High-thermal-conductivity aluminum alloy material for ai liquid cooling heat dissipation module and application thereof

Abstract

The application relates to a high-thermal-conductivity aluminum alloy material for an AI liquid cooling heat dissipation module and application thereof, and belongs to the technical field of liquid cooling plate materials. The application comprises low-silicon Al-Mg-Cu series aluminum alloy powder and nano components; the low-silicon Al-Mg-Cu series aluminum alloy powder comprises the following components: Mg 2.0-4.0 wt%, Cu 0.8-3.0 wt%, Si 0.1-0.8 wt%, and the balance of Al and inevitable impurities; the nano components comprise nano CeO2, nano La2O3 and nano BN, the addition amount of the nano CeO2 is 0.1-1.5 wt%, the addition amount of the nano La2O3 is 0.1-1.0 wt%, and the addition amount of the nano BN is 0.1-1.5 wt%. The scheme can reduce the thermal conduction hindering effect in a traditional high-silicon aluminum alloy system, improve material organization uniformity and thermal conduction path continuity, and improve material thermal conduction performance, structural compactness and liquid cooling environment stability.

Description

Technical Field

[0001] This application relates to a high thermal conductivity aluminum alloy material for AI liquid cooling heat dissipation modules and its application, belonging to the field of liquid cooling plate material technology. Background Technology

[0002] Currently, with the continuous increase in the power density of AI servers, high-performance GPUs, and data centers, traditional air cooling is no longer sufficient to meet the heat dissipation requirements of high heat flux density devices. Liquid cooling technology, with its advantages of high heat exchange efficiency, low energy consumption, and good heat dissipation stability, is gradually becoming an important development direction for thermal management in AI data centers.

[0003] In existing liquid cooling systems, the liquid cooling plate is the core component for heat transfer, and its material properties directly affect the overall heat dissipation efficiency. Currently, liquid cooling plates are mostly made of aluminum or aluminum alloys, mainly because aluminum has advantages such as light weight, good thermal conductivity, low processing cost, and ease of forming, and is therefore widely used in the field of liquid cooling for AI servers.

[0004] As liquid cooling structures gradually evolve towards complex microchannels, integration, and lightweight designs, additive manufacturing technology, capable of producing integrated complex liquid cooling components, is increasingly being used in the fabrication of aluminum liquid cooling plates. Among these, metal additive manufacturing processes such as selective laser melting (SLM) can overcome the limitations of traditional machining in forming complex liquid cooling components, improving the integrated manufacturing capabilities of liquid cooling plates and the ability to form complex components. Therefore, it has promising application prospects in the field of AI-driven liquid cooling thermal management.

[0005] However, during the additive manufacturing process, existing aluminum liquid cooling plates are prone to defects such as pores, cracks and uneven structure due to the rapid melting and solidification of laser and the interlayer thermal circulation. This leads to discontinuous heat conduction pathways inside the material, and further causes a decrease in thermal conductivity and an increase in local thermal resistance.

[0006] Meanwhile, existing aluminum materials are prone to localized corrosion, decreased interlayer stability, and insufficient thermal cycling stability under long-term coolant circulation conditions, which affects the long-term operational reliability of liquid cooling plates.

[0007] Therefore, how to improve the internal thermal conductivity continuity, structural density, and long-term stability of the liquid cooling environment of aluminum liquid-cooled plates while ensuring their lightweight and formability of complex structures has become a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0008] To address the aforementioned issues, a high thermal conductivity aluminum alloy material for AI liquid cooling heat dissipation modules and its application are provided. By using low-silicon Al-Mg-Cu aluminum alloy powder as the matrix material and combining it with nano CeO2, nano La2O3 and nano BN, the thermal conductivity resistance in traditional high-silicon aluminum alloy systems can be reduced, while improving the material's microstructure uniformity and the continuity of the thermal conductivity pathway, thereby enhancing the material's thermal conductivity, structural density, and stability in the liquid cooling environment.

[0009] This application provides a high thermal conductivity aluminum alloy material for AI liquid cooling heat dissipation modules, which is a composite aluminum alloy powder, the composite aluminum alloy powder comprising low silicon Al-Mg-Cu aluminum alloy powder and nano-components; The low-silicon Al-Mg-Cu aluminum alloy powder comprises, by mass percentage: Mg 2.0~4.0wt%, Cu 0.8~3.0wt%, Si 0.1~0.8wt%, with the balance being Al and unavoidable impurities; The nano-components include nano CeO2, nano La2O3, and nano BN. Based on the mass of low-silicon Al-Mg-Cu aluminum alloy powder, the amount of nano CeO2 added is 0.1~1.5wt%, the amount of nano La2O3 added is 0.1~1.0wt%, and the amount of nano BN added is 0.1~1.5wt%.

[0010] Optionally, the low-silicon Al-Mg-Cu aluminum alloy powder has an average particle size of 15~50μm and a sphericity of not less than 90%. The average particle size of the nano-CeO2 is 20~150nm, the average particle size of the nano-La2O3 is 30~200nm, and the average particle size of the nano-BN is 50~500nm.

[0011] This application provides an aluminum alloy liquid cooling plate made of the aforementioned high thermal conductivity aluminum alloy material, wherein the high thermal conductivity aluminum alloy liquid cooling plate further includes a ceramic oxide layer with a thickness of 5~30μm.

[0012] This application provides a method for preparing the above-mentioned aluminum alloy liquid cooling plate, the method comprising the following steps: S1. Prepare a coupling agent solution by adding silane coupling agent to an organic solvent, and then add deionized water for hydrolysis treatment; S2. Nano CeO2, nano La2O3 and nano BN are added to the coupling agent solution obtained in step S1, and the nano dispersion slurry is obtained after ultrasonic dispersion and high-speed shear dispersion. S3. Mix the low-silicon Al-Mg-Cu aluminum alloy powder with the nano-dispersion slurry obtained in step S2 to make the nano-components adhere to the surface of the aluminum alloy powder. After drying and sieving, composite aluminum alloy powder is obtained. S4. The composite aluminum alloy powder obtained in step S3 is printed into shape using a laser selective melting additive manufacturing equipment. S5. Heat-treat the liquid cooling plate after printing; S6. Perform micro-arc oxidation surface treatment on the heat-treated liquid cooling plate to obtain a high thermal conductivity aluminum alloy liquid cooling plate for AI liquid cooling heat dissipation module.

[0013] Optionally, the silane coupling agent in step S1 is one or more of KH550, KH560, and KH570.

[0014] Optionally, in step S2, the ultrasonic dispersion time is 30-120 min, the high-speed shear dispersion speed is 3000-10000 rpm, and the time is 10-60 min; and / or, In step S3, the mixing temperature is 30~60℃, the mixing speed is 100~300rpm, and the mixing time is 2~8h.

[0015] Optionally, in step S4, the printing protective atmosphere is argon, and the oxygen content during the printing process is less than 200 ppm. Optionally, step S4 uses a partitioned gradient energy density scanning method for printing; Optionally, the printing parameters include: laser power 250~380W, scanning speed 800~1500mm / s, scanning spacing 0.08~0.15mm, and powder layer thickness 20~50μm; Optionally, in step S4, an interlayer rotation scanning strategy is used during the printing process, with an interlayer rotation angle of 45~90°; Optionally, the preheating temperature of the printing substrate in step S4 is 150~300℃; Optionally, in step S4, ultrasonic-assisted vibration is applied to the bottom of the molding substrate during the printing process. The ultrasonic-assisted vibration frequency is 15~40kHz, the amplitude is 5~20μm, and the ultrasonic power is 300~1200W.

[0016] Optionally, step S5 includes stress-relieving heat treatment and homogenization heat treatment; Optionally, the stress-relieving heat treatment temperature is 250~380℃, and the holding time is 1~4h; Optionally, the homogenization heat treatment temperature is 430~520℃, and the holding time is 10~60min.

[0017] Optionally, the micro-arc oxidation electrolyte in step S6 includes at least two of Na2SiO3, NaOH, and NaF; Optionally, in step S6, the micro-arc oxidation treatment voltage is 300~500V, the frequency is 500~1200Hz, and the treatment time is 5~30min.

[0018] This application provides an AI liquid cooling heat dissipation module, including the aforementioned aluminum alloy liquid cooling plate.

[0019] The beneficial effects of this application include, but are not limited to: 1. The high thermal conductivity aluminum alloy material for AI liquid cooling heat dissipation module and its application according to this application adopts low silicon Al-Mg-Cu aluminum alloy as the matrix material and is compounded with nano CeO2, nano La2O3 and nano BN components. The low siliconization design reduces the problem of increased thermal resistance caused by Si phase segregation in traditional high silicon additive manufacturing aluminum alloys. At the same time, rare earth oxides and BN are used to improve the uniformity of material structure and the continuity of thermal conduction path, thereby improving the overall thermal conductivity of the liquid cooling plate.

[0020] 2. The high thermal conductivity aluminum alloy material for AI liquid cooling heat dissipation modules according to this application and its application, through the application of nano-CeO2 and nano-L... a2 O3 and nano BN are pre-dispersed and then uniformly adhered to the surface of aluminum alloy powder using KH550 silane coupling agent. This effectively reduces the agglomeration of nano-components, improves the uniformity of composite powder, and helps to improve the interlayer bonding state and reduce porosity defects, thereby improving the microstructure density of the liquid cooling plate and reducing porosity defects.

[0021] 3. Based on the high thermal conductivity aluminum alloy material and its application for AI liquid cooling heat dissipation module of this application, the partitioned gradient energy density scanning strategy combined with ultrasonic-assisted vibration additive manufacturing process is adopted. By controlling the energy input in different regions and cooperating with ultrasonic-assisted vibration process, the problems of porosity, cracks and uneven structure formed in the additive manufacturing process can be reduced, and the interlayer density and structural stability can be further improved.

[0022] 4. The high thermal conductivity aluminum alloy material for AI liquid cooling heat dissipation module and its application according to this application, after additive manufacturing, further combined with stress relief heat treatment, short-time homogenization treatment and micro-arc oxidation surface treatment, can not only reduce printing residual stress and improve the uniformity of the structure, but also form a dense ceramic oxide layer on the surface of the liquid cooling plate, thereby improving the corrosion resistance and operational reliability of the liquid cooling plate in the long-term coolant circulation environment. Detailed Implementation

[0023] The present application is described in detail below with reference to the embodiments, but the present application is not limited to these embodiments. Unless otherwise specified, the raw materials and reagents in the embodiments of the present application are all purchased through commercial channels.

[0024] The present application scheme is described below through specific embodiments.

[0025] Example 1 This embodiment provides a high thermal conductivity aluminum alloy liquid cooling plate for AI liquid cooling heat dissipation modules and its additive manufacturing preparation method.

[0026] The aluminum alloy system used is a low-silicon Al-Mg-Cu alloy powder, wherein the components, by mass percentage, are: Mg 2.8wt%, Cu 1.5wt%, Si 0.35wt%, with the balance being Al and unavoidable impurities. The aluminum alloy powder used is an atomized spherical powder with an average particle size D. 50 The particle size is 28 μm and the sphericity is not less than 95%. In addition, based on the mass of low-silicon Al-Mg-Cu aluminum alloy powder, 0.6 wt% of nano CeO2, 0.4 wt% of nano La2O3 and 0.5 wt% of nano BN are added, wherein the average particle size of nano CeO2 is 80 nm, the average particle size of nano La2O3 is 100 nm and the average particle size of nano BN is 200 nm.

[0027] The specific preparation method includes the following steps: 1) First, the composite powder was pretreated. A coupling agent solution was prepared by adding KH550 silane coupling agent to anhydrous ethanol, with the amount of KH550 added being 1 wt% of the aluminum alloy powder mass. Then, deionized water (50% by mass of KH550) was added, and the pH was adjusted to 4.5. The mixture was stirred at room temperature for 30 minutes to complete hydrolysis. Next, nano-CeO2, nano-La2O3, and nano-BN were added to the coupling agent solution. The mixture was ultrasonically dispersed for 60 minutes, followed by high-speed shearing at 6000 rpm for 30 minutes to obtain a uniform nano-dispersion slurry.

[0028] 2) Subsequently, Al-Mg-Cu alloy powder was added to a planetary mixer, and the above-mentioned nano-dispersion slurry was slowly added. The mixture was stirred at 180 rpm for 4 hours at 40°C to ensure that the nano-components were uniformly attached to the surface of the aluminum alloy powder. After mixing, the mixture was dried under vacuum at 60°C for 10 hours and then sieved through an 80-mesh sieve to obtain composite aluminum alloy powder.

[0029] 3) The obtained composite aluminum alloy powder is printed using laser selective melting additive manufacturing equipment. The printing protective atmosphere is high-purity argon, and the oxygen content during the printing process is controlled to be below 100ppm.

[0030] The printing process employs a zoned gradient energy density scanning method. The printing parameters for the main body area of ​​the liquid-cooled plate are: laser power 320W, scanning speed 1200mm / s, scanning spacing 0.11mm, and powder layer thickness 30μm. The printing parameters for the edge area of ​​the liquid-cooled plate are: laser power 280W, scanning speed 1000mm / s, scanning spacing 0.09mm, and powder layer thickness 30μm. A 67° interlayer rotation scanning strategy is used during printing, and the substrate preheating temperature is 220℃.

[0031] Meanwhile, during the printing process, ultrasonic-assisted vibration is applied to the bottom of the substrate. The ultrasonic frequency is 25kHz, the amplitude is 12μm, and the ultrasonic power is 800W.

[0032] 4) After printing, stress relief heat treatment is performed first: under the protection of high-purity argon, the temperature is increased to 320℃ at 5℃ / min and held for 2 hours, and then cooled to room temperature with the furnace; then a short-term homogenization treatment is performed: the temperature is increased to 480℃ at 8℃ / min and held for 20 minutes, and then cooled with high-purity argon.

[0033] 5) After heat treatment, the connecting end face of the liquid cooling plate is mechanically precision machined, and then subjected to micro-arc oxidation surface treatment. The micro-arc oxidation electrolyte composition is: Na2SiO3 12g / L, NaOH 3g / L and NaF 2g / L; the treatment voltage is 420V, the frequency is 800Hz, and the treatment time is 12min, thereby forming a ceramic oxide layer with a thickness of 18μm on the surface of the liquid cooling plate, thus obtaining a high thermal conductivity aluminum alloy liquid cooling plate for AI liquid cooling heat dissipation module.

[0034] Comparative Example 1 The difference between this comparative example and Example 1 is that it uses conventional AlSi. 10 Mg aluminum alloy powder replaces the low-silicon Al-Mg-Cu aluminum alloy powder in Example 1, wherein AlSi 10 The components of the Mg aluminum alloy powder, by mass percentage, include: Si: 10.2wt%, Mg: 0.35wt%, with the balance being Al and unavoidable impurities; the average particle size of the powder used is 30μm, the sphericity is not less than 95%, and no nano CeO2, nano La2O3, or nano BN are added.

[0035] Comparative Example 2 The difference between this comparative example and Example 1 is that: no nano CeO2 and nano La2O3 are added, only nano BN is retained, and only 0.5 wt% nano BN is added based on the mass of low silicon Al-Mg-Cu aluminum alloy powder.

[0036] Comparative Example 3 The difference between this comparative example and Example 1 is that no nano BN is added, only nano CeO2 and nano La2O3 are added. Based on the mass of low silicon Al-Mg-Cu aluminum alloy powder, 0.6 wt% of nano CeO2 and 0.4 wt% of nano La2O3 are added.

[0037] Comparative Example 4 The difference between this comparative example and Example 1 is that the nano CeO2, nano La2O3 and nano BN were not pretreated with coupling agents or ultrasonically dispersed, but were directly mechanically mixed with low-silicon Al-Mg-Cu aluminum alloy powder. Specifically, the nano CeO2, nano La2O3 and nano BN were directly added to the Al-Mg-Cu aluminum alloy powder and mixed at 120 rpm for 2 hours at room temperature using a conventional drum mixer, and then directly laser selective melting printing was performed.

[0038] Comparative Example 5 The difference between this comparative example and Example 1 is that ultrasonic-assisted vibration is not applied during the printing process, and no ultrasonic-assisted vibration device is set up during the laser selective melting printing process.

[0039] Comparative Example 6 The difference between this comparative example and Example 1 is that: the partitioned gradient energy density scanning method is not used in the printing process, but a unified printing parameter is used for overall printing. The overall printing parameters of the liquid cooling plate are uniformly set as follows: laser power 300W, scanning speed 1100mm / s, scanning spacing 0.10mm, and powder layer thickness 30μm.

[0040] Comparative Example 7 The difference between this comparative example and Example 1 is that the low-silicon Al-Mg-Cu aluminum alloy powder used has an average particle size of 75 μm.

[0041] Comparative Example 8 The difference between this comparative example and Example 1 is that the low-silicon Al-Mg-Cu aluminum alloy powder used has an average particle size of 8 μm.

[0042] Comparative Example 9 The difference between this comparative example and Example 1 is that the average particle size of the nano-BN used is 2 μm.

[0043] Comparative Example 10 The difference between this comparative example and Example 1 is that: after adding the coupling agent solution, nano CeO2, nano La2O3 and nano BN are only ultrasonically dispersed for 60 minutes, and are no longer subjected to high-speed shear dispersion.

[0044] Comparative Example 11 The difference between this comparative example and Example 1 is that the nano CeO2, nano La2O3 and nano BN were only subjected to high-speed shearing at 6000 rpm for 30 min after the coupling agent solution was added, without ultrasonic dispersion.

[0045] Comparative Example 12 The difference between this comparative example and Example 1 is that the interlayer rotation scanning strategy is not used during the printing process, but a fixed-direction scanning strategy is used instead.

[0046] Comparative Example 13 The difference between this comparative example and Example 1 is that the printing substrate is not preheated during the printing process.

[0047] Comparative Example 14 The difference between this comparative example and Example 1 is that: after printing, only stress relief heat treatment is performed, and no homogenization heat treatment is performed. Specifically, under the protection of high-purity argon, the temperature is raised to 320°C at 5°C / min and held for 2 hours, and then cooled to room temperature with the furnace.

[0048] Comparative Example 15 The difference between this comparative example and Example 1 is that no micro-arc oxidation surface treatment is performed after printing and heat treatment.

[0049] Test Example 1 Performance tests were conducted on the products obtained in the examples and comparative examples, and the test results are shown in Table 1 below.

[0050] The test items include the following: To characterize the thermal conductivity of aluminum alloy liquid cooling plates, the thermal conductivity (unit: W / (m·K)) was measured using a laser flash analysis (LFA). The test conditions were: test temperature 25℃, sample size 10mm × 10mm × 2mm. This parameter reflects the material's internal thermal conductivity and the continuity of the thermal conduction path. A higher thermal conductivity indicates higher thermal conductivity efficiency, which is more beneficial for improving the heat dissipation performance of AI liquid cooling modules.

[0051] To characterize the internal porosity and defects of additively manufactured aluminum alloy liquid-cooled plates, industrial CT was used to perform three-dimensional porosity testing (in %). The testing conditions were: scanning resolution no higher than 5 μm. This parameter reflects the number of internal porosity and defects and the structural integrity of the material; the lower the porosity, the fewer the internal defects and the better the overall structural density.

[0052] To characterize the overall densification degree of additively manufactured aluminum alloy liquid-cooled plates, the relative density (unit: %) of the material was measured using the Archimedes' displacement method, and the test method was performed according to GB / T 1423-1996. This parameter reflects the degree of internal density and interlayer bonding of the material; the higher the relative density, the denser the overall structure of the material and the better the interlayer bonding effect.

[0053] To characterize the internal heat transfer rate of the aluminum alloy liquid-cooled plate, a laser flash analysis (LFA) was used to measure the thermal diffusivity of the material (unit: mm). 2 / The test conditions were: test temperature 25℃. This parameter reflects the ability of heat to diffuse and transfer within a material. The higher the thermal diffusivity, the faster the heat transfer rate within the material and the lower the thermal resistance.

[0054] To characterize the continuity and microstructure uniformity of the internal thermal conductivity pathways of aluminum alloy liquid cooling plates, the volume resistivity (in μΩ·cm) of the material was measured using a four-probe resistance meter. The test method was performed according to GB / T 3048.2-2007. This parameter reflects the internal electrical conductivity continuity and microstructure integrity of the material; the lower the volume resistivity, the fewer internal defects and interface obstacles there are, and the better the continuity of the thermal conductivity pathways.

[0055] To characterize the long-term stability of aluminum alloy liquid-cooled plates in alternating hot and cold environments, a thermal cycling test chamber was used to conduct thermal cycling tests on the materials, and the thermal conductivity retention rate (in %) after the thermal cycling was measured. The test conditions were: a cycling temperature range of -40℃ to 120℃, and 1000 cycles. This parameter reflects the thermal conductivity stability of the material in a long-term liquid-cooled cycling environment; a higher thermal conductivity retention rate indicates better long-term operational stability of the material.

[0056] Table 1. Performance test results of the examples and comparative products.

[0057] Table 1 (continued)

[0058] As can be seen from Table 1, Embodiment 1 of this application exhibits significant advantages in terms of thermal conductivity, structural compactness, and long-term stability.

[0059] Among them, the thermal conductivity of Example 1 reached 221 W / (m·K), which was significantly higher than that of Comparative Example 1 (158 W / (m·K)) and Comparative Example 3 (192 W / (m·K), and its thermal diffusivity reached 92.5 mm. 2 / s, and the volume resistivity decreased to 3.1μΩ·cm, indicating that by adopting a low-silicon Al-Mg-Cu aluminum alloy system and combining it with nano CeO2, nano La2O3 and nano BN, this application can effectively reduce the thermal conductivity resistance in the traditional high-silicon aluminum alloy system, while improving the continuity of the internal thermal conductivity pathway of the material, thereby significantly improving the thermal conductivity of the material.

[0060] Furthermore, the porosity of Example 1 was only 0.42%, and the relative density reached 99.1%, which was significantly better than Comparative Example 4 and Comparative Example 5. Comparative Example 4 did not use coupling agent pre-dispersion and ultrasonic dispersion treatment, and Comparative Example 5 did not use ultrasonic-assisted vibration additive manufacturing process. Their porosities increased to 2.15% and 1.96%, respectively. This shows that the present application can effectively reduce porosity and structural defects in the additive manufacturing process and improve the overall structural density and interlayer bonding state of the material through nano-component pre-dispersion treatment and ultrasonic-assisted additive manufacturing process.

[0061] Meanwhile, after high-speed shear dispersion and ultrasonic dispersion were removed in Comparative Examples 10 and 11, respectively, their thermal conductivity, thermal diffusivity, and relative density all decreased to varying degrees. This indicates that the synergistic effect of ultrasonic dispersion and high-speed shear dispersion is beneficial to improving the dispersion uniformity of nano-components, thereby improving the uniformity of the composite powder structure and the continuity of thermal conductivity.

[0062] In addition, after Comparative Examples 6, 12 and 13 removed the partition gradient energy density scanning, interlayer rotation scanning and preheating of the printed substrate, their porosity and thermal conductivity retention decreased, indicating that the additive manufacturing process adopted in this application is beneficial to reducing interlayer defects and thermal stress problems, thereby improving structural stability.

[0063] Furthermore, Comparative Example 14, without homogenization heat treatment, showed a decrease in both thermal conductivity and thermal conductivity retention rate; while Comparative Example 15, without micro-arc oxidation treatment, showed a decrease in thermal conductivity retention rate from 97.4% to 82.4%, indicating that this application can further improve the material's structural stability and operational reliability under long-term liquid cooling cycle environment through heat treatment and micro-arc oxidation surface treatment.

[0064] In summary, this application achieves simultaneous improvement in the thermal conductivity, structural density, and long-term stability of materials through the design of a low-silicon Al-Mg-Cu aluminum alloy system, synergistic composite of nano-CeO2 / La2O3 / BN, pre-dispersion treatment of nano-components, and synergistic control of ultrasonic-assisted additive manufacturing and post-processing. This effectively solves the problems of insufficient thermal conductivity, numerous pore defects, and poor long-term liquid cooling stability of existing additive-manufactured aluminum liquid-cooled plates.

[0065] The above description is merely an embodiment of this application, and the scope of protection of this application is not limited to these specific embodiments, but is determined by the claims of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the technical concept and principles of this application should be included within the scope of protection of this application.

Claims

1. A high thermal conductivity aluminum alloy material for AI liquid cooling heat dissipation modules, characterized in that, It is a composite aluminum alloy powder, which includes low-silicon Al-Mg-Cu aluminum alloy powder and nano-components; The low-silicon Al-Mg-Cu aluminum alloy powder comprises, by mass percentage: Mg 2.0~4.0wt%, Cu 0.8~3.0wt%, Si 0.1~0.8wt%, with the balance being Al and unavoidable impurities; The nano-components include nano CeO2, nano La2O3, and nano BN. Based on the mass of low-silicon Al-Mg-Cu aluminum alloy powder, the amount of nano CeO2 added is 0.1~1.5wt%, the amount of nano La2O3 added is 0.1~1.0wt%, and the amount of nano BN added is 0.1~1.5wt%.

2. The high thermal conductivity aluminum alloy material for AI liquid cooling heat dissipation modules according to claim 1, characterized in that, The low-silicon Al-Mg-Cu aluminum alloy powder has an average particle size of 15~50μm and a sphericity of not less than 90%. The average particle size of the nano-CeO2 is 20~150nm, the average particle size of the nano-La2O3 is 30~200nm, and the average particle size of the nano-BN is 50~500nm.

3. An aluminum alloy liquid cooling plate comprising the high thermal conductivity aluminum alloy material as described in claim 1 or 2, characterized in that, The high thermal conductivity aluminum alloy liquid cooling plate also includes a ceramic oxide layer with a thickness of 5~30μm.

4. The method for preparing the aluminum alloy liquid cooling plate as described in claim 3, characterized in that, The preparation method includes the following steps: S1. Prepare a coupling agent solution by adding silane coupling agent to an organic solvent, and then add deionized water for hydrolysis treatment; S2. Nano CeO2, nano La2O3 and nano BN are added to the coupling agent solution obtained in step S1, and the nano dispersion slurry is obtained after ultrasonic dispersion and high-speed shear dispersion. S3. Mix the low-silicon Al-Mg-Cu aluminum alloy powder with the nano-dispersion slurry obtained in step S2 to make the nano-components adhere to the surface of the aluminum alloy powder. After drying and sieving, composite aluminum alloy powder is obtained. S4. The composite aluminum alloy powder obtained in step S3 is printed into shape using a laser selective melting additive manufacturing equipment. S5. Heat-treat the liquid cooling plate after printing; S6. Perform micro-arc oxidation surface treatment on the heat-treated liquid cooling plate to obtain a high thermal conductivity aluminum alloy liquid cooling plate for AI liquid cooling heat dissipation module.

5. The method for preparing the aluminum alloy liquid cooling plate according to claim 4, characterized in that, The silane coupling agent in step S1 is one or more of KH550, KH560, and KH570.

6. The method for preparing the aluminum alloy liquid cooling plate according to claim 4, characterized in that, In step S2, the ultrasonic dispersion time is 30-120 min, the high-speed shear dispersion speed is 3000-10000 rpm, and the time is 10-60 min; and / or, In step S3, the mixing temperature is 30~60℃, the mixing speed is 100~300rpm, and the mixing time is 2~8h.

7. The method for preparing the aluminum alloy liquid cooling plate according to claim 4, characterized in that, In step S4, the protective atmosphere for printing is argon, and the oxygen content during the printing process is less than 200 ppm. Optionally, step S4 uses a partitioned gradient energy density scanning method for printing; Optionally, the printing parameters include: laser power 250~380W, scanning speed 800~1500mm / s, scanning spacing 0.08~0.15mm, and powder layer thickness 20~50μm; Optionally, in step S4, an interlayer rotation scanning strategy is used during the printing process, with an interlayer rotation angle of 45~90°; Optionally, the preheating temperature of the printing substrate in step S4 is 150~300℃; Optionally, in step S4, ultrasonic-assisted vibration is applied to the bottom of the molding substrate during the printing process. The ultrasonic-assisted vibration frequency is 15~40kHz, the amplitude is 5~20μm, and the ultrasonic power is 300~1200W.

8. The method for preparing the aluminum alloy liquid cooling plate according to claim 4, characterized in that, Step S5 includes stress-relieving heat treatment and homogenization heat treatment. Optionally, the stress-relieving heat treatment temperature is 250~380℃, and the holding time is 1~4h; Optionally, the homogenization heat treatment temperature is 430~520℃, and the holding time is 10~60min.

9. The method for preparing the aluminum alloy liquid cooling plate according to claim 4, characterized in that, The micro-arc oxidation electrolyte in step S6 includes at least two of Na2SiO3, NaOH, and NaF. Optionally, in step S6, the micro-arc oxidation treatment voltage is 300~500V, the frequency is 500~1200Hz, and the treatment time is 5~30min.

10. An AI liquid cooling heat dissipation module, characterized in that, Including the aluminum alloy liquid cooling plate as described in claim 3.

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