Memory stick automatic plug-in and plug-out clamping mechanism and using method

Abstract

The application discloses a memory bar automatic plugging and clamping mechanism and a use method, which comprises a bottom plate for connecting a mechanical hand, a guide assembly and a clamping jaw assembly are arranged on the bottom plate, the guide assembly comprises a memory bar guide piece and a pressing plate, a guide clamping groove is formed on the guide piece, and a pressing surface is formed at the end of the guide piece, so that the guide limiting and vertical pressing of the memory bar plugging process are realized; the clamping jaw assembly is clamped through the cooperation of the supporting protrusions on the clamping jaw end clamping blocks and the side edge clamping grooves of the memory bar, and can be positioned with the aid of the guide piece shape; the plugging and clamping mechanism cooperates with a pressure sensor and the mechanical hand to realize the whole plugging action force monitoring, realizes the automatic and high-precision plugging operation of the memory bar, effectively reduces the damage to the memory bar and the slot in the plugging process, and has the advantages of compact structure, stable and reliable operation.

Description

Technical Field

[0001] This invention relates to the field of memory module insertion and removal equipment technology, specifically to an automatic memory module insertion and removal clamping mechanism and its usage method. Background Technology

[0002] Currently, most memory module insertion and removal mechanisms are divided into two independent structures: one for inserting memory modules and the other for removing them. This increases the complexity of the equipment. Furthermore, the switching between different insertion and removal mechanisms can lead to positioning errors, which can affect the accuracy of memory module insertion and removal operations. In addition, most existing insertion and removal processes rely on the friction generated by strong clamping to perform the insertion and removal actions, which can easily damage the memory modules. Summary of the Invention

[0003] Technical objective: To address the shortcomings of existing memory module insertion and removal devices, this invention discloses an automatic memory module insertion and removal clamping mechanism and its usage method.

[0004] Technical solution: To achieve the above technical objectives, the present invention adopts the following technical solution: An automatic memory module insertion and removal clamping mechanism includes a base plate for connection with a robotic arm, a guide component for guiding and limiting the insertion and removal process of the memory module, and a gripper assembly for clamping and transferring the memory module. The guide component has a guide slot and a pressing surface for pressing and inserting the memory module at the end of the guide slot. The gripper assembly has grippers for engaging with the side of the memory module along its length. Before the memory module is pressed and inserted and after it is popped out, the memory module is clamped and moved by the grippers.

[0005] Preferably, the gripper end of the present invention has a gripping block on the surface that mates with the memory module. The gripping block has a guide groove that mates with the memory module, and a supporting protrusion is provided at the lower part of the guide groove. The memory module is gripped by the supporting protrusion cooperating with the slot on the side of the memory module, and the memory module is moved by the movement of the robot arm.

[0006] Preferably, the guiding component of the present invention includes memory module guides located at both ends of the memory module along the length direction of the memory module and a pressure plate disposed between the memory module guides. A guide slot is formed on the memory module guide, and the plate surface of the pressure plate is flush with the pressing surface at the end of the guide slot. When the memory module is pressed in, the memory module is pressed in by the pressure plate and the pressing surface of the memory module guide together.

[0007] Preferably, the memory strip guides of the present invention are all fixedly connected to the base plate through connecting plates, the two connecting plates are symmetrically arranged, and the two ends of the pressure plate are fixedly connected to the bottom ends of the two connecting plates respectively; the two connecting plates, the base plate and the pressure plate together form the installation space of the gripper assembly.

[0008] Preferably, the gripper assembly of the present invention includes a gripper cylinder and a gripper. The gripper cylinder is fixed on the base plate, and the gripper and the driving end of the gripper cylinder are connected by a connector. The gripper is located outside the memory module guide. The profile formed at the junction of the gripper block and the gripper matches the shape of the memory module guide. The memory module guide assists the gripper assembly in gripping the memory module.

[0009] Preferably, the connector of the present invention is a hollow shell structure. The lower end of the connecting plate passes through the corresponding connector and is connected to the pressure plate and the memory module guide. A gap is formed between the hollow part of the connector and the plate surface of the connecting plate for the gripper cylinder to drive the gripper to move.

[0010] Preferably, the base plate of the present invention is further provided on the outside of the guide component for opening the latch of the memory module slot, so that the memory module can be ejected from the memory module slot when it is pulled out; the latch opening component includes a latch opening cylinder and a latch opening block, the latch opening block is fixed to the drive end of the latch opening cylinder, and the latch opening cylinder drives the latch opening block to move towards the latch, pressing down the latch to eject the memory module from the memory module slot.

[0011] Preferably, a force control sensor for detecting the insertion and removal force of memory modules is provided between the base plate and the robot arm in this invention.

[0012] This invention discloses a method of using the above-mentioned automatic memory module insertion and removal clamping mechanism. The method is characterized in that the base plate is moved by the robot arm to clamp the memory module and move it to the memory module slot. The memory module is gradually placed into the pre-guided part of the memory module slot. Then, the robot arm applies downward pressure and the memory module is vertically pressed into the memory module slot through the pressing surface and the pressure plate to complete the fixation. When removing the memory module, a robotic arm drives the gripping mechanism to move the memory module to be removed, positioning the upper part of the memory module within the guide slot. Then, the latch of the memory module slot is opened, and the memory module is ejected from the slot. During ejection, the memory module is limited by the guide slot, and the grippers in the clamping assembly hold the memory module along its length. The robotic arm then moves the base plate upward, pulling the memory module out of the slot. After removal, the grippers remain in the clamping state, and the robotic arm, along with the base plate, transports the memory module to the target location.

[0013] Preferably, when the present invention grips the memory module using the gripper assembly, it positions the memory module by the relative position between the memory module guide and the gripper.

[0014] Beneficial effects: The automatic memory module insertion / removal clamping mechanism and its usage method disclosed in this invention have the following beneficial effects: 1. This invention utilizes memory module guides at both ends of the memory module and guide slots on them to guide and limit the memory module throughout the insertion and removal process. During insertion, the guide slots ensure the memory module enters the slot vertically, preventing bending of the gold fingers or damage to the slot due to tilting. During removal, as the latch ejects the memory module, the guide slots limit its ejection path, preventing displacement or tipping and ensuring accurate gripping by the clamps. This guiding and limiting mechanism effectively solves the technical problem of damage to precision electronic components due to inaccurate positioning during automatic memory module insertion and removal.

[0015] 2. This invention features a clamping block with a supporting protrusion at the end of the gripper. Reliable clamping is achieved through the engagement of the supporting protrusion with the side slot of the memory module, rather than relying solely on friction, significantly improving clamping stability. Furthermore, the profile formed at the junction of the clamping block and the gripper matches the shape of the memory module guide. During clamping, the memory module guide can assist in positioning, ensuring precise alignment between the supporting protrusion and the slot, further enhancing clamping reliability.

[0016] 3. This invention utilizes the combined action of the pressing surface and the pressure plate to create a continuous pressing force surface along the length of the memory module, ensuring that the downward pressure is evenly distributed to the top of the memory module and preventing deformation or damage caused by single-point force application. Simultaneously, the two connecting plates, the base plate, and the pressure plate together form a frame structure, guaranteeing the relative positional accuracy and overall rigidity of each component during the pressing process, ensuring that the downward pressure is transmitted vertically and smoothly to the memory module.

[0017] 4. This invention integrates a latching component. A latching cylinder drives a latching block to press down the latch, automatically ejecting the memory module from the slot. The module is then gripped by claws and pulled out by a robotic arm. The entire removal process requires no manual intervention, achieving a high degree of automation. The timing of the latching and gripping actions is well-coordinated: first, a guide slot limits the memory module's position; then, the claws grip it; and finally, the latch opens, ejecting the memory module. Each step is interconnected, ensuring the safety and reliability of the removal process.

[0018] 5. This invention, by placing a force control sensor between the base plate and the robotic arm, can detect the force applied during the insertion and removal of memory modules in real time, and feed the force signal back to the control system for closed-loop adjustment. This design effectively prevents damage to memory modules or slots due to excessive insertion and removal force. It can also be used to determine whether the memory module is installed correctly, whether there are foreign objects blocking the slot, and other abnormalities, thus achieving intelligent and quality-controllable insertion and removal processes.

[0019] 6. Compact structure and high space utilization. The gripper assembly of this invention is installed in a frame space enclosed by a connecting plate, a base plate, and a pressure plate. The structure is compact and reasonable, with minimal interference between components and a small overall size, making it convenient for automatic insertion and removal of memory modules in confined spaces. It is especially suitable for scenarios with limited internal space, such as server chassis. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0021] Figure 1 This is a three-dimensional view of the mechanism of the present invention; Figure 2 This is a structural diagram of the guiding component of the present invention; Figure 3 This is a structural diagram of the gripper assembly of the present invention; Figure 4 This is a schematic diagram of the memory stick being popped up by the latch of the present invention; Figure 5 This is a schematic diagram showing the cooperation between the mechanism of the present invention and the robotic arm; Among them, 1-base plate, 2-memory module, 3-guide slot, 4-pressing surface, 5-clamping claw, 6-clamping block, 7-guide groove, 8-supporting protrusion, 9-slot, 10-memory module guide, 11-pressure plate, 12-connecting plate, 13-clamping claw cylinder, 14-connecting component, 15-memory module slot, 16-buckle, 17-buckle opening cylinder, 18-buckle opening pressure block, 19-force control sensor. Detailed Implementation

[0022] Reference will now be made in detail to embodiments of the present disclosure, one or more of which are set forth herein. Each embodiment and example is provided by way of explanation of the apparatus, composition, and materials of the present disclosure, and not by way of limitation. Rather, the following description provides convenient illustrations for implementing exemplary embodiments of the present disclosure. Indeed, it will be apparent to those skilled in the art that various modifications and variations can be made to the teachings of the present disclosure without departing from the scope or spirit of the present disclosure.

[0023] like Figures 1 to 5 As shown, the present invention provides an automatic memory module insertion and removal clamping mechanism, including a base plate 1, a guide assembly, a gripper assembly, and a latching assembly. The base plate 1 has a rectangular plate structure, and a flange or quick-connect coupling is fixedly installed at the center of its upper surface for detachable connection with the end effector of a six-axis industrial robot.

[0024] like Figure 2As shown, the guiding assembly includes two memory module guides 10 respectively disposed at both ends of the memory module 2 along its length, two connecting plates 12, and a pressure plate 11 disposed between the two memory module guides 10. The memory module guides 10 are L-shaped blocks. Each memory module guide 10 has a guide groove 3 longitudinally formed along the orientation shown in the figure. The groove width is adapted to the thickness of the memory module 2, and the two are fitted with a clearance. The clearance on one side is preferably 0.1mm to 0.3mm. The bottom end face of the guide groove 3 forms a pressing surface 4 that abuts against the upper end face of the memory module. The pressing surface 4 is a horizontal plane, used to apply a vertical downward pressing force to the top of the memory module when the memory module 2 is inserted into place.

[0025] The connecting plate 12 has a vertical plate-like structure. Two connecting plates 12 are symmetrically arranged at both ends of the base plate 1 along its length. The upper end of each connecting plate 12 is fixedly connected to the base plate 1 by bolts, and the lower end extends downwards. Two memory module guides 10 are respectively fixedly connected to the bottom ends of the two connecting plates 12 by bolts. The pressure plate 11 is a long strip-like structure with its length extending along the length of the memory module 2. The two ends of the pressure plate 11 are respectively fixedly connected to the bottom ends of the two connecting plates 12 by bolts, and the surface of the pressure plate 11 is flush with the pressing surface 4 on the memory module guide 10. After assembly, the two connecting plates 12, the base plate 1, and the pressure plate 11 together form a rectangular frame structure, and the interior of this frame forms the installation space for the gripper assembly.

[0026] like Figure 3 As shown, the gripper assembly includes a gripper cylinder 13, grippers 5, and a connector 14. The gripper cylinder 13 is a parallel-opening and closing pneumatic gripper, fixedly mounted on the lower surface of the base plate 1 by bolts, located between two connecting plates 12. The gripper cylinder 13 has two relatively movable drive ends. The grippers 5 are arranged in pairs, respectively located on the outside of the two memory module guides 10. Each gripper 5 is fixedly connected to the corresponding drive end of the gripper cylinder 13 through the connector 14. The connector 14 preferably adopts a hollow shell structure, and the lower end of the connecting plate 12 passes through the corresponding connector 14 and connects to the pressure plate 11 and the memory module guide 10. A gap is formed between the hollow part of the connector 14 and the surface of the connecting plate 12 for the gripper cylinder 13 to drive the gripper 5 to move, ensuring that the gripper 5 will not interfere with the connecting plate 12 during clamping and releasing actions, and ensuring that the gripper and the guide slot 3 of the memory module guide are on the same vertical plane, which facilitates the gripping of the memory module.

[0027] At the end of the gripper 5, i.e., the surface that mates with the side of the memory module 2, a clamping block 6 is fixedly provided. The clamping block 6 and the gripper 5 are integrally formed or fixed by screws. The clamping block 6 has a guide groove 7 that matches the contour of the side of the memory module 2, and a supporting protrusion 8 is provided at the lower part of the guide groove 7. The shape of the supporting protrusion 8 matches the slot 9 on the side of the memory module 2. By embedding the supporting protrusion 8 into the slot 9 on the side of the memory module 2, reliable clamping of the memory module is achieved. The profile formed at the junction of the clamping block 6 and the gripper 5 matches the shape of the memory module guide 10, so that the gripper 5 can be assisted in positioning by the shape of the memory module guide 10 during the clamping process, thereby improving the clamping accuracy.

[0028] The latching assembly is mounted on the base plate 1 and located outside the guide assembly, including a latching cylinder 17 and a latching pressure block 18. The latching cylinder 17 is a miniature double-acting cylinder, fixedly mounted on the base plate 1 via a cylinder mounting base, with its drive end vertically downwards. The latching pressure block 18 is fixedly connected to the drive end of the latching cylinder 17, with its lower end face being a horizontal pressure surface. The latching cylinder 17 drives the latching pressure block 18 to move vertically towards the latches 16 on both sides of the memory slot 15, pressing down the latches 16 to release the lock on the memory module 2, causing the memory module 2 to pop upwards from the memory slot 15 under the elastic force of the latches 16. Figure 4 The latch 16 is engaged with the memory module slot via a rotating shaft, with its bottom end located below the memory module pressing position. When the latch pressing block 18 moves down, it drives the latch block 16 to rotate clockwise, thereby popping the memory module 2 out of the memory module slot 15.

[0029] A force control sensor is also installed between the base plate 1 and the robotic arm. This force control sensor is a six-dimensional force sensor, with its fixed end connected to the end effector of the robotic arm and its detection end connected to the base plate 1. The force control sensor can detect the force applied during the insertion and removal of memory modules in real time and feed the force signal back to the robotic arm control system, realizing closed-loop control of the insertion and removal force and preventing damage to the memory modules or slots due to excessive insertion and removal force. For situations where multiple sets of memory modules need to be inserted and removed simultaneously, several sets of clamping structures can be arranged side by side on the same base plate 1 according to the spacing requirements of the memory modules to facilitate simultaneous insertion and removal, thereby improving work efficiency.

[0030] The method of using the automatic memory module insertion and removal clamping mechanism described in this invention is as follows: During the memory module insertion process, the robotic arm first moves the entire gripping mechanism to the memory module feeding position. The upper part of the memory module 2 enters the memory module guide along the guide slot 3. After moving into position, the gripper cylinder 13 drives the two grippers 5 to move towards each other. The supporting protrusion 8 on the gripper block 6 embeds into the slot 9 on the side of the memory module 2, clamping and fixing the memory module 2. For position detection, a detection sensor, such as a distance sensor, can be configured; or the robotic arm's movement coordinates can be preset according to the specifications of the memory module to be clamped to control the height position during clamping. Subsequently, the robotic arm moves the gripping mechanism and the memory module to directly above the memory module slot 15.

[0031] During the insertion of the memory module, existing memory slots 15 all have a pre-guide section for inserting the memory module and an interface section with significant pressing resistance. During the pressing process, the robotic arm slowly descends, and the memory module 2 gradually enters the pre-guide section. At this point, the lower gold fingers of the memory module 2 begin to contact the interface section of the slot 15, and the upper surface of the memory module 2 contacts the pressure plate 11 and the pressing surface 4. The grippers are released, and then the robotic arm applies a vertically downward pressing force. This downward force is transmitted through the pressing surface 4 at the bottom of the memory module guide 10 and the pressure plate 11 to the top of the memory module 2, vertically pressing the memory module 2 into the memory slot 15 until it is completely fixed. Throughout the pressing process, the memory module 2 maintains a vertical posture under the limiting effect of the guide slot 3, without tilting or shifting.

[0032] During the memory module removal process, a robotic arm first moves the gripping mechanism to the location of the memory module 2 to be removed. The robotic arm's precise positioning ensures the upper part of the memory module 2 is positioned within the guide slots 3 of the two memory module guides 10. At this point, the memory module 2 is limited in thickness by the guide slots 3, while leaving space above for upward movement as it ejects. Then, the latching cylinder 17 is activated, moving the latching pressure block 18 towards the latch 16. Pressing down the latch 16 causes the memory module 2 to eject upwards from the memory module slot 15, and the memory module guides 10 further limit its movement for subsequent clamping.

[0033] Next, the gripper cylinder 13 drives the grippers 5 to move towards each other. The relative position between the memory module 2 and the grippers is determined by the memory module guide 10. The supporting protrusion 8 on the clamping block 6 engages with the slot 9 on the side of the memory module 2, clamping and fixing it in place. The robotic arm moves the base plate 1 upwards, while the grippers 5 maintain their gripping state on the memory module 2. The supporting protrusion 8 is used to completely pull the memory module 2 out of the memory module slot 15. After extraction, the grippers 5 continue to hold the memory module, and the robotic arm drives the gripping mechanism to transport it to the target position. Then, the grippers 5 release, completing the unloading process.

[0034] During the process of gripping the memory module using the aforementioned gripper assembly, the relative position between the memory module 2 and the gripper 5 is positioned by the memory module guide 10. Specifically, the shape of the memory module guide 10 matches the profile formed at the junction of the gripper block 6 and the gripper 5. When the gripper 5 moves towards the memory module 2, the gripper 5 first contacts the outer wall of the memory module guide 10 and slides along its outline, thereby automatically correcting the relative position between the gripper 5 and the side slot 9 of the memory module 2, ensuring that the supporting protrusion 8 is accurately embedded in the slot 9. Furthermore, the method of ejecting first and then pulling out reduces the force required to pull out the memory module. At the same time, compared with the method of inserting and removing using friction, this invention can reduce the damage to the memory module.

[0035] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. An automatic memory module insertion and removal mechanism, characterized in that, The system includes a base plate (1) for connecting with a robotic arm, a guide assembly for guiding and limiting the insertion and removal of the memory module (2) and a gripper assembly for clamping the memory module for transport and transfer. The guide assembly is provided with a guide slot (3) and a pressing surface (4) for pressing and inserting the memory module is formed at the end of the guide slot (3). The gripper assembly is provided with a gripper (5) for engaging with the side of the memory module (2) in the length direction. Before the memory module is pressed and inserted and after it is popped out and pulled out, the memory module is clamped by the gripper (5) for transport and movement.

2. The memory module automatic insertion and removal clamping mechanism according to claim 1, characterized in that, The end of the gripper (5) is provided with a clamping block (6) on the surface that cooperates with the memory module (2). The clamping block (6) has a guide groove (7) that cooperates with the memory module, and a supporting protrusion (8) is provided at the lower part of the guide groove (7). The memory module is clamped by the cooperation of the supporting protrusion (8) with the slot (9) on the side of the memory module (2), and the memory module (2) is moved by the movement of the robot arm.

3. The memory module automatic insertion and removal clamping mechanism according to claim 2, characterized in that, The guiding assembly includes memory module guides (10) located at both ends of the memory module along the length of the memory module (2) and pressure plates (11) disposed between the memory module guides (10). Guide slots (3) are formed on the memory module guides (10). The surface of the pressure plate (11) is flush with the pressing surface (4) at the end of the guide slot. When the memory module (2) is pressed in, the memory module (2) is pressed in by the pressure plate (11) and the pressing surface (4) of the memory module guides (10).

4. The memory module automatic insertion and removal clamping mechanism according to claim 3, characterized in that, The memory strip guide (10) is fixedly connected to the base plate (1) through the connecting plate (12). The two connecting plates (12) are symmetrically arranged, and the two ends of the pressure plate (11) are fixedly connected to the bottom ends of the two connecting plates (12) respectively. The two connecting plates (12), the base plate (1) and the pressure plate (11) together form the installation space of the gripper assembly.

5. The memory module automatic insertion and removal clamping mechanism according to claim 4, characterized in that, The gripper assembly includes a gripper cylinder (13) and a gripper (5). The gripper cylinder (13) is fixed on the base plate (1). The gripper (5) is connected to the drive end of the gripper cylinder (13) through a connector (14). The gripper (5) is located outside the memory module guide (10). The profile formed at the junction of the clamping block (6) and the gripper (5) matches the shape of the memory module guide (10). The memory module guide (10) assists the gripper assembly in gripping the memory module (2).

6. The memory module automatic insertion and removal clamping mechanism according to claim 5, characterized in that, The connector (14) is a hollow shell structure. The lower end of the connecting plate (12) passes through the corresponding connector (14) and is connected to the pressure plate (11) and the memory module guide (10). A gap is formed between the hollow part of the connector (14) and the plate surface of the connecting plate (12) for the gripper cylinder (13) to drive the gripper (5) to move.

7. The memory module automatic insertion and removal clamping mechanism according to claim 1, characterized in that, The base plate (1) is also provided on the outside of the guide assembly for opening the latch (16) of the memory slot (15) so that the memory module (2) can be ejected from the memory slot (15) when it is pulled out. The latch opening assembly includes a latch opening cylinder (17) and a latch opening block (18). The latch opening block (18) is fixed to the drive end of the latch opening cylinder (17). The latch opening cylinder (17) drives the latch opening block (18) to move toward the latch (16) and press down the latch (16) to eject the memory module (2) from the memory slot (15).

8. The memory module automatic insertion and removal clamping mechanism according to claim 1, characterized in that, A force control sensor (19) for detecting the force of inserting and removing memory modules is provided between the base plate (1) and the robot arm.

9. The method of using the automatic memory module insertion / removal clamping mechanism according to any one of claims 1-8, characterized in that, The robot arm moves the base plate, picks up the memory module and moves it to the memory module slot. The memory module is then gradually placed into the pre-guided part of the memory module slot. The robot arm then applies downward pressure, and the memory module is vertically pressed into the memory module slot through the pressing surface and the pressure plate to complete the fixation. When removing the memory module, a robotic arm drives the gripping mechanism to move the memory module to be removed, positioning the upper part of the memory module within the guide slot. Then, the latch of the memory module slot is opened, and the memory module is ejected from the slot. During ejection, the memory module is limited by the guide slot, and the grippers in the clamping assembly hold the memory module along its length. The robotic arm then moves the base plate upward, pulling the memory module out of the slot. After removal, the grippers remain in the clamping state, and the robotic arm, along with the base plate, transports the memory module to the target location.

10. The method of using the automatic internal memory module insertion and removal mechanism according to claim 9, characterized in that, When gripping a memory module using the gripper assembly, the memory module is positioned relative to the gripper using the memory module guide.

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