to the substrate support device, wherein the first magnetic interaction controls the vertical position of the substrate support member. The first magnetic field is used to selectively suspend the substrate support above the stationary position at any vertical distance ranging from 0 mm to 6 mm. A second magnetic field is generated by the stator to cause a second magnetic interaction with the first iron ring of the rotor, wherein the second magnetic interaction centers the substrate support on the base. Within the vertical range, the second magnetic interaction centers the substrate support relative to the substrate. A third magnetic field is generated by the stator to cause a third magnetic interaction with the second iron ring of the rotor attached to the substrate support, wherein the third magnetic interaction rotates the substrate support. and The support device is rotated within the vertical distance by the third magnetic interaction.

20. The method of claim 19, wherein the first and second iron rings of the rotor are configured to effectively interact with the second and third magnetic fields of the stator at any vertical position ranging from 0 mm to 6 mm above the rest position of the substrate support.

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