PCB blanking device and PCB group blanking method

Abstract

The application discloses a PCB unloading device, which comprises a casing, a material taking bin, a paper separating bin, a board separating bin, an unloading track, a CCD camera, a mechanical arm and a controller arranged in the casing. The material taking bin is used for placing a PCB group to be unloaded. The paper separating bin and the board separating bin are respectively used for receiving paper between adjacent PCBs and a board on the top of the PCB group. The unloading track is used for receiving and transmitting the PCB. The suction mechanism is used for adsorbing and releasing the PCB / board / paper. The CCD camera is used for distinguishing the PCB / board / paper in the material taking bin. The mechanical arm is connected with the suction mechanism and drives the suction mechanism to move between the material taking bin, the paper separating bin, the board separating bin and the unloading track. The controller is in communication connection with the unloading track, the suction mechanism, the CCD camera and the mechanical arm. The PCB unloading device can place the PCB, the board and the paper in the PCB group on different containers or carriers, realizes automatic distribution of the PCB group, liberates manpower, greatly reduces distribution time, and improves work efficiency and success rate.

Description

Technical Field

[0001] This invention belongs to the field of automation equipment technology, specifically relating to a PCB blanking device and a PCB assembly blanking method. Background Technology

[0002] A PCB (Printed Circuit Board) is the support structure for electronic components and the carrier for electrical interconnection. Due to its thinness, multiple PCBs are often stacked for storage. For safety reasons, a partition is placed between two PCBs, and a divider is placed on top of the entire stack. This divider records information such as the number and model of the PCBs. However, when removing a PCB, the divider and the partition must be removed, which increases workload and reduces efficiency.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0004] The purpose of this invention is to provide a PCB unloading device to solve the problem of reduced material handling efficiency caused by separators and partitions.

[0005] To achieve the above objectives, a specific embodiment of the present invention provides a PCB unloading device, including a housing, a material picking bin, a paper separator waste bin, a partition waste bin, an unloading track, a CCD camera, a robotic arm, and a controller. The material picking bin is disposed within the housing and is used to hold PCB groups to be unloaded. The paper separator waste bin is disposed within the housing and is used to receive paper separators between adjacent PCBs. The partition waste bin is disposed within the housing and is used to receive partitions at the top of the PCB groups. The unloading track is disposed within the housing and is used to receive and transport PCBs. The adsorption mechanism includes a base plate, multiple PCB suction nozzles, and paper separator suction nozzles. A plurality of PCB suction nozzles are fixed around the base plate and a paper separator suction nozzle is fixed in the center of the base plate, connected to the robotic arm. An adsorption mechanism is disposed within the housing for adsorbing and releasing PCBs / separators / paper separators. A CCD camera is disposed within the housing for identifying PCBs / separators / paper separators within the material picking bin. The robotic arm is disposed within the housing and connected to the adsorption mechanism, driving the adsorption mechanism to move between the material picking bin, the paper separator disposal bin, the paper separator disposal bin, and the unloading track. A controller is communicatively connected to the unloading track, the adsorption mechanism, the CCD camera, and the robotic arm. Based on the images captured by the CCD camera, the controller controls the robotic arm and the adsorption mechanism to place the PCBs / separators / paper separators from the material picking bin into the unloading track / paper separator disposal bin / paper separator disposal bin, respectively.

[0006] In one or more embodiments of the present invention, the adsorption mechanism further includes a nozzle connected to the base plate, the nozzle being used to blow off the paper adhering to the PCB when the PCB suction nozzle picks up the PCB.

[0007] In one or more embodiments of the present invention, the adsorption mechanism further includes a fixing plate fixed to the robotic arm, the base plate being connected to the fixing plate by a spring, and the CCD camera being fixed to the fixing plate.

[0008] In one or more embodiments of the present invention, the material handling hopper includes a base, a lifting plate, multiple baffles, and a first lifting assembly. The base is fixed to the housing, the multiple baffles are fixed around the base, the lifting plate is used to support the PCB, it is placed on the base and confined between the baffles, and the first lifting assembly is disposed below the base, the first lifting assembly is connected to the lifting plate and drives it to move up and down.

[0009] In one or more embodiments of the present invention, the material handling bin further includes a first photoelectric sensor for detecting the PCB moving away from the lifting plate, the first photoelectric sensor being fixed to the housing and disposed above the top of the baffle.

[0010] In one or more embodiments of the present invention, two sets of material picking bins are fixed on the housing, and each set of material picking bins further includes a second photoelectric sensor fixed on the base. The second photoelectric sensor is used to detect whether a PCB is placed on its corresponding lifting plate.

[0011] In one or more embodiments of the present invention, the feeding track includes two parallel belts, and the distance between the two belts is adjustable.

[0012] In one or more embodiments of the present invention, the unloading track further includes a second lifting component disposed between the two belts, the second lifting component being used to receive the PCB transmitted from the robotic arm and place the PCB on the two belts; and / or the unloading track further includes a blocking cylinder disposed at the downstream end of the belt for limiting the PCB, and two discharge sensors disposed on both sides of the blocking cylinder, the discharge sensors and the blocking cylinder being disposed between the two belts; and / or each of the belts is provided with a dust collection box for collecting debris at both ends.

[0013] The present invention also provides a method for cutting PCB assemblies, wherein the PCB assembly consists of multiple PCBs stacked vertically together, wherein adjacent PCBs are separated by spacers, and a partition is provided at the top of the PCB assembly. The cutting method includes the following steps:

[0014] S1. Place the PCBs to be sorted into the material picking hopper;

[0015] S2, CCD camera identifies whether the top of the material picking bin is a partition, PCB or paper divider, and sends the identification result to the controller;

[0016] S3. Under the control of the controller, if the partition is identified, the robotic arm drives the adsorption mechanism to adsorb the partition and place it in the partition disposal bin; if the paper is identified, the robotic arm drives the adsorption mechanism to adsorb the paper and place it in the paper disposal bin; if the PCB is identified, the robotic arm drives the adsorption mechanism to adsorb the PCB and place it on the unloading track.

[0017] In one or more embodiments of the present invention, in step S3, if the PCB is identified, after the adsorption mechanism adsorbs the PCB, when the robotic arm controls the adsorption mechanism to move away from the picking bin, the CCD camera detects whether the top of the picking bin is a partition paper. If the picking bin is detected to be a PCB, the robotic arm controls the adsorption mechanism to move to the partition paper disposal bin. After the nozzle blows the partition paper attached to the bottom of the PCB into the partition paper disposal bin, the robotic arm controls the adsorption mechanism to move to the unloading track, and the adsorption mechanism places the PCB on the unloading track.

[0018] Compared with the prior art, the PCB unloading device of the present invention can place the PCB, partition and partition paper in the PCB group on different containers or carriers, realize the automatic sorting of PCB group, free up manpower, greatly reduce the sorting time, and improve work efficiency and success rate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the appearance of a PCB cutting device according to an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the internal structure of a PCB cutting device according to an embodiment of the present invention;

[0022] Figure 3 This is a top view of the upper space of the PCB unloading device in one embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the adsorption mechanism and CCD camera in one embodiment of the present invention;

[0024] Figure 5This is a schematic diagram of another angle adsorption mechanism and CCD camera in one embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the feeding track in one embodiment of the present invention;

[0026] Figure 7 This is a partial disassembly diagram of the feeding track in one embodiment of the present invention;

[0027] Figure 8 This is a schematic diagram of a material handling bin in one embodiment of the present invention.

[0028] Explanation of key figure labels:

[0029] 1-Casing, 11-Intermediate Plate, 12-Ion Fan, 13-Touch Screen, 14-Discharge Port, 2-Feeding Bin, 21-Base, 22-Lifting Plate, 23-Baffle, 24-First Lifting Assembly, 241-Motor, 242-Lead Screw, 243-Threaded Sleeve, 244-Moving Plate, 245-Lifting Rod, 246-Belt, 25-First Photoelectric Sensor, 26-Second Photoelectric Sensor, 3-Paper Disposal Bin, 4-Baffle Disposal Bin 5-Loading track, 51-Belt, 52-Second lifting assembly, 521-Cylinder, 522-Support plate, 523-Loading sensor, 53-Blocking cylinder, 54-Discharge sensor, 55-Dust collection box, 56-Guide rail, 6-Adsorption mechanism, 61-Base plate, 62-PCB suction nozzle, 63-Paper-separating suction nozzle, 64-Blow nozzle, 65-Fixing plate, 66-Spring, 7-CCD camera, 8-Robotic arm, 9-Controller. Detailed Implementation

[0030] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0031] A PCB (Printed Circuit Board) is the support structure for electronic components and the carrier for electrical interconnection. Due to its thinness, PCBs without installed electronic components are often stacked together for storage. For example, multiple PCBs can be stacked vertically together, with adjacent PCBs separated by partitions. A partition is placed on top of the entire PCB stack; this partition has a shape roughly similar to the PCBs below it and records information such as the quantity and model of the PCBs below. In this embodiment, the PCB unloading device is used to remove and unload the PCBs from the entire stack. The partitions and partitions are stored separately and removed for reuse or disposal after a certain number of stacks have been completed. The PCBs are then unloaded to other equipment for the next processing step.

[0032] like Figure 1-3 As shown, a PCB unloading device in one embodiment of the present invention includes a housing 1, a material picking bin 2, a paper separation waste bin 3, a partition waste bin 4, an unloading track 5, an adsorption mechanism 6, a CCD camera 7, a robotic arm 8, and a controller 9. Preferably, the interior of the housing 1 is divided into upper and lower spaces, separated by a middle plate 11. The controller 9 and other electrical components are located in the lower space, while the main components of the material picking bin 2, paper separation waste bin 3, partition waste bin 4, unloading track 5, adsorption mechanism 6, CCD camera 7, and robotic arm 8 are located in the upper space. The feeding bin 2 is used to place PCB groups to be sorted; the paper separator bin 3 is used to receive the paper separators between adjacent PCBs; the partition bin 4 is used to receive the partitions on top of the PCB groups; the unloading track 5 is used to receive PCBs and transport them downstream; the adsorption mechanism 6 is used to adsorb PCBs and place them on the unloading track 5, or adsorb partitions and place them in the partition bin 4, or adsorb paper separators and place them in the paper separator bin 3; the CCD camera 7 is used to identify whether the top of the feeding bin 2 contains PCBs / partitions / paper separators; the robotic arm 8 is connected to the adsorption mechanism 6 and drives it to move between the feeding bin 2 and the unloading track 5 / paper separator bin 3 / partition bin 4. The controller 9 is communicatively connected to the robotic arm 8, the CCD camera 7, the adsorption mechanism 6, and the unloading track 5, and controls their operation.

[0033] During use, the entire PCB (with a partition on top and paper separating the PCBs) is placed in the picking bin 2 by manual loading. Then, the robotic arm 8 drives the adsorption mechanism 6 to move above the picking bin 2. When the CCD camera 7 detects that the top of the picking bin 2 contains a partition / paper / PCB, the controller 9 controls the robotic arm 8 and the adsorption mechanism 6 to transfer the partition / paper / PCB to the partition disposal bin 4 / paper disposal bin 3 / unloading track 5. The unloading track 5 will transport the PCB to the rear end. The partitions in the partition disposal bin 4 and the paper in the paper disposal bin 3 are removed after accumulating to a certain quantity.

[0034] Furthermore, due to the thin and light texture of the separator paper, it may wrinkle or other issues caused by airflow during operation. Therefore, please refer to [link / reference needed]. Figure 4 and Figure 5As shown, the adsorption mechanism 6 includes a base plate 61, multiple PCB suction nozzles 62, and paper separator suction nozzles 63. The base plate 61 is a rectangular plate structure similar in shape to the PCB and is connected to the robotic arm 8. The multiple PCB suction nozzles 62 are fixed to the base plate 61 and distributed around its perimeter, while the paper separator suction nozzles 63 are fixed to the center of the base plate 61. The PCB and the separator are adsorbed by the PCB suction nozzles 62, while the paper separator is adsorbed by the paper separator suction nozzles 63. By fixing the paper separator suction nozzles 63 to the center of the base plate 61 and by using a larger diameter paper separator suction nozzle, the success rate of paper separator adsorption is improved.

[0035] The PCB unloading device in this embodiment can place the PCBs, partitions, and separators in the PCB group onto different containers or carriers, realizing automatic PCB group unloading, freeing up manpower, greatly reducing unloading time, and improving work efficiency and success rate.

[0036] The adsorption mechanism 6 also includes a nozzle 64, which is connected to the base plate 61. During PCB transfer, after the CCD camera 7 detects the PCB, the PCB suction nozzle 62 adsorbs the PCB. As the robotic arm 8 drives the adsorption mechanism 6 and CCD camera 7 away from the material handling bin 2, the CCD camera 7 will again check if there is a paper separator at the top of the material handling bin 2. If not, the paper separator is adsorbed onto the PCB and lifted along with it. At this time, the robotic arm 8 will drive the adsorption mechanism 6 to move above the paper separator disposal bin 3, and the nozzle 64 will blow the paper separator into the paper separator disposal bin 3. Then, the robotic arm 8 will move the adsorption mechanism 6 to the unloading track 5 and place the PCB on the unloading track 5. Figure 4 In the embodiment shown, nozzles 64 are provided at both ends of the base plate 61.

[0037] In one embodiment, the adsorption mechanism 6 further includes a fixed plate 65 fixed to the robotic arm 8. The base plate 61 is connected to the fixed plate 65 via a spring 66, and the CCD camera 7 is fixed to the fixed plate 65. To improve the success rate when adsorbing PCBs and partitions, when the robotic arm 8 drives the adsorption mechanism 6 downwards, after the PCB suction nozzle 62 contacts the PCB or partition, the robotic arm 8 will drive the adsorption mechanism 6 to continue downwards for a certain distance. At this time, the spring 66 will be compressed and deformed to a certain extent, and the PCB suction nozzle 62 will fit more tightly against the PCB or partition, thereby avoiding adsorption failure and improving the adsorption effect and success rate.

[0038] In a preferred embodiment, the CCD camera 7 is also attached to the robotic arm 8 and moves with it.

[0039] like Figure 8As shown, the material handling hopper 2 includes a base 21, a lifting plate 22, multiple baffles 23, and a first lifting assembly 24. The base 21 is fixed to the housing 1, and the multiple baffles 23 are fixed to the base 21, forming a limiting space for placing the PCB. The lifting plate 22 is used to support the PCB, and it is disposed on the base 21 and confined between the baffles 23. The first lifting assembly 24 is fixed to the housing 1 and disposed below the base 21. It is connected to the lifting plate 22 and drives it to move up and down.

[0040] The PCB assembly is placed on the lifting plate 22 along the baffle 23. The baffle 23 is used to maintain the posture of the PCB assembly and prevent it from tilting or falling. Furthermore, due to the presence of the baffle 23, the adsorption mechanism 6 cannot move between the baffles 23 to adsorb the PCBs. To address this, a first lifting component 24 is provided below the base 21. Each time a PCB is removed, the first lifting component 24 drives the lifting plate 22 to rise a certain distance, ensuring that the PCB is always positioned at the top of the baffle 23, facilitating adsorption by the adsorption mechanism 6.

[0041] The first lifting component 24 can be... Figure 8 As shown, the system comprises a motor 241, a lead screw 242, a threaded sleeve 243, a moving plate 244, and a lifting rod 245. The motor 241 is fixed below the base 21 and drives the lead screw 242 to rotate via a belt 246. The lead screw 242 is vertically oriented. The threaded sleeve 243 is fixed to the moving plate 244 and threadedly engages with the lead screw 242. One end of the lifting rod 245 is fixed to the moving plate 244, and the other end is fixed to the lifting plate 22. Therefore, the rotation of the motor 241 drives the lead screw 242 to rotate, and under the action of the thread, the threaded sleeve 243 drives the moving plate 244 to move up and down, thereby causing the lifting rod 245 to drive the lifting plate 22 to move up and down between the baffles 23.

[0042] Preferably, the material handling bin 2 further includes a first photoelectric sensor 25, which is disposed on the top of the baffle 23 and is used to monitor whether the PCB is correctly adsorbed and removed from the lifting plate 22. Specifically, when the PCB is located at the top of the baffle 23, the light emitted by the first photoelectric sensor 25 is blocked by the PCB. When the PCB is adsorbed by the adsorption mechanism 6 and removed from the lifting plate 22, the light emitted by the first photoelectric sensor 25 is not blocked and can be received normally. At this time, the controller 9 controls the first lifting component 24 to operate, causing the lifting plate 22 to rise by approximately the thickness of one PCB, thereby moving the next PCB to the top position of the baffle 23.

[0043] Furthermore, two sets of material dispensing bins 2 are fixed on the housing 1, and each set of dispensing bins 2 is also equipped with a second photoelectric sensor 26, which is located at the bottom of the baffle 23, and its structure and principle are the same as those of the first photoelectric sensor 25, and will not be described again here. The second photoelectric sensor 26 is used to monitor whether there is a PCB in the dispensing bin 2. When a PCB is detected, the controller 9 controls the adsorption mechanism 6 to operate on the PCB in the dispensing bin 2. If no PCB is detected, the adsorption mechanism 6 does not perform the dispensing action on the dispensing bin 2.

[0044] like Figure 6 , 7 As shown, the feeding track 5 includes two parallel belts 51. Preferably, one belt 51 is fixed to the housing 1, and the other belt 51 is supported on a guide rail 56. The extension direction of the guide rail 56 is perpendicular to the length direction of the belt 51, so that the belt 51 can move in the extension direction of the guide rail 56, thereby moving closer to or away from the belt 51 fixed to the housing 1. Therefore, the spacing between the two belts 51 is adjustable to accommodate PCBs of different specifications.

[0045] Preferably, the unloading track 5 further includes a second lifting assembly 52 disposed between the two belts 51. The second lifting assembly 52 consists, for example, a lifting cylinder 521 fixed to the housing 1 and a support plate 522 fixed to the output shaft of the lifting cylinder 521. When the PCB moves above the belt 51, the lifting cylinder 521 drives the support plate 522 upward. After the adsorption mechanism 6 places the PCB on the support plate 522, the lifting cylinder 521 reverses, and the support plate 522 moves downward, thereby placing the PCB on the belt 51.

[0046] like Figure 7 As shown, the support plate 522 has an opening, and a loading sensor 523 is installed below the opening. It is fixed to the housing 1 and is used to monitor whether there is a PCB above the second lifting assembly 52. ​​When the robotic arm 8 detects that it has transferred the PCB above the second lifting assembly 52, it sends a signal to the controller 9. The controller 9 controls the second lifting assembly 52 to operate and receive the PCB according to the signal.

[0047] Furthermore, a stop cylinder 53 for limiting the PCB is provided at the downstream end of the belt 51, and two discharge sensors 54 are provided on both sides of the stop cylinder 53. The stop cylinder 53 and the discharge sensors 54 are located between the two belts 51. Under normal conditions, the output shaft of the stop cylinder 53 extends above the belt 51 to block the PCB. When the PCB is transported on the belt 51 and blocked by the stop cylinder 53, the discharge sensor 54 at the front end of the stop cylinder 53 senses the PCB, and the output shaft of the stop cylinder 53 moves below the belt 51, allowing the PCB to continue to be transported backward. When it passes the discharge sensor 54 on the rear side, the discharge sensor 54 sends a counting signal to the controller 9, and the system obtains the PCB discharge information.

[0048] The feeding sensor 523 and the discharging sensor 54 can be light sensors or distance sensors, etc., and this embodiment is not limited to them.

[0049] The robotic arm 8 can drive the CCD camera 7 and the adsorption mechanism 6 to move in the horizontal and vertical directions. Common driving devices in the art (such as Estun's ER10-700-SR) can be selected, but this embodiment is not limited.

[0050] Dust collection boxes 55 are provided at both ends of the belt 51 to collect debris and dust that may be generated during the operation.

[0051] Multiple ion fans 12 are also installed inside the casing 1 for dust removal and to eliminate static electricity that may be generated during the production process.

[0052] The housing 1 is also equipped with a touch screen 13 and a discharge port 14. The operating status of the equipment can be obtained and controlled through the touch screen 13. The unloading track 5 extends to the discharge port 14, and a single PCB can be obtained sequentially through the discharge port 14.

[0053] This application provides a method for cutting PCB assemblies, specifically including the following steps:

[0054] S1. Place the PCBs to be sorted into the material picking hopper.

[0055] Specifically, the numbering information of the PCB group on the partition is first entered, and then the entire PCB group is placed in the material picking bin 2 by manual or mechanical means.

[0056] The S2 and CCD cameras identify whether the top of the material hopper is a partition, PCB, or paper divider, and send the identification results to the controller.

[0057] Specifically, the CCD camera 7 scans the material handling bin 2 to identify whether the top is a PCB, a partition, or a paper divider, and sends the identification result to the controller.

[0058] S3. Under the control of the controller, if the partition is identified, the robotic arm drives the adsorption mechanism to adsorb the partition and place it in the partition disposal bin; if the paper is identified, the robotic arm drives the adsorption mechanism to adsorb the paper and place it in the paper disposal bin; if the PCB is identified, the robotic arm drives the adsorption mechanism to adsorb the PCB and place it on the unloading track.

[0059] Specifically, when a partition is detected at the top of the material handling hopper, the robotic arm 8 controls the adsorption mechanism 6 to descend, adsorbing the partition. The robotic arm 8 then moves the adsorption mechanism 6 to the partition disposal hopper 4, where the adsorption mechanism 6 places the partition. Conversely, if a PCB or partition paper is detected, the robotic arm 8 drives the adsorption mechanism 6 to adsorb and place the PCB or partition paper onto the unloading track 5 or into the partition paper disposal hopper 3, respectively. After a certain quantity of partition paper and partitions have accumulated, they are removed for reuse or discarded, while the PCBs are transported to other downstream stations on the unloading track 5.

[0060] In one embodiment, the first lifting component 24 transports the uppermost PCB or partition to a position near the top of the baffle 23 for the adsorption mechanism 6 to pick up. Furthermore, each time a partition or PCB is removed, the first lifting component 24 pushes the lifting plate 22 upwards a certain distance, so that the next PCB moves to a position near the top of the baffle 23.

[0061] When the PCB is adsorbed and removed from the picking bin 2, the CCD camera 7 will scan the top of the picking bin 2 again. If the top is detected to be a PCB, it means that the separator paper between the two PCBs is attached to the top of the removed PCB and is taken away together. At this time, the robotic arm 8 will control the adsorption mechanism 6 to move to the separator paper disposal bin 3, and the nozzle 64 will blow the separator paper down. The separator paper falls into the separator paper disposal bin 3. The robotic arm 8 drives the adsorption mechanism 6 to move to the unloading track 5. The adsorption mechanism 6 places the PCB on the unloading track 5 and then unloads it.

[0062] It will be apparent to those skilled in the art that this disclosure is not limited to the details of the exemplary embodiments described above, and that this disclosure can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of this disclosure is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within this disclosure. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0063] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A PCB unloading device for conveying vertically stacked PCB groups in a PCB manufacturing line, wherein adjacent PCBs are separated by partition paper, and a partition is provided at the top of the PCB group, characterized in that, The PCB unloading device includes: chassis; The material handling bin is located inside the machine housing and is used to hold the PCB assembly to be unloaded; A paper separator tray, located inside the housing, is used to receive paper separators between adjacent PCBs; A partition disposal compartment is located inside the housing and is used to receive the partition from the top of the PCB assembly; The unloading track, located inside the housing, is used to receive and transmit PCBs; An adsorption mechanism is disposed inside the housing and is used to adsorb and release PCBs / partitions / paper separators. The adsorption mechanism includes a base plate, multiple PCB suction nozzles and paper separator suction nozzles. The base plate is connected to the robotic arm. The multiple PCB suction nozzles are fixed around the base plate, and the paper separator suction nozzles are fixed in the middle of the base plate. A CCD camera is installed inside the housing to distinguish the PCB / partition / paper separator in the material picking bin; A robotic arm is installed inside the housing and connected to the adsorption mechanism. The robotic arm drives the adsorption mechanism to move between the material picking bin, the paper separation waste bin, the partition waste bin, and the unloading track. The controller is communicatively connected to the feeding track, adsorption mechanism, CCD camera, and robotic arm. The controller, based on the images captured by the CCD camera, controls the robotic arm and the adsorption mechanism to place the PCB / partition / paper separator in the material picking bin into the unloading track / partition discard bin / paper discard bin, respectively.

2. The PCB blanking device according to claim 1, characterized in that, The adsorption mechanism also includes a nozzle connected to the base plate, which is used to blow off the paper adhering to the PCB when the PCB suction nozzle picks up the PCB.

3. The PCB blanking device according to claim 1, characterized in that, The adsorption mechanism also includes a fixing plate fixed to the robotic arm, the base plate being connected to the fixing plate by a spring, and the CCD camera being fixed to the fixing plate.

4. The PCB blanking device according to claim 1, characterized in that, The material handling hopper includes a base, a lifting plate, multiple baffles, and a first lifting assembly. The base is fixed to the housing, the multiple baffles are fixed around the base, the lifting plate is used to support the PCB, it is placed on the base and confined between the baffles, and the first lifting assembly is disposed below the base, the first lifting assembly is connected to the lifting plate and drives it to move up and down.

5. The PCB blanking device according to claim 4, characterized in that, The material handling hopper also includes a first photoelectric sensor for detecting the distance of the PCB from the lifting plate. The first photoelectric sensor is fixed on the housing and positioned above the top of the baffle.

6. The PCB blanking device according to claim 5, characterized in that, Two sets of material picking bins are fixed on the housing, and each set of material picking bins also includes a second photoelectric sensor fixed on the base. The second photoelectric sensor is used to detect whether a PCB is placed on its corresponding lifting plate.

7. The PCB blanking device according to claim 1, characterized in that, The feeding track includes two parallel belts, and the distance between the two belts is adjustable.

8. The PCB blanking device according to claim 7, characterized in that, The unloading track also includes a second lifting assembly disposed between the two belts. The second lifting assembly is used to receive the PCB transmitted from the robotic arm and place the PCB on the two belts; and / or The feeding track also includes a stop cylinder located at the downstream end of the belt for limiting the PCB, and two discharge sensors located on both sides of the stop cylinder. The discharge sensors and the stop cylinder are positioned between the two belts; and / or Each belt is equipped with a dust collection box at both ends for collecting debris.

9. A method for cutting a PCB assembly, wherein the PCB assembly comprises multiple PCBs stacked vertically together, wherein adjacent PCBs are separated by spacers, and a partition is provided at the top of the PCB assembly, characterized in that... The material feeding method includes the following steps: S1. Place the PCBs to be sorted into the material picking hopper; S2, CCD camera identifies whether the top of the material picking bin is a partition, PCB or paper divider, and sends the identification result to the controller; S3. Under the control of the controller, if the partition is identified, the robotic arm drives the adsorption mechanism to adsorb the partition and place it in the partition disposal bin; if the paper is identified, the robotic arm drives the adsorption mechanism to adsorb the paper and place it in the paper disposal bin; if the PCB is identified, the robotic arm drives the adsorption mechanism to adsorb the PCB and place it on the unloading track.

10. The feeding method according to claim 9, characterized in that, In step S3, if the PCB is identified, after the adsorption mechanism adsorbs the PCB, when the robotic arm controls the adsorption mechanism to move away from the picking bin, the CCD camera detects whether the top of the picking bin is a partition paper. If the picking bin is located as a PCB, the robotic arm controls the adsorption mechanism to move to the partition paper disposal bin. The partition paper attached to the bottom of the PCB is blown into the partition paper disposal bin by the nozzle. Then, the robotic arm controls the adsorption mechanism to move to the unloading track, and the adsorption mechanism places the PCB on the unloading track.

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