A kind of adhesive mechanism for semiconductor packaging

Abstract

The application provides a kind of gluing mechanism for semiconductor packaging, belongs to the technical field of gluing mechanism.It includes mounting seat to be fixedly installed on the fixed table outside the mounting seat, the outside of fixed table is equipped with liftable movable table, the outside of movable table is fixedly installed with glue cylinder through lock head, the bottom end of glue cylinder is provided with glue head, the middle position of the outside of fixed table is provided with storage groove, and servo motor is fixedly installed in the storage groove.The application is driven by servo motor to deflect connecting rod and assembly equipped at the end, and cooperates with infrared sensor and liftable movable table, in standby state, connecting rod drives assembly to automatically deflect to the bottom of glue head, movable table is pressed down to make inserting rod and rubber seat close glue head bottom end outlet, realizes instant sealing of glue head during replacement of semiconductor substrate, effectively avoids residual glue to be exposed to air to form blocking film layer, and guarantees the gluing quality of mechanism.

Description

Technical Field

[0001] This invention relates to the field of adhesive coating mechanism technology, and in particular to an adhesive coating mechanism for semiconductor packaging. Background Technology

[0002] In semiconductor packaging processes, dispensing mechanisms are used to precisely apply epoxy resin, silver paste, or underfill adhesive to designated locations on chips or substrates. Among these, non-contact jet dispensing mechanisms are widely used in flip chip underfilling, wafer-level packaging, and wire bonding reinforcement due to their advantages of high frequency, micro-volume application, and high positioning accuracy. These mechanisms typically include a glue cylinder, valve body, nozzle, and piezoelectric or pneumatic drive components. By driving the valve core to reciprocate at high speed, the adhesive is ejected from the nozzle outlet in the form of droplets, achieving non-contact precision dispensing.

[0003] However, existing coating mechanisms still suffer from prominent nozzle clogging issues in actual continuous production. This manifests as a gradual decrease in adhesive output, missing adhesive dots, or spray direction deviation, sometimes leading to production shutdowns and requiring cleaning or nozzle replacement. The main causes of clogging are twofold: firstly, the micron-sized filler particles commonly found in encapsulating adhesives, such as silver powder and silicon dioxide, gradually deposit on the inner wall of the nozzle due to electrostatic adsorption or mechanical jamming during long-term spraying, forming a progressive buildup; secondly, during the dispensing interval when changing semiconductor substrates, residual adhesive at the nozzle tip is exposed to air, causing solvent evaporation and rapid drying and hardening, forming a clogging film. The root cause of these problems is that existing coating mechanisms lack online self-cleaning and anti-drying auxiliary structures for the nozzles, relying solely on periodic offline ultrasonic cleaning. This prevents automatic restoration of unobstructed flow without shutting down the system, affecting semiconductor packaging efficiency and causing poor coating quality during operation. Therefore, this application provides a coating mechanism for semiconductor packaging to meet these needs. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a coating mechanism for semiconductor packaging to solve the problems of frequent clogging of nozzles in existing coating mechanisms due to filler deposition and intermittent drying, which leads to the need for shutdown for cleaning and poor coating quality.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: A semiconductor packaging adhesive coating mechanism includes a mounting base for fixing a fixed platform outside the mounting base. A liftable movable platform is mounted outside the fixed platform. A glue tube is fixedly mounted outside the movable platform via a lock. An adhesive coating head is located at the bottom of the glue tube. A storage groove is formed in the middle of the fixed platform's exterior. A servo motor is fixedly mounted in the storage groove, and a connecting rod that can deflect around the drive shaft of the servo motor is sleeved in the storage groove. An infrared sensor electrically connected to the servo motor is fixedly mounted inside the fixed platform. A sealing component is mounted at the end of the connecting rod. The sealing component is used to seal the bottom of the adhesive coating head when the semiconductor packaging adhesive coating mechanism is in standby mode to replace the semiconductor to be packaged. A cleaning component is provided in the sealing component, which is used to clean the inner wall of the bottom of the adhesive coating head while the sealing component is separated from the bottom of the adhesive coating head.

[0006] Optionally, an electric telescopic rod is symmetrically installed on the fixed platform to drive the movable platform to move up and down. The bottom end of the telescopic part of the electric telescopic rod is fixedly connected to the outside of the movable platform through a connecting seat. A sliding groove adapted to the shape of the connecting seat is opened on the fixed platform, and the electric telescopic rod is fixedly installed in the sliding groove.

[0007] Optionally, the infrared sensor is located on the outside of the fixed platform near the top, corresponding to the highest point that the movable platform can be moved to.

[0008] Optionally, the movable platform and the lock head are fixedly connected by bolts. After the movable platform and the lock head are fixedly connected, the whole is C-shaped. The top of the movable platform and the outside of the lock head are provided with slots that match the external shape of the glue tube. The bottom of the movable platform is provided with a through hole that matches the size of the glue applicator.

[0009] Optionally, the sealing assembly includes a sealing box fitted at the end of the connecting rod, a rubber seat fixedly connected to the middle of the inner side of the sealing box, an insertion rod fixedly connected to the top of the rubber seat, and a tapered insertion head provided at the top of the insertion rod.

[0010] Optionally, the diameter of the insertion rod is smaller than the inner diameter of the outlet at the bottom of the glue applicator, and a bevel is provided at the connection between the rubber seat and the insertion rod, and the rubber seat is made of hard rubber.

[0011] Optionally, the end of the connecting rod is fixedly connected to a mounting bracket for accommodating the closed box. The mounting bracket is C-shaped, and inlet plates are fixedly connected to both ends of the opening of the mounting bracket. The distance between the inlet plates is less than the outer diameter of the closed box.

[0012] Optionally, positioning blocks are symmetrically installed on the inner side of the fixing frame, and positioning grooves that match the shape of the positioning blocks are opened on the outside of the closed box. A support plate corresponding to the bottom position of the closed box is fixedly connected to the outside of the fixing frame.

[0013] Optionally, the cleaning component includes a clearance area opened on the outside of the plug, on which uniformly distributed scrapers are fixedly connected. The uniformly distributed scrapers are umbrella-shaped, and an S-shaped deformation zone is fixedly connected between the middle of the scraper and the clearance area. The thickness of the deformation zone is less than the thickness of the scraper.

[0014] Optionally, the sum of the radius value of the avoidance area and the thickness values ​​of the scraper and the deformation area is less than the radius value of the insertion rod. The end of the scraper is provided with a protruding strip. The top of the closed box is fixedly connected with a partition. The diameter of the partition shrinks from top to bottom, forming a frustum structure that runs through the top and bottom.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: In the above solution, by setting a connecting rod driven by a servo motor and a sealing component assembled at the end, and in conjunction with an infrared sensor and a liftable movable platform, in the standby state, the connecting rod drives the sealing component to automatically deflect to directly below the dispensing head. The movable platform presses down to seal the bottom outlet of the dispensing head with the insertion rod and the rubber seat, realizing the instant sealing of the dispensing head during the replacement of semiconductor substrates. This effectively avoids residual glue being exposed to the air and forming a blocking film layer, ensuring the dispensing quality of the mechanism.

[0016] By designing a cleaning component consisting of an external clearance area for the insertion rod, an umbrella-shaped scraper, and an S-shaped deformation area, the scraper cleans the progressively accumulating area on the inner wall of the adhesive head twice as the sealing component is pressed down and lifted out during separation. The deformation area achieves automatic folding and restoration of the scraper through elastic deformation, realizing the synchronous linkage of sealing and cleaning actions, and removing accumulated impurities on the inner wall without additional power. This significantly extends the service life of the adhesive head and the glue cartridge, reduces the overall downtime frequency of the mechanism, and improves the working efficiency of the mechanism.

[0017] By symmetrically installing electric telescopic rods in the fixed platform and cooperating with the guide structure of the connecting seat and the slide, the lifting movement of the movable platform outside the fixed platform obtains stable and efficient guidance support. At the same time, the infrared sensor accurately detects the position of the movable platform and coordinates the working sequence of the electric telescopic rod and the servo motor, so that the switching between the glue application state and the standby state, the deflection and positioning of the sealing component, and the pressing and sealing action of the glue application head can all be automatically and continuously executed, realizing the automated and coordinated control of the entire process.

[0018] By detachably connecting the sealing box to the end of the connecting rod via a C-shaped fixing bracket, and utilizing the embedded fit of the positioning block and positioning groove, as well as the bottom support of the tray, combined with the guidance of the inlet plate and the elastic deformation and reset of the fixing bracket, the sealing box can be easily replaced. At the same time, a rigid rubber seat and an insertion head are set inside the sealing box, and a frustum-shaped partition is set on the top. This not only ensures the close sealing effect when pressed and closed, but also shields impurities and residual glue stored in the sealing box during the glue application process, avoiding secondary pollution of the packaging environment and further improving the functional reliability of the mechanism. Attached Figure Description

[0019] The accompanying drawings, which are incorporated herein and form part of the specification, illustrate embodiments of the invention and, together with the specification, further serve to explain the principles of the invention and enable those skilled in the art to practice and use the invention.

[0020] Figure 1 A three-dimensional structural diagram of a semiconductor packaging adhesive coating mechanism in standby mode; Figure 2 A three-dimensional structural diagram of a coating mechanism for semiconductor packaging in the coating state; Figure 3 A schematic diagram of the external structure of the fixing stage in the coating state of a coating mechanism for semiconductor packaging. Figure 4 for Figure 3 Enlarged structural diagram at point A in the middle; Figure 5 for Figure 3 Enlarged structural diagram at point B; Figure 6 This is a schematic diagram of the working structure of the movable platform and the electric telescopic rod in the glued state. Figure 7 A schematic diagram of the exploded structure of the movable platform, lock, and rubber tube; Figure 8 This is a schematic diagram of the servo motor, connecting rod, and glue applicator in standby mode. Figure 9 for Figure 8 Enlarged structural diagram at point C; Figure 10 This is a schematic diagram of the three-dimensional structure of the enclosed box and the fixing frame; Figure 11 This is a schematic diagram of a partial cross-sectional view of the enclosed box. Figure 12 A schematic diagram of the three-dimensional structure of the glue cartridge and the glue applicator; Figure 13 This is a magnified structural diagram of point D in section 12; Figure 14 A schematic diagram of the structure in which the insertion rod, clearance area, and scraper blade work together; Figure 15 for Figure 14 Enlarged structural diagram at point E in the middle.

[0021] Figure label: 1. Mounting base; 2. Fixed platform; 3. Movable platform; 4. Lock head; 5. Glue tube; 6. Infrared sensor; 7. Electric telescopic rod; 8. Slide groove; 9. Servo motor; 10. Connecting rod; 11. Storage slot; 12. Enclosed box; 13. Fixing frame; 14. Connecting base; 15. Glue applicator head; 16. Slot; 17. Through port; 18. Support plate; 19. Inlet plate; 20. Positioning block; 21. Positioning groove; 22. Insert rod; 23. Insert head; 24. Clearance area; 25. Scraper; 26. Rubber seat; 27. Partition plate; 28. Deformation area; 29. ​​Raised strip.

[0022] As shown in the figure, specific structures and devices are marked in the figure to clearly illustrate the structure of the embodiments of the present invention. However, this is only for illustrative purposes and is not intended to limit the present invention to this specific structure, device and environment. Those skilled in the art can adjust or modify these devices and environments according to specific needs. Detailed Implementation

[0023] The following is a detailed description of a coating mechanism for semiconductor packaging provided by the present invention, with reference to the accompanying drawings and specific embodiments. It should be noted that, to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and those skilled in the art can use other alternative methods to implement some known technologies; moreover, the accompanying drawings are only for more specific description of the embodiments and are not intended to specifically limit the present invention.

[0024] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0025] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0026] It is understood that the meanings of “on”, “above”, and “above” in this invention should be interpreted in the broadest manner, such that “on” means not only “directly on” something, but also includes the meaning of being “on” something with an intervening feature or layer, and that “above” or “above” means not only “on” something, but also includes the meaning of being “on” something without an intervening feature or layer.

[0027] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0028] like Figures 1 to 15 As shown, an embodiment of the present invention provides a coating mechanism for semiconductor packaging, including a mounting base 1 for fixing a fixed platform 2 outside the mounting base 1. A liftable movable platform 3 is mounted on the outside of the fixed platform 2. A glue tube 5 is fixedly mounted on the outside of the movable platform 3 by a lock head 4. A coating head 15 is provided at the bottom end of the glue tube 5. A storage groove 11 is opened in the middle of the outside of the fixed platform 2. A servo motor 9 is fixedly mounted in the storage groove 11, and a connecting rod 10 that can deflect around the drive shaft of the servo motor 9 is sleeved in the storage groove 11. An electrically connected component is fixedly mounted inside the fixed platform 2. The infrared sensor 6 and the end of the connecting rod 10 are equipped with a sealing component. The sealing component is used to seal the bottom of the coating head 15 when the semiconductor packaging coating mechanism is in standby mode to replace the semiconductor to be packaged. The sealing component is equipped with a cleaning component, which is used to clean the inner wall of the bottom of the coating head 15 while the sealing component is separated from the bottom of the coating head 15. The mounting base 1 is installed inside the semiconductor packaging coating equipment through a drive module. It can be moved horizontally and vertically under the action of the drive module to drive the external structure of the mounting base 1 to move inside the equipment and change the coating position.

[0029] The external structure of mounting base 1 has two states. The first is the adhesive application state, in which the sealing component is housed outside the fixed platform 2, avoiding interference with the movable platform 3. The movable platform 3 drives the glue cylinder 5 and the adhesive application head 15 to apply adhesive to the semiconductor substrate awaiting encapsulation, in conjunction with the drive module. The second state is the standby state. After completing the adhesive application for a batch of semiconductor substrates, when it's time to replace the entire semiconductor substrate, the sealing component activates. Driven by the servo motor 9, it follows the connecting rod 10 and deflects to directly below the adhesive application head 15. Then, the movable platform 3 drives the glue cylinder 5 and the adhesive application head 15 downwards, allowing the sealing component to seal the bottom of the adhesive application head 15. Simultaneously, the cleaning component is inserted into the adhesive application head 15 from its outlet to prevent the bottom of the adhesive application head 15 from being damaged. The residual colloid, when exposed to air, forms a blocking film layer, ensuring the quality of subsequent coating. After the semiconductor substrate is replaced, the entire mechanism switches back to the coating state. During this process, the movable stage 3 first lifts the glue cylinder 5 and the coating head 15, allowing the sealing component to separate from the bottom of the coating head 15. During separation, the sealing component brings out the cleaning component, and in this process, the cleaning component completes the scraping and cleaning of the inner wall of the coating head 15, removing the progressive buildup on the inner wall of the coating head 15, greatly extending the service life of the coating head 15 and the glue cylinder 5. The infrared sensor 6 is used to control the operation of the servo motor 9 to switch the overall working state of the mechanism. The above-mentioned drive module and infrared sensor 6 are existing technologies, and their installation methods and working principles are the same as existing technologies, so they will not be described in detail here.

[0030] In this embodiment, as Figures 2 to 7 As shown, an electric telescopic rod 7 for driving the movable platform 3 to move up and down is symmetrically installed in the fixed platform 2. The bottom end of the telescopic part of the electric telescopic rod 7 is fixedly connected to the outside of the movable platform 3 through a connecting seat 14. A sliding groove 8 adapted to the shape of the connecting seat 14 is provided on the fixed platform 2. The electric telescopic rod 7 is fixedly installed in the sliding groove 8. The infrared sensor 6 is located on the outside of the fixed platform 2 near the top, corresponding to the highest position that the movable platform 3 can move to. The setting of the connecting seat 14 and the sliding groove 8 can ensure the stability of the movable platform 3 during the movement outside the fixed platform 2, and ensure that the movable platform 3 can move stably along the guide of the sliding groove 8 and the connecting seat 14. The efficient movement of the movable platform 3 outside the fixed platform 2 is controlled by the electric telescopic rod 7. The electric telescopic rod 7 is also electrically connected to the infrared sensor 6, which can work with the infrared sensor 6 to detect the position of the movable platform 3 and control the movement of the movable platform 3 outside the fixed platform 2. This allows the movable platform 3 to work with the sealing component to seal the bottom of the glue applicator 15 in the standby state of the mechanism, or to wait for the sealing component to fold and store in the storage slot 11 in the glue applicator state before driving the movable platform 3, glue cylinder 5 and glue applicator 15 to descend to the working position. This ensures that the various structures of the glue applicator mechanism can work together stably and efficiently.

[0031] In this embodiment, as Figures 6 to 7 As shown, the movable platform 3 and the lock head 4 are fixedly connected by bolts. After the movable platform 3 and the lock head 4 are fixedly connected, the whole is C-shaped. The top of the movable platform 3 and the outside of the lock head 4 are provided with slots 16 that are adapted to the external shape of the glue tube 5. The bottom of the movable platform 3 is provided with a through hole 17 that is adapted to the size of the glue applicator 15. When the glue tube 5 is fixedly installed on the movable platform 3 and the lock head 4, the bottom end of the glue applicator 15 extends through the through hole 17 to the bottom of the movable platform 3. The structure formed by the movable platform 3 and the lock head 4 is used for the glue tube 5 and The fixed installation of the glue applicator 15 allows for disassembly of the glue tube 5 and the glue applicator 15 after aging, enabling them to be removed and replaced. The slot 16 allows the movable platform 3 and the locking head 4 to be spliced ​​together to form a surrounding clamp around the glue tube 5, which is fitted between the movable platform 3 and the locking head 4, thus fixing the glue tube 5. The through-hole 17 not only further reinforces the glue tube 5 and the glue applicator 15, but also ensures that the bottom end of the glue applicator 15 can pass through the bottom of the movable platform 3 to perform glue application on the semiconductor substrate.

[0032] In this embodiment, as Figures 2 to 11 As shown, the sealing assembly includes a sealing box 12 fitted at the end of the connecting rod 10. A rubber seat 26 is fixedly connected to the middle of the inner side of the sealing box 12. An insert rod 22 is fixedly connected to the top of the rubber seat 26. A tapered insert head 23 is provided at the top of the insert rod 22. The diameter of the insert rod 22 is smaller than the inner diameter of the bottom outlet of the glue applicator 15. An inclined surface is provided at the connection between the rubber seat 26 and the insert rod 22. The rubber seat 26 is made of hard rubber. When the sealing assembly seals the bottom of the glue applicator 15, the movable platform 3 drives the glue cylinder 5 and the glue applicator 15 to press down, so that the insert head 23 at the very top of the insert rod 22 is inserted from the bottom outlet of the glue applicator 15. The tapered insert head 23 has a smaller top area, which makes it easier to insert into the bottom outlet of the glue applicator 15. In this design, the diameter of the insertion rod 22 is designed to allow it to be smoothly inserted into the glue applicator head 15. After the insertion rod 22 is fully inserted into the glue applicator head 15, the rubber seat 26 contacts the bottom end of the glue applicator head 15, and the partition plate 27 also adheres to the outside of the bottom end of the glue applicator head 15, forming a comprehensive protection for the bottom end of the glue applicator head 15. At the same time, the hard rubber material of the rubber seat 26 gives it a certain deformation capability, allowing it to deform under the pressure from the glue applicator head 15 and fill the gap between the insertion rod 22 and the bottom end outlet of the glue applicator head 15, further ensuring the sealing effect on the bottom end of the glue applicator head 15. This effectively prevents the glue residue at the bottom end of the glue applicator head 15 from being directly exposed to the air and forming a clogging film, thus effectively improving the glue applicator quality of the entire mechanism.

[0033] In this embodiment, as Figures 8 to 10As shown, a fixing frame 13 for accommodating the closure box 12 is fixedly connected to the end of the connecting rod 10. The fixing frame 13 is C-shaped, and inlet plates 19 are fixedly connected to both ends of the opening of the fixing frame 13. The distance between the inlet plates 19 is less than the outer diameter of the closure box 12. Positioning blocks 20 are symmetrically installed on the inner side of the fixing frame 13. The outer side of the closure box 12 has positioning grooves 21 that match the shape of the positioning blocks 20. A support plate 18 corresponding to the bottom position of the closure box 12 is fixedly connected to the outer side of the fixing frame 13. The installation method of connecting the closure box 12 and the connecting rod 10 through the fixing frame 13 allows the closure box 12 to be replaced periodically. After a certain amount of residual glue accumulates inside the closure box 12 due to long-term use, it can be directly replaced to ensure the working effect of the sealing and cleaning components. The specific replacement frequency can be the same as the replacement frequency of the glue cartridge 5 and the glue applicator 15. Synchronization reduces equipment downtime. The C-shaped structure of the mounting bracket 13 facilitates the insertion of the sealing box 12. During insertion, the sealing box 12 can be squeezed from the inlet plate 19 toward the inside of the mounting bracket 13, causing the mounting bracket 13 to deform. During this process, the bottom of the sealing box 12 is kept in contact with the support plate 18, ensuring the accurate installation position of the sealing box 12. After the sealing box 12 is fully inserted into the mounting bracket 13, the mounting bracket 13 returns to its original position under its own elasticity, and the positioning block 20 on the inner wall of the mounting bracket 13 is embedded into the positioning groove 21 on the outside of the sealing box 12, thus fixing the sealing box 12. This design makes the replacement of the sealing box 12 simple and convenient. After installation, the mounting bracket 13 provides stable and reliable support for the sealing box 12, ensuring that the sealing component can stably complete the sealing work after being pressed down by the glue applicator 15.

[0034] In this embodiment, as Figures 8 to 15 As shown, the cleaning component includes a clearance area 24 formed outside the insertion rod 22. Uniformly distributed scraper blades 25 are fixedly connected to the clearance area 24. The uniformly distributed scraper blades 25 are umbrella-shaped, and an S-shaped deformation zone 28 is fixedly connected between the center of the scraper blades 25 and the clearance area 24. The thickness of the deformation zone 28 is less than the thickness of the scraper blades 25. The smaller thickness and weaker strength of the deformation zone 28 make it more prone to deformation under external force. The sum of the radius of the clearance area 24 and the thicknesses of the scraper blades 25 and the deformation zone 28 is less than the radius of the insertion rod 22. The scraper 25 has a protrusion 29 at its end, and a partition 27 is fixedly connected to the top of the sealed box 12. The diameter of the partition 27 narrows from top to bottom, forming a frustum structure that runs vertically through the box. The cleaning component enters the interior of the adhesive applicator 15 at the same time as the sealing component completes the sealing action on the bottom of the adhesive applicator 15. The clearance area 24 is provided so that the scraper 25 can be folded and stored after being squeezed by the inner wall or the outside of the adhesive applicator 15, so as to ensure that the insert rod 22 can drive the scraper 25 and the deformation area 28 to pass through the bottom outlet of the adhesive applicator 15.

[0035] Specifically, during the insertion of the insert rod 22 into the glue applicator head 15, the outer surface of the scraper 25 is compressed and deformed by the bottom of the glue applicator head 15, simultaneously compressing the deformation zone 28. This causes the scraper 25 and the deformation zone 28 to fold and be stored together in the clearance zone 24 on the insert rod 22 until the insert rod 22 is fully inserted into the glue applicator head 15. The elastic potential energy accumulated during the compression of the deformation zone 28 is released, causing the scraper 25 to unfold and return to its original position. This allows the end of the scraper 25 to contact the progressive accumulation area on the inner wall of the glue applicator head 15 and perform a scraping motion, removing the accumulated impurities from the inner wall of the glue applicator head 15. When the entire mechanism switches from standby to glue applicator mode, the sealing component separates from the bottom of the glue applicator head 15 to release the seal, and the insert rod 22 is also pulled out along with the sealing component. During the pulling process, the end of the scraper 25 performs a secondary scraping motion on the inner wall of the glue applicator head 15, cleaning the progressive accumulation area again. Impurities are removed, and the scraper 25 and deformation area 28 deform again, folding at the avoidance area 24, until the insertion rod 22 is completely pulled out of the dispensing head 15. The scraper 25 and deformation area 28 then return to their original shape. The design of the protrusion 29 can prevent the end of the scraper 25 from being too sharp and causing damage to the inner wall of the dispensing head 15. Part of the scraped impurities mixed with the glue is carried out when the insertion rod 22 is pulled out, and the other part is discharged by the glue cartridge 5 through the dispensing head 15 and stored in the sealed box 12 to maintain the purity of the glue in the dispensing head 15 that will be used for encapsulation. The partition 27 allows the sealed box 12 to act as a semi-closed container to store the impurities and residual glue discharged from the dispensing head 15. When the mechanism is in the dispensing state, it shields the impurities and glue stored in the sealed box 12 to prevent the glue and impurities from flowing out and causing pollution to the encapsulation environment, thus further improving the technical solution of the entire mechanism.

[0036] This invention encompasses any substitutions, modifications, equivalent methods, and solutions made within the spirit and scope of this invention. To provide the public with a thorough understanding of this invention, specific details are described in detail in the following preferred embodiments; however, those skilled in the art will fully understand the invention even without these details. Furthermore, to avoid unnecessary misunderstanding of the essence of this invention, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0037] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A semiconductor packaging adhesive coating mechanism, comprising a mounting base for fixing a fixed platform mounted outside the mounting base, characterized in that, The fixed platform is equipped with a liftable movable platform. A glue tube is fixedly installed on the outside of the movable platform by a lock. A glue applicator is provided at the bottom of the glue tube. A storage slot is opened in the middle of the outside of the fixed platform. A servo motor is fixedly installed in the storage slot. A connecting rod that can deflect around the drive shaft of the servo motor is also sleeved in the storage slot. An infrared sensor that is electrically connected to the servo motor is fixedly installed inside the fixed platform. The end of the connecting rod is equipped with a sealing component, which is used to seal the bottom of the dispensing head when the dispensing mechanism for semiconductor packaging is in standby mode to replace the semiconductor to be packaged. The sealing assembly includes a cleaning component, which is used to clean the inner wall of the bottom of the dispensing head while the sealing assembly separates from the bottom of the dispensing head.

2. The semiconductor packaging coating mechanism according to claim 1, characterized in that, The fixed platform is symmetrically equipped with electric telescopic rods that drive the movable platform to move up and down. The bottom end of the telescopic part of the electric telescopic rod is fixedly connected to the outside of the movable platform through a connecting seat. The fixed platform has a sliding groove that matches the shape of the connecting seat, and the electric telescopic rod is fixedly installed in the sliding groove.

3. The semiconductor packaging coating mechanism according to claim 2, characterized in that, The infrared sensor is located on the outside of the fixed platform near the top, corresponding to the highest point that the movable platform can be moved to.

4. The semiconductor packaging coating mechanism according to claim 1, characterized in that, The movable platform and the lock head are fixedly connected by bolts. After the movable platform and the lock head are fixedly connected, the whole is C-shaped. The top of the movable platform and the outside of the lock head are provided with slots that match the outer shape of the glue tube. The bottom of the movable platform is provided with a through hole that matches the size of the glue applicator.

5. The semiconductor packaging coating mechanism according to claim 1, characterized in that, The sealing assembly includes a sealing box fitted at the end of the connecting rod, a rubber seat fixedly connected to the middle of the inner side of the sealing box, an insertion rod fixedly connected to the top of the rubber seat, and a tapered insertion head provided at the top of the insertion rod.

6. The semiconductor packaging coating mechanism according to claim 5, characterized in that, The diameter of the insertion rod is smaller than the inner diameter of the outlet at the bottom of the glue applicator. The connection between the rubber seat and the insertion rod is provided with an inclined surface, and the rubber seat is made of hard rubber.

7. The semiconductor packaging coating mechanism according to claim 6, characterized in that, The end of the connecting rod is fixedly connected to a mounting bracket that accommodates the closed box. The mounting bracket is C-shaped, and inlet plates are fixedly connected to both ends of the opening of the mounting bracket. The distance between the inlet plates is less than the outer diameter of the closed box.

8. The coating mechanism for semiconductor packaging according to claim 7, characterized in that, The inner side of the fixing frame is symmetrically equipped with positioning blocks, and the outer side of the closed box is provided with positioning grooves that match the shape of the positioning blocks. The outer side of the fixing frame is fixedly connected with a support plate corresponding to the bottom position of the closed box.

9. The semiconductor packaging coating mechanism according to claim 5, characterized in that, The cleaning component includes a clearance area opened on the outside of the plug, on which uniformly distributed scrapers are fixedly connected. The uniformly distributed scrapers are umbrella-shaped, and an S-shaped deformation zone is fixedly connected between the middle of the scraper and the clearance area. The thickness of the deformation zone is less than the thickness of the scraper.

10. The coating mechanism for semiconductor packaging according to claim 9, characterized in that, The sum of the radius value of the avoidance area and the thickness values ​​of the scraper and the deformation area is less than the radius value of the insertion rod. The end of the scraper is provided with a protruding strip. The top of the closed box is fixedly connected with a partition. The diameter of the partition shrinks from top to bottom, forming a frustum structure that runs through the top and bottom.

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