Dust removal device with self-cleaning function and laser dicing machine

Abstract

The application provides a dust removal device with self-cleaning function and a laser scribing machine, which comprises a base; a movable carrier table is movably arranged on the base and used for carrying a wafer; a laser head assembly is arranged on the base in a lifting manner and located above the movable carrier table; an executing mechanism is arranged at the bottom of the laser head assembly and used for emitting laser to the wafer to form a cutting point; a suction assembly is arranged on one side of the laser head assembly, the suction assembly is configured to move up and down with the laser head assembly, the suction assembly has a suction head, the suction head has a main suction port and a plurality of side suction ports located above the side of the main suction port, the main suction port faces the cutting point to suck dust, and the plurality of side suction ports all face the exit of the executing mechanism to suck the dust diffused to the executing mechanism.

Description

[0001] This application is a divisional application of the invention patent application filed on March 27, 2026, with application number 2026103954175. Technical Field

[0002] This application belongs to the field of semiconductor laser slicing technology, and more specifically, relates to a dust removal device with self-cleaning function and a laser scribing machine. Background Technology

[0003] Laser scribing machines are core equipment for precision semiconductor wafer processing. They are widely used in the dicing process of brittle semiconductor wafers such as single-crystal silicon, silicon carbide, and gallium nitride. They emit high-energy lasers through a laser head assembly, and precisely apply the focus of the beam to the wafer surface to form a cutting point. The wafer dicing process is completed by relying on the laser thermal effect and material modification.

[0004] During laser scribing, high-energy focusing generates a large amount of dust and debris on the wafer surface. If this dust is not collected in a timely and effective manner, it will settle and contaminate the wafer's processing area, affecting scribing accuracy and product yield. On the other hand, some dust will be dispersed upwards by the laser's hot airflow and adhere to the optical protective lens at the laser head assembly's actuator. Long-term accumulation will lead to reduced laser beam transmittance and focus shift, which in turn will cause scribing trajectory deviation, uneven groove depth, and even wafer chipping and scrap.

[0005] Existing technologies mostly use negative pressure suction components to collect dust. The mainstream forms are divided into two types: one is a suction component that moves with the laser head assembly. Although it can adsorb most of the dust, it cannot handle the dust that escapes from the adsorption field because of its fixed orientation and limited coverage of the negative pressure adsorption field. Such dust will still be disturbed by the hot airflow and contaminate the internal lenses of the laser head. The other type is a suction component located on one side of the stage. Its negative pressure adsorption field range is larger, but it is easily disturbed by the movement of the stage, and the dust adsorption effect is difficult to guarantee. Summary of the Invention

[0006] In view of the above problems, this application provides a dust removal device and a laser scribing machine with self-cleaning function, thereby solving or at least alleviating one or more of the above-mentioned problems and other problems existing in the prior art.

[0007] A first aspect of this application provides a laser scribing machine, comprising: Base; A movable stage is movably mounted on the base to support the wafer; A laser head assembly is raised and lowered on the base and located above the movable stage. An actuator is provided at the bottom of the laser head assembly. The actuator is used to emit a laser to the wafer to form a cutting point. A suction assembly is disposed on one side of the laser head assembly. The suction assembly is configured to move up and down with the laser head assembly. The suction assembly has a suction head with a main suction port and several side suction ports located above the main suction port. The main suction port faces the cutting point to suction dust, and the several side suction ports face the outlet of the actuator to suction dust that has escaped to the actuator.

[0008] In one embodiment, the suction assembly further includes a suction connecting tube having a vertical extension section, an angle adjustment section, and a support extension section connected in sequence. The vertical extension section is disposed on the laser head assembly, and the suction head is disposed at the end of the support extension section. The angle adjustment section is configured to drive the support extension section and the suction head to swing relative to the vertical extension section to adjust the orientation of the suction head.

[0009] In one embodiment, the suction head is cylindrical, the main suction port is located at the lower end of the suction head, the side suction ports are located on the side wall of the suction head near the laser head assembly, and a plurality of the side suction ports are distributed at intervals along the axial direction of the suction head.

[0010] In one embodiment, the effective flow cross-sectional area of ​​the main suction port is A, the vertical distance between the main suction port and the laser focus is H, and 1.5H2≤A≤4H2.

[0011] In one embodiment, the height of the suction head is higher than the top surface of the movable platform and lower than the bottom section of the actuator, so that the side suction port can downwards absorb dust escaping near the actuator.

[0012] In one embodiment, the axes of the plurality of side suction ports are located in the same longitudinal plane as the axis of the output end of the actuator, so that the negative pressure generated by the side suction ports can be applied to the area directly below the actuator.

[0013] A second aspect of this application provides a filtration and dust removal system, disposed on the laser scribing machine, for collecting dust adsorbed by the suction component, the filtration and dust removal system comprising: A centrifugal dust removal module is arranged adjacent to the laser head assembly. The peripheral wall of the centrifugal dust removal module is provided with an air inlet pipe that allows tangential air intake and is connected to the suction assembly. A flared connecting pipe is located at the top of the centrifugal dust removal module, and its cross-sectional area gradually increases from bottom to top; An electrostatic dust removal module is connected to the top of the flared connecting pipe. The flared connecting pipe is used to reduce the airflow velocity entering the electrostatic dust removal module. An electric field can be formed inside the electrostatic dust removal module to cause dust to be adsorbed onto the inner wall of the electrostatic dust removal module.

[0014] In one embodiment, the electrostatic dust removal module includes: A conductive cylinder, connected to the top of the flared connecting pipe, is used for electrical connection to the positive terminal of a high-voltage power supply; A conductive rod is disposed inside the conductive cylinder. The top of the conductive rod has a negative lead that extends upward through the top wall of the conductive cylinder and is used to connect with the negative terminal of a high-voltage power supply. When energized, an electric field can be formed between the conductive cylinder and the conductive rod, so that dust in the conductive cylinder is adsorbed onto the inner wall of the conductive cylinder.

[0015] In one embodiment, the inner diameter of the large-diameter end of the flared connecting pipe is D, and the inner diameter of the small-diameter end is d, where 3d≤D≤4d.

[0016] In one embodiment, the electrostatic dust removal module further includes: An insulating outer shell covers the top wall and outer periphery of the conductive cylinder and can seal the top of the conductive cylinder. The conductive rod penetrates the top wall of the insulating outer shell and is connected to the insulating outer shell.

[0017] In one embodiment, the lower end of the conductive rod is positioned higher than the flared connecting tube.

[0018] In one embodiment, the length of the conductive cylinder is L, and the inner wall radius of the conductive cylinder is R, where 8R≤L≤12R.

[0019] In one embodiment, the centrifugal dust removal module further includes a cylindrical body, a conical body, and a dust collection box connected sequentially from top to bottom. The outer periphery of the cylindrical body is provided with the air inlet pipe, and the top of the cylindrical body is provided with an exhaust pipe. The upper end of the exhaust pipe is connected to the flared connecting pipe, and the lower end of the exhaust pipe penetrates the top wall of the cylindrical body and extends downward into the cylindrical body. The lower end of the exhaust pipe is lower than the lowest point of the air inlet pipe.

[0020] In one embodiment, an acoustic dust collector is also included, which is disposed on top of the electrostatic dust removal module. The acoustic dust collector is capable of generating sound waves to cause the dust adsorbed on the electrostatic dust removal module to resonate and fall off. When the laser scribing machine is in a processing gap, the electrostatic dust removal module stops supplying power, and the acoustic dust cleaner emits sound waves.

[0021] In one embodiment, the centrifugal dust removal module is provided with a negative pressure collection port at the bottom, and a one-way valve plate is provided at the negative pressure collection port. The negative pressure in the negative pressure collection port can generate negative pressure to open the one-way valve plate and suck up the dust that escapes from the centrifugal dust removal module and the electrostatic dust removal module.

[0022] A third aspect of this application provides a laser scribing machine control method for controlling the laser scribing machine, including a controller, the controller being configured to perform the following steps: When the moving stage moves horizontally towards the side closer to the suction assembly, the suction head is controlled to operate at a first preset negative pressure adsorption power. When the moving stage moves horizontally in other directions, the suction head is controlled to operate with a second preset negative pressure adsorption power. Wherein, the first preset negative pressure adsorption power is less than the second preset negative pressure adsorption power, and the second preset negative pressure adsorption power is less than the rated negative pressure suction power of the suction head.

[0023] In one embodiment, the first preset negative pressure adsorption power is positively correlated with the moving speed of the moving platform and the laser output power of the actuator. The second preset negative pressure adsorption power is positively correlated with the moving speed of the moving platform and the laser output power of the actuator.

[0024] The beneficial effects of this application embodiment are as follows: the moving stage achieves horizontal movement through the X-axis moving stage and the Y-axis moving stage, which can drive the wafer to complete the dicing and feeding action; the laser head assembly is set to rise and fall through the guide rail slider, which can adjust the relative position between the actuator and the wafer. On the one hand, it can perform laser focusing, and on the other hand, it can adapt to the dicing of wafers of different thicknesses. The suction assembly rises and falls synchronously with the laser head assembly, which can always maintain the relative position between the suction head and the cutting point constant, avoid the suction position shift caused by the laser head focusing and rising and falling, and ensure the stability and continuity of negative pressure suction. The main suction port is positioned towards the cutting point, directly targeting the core dust-generating area to ensure timely dust extraction. This reduces dust settling into the wafer processing area and avoids the decrease in dicing accuracy caused by dust contamination. The side suction port is located above and to the side of the main suction port, facing the actuator's outlet. It specifically intercepts dust rising with the heated airflow, blocking its path to the actuator's outlet and preventing dust from entering the laser head assembly and adhering to the protective lens, causing focus shift or affecting light transmission. The main and side suction ports work together to form a zoned suction structure, covering the path of laser dicing dust spreading to the actuator. This comprehensively improves dust collection while ensuring long-term stable operation of the laser dicing machine, reducing the probability of wafer chipping and scrap. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the overall structure of the laser scribing machine of this application; Figure 2 for Figure 1 Enlarged structural diagram at point A in the middle; Figure 3 This is a schematic diagram of the suction head structure of this application; Figure 4 This is a schematic diagram of the overall structure of the filtration and dust removal system of this application; Figure 5 This is a cross-sectional view of the dust removal system of this application; Figure 6 for Figure 5 Enlarged structural diagram at point B; Figure 7 This is a cross-sectional view of a filtration and dust removal system according to another embodiment of this application; Figure 8 for Figure 7 Enlarged structural diagram at point C; Figure label: 01. Laser scribing machine; 011. Base; 012. Moving platform; 013. Laser head assembly; 014. Actuator; 02. Suction assembly; 021. Suction head; 0211. Main suction port; 0212. Side suction port; 022. Suction connecting pipe; 0221. Vertical extension section; 0222. Angle adjustment section; 0223. Support extension section; 400. Filtration and dust removal system; 420. Centrifugal dust removal module; 430. Electrostatic dust removal module; 500. Acoustic dust cleaner; 432. Flared connecting pipe; 433. Conductive cylinder; 434. Conductive rod; 435. Insulating shell; 422. Air inlet pipe; 423. Cylindrical body; 424. Conical body; 425. Exhaust pipe; 426. Dust collection box; 427. Negative pressure collection port; 428. One-way valve plate. Detailed Implementation

[0027] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in the specific implementation of this application should fall within the protection scope of the embodiments of this application.

[0028] To keep the drawings concise, each drawing only schematically shows the parts relevant to the disclosure; these do not represent the actual structure of the product. Furthermore, for ease of understanding, in some drawings, only one of components with the same structure or function is schematically shown, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one," and "several" includes "two" and "more than two."

[0029] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the liquid level of the first feature is higher than that of the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the liquid level of the first feature is lower than that of the second feature.

[0031] In the description of this embodiment, terms such as "upper," "lower," "left," and "right" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0032] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] It should be understood that, unless the context clearly states otherwise, the terms "comprising," "including," or "having" as used herein refer to the presence of an element, but do not exclude the presence or addition of one or more other elements. Furthermore, "comprising" and / or "including" as used herein specify the presence of shapes, numbers, steps, operations, members, elements, and / or combinations thereof, and do not exclude the presence or addition of one or more other shapes, numbers, operations, elements, and / or combinations thereof. Some embodiments of this application are described in detail below with reference to the accompanying drawings. Where there is no conflict between the embodiments, the following embodiments and features can be combined with each other. The steps in the following method embodiments are for illustrative purposes only and are not intended to limit this application.

[0034] During laser scribing, high-energy focusing generates a large amount of dust and debris on the wafer surface. If this dust is not collected in a timely and effective manner, it will settle and contaminate the wafer's processing area, affecting scribing accuracy and product yield. On the other hand, some dust will be dispersed upwards by the laser's hot airflow and adhere to the optical protective lens at the output port of the laser head assembly 013 actuator 014. Long-term accumulation will lead to reduced laser beam transmittance and focus shift, which in turn will cause scribing trajectory deviation, uneven groove depth, and even wafer chipping and scrapping.

[0035] To address the above issues, existing technologies often employ a negative pressure suction component 02 to collect dust. The mainstream forms fall into two categories: one is a suction component 02 that moves with the laser head component 013. While this can adsorb most dust, its fixed position on the laser head component 013 limits its effective cross-sectional area and restricts its orientation. Furthermore, to address the irregular dispersion of dust, if the negative pressure suction component 02 is too close to the cutting point, the negative pressure adsorption field will have a small coverage area, and dust will become uncontrollable once it escapes. If the negative pressure suction component 02 is too far from the cutting point, increasing the negative pressure suction power is necessary to maintain the adsorption effect. However, excessively high suction power can lead to instability of the cutting laser due to excessively fast airflow. Another type is the suction component 02 located on one side of the stage. This suction component 02 can maximize the effective flow cross-sectional area without being limited by the laser head component 013. However, during the cutting process, the movement of the moving stage 012 will affect the adsorption effect of the negative pressure adsorption field. Specifically, there are two situations: one is that the suction component 02 does not move with the moving stage 012. In this method, the negative pressure adsorption field of the suction component 02 needs to cover the entire moving path of the moving stage 012. Although this can effectively solve the problem of dust dispersion, it is also easy to adsorb other dust floating in the air into the cutting area. The second is that the suction component 02 moves with the moving stage 012. In this method, the negative pressure adsorption field is easily shifted due to the movement of the moving stage 012, thereby reducing the adsorption effect.

[0036] To solve the above problems, such as Figures 1-3 As shown, in a first aspect of this application, a laser dicing machine 01 is provided, including a base 011, a movable stage 012, a laser head assembly 013, and a suction assembly 02. The base 011 serves as the basic load-bearing component of the entire machine, providing a fixed assembly reference for the other components. The movable stage 012 is mounted on the base 011 via an X-axis movable stage and a Y-axis movable stage. The X-axis movable stage and the Y-axis movable stage are sequentially linked to achieve horizontal movement of the movable stage 012 on the base 011. The movable stage 012 is used to carry the wafer to be diced and drive the wafer to complete the horizontal feed displacement. The laser head assembly 013 is mounted on the base 011 via a C-shaped support frame. The laser generating assembly is mounted on the support frame. The laser head assembly 013 is at a certain distance from the surface of the base 011. The laser head assembly 013 is raised and lowered on the base 011 via a guide rail slider mechanism. After assembly, the laser head assembly 013 is located above the movable stage 012. The laser head assembly 013 can move vertically up and down along the guide rail slider path. An actuator 014 is fixedly mounted at the bottom of the laser head assembly 013. The actuator 014 is used to emit the focused laser. After the laser is projected onto the wafer surface, a cutting point is formed.

[0037] The suction assembly 02 is fixedly installed on one side of the laser head assembly 013. The suction assembly 02 moves vertically up and down synchronously with the laser head assembly 013 along the guide rail slider. The suction assembly 02 is provided with a suction head 021. The suction head 021 is formed with a main suction port 0211 and several side suction ports 0212. The several side suction ports 0212 are all located on the side and above the main suction port 0211. The opening of the main suction port 0211 faces the cutting point on the wafer surface and is used to suck up the dust generated at the cutting point. The openings of the several side suction ports 0212 face the outlet of the actuator 014 and are used to suck up the dust that is disturbed by the heated airflow and dispersed to the actuator 014.

[0038] The mobile stage 012 achieves horizontal wafer feeding through the cooperation of the X-axis and Y-axis mobile stages. The laser head assembly 013 is stably raised, lowered, and focused through the guide rail slider. The relative position of the suction head 021 and the cutting point is kept constant by relying on the synchronous linkage between the suction assembly 02 and the laser head assembly 013. The partitioned arrangement of the main suction port 0211 and the side suction port 0212 is used to match the suction requirements of the dust generation location at the cutting point and the dust emission path of the actuator 014 outlet.

[0039] During the actual dicing operation, the moving stage 012 is linked with the X-axis moving stage and the Y-axis moving stage to move the wafer horizontally to the dicing station. The laser head assembly 013 moves up and down along the guide rail slider to adjust the relative height between the actuator 014 and the wafer. The suction assembly 02 moves up and down synchronously with the laser head assembly 013. The actuator 014 emits a laser to the wafer surface to form a cutting point. In the dust generated by laser dicing, the dust near the wafer surface is sucked up and collected by the main suction port 0211, and the dust that rises is sucked up and collected by the side suction port 0212, thus completing the synchronous dust cleaning throughout the process.

[0040] The moving stage 012 moves horizontally via X-axis and Y-axis moving stages, enabling the wafer to complete the dicing and feeding action. The laser head assembly 013 is raised and lowered via a guide rail slider, which can adjust the relative position of the actuator 014 and the wafer. On the one hand, it can perform laser focusing, and on the other hand, it can adapt to dicing wafers of different thicknesses. The suction assembly 02 moves up and down synchronously with the laser head assembly 013, which can always maintain a constant relative position between the suction head 021 and the cutting point, avoiding the suction position shift caused by the laser head focusing and raising and lowering, and ensuring the stability and continuity of negative pressure suction. The main suction port 0211 is oriented towards the cutting point, directly targeting the core dust-generating area to ensure timely dust extraction. This reduces dust settling into the wafer processing area and avoids the decrease in dicing accuracy caused by dust contamination. The side suction port 0212 is located above and to the side of the main suction port 0211, facing the exit port of the actuator 014. It specifically intercepts dust rising with the heated airflow, blocking the path of dust adhering to the exit port of the actuator 014. This prevents dust from entering the laser head assembly 013 and adhering to the protective lens, causing focus shift or affecting light transmission. The main suction port 0211 and the side suction port 0212 work together to form a zoned suction structure, covering the path of laser dicing dust spreading to the actuator 014. This improves the overall comprehensiveness of dust collection while ensuring the long-term stable operation of the laser dicing machine 01, reducing the probability of wafer chipping and scrap.

[0041] like Figure 2As shown, the suction assembly 02 further includes a suction connecting pipe 022, which connects the suction head 021 to the subsequent dust removal components and provides support and angle adjustment for the suction head 021. The suction connecting pipe 022 is divided into three sections: a vertical extension section 0221, an angle adjustment section 0222, and a support extension section 0223, which are sequentially connected. The vertical extension section 0221 is fixedly mounted on the laser head assembly 013 using a clamp or bolts, enabling overall linkage between the suction assembly 02 and the laser head assembly 013. The angle adjustment section 0222 is located between the vertical extension section 0221 and the support extension section 0223 and can bend and swing under external force. When the angle adjustment section 0222 swings, it simultaneously drives the support extension section 0223 and the suction head 021 at the end to move, thereby adjusting the overall orientation of the suction head 021 and adapting it to different cutting conditions. The support extension section 0223 extends from the other end of the angle-adjustable swing section. On one hand, it facilitates fixing the suction head 021 and provides support for it. On the other hand, the distance between the suction head 021 and the cutting point can be adjusted by changing the length of the support extension section 0223. The suction head 021 is fixedly mounted on the end of the support extension section 0223 by a clamp, ensuring that the orientation of the suction head 021 is consistent with the orientation of the support extension section 0223.

[0042] Optionally, the angle adjustment section 0222 can be adjusted by a flexible bending structure or by a hinged rotation structure. Both types of structures can flexibly adjust the orientation of the suction head 021 to meet the dust suction needs under different working conditions.

[0043] Furthermore, the suction head 021 is arranged in a cylindrical shape, which facilitates stable airflow and ensures the concentration of the negative pressure suction field. The lower end of the suction head 021 has a main suction port 0211, which faces downwards towards the cutting point, directly targeting the dust generation location for immediate dust collection. Near the laser head assembly 013, the suction head 021 has several side suction ports 0212, all located above and to the side of the main suction port 0211. These side suction ports 0212 are evenly spaced along the axial direction of the suction head 021, with their openings facing either the outlet of the actuator 014 or parallel to it. One side suction port 0212 faces the outlet of the actuator 014. These side suction ports 0212 intercept dust particles escaping upwards with the heated airflow, blocking the path of dust diffusion towards the actuator 014.

[0044] Furthermore, to ensure effective adsorption from the side suction ports 0212, the overall height of the suction head 021 is higher than the top surface of the moving stage 012, but lower than the bottom of the actuator 014. This height of the suction head 021 prevents interference with the wafers on the moving stage 012 and allows the side suction ports 0212 to create a downward negative pressure suction force relative to the actuator 014, adsorbing dust particles that have drifted towards the actuator 014 and preventing them from moving upwards and entering the actuator 014. The axes of the side suction ports 0212 are in the same longitudinal plane as the axis of the output end of the actuator 014. This arrangement ensures that the negative pressure generated by the side suction ports 0212 acts entirely on the area directly below the actuator 014, maximizing the interception effect of drifting dust and preventing the negative pressure field from dispersing.

[0045] Furthermore, to ensure the negative pressure adsorption effect of the main suction port 0211, the effective flow cross-sectional area corresponding to the main suction port 0211 is set as A, and the vertical distance between the main suction port 0211 and the laser focus is set as H, where A and H satisfy 1.5H²≤A≤4H². The suction pressure range of the main suction port 0211 is set between 0.05MPa and 0.07MPa. This negative pressure range is suitable for the process requirements of wafer laser scribing, mainly reflecting the influence of the suction airflow velocity on the laser beam. Laser scribing relies on a focused beam to complete the process. The stability of the beam transmission directly determines the scribing accuracy, and the magnitude of the suction negative pressure directly determines the flow rate of the suction airflow. If the negative pressure is too low, the airflow speed will be too slow, making it impossible to instantly remove the dust generated at the cutting point. The dust will easily spread and contaminate the wafer and the laser exit port. If the negative pressure is too high, the airflow speed will be too fast. On the one hand, it will form a violent airflow turbulence around the laser focus. The turbulence will interfere with the straight transmission path of the laser beam, directly causing the laser focus to shift and the scribing trajectory to deviate. On the other hand, the excessively fast airflow will cause lateral disturbance to the thin and brittle wafer, destroying the wafer's positioning stability and affecting the dimensional accuracy of the scribing.

[0046] Within the pressure range mentioned above, when A is less than 1.5H², the effective flow cross-sectional area of ​​the main suction port 0211 is too small, limiting the coverage of the negative pressure field. Dust particles far around the cutting point cannot be effectively adsorbed, leading to dust residue. Simultaneously, the small airflow cross-section causes excessively high local flow velocity, generating airflow turbulence and interfering with the stability of the laser focus. When A is greater than 4H², the effective flow cross-sectional area of ​​the main suction port 0211 is too large. Under reasonable suction pressure, the negative pressure intensity per unit area decreases significantly, resulting in insufficient suction in the core dust-generating area of ​​the cutting point. This fails to remove instantaneously generated dust in a timely manner, significantly reducing dust removal efficiency. When A is between 1.5H² and 4H², under reasonable suction pressure, the coverage of the negative pressure field of the main suction port 0211 balances with the suction intensity in the core area. This ensures complete coverage of the dust diffusion area at the cutting point, achieving instantaneous dust absorption and collection, while maintaining moderate negative pressure intensity and stable airflow, preventing interference with laser beam transmission and avoiding dust residue or excessive suction.

[0047] like Figures 4-6 As shown, another aspect of this application embodiment provides a filtration and dust removal system 400. The main body of the filtration and dust removal system 400 is fixedly mounted on the support frame of the base 011, located on one side of the laser head assembly 013. The filtration and dust removal system 400 is connected to the suction assembly 02 and is used to process the dust collected by the suction assembly 02, realizing graded filtration and collection of dust. Specifically, the filtration and dust removal system 400 includes: a centrifugal dust removal module 420 and an electrostatic dust removal module 430, which are connected by a flared connecting pipe 432. The top of the electrostatic dust removal module 430 is provided with an air outlet, which is connected to a negative pressure generating device. The peripheral wall of the centrifugal dust removal module 420 is provided with an air inlet pipe 422, which is arranged tangentially along the centrifugal dust removal module 420. The other end of the air inlet pipe 422 is connected to the suction assembly 02, allowing the dust-laden airflow to enter the centrifugal dust removal module 420 tangentially. The centrifugal dust collection module 420 has, from top to bottom, a cylindrical body 423, a conical body 424, and a dust collection box 426. A dust discharge valve is installed between the dust collection box 426 and the conical body 424. This valve, acting as a gas barrier between the conical body 424 and the dust collection box 426, allows dust to be transferred into the dust collection box 426. The dust discharge valve is a mature existing technology and will not be described in detail here. The aforementioned air inlet pipe 422 is arranged around the outer periphery of the cylindrical body 423, and an exhaust pipe 425 is located at the top of the cylindrical body 423. The upper end of the exhaust pipe 425 is connected to the flared connecting pipe 432, and the lower end of the exhaust pipe 425 penetrates the top wall of the cylindrical body 423, extending into the interior of the cylindrical body 423. The lower end of the exhaust pipe 425 is lower than the lowest point of the air inlet pipe 422. After the dust-laden airflow enters the cylindrical body 423 tangentially, it forms a centrifugal rotation motion. Large dust particles fall along the cylinder wall under the action of centrifugal force and finally fall into the dust collection box 426 to complete the initial collection of large dust particles.

[0048] The flared connecting pipe 432 is connected to the top of the centrifugal dust removal module 420. Its cross-sectional area gradually increases from bottom to top. As the airflow passes through the flared connecting pipe 432, the flow velocity gradually decreases, preventing the airflow velocity from being too high when entering the electrostatic dust removal module 430, which could affect the dust adsorption effect of the electrostatic dust removal module 430. The inner diameter of the large-diameter end of the flared connecting pipe 432 is set as D, and the inner diameter of the small-diameter end is set as d, with the two being limited to a ratio of 3d ≤ D ≤ 4d. This ratio is adapted to the deceleration requirements of dust-laden airflow. When D is less than 3d, the cross-sectional increase of the flared connecting pipe 432 is too small, resulting in insufficient airflow deceleration. The high-speed dust-laden airflow directly enters the electrostatic precipitator module 430. The excessively fast airflow velocity will cause fine dust to not fully contact the electric field, making it difficult to complete adsorption. The dust will be directly discharged with the airflow, reducing the dust removal effect. When D is greater than 4d, the cross-sectional increase of the flared connecting pipe 432 is too large, causing a sudden drop in airflow velocity. This can easily form an airflow stagnation zone within the flared connecting pipe 432, causing some dust to accumulate and preventing it from entering subsequent modules. Long-term accumulation will block the airflow channel and increase the overall suction load. When D is in the range of 3d to 4d, the airflow can achieve stable deceleration. This ensures that the electrostatic precipitator effect is not affected by excessively fast flow velocity, nor that dust accumulation occurs due to excessively slow flow velocity. This guarantees that the dust-laden airflow smoothly enters the electrostatic precipitator module 430 and ensures the effectiveness of electrostatic adsorption dust removal.

[0049] Furthermore, when the dust adsorbed on the outer wall of the electrostatic dust removal module 430 is cleaned by vibration, the dust will slide down through the inner wall of the flared connecting pipe 432 into the centrifugal dust removal module 420 and finally enter the dust collection box 426. If the cross-sectional area of ​​the flared connecting pipe 432 increases too much, the gas in the electrostatic dust removal module 430 will have difficulty sliding down along the inner wall of the flared connecting pipe 432, whether under the action of gravity or under the action of negative pressure.

[0050] like Figure 5 As shown, in one embodiment, the electrostatic dust removal module 430 is connected to the top of the flared connecting pipe 432 by welding or bolting. A stable electric field can be formed inside, enabling the adsorption and collection of fine dust particles. The electrostatic dust removal module 430 includes a conductive cylinder 433 and a conductive rod 434. The conductive cylinder 433 is connected to the top of the flared connecting pipe 432 and is externally connected to the positive terminal of a high-voltage power supply. The conductive rod 434 is located at the center of the conductive cylinder 433, and a negative electrode lead is provided at the top of the conductive rod 434. The negative electrode lead extends upward through the top wall of the conductive cylinder 433 to connect to the negative terminal of the high-voltage power supply. After being energized, a ring-shaped electric field is formed between the conductive cylinder 433 and the conductive rod 434. After the decelerated dust-laden airflow enters the electric field region, the fine dust particles become charged and are adsorbed onto the inner wall of the conductive cylinder 433, completing the collection of small dust particles from the dust-laden gas.

[0051] Furthermore, the conductive cylinder 433 is externally covered by an insulating shell 435. The insulating shell 435 completely covers the top and outer peripheral walls of the conductive cylinder 433, while sealing the top opening of the conductive cylinder 433, thus providing insulation and protection to prevent electric field leakage from affecting equipment operation. The conductive rod 434 penetrates the top wall of the insulating shell 435 and remains fixedly connected to it. This ensures the positional stability of the conductive rod 434 and prevents direct contact between the negative conductive rod 434 and the positive conductive cylinder 433. The lower end of the conductive rod 434 is higher than the top end of the flared connecting pipe 432 to prevent the conductive rod 434 from interfering with the airflow path into the conductive cylinder 433.

[0052] Furthermore, the length of the conductive cylinder 433 is set to L, and the inner radius of the conductive cylinder 433 is set to R, with the two constrained to satisfy the ratio of 8R≤L≤12R. When L is less than 8R, the length of the conductive cylinder 433 is too short, the dust-laden airflow does not have enough residence time inside the cylinder, and the fine dust cannot be fully charged and adsorbed onto the cylinder wall. A large amount of fine dust will directly pass through the electric field and be discharged, and the electrostatic dust removal module 430 loses its fine filtration effect. When L is greater than 12R, the length of the conductive cylinder 433 is too long, and the airflow resistance inside the cylinder increases significantly, which will lead to the attenuation of the front-end suction negative pressure, indirectly affecting the dust adsorption effect of the main suction port 0211 and the side suction port 0212. At the same time, the excessively long cylinder will increase the overall size of the equipment, which is not conducive to the equipment layout. When L is in the range of 8R to 12R, the dust-laden airflow has sufficient residence time inside the conductive cylinder 433, the fine dust can fully contact the electric field and complete the adsorption, and the airflow resistance is moderate, which will not affect the front-end suction negative pressure, ensuring the effect of graded dust removal.

[0053] The dust removal system 400 adopts a graded dust removal method that combines centrifugal dust removal and electrostatic dust removal. The centrifugal dust removal module 420 first separates large dust particles through centrifugal force, reducing the load of subsequent fine dust treatment and extending the service life of the electrostatic dust removal module 430.

[0054] like Figure 5 , Figure 6 As shown, in one embodiment, the filtration and dust removal system 400 is further equipped with an acoustic cleaner 500, which is installed on top of the electrostatic dust removal module 430. When the laser scribing machine 01 is in the processing interval, the electrostatic dust removal module 430 stops high-voltage power supply, and the acoustic cleaner 500 starts and generates directional sound waves. The sound waves are transmitted to the inside of the electrostatic dust removal module 430, causing the dust adsorbed on the inner wall of the conductive cylinder 433 to resonate. The dust is detached from the cylinder wall by the resonance and falls downwards into the centrifugal dust removal module 420, and finally falls into the dust collection box 426 for centralized collection. This avoids dust from adhering to the inner wall of the conductive cylinder 433 for a long time and blocking the electric field channel, ensuring the long-term stable efficiency of the electrostatic dust removal module 430.

[0055] Preferably, the acoustic cleaner 500 is a diaphragm vibrator. After receiving the differential pressure signal, the control unit of the acoustic cleaner 500 starts the diaphragm sound-generating device, drives the diaphragm to generate a 100Hz sound wave with a sound pressure level of 140dB using an air source pressure of 0.5MPa. The sound wave propagates through the air to the dust accumulation layer on the inner wall of the electrostatic dust removal module 430. The dust accumulation layer resonates with the sound wave, with an amplitude of 5mm, which destroys the adhesion between particles. At the same time, the fatigue effect caused by the vibration causes microcracks to form in the dust accumulation layer. Finally, the dust accumulation layer remains in a dissipated state in the electrostatic dust removal module 430, thus completing the cleaning of the inner wall of the electrostatic dust removal module 430.

[0056] like Figure 7 , Figure 8 As shown, the centrifugal dust removal module 420 is further provided with a negative pressure collection port 427 at its bottom, and a one-way valve plate is provided inside the negative pressure collection port 427. The negative pressure collection port 427 can generate auxiliary negative pressure through an external pipeline. When the auxiliary negative pressure is activated, the one-way valve plate automatically opens under the suction of the negative pressure. After the one-way valve plate opens, it can simultaneously suck up the residual dust inside the centrifugal dust removal module 420, as well as the dust falling back from the electrostatic dust removal module 430, to prevent the fine powder inside the electrostatic dust removal module 430 from being in a scattered state and difficult to fall quickly under the action of gravity. When the laser scribing machine 01 is processing normally, the negative pressure collection port 427 stops supplying auxiliary negative pressure, and the one-way valve plate automatically closes under its own gravity or external drive, sealing the bottom of the centrifugal dust removal module 420 to prevent external air from being sucked back into the system and to ensure the stability of the internal negative pressure field.

[0057] The acoustic dust cleaner 500 enables automated cleaning of the electrostatic dust removal module 430 during equipment processing intervals, eliminating the need for manual disassembly and simplifying equipment maintenance. It also prevents long-term dust accumulation that could lead to a decrease in electric field adsorption efficiency, ensuring the long-term stable operation of the filtration dust removal system 400. The negative pressure collection port 427 at the bottom of the centrifugal dust removal module 420, in conjunction with a one-way valve plate, enables secondary collection of residual dust, further eliminating the risk of dust escape. The opening and closing structure of the one-way valve plate ensures both auxiliary dust collection and prevents backflow of external air during normal processing, maintaining stable negative pressure within the system and further improving overall dust removal airtightness.

[0058] Another aspect of this application provides a control method for a laser scribing machine 01, specifically including the following: the rated negative pressure suction power of the suction head 021 is designed to be its working power at full load, denoted as Prated; the first preset negative pressure adsorption power is the working power of the suction head 021 when the moving platform moves horizontally towards the side close to the suction assembly 02, denoted as P1, and the value range of P1 is 0.6~0.8Prated; the second preset negative pressure adsorption power is the working power of the suction head 021 when the moving platform moves horizontally in other directions, denoted as P2, and the value range of P2 is 0.8~1.0Prated; the above parameters satisfy P1 < P2 < Prated, and this value is set based on the influence of the moving direction on the probability of dust dispersion.

[0059] When the moving platform moves horizontally towards the side closer to the suction component 02, the wafer cutting point is always within the area where the suction head 021 can efficiently adsorb dust, resulting in a low risk of dust escape. Therefore, the difference between P1 and P_rated is relatively large. When the moving platform moves horizontally in other directions (such as moving horizontally away from the suction component 02, or moving in two directions perpendicular to the away direction), the movement of the moving platform easily causes airflow, resulting in dust escape. Therefore, the difference between P2 and P_rated is relatively small, ensuring the dust adsorption effect.

[0060] Based on this, both the first preset negative pressure adsorption power and the second preset negative pressure adsorption power are positively correlated with the moving speed of the moving platform. The faster the moving platform moves, the higher the corresponding first preset negative pressure adsorption power and the second preset negative pressure adsorption power. Because the faster the moving platform moves, the wider the dust dispersion range, the higher the negative pressure adsorption power required by the suction head 021 should be.

[0061] Furthermore, both the first preset negative pressure adsorption power and the second preset negative pressure adsorption power are positively correlated with the laser output power. The greater the laser output power, the more dust is generated by the laser scribing. Therefore, the negative pressure adsorption power required by the suction head 021 is higher. Thus, the moving speed of the moving platform and the laser output power together positively determine the magnitude of the negative pressure adsorption power of the suction head 021.

[0062] The first preset negative pressure adsorption power increases with the increasing speed of the moving platform, and also increases synchronously with the increasing laser output power of the actuator 014. The first preset negative pressure adsorption power decreases with the decreasing speed of the moving platform, and also decreases synchronously with the decreasing laser output power of the actuator 014. The influencing factors of the second preset negative pressure adsorption power are the same as those of the first preset negative pressure adsorption power, and will not be elaborated further here.

[0063] The uncommon terms used in this solution are explained as follows: Laser scribing refers to a processing method that uses a focused high-energy laser beam to modify or remove material from the wafer surface, achieving wafer dicing. Negative pressure suction field refers to the negative pressure airflow area formed at the suction port, where suction is generated, causing dust to move with the airflow. Centrifugal dust removal module 420 refers to a component that uses centrifugal force to separate dust from the airflow, primarily handling large dust particles. Electrostatic dust removal module 430 refers to a component that uses an electric field to adsorb fine dust, primarily handling micron-sized fine dust.

[0064] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A dust removal device with self-cleaning function, characterized in that, include: Base (011); A suction component (02) is provided on one side of the laser head assembly (013) for suctioning dust that has escaped into the laser head assembly (013); A filtration and dust removal system (400) is installed on the base (011) and includes a centrifugal dust removal module (420), a flared connecting pipe (432), and an electrostatic dust removal module (430) connected in sequence. The flared connecting pipe (432) is installed on the top of the centrifugal dust removal module (420), and the electrostatic dust removal module (430) is connected to the top of the flared connecting pipe (432). The centrifugal dust removal module (420) has an air inlet pipe (422) on its peripheral wall that allows tangential air intake and is connected to the suction assembly (02). An acoustic dust remover (500) is installed on top of the electrostatic dust removal module (430). The acoustic dust remover (500) can generate sound waves to cause the dust adsorbed on the electrostatic dust removal module (430) to resonate and fall off. When the laser head assembly (013) is in the processing gap, the electrostatic dust removal module (430) stops supplying power, and the acoustic dust remover (500) emits sound waves to remove the dust accumulated on the electrostatic dust removal module (430).

2. The dust removal device with self-cleaning function as described in claim 1, characterized in that, The acoustic soot remover (500) is a diaphragm vibrator.

3. A dust removal device with self-cleaning function as described in claim 1, characterized in that, The electrostatic dust removal module (430) includes: The conductive tube (433) is connected to the top of the flared connecting tube (432) and is used to connect to the positive terminal of the high voltage power supply. A conductive rod (434) is disposed inside the conductive cylinder (433). The top of the conductive rod (434) has a negative lead that extends upward through the top wall of the conductive cylinder (433) and is used to connect with the negative terminal of the high-voltage power supply. The lower end of the conductive rod (434) is higher than the top end of the flared connecting pipe (432). When energized, an electric field can be formed between the conductive cylinder (433) and the conductive rod (434) so ​​that the dust in the conductive cylinder (433) is adsorbed onto the inner wall of the conductive cylinder (433).

4. A dust removal device with self-cleaning function as described in claim 1, characterized in that, The cross-sectional area of ​​the flared connecting pipe (432) gradually increases from bottom to top. The flared connecting pipe (432) is used to reduce the airflow velocity entering the electrostatic dust removal module (430). An electric field can be formed inside the electrostatic dust removal module (430) to make dust adsorb onto the inner wall of the electrostatic dust removal module (430). The top of the electrostatic dust removal module (430) is provided with an air outlet for connecting to a negative pressure generating device.

5. A dust removal device with self-cleaning function as described in claim 4, characterized in that, The inner diameter of the large diameter end of the flared connecting pipe (432) is D, and the inner diameter of the small diameter end is d, where 3d≤D≤4d.

6. A dust removal device with self-cleaning function as described in claim 3, characterized in that, The electrostatic dust removal module (430) also includes: An insulating shell (435) covers the top wall and outer periphery of the conductive cylinder (433) and can seal the top of the conductive cylinder (433) to prevent electric field leakage. The conductive rod (434) penetrates the top wall of the insulating shell (435) and is connected to the insulating shell (435).

7. A dust removal device with self-cleaning function as described in claim 3, characterized in that, The length of the conductive tube (433) is L, and the inner radius of the conductive tube (433) is R, where 8R≤L≤12R.

8. A dust removal device with self-cleaning function as described in claim 1, characterized in that, The centrifugal dust removal module (420) also includes a cylindrical body (423), a conical body (424), and a dust collection box (426) connected sequentially from top to bottom. The cylindrical body (423) is provided with an air inlet pipe (422) on its outer periphery. An exhaust pipe (425) is provided at the top of the cylindrical body (423). The upper end of the exhaust pipe (425) is connected to the flared connecting pipe (432). The lower end of the exhaust pipe (425) penetrates the top wall of the cylindrical body (423) and extends downward into the cylindrical body (423). The lower end of the exhaust pipe (425) is lower than the lowest point of the air inlet pipe (422). An ash discharge valve is provided between the conical body (424) and the dust collection box (426).

9. A dust removal device with self-cleaning function as described in claim 8, characterized in that, The centrifugal dust removal module (420) is provided with a negative pressure collection port (427) at the bottom. A one-way valve plate (428) is provided at the negative pressure collection port (427). The negative pressure collection port (427) is connected to a negative pressure pipeline to generate negative pressure, which causes the one-way valve plate (428) to open and suck up the dust that escapes from the centrifugal dust removal module (420) and the electrostatic dust removal module (430).

10. A laser scribing machine, comprising a dust removal device with self-cleaning function as described in any one of claims 1 to 9, characterized in that, Also includes: A movable stage (012) is movably mounted on the base (011) for carrying wafers; The laser head assembly (013) is raised and lowered on the base (011) and located above the movable stage (012). An actuator (014) is provided at the bottom of the laser head assembly (013). The actuator (014) is used to emit laser light to the wafer to form a cutting point.

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