A glass atomizing core assembly, an atomizer and a preparation method thereof

Abstract

This application discloses a glass atomizing core assembly, an atomizer, and a method for preparing the same, belonging to the field of atomizing core technology. The glass atomizing core assembly includes a glass substrate and a heating element, wherein the glass substrate is made of borosilicate glass, and its composition includes 18-22 wt% B2O. 3 It contains 4-5 wt% TiO2; its coefficient of thermal expansion is 4.2-4.5 × 10⁻⁶. ‑6 / K; Through-hole micro-vias are formed on the glass substrate by laser-induced deep etching; the walls of the micro-vias are coated with a silane coupling agent; a fixing bonding layer is provided between the heating element and the glass substrate to bond the heating element to the surface of the glass substrate. The fixing bonding layer includes a nano-metal sintered body and inorganic nano-reinforcing phases dispersed therein. This invention improves the consistency and stability of the liquid supply to the glass atomizing core assembly by changing the glass substrate formulation, the process of forming the micro-vias, and the bonding surface between the heating element and the glass substrate. It prevents problems such as carbon buildup clogging the micro-vias, heating element detachment, cracks, and warping, achieving faster atomization response, more complete atomization, and a delicate and uniform taste, thus enhancing the user experience.

Description

[0001] Priority Explanation

[0002] This application claims priority to Chinese Patent Application No. 202610113112.0, filed on January 27, 2026, entitled "A Glass Atomizing Core Assembly, Atomizer and Preparation Method Thereof", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to the field of atomization technology, specifically to a glass atomizing core assembly, an atomizer, and a method for preparing the same. Background Technology

[0004] The atomizing core is the core component of an electronic atomizing device, and its performance directly determines the atomization effect, taste, and service life. Currently, the mainstream porous ceramic atomizing cores on the market are usually made by adding a pore-forming agent to the ceramic slurry and then molding, high-temperature sintering, and debinding. This technology has the following defects: (1) The pores formed by sintering are of different sizes and unevenly distributed, resulting in unstable oil supply, poor atomization uniformity, and easy leakage; (2) Impurities such as pore-forming agents may remain in the porous structure, affecting the purity of the atomized liquid and the taste of the final aerosol; (3) Due to the difference in the coefficient of thermal expansion between the ceramic substrate and the metal heating element attached to it, stress is easily generated in repeated hot and cold cycles, causing the heating element to warp, crack, or fall off, which in turn leads to the "burnt core" phenomenon, seriously affecting product reliability and user experience.

[0005] Therefore, developing an atomizing core assembly with a uniform and stable pore structure, good atomization effect, and high-strength and reliable bonding between the heating element and the substrate has become an urgent technical problem to be solved in this field. Summary of the Invention

[0006] The purpose of this invention is to overcome the defects of existing porous ceramic atomizing cores, such as inconsistent pore size and uneven distribution, resulting in unstable oil supply and poor atomization uniformity, and to provide a novel atomizing core solution based on a glass substrate.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] A glass atomizing core assembly includes: a glass substrate, micro-holes, a heating element, and a fixing bonding layer.

[0009] The glass substrate is made of borosilicate glass, and its composition includes 18-22 wt% B₂O₃ and 4-5 wt% TiO₂; the coefficient of thermal expansion of the glass substrate is 4.2-4.5 × 10⁻⁶. -6 / K;

[0010] The microvia penetrates the glass substrate and is formed by a laser-induced deep etching process; the walls of the microvia are covered with a silane coupling agent coating.

[0011] The fixing bonding layer is disposed between the heating element and the glass substrate. The fixing bonding layer is used to fix the heating element to the surface of the glass substrate. The fixing bonding layer includes a nano-metal sintered body and an inorganic nano-reinforcing phase dispersed therein.

[0012] Furthermore, the glass substrate also comprises 58-72 wt% SiO2, 4-16 wt% Al2O3 and 2-3 wt% Na2O, and the sum of the weight percentages of the above components in the glass substrate is 100%.

[0013] Furthermore, the pore size of the micro-via is 10-200 μm, the aspect ratio is 5:1 to 20:1, and the array density is 500-2500 pores / square centimeter.

[0014] Furthermore, the material of the silane coupling agent coating is selected from dimethyldichlorosilane or 3-aminopropyltriethoxysilane, so that the pore walls of the micropores are hydrophobic or hydrophilic.

[0015] Furthermore, the surface of the glass substrate to which the heating element is to be bonded is provided with a metallization transition layer, the metallization transition layer including at least an adhesion layer bonded to the glass substrate and a conductive layer located on the adhesion layer.

[0016] Furthermore, the material of the adhesion layer is Cr, Ti, or Mo, and the material of the conductive layer is Cu or Ni.

[0017] Furthermore, the inorganic nano-reinforcing phase is Al2O3 nanorods with a size of 50×1000nm and a mass fraction of 0.5wt% in the fixed bonding layer.

[0018] Furthermore, the surface of the heating element that contacts the fixing bonding layer is provided with an array of micro-pits.

[0019] Furthermore, the diameter of the micro-pits is approximately 10-20 μm, and the depth is 5-10 μm.

[0020] In one aspect, the present invention provides an atomizer, comprising: a housing, an electrode assembly, and a glass atomizing core assembly as described above, wherein,

[0021] The outer casing contains an oil tank and an atomizing chamber, which are connected by a liquid inlet channel. The glass atomizing core assembly is disposed within the atomizing chamber and is used to atomize the atomized liquid from the oil tank. The electrode assembly is electrically connected to the heating element of the glass atomizing core assembly.

[0022] Furthermore, the outlet of the liquid inlet channel corresponds to the micro-hole of the glass atomizing core assembly.

[0023] In another aspect, the present invention also provides a method for preparing a glass atomizing core assembly, comprising the following steps:

[0024] S1: Prepare a glass substrate as described above, wherein the composition of the glass substrate meets the requirements of 18-22 wt% B2O3, 4-5 wt% TiO2, 58-72 wt% SiO2, 4-16 wt% Al2O3, and 2-3 wt% Na2O content, the sum of the weight percentages of the above components in the glass substrate is 100%, and the coefficient of thermal expansion is 4.2-4.5 × 10⁻⁶. -6 / K;

[0025] S2: A through-hole array is formed on the glass substrate by laser-induced deep etching process;

[0026] S3: The walls of the micro-holes are cleaned and silanized to form a silane coupling agent coating.

[0027] S4: A metallization transition layer is formed on the surface of the glass substrate to which the heating element is to be bonded;

[0028] S5: Prepare a sintering paste containing nano-metal particles and inorganic nano-reinforcing phase;

[0029] S6: Apply the sintering paste to the bonding surface of the metallization transition layer and / or the heating element, align the heating element, and perform stepped pressure sintering to form the fixed bonding layer.

[0030] Furthermore, in step S2, the laser-induced deep etching process includes: using a laser to scan and form a modified region on a glass substrate, and then immersing the glass substrate in an etching solution containing hydrofluoric acid to form micro-vias in the modified region.

[0031] Furthermore, in step S3, the silanization treatment is as follows: a hydrophobic silane coupling agent is coated onto the wall of the micro-hole using an ultrasonic spraying process; or, the wall of the micro-hole is first activated by oxygen plasma, and then impregnated with a hydrophilic silane coupling agent solution and cured.

[0032] Furthermore, in step S4, the method for forming the metallization transition layer includes: sequentially sputtering or evaporating an adhesion layer and a conductive layer on the surface of a glass substrate, patterning and thickening the conductive layer through photolithography and electroplating processes, and performing a solderability surface treatment on the outermost layer.

[0033] Furthermore, in step S5, the sintering paste comprises 85% by weight silver particles with a particle size of 50 nm, 0.5% Al2O3 nanorods, and 14.5% organic solvent.

[0034] Furthermore, in step S6, the stepped pressure sintering includes: debinding for 5 minutes at 180°C, 0MPa pressure and N2 atmosphere; then pre-firing for 8 minutes at 230°C, 5MPa pressure and a reducing atmosphere of N2:H2=95:5; and finally densification sintering for 2 minutes at 300°C, 15MPa pressure and vacuum environment.

[0035] Furthermore, prior to step S6, the method further includes laser processing of the mating surface of the heating element to form a micro-dimple array.

[0036] The beneficial effects of this application are:

[0037] Compared with existing technologies, the glass substrate used in this application as the conductive atomizing liquid results in better atomization, better taste, and improved user experience, as shown in the following details:

[0038] 1. Laser-induced deep etching technology can be used to precisely process micro-hole arrays with uniform aperture, high aspect ratio, and uniform distribution on glass substrates, fundamentally solving the problem of uneven pore size in ceramic atomizing cores and ensuring the consistency and stability of liquid supply.

[0039] 2. The glass material itself is chemically stable and leaves no pore-forming agent residue. By silanizing the walls of the micropores, hydrophilic or hydrophobic properties can be flexibly imparted to them according to the characteristics of the atomizing liquid, enabling rapid directional flow or anti-adhesion of the liquid and effectively preventing carbon buildup and clogging.

[0040] 3. By combining multiple processes such as changing the glass formula, the metallization transition layer of the glass substrate, and enhanced sintering, a high-strength, high-thermal-conductivity, and heat-fatigue-resistant metallurgical or sintered bond is formed between the glass substrate and the heating element. This completely solves the core problems of the heating element being easy to fall off, crack, and warp, and significantly extends the product life.

[0041] 4. The TiO2 in the glass formulation helps optimize infrared heat absorption. Combined with a highly thermally conductive bonding layer, it allows heat to be more efficiently concentrated in the atomization area, improving energy efficiency and atomization response speed, resulting in more complete atomization and a delicate and uniform taste.

[0042] 5. The laser processing, photolithography, sputtering, and low-temperature sintering processes used are highly compatible with semiconductor and microelectronics manufacturing processes, making it easy to achieve automated, high-volume, and highly consistent production with high yield and controllable costs. Attached Figure Description

[0043] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0044] Figure 1 This is a cross-sectional view of an atomizer structure according to an embodiment of the present invention;

[0045] Figure 2 yes Figure 1 An exploded view of the concealed outer shell and mounting base;

[0046] Figure 3 yes Figure 1 A schematic diagram of the glass atomizing core component in the diagram;

[0047] Figure 4 yes Figure 1 A schematic diagram of the metallization transition layer on the surface of the glass substrate;

[0048] Figure 5 yes Figure 1 A schematic diagram of the surface treatment of the heating element in the diagram;

[0049] Figure 6 yes Figure 2 A schematic diagram of the contact angle between the hydrophilic surface of the pore wall of the micro-pore structure of the glass substrate and the droplet.

[0050] Figure 7 yes Figure 2 A schematic diagram of the contact angle between the hydrophobic surface of the pore wall of the micro-pore structure in the glass substrate and the droplet;

[0051] Figure 8 yes Figure 1 A schematic diagram of low-temperature nano-silver sintering of the glass atomizing core component in the image;

[0052] Figure 9 yes Figure 1 The manufacturing process flow diagram of the glass atomizing core component.

[0053] Explanation of reference numerals in the attached figures:

[0054] 100. Atomizer; 101. Oil tank; 102. Outer shell; 103. Smoke channel; 104. Air inlet; 105. Mounting base; 106. Glass atomizing core assembly; 1061. Base; 1062. Glass substrate; 1063. Heating element; 1064. Limiting element; 10611. Fixing groove; 10612. Through groove; 10613. Liquid inlet channel; 10614. Atomizing chamber; 10621. Micro-perforation; 10622. Adhesion layer; 10623. Conductive layer; 10624. Metallization transition layer; 10631. Micro-dimple; 107. Droplet. Detailed Implementation

[0055] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected to" another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and similar expressions used in this specification are for illustrative purposes only. In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating relative importance or implying the number of indicated technical features. Thus, unless otherwise stated, features defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "multiple" means two or more. The term "comprising" and any variations thereof mean non-exclusive inclusion, where one or more other features, integers, steps, operations, units, components, and / or combinations thereof may be present or added.

[0056] Furthermore, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections via an intermediate medium, or internal communication between two components. All technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0057] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0058] The technical solution of the present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. It should be understood that the following embodiments are only for explaining the present invention and are not intended to limit the scope of protection of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0059] This application provides an atomizer that can be used to atomize aerosol matrices such as e-liquid, medicinal liquid, or nutrient solution, that is, to atomize liquid aerosol matrices into aerosols for users to inhale.

[0060] See Figure 1 and Figure 2 , Figure 1 This is a cross-sectional view of one embodiment of the atomizer provided in this application. Figure 2 For example Figure 1 An exploded view of the concealed housing and mounting base is shown.

[0061] The atomizer 100 includes a housing 102 and a glass atomizing core assembly 106. The housing 102 contains an oil tank 101 and an atomizing chamber 10614, which are connected via a liquid inlet channel 10613. The glass atomizing core assembly 106 is disposed within the atomizing chamber 10614 and is connected to the oil tank 101 via the liquid inlet channel 10613. In other words, the atomized liquid in the oil tank 101 is guided to the glass atomizing core assembly 106 via the liquid inlet channel 10613. The atomizer 100 also includes a smoke channel 103 and an electrode assembly (not labeled). The smoke channel 103 is connected to the atomizing chamber 10614, and the electrode assembly is electrically connected to the glass atomizing core assembly 106. When the glass atomizing core assembly 106 atomizes the atomized liquid in the oil tank 101 to generate an aerosol, the aerosol is delivered to the user's mouth through the smoke channel 103 for inhalation.

[0062] The atomizer 100 also includes a mounting base 105, on which an air inlet 104 is provided. The mounting base 105 abuts against and fixes the glass atomizing core assembly 106 to form an atomization chamber 10614, and the air inlet 104 faces the glass atomizing core assembly 106 or the atomization chamber 10614. When the user uses the atomizer 100, the airflow enters through the air inlet 104 and carries the aerosol produced by the glass atomizing core assembly 106 from the smoke channel 103 to the user's mouth, so that the glass atomizing core assembly 106 atomizes more fully, the flavor reproduction is better, and the user experience is improved.

[0063] In this embodiment, as Figure 2As shown, the glass atomizing core assembly 106 includes a glass substrate 1062, a fixing bonding layer, and a heating element 1063. The glass substrate 1062 and the heating element 1063 are bonded together by the fixing bonding layer to form the glass atomizing core assembly 106. The atomizer 100 also includes a base 1061 and a limiting member 1064. The glass atomizing core assembly 106 is disposed in the base 1061 and is fixedly installed in the base 1061 by the limiting member 1064 to prevent it from loosening and causing oil leakage.

[0064] The base 1061 is provided with a fixing groove 10611 and a through groove 10612. The opening of the fixing groove 10611 is larger than the opening of the through groove 10612, and the fixing groove 10611 and the through groove 10612 are connected and connected, so that one end face of the base 1061 is penetrated by the opening of the fixing groove 10611, and the other end face is penetrated by the opening of the through groove 10612. The glass atomizing core assembly 106 and the limiting member 1064 are stacked and installed in the fixing groove 10611 in sequence, so that one side of the glass substrate 1062 faces the through groove 10612 and is connected to the oil tank 101 through the through groove 10612 (the through groove 10612 is the liquid inlet channel 10613). The other side is provided with a heating element 1063, which is used to atomize the atomizing liquid that is guided from the oil tank 101 to the glass substrate 1062 through the through groove 10612.

[0065] The glass substrate 1062 has two sides. The side facing the oil tank 101 is the liquid absorption surface, and the side facing the opposite direction of the oil tank 101 is the atomizing surface. That is, the side where the heating element 1063 is disposed is the atomizing surface. The atomized liquid is conducted from the liquid absorption surface to the atomizing surface so that the heating element 1063 can heat and atomize it to generate an aerosol.

[0066] The following further explains the structure and manufacturing process of the glass atomizing core component.

[0067] In some embodiments, such as Figures 3 to 9 As shown, the glass atomizing core assembly includes a glass substrate 1062, micro-holes 10621, a heating element 1063, and a fixing bonding layer. The glass substrate 1062 is made of borosilicate glass, and its composition includes: 18-22 wt% B₂O₃, 4-5 wt% TiO₂, 58-72 wt% SiO₂, 4-16 wt% Al₂O₃, and 2-3 wt% Na₂O, with the sum of the weight percentages of these components in the glass substrate being 100%. The coefficient of thermal expansion of the glass substrate 1062 is 4.2-4.5 × 10⁻⁶. -6 / K; A micro-via 10621 penetrates the glass substrate 1062 and is formed by a laser-induced deep etching process; the wall of the micro-via 10621 is covered with a silane coupling agent coating; a fixing bonding layer is disposed between the heating element 1063 and the glass substrate 1062, and is used to fix the heating element 1063 to the surface of the glass substrate 1062. In this embodiment, the fixing bonding layer includes a nano-metal sintered body and an inorganic nano-reinforcing phase dispersed therein. The coefficient of thermal expansion of the glass substrate 1062 after molding is adjusted by B2O3, that is, the coefficient of thermal expansion (CTE) of the glass substrate 1062 is significantly reduced to 4.2-4.5×10. -6 / K, so that its coefficient of thermal expansion with the subsequently used heating element 1063 (iron-chromium-aluminum) is 5-6×10. -6 / K forms a good match, reducing stress cracking problems during thermal cycling.

[0068] Using the above-mentioned components, the glass substrate 1062 can not only enhance its mechanical strength, but also improve its chemical stability, thermal shock resistance, and etching efficiency during laser-induced deep etching. In terms of atomization, TiO2, as an infrared absorber, optimizes the absorption and distribution of radiated heat from the heating element 1063 by the glass substrate 1062, thereby improving the thermal energy utilization rate.

[0069] In some embodiments, the thickness of the glass substrate 1062 is 0.2-1.2 mm, preferably 0.4-0.7 mm; specifically, the thickness of the glass substrate 1062 can be selected from 0.2 mm, 0.25 mm, 0.3 mm, 0.35 mm, 0.4 mm, 0.45 mm, 0.5 mm, 0.55 mm, 0.6 mm, 0.65 mm, 0.7 mm, 0.75 mm, 0.8 mm, 0.85 mm, 0.9 mm, 0.95 mm, 1.0 mm, 1.1 mm, and 1.2 mm. Because the thickness of the glass substrate 1062 is 0.2-1.2 mm, the path of the atomized liquid is short when it is conducted from the liquid absorption surface to the atomizing surface, resulting in timely liquid supply and reduced thermal resistance. When heat is generated in the heating element 1063, the heat can be quickly distributed on the atomizing surface, thereby improving atomization efficiency.

[0070] In some embodiments, the aperture of the microvia 10621 is 10-200 μm, the aspect ratio is 5:1 to 20:1, and the array density of the microvia 10621 is 500-2500 holes / cm². Preferably, the pore size of the micro-hole 10621 is 30-150μm; in specific embodiments, the pore size of the micro-hole 10621 can be selected from 10μm, 20μm, 30μm, 40μm, 50μm, 60μm, 70μm, 80μm, 90μm, 100μm, 110μm, 120μm, 130μm, 140μm, 150μm, 160μm, 170μm, 180μm, 190μm, and 200μm; users can select a suitable pore size of the micro-hole 10621 according to implementation requirements to ensure sufficient liquid supply without leakage, thereby improving atomization efficiency and user experience.

[0071] Preferably, the microvia 10621 array density is 800-1200 holes / cm². In specific embodiments, the microvia 10621 array density can be selected as 500 holes / cm², 500 holes / cm², 600 holes / cm², 700 holes / cm², 800 holes / cm², 900 holes / cm², 1000 holes / cm², 1100 holes / cm², 1200 holes / cm², 1300 holes / cm², 1400 holes / cm², 1500 holes / cm², 1600 holes / cm², 1700 holes / cm², 1800 holes / cm², 1900 holes / cm², 2000 holes / cm², 2100 holes / cm², 2200 holes / cm², 2300 holes / cm², 2400 holes / cm², or 2500 holes / cm². Since some of the micro-holes 10621 are blocked by the heating element 1063, the number of holes should be increased appropriately. However, the number of holes should be increased while ensuring sufficient strength to avoid problems such as thermal stress cracks during the operation of the heating element 1063, thereby improving atomization efficiency and service life.

[0072] The walls of the micro-holes 10621 are coated with a silane coupling agent. The material of the silane coupling agent coating is selected from dimethyldichlorosilane or 3-aminopropyltriethoxysilane, which makes the walls of the micro-holes 10621 hydrophobic or hydrophilic, reducing the adsorption residue of high-viscosity components on the pore walls, preventing carbon buildup and clogging, and improving corrosion resistance. In terms of atomizing liquid conduction, relying on strong capillary force, even for high-viscosity e-liquid (viscosity is about 50 cP), its climbing speed can reach >0.5 mm / s, ensuring rapid liquid supply.

[0073] In some embodiments, such as Figure 4As shown, the surface of the glass substrate 1062 to be bonded with the heating element 1063 is provided with a metallization transition layer 10624. The metallization transition layer 10624 includes at least an adhesion layer 10622 bonded to the glass substrate 1062 and a conductive layer 10623 located on the adhesion layer 10622.

[0074] In some embodiments, the material of the adhesion layer 10622 is Cr, Ti, or Mo, and the material of the conductive layer is Cu or Ni. Specifically, the adhesion layer 10622 and the conductive layer 10623 in the metallization transition layer 10624 constructed on the glass substrate 1062 promote a firm bond between the glass substrate 1062 and the heating element 1063 through the Cr / Ti of the adhesion layer 10622, and the Mo layer plays a stress buffering role, reducing vibration or thermal stress. As a result, the coefficient of thermal expansion of the metallization transition layer 10624 is between that of glass and metal solder, sintered silver, thereby forming a firmly attached metal pad or metallized area with good thermal and electrical conductivity in a designated area of ​​the glass substrate.

[0075] In some embodiments, the inorganic nano-reinforcing phase is Al2O3 nanorods with a size of 50×1000nm and a mass fraction of 0.5wt% in the fixed bonding layer.

[0076] In some embodiments, such as Figure 5 As shown, the surface of the heating element 1063 in contact with the fixing bonding layer is provided with an array of micro-pits 10631, which greatly increases the area of ​​the bonding surface and provides a mechanical interlocking structure, making the bonding between the heating element 1063 and the glass substrate 1062 more secure and preventing lifting or detachment. The diameter of the micro-pits 10631 is approximately 10-20 μm, and the depth is 5-10 μm. Specifically, the diameter of the micro-pits 10631 can be selected as 10 μm, 15 μm, or 20 μm. Users can choose the diameter of the micro-pits 10631 according to their needs to improve the bonding and fixing strength and extend the product life.

[0077] Specifically, the manufacturing process steps for this glass atomizing core component are as follows:

[0078] A method for preparing the glass atomizing core assembly 106 includes the following steps:

[0079] S1: Prepare a glass substrate 1062, wherein the composition of the glass substrate 1062 meets the requirements of 18-22 wt% B2O3, 4-5 wt% TiO2, 58-72 wt% SiO2, 4-16 wt% Al2O3 and 2-3 wt% Na2O, the sum of the weight percentages of the above components in the glass substrate is 100%, and the coefficient of thermal expansion is 4.2-4.5 × 10⁻⁶. -6 / K;

[0080] S2: A through-hole array 10621 is formed on the glass substrate 1062 by laser-induced deep etching process;

[0081] S3: Clean and silanize the walls of the micro-holes 10621 to form a silane coupling agent coating;

[0082] S4: A metallization transition layer is formed on the surface of the glass substrate 1062 to be bonded with the heating element 1063;

[0083] S5: Prepare a sintering paste containing nano-metal particles and inorganic nano-reinforcing phase;

[0084] S6: Apply sintering paste to the bonding surface of the metallization transition layer and / or the heating element, align the heating element 1063, and perform stepped pressure sintering to form a fixed bonding layer.

[0085] In some embodiments, step S2, the laser-induced deep etching process includes: using a laser to scan and form a modified region on a glass substrate 1062, and then immersing the glass substrate 1062 in an etching solution containing hydrofluoric acid for etching to form a micro-via 10621 in the modified region.

[0086] In step S3, silanization treatment: a hydrophobic silane coupling agent is coated on the wall of the micro-hole 10621 using an ultrasonic spraying process to form a silane coupling agent coating; or, the wall of the micro-hole 10621 is first activated by oxygen plasma, then impregnated with a hydrophilic silane coupling agent solution and cured to form a silane coupling agent coating.

[0087] In step S4, the method for forming the metallization transition layer includes: sequentially sputtering or evaporating an adhesion layer 10622 and a conductive layer 10623 on the surface of a glass substrate, patterning and thickening the conductive layer by photolithography and electroplating processes, and performing a solderability surface treatment on the outermost layer.

[0088] In step S5, the sintering paste contains 85% by weight of silver particles with a particle size of 50 nm, 0.5% of Al2O3 nanorods, and 14.5% of organic solvent; the sintering paste is used to bond the metallization transition layer on the surface of the heating element and the glass substrate, that is, to form a fixed bonding layer between the heating element and the glass substrate, thereby fixing the two together.

[0089] In step S6, the stepped pressure sintering includes: debinding for 5 minutes at 180°C, 0MPa pressure and N2 atmosphere; then pre-firing for 8 minutes at 230°C, 5MPa pressure and N2:H2=95:5 reducing atmosphere; and finally densification sintering for 2 minutes at 300°C, 15MPa pressure and vacuum environment.

[0090] Before step S6, the bonding surface of the heating element 1063 is laser-processed to form a micro-pit array. The micro-pits allow the heating element and the glass substrate surface to be inter-embedded, thereby making the bonding between the glass substrate and the heating element more stable.

[0091] More specifically, the following are specific implementation examples of the preparation method of the glass atomizing core component. In the following examples, the heating element selected is FeCrAl alloy.

[0092] Example 1:

[0093] This embodiment prepares a glass atomizing core assembly with hydrophilic microporous pore walls.

[0094] Step 1: Glass substrate preparation: Weigh the raw materials according to the following weight percentages: SiO2 60%, B2O3 20%, Al2O3 13%, Na2O 2.5%, TiO2 4.5%; after mixing, melting and clarifying, and homogenizing, draw the mixture into a thin glass sheet with a thickness of 0.5 mm, and cut it into 4 mm × 8 mm glass sheets; the coefficient of thermal expansion was measured to be approximately 4.3 × 10⁻⁶. -6 / K, resistivity >10 14 The surface roughness is Ω·cm, softening point is above 800℃, and surface roughness Ra < 0.1μm. A thorough cleaning process using standard RCA is employed to obtain the glass substrate. In this embodiment, standard RCA cleaning is a well-known technique and will not be explained in detail here.

[0095] Step 2: Fabricate microvias on the glass substrate. The specific fabrication process for the microvia array is as follows:

[0096] a. First, laser-induced modification is used: positive photoresist is spin-coated on the surface of the glass substrate, and exposed and developed through a mask to form a circular hole pattern window with a diameter of 50μm; then, a picosecond laser is used to scan and modify the glass substrate through the photoresist window. The picosecond laser processing system is Vitrion S 5000, with a wavelength of 355nm and a power setting of 12W; the photoresist windows (predetermined areas) on the upper and lower surfaces of the glass substrate are scanned to form a blind hole-shaped modification area with a diameter of about 50μm.

[0097] b. The process involves wet etching, in which the laser-treated glass substrate is immersed in an etching solution at 35°C for 20 minutes. The modified areas are rapidly and selectively etched through, forming through-hole microvias with a diameter of approximately 50 μm, a depth of approximately 450 μm, and an aspect ratio of 15:1. The microvia array density is approximately 1000 holes / cm², with a hole spacing of approximately 80 μm. The resulting microvias have smooth, vertical walls free of microcracks. The etching solution composition is: 5 wt% hydrofluoric acid (HF) + 10 wt% ammonium fluoride (NH₄F) + 0.3 wt% surfactant (Triton X-100).

[0098] Step 3: Perform hydrophilic treatment on the walls of the micropores:

[0099] a. Cleaning: The glass substrate after the micro-vias are formed is ultrasonically cleaned with deionized water to remove all etching solution residue.

[0100] b. Activation: The substrate is placed in a plasma cleaner and treated with oxygen plasma at 100W for 5 minutes to activate the hydroxyl groups on the walls of the micropores.

[0101] c. Formation of hydrophilic coating: The activated glass substrate is immersed in a hydrophilic treatment solution for 10 minutes. The hydrophilic treatment solution is formulated with H2O, ethanol and 3-aminopropyltriethoxysilane, wherein the volume ratio of H2O:ethanol = 7:3 and 2wt% of 3-aminopropyltriethoxysilane (APTES) is dissolved.

[0102] d. Curing: Remove the glass substrate and place it in an oven to cure at 120°C for 30 minutes, thereby forming a strong hydrophilic surface treatment layer on the walls of the micro-holes, with the contact angle between the droplet 107 and the hole wall being less than 10°.

[0103] Step 4: Metallization of the glass substrate surface:

[0104] a. Thin film deposition: Using magnetron sputtering equipment, a Cr adhesion layer and a Cu conductive layer are sequentially deposited on the glass substrate in the area where the heating element needs to be bonded; the thickness of the Cr adhesion layer is 50 nm and the thickness of the Cu conductive layer is 200 nm.

[0105] b. Patterned Electroplating Thickening: Photoresist is spin-coated onto the sputtered layer, and the desired pattern, such as a 2mm x 6mm square pad, is developed by exposure. Electroplating is then performed to thicken the Cu layer to 10μm. Following this, electroless nickel plating to a thickness of 1μm and immersion gold plating to a thickness of 0.05μm are applied to form a solderable surface layer.

[0106] c. Photoresist removal and stripping: The photoresist is removed with a photoresist remover, and the sputtered thin film outside the pattern that is not protected by the electroplating layer is removed with an etchant, finally obtaining the patterned metallization transition layer.

[0107] Step 5: Pretreatment of heating element: Provide FeCrAl heating element with a coefficient of thermal expansion of approximately 5.5 × 10⁻⁶. -6 / K. A dense array of micro-pits was fabricated on the side of the heating element bonded to the glass substrate using a short-pulse laser. The micro-pits had a diameter of approximately 20 μm, a depth of approximately 8 μm, and a density of approximately 1 × 10⁻⁶. 5 The number of pieces per cm² is approximately 0.35 in depth.

[0108] Step 6: Prepare the enhanced nano-silver sintering paste: Weigh the following by weight percentage: 85wt% silver powder with an average particle size of 50nm, 0.5wt% Al2O3 nanorods with a size of 50nm×1000nm, and 14.5wt% terpineol solvent. Mix thoroughly in a planetary mixer to form a paste.

[0109] Step 7: Low-temperature nano-silver sintering bonding:

[0110] a. Using screen printing, uniformly coat the sintering paste prepared in step 6 onto the metallization transition layer of the glass substrate.

[0111] b. Precisely align the pre-treated FeCrAl heating element with its micro-recessed surface and place it on the area coated with sintering paste.

[0112] c. Place the assembly of the heating element and the glass substrate in a pressure sintering furnace that can be inflated for protection and under vacuum, and perform pressure sintering according to the following stepped procedure, with the program settings as follows:

[0113] (1) Degumming stage: temperature 180℃, pressure 0MPa, N2 atmosphere, time 5 minutes.

[0114] (2) Pre-burning stage: temperature 230℃, pressure 5MPa, N2:H2=95:5 atmosphere, time 8 minutes.

[0115] (3) Densification stage: temperature 300℃, pressure 15MPa, vacuum environment, time 2 minutes.

[0116] d. After the process is completed, the furnace is cooled, which forms a high-strength sintered bonding layer between the heating element and the glass substrate. The electrodes of the heating element are led out through welding electrode leads.

[0117] The glass atomizing core component is now complete after the above steps.

[0118] Example 2: Preparation of hydrophobic glass atomizing core assembly

[0119] The main difference between this embodiment and Embodiment 1 lies in the treatment method of the micro-hole wall, which aims to obtain hydrophobic and non-stick properties.

[0120] The glass substrate preparation, micro-hole processing, glass substrate surface metallization, and heating element pretreatment steps are the same as in Example 1.

[0121] Hydrophobic treatment of micro-hole walls:

[0122] a. Cleaning: Same as in Example 1.

[0123] b. Hydrophobic coating formation: Using ultrasonic spraying equipment, a diluted heptane solution of dimethyldichlorosilane is uniformly sprayed onto the walls of the micropores.

[0124] c. Curing: Heat treatment at 150℃ for 1 hour causes the silane to hydrolyze and condense, forming a stable hydrophobic monolayer on the pore wall, thus constituting a hydrophobic surface treatment layer. Measurements show that the contact angle between the atomized liquid droplet 107 and the pore wall is greater than 100°.

[0125] The subsequent sintering paste preparation and low-temperature nano-silver sintering bonding steps are the same as in Example 1.

[0126] This solution is suitable for atomizing fluids with high viscosity or easy crystallization, and can effectively reduce the risk of adsorption and clogging on the pore walls.

[0127] Example 3: Preparation of glass atomizing core components with different glass compositions and thicknesses

[0128] This embodiment aims to illustrate the range of options for glass substrate formulation and thickness.

[0129] Glass substrate: Borosilicate glass with a composition of 58% SiO2, 22% B2O3, 14% Al2O3, 2% Na2O, and 4% TiO2, and a thickness of 0.3 mm. Its coefficient of thermal expansion is approximately 4.2 × 10⁻⁶. -6 / K.

[0130] Microvias: Using a LIDE process similar to that in Example 1, an array of microvias with a diameter of 20 μm and an aspect ratio of 20:1 was fabricated.

[0131] The walls of the micropores are hydrophilically treated (same as in Example 1).

[0132] The subsequent steps of metallization of the glass substrate surface, pretreatment of the heating element, and sintering bonding are basically the same as those in Example 1.

[0133] Example 4:

[0134] Preparation of glass atomizing cores with different glass compositions and thicknesses

[0135] This embodiment aims to illustrate the range of options for glass substrate formulation and thickness.

[0136] Glass substrate: The glass used has a composition of 62% SiO2, 22% B2O3, 8% Al2O3, 3% Na2O, and 25% TiO2, with a thickness of 0.7 mm and a coefficient of thermal expansion of approximately 4.5 × 10⁻⁶. -6 / K, the micro-via is processed with a diameter of 100μm and a depth-to-width ratio of 10:1, and hydrophobic treatment is performed. The remaining steps are the same as in Example 1.

[0137] Example 5:

[0138] Preparation of glass atomizing cores with different glass compositions and thicknesses

[0139] This embodiment aims to illustrate the range of options for glass substrate formulation and thickness.

[0140] Glass substrate: The glass used has a formulation of 72% SiO2, 18% B2O3, 4% Al2O3, 2% Na2O, and 4% TiO2, with a thickness of 1.2 mm and a coefficient of thermal expansion of approximately 4.5 × 10⁻⁶. -6 / K, the micro-via is processed with a diameter of 200μm and a depth-to-width ratio of 10:1, and hydrophobic treatment is performed. The remaining steps are the same as in Example 1.

[0141] Comparative Example

[0142] The existing conventional ceramic atomizing core component is used. The ceramic atomizing core component includes a ceramic substrate, which is a commercially available porous ceramic sheet. Its main components are Al2O3 and organic pore-forming agents, and its thickness is about 3.5 mm. The pores of the ceramic substrate are formed after the pore-forming agent is sintered and volatilized. The pore size distribution ranges from a few micrometers to hundreds of micrometers, with poor uniformity and inability to be precisely controlled.

[0143] A heating paste is printed on the surface of a ceramic substrate, and then the ceramic atomizing core component is obtained by high-temperature sintering.

[0144] The samples obtained in the above embodiments and the ceramic atomizing core components of the comparative examples were tested and their effects analyzed under the same conditions, as follows:

[0145] Bond strength (shear strength in MPa) 45 43 42 55 48 20 Thermal cycling test (-10℃ to 200℃, 15,000 cycles). The interface is intact and there are no peeling parts. The interface is intact and there are no peeling parts. The interface is intact and there are no peeling parts. The interface is intact and there are no peeling parts. The interface is intact and there are no peeling parts. It warps up after 100 cycles and shows visible cracks after 1000 cycles. Liquid supply stability (capillary flow rate, mm / s) 0.68 0.63 0.59 0.75 0.88 0.1 (fluctuation ±0.03) Atomization uniformity (atomization quantity per unit power, PTM) 16 14 13 18 20 7 (Fast decay) Taste evaluation (10,000 puffs) Always smooth and even Smooth and carbon-free Good, no carbon buildup High fidelity High fidelity After 300 bites, a burnt taste occasionally appeared, and the texture became increasingly mixed. Pore ​​uniformity (microscopic statistics) Aperture deviation < ±5% Aperture deviation < ±5% Aperture deviation < ±7% Aperture deviation < ±8% Aperture deviation < ±5% The apertures are of varying sizes and have poor uniformity. Leakage test after standing (35 days) none none none none none Leaks began to appear on the third day. Flavor degradation (10,000 puffs) none none none none none At 200 rpm, degradation begins; at 400 rpm, various impurities appear.

[0146] The specific purposes of the above tests are as follows: bonding strength is used to evaluate the reliability of the bonding between the heating element and the glass substrate; thermal cycling test is used to evaluate the thermal fatigue life after the heating element and the glass substrate are bonded; liquid supply stability is used to evaluate the pore uniformity and flow conductivity on the glass substrate; atomization uniformity is used to evaluate atomization efficiency and uniformity; long-term taste evaluation is used to evaluate the risk of impurities and paste core; and static leakage test is used to evaluate leakage phenomena in the use and non-use states.

[0147] In summary, the tests show that the glass atomizing core assembly of the present invention is significantly superior to existing ceramic atomizing cores in terms of bonding reliability, oil supply consistency, prevention of dry burning and core scorching, atomization uniformity, leakage prevention and service life.

[0148] Specifically,

[0149] Regarding the issue of heating element detachment: the bonding strength of all embodiments reaches 55 MPa, far exceeding the comparative example's 20 MPa, and all passed 15,000 rigorous thermal cycling tests with intact interfaces. This fully demonstrates that the technical solution of this invention completely solves the core reliability problem of easy detachment and cracking of the heating element in traditional ceramic atomizing core components.

[0150] To address the issues of uneven pore size and unstable liquid supply: the micro-holes in all embodiments are precisely machined using laser-induced deep etching technology, resulting in uniform pore size and fast and stable liquid supply speed. In contrast, the ceramic pores in the comparative embodiment are naturally uneven, leading to low liquid supply speed and large fluctuations (±30%). Therefore, the technical solution of this invention completely solves the problems of unstable oil supply and uneven atomization caused by uneven pore size in traditional ceramic atomizing core components.

[0151] Regarding the issues of impurity residue and taste: All embodiments use pure glass and molecular-level surface coatings, eliminating the risk of introducing foreign impurities and ensuring consistent taste over long-term use. In contrast, the comparative embodiment uses pore-forming agents to create ceramic pores and sintersulates silver paste in high-temperature air, which carries the risk of impurity residue and oxidation, easily leading to off-flavors and burnt tastes in the later stages of vaping. Therefore, the technical solution of this invention completely solves the problems of off-flavors and burnt tastes that occur in traditional ceramic atomizing core components during the atomization process.

[0152] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit it. Under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above. For the sake of brevity, they are not provided in detail. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A glass atomizing core assembly, characterized in that, include: The glass substrate is made of borosilicate glass, and its composition includes 18-22 wt% B₂O₃ and 4-5 wt% TiO₂; the coefficient of thermal expansion of the glass substrate is 4.2-4.5 × 10⁻⁶. -6 / K; Microvias penetrating the glass substrate are formed by a laser-induced deep etching process; the walls of the microvias are coated with a silane coupling agent coating. Heating components; and, A fixing bonding layer is disposed between the heating element and the glass substrate. The fixing bonding layer is used to fix the heating element to the surface of the glass substrate. The fixing bonding layer includes a nano-metal sintered body and an inorganic nano-reinforcing phase dispersed therein.

2. The glass atomizing core assembly according to claim 1, characterized in that, The glass substrate also comprises 58-72 wt% SiO2, 4-16 wt% Al2O3 and 2-3 wt% Na2O, and the sum of the weight percentages of the above components in the glass substrate is 100%.

3. The glass atomizing core assembly according to claim 1, characterized in that, The micro-vias have a diameter of 10-200 μm, an aspect ratio of 5:1 to 20:1, and an array density of 500-2500 pores / cm².

4. The glass atomizing core assembly according to claim 1, characterized in that, The silane coupling agent coating is made of dimethyldichlorosilane or 3-aminopropyltriethoxysilane, which makes the pore walls of the micropores hydrophobic or hydrophilic.

5. The glass atomizing core assembly according to claim 1, characterized in that, The surface of the glass substrate to which the heating element is to be bonded is further provided with a metallization transition layer, the metallization transition layer including at least an adhesion layer bonded to the glass substrate and a conductive layer located on the adhesion layer.

6. The glass atomizing core assembly according to claim 5, characterized in that, The material of the adhesion layer is Cr, Ti or Mo, and the material of the conductive layer is Cu or Ni.

7. The glass atomizing core assembly according to claim 1, characterized in that, The inorganic nano-reinforcing phase is Al2O3 nanorods with a size of 50×1000nm and a mass fraction of 0.5wt% in the fixed bonding layer.

8. The glass atomizing core assembly according to claim 1, characterized in that, The surface of the heating element that contacts the fixing bonding layer is provided with an array of micro-pits.

9. The glass atomizing core assembly according to claim 8, characterized in that, The micro-pits have a diameter of approximately 10-20 μm and a depth of 5-10 μm.

10. An atomizer, characterized in that, include: The outer casing contains an oil tank and an atomizing chamber, which are connected by a liquid inlet channel. The glass atomizing core assembly as described in any one of claims 1 to 9, wherein the glass atomizing core assembly is disposed within the atomizing chamber, and the glass atomizing core assembly is used to atomize the atomizing liquid from the oil tank; and, The electrode assembly is electrically connected to the heating element of the glass atomizing core assembly.

11. The atomizer according to claim 10, characterized in that, The outlet of the liquid inlet channel corresponds to the micro-hole of the glass atomizing core assembly.

12. A method for preparing a glass atomizing core assembly as described in any one of claims 1-9, characterized in that, Includes the following steps: S1: Prepare the glass substrate as described in claim 1, wherein the composition of the glass substrate meets the requirements of 18-22 wt% B2O3, 4-5 wt% TiO2, 58-72 wt% SiO2, 4-16 wt% Al2O3 and 2-3 wt% Na2O, the sum of the weight percentages of the above components in the glass substrate is 100%, and the coefficient of thermal expansion is 4.2-4.5 × 10⁻⁶. -6 / K; S2: A through-hole array is formed on the glass substrate by laser-induced deep etching process; S3: The walls of the micro-holes are cleaned and silanized to form a silane coupling agent coating. S4: A metallization transition layer is formed on the surface of the glass substrate to which the heating element is to be bonded; S5: Prepare a sintering paste containing nano-metal particles and inorganic nano-reinforcing phase; S6: Apply the sintering paste to the bonding surface of the metallization transition layer and / or the heating element, align the heating element, and perform stepped pressure sintering to form the fixed bonding layer.

13. The method according to claim 12, characterized in that, In step S2, the laser-induced deep etching process includes: using a laser to scan and form a modified region on a glass substrate, and then immersing the glass substrate in an etching solution containing hydrofluoric acid to form micro-vias in the modified region.

14. The method according to claim 12, characterized in that, In step S3, the silanization process is as follows: a hydrophobic silane coupling agent is coated onto the wall of the micro-hole using an ultrasonic spraying process; or, the wall of the micro-hole is first activated by oxygen plasma, and then impregnated with a hydrophilic silane coupling agent solution and cured.

15. The method according to claim 12, characterized in that, In step S4, the method for forming the metallization transition layer includes: sequentially sputtering or evaporating an adhesion layer and a conductive layer on the surface of a glass substrate, patterning and thickening the conductive layer through photolithography and electroplating processes, and performing a solderability surface treatment on the outermost layer.

16. The method according to claim 12, characterized in that, In step S5, the sintering paste contains 85% by weight of silver particles with a particle size of 50 nm, 0.5% of Al2O3 nanorods, and 14.5% of organic solvent.

17. The method according to claim 12, characterized in that, In step S6, the stepped pressure sintering includes: debinding for 5 minutes at 180°C, 0MPa pressure and N2 atmosphere; then pre-firing for 8 minutes at 230°C, 5MPa pressure and N2:H2=95:5 reducing atmosphere; and finally densification sintering for 2 minutes at 300°C, 15MPa pressure and vacuum environment.

18. The method according to claim 12, characterized in that, Before step S6, the mating surface of the heating element is laser-processed to form a micro-dimple array.

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