Wearable device and method of manufacturing the same

Abstract

The application belongs to the technical field of wearable devices, and particularly relates to a wearable device and a preparation method thereof. The wearable device comprises a shell, which is annular, and an accommodating cavity is arranged in the shell; at least two electronic modules, which comprise a power module and a circuit module, are arranged in the accommodating cavity at intervals; and a sealing body is filled in the accommodating cavity to encapsulate the electronic modules in the shell. The sealing body comprises at least one buffer cavity, which is a space not filled with sealing material in the sealing body, and the buffer cavity is located between two adjacent electronic modules and / or between the electronic module and the inner wall of the shell to absorb stress acting on the electronic module. The application can ensure the encapsulation protection performance and provide the buffer cavity for the internal electronic module to absorb the stress acting on the electronic module.

Description

Technical Field

[0001] This application belongs to the field of wearable device technology, specifically relating to a wearable device and its manufacturing method. Background Technology

[0002] Existing smart rings typically employ an integral potting process, which completely encapsulates electronic modules such as batteries and circuit boards with resin or soft glue in one go, forming a rigid whole without gaps.

[0003] However, this fully filled method results in the rigid transfer of impact energy to all electronic modules, which can easily damage the devices when dropped; the thermal stress generated by the different heat generation and thermal expansion coefficients of each electronic module cannot be released, which may lead to internal cracking or desoldering under long-term use; the expansion of the battery during charge and discharge cycles is rigidly restrained, which poses a safety hazard. Summary of the Invention

[0004] The purpose of this application is to provide a wearable device and its manufacturing method, which can provide a buffer cavity for the internal electronic module while ensuring the encapsulation and protection performance, so as to absorb the stress acting on the electronic module.

[0005] The first aspect of this application provides a wearable device, comprising: a housing, which is annular in shape, having an accommodating cavity inside the housing; at least two electronic modules, spaced apart within the accommodating cavity, the at least two electronic modules including a power module and a circuit module; and a sealing body, which fills the accommodating cavity for encapsulating each of the electronic modules within the housing; wherein the sealing body includes at least one buffer cavity, the buffer cavity being the space within the sealing body not filled with sealing material, and the buffer cavity being located between two adjacent electronic modules, and / or between the electronic module and the inner wall of the housing, to absorb stress acting on the electronic module.

[0006] In one exemplary embodiment of this application, the sealed body includes at least two buffer cavities, at least one of the buffer cavities is located between the power module and the circuit module, and at least another buffer cavity is located between the circuit module and the inner wall of the housing or between the power module and the inner wall of the housing.

[0007] In one exemplary embodiment of this application, at least two of the buffer cavities are not interconnected; or at least two of the buffer cavities are partially interconnected through the internal channels of the sealing body to form a network of distributed buffer cavities.

[0008] In one exemplary embodiment of this application, at least one of the electronic modules has an elastic wrapping layer on its outer surface, the elastic wrapping layer being configured to space the electronic module from the sealing body.

[0009] In one exemplary embodiment of this application, the thickness of the elastic wrapping layer is 0.2 mm to 0.5 mm.

[0010] In one exemplary embodiment of this application, the power module has a first buffer layer on the surface facing the circuit module and a second buffer layer on the surface away from the circuit module. The power module is clamped and fixed to the circuit module by the first buffer layer and the second buffer layer.

[0011] In one exemplary embodiment of this application, the housing has an opening and is switchable between a closed state and an open state; the sealing body encapsulates each of the electronic modules into an independent module unit, and a buffer cavity is provided between two adjacent module units; in the closed state, two adjacent module units abut against each other at a portion near the radially inner side of the housing, and the buffer cavity gradually increases in size from the inner side to the outer side along the radial direction of the housing; when the housing switches from the closed state to the open state, the abutting portions of the two adjacent module units separate from each other, and the size of the buffer cavity increases at all points along the radial direction.

[0012] In one exemplary embodiment of this application, the sealing body fills a portion of the accommodating cavity, and the sealing body forms an avoidance structure in the space corresponding to the buffer cavity, such that the buffer cavity is jointly enclosed by the sealing body and the electronic module.

[0013] A second aspect of this application provides a method for manufacturing a wearable device, comprising: arranging at least two electronic modules spaced apart within a cavity of an annular housing, the at least two electronic modules including a power module and a circuit module; injecting a sealing material into the cavity and curing it to form a sealed body; wherein, before injecting the sealing material, a predetermined space is occupied by a pre-set removable spacer structure, such that the cured sealed body forms at least one buffer cavity in the predetermined space, the buffer cavity being located between two adjacent electronic modules and / or between the electronic modules and the inner wall of the housing.

[0014] In one exemplary embodiment of this application, the removable spacer structure is at least one of a soluble core mold, a detachable mold, or a compressible elastic microsphere.

[0015] The wearable device and its manufacturing method described in this application have at least the following beneficial effects:

[0016] The wearable device of this application has a buffer cavity formed within the sealed body. When the electronic module expands in volume due to battery charge-discharge cycles, the expansion stress can be released by squeezing the buffer cavity, reducing the direct stress acting on the sealed body and preventing cracking or damage. When the device is dropped or subjected to external impact, the impact energy is partially absorbed at the buffer cavity, reducing the rigid impact on the electronic module. When thermal stress is generated by the different heat generation and thermal expansion coefficients of the various electronic modules, the buffer cavity provides space for the slight displacement of the electronic modules, releasing thermal mismatch stress. Furthermore, this application employs a removable spacer structure to occupy a predetermined space before filling with sealing material. After the sealed body cures, the spacer structure is removed to form the buffer cavity. This allows the position, size, and shape of the buffer cavity to be precisely preset according to the expansion amount and force direction of different electronic modules, improving the risk of damage to the device caused by traditional mechanical machining of cavities. It also has strong process compatibility and is suitable for mass production.

[0017] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0020] Figure 1 A schematic diagram of the wearable device provided in the embodiment of this application in the closed state is shown.

[0021] Figure 2 A schematic diagram of the wearable device provided in the embodiment of this application in a semi-open state is shown.

[0022] Figure 3 A schematic diagram of the wearable device provided in the embodiment of this application in its fully open state is shown.

[0023] Figure 4 A schematic diagram of the manufacturing process of the wearable device provided in the embodiments of this application is shown.

[0024] Explanation of reference numerals in the attached figures: 100. Wearable device; 200. Housing; 210. Receptacle; 300. Electronic module; 310. Power module; 320. Circuit module; 400. Sealing body; 410. Buffer cavity. Detailed Implementation

[0025] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0026] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0027] In this application, unless otherwise expressly specified and limited, the terms "assembly," "connection," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0028] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0029] It should be noted that, in the following embodiments, "axial" refers to the direction along the central axis of the annular housing 200, "radial" refers to the direction along the radius of the annular housing 200, and "circumferential" refers to the direction along the circumference of the annular housing 200.

[0030] This embodiment provides a wearable device 100, which can be a ring, bracelet, etc. The following embodiment uses a ring as an example for illustration, but those skilled in the art should understand that the technical solution of this application is also applicable to other ring-shaped wearable devices 100, such as smart bracelets, smart necklaces, etc.

[0031] Among them, see Figure 1 As shown, the wearable device 100 may include a housing 200, at least two electronic modules 300, and a sealing body 400.

[0032] The housing 200 may be annular, with an internal accommodating cavity 210. The housing 200 may be made of a metallic material (such as stainless steel, aluminum alloy, or titanium alloy), a ceramic material, or an engineering plastic. The housing 200 may be a closed, complete annular shape, or a discontinuous annular shape with an opening (such as a C-shape or a U-shape).

[0033] In some embodiments, the housing 200 has an opening and a discontinuous annular structure, through which the user can wear the device. The housing 200 can switch between a closed state and an open state; in the open state, it can be slipped onto the user's finger, and after wearing, it switches to the closed state to maintain a snug fit. The housing 200 can be made of a flexible metallic material, and the user can manually switch between the two states by applying force. For example, the housing 200 includes a two-way memory alloy material, the phase transition temperature of which is configured to be close to human body temperature (e.g., 32°C to 35°C). In the wearing state, the housing 200 automatically closes to the closed state due to body temperature, and in the removal state, the housing 200 automatically switches to the open state due to the drop in ambient temperature, making wearing and removing the device more convenient.

[0034] See Figure 1 As shown, at least two electronic modules 300 are spaced apart within the accommodating cavity 210. Each electronic module 300 includes a power module 310 and a circuit module 320. The power module 310 is a unit used to store electrical energy and supply power to other electronic modules 300, such as a lithium polymer battery, lithium-ion battery, solid-state battery, or supercapacitor. The circuit module 320 is a circuit board assembly housing electronic components such as a processor, memory, wireless communication chip, charging management chip, sensors, and their peripheral circuits. The circuit board can be a rigid printed circuit board (PCB), a flexible printed circuit board (FPC), or a rigid-flex board. The electronic modules 300 can be electrically connected to each other via wires, flexible connectors (such as FPC connectors), or board-to-board connectors.

[0035] A sealing body 400 fills the receiving cavity 210 to encapsulate and fix each electronic module 300 within the housing 200. The sealing body 400 can be made of at least one of epoxy resin, polyurethane, silicone, or thermoplastic polyurethane (TPU). Before curing, the sealing body 400 is a flowable liquid or paste material, filled into the receiving cavity 210 by pouring, and cured by heating or room temperature to form a solid sealing body 400. The sealing body 400 mechanically fixes the electronic modules 300 within the housing 200, reducing displacement under vibration or impact. It also isolates the electronic modules 300 from external moisture, dust, sweat, etc., providing waterproof and dustproof encapsulation protection. Furthermore, the insulating properties of the sealing body 400 itself reduce electrical short circuits between electronic modules 300 or between electronic modules 300 and the housing 200.

[0036] It is worth mentioning that, see Figure 1 As shown, at least one buffer cavity 410 is formed inside the sealing body 400. The buffer cavity 410 is the space inside the sealing body 400 that is not filled with sealing material, and the buffer cavity 410 is located between two adjacent electronic modules 300, and / or between the electronic module 300 and the inner wall of the housing 200, so as to absorb the stress acting on the electronic module 300.

[0037] It should be noted that the buffer cavity 410 is a closed or semi-closed space filled with gas (which can be air or an inert gas) without being filled with sealing material. Since the bulk elastic modulus of gas is much lower than that of solid sealing material, when the electronic module 300 is subjected to stress due to battery expansion, external impact, or thermal expansion, the gaseous cavity can provide the electronic module 300 with deformation displacement space at the micrometer to millimeter level through volume compression. The stress is released or attenuated through the volume change of the cavity, thereby reducing the direct stress acting on the electronic module 300 body and its vulnerable parts such as solder joints.

[0038] In addition, since the buffering capacity of the gas cavity comes from the compressibility of the gas, a large buffering stroke can be obtained in a very small space, making it more suitable for application scenarios where the internal space of the smart wearable device 100 is extremely small.

[0039] In some examples, the number of buffer cavities 410 is at least two, forming a distributed layout. At least one buffer cavity 410 is located between the power module 310 and the circuit module 320, and at least another buffer cavity 410 is located between the circuit module 320 and the inner wall of the housing 200 or between the power module 310 and the inner wall of the housing 200.

[0040] For example, a first buffer cavity 410 is reserved between the power module 310 and the circuit module 320, mainly to absorb the expansion stress generated during the charging and discharging cycles of the power module 310, while isolating the power module 310 and the circuit module 320 from heat conduction and thermal mismatch stress. A second buffer cavity 410 is reserved between the circuit module 320 and the inner wall of the housing 200, mainly to absorb drop impact and external extrusion stress. A third buffer cavity 410 is reserved between the power module 310 and the inner wall of the housing 200, providing additional expansion space for the power module 310. Through this distributed layout, different types of stress have different sources and transmission paths. Battery expansion stress mainly acts on the battery body and is transmitted towards adjacent devices, drop impact stress is mainly transmitted from the outside of the housing 200 inwards, and thermal stress is generated at the interface between devices due to the different heat generation and thermal expansion coefficients of each device. If only a single cavity is set, it is impossible to simultaneously meet the absorption needs of different directions and types of stress. By setting corresponding buffer cavities 410 on different stress transmission paths, stress absorption is partitioned and isolated. The design parameters of each cavity can be optimized independently to absorb the main stress types on its transmission path.

[0041] The distribution network of the buffer cavity 410 can adopt various forms to adapt to different stress management requirements.

[0042] In one example, the buffer cavity 410 is a multi-level radial network. Multiple nested cavities are formed along the radial direction of the housing 200. For instance, the innermost layer is a first annular cavity layer between the electronic module 300 and the inner surface of the sealing body 400; the middle layer is a second annular cavity layer between the power module 310 and the circuit module 320; and the outermost layer is a third annular cavity layer between the circuit module 320 and the inner wall of the housing 200. These three cavities form an inner-middle-outer three-level buffer system in the radial direction. When the finger side is squeezed, the first annular cavity layer preferentially absorbs the radially inward squeezing force; when mutual thrust stress occurs between devices due to thermal expansion or battery expansion, the second annular cavity layer provides release space; when the housing 200 is subjected to a drop impact, the third annular cavity layer absorbs the impact energy from the outside in. Each of the three cavities performs its specific function and can also achieve pressure series release through micro-channels, forming a complete buffer chain.

[0043] In another example, the buffer cavity 410 is independently arranged. The cavity is divided into multiple independent buffer islands along the circumference of the housing 200, each corresponding to a major heat-generating or vulnerable component. For example, the power module 310 (battery) has two lateral expansion absorption islands on its sides and one thermal expansion release island at its bottom. The islands are separated by narrow solid walls of the sealing body 400. In this way, when stress concentration occurs in a certain area (such as the battery), the stress is confined within the cavity corresponding to that island and is not transmitted to adjacent areas through the sealing body 400, thus protecting the adjacent circuit module 320 from impact. The presence of the solid walls also provides structural support, preventing the overall strength of the sealing body 400 from decreasing due to excessive cavities.

[0044] In another example, the buffer cavity 410 is gradient-distributed. The volumetric density of the cavity (i.e., the proportion of cavity volume per unit volume) varies gradient along the circumference or radial direction of the housing 200. Areas with dense solder joints are most sensitive to stress; even minor stress concentrations can lead to solder joint cracking or detachment. Therefore, a higher cavity density is needed to provide more adequate stress relief. Sensor modules, on the other hand, are typically smaller and have relatively simpler structures, with lower stress relief requirements, so a lower cavity density suffices. For example, in the dense solder joint area of ​​the circuit module 320 (i.e., the stress-sensitive area), the cavity volume ratio is 15% to 20%; in the power module 310 area, the cavity volume ratio is 10% to 15%; and in the sensor module area, the cavity volume ratio is 5% to 10%. This gradient distribution allows for the priority allocation of cavity resources to the most vulnerable points requiring protection while maximizing the use of limited internal space.

[0045] It is worth mentioning that the connection between each buffer cavity 410 can be implemented in the following two ways.

[0046] For example, see Figure 1 As shown, at least two buffer cavities 410 are not interconnected, and each cavity functions as an independent buffer unit. When a certain area is impacted, the impact stress is confined within that cavity and will not be transmitted to other areas. The fact that the buffer cavities 410 are not interconnected provides strong stress isolation capabilities, and the failure of one cavity area (such as overcompression leading to cavity collapse) does not affect the function of other cavities.

[0047] In another example, at least two buffer cavities 410 are partially interconnected through internal channels of the sealing body 400, forming a network of buffer cavities 410. The internal channels are microchannels with a diameter of 0.05 mm to 0.2 mm. The diameter of these microchannels is sufficient to allow air to flow under pressure, but insufficient for liquid sealing material to fill the channels due to capillary action during injection. Under normal conditions (no impact or slight vibration), each cavity operates independently; when a region experiences a severe impact causing a sharp increase in local pressure (e.g., the instantaneous pressure of hundreds of kilopascals in the power module 310 region due to the instantaneous expansion of the battery), air in the high-pressure area diffuses to adjacent cavities through the microchannels, achieving a dynamic response mechanism of pressure release and distributed absorption. This intelligent response characteristic of normal isolation and interconnection during impact allows the entire cavity network to exhibit distributed cooperative buffering capacity when facing severe local impacts, while maintaining independent stability of each region when facing minor daily vibrations.

[0048] In some embodiments, the sealing body 400 encapsulates each electronic module 300 into an independent module unit. That is, the power module 310 is enclosed by the sealing body 400 to form an independent module unit, the circuit module 320 is enclosed by the sealing body 400 to form another independent module unit, and so on. A buffer cavity 410 is provided between two adjacent module units, which physically separates the two module units, allowing them to move relative to each other within a certain range.

[0049] In some embodiments, at least one electronic module 300 may have an elastic wrapping layer (not shown) on its outer surface. The elastic wrapping layer is configured to space the electronic module 300 from the sealing body 400 so that the electronic module 300 can micro-move relative to the sealing body 400.

[0050] It is understandable that the micro-motion here refers to the micrometer-level elastic displacement of the electronic module 300 relative to the sealing body 400 when subjected to expansion stress, impact stress, or thermal stress. The displacement range can be from 10μm to 200μm. The sealing body 400 is a rigid or semi-rigid material, while the electronic module 300 is a rigid device. If the two are in direct contact, any slight deformation of the electronic module 300 will be rigidly constrained by the sealing body 400, resulting in stress concentration. The introduction of the elastic wrapping layer makes the connection between the electronic module 300 and the sealing body 400 no longer rigid, but a soft connection achieved through the deformable properties of the elastic wrapping layer.

[0051] Furthermore, due to the presence of the elastic wrapping layer, the electronic module 300 can achieve a near-floating effect within the sealed body 400. During the potting process, the electronic module 300 is first completely or partially covered by the elastic wrapping layer, and then the sealing material is injected. Although the cured sealed body 400 fills most of the space in the accommodating cavity 210, the presence of the elastic wrapping layer prevents the electronic module 300 from directly contacting the sealed body 400. Necessary mechanical positioning is only transmitted through weak point or line contact between the elastic wrapping layer and the sealed body 400. This floating arrangement grants the electronic module 300 a degree of freedom of movement in three-dimensional space while ensuring that it does not undergo significant displacement during normal wear.

[0052] In some embodiments, the thickness of the elastic wrapping layer can be from 0.2 mm to 0.5 mm, for example, 0.2 mm, 0.3 mm, 0.4 mm or 0.5 mm.

[0053] Understandably, when the thickness is less than 0.2mm, the elastic layer has insufficient deformation when subjected to a drop impact, and cannot effectively buffer the impact. Most of the impact energy is still rigidly transmitted to the electronic module 300. When the thickness is greater than 0.5mm, the elastic layer occupies too much radial space of the accommodating cavity 210, resulting in an increase in the overall wall thickness of the ring, which affects wearing comfort and appearance.

[0054] In some embodiments, the elastic wrapping layer is made of at least one of silicone, thermoplastic polyurethane (TPU), fluororubber, or polyborosiloxane. The selection of different materials depends on the target application scenario and performance requirements of the product. Silicone has a Shore hardness range of A30 to A70 and an elastic modulus range of 1 MPa to 10 MPa, exhibiting good biocompatibility and low cost, making it suitable for mass-produced consumer products. Thermoplastic polyurethane has an adjustable elastic modulus range of 5 MPa to 100 MPa, excellent abrasion resistance, and is oil and sweat resistant, making it suitable for rings used in sports settings. Fluororubber has a long-term operating temperature up to 200°C and excellent chemical corrosion resistance, making it suitable for extreme environments such as high temperature and humidity or contact with chemicals. Polyborosiloxane has excellent temperature stability (-60°C to 250°C) and excellent elastic recovery (compression set less than 5%), making it suitable for wide-temperature-range applications, such as outdoor use in northern winters.

[0055] In other embodiments, the elastic wrapping layer can also be made of smart materials such as foamed silicone or shear-thickening gel. Foamed silicone contains a large number of micron-sized closed-cell bubbles, with bubble diameters ranging from 10 μm to 100 μm and a volume percentage of 20% to 40%. These closed-cell bubbles constitute distributed buffer cavities 410 at the microscale, enabling the elastic wrapping layer to provide elastic wrapping while also possessing a certain stress absorption capacity, forming a double-layer buffer system. Shear-thickening gel has unique rate-dependent response characteristics: under normal wear or slow deformation, the material remains soft with an elastic modulus below 100 kPa, providing a comfortable wearing experience; upon high-speed impact such as a drop, the material instantly hardens due to the shear-thickening effect, with the elastic modulus jumping to over 10 MPa, dispersing the impact energy over a larger area, forming intelligent responsive buffer protection.

[0056] In some embodiments, a first buffer layer (not shown in the figure) is attached to the surface of the power module 310 facing the circuit module 320, and a second buffer layer (not shown in the figure) is attached to the surface facing away from the circuit module 320. The power module 310 is clamped and fixed to the circuit module 320 by the first and second buffer layers. The first and second buffer layers can be made of foam (such as PU foam, microporous polyurethane foam) or silicone pads, with a thickness of 0.1 mm to 0.3 mm, for example, 0.1 mm, 0.2 mm or 0.3 mm. This configuration forms a two-stage buffer system of buffer layers and buffer cavities 410. In the first stage, the buffer layer directly attached to the surface of the power module 310 provides initial buffering, absorbing the small deformation of the power module 310 during normal slight expansion or small vibrations. In the second stage, when the power module 310 undergoes a large expansion that exceeds the absorption capacity of the buffer layer, the buffer cavity 410 continues to absorb the deformation, providing a larger deformation accommodation space. The two-stage design allows for a reduction in the overall thickness of the buffer structure without sacrificing buffering capacity.

[0057] In some embodiments, the sealing body 400 only fills a portion of the accommodating cavity 210, and the sealing body 400 forms a clearance structure in the space corresponding to the buffer cavity 410, so that the buffer cavity 410 is jointly enclosed by the sealing body 400 and the electronic module 300 or the sealing body 400. That is to say, the buffer cavity 410 is not formed by removing material from the cured sealing body 400 through post-processing (such as mechanical drilling or laser cutting), but rather by pre-occupying the target cavity space through process means during the injection of sealing material, so that the sealing material naturally avoids the space, and the space directly constitutes the cavity after curing.

[0058] Understandably, by pre-occupying the target cavity space, not only can damage to the interface between the seal 400 and the electronic module 300 caused by machining be reduced, but the cavity inner wall is also smooth, without machining marks, and the stress distribution is uniform. Furthermore, the cavity shape is not limited by the geometry of drilling or cutting tools, allowing for the fabrication of arbitrarily complex three-dimensional cavities, such as curved streamlined shapes and gradually changing cross-sections, providing greater design freedom for optimizing buffer performance.

[0059] In some other embodiments, at least one buffer cavity 410 is provided with an elastic structural member (not shown). The elastic structural member is configured to elastically deform to absorb energy when the buffer cavity 410 is compressed and deformed, and to return to its original shape after the pressure is released.

[0060] It is worth mentioning that before injecting the sealing material into the accommodating cavity 210, the elastic structural component is pre-embedded in a predetermined position within the accommodating cavity 210. During the injection of the sealing material, the elastic structural component occupies at least a portion of the target cavity, acting as a physical barrier to prevent the sealing material from flowing into the space. Simultaneously, after the sealant 400 has cured, the elastic structural component remains in place, forming a buffer elastic structural component within the buffer cavity 410. With this configuration, the elastic structural component can act as a occupant barrier during the injection stage, preventing the sealing material from entering the target cavity area and ensuring the cavity forms naturally after curing. Furthermore, during the finished product usage stage, it can act as an elastic response element, undergoing elastic deformation to absorb energy when the cavity is under pressure and returning to its original shape after the pressure is released. This design eliminates the need for a separate soluble core mold or detachable mold, simplifying the manufacturing process.

[0061] In some other embodiments, the elastic structural member can be an annular or arc-shaped elastomer extending circumferentially along the housing 200. In embodiments with an openable housing 200, the elastic structural member is disposed within a buffer cavity 410 between adjacent module units, and its cross-sectional dimensions gradually increase from the radially inner side to the radially outer side of the housing 200, i.e., the portion corresponding to the radially inner side has a smaller cross-sectional dimension, and the portion corresponding to the radially outer side has a larger cross-sectional dimension. The elastic structural member can be made of silicone, thermoplastic polyurethane, or foamed elastomer, and its cross-sectional shape can be wedge-shaped, trapezoidal, or stepped. The elastic structural member can be segmented circumferentially along the housing 200, with gaps between the segments or connected by flexible connecting bridges to accommodate the curvature of the housing 200.

[0062] The following section describes in detail the linkage mechanism between the elastic structural component and the buffer cavity 410 in conjunction with the opening and closing action of the housing 200.

[0063] See Figure 1As shown, in the normally worn closed state, adjacent module units abut against each other in the radially inner portion near the housing 200. This abutment means that the outer surfaces of the sealing bodies 400 of the two module units are in direct contact or indirectly contacted through an elastic wrapping layer in the radially inner region, serving a mutual positioning and support function. Simultaneously, since the module units do not abut against each other in the radially outer region, the buffer cavity 410 gradually increases in size from the inner to the outer side of the housing 200. Specifically, the cavity is narrowest (even zero, i.e., in the abutment state) on the inner side near the fingers, and widest on the outer side away from the fingers. This gradual structure provides a stable positioning reference for the module units on the inner side, ensuring that each module unit does not wobble or shift during wear; the larger cavity on the outer side provides buffer space for external impacts that may occur during daily wear.

[0064] See Figures 1 to 3 As shown, when the housing 200 switches from a closed state to an open state (i.e., the action of prying open when a user takes a ring off or puts it on), the curvature of the housing 200 changes. Adjacent module units that were originally in contact with each other on the radially inner side are forced to separate, meaning the contact portion disengages. The size of the buffer cavity 410 between the two module units increases radially at all points. The cavity that was originally zero or close to zero on the inner side is expanded into a non-zero gap during the opening process, and the cavity that already existed on the outer side further expands. During this process, if the cavity contains the aforementioned elastic structural member, the portion of the elastic structural member corresponding to the radially inner side gradually releases from its compressed state due to the separation of the module units. The released elastic potential energy provides an auxiliary thrust for the separation of the module units, making the separation action smoother.

[0065] See Figures 3 to 1 As shown, when the shell 200 retracts from an open state to a closed state (e.g., the shape memory alloy automatically retracts due to body temperature), the contact portions of adjacent module units move closer together again and eventually re-establish contact. The buffer cavity 410 gradually shrinks radially, returning to its gradual shape from the inside to the outside in the closed state. During this retraction process, the inner cavity shrinks, and the module units move closer together on the inside. If the cavity is equipped with the aforementioned elastic structure, the portion of the elastic structure corresponding to the radially inner side is first gradually compressed by the module units during the retraction process, generating elastic resistance. This elastic resistance slows down the retraction speed of the inner portion of the module unit, preventing the two module units from colliding due to retraction inertia when they re-contact on the inside. As the retraction continues, the portion of the elastic structure corresponding to the radially outer side is also gradually compressed in the later stages of retraction, providing further damping and buffering. At the same time, the air in the buffer cavity 410 also generates a gas damping effect during the volume compression process. This effect works in conjunction with the elastic damping of the elastic structural component to ensure that the module unit is smoothly reset during the entire retraction process and will not be impacted by the retraction inertia.

[0066] In other words, regardless of whether the ring is closed, open, or in transition, at least one non-zero cavity area is always maintained between adjacent module units, and each electronic module 300 is always under full-posture buffer protection. In the closed state, the inner abutment provides positioning, and the outer cavity provides daily cushioning; in the open state, the inner abutment separates, and the cavity expands fully, providing dynamic avoidance during the wearing and removal process; in the transition state, the dual damping effect of the elastic structural component and the gas in the cavity provides flexible cushioning, reducing collisions between module units during separation or retraction.

[0067] It is understood that the elastic structural component can be one of the following: a micropillar array, a corrugated elastic membrane, an elastic microsphere filling, or a micro-spring. These various forms of elastic structural components can be combined as needed. For example, a combination of corrugated membrane and microspheres: elastic microsphere layers are sandwiched between multiple layers of corrugated membrane; the membrane provides structural restoring force and high resilience, while the microspheres provide damping and disperse concentrated loads. Another example is a combination of spring and damping fluid: the cavity is filled with high-viscosity silicone oil (kinematic viscosity of 100 cSt to 1000 cSt), and micro-springs are installed simultaneously; the springs provide elastic restoring force, and the silicone oil provides viscous damping.

[0068] See Figure 4 As shown, this application embodiment also provides a method for manufacturing a wearable device 100, namely, forming a buffer cavity 410 by means of a removable spacer structure.

[0069] First, at least two electronic modules 300 are spaced apart within the accommodating cavity 210 of the annular housing 200. The at least two electronic modules 300 include a power supply module 310 and a circuit module 320. The electronic modules 300 can be inserted after the housing 200 is formed, or they can be pre-embedded during the forming process of the housing 200.

[0070] Then, sealing material is poured into the accommodating cavity 210 and cured to form a sealed body 400. Prior to pouring the sealing material, a pre-set removable spacer occupies a predetermined space, such that the cured sealed body 400 forms at least one buffer cavity 410 within the predetermined space. The buffer cavity 410 is located between two adjacent electronic modules 300, and / or between the electronic module 300 and the inner wall of the housing 200.

[0071] The removable spacer structure is at least one of a soluble mandrel, a detachable mold, or a compressible elastic microsphere. The specific process steps for each of the three spacer structure schemes are detailed below.

[0072] Soluble core mold method: Before potting, it is precisely placed in the target position. When the sealing material is poured, it is blocked by the core mold and naturally avoids it. After curing, the core mold is dissolved and removed, and the space originally occupied by the core mold is transformed into a buffer cavity 410 in situ.

[0073] The specific steps are as follows: Step 1: Core mold preparation. A soluble core mold is prepared using 3D printing (such as photopolymer 3D printing or fused deposition modeling) or micro-injection molding. 3D printing can create complex cavity shapes that are impossible to achieve with traditional machining, such as curved streamlines and variable cross-sections.

[0074] Step Two: Core Mold Positioning and Fixing. Temporarily fix the soluble core mold to the target cavity area. The positioning method depends on the core mold size and shape: For core molds larger than 1mm, elastic clamps can be used to hold the edges of the core mold, and the clamps can be fixed to the housing 200 or the electronic module 300; for micro-core molds smaller than 1mm, a biocompatible adhesive (such as soluble polyvinyl alcohol glue) can be applied to the surface of the electronic module 300 or the inner wall of the housing 200.

[0075] Step 3: Inject sealing material. Inject liquid sealing material (such as epoxy resin, polyurethane, or silicone) into the accommodating cavity 210. The sealing material is naturally blocked by the mandrel and does not enter the space occupied by the mandrel.

[0076] Step 4: Curing the sealant. Curing should be performed according to the requirements of the sealant system. For example, epoxy resin systems typically cure at 60°C to 80°C for 2 to 4 hours, or at room temperature for 24 to 48 hours; silicone systems typically cure at room temperature for 12 to 24 hours. The optimal curing temperature and time should be chosen to avoid damaging the electronic module 300 and the core mold.

[0077] Step 5: Core Molding Dissolution. Immerse the cured component in a solvent to dissolve and remove the soluble core mold. When using a water-soluble polyvinyl alcohol core mold, the solvent is deionized water, and the dissolution temperature is 25°C to 60°C. For a polyvinyl alcohol core mold with a wall thickness of 0.5 mm, the complete dissolution time is approximately 30 to 90 minutes. When using an alkali-soluble acrylic resin core mold, the solvent is a weakly alkaline solution with a pH of 8 to 10, and the dissolution temperature is 25°C to 50°C. The complete dissolution time is approximately 20 to 60 minutes. The dissolution endpoint is determined by confirming the complete disappearance of the core mold through X-ray or ultrasonic testing.

[0078] Step Six: Post-treatment. The dissolved components require post-treatment to remove residual solvent. The method is as follows: vacuum dry at 40°C to 60°C and a vacuum degree of 10⁻¹ Pa to 10⁻² Pa for 4 to 8 hours, ensuring that there is no residual moisture on the inner wall of the cavity and inside the sealing body 400. After drying, seal the filling hole or solvent inlet / outlet channels, for example, using UV-curable adhesive.

[0079] Soluble core molds can manufacture cavities of any complex shape with extremely high morphological freedom. They are not constrained by traditional machining processes such as draft direction and tool accessibility, making them suitable for flexible production in small to medium batches. Cavity designs can be quickly switched by changing the core mold design.

[0080] The pre-formed mold method is a process solution based on the formation of cavities using a detachable mold. Its specific steps are as follows: First, a detachable multi-segment mold is designed and manufactured. The mold consists of 2 to 4 segments, which are precisely joined together by precision guide pillars and locating pins. The mold segments are equipped with raised structures that complement the shape of the target cavity; that is, the shape of the mold protrusions is the negative shape of the target cavity.

[0081] Then, the electronic module 300 is positioned inside the mold. The electronic module 300 can be fixed in a preset position inside the mold via a slot, positioning pin, or vacuum adsorption. After the mold is closed, the mold protrusion occupies the target cavity space, meaning that the sealing material is blocked by the mold protrusion during injection and cannot fill the space.

[0082] Next, a sealing material is injected into the mold and allowed to cure. The injection and curing parameters are similar to those for the soluble core molding method.

[0083] Finally, demolding is performed. The mold segments are separated along a predetermined direction (i.e., core pulling). After demolding, the space previously occupied by the mold protrusions forms the buffer cavity 410. Demolding can be assisted by a release agent (such as silicone oil spray) to reduce demolding resistance and minimize damage to the seal 400 during demolding. No post-processing steps are required after demolding.

[0084] Understandably, the mold is reusable, suitable for mass production, has high dimensional accuracy, and the cavity is formed immediately after demolding without waiting for dissolution, resulting in high production efficiency.

[0085] The spacer bead method involves pre-mixing compressible elastic microspheres into the sealing material, using the microspheres themselves as nanoscale occupant structures to directly form distributed microcavities.

[0086] The specific steps are as follows: First, select elastic microspheres with a diameter of 0.1 mm to 0.5 mm, made of foamed polyurethane or silicone rubber. The choice of microsphere diameter depends on the target cavity size: smaller diameters (0.1 mm to 0.2 mm) are suitable for forming a dense microcavity network, while larger diameters (0.3 mm to 0.5 mm) are suitable for forming discrete large cavities.

[0087] Then, the elastic microspheres are mixed into the uncured sealant at a volume ratio of 5% to 20%, and dispersed using a planetary mixer or twin-screw extruder to ensure that the microspheres are evenly distributed in the sealant without significant agglomeration. The stirring parameters (speed and time) need to be optimized according to the viscosity of the sealant to avoid over-stirring and causing the microspheres to break down.

[0088] Next, the sealing material mixed with elastic microspheres is poured into the accommodating cavity 210 and cured according to the requirements of the sealing material. During the pouring process, slight vibration (frequency 50Hz to 200Hz, amplitude 0.1mm to 0.5mm) is applied to the accommodating cavity 210 to help remove air bubbles introduced during the pouring process.

[0089] After curing, a large number of microspheres are embedded within the sealed body 400. Each microsphere itself is a tiny buffer cavity 410 (the interior of the microsphere is gas or low-density foamed material). The numerous microspheres form a foam-like distributed cavity network within the sealed body 400, with the spacing between the microspheres determined by the volume ratio during mixing. At a volume ratio of 5%, the average microsphere spacing is approximately 2 to 3 microsphere diameters, forming a sparse network; at a volume ratio of 20%, the average microsphere spacing is approximately 0.5 to 1 microsphere diameter, forming a dense network.

[0090] The spacer bead method is simple to implement, requiring no additional core-making, dissolution, or demolding processes, making it suitable for extremely high-volume production. The microsphere volume ratio is continuously adjustable, allowing for flexible adjustment of the network density according to the stress relief requirements of different products.

[0091] Understandably, the choice can be made flexibly based on the product's precision requirements, batch size, cavity morphology complexity, and production line configuration. In some implementations, two or three methods can be combined. For example, a soluble core mold method can be used for critical cavities requiring precise morphological control, while a spacer bead method can be used for general-purpose buffer zones requiring filling, in order to achieve the optimal balance between manufacturing efficiency and quality.

[0092] In summary, the wearable device 100 of this application has a buffer cavity 410 formed within the sealed body 400. When the electronic module 300 expands in volume due to battery charging and discharging cycles, the expansion stress can be released by squeezing the buffer cavity 410, reducing the stress directly acting on the sealed body 400 and causing cracking or damage. When the device is dropped or subjected to external impact, the impact energy is partially absorbed at the buffer cavity 410, reducing the rigid impact on the electronic module 300. When each electronic module 300 generates thermal stress due to different heat generation and thermal expansion coefficients, the buffer cavity 410 provides space for the small displacement of the electronic module 300, releasing thermal mismatch stress. Furthermore, by encapsulating each electronic module 300 into an independent module unit and setting a buffer cavity 410 between adjacent module units, the inner side provides positioning and the outer cavity provides buffering in the closed state. In the open state, the contact part separates and the cavity fully expands, ensuring that the module units never touch or squeeze each other during the device's insertion and removal, thus achieving full-position buffer protection. Simultaneously, this application employs a removable spacer structure to occupy a predetermined space before filling it with sealing material. After the seal 400 cures, the spacer structure is removed to form the buffer cavity 410. This allows the position, size, and shape of the buffer cavity 410 to be precisely preset according to the expansion amount and force direction of different electronic modules 300, reducing the risk of damage to the device caused by mechanical machining in related technologies. It also offers strong process compatibility and is suitable for mass production.

[0093] In the description of this specification, references to terms such as "some embodiments," "exemplarily," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0094] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A wearable device, characterized in that, include: The shell is annular, and the shell has an internal cavity. At least two electronic modules are disposed at intervals within the accommodating cavity, the at least two electronic modules including a power supply module and a circuit module; A sealing body is filled within the accommodating cavity to encapsulate each of the electronic modules within the housing; The sealed body includes at least one buffer cavity, which is the space in the sealed body that is not filled with sealing material. The buffer cavity is located between two adjacent electronic modules and / or between the electronic module and the inner wall of the housing, so as to absorb the stress acting on the electronic module.

2. The wearable device according to claim 1, characterized in that, The sealed body includes at least two buffer cavities, at least one of the buffer cavities is located between the power module and the circuit module, and at least another buffer cavity is located between the circuit module and the inner wall of the housing or between the power module and the inner wall of the housing.

3. The wearable device according to claim 2, characterized in that, At least two of the buffer cavities are not interconnected; or At least two of the buffer cavities are connected by internal channels of the seal to form a network of buffer cavities.

4. The wearable device according to claim 2, characterized in that, At least one of the electronic modules has an elastic wrapping layer on its outer surface, the elastic wrapping layer being configured to space the electronic module from the sealing body.

5. The wearable device according to claim 4, characterized in that, The thickness of the elastic wrapping layer is 0.2 mm to 0.5 mm.

6. The wearable device according to claim 4, characterized in that, The power module has a first buffer layer on its surface facing the circuit module and a second buffer layer on its surface away from the circuit module. The power module is clamped and fixed to the circuit module by the first buffer layer and the second buffer layer.

7. The wearable device according to claim 1, characterized in that, The housing has an opening and is capable of switching between a closed state and an open state; The sealing body encapsulates each of the electronic modules into an independent module unit, and a buffer cavity is provided between two adjacent module units; In the closed state, two adjacent module units abut against each other in the portion near the radially inner side of the housing, and the buffer cavity gradually increases in size from the inner side to the outer side along the radial direction of the housing; When the housing switches from the closed state to the open state, the abutting portions of two adjacent module units separate from each other, and the size of the buffer cavity increases radially at all points.

8. The wearable device according to claim 1, characterized in that, The sealing body fills a portion of the accommodating cavity, and the sealing body forms an avoidance structure in the space corresponding to the buffer cavity, so that the buffer cavity is jointly enclosed by the sealing body and the electronic module.

9. A method for manufacturing a wearable device, characterized in that, include: At least two electronic modules are spaced apart within the accommodating cavity of a ring-shaped housing, the at least two electronic modules including a power module and a circuit module; A sealing material is poured into the accommodating cavity and cured to form a sealed body; Before the sealing material is injected, a pre-set removable spacer occupies a predetermined space, so that the cured sealant forms at least one buffer cavity in the predetermined space. The buffer cavity is located between two adjacent electronic modules and / or between the electronic module and the inner wall of the housing.

10. The preparation method according to claim 9, characterized in that, The removable spacer structure is at least one of a soluble core mold, a detachable mold, or a compressible elastic microsphere.

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