A stamping die for producing an LED backlight module backboard

Abstract

The application discloses a stamping die for producing an LED backlight module backboard and belongs to the technical field of stamping dies. The stamping die for producing the LED backlight module backboard comprises a base assembly, the base assembly comprises a base, a lifting seat is movably arranged above the base, a plurality of guide columns a are fixedly installed at four corners of the base and are in sliding cooperation with the lifting seat, a lower die assembly is arranged on the base, the lower die assembly comprises a lower die frame arranged on the base, a stamping groove for placing a plate is arranged on the top of the lower die frame, a through groove a is formed in the middle of the lower die frame, an upper die assembly is arranged on one side of the lifting seat close to the base, a positioning assembly connected with the base is arranged in the through groove a, and an ejection assembly for ejecting the backboard after stamping is arranged between the lower die frame and the positioning assembly. The stamping die has the advantages of stable abutting support, uniform compact constraint, stable positioning and anti-deviation, and stable and reliable operation.

Description

Technical Field

[0001] This invention relates to the field of stamping die technology, specifically to a stamping die for producing LED backlight module backplates. Background Technology

[0002] The LED backlight module backplate is a core structural component of the LCD backlight module, primarily serving five functions: support, fixation, protection, heat dissipation, and reflection. LED backlight module backplates are typically thin sheet metal parts, mass-produced using precision stamping dies. They are often made of thin-gauge aluminum alloy or galvanized steel, characterized by large size, thinness, low rigidity, and extremely high flatness requirements.

[0003] In traditional stamping dies used for backplate production, the lower die and the lower template are usually directly connected by multiple screws and bolts, without any other positioning mechanism to reinforce the connection between the lower die and the lower template.

[0004] During the production of the back panel, the intense vibration and impact generated by high-frequency stamping can cause the screw and bolt connections to loosen, leading to problems such as positional displacement or increased gaps in the lower die. This makes it impossible to always ensure that the lower die is in its initial setting position, which may result in stamping dimensional deviations, product burrs, or poor forming.

[0005] Therefore, there is a need to provide a stamping die for the production of LED backlight module backplates, in order to solve the above problems. Summary of the Invention

[0006] To address the shortcomings of existing technologies, the purpose of this invention is to provide a stamping die for producing LED backlight module backplates, thereby solving the problems mentioned in the background section.

[0007] To achieve the above objectives, the present invention provides the following technical solution: A stamping die for producing an LED backlight module backplate includes a base assembly. The base assembly includes a base, a lifting seat is movably disposed above the base, and a plurality of guide posts a are fixedly installed at the four corners of the base, which slide in cooperation with the lifting seat. The die also includes: A lower mold assembly is provided on a base. The lower mold assembly includes a lower mold frame provided on the base. The top of the lower mold frame is provided with a stamping groove for placing the sheet metal. The middle of the lower mold frame is provided with a through slot a. The upper mold assembly is located on the side of the lifting base near the base; A positioning component is disposed inside the empty slot a and connected to the base. The positioning component includes mounting holes, which are provided in a plurality of manner and symmetrically arranged at the bottom of the lower mold frame. The base is provided with a plurality of mounting screws passing through the mounting holes. A washer a is fitted on the outside of the mounting screw and contacts the bottom of the empty slot a. A connecting nut is threaded onto the mounting screw and contacts the top surface of the washer a. A sliding groove is symmetrically provided inside the empty slot a. A snap-fit ​​plate is slidably provided on the sliding groove. The snap-fit ​​plate has a plurality of snap-fit ​​grooves on the side away from the lifting slide plate that are movably snap-fitted with the connecting nut. The ejector assembly, located between the lower die frame and the positioning assembly, is used to eject the back plate after stamping.

[0008] As a further embodiment of the present invention, the lower die assembly also includes limiting plates distributed at the four corners of the top of the lower die frame, and side grooves are provided in the lower die frame located at both ends of the stamping groove, and a plurality of ventilation holes a are provided in the side grooves that communicate with the outside of the lower die frame.

[0009] As a further embodiment of the present invention, the bottom of the side groove corresponds to the bottom of the stamping groove.

[0010] As a further embodiment of the present invention, the diameter of the vent hole a is consistent with the height of the side groove.

[0011] As a further embodiment of the present invention, the positioning component further includes pillars symmetrically arranged inside the slot a, with the two ends of the pillars fixedly connected to the top and bottom surfaces of the slot a, respectively. A lifting slide plate is slidably mounted on the symmetrically arranged pillars, and the snap-fit ​​plate is hinged to the corresponding side of the lifting slide plate through a plurality of hinge rods.

[0012] As a further embodiment of the present invention, the slot is configured as a U-shaped slot, and the distance between the two sides of the slot is consistent with the width of the opposite sides of the connecting nut.

[0013] As a further embodiment of the present invention, the ejection assembly includes a plurality of ejector pins movably disposed inside the stamping groove. The top surface of the ejector pins is flush with the top surface of the lower die frame. One end of each ejector pin away from the top surface of the lower die frame passes through the lower die frame and is connected to a movable plate movably disposed in the slot a. The movable plate is provided with a sliding hole that slides with the support pin. A spring b is provided between the movable plate and the lifting slide plate and is sleeved on the outside of the support pin. The top of the spring b contacts the movable plate through a washer b.

[0014] As a further embodiment of the present invention, the gasket a is a rubber ring or a metal ring.

[0015] As a further embodiment of the present invention, the upper mold assembly includes an upper mold frame disposed at the bottom of the lifting seat, the upper mold frame having an inner groove b, an unloading plate corresponding to the groove b being movably disposed between the upper mold frame and the lower mold assembly, a plurality of guide posts b being mounted on the unloading plate and slidingly engaging with the lifting seat, a spring a being sleeved on the outside of the guide posts b being connected between the unloading plate and the lifting seat, a vent hole b corresponding to the groove b being opened on the lifting seat, and a limiting rod connected to the bottom of the lifting seat being disposed inside the groove b.

[0016] As a further embodiment of the present invention, the distance between the bottom of the limiting rod and the bottom of the upper mold frame is consistent with the thickness of the unloading plate.

[0017] In summary, the embodiments of the present invention have the following beneficial effects compared with the prior art: In this invention, a positioning component enables precise positioning and secure locking between the two components. This structure effectively resists the severe vibration and impact generated by long-term high-frequency stamping operations, preventing the lower die frame from shifting or widening gaps due to loose fasteners and stress accumulation, as is common in traditional connection methods. Structurally, it ensures that the lower die frame always maintains its initial design position, avoiding defects such as stamping dimensional deviations, product burrs, and poor forming caused by die body offset. It significantly improves the overall operational stability and guiding accuracy of the die during stamping, ensuring smooth and reliable stamping operations, extending the die's service life, and enhancing the safety and reliability of continuous operation in the production process. This provides a strong guarantee for the stable and efficient production of LED backlight module backplates.

[0018] In this invention, the upper mold assembly first contacts the middle area of ​​the sheet metal and applies pre-tightening force, which can achieve uniform clamping constraint on the sheet metal over a large span and area, effectively avoiding problems such as insufficient force, bulging, or uneven local deformation in the middle part of the sheet metal that are prone to occur during the stamping process of traditional molds. This clamping method can significantly improve the overall forming accuracy and dimensional consistency of the back plate, adapt to the stamping forming needs of various materials and sheet metals of different thicknesses, effectively improve the forming quality of products, reduce the scrap rate caused by uneven local force, and meet the process requirements of large-scale, high-precision back plate production.

[0019] In this invention, the lifting seat drives the upper mold assembly to move upward synchronously, gradually separating the upper mold assembly from the forming sheet material. This effectively eliminates the negative pressure adsorption and sticking phenomenon caused by the mold surface adhesion after stamping, preventing deformation, tearing, or sticking of the sheet material during removal. Through the above-mentioned coordinated ejection and demolding actions, the formed LED backlight module backplate can be quickly and smoothly ejected from the mold surface, greatly facilitating operators to remove the finished product and reposition the sheet material to be stamped. This ensures that the entire stamping process is continuous, stable, and orderly, improving overall production efficiency and operational safety.

[0020] To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0021] Figure 1 This is a perspective view of the present invention.

[0022] Figure 2 This is a front view of the present invention.

[0023] Figure 3 This is a cross-sectional view of the present invention.

[0024] Figure 4 for Figure 3 A magnified view of a portion of point A in the middle.

[0025] Figure 5 for Figure 4 A magnified view of a section at point B in the middle.

[0026] Figure 6 This is a schematic diagram of the positioning component in this invention.

[0027] Figure 7 This is an exploded view of the positioning component and the ejection component in this invention.

[0028] Reference numerals: 1. Base assembly; 101. Base; 102. Guide column a; 103. Lifting seat; 2. Lower mold assembly; 201. Lower mold frame; 202. Stamping groove; 203. Hole a; 204. Limiting plate; 205. Side groove; 206. Vent hole a; 3. Upper mold assembly; 301. Upper mold frame; 302. Empty slot b; 303. Stripper plate; 304. Guide post b; 305. Vent hole b; 306. Spring a; 307. Limiting rod; 4. Positioning assembly; 401. Support column; 402. Lifting slide plate; 403. Hinge rod; 404. Snap-fit ​​plate; 4041. Snap-fit ​​groove; 405. Mounting hole; 406. Mounting screw; 407. Connecting nut; 408. Washer a; 409. Slide groove; 5. Ejector assembly; 501. Ejector column; 502. Movable plate; 503. Spring b; 504. Gasket b. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0030] The specific implementation of the present invention will be described in detail below with reference to specific embodiments.

[0031] In one embodiment of the present invention, see Figures 1-4 A stamping die for producing an LED backlight module backplate includes a base assembly 1, which includes a base 101. A lifting seat 103 is movably disposed above the base 101. Several guide posts a102 that slide and cooperate with the lifting seat 103 are fixedly installed at the four corners of the base 101. A lower die assembly 2 is disposed on the base 101. The lower die assembly 2 includes a lower die frame 201 disposed on the base 101. A stamping groove 202 for placing sheet metal is provided on the top of the lower die frame 201. A through slot a203 is opened in the middle of the lower die frame 201. An upper die assembly 3 is disposed on the side of the lifting seat 103 near the base 101. A positioning component 4 connected to the base 101 is disposed inside the slot a203. An ejection component 5 for ejecting the stamped backplate is disposed between the lower die frame 201 and the positioning component 4.

[0032] In this embodiment, in the initial state, the lifting seat 103 is at its highest point and the upper mold assembly 3 is at its highest point. At this time, the distance between the lower mold assembly 2 and the upper mold assembly 3 is at its maximum value.

[0033] Furthermore, when performing subsequent stamping and forming operations on the blanked sheet, the operator first places the blanked sheet stably in the preset positioning area on the top of the lower die frame 201. The top of the ejector component 5 forms a stable abutment support with the bottom of the sheet, providing uniform initial support force for the sheet and preventing the sheet from tilting, shifting or collapsing locally before the die is closed.

[0034] Subsequently, driven by the press, the lifting seat 103 moves smoothly and slowly downward along the axial length of the guide column a102. During the downward movement of the lifting seat 103, the upper die assembly 3 moves downward at a uniform speed. The upper die assembly 3 first contacts the middle area of ​​the sheet metal and applies pre-tightening force, which can achieve uniform clamping and constraint of the sheet metal over a large span and area, effectively avoiding problems such as insufficient force in the middle part of the sheet metal, suspended arching, or uneven local deformation that are prone to occur in the stamping process of traditional dies.

[0035] This clamping method can significantly improve the overall forming accuracy and dimensional consistency of the back panel, adapt to the stamping requirements of various materials and plates of different thicknesses, effectively improve the product forming quality, reduce the scrap rate caused by uneven local stress, and meet the process requirements of large-scale, high-precision back panel production.

[0036] Furthermore, the lifting seat 103 drives the upper mold assembly 3 to continue moving downwards. Under the pressure of the sheet metal, the ejector assembly 5 moves downwards by continuously abutting against the bottom of the sheet metal, maintaining stable support for the sheet metal. After the upper mold assembly 3 completes the uniform pre-pressing of the middle area of ​​the sheet metal, under the continuous drive of the lifting seat 103, the upper mold assembly 3 performs precise mold closing guided by the guide post a102, applying forming pressure to the sheet metal to complete stamping, bending, and shaping processes, ultimately achieving high-precision stamping forming of the LED backlight module backplate.

[0037] Furthermore, after the sheet metal is stamped, the press drives the lifting seat 103 to rise upward along the guide post a102. At the same time, the ejector assembly 5 moves upward synchronously under the action of elasticity. The top of the ejector assembly 5 always keeps in contact with the bottom of the formed sheet metal and continuously applies an upward pushing force to smoothly lift the formed back plate upward.

[0038] During this process, the lifting seat 103 drives the upper mold assembly 3 to move upward synchronously, gradually separating the upper mold assembly 3 from the forming sheet material. This effectively eliminates the negative pressure adsorption and sticking phenomenon caused by the mold surface adhesion after stamping, preventing deformation, tearing, or sticking of the sheet material during removal. Through the above-mentioned coordinated ejection and demolding actions, the formed LED backlight module backplate can be quickly and smoothly ejected from the mold surface, greatly facilitating operators to remove the finished product and reposition the sheet material to be stamped. This ensures that the entire stamping process is continuous, stable, and orderly, improving overall production efficiency and operational safety.

[0039] During continuous sheet metal stamping, the positioning component 4, located between the base 101 and the lower die frame 201, enables precise positioning and secure locking between the two. This structure effectively resists the severe vibration and impact generated by long-term high-frequency stamping operations, preventing problems such as positional shifts and increased gaps in the lower die frame 201 caused by factors like loose fasteners and stress accumulation, which are common in traditional connection methods. Structurally, it ensures that the lower die frame 201 always maintains its initial design position, avoiding defects such as stamping dimensional deviations, product burrs, and poor forming due to die body offset.

[0040] Through the constraint and reinforcement of positioning component 4, the overall operational stability and guiding accuracy of the mold during the stamping process are significantly improved, ensuring smooth and reliable stamping action, extending the service life of the mold, and improving the safety of the production process and the reliability of continuous operation, providing a strong guarantee for the stable and efficient production of LED backlight module backplates.

[0041] In one embodiment of the present invention, see Figures 1-5The lower die assembly 2 also includes limiting plates 204 distributed at the four corners of the top of the lower die frame 201. Side grooves 205 are provided in the lower die frame 201 located at both ends of the stamping groove 202. Several ventilation holes a206 connected to the outside of the lower die frame 201 are provided in the side grooves 205.

[0042] In this embodiment, the setting of several limiting plates 204 facilitates the automatic positioning and placement of the stamped sheet material, avoiding the tedious and inefficient operation of manually adjusting the position of the sheet material, and improving the consistency of the stamped sheet material dimensions.

[0043] Furthermore, the symmetrically arranged side grooves 205 and several vent holes a206 facilitate the orderly export of air between the sheet metal and the stamping groove 202 during the stamping process of the sheet metal into the stamping groove 202, and the introduction of air between the sheet metal and the stamping groove 202 during the upward movement of the sheet metal after stamping. This avoids the problem that the space between the sheet metal and the stamping groove 202 cannot be effectively sealed to export or import gas, which would affect the sheet metal stamping operation and the ejection operation of the sheet metal after stamping.

[0044] It is worth noting that the bottom of the side groove 205 corresponds to the bottom of the stamping groove 202, and the diameter of the vent hole a206 is consistent with the height of the side groove 205, which can ensure that the air between the sheet and the stamping groove 202 is exhausted.

[0045] In one embodiment of the present invention, see Figures 1-4 , Figures 6-7 The positioning component 4 includes pillars 401 symmetrically arranged inside the slot a203. The two ends of each pillar 401 are fixedly connected to the top and bottom surfaces of the slot a203, respectively. A lifting slide plate 402 is slidably mounted on each pillar 401. A plurality of mounting holes 405 are symmetrically arranged at the bottom of the lower mold frame 201. A plurality of mounting screws 406 passing through the mounting holes 405 are provided on the base 101. The outer side of each mounting screw 406 is fitted with a fitting that engages with the bottom of the slot a203. The gasket a408 is in contact with the mounting screw 406, and a connecting nut 407 is threaded onto the mounting screw 406 to contact the top surface of the gasket a408. The slot a203 is symmetrically provided with a sliding groove 409, and a snap-fit ​​plate 404 is slidably provided on the sliding groove 409. The snap-fit ​​plate 404 is hinged to the corresponding side of the lifting slide plate 402 through several hinge rods 403. The snap-fit ​​plate 404 is provided with several slots 4041 on the side away from the lifting slide plate 402, which are movably snapped into the connecting nut 407.

[0046] In this embodiment, in the initial state, the lifting slide plate 402 is located at the lowest point, the slot 4041 is engaged with the connecting nut 407, and the symmetrically arranged locking plates 404 are far apart from each other. At this time, a fixed connection between the lower mold frame 201 and the base 101 can be achieved. At this time, the included angle between the hinge rod 403 and the locking plate 404 is set to an acute angle and is at its minimum value.

[0047] Furthermore, when it is necessary to disconnect the assembly connection between the base 101 and the lower mold frame 201, the operator pushes the lifting slide plate 402 upward along the axial direction of the support column 401. During the displacement process, the lifting slide plate 402, through the hinge transmission action with the hinge rod 403 and in conjunction with the sliding guide constraint of the snap-fit ​​plate 404 and the slide groove 409, drives the two sets of symmetrically arranged snap-fit ​​plates 404 to move inward towards each other synchronously.

[0048] As the snap-fit ​​plates 404 approach each other, their sides gradually disengage from the connecting nut 407, thereby releasing the locking relationship between the snap-fit ​​groove 4041 on the snap-fit ​​plate 404 and the connecting nut 407. Subsequently, by rotating the connecting nut 407, the locking fit between the connecting nut 407 and the mounting hole 405 can be released, and the gasket a408 can then be easily removed, completely disengaging the connection between the base 101 and the lower mold frame 201.

[0049] This disassembly method is simple to operate and reliable in positioning, and can quickly complete the replacement of the lower mold frame 201. It is convenient to flexibly replace the corresponding model of the lower mold frame 201 according to different sheet specifications, stamping size and forming process requirements, effectively improving the versatility and adaptability of the entire mold device and meeting the actual use needs of diversified back panel production.

[0050] Furthermore, after replacing and assembling the lower die frame 201 required for stamping production, several washers a408 are respectively fitted onto the corresponding mounting screws 406, ensuring that the bottom of the washers a408 is tightly fitted against the bottom surface of the inner groove a203 of the lower die frame 201, achieving initial positioning and support. Then, the connecting nut 407 is aligned and engaged with the mounting screws 406, and the connecting nut 407 is rotated in the opposite direction, ensuring that the lower surface of the connecting nut 407 is fully fitted and pressed against the upper end face of the washers a408, completing the pre-tightening assembly of the threaded parts.

[0051] After the above assembly is completed, the lifting slide plate 402 is released, and under its own weight, the lifting slide plate 402 slides smoothly downward along the axial direction of the support column 401. During the downward movement of the lifting slide plate 402, through the hinge transmission with the hinge rod 403, and in conjunction with the sliding guide constraint of the locking plate 404 and the slide groove 409, the two sets of symmetrically arranged locking plates 404 are pushed outward synchronously away from each other. As the locking plate 404 gradually approaches the connecting nut 407, the locking groove 4041 provided on it forms a stable and reliable locking limit with the connecting nut 407, thereby locking the circumferential angle of the multiple connecting nuts 407 and preventing them from rotating in subsequent operations.

[0052] This locking structure effectively avoids problems such as loosening or disengagement between the connecting nut 407 and the mounting screw 406 due to vibration and impact during long-term high-frequency stamping operations. It ensures that the lower die frame 201 always remains in a precise fixed state, significantly improving the overall stability and forming accuracy during sheet metal stamping. It fundamentally eliminates the risks of stamping dimension deviation, die interference, and product defects caused by the positional offset of the lower die frame 201, further improving the operational reliability and service life of the entire stamping device.

[0053] It is worth noting that the slot 4041 is specifically designed as a U-shaped groove structure adapted to the shape of the connecting nut 407. Its design fully incorporates the actual size parameters of the connecting nut 407, and the distance between the inner walls on both sides of the slot 4041 precisely matches and is consistent with the width of the opposite sides of the connecting nut 407. This precise size adaptation design allows the connecting nut 407 to be stably embedded inside the U-shaped slot 4041, ensuring a tight fit between the inner walls on both sides of the slot 4041 and the corresponding sides of the connecting nut 407. This effectively avoids problems such as loosening and shaking caused by excessive gaps after the engagement. At the same time, it prevents the connecting nut 407 from rotating circumferentially or shifting axially within the slot 4041, thereby ensuring the firmness and stability of the engagement between the slot 4041 and the connecting nut 407. This provides a strong guarantee for the reliable fixation of the lower die frame 201 and further supports the stability and precision of the sheet metal stamping process.

[0054] It is worth noting that the gasket a408 can be a rubber ring or a metal ring structure, which has good structural rigidity and friction characteristics. In the assembled state, this ring structure is pressed between the connecting nut 407 and the bottom of the slot a203. By increasing the frictional resistance between the contact surfaces, it effectively suppresses the loosening, deflection or slippage of the connecting nut 407 and the gasket a408 under the stamping vibration environment, and further strengthens the connection and fastening effect between the base 101 and the lower mold frame 201.

[0055] By selecting shims of different materials (A408), the clamping force and friction can be adjusted according to the stamping conditions. This ensures assembly reliability, buffers some stamping impacts, and reduces stress concentration caused by rigid connections. As a result, the overall connection stability of the mold is significantly improved, ensuring that the lower mold frame 201 maintains accurate positioning and no offset during long-term continuous stamping. This provides structural protection for improving the stamping accuracy of sheet metal and product consistency.

[0056] In one embodiment of the present invention, see Figures 1-4 and Figure 7 The ejection assembly 5 includes several ejector pins 501 movably disposed inside the stamping groove 202. The top surface of the ejector pins 501 is flush with the top surface of the lower mold frame 201. One end of each ejector pin 501 away from the top surface of the lower mold frame 201 passes through the lower mold frame 201 and is connected to a movable plate 502 movably disposed in the slot a203. The movable plate 502 is provided with a sliding hole that slides with the support column 401. A spring b503 is provided between the movable plate 502 and the lifting slide plate 402 and is sleeved on the outside of the support column 401. The top of the spring b503 contacts the movable plate 502 through a washer b504.

[0057] In this embodiment, in the initial state, the top surface of the top post 501 is flush with the top surface of the lower mold frame 201, and the spring b503 is at its original length. At this time, the plate to be stamped can be placed above the lower mold frame 201, and the top surface of the top post 501 is in contact with the bottom surface of the plate to be stamped.

[0058] Furthermore, during the stamping process of the sheet metal, the upper die assembly 3 pushes the sheet metal into the stamping groove 202. The sheet metal contacts the top post 501 and the top post 501 slides with the lower die frame 201, causing the movable plate 502 to move down synchronously. At this time, since the length of the hinge rod 403 is fixed, when the slot 4041 and the connecting nut 407 are in the snap-fit ​​state, the symmetrically arranged snap-fit ​​plates 404 support the lifting slide plate 402 by hinge with the hinge rod 403. The bottom surface of the lifting slide plate 402 is higher than the top surface of the snap-fit ​​plate 404. Therefore, the height of the lifting slide plate 402 is relatively fixed, the gap between the lifting slide plate 402 and the movable plate 502 is reduced, and the spring b503 is stressed and contracts.

[0059] Furthermore, when the sheet metal comes into contact with the bottom of the stamping groove 202, the top post 501 moves down to the lowest point, that is, the top surface of the top post 501 is flush with the bottom surface of the stamping groove 202. At this time, the upper die assembly 3 completes the stamping forming operation of the sheet metal by cooperating with the stamping groove 202.

[0060] Furthermore, after the sheet metal is stamped, the press moves the upper die assembly 3 upward by moving the lifting seat 103 upward, which can relieve the downward pressure on the top of the sheet metal. The spring b503 extends and pushes the movable plate 502 upward along the length of the support column 401 through the shim b504. The movable plate 502 pushes out the stamped sheet metal by moving the top column 501 synchronously, which facilitates the removal of the sheet metal after the stamping operation and the repositioning of the sheet metal to be stamped.

[0061] It is worth noting that during the sheet metal stamping process, the pressure generated by the mold closing will cause the spring b503 to be compressed and elastically contracted. The contracted spring b503 continuously applies a downward preload, firmly pressing the lifting slide plate 402 to prevent it from jumping or loosening under high-frequency stamping vibration. This downward pressure is transmitted to the locking part through the transmission structure, making the locking fit between the slot 4041 and the connecting nut 407 tighter, effectively eliminating gaps and preventing loosening due to vibration. This structure significantly improves the positioning and locking effect, ensuring that the lower mold frame 201 remains in a fixed position without shifting during continuous stamping, thereby improving overall stamping stability and forming accuracy.

[0062] It is worth noting that the pad b504 is designed as a circular ring. The pad b504 facilitates the even distribution of the elastic force of the spring b503, and makes it easier for the movable plate 502 to rise and fall stably.

[0063] In one embodiment of the present invention, see Figures 1-3 The upper mold assembly 3 includes an upper mold frame 301 disposed at the bottom of the lifting seat 103. The inner side of the upper mold frame 301 is provided with a slot b302. A stripper plate 303 corresponding to the slot b302 is movably disposed between the upper mold frame 301 and the lower mold assembly 2. A plurality of guide posts b304 that slide with the lifting seat 103 are installed on the stripper plate 303. A spring a306 sleeved on the outside of the guide posts b304 is connected between the stripper plate 303 and the lifting seat 103. A vent hole b305 corresponding to the slot b302 is opened on the lifting seat 103. A limiting rod 307 connected to the bottom of the lifting seat 103 is provided on the inner side of the slot b302. The distance between the bottom of the limiting rod 307 and the bottom of the upper mold frame 301 is the same as the thickness of the stripper plate 303.

[0064] In this embodiment, in the initial state, the spring a306 is at its original length, and the unloading plate 303 is away from the upper mold frame 301 and the lifting seat 103. At this time, the upper mold assembly 3 does not perform a stamping operation on the sheet metal.

[0065] Furthermore, when the sheet metal needs to be stamped, the press pushes the lifting seat 103 to move down, and the lifting seat 103 drives the upper die frame 301 to move down synchronously. Since there is no obstruction under the unloading plate 303 at this time, the unloading plate 303 will move down synchronously, and the spring a306 is at its original length.

[0066] Furthermore, when the spring a306 moves down to contact the upper surface of the plate, there is still a gap between the bottom of the upper mold frame 301 and the plate. When the lifting seat 103 continues to move down, the lifting seat 103 drives the upper mold frame 301 to continue to move down. Since the height of the unloading plate 303 is relatively fixed at this time, the spring a306 is stressed and contracts.

[0067] Furthermore, when the upper die frame 301 moves down to contact the upper surface of the sheet metal, the bottom surface of the stripper plate 303 is flush with the bottom surface of the upper die frame 301, and the top surface of the stripper plate 303 contacts the bottom surface of the limit rod 307, thereby achieving synchronous downward movement of the stripper plate 303 and the upper die frame 301, and the compression of the spring a306 is at its maximum value. When the lifting seat 103 continues to move down, the upper die frame 301 performs stamping processing on the sheet metal by cooperating with the stamping groove 202.

[0068] Furthermore, after the sheet metal is stamped, the press moves the upper die frame 301 upward by lifting the lifting seat 103, releasing the contact between the upper die frame 301 and the sheet metal. Simultaneously, the contact between the top surface of the stripper plate 303 and the bottom surface of the limit rod 307 is released, increasing the distance between the stripper plate 303 and the lifting seat 103. The spring a306 extends, and under the action of the spring a306, the bottom surface of the stripper plate 303 remains in contact with the top surface of the back plate for a period of time. When the spring a306 returns to its original length, the lifting seat 103, connected to the spring a306, moves the stripper plate 303 upward, releasing the contact between the stripper plate 303 and the back plate, facilitating the removal of the back plate and the repositioning of the sheet metal to be stamped.

[0069] It is worth noting that the ventilation hole b305 ensures air circulation in the internal space of the slot b302 between the lifting seat 103 and the unloading plate 303.

[0070] It is worth noting that the elastic force of spring b503 is less than that of spring a306. By having the top surface of the unloading plate 303 in contact with the bottom surface of the limiting rod 307 and the elastic force of spring b503 being less than that of spring a306, the arching of the middle of the sheet metal during stamping can be avoided, thus ensuring the stability of the stamping effect.

[0071] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A stamping die for producing an LED backlight module backplate, comprising a base assembly (1), the base assembly (1) comprising a base (101), a lifting seat (103) movably disposed above the base (101), and a plurality of guide posts a (102) slidably engaged with the lifting seat (103) fixedly installed at the four corners of the base (101), characterized in that, Also includes: The lower mold assembly (2) is disposed on the base (101). The lower mold assembly (2) includes a lower mold frame (201) disposed on the base (101). The top of the lower mold frame (201) is provided with a stamping groove (202) for placing the sheet metal. The middle of the lower mold frame (201) is provided with a through slot a (203). The upper mold assembly (3) is located on the side of the lifting seat (103) near the base (101); A positioning component (4) is located inside the empty slot a (203) and connected to the base (101). The positioning component (4) includes mounting holes (405). Several mounting holes (405) are provided and symmetrically arranged at the bottom of the lower mold frame (201). Several mounting screws (406) passing through the mounting holes (405) are provided on the base (101). A washer a (408) is sleeved on the outside of the mounting screw (406) and contacts the bottom of the empty slot a (203). A connecting nut (407) is threaded on the mounting screw (406) and contacts the top surface of the washer a (408). A sliding groove (409) is symmetrically arranged inside the empty slot a (203). A snap-fit ​​plate (404) is slidably arranged on the sliding groove (409). Several snap-fit ​​grooves (4041) are provided on the side of the snap-fit ​​plate (404) away from the lifting slide plate (402) and are movably snapped with the connecting nut (407). Ejection assembly (5) is located between the lower die frame (201) and the positioning assembly (4) for ejecting the back plate after stamping.

2. The stamping die for producing the backplate of an LED backlight module according to claim 1, characterized in that, The lower die assembly (2) also includes limiting plates (204) distributed at the four corners of the top of the lower die frame (201). Side grooves (205) are provided in the lower die frame (201) located at both ends of the stamping groove (202). Several ventilation holes a (206) connected to the outside of the lower die frame (201) are provided in the side grooves (205).

3. The stamping die for producing the backplate of an LED backlight module according to claim 2, characterized in that, The bottom of the side groove (205) corresponds to the bottom of the stamping groove (202).

4. The stamping die for producing the backplate of an LED backlight module according to claim 2, characterized in that, The diameter of the vent hole a (206) is the same as the height of the side groove (205).

5. The stamping die for producing the backplate of an LED backlight module according to claim 1, characterized in that, The positioning component (4) further includes a support column (401) symmetrically arranged inside the slot a (203). The two ends of the support column (401) are fixedly connected to the top and bottom surfaces of the slot a (203) respectively. A lifting slide plate (402) is slidably arranged on the support column (401). The snap plate (404) is hinged to the corresponding side of the lifting slide plate (402) through several hinge rods (403).

6. The stamping die for producing the backplate of an LED backlight module according to claim 1, characterized in that, The slot (4041) is designed as a U-shaped slot, and the distance between the two sides of the slot (4041) is consistent with the width of the opposite side of the connecting nut (407).

7. The stamping die for producing the backplate of an LED backlight module according to claim 5, characterized in that, The ejection assembly (5) includes several ejector pins (501) movably disposed inside the stamping groove (202). The top surface of the ejector pins (501) is flush with the top surface of the lower mold frame (201). One end of each ejector pin (501) away from the top surface of the lower mold frame (201) passes through the lower mold frame (201) and is connected to a movable plate (502) movably disposed in the slot a (203). The movable plate (502) is provided with a sliding hole that slides with the support column (401). A spring b (503) is sleeved on the outside of the support column (401) between the movable plate (502) and the lifting slide plate (402). The top of the spring b (503) contacts the movable plate (502) through a washer b (504).

8. The stamping die for producing the backplate of an LED backlight module according to claim 1, characterized in that, The gasket a (408) is a rubber ring or a metal ring.

9. The stamping die for producing the backplate of an LED backlight module according to claim 1, characterized in that, The upper mold assembly (3) includes an upper mold frame (301) disposed at the bottom of the lifting seat (103). The upper mold frame (301) has an inner groove b (302). A stripper plate (303) corresponding to the groove b (302) is movably disposed between the upper mold frame (301) and the lower mold assembly (2). A plurality of guide posts b (304) that slide with the lifting seat (103) are installed on the stripper plate (303). A spring a (306) sleeved on the outside of the guide post b (304) is connected between the stripper plate (303) and the lifting seat (103). A vent hole b (305) corresponding to the groove b (302) is opened on the lifting seat (103). A limiting rod (307) connected to the bottom of the lifting seat (103) is disposed inside the groove b (302).

10. The stamping die for producing the backplate of an LED backlight module according to claim 9, characterized in that, The distance between the bottom of the limiting rod (307) and the bottom of the upper mold frame (301) is consistent with the thickness of the unloading plate (303).

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