A soldering apparatus

Abstract

The application discloses a kind of to the stream type drop tin welding device, including bearing mechanism, mounting seat board, welding execution mechanism and tin sending mechanism.Bearing mechanism is used to place the workpiece to be welded, welding execution mechanism is arranged in the lower part of mounting seat board, including guide assembly and the two mobile seats of sliding cooperation with it, mobile seat is equipped with respectively with soldering iron with welding head, two welding heads are oppositely opened with tin guide groove, and two welding heads are oppositely close and are enclosed into flow cavity when tin guide groove.The tin sending mechanism is arranged in the upper part of mounting seat board, and the tin outlet of its tin sending pipeline is located above the flow cavity, for conveying the broken welding tin wire.Welding, two welding heads are oppositely close and make flow cavity corresponding workpiece to be welded part, and tin sending pipeline sends tin wire into flow cavity, and tin wire is melted along tin guide groove and flows to welding point after being heated.The application forms flow cavity by two welding heads oppositely folding, realizes tin concentrate melting and accurate flow guide, avoids tin bead splashing, and improves welding quality.

Description

Technical Field

[0001] This invention relates to the field of automatic soldering technology for electronic components, and specifically to a counter-current flow-type tin-drip soldering device for precision solder joint soldering. Background Technology

[0002] In the assembly of electronic components, soldering is a crucial process for connecting components to circuit boards. Traditional manual soldering methods are inefficient and produce inconsistent quality, making it difficult to meet the demands of large-scale production. Existing automated soldering equipment mostly uses a single soldering iron tip with a solder feeding mechanism, where the solder wire melts on the surface of the soldering iron tip and flows to the solder joint. Although some equipment uses a dual soldering iron structure, the two soldering irons usually work independently or only move synchronously, mainly for dual-station parallel operations to improve efficiency.

[0003] The existing technology has the following shortcomings: First, when soldering with a single soldering iron, the molten solder tends to spread on the surface of the soldering head, making it difficult to accurately control the amount and direction of solder, which easily leads to solder ball splatter and affects the soldering quality; Second, the dual soldering iron structure is only used to solder different stations or different pins separately, and does not combine the two soldering heads to form a unified flow guiding structure; Third, the coordination between the solder feeding mechanism and the soldering mechanism is not tight enough, and the positioning accuracy between the solder wire feeding position and the solder joint is insufficient, making it difficult to meet the requirements of electronic components for solder joint accuracy. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a counter-current flow-type tin soldering device, which aims to solve the technical problems in existing soldering equipment where molten tin easily spreads out and is difficult to accurately guide to the soldering point, resulting in tin ball splashing and unstable soldering quality.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] The opposing flow-type tin-dispensing device includes a support mechanism, a mounting plate, a welding actuator, and a tin-feeding mechanism.

[0007] The support mechanism is used to place the workpiece to be welded. The mounting plate serves as the basic support component. The welding actuator is located at the lower part of the mounting plate and includes a guide assembly mounted on the mounting plate, and a first movable seat and a second movable seat that slide and cooperate with the guide assembly and can move towards or away from each other along the guide assembly. A first soldering iron is mounted on the first movable seat, and a second soldering iron is mounted on the second movable seat. The first soldering iron has a first soldering tip, and the second soldering iron has a second soldering tip. A first solder guide groove and a second solder guide groove are respectively formed on the opposite side of the first soldering tip and the second solder guide groove. When the two soldering tips are close to each other, the two solder guide grooves together form a collecting cavity.

[0008] The solder feeding mechanism is located on the upper part of the mounting plate and includes a solder feeding pipe. The solder outlet of the solder feeding pipe is located above the manifold and is used to deliver broken solder wires into the manifold.

[0009] When the first welding head and the second welding head move closer to each other and the collecting cavity corresponds to the part of the workpiece to be welded on the bearing mechanism, the solder feeding pipe feeds solder wire into the collecting cavity. The solder wire is heated and melted in the collecting cavity and flows along the first solder guide groove and the second solder guide groove to the part of the workpiece to be welded.

[0010] The beneficial effects of implementing this invention are as follows:

[0011] 1. The solder melts in a concentrated manner, preventing solder balls from splashing. After the two solder heads are brought together, the solder guide pool forms a circumferentially closed collector cavity. The solder wire melts inside the collector cavity, and the solder is confined inside the cavity, preventing it from spreading outwards and effectively avoiding solder balls from splashing.

[0012] 2. Precise flow guidance ensures high soldering quality. Molten solder flows directionally along the solder guide groove towards the solder joint, with controllable solder quantity and precise flow direction, meeting the precision requirements of electronic components for solder joints.

[0013] 3. Double-sided heating ensures excellent wetting. Two soldering heads heat the solder joint simultaneously from opposite sides, resulting in uniform heating, thorough solder wetting, and high solder consistency.

[0014] 4. Compact structure and reasonable layout. The welding actuator and the solder feeding mechanism are respectively located at the lower and upper parts of the mounting plate. The solder outlet of the solder feeding pipe is directly above the collecting cavity. The overall structure is compact, the solder wire conveying path is short, and the positioning accuracy is high. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of an embodiment of the opposing flow-type droplet soldering device of the present invention;

[0017] Figure 2 This is a schematic diagram of the overall structure of an embodiment of the opposing flow-type droplet soldering device of the present invention;

[0018] Figure 3 This is a partial structural schematic diagram of an embodiment of the opposing flow-type droplet soldering device of the present invention;

[0019] Figure 4This is an exploded view of the welding actuator of an embodiment of the opposing flow-type droplet soldering device of the present invention;

[0020] Figure 5 This is one of the schematic diagrams of the welding actuator part of an embodiment of the opposing flow-type droplet soldering device of the present invention;

[0021] Figure 6 This is the second schematic diagram of the welding actuator part of an embodiment of the opposing flow-type drop soldering device of the present invention;

[0022] Figure 7 This is a schematic diagram of the linear guide rail structure of an embodiment of the opposing flow-gathering tin soldering device of the present invention;

[0023] Figure 8 This is a schematic diagram of the separation state of the first and second welding heads in an embodiment of the opposing flow-gathering tin soldering device of the present invention.

[0024] Figure 9 This is a schematic diagram of the first and second welding heads in close proximity in an embodiment of the opposing flow-gathering tin soldering device of the present invention.

[0025] Figure 10 This is a schematic diagram of the first solder head structure of an embodiment of the opposing flow-type drop soldering device of the present invention;

[0026] Figure 11 This is a schematic diagram of the solder feeding mechanism structure of an embodiment of the opposing flow-type drop soldering device of the present invention;

[0027] Figure 12 This is a schematic diagram of the tin wire cutting component structure of an embodiment of the opposing flow-type tin soldering device of the present invention;

[0028] Figure 13 This is a schematic diagram of the solder wire delivery pipe structure of the solder wire cutting assembly in an embodiment of the opposing flow type drop soldering device of the present invention.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1-Base; 2-Bearing mechanism; 3-Mounting plate; 4-Welding actuator; 41-Guide assembly; 411-Linear guide rail; 42-First moving seat; 421-First slider; 422-First support arm; 423-First rolling bearing; 43-Second moving seat; 431-Second slider; 432-Second support arm; 433-Second rolling bearing; 44-First soldering iron; 441-First soldering tip; 442-First solder guide groove; 443-First recessed guide part; 45-Second soldering iron; 451-Second soldering tip; 452-Second solder guide groove; 453-Second recessed guide part; 46-Drip solder nozzle; 47-Elastic bias assembly; 48-Push drive assembly; 481-Push drive component; 482-Push rod; 483-Wedge-shaped push part; 5- Solder feeding mechanism; 51- Solder feeding pipe; 511- Solder outlet; 512- Solder inlet; 513- Airflow interface; 52- Lifting drive assembly; 521- Lifting drive component; 522- Driving wheel; 523- Driven wheel; 524- Synchronous belt; 525- Transmission component; 6- Solder wire cutting assembly; 61- Cutting drive component; 62- Cylindrical cutter; 63- Hollow straight pipe; 631- Solder wire inlet; 64- Solder wire conveying pipe; 7- X-axis-Y-axis moving assembly; 71- X-axis moving module; 72- Y-axis moving module; 8- Vertical plate; 9- Vertical lifting mechanism; 10- Touch control screen; 101- Support frame. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] In the description of this invention, the terms "upper," "lower," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0033] Please see Figure 1 and Figure 2The opposing flow-type drop soldering device includes a base 1, a support mechanism 2, a mounting plate 3, a soldering execution mechanism 4, a solder feeding mechanism 5, and a solder wire cutting assembly 6. The base 1 is the fundamental support component of the device, made of a metallic material (such as cast iron or steel), possessing sufficient rigidity and stability to support and fix the other functional components of the device. The base 1 is generally a rectangular plate structure, with its front area used to install the support mechanism 2 and its rear area used to install the X-axis-Y-axis moving assembly 7.

[0034] like Figure 1 As shown, the support mechanism 2 is located at the front of the base 1 and is used to place and fix the workpiece to be welded (such as circuit boards, electronic components, etc.). The support mechanism 2 can take the form of a jig, fixture, or vacuum adsorption platform, and the specific structure is designed to be adapted to the shape and size of the workpiece to be welded.

[0035] like Figure 1 As shown, the X-axis-Y-axis moving assembly 7 is located at the rear of the base 1 and is used to drive the vertical plate 8 and the various functional components mounted on the vertical plate 8 to move in the horizontal plane, so as to achieve precise alignment between the welding actuator 4 and the workpiece to be welded on the bearing mechanism 2. The X-axis-Y-axis moving assembly 7 includes an X-axis moving module 71 and a Y-axis moving module 72. The X-axis moving module 71 is mounted on the base 1, and the Y-axis moving module 72 is mounted on the output end of the X-axis moving module 71. The vertical plate 8 is mounted on the output end of the Y-axis moving module 72. The X-axis moving module 71 and the Y-axis moving module 72 each include a guide rail, a slider, and a driving component. The driving component can be a servo motor with a lead screw and nut pair, a linear motor, or a stepper motor with a synchronous belt drive, etc. Through the coordinated action of the X-axis moving module 71 and the Y-axis moving module 72, the vertical plate 8 and its various functional components can achieve precise movement to any position in the horizontal plane.

[0036] like Figure 1 As shown, a vertical lifting mechanism 9 is provided on the front side of the upright plate 8, which is used to drive the mounting plate 3 to rise and fall vertically. Preferably, the vertical lifting mechanism 9 is a linear motor module. The upright plate 8 is fixedly installed on the output end of the X-axis-Y-axis moving assembly 7, and the vertical lifting mechanism 9 is provided on the front side of the upright plate 8. The mounting plate 3 is located at the output end of the vertical lifting mechanism 9. The vertical lifting mechanism 9 is used to drive the mounting plate 3 to rise and fall vertically. The X-axis-Y-axis moving assembly 7 and the vertical lifting mechanism 9 together constitute a three-dimensional spatial position adjustment system, which can move the welding actuator 4, the solder feeding mechanism 5 and the solder wire cutting assembly 6 on the mounting plate 3 as a whole to the position corresponding to the part of the workpiece to be welded on the bearing mechanism 2.

[0037] like Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7As shown, the welding actuator 4 is disposed on the lower part of the mounting plate 3, and includes a guide assembly 41, a first movable seat 42, a second movable seat 43, a first soldering iron 44, a second soldering iron 45, an elastic biasing assembly 47, and a push-drive assembly 48. The guide assembly 41 is disposed on the mounting plate 3. In this embodiment, the guide assembly 41 includes a linear guide rail 411 fixedly mounted on the mounting plate 3. The first movable seat 42 is slidably engaged with the linear guide rail 411 via a first slider 421, and the second movable seat 43 is slidably engaged with the linear guide rail 411 via a second slider 431. The extending direction of the linear guide rail 411 is parallel to the relative movement direction of the first soldering tip 441 of the first soldering iron 44 and the second soldering tip 451 of the second soldering iron 45.

[0038] It is understood that the guide component 41 is not limited to the cooperation form of linear guide rail and slider. In other embodiments, a synchronous belt linear module or a gear rack and pinion guide groove can also be used, as long as the first moving seat 42 and the second moving seat 43 can slide along a predetermined linear trajectory.

[0039] like Figure 5 As shown, a first movable base 42 is provided with a first support arm 422, and a first soldering iron 44 is disposed on the first support arm 422. A second movable base 43 is provided with a second support arm 432, and a second soldering iron 45 is disposed on the second support arm 432. The first support arm 422 and the second support arm 432 are arranged in parallel. The first soldering iron 44 has a first solder tip 441, and the second soldering iron 45 has a second solder tip 451. A first solder guide groove 442 and a second solder guide groove 452 are respectively opened on the opposite side of the first solder tip 441 and the second solder tip 451.

[0040] like Figure 5 and Figure 6 As shown, the elastic biasing component 47 is connected between the first movable seat 42 and the second movable seat 43, and is used to apply an elastic biasing force to the first movable seat 42 and the second movable seat 43 to bring them closer together. In this embodiment, the elastic biasing component 47 includes a tension spring, one end of which is connected to the first movable seat 42, and the other end is connected to the second movable seat 43. It can be understood that the elastic biasing component 47 can also use a compression spring instead of a tension spring. The compression spring is disposed between the first movable seat 42 and the second movable seat 43, and its two ends are respectively abutted against or fixedly connected to the first movable seat 42 and the second movable seat 43, which can also achieve the same effect of applying an elastic biasing force to bring them closer together.

[0041] like Figure 4 and Figure 5As shown, the push drive assembly 48 is used to drive the first movable seat 42 and the second movable seat 43 to move away from each other against the biasing force of the elastic biasing assembly 47. The push drive assembly 48 includes a push drive member 481 and a push rod 482 connected to the output end of the push drive member 481. The end of the push rod 482 is located between the first movable seat 42 and the second movable seat 43. The push drive member 481 can be driven by a motor or a cylinder, etc.

[0042] like Figure 5 As shown, in this embodiment, the end of the push rod 482 is a wedge-shaped push portion 483. A first rolling bearing 423 is provided on the first moving seat 42, and a second rolling bearing 433 is provided on the second moving seat 43. The first rolling bearing 423 and the second rolling bearing 433 are arranged opposite to each other, and their axes are both perpendicular to the axial direction of the push rod 482, forming a gap between them for the wedge-shaped push portion 483 to be inserted. When the push drive member 481 drives the push rod 482 to move along its axial direction, the wedge-shaped push portion 483 is inserted into the gap between the first rolling bearing 423 and the second rolling bearing 433, and its two inclined surfaces abut against the outer ring circumferential surfaces of the first rolling bearing 423 and the second rolling bearing 433, respectively. The push force is transmitted to the first moving seat 42 and the second moving seat 43 through the rolling bearings, so that they overcome the elastic bias force of the elastic biasing component 47 and move away from each other. When the pusher 481 drives the pusher rod 482 to move in the opposite direction, the wedge-shaped pusher 483 exits from the gap, and the first moving seat 42 and the second moving seat 43 move closer to each other under the action of the elastic bias force of the elastic bias assembly 47.

[0043] It is understood that the end of the push rod 482 is not limited to the form of a wedge-shaped push part 483. In other embodiments, a conical push part or a spherical push part can also be used, which can also achieve the function of pushing the first moving seat 42 and the second moving seat 43 to both sides respectively. Accordingly, the first moving seat 42 and the second moving seat 43 may not be provided with rolling bearings, but instead directly provided with inclined surfaces or arc surfaces that cooperate with the push part, which can also achieve the transmission of force.

[0044] like Figure 8 , Figure 9 and Figure 10As shown, both the first solder guide trough 442 and the second solder guide trough 452 are conical grooves with a gradually narrowing cross-sectional area from top to bottom. A first recessed flow guide portion 443 is formed in the middle of the inclined wall of the first solder guide trough 442 along the vertical direction, and a second recessed flow guide portion 453 is formed in the middle of the inclined wall of the second solder guide trough 452 along the vertical direction. When the first solder head 441 and the second solder head 451 approach each other under the action of the elastic bias component 47, the first solder guide trough 442 and the second solder guide trough 452 together form a flow collecting cavity. Simultaneously, the first recessed flow guide portion 443 and the second recessed flow guide portion 453 together form a solder dripping channel, and the bottom end of the solder dripping channel forms a solder dripping opening 46, which faces the part of the workpiece to be soldered on the bearing mechanism 2.

[0045] like Figure 1 , Figure 3 and Figure 11 As shown, the solder feeding mechanism 5 is located on the upper part of the mounting base plate 3, and includes a solder feeding pipe 51 and a lifting drive assembly 52. ​​The solder feeding pipe 51 is a vertically arranged hollow tubular component, with a solder outlet 511 at its lower end and a solder inlet 512 at its upper end. The solder outlet 511 of the solder feeding pipe 51 is located above the collector cavity and is used to deliver broken solder wires into the collector cavity.

[0046] like Figure 3 and Figure 11 As shown, the lifting drive assembly 52 is used to drive the solder feeding pipe 51 to move up and down, so that the solder outlet 511 of the solder feeding pipe 51 is closer to or further away from the upper end of the collecting cavity. In this embodiment, the lifting drive assembly 52 includes a lifting drive component 521, a driving wheel 522, a driven wheel 523, a timing belt 524, and a transmission component 525. The lifting drive component 521 is fixedly mounted on the mounting base plate 3, and the driving wheel 522 is located at the output end of the lifting drive component 521. The driven wheel 523 is rotatably mounted on the mounting base plate 3. The timing belt 524 is wound between the driving wheel 522 and the driven wheel 523. One end of the transmission component 525 is fixedly connected to the timing belt 524, and the other end is fixedly connected to the solder feeding pipe 51. The lifting drive component 521 can be driven by a servo motor, a stepper motor, or a rotary cylinder, etc. The lifting drive component 521 drives the synchronous belt 524 to rotate via the drive wheel 522. The synchronous belt 524 drives the solder feeding pipe 51 to move up and down in the vertical direction via the transmission component 525. When the solder feeding pipe 51 descends, the solder outlet 511 is close to the upper end of the collecting cavity, which facilitates the precise falling of the solder wire into the collecting cavity; when the solder feeding pipe 51 rises, the solder outlet 511 moves away from the upper end of the collecting cavity.

[0047] It is understood that the lifting drive assembly 52 is not limited to the synchronous belt drive form. In other embodiments, a screw and nut lifting mechanism or a cylinder direct drive can also be used, as long as the function of driving the tin feeding pipe 51 to lift is achieved.

[0048] like Figure 11 and Figure 12 As shown, the upper section of the solder feeding pipe 51 is equipped with an airflow interface 513. The airflow interface 513 is used to connect to an external air source (such as a compressed air pipeline) to introduce compressed air during the solder feeding process, thereby accelerating the downward output of the solder wire in the solder feeding pipe 51 and improving the solder feeding efficiency and reliability. The solder wire cutting assembly 6 is located on the upper part of the mounting plate 3 and is used to cut the continuous solder wire into segmented solder wire segments for delivery by the solder feeding pipe 51 to the collection chamber.

[0049] like Figure 11 , Figure 12 and Figure 13 As shown, in this embodiment, the solder wire cutting assembly 6 includes a cutting drive 61, a cylindrical cutter 62, a hollow straight tube 63, and a solder wire conveying tube 64. The cutting drive 61 is fixedly mounted on the mounting base plate 3 and can be driven by a cylinder or a linear motor. The cylindrical cutter 62 is fixedly mounted on the output end of the cutting drive 61 and moves up and down reciprocally with the output end of the cutting drive 61.

[0050] The hollow straight tube 63 is vertically arranged, with a horizontal solder wire inlet 631 in its middle. The upper end of the hollow straight tube 63 has an opening, and the lower end is connected to the solder inlet 512 of the solder delivery pipe 51. The outlet end of the solder wire delivery pipe 64 is arranged opposite to the solder wire inlet 631, and is used to deliver continuous solder wire into the hollow straight tube 63.

[0051] A cylindrical cutter 62 extends into the hollow straight tube 63 through an opening at the upper end of the tube, and its outer circumferential surface slides against the inner wall of the tube. When the cutting drive 61 drives the cylindrical cutter 62 downward to below the solder wire inlet 631, the cutting edge of the cylindrical cutter 62 cuts the solder wire located inside the hollow straight tube 63. Subsequently, the cutting drive 61 drives the cylindrical cutter 62 upward to reset, allowing the next section of solder wire to enter the hollow straight tube 63 through the solder wire inlet 631, ready for the next cut.

[0052] It should be noted that the solder wire cutting assembly 6 is not limited to the form of a cylindrical cutter and a hollow straight tube. In other embodiments, a shearing cutting structure with a fixed blade and a movable blade can also be used, as long as it can cut the continuous solder wire into segments. The cut solder segments fall into the solder feeding pipe 51 through the lower end of the hollow straight tube 63 and are then transported to the collection chamber by the solder feeding pipe 51.

[0053] like Figure 1 and Figure 2 As shown, the device also includes a touch control screen 10 for human-computer interaction. The touch control screen 10 is located above the upright plate 8 and is fixedly installed on the upper end or side of the upright plate 8 by a support frame 101.

[0054] The working principle of the opposing flow-type tin soldering device in this embodiment is as follows:

[0055] The workpiece to be welded is placed on the workpiece positioning fixture of the bearing mechanism 2 and fixed. Welding parameters are set through the touch control screen 10. The control system controls the X-axis-Y-axis moving component 7 and the vertical lifting mechanism 9 according to the set parameters, so as to move the welding execution mechanism 4, the solder feeding mechanism 5 and the solder wire cutting component 6 on the mounting plate 3 to the position corresponding to the part of the workpiece to be welded.

[0056] The elastic bias assembly 47 pulls the first moving seat 42 and the second moving seat 43 closer together, so that the first solder head 441 and the second solder head 451 are closed, the first solder guide groove 442 and the second solder guide groove 452 form a collector cavity, and the solder dripping port 46 is aligned with the part of the workpiece to be soldered.

[0057] Solder wire delivery pipe 64 delivers continuous solder wire into hollow straight pipe 63. Cutting drive unit 61 drives cylindrical cutter 62 downwards to cut the solder wire into a segment. The cut solder wire segment falls through hollow straight pipe 63 into solder delivery pipe 51. Lifting drive assembly 52 drives solder delivery pipe 51 downwards, bringing the solder outlet 511 closer to the upper end of the collection chamber. External air source introduces compressed air into solder delivery pipe 51 through airflow interface 513, accelerating the solder wire segment into the collection chamber.

[0058] The solder wire segment melts rapidly in the collector cavity under the combined heating of the first soldering iron 44 and the second soldering iron 45. Under the converging effect of the collector cavity, the molten solder flows through the droplet channel formed by the first recessed guide part 443 and the second recessed guide part 453, and is finally output from the droplet port 46 to the part of the workpiece to be soldered, thus completing the soldering.

[0059] After welding is completed, the push drive assembly 48 drives the push rod 482 to extend, and the wedge-shaped push part 483 inserts between the first rolling bearing 423 and the second rolling bearing 433, pushing the first moving seat 42 and the second moving seat 43 away from each other, so that the first welding head 441 and the second welding head 451 are separated. The lifting drive assembly 52 drives the solder delivery pipe 51 to rise, and the solder outlet 511 moves away from the upper end of the collector cavity.

[0060] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A counter-current flow-type soldering device, characterized in that, include: The supporting mechanism (2) is used to place the workpiece to be welded; Mounting base plate (3); The welding actuator (4) is located at the lower part of the mounting base plate (3), including a guide assembly (41) located on the mounting base plate (3), and a first movable seat (42) and a second movable seat (43) that are slidably engaged with the guide assembly (41) and can move closer to each other or further away from each other along the guide assembly (41). The first movable seat (42) is provided with a first soldering iron (44), and the second movable seat (43) is provided with a second soldering iron (45). The first soldering iron (44) has a first soldering tip (441), and the second soldering iron (45) has a second soldering tip (451). The first soldering tip (441) and the second soldering tip (451) are respectively provided with a first solder guide groove (442) and a second solder guide groove (452) on the opposite side. When the first soldering tip (441) and the second soldering tip (451) are close to each other, the first solder guide groove (442) and the second solder guide groove (452) together form a collector cavity. The solder feeding mechanism (5) is located on the upper part of the mounting base plate (3) and includes a solder feeding pipe (51). The solder outlet (511) of the solder feeding pipe (51) is located above the collecting cavity and is used to deliver the broken solder wire into the collecting cavity. When the first welding head (441) and the second welding head (451) move closer to each other and the collecting cavity corresponds to the part of the workpiece to be welded on the bearing mechanism (2), the solder feeding pipe (51) feeds solder wire into the collecting cavity. The solder wire is heated and melted in the collecting cavity and flows along the first solder guide groove (442) and the second solder guide groove (452) to the part of the workpiece to be welded.

2. The opposing flow-type droplet soldering device according to claim 1, characterized in that: The guide assembly (41) includes a linear guide rail (411) fixed on the mounting base plate (3), a first movable seat (42) slidingly engaging with the linear guide rail (411) via a first slider (421), and a second movable seat (43) slidingly engaging with the linear guide rail (411) via a second slider (431). The extension direction of the linear guide rail (411) is parallel to the relative movement direction of the first welding head (441) and the second welding head (451).

3. The opposing flow-gathering tin-soldering device according to claim 2, characterized in that, Both the first solder guide groove (442) and the second solder guide groove (452) are tapered grooves with a cross-sectional area that gradually narrows from top to bottom.

4. The opposing flow-gathering tin-soldering device according to claim 3, characterized in that: The first tin guide groove (442) has a first recessed guide portion (443) in the middle of the inclined wall along the vertical direction; The second tin guide tank (452) has a second recessed guide portion (453) in the middle of the inclined wall along the vertical direction; When the first solder head (441) and the second solder head (451) are close to each other and form a current collection cavity, the first recessed guide part (443) and the second recessed guide part (453) together form a solder dripping channel. The bottom end of the solder dripping channel forms a solder dripping port (46), which is directly opposite the part of the workpiece to be soldered.

5. The opposing flow-type droplet soldering device according to claim 4, characterized in that: The welding actuator (4) also includes: An elastic biasing assembly (47) is connected between the first movable seat (42) and the second movable seat (43) for applying an elastic biasing force to the first movable seat (42) and the second movable seat (43) to bring them closer together. The push drive assembly (48) includes a push drive component (481) and a push rod (482) connected to the output end of the push drive component (481). The end of the push rod (482) is located between the first movable seat (42) and the second movable seat (43). When the push drive (481) drives the push rod (482) to move along its axial direction, the end of the push rod (482) pushes the first moving seat (42) and the second moving seat (43) to the sides respectively, so that the two overcome the elastic bias force and move away from each other.

6. The opposing flow-type droplet soldering device according to claim 5, characterized in that: The end of the push rod (482) is a wedge-shaped push part (483); The welding actuator (4) further includes a first rolling bearing (423) disposed on the first movable seat (42) and a second rolling bearing (433) disposed on the second movable seat (43). The axes of the first rolling bearing (423) and the second rolling bearing (433) are both perpendicular to the axial direction of the push rod (482), and a gap is formed between them for the wedge-shaped push part to be inserted. When the wedge-shaped pusher (483) is inserted into the gap, its two inclined surfaces abut against the outer ring circumference of the first rolling bearing (423) and the second rolling bearing (433), respectively, and the pusher force is transmitted to the first moving seat (42) and the second moving seat (43) through the rolling bearing.

7. The opposing flow-type droplet soldering device according to claim 6, characterized in that: The welding actuator (4) also includes: The first support arm (422) is fixed on the first movable base (42), and the first soldering iron (44) is disposed on the first support arm (422); The second support arm (432) is fixed on the second movable base (43), and the second soldering iron (45) is disposed on the second support arm (432); The first support arm (422) and the second support arm (432) are arranged in parallel.

8. The opposing flow-type droplet soldering device according to claim 1, characterized in that: The solder feeding mechanism (5) also includes a lifting drive assembly (52) for driving the solder feeding pipe (51) to rise and fall, so that the solder outlet (511) of the solder feeding pipe (51) is close to or away from the upper end of the collecting cavity. The lifting drive assembly (52) includes a lifting drive component (521), a drive wheel (522), a driven wheel (523), a synchronous belt (524), and a transmission component (525); The lifting drive (521) is mounted on the mounting plate (3), the drive wheel (522) is located at the output end of the lifting drive (521), the driven wheel (523) is rotatably mounted on the mounting plate (3), the synchronous belt (524) is wound between the drive wheel (522) and the driven wheel (523), one end of the transmission component (525) is fixedly connected to the synchronous belt (524), and the other end is connected to the solder feeding pipe (51); The lifting drive (521) drives the synchronous belt (524) to rotate through the drive wheel (522), and the synchronous belt (524) drives the solder delivery pipe (51) to rise and fall through the transmission component (525).

9. The opposing flow-type droplet soldering device according to claim 8, characterized in that: The upper part of the solder delivery pipe (51) is provided with an airflow interface (513), which is used to connect with an external air source to accelerate the output of the solder wire in the solder delivery pipe (51).

10. The opposing flow-gathering tin soldering device according to claim 9, characterized in that, It also includes a solder wire cutting assembly (6), which comprises: Cut off the drive component (61) and fix it on the mounting base plate (3); A cylindrical cutter (62) is fixedly installed at the output end of the cutting drive (61); A hollow straight tube (63) has a horizontal tin wire inlet (631) in its middle, and the upper end of the hollow straight tube (63) has an opening (632), and the lower end is connected to the tin inlet (512) of the tin delivery pipe (51). The solder wire delivery pipe (64) is arranged with its outlet end opposite to the solder wire inlet (631) and is used to deliver solder wire into the hollow straight pipe (63); A cylindrical cutter (62) extends into the hollow straight tube (63) through the opening (632), and the outer circumferential surface of the cylindrical cutter (62) slides in contact with the inner wall of the hollow straight tube (63). The cutting drive (61) drives the cylindrical cutter (62) to move below the solder wire inlet (631) to cut the solder wire located in the hollow straight tube (63), and drives the cylindrical cutter (62) to reset upward to allow the next section of solder wire to enter the hollow straight tube (63) through the solder wire inlet (631).

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