Flip control method, device and system
Patent Information
- Application Number
- CN202610668395.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-05-14
- Publication Date
- 2026-08-21
AI Technical Summary
[0004]然而,铝塑膜在翻转过程中,容易导致铝塑膜在翻转时被拉伸,从而影响电池封装质量
[0038] This application provides a flipping control method, device, and system. The flipping control method first determines a dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameters between the flipping plate and the target to be flipped. When controlling the flipping plate to flip, based on a preset motion path and the dynamic compensation amount, the flipping plate drives the target to complete the flipping. In this application, by associating the flipping angle and eccentricity parameters to determine the appropriate dynamic compensation amount, and simultaneously combining the preset motion path and the dynamic compensation amount to coordinate the control of the flipping plate's movement, it can adapt to eccentricity differences during the flipping process while ensuring the flipping plate flips normally along a predetermined path. This reduces the adverse effects of eccentricity, lowers the risk of stretching or deformation of the target to be flipped, and thus improves the overall stability and processing quality of the flipping operation.
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Figure CN122607746A_ABST
Abstract
Description
Technical Field
[0001] This application relates to automation control technology, and more particularly to a flip control method, device and system. Background Technology
[0002] Pouch batteries are widely used in consumer electronics and new energy vehicles due to their high energy density and good safety. In the manufacturing process of pouch batteries, aluminum-plastic film, as a key material for battery encapsulation, requires multiple processes including cutting, flipping, and casing. Among these, the flipping process of the aluminum-plastic film is a crucial step affecting battery production quality and efficiency. How to prevent the aluminum-plastic film from stretching, wrinkling, or tearing during the flipping process is a technical issue that continues to be a focus of attention in the industry.
[0003] Currently, known aluminum-plastic film flipping devices typically employ a mechanically driven structure. For example, a sliding platform moves along the X-axis in conjunction with a rotating flipping plate to achieve the positioning and flipping of the aluminum-plastic film. The core components of such devices include a tray, a drive motor, and a flipping plate. The working principle is as follows: after the aluminum-plastic film is stamped, it falls onto the tray. The X-axis drive motor moves the sliding platform to the coding or flipping station. Subsequently, the flipping plate drive motor rotates the flipping plate, opening the aluminum-plastic film from its closed state to facilitate the subsequent core insertion operation.
[0004] However, during the flipping process, the aluminum-plastic film is easily stretched, which can affect the battery packaging quality. Summary of the Invention
[0005] This application provides a flipping control method, device, and system to reduce the risk of stretching during aluminum-plastic film flipping, thereby improving battery packaging quality.
[0006] In a first aspect, this application provides a flipping control method, the method comprising:
[0007] The dynamic compensation amount is determined based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped.
[0008] Based on the preset motion path and the dynamic compensation amount, the flipping plate is controlled to drive the target to be flipped to complete the flipping.
[0009] In one possible implementation, controlling the flipping plate to rotate the target to be rotated based on the preset motion path and the dynamic compensation amount includes:
[0010] Based on the preset motion path, multiple preset flip angles are determined;
[0011] During the process of controlling the flipping plate to flip the target to be flipped, the flipping plate is adjusted according to the corresponding dynamic compensation amount every time a preset flipping angle is reached.
[0012] In one possible implementation, controlling the flipping plate to rotate the target to be rotated based on the preset motion path and the dynamic compensation amount includes:
[0013] Based on the preset motion path, the rotation servo device is controlled to drive the target to be flipped to perform a flipping motion;
[0014] At each preset flip angle, the lifting servo device is controlled to adjust the position of the flip plate based on the dynamic compensation amount corresponding to the preset flip angle.
[0015] In one possible implementation, during the process of controlling the flipping plate to flip the target to be flipped, the rotary servo device and the lifting servo device are in an electronic cam coupled linkage state; wherein, the rotary servo device acts as the main axis of the electronic cam, and the lifting servo device acts as the slave axis of the electronic cam.
[0016] In one possible implementation, determining the dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped includes:
[0017] Based on the flipping angle and the eccentricity parameter, the predicted stretching length of the target to be flipped during the flipping process is determined;
[0018] Based on the predicted stretch length and the preset maximum allowable stretch length, the dynamic compensation amount corresponding to each of the flip angles is determined.
[0019] In one possible implementation, determining the dynamic compensation amount corresponding to each of the flipping angles based on the predicted stretch length and the preset maximum allowable stretch length includes:
[0020] The critical flip angle is determined based on the predicted stretch length and the maximum allowable stretch length.
[0021] Within the range where the flip angle is greater than the critical flip angle, based on the geometric relationship between the horizontal eccentricity, vertical eccentricity and the current flip angle indicated by the eccentricity parameter, the vertical position compensation is calculated angle by angle and used as the dynamic compensation corresponding to the current flip angle.
[0022] Within the range where the flip angle is not greater than the critical flip angle, zero is used as the dynamic compensation amount corresponding to the current flip angle.
[0023] In one possible implementation, the method further includes:
[0024] Before controlling the flipping plate to flip the target to be flipped, based on the distance between the flipping plate and the target to be flipped, control the flipping plate to move to the adsorption position of the target to be flipped;
[0025] And / or, after the target to be flipped is flipped into place, based on the preset motion path and the dynamic compensation amount, the flipping plate is controlled to drive the target to be flipped in the opposite direction to adapt to the subsequent process;
[0026] And / or, adjust the dynamic compensation amount according to the material properties of the target to be flipped; the material properties include at least one of thickness, ductility, and elastic modulus.
[0027] Secondly, this application provides a flipping control device, the device comprising:
[0028] The determination module is used to determine the dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped.
[0029] The control module is used to control the flipping plate to drive the target to be flipped to complete the flipping based on the preset motion path and the dynamic compensation amount.
[0030] Thirdly, this application provides an electronic device, including at least one processor and a memory communicatively connected to the processor;
[0031] The memory stores computer-executed instructions;
[0032] The processor executes computer execution instructions stored in the memory to implement the method as described in any of the first aspects.
[0033] Fourthly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any of the first aspects.
[0034] Fifthly, this application provides a computer program product, including a computer program that, when executed by a processor, implements the method as described in any of the first aspects.
[0035] Sixthly, this application provides a flipping control system, the system including a flipping plate and electronic equipment;
[0036] The electronic device is configured to perform: determining a dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped;
[0037] Based on the preset motion path and the dynamic compensation amount, the flipping plate is controlled to drive the target to be flipped to complete the flipping.
[0038] This application provides a flipping control method, device, and system. The flipping control method first determines a dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameters between the flipping plate and the target to be flipped. When controlling the flipping plate to flip, based on a preset motion path and the dynamic compensation amount, the flipping plate drives the target to complete the flipping. In this application, by associating the flipping angle and eccentricity parameters to determine the appropriate dynamic compensation amount, and simultaneously combining the preset motion path and the dynamic compensation amount to coordinate the control of the flipping plate's movement, it can adapt to eccentricity differences during the flipping process while ensuring the flipping plate flips normally along a predetermined path. This reduces the adverse effects of eccentricity, lowers the risk of stretching or deformation of the target to be flipped, and thus improves the overall stability and processing quality of the flipping operation. Attached Figure Description
[0039] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.
[0040] Figure 1 This is a schematic diagram illustrating an application scenario of a flip control method provided in an embodiment of this application;
[0041] Figure 2 A flowchart illustrating a flip control method provided in this application embodiment. Figure 1 ;
[0042] Figure 3A A schematic diagram of the principle of a flip control method provided in this application embodiment. Figure 1 ;
[0043] Figure 3B A schematic diagram of the principle of a flip control method provided in this application embodiment. Figure 2 ;
[0044] Figure 3C A schematic diagram (3) illustrating the principle of a flip control method provided in an embodiment of this application;
[0045] Figure 4 A flowchart illustrating a flip control method provided in this application embodiment. Figure 2 ;
[0046] Figure 5 This is a schematic diagram of the structure of a flipping control device provided in an embodiment of this application;
[0047] Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;
[0048] Figure 7 This is a schematic diagram of a flipping control system provided in an embodiment of this application.
[0049] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation
[0050] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0051] Pouch batteries are widely used in consumer electronics and new energy vehicles due to their high energy density and safety. In the production process of pouch batteries, aluminum-plastic film, as the encapsulation material, is crucial for key processes such as cell insertion, encapsulation, and cutting. The aluminum-plastic film is typically stamped to form a recessed structure, then a flipping mechanism opens the film from its closed state to allow the cell to be inserted. Finally, heat sealing and cutting complete the battery encapsulation.
[0052] In the above production process, the precision and stability requirements of the flipping mechanism are extremely high: on the one hand, the aluminum-plastic film material is thin and easily deformed. If the force is uneven or the motion trajectory is not designed properly during the flipping process, it is easy to cause the material to be stretched, torn or deviated; on the other hand, the flipping action needs to be highly coordinated with the subsequent electrode core placement, heat sealing and other processes. If the motion trajectory of the flipping mechanism is deviated, it may directly cause the electrode core to be crushed or the packaging to fail, thereby affecting the battery yield.
[0053] Currently, known aluminum-plastic film flipping devices typically employ a mechanical drive structure. Most utilize a sliding platform that moves linearly along the horizontal X-axis, coordinated with the rotational motion of a flipping plate, to achieve precise positioning and flipping of the aluminum-plastic film. The core components of this traditional flipping device mainly include a support tray, an X-axis translation drive motor, a flipping plate rotation drive motor, and the flipping plate itself. Its conventional working principle is as follows: after the aluminum-plastic film is stamped and formed, it is smoothly placed on the surface of the support tray. The X-axis translation drive motor drives the sliding platform to move linearly, precisely conveying the tray carrying the aluminum-plastic film to the coding station or the flipping station before the electrode core is inserted into the casing. After the platform is positioned and locked, the flipping plate rotation drive motor drives the flipping plate to rotate and swing around a fixed axis of rotation, allowing the aluminum-plastic film to smoothly flip from a closed stacked state to an open state synchronously with the flipping plate. This provides working space for subsequent downstream processes such as electrode core insertion and packaging, adapting to the continuous operation requirements of automated production lines for soft-pack batteries.
[0054] However, during the aluminum-plastic film flipping process, the aluminum-plastic film is easily stretched, which can easily lead to problems such as material misalignment, tearing, or being crushed during closure, affecting the battery packaging quality.
[0055] Therefore, embodiments of this application provide a flipping control method, device, and system to solve the above-mentioned problems. Specifically, the flipping control method of this application proposes to determine a dynamic compensation amount based on the flipping angle and the eccentricity parameter between the flipping plate and the target to be flipped, and to adjust the position of the flipping plate in real time based on the dynamic compensation amount during the flipping process, so as to reduce the stretching caused to the target to be flipped.
[0056] It is understood that the flipping control method of this application is applicable to scenarios where there is a positional offset between the rotation center of any flipping plate and the flipping center of the workpiece to be flipped, and rotation, opening, closing, and flipping are required. For example, the method of this application can be used in the manufacturing process of soft-pack batteries. Figure 1 This is a schematic diagram illustrating an application scenario of a flip control method provided in an embodiment of this application, such as... Figure 1 As shown, the method of this application is executed by a servo controller in the manufacturing scenario, such as a programmable logic controller (PLC).
[0057] In the manufacturing of pouch batteries, the aluminum-plastic film forms its own fixed flipping center as it is positioned by the tooling. Affected by equipment assembly tolerances, part processing errors, and station positioning deviations, the rotation center of the flipping plate is difficult to coincide with the workpiece flipping center of the aluminum-plastic film, resulting in an inherent eccentricity. Traditional flipping methods only control the single rotational movement of the flipping plate according to a preset fixed trajectory, which cannot adapt to the motion deviation caused by the misalignment of the two types of flipping centers. During continuous rotation and flipping, it is easy to generate a pulling force on the aluminum-plastic film, which in turn causes the film to stretch, resulting in the aluminum-plastic film length increase, deformation, or even breakage, reducing the production yield of subsequent packaging processes of pouch batteries.
[0058] Based on the method of this application, the PLC obtains parameters such as the flipping angle of the flipping plate and the eccentricity between the flipping plate and the flipping center of the aluminum-plastic film workpiece, determines the dynamic compensation amount to adapt to the current flipping condition, and adjusts the control position of the flipping plate synchronously according to the dynamic compensation amount during the flipping process until the aluminum-plastic film flipping and opening process is completed.
[0059] In the above process, by combining the flipping angle and eccentricity parameters to generate dynamic compensation, while keeping the original preset flipping motion path of the flipping plate unchanged, the misalignment deviation between the rotation center of the flipping plate and the flipping center of the aluminum-plastic film workpiece is adapted in real time to offset the pulling effect generated by the relative motion during the rotation, effectively avoiding excessive stretching, deformation and damage of the aluminum-plastic film, and improving the smoothness of the flipping process and the quality of product processing.
[0060] It should be understood that, in the above process, the executing entity of the method of this application can also be a control unit with computing and control capabilities, such as a motion controller, an embedded control chip, or an industrial control computer, and this embodiment does not limit this. In addition, the application scenario of the method of this application can also be other scenarios involving component rotation and flipping with offset of the double flipping center position, such as precision membrane folding, synchronous flipping processing of precision parts, etc., and this embodiment does not limit this.
[0061] The following detailed description, with reference to the accompanying drawings and using any electronic device as the executing entity, outlines some embodiments of the flip control method of this application. Where the embodiments do not conflict, the following embodiments and features thereof can be combined with each other.
[0062] This application provides a flipping control method. Figure 2 A flowchart illustrating a flip control method provided in this application embodiment. Figure 1 ,like Figure 2 As shown, the method in this application embodiment includes:
[0063] S201. Based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped, determine the dynamic compensation amount.
[0064] Among them, the flipping plate is a tooling component used to support and limit the target to be flipped, and can rotate and flip around its own fixed rotation axis; the flipping angle is the deflection angle of the flipping plate relative to the initial reference position at any time during the flipping process; the target to be flipped is a sheet-shaped workpiece that needs to cooperate with the flipping plate to complete the rotation opening and closing process; the eccentricity parameter is the position offset characteristic parameter formed by the fact that the rotation center of the flipping plate and the rotation center of the target to be flipped do not coincide with each other.
[0065] In this embodiment, aluminum-plastic film in the manufacturing process of soft-pack batteries is used as a typical target to be flipped for illustrative purposes. Specifically, the flipping angle can be obtained in real time by the encoder built into the rotating servo motor that drives the flipping plate, or it can be calculated by the controller based on the servo running speed and running time; the eccentricity parameter is obtained by multi-cycle distance sampling by the distance measuring sensor deployed on the flipping plate, and after removing extreme values and taking the average value for filtering, it is calculated and calibrated.
[0066] More specifically, in production conditions, when the fixture carries the stamped aluminum-plastic film to the flipping station, the aluminum-plastic film is in a closed, stacked state, with the grooves on both sides of the film aligned with each other. The fixture uses its built-in vacuum suction cup to firmly adsorb and position the aluminum-plastic film. At this time, the flipping plate, the aluminum-plastic film, and the fixture on the station maintain an initial reference posture that is parallel to each other. After the station is positioned, the flipping plate moves down and approaches the aluminum-plastic film, adhering to it with its built-in vacuum suction cup. Subsequently, the rotating servo motor drives the flipping plate to rotate around a fixed rotation axis, realizing the opening and closing flipping of the aluminum-plastic film. During the operation of the rotating servo motor, its built-in encoder feeds back pulse signals to the electronic equipment in real time. The electronic equipment calculates the current flipping angle of the flipping plate in real time by analyzing the pulse signals.
[0067] More specifically, when the flip plate and the aluminum-plastic film are adsorbed and bonded, the distance sensor installed on the flip plate collects the reference distance information and transmits it to the electronic device; the electronic device summarizes multiple sets of distance data within a collection cycle, removes the maximum and minimum values, calculates the average value of the remaining valid data, and then combines it with the reference dimensions of the tooling mechanical structure to calculate the eccentricity parameter between the flip plate and the aluminum-plastic film, thus completing the on-site calibration and acquisition of the eccentricity parameter.
[0068] In practical applications, the target to be flipped can also be paper packaging film, plastic packaging film, various sheet-shaped precision workpieces, and other components that need to be rotated, opened, and flipped. The flipping angle can also be acquired by independent angle sensors, grating rulers, or visual positioning methods. The eccentricity parameter can also be obtained by manual measurement, calibration, recording, visual inspection and calculation, or tooling preset parameter assignment. This embodiment does not limit this.
[0069] In this embodiment, the electronic device determines the predicted stretching length of the target to be flipped during the flipping process based on the flipping angle and eccentricity parameters; and determines the dynamic compensation amount corresponding to each flipping angle based on the predicted stretching length and the preset maximum allowable stretching length.
[0070] The eccentricity parameters include horizontal and vertical eccentricity, taking the initial reference state where the flipping plate has completed adsorption and bonding with the aluminum-plastic film but has not yet started flipping as a reference: the horizontal eccentricity is the fixed position offset between the rotation center of the flipping plate and the rotation center of the aluminum-plastic film in the direction parallel to the surface of the aluminum-plastic film in this initial reference state; the vertical eccentricity is the fixed position offset between the rotation center of the flipping plate and the rotation center of the aluminum-plastic film in the vertical height direction perpendicular to the surface of the aluminum-plastic film in this initial reference state; the horizontal and vertical eccentricities are orthogonal to each other, and together they constitute the total eccentricity between the flipping plate and the aluminum-plastic film; the horizontal and vertical eccentricities are obtained by multi-cycle sampling of the station distance by the distance measuring sensor on the flipping plate, removing extreme values and taking the average value, and can be calibrated and flexibly replaced according to the actual measurement of the on-site equipment structure.
[0071] Specifically, a geometric relationship is established based on the horizontal eccentricity, vertical eccentricity, and real-time flip angle. The predicted stretch length of the aluminum-plastic film at the corresponding flip angle is obtained by solving the preset stretch length calculation formula. The stretch length changes regularly with the flip angle in the range of 0°-180°. When the eccentricity is fixed, the larger the flip angle, the larger the predicted stretch length is. The total eccentricity is obtained by taking the square root of the sum of the squares of the horizontal eccentricity and the vertical eccentricity. Combined with the cosine relationship of the flip angle, the theoretical stretch amount of the aluminum-plastic film caused by the eccentric rotation can be calculated angle by angle.
[0072] As an explanation, Figure 3A A schematic diagram of the principle of a flip control method provided in this application embodiment. Figure 1 ,like Figure 3A As shown, assuming the vertical eccentricity between the flip plate and the aluminum-plastic film is H and the horizontal eccentricity is X, based on the Pythagorean theorem, the total eccentricity D can be obtained as D = Furthermore, based on the law of cosines, and combining the total eccentricity and the flipping angle θ, the predicted stretching length can be obtained. It should be understood that, Figure 3A The θ shown is specifically the rotation angle of the line connecting the two rotation centers, which is essentially the same as the actual flip angle of the flip plate.
[0073] In practical applications, the total eccentricity can be obtained by combining the horizontal and vertical eccentricities using the Pythagorean theorem, or it can be directly measured and calibrated using the tooling reference dimensions. The predicted stretching length can be calculated using the cosine theorem, or it can be solved by establishing a calculation model using other trigonometric geometric relationships such as the sine theorem and the trigonometric half-angle formula. Alternatively, the curve of the relationship between the flipping angle and the stretching length can be obtained in advance through simulation fitting, and the predicted stretching length under the corresponding flipping angle can be directly obtained by table lookup interpolation. The eccentricity parameter can be obtained by calculating the average value of multi-cycle sampling from the ranging sensor, or it can be obtained by visual imaging measurement, manual reference calibration and input, or preset values of equipment system parameters. This embodiment does not limit this method.
[0074] After obtaining the predicted stretch length, the electronic device determines the critical flip angle based on the predicted stretch length and the maximum allowable stretch length. Within the range where the flip angle is greater than the critical flip angle, the vertical position compensation is calculated angle by angle based on the geometric relationship between the horizontal eccentricity indicated by the eccentricity parameter, the vertical eccentricity, and the current flip angle, and is used as the dynamic compensation amount corresponding to the current flip angle. Within the range where the flip angle is not greater than the critical flip angle, zero is used as the dynamic compensation amount corresponding to the current flip angle.
[0075] The maximum allowable stretch length is a threshold pre-set based on the material extensibility, thickness physical properties of the aluminum-plastic film itself, and the deformation allowance allowed by the production process. This threshold is the upper limit of safe stretching of the aluminum-plastic film without tearing, ripping, or plastic deformation during the flipping process. It can be customized and modified according to different specifications and materials of aluminum-plastic film products.
[0076] Specifically, the electronic device substitutes the maximum allowable stretch length S into the calculation formula for the flip angle and the predicted stretch length L to obtain the critical flip angle. It should be understood that L ≤ S. Based on this, it is possible to obtain... The angle calculated when the aforementioned formula is equal is the critical flip angle.
[0077] As an example, if the vertical eccentricity H between the aluminum-plastic film and the flip plate is 36mm, the horizontal eccentricity X is 15mm, and the maximum allowable stretching length S of the aluminum-plastic film is 35mm, then when θ≥53.32°, L≥S, that is, 53.32° is taken as the critical flipping angle.
[0078] It should be understood that when the flip angle is less than or equal to the critical flip angle, the stretching of the aluminum-plastic film is within the process safety range and no position compensation is required. Therefore, in this embodiment, the electronic device sets the dynamic compensation amount to zero within the range where the flip angle is not greater than the critical flip angle. When the flip angle is greater than the critical flip angle, the stretching amount exceeds the safety allowable range. Using the horizontal eccentricity, vertical eccentricity and the current flip angle as inputs, the vertical position compensation amount is calculated by fitting the geometric relationship degree by degree, generating the vertical dynamic compensation amount corresponding to each flip angle, and establishing a compensation data table that corresponds one-to-one between the angle and the compensation amount, as the reference curve for subsequent electronic cam linkage control.
[0079] In practical applications, the critical flip angle can be obtained not only through inverse algebraic calculation of the formula, but also through simulation traversal fitting, experimental calibration sampling, interpolation lookup comparison, etc.; the dynamic compensation amount can be calculated by angle-by-angle geometric fitting of the vertical position compensation amount, and can also be generated by piecewise linear fitting, high-order curve fitting, finite element deformation simulation calibration, etc. to generate the angle-compensation amount correspondence; the maximum allowable tensile length can be set by preset fixed threshold based on material properties and process allowance, and can also be set by actual tensile test calibration, grouping and assigning parameters of different product models, online real-time adaptive correction, etc.; the compensation reference curve can be generated by point-by-point table building, and can also be fitted into a continuous function expression or piecewise function form for direct use in real-time calculation of the motion controller. This embodiment does not limit this.
[0080] For the example above, Figure 3B A schematic diagram of the principle of a flip control method provided in this application embodiment. Figure 2 , Figure 3C The third diagram illustrates the principle of a flipping control method provided in this application embodiment. If the predicted stretching length range is [0, 2D], then when D is 39mm, the following can be obtained: Figure 3B The curve shown represents the predicted stretch length L as a function of the flip angle θ, where the horizontal axis represents θ in the range of [0, π], and the vertical axis represents the predicted stretch length L.
[0081] Furthermore, as mentioned above, vertical compensation is required for θ within the range of [0°, 53.32°] and [53.32°, 180°]. In this case, the electronic device calculates this by substituting the maximum allowable stretching length S, the horizontal eccentricity X, and the various flip angles θ within the range of [53.32°, 180°] into the calculation formula. You can get something like this. Figure 3C The compensation curve shown indicates the dynamic compensation amount corresponding to each flip angle θ.
[0082] In this embodiment, a geometric correlation model is constructed based on the flip angle, horizontal eccentricity, and vertical eccentricity. The maximum allowable stretch length threshold is preset in combination with the material characteristics of aluminum-plastic film, and the critical flip angle is solved in reverse. Differentiated compensation is achieved by dividing the critical flip angle into zones. The compensation amount in the small angle range is set to zero to simplify the control logic and reduce unnecessary mechanical movements and wear. In the large angle range, the vertical position compensation amount is calculated point by point according to the real-time angle, which can accurately offset the stretch deformation caused by eccentric rotation. The safe deformation range of aluminum-plastic film can be accurately defined by quantitative modeling and zone judgment. The stretch amount during the flipping process is constrained from the theoretical level to effectively avoid problems such as tearing, plastic deformation, etc. of aluminum-plastic film. At the same time, the threshold and eccentricity parameters can be flexibly modified according to different materials and specifications of aluminum-plastic film to complete the adaptation calibration, reduce the error and cost caused by manual experience debugging, and improve process compatibility and production quality stability.
[0083] Furthermore, in practical applications, it is not necessary to calculate the predicted stretch length separately and then match the maximum allowable stretch length to determine the dynamic compensation amount. Alternatively, a mapping model between the flip angle, eccentricity parameter and compensation amount can be directly established, and the compensation value corresponding to each flip angle can be obtained directly through experimental calibration and simulation fitting. At the same time, the dynamic compensation amount is not limited to vertical compensation or a single direction. Horizontal and tilting compensation amounts can also be added according to the actual deformation to achieve multi-directional deformation deviation correction. This embodiment does not limit this.
[0084] For example, under the condition of large-angle flipping of aluminum-plastic film, due to the coupling effect of horizontal and vertical eccentricity, the aluminum-plastic film will not only experience vertical stretching and offset, but also simultaneously experience horizontal lateral offset and shear offset caused by spatial tilt angle. Among them, the horizontal lateral compensation dimension is obtained by geometrically calculating the change of horizontal eccentricity with the horizontal projection of the flipping angle. Based on the offset components of the two rotation centers in the horizontal direction of the film surface, combined with the sine and cosine trigonometric function relationship of the flipping angle, the required horizontal lateral position compensation is solved for each angle. The film surface tilt compensation dimension is derived from the spatial geometric angle formed by the total eccentricity and the flipping angle. Based on the spatial attitude deflection of the total eccentricity vector synthesized by the horizontal and vertical eccentricities during the flipping process, the real-time tilt angle of the film surface is calculated, and the compensation component required for tilt attitude correction is calculated accordingly.
[0085] Based on this, horizontal and transverse compensation components and membrane tilt compensation components can be simultaneously superimposed on the original vertical position compensation, and three-dimensional independent compensation amounts can be calculated for each flip angle. When the equipment is running, the multi-dimensional compensation amounts are called simultaneously to coordinate and correct the spatial position and attitude, and to fully offset the tensile, misalignment and shear composite deformation caused by eccentric rotation. This makes up for the limitation that single vertical compensation cannot eliminate multi-directional spatial deformation. Any dimension or multi-dimensional combination compensation can be flexibly activated according to the equipment installation deviation and the specifications of aluminum-plastic film material, adapting to the high-precision flipping process requirements under complex working conditions.
[0086] Furthermore, as a preferred example, after obtaining the dynamic compensation amount through the above method, the electronic device adjusts the dynamic compensation amount according to the material properties of the target to be flipped; the material properties include at least one of thickness, ductility, and elastic modulus.
[0087] Specifically, the electronic device pre-stores material correction coefficients corresponding to different thicknesses, ductility, and elastic moduli. It uses the dynamic compensation amount obtained from the initial geometric solution as the benchmark compensation value and matches the corresponding material correction coefficients based on the thickness parameters, ductility level, and elastic modulus values of the target to be flipped.
[0088] More specifically, the dynamic compensation amount corresponding to each flipping angle is scaled up or fine-tuned segmentally by multiplying the baseline compensation value by the material correction coefficient or by segmenting and weighting the correction. For aluminum-plastic films with greater thickness and stronger rigidity, a larger correction coefficient is used to appropriately increase the compensation amount to offset rigid deformation; for aluminum-plastic films with better ductility and higher flexibility, a smaller correction coefficient is used to appropriately reduce the compensation amount to avoid over-compensation causing wrinkles and deformation; for products with different elastic moduli, the compensation value is corrected segmentally according to the elastic deformation rebound characteristics to ensure that the compensation amount is accurately matched with the deformation adaptation characteristics of the material itself.
[0089] The material properties of the target to be flipped can be obtained through any of the following methods: manual input, external detection equipment acquisition and identification, or retrieval from the system's preset material parameter library. The manual input method involves the operator manually entering parameters such as thickness and material type into the controller interface according to the specifications of the production material. The external detection equipment acquisition and identification method relies on a thickness detector and a physical property sensor to detect the aluminum-plastic film in real time and automatically upload the material property data. The system's preset material parameter library retrieval method directly matches the pre-stored material property parameters according to the selected material code.
[0090] By adjusting the dynamic compensation amount according to the material properties, the physical deformation properties of the material itself can be further incorporated on the basis of geometric theoretical compensation. This compensates for the compensation deviation caused by material differences that are not considered in pure geometric modeling, making the compensation amount more in line with the actual deformation law of aluminum-plastic film of different specifications. In addition, based on this, it is not necessary to rebuild the geometric calculation model for each material specification. Adaptation and adjustment can be completed simply by calling the corresponding material correction coefficient, which greatly reduces the workload of new product process modeling and debugging. At the same time, it can accurately adapt to the production switch of aluminum-plastic film of different thicknesses, ductility, and elastic modulus, improve the accuracy and versatility of compensation control, and further reduce the adverse risks such as flipping damage, wrinkles, and plastic deformation from the material adaptation level, thus stabilizing the batch production quality.
[0091] In this embodiment, a geometric calculation logic is first established based on the eccentricity parameter and the flipping angle to solve and predict the stretching length. Then, the maximum allowable stretching length is set as the judgment criterion by combining the material properties of aluminum-plastic film and process constraints. This constructs a complete, quantifiable, and traceable compensation amount generation logic, breaking away from the traditional extensive mode of relying on manual trial and error to set compensation parameters. The entire calculation logic architecture has a high degree of modularity. Only the eccentricity parameter and the allowable stretching threshold of the material need to be changed to adapt to production scenarios of different specifications and materials without modifying the core algorithm framework. This results in high flexibility in equipment and process adaptation. At the same time, this method reserves multi-dimensional compensation expansion space, which can flexibly expand the compensation direction according to the actual eccentric deformation characteristics to adapt to the deformation correction needs under complex working conditions. This provides accurate and standardized compensation data support for subsequent motion control, which is conducive to improving product processing consistency and industrial mass production adaptability.
[0092] S202. Based on the preset motion path and dynamic compensation amount, control the flipping plate to drive the target to be flipped to complete the flipping.
[0093] The preset motion path is a continuously changing trajectory of angles pre-planned to adapt to the flexible flipping process of aluminum-plastic film. It limits the range of angle changes, the start and end positions of the motion, and the overall motion direction of the flipping plate from the initial horizontal adsorption station to the final flipping station. The preset motion path limits the overall flipping stroke range of the flipping plate to cover the flipping angle required by the process from 0° to 180°. The path trend conforms to the motion requirements of aluminum-plastic film without impact and with a smooth transition, providing a reference motion constraint for subsequent segmented angle compensation and continuous motion control.
[0094] In this embodiment, the electronic device first determines multiple preset flip angles according to a preset motion path; during the process of controlling the flip plate to flip the target to be flipped, the flip plate is adjusted according to the corresponding dynamic compensation amount each time a preset flip angle is reached.
[0095] Specifically, in this embodiment, points are uniformly intercepted within the overall angle range of the preset motion path at fixed angle intervals (e.g., 1°). Using the preset angle step size as the dividing benchmark, several equally spaced preset flip angles are obtained in sequence, thereby achieving uniform discrete point selection for the entire flip motion path.
[0096] In practical applications, in addition to being evenly divided according to fixed angle intervals, multiple preset flip angles can also be determined by non-uniformly dense point selection based on the degree of deformation sensitivity. Points can be densely selected in the range near the critical flip angle and in the range where the rate of change of tensile deformation is large, and sparsely selected in the range where the deformation change is slow. Alternatively, the nodes can be customized according to the resolution of the equipment servo control and the accuracy requirements of the process control. This embodiment does not limit this.
[0097] In addition, in practical applications, multiple preset flip angles can be determined without discrete division, and the fixed-point segmented compensation mode can be avoided. Instead, full-angle continuous real-time calculations can be performed along the preset motion path, and the corresponding dynamic compensation amount can be matched according to the instantaneous flip angle collected in real time to achieve uninterrupted continuous compensation control. This embodiment does not limit this.
[0098] It should be understood that in practical applications, electronic devices can also pre-synthesize the angle trajectory of the preset motion path and the dynamic compensation amount corresponding to each flip angle before the flipping action is executed, and generate a compensated motion path containing both angle and position constraints. This compensated motion path directly defines the target vertical position corresponding to each flip angle of the flipping plate. The electronic device can directly drive the servo system to perform continuous motion according to the synthesized path without having to retrieve the compensation amount for adjustment in real time during the flipping process.
[0099] In this embodiment, by dividing the preset motion path into multiple preset flip angles for fixed-point compensation, the continuous flip motion is decomposed into a segmented node control method. The control logic is simple and clear, and easy for the servo system to recognize and execute. In addition, the fixed-point matching is adjusted according to the corresponding dynamic compensation amount, and the compensation action is accurately aligned with minimal interference, which can avoid the control computing power consumption caused by continuous calculation throughout the process. At the same time, the segmented fixed-point mode facilitates process debugging and parameter calibration, and the compensation amount of any angle node can be finely adjusted and optimized to adapt to the process calibration requirements of different product specifications.
[0100] As described above, in this embodiment, the electronic device first obtains the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped. Based on the flipping angle and eccentricity parameter, it determines the predicted stretching length of the target to be flipped during the flipping process. Then, based on the predicted stretching length and the preset maximum allowable stretching length, it determines the dynamic compensation amount at the corresponding flipping angle. Based on this dynamic compensation amount, when controlling the flipping plate to flip, the electronic device, in conjunction with a preset motion path, controls the flipping plate to complete the flipping operation of the target to be flipped.
[0101] In the method provided in this embodiment, the tensile deformation is quantitatively predicted based on the eccentricity and the flipping angle. A matching dynamic compensation amount is generated based on the tensile safety threshold. Combined with the reference motion path, integrated flipping control is implemented. This method can adapt to the influence of eccentric rotation caused by eccentric installation deviation. It can accurately offset the additional tensile deformation generated during the flipping process from the control level, avoiding the problem of tensile damage, tearing and plastic deformation of the target to be flipped. The overall solution does not need to rely on manual experience to roughly adjust the compensation parameters. It automatically generates the compensation amount by relying on parameter quantitative modeling. It can adapt to the production switch of products to be flipped with different specifications and materials. The process has strong portability and is conducive to improving production yield and batch quality consistency.
[0102] As a further explanation, Figure 4 A flowchart illustrating a flip control method provided in this application embodiment. Figure 2 This is used to provide a detailed explanation of the process of controlling the flip panel to rotate in electronic devices. For example... Figure 4 As shown, the method in this embodiment includes:
[0103] S401. Based on a preset motion path, control the rotation servo device to drive the target to be flipped to perform a flipping motion.
[0104] S402. Each time a preset flip angle is reached, the lifting servo device is controlled to adjust the position of the flip plate based on the dynamic compensation amount corresponding to the preset flip angle.
[0105] In this embodiment, the electronic device sends operation control commands to the rotary servo device according to a preset motion path, controlling the rotary servo device to autonomously complete the rotation angle movement according to a predetermined stroke and motion law. The electronic device does not make any additional modifications or replanning to the original motion trajectory, speed, and running rhythm of the rotary servo device. During the operation of the rotary servo device, the electronic device collects the current actual rotation angle in real time and monitors whether the rotary servo device has reached each preset rotation angle. When any preset rotation angle is detected, the electronic device retrieves the pre-matched dynamic compensation amount for that angle and sends the corresponding position adjustment command to the lifting servo device, controlling the lifting servo device to synchronously complete the vertical position compensation adjustment of the rotating plate, so that the compensation adjustment action of the lifting servo device is executed synchronously with the rotation control process of the rotary servo device by the electronic device.
[0106] As a preferred example, during the process of controlling the flip plate to flip the target to be flipped, the rotary servo device and the lifting servo device are in an electronic cam coupled linkage state; wherein, the rotary servo device is the main shaft of the electronic cam, and the lifting servo device is the follower shaft of the electronic cam.
[0107] Specifically, the electronic device is equipped with electronic cam function logic, which sets the controlled and normally operating rotary servo device as the electronic cam spindle, and presets the correspondence between the pre-built flip angle and the dynamic compensation amount as the electronic cam profile curve. The electronic device reads the angular position of the rotary servo device as the spindle in real time, and based on the built-in electronic cam profile curve, automatically calculates and outputs the corresponding slave axis position command according to the real-time angle of the spindle, driving the lifting servo device as the slave axis to synchronously perform position compensation as the spindle angle changes. There is no need for the electronic device to separately perform time-sharing logic scheduling and timing programming for the two servos.
[0108] In practical applications, electronic devices can achieve synchronous linkage between rotary servo devices and lifting servo devices. In addition to using electronic cam coupling control, this can also be achieved through software control methods such as issuing synchronous pulse commands, position closed-loop following triggering, and fixed timing cycle scheduling. Alternatively, external mechanical linkage structures can be used to constrain the synchronous movement of the two axes. As long as the compensation action of the lifting servo device can be synchronously responded to in the rotation process of the rotary servo device, this embodiment does not impose any limitations on this.
[0109] In addition, in practical applications, in addition to controlling the rotary servo device in conjunction with the lifting servo device to achieve flipping and compensation, electronic devices can also drive other drive units such as multi-axis linear motors, stepper motor combinations or single servo linkage mechanical compensation mechanisms to achieve the same flipping operation and position compensation function. This embodiment does not limit this.
[0110] In this embodiment, the electronic device adopts a dual-axis collaborative control logic. It only needs to control the rotating servo device to complete the main body flipping according to the preset motion path, and then dispatch the lifting servo device to make position correction based on the real-time angle point matching dynamic compensation amount. The overall control logic is clearly layered and has a small computational burden. At the same time, there is no need to modify the motion control logic of the existing rotating servo device. Deformation compensation can be achieved simply by adding angle acquisition and compensation command issuance. It can be compatible with the existing equipment control architecture, and the process debugging and program porting are highly convenient.
[0111] In this embodiment, the electronic device achieves dual-axis synchronous control by relying on the electronic cam coupling linkage mode. The rotary servo device is the main axis reference and the lifting servo device is the follower axis. It automatically completes the real-time matching and interpolation of angle and compensation position by relying on the preset contour curve. There is no need for the electronic device to frequently perform timing judgment and issue commands one by one. The two-axis motion synchronization accuracy is high, the response delay is small, the motion transition is smooth and shock-free, and it can accurately match the compensation requirements corresponding to each flip angle, which is suitable for the high precision and high stability control requirements of the aluminum-plastic film flexible flipping process.
[0112] It should be understood that in actual pouch battery manufacturing scenarios, there is often a vertical or horizontal gap between the flipping plate and the aluminum-plastic film-type target to be flipped in the initial state. They are not naturally aligned and cannot be directly adsorbed and flipped. Therefore, in this embodiment, before controlling the flipping plate to flip the target, the electronic device needs to move the flipping plate to the adsorption position. Taking the vertical gap between the flipping plate and the aluminum-plastic film as an example, the electronic device controls the flipping plate to move to the adsorption position of the target based on the distance between them.
[0113] The adsorption position is a preset alignment position where the suction cups on the flipping plate can accurately adhere to and reliably adsorb the target to be flipped. This position satisfies the prerequisite that the flipping plate and the target to be flipped are parallel to each other, ensuring that the suction cups are subjected to uniform adsorption force and avoiding problems such as local pressure deformation, adsorption displacement, or weak adsorption caused by tilted alignment. This provides a structural alignment basis for subsequent smooth flipping.
[0114] Specifically, a distance sensor is deployed at the edge of the flipping plate or around the suction cup to collect the relative distance between the flipping plate and the target to be flipped in real time. The electronic device detects the real-time distance data between the two through the distance sensor, removes outliers after multiple consecutive samplings, and calculates the average value to obtain the accurate actual distance. The electronic device compares the measured distance with the preset standard alignment distance, generates a translation adjustment command based on the difference, and controls the flipping plate to make vertical or horizontal translation feeds until the measured distance matches the preset standard alignment distance, and determines that the flipping plate has reached the adsorption position of the target to be flipped.
[0115] More specifically, in this embodiment, 1 second is taken as a complete sampling period. The ranging sensor continuously collects the distance signal between the flipping plate and the target to be flipped at a single sampling time interval of 0.1 seconds, and uploads the collected real-time distance data to the electronic device in real time. The electronic device collects 10 sets of distance data in one sampling period and stores the 10 sets of distance data in a REAL array. The electronic device performs calculations on the 10 sets of distance data in the array, removes the maximum and minimum values of all data, and then calculates the average value of the remaining 8 sets of valid data after removing the extreme values, and stores the average value result. This average value is the distance that the lifting servo device needs to move downward to move the flipping plate closer to the aluminum-plastic film. The electronic device issues a control command based on the calculated moving distance to drive the lifting servo device to move the flipping plate to the adsorption position corresponding to the target to be flipped.
[0116] In this embodiment, the electronic device independently drives the flipping plate to complete the vertical displacement adjustment to reach the adsorption position through the same lifting servo device configured in the flipping compensation process described above. During this stage, the lifting servo device and the rotary servo device do not enter the electronic cam coupling linkage state. The electronic device sends a fixed-point displacement command to the lifting servo device alone and only performs the vertical short-distance feed alignment action. It does not need to follow the angular trajectory of the rotary servo device to perform synchronous following motion, so as to realize the time-sharing independent control of the two working conditions of alignment and subsequent flipping compensation.
[0117] In practical applications, the servo mechanism used to drive the alignment movement of the flipping plate can also be set as an independent power unit from the lifting servo device in the flipping compensation process. When there is a horizontal offset between the flipping plate and the target to be flipped, an additional horizontal servo mechanism can be configured. The electronic device controls the horizontal servo to move the flipping plate laterally based on the horizontal offset detected, so that the flipping plate and the target to be flipped are positioned facing each other on the horizontal plane. Then, the vertical servo is used to complete the height alignment. Furthermore, if the flipping plate is not in a horizontal position in the initial state, the electronic device can first control the rotation servo device to adjust the flipping plate to a horizontal position to ensure that it is parallel to the target to be flipped before executing the distance detection and alignment translation process. This embodiment does not impose any limitations on this.
[0118] After the flipping plate reaches the adsorption position, the electronic device controls the suction cup on the flipping plate to adsorb the target to be flipped. When the vacuum negative pressure value of the suction cup reaches the preset vacuum threshold and it is determined that the target to be flipped is reliably clamped and fixed, the flipping plate is controlled to flip according to the control method of the aforementioned embodiment.
[0119] After the flipping plate rotates the target to be rotated into position, the electronic equipment controls the flipping plate to rotate the target in the opposite direction based on the preset motion path and dynamic compensation amount, so as to adapt to the subsequent process.
[0120] Among them, "flipping into position" means that the flipping plate drives the aluminum-plastic film to flip to the preset process station angle and designated placement position. After flipping into position, the station status needs to be checked to confirm that the battery core has been accurately placed and stored in the forming groove of the aluminum-plastic film, and that the relative position of the core and the aluminum-plastic film is not offset or misaligned. After meeting the requirements of the pre-packaging process, the reverse flipping action is then performed.
[0121] Specifically, when performing the reverse flipping action, the electronic device reuses the pre-planned preset motion path and the dynamic compensation amount corresponding to each flipping angle. Taking the flipped position as the starting point, it generates a reverse motion path in reverse according to the original flipping angle trajectory. It controls the rotation servo device to rotate in the opposite direction along the original flipping angle, while the lifting servo device still matches the dynamic compensation amount under the corresponding reverse angle to synchronously perform position compensation adjustment. Following the original partition compensation logic and servo linkage control mode, it smoothly completes the reverse reset flipping of the aluminum-plastic film.
[0122] It should be understood that subsequent processes mainly include forming and processing steps such as aluminum-plastic film folding, heat sealing, side cutting, electrolyte injection, and formation and settling of soft-pack batteries. After reversing and resetting, the aluminum-plastic film can return to its initial reference posture and adapt to the continuous operation rhythm of the subsequent automated production line.
[0123] In this embodiment, the flipping plate and the target to be flipped are first precisely aligned by distance detection and alignment translation to ensure the reliability and uniformity of suction cup adsorption, thus avoiding adsorption deviation and local pressure damage to the aluminum-plastic film from the source. The distance is quantitatively obtained by the distance sensor and the alignment position is automatically adjusted without manual alignment adjustment, resulting in a high degree of automation and stable alignment accuracy. At the same time, the adsorption locking state is determined by the vacuum negative pressure threshold to avoid material falling off and poor positioning caused by flipping before the adsorption is tight.
[0124] In this embodiment, after the core is flipped into place, a core insertion status detection is added to ensure the compliance of the pre-assembly process. Combined with the original motion path and dynamic compensation, a smooth reverse flip is achieved. The motion compensation is consistent throughout the process, effectively avoiding stretching, wrinkling and deformation damage during the aluminum-plastic film resetting process. The overall process is compact and adaptable to the continuous production of soft-pack batteries in automated production lines, which can improve the processing yield and the stability of equipment operation cycle.
[0125] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that this application is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to this application. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.
[0126] It should be further noted that although the steps in the flowchart are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.
[0127] The above embodiments introduce a flip control method from the perspective of process flow. The following embodiments introduce a flip control device from the perspective of virtual module or virtual unit. For details, please refer to the following embodiments.
[0128] This application also provides a flipping control device for implementing the method described in the above method embodiments. Figure 5 This is a schematic diagram of the structure of a flipping control device provided in an embodiment of this application, as shown below. Figure 5 As shown, in this embodiment, the training device for the direction-finding model may include:
[0129] The determination module 51 is used to determine the dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped.
[0130] The control module 52 is used to control the flipping plate to drive the target to be flipped to complete the flipping based on the preset motion path and dynamic compensation amount.
[0131] In one possible implementation of this application embodiment, the control module 52 is specifically used for:
[0132] Based on the preset motion path, multiple preset flip angles are determined;
[0133] During the process of controlling the flipping plate to flip the target to be flipped, the flipping plate is adjusted according to the corresponding dynamic compensation amount every time a preset flipping angle is reached.
[0134] In one possible implementation of this application embodiment, the control module 52 is specifically used for:
[0135] Based on a preset motion path, the rotation servo device is controlled to drive the target to be flipped to perform a flipping motion.
[0136] At each preset flip angle, the lifting servo device is controlled to adjust the position of the flip plate based on the dynamic compensation amount corresponding to the preset flip angle.
[0137] In one possible implementation of this application, during the process of controlling the flipping plate to drive the target to be flipped to flip, the rotary servo device and the lifting servo device are in an electronic cam coupled linkage state; wherein, the rotary servo device acts as the main axis of the electronic cam, and the lifting servo device acts as the slave axis of the electronic cam to follow the movement.
[0138] In one possible implementation of this application embodiment, the determining module 51 is specifically used for:
[0139] Based on the flipping angle and eccentricity parameters, the predicted stretching length of the target to be flipped during the flipping process is determined.
[0140] Based on the predicted stretch length and the preset maximum allowable stretch length, determine the dynamic compensation amount corresponding to each flipping angle.
[0141] In one possible implementation of this application embodiment, the determining module 51 is specifically used for:
[0142] The critical flip angle is determined based on the predicted stretch length and the maximum allowable stretch length.
[0143] Within the range where the flip angle is greater than the critical flip angle, the vertical position compensation is calculated angle by angle based on the geometric relationship between the horizontal eccentricity, vertical eccentricity indicated by the eccentricity parameter and the current flip angle, and is used as the dynamic compensation for the current flip angle.
[0144] Within the range where the flip angle is no greater than the critical flip angle, zero is used as the dynamic compensation amount corresponding to the current flip angle.
[0145] In one possible implementation of this application embodiment, the control module 52 is further configured to:
[0146] Before the flipping plate drives the target to flip to flip, based on the distance between the flipping plate and the target to flip, the flipping plate is controlled to move to the adsorption position of the target to flip.
[0147] And / or, after the target to be flipped is flipped into place, based on the preset motion path and dynamic compensation amount, the flipping plate is controlled to drive the target to be flipped in the opposite direction to adapt to the subsequent process.
[0148] And / or, adjust the dynamic compensation amount according to the material properties of the target to be flipped; the material properties include at least one of thickness, ductility, and elastic modulus.
[0149] It should be understood that the above-described device embodiments are merely illustrative, and the device of this application can also be implemented in other ways. For example, the division of units / modules in the above embodiments is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units, modules, or components may be combined, or integrated into another system, or some features may be ignored or not executed.
[0150] This application provides an electronic device. Figure 6 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application, such as... Figure 6 As shown, Figure 6 The illustrated electronic device includes at least one processor 61 and a memory 62. The processor 61 and the memory 62 are connected, for example, via a bus 63. Optionally, the electronic device may also include a transceiver 64. It should be noted that in practical applications, the transceiver 64 is not limited to one, and the structure of this electronic device does not constitute a limitation on the embodiments of this application.
[0151] Processor 61 may be a central processing unit (CPU), a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It may implement or execute the various exemplary logic blocks, modules, and circuits described in conjunction with the disclosure of this application. Processor 61 may also be a combination that implements computational functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, etc.
[0152] Bus 63 may include a pathway for transmitting information between the aforementioned components. Bus 63 may be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. Bus 63 may be divided into address bus, data bus, control bus, etc. For ease of representation, Figure 6 The bus is represented by a single thick line, but this does not mean that there is only one bus or one type of bus.
[0153] The memory 62 may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CD-ROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disk storage media or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto.
[0154] The memory 62 stores computer execution instructions for implementing the scheme of this application, and the processor 61 controls the execution. The processor 61 executes the computer execution instructions stored in the memory 62 to implement the content shown in the foregoing method embodiments.
[0155] This application also provides a computer-readable storage medium, which may include various media capable of storing program code, such as a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk. Specifically, the computer-readable storage medium stores computer-executable instructions, which are used to implement the methods in the above embodiments.
[0156] This application embodiment also provides a flipping control system, the system including a flipping plate and electronic equipment; the electronic equipment is configured to perform: determining a dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped; and controlling the flipping plate to drive the target to be flipped to complete the flipping based on a preset motion path and the dynamic compensation amount.
[0157] Furthermore, the system also includes a lifting servo device and a rotating servo device, with electronic devices communicating and controlling with the rotating servo device and the lifting servo device respectively; wherein, the rotating servo device is connected to the flipping plate and is used to drive the flipping plate to perform normal flipping motion along a preset motion path; the lifting servo device is connected to the flipping plate and is used to adjust the vertical position of the flipping plate according to the dynamic compensation amount when the rotating servo device drives the flipping plate to perform normal flipping motion along the preset motion path.
[0158] Specifically, the lifting servo device includes a lifting servo motor and a corresponding lifting module, while the rotation servo device includes a rotation servo motor and a corresponding rotation module. The lifting module is a mechanical transmission and guiding load-bearing structure that works in conjunction with the lifting servo motor, converting the rotational motion of the lifting servo motor into linear lifting displacement, providing stable vertical guidance and precise feed support for the tilting plate. The rotation module is a rotary load-bearing transmission structure matched with the rotation servo motor, transmitting the power of the rotation servo motor to the tilting plate, causing the tilting plate to rotate and tilt along a preset angle trajectory, while simultaneously providing structural limits and attitude maintenance for the tilting plate during rotation.
[0159] As an example, Figure 7 This is a schematic diagram of a flipping control system provided in an embodiment of this application, as shown below. Figure 7As shown, the flipping control system includes a flipping plate, electronic equipment, lifting servo device, rotation servo device, aluminum-plastic film clamp, distance sensor, and vacuum suction cup. The aluminum-plastic film clamp is used to fix and limit the aluminum-plastic film to be processed, so that the aluminum-plastic film maintains a fixed posture and reference position, providing a reference for the precise alignment of the flipping plate. The distance sensor is installed on the edge of the flipping plate or around the vacuum suction cup to detect the relative distance between the flipping plate and the aluminum-plastic film in real time and upload the distance detection signal to the electronic equipment. The vacuum suction cup is assembled on the adsorption working surface of the flipping plate to firmly fix the aluminum-plastic film by negative pressure adsorption after the flipping plate reaches the adsorption position.
[0160] Based on the above system, during the processing of pouch batteries, the distance data between the flipping plate and the aluminum-plastic film is first collected in real time by a distance sensor and uploaded to an electronic device. After sampling, filtering, and averaging the distance data, the electronic device controls the lifting servo device to move the flipping plate vertically to an adsorption position parallel and directly opposite the aluminum-plastic film. Subsequently, a vacuum suction cup generates negative pressure to adsorb the aluminum-plastic film. After the vacuum negative pressure reaches a preset threshold and the adsorption is deemed secure, the electronic device controls the rotation servo device to drive the flipping plate to perform a regular flipping motion along a preset motion path. At the same time, the electronic device determines the corresponding dynamic compensation amount based on the real-time flipping angle and eccentricity parameters, and controls the lifting servo device to synchronously complete the vertical position compensation adjustment following the flipping process, achieving precise compensation for the stretching deformation of the aluminum-plastic film during the flipping process. After flipping to the correct position, the system can control the flipping plate to reverse and reset according to process requirements, adapting to subsequent automated processing steps of pouch batteries.
[0161] The above system relies on electronic devices to coordinate and manage various functional components. The rotary servo device is responsible for the main body flipping drive, and the lifting servo device is responsible for dynamic position compensation, so as to realize the coordinated cooperation between flipping motion and compensation motion. Automatic alignment and distance measurement are realized with the help of distance measuring sensors, reliable material adsorption is realized with vacuum suction cups, and material reference limit is realized with aluminum-plastic film clamps. The whole system has a regular structure and strong functional modularity.
[0162] Meanwhile, the system can automatically adapt to the eccentric installation deviation between the flip plate and the aluminum-plastic film, and correct the vertical position in real time by quantitatively solving the dynamic compensation amount. This effectively offsets the problems of stretching, misalignment and plastic deformation of the aluminum-plastic film caused by eccentric rotation, reduces the reliance on manual adjustment, and improves the alignment accuracy and motion stability of the flipping operation. The whole system has a high degree of automation and integration, can be adapted to the processing and production of aluminum-plastic film of different specifications and materials, has strong adaptability to working conditions and stability in batch production, and can effectively improve the yield of soft-pack battery processing.
[0163] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the technical solution of the above method embodiments. Its implementation principle and technical effects are similar, and will not be repeated here.
[0164] In the above embodiments, the descriptions of each embodiment have their own emphasis. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments. The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification.
[0165] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.
[0166] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A flipping control method, characterized in that, The method includes: The dynamic compensation amount is determined based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped. Based on the preset motion path and the dynamic compensation amount, the flipping plate is controlled to drive the target to be flipped to complete the flipping.
2. The method according to claim 1, characterized in that, The step of controlling the flipping plate to rotate the target to be rotated based on the preset motion path and the dynamic compensation amount includes: Based on the preset motion path, multiple preset flip angles are determined; During the process of controlling the flipping plate to flip the target to be flipped, the flipping plate is adjusted according to the corresponding dynamic compensation amount every time a preset flipping angle is reached.
3. The method according to claim 1 or 2, characterized in that, The step of controlling the flipping plate to rotate the target to be rotated based on the preset motion path and the dynamic compensation amount includes: Based on the preset motion path, the rotation servo device is controlled to drive the target to be flipped to perform a flipping motion; At each preset flip angle, the lifting servo device is controlled to adjust the position of the flip plate based on the dynamic compensation amount corresponding to the preset flip angle.
4. The method according to claim 3, characterized in that, During the process of controlling the flipping plate to flip the target to be flipped, the rotary servo device and the lifting servo device are in an electronic cam coupled linkage state; wherein, the rotary servo device is the main axis of the electronic cam, and the lifting servo device is the follower axis of the electronic cam.
5. The method according to any one of claims 1-4, characterized in that, The determination of the dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped includes: Based on the flipping angle and the eccentricity parameter, the predicted stretching length of the target to be flipped during the flipping process is determined; Based on the predicted stretch length and the preset maximum allowable stretch length, the dynamic compensation amount corresponding to each of the flip angles is determined.
6. The method according to claim 5, characterized in that, The step of determining the dynamic compensation amount corresponding to each of the flipping angles based on the predicted stretching length and the preset maximum allowable stretching length includes: The critical flip angle is determined based on the predicted stretch length and the maximum allowable stretch length. Within the range where the flip angle is greater than the critical flip angle, based on the geometric relationship between the horizontal eccentricity, vertical eccentricity and the current flip angle indicated by the eccentricity parameter, the vertical position compensation is calculated angle by angle and used as the dynamic compensation corresponding to the current flip angle. Within the range where the flip angle is not greater than the critical flip angle, zero is used as the dynamic compensation amount corresponding to the current flip angle.
7. The method according to any one of claims 1-3, characterized in that, The method further includes: Before controlling the flipping plate to flip the target to be flipped, based on the distance between the flipping plate and the target to be flipped, control the flipping plate to move to the adsorption position of the target to be flipped; And / or, after the target to be flipped is flipped into place, based on the preset motion path and the dynamic compensation amount, the flipping plate is controlled to drive the target to be flipped in the opposite direction to adapt to the subsequent process; And / or, adjust the dynamic compensation amount according to the material properties of the target to be flipped; the material properties include at least one of thickness, ductility, and elastic modulus.
8. An electronic device, characterized in that, It includes at least one processor and a memory communicatively connected to the processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory to implement the method as described in any one of claims 1-7.
9. A flipping control system, characterized in that, The system includes a flip panel and electronic equipment; The electronic device is configured to perform: determining a dynamic compensation amount based on the flipping angle of the flipping plate and the eccentricity parameter between the flipping plate and the target to be flipped; Based on the preset motion path and the dynamic compensation amount, the flipping plate is controlled to drive the target to be flipped to complete the flipping.
10. According to claim 9, the characteristic is that, The system also includes a lifting servo device and a rotation servo device, and the electronic device is communicatively connected to the rotation servo device and the lifting servo device respectively. The rotary servo device is connected to the flipping plate and is used to drive the flipping plate to perform a conventional flipping motion along the preset motion path; The lifting servo device is connected to the flipping plate and is used to adjust the vertical position of the flipping plate according to the dynamic compensation amount when the rotating servo device drives the flipping plate to perform a normal flipping motion along the preset motion path.