Flexible circuit board high-precision laser cutting device and anti-deformation control method

Abstract

The application relates to the technical field of circuit board processing, in particular to a flexible circuit board high-precision laser cutting device and a deformation prevention control method, which comprises the following: a hollow cylinder, a multi-hole cylinder is fixedly arranged in the middle of the hollow cylinder, and a circuit board base material is spirally wound on the outer side wall of the multi-hole cylinder; an air extraction cylinder is located in the inner cavity of the hollow cylinder and coaxial with the hollow cylinder; an adjusting shaft rod penetrates through the air extraction cylinder along the air extraction cylinder axis and is rotationally connected with the air extraction cylinder, and a threaded sleeve ring is arranged on the outer side of both ends of the adjusting shaft rod; beneficial effects are as follows: the multi-hole cylinder is arranged in the middle of the hollow cylinder, the circuit board base material is attached to the outer side wall of the multi-hole cylinder in a spiral winding mode, the air extraction cylinder is arranged in the inner cavity of the hollow cylinder, a negative pressure is formed in the inner cavity of the hollow cylinder when the air extraction cylinder extracts air, and the circuit board base material is stably attached to the surface of the multi-hole cylinder; on one hand, the flatness of the surface of the circuit board base material is ensured; on the other hand, the horizontal occupation area of the whole equipment is reduced.

Description

Technical Field

[0001] This invention relates to the field of circuit board processing technology, specifically to a high-precision laser cutting device for flexible circuit boards and a method for preventing deformation control. Background Technology

[0002] Flexible circuit boards are bendable and foldable printed circuit boards made with flexible insulating materials such as polyimide or polyester film as substrates. Because the substrate of flexible circuit boards is thin and soft, traditional mechanical punching or die cutting is prone to delamination, burrs, deformation and stress damage. By using non-contact laser cutting, micron-level high precision and rapid processing of complex irregular contours can be achieved.

[0003] In the prior art, Chinese utility model with announcement number CN224088213U discloses a flexible circuit board laser cutting device. The device uses a motor to drive a threaded rod to move a slide along a limiting rod. Combined with the electric push rod of the protective component to adjust the height of the isolation plate and the electric telescopic rod to dynamically press down and fit, a closed cutting space is formed, which effectively blocks laser scattering and dust diffusion.

[0004] Currently, flexible printed circuit boards (PCBs) are typically positioned and cut on a processing table in a flat manner. This layout requires a large horizontal workspace, especially when processing long, strip-shaped PCBs, where the table size must be roughly the same as the PCB length, resulting in a large equipment footprint. Furthermore, in this flat-lay configuration, the edges of the PCB are prone to warping or unevenness, making it difficult to achieve uniform adhesion of the entire board solely through its own weight or edge clamping, thus affecting the focusing accuracy and positioning stability of the laser cutting. Therefore, this invention proposes a high-precision laser cutting device for flexible printed circuit boards and an anti-deformation control method to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a high-precision laser cutting device for flexible circuit boards and a method for preventing deformation, so as to solve the problems mentioned in the background art, such as the large horizontal footprint of traditional laser cutting devices and the difficulty in keeping long strip flexible circuit boards flat.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-precision laser cutting device for flexible circuit boards, comprising: A hollow cylinder, wherein a perforated cylinder is fixedly disposed in the middle of the hollow cylinder, a circuit board substrate is spirally wound on the outer wall of the perforated cylinder, and sealing rings are provided at both ends of the inner cavity of the hollow cylinder, and clearance grooves are provided at the edges of the two sealing rings that are close to each other. An air extraction cylinder is located in the inner cavity of a hollow cylinder and is coaxial with it. A guide groove is provided on the outer side wall of the air extraction cylinder along its length direction, and a guide through groove is provided through the bottom of the guide groove. An inner sliding ring is provided in the inner cavity of the sealing ring and is rotatably connected to it. An anti-rotation platform is fixed on the inner wall of the inner sliding ring. The anti-rotation platform is located in the inner cavity of the guide groove and is slidably connected to it. An adjusting shaft is provided, which passes through the air extraction cylinder along the axis of the air extraction cylinder and is rotatably connected to it. Threaded collars are fitted on the outer sides of both ends of the adjusting shaft. Threaded grooves that cooperate with the threaded collars are opened on the surface of both ends of the adjusting shaft, and the two threaded grooves rotate in opposite directions. A connecting rod is fixed to the outer wall of the threaded collar. One end of the connecting rod movably passes through the guide groove and is fixedly connected to the middle of the anti-rotation platform.

[0007] Preferably, the outer wall of the sealing ring is attached to the inner wall of the hollow cylinder, the inner wall of the hollow cylinder is bonded with a rubber layer, the outer wall of the hollow cylinder is fixedly fitted with an annular toothed ring, and a transmission toothed ring that meshes with the annular toothed ring is provided above the annular toothed ring.

[0008] Preferably, a bearing is embedded in the middle of the inner wall of the sealing ring, and the inner cavity of the bearing is fitted into the middle of the outer wall of the inner slip ring. One end of the adjusting shaft is fixed with an adjusting knob, and the other end of the adjusting shaft is provided with an air extraction pipe and a positioning frame. The air extraction pipe and the positioning frame are both fixedly connected to the end of the air extraction cylinder, and the air extraction pipe communicates with the inner cavity of the air extraction cylinder.

[0009] Preferably, an inner retaining ring is fixedly provided in the middle of the inner wall of the porous cylinder, and two outer retaining rings are fixed in the middle of the outer wall of the air extraction cylinder, with the two outer retaining rings respectively fitting against the two sides of the inner retaining ring. A vent hole is provided through the outer retaining ring, and the vent hole connects the inner and outer sides of the air extraction cylinder.

[0010] Preferably, a mounting bracket is provided above the circuit board substrate, and two transmission gear rings are provided. The two transmission gear rings are rotatably mounted on the outer ends of the mounting bracket through bearings. A drive gear is rotatably mounted on one end of the mounting bracket, and the drive gear meshes with one transmission gear ring. The drive gear is driven to rotate by a motor.

[0011] Preferably, a limiting groove is formed through the surface of the mounting bracket from top to bottom, and the length direction of the limiting groove is parallel to the axis of the porous cylinder. A limiting slider adapted to it is slidably installed in the inner cavity of the limiting groove. A laser cutting head is fixedly installed through the middle of the limiting slider, and the laser cutting head is facing the circuit board substrate below.

[0012] Preferably, a cylinder is fixed to the inner wall of one end of the limiting through groove, and the movable end of the cylinder is fixedly connected to the side of the limiting slider. Both ends of the mounting bracket are fixed with suspension plates. An angular displacement sensor is installed on the side of one suspension plate, and an arc-shaped scale is opened on the side of one transmission gear ring. The angular displacement sensor is directly opposite the arc-shaped scale.

[0013] Preferably, smoothing rollers are provided on both sides of the mounting bracket, the surface of the smoothing rollers is provided with a flexible layer, the axis of the smoothing rollers is parallel to the axis of the porous cylinder, and the smoothing rollers press down on the surface of the circuit board substrate from top to bottom.

[0014] Preferably, both ends of the smoothing roller are provided with elastic telescopic rods, and the upper end of the elastic telescopic rod is fixedly connected to the mounting frame, and the lower end of the elastic telescopic rod is fixedly connected to a bearing seat, which is rotatably sleeved on the outside of the rotating shaft of the smoothing roller.

[0015] A deformation prevention control method, using the aforementioned high-precision laser cutting device for flexible circuit boards, specifically includes the following steps: Step 1: Wrap the circuit board substrate spirally around the outside of the porous cylinder. Then turn the adjustment knob to drive the inner slip ring and the sealing ring to slide through the cooperation between the threaded groove and the threaded collar. The two sealing rings move closer to each other and seal some of the holes on the porous cylinder from the inside of the porous cylinder. Step 2: Start the external air pump. The air pump draws air from the air pump cylinder and the inner cavity of the porous cylinder through the air pump pipe. The air on the outside of the porous cylinder enters the inner cavity of the porous cylinder through another part of the holes on the surface of the porous cylinder, so that the air can flow and ensure the normal operation of the air pump. When the air flows in the inner cavity of the porous cylinder, a negative pressure is formed. Under the action of negative pressure, the circuit board substrate is stably adsorbed on the outer wall of the porous cylinder. Step 3: Start the laser cutting head to laser cut the circuit board substrate. When the cylinder extends and retracts, it drives the laser cutting head to move along the axial direction of the porous cylinder. When the drive gear is driven by the motor to rotate, it drives the hollow cylinder to rotate through the transmission gear ring, thereby causing the circuit board substrate to rotate as well. The laser cutting head can then cut the specified position on the surface of the circuit board substrate. When the hollow cylinder and the porous cylinder rotate, the smoothing roller rolls on the surface of the porous cylinder. The smoothing roller presses and smooths the surface of the circuit board substrate, ensuring that the circuit board substrate located directly below the laser cutting head is in a flat and stable state, preventing the circuit board substrate from deforming.

[0016] Compared with the prior art, the beneficial effects of the present invention are: This invention features a perforated cylinder in the middle of a hollow cylinder. A circuit board substrate is spirally wound and attached to the outer wall of the perforated cylinder. Sealing rings are slidably installed at both ends of the hollow cylinder's inner cavity, with clearance grooves at their end edges. The outer wall of the sealing ring is in contact with the inner wall of the hollow cylinder, and the two are concentric. When the sealing ring slides, it can be used to seal any excess holes on the perforated cylinder. An air extraction cylinder is installed inside the hollow cylinder. When the air extraction cylinder extracts air, it creates a negative pressure inside the hollow cylinder, ensuring that the circuit board substrate is stably attached to the surface of the perforated cylinder. This ensures the flatness of the circuit board substrate surface and reduces the overall horizontal footprint of the equipment. Attached Figure Description

[0017] Figure 1 This is a three-dimensional schematic diagram of the overall structure of the present invention; Figure 2 This is an exploded view of the mounting frame structure of the present invention; Figure 3 This is a three-dimensional schematic diagram of the transmission gear ring structure of the present invention; Figure 4 This is a three-dimensional schematic diagram of the smoothing roller structure of the present invention; Figure 5 This is a schematic diagram of the internal structure of the hollow cylinder of the present invention; Figure 6 This is a schematic diagram of the internal structure of the sealing ring of the present invention; Figure 7 This is a schematic diagram of the internal structure of the air extraction cylinder of the present invention; Figure 8 This is a cross-sectional schematic diagram of the inner slip ring and vacuum tube structure of the present invention; Figure 9 This is a three-dimensional schematic diagram of the adjusting shaft structure of the present invention; Figure 10 This is a schematic diagram of the assembly of the air extraction cylinder and adjusting shaft structure of the present invention.

[0018] In the diagram: 1. Hollow cylinder; 11. Perforated cylinder; 12. Annular gear ring; 13. Inner retaining ring; 2. Circuit board substrate; 3. Sealing ring; 31. Clearance groove; 32. Inner slip ring; 321. Anti-rotation platform; 33. Threaded collar; 331. Connecting rod; 4. Air extraction cylinder; 41. Outer retaining ring; 411. Vent hole; 42. Guide groove; 43. Guide through groove; 44. Air extraction pipe; 45. Positioning frame; 5. Adjusting shaft; 51. Threaded groove; 52. Adjusting knob; 6. Mounting frame; 61. Limiting through groove; 62. Limiting slider; 621. Cylinder; 63. Laser cutting head; 64. Transmission gear ring; 641. Arc-shaped scale; 65. Drive gear; 66. Suspension plate; 67. Angular displacement sensor; 68. Smoothing roller; 681. Flexible layer; 69. Elastic telescopic rod; 691. Shaft seat. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the present invention clear and complete, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of the present invention, and are merely illustrative of the embodiments of the present invention. They are not intended to limit the embodiments of the present invention. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figures 1 to 10 The present invention provides a technical solution: Example 1: A high-precision laser cutting device for flexible circuit boards includes: a hollow cylinder 1, an air extraction cylinder 4, and an adjusting shaft 5.

[0021] Specifically, a porous cylinder 11 is fixedly installed in the middle of the hollow cylinder 1. The diameter of the outer wall of the porous cylinder 11 is slightly smaller than that of the outer wall of the hollow cylinder 1. Multiple evenly distributed holes are formed on the surface of the porous cylinder 11 to allow airflow. A circuit board substrate 2 is spirally wound around the outer wall of the porous cylinder 11, covering some of the holes. When the air inside the porous cylinder 11 is removed, the circuit board substrate 2 can be adsorbed onto the surface of the porous cylinder 11 under negative pressure. Sealing rings 3 are provided at both ends of the hollow cylinder 1's inner cavity. The edges of the two sealing rings 3 that are close to each other are provided with clearance slots 31. Figure 1 and Figure 5 As shown, the clearance slot 31 is mainly used to cooperate with the end position of the circuit board substrate 2. The sealing ring 3 can seal some of the holes on the surface of the porous cylinder 11, thereby increasing the negative pressure in the cavity of the porous cylinder 11. The clearance slot 31 can prevent the sealing ring 3 from overlapping with the circuit board substrate 2, which would prevent some areas on the circuit board substrate 2 from being adsorbed onto the porous cylinder 11. Secondly, the suction cylinder 4 is located within the inner cavity of the hollow cylinder 1 and is coaxial with it. The suction cylinder 4 itself maintains a fixed position. A guide groove 42 is provided on the outer wall of the suction cylinder 4 along its length, and a guide through groove 43 is provided through the bottom of the guide groove 42. An inner slip ring 32 is provided in the inner cavity of the sealing ring 3 and is rotatably connected to it. The inner slip ring 32 and the sealing ring 3 can only rotate relative to each other and will not shift in position. An anti-rotation platform 321 is fixed on the inner wall of the inner slip ring 32. The anti-rotation platform 321 is located in the inner cavity of the hollow cylinder 1 and is located in the inner cavity of the hollow cylinder 1. The inner sliding ring 32 is slidably connected to the inner cavity of the slide groove 42. The anti-rotation platform 321 cooperates with the guide slide groove 42, so that the inner sliding ring 32 can only slide along the length direction of the air extraction cylinder 4 on the outside of the air extraction cylinder 4, thereby driving the sealing ring 3 to move along the length direction of the air extraction cylinder 4. When the hollow cylinder 1 and the porous cylinder 11 rotate, the friction between them and the sealing ring 3 can drive the sealing ring 3 to rotate on the outside of the inner sliding ring 32, thereby avoiding misalignment between the avoidance slot 31 and the end of the circuit board substrate 2. Furthermore, the adjusting shaft 5 passes through the suction cylinder 4 along its axis and is rotatably connected to it. The adjusting shaft 5 can rotate around its own axis. Threaded collars 33 are fitted on the outer sides of both ends of the adjusting shaft 5. Threaded grooves 51 that cooperate with the threaded collars 33 are opened on the surface of both ends of the adjusting shaft 5, and the two threaded grooves 51 rotate in opposite directions. A connecting rod 331 is fixed to the outer wall of the threaded collar 33. One end of the connecting rod 331 movably passes through the guide groove 43 and is fixedly connected to the middle of the anti-rotation platform 321. The connecting rod 331 is used to fix the inner slip ring 32 and the threaded collar 33 together. Therefore, the threaded collar 33 itself cannot rotate. When the adjusting shaft 5 rotates, the threaded grooves 51 and the threaded collar 33 cooperate with each other, which can drive the two threaded collars 33 to move synchronously in opposite directions, thereby realizing the two sealing rings 3 moving closer or further apart.

[0022] To drive the hollow cylinder 1 to rotate, the outer side wall of the sealing ring 3 of this application is attached to the inner side wall of the hollow cylinder 1. A rubber layer is bonded to the inner wall of the hollow cylinder 1. The rubber layer can be used to increase the friction between the sealing ring 3 and the hollow cylinder 1, thereby preventing relative rotation between the two. When the hollow cylinder 1 rotates, it can stably drive the sealing ring 3 to rotate. An annular toothed ring 12 is fixedly sleeved on the outer side wall of the hollow cylinder 1, and a transmission toothed ring 64 is provided above the annular toothed ring 12 to mesh with it. When the transmission toothed ring 64 rotates, it can drive the hollow cylinder 1, the porous cylinder 11 and the circuit board substrate 2 to rotate through meshing with the annular toothed ring 12.

[0023] To connect the sealing ring 3 to the inner slip ring 32, this application further includes a bearing embedded in the middle of the inner wall of the sealing ring 3, and the inner cavity of the bearing is fitted and embedded in the middle of the outer wall of the inner slip ring 32, such as... Figure 6As shown, the bearing between the sealing ring 3 and the inner slip ring 32 can reduce the friction force on the sealing ring 3 when it rotates outside the inner slip ring 32, and at the same time prevent the sealing ring 3 and the inner slip ring 32 from axially offset. An adjustment knob 52 is fixed at one end of the adjustment shaft 5 so that the operator can turn the adjustment shaft 5 to rotate. On the other side of the adjustment shaft 5, an air extraction pipe 44 and a positioning frame 45 are provided. The air extraction pipe 44 and the positioning frame 45 are both fixedly connected to the end of the air extraction cylinder 4. The air extraction pipe 44 is connected to the inner cavity of the air extraction cylinder 4. The positioning frame 45 can be fixedly connected to the external bracket by bolts to fix the air extraction cylinder 4 and prevent the air extraction cylinder 4 from rotating. The air extraction pipe 44 is connected to an external air pump so that the air pump can extract the air from the inner cavity of the air extraction cylinder 4.

[0024] To limit the position of the porous cylinder 11, this application further includes an inner retaining ring 13 fixedly disposed in the middle of the inner wall of the porous cylinder 11, and two outer retaining rings 41 fixed in the middle of the outer wall of the suction cylinder 4, with the two outer retaining rings 41 respectively fitting against both sides of the inner retaining ring 13, such as... Figure 5 As shown, the two outer retaining rings 41 can be used to limit the inner retaining ring 13, thereby limiting the hollow cylinder 1 and the porous cylinder 11, ensuring that the hollow cylinder 1 and the porous cylinder 11 can only rotate on the outside of the suction cylinder 4, and will not shift in position along the length of the suction cylinder 4. A vent hole 411 is provided through the outer retaining ring 41, and the vent hole 411 connects the inner and outer sides of the suction cylinder 4. The vent hole 411 ensures that the inner and outer sides of the suction cylinder 4 remain connected, so the external suction pump can pump air into the inner cavity of the suction cylinder 4. When the air is pumped out, the air inside the porous cylinder 11 can also be drawn away, thus creating a negative pressure inside the porous cylinder 11. This allows the circuit board substrate 2 to be adsorbed onto the outer wall of the porous cylinder 11 under the negative pressure. It should be noted that the holes on the surface of the porous cylinder 11 are not completely blocked by the sealing ring 3 and the circuit board substrate 2. Air from the outside of the porous cylinder 11 can pass through some of the holes on the porous cylinder 11 and enter the inner cavity of the porous cylinder 11 to ensure continuous air flow and normal operation of the air pump.

[0025] To position the transmission gear ring 64, this application also includes a mounting bracket 6 above the circuit board substrate 2. Two transmission gear rings 64 are provided, and the two transmission gear rings 64 are rotatably mounted on the outer ends of the mounting bracket 6 via bearings. Therefore, the transmission gear rings 64 can only rotate on the outer ends of the mounting bracket 6 without separating from it. A drive gear 65 is rotatably mounted on one end of the mounting bracket 6, and the drive gear 65 meshes with one of the transmission gear rings 64. The drive gear 65 is driven to rotate by a motor. When the motor is working, it can drive the ring gear ring 12 to rotate through the meshing transmission between the drive gear 65 and the transmission gear ring 64, thereby driving the hollow cylinder 1 and the porous cylinder 11 to rotate.

[0026] In order to cut the circuit board substrate 2, a limiting groove 61 is formed through the surface of the mounting bracket 6 of this application from top to bottom. The limiting groove 61 is a horizontal strip and its length direction is parallel to the axis of the porous cylinder 11. A limiting slider 62 adapted to the limiting groove 61 is slidably installed in the inner cavity of the limiting groove 61. The cross-section of the limiting slider 62 is set in the shape of "I". The limiting slider 62 can only slide horizontally along the length direction of the limiting groove 61 and will not disengage from the limiting groove 61. A laser cutting head 63 is fixedly installed through the middle of the limiting slider 62. The laser cutting head 63 faces the circuit board substrate 2 below and is used to cut the circuit board substrate 2 below it.

[0027] To detect the relative position between the laser cutting head 63 and the circuit board substrate 2, this application further includes a cylinder 621 fixed to the inner wall of one end of the limiting groove 61, with the movable end of the cylinder 621 fixedly connected to the side of the limiting slider 62. When the cylinder 621 extends or retracts, it can drive the limiting slider 62 to slide within the cavity of the limiting groove 61, thereby adjusting the position of the laser cutting head 63. Suspension plates 66 are fixed to both ends of the mounting frame 6, with the upper end of the suspension plates 66 fixed to an I-beam. The I-beam, as the main beam, is suspended and its position is fixed, thus keeping the mounting frame 6 in a fixed position. An angular displacement sensor 67 is installed on the side of the suspension plate 66, and an arc-shaped scale 641 is opened on the side of a transmission gear ring 64. The angular displacement sensor 67 is directly opposite the arc-shaped scale 641. The angular displacement sensor 67 and the arc-shaped scale 641 cooperate with each other to detect the rotation angle of the transmission gear ring 64, thereby detecting the rotation angle of the porous cylinder 11 and the circuit board substrate 2. After knowing the rotation angle of the circuit board substrate 2 and the sliding distance of the laser cutting head 63, the relative position between the laser cutting head 63 and the circuit board substrate 2 can be known, thereby achieving precise cutting of the circuit board substrate 2.

[0028] To press and smooth the circuit board substrate 2, this application also includes smoothing rollers 68 arranged on both sides of the mounting frame 6. The surface of the smoothing rollers 68 is provided with a flexible layer 681. The axis of the smoothing rollers 68 is parallel to the axis of the porous cylinder 11. The smoothing rollers 68 press down on the surface of the circuit board substrate 2 from top to bottom. The smoothing rollers 68 are used to press the circuit board substrate 2, so that when the porous cylinder 11 rotates, the smoothing rollers 68 can press over various positions on the surface of the circuit board substrate 2, thereby smoothing the circuit board substrate 2 and ensuring that the circuit board substrate 2 and the surface of the porous cylinder 11 remain in close contact. The flexible layer 681 can prevent the surface of the circuit board substrate 2 from being scratched by the smoothing rollers 68.

[0029] To ensure that the smoothing roller 68 always presses against the circuit board substrate 2 and the porous cylinder 11, this application further includes elastic telescopic rods 69 at both ends of the smoothing roller 68. The upper end of the elastic telescopic rod 69 is fixedly connected to the mounting frame 6, and the lower end of the elastic telescopic rod 69 is fixedly connected to a bearing seat 691. The bearing seat 691 is rotatably sleeved on the outside of the rotating shaft of the smoothing roller 68. The elastic telescopic rod 69 has a built-in thrust spring and always has a tendency to extend. The setting of the elastic telescopic rod 69 enables the smoothing roller 68 to always press against the circuit board substrate 2 and the porous cylinder 11, thereby achieving the positioning of the smoothing roller 68.

[0030] This invention also discloses a deformation prevention control method, which utilizes the aforementioned high-precision laser cutting device for flexible circuit boards, and specifically includes the following steps: Step 1: The circuit board substrate 2 is spirally wound around the outside of the porous cylinder 11. Then, the adjustment knob 52 is turned to drive the inner slip ring 32 and the sealing ring 3 to slide through the cooperation between the threaded groove 51 and the threaded collar 33. The two sealing rings 3 move closer to each other and the sealing rings 3 seal some of the holes on the porous cylinder 11 from the inside of the porous cylinder 11. Step 2: Start the external air pump. The air pump draws air from the air pump cylinder 4 and the inner cavity of the porous cylinder 11 through the air pump pipe 44. The air outside the porous cylinder 11 enters the inner cavity of the porous cylinder 11 through another part of the holes on the surface of the porous cylinder 11, so that the air can flow and ensure the normal operation of the air pump. When the air flows in the inner cavity of the porous cylinder 11, a negative pressure is formed. Under the action of negative pressure, the circuit board substrate 2 is stably adsorbed on the outer wall of the porous cylinder 11. Step 3: Start the laser cutting head 63 to perform laser cutting on the circuit board substrate 2. When the cylinder 621 extends and retracts, it drives the laser cutting head 63 to move along the axial direction of the porous cylinder 11. When the drive gear 65 is driven to rotate by the motor, it drives the hollow cylinder 1 to rotate through the transmission gear ring 64, thereby causing the circuit board substrate 2 to rotate as well. The laser cutting head 63 can then cut the specified position on the surface of the circuit board substrate 2. When the hollow cylinder 1 and the porous cylinder 11 rotate, the smoothing roller 68 rolls on the surface of the porous cylinder 11. The smoothing roller 68 presses and smooths the surface of the circuit board substrate 2, ensuring that the circuit board substrate 2 located directly below the laser cutting head 63 is in a flat and stable state, preventing the circuit board substrate 2 from deforming.

[0031] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision laser cutting device for flexible circuit boards, characterized in that: include: Hollow cylinder (1), a perforated cylinder (11) is fixedly provided in the middle of the hollow cylinder (1), a circuit board substrate (2) is spirally wound on the outer side wall of the perforated cylinder (11), and sealing rings (3) are provided at both ends of the inner cavity of the hollow cylinder (1), and clearance slots (31) are opened at the edges of the two sealing rings (3) that are close to each other. The vacuum cylinder (4) is located in the inner cavity of the hollow cylinder (1) and is coaxial with it. The outer side wall of the vacuum cylinder (4) is provided with a guide groove (42) along its length direction, and the bottom of the guide groove (42) is provided with a guide through groove (43). The inner cavity of the sealing ring (3) is provided with an inner sliding ring (32) rotatably connected to it, and the inner wall of the inner sliding ring (32) is fixed with an anti-rotation platform (321). The anti-rotation platform (321) is located in the inner cavity of the guide groove (42) and is slidably connected to it. An adjusting shaft (5) is inserted through the air extraction cylinder (4) along the axis of the air extraction cylinder (4) and rotated therewith. Threaded collars (33) are fitted on the outer sides of both ends of the adjusting shaft (5). Threaded grooves (51) that cooperate with the threaded collars (33) are opened on the surface of both ends of the adjusting shaft (5). The two threaded grooves (51) rotate in opposite directions. A connecting rod (331) is fixed on the outer wall of the threaded collar (33). One end of the connecting rod (331) moves through the guide groove (43) and is fixedly connected to the middle of the anti-rotation platform (321).

2. The high-precision laser cutting device for flexible circuit boards according to claim 1, characterized in that: The outer side wall of the sealing ring (3) is attached to the inner side wall of the hollow cylinder (1). The inner wall of the hollow cylinder (1) is bonded with a rubber layer. The outer side wall of the hollow cylinder (1) is fixedly fitted with an annular toothed ring (12), and a transmission toothed ring (64) that meshes with the annular toothed ring (12) is provided above it.

3. The high-precision laser cutting device for flexible circuit boards according to claim 2, characterized in that: The inner wall of the sealing ring (3) is inlaid with a bearing, and the inner cavity of the bearing is fitted into the middle of the outer wall of the inner slip ring (32). One end of the adjusting shaft (5) is fixed with an adjusting knob (52), and the other end of the adjusting shaft (5) is provided with an air extraction pipe (44) and a positioning frame (45). The air extraction pipe (44) and the positioning frame (45) are both fixedly connected to the end of the air extraction cylinder (4). The air extraction pipe (44) is connected to the inner cavity of the air extraction cylinder (4).

4. The high-precision laser cutting device for flexible circuit boards according to claim 3, characterized in that: An inner retaining ring (13) is fixedly provided in the middle of the inner wall of the porous cylinder (11), and two outer retaining rings (41) are fixed in the middle of the outer wall of the air extraction cylinder (4). The two outer retaining rings (41) are respectively attached to the two sides of the inner retaining ring (13). A vent hole (411) is provided through the outer retaining ring (41), and the vent hole (411) connects the inner and outer sides of the air extraction cylinder (4).

5. The high-precision laser cutting device for flexible circuit boards according to claim 4, characterized in that: A mounting bracket (6) is provided above the circuit board substrate (2). Two transmission gear rings (64) are provided, and the two transmission gear rings (64) are rotatably mounted on the outer sides of the two ends of the mounting bracket (6) through bearings. A drive gear (65) is rotatably mounted on one end of the mounting bracket (6), and the drive gear (65) meshes with a transmission gear ring (64) for transmission. The drive gear (65) is driven to rotate by a motor.

6. The high-precision laser cutting device for flexible circuit boards according to claim 5, characterized in that: The mounting bracket (6) has a limiting groove (61) extending from top to bottom on its surface. The length of the limiting groove (61) is parallel to the axis of the porous cylinder (11). A limiting slider (62) is slidably installed in the inner cavity of the limiting groove (61). A laser cutting head (63) is fixedly installed in the middle of the limiting slider (62). The laser cutting head (63) is directly facing the circuit board substrate (2) below.

7. The high-precision laser cutting device for flexible circuit boards according to claim 6, characterized in that: A cylinder (621) is fixed to the inner wall of one end of the limiting through groove (61), and the movable end of the cylinder (621) is fixedly connected to the side of the limiting slider (62). Both ends of the mounting bracket (6) are fixed with suspension plates (66). An angular displacement sensor (67) is installed on the side of one suspension plate (66), and an arc-shaped scale (641) is opened on the side of one transmission gear ring (64). The angular displacement sensor (67) is directly opposite the arc-shaped scale (641).

8. The high-precision laser cutting device for flexible circuit boards according to claim 7, characterized in that: Smoothing rollers (68) are provided on both sides of the mounting bracket (6). A flexible layer (681) is provided on the surface of the smoothing rollers (68). The axis of the smoothing rollers (68) is parallel to the axis of the porous cylinder (11). The smoothing rollers (68) press down on the surface of the circuit board substrate (2) from top to bottom.

9. The high-precision laser cutting device for flexible circuit boards according to claim 8, characterized in that: Both ends of the smoothing roller (68) are provided with elastic telescopic rods (69), and the upper end of the elastic telescopic rod (69) is fixedly connected to the mounting frame (6). The lower end of the elastic telescopic rod (69) is fixedly connected to a bearing seat (691), and the bearing seat (691) is rotatably sleeved on the outside of the rotating shaft of the smoothing roller (68).

10. A method for preventing deformation control, using the high-precision laser cutting device for flexible circuit boards as described in claim 9, characterized in that: Specifically, the following steps are included: Step 1: The circuit board substrate (2) is spirally wound around the outside of the porous cylinder (11). Then, the adjustment knob (52) is turned to drive the inner slip ring (32) and the sealing ring (3) to slide through the cooperation between the threaded groove (51) and the threaded collar (33). The two sealing rings (3) move closer to each other and the sealing rings (3) seal some of the holes on the porous cylinder (11) from the inside. Step 2: Start the external air pump. The air pump draws air from the air pump cylinder (4) and the inner cavity of the porous cylinder (11) through the air pump pipe (44). The air outside the porous cylinder (11) enters the inner cavity of the porous cylinder (11) through another part of the holes on the surface of the porous cylinder (11), so that the air can flow and ensure the normal operation of the air pump. When the air flows in the inner cavity of the porous cylinder (11), a negative pressure is formed. The circuit board substrate (2) is stably adsorbed on the outer wall of the porous cylinder (11) under the action of negative pressure. Step 3: Start the laser cutting head (63) to perform laser cutting on the circuit board substrate (2). When the cylinder (621) extends and retracts, it drives the laser cutting head (63) to move along the axial direction of the porous cylinder (11). When the drive gear (65) is driven to rotate by the motor, it drives the hollow cylinder (1) to rotate through the transmission gear ring (64), which in turn drives the circuit board substrate (2) to rotate. The laser cutting head (63) can then cut the specified position on the surface of the circuit board substrate (2). When the hollow cylinder (1) and the porous cylinder (11) rotate, the smoothing roller (68) rolls on the surface of the porous cylinder (11). The smoothing roller (68) presses and smooths the surface of the circuit board substrate (2) to ensure that the circuit board substrate (2) located directly below the laser cutting head (63) is in a flat and stable state, preventing the circuit board substrate (2) from deforming.

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