Welding apparatus and electrode assembly manufactured using the same

Abstract

The present disclosure relates to a welding device and an electrode assembly manufactured using the same. The welding device includes an anvil and a horn configured to apply ultrasonic waves while pressing an electrode plate, a first substrate tab, and a second substrate tab on the anvil to weld the electrode plate, the first substrate tab, and the second substrate tab together. The horn includes a disc-shaped welding head and a body portion connected to a central shaft of the welding head, wherein the welding head is rotatable. The disc-shaped welding head includes a first pressing portion configured to press a first area in which the electrode plate and the first substrate tab overlap each other and a second area in which the electrode plate and the second substrate tab overlap each other between the anvil and the horn, and a second pressing portion configured to press a portion of a third area in which the first substrate tab and the second substrate tab overlap each other and which is different from the first area and the second area.

Description

Technical Field

[0001] This disclosure relates to a welding apparatus and an electrode assembly manufactured using the welding apparatus. Background Technology

[0002] Unlike primary batteries, which are not designed for (re)charging, secondary (or rechargeable) batteries are designed to discharge and be recharged. Low-capacity secondary batteries are used in portable small electronic devices such as smartphones, feature phones, laptops, digital cameras, and camcorders, while high-capacity secondary batteries are widely used as power sources for driving motors in hybrid and electric vehicles and for storing electricity (e.g., household and / or utility-scale power storage). A secondary battery typically includes an electrode assembly containing positive and negative electrodes, a housing that houses the electrode assembly, and electrode terminals connected to the electrode assembly.

[0003] Copper or aluminum has been used as materials for electrodes in the manufacture of conventional electrode assemblies. However, when aluminum is used, contact with the active material of the negative electrode in the event of a short circuit can cause a fire.

[0004] To address this problem, this paper discloses a method for manufacturing an electrode comprising a composite substrate having metal layers disposed on two surfaces of a polymer insulating layer (such as polyethylene terephthalate (PET)), and there is a need for a method for electrically conducting current between the metal layers disposed on the two surfaces of the insulating layer.

[0005] The information disclosed in this background section is intended to enhance the understanding of the background of this disclosure, and therefore may contain information that does not constitute related (or prior art). Summary of the Invention

[0006] This disclosure aims to provide a welding apparatus capable of solving the aforementioned problems, and an electrode assembly manufactured using the welding apparatus.

[0007] However, the technical problems to be solved by this disclosure are not limited to the above-mentioned problems, and those skilled in the art will clearly understand from the following description of this disclosure other problems not mentioned herein, as well as the aspects and features of this disclosure that will solve these problems.

[0008] According to an embodiment for solving the above-mentioned technical problem, a welding apparatus includes: an anvil; and a welding head configured to apply ultrasonic waves to weld the electrode plate, the first substrate terminal piece, and the second substrate terminal piece together while pressing an electrode plate, a first substrate terminal piece, and a second substrate terminal piece onto the anvil, wherein the welding head includes: a disc-shaped welding head; and a body portion connected to a central axis of the disc-shaped welding head, wherein the disc-shaped welding head is rotatable about the central axis, wherein the disc-shaped welding head includes: a first pressing portion configured to press: configured to: (1) press a first region where the electrode plate and the first substrate terminal piece overlap each other between the anvil and the welding head, and (2) press a second region where the electrode plate and the second substrate terminal piece overlap each other between the anvil and the welding head; and a second pressing portion configured to press a portion of a third region between the anvil and the welding head that overlaps the first substrate terminal piece and the second substrate terminal piece and is different from the first region and the second region.

[0009] In some embodiments, the electrode plate may include: an insulating layer; a first metal layer disposed on a first surface of the insulating layer, the first metal layer including an uncoated portion of the first metal layer; and a second metal layer disposed on a second surface of the insulating layer, the second metal layer including an uncoated portion of the second metal layer, wherein: the first region is the region where the uncoated portion of the first metal layer overlaps with the first substrate tab, and the second region is the region where the uncoated portion of the second metal layer overlaps with the second substrate tab.

[0010] In some embodiments, the first pressing portion may be continuously formed along the circumference of the outer peripheral surface of the disc-shaped welding head to press the electrode plate, the first substrate terminal block and the second substrate terminal block between the anvil and the welding head. The first pressing portion has a predetermined width, and the second pressing portion may include a plurality of second pressing portions extending in pairs from the first pressing portion in a direction orthogonal to the circumferential direction of the outer peripheral surface.

[0011] In some embodiments, each pair of second pressing portions in the plurality of second pressing portions may be spaced apart from each other by a predetermined distance along the circumference of the outer peripheral surface.

[0012] In some embodiments, a non-pressing area is formed between the plurality of second pressing portions, wherein when the electrode plate, the first substrate connector and the second substrate connector are pressed between the anvil and the welding head, the portions of the first substrate connector and the second substrate connector corresponding to the non-pressing area may not be pressed.

[0013] In some embodiments, the first pressing portion may be continuously formed along the circumference of the outer peripheral surface of the disc-shaped welding head to press the electrode plate, the first substrate contact, and the second substrate contact between the anvil and the welding head. The first pressing portion has a predetermined first width, and the second pressing portion may include: a circumferential pressing portion continuously formed along the circumference of the outer peripheral surface to press the first substrate contact and the second substrate contact between the anvil and the welding head, the circumferential pressing portion having a predetermined second width and located at a predetermined interval from the first pressing portion in a direction orthogonal to the circumferential direction of the outer peripheral surface; and a plurality of intermediate pressing portions formed along the circumference of the outer peripheral surface, the plurality of intermediate pressing portions having a predetermined third width between the first pressing portion and the circumferential pressing portion, each of the plurality of intermediate pressing portions being formed with a predetermined length in the circumferential direction of the outer peripheral surface, and the plurality of intermediate pressing portions being disposed at a predetermined constant interval in the circumferential direction of the outer peripheral surface.

[0014] In some embodiments, the fourth region corresponding to the preset constant interval may include a non-pressing region, wherein when the electrode plate, the first substrate connector and the second substrate connector are pressed between the anvil and the welding head, the portions of the first substrate connector and the second substrate connector corresponding to the non-pressing region are not pressed.

[0015] In some embodiments, the first pressing portion may include a plurality of first pressing portion protrusions that protrude from the outer peripheral surface of the disc-shaped welding head at predetermined intervals, and the second pressing portion may include a plurality of second pressing portion protrusions that protrude from the outer peripheral surface of the disc-shaped welding head at predetermined intervals.

[0016] In some embodiments, the second length of each of the plurality of second pressing portion protrusions may be greater than the first length of each of the plurality of first pressing portion protrusions.

[0017] In some embodiments, the second pressing portion may include one or more second pressing portions, and the number of the one or more second pressing portions is preset based on at least one of the circumference of the disc-shaped welding head and the length of the electrode plate.

[0018] In some embodiments, an electrode assembly may include: a first electrode; a second electrode; and a diaphragm disposed between the first electrode and the second electrode, wherein at least one of the first electrode and the second electrode may include: an electrode substrate, which may include: an insulating layer; a first metal layer disposed on a first surface of the insulating layer, the first metal layer including a first metal layer uncoated portion without active material; and a second metal layer disposed on a second surface of the insulating layer, the second metal layer including a second metal layer uncoated portion without active material; a first electrode mixture layer formed by coating the active material on a region of the first metal layer; and a second electrode mixture layer formed by coating the active material on a region of the second metal layer; a first substrate tab extending in a first direction from a first point on the uncoated portion of the first metal layer; and a second substrate tab extending in the first direction from a second point on the uncoated portion of the second metal layer, the second substrate tab being formed facing the first substrate tab, wherein only a portion of the overlapping regions of the first substrate tab and the second substrate tab are soldered.

[0019] In some embodiments, a first region of the first substrate terminal block may be connected to an uncoated portion of the first metal layer, a first region of the second substrate terminal block may be connected to an uncoated portion of the second metal layer, and a second region of the first substrate terminal block and a second region of the second substrate terminal block may be connected to each other, such that the first metal layer and the second metal layer are electrically connected.

[0020] In some embodiments, the first point is separated from the first electrode mixture layer on the first metal layer by a predetermined distance, and the second point is separated from the second electrode mixture layer by the predetermined distance.

[0021] In some embodiments, at least one of the first electrode and the second electrode may further include: a first welding portion, comprising a welding portion in the following regions: (1) a first region where the uncoated portion of the first metal layer overlaps with the first substrate tab; and (2) a second region where the uncoated portion of the second metal layer overlaps with the second substrate tab; and a second welding portion, extending from the first welding portion in the first direction, wherein the second welding portion comprises a welding portion in the following regions: (3) a third region where the first substrate tab and the second substrate tab overlap with each other and are different from the first region and the second region, the second welding portion having a predetermined width at one end and the other end of the first substrate tab and the second substrate tab in a second direction intersecting the first direction.

[0022] In some embodiments, the first weld portion may be welded continuously in the first region and the second region.

[0023] In some embodiments, the non-soldering regions of the first substrate terminal block and the second substrate terminal block that can be left unsoldered are formed at a predetermined interval, the non-soldering regions being located between the second welded portions welded at one end of the first substrate terminal block and the second substrate terminal block in the second direction and the second welded portions welded at the other end of the first substrate terminal block and the second substrate terminal block in the second direction.

[0024] In some embodiments, the first substrate terminal block may include a plurality of first substrate terminal blocks, and the second substrate terminal block may include a plurality of second substrate terminal blocks. The plurality of first substrate terminal blocks and the plurality of second substrate terminal blocks may be stacked in a direction intersecting the first direction and the second direction. Lead terminal blocks may be disposed on the non-soldering area of ​​the plurality of first substrate terminal blocks and the plurality of second substrate terminal blocks stacked in the direction intersecting the first direction and the second direction, and the non-soldering area and the lead terminal block may be soldered to each other.

[0025] In some embodiments, the spacing in the second direction between the second weld portion welded at one end of the first substrate terminal block and the second substrate terminal block and the second weld portion welded at the other end of the first substrate terminal block and the second substrate terminal block can be set based on the width of the lead terminal block in the second direction.

[0026] In some embodiments, at least one of the first electrode and the second electrode may further include a third welding portion, the third welding portion being connected in the second direction to a plurality of second welding portions welded at one end of the first substrate terminal block, the other end of the first substrate terminal block, one end of the second substrate terminal block, and the other end of the second substrate terminal block, respectively.

[0027] In some embodiments, at least one of the first electrode and the second electrode further includes a coating portion formed by coating an insulating material in the first welding portion onto the first substrate tab and the second substrate tab.

[0028] According to some embodiments of this disclosure, a welding apparatus can be provided that ensures sufficient welding area between the metal layer disposed on two surfaces (e.g., a first surface and a second surface) of an insulating layer included in an electrode substrate and the substrate tab.

[0029] According to some embodiments of this disclosure, the welding strength can be improved by increasing the welding area between the substrate terminals while ensuring the contact area between the substrate terminals and the lead terminals.

[0030] According to some embodiments of this disclosure, electrodes with high energy density can be manufactured by ensuring the welding area of ​​the fixed substrate tabs and lead tabs, thereby reducing the length of the substrate tabs extending from the electrode substrate and reducing the length of the lead tabs connected to the substrate tabs.

[0031] However, the aspects and features of this disclosure are not limited to those described above, and those skilled in the art will clearly understand from the detailed description below that other aspects and features not mentioned will be apparent. Attached Figure Description

[0032] The following accompanying drawings illustrate embodiments of the present disclosure and, together with the detailed description of the present disclosure, further describe aspects and features of the present disclosure. Therefore, the present disclosure should not be construed as limited to the drawings.

[0033] Figure 1 An example of the upper surface of an electrode plate according to an embodiment of the present disclosure is shown.

[0034] Figure 2 It is along Figure 1 The cross-sectional view taken from line AA.

[0035] Figure 3 An example is shown of the upper surface of an electrode plate provided with substrate connecting pieces according to an embodiment of the present disclosure.

[0036] Figure 4 It is along Figure 3 The cross-sectional view of line BB.

[0037] Figure 5 Examples of welding apparatus and electrode plates according to embodiments of the present disclosure are provided.

[0038] Figure 6 An example of an unfolded view of the welding head of a welding apparatus according to an embodiment of the present disclosure.

[0039] Figure 7 This is an example Figure 6 A perspective view of an example of the CC region.

[0040] Figure 8 and Figure 9 Exemplary states before and after the welding of the electrode plate and substrate terminals is performed by the welding apparatus, according to embodiments of the present disclosure.

[0041] Figure 10 It is along Figure 9The cross-sectional view of line DD.

[0042] Figure 11 It is along Figure 9 The cross-sectional view of line EE.

[0043] Figure 12 Example by using Figure 9 An example of a single electrode manufactured by slitting and punching an electrode plate is shown.

[0044] Figure 13 Another example of a welding apparatus according to an embodiment of the present disclosure is shown.

[0045] Figure 14 An unfolded view of the welding head of another example of a welding apparatus according to an embodiment of the present disclosure.

[0046] Figure 15 This is an example Figure 14 A perspective view of an example of the FF region.

[0047] Figure 16 and Figure 17 The illustration shows the state before and after welding of the electrode plate and substrate tabs performed by another example of the welding apparatus according to an embodiment of the present disclosure.

[0048] Figure 18 Example by using Figure 17 An example of a single electrode manufactured by slitting and punching an electrode plate is shown.

[0049] Figure 19 An example of a coating portion applied to a first weld portion according to an embodiment of the present disclosure is shown.

[0050] Figure 20 It is along Figure 19 The cross-sectional view of line GG.

[0051] Figure 21 Example by using Figure 19 An example of a single electrode manufactured by slitting and punching an electrode plate is shown.

[0052] Figure 22 An example of a stacked structure of a first electrode, a diaphragm, and a second electrode according to an embodiment of the present disclosure is shown.

[0053] Figure 23 An example of an electrode assembly according to an embodiment of the present disclosure is shown, wherein lead terminals are connected to substrate terminals.

[0054] Figure 24 It is along Figure 23 The cross-sectional view taken from line HH.

[0055] Figure 25 It is along Figure 23 The cross-sectional view taken from line II.

[0056] Figure 26 Examples of secondary batteries including electrode assemblies according to embodiments of the present disclosure are illustrated.

[0057] <Description of reference numerals in the attached figures>

[0058] 1: Secondary battery; 10: Electrode assembly

[0059] 20: Shell 21: Receiving portion

[0060] 22: Sealing part 100a: Electrode plate

[0061] 100: Electrode, first electrode; 110: Electrode substrate

[0062] 111: Insulating layer; 112: First metal layer

[0063] 112a: Uncoated portion P1: First point

[0064] 113: Second metal layer

[0065] 113a: Uncoated portion; P2: Second point

[0066] 114: Electrode mixture layer; 120: First substrate terminal block

[0067] 120a: First region of the first substrate terminal block

[0068] 120b: Second region of the first substrate terminal block

[0069] 130: Second substrate connector

[0070] 130a: First region of the second substrate terminal block

[0071] 130b: Second region of the second substrate terminal block

[0072] 140a: First welding area; 140: First welding section

[0073] 150a: Second welding area; 150: Second welding section

[0074] 160: Non-welding area; 170a: Third welding area

[0075] 170: Third welding section; 190: Coated section

[0076] 200: Second electrode; 300: Diaphragm

[0077] 400: Lead wire connector; 410: Connector film

[0078] 1000: Welding device; 1100: Anvil.

[0079] 1200: Welding head; 1300: Welding head

[0080] 1300': Disc-shaped welding head; 1310: First pressing part

[0081] 1320: Second pressing part; 1320a: Circumferential pressing part

[0082] 1320b: Middle pressing part

[0083] 1311, 1321: Protrusions; 1400: Main body. Detailed Implementation

[0084] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. The terms or words used in this specification and claims should not be construed as having a general or dictionary meaning, but should be interpreted as consistent with the technical spirit of the present disclosure, based on the principle that the inventor is capable of being his / her own lexicographer to appropriately define the terms and concepts in order to best describe his / her invention.

[0085] The embodiments described in this specification and the configurations shown in the accompanying drawings are only some of the embodiments of this disclosure and do not represent all the technical spirit, aspects, and features of this disclosure. Accordingly, it should be understood that various equivalents and modifications that can replace or modify the embodiments described herein may exist at the time of filing this application.

[0086] It will be understood that when an element or layer is referred to as being "on" another element or layer, "connected to," or "linked to" another element or layer, it may be directly on, directly connected to, or linked to the other element or layer, or one or more intermediary elements or layers may be present. When an element or layer is referred to as being "directly on" another element or layer, "directly connected to," or "directly linked to" another element or layer, no intermediary element or layer is present. For example, when a first element is described as being "linked" or "connected" to a second element, the first element may be directly linked to or connected to the second element, or the first element may be indirectly linked to or connected to the second element via one or more intermediary elements.

[0087] In the figures, the dimensions of various elements, layers, etc., may be exaggerated for clarity of illustration. The same reference numerals denote the same elements. As used herein, the term “and / or” includes any and all combinations of one or more of the related listed items. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.” Expressions such as “at least one of…” and “any one of…” modify the entire list of elements when following it, and not individual elements within that list. When phrases such as “at least one of A, B, and C,” “at least one of A, B, or C,” “at least one selected from the group of A, B, and C,” or “at least one selected from A, B, and C” are used to refer to a list of elements A, B, and C, the phrase may refer to any one of A, B, and C and all suitable combinations or subsets of them, such as A, B, C, A and B, A and C, B and C, or A and B and C. As used herein, the term “use” may be considered synonymous with the term “utilize.” As used herein, the terms “substantially,” “about,” and similar terms are used as approximate terms and not as terms of degree, and are intended to describe the inherent variations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art.

[0088] It will be understood that although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or segment from another element, component, region, layer, or segment. Therefore, without departing from the teachings of the exemplary embodiments, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment.

[0089] For ease of description, spatial relative terms such as “below,” “under,” “down,” “above,” and “above” are used herein to describe the relationship between one element or feature illustrated in the figure and another element or feature. It will be understood that spatial relative terms are intended to cover different orientations of the device in use or operation other than the orientation depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “under” other elements or features would then be oriented as “above” or “above” other elements or features. Therefore, the term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly.

[0090] The terminology used herein is for the purpose of describing embodiments of this disclosure and is not intended to limit this disclosure. As used herein, the singular form “a” is intended to include the plural form as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprising” and / or “including” as used in this specification specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0091] Furthermore, any numerical range disclosed and / or described herein is intended to include all subranges with the same numerical precision contained within the described range. For example, the range “1.0 to 10.0” is intended to include all subranges between the described minimum value of 1.0 and the described maximum value of 10.0 (and including both the described minimum value of 1.0 and the described maximum value of 10.0), i.e., a minimum value equal to or greater than 1.0 and a maximum value equal to or less than 10.0, such as 2.4 to 7.6. Any maximum numerical limit described herein is intended to include all lower numerical limits contained therein, and any minimum numerical limit described herein is intended to include all higher numerical limits contained therein. Accordingly, the applicant reserves the right to amend this specification, including the claims, to explicitly describe any subranges contained within the scope explicitly described herein.

[0092] Referring to two compared elements, features, etc., as “identical” can mean that they are “substantially identical.” Therefore, the phrase “substantially identical” can include cases where the deviation is considered low in the art (e.g., 5% or less). Additionally, when a parameter is said to be consistent in a given region, it can mean that it is consistent in terms of average value.

[0093] Throughout this specification, unless otherwise stated, each element may be singular or plural.

[0094] Placing any element "above (or below)" or "on (or under)" another element can mean that the arbitrary element can be positioned to contact the upper (or lower) surface of the element, and that the other element can be positioned between the element and the arbitrary element positioned on (or under) the element.

[0095] Additionally, it will be understood that when a component is referred to as “connected,” “linked,” or “attached” to another component, these components can be directly “connected,” “linked,” or “attached” to each other, or another component can be “between” these components.

[0096] Throughout this specification, unless otherwise stated, the phrase "A and / or B" means A, B, or A and B. That is, "and / or" includes any one or all of the listed items. Unless otherwise stated, the phrase "C to D" means C and below D.

[0097] In the following text, reference will be made to Figures 1 to 26 Various embodiments of this disclosure are described. Throughout the specification, the same reference numerals may denote the same constituent elements.

[0098] Figure 1 An example of the upper surface of an electrode plate according to an embodiment of the present disclosure is shown. Figure 2 It is along Figure 1 The cross-sectional view taken from line AA. Figure 3 An example is shown of the upper surface of an electrode plate provided with substrate connecting pieces according to an embodiment of the present disclosure. Figure 4 It is along Figure 3 The cross-sectional view of line BB.

[0099] refer to Figure 1 and Figure 2 According to embodiments of the present disclosure, the electrode plate 100a may include an electrode substrate 110 and a mixture layer 114. The electrode substrate 110 may include an insulating layer 111 and a first metal layer 112 and a second metal layer 113 respectively disposed on two surfaces of the insulating layer 111 (i.e., the first metal layer 112 disposed on the first surface of the insulating layer 111, and the second metal layer 113 disposed on the second surface of the insulating layer 111). Each electrode mixture layer 114 may be formed by coating an active material onto a region of each of the first metal layer 112 and the second metal layer 113.

[0100] According to one embodiment, the insulating layer 111 may be formed of a polymer material. For example, the insulating layer 111 may be formed of polyethylene terephthalate (PET) resin. The material of the insulating layer 111 is not limited to this and may be formed of polyester resins such as polypropylene terephthalate (PTT), polybutylene terephthalate (PBT), or polyethylene naphthalate (PEN).

[0101] According to one embodiment, a first metal layer 112 may be disposed on one surface of an insulating layer 111, and a second metal layer 113 may be disposed on the other surface of the insulating layer 111. Each of the first metal layer 112 and the second metal layer 113 may be formed by coating the insulating layer 111 with a metal material such as copper, copper alloy, nickel, or nickel alloy, or by coating the insulating layer 111 with a metal material such as aluminum or aluminum alloy.

[0102] For example, when the first metal layer 112 and the second metal layer 113 are composed of aluminum, the electrode mixture layer 114 formed on the regions of the first metal layer 112 and the second metal layer 113 may include a positive electrode active material. In this case, the electrode plate 100a is used as a positive electrode plate, and the positive electrode can be manufactured by a slitting process or the like.

[0103] As another example, when the first metal layer 112 and the second metal layer 113 are composed of copper, the electrode mixture layer 114 formed on the regions of the first metal layer 112 and the second metal layer 113 may include a negative electrode active material. In this case, the electrode plate 100a serves as a negative electrode plate, and the negative electrode can be manufactured by a slitting process or the like.

[0104] According to one embodiment, the electrode mixture layer 114 can be formed by coating an active material onto a region of the first metal layer 112. The uncoated portion of the first metal layer 112 (i.e., the uncoated portion of the first metal layer) 112a can be a region of the first metal layer 112 where no active material is coated.

[0105] According to one embodiment, the electrode mixture layer 114 can be formed by coating an active material onto a region of the second metal layer 113. The uncoated portion of the second metal layer 113 (i.e., the uncoated portion of the second metal layer) 113a can be a region of the second metal layer 113 where no active material is coated.

[0106] like Figure 1 and Figure 2 As shown, when the electrode substrate 110 includes an insulating layer 111 formed of a polymer material, the weight of the electrode substrate 110 itself can be reduced, thereby increasing the energy density of the battery. However, since the first metal layer 112 and the second metal layer 113 are insulated from each other through the insulating layer 111, additional configuration and processes may be required to electrically connect the first metal layer 112 and the second metal layer 113.

[0107] refer to Figures 2 to 4 The first substrate terminal block 120 and the second substrate terminal block 130 for connecting the first metal layer 112 and the second metal layer 113 can be disposed on the electrode plate 100a according to an embodiment of the present disclosure.

[0108] According to one embodiment, the first substrate terminal block 120 may be configured to extend from a first point P1 on the uncoated portion 112a of the first metal layer 112 in a first direction (e.g., the Y-axis direction). The first point P1 may be a point on the uncoated portion 112a of the first metal layer 112 that is separated from the electrode mixture layer 114 on the first metal layer 112 by a predetermined distance G.

[0109] According to one embodiment, the second substrate terminal block 130 may be configured to extend from a second point P2 on the uncoated portion 113a of the second metal layer 113 in a first direction (e.g., the Y-axis direction). The first substrate terminal block 120 and the second substrate terminal block 130 may be disposed facing each other. The second point P2 may be a point on the uncoated portion 113a of the second metal layer 113 that is separated from the electrode mixture layer 114 on the second metal layer 113 by a predetermined distance G.

[0110] In one example, a short circuit may occur and problems may arise when the first substrate tab 120 and the electrode mixture layer 114, or the second substrate tab 130 and the electrode mixture layer 114, are in contact with or very close to each other. For example, the electrode mixture layer 114 may be damaged when the first substrate tab 120 and the second substrate tab 130 are soldered. Furthermore, as the distance between (1) the first substrate tab 120 and the electrode mixture layer 114 and (2) the second substrate tab 130 and the electrode mixture layer 114 increases, the width of the electrode mixture layer 114 decreases, which may reduce the battery capacity. Accordingly, the first point P1 and the second point P2 can be separated from the electrode mixture layer 114 so that the first substrate tab 120 and the electrode mixture layer 114, and the second substrate tab 130 and the electrode mixture layer 114, do not cause a short circuit and do not damage the electrode mixture layer 114 during the soldering process, while also minimizing the reduction in battery capacity.

[0111] According to one embodiment, when the first metal layer 112 and the first substrate terminal block 120, the second metal layer 113 and the second substrate terminal block 130, and the first substrate terminal block 120 and the second substrate terminal block 130 are connected, the first metal layer 112 and the second metal layer 113 can be electrically connected to each other through the first substrate terminal block 120 and the second substrate terminal block 130. Specifically, the first region 120a of the first substrate terminal block 120 can be connected to the uncoated portion 112a of the first metal layer 112, the first region 130a of the second substrate terminal block 130 can be connected to the uncoated portion 113a of the second metal layer 113, and the second region 120b of the first substrate terminal block 120 and the second region 130b of the second substrate terminal block 130 can be connected to each other, so that the first metal layer 112 and the second metal layer 113 are electrically connected to each other.

[0112] The following will describe in detail a method for welding electrode plate 100a, first substrate terminal block 120 and second substrate terminal block 130 together using a welding apparatus 1000 according to embodiments of the present disclosure.

[0113] Figure 5 Examples of welding apparatus and electrode plates according to embodiments of the present disclosure are provided.

[0114] refer to Figure 5 According to embodiments of the present disclosure, the welding apparatus 1000 may include an anvil 1100 and a welding head 1200, the welding head 1200 being configured to press an electrode plate 100a, a first substrate contact 120, and a second substrate contact 130 (see [link to documentation]) disposed on the anvil 1100. Figure 4 While applying ultrasonic waves, the electrode plate 100a, the first substrate connector 120, and the second substrate connector 130 are welded together. The welding head 1200 may include a disc-shaped welding head 1300 and a body portion 1400 connected to a central axis of the welding head 1300, allowing the welding head 1300 to rotate. The welding head 1300 may include a first pressing portion 1310 and a second pressing portion 1320. The first pressing portion 1310 is configured to press a first region where the electrode plate 100a and the first substrate connector 120 overlap, and a second region where the electrode plate 100a and the second substrate connector 130 overlap. The second pressing portion 1320 is configured to press a portion of a third region where the first substrate connector 120 and the second substrate connector 130 overlap, and which is different from the first and second regions.

[0115] According to one embodiment, the electrode plate 100a, the first substrate terminal block 120, and the second substrate terminal block 130 can be welding targets and can be transported between the anvil 1100 and the welding head 1200 by an electrode plate conveying device (not shown).

[0116] According to one embodiment, the welding targets (i.e., electrode plate 100a, first substrate terminal block 120, and second substrate terminal block 130) can be conveyed and placed on one surface of anvil 1100. As an example, the first substrate terminal block 120 and the second substrate terminal block 130 can be in the uncoated portion 112a of the first metal layer 112 of the electrode plate 100a (see...). Figure 2 ) and the uncoated portion 113a of the second metal layer 113 (see Figure 2 The overlapping state is conveyed on the anvil 1100 and can be set on the anvil.

[0117] According to one embodiment, the anvil 1100 may be symmetrical to the welding head 1200. However, the embodiment is not limited to this, and any shape can be used as the anvil 1100, as long as the electrode plate 100a, the first substrate terminal block 120, and the second substrate terminal block 130 can be conveyed and pressed between the anvil 1100 and the welding head 1200. For example, the anvil 1100 may be configured with a pair of rollers together with the welding head 1200, and the electrode plate 100a, the first substrate terminal block 120, and the second substrate terminal block 130 may be pressed and passed through in the rotational direction of the anvil 1100 and the welding head 1200.

[0118] According to one embodiment, the welding head 1200 can apply ultrasonic waves to weld the electrode plate 100a, the first substrate connector 120, and the second substrate connector 130 disposed on the anvil 1100 while pressing the welding head 1200 between the welding head 1200 and the anvil 1100. The welding head 1200 may include a welding head 1300 and a main body portion 1400.

[0119] According to one embodiment, the welding head 1300 may be configured as generally disc-shaped and may include a first pressing portion 1310 and a second pressing portion 1320 formed along the outer peripheral surface of the disc's circumference. Reference will be made below. Figure 6 and Figure 7 A detailed description of the first pressing part 1310 and the second pressing part 1320 is provided.

[0120] According to one embodiment, the welding head 1300 can rotate in a direction corresponding to the electrode plate conveying direction (e.g., the X-axis direction) (e.g., counterclockwise direction) and can continuously press the welding target (e.g., electrode plate 100a, first substrate terminal block 120 and second substrate terminal block 130) disposed on the anvil 1100 (i.e., as the welding head 1300 rotates, the welding target is pressed between the anvil 1000 and the welding head 1300).

[0121] According to one embodiment, the main body 1400 can be connected to the central axis of the welding head 1300, allowing the welding head 1300 to rotate. The main body 1400 can ultrasonically vibrate in a direction perpendicular to the electrode plate conveying direction (e.g., the X-axis direction) (e.g., the Z-axis direction). As the main body 1400 vibrates, the vibration is transmitted to the welding head 1300 connected to the main body 1400, thereby applying ultrasonic waves to the welding target. For example, when the electrode plate 100a, the first substrate terminal block 120, and the second substrate terminal block 130 are conveyed and disposed on the anvil 1100, and the welding head 1300 presses against the electrode plate 100a, the first substrate terminal block 120, and the second substrate terminal block 1300 disposed on the anvil 1100, the welding head 1300 can vibrate laterally. Due to the vibration energy at this time, the contact surfaces of the electrode plate 100a, the first substrate terminal block 120, and the second substrate terminal block 130 can be heated and welded together.

[0122] Figure 6 An unfolded view of the welding head of a welding apparatus according to an embodiment of the present disclosure is shown. Figure 7 This is an example Figure 6 A perspective view of the CC region.

[0123] refer to Figure 6According to an embodiment of the present disclosure, the welding head 1300 of the welding apparatus 1000 may include a first pressing portion 1310 and a second pressing portion 1320.

[0124] According to one embodiment, the first pressing portion 1310 may be continuously formed along the circumference of the outer peripheral surface of the welding head 1300 with a predetermined width (e.g., in the Y direction). The first pressing portion 1310 may be connected to the first region 120a of the first substrate tab 120 (see...). Figure 4 ) and the first region 130a of the second substrate terminal block 130 (see Figure 4 Correspondingly, the first substrate contact 120 and the second substrate contact 130 are pressed. For example, at the first region 120a of the first substrate contact 120, the first pressing portion 1310 can press the uncoated portion 112a of the first metal layer 112 (see...). Figure 2 The first substrate connector 120 is on the first substrate connector 120. At a first region 120a of the first substrate connector 120, the first substrate connector 120 can be soldered to the first metal layer 112. As another example, at a first region 130a of the second substrate connector 130, a first pressing portion 1310 can press against an uncoated portion 113a of the second metal layer 113 (see...). Figure 2 The second substrate connector 130 is located on the second substrate connector 130. At the first region 130a of the second substrate connector 130, the second substrate connector 130 can be soldered to the second metal layer 113.

[0125] According to one embodiment, the second pressing portion 1320 may include a plurality of second pressing portions 1320, which are formed to extend in pairs from the first pressing portion 1310 in a direction orthogonal to the circumferential direction of the outer peripheral surface of the welding head 1300 (e.g., the Y-axis direction). Each pair of second pressing portions 1320 may be spaced apart from each other by a predetermined distance W1 along the circumference of the outer peripheral surface of the welding head 1300.

[0126] According to one embodiment, a plurality of second pressing portions 1320 can press the first substrate connector 120 and the second substrate connector 130 corresponding to the second region 120b of the first substrate connector 120 and the second substrate connector 130. For example, at the second region 120b of the first substrate connector 120 and the second region 130b of the second substrate connector 130, the second pressing portions 1320 can press both the first substrate connector 120 and the second substrate connector 130, thereby soldering the first substrate connector 120 and the second substrate connector 130 together.

[0127] According to one embodiment, a first substrate bonding pad 120 may be formed between a plurality of second pressing portions 1320 (see...). Figure 4 ) and the second substrate connector 130 (see Figure 4 The non-pressed area 1330 is not pressed. For example, in the region where the second region 120b of the first substrate contact 120 and the second region 130b of the second substrate contact 130 face each other, the first substrate contact 120 and the second substrate contact 130 can be partially pressed and soldered in the electrode plate conveying direction (e.g., the X-axis direction) by a plurality of second pressing portions 1320. The portions of the first substrate contact 120 and the second substrate contact 130 corresponding to the non-pressed area 1330 between the plurality of second pressing portions 1320 may not be pressed, and therefore may not be soldered to each other.

[0128] According to one embodiment, the first pressing portion 1310 and the second pressing portion 1320 may each include a plurality of protrusions 1311 and 1321 that protrude from the outer peripheral surface of the welding head 1300 at predetermined intervals.

[0129] According to one embodiment, a plurality of protrusions 1311 and 1321 may be continuously arranged at predetermined intervals along the outer peripheral surface of the welding head 1300. The plurality of protrusions 1311 and 1321 may protrude from the outer peripheral surface of the welding head 1300. The protruding surfaces of the plurality of protrusions 1311 and 1321 may have a specific shape that provides good contact with the welding target. For example, the plurality of protrusions 1311 and 1321 may have a plurality of rectangular column shapes protruding from the outer peripheral surface of the welding head 1300. Other shapes are also within the scope of this disclosure.

[0130] According to one embodiment, the heights at which a plurality of protrusions (i.e., first pressing portion protrusions) 1311 in the first pressing portion 1310 and a plurality of protrusions (i.e., second pressing portion protrusions) 1321 in the second pressing portion 1320 protrude from the outer peripheral surface of the welding head 1300 can be different from each other. For example, the length (e.g., second length) L2 of the protrusion 1321 protruding from the outer peripheral surface of the welding head 1300 at the second pressing portion 1320 can be greater than the length (e.g., first length) L1 of the protrusion 1321 protruding from the outer peripheral surface of the welding head 1300 at the first pressing portion 1310. This correspondence can be based on the thickness of the electrode substrate 110, wherein the first pressing portion 1310 presses the electrode substrate 110 (see...). Figure 4 The first substrate connector 120 and the second substrate connector 130 overlap in a first region, and the second pressing portion 1320 presses the second substrate connector 120 and the second substrate connector 130 overlap in a second region.

[0131] Figure 8 and Figure 9Exemplary states are shown before and after the welding of electrode plates and substrate terminals is performed by a welding apparatus according to an embodiment of the present disclosure. Figure 10 It is along Figure 9 The cross-sectional view of line DD. Figure 11 It is along Figure 9 The cross-sectional view of line EE. Figure 12 Example passed Figure 9 An example of a single electrode manufactured by the slitting and punching process of the electrode plate is shown in the figure.

[0132] refer to Figure 3 , Figure 4 and Figure 8 According to an embodiment of the present disclosure, the electrode plate 100a (wherein the first substrate terminal piece 120 is disposed on the uncoated portion 112a of the first metal layer 112 of the electrode substrate 110) Figure 2 The second substrate terminal block 130 is disposed on the uncoated portion 113a of the second metal layer 113 (see...). Figure 2 The material can be transported between the anvil 1100 and the welding head 1200 in one direction (e.g., the Y-axis direction).

[0133] According to one embodiment, the anvil 1100 and the welding head 1200 can rotate corresponding to the electrode plate conveying direction (e.g., the X-axis direction), and the electrode plate 100a can be pressed between the anvil 1100 and the welding head 1200 while the welding head 1200 rotates. For example, corresponding to the conveying speed of the electrode plate 100a, the main body portion 1400 of the welding head 1200 can provide a driving force, enabling the welding head 1300 to rotate. The main body portion 1400 can ultrasonically vibrate in a direction perpendicular to the electrode plate conveying direction (e.g., the Z-axis direction). As the main body portion 1400 vibrates, the vibration is transmitted to the welding head 1300 connected to the main body portion 1400, thereby allowing ultrasonic waves to be applied to the electrode plate 100a.

[0134] According to one embodiment, as the welding head 1300 rotates, the first pressing portion 1310 of the welding head 1300 (see...) Figure 6 The first region 120a of the first substrate contact 120 can be pressed. A plurality of second pressing portions 1320 are formed in pairs on the solder head 1300 (see...). Figure 6 A portion of the second region 120b of the first substrate contact 120 can be pressed, but the non-pressable region 1330 (see...) Figure 6 It is possible to not press another part of the second region 120b of the first substrate connector 120.

[0135] According to one embodiment, the second pressing portion 1320 may include one or more second pressing portions 1320. The number of the one or more second pressing portions 1320 may be predetermined based on at least one of the perimeter of the welding head 1300 (assuming the welding head 1300 is disc-shaped) and the length of the electrode plate 100a. The perimeter of the disc-shaped welding head 1300 may correspond to the electrode 100 cut from the electrode plate 100a according to battery design conditions (see...). Figure 12 The width (length in the X-axis direction) of the electrode. For example, when the circumference of the disc-shaped welding head 1300 is the width of the electrode 100 (see... Figure 12 When the width of the electrode plate 100a is four times that of the electrode 100, the length of contact with the electrode plate 100a during one rotation of the disc-shaped welding head 1300 corresponds to a length four times the width of the electrode 100. The second pressing portion 1320 corresponds to the width of each electrode 100 to be cut, and the disc-shaped welding head 1300 may include four second pressing portions 1320 arranged at regular intervals. Accordingly, when the disc-shaped welding head 1300 rotates once on the electrode plate 100a, the second pressing portion 1320 may press the second region 120b of the first substrate terminal piece 120 four times at regular intervals.

[0136] refer to Figures 9 to 11 According to an embodiment of the present disclosure, the first region 120a of the first substrate terminal block 120 (see...) Figure 4 It can be soldered to the uncoated portion 112a of the first metal layer 112 (see...) Figure 2 The first region 130a of the second substrate terminal block 130 (see...) Figure 4 It can be soldered to the uncoated portion 113a of the second metal layer 113 (see...). Figure 2 The second region 120b of the first substrate terminal block 120 (see...) Figure 4 ) and the second region 130b of the second substrate terminal block 130 (see Figure 4 A portion of the areas facing each other can be welded, while the remaining areas can remain unwelded.

[0137] According to one embodiment, the first welding area 140a may be the uncoated portion 112a of the first metal layer 112 (see...). Figure 2 The uncoated portion 113a of the second metal layer 113 between the first substrate terminal block 120 and the second substrate terminal block 113 (see...) Figure 2 The first soldering area 140a may be the area soldered between the first soldering area 140a and the second substrate terminal piece 130. The first soldering area 140a may be the area soldered via the soldering head 1300 (see...). Figure 8 The first pressing part 1310 (see) Figure 6 The area continuously welded in a second direction (e.g., the X-axis direction). The first weld depth (also referred to as the first weld portion) WD1 can be connected to a plurality of protrusions 1311 of the first pressing portion 1310 (see...). Figure 7 Correspondingly formed in the first welding area 140a.

[0138] According to one embodiment, the second soldering region 150a may be the soldered region within the areas where the second regions 120b of the first substrate connector 120 and the second regions 130b of the second substrate connector 130 face each other. The non-soldering region 160a may be the remaining unsoldered regions within the areas where the second regions 120b of the first substrate connector 120 and the second regions 130b of the second substrate connector 130 face each other. The second soldering region 150a may be formed in pairs on the soldering head 1300 (see...). Figure 8 Multiple second pressing portions 1320 on the surface (see) Figure 6 The area to be welded. The second weld depth (also referred to as the second weld portion) WD2 can be connected to the multiple protrusions 1321 of the second pressing portion 1320 (see...). Figure 7 Correspondingly formed in the second welding area 150a. The non-welding area 160a may be the area in the second direction (e.g., the X-axis direction) between a pair of second welding areas 150a where the first substrate terminal block 120 and the second substrate terminal block 130 are not welded.

[0139] According to one embodiment, the first metal layer 112 and the second metal layer 113 can be indirectly connected to each other via the first substrate terminal block 120 and the second substrate terminal block 130, thereby enabling them to be electrically connected to each other. A first region 120a of the first substrate terminal block 120 is connected to an uncoated portion 112a of the first metal layer 112, a first region 130a of the second substrate terminal block 130 is connected to an uncoated portion 113a of the second metal layer 113, and a portion of the second region 120b of the first substrate terminal block 120 and a portion of the second region 130b of the second substrate terminal block 130 are connected, allowing the first metal layer 112 and the second metal layer 113 to be electrically connected to each other.

[0140] refer to Figure 10 and Figure 12 , Figure 9 The electrode plate 100a shown can be slit along the slit line SL and can be manufactured into multiple electrodes. The slit electrode 100 may include a first welding region 140a, a second welding region 150a, and a non-welding region 160a. The slit electrode 100 may have a portion of an electrode substrate 110, a first substrate tab 120, and a second substrate tab 130 stamped along the punching line NL. After stamping, the electrode 100 may include a first welding portion 140, a second welding portion 150, and a non-welding region 160.

[0141] According to one embodiment, the first weld portion 140 may be an uncoated portion 112a of the first metal layer 112 (see [reference]). Figure 2 The uncoated portion 113a of the second metal layer 113 between the first substrate terminal block 120 and the second substrate terminal block 113 (see...) Figure 2 The area to be soldered between the first substrate connector 120 and the second substrate connector 130. The second solder portion 150 may be an area extending from the first solder portion 140 in a first direction (e.g., the Y-axis direction) and soldered at one end of the first substrate connector 120 and the second substrate connector 130 in a second direction (e.g., the X-axis direction) intersecting the first direction and at the other end of the first substrate connector 120 and the second substrate connector 130 in the second direction, with a predetermined width in the area between the first substrate connector 120 and the second substrate connector 130.

[0142] According to one embodiment, the non-welded area 160 may be the area in the region between the first substrate connector 120 and the second substrate connector 130 where the first substrate connector 120 and the second substrate connector 130 are welded at one end in a second direction (e.g., the X-axis direction) and the second welded portion 150 where the first substrate connector 120 and the second substrate connector 130 are welded at the other end in the second direction, where the first substrate connector 120 and the second substrate connector 130 are not welded.

[0143] According to one embodiment, the first welded portion 140, the second welded portion 150, and the non-welded area 160 can be used as electrode terminals. The non-welded area 160 can be in which lead terminals 400 can be welded (see...). Figure 23 The region is as described below.

[0144] Even if the width of the first substrate connector 120 and the second substrate connector 130 welded in the first welding portion 140 in the first direction is narrow, the welding area of ​​the first substrate connector 120 and the second substrate connector 130 in the second welding portion 150 can be sufficiently ensured. Therefore, the first substrate connector 120 and the second substrate connector 130 can be welded together with high welding strength.

[0145] Figure 13 Another example of a welding apparatus according to an embodiment of the present disclosure is shown. Figure 14 An unfolded view of the welding head of another example of a welding apparatus according to an embodiment of the present disclosure. Figure 15 This is an example Figure 14 A perspective view of an example of the FF region.

[0146] refer to Figures 13 to 15The welding apparatus 1000 according to an embodiment of the present disclosure may include a disc-shaped welding head 1300', which includes a pressing portion surrounding a non-pressing region 1330. The disc-shaped welding head 1300' may include a first pressing portion 1310 and a second pressing portion 1320.

[0147] According to one embodiment, the first pressing portion 1310 may be continuously formed along the circumference of the outer peripheral surface of the disc-shaped welding head 1300' with a predetermined first width. The first pressing portion 1310 may be connected to the first region 120a of the first substrate tab 120 (see...). Figure 4 ) and the first region 130a of the second substrate terminal block 130 (see Figure 4 Correspondingly, the first substrate contact 120 and the second substrate contact 130 are pressed. For example, at the first region 120a of the first substrate contact 120, the first pressing portion 1310 can press the uncoated portion 112a of the first metal layer 112 (see...). Figure 2 The first substrate connector 120 is on the first substrate connector 120. At a first region 120a of the first substrate connector 120, the first substrate connector 120 can be soldered to the first metal layer 112. As another example, at a first region 130a of the second substrate connector 130, a first pressing portion 1310 can press against an uncoated portion 113a of the second metal layer 113 (see...). Figure 2 The second substrate connector 130 is located on the second substrate connector 130. At the first region 130a of the second substrate connector 130, the second substrate connector 130 can be soldered to the second metal layer 113.

[0148] According to one embodiment, the second pressing portion 1320 can be located in the second region 120b of the first substrate terminal block 120 (see...). Figure 4 ) and the second region 130b of the second substrate terminal block 130 (see Figure 4 The area to be pressed is the area other than the non-pressed area 1330. The second pressing portion 1320 may include a circumferential pressing portion 1320a and a plurality of intermediate pressing portions 1320b.

[0149] According to one embodiment, the circumferential pressing portion 1320a may be continuously formed along the circumference of the outer peripheral surface of the disc-shaped welding head 1300' with a predetermined second width and at a predetermined distance from the first pressing portion 1310 in a direction orthogonal to the circumferential direction of the outer peripheral surface of the disc-shaped welding head 1300' (e.g., the Y-axis direction).

[0150] According to one embodiment, a plurality of intermediate pressing portions 1320b may be formed with a predetermined third width along the circumference of the outer peripheral surface of the disc-shaped welding head 1300' between the first pressing portion 1310 and the circumferential pressing portion 1320a. Each of the plurality of intermediate pressing portions 1320b may be formed with a predetermined length in the circumferential direction of the outer peripheral surface of the disc-shaped welding head 1300'. The plurality of intermediate pressing portions 1320b may be formed to be spaced apart by a predetermined constant interval W1 in the circumferential direction of the outer peripheral surface of the disc-shaped welding head 1300'.

[0151] According to one embodiment, the area spaced apart between a plurality of intermediate pressing portions 1320b on the outer peripheral surface of the disc-shaped welding head 1300' may include a non-pressing area 1330 in which the first substrate contact 120 and the second substrate contact 130 are not pressed.

[0152] For example, in the regions where the second region 120b of the first substrate terminal block 120 and the second region 130b of the second substrate terminal block 130 face each other, the first substrate terminal block 120 and the second substrate terminal block 130 can be partially pressed and soldered in the electrode plate conveying direction (e.g., the X-axis direction) by a circumferential pressing portion 1320a and a plurality of intermediate pressing portions 1320b. The portions of the first substrate terminal block 120 and the second substrate terminal block 130 corresponding to the non-pressed regions 1330 between the plurality of intermediate pressing portions 1320b may not be pressed and may not be soldered to each other.

[0153] According to one embodiment, the first pressing portion 1310 and the second pressing portion 1320 may each include a plurality of protrusions 1311 and 1321 protruding from the outer peripheral surface of the disc-shaped welding head 1300' at predetermined intervals. Since the plurality of protrusions 1311 and 1321 are related to a reference... Figure 6 and Figure 7 The multiple protrusions 1311 and 1321 described are essentially the same, so their detailed descriptions will be omitted below.

[0154] Figure 16 and Figure 17 The illustration shows the state before and after welding of the electrode plate and substrate tab performed by another example of the welding apparatus according to an embodiment of the present disclosure. Figure 18 Example by using Figure 17 The electrode plate shown is a single electrode manufactured by slitting and punching.

[0155] refer to Figure 3 , Figure 4 and Figure 16 According to the embodiment, the electrode plate 100a (wherein the first substrate terminal piece 120 is disposed on the uncoated portion 112a of the first metal layer 112 of the electrode substrate 110) Figure 2 The second substrate terminal block 130 is disposed on the uncoated portion 113a of the second metal layer 113 (see...). Figure 2 The electrode plate 100a, the first substrate contact plate 1200, and the welding head 1200 can be transported in one direction between the anvil 1100 and the welding head 1200. The welding head 1200 may include a disc-shaped welding head 1300' configured to press the electrode plate 100a, the first substrate contact plate 120, and the second substrate contact plate 130, and a body portion 1400 configured to provide rotational power to the disc-shaped welding head 1300'. Figure 16 Apart from the disc-shaped welding head 1300' shown in the diagram, the rest of the configuration is the same as the reference. Figure 8 The configuration described is basically the same except for the disc-shaped welding head 1300, so the following description focuses on the disc-shaped welding head 1300'.

[0156] According to one embodiment, the disc-shaped welding head 1300' may include a first pressing portion 1310 (see...). Figure 14 ), circumferential pressing part 1320a (see Figure 14 ), middle pressing part 1320b (see Figure 14 ) and non-pressing area 1330 (see Figure 14 (See reference) Figures 13 to 15 The first pressing portion 1310 can press the first region 120a of the first substrate connector 120. The circumferential pressing portion 1320a and the middle pressing portion 1320b can press a portion of the second region 120b of the first substrate connector 120, but the non-pressing region 1330 can leave the other portion of the second region 120b of the first substrate connector 120 unpressed.

[0157] refer to Figure 3 , Figure 4 and Figure 17 According to the embodiment, the first region 120a of the first substrate terminal block 120 can be soldered to the uncoated portion 112a of the first metal layer 112 (see...). Figure 2 The first region 130a of the second substrate terminal block 130 can be soldered to the uncoated portion 113a of the second metal layer 113 (see...). Figure 2 A portion of the area where the second region 120b of the first substrate terminal block 120 and the second region 130b of the second substrate terminal block 130 face each other may be soldered, while the remaining areas may not be soldered.

[0158] According to one embodiment, the first welding region 140a may be the region between the uncoated portion 112a of the first metal layer 112 and the first substrate tab 120, and between the uncoated portion 113a of the second metal layer 113 and the second substrate tab 130. The first welding region 140a may be the region continuously welded in a second direction (e.g., the X-axis direction) by the first pressing portion 1310 of the welding head 1300. The first welding depth (not shown) may correspond to the plurality of protrusions 1311 of the first pressing portion 1310 (see...). Figure 15 Correspondingly formed in the first welding area 140a.

[0159] According to one embodiment, the second welding region 150a may be a portion of the welded region within the areas where the second regions 120b of the first substrate connector 120 and the second regions 130b of the second substrate connector 130 face each other. The non-welded region 160a may be the remaining unwelded region within the areas where the second regions 120b of the first substrate connector 120 and the second regions 130b of the second substrate connector 130 face each other. The second welding region 150a may be the region welded by the intermediate pressing portion 1320b of the welding head 1300. The second welding depth (not shown) may be related to the plurality of protrusions 1321 of the intermediate pressing portion 1320b (see...). Figure 15 Correspondingly formed in the second welding area 150a. The non-welding area 160a may be the area in the second direction (e.g., the X-axis direction) between the second welding areas 150a where the first substrate terminal block 120 and the second substrate terminal block 130 are not welded.

[0160] According to one embodiment, the third welding region 170a may be a region being welded within the regions where the second regions 120b of the first substrate terminal block 120 and the second regions 130b of the second substrate terminal block 130 face each other. The third welding region 170a may be a region welded by the circumferential pressing portion 1320a of the welding head 1300 (when the welding head 1300 is disc-shaped). The third welding region 170a may be a region continuously welded in a second direction (e.g., the X-axis direction) by the circumferential pressing portion 1320a of the welding head 1300.

[0161] refer to Figure 18 , Figure 17 The electrode plate 100a shown can be slit along the slitting line SL and can be manufactured into multiple electrodes. The slit electrodes 100 can have an electrode substrate 110 stamped along the punching line NL (see...). Figure 10 ), First substrate connector 120 (see Figure 10 ) and the second substrate connector 130 (see Figure 10As part of the stamping process, electrode 100 may include a first welded portion 140, a second welded portion 150, a third welded portion 170, and a non-welded area 160.

[0162] According to one embodiment, the first welding portion 140 may be a region where the uncoated portion 112a of the first metal layer 112 is welded to the first substrate tab 120, and between the uncoated portion 113a of the second metal layer 113 and the second substrate tab 130. The second welding portion 150 may be a region extending from the first welding portion 140 in a first direction (e.g., the Y-axis direction) while simultaneously welding the first substrate tab 120 and the second substrate tab 130 to one and the other ends of the first substrate tab 120 and the second substrate tab 130 at a predetermined width in a second direction (e.g., the X-axis direction) intersecting the first direction. The third welding portion 170 may be a region where multiple second welding portions 150, respectively welded at one and the other ends of the first substrate tab 120 and the second substrate tab 130, are connected in a second direction (e.g., the X-axis direction). The non-welded area 160 may be the area surrounded by the first welded portion 140, the second welded portion 150 and the third welded portion 170, and may be the area where the first substrate connector 120 and the second substrate connector 130 are not welded.

[0163] According to one embodiment, the first welded portion 140, the second welded portion 150, the third welded portion 170, and the non-welded area 160 can be used as electrode contacts. The non-welded area 160 can be in which lead contacts 400 can be welded (see...). Figure 23 The region is as described below.

[0164] Figure 19 An example of a coating portion applied to a first weld portion according to an embodiment of the present disclosure is shown. Figure 20 It is along Figure 19 The cross-sectional view of line GG. Figure 21 Example by using Figure 19 An example of a single electrode manufactured by slitting and punching an electrode plate is shown.

[0165] refer to Figure 9 , Figure 19 and Figure 20 According to an embodiment of the present disclosure, the electrode plate 100a may further include a coating portion 190, which is formed by coating an insulating material in a first welding region 140a onto a first substrate terminal block 120 and a second substrate terminal block 130. The coating portion 190 may be formed in a first region 120a of the first substrate terminal block 120 (see...). Figure 4 The first region 130a of the second substrate terminal block 130 (see) Figure 4 The coated portion 190 can be made by filling the uncoated portion 112a of the first metal layer 112 with insulating material (see...). Figure 2 The region between the first substrate terminal block 120 and the electrode mixture layer 114 and the uncoated portion 113a of the second metal layer 113 (see) Figure 2 It is formed in the region between the second substrate terminal piece 130 and the electrode mixture layer 114.

[0166] refer to Figure 12 and Figure 21 , Figure 19 The electrode plate 100a shown can be slit along the slit line SL and can be manufactured into multiple electrodes. The slit electrodes 100 can have an electrode substrate 110 stamped along the punching line NL (see...). Figure 20 ), First substrate connector 120 (see Figure 20 ) and the second substrate connector 130 (see Figure 20 Part of the electrode 100. After stamping, the electrode 100 may include a first weld portion 140 (see...). Figure 12 ), second welded portion 150, non-welded area 160 and coated portion 190.

[0167] Figure 22 Examples of stacked structures in which a first electrode, a diaphragm, and a second electrode are stacked according to embodiments of the present disclosure are illustrated. Figure 23 An example of an electrode assembly according to an embodiment of the present disclosure is shown, wherein lead terminals are connected to substrate terminals. Figure 24 It is along Figure 23 The cross-sectional view taken from line HH. Figure 25 It is along Figure 23 The cross-sectional view taken from line II.

[0168] refer to Figures 22 to 25 According to embodiments of the present disclosure, the electrode assembly 10 may include a first electrode 100, a second electrode 200, and a diaphragm 300 disposed between the first electrode 100 and the second electrode 200.

[0169] like Figure 22 As shown, according to one embodiment, the electrode assembly 10 may include a first electrode 100, a second electrode 200, and a separator 300, each stacked in a predetermined number according to the battery design capacity. For example, the electrode assembly 10 may be stacked, wherein the first electrode 100, the second electrode 200, and the separator 300 disposed between the first electrode 100 and the second electrode 200 are formed as a thin plate or film and are stacked. As another example, the electrode assembly 10 may be Z-stacked, wherein the first electrode 100 and the second electrode 200 are inserted into both sides of the separator 300 folded in a Z-stack configuration.

[0170] According to one embodiment, the first electrode 100 can be an electrode corresponding to either the positive or negative electrode in a secondary battery. The second electrode 200 can be an electrode with a polarity opposite to that of the first electrode 100. For example, when the first electrode 100 is a positive electrode, the second electrode 200 can be a negative electrode. Conversely, when the first electrode 100 is a negative electrode, the second electrode 200 can be a positive electrode.

[0171] Figures 22 to 25 The first electrode 100 and the second electrode 200 shown can be with Figure 12 , Figure 18 and Figure 21 The electrode 100 shown is essentially the same as the electrode. Since it has been referenced... Figures 1 to 21 Detailed description Figure 12 , Figure 18 and Figure 21 The detailed configuration and manufacturing method of electrode 100 shown are omitted below, therefore a detailed description of the specific configuration of the first electrode 100 and the second electrode 200 will be omitted below.

[0172] According to one embodiment, when the first electrode 100 is a positive electrode and the second electrode 200 is a negative electrode, the area of ​​the second electrode 200 can be larger than the area of ​​the first electrode 100. Because the area of ​​the second electrode 200 is larger than the area of ​​the first electrode 100, problems such as a short circuit between the first electrode 100 and the second electrode 200 may occur. For example, in the process of bending the first substrate tab 120 and the second substrate tab 130 extending from one side of the first electrode 100, the first substrate tab 120 and the second substrate tab 130 may short-circuit with the facing second electrode 200. To prevent this, a coating portion 190 can be applied to or otherwise disposed on the first substrate tab 120 and the second substrate tab 130.

[0173] like Figure 23 As shown, according to one embodiment, the lead connector 400 may be disposed in a plurality of second solder portions 150 (see Figure 1). Figure 21 The non-welded area 160 between (see) Figure 21 The lead terminal 400 can be connected to the first substrate terminal 120 and the second substrate terminal 130. The lead terminal 400 can be used as a current path to the external terminals of the first electrode 100 and the second electrode 200, respectively.

[0174] According to one embodiment, a terminal sheet film 410 may be provided on the lead terminal sheet 400. The terminal sheet film 410 may surround both surfaces of the lead terminal sheet 400, or may be attached to each of the two surfaces of the lead terminal sheet 400 respectively. The terminal sheet film 410 may be housed in the casing 20 of the secondary battery 1 within the electrode assembly 10 (see...). Figure 26When the lead wire connector 400 is in contact with the housing 20 (see...), it is important to prevent the lead wire connector 400 from contacting the housing 20 (see...). Figure 26 Short circuit between ).

[0175] According to one embodiment, the spacing W2 in the second direction between the second weld portion 150 welded at one end and the second weld portion 150 welded at the other end can be based on the width W3 of the lead connector 400 in the second direction (e.g., the X-axis direction) (see...). Figure 23 The spacing W2 between the second solder portions 150 in the second direction can be set based on the width W3 of the lead connector 400 in the second direction, and the solder head 1300 (see...) can also be set. Figure 6 The second pressing part 1320 (see) Figure 6 The width W1 between ) in the second direction (see Figure 6 ).

[0176] According to one embodiment, it is provided in the non-welding area 160 (see...) Figure 12 The lead terminal 400 on the substrate can be soldered to the first substrate terminal 120 and the second substrate terminal 130 at the non-soldering area 160. The first substrate terminal 120, the second substrate terminal 130, and the lead terminal 400 can be soldered together to form a third solder depth (also referred to as the third solder portion) WD3 (see...). Figure 23 For example, in the first welded portion 140 (see...) Figure 12 ) and the second welded part 150 (see Figure 12 In the first substrate connector 120 and the second substrate connector 130 soldered together, their surfaces may be damaged by friction during the soldering process, resulting in uneven surfaces. In contrast, the surfaces of the first substrate connector 120 and the second substrate connector 130 that are not soldered in the non-soldering area 160 can be flat. By soldering the portions of the first substrate connector 120 and the second substrate connector 130 with flat surfaces in the non-soldering area 160 to the lead connector 400, the soldering strength can be improved.

[0177] According to one embodiment, one end of the lead connector 400 (e.g., the end in the direction opposite to the Y-axis direction) can be connected to the first solder portion 140 (see...). Figure 12 The lead-in tab 400 is arranged adjacent to each other. A portion of each of the two side edges (e.g., the left and right edges in the X-axis direction) of the lead-in tab 400 may be soldered to the second solder portion 150 (see...). Figure 12They are arranged adjacent to each other. Even if the width of the area where the first substrate connector 120 and the second substrate connector 130 are welded in the first welding portion 140 in the first direction (Y-axis direction) is narrow, the welding area of ​​the first substrate connector 120 and the second substrate connector 130 in the second welding portion 150 can be sufficiently ensured, thereby ensuring high welding strength. Since the width of the area where the first substrate connector 120 and the second substrate connector 130 are welded in the first welding portion 140 in the first direction (Y-axis direction) is narrowed, the area where the lead connector 400 can be welded (e.g., the non-welded area 160) can be sufficiently ensured.

[0178] In one embodiment, such as Figure 24 As shown, the first substrate terminal block 120 may include a plurality of first substrate terminal blocks 120, and the second substrate terminal block 130 may include a plurality of second substrate terminal blocks 130. Furthermore, the plurality of first substrate terminal blocks 120 and the plurality of second substrate terminal blocks 130 may be stacked in a direction intersecting the first and second directions (e.g., they may be stacked in the Z-axis direction). The plurality of first substrate terminal blocks 120 and the plurality of second substrate terminal blocks 130 stacked in a direction intersecting the first and second directions may not be soldered to each other in the non-soldering region 160. For example, the second region 120b of the first substrate terminal block 120 and the second region 130b of the second substrate terminal block 130 may not be soldered together in the non-soldering region 160. The lead terminal block 400 may be in surface contact with any one of the first substrate terminal blocks 120 and the second substrate terminal block 130 in the non-soldering region 160. A plurality of first substrate terminals 120 and a plurality of second substrate terminals 130, and lead terminals 400, which are stacked in a direction intersecting the first and second directions and are not soldered together in the non-soldering region 160, may be soldered together in the stacking direction (e.g., the Z-axis direction). A third soldering depth WD3 may be formed in the region where the plurality of first substrate terminals 120 and the plurality of second substrate terminals 130 overlap with the lead terminals 400.

[0179] like Figure 25As shown, according to one embodiment, the second region 120b of the first substrate connector 120 and the second region 130b of the second substrate connector 130 can be welded together in the second welding portion 150. A second welding depth WD2 can be formed in the second welding portion 150 within the second region 120b of the first substrate connector 120 and the second region 130b of the second substrate connector 130. Even if the welding width in the first direction (Y-axis direction) is narrow in the first welding portion 140 between the first region 120a of the first substrate connector 120 and the first region 130a of the second substrate connector 130, the welding area of ​​the second region 120b of the first substrate connector 120 and the second region 130b of the second substrate connector 130 in the second welding portion 150 can be sufficiently ensured. Therefore, welding strength can be improved in the area where the first substrate connector 120 and the second substrate connector 130 overlap.

[0180] Figure 26 An example of a secondary battery including an electrode assembly according to an embodiment of the present disclosure is shown.

[0181] although Figure 26 The secondary battery 1 shown is primarily described with reference to a pouch-type battery, but the embodiment is not limited thereto and can also be applied to other types of batteries (such as prismatic batteries). However, for ease of explanation, the following description will focus on pouch-type batteries.

[0182] refer to Figure 26 According to embodiments of the present disclosure, the secondary battery 1 may include an electrode assembly 10 and a housing 20 that accommodates at least a portion of the electrode assembly 10. Although in Figure 26 Not shown, but the secondary battery 1 may further include an electrolyte contained in the housing 20 and permeating at least a portion of the electrode assembly 10.

[0183] According to one embodiment, the electrode assembly 10 may include a first electrode 100, a second electrode 200, and a diaphragm 300. Figure 26 The electrode assembly 10 shown has the same characteristics as the reference. Figures 22 to 25 The electrode assembly 100 described is essentially the same configuration, so its detailed description will be omitted below.

[0184] According to one embodiment, the housing 20 can form the appearance of the secondary battery 1. The housing 20 can have, for example, the appearance of... Figure 26 The cuboid shape shown is not limited to this; however, embodiments are not limited to this, and other shapes are also within the scope of this disclosure.

[0185] According to one embodiment, the housing 20 may include a receiving portion 21 and a sealing portion 22.

[0186] According to one embodiment, the receiving portion 21 may have an internal space larger than the size of the electrode assembly 10, and may accommodate the electrode assembly 10 and the electrolyte. With the electrode assembly 10 contained in the receiving portion 21, the cover of the housing 20 may be closed to seal the electrode assembly 10.

[0187] According to one embodiment, the sealing portion 22 may be provided along the edge of the housing 20. With the electrode assembly 10 housed, the sealing portions 22 provided along the edge of the housing 20 may come into contact with each other and be sealed. At this time, a portion of the lead tab 400 may be exposed outside the housing 20, and the tab film 410 may be located between the upper and lower portions of the housing 20 corresponding to the sealing portion 22.

[0188] According to one embodiment, the sealing portion 22 may be made of a heat-sealable material and may have a structure in which heat-melt layers adhere to each other for sealing. For example, since heat-sealable materials typically have weak adhesion to metals, the lead patch film 410 may be attached to the lead patch 400 in thin film form and may be fused to the housing 20. According to one embodiment, the lead patch 400 may be connected to the substrate patches 120, 130, 220, and 230.

[0189] Although the present disclosure has been described above with reference to embodiments thereof, the present disclosure is not limited thereto. Various modifications and variations can be made to it within the spirit of the present disclosure by those skilled in the art.

Claims

1. A welding apparatus, comprising: Anvil; as well as A welding head is configured to apply ultrasonic waves while pressing an electrode plate, a first substrate terminal block, and a second substrate terminal block onto the anvil to weld the electrode plate, the first substrate terminal block, and the second substrate terminal block together. The welding head includes: Disc-shaped welding head; and The main body is connected to the central axis of the disc-shaped welding head, wherein the disc-shaped welding head is rotatable about the central axis. The disc-shaped welding head includes: A first pressing portion is configured to press a first region where the electrode plate and the first substrate terminal block overlap between each other between the anvil and the welding head, and to press a second region where the electrode plate and the second substrate terminal block overlap between the anvil and the welding head; and The second pressing portion is configured to press a portion of a third region between the anvil and the welding head, where the first substrate terminal block and the second substrate terminal block overlap each other and are different from the first region and the second region.

2. The welding apparatus according to claim 1, wherein the electrode plate comprises: Insulating layer; A first metal layer is disposed on a first surface of the insulating layer, the first metal layer including an uncoated portion of the first metal layer; as well as A second metal layer is disposed on a second surface of the insulating layer, the second metal layer including an uncoated portion thereof, wherein: The first region is the region where the uncoated portion of the first metal layer overlaps with the first substrate terminal block, and the second region is the region where the uncoated portion of the second metal layer overlaps with the second substrate terminal block.

3. The welding apparatus according to claim 1, wherein: The first pressing portion is continuously formed along the circumference of the outer peripheral surface of the disc-shaped welding head to press the electrode plate, the first substrate contact plate, and the second substrate contact plate between the anvil and the welding head. The first pressing portion has a predetermined width. The second pressing portion includes a plurality of second pressing portions extending in pairs from the first pressing portion in a direction orthogonal to the circumferential direction of the outer peripheral surface.

4. The welding apparatus according to claim 3, wherein each pair of the plurality of second pressing portions is spaced apart from each other by a predetermined distance along the circumference of the outer peripheral surface.

5. The welding apparatus according to claim 4, wherein a non-pressing area is formed between the plurality of second pressing portions, and while the electrode plate, the first substrate terminal block and the second substrate terminal block are pressed between the anvil and the welding head, the portions of the first substrate terminal block and the second substrate terminal block corresponding to the non-pressing area are not pressed.

6. The welding apparatus according to claim 1, wherein the first pressing portion is continuously formed along the circumference of the outer peripheral surface of the disc-shaped welding head to press the electrode plate, the first substrate terminal piece, and the second substrate terminal piece between the anvil and the welding head, the first pressing portion having a predetermined first width, and The second pressing part includes: A circumferential pressing portion is continuously formed along the circumference of the outer peripheral surface to press the first substrate contact and the second substrate contact between the anvil and the welding head. The circumferential pressing portion has a predetermined second width and is located at a predetermined distance from the first pressing portion in a direction orthogonal to the circumferential direction of the outer peripheral surface. as well as Multiple intermediate pressing portions are formed along the circumference of the outer peripheral surface. The plurality of intermediate pressing portions have a predetermined third width between the first pressing portion and the circumferential pressing portion. Each of the plurality of intermediate pressing portions is formed with a predetermined length in the circumferential direction on the outer peripheral surface, and The plurality of intermediate pressing portions are arranged at a preset constant interval in the circumferential direction on the outer peripheral surface.

7. The welding apparatus according to claim 6, wherein the fourth region corresponding to the preset constant interval includes a non-pressing region, wherein when the electrode plate, the first substrate connector and the second substrate connector are pressed between the anvil and the welding head, the portions of the first substrate connector and the second substrate connector corresponding to the non-pressing region are not pressed.

8. The welding apparatus according to any one of claims 1 to 7, wherein: The first pressing portion includes a plurality of first pressing portion protrusions that project from the outer peripheral surface of the disc-shaped welding head at predetermined intervals; and The second pressing portion includes a plurality of second pressing portion protrusions that protrude from the outer peripheral surface of the disc-shaped welding head at predetermined intervals.

9. The welding apparatus according to claim 8, wherein the second length of each of the plurality of second pressing portion protrusions is greater than the first length of each of the plurality of first pressing portion protrusions.

10. The welding apparatus of claim 1, wherein the second pressing portion comprises one or more second pressing portions, and the number of the one or more second pressing portions is predetermined based on at least one of the circumference of the disc-shaped welding head and the length of the electrode plate.

11. An electrode assembly, comprising: First electrode; Second electrode; as well as A diaphragm is disposed between the first electrode and the second electrode. At least one of the first electrode and the second electrode includes: Electrode substrate, including: Insulating layer; A first metal layer is disposed on a first surface of the insulating layer, the first metal layer including an uncoated portion of the first metal layer to which no active material is provided; and A second metal layer is disposed on the second surface of the insulating layer, the second metal layer including an uncoated portion of the second metal layer to which no active material is provided; The first electrode mixture layer is formed by coating the active material onto a region of the first metal layer; and The second electrode mixture layer is formed by coating the active material onto a region of the second metal layer; A first substrate terminal extends in a first direction from a first point on the uncoated portion of the first metal layer; and The second substrate terminal extends from a second point on the uncoated portion of the second metal layer in the first direction, and the second substrate terminal faces the first substrate terminal. Only a portion of the overlapping area between the first substrate terminal block and the second substrate terminal block is soldered.

12. The electrode assembly according to claim 11, wherein: The first region of the first substrate terminal block is connected to the uncoated portion of the first metal layer; The first region of the second substrate terminal block is connected to the uncoated portion of the second metal layer; and The second region of the first substrate terminal block and the second region of the second substrate terminal block are connected to each other, so that the first metal layer and the second metal layer are electrically connected.

13. The electrode assembly according to claim 12, wherein: The first point is separated from the first electrode mixture layer on the first metal layer by a predetermined distance; and The second point is separated from the second electrode mixture layer on the second metal layer by the predetermined distance.

14. The electrode assembly of claim 11, wherein at least one of the first electrode and the second electrode further comprises: The first welding portion includes the welding area in the following region: The first region where the uncoated portion of the first metal layer overlaps with the first substrate terminal block; as well as The second region where the uncoated portion of the second metal layer overlaps with the second substrate terminal block; as well as A second weld portion extends from the first weld portion in the first direction, wherein the second weld portion includes a weld portion in the following region: The third region, which overlaps with the first substrate terminal block and is different from the first region and the second region, has a predetermined width at one end and the other end of the first substrate terminal block and the second substrate terminal block in a second direction intersecting the first direction.

15. The electrode assembly of claim 14, wherein the first weld portion is continuously welded in the first region and the second region.

16. The electrode assembly of claim 15, wherein the unsoldered areas of the first substrate terminal block and the second substrate terminal block are formed at a predetermined interval, the unsoldered areas being located between the second welded portion welded at one end of the first substrate terminal block and the second substrate terminal block in the second direction and the second welded portion welded at the other end of the first substrate terminal block and the second substrate terminal block in the second direction.

17. The electrode assembly of claim 16, wherein: The first substrate connector includes a plurality of first substrate connectors; The second substrate connector includes a plurality of second substrate connectors; The plurality of first substrate terminals and the plurality of second substrate terminals are stacked in a direction intersecting the first direction and the second direction; Lead terminals are disposed on the non-soldering areas of the plurality of first substrate terminals and the plurality of second substrate terminals stacked in the directions intersecting the first and second directions; and The non-welded area and the lead terminal piece are welded together.

18. The electrode assembly of claim 17, wherein the spacing in the second direction between the second weld portion welded at one end of the first substrate tab and the second substrate tab and the second weld portion welded at the other end of the first substrate tab and the second substrate tab is set based on the width of the lead tab in the second direction.

19. The electrode assembly of claim 14, wherein at least one of the first electrode and the second electrode further comprises a third welding portion, the third welding portion being connected in the second direction to a plurality of second welding portions respectively welded at one end of the first substrate terminal block, the other end of the first substrate terminal block, one end of the second substrate terminal block, and the other end of the second substrate terminal block.

20. The electrode assembly according to any one of claims 14 to 19, wherein at least one of the first electrode and the second electrode further comprises a coating portion formed by coating an insulating material in the first solder portion onto the first substrate tab and the second substrate tab.

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