A camera assembly of an endoscope, a processing technology and an endoscope

Abstract

The application provides an image pickup assembly of an endoscope, a processing technology and the endoscope. The image pickup assembly of the endoscope comprises an image acquisition assembly, an adapter and at least two conductive pieces. The image acquisition assembly has at least two welding points. The adapter has a positioning structure matched with the welding points. The positioning structure cooperates with the welding points to limit the movement of the adapter relative to the image acquisition assembly. The at least two conductive pieces are arranged on the adapter, and the conductive pieces are arranged one by one corresponding to the welding points. The corresponding conductive pieces and the welding points are electrically connected. The image pickup assembly of the endoscope can reduce the difficulty of welding the image pickup assembly and improve the reliability of welding.

Description

Technical Field

[0001] This application relates to the field of medical device technology, and in particular to an endoscope's camera component, manufacturing process, and endoscope. Background Technology

[0002] Endoscopes can be inserted into the stomach through the mouth or other natural orifices. They allow doctors to visualize lesions that X-rays cannot, assisting in diagnosis and treatment planning. However, the camera components of an endoscope are small, and during assembly, issues such as weak or inaccurate soldering can easily occur. Summary of the Invention

[0003] This application provides an endoscope camera component, a processing technology, and an endoscope, which can reduce the difficulty of welding the camera component and improve the reliability of the welding.

[0004] The technical solution of this application is implemented as follows: On one hand, this application provides an imaging component for an endoscope, which includes: an image acquisition component, an adapter, and at least two conductive components; wherein, the image acquisition component has at least two solder joints; the adapter has a positioning structure that matches the solder joints, and the positioning structure cooperates with the solder joints to restrict the movement of the adapter relative to the image acquisition component; at least two conductive components are disposed on the adapter, and the conductive components are disposed in a one-to-one correspondence with the solder joints, and the corresponding conductive components and solder joints are electrically connected.

[0005] The endoscope camera assembly provided in this application has at least two solder points, facilitating electrical connection between the image acquisition assembly and other components. Furthermore, the adapter has a positioning structure matching the solder points, allowing the solder points to act as positioning posts and engage with the positioning structure to constrain the adapter relative to the solder points in a defined position. Simultaneously, the adapter has conductive components corresponding to each solder point. After the adapter is constrained onto the image acquisition assembly by the positioning structure and solder points, the corresponding conductive components and solder points are positioned within a defined range, limiting their relative movement. This facilitates electrical connection between the corresponding conductive components and solder points, and further solidifies them into a single unit, increasing the area of ​​each solder point. Thus, when soldering the camera assembly's solder points to other components, the other components are soldered to the conductive components. Compared to directly soldering tiny solder points to other components, this reduces the difficulty of soldering the camera assembly and improves soldering reliability.

[0006] In some possible implementations of this application, the positioning structure includes positioning holes corresponding to the solder joints, and the positioning holes penetrate the adapter along the arrangement direction of the adapter and the image acquisition component.

[0007] In some possible implementations of this application, the positioning hole includes a connecting hole, which has a limiting part that matches each solder joint, and any two limiting parts are connected.

[0008] In some possible implementations of this application, the conductive element includes a first solder layer disposed on the adapter. Along the arrangement direction of the adapter and the image acquisition component, the first solder layer is disposed on the surface of the adapter facing away from the image acquisition component. There is a gap between two adjacent first solder layers. The first solder layer extends on the adapter to the edge of the positioning structure.

[0009] In some possible implementations of this application, at least two solder joints are arranged in an array, and the area where the at least two solder joints are located on the image acquisition component is a connection area; the first welding layer corresponding to a solder joint is located on the side of the adapter away from the center of the connection area of ​​a solder joint.

[0010] In some possible implementations of this application, the conductive component further includes a second welding layer disposed on the adapter. Along the arrangement direction of the adapter and the image acquisition component, the second welding layer is disposed on the surface of the adapter facing the image acquisition component. There is a gap between two adjacent second welding layers, and the second welding layer extends on the adapter to the edge of the positioning structure.

[0011] In some possible implementations of this application, the conductive element further includes a third welding layer disposed on the adapter, and the first welding layer and the second welding layer corresponding to the same welding point are electrically connected through the third welding layer.

[0012] In some possible implementations of this application, the adapter is adhesively and fixedly connected to the image acquisition component.

[0013] In some possible implementations of this application, along the arrangement direction of the adapter and the image acquisition component, the thickness of the adapter is less than or equal to the height of the solder joint.

[0014] On the other hand, this application provides an endoscope including: a handle, an insertion tube, and a camera assembly of the endoscope provided in any of the above; wherein the proximal end of the insertion tube is connected to the handle; the camera assembly is disposed at the distal end of the insertion tube, and a conductive element is electrically connected to a connector on the handle via a wire.

[0015] The endoscope provided in this application includes the imaging component of the endoscope provided in any of the above claims, which reduces the difficulty of soldering the imaging component and the wires and improves the reliability of the soldering.

[0016] Furthermore, this application provides a manufacturing process for an endoscope camera assembly. The manufacturing process is used to fabricate the camera assembly of the endoscope provided in any of the above-mentioned methods. The manufacturing process includes the following steps: acquiring the shape and position information of at least two solder points on the image acquisition assembly; based on the shape and position information, preparing a positioning structure on the adapter that matches the at least two solder points; having conductive elements corresponding to the solder points on the adapter; placing the adapter on the image acquisition assembly and cooperating the positioning structure with the solder points to restrict the movement of the adapter relative to the image acquisition assembly; and electrically connecting the corresponding solder points to the conductive elements.

[0017] The processing technology of the endoscope camera component provided in this application improves the matching degree between the positioning structure and the solder joints by fabricating a positioning structure on the adapter based on the shape and position information of at least two solder joints. This allows the adapter to be accurately positioned relative to the image acquisition component through the cooperation of the positioning structure and the solder joints, thereby ensuring that the corresponding conductive parts and solder joints are in relatively accurate positions. Furthermore, electrically connecting the corresponding solder joints to the conductive parts expands the area of ​​the solder joints, reducing the difficulty of welding the camera component and wires, and improving the reliability of the welding process.

[0018] In some possible implementations of this application, the positioning structure includes positioning holes corresponding to the solder joints, and the conductive component includes a first welding layer corresponding to each solder joint; placing the adapter in the image acquisition component specifically includes the following steps: fitting the adapter onto the solder joint through the positioning holes; welding the corresponding solder joint to the conductive component specifically includes the following steps: welding the corresponding solder joint to the first welding layer.

[0019] In some possible implementations of this application, the processing technology of the camera component of the endoscope further includes the following steps: injecting an adhesive between the adapter and the image acquisition component, and bonding and fixing the adapter and the image acquisition component together through the adhesive. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the imaging component of the endoscope provided in this application; Figure 2 This is a schematic diagram of the image acquisition component in the camera module of the endoscope provided in this application; Figure 3 This is a schematic diagram of the adapter structure in the camera assembly of the endoscope provided in this application. Figure 1 ; Figure 4 This is a schematic diagram of the adapter structure in the camera assembly of the endoscope provided in this application. Figure 2 ; Figure 5 This is a side view schematic diagram of the imaging component of the endoscope provided in this application; Figure 6 This is the process flow of the imaging component of the endoscope provided in this application. Figure 1 ; Figure 7 This is the process flow of the imaging component of the endoscope provided in this application. Figure 2 ; Figure 8 This is the process flow of the imaging component of the endoscope provided in this application. Figure 3 .

[0021] Explanation of reference numerals in the attached figures: 1-Image acquisition component; 11-Solder joint; 12-Boss; 13-Connection area; 2-Adapter; 21-Positioning structure; 211-Positioning hole; 212-Connecting hole; 3-Conductive component; 31-First welding layer; 32-Second welding layer; 33-Third welding layer; Z-Arrangement direction.

[0022] It should be noted that the terms "first" and "second" mentioned above are only used to distinguish between different options and do not represent the degree of superiority or inferiority of the options or their priority in the implementation process. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings. The described embodiments should not be regarded as limitations on this application. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0024] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0025] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0026] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0027] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0028] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0029] The camera module of an endoscope is typically located at the distal end of the endoscope's insertion tube. Wires are run through the insertion tube and soldered to the camera module to facilitate electrical connection between the camera module and the monitor. In related technologies, a flat soldering plate is provided for the camera module. The camera module is attached to one side of the soldering plate using a surface mount technology (SMT) process, and then the soldering plate is soldered to the wires. However, due to limitations of the SMT process, it is impossible to use fixtures to hold the tiny soldering plate, and the soldering plate is prone to misalignment during placement, leading to placement failure. Alternatively, the placement machine may not be able to align the soldering plate and the camera module during placement, causing the soldering plate to misalign and resulting in placement failure. If the various soldering plates are assembled into a single piece and then placed using the traditional method, the edges of the soldering plate need to be a certain distance from the camera module during cutting after soldering; otherwise, the camera module may be easily damaged. While increasing the size of the soldering plate makes soldering and cutting easier, it leads to insufficient assembly space for the endoscope. If the solder joints in the camera assembly are too close together, solder bridging is likely to occur during solder paste application and surface mounting. If solder paste is not applied, relying solely on the solder joints will result in weak adhesion between the camera assembly and the soldering board. Furthermore, surface mount technology (SMT) is expensive, impacting the production cost of the endoscope.

[0030] This application provides an endoscope camera assembly that reduces the difficulty of soldering the camera assembly and improves the reliability of the soldering. (Refer to...) Figure 1 , Figure 2 , Figure 3 and Figure 4 , Figure 1 This is a schematic diagram of the imaging component of the endoscope provided in this application. Figure 2 This is a schematic diagram of the image acquisition component in the camera module of the endoscope provided in this application. Figure 3 This is a schematic diagram of the adapter structure in the camera assembly of the endoscope provided in this application. Figure 1 , Figure 4 This is a schematic diagram of the adapter structure in the camera assembly of the endoscope provided in this application. Figure 2 The imaging component of the endoscope provided in the embodiments of this application will be described below with reference to the examples in the accompanying drawings.

[0031] The imaging component of the endoscope provided in this application embodiment includes: an image acquisition component 1, an adapter 2, and at least two conductive elements 3; wherein, the image acquisition component 1 has at least two solder joints 11; the adapter 2 has a positioning structure 21 that matches the solder joints 11, and the positioning structure 21 cooperates with the solder joints 11 to restrict the movement of the adapter 2 relative to the image acquisition component 1; at least two conductive elements 3 are disposed on the adapter 2, and the conductive elements 3 and solder joints 11 are disposed in a one-to-one correspondence, and the corresponding conductive elements 3 and solder joints 11 are electrically connected.

[0032] In some embodiments, the image acquisition component 1 can utilize the photoelectric conversion function of an optoelectronic device to convert the light image on the photosensitive surface into an electrical signal proportional to the light image, and then transmit the electrical signal to the display, thereby obtaining a visual image. For example, the image sensor in the image acquisition component 1 can be a photoconductive camera tube or a solid-state image sensor, and the solid-state image sensor can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS). An illumination element capable of generating light can be provided in the image acquisition component 1, such as a light-emitting diode. This application does not limit the specific type and category of the image acquisition component 1.

[0033] For example, such as Figure 2 As shown, multiple solder points 11 can be provided at one end of the image acquisition component 1, and each solder point 11 is electrically connected to a component within the image acquisition component 1. The number of solder points 11 can be set according to the number of components that need to be electrically connected. The solder point 11 may include the lead of the component and the soldering material attached to the lead. The soldering material may be tin-containing solder, and a spherical solder ball may be formed on the lead. For example, a boss 12 may be formed at one end of the image acquisition component 1, and multiple solder points 11 may be provided on the surface of the boss 12.

[0034] In some embodiments, the conductive element 3, which is electrically connected to the solder joint 11, can be placed near the solder joint 11 via the adapter 2. The shape of the adapter 2 can be set according to the shape of the boss 12 on the image acquisition component 1 and the distribution and shape of the solder joint 11. For example, the adapter 2 can be set as a thin sheet that matches the size and shape of the boss 12. The adapter 2 can be made of materials such as paper-based, glass fiber cloth-based, composite-based, or multilayer board-based.

[0035] For example, a positioning structure 21 matching the solder joint 11 can be provided on the adapter 2. For instance, the positioning structure 21 can be configured to fit all solder joints 11, or it can be configured to fit one or two solder joints 11. In this way, during the assembly of the camera assembly, the adapter 2 can be constrained to the image acquisition assembly 1 by the cooperation between the positioning structure 21 and the solder joint 11, so that the adapter 2 is in a fixed position relative to the solder joint 11 (preventing arbitrary relative movement).

[0036] In some embodiments, multiple conductive elements 3 can be provided on the adapter 2. The conductive elements 3 can be made of materials capable of transmitting current, such as copper or copper alloys. The position of each conductive element 3 on the adapter 2 can be determined according to the distribution of the multiple solder points 11, so that the multiple conductive elements 3 and the multiple solder points 11 can correspond one-to-one. That is, after the adapter 2 is set on the image acquisition component 1 through the cooperation of the positioning structure 21 and the solder points 11, there is a conductive element 3 adjacent to each solder point 11.

[0037] For example, copper plating can be formed on the adapter 2 through processes such as chemical deposition or mechanical pressing, and the copper plating can be chemically etched to form conductive elements 3 corresponding to each solder joint 11. After the adapter 2 is placed on the image acquisition component 1 through the cooperation of the positioning structure 21 and the solder joint 11, the corresponding conductive elements 3 can be electrically connected to the solder joint 11. For example, the conductive elements 3 can be pressed and connected to the solder joint 11 by a pressing process, or the conductive elements 3 can be connected to the solder joint 11 by ultrasonic welding or conductive adhesive bonding.

[0038] Another example, such as Figure 1 As shown, after the conductive component 3 is electrically connected to the corresponding solder joint 11, the conductive component 3 and the solder joint 11 are fixedly connected as one unit, and the area of ​​each solder joint 11 can be increased by the conductive component 3. During the process of soldering the wires that are electrically connected to the camera component to the solder joint 11, the wires can be soldered to the conductive component 3.

[0039] The endoscope camera assembly provided in this embodiment has at least two solder points 11 in the image acquisition component 1, which facilitates electrical connection of the image acquisition component 1 to other components via the solder points 11. Furthermore, the adapter 2 is provided with a positioning structure 21 that matches the solder points 11, allowing the solder points 11 to act as positioning posts in conjunction with the positioning structure 21, thereby fixing the adapter 2 relative to the solder points 11 in a defined position. Simultaneously, the adapter 2 is provided with conductive elements 3 corresponding to each solder point 11. After the adapter 2 is fixed to the image acquisition component 1 by the positioning structure 21 and the solder points 11, the corresponding conductive elements 3 and solder points 11 are positioned in a defined manner, and their relative movement is restricted. This facilitates electrical connection of the corresponding conductive elements 3 and solder points 11, thereby fixing the corresponding conductive elements 3 and solder points 11 as a single unit and increasing the area of ​​each solder point 11. In this way, when soldering the camera component's solder joint 11 to other components, the other components can be soldered to the conductive component 3. Compared to directly soldering the tiny solder joint 11 to other components, this reduces the difficulty of soldering the camera component and improves the reliability of the soldering.

[0040] In some possible embodiments of this application, such as Figure 1 and Figure 3 As shown, the positioning structure 21 includes a positioning hole 211 corresponding to the solder joint 11. The positioning hole 211 passes through the adapter 2 along the arrangement direction Z of the adapter 2 and the image acquisition component 1.

[0041] In some embodiments, the positioning structure 21 can be configured as a through-hole structure, that is, a positioning hole 211 corresponding to at least one solder joint 11 is provided on the adapter 2, and the positioning hole 211 can penetrate the adapter 2 along the thickness direction (parallel to the Z-direction of the arrangement direction). For example, if the image acquisition component 1 has two solder joints 11, two positioning holes 211 can be provided on the adapter 2, each positioning hole 211 corresponding to one solder joint 11. If the image acquisition component 1 has four solder joints 11, four positioning holes 211 can be provided on the adapter 2, each positioning hole 211 corresponding to one solder joint 11. If the image acquisition component 1 has six solder joints 11, six positioning holes 211 can be provided on the adapter 2, each positioning hole 211 corresponding to one solder joint 11. In this way, the adapter 2 can be fitted onto the solder joint 11 through the positioning hole 211, so that the positioning hole 211 and the solder joint 11 cooperate, thereby restricting the movement of the adapter 2 relative to the image acquisition component 1 in the direction of the vertical arrangement Z.

[0042] The imaging component of the endoscope provided in this application embodiment has a positioning structure 21 that includes a positioning hole 211 corresponding to the solder joint 11. The positioning hole 211 can be sleeved with the solder joint 11 to restrict the movement of the adapter 2 and the conductive component 3 relative to the solder joint 11. Furthermore, the positioning hole 211 has a simple structure and is easy to manufacture, which helps to reduce the manufacturing difficulty of the adapter 2.

[0043] In some possible embodiments of this application, such as Figure 1 , Figure 3 and Figure 4 As shown, the positioning hole 211 includes a connecting hole 212, which has a limiting part that matches each solder joint 11, and any two limiting parts are connected.

[0044] In some embodiments, the positioning hole 211 can be set as a large connecting hole 212, that is, a limiting through hole corresponding to each solder joint 11 is provided on the adapter 2, and the portion of the adapter 2 between all the limiting through holes is removed so that all the limiting through holes are connected. The portion forming the limiting through hole is the limiting part that matches each solder joint 11. For example, when the image acquisition component 1 has four solder joints 11, four circular limiting through holes can be provided on the adapter 2. The diameter of the circular limiting through holes is larger than the outer diameter of the solder joint 11, and the approximately "cross-shaped" portion between the four limiting through holes on the adapter 2 is removed so that any two of the four limiting parts are connected.

[0045] The imaging component of the endoscope provided in this embodiment includes a connecting hole 212 in the positioning hole 211. The connecting hole 212 has a limiting part that matches each solder joint 11, allowing all solder joints 11 to pass through the adapter 2 via their corresponding limiting parts. The movement of the adapter 2 relative to the solder joints 11 is restricted by the cooperation of the corresponding limiting parts with the solder joints 11. Furthermore, any two adjacent limiting parts are connected, which increases the area of ​​the connecting hole 212 on the adapter 2, facilitating the placement of other devices or objects between the adapter 2 and the image acquisition component 1 through the connecting hole 212.

[0046] In some possible embodiments of this application, such as Figure 1 and Figure 3 As shown, the conductive component 3 includes a first welding layer 31 disposed on the adapter 2. Along the Z-direction of the adapter 2 and the image acquisition component 1, the first welding layer 31 is disposed on the surface of the adapter 2 facing away from the image acquisition component 1. There is a gap between two adjacent first welding layers 31. The first welding layer 31 extends on the adapter 2 to the edge of the positioning structure 21.

[0047] In some embodiments, the first solder layer 31 can be configured as a thinner solder layer structure. For example, a copper layer can be provided on the surface of the adapter 2 on the side away from the image acquisition component 1 along the arrangement direction Z. The copper layer can be chemically etched or ground so that the complete copper layer is cut into multiple individual first solder layers 31, so that there is a gap between adjacent first solder layers 31.

[0048] For example, a connecting hole 212 can be formed on the adapter 2 by drilling. During the drilling process, the copper plating on the adapter 2 at the location of the connecting hole 212 can be removed, so that the first solder layer 31 can extend on the adapter 2 to the edge of the connecting hole 212.

[0049] The imaging component of the endoscope provided in this application embodiment includes a first welding layer 31 disposed on the adapter 2 on the side opposite to the image acquisition component 1. This first welding layer 31 can be electrically connected to the solder joint 11 by welding. Furthermore, the first welding layer 31 extends on the adapter 2 to the edge of the positioning structure 21, which shortens the distance between the corresponding first welding layer 31 and the solder joint 11, facilitating welding between them.

[0050] In some possible embodiments of this application, such as Figure 1 , Figure 2 and Figure 3 As shown, at least two solder points 11 are arranged in an array, and the area where the at least two solder points 11 are located on the image acquisition component 1 is the connection area 13; the first welding layer 31 corresponding to one solder point 11 is located on the side of the adapter 2 away from the center of the connection area 13 of the solder point 11.

[0051] In some embodiments, multiple solder points 11 can be arranged in an array on the image acquisition component 1. For example, if the image acquisition component 1 has four solder points 11, the four solder points 11 can be arranged in a two-row, two-column square array on the image acquisition component 1. If the image acquisition component 1 has six solder points 11, the six solder points 11 can be arranged in a two-row, three-column or three-row, two-column rectangular array on the image acquisition component 1. In this way, the area on the image acquisition component 1 where the multiple solder points 11 are located, and the area between any two adjacent solder points 11 on the image acquisition component 1, constitutes the connection area 13, such as... Figure 2 As shown, the connection area 13 can be the area indicated by the dashed box.

[0052] For example, such as Figure 1 and Figure 3As shown, the first welding layer 31 corresponding to a solder joint 11 can be disposed on the outside of the solder joint 11, that is, the first welding layer 31 is located on the side of the adapter 2 away from the center of the solder joint 11 and the connection area 13. For example, if the image acquisition component 1 has four solder joints 11, and the four solder joints 11 are arranged in a two-row, two-column square array on the image acquisition component 1, the adapter 2 can be set as a square, with the four limiting parts located on the diagonals of the square adapter 2, and the first welding layer 31 can be disposed at the four corners of the square adapter 2. In this way, the four first welding layers 31 are all located on the side of the corresponding solder joint 11 away from the center of the connection area 13.

[0053] The imaging component of the endoscope provided in this application embodiment has a first welding layer 31 corresponding to a solder joint 11 located on the side of the adapter 2 away from the center of the connection area 13 of the solder joint 11. The first welding layer 31 can be set in a larger area on the adapter 2 where the solder joint 11 is away from the center of the connection area 13, thereby increasing the area of ​​the first welding layer 31 and thus expanding the welding area.

[0054] In some possible embodiments of this application, such as Figure 4 As shown, the conductive component 3 also includes a second welding layer 32 disposed on the adapter 2. Along the Z-direction of the adapter 2 and the image acquisition component 1, the second welding layer 32 is disposed on the surface of the adapter 2 facing the image acquisition component 1. There is a gap between two adjacent second welding layers 32. The second welding layer 32 extends on the adapter 2 to the edge of the positioning structure 21.

[0055] In some embodiments, a second solder layer 32, which is another part of the conductive element 3, can be provided on the adapter 2. The second solder layer 32 can be configured as a thinner layer structure. For example, a copper layer can be provided on the surface of the adapter 2 facing the image acquisition component 1 along the Z-direction. The copper layer can be chemically etched or ground to cut the complete copper layer into multiple individual second solder layers 32, so that there are gaps between adjacent second solder layers 32.

[0056] For example, when setting the second solder layer 32, it is necessary to align one second solder layer 32 with one first solder layer 31, that is, the corresponding second solder layer 32 and the corresponding first solder layer 31 are aligned with the same solder joint 11. The second solder layer 32 can extend to the edge of the connecting hole 212 on the surface of the adapter 2 facing the image acquisition component 1. For example, the area of ​​the second solder layer 32 can be set to be smaller than the area of ​​the first solder layer 31, and the second solder layer 32 can surround a portion of the corresponding solder joint 11.

[0057] The imaging component of the endoscope provided in this embodiment includes a second welding layer 32 disposed on the adapter 2 facing the image acquisition component 1. This second welding layer 32 can be electrically connected to the solder joint 11 by welding, thereby increasing the welding area between the conductive component 3 and the solder joint 11 and improving the welding strength. Furthermore, the second welding layer 32 extends to the edge of the positioning structure 21 on the adapter 2, shortening the distance between the second welding layer 32 and the solder joint 11, facilitating welding between them.

[0058] In some possible embodiments of this application, such as Figure 4 As shown, the conductive component 3 also includes a third welding layer 33 disposed on the adapter 2, and the first welding layer 31 and the second welding layer 32 corresponding to the same solder point 11 are electrically connected through the third welding layer 33.

[0059] In some embodiments, a third welding layer 33, which serves as the third part of the conductive element 3, may be provided on the adapter 2. The third welding layer 33 may be configured as a thinner layer structure so that the corresponding first welding layer 31 and second welding layer 32 can be electrically connected through the third welding layer 33.

[0060] For example, a copper plating layer can be provided on the side wall of the connecting hole 212 on the adapter 2. The copper plating layer can be soldered to the corresponding first solder layer 31 and second solder layer 32 respectively, or the copper plating layer can be connected to the corresponding first solder layer 31 and second solder layer 32 respectively by mechanical contact, so that the corresponding first solder layer 31 and second solder layer 32 are connected through the third solder layer 33. In this way, the third solder layer 33 can abut against the circumferential surface of the solder joint 11, or be spaced apart from each other.

[0061] In another example, a copper plating layer can be provided on the circumferential sidewall of the adapter 2, and the copper plating on the circumferential sidewall can be extended to the positions where it connects with the second solder layer 32 and the first solder layer 31 on two opposite surfaces of the adapter 2, respectively. The copper plating layer can be electrically connected to the corresponding second solder layer 32 and the first solder layer 31 by means of welding, conductive adhesive bonding or other methods, so that the corresponding first solder layer 31 and the second solder layer 32 are connected through the third solder layer 33.

[0062] The endoscope camera assembly provided in this application embodiment includes a third welding layer 33 disposed on the adapter 2, which can electrically connect the corresponding second welding layer 32 and the first welding layer 31 through the third welding layer 33. This increases the area of ​​the conductive element 3 and the welding area between the conductive element 3 and the solder joint 11, thereby improving the welding strength between the conductive element 3 and the solder joint 11 and facilitating the welding of the conductive element 3 to other devices.

[0063] In some possible embodiments of this application, the adapter 2 is adhesively and fixedly connected to the image acquisition component 1.

[0064] In some embodiments, after the welding of the conductive component 3 and the solder joint 11 is completed, liquid adhesive can be applied between the adapter 2 and the image acquisition component 1. After the liquid adhesive has cured, the adapter 2 and the image acquisition component 1 can be bonded and fixed together.

[0065] For example, a second welding layer 32 is provided on the surface of the adapter 2 facing the image acquisition component 1. After the solder joint 11 is welded to the first welding layer 31 and the second welding layer 32, the second welding layer 32 is spaced between the adapter 2 and the boss 12 of the image acquisition component 1, creating a gap between the surface of the adapter 2 facing the image acquisition component 1 and the boss 12. Liquid adhesive can then be added to the connection area 13 of the image acquisition component 1, allowing the adhesive to flow into the gap between the adapter 2 and the boss 12. For example, a capillary structure can be provided in the area of ​​the surface of the adapter 2 facing the image acquisition component 1 where the second welding layer 32 is not provided, so that the adhesive can be guided to the depth of the gap between the adapter 2 and the boss 12 through the capillary structure. Alternatively, adhesive can be applied between the edge of the adapter 2 and the boss 12 to bond and fix the adapter 2 to the image acquisition component 1.

[0066] The endoscope camera component provided in this application embodiment can improve the connection strength between the adapter 2 and the image acquisition component 1 by bonding and fixing the adapter 2 and the image acquisition component 1 with adhesive, thereby reducing the risk of cracks between the conductive component 3 and the solder joint 11 due to vibration or other reasons.

[0067] In some possible embodiments of this application, reference is made to Figure 5 , Figure 5 This is a side view schematic diagram of the imaging component of the endoscope provided in this application. Along the Z-direction of the arrangement of the adapter 2 and the image acquisition component 1, the thickness of the adapter 2 is less than or equal to the height of the solder joint 11.

[0068] In some embodiments, the thickness of the adapter 2 and the thickness of the conductive element 3 can be set according to the height of the solder joint 11 along the Z-direction, or the height of the solder joint 11 along the Z-direction can be set according to the sum of the thickness of the adapter 2 and the thickness of the conductive element 3. For example, the height of the solder joint 11 can be set to be greater than or equal to the thickness of the adapter 2 along the Z-direction. In this way, after the adapter 2 is set on the image acquisition component 1 by the positioning structure 21, the solder joint 11 can protrude from the adapter 2 through the positioning structure 21 and be higher than the adapter 2.

[0069] The endoscope camera assembly provided in this application embodiment has a thickness of adapter 2 that is less than or equal to the height of solder joint 11. After the adapter 2 is placed on the image acquisition assembly 1, the solder joint 11 can protrude from the adapter 2 through the positioning structure 21, thereby facilitating the welding of the corresponding conductive component 3 to the solder joint 11.

[0070] In addition, this application embodiment also provides an endoscope, which includes: a handle, an insertion tube, and an imaging component of the endoscope provided in any of the above embodiments; wherein, the proximal end of the insertion tube is connected to the handle; the imaging component is disposed at the distal end of the insertion tube, and the conductive element 3 is electrically connected to the connector on the handle through a wire.

[0071] In some embodiments, the handle is used by the operator to hold and to manipulate the endoscope. The insertion tube can be inserted into the body and can be configured to include a curved section and an extension section. The extension section is located at the proximal end of the insertion tube, and the curved section is located at the distal end. By manipulating the handle, the curved section can be bent and deformed, thereby changing the direction of travel of the distal end of the insertion tube within the body. The proximal end of the extension section can be fixedly connected to the handle.

[0072] For example, the camera assembly can be fixed to the distal end of the curved section, and a wire can be threaded through the insertion tube, with the distal end of the wire soldered to the conductive element 3. A connector can be provided on the handle, and the proximal end of the wire soldered to the connector. In this way, the endoscope can be electrically connected to the display via the connector, allowing the image acquired by the camera assembly to be displayed on the display.

[0073] The endoscope provided in this application includes the camera component of the endoscope provided in any of the above embodiments. Therefore, the difficulty of soldering the camera component and the wires can be reduced, and the reliability of the soldering can be improved.

[0074] This application also provides a manufacturing process for an endoscope camera assembly, which is used to manufacture the camera assembly of the endoscope provided in any of the above embodiments. (Refer to...) Figure 6 , Figure 6 This is the process flow of the imaging component of the endoscope provided in this application. Figure 1 This processing technology can be achieved through steps S101 to S104, which will be explained below with reference to the steps shown in the figure.

[0075] S101. Obtain the shape and position information of at least two solder points on the image acquisition component.

[0076] In some embodiments, before setting the structure of the adapter 2 and the conductive element 3, it is necessary to determine the shape and position information of multiple solder points 11 on the image acquisition component 1, so as to set the positioning structure 21 and the conductive element 3 on the adapter 2 according to the shape and position information of the multiple solder points 11. The shape and position information may include the structural information of each solder point 11 and the relative position information of all solder points 11 on the image acquisition component 1, such as the diameter, height, and spacing between adjacent solder points 11.

[0077] S102. Based on the shape and position information, a positioning structure matching at least two solder joints is prepared on the adapter; the adapter has a conductive component corresponding to the solder joint.

[0078] In some embodiments, copper plating can be fabricated on two opposite surfaces along the Z-direction of the arrangement on the sheet-like adapter 2. Positioning structures 21 matching the solder joints 11 can be fabricated on the adapter 2 based on the determined shape and position information. For example, four limiting through holes can be drilled on the adapter 2, and then the "cross-shaped" portion between the four limiting through holes can be removed, thereby forming a positioning structure 21 matching each solder joint 11 on the adapter 2.

[0079] S103. Place the adapter on the image acquisition assembly and align the positioning structure with the solder joint to restrict the movement of the adapter relative to the image acquisition assembly.

[0080] In some embodiments, the image acquisition component 1 and the adapter 2 are relatively small and can be assembled under a microscope. The image acquisition component 1 can be fixed to a fixture first, and then the adapter 2 can be placed on the image acquisition component 1, with the positioning structure 21 aligning with the solder joints 11. For example, the adapter 2 can be fitted onto multiple solder joints 11 through a connecting hole 212 serving as the positioning structure 21, thereby restricting the movement of the adapter 2 relative to the image acquisition component 1 along the vertical alignment direction Z.

[0081] S104. Connect the corresponding solder joints to the conductive parts.

[0082] In some embodiments, after the adapter 2 and the image acquisition component 1 are positioned, the corresponding conductive parts 3 and solder joints 11 can be electrically connected. For example, the conductive parts 3 and solder joints 11 can be pressed together by a crimping process; the conductive parts 3 and solder joints 11 can also be welded by ultrasonic welding; or the conductive parts 3 and solder joints 11 can be connected by conductive adhesive bonding or other methods.

[0083] The processing technology of the endoscope camera component provided in this application embodiment improves the matching degree between the positioning structure 21 and the solder points 11 by fabricating a positioning structure 21 on the adapter 2 based on the shape and position information of at least two solder points 11. This allows the adapter 2 to be accurately positioned relative to the image acquisition component 1 through the cooperation of the positioning structure 21 and the solder points 11, thereby ensuring that the corresponding conductive component 3 and solder points 11 are in relatively accurate positions. Furthermore, electrically connecting the corresponding solder points 11 to the conductive component 3 expands the area of ​​the solder points 11 through the conductive component 3, reducing the difficulty of soldering the camera component and wires, and improving the reliability of the soldering.

[0084] Reference Figure 7 , Figure 7 This is the process flow of the imaging component of the endoscope provided in this application. Figure 2 The positioning structure 21 includes positioning holes 211 corresponding to the solder joints, and the conductive component includes a first welding layer corresponding to each solder joint. Figure 6 , Figure 6 Steps S103 and S104 can be implemented by S1031 and S1041 respectively.

[0085] S1031. The adapter is fitted onto the solder joint through the positioning hole.

[0086] In some embodiments, the positioning structure 21 can be configured as a through-hole structure, that is, a positioning hole 211 corresponding to at least one solder joint 11 is provided on the adapter 2, and the positioning hole 211 can penetrate the adapter 2 along the thickness direction (parallel to the Z-direction of the arrangement). Then the adapter 2 can be attached to the image acquisition component 1 along the Z-direction of the arrangement, so that the adapter 2 is fitted onto the solder joint 11 through the positioning hole 211.

[0087] S1041. Weld the corresponding solder joints to the first solder layer.

[0088] In some embodiments, the first solder layer 31 can be configured as a thinner solder layer structure. For example, a copper layer can be provided on the surface of the adapter 2 on the side opposite to the image acquisition component 1 along the arrangement direction Z. The copper layer can be chemically etched or ground so that the complete copper layer is cut into multiple individual first solder layers 31.

[0089] For example, in a microscopic apparatus, solder can be used to solder the first solder layer 31 to the corresponding solder point 11.

[0090] The processing technology of the endoscope camera component provided in this application embodiment, since the adapter 2 is sleeved on the solder joint 11 through the positioning hole 211, can not only use the solder joint 11 and the positioning hole 211 to achieve the positioning of the adapter 2 and the image acquisition component 1, but also allow the solder joint 11 to extend through the positioning hole 211 to the area adjacent to the first welding layer 31, thereby facilitating the welding of the first welding layer 31 and the solder joint 11 and reducing the difficulty of welding the first welding layer 31 and the solder joint 11.

[0091] Reference Figure 8 , Figure 8 This is the process flow of the imaging component of the endoscope provided in this application. Figure 3 .based on Figure 6 The manufacturing process of the camera component of the endoscope also includes step S105.

[0092] S105. Inject adhesive between the adapter and the image acquisition component, and use the adhesive to bond and fix the adapter and the image acquisition component together.

[0093] In some embodiments, after the welding of the conductive component 3 and the solder joint 11 is completed, liquid adhesive can be applied between the adapter 2 and the image acquisition component 1. After the liquid adhesive has cured, the adapter 2 and the image acquisition component 1 can be bonded and fixed together.

[0094] For example, liquid adhesive can be injected into the connection area 13 of the image acquisition component 1, allowing the adhesive to flow into the gap between the adapter 2 and the boss 12 on the image acquisition component 1. Alternatively, adhesive can be applied between the edge of the adapter 2 and the boss 12 to bond and fix the adapter 2 to the image acquisition component 1.

[0095] The processing technology of the camera component of the endoscope provided in this application embodiment can improve the connection strength between the adapter 2 and the image acquisition component 1 by bonding and fixing the adapter 2 and the image acquisition component 1 with an adhesive, thereby reducing the risk of cracks between the conductive component 3 and the solder joint 11 due to vibration and other reasons.

[0096] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Any modifications, equivalent substitutions, and improvements made within the spirit and scope of this application are included within the scope of protection of this application.

Claims

1. An imaging component for an endoscope, characterized in that, include: An image acquisition component having at least two solder joints; An adapter having a positioning structure that matches the solder joint, the positioning structure cooperating with the solder joint to restrict the movement of the adapter relative to the image acquisition component; At least two conductive elements are disposed on the adapter, and the conductive elements are disposed in a one-to-one correspondence with the solder joints, and the corresponding conductive elements and solder joints are electrically connected.

2. The imaging component of the endoscope according to claim 1, characterized in that, The positioning structure includes a positioning hole corresponding to the solder joint, and the positioning hole penetrates the adapter along the arrangement direction of the adapter and the image acquisition component.

3. The imaging component of the endoscope according to claim 2, characterized in that, The positioning hole includes a connecting hole, and the connecting hole has a limiting part that matches each of the solder joints, and any two of the limiting parts are connected.

4. The imaging component of the endoscope according to claim 1, characterized in that, The conductive component includes a first solder layer disposed on the adapter. Along the arrangement direction of the adapter and the image acquisition component, the first solder layer is disposed on the surface of the adapter facing away from the image acquisition component. There is a gap between two adjacent first solder layers. The first solder layer extends on the adapter to the edge of the positioning structure.

5. The imaging component of the endoscope according to claim 4, characterized in that, At least two of the solder joints are arranged in an array, and the area where the at least two solder joints are located on the image acquisition component is a connection area; the first welding layer corresponding to one of the solder joints is located on the side of the adapter that is away from the center of the connection area of ​​one of the solder joints.

6. The imaging component of the endoscope according to claim 4, characterized in that, The conductive component further includes a second welding layer disposed on the adapter. Along the arrangement direction of the adapter and the image acquisition component, the second welding layer is disposed on the surface of the adapter facing the image acquisition component. There is a gap between two adjacent second welding layers, and the second welding layer extends on the adapter to the edge of the positioning structure.

7. The imaging component of the endoscope according to claim 6, characterized in that, The conductive component further includes a third welding layer disposed on the adapter, and the first welding layer and the second welding layer corresponding to the same welding point are electrically connected through the third welding layer.

8. The imaging component of the endoscope according to any one of claims 1 to 7, characterized in that, The adapter is bonded and fixedly connected to the image acquisition component.

9. The imaging component of the endoscope according to any one of claims 1 to 7, characterized in that, Along the arrangement direction of the adapter and the image acquisition component, the thickness of the adapter is less than or equal to the height of the solder joint.

10. An endoscope, characterized in that, include: handle; An insertion tube, the proximal end of which is connected to the handle; The camera assembly of the endoscope according to any one of claims 1 to 9, wherein the camera assembly is disposed at the distal end of the insertion tube, and the conductive element is electrically connected to a connector on the handle via a wire.

11. A manufacturing process for an imaging component of an endoscope, characterized in that, The processing technology is used to manufacture the imaging component of the endoscope according to any one of claims 1 to 9, and the processing technology includes the following steps: Acquire the shape and position information of at least two solder joints on the image acquisition component; Based on the shape and position information, a positioning structure matching at least two of the solder joints is prepared on the adapter; the adapter has a conductive element corresponding to the solder joint; The adapter is placed on the image acquisition assembly, and the positioning structure is engaged with the solder joint to restrict the movement of the adapter relative to the image acquisition assembly. The corresponding solder joints are electrically connected to the conductive components.

12. The manufacturing process of the imaging component of the endoscope according to claim 11, characterized in that, The positioning structure includes positioning holes corresponding to the solder joints, and the conductive component includes a first welding layer corresponding to each of the solder joints. Placing the adapter in the image acquisition component specifically includes the following steps: The adapter is fitted onto the solder joint through the positioning hole; The corresponding solder joints are soldered to the conductive components, specifically including the following steps: The corresponding solder joints are then welded to the first solder layer.

13. The manufacturing process of the imaging component of the endoscope according to claim 11, characterized in that, It also includes the following steps: An adhesive is injected between the adapter and the image acquisition component to bond and fix the adapter and the image acquisition component together.

Images