Display panel cutting method and device based on ultraviolet femtosecond laser, and storage medium

Abstract

The present application relates to a display panel cutting method and device based on ultraviolet femtosecond laser, and a storage medium, using ultraviolet femtosecond laser, the display panel is processed in stages, in each stage, the target focal position of the processing point, the laser wavelength and the pulse energy are adjusted, so that the laser processing operation of the display panel is gradually accumulated, according to the physical characteristics of different functional layers in the display panel, the processing parameters of each layer are dynamically adjusted, and adaptive laser processing is realized. Among them, ultraviolet femtosecond laser is used, and OLED display panel is cut in stages, the heat affected zone and edge crack are reduced, the damage to the OLED active area and the encapsulation layer is reduced, and high throughput panel cutting is realized.

Description

Technical Field

[0001] This invention relates to the field of laser precision machining technology, and in particular to a method, apparatus and storage medium for cutting display panels based on ultraviolet femtosecond lasers. Background Technology

[0002] OLED panels are multi-layered structures, and traditional mechanical cutting / dicing processes are prone to defects such as edge chipping, microcracks, and delamination of the encapsulation layer. Ultrashort pulse lasers, due to their extremely short pulse widths, can effectively reduce the heat-affected zone (HAZ) and are currently used in the processing of display glass and OLED multi-layered structures. However, despite the significant differences in optical, thermal, and mechanical properties among the layers of an OLED panel, most related technologies still use single parameters (such as wavelength, energy, and velocity) to simultaneously penetrate all layers, resulting in persistent problems such as damage to the active layer, cracking of the encapsulation layer, and expansion of dark areas. Summary of the Invention

[0003] This invention provides a method, apparatus, and storage medium for cutting display panels based on ultraviolet femtosecond lasers, aiming to solve at least one of the technical problems existing in the prior art.

[0004] The technical solution of this invention is a display panel cutting method based on ultraviolet femtosecond laser, comprising the following steps: S100: Using ultraviolet femtosecond laser, the display panel is laser-processed in stages. In each stage, the target focus position, laser wavelength and pulse energy of the processing point are adjusted to gradually accumulate and complete the laser processing operation of the display panel. S200. Based on the physical characteristics of different functional layers in the display panel, dynamically adjust the processing parameters of each layer to achieve adaptive laser processing.

[0005] According to some embodiments of the present invention, in step S100, adjusting the target focal position, laser wavelength, and pulse energy of the processing point to gradually accumulate and complete the laser processing operation of the display panel includes the following steps: A. Calculate the target focus position of the processing point based on the panel surface height, target layer boundary depth, and focus offset; B. For the target processing layer, calculate the target flux based on the baseline removal flux and the wavelength absorption rate of the laser wavelength; C. Calculate the pulse energy based on the single pulse flux, the target flux, and the laser spot diameter; D. Using the ultraviolet femtosecond laser, the laser focus is automatically aligned to the target focus position of the processing point, and the laser wavelength and pulse energy are adjusted to process the display panel.

[0006] According to some embodiments of the present invention, in step A, the target focal position of the processing point is calculated based on the panel surface height, the target layer boundary depth, and the focal offset, as shown below: , In the formula, This indicates the target focal position of the processing point. Indicates the height of the panel surface. Indicates the depth of the target layer boundary. This represents the focal offset.

[0007] According to some embodiments of the present invention, in step B, The baseline removal flux of each material layer and the wavelength absorption rate of each material layer to the laser wavelength are stored in the form of a layer parameter table; For the target processing layer, the target flux is calculated based on the reference removal flux and the wavelength absorptivity to the laser wavelength, as follows: , In the formula, The baseline removal flux for the target processing layer, The wavelength absorption rate of the target processing layer to the laser wavelength. The target throughput for the target processing layer, This is the safety margin coefficient.

[0008] According to some embodiments of the present invention, in step C, In satisfying The pulse energy is calculated based on the laser spot diameter, as shown below: , In the formula, This refers to the single-pulse flux. For the target flux, d represents the pulse energy, and d represents the laser spot diameter.

[0009] According to some embodiments of the present invention, step A further includes the following steps: The upper surface of the display panel is set as the reference plane. Using a non-contact height sensor, interferometer or confocal sensor, the height of the panel surface between the laser head and the display panel is measured along the cutting path, and the height of the panel surface is stored in the form of a height mapping map. The layer thickness data and layer material information of the display panel obtained during the initial debugging are stored in the form of a layer data table; For the target processing layer, the boundary depth of the target layer is calculated based on the layer thickness data.

[0010] According to some embodiments of the present invention, the target processing layer is calculated based on the layer thickness data to determine the target layer boundary depth, as shown below: , In the formula, Indicates the depth of the target layer boundary. This represents the layer thickness data, where k is the target processing layer.

[0011] According to some embodiments of the present invention, in step S200, The processing condition data table stores the focus offset, pulse energy, repetition frequency, scanning speed, overlap rate, laser spot diameter, and number of scanning passes. It identifies the current cutting depth and the current processing layer, retrieves the parameter group that matches the current processing layer identification result from the processing condition data table, and calls the parameter group as the processing process condition to achieve dynamic switching of the processing process.

[0012] The present invention also relates to a computer device, including a memory and a processor, wherein the processor executes the method described above when executing a computer program stored in the memory.

[0013] The present invention also relates to a computer-readable storage medium having program instructions stored thereon, which, when executed by a processor, implement the method described above.

[0014] The beneficial effects of this invention include: using ultraviolet femtosecond lasers to perform staged laser processing on display panels, adjusting the target focal position, laser wavelength, and pulse energy at each stage to gradually accumulate and complete the laser processing operation of the display panel; and dynamically adjusting the processing parameters of each layer according to the physical characteristics of different functional layers in the display panel to achieve adaptive laser processing. Specifically, using ultraviolet femtosecond lasers and cutting OLED display panels in stages reduces the heat-affected zone and edge cracks, minimizes damage to the OLED active area and encapsulation layer, and achieves high-throughput panel cutting.

[0015] Furthermore, additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0016] Figure 1 This is an optional flowchart of a display panel cutting method based on ultraviolet femtosecond laser in an embodiment of the present invention.

[0017] Figure 2 This is a structural diagram of a display panel cutting based on ultraviolet femtosecond laser in an embodiment of the present invention. Detailed Implementation

[0018] The following will provide a clear and complete description of the concept, specific structure, and technical effects of the present invention in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, solution, and effects of the present invention. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0019] It should be noted that, unless otherwise specified, when a feature is referred to as "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. Furthermore, the descriptions of "upper," "lower," "left," "right," "top," and "bottom" used in this invention are only relative to the relative positional relationships of the various components of the invention in the accompanying drawings.

[0020] Furthermore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used in this specification is for the purpose of describing particular embodiments only and not for limiting the invention. The term "and / or" as used herein includes any combination of one or more of the associated listed items.

[0021] It should be understood that although the terms first, second, third, etc., may be used to describe various elements in this invention, these elements should not be limited to these terms. These terms are only used to distinguish elements of the same type from each other. For example, a first element may also be referred to as a second element without departing from the scope of this invention, and similarly, a second element may also be referred to as a first element.

[0022] Reference Figures 1 to 2 In some embodiments, the display panel cutting method based on ultraviolet femtosecond laser of the present invention includes at least the following steps: S100: Using ultraviolet femtosecond laser, the display panel is laser-processed in stages. In each stage, the target focus position, laser wavelength and pulse energy of the processing point are adjusted to gradually accumulate and complete the laser processing operation of the display panel. S200: Based on the physical characteristics of different functional layers in the display panel, the processing parameters of each layer are dynamically adjusted to achieve adaptive laser processing.

[0023] Specifically, the display panel includes a protective film, an encapsulation layer, an electrode, an organic light-emitting layer, a thin-film transistor (TFT), and a substrate stacked from top to bottom. The first stage of processing layers consists of the protective film and the encapsulation layer, while the second stage of processing layers consists of the electrode, the organic light-emitting layer, the thin-film transistor, and the substrate.

[0024] In the multi-layered stacked structure of an OLED display panel, the electrodes are conductive layers responsible for injecting current into the organic light-emitting layer, causing it to emit light. The electrodes are essentially the "power lines" of the OLED, consisting of two key parts: the anode and the cathode.

[0025] It is evident that using ultraviolet femtosecond lasers and cutting OLED display panels in stages reduces the heat-affected zone and edge cracks, minimizes damage to the OLED active area and encapsulation layer, and achieves high-throughput panel cutting. By dynamically adjusting the processing parameters of each layer according to its physical characteristics, adaptive laser processing is achieved, resulting in higher processing quality consistency, lower scrap rate, and greater process adaptability.

[0026] In one possible implementation, a picosecond ultraviolet laser is used to cut the display panel in stages, reducing the heat-affected zone and edge cracks, minimizing damage to the OLED active area and encapsulation layer, and achieving high-throughput panel cutting. Ultrashort pulse lasers (femtosecond / picosecond) can reduce the heat-affected zone due to their extremely short pulse width.

[0027] Specifically, OLED stands for Organic Light-Emitting Diode. Ultraviolet picosecond lasers utilize the ultraviolet (UV) wavelength (approximately 200-400 nm) and picosecond pulse width (1 picosecond = 10^12 picoseconds). -12 A femtosecond laser combines a wavelength in the ultraviolet range (approximately 200-400 nm) with a pulse width of 1 femtosecond (1 femtosecond = 10^12 nm). -15 Laser combined with (seconds).

[0028] In some embodiments, in step S100, the target focal position, laser wavelength, and pulse energy of the processing point are adjusted to gradually accumulate and complete the laser processing operation of the display panel, including the following steps: A. Calculate the target focus position of the processing point based on the panel surface height, target layer boundary depth, and focus offset; B. For the target processing layer, calculate the target flux based on the baseline removal flux and the wavelength absorption rate for a specific laser wavelength; C. Calculate the pulse energy based on the single pulse flux, target flux, and laser spot diameter; D. Using an ultraviolet femtosecond laser, the laser focus is automatically aligned with the target focus position of the processing point, and the laser wavelength and pulse energy are adjusted to process the display panel.

[0029] Specifically, an ultraviolet femtosecond laser is used, and a focusing optical system or Z-axis slide is controlled to automatically align the laser focus to the target focus position of the processing point, and the pulse energy is adjusted to process the display panel. Pulse energy: the total energy carried by a laser pulse.

[0030] Specifically, the focus offset is obtained through a layered experiment: before the formal processing, a "layered experiment" (i.e., changing the position of the focus in different layers) is conducted to find out the specific value (focus offset) of the laser focus deviating from the preset position in advance, so that compensation and correction can be carried out later.

[0031] In some embodiments, in step A, the target focal position of the processing point is calculated based on the panel surface height, the target layer boundary depth, and the focal offset, as shown below: , In the formula, Indicates the target focal position of the processing point. Indicates the height of the panel surface. Indicates the depth of the target layer boundary. This indicates the focus offset.

[0032] Specifically, This indicates the target focal position of the processing point, i.e., the processing point. The height / depth coordinates are in the thickness direction (optical axis direction) of the display panel, where x and y represent the two-dimensional position coordinates on the display panel plane, i.e., the position of the processing point moving along the cutting path. Indicates processing point The height of the panel surface at the location. The target layer boundary depth is the vertical distance from the panel surface to the bottom boundary of the target processed layer.

[0033] In some embodiments, in step B, The baseline removal flux of each material layer and the wavelength absorption rate of each material layer for a specific laser wavelength are stored in the form of a layer parameter table. For the target processing layer, the target flux is calculated based on the baseline removal flux and the wavelength absorptivity for a specific laser wavelength, as shown below: , In the formula, The baseline removal flux for the target processing layer. The wavelength absorption rate of the target processing layer for a specific laser wavelength. The target throughput for the target processing layer. This is the safety margin coefficient.

[0034] Specifically, the baseline removal flux represents the minimum laser energy density required to remove (ablate / vaporize) the material to a depth of one unit. Indicates wavelength.

[0035] In some embodiments, in step C, In satisfying The pulse energy is calculated based on the laser spot diameter, as shown below: , In the formula, For single-pulse flux, For the target flux, d is the pulse energy, and d is the laser spot diameter.

[0036] In some embodiments, step A further includes the following steps: The upper surface of the display panel is set as the reference plane. Using a non-contact height sensor, interferometer, or confocal sensor, the panel surface height between the laser head and the display panel is measured along the cutting path, and the panel surface height is stored in the form of a height mapping map. The layer thickness data of the display panel measured during initial debugging is stored in the form of a layer data table. and the layer material information of the display panel; For the target processing layer, calculate the target layer boundary depth based on the layer thickness data.

[0037] Specifically, layer thickness data: the physical thickness of each layer of material, and layer material information: the type of material used in each layer and its key properties.

[0038] In some embodiments, for the target processing layer, the target layer boundary depth is calculated based on the layer thickness data, as shown below: , In the formula, Indicates the depth of the target layer boundary. This represents the layer thickness data, where k is the target processing layer.

[0039] In some embodiments, in step S200, the processing condition data table stores focus offset, pulse energy, repetition frequency, scanning speed, overlap rate, laser spot diameter and scanning passes, identifies the current cutting depth and the current processing layer, retrieves the parameter group that matches the current processing layer identification result in the processing condition data table, and calls the parameter group as the processing process condition to realize dynamic switching of the processing process.

[0040] Specifically, based on the panel thickness and layer structure, the laser focusing position (i.e., the target focal position of the aforementioned processing point), laser wavelength, and energy distribution are set and controlled to adapt to the stacked structure, thereby maintaining consistent cutting quality in various OLED panel structures.

[0041] Specifically, see Figure 2The OLED display panel is fixed on a support platform. The display panel is then processed using a UV femtosecond laser (e.g., wavelength 343 nm, pulse width <500 fs, repetition rate in the MHz range) in a multi-pass manner along the cutting path.

[0042] The laser does not penetrate the substrate and the entire film structure in one go, but rather adjusts the laser focusing position and energy density in stages to gradually accumulate and complete the cutting: Phase 1: Primarily involves processing the upper protective film and encapsulation layer; Phase 2: Expand the processing scope to the substrate and TFT / OLED film layer areas.

[0043] Specifically, the specifications for ultraviolet femtosecond lasers are as follows: Wavelength: 200~400 nm ultraviolet band, preferably about 343 nm, suitable for high-precision material processing, and can effectively reduce heat diffusion.

[0044] Pulse width: 50~500 fs. Ultra-short pulses help achieve cold processing and significantly reduce the heat-affected zone.

[0045] Repetition frequency: 100 kHz ~ 2 MHz, supports high-speed scanning, which is beneficial to improving cutting efficiency and throughput.

[0046] Average output power: 10~50 W, meeting the needs of industrial-grade continuous processing, balancing speed and stability.

[0047] Beam quality: Fundamental mode (TEM) 00 The output ensures high focusing accuracy; if necessary, it can be combined with an extended focus optical element to enhance penetration consistency and cutting depth control.

[0048] Specifically, the cutting method: By combining scanning speed and processing times, the heat-affected zone (HAZ) can be controlled to below 10μm (especially smaller on the light-emitting surface) while ensuring cutting speed (e.g., above 100 mm / s).

[0049] The protective film / encapsulation layer around the cutting path is first pretreated at a shallow depth to release stress, and then a defect line that penetrates to the substrate is formed in subsequent processing passes, thereby guiding the stable propagation of cracks.

[0050] Specifically, the condition settings are based on layer thickness: Non-contact sensors (such as laser rangefinders or interferometers) are used to measure the total thickness of the panel in real time to ensure data accuracy.

[0051] By combining the pre-stored OLED layer structure information (including the thickness and material properties of each layer), the laser focus position is automatically calculated and located to match the optimal energy density.

[0052] Based on the physical characteristics of different functional layers, the processing parameters of each layer are dynamically adjusted to achieve adaptive laser processing.

[0053] Specifically, firstly, the logic for automatically calculating and determining the focus position. Point 1, Measurement and Data Preparation Stage The control unit sets the upper surface of the display panel as the reference plane Z=0, and uses a non-contact height sensor, interferometer or confocal sensor to measure the height of the panel surface along the cutting path and store it in the form of a height map.

[0054] The storage unit stores the thickness data of each layer of the OLED panel measured during the initial debugging in the form of a layered data table. And information on the materials used in each layer.

[0055] Point 2, Calculation of target layer depth and focal position For the k-th layer currently being processed, the control unit calculates the target layer boundary depth based on the layer thickness data. ; The control unit uses the panel surface height, the target layer boundary depth, and the focal offset predetermined through layering experiments to calculate the target focal position of the processing point using the following formula: It controls the focusing optical system or Z-axis slide to automatically align the laser focus to the target focus position of the processing point.

[0056] Second, optimal energy density matching method Point 1: Layered flux baseline and absorption rate storage The storage department stores the baseline removal throughput of each layer of material in the form of a layer parameter table. and the absorption rate at the corresponding wavelength (e.g., 343 nm). ; This parameter table is set based on values ​​obtained from sample pre-experiments or material databases.

[0057] Secondly, parameter calculation based on flux and overlap rate. For the current processing layer k, the control unit sets the target throughput as follows: ; After determining the laser spot diameter d, the single-pulse flux is calculated using the following formula: And solve for the pulse energy. To ensure that the single pulse flux meets the requirements .

[0058] Third, dynamic storage and adaptive control of layered processing parameters. Point 1: Automatic matching based on processing condition tables The storage unit stores processing condition data tables, including focus offset, pulse energy, repetition frequency, scanning speed, spot diameter, and number of scanning passes, according to layer combination and panel type.

[0059] The control unit determines the current cutting depth and the corresponding processing layer k based on the sensor measurements and layer data. It then searches the processing condition table for entries that match the layer identification results and automatically calls the corresponding parameter group as the processing conditions.

[0060] Specifically, the control unit utilizes the panel surface height obtained from a non-contact height sensor and interferometer, as well as the OLED panel layer thickness data stored in the storage unit. Calculate the target layer boundary depth of the k-th layer to be processed; then, combined with the focal offset of the corresponding target layer determined experimentally, use the formula... The target focal point position of the machining point is calculated. The control unit automatically aligns the laser focal point to the aforementioned position by controlling the focusing optical system or the Z-axis slide. Positioning is used to compensate for panel thickness deviations and tilt errors.

[0061] In addition, the control unit refers to the pre-stored baselines for removal flux and absorption rate of each layer of material. Calculate the target flux; and based on the laser spot diameter d, use the formula... The single-pulse flux is converted, and the pulse energy is automatically set to make the single-pulse flux approach the target flux. The scan speed v and repetition frequency f are calculated according to the overlap ratio formula. Matching settings were implemented to meet target values ​​for each layer: the upper protective film and encapsulation layer employed low-energy, high-speed, and low-overlap-rate process conditions to achieve shallow stress relief processing; the substrate layer employed high-overlap-rate, multi-scan pass process conditions to achieve cumulative molding of defect patterns. Among these, This represents the overlap rate.

[0062] The storage unit has a built-in processing condition data table containing parameters such as focus offset, pulse energy, repetition frequency, scanning speed, overlap rate, and number of scan passes. The control unit identifies the current cutting surface level based on sensor measurements and layer data, and dynamically switches the processing technology by calling the corresponding parameter group. Furthermore, if process parameters such as the industrial camera monitoring image and heat-affected zone (HAZ) width exceed the reference range during processing, the control unit calculates compensation amounts for energy, speed, and focus position and applies them immediately. If a statistically significant repetitive compensation requirement occurs, the corresponding level's process condition table is automatically updated, thereby achieving dynamic storage and self-learning adaptive laser processing control of processing parameters at each level.

[0063] This invention also provides a computer device including a memory and a processor, wherein the processor performs the above-described method when executing a computer program stored in the memory.

[0064] This invention also provides a computer-readable storage medium storing program instructions thereon, which, when executed by a processor, implement the method described above.

[0065] It should be understood that the method steps in the embodiments of the present invention can be implemented or carried out by computer hardware, a combination of hardware and software, or by computer instructions stored in a non-transitory computer-readable storage medium. The method can use standard programming techniques. Each program can be implemented in a high-level procedural or object-oriented programming language to communicate with the computer system. However, if necessary, the program can be implemented in assembly or machine language. In any case, the language can be a compiled or interpreted language. Furthermore, for this purpose, the program can run on a programmed application-specific integrated circuit (ASIC).

[0066] Furthermore, the procedures described herein may be performed in any suitable order unless otherwise indicated herein or otherwise clearly contradicted by the context. The procedures described herein (or variations and / or combinations thereof) may be executed under the control of one or more computer systems configured with executable instructions, and may be implemented by hardware or a combination thereof as code (e.g., executable instructions, one or more computer programs, or one or more applications) that commonly executes on one or more processors. The computer program comprises a plurality of instructions executable by one or more processors.

[0067] Furthermore, the method can be implemented in any suitable type of computing platform, including but not limited to personal computers, minicomputers, mainframes, workstations, networked or distributed computing environments, standalone or integrated computer platforms, or in communication with charged particle tools or other imaging devices, etc. Aspects of the invention can be implemented as machine-readable code stored on a non-transitory storage medium or device, whether removable or integrated into a computing platform, such as a hard disk, optical read and / or write storage medium, RAM, ROM, etc., such that it is readable by a programmable computer, and when the storage medium or device is read by the computer, it can be used to configure and operate the computer to perform the processes described herein. Furthermore, the machine-readable code, or portions thereof, can be transmitted via wired or wireless networks. The invention described herein includes these and other different types of non-transitory computer-readable storage media when such media comprises instructions or programs that implement the steps described above in conjunction with a microprocessor or other data processor. When programmed according to the methods and techniques described in the invention, the invention may also include the computer itself.

[0068] A computer program can be applied to input data to perform the functions described herein, thereby transforming the input data to generate output data stored in non-volatile memory. The output information can also be applied to one or more output devices, such as a display. In a preferred embodiment of the invention, the transformed data represents physical and tangible objects, including specific visual depictions of physical and tangible objects generated on the display.

[0069] The above description is merely a preferred embodiment of the present invention. The present invention is not limited to the above-described embodiments. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention, as long as they achieve the technical effects of the present invention by the same means, should be included within the scope of protection of the present invention. Within the scope of protection of the present invention, the technical solutions and / or implementation methods can have various modifications and variations.

Claims

1. A display panel cutting method based on ultraviolet femtosecond laser, characterized in that, Includes the following steps: S100: Using ultraviolet femtosecond laser, the display panel is laser-processed in stages. In each stage, the target focus position, laser wavelength and pulse energy of the processing point are adjusted to gradually accumulate and complete the laser processing operation of the display panel. S200. Based on the physical characteristics of different functional layers in the display panel, dynamically adjust the processing parameters of each layer to achieve adaptive laser processing.

2. The display panel cutting method based on ultraviolet femtosecond laser according to claim 1, characterized in that, In step S100, the target focal position, laser wavelength, and pulse energy of the processing point are adjusted to gradually accumulate and complete the laser processing operation of the display panel, including the following steps: A. Calculate the target focus position of the processing point based on the panel surface height, target layer boundary depth, and focus offset; B. For the target processing layer, calculate the target flux based on the baseline removal flux and the wavelength absorption rate of the laser wavelength; C. Calculate the pulse energy based on the single pulse flux, the target flux, and the laser spot diameter; D. Using the ultraviolet femtosecond laser, the laser focus is automatically aligned to the target focus position of the processing point, and the laser wavelength and pulse energy are adjusted to process the display panel.

3. The display panel cutting method based on ultraviolet femtosecond laser according to claim 2, characterized in that, In step A, the target focus position of the processing point is calculated based on the panel surface height, target layer boundary depth, and focus offset, as shown below: ， In the formula, This indicates the target focal position of the processing point. Indicates the height of the panel surface. Indicates the depth of the target layer boundary. This represents the focal offset.

4. The display panel cutting method based on ultraviolet femtosecond laser according to claim 2, characterized in that, In step B, The baseline removal flux of each material layer and the wavelength absorption rate of each material layer to the laser wavelength are stored in the form of a layer parameter table; For the target processing layer, the target flux is calculated based on the reference removal flux and the wavelength absorptivity to the laser wavelength, as follows: ， In the formula, The baseline removal flux for the target processing layer, The wavelength absorption rate of the target processing layer to the laser wavelength. The target throughput for the target processing layer, This is the safety margin coefficient.

5. The display panel cutting method based on ultraviolet femtosecond laser according to claim 2, characterized in that, In step C In satisfying The pulse energy is calculated based on the laser spot diameter, as shown below: ， In the formula, This refers to the single-pulse flux. For the target flux, d represents the pulse energy, and d represents the laser spot diameter.

6. The display panel cutting method based on ultraviolet femtosecond laser according to claim 2, characterized in that, Step A further includes the following steps: The upper surface of the display panel is set as the reference plane. Using a non-contact height sensor, interferometer or confocal sensor, the height of the panel surface between the laser head and the display panel is measured along the cutting path, and the height of the panel surface is stored in the form of a height mapping map. The layer thickness data and layer material information of the display panel obtained during the initial debugging are stored in the form of a layer data table; For the target processing layer, the boundary depth of the target layer is calculated based on the layer thickness data.

7. The display panel cutting method based on ultraviolet femtosecond laser according to claim 6, characterized in that, For the target processing layer, the boundary depth of the target layer is calculated based on the layer thickness data, as shown below: ， In the formula, Indicates the depth of the target layer boundary. This represents the layer thickness data, where k is the target processing layer.

8. The display panel cutting method based on ultraviolet femtosecond laser according to claim 1, characterized in that, In step S200 The processing condition data table stores the focus offset, pulse energy, repetition frequency, scanning speed, overlap rate, laser spot diameter, and number of scanning passes. It identifies the current cutting depth and the current processing layer, retrieves the parameter group that matches the current processing layer identification result from the processing condition data table, and calls the parameter group as the processing process condition to achieve dynamic switching of the processing process.

9. A computer device comprising a memory and a processor, characterized in that, When the processor executes a computer program stored in the memory, it performs the method as described in any one of claims 1 to 8.

10. A computer-readable storage medium having program instructions stored thereon, characterized in that, When the program instructions are executed by the processor, they perform the method as described in any one of claims 1 to 8.

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