High speed line bus assembly laser welding apparatus

Abstract

The application discloses a high-speed cable processing equipment and belongs to the technical field of high-speed cable processing equipment, in particular to a high-speed BUS assembling laser welding device, which comprises a discharging detection part, a feeding detection part and an assembling and welding unit. The assembling and welding unit comprises a feeding and assembling part, a material plate collecting assembly, two tin paste point taking assemblies and two welding assemblies. A hot melting matching part is arranged on the second welding assembly of the two welding assemblies. The hot melting matching part comprises a support fixed on a third frame body of the second welding assembly, a third cylinder fixed on the upper end of the support and a pressing block slidably connected to one side of the pressing block of the second welding assembly. The ceramic heat-conducting plate is in physical contact with the surface of the BUS and conducts the heat generated by the heating part. The physical contact type preheating can adjust the temperature difference gradient between the thick BUS and the to-be-welded thin copper foil before laser irradiation, slows down the heat extraction effect of the thick metal BUS under laser irradiation, and thus reduces the probability of welding defects such as cold welding, false welding and low bonding strength.

Description

Technical Field

[0001] This application relates to the technical field of high-speed cable processing equipment, specifically to laser welding equipment for high-speed bus assembly. Background Technology

[0002] With the rapid development of the high-speed cable industry (such as SFP, QSFP, and other data center connection cables), the industry has placed extremely high demands on product consistency and production efficiency. In the production process of high-speed cables, the assembly and soldering of the BUS (Common Grounding Busbar) is one of the key processes; the BUS not only serves to fix the cable structure, but also undertakes important grounding and electromagnetic shielding functions.

[0003] In existing high-speed cable bus soldering processes, a two-step process is typically employed. First, the bus is soldered as a whole onto the PCB board. Then, a laser is used to apply solder paste to the contact points between the bus and the extremely thin outer shielding copper foil (or braided layer) of the shielded cable, followed by fusion soldering. However, because the thickness and heat capacity of the rigid metal bus are significantly greater than those of the extremely thin outer shielding copper foil, when the same laser beam irradiates the soldering point, the thin copper foil is prone to overheating and melting due to heat accumulation. Meanwhile, because the bus has fast heat conduction and a large heat capacity, its surface temperature often fails to reach the critical temperature required for solder paste wetting within a short time. This heat capacity mismatch caused by differences in material and geometry easily leads to a temperature gradient at the soldering contact surface, resulting in cold solder joint defects such as incomplete soldering, insufficient bonding strength, and easy peeling of the solder joint under tensile stress. Summary of the Invention

[0004] The purpose of this application is to provide a high-speed bus assembly laser welding device to solve the technical problems mentioned in the background art.

[0005] To achieve the above objectives, this application provides the following technical solution: a high-speed bus assembly laser welding equipment, including an outgoing inspection unit, an incoming inspection unit, and an assembly welding unit; The assembly and welding unit includes a feeding assembly section, a material board collection component, two solder paste dispensing components, and two welding components. The second welding component is provided with a hot melt matching section, which includes a support fixed to a third frame of the second welding component, a third cylinder fixed to the upper end of the support, a pressure seat slidably connected to one side of the pressure block of the second welding component, a guide section fixed to one side of the pressure block and connected to the pressure seat for guiding the pressure seat to rise and fall, a pressure plate fixed to the lower end of the pressure seat, a ceramic heat-conducting plate fixed to the lower end of the pressure plate, a heating part fixed inside the pressure plate, and a hollow groove penetrating inside the ceramic heat-conducting plate and the pressure plate. The telescopic end of the third cylinder passes through the support and is fixed to the upper end of the pressure seat.

[0006] Preferably, washers are fixed to the lower end of the ceramic heat-conducting plate and the upper end of the pressure plate. A lens is fixed to the upper end of the pressure plate, and the lower end of the lens is pressed tightly against the upper end of the washer on the upper end of the pressure plate. An exhaust hole communicating with the hollow groove is opened inside the pressure plate. A baffle located below the lens is fixed at the opening at the upper end of the hollow groove, and a through hole for the laser to pass through is opened at the center of the baffle.

[0007] Preferably, the pressure plate is further provided with a pulsed localization heating component, which includes an isolation bushing fixed to the inner wall of the hollow groove, a hollow magnetic core fixed to the outside of the isolation bushing and located inside the pressure plate, a groove formed in the hollow magnetic core, an excitation coil fixed inside the groove, a water-cooling jacket fixed to the outside of the hollow magnetic core and located inside the pressure plate, and a shielding cover fixed to the outside of the water-cooling jacket and located inside the pressure plate. The opening of the groove faces the ceramic heat-conducting plate. A heat dissipation part and a pump body are also fixedly connected to the upper end of the pressure plate. The output end of the pump body is connected to the input end of the heat dissipation part, the output end of the heat dissipation part is connected to the input end of the water-cooling jacket, and the output end of the water-cooling jacket is connected to the input end of the pump body.

[0008] Preferably, the feeding and assembly unit includes a machine base, a vibratory feeder fixed on the machine base, a material discharge channel fixed on the machine base and located above the vibratory feeder, a material distribution component fixed on the machine base for distributing the material discharged from the discharge end of the vibratory feeder, an assembly robot fixed on the machine base for grabbing and transporting the material separated on the material distribution component, and a fourth CCD imaging unit fixed on the machine base for taking pictures of the BUS material grabbed by the assembly robot for feedback and positioning adjustment.

[0009] Preferably, the material distribution assembly includes a bracket fixed on the machine base, a first cylinder fixed on the upper end of the bracket, a material distribution seat slidably connected to the upper end of the bracket and guided by a linear guide rail, and a material trough opened on the upper end of the material distribution seat for receiving materials, wherein the telescopic end of the first cylinder is fixedly connected to one side of the material distribution seat.

[0010] Preferably, the discharge detection unit has the same structure as the feed detection unit, both including a detection platform, a fourth frame fixed to the upper part of the detection platform, a display screen fixed to the fourth frame, and a third CCD imaging unit; a conveyor belt for transporting the fixture is horizontally inserted in the detection platform, and the conveyor belt is located below the third CCD imaging unit.

[0011] Preferably, the material plate acquisition assembly includes a first frame fixed on the machine base, a first axial moving module fixed on the first frame, and a first CCD imaging unit fixed on the moving end of the first axial moving module.

[0012] Preferably, the solder paste application assembly includes a second frame fixed on the machine base, a second axial movement module fixed on the second frame, a second CCD imaging unit and a solder application unit fixed on the moving end of the second axial movement module.

[0013] Preferably, each welding assembly includes a third frame fixed on the machine base, a third axial moving module fixed on the third frame, a laser welding part and a fume extraction pipe fixed on the moving end of the third axial moving module, and the welding assembly also includes a fourth axial moving module fixed on the machine base, a second cylinder fixed on the moving end of the fourth axial moving module, and a pressure block connected to the telescopic end of the second cylinder and used to press the positioning plate.

[0014] Compared with the prior art, the beneficial effects of this application are as follows.

[0015] 1) This application includes a heat-fusion matching section on the second welding assembly. Before laser welding, a third cylinder drives the pressure seat and ceramic heat-conducting plate to press down, causing the ceramic heat-conducting plate to physically contact the BUS surface and conduct heat generated by the heating element. This physical contact preheating can harmonize the temperature gradient between the BUS and the thin copper foil to be welded before laser irradiation, mitigating the heat extraction effect of the thick metal BUS under laser irradiation, thereby reducing the probability of welding defects such as cold welding, incomplete welding, and low bonding strength.

[0016] 2) This application provides gaskets, lenses and baffles at corresponding positions on the pressure plate and ceramic heat-conducting plate. When pressed tightly, a semi-closed cavity is formed inside the hollow groove. The hollow groove and baffle structure can intercept the splashes generated by the instantaneous boiling of flux, and prevent the tiny splashed solder beads from falling into the gaps between adjacent core wires and causing short circuits.

[0017] 3) This application incorporates a pulsed localization heating component within the pressure plate. Based on the ceramic heat-conducting plate's gentle preheating of the BUS to safely dry the solder paste and activate the flux, the excitation coil of the pulsed localization heating component generates a high-frequency alternating magnetic field, targeting and inducing eddy current self-heating within the BUS and PCB substrate. At the moment of laser emission, this component can rapidly raise the surface temperature of the localized soldering area. This coupled control of contact conduction heat and targeted eddy current localization not only limits excessive lateral heat diffusion, preventing thermal damage to the insulation layer of the underlying signal lines, but also shortens the overall preheating and soldering cycle. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this application; Figure 2 This is a schematic diagram of the assembly and welding unit structure of this application; Figure 3 This is a schematic diagram of the outgoing inspection department and the incoming inspection department of this application; Figure 4This is a schematic diagram of the material loading assembly section and the material plate acquisition component structure of this application; Figure 5 This is a schematic diagram of the support, first cylinder, and material distribution seat structure of this application; Figure 6 This is a schematic diagram of the solder paste application component structure in this application; Figure 7 This is a schematic diagram of the welding assembly structure of this application; Figure 8 This is a schematic diagram of the hot-melt matching part structure of this application. Figure 1 ; Figure 9 This is a schematic diagram of the hot-melt matching part structure of this application. Figure 2 ; Figure 10 This is a schematic diagram of the ceramic heat-conducting plate, lens, heat dissipation part, and pump body structure of this application; Figure 11 This is a schematic diagram of the hollow groove and gasket structure in this application; Figure 12 This is a cross-sectional view of the pressure plate and ceramic heat-conducting plate of this application; Figure 13 For this application Figure 12 Enlarged schematic diagram of the structure at point A in the middle; Figure 14 This is a schematic diagram showing the location of the BUS solder joints in this application.

[0019] In the diagram: 1. Outgoing material inspection unit; 2. Assembly and welding unit; 3. Incoming material inspection unit; 4. Loading and assembly unit; 41. Material discharge channel; 42. Vibrating feeder; 43. Material distribution component; 431. Support; 432. First cylinder; 433. Material distribution seat; 44. Assembly robot; 45. Fourth CCD imaging unit; 5. Material board acquisition component; 51. First frame; 52. First axial movement module; 53. First CCD imaging unit; 6. Solder paste application component; 61. Second frame; 62. Second axial movement module; 63. Second CCD imaging unit; 64. Solder application unit; 7. Welding component; 71. Third frame; 72. Third axial movement module; 73. Laser welding unit; 74. 75. Smoke duct; 76. Fourth axial movement module; 77. Second cylinder; 78. Pressure block; 89. Detection table; 80. Fourth frame; 81. Display screen; 82. Third CCD imaging unit; 93. Hot melt matching unit; 94. Support; 95. Third cylinder; 96. Pressure seat; 97. Guide; 98. Pressure plate; 99. Ceramic heat-conducting plate; 90. Heating unit; 91. Hollow groove; 92. Washer; 10. Lens; 11. Baffle; 12. Through hole; 13. Exhaust hole; 14. Pulse localization heating component; 15. Heat dissipation unit; 16. Pump body; 17. Isolation bushing; 18. Hollow magnetic core; 19. Groove; 19. Excitation coil; 10. Water-cooled jacket; 11. Shielding cover. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] Please see Figures 1 to 14 This application provides a technical solution: a high-speed cable bus assembly laser welding equipment, including an outgoing inspection unit 1 for inspecting processed products, an incoming inspection unit 3 for inspecting unprocessed products, and an assembly welding unit 2 for assembling and welding products after passing through the incoming inspection unit 3. All of the above units are controlled by a unified logic control system via an industrial computer or PLC. The assembly welding unit 2 includes an incoming loading assembly unit 4 for feeding the BUS (in the high-speed cable manufacturing industry, this usually refers to a common grounding bus / busbar, which is not a bus in the communication protocol but a physical conductive metal strip) and assembling the BUS onto the material board; a material board acquisition component 5 for acquiring the feeding position; two solder paste application components 6 for applying solder to the BUS on the material board; and two welding components 7 for welding the soldered areas of the BUS. The product processing flow is as follows: A jig with a fixed material board is conveyed by a conveyor belt. The conveyor belt is driven by a servo motor, and multiple blocking cylinders are installed on the conveying track to ensure precise stopping of the jig at each station. The jig first passes through the feeding inspection unit 3, which takes pictures of the material board in the jig and uses a preset image recognition algorithm to compare it with a standard template to determine whether there are any defects in the material board (such as pad oxidation, impurities, or positional misalignment). After being inspected by the feeding inspection unit 3, the jig moves to the loading and assembly unit 4, which can place the BUS on the soldering area of ​​the material board. Then, the jig moves to the first solder paste application component 6, which applies solder to the solder joints of the BUS on the material board. After soldering, the jig moves to the first soldering component 7, which applies solder to the BUS on the material board. Laser welding is performed to weld the entire BUS onto the PCB board. Next, the board moves to the second solder paste application component 6. After the previous process, multiple wires are already welded onto the PCB board on the fixture. When the BUS is welded onto the PCB board, there will be contact points between the BUS and the ground wire or outer shielding copper foil / braid layer of the core wire on the PCB board. The second solder paste application component 6 applies solder to these contact points. After soldering, the board moves to the second welding component 7, where laser welding is performed on the contact points between the BUS and the ground wire or outer shielding copper foil / braid layer of the core wire. After the second welding is completed, the product moves to the outgoing inspection unit 1, where the welded area is photographed and inspected (the inspection includes checking the fullness of the weld, whether there are any cold solder joints or bridging).

[0022] like Figure 3 As shown, the discharge detection unit 1 and the feed detection unit 3 have the same structure and both include the following components: The test bench 8, the fourth frame 81 fixed to the upper end of the test bench 8, the display screen 82 fixed to the fourth frame 81, and the third CCD imaging unit 83; a conveyor belt for transporting the fixture is horizontally installed in the test bench 8, and the conveyor belt is located below the third CCD imaging unit 83. The third CCD imaging unit 83 takes pictures of the products and solder joints on the conveyor belt for inspection, and the images taken by the third CCD can be displayed on the display screen 82.

[0023] like Figure 4 and Figure 5 As shown, the loading assembly unit 4 includes the following components: The machine platform, a vibratory feeder 42 fixed on the machine platform, a material discharge channel 41 fixed on the machine platform and located above the vibratory feeder 42, a material distribution component 43 fixed on the machine platform for distributing the material discharged from the discharge end of the vibratory feeder 42, an assembly robot 44 fixed on the machine platform for grabbing and transporting the material separated on the material distribution component 43 (the assembly robot 44 is equipped with a vacuum nozzle or pneumatic finger at its end), and a fourth CCD imaging unit 45 fixed on the machine platform for taking pictures of the material grabbed by the assembly robot 44. The material distribution assembly 43 includes the following components: The bracket 431 is fixed on the machine base, the first cylinder 432 is fixed on the upper end of the bracket 431, the material distribution seat 433 is slidably connected to the upper end of the bracket 431 and guided by the linear guide rail, and the material trough is opened on the upper end of the material distribution seat 433 for accommodating materials, and the telescopic end of the first cylinder 432 is fixedly connected to one side of the material distribution seat 433. After the BUS is discharged from the discharge end of the vibratory feeder 42, it can enter the material trough in the material distribution seat 433. When the material trough is full (the presence of material in the trough is detected by a photoelectric sensor, which is linked to the first cylinder 432 for control, which is a mature existing technology), the telescopic end of the first cylinder 432 extends and drives the material distribution seat 433 to move on the support 431. At this time, the position of the material trough on the material distribution seat 433 is offset from the position of the discharge end of the vibratory feeder 42. The material discharged from the discharge end of the vibratory feeder 42 will be blocked by the material distribution seat 433 and cannot be discharged. Then the assembly robot 44 can grab the BUS in the material trough of the material distribution seat 433 and transport the grabbed BUS to the fixture. On the PCB board in the fixture, after the previous soldering process, multiple wires have been soldered onto the PCB board. At this time, the BUS is transported and placed on the PCB board at the BUS placement position. When the assembly robot 44 picks up the BUS and transports it, the assembly robot 44 can move the BUS to above the fourth CCD imaging unit 45. The fourth CCD imaging unit 45 takes a picture of the BUS and determines the angle and direction of the BUS (i.e., calculates the coordinate deviation and rotation angle of the BUS center point relative to the robot end). When there is a problem with the angle and direction of the BUS, it is convenient to feed back the adjustment data to the assembly robot 44 to correct the BUS (attitude compensation and displacement).

[0024] like Figure 4 As shown, the material plate acquisition assembly 5 includes the following components: The system includes a first frame 51 fixed on the machine base, a first axial movement module 52 fixed on the first frame 51, and a first CCD imaging unit 53 fixed on the moving end of the first axial movement module 52. The first axial movement module 52 can be a three-axis movement module (XYZ) or a single-axis movement module. The first CCD imaging unit 53 is fixed on the Z-axis moving end or the single-axis moving end. The position of the first CCD imaging unit 53 can be adjusted by the first axial movement module 52, so that the first CCD imaging unit 53 can move to the top of the material board and take pictures of the BUS position that has been placed on the PCB material board by the assembly robot 44. If there is a positional deviation (the vector difference between the actual placement position and the theoretical position on the drawing is calculated), the assembly robot 44 can be controlled to adjust the BUS position.

[0025] like Figure 6 As shown, the solder paste application assembly 6 includes the following components: The system includes a second frame 61 fixed to the machine base, a second axial moving module 62 fixed to the second frame 61, a second CCD imaging unit 63 and a soldering unit 64 fixed to the moving end of the second axial moving module 62; the second axial moving module 62 is an XYZ three-axis moving module, and the second CCD imaging unit 63 and the soldering unit 64 are fixed to the Z-axis moving end. The second CCD imaging unit 63 takes pictures of the material board, which can capture the position of the BUS solder paste and the contact point position between the BUS and the core wire ground wire or the outer shielding copper foil / braid layer; the soldering unit 64 can perform solder paste application on the position of the BUS solder paste and the contact point position; the soldering unit 64 is a mature existing automatic soldering component, which will not be described in detail here.

[0026] like Figure 7 As shown, welding assembly 7 includes the following components: The system comprises a third frame 71 fixed to the machine base, a third-axis moving module 72 fixed to the third frame 71, a laser welding section 73 fixed to the moving end of the third-axis moving module 72, and a fume extraction pipe 74. The third-axis moving module 72 is an XYZ three-axis moving module. The laser welding section 73 and the fume extraction pipe 74 are fixed to the Z-axis moving end. The laser welding section 73 is a mature existing laser welding component 7, which will not be described in detail here. It should be noted that the laser welding section 73 integrates a CCD camera. The CCD camera takes pictures of the material board and can capture the position of the solder paste at the BUS point and the contact point position between the BUS and the ground wire or the outer shielding copper foil / braid layer (through a visual tracking algorithm). The laser welding component 7 can perform laser welding on the position of the solder paste at the BUS point and the contact point position. At the same time, the CCD camera can take pictures to inspect the welded joints. The welding assembly 7 also includes a fourth-axis moving module 75 fixed to the machine base, a second cylinder 76 fixed to the moving end of the fourth-axis moving module 75, and a pressure block 77 connected to the telescopic end of the second cylinder 76. The bottom surface of the pressure block 77 is provided with a high-temperature resistant elastic pad to prevent damage to the PCB board surface. The fourth-axis moving module 75 is a single-axis moving module. The fourth-axis moving module 75 drives the second cylinder 76 and the pressure block 77 to perform back-and-forth translational movements. When the fixture moves to the processing position of the welding assembly 7, the fourth-axis moving module 75 can drive the second cylinder 76 and the pressure block 77 to move forward, so that the pressure block 77 is above the fixture. The second cylinder 76 retracts, causing the pressure block 77 to descend, so that the pressure block 77 presses against the fixture or the PCB board on the fixture, positioning the fixture and maintaining physical fixation during the welding process to prevent the board from warping due to thermal stress from laser welding. The first soldering component 7 is used to solder the entire BUS onto the PCB board. Figure 14 The solder joint at point C is where the BUS connects to the PCB board; the second soldering component 7 is used to laser solder the contact points between the BUS and the ground wire of the core wire or the outer shielding copper foil / braid layer. Figure 14 (Point B in the image is the solder joint connecting the BUS to the core wire). Rigid metal BUSes are typically thicker and have a larger heat capacity, while the outer shielding copper foil is very thin and has a smaller heat capacity. Under the same laser beam, the thin copper foil reaches its melting point instantly, while the thick BUS, due to its faster thermal conductivity and larger heat capacity, does not reach the critical point for solder paste wetting. This leads to cold soldering; although the solder paste melts and coats the copper foil, it does not form a good intermetallic compound with the rigid BUS substrate. Under subsequent molding or tensile stress, the solder joint detaches easily upon contact.

[0027] like Figures 7 to 11As shown, in this application, a hot-melt matching part 9 is added to the second welding assembly 7. The hot-melt matching part 9 includes a support 91 fixed to the third frame 71, a third cylinder 92 fixed to the upper end of the support 91, a pressure seat 93 slidably connected to one side of the pressure block 77, a guide part 94 fixed to one side of the pressure block 77 and connected to the pressure seat 93 for guiding the pressure seat 93, a pressure plate 95 fixed to the lower end of the pressure seat 93, a ceramic heat-conducting plate 96 fixed to the lower end of the pressure plate 95, a heating part 97 fixed inside the pressure plate 95, and a hollow groove 98 opened inside the ceramic heat-conducting plate 96 and the pressure plate 95. The telescopic end of the third cylinder 92 passes through the support 91 and is fixed to the upper end of the pressure seat 93. When the pressure block 77 presses onto the fixture or the PCB board on the fixture, and the fixture is positioned, the third cylinder 92 is extended and the pressure base 93 is lowered, causing the ceramic heat-conducting plate 96 to press onto the upper surface of the BUS. The heating element 97 generates heat, which is conducted to the BUS through the ceramic heat-conducting plate 96. This physical contact preheating before laser welding reduces the thermal gradient between the BUS and the copper foil during laser irradiation, mitigating the heat extraction effect of the BUS. This allows the copper foil, BUS, and base to reach the wetting temperature more synchronously when the laser arrives, solving the problems of cold soldering or incomplete fusion. The heating element 97 can be a PTC heating ceramic sheet with a rated operating temperature of 100°C-150°C. The heat-fusion matching part 9 also includes a temperature sensor attached to the side of the ceramic heat-conducting plate 96. The temperature sensor is electrically connected to an external controller to achieve closed-loop temperature control of the heating element 97.

[0028] like Figures 10 to 12As shown, washers 99 are fixed to the lower end of the ceramic heat-conducting plate 96 and the upper end of the pressure plate 95. A lens 10 is also fixed to the upper end of the pressure plate 95. The lower end of the lens 10 is pressed tightly against the upper end of the washer 99 on the upper end of the pressure plate 95. An exhaust hole 13 communicating with the hollow groove 98 is opened inside the pressure plate 95. The exhaust hole 13 can be connected to a negative pressure pipe, and the fumes generated during the welding process can be extracted from the hollow groove 98 through the exhaust hole 13. A baffle 11 is fixed at the opening at the upper end of the hollow groove 98. The baffle 11 is located below the lens 10, and a through hole 12 for the laser to pass through is opened at the center of the baffle 11. When the ceramic heat-conducting plate 96 is pressed down on the BUS and preheated, the washer 99 at the lower end of the ceramic heat-conducting plate 96 contacts and presses against the BUS. The laser emitted by the laser welding part 73 acts on the welding area on the BUS through the lens 10 and the through hole 12. The gasket 99 at the upper end of the pressure plate 95 is used to seal the lower end of the lens 10 with the upper end of the pressure plate 95, thereby sealing the upper opening of the hollow slot 98. The gasket 99 at the lower end of the ceramic heat-conducting plate 96 presses against the upper surface of the BUS, thereby sealing the lower opening of the hollow slot 98, forming a semi-closed cavity inside the hollow slot 98. This design of the hollow slot 98 can achieve the effect of preventing short circuits. Even if the flux inside the solder paste boils up instantly, the tiny solder beads and splattered particles can only hit the inner wall of the hollow slot 98 or the lower surface of the baffle 11, preventing them from splashing into the gaps between adjacent core wires.

[0029] like Figure 10 , Figure 12 and Figure 13 As shown, a pulsed localization heating assembly 14 is also provided inside the pressure plate 95. The pulsed localization heating assembly 14 includes an isolation bushing 143 fixed on the inner wall of the hollow groove 98, a hollow magnetic core 144 fixed outside the isolation bushing 143 and located inside the pressure plate 95, a groove 145 opened in the hollow magnetic core 144, an excitation coil 146 fixed inside the groove 145, a water-cooling jacket 147 fixed outside the hollow magnetic core 144 and located inside the pressure plate 95, and a shielding cover 148 fixed outside the water-cooling jacket 147 and located inside the pressure plate 95. The opening of the groove 145 faces the ceramic heat-conducting plate 96. A heat dissipation section 141 and a pump body 142 are fixedly connected to the upper end of the pressure plate 95. The heat dissipation section 141 is an air-cooled heat sink composed of copper pipes, fins, heat sinks and other structures. The pump body 142 is a circulating pump. The output end of the pump body 142 is connected to the input end of the heat dissipation section 141. The output end of the heat dissipation section 141 is connected to the input end of the water cooling jacket 147. The output end of the water cooling jacket 147 is connected to the input end of the pump body 142.

[0030] The pressure plate 95 is made of a non-magnetic material that does not generate eddy currents, such as silicon nitride ceramic. The isolation bushing 143 is made of quartz material, providing high-temperature resistance and physical insulation for the air passage. The hollow magnetic core 144 is used to gather and guide magnetic lines of force, and is made of high-frequency, low-loss manganese-zinc ferrite or nanocrystalline material. The excitation coil 146 is made of Litz wire wound into a ring, and the entire Litz coil is embedded in the groove 145 of the hollow magnetic core 144. It is completely encapsulated and fixed with a high thermal conductivity insulating adhesive (such as epoxy resin potting compound) to ensure that the excitation coil 146 will not loosen due to high-frequency electromagnetic oscillation. The two high-voltage leads of the excitation coil 146 pass through the hollow magnetic core 144, the shield 148, and the pressure plate 95, and are connected to an external high-frequency pulse power generator. The water-cooling jacket 147 is in close contact with the outer periphery of the hollow magnetic core 144 to dissipate the large amount of heat generated by the high-frequency pulse. The shield 148 is used to physically shield the magnetic field.

[0031] After the ceramic heat-conducting plate 96 is pressed onto the BUS, the high-frequency magnetic field generated by the control pulse localization heating component 14 and the excitation coil 146 directly induces eddy current self-heating inside the metal BUS and the PCB metal base. The bottom of the BUS is preheated before the laser strikes the thin copper foil from the top. When the temperature difference between the two is mechanically reduced, cold soldering can be effectively avoided.

[0032] The heat generated by the heating element 97 is conducted to the BUS through the ceramic heat-conducting plate 96, and the heat slowly penetrates from the ceramic heat-conducting plate 96 to the metal BUS and PCB board. If only this were used to heat the heavy metal BUS to the molten solder temperature, it would take a long time, and the heat would dissipate severely, directly damaging the insulation layer of the signal lines underneath. However, the pulse localization heating component 14 can directly induce eddy currents inside the BUS, rapidly increasing the temperature of the workpiece. The ceramic heat-conducting plate 96 itself provides a stable macroscopic preheating temperature, such as 100°C - 120°C, without damaging the wires; the high-frequency pulse electromagnet is responsible for instantly raising the surface temperature of the soldering area at the moment of laser emission.

[0033] If cold solder paste is exposed to high-power lasers or intense high-frequency induction, the flux solvent inside will boil instantly, causing metal splattering. By utilizing the heat conduction of the ceramic heat-conducting plate 96 itself, the solder paste on the BUS is dried and the flux is activated (allowing the solvent to evaporate safely, and the solder paste to begin softening and collapsing); subsequently, the high-frequency pulse and laser are activated simultaneously. At this point, the solder paste is already in a ready-to-melt state, effectively reducing the splattering rate.

[0034] To prevent strong electromagnetic interference to the CCD camera, temperature sensor, and PLC transmission signals integrated in the laser welding section 73 on the second welding assembly 7 when the excitation coil 146 of the pulse localization heating component 14 generates a high-frequency alternating magnetic field, this embodiment employs a time-division multiplexing timing coupling control strategy, the specific execution process of which is as follows: First stage (visual positioning stage): After the fixture is accurately positioned, the control system first cuts off the current of the excitation coil 146 to put it in a de-energized state, at which time no alternating electromagnetic field is generated; the integrated CCD camera of the laser welding part 73) performs alignment and image acquisition and uses a visual tracking algorithm to lock the welding coordinates; The second stage (electrostatic conduction preheating stage): The third cylinder 92 drives the hot melt matching part 9 to press down, so that the ceramic heat-conducting plate 96 is physically pressed against the surface of the BUS. The temperature sensor feeds back the real-time temperature signal to the external temperature controller. The external temperature controller performs closed-loop adjustment of the PTC heating ceramic sheet embedded in the pressure plate 95, and stably heats the BUS within 3s-5s and maintains it at a safe preheating temperature of 100°C-120°C, so as to achieve physical drying of cold solder paste and activation of flux. The third stage (targeted pulse local heating stage): The control system pauses the image acquisition and data transmission of the CCD camera and passes a high-frequency pulsed alternating current to the excitation coil 146, instantly induced eddy current self-heating inside the metal BUS, and raised the surface temperature of the local welding area to 150°C - 180°C in a short time of 50ms-200ms, so that the solder paste is in a semi-molten, softened and collapsed state ready for soldering. Fourth stage (laser-emitting welding stage): The control system immediately disconnects the current of the excitation coil 146. In the instant after the alternating electromagnetic field completely disappears, the laser welding part 73 immediately emits light to irradiate the welding area to complete the fusion welding.

[0035] By using the time-division multiplexing control sequence described above, efficient heating with anti-explosion boiling and splashing is achieved through "conductive heat drying + targeted pulsed eddy current local thermal coupling". At the physical level, electromagnetic interference of high-frequency pulsed strong magnetic field on precision optical sensing and electronic signals is avoided, which greatly improves the system consistency and operational reliability of the equipment.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this application. It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or basic characteristics of this application. Therefore, the embodiments should be regarded as exemplary and non-limiting in all respects. The scope of this application is defined by the appended claims rather than the foregoing description. Therefore, it is intended to encompass all variations falling within the meaning and scope of equivalents of the claims within this application, and no reference numerals in the claims should be regarded as limiting the scope of the claims.

[0037] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-speed bus assembly laser welding equipment, comprising an output inspection unit (1), an input inspection unit (3), and an assembly welding unit (2), characterized in that: The assembly and welding unit (2) includes a feeding assembly section (4), a material board collection component (5), two solder paste dispensing components (6), and two welding components (7); the second welding component (7) of the two welding components (7) is provided with a hot melt matching part (9), the hot melt matching part (9) includes a support (91) fixed to the third frame (71) of the second welding component (7), a third cylinder (92) fixed to the upper end of the support (91), and a pressure seat sliding on one side of the pressure block (77) of the second welding component (7). (93) A guide part (94) fixed to one side of the pressure block (77) and connected to the pressure seat (93) for lifting and guiding the pressure seat (93); a pressure plate (95) fixed to the lower end of the pressure seat (93); a ceramic heat-conducting plate (96) fixed to the lower end of the pressure plate (95); a heating part (97) fixed inside the pressure plate (95); and a hollow groove (98) through which the ceramic heat-conducting plate (96) and the pressure plate (95) are opened, wherein the telescopic end of the third cylinder (92) passes through the support (91) and is fixed to the upper end of the pressure seat (93).

2. The high-speed bus assembly laser welding equipment according to claim 1, characterized in that: The lower end of the ceramic heat-conducting plate (96) and the upper end of the pressure plate (95) are both fixed with washers (99). The upper end of the pressure plate (95) is fixed with a lens (10), and the lower end of the lens (10) is pressed tightly against the upper end of the washer (99) at the upper end of the pressure plate (95). The pressure plate (95) has an exhaust hole (13) that communicates with the hollow groove (98). The upper end of the hollow groove (98) is fixed with a baffle (11) located below the lens (10), and the center of the baffle (11) has a through hole (12) for the laser to pass through.

3. The high-speed bus assembly laser welding equipment according to claim 2, characterized in that: The pressure plate (95) is also provided with a pulse localization component (14). The pulse localization component (14) includes an isolation bushing (143) fixed on the inner wall of the hollow groove (98), a hollow magnetic core (144) fixed outside the isolation bushing (143) and located inside the pressure plate (95), a groove (145) opened in the hollow magnetic core (144), an excitation coil (146) fixed inside the groove (145), a water-cooling jacket (147) fixed outside the hollow magnetic core (144) and located inside the pressure plate (95), and a shield (148) fixed outside the water-cooling jacket (147) and located inside the pressure plate (95). The opening of the groove (145) faces the ceramic heat-conducting plate (96). The upper end of the pressure plate (95) is also fixed with a heat dissipation part (141) and a pump body (142). The output end of the pump body (142) is connected to the input end of the heat dissipation part (141), the output end of the heat dissipation part (141) is connected to the input end of the water cooling jacket (147), and the output end of the water cooling jacket (147) is connected to the input end of the pump body (142).

4. The high-speed bus assembly laser welding equipment according to claim 1, characterized in that: The loading assembly unit (4) includes a machine base, a vibrating feeder (42) fixed on the machine base, a material discharge channel (41) fixed on the machine base and located above the vibrating feeder (42), a material distribution component (43) fixed on the machine base for distributing the material discharged from the discharge end of the vibrating feeder (42), an assembly robot (44) fixed on the machine base for grabbing and transporting the material separated on the material distribution component (43), and a fourth CCD imaging unit (45) fixed on the machine base for taking pictures of the BUS material grabbed by the assembly robot (44) for feedback and positioning adjustment.

5. The high-speed bus assembly laser welding equipment according to claim 4, characterized in that: The material distribution assembly (43) includes a bracket (431) fixed on the machine base, a first cylinder (432) fixed on the upper end of the bracket (431), a material distribution seat (433) slidably connected to the upper end of the bracket (431) and guided by a linear guide rail, and a material trough opened on the upper end of the material distribution seat (433) for accommodating materials. The telescopic end of the first cylinder (432) is fixedly connected to one side of the material distribution seat (433).

6. The high-speed bus assembly laser welding equipment according to claim 1, characterized in that: The discharge detection unit (1) has the same structure as the feed detection unit (3), both including a detection table (8), a fourth frame (81) fixed to the upper end of the detection table (8), a display screen (82) fixed to the fourth frame (81), and a third CCD imaging unit (83); a conveyor belt for transporting the fixture is horizontally inserted in the detection table (8), and the conveyor belt is located below the third CCD imaging unit (83).

7. The high-speed bus assembly laser welding equipment according to claim 1, characterized in that: The material plate acquisition component (5) includes a first frame (51) fixed on the machine base, a first axial moving module (52) fixed on the first frame (51), and a first CCD imaging unit (53) fixed on the moving end of the first axial moving module (52).

8. The high-speed bus assembly laser welding equipment according to claim 1, characterized in that: The solder paste application assembly (6) includes a second frame (61) fixed on the machine base, a second axial movement module (62) fixed on the second frame (61), a second CCD imaging unit (63) fixed on the moving end of the second axial movement module (62), and a solder application unit (64).

9. The high-speed bus assembly laser welding equipment according to claim 1, characterized in that: Each welding assembly (7) includes a third frame (71) fixed on the machine base, a third axial moving module (72) fixed on the third frame (71), a laser welding part (73) fixed on the moving end of the third axial moving module (72), and a smoke extraction pipe (74). The welding assembly (7) also includes a fourth axial moving module (75) fixed on the machine base, a second cylinder (76) fixed on the moving end of the fourth axial moving module (75), and a pressure block (77) connected to the telescopic end of the second cylinder (76) and used to press the positioning plate.

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