A module for a modular automation device

Abstract

The application relates to the technical field of automation, and discloses an assembly for a modular automation device, which comprises a mechanical arm and a loading box, a spacer for placing a wafer is movably arranged in the loading box, a supporting rod and a tray are arranged at the end of the mechanical arm, a cylinder is mounted on the inner side of the tray, an air pipe is inserted into the side of the tray, a suction disc is mounted at one end of the air pipe and communicates with the cylinder, a piston is slidably arranged on the inner side of the cylinder, and a driving assembly is arranged between the piston and the air pipe. The wafer on the detection position is adsorbed below the tray by the suction disc, is transferred to the side of the loading box by the mechanical arm, and the slider, the spacer and the wafer above the tray are simultaneously supported upward by the supporting rod, the interval between two adjacent spacers is expanded, enough space is provided for the insertion of the tray and the suction disc, the wafer after detection is placed on the empty spacer again by the tray moving downward, the wafer on the upper side is taken out for detection by the tray moving upward, the moving and taking process is simplified, and the detection efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of automation technology, and more specifically, to a component for modular automation equipment. Background Technology

[0002] Modular automated equipment achieves flexible configuration and efficient production through standardized components, and its core components cover multiple aspects such as control, execution, sensing, power transmission and auxiliary systems.

[0003] Controllers: As the "brain" of automated equipment, controllers are responsible for coordinating and directing the operation of the entire system. Common controllers include programmable logic controllers (PLCs) and industrial control computers (ICCs). They can control the operation of actuators and other components according to preset programs or external input signals. Automation software: Such as SCADA data acquisition and monitoring system software, it can accurately monitor the production process for a long time without human supervision and acquire effective information data, providing managers with powerful evaluation references. Actuators: Perform specific operations according to control signals, such as electric motors, hydraulic cylinders, and pneumatic components. They are responsible for realizing mechanical movement, pushing and completing various tasks. Robots: As executors of automated equipment, robots can automatically perform tasks. They can be commanded by humans, run pre-programmed programs, or act according to principles and guidelines established by artificial intelligence technology. They are usually composed of actuators, drive devices, detection devices, and control systems. A wafer is a silicon wafer used to manufacture silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seed crystals. Then it is slowly pulled out to form a cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, which is a wafer. Before use, the wafer needs to be tested to ensure that the wafer is of good quality.

[0004] Currently, existing technologies typically use robotic arms to transfer wafers from loading bins to the inspection station for testing. However, during the transfer process, the robotic arm needs to first reach into the loading bin to lift and remove a wafer, place it at the inspection station, and after inspection, lift it back into the loading bin for placement. Then, the robotic arm is withdrawn from the loading bin, moves to the bottom of the next wafer, and re-inserts itself to lift and remove it. The wafer placement requires the robotic arm to reach into and withdraw from the loading bin, and the removal of the next wafer requires the robotic arm to reach into and withdraw from the loading bin again. This cumbersome process results in long inspection times, which can easily affect the efficiency of wafer inspection. Therefore, it does not meet the current requirements. To address this, we propose a component for modular automated equipment. Summary of the Invention

[0005] This invention provides a component for modular automated equipment. This component simplifies the wafer handling process and steps during wafer inspection, shortens the inspection time, and thus improves the efficiency of wafer inspection. It solves the problem mentioned in the background art that the process of robotic arms handling wafers during wafer inspection is complicated, resulting in long inspection times and easily affecting the efficiency of wafer inspection.

[0006] To achieve the above objectives, this disclosure provides a component for a modular automated device, including a robotic arm and a loading bin for storing wafers. A spacer for placing wafers is movably disposed within the loading bin. A support rod is provided at the end of the robotic arm to support the spacer. A tray for supporting wafers is mounted at the end of the robotic arm. A cylinder is mounted inside the tray, and an air pipe is inserted into the side of the tray. One end of the air pipe communicates with the cylinder, and the other end of the air pipe is fitted with a suction cup for adsorbing wafers. A piston is slidably disposed inside the cylinder, and a driving assembly is disposed between the piston and the air pipe. A through hole is provided on the side wall of the cylinder. The robotic arm controls the movement of the tray and the suction cup. The suction cup adsorbs the wafers that have completed testing at the testing position below the tray. The support rod lifts the spacer upward, increasing the distance between two adjacent spacers. After the tray is inserted into the gap, it moves downward to place the tested wafers back onto empty spacers. The tray moves upward to lift the upper wafers and remove them for testing.

[0007] Optionally, the inner wall of the loading box is provided with a slider, the slider is configured as "T" shaped, one end of the slider is slidably inserted into the side wall of the loading box, and the other end of the slider is connected to the partition. The number of partitions and sliders is set to several, and the several partitions and sliders are symmetrically arranged on both sides of the loading box. A spacer block is installed on the lower side of each slider, and the lower end of the spacer block abuts against the upper side of the adjacent slider.

[0008] Optionally, slots are provided on both sides of the loading box, and one end of the slider away from the partition is located in the slot. The support rod is set to "L" shape, and there are two support rods, which are symmetrically arranged. The two slots are used in conjunction with the two support rods. One end of the support rod is provided with a ramp, and the slider intermittently abuts against the ramp and the upper side of the support rod. The other end of the support rod is slidably inserted into the end of the robotic arm.

[0009] Optionally, a first spring is provided on the inner side of the robotic arm. The upper end of the first spring is connected to the lower side of the support rod, and the lower end of the first spring is connected to the inner wall of the robotic arm. The rigidity of the first spring is greater than the sum of the weights of the several sliders, the several spacers, the several spacer blocks, and the several wafers.

[0010] Optionally, a positioning plate is installed on the upper side of the tray. The number of positioning plates is set to two. The inner diameter of the ring on the lower side of the two positioning plates is the same as the diameter of the wafer, and the inner diameter of the ring on the upper side of the two positioning plates is larger than the diameter of the wafer, so that the side of the positioning plate forms a slope, and the edge of the wafer slides in cooperation with the slope of the two positioning plates.

[0011] Optionally, the side of the cylinder away from the suction cup is open, and there are two cylinders and two air tubes. The air tube includes a rigid tube and a flexible tube connected to the rigid tube. The rigid tube is slidably inserted into the side of the tray, and the flexible tube is located inside the tray. One end of the rigid tube is connected to the suction cup, and the other end of the rigid tube is connected to one end of the flexible tube. The other end of the flexible tube is connected to the cylinder.

[0012] Optionally, the drive assembly includes a first wedge block mounted on the outside of the rigid tube and slidably disposed within the tray, a second wedge block slidably disposed within the tray and cooperating with the first wedge block, a limiting groove formed on the inclined surface of the first wedge block, a limiting block mounted on the inclined surface of the second wedge block and slidably disposed within the limiting groove, and a connecting rod connected to the second wedge block. The connecting rod is slidably inserted into the side of the cylinder, and the sliding insertion point of the connecting rod and the cylinder is sealed by conventional technical means. The end of the connecting rod is connected to the piston.

[0013] Optionally, the width of the through hole is smaller than the thickness of the piston, and the side wall of the tray is provided with an air hole, through which the interior of the tray communicates with the outside air.

[0014] Optionally, a magnetic ring is installed on the outer side of the piston, an electromagnetic ring is slidably arranged on the inner side of the cylinder, an insert is installed on the outer side of the electromagnetic ring, the insert is slidably inserted into the inner wall of the cylinder, and a second spring is installed in the inner wall of the cylinder, with the end of the second spring connected to the insert.

[0015] Optionally, an energized switch is slidably disposed inside the cylinder, a first elastic rod is installed on the inner wall of the cylinder, the end of the first elastic rod is connected to the energized switch, an energized switch is also disposed inside the cylinder, a second elastic rod is installed on the inner wall of the cylinder, the end of the second elastic rod is connected to the energized switch, and wires are electrically connected to the sides of both the energized switch and the energized switch, and the wires are electrically connected to the electromagnetic ring.

[0016] Through the above technical solution, the components for modular automated equipment provided in this disclosure, when in use: employ an air tube in conjunction with a drive assembly to achieve mechanical linkage between the air tube lifting and piston movement, eliminating the need for additional independent vacuum pumps or other vacuum generating devices, automatically generating negative pressure adsorption force during wafer contact with the chuck; employing an adsorption-coupling structure of an electromagnetic ring and a magnetic chuck, combined with the triggering of the power switch and power-off switch during piston movement, automatically locks and unlocks the chuck's adsorption state on the wafer. After the first wafer, after adsorption and detection by the chuck, is inserted into the loading box and its placement is completed, there is no need to remove the tray and re-insert it into the loading box; the second wafer can be immediately lifted by the upward movement of the tray to achieve wafer removal and detection, simplifying the wafer removal steps, reducing the time consumption of the wafer detection and removal process, and thus effectively improving the efficiency of wafer detection.

[0017] Other features and advantages of this disclosure will be described in detail in the following detailed description section. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the present disclosure and form part of the specification. They are used together with the following detailed description to explain the present disclosure, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a three-dimensional structural diagram of the present invention.

[0019] Figure 2 This is a partial three-dimensional structural diagram of the present invention.

[0020] Figure 3 This is a schematic diagram of the three-dimensional structure of the tray and suction cup of the present invention.

[0021] Figure 4 This is a partial exploded view of the present invention.

[0022] Figure 5 This is a three-dimensional structural diagram of the cylinder of the present invention.

[0023] Figure 6 This is a schematic diagram of the internal three-dimensional structure of the cylinder of the present invention.

[0024] Figure 7 This is a schematic diagram of the three-dimensional structure of the first wedge block of the present invention.

[0025] Figure 8 This is a schematic diagram of the three-dimensional structure of the spacer of the present invention.

[0026] Figure 9 This is a cross-sectional structural diagram of the loading box of the present invention.

[0027] Figure 10 This is a schematic diagram of the tray cross-section structure of the present invention.

[0028] Figure 11 For the present invention Figure 10 Enlarged structural diagram at point A in the middle.

[0029] Explanation of reference numerals in the attached drawings: 100, robotic arm; 110, loading box; 120, partition; 121, slider; 122, spacer block; 130, support rod; 131, slot; 132, ramp; 133, first spring; 140, tray; 141, positioning plate; 150, cylinder; 160, air pipe; 161, rigid pipe; 162, flexible hose; 170, suction cup; 180, piston; 190, drive. Components; 191, First wedge block; 192, Second wedge block; 193, Limiting groove; 194, Limiting block; 195, Connecting rod; 200, Through hole; 201, Air hole; 210, Magnetic ring; 211, Electromagnetic ring; 212, Insert block; 213, Second spring; 220, Power switch; 221, First elastic rod; 222, Power off switch; 223, Second elastic rod; 224, Wire. Detailed Implementation

[0030] To make the above-described objects, features, and advantages of this disclosure more apparent and understandable, specific embodiments of this disclosure will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this disclosure. However, this disclosure can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this disclosure. Therefore, this disclosure is not limited to the specific embodiments disclosed below.

[0031] In the description of this disclosure, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. The terms "first" and "second" are used to distinguish one element from another and do not have sequential or importance. Furthermore, in the following description, when referring to the accompanying drawings, the same reference numerals in different drawings denote the same or similar elements, which will not be repeated here.

[0032] In this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0033] According to some embodiments of this disclosure, a component for a modular automation device is provided, with reference to... Figure 1 — Figure 11 As shown, the components for the modular automated equipment include a robotic arm 100 and a loading bin 110 for storing wafers. A spacer 120 for placing wafers is movably disposed within the loading bin 110. A slider 121 is disposed on the inner wall of the loading bin 110. The slider 121 is T-shaped, with one end of the slider 121 having a crossbar slidably inserted into the side wall of the loading bin 110 to prevent rotation, thereby allowing the slider 121 to slide smoothly up and down within the loading bin 110. The other end of 121 is fixedly connected to the spacer 120. The spacer 120 is set as an arc-shaped piece, and the curvature of the spacer 120 is adapted to the curvature of the wafer. The number of spacers 120 and sliders 121 is set to several, and several spacers 120 and sliders 121 are symmetrically arranged on both sides of the loading box 110. A spacer block 122 is fixedly installed on the lower side of each slider 121. The lower end of the spacer block 122 abuts against the upper side of the adjacent slider 121, that is, the lower end of the spacer block 122 presses on the slider 121 located below it.

[0034] The robotic arm 100 has a support rod 130 at its end, which is used to support the partition 120. Slots 131 are provided on both sides of the loading box 110. One end of the slider 121, away from the partition 120, is located in the slot 131. The support rod 130 is L-shaped, and there are two support rods 130 arranged symmetrically. The two slots 131 cooperate with the two support rods 130. One end of the support rod 130 has a ramp 132. The slider 121 intermittently contacts the ramp 132 and the upper side of the support rod 130. When the support rod 130 is away from the loading box 110, the support rod 130 does not contact the slider 121. When the support rod 130 is inserted into the slot 131, the ramp 132 first contacts the slider 121, thus lifting the slider 121 and the partition 120. The wafer 120 and the wafer are lifted upwards simultaneously. Then, the upper side of the support rod 130 continues to abut against the slider 121, thereby widening the distance between the two adjacent spacers 120 and providing sufficient operating space for subsequent steps. The other end of the support rod 130 is slidably inserted into the end of the robotic arm 100. A first spring 133 is provided on the inner side of the robotic arm 100. The upper end of the first spring 133 is engaged with the lower side of the support rod 130, and the lower end of the first spring 133 is engaged with the inner wall of the robotic arm 100. When the first spring 133 becomes fatigued due to prolonged use and can no longer perform its function, the first spring 133 can be replaced. The rigidity of the first spring 133 is greater than the sum of the weights of several sliders 121, several spacers 120, several spacer blocks 122, and several wafers.

[0035] The robotic arm 100 has a tray 140 fixedly installed at its end for holding the wafer. Positioning plates 141 are installed on the upper side of the tray 140. There are two positioning plates 141. The inner diameter of the ring on the lower side of the two positioning plates 141 is the same as the diameter of the wafer, and the inner diameter of the ring on the upper side of the two positioning plates 141 is larger than the diameter of the wafer. This makes the sides of the positioning plates 141 form a slope. The edge of the wafer slides and engages with the slope of the two positioning plates 141. This not only facilitates the positioning of the wafer but also avoids the problem of wafer displacement during the transfer process.

[0036] A cylinder 150 is fixedly installed inside the tray 140, and an air pipe 160 is slidably inserted into the side of the tray 140. An elastic element (not shown in the figure) is provided on the side of the air pipe 160. The elastic element can be configured as an elastic pull rod to facilitate the resetting of the air pipe 160, and also to allow the air pipe 160 to drive the suction cup 170 and piston 180 to reset. This is a well-known technique to those skilled in the art and will not be elaborated upon here. One end of the air pipe 160 is connected to the cylinder 150, and the other end of the air pipe 160 is fixedly installed with a suction cup 170 for adsorbing wafers. The cylinder is located away from the suction cup 170. One side of 150 is open, and there are two cylinders 150 and two air pipes 160. The air pipe 160 includes a rigid tube 161 and a flexible tube 162 connected to the rigid tube 161. The rigid tube 161 is slidably inserted into the side of the tray 140, and the flexible tube 162 is located inside the tray 140. One end of the rigid tube 161 is fixedly connected to the suction cup 170, and the other end of the rigid tube 161 is fixedly connected to one end of the flexible tube 162. The other end of the flexible tube 162 is connected to the cylinder 150. The setting of the flexible tube 162 allows the rigid tube 161 to slide up and down on the side of the tray 140.

[0037] A piston 180 is slidably disposed inside the cylinder 150 and used in conjunction with the cylinder 150. A drive assembly 190 is disposed between the piston 180 and the air pipe 160. The drive assembly 190 includes a first wedge block 191 fixedly mounted on the outside of the rigid pipe 161 and slidably disposed in the tray 140, a second wedge block 192 slidably disposed in the tray 140 and used in conjunction with the first wedge block 191, a limiting groove 193 formed on the inclined surface of the first wedge block 191, a limiting block 194 fixedly mounted on the inclined surface of the second wedge block 192 and slidably disposed in the limiting groove 193, and a connecting rod 195 fixedly connected to the second wedge block 192. The connecting rod 195 is slidably inserted into the side of the cylinder 150. The sliding insertion point between the connecting rod 195 and the cylinder 150 is sealed by conventional technical means, such as by using a sealing ring. This is a technical means well known to those skilled in the art and will not be described in detail here. The end of the connecting rod 195 is fixedly connected to the piston 180.

[0038] The cylinder 150 has a through hole 200 on its side wall. The width of the through hole 200 is smaller than the thickness of the piston 180. A sealing ring (not shown in the figure) is installed around the through hole 200 on the inner wall of the cylinder 150. When the piston 180 moves to the underside of the through hole 200 and blocks the through hole 200, the side of the piston 180 is pressed against the sealing ring, so that the piston 180 and the through hole 200 are sealed, ensuring the negative pressure state of the cylinder 150, the air pipe 160 and the suction cup 170, thereby ensuring the effective adsorption of the wafer by the suction cup 170. The tray 140 has an air hole 201 on its side wall. The piston 180 is connected to the outside air through the air hole 201. A magnetic ring 210 is fixedly installed on the outside of the piston 180. An electromagnetic ring 211 is slidably arranged on the inside of the cylinder 150. The electromagnetic ring 211 is an electromagnet. An insert block 212 is fixedly installed on the outside of the electromagnetic ring 211. The insert block 212 is slidably inserted into the inner wall of the cylinder 150. A second spring 213 is snapped into the inner wall of the cylinder 150. The end of the second spring 213 is snapped into the insert block 212. When the second spring 213 becomes fatigued after long-term use and can no longer perform its function, the second spring 213 can be replaced.

[0039] An energizing switch 220 is slidably mounted inside the cylinder 150. A first elastic rod 221 is engaged with the inner wall of the cylinder 150, with its end engaged with the energizing switch 220. A de-energizing switch 222 is also mounted inside the cylinder 150. A second elastic rod 223 is engaged with the inner wall of the cylinder 150, with its end engaged with the de-energizing switch 222. When either the first elastic rod 221 or the second elastic rod 223 becomes fatigued after prolonged use and can no longer perform its function, it can be replaced. Both the power switch 220 and the power off switch 222 are electrically connected to wires 224 on their sides. Wires 224 are electrically connected to an electromagnetic ring 211. The robotic arm 100 controls the movement of the tray 140 and the suction cup 170. The suction cup 170 adsorbs the wafer that has been tested at the test position and places it under the tray 140. The support rod 130 lifts the spacer 120 upward to widen the gap between two adjacent spacers 120. After the tray 140 is inserted into the gap, it moves down to place the tested wafer back on the empty spacer 120. The tray 140 moves up to lift the upper wafer and remove it for testing.

[0040] Through the above technical solution, when the components for modular automated equipment provided in this disclosure are in use, the spacer blocks 122 at the bottom of each slider 121 abut against the upper surface of the adjacent slider 121 below, so that the spacers 120 connected to each slider 121 maintain a uniform preset spacing. The wafer is placed on the spacers 120 to achieve stable storage of the wafer. When the first wafer to be tested is picked up, the robotic arm 100 drives the support rod 130 to be inserted into the slots 131 on both sides of the loading box 110. Since the stiffness of the first spring 133 is greater than the total weight of all the sliders 121, spacers 120, spacers 122 and the stored wafers, the first spring 133 is not compressed during the insertion of the support rod 130. The ramp 132 at end 0 first abuts against the bottom of the slider 121 in the slot 131, simultaneously lifting the corresponding slider 121, spacer 120 and wafer upward until the bottom surface of the slider 121 abuts against the upper surface of the support rod 130. At this time, the spacing between adjacent spacers 120 increases, providing sufficient operating space for wafer loading and unloading. If the spacers 120 are fixed, the spacing between each adjacent spacer 120 needs to be large enough, which will greatly reduce the number of wafers stored in the loading box 110. Therefore, by setting the movable slider 121, the spacers 120 can be densely arranged, making rational use of the storage space of the loading box 110, thereby greatly increasing the wafer storage capacity of the loading box 110. The robotic arm 100 pulls the tray 140 into the loading box 110, with the tray 140 positioned directly above the first wafer. The tray 140 then moves the suction cup 170 downwards, pressing it onto the first wafer. At this point, the first wafer exerts an upward force on the suction cup 170, causing the rigid tube 161 to slide upwards along the side wall of the tray 140. The rigid tube 161 simultaneously moves the first wedge block 191 upwards, and through its cooperation with the second wedge block 192, pushes the second wedge block 192 horizontally towards the cylinder 150. The second wedge block 192, via the connecting rod 195, drives the piston 180 to move along the inner wall of the cylinder 150 away from the air tube 160, causing the cylinder 150... The volume of the sealed cavity formed by the flexible tube 162, rigid tube 161, and suction cup 170 increases, generating negative pressure, thereby adsorbing and fixing the wafer onto the suction cup 170. During this process, when the piston 180 moves, it passes the position of the energized switch 220. The piston 180 squeezes the energized switch 220, pressing it downward, which energizes the electromagnetic ring 211 and generates magnetism, adsorbing and fixing the magnetic ring 210 on the outside of the piston 180, keeping the position of the piston 180 unchanged. At this time, the piston 180 is located below the through hole 200, blocking the through hole 200, so that the cylinder 150 remains sealed, maintaining the negative pressure adsorption state of the suction cup 170, and achieving stable adsorption of the wafer. When the wafer is transferred and placed on the testing station, the tray 140 drives the suction cup 170 to press down again, causing the piston 180 to continue moving and release the piston 180 from the through hole 200. This allows the cylinder 150 to communicate with the outside air through the through hole 200, thereby eliminating the negative pressure adsorption effect of the suction cup 170 and releasing the wafer. The continued movement of the piston 180 also activates the power-off switch 222, de-energizing the electromagnetic ring 211 and releasing it from the magnetic suction ring 210. After the tray 140 drives the suction cup 170 away from the wafer, the piston 180 can move freely, allowing the piston 180, air tube 160, and suction cup 170 to reset. After the wafer is tested, the above steps of suction cup 170 adsorbing and releasing the wafer are repeated, so that the suction cup 170 picks up the first tested wafer and transfers it to the empty partition 120 inside the loading box 110. Next, the tray 140 moves upward to lift and remove the second wafer located above it, and then transfer it to the inspection station for inspection. Moreover, during the process of the robotic arm 100 driving the tray 140 to move upward to lift the second wafer, the support rod 130 abuts against the lower side of the adjacent slider 121, while the uppermost slider 121 abuts against the inner wall of the loading box 110, so that the support rod 130 and the slider 121 remain stationary relative to the loading box 110. This causes the support rod 130 to move downward relative to the robotic arm 100, compressing the first spring 133. When the tray 140 lifts the second wafer and pulls it out of the loading box 110, the support rod 130 is also pulled out from the slot 131, releasing the support rod 130 from lifting the slider 121, so that the slider 121 slowly descends and resets along the ramp 132 at the end of the support rod 130. In summary, the mechanical linkage between the air tube 160 and the drive assembly 190, which enables the lifting of the air tube 160 and the movement of the piston 180, eliminates the need for an independent vacuum pump or other vacuum generating device. This automatically generates negative pressure adsorption force during wafer contact with the chuck 170, simplifying the overall structure and reducing control costs. The adsorption combination of the electromagnetic ring 211 and the magnetic ring 210, along with the triggering of the power switch 220 and power-off switch 222 during piston 180 movement, automatically locks and unlocks the chuck 170's wafer adsorption state. The addition of complex adsorption control logic improves the automation of wafer handling operations and ensures stable adsorption, effectively avoiding the risk of wafers falling during transfer. After the first wafer, after adsorption and testing by the suction cup 170, is inserted into the loading box 110 and returned to its original position, the second wafer can be immediately lifted by the upward movement of the tray 140 without the need for the tray 140 to be pulled out and then inserted back into the loading box 110. This simplifies the wafer handling steps, reduces the time consumed in the wafer handling process, and thus effectively improves the efficiency of wafer handling.

[0041] It should be noted that the power switch 220 is designed as a wedge shape with bevels on both sides, so that when the piston 180 squeezes the power switch 220, it can press the power switch 220 downward, and also allows the piston 180 to pass over the power switch 220 without hindering the movement of the piston 180.

[0042] The preferred embodiments of this disclosure have been described in detail above with reference to the accompanying drawings. However, this disclosure is not limited to the specific details of the above embodiments. Within the scope of the technical concept of this disclosure, various simple modifications can be made to the technical solutions of this disclosure, and these simple modifications all fall within the protection scope of this disclosure.

[0043] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, this disclosure will not describe the various possible combinations separately.

[0044] Furthermore, various different embodiments of this disclosure can be combined in any way, as long as they do not violate the spirit of this disclosure, they should also be regarded as the content disclosed in this disclosure.

Claims

1. A component for a modular automated device, comprising a robotic arm (100) and a loading bin (110) for storing wafers, characterized in that: The loading box (110) is movably equipped with a spacer (120) for placing wafers. The end of the robotic arm (100) is equipped with a support rod (130) for lifting the spacer (120). The end of the robotic arm (100) is equipped with a tray (140) for lifting wafers. A cylinder (150) is installed inside the tray (140). An air pipe (160) is inserted into the side of the tray (140). One end of the air pipe (160) is connected to the cylinder (150), and the other end of the air pipe (160) is equipped with a suction cup (170) for adsorbing wafers. A piston (180) is slidably arranged inside the cylinder (150). A drive assembly (190) is provided between the plug (180) and the air tube (160). A through hole (200) is provided on the side wall of the cylinder (150). The movement of the tray (140) and the suction cup (170) is controlled by the robotic arm (100). The suction cup (170) adsorbs the wafer that has been tested at the detection position under the tray (140). The support rod (130) lifts the partition (120) upward to expand the distance between two adjacent partitions (120). After the tray (140) is inserted into the gap, it moves down to place the tested wafer back on the empty partition (120). The tray (140) moves up to lift the upper wafer and take it out for testing.

2. A component for modular automated equipment according to claim 1, characterized in that: The inner wall of the loading box (110) is provided with a slider (121). The slider (121) is T-shaped. One end of the slider (121) is slidably inserted into the side wall of the loading box (110). The other end of the slider (121) is connected to the partition (120). The number of partitions (120) and sliders (121) is set to several. Several partitions (120) and sliders (121) are symmetrically arranged on both sides of the loading box (110). A spacer block (122) is installed on the lower side of each slider (121). The lower end of the spacer block (122) abuts against the upper side of the adjacent slider (121).

3. A component for modular automated equipment according to claim 2, characterized in that: The loading box (110) has slots (131) on both sides. One end of the slider (121) away from the partition (120) is located in the slot (131). The support rod (130) is set to "L" shape. There are two support rods (130), and the two support rods (130) are symmetrically arranged. The two slots (131) are used in conjunction with the two support rods (130). One end of the support rod (130) is provided with a ramp (132). The slider (121) intermittently abuts against the ramp (132) and the upper side of the support rod (130). The other end of the support rod (130) is slidably inserted into the end of the robotic arm (100).

4. A component for a modular automated device according to claim 3, characterized in that: The robotic arm (100) is provided with a first spring (133) on its inner side. The upper end of the first spring (133) is connected to the lower side of the support rod (130), and the lower end of the first spring (133) is connected to the inner wall of the robotic arm (100). The rigidity of the first spring (133) is greater than the sum of the weights of several sliders (121), several spacers (120), several spacer blocks (122), and several wafers.

5. A component for a modular automated device according to claim 1, characterized in that: The tray (140) is equipped with a positioning piece (141) on its upper side. The number of positioning pieces (141) is set to two. The inner diameter of the ring on the lower side of the two positioning pieces (141) is the same as the diameter of the wafer, and the inner diameter of the ring on the upper side of the two positioning pieces (141) is larger than the diameter of the wafer, so that the side of the positioning piece (141) forms a slope, and the edge of the wafer slides in cooperation with the slope of the two positioning pieces (141).

6. A component for a modular automated device according to claim 1, characterized in that: The side of the cylinder (150) away from the suction cup (170) is open. There are two cylinders (150) and two air pipes (160). The air pipe (160) includes a rigid tube (161) and a flexible tube (162) connected to the rigid tube (161). The rigid tube (161) is slidably inserted into the side of the tray (140). The flexible tube (162) is located inside the tray (140). One end of the rigid tube (161) is connected to the suction cup (170), and the other end of the rigid tube (161) is connected to one end of the flexible tube (162). The other end of the flexible tube (162) is connected to the cylinder (150).

7. A component for a modular automated device according to claim 6, characterized in that: The drive assembly (190) includes a first wedge block (191) mounted on the outside of the rigid tube (161) and slidably disposed in the tray (140), a second wedge block (192) slidably disposed in the tray (140) and used in conjunction with the first wedge block (191), a limiting groove (193) formed on the inclined surface of the first wedge block (191), a limiting block (194) mounted on the inclined surface of the second wedge block (192) and slidably disposed in the limiting groove (193), and a connecting rod (195) connected to the second wedge block (192). The connecting rod (195) is slidably inserted into the side of the cylinder (150). The sliding insertion point of the connecting rod (195) and the cylinder (150) is sealed by conventional technical means. The end of the connecting rod (195) is connected to the piston (180).

8. A component for a modular automated device according to claim 1, characterized in that: The width of the through hole (200) is smaller than the thickness of the piston (180), and the side wall of the tray (140) is provided with an air hole (201), through which the interior of the tray (140) communicates with the outside air.

9. A component for a modular automated device according to claim 1, characterized in that: A magnetic ring (210) is installed on the outside of the piston (180), an electromagnetic ring (211) is slidably arranged on the inside of the cylinder (150), an insert (212) is installed on the outside of the electromagnetic ring (211), the insert (212) is slidably inserted into the inner wall of the cylinder (150), a second spring (213) is installed in the inner wall of the cylinder (150), and the end of the second spring (213) is connected to the insert (212).

10. A component for a modular automated device according to claim 9, characterized in that: An energized switch (220) is slidably disposed inside the cylinder (150). A first elastic rod (221) is installed on the inner wall of the cylinder (150). The end of the first elastic rod (221) is connected to the energized switch (220). An energized switch (222) is also disposed inside the cylinder (150). A second elastic rod (223) is installed on the inner wall of the cylinder (150). The end of the second elastic rod (223) is connected to the energized switch (222). Wires (224) are electrically connected to the sides of both the energized switch (220) and the energized switch (222). The wires (224) are electrically connected to the electromagnetic ring (221).

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