Chip carrier cleaning apparatus

Abstract

The application belongs to the technical field of semiconductor manufacturing equipment and relates to a chip carrier cleaning device. The device comprises a bearing unit, a cleaning unit, an air supply unit and an image acquisition unit. The bearing unit is used for placing the chip carrier. The cleaning unit comprises a moving part and a nozzle. The moving part is used for driving the nozzle to move. The nozzle realizes cleaning of the chip carrier by spraying gas. The air supply unit is used for conveying the cleaned and impurity-removed cleaning gas to the nozzle. The image acquisition unit is used for acquiring image information of the chip carrier to obtain stain position data, contamination degree data and cleanliness data. The device accurately locks the stain coordinates with the aid of the image acquisition unit, drives the nozzle to realize point pneumatic cleaning in cooperation with the moving part, does not need manual removal of the carrier, greatly reduces material loss and manual risk, and effectively improves the cleaning efficiency of the chip carrier and the product yield.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, and more specifically to a chip carrier cleaning device. Background Technology

[0002] In the electrical testing process of semiconductor products, product carriers, as tools for carrying and transporting products, have contact points that are in constant contact with the products. This contact area easily accumulates dust, adhesive residue, and other impurities, which can cause surface defects and severely affect the product's appearance. The machine has a multi-layered, three-dimensional carrier storage area for storing multiple sets of product carriers. However, due to limitations in the original equipment structure, it is impossible to avoid the problem of impurity adhesion by changing the material and structure of the contact points.

[0003] Current processing methods require removing the product carrier entirely from the machine and manually cleaning the contact points. After cleaning, repeated application and verification with test samples matching the product's surface parameters are necessary. This entire process is cumbersome, consumes significant production time, and severely reduces production line efficiency. Manual application is also affected by variations in operator distance and technique, resulting in high consumption and low utilization of experimental consumables, leading to high production costs. Furthermore, some testing machines have multiple contact points of different sizes, and the limited space for manual cleaning of irregularly shaped or concealed contact points makes cleaning difficult and prone to incomplete cleaning. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a chip carrier cleaning device that accurately locks the coordinates of the stain through an image acquisition unit and drives the nozzle with a motion unit to achieve fixed-point pneumatic cleaning. This eliminates the need for manual removal of the carrier, significantly reduces material loss and human risk, and effectively improves the cleaning efficiency of the chip carrier and the product yield.

[0005] On the one hand, this application provides a chip carrier cleaning device, which is disposed in a semiconductor testing machine and includes a carrier unit, a cleaning unit, a ventilation unit and an image acquisition unit;

[0006] The carrier unit is used to place the chip carrier;

[0007] At least one of the cleaning units is disposed at a distance from each other on at least one side of the chip carrier, and includes a moving part and a nozzle;

[0008] The ventilation unit includes a ventilation pipe connected to the nozzle to provide clean gas to the nozzle.

[0009] The image acquisition unit is disposed on the nozzle and is used to acquire image information of the chip carrier. The moving part drives the nozzle to align with the chip carrier according to the image information, so as to clean the chip carrier by spraying cleaning gas.

[0010] In an optional embodiment, the moving part includes a rotating structure and a telescopic structure. The telescopic structure has a first end and a second end disposed opposite to each other. The first end is connected to the rotating structure, and the second end is connected to the nozzle. The rotating structure can drive the telescopic structure to rotate around the first end, and the telescopic structure can perform telescopic movement to move the nozzle closer to or away from the first end.

[0011] In an optional embodiment, the ventilation unit further includes a filter structure and a pressure regulation structure. The filter structure is disposed on the ventilation pipeline for purifying and removing impurities from the clean gas in the ventilation pipeline. The pressure regulation structure is connected to the ventilation pipeline for regulating the pressure in the ventilation pipeline.

[0012] In an optional embodiment, the chip carrier cleaning device further includes a control unit connected to the cleaning unit, the ventilation unit, and the image acquisition unit. The control unit is used to receive the image information acquired by the image acquisition unit and control the working state of the cleaning unit and the ventilation unit according to the image information.

[0013] In an optional embodiment, the control unit includes a motion control module, which is used to acquire stain location data in the chip carrier based on the received image information, and control the movement of the moving part in the cleaning unit based on the stain location data to adjust the orientation and position of the nozzle.

[0014] In an optional embodiment, the control unit further includes a cleaning control module, which is used to obtain cleanliness data of the chip carrier based on the received image information, and control the working state of the ventilation unit based on the cleanliness data.

[0015] Specifically, when the cleanliness data does not meet the preset threshold requirement, the cleaning control module controls the ventilation unit to operate in order to clean the chip carrier; when the cleanliness data meets the preset threshold requirement, the cleaning control module controls the ventilation unit to stop operating, and the cleaning ends.

[0016] In an optional embodiment, the control unit further includes a flow control module, and the ventilation unit is further provided with a flow control structure. The flow control module is used to obtain contamination data in the chip carrier based on the received image information, and to control the flow control structure to adjust the flow rate of the clean gas in the ventilation pipeline based on the contamination data.

[0017] In an optional embodiment, the chip carrier cleaning device further includes a detection unit for detecting the material placement status of the chip carrier, the material placement status including a loaded state and an empty state.

[0018] In an optional embodiment, the control unit is connected to the detection unit, the control unit receives the material placement status sent by the detection unit, and controls the working status of the ventilation unit according to the material placement status;

[0019] When the chip carrier is in a loaded state, the control unit controls the ventilation unit to stop operating; when the chip carrier is in an unloaded state, the control unit controls the ventilation unit to operate.

[0020] In an optional embodiment, the semiconductor testing machine is provided with a multi-layer three-dimensional carrier storage rack, which has multiple storage areas, and the chip carrier cleaning device is disposed in the storage area.

[0021] As described above, compared with the prior art, the chip carrier cleaning device provided in this application has at least the following beneficial effects:

[0022] This application uses an image acquisition unit to capture the target image in real time, accurately locate the stains, and avoid missed inspections by manual visual inspection; the motion unit extends and deflects at multiple angles based on the positioning data, and can reach into narrow and irregular spaces, overcoming the shortcomings of traditional cleaning heads that have limited angles and many blind spots; the device automatically completes positioning and fixed-point cleaning, eliminating the need for disassembly and manual wiping, shortening equipment downtime for maintenance, reducing damage to precision components, lowering consumable and labor costs, and effectively improving the cleaning stability of the carrier and the product yield. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1The diagram shown is a structural schematic of a chip carrier cleaning device provided in an embodiment of this application.

[0025] Figure 2 The diagram shown is a schematic representation of a chip carrier provided in an embodiment of this application.

[0026] Figure 3 The diagram shown is a structural schematic of a vehicle storage rack provided in an embodiment of this application.

[0027] In the diagram: 1. Bearing unit; 2. Cleaning unit; 21. Moving part; 211. Rotating structure; 212. Telescopic structure; 22. Nozzle; 3. Ventilation unit; 31. Pressure regulation structure; 32. Filtration structure; 33. Ventilation pipeline; 34. Flow control structure; 4. Image acquisition unit; 5. Control unit; 6. Detection unit; 02. Chip carrier; 03. Contact point; 04. Carrier temporary storage rack. Detailed Implementation

[0028] To make the technical objectives, technical solutions, and technical effects of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with embodiments. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of embodiments of this application is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this application, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0031] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly, for example, referring to both fixed connections and detachable connections. Furthermore, the descriptions using terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples" indicate that a specific feature, structure, material, or characteristic described in connection with an implementation or example is included in at least one implementation or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same implementation or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more implementations or examples.

[0032] To address the problems of high cleaning difficulty and incomplete cleaning in the existing technologies described above, this embodiment provides a chip carrier cleaning device, referring to... Figure 1 The device is installed inside a semiconductor testing machine and includes a support unit 1, a cleaning unit 2, a ventilation unit 3, and an image acquisition unit 4.

[0033] The carrier unit 1 is used to place the chip carrier 02;

[0034] At least one cleaning unit 2 is disposed at a distance from each other on at least one side of the chip carrier 02, and includes a moving part 21 and a nozzle 22;

[0035] Ventilation unit 3 includes ventilation pipe 33, which is connected to nozzle 22 to provide clean gas to nozzle 22;

[0036] The image acquisition unit 4 is mounted on the nozzle 22 and is used to acquire image information of the chip carrier 02. The motion unit 21 drives the nozzle 22 to align with the chip carrier 02 according to the image information, so as to clean the chip carrier 02 by spraying cleaning gas.

[0037] In practical applications, the image acquisition unit 4 can capture images of target locations in real time, accurately identify the location and area of ​​stains, and perform coordinate calculations based on visual positioning, replacing manual visual inspection. This results in higher positioning accuracy and a significantly reduced missed detection rate. The motion unit 21 can flexibly adjust its extension length and multi-angle deflection based on the position data from visual feedback, adapting to narrow and irregularly deep internal spaces of equipment. This overcomes the limitations of traditional fixed cleaning heads in terms of stroke and angle, achieving full-area, dead-angle-free, fixed-point cleaning.

[0038] The semiconductor testing machine is equipped with a temporary storage rack 04, as shown in the reference. Figure 3The carrier storage rack 04 has a multi-layer three-dimensional structure with multiple storage areas. In this embodiment, the chip carrier cleaning device is installed in each storage area. Each layer of the multi-layer storage area is independently equipped with a cleaning device, which can realize in-situ online cleaning of the chip carrier 02 without removing it from the rack, thus improving production efficiency; it avoids the risk of chip carrier 02 damage during manual operation, and can also collect data layer by layer and adapt the cleaning parameters of different chip carriers 02 as needed.

[0039] In one optional embodiment, the chip carrier cleaning device is independently installed and does not depend on any other structure or equipment, and is used to perform all-round cleaning of the chip carrier 02. The independently deployed cleaning device can be disassembled and repaired separately from the carrier temporary storage rack 04, and maintenance does not interfere with the normal feeding and storage of materials in the temporary storage area, ensuring continuous operation of the equipment; the parameters of the cleaning device can be adjusted individually to be specifically matched to the workpiece to be cleaned, resulting in higher cleaning accuracy; a fault only affects a single cleaning device, which facilitates disassembly and maintenance and reduces machine downtime losses.

[0040] In this embodiment, refer to Figure 2 The chip carrier 02 has contact points 03 that come into contact with the product. The cleaning unit 2 is located above the chip carrier 02 and is used to precisely clean the contact points 03 on the chip carrier 02. The cleaning unit 2 includes a moving part 21 and a nozzle 22. The moving part 21 is connected to the nozzle 22 to drive the nozzle 22 to move. The nozzle 22 is connected to a ventilation unit 3. The clean gas that has been purified and removed from impurities in the ventilation unit 3 is ejected through the nozzle 22, thereby cleaning the contact points 03 of the chip carrier 02.

[0041] The motion unit 21 can be one or more of the following: an axial motion combination structure of slider and guide rail, a combination structure of rotating part and telescopic part, or other suitable motion structure. It is used to drive the nozzle 22 to approach and align the contact point 03 on the chip carrier 02 to the maximum extent and to clean the stains on the surface of the contact point 03.

[0042] In this embodiment, the moving part 21 includes a rotating structure 211 and a telescopic structure 212. The rotating structure 211 is fixed to the upper surface inside the temporary storage area, and the lower part of the rotating structure 211 is connected to the telescopic structure 212. The lower part of the telescopic structure 212 is connected to the nozzle 22. The rotating structure 211 can drive the telescopic structure 212 and the nozzle 22 to rotate synchronously, and the telescopic structure 212 can drive the nozzle 22 to move along the axial direction of the telescopic structure 212. Specifically, the telescopic structure 212 has a first end and a second end that are arranged opposite to each other. The first end is connected to the rotating structure 211, and the second end is connected to the nozzle 22. The rotating structure 211 can drive the telescopic structure 212 to rotate around the first end, and the telescopic structure 212 can perform telescopic movement to move the nozzle 22 closer to or away from the first end. The rotating structure 211 and the telescopic structure 212 work together to flexibly adjust the position and orientation of the nozzle 22, adapt to different positions and specifications of carrier contact points 03, eliminate cleaning dead corners, and optimize dust removal effect.

[0043] In an optional embodiment, the chip carrier cleaning device is not attached to the temporary storage area in the carrier temporary storage rack 04, but is provided with a separate support frame. The support frame is used to fix the carrier unit 1, cleaning unit 2, and ventilation unit 3 in the chip carrier cleaning device. The cleaning unit 2 is disposed on the support frame and located on at least two sides of the chip carrier 02. For example, the chip carrier 02 has an upper surface and a lower surface that are arranged opposite each other, and a first side, a second side, a third side, and a fourth side that are perpendicular to the upper surface and the lower surface. The first side and the third side are arranged opposite each other, and the second side and the fourth side are arranged opposite each other. The cleaning unit 2 can be located on the two opposite sides of the chip carrier 02, such as the upper surface and the lower surface, and the first side and the third side. It can be located on any two different sides of the chip carrier 02, or on any three, four, five, or six different surfaces and sides of the chip carrier 02, so as to achieve all-round cleaning of the chip carrier 02. Specifically, the number and specific location of the cleaning units 2 can be designed according to actual conditions and actual needs, and are not specifically limited here.

[0044] In this embodiment, the ventilation unit 3 includes a pressure regulating structure 31, a filter structure 32, and a ventilation pipe 33. The ventilation pipe 33 connects the pressure regulating structure 31 and the nozzle 22 to deliver clean gas to the nozzle 22. The filter structure 32 is disposed on the ventilation pipe 33 to purify and remove impurities from the clean gas.

[0045] In this embodiment, the pressure regulating structure 31 can be any of an oil-free screw air compressor, an oil-free diaphragm booster pump, or other suitable power devices. The pressure regulating structure 31 is externally connected to the semiconductor plant's gas supply pipeline to boost and stabilize the clean gas output from the plant. By using the external gas supply method of the pressure regulating structure 31, the gas source is centrally supplied by the plant, allowing for continuous, uninterrupted gas supply over long periods, suitable for 24-hour mass production on semiconductor production lines.

[0046] In an optional embodiment, the pressure regulation structure 31 can be replaced with a high-pressure storage tank for clean gas. The high pressure within the tank serves as the gas source, and secondary fine-tuning and flow control are performed solely by the downstream flow control structure 34. Using a high-pressure storage tank allows for equipment miniaturization, eliminates the need for an external plant gas source, avoids the risk of oil contamination from the pump body, and ensures stable gas purity.

[0047] In this embodiment, the filter structure 32 can be a combination of one or more of a precision PTFE gas filter, an adsorption dryer filter, or other suitable filters. Although the clean gas output from the plant gas source or high-pressure storage tank has undergone pretreatment before leaving the factory, pipeline debris, valve wear particles, and trace amounts of water vapor are easily mixed into the gas during pipeline transportation, pressure regulation, and pressurization. The filter structure 32 is located between the pressure regulation structure 31 and the flow control structure 34 to perform terminal fine filtration of the clean gas to remove solid particles and water vapor impurities, and to prevent impurities from being sprayed to the carrier contact point 03 with the purging gas, thereby ensuring the cleaning effect.

[0048] In this embodiment, the cleaning gas can be any of high-purity nitrogen, high-purity argon, CDA clean dry air, or other suitable cleaning gases, so as to use high-pressure airflow to blow away dust and residual impurities on the surface of the carrier contact point 03 and prevent secondary pollution.

[0049] In this embodiment, the chip carrier cleaning device is further provided with a flow control structure 34, which is disposed on the ventilation pipe 33 at the output end of the filter structure 32 and is used to regulate the flow rate of the cleaning gas. The flow control structure 34 can be an electronically controlled proportional valve, a mass flow controller, or other suitable flow regulation device to achieve precise micro-volume output of the cleaning gas.

[0050] In this embodiment, the chip carrier cleaning device is further provided with an image acquisition unit 4, which is disposed on the nozzle 22 and is used to acquire surface image information of the contact point 03 of the chip carrier 02.

[0051] In one optional embodiment, the cleaning unit 2 is disposed on at least two sides of the chip carrier 02 for omnidirectional cleaning of the chip carrier 02. The image acquisition unit 4 is disposed on the nozzle 22 of the cleaning unit 2 for acquiring surface image information of the chip carrier 02.

[0052] In this embodiment, the chip carrier cleaning device is further provided with a control unit 5. The control unit 5 is connected to the cleaning unit 2, the ventilation unit 3 and the image acquisition unit 4. The control unit 5 receives image information from the image acquisition unit 4 and controls the working status of the cleaning unit 2 and the ventilation unit 3 according to the image information.

[0053] Specifically, the control unit 5 includes a motion control module, a cleaning control module, and a flow control module, which can acquire stain location data, contamination level data, and cleanliness data of contact point 03 based on the image information in the image acquisition unit 4. Specifically, the stain location data is used to calculate the stain location on contact point 03; the contamination level data is used to calculate the contamination level on contact point 03 before cleaning to obtain the contamination status of contact point 03 before cleaning; and the cleanliness data is used to calculate the cleanliness of contact point 03 after cleaning to obtain the contamination status of contact point 03 after cleaning.

[0054] The motion control module in control unit 5 acquires the stain location data at contact point 03 based on the received image information, calculates the stain position at contact point 03, and controls the movement of the moving part 21 in cleaning unit 2 according to the stain position to adjust the orientation and position of nozzle 22. Specifically, the motion control module in control unit 5 controls the rotation structure 211 in moving part 21 to rotate so that nozzle 22 faces the direction of the stain, and then controls the extension structure 212 to extend to drive nozzle 22 to move in the direction of the stain, thereby achieving accurate capture of stain location based on visual feedback. The moving part 21 flexibly adjusts its extension length and multi-angle deflection according to the position data of visual feedback, adapting to narrow and irregularly deep internal spaces of equipment, overcoming the drawbacks of the limited stroke and angle of traditional fixed cleaning heads, and achieving full-area, dead-angle-free fixed-point cleaning.

[0055] The cleaning control module in control unit 5 acquires cleanliness data at contact point 03 based on received image information to calculate the cleanliness of contact point 03 after cleaning, i.e., the contamination level of contact point 03 after cleaning, and controls the operating state of ventilation unit 3 according to the cleanliness. Specifically, when the cleanliness does not meet the preset threshold range, ventilation unit 3 operates to clean contact point 03; when the cleanliness meets the preset threshold range, ventilation unit 3 stops operating, and cleaning ends. For example, if the preset threshold range for cleanliness is set to less than 0.2%, when the cleanliness is greater than or equal to 0.2%, i.e., the cleanliness does not meet the preset threshold range, the cleaning control module in control unit 5 controls the pressure regulation structure 31, filter structure 32, and flow control structure 34 to operate to clean the stains; when the cleanliness is less than 0.2%, i.e., the cleanliness meets the preset threshold range, the cleaning control module in control unit 5 controls the pressure regulation structure 31, filter structure 32, and flow control structure 34 to stop operating, and the cleaning task is completed.

[0056] By combining the cleaning control module in the control unit 5 with the cleanliness management of the cleaning process, the purging ends when the standard is met, and automatically replenishes the purging when the standard is not met. This can save the amount of cleaning gas consumed and prevent the high-pressure gas from over-purging and damaging the carrier contact point 03. It can achieve automated closed-loop operation while ensuring the cleaning quality, and is suitable for batch continuous production on the production line.

[0057] The flow control module in control unit 5 obtains the contamination data at contact point 03 based on the received image information to calculate the contamination level at contact point 03 before cleaning, and adjusts the flow rate of the clean gas in the ventilation pipe 33 according to the contamination level using the flow control structure 34. For example, a contamination level between 0.2% and 1.5% is defined as light contamination, between 1.5% and 4% as moderate contamination, and greater than 4% as heavy contamination. When the flow control module in control unit 5 determines that the contamination is light, it controls the flow control structure 34 to output low-pressure purging; when it determines that the contamination is moderate, it controls the flow control structure 34 to output medium-pressure purging; and when it determines that the contamination is heavy, it controls the flow control structure 34 to output high-pressure purging.

[0058] The flow control module in control unit 5 dynamically adjusts the flow rate of the clean gas according to the degree of contamination. The flow rate is large for heavy contamination and small for light contamination. This ensures the cleaning effect under different levels of contamination, saves clean gas consumption, and avoids damage to the precision contact structure of the carrier by excessive airflow, thus balancing cleaning quality and economic efficiency.

[0059] It should be noted that regardless of whether the pressure is low, medium, or high, the primary concern should be avoiding damage to the carrier. In this embodiment, the control unit 5 is equipped with an AI model that uploads the images acquired by the image acquisition unit 4 in real time and performs autonomous algorithm iteration and optimization. Specifically, the control unit 5 stores all parameters such as the contamination level, pressure of the flow control structure 34, purging time, and cleanliness of each purging into the AI ​​model. After accumulating a large amount of historical data, the model learns autonomously and continuously iterates and optimizes the purging control parameters, enabling the equipment to adapt to different working conditions, continuously improve the cleaning effect, and optimize air consumption.

[0060] In this embodiment, the chip carrier cleaning device is further equipped with a detection unit 6 for detecting the material placement status of the chip carrier 02. The material placement status includes a loaded state and an empty state. Specifically, the loaded state refers to the state in which wafers, bare dies, finished chips, and other products are placed on the chip carrier 02, while the empty state refers to the state in which no wafers, bare dies, finished chips, or other products are placed on the chip carrier 02. The detection unit 6 can be any of a photoelectric sensor, a capacitive proximity sensor, or other suitable detection unit 6, used to detect the material placement status above the chip carrier 02, preventing high-pressure gas from directly blowing onto wafers, bare dies, finished chips, and other products, causing product scrapping.

[0061] In this embodiment, the control unit 5 is connected to the detection unit 6. The control unit 5 receives the material placement status from the detection unit 6 and controls the working status of the ventilation unit 3 according to the material placement status. Specifically, when the detection unit 6 detects that the chip carrier 02 is in a loaded state, the control unit 5 controls the ventilation unit 3 to stop operating; when the detection unit 6 detects that the chip carrier 02 is in an unloaded state, the control unit 5 controls the ventilation unit 3 to operate as needed according to the contamination and cleanliness data.

[0062] The detection unit 6 works in conjunction with the control unit 5 to achieve linkage control by monitoring the material placement status of the chip carrier 02 in real time. This can prevent airflow from damaging the product and reduce the product scrap rate, while also avoiding wasted gas supply and achieving automated and safe management of the equipment.

[0063] The above description is only a partial preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A chip carrier cleaning device, characterized in that, The chip carrier cleaning device is installed inside the semiconductor testing machine and includes a carrier unit, a cleaning unit, a ventilation unit, and an image acquisition unit. The carrier unit is used to place the chip carrier; At least one of the cleaning units is disposed at a distance from each other on at least one side of the chip carrier, and includes a moving part and a nozzle; The ventilation unit includes a ventilation pipe connected to the nozzle to provide clean gas to the nozzle. The image acquisition unit is disposed on the nozzle and is used to acquire image information of the chip carrier. The moving part drives the nozzle to align with the chip carrier according to the image information, so as to clean the chip carrier by spraying cleaning gas.

2. The chip carrier cleaning device according to claim 1, characterized in that, The moving part includes a rotating structure and a telescopic structure. The telescopic structure has a first end and a second end that are arranged opposite to each other. The first end is connected to the rotating structure, and the second end is connected to the nozzle. The rotating structure can drive the telescopic structure to rotate around the first end, and the telescopic structure can perform telescopic movement to move the nozzle closer to or away from the first end.

3. The chip carrier cleaning device according to claim 1, characterized in that, The ventilation unit further includes a filtration structure and a pressure regulation structure. The filtration structure is disposed on the ventilation pipeline and is used to purify and remove impurities from the clean gas in the ventilation pipeline. The pressure regulation structure is connected to the ventilation pipeline and is used to regulate the pressure in the ventilation pipeline.

4. The chip carrier cleaning device according to claim 1, characterized in that, The chip carrier cleaning device also includes a control unit, which is connected to the cleaning unit, the ventilation unit and the image acquisition unit. The control unit is used to receive the image information acquired by the image acquisition unit and control the working status of the cleaning unit and the ventilation unit according to the image information.

5. The chip carrier cleaning device according to claim 4, characterized in that, The control unit includes a motion control module, which is used to acquire stain location data in the chip carrier based on the received image information, and control the movement of the moving part in the cleaning unit based on the stain location data to adjust the orientation and position of the nozzle.

6. The chip carrier cleaning apparatus according to claim 4, characterized in that, The control unit further includes a cleaning control module, which is used to obtain the cleanliness data of the chip carrier based on the received image information, and control the working state of the ventilation unit based on the cleanliness data. Specifically, when the cleanliness data does not meet the preset threshold requirement, the cleaning control module controls the ventilation unit to operate in order to clean the chip carrier; when the cleanliness data meets the preset threshold requirement, the cleaning control module controls the ventilation unit to stop operating, and the cleaning ends.

7. The chip carrier cleaning device according to claim 4, characterized in that, The control unit further includes a flow control module, and the ventilation unit is also provided with a flow control structure. The flow control module is used to obtain the contamination data in the chip carrier based on the received image information, and to control the flow control structure to adjust the flow rate of the clean gas in the ventilation pipeline based on the contamination data.

8. The chip carrier cleaning device according to claim 4, characterized in that, The chip carrier cleaning device also includes a detection unit for detecting the material placement status of the chip carrier, which includes a loaded state and an empty state.

9. The chip carrier cleaning apparatus according to claim 8, characterized in that, The control unit is connected to the detection unit. The control unit receives the material placement status sent by the detection unit and controls the working status of the ventilation unit according to the material placement status. When the chip carrier is in a loaded state, the control unit controls the ventilation unit to stop operating; when the chip carrier is in an unloaded state, the control unit controls the ventilation unit to operate.

10. The chip carrier cleaning apparatus according to claim 1, characterized in that, The semiconductor testing machine is equipped with a multi-layered, three-dimensional carrier storage rack, which has multiple storage areas. The chip carrier cleaning device is located within the storage area.

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