Mover module motion control method and apparatus, material processing system

Abstract

The application discloses a mover module motion control method and device and a material processing system. The method comprises the following steps: acquiring real-time position information of each mover module; after receiving an external signal, analyzing the external signal; when it is analyzed that the external signal represents starting to cut a first material, based on the real-time position information of each mover module, controlling at least one mover module to be located at a material placing position to receive a piece of second material obtained by cutting the first material. Through the application, the technical problem of low overall material processing efficiency in the related art is solved.

Description

Technical Field

[0001] This application relates to the field of automation control technology, and more specifically, to a motion control method and device for a moving module and a material processing system. Background Technology

[0002] In material processing scenarios, materials are typically transferred between various operating devices via mechanical transmission methods (such as belt conveyors, chain conveyors, etc.).

[0003] Because mechanical transmission methods use a uniform conveying mechanism (such as conveyor belts, conveyor chains, etc.) to transfer materials, there may be overlap or even accumulation of materials during the transfer process, which may lead to adverse consequences such as material slippage or inability to be processed later. In order to avoid material overlap or accumulation, the execution frequency of the operating equipment that transfers materials to the conveying mechanism is inevitably limited, resulting in low overall material processing efficiency.

[0004] There is currently no effective solution to the technical problem of low overall material processing efficiency. Summary of the Invention

[0005] The main objective of this application is to provide a motion control method and device for a moving submodule and a material processing system to solve the technical problem of low overall material processing efficiency in related technologies.

[0006] To achieve the above objectives, according to one aspect of this application, a motion control method for moving sub-modules is provided, applied to a material processing scenario. The method includes: acquiring real-time position information of each moving sub-module; parsing an external signal after receiving it; and, when the parsed external signal indicates that cutting of a first material has begun, controlling at least one moving sub-module to be positioned at a placement position based on the real-time position information of each moving sub-module to receive a piece of second material obtained from cutting the first material.

[0007] To achieve the above objectives, according to another aspect of this application, a motion control device for a moving submodule is provided. The device includes: a memory storing an executable program; and a processor for running the program, wherein the program executes the motion control method for the moving submodule described above during runtime.

[0008] To achieve the above objectives, according to another aspect of this application, a material processing system is provided. The system includes a moving submodule, a stator track, a cutting device, and a control device, wherein: the cutting device is distributed along the stator track; the control device is used to control the moving submodule to move along the stator track, acquire real-time position information of each moving submodule, and, when an external signal indicating the start of cutting a first material is obtained, control at least one moving submodule to be positioned at a placement position based on the real-time position information of each moving submodule to receive a piece of second material obtained by the cutting device from the first material.

[0009] In this embodiment, after receiving an external signal, the external signal is parsed. When the parsed external signal indicates that the cutting of the first material has started, at least one moving sub-module is controlled to be positioned at the placement position by acquiring the real-time position information of each moving sub-module to receive a piece of second material obtained from the cutting of the first material. Thus, different second materials are received by different moving sub-modules, avoiding material overlap or accumulation. Furthermore, the second material feeding process is performed on the moving sub-modules while the first material is being cut, saving the time of feeding the second material to the moving sub-modules separately and improving the overall processing efficiency of the materials. Attached Figure Description

[0010] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0011] Figure 1 This is a flowchart of the motion control method for the moving submodule provided according to an embodiment of this application;

[0012] Figure 2 This is a schematic diagram showing the position of the moving submodule in the motion control method for the moving submodule provided according to an embodiment of this application;

[0013] Figure 3 This is a schematic diagram of the moving submodule carrying the second material in the motion control method for the moving submodule provided in the embodiments of this application. Figure 1 ;

[0014] Figure 4 This is a schematic diagram of the moving submodule carrying the second material in the motion control method for the moving submodule provided in the embodiments of this application. Figure 2 ;

[0015] Figure 5 This is a schematic diagram of the second material processing process in the motion control method of the moving submodule provided in the embodiments of this application;

[0016] Figure 6 This is a schematic diagram of the motion control method for the moving submodule provided in the embodiments of this application, in which the moving submodule carries the second material by adsorption. Figure 1 ;

[0017] Figure 7 This is a schematic diagram of the motion control method for the moving submodule provided in the embodiments of this application, in which the moving submodule carries the second material by adsorption. Figure 2 ;

[0018] Figure 8 This is a schematic diagram of rotating a second material in the motion control method for a moving submodule provided according to an embodiment of this application;

[0019] Figure 9 This is a schematic diagram of the folding of the second material by the moving submodule in the motion control method of the moving submodule provided in the embodiments of this application;

[0020] Figure 10 This is a schematic diagram of the motion control device for the moving submodule provided according to an embodiment of this application;

[0021] Figure 11 This is a structural block diagram of a material processing system according to an embodiment of this application.

[0022] In the accompanying drawings of the instruction manual: 10, First material; 11, Second material; 20, Cutting equipment; 30, Moving module; 31, Carrier; 32, Wireless processing module; 33, Motor shaft; 34, Air pump; 35, Air pipe; 36, Air hole; 40, Stator track; 50, Adhesive bonding equipment; 60, Actuator; 71, First feeding device; 72, Second feeding device; 80, Control device. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0024] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0025] To facilitate understanding of the present invention by those skilled in the art, some terms or nouns involved in the various embodiments of the present invention will be explained below:

[0026] In this embodiment, the moving module is configured to move along the stator track, and the stator track is configured to be magnetically coupled to the moving module to control its movement or stationary position relative to the stator track. The stator track includes at least one stator module, and the moving module is interlocked with the stator module. One of the moving module and the stator module is provided with a winding, and the other is provided with a permanent magnet. Based on the current driving parameters and the moving module's motion parameters, the winding is dynamically selected and the current magnitude and direction are dynamically adjusted, causing the winding current to excite and generate a traveling wave magnetic field. The traveling wave magnetic field interacts with the magnetic field of the permanent magnet, generating a force on the moving module to control its movement.

[0027] To address the aforementioned technical problems, this application provides the following: Figure 1 The motion control method for the moving submodule shown is applied to material processing scenarios. Figure 1 This is a flowchart of a motion control method for a moving submodule provided according to an embodiment of this application. The motion control method for the moving submodule includes:

[0028] Step S101: Obtain the real-time position information of each moving submodule.

[0029] In some embodiments, the real-time position information of each moving submodule running in the stator track is continuously collected, and this real-time position information is used as the basis for subsequent control decisions. The moving submodules move along the stator track. Unlike traditional conveyor mechanisms such as belts, each moving submodule can achieve different motion states under the control of a control device. In other words, the motion state of each moving submodule can be controlled independently, and the moving submodules can move independently of each other. The control device corresponding to each moving submodule can be the same or different. For example, a moving submodule in one track area of ​​the stator track corresponds to one control device, and a moving submodule in another track area of ​​the stator track corresponds to another control device; another example is that all moving submodules are controlled by a unified control device; yet another example is that multiple controllers control multiple moving submodules, with each controller controlling at least one moving submodule among the multiple moving submodules.

[0030] For example, real-time position information can include the spatial coordinates of the moving submodule on the stator track, updated at fixed time intervals. This real-time position information is not a static parameter but a dynamically changing state variable. Methods for obtaining the real-time position information of the moving submodule include encoders, sensors, and computer vision.

[0031] Step S102: After receiving the external signal, the external signal is analyzed.

[0032] In some embodiments, the external signal is a signal emitted by an external device other than the stator track and the moving submodule. The external device can be a device configured along the stator track in a material processing scenario, such as a cutting device for cutting the first material. It should be understood that other types of external devices may also exist around the stator track, such as feeding devices, gluing devices, etc. The signal emitted by the external device is at least used to indicate the process execution status of the external device, such as the signal indicating the start, progress, or completion of a process. By parsing each received signal from the external device, the current process execution status of the external device can be determined, and corresponding movement control can be performed on the moving submodule. Furthermore, the external signal can be parsed using logical judgment or protocol decoding to determine the current process execution status of the external device.

[0033] Step S103: When the external signal indicating the start of cutting the first material is obtained, at least one moving submodule is controlled to be positioned at the placement position based on the real-time position information of each moving submodule to receive a piece of the second material obtained from cutting the first material.

[0034] In some embodiments, starting to cut the first material may refer to the preparatory stage before cutting into the first material.

[0035] In some embodiments, the placement position is set in a track area of ​​the stator track that is spatially aligned with the cutting direction of the cutting equipment. That is, the placement position is used to indicate the position of the moving module expected to be located on the stator track when the second material cutting of the first material begins, thereby ensuring that the moving module located at the placement position can receive one piece of the second material obtained in this cutting. One piece of the second material is a single finished product or a single semi-finished product separated from the first material after being cut by the cutting equipment.

[0036] In some embodiments, when the external signal indicating the start of cutting the first material is obtained, the presence of the moving submodule at the placement position can be determined based on the real-time position information of the moving submodule.

[0037] If, when an external signal indicating the start of cutting the first material is received, there is no moving submodule at the placement position, the moving submodules at unplaced positions are scheduled to move to an idle placement position (i.e., a placement position without a moving submodule) within a preset scheduling time. The preset scheduling time is less than the time required to cut a second material. For example, if it takes time unit t1 to cut a second material from the first material, the preset scheduling time can be time unit t2, where t1 and t2 are natural numbers, and t2 < t1. The time unit can be seconds, milliseconds, microseconds, etc.

[0038] If it is determined that the moving submodule cannot be scheduled to reach an idle placement position within the preset scheduling time, a stop cutting feedback signal can be sent to the cutting equipment to stop the cutting operation of the first material. After the moving submodule reaches the idle placement position, a resume cutting feedback signal can be sent to the external device to resume the cutting operation of the first material.

[0039] Upon receiving an external signal, the system analyzes the signal. When the external signal indicates that the cutting of the first material has begun, the system uses the real-time position information of each moving sub-module to control at least one moving sub-module to be positioned at the placement position to receive a piece of second material obtained from the cutting of the first material. Thus, different second materials are received by different moving sub-modules, avoiding material overlap or accumulation. Furthermore, the system performs the second material loading process on the moving sub-modules simultaneously with the cutting of the first material, eliminating the time required for separate second material loading on the moving sub-modules and improving the overall material processing efficiency.

[0040] Optionally, the motion control method for the moving submodule further includes at least one of the following: when the external signal indicating that the first material is being cut is resolved, controlling the moving submodule receiving the second material to remain stationary; or, based on the received external signal indicating that the first material is being cut, controlling the moving speed of the moving submodule receiving the second material to match the moving speed of the moving submodule with the speed of cutting the first material; after the external signal indicating that the first material has been cut is resolved, controlling the moving submodule carrying the second material to accelerate.

[0041] In some embodiments, new external signals emitted by external devices can be continuously received and analyzed. The external signals can also indicate that the first material is being cut or that the first material has been cut. The first material being cut refers to the physical process stage in which the first material has been cut but the second material has not yet been completely separated. Its duration is related to the thickness of the first material, the cutting speed, and the elasticity of the material. The first material being cut is the stage in which the second material has been completely separated from the first material and there is no physical connection between the second material and the first material.

[0042] In some embodiments, when the cutting device is cutting the first material, the moving submodule used to receive the second material is controlled to pause its movement, so that the moving submodule is stationary and placed in the placement position, so that the second material can be stably and without deviation received by the moving submodule at the moment of being cut and separated.

[0043] In other embodiments, when the cutting device is cutting the first material, the moving speed of the moving sub-module is limited. The moving speed of the moving sub-module is matched with the cutting speed of the first material, so that the moving speed of the moving sub-module and the speed at which the second material detaches from the first material are matched. During the movement of the moving sub-module, the portion of the second material that detaches from the first material first falls onto the moving sub-module. When the cutting is completed, the second material can fall completely onto the moving sub-module. Thus, during the movement of the moving sub-module, it is ensured that the cut second material can fall onto the moving sub-module, and the dwell time of the moving sub-module is reduced, so that the moving sub-module can leave the track area corresponding to the cutting device more quickly.

[0044] It should be understood that in the dynamic material receiving method of the moving submodule, the placement position is used to determine whether the moving submodule can start performing the task of receiving the second material. That is, after the moving submodule reaches the placement position, it is determined that the moving submodule can start performing the task of receiving the second material, and the second material is received during the movement of the moving submodule. The moving submodule can be stationary or already has a speed matching the speed of cutting the first material when it reaches the placement position; this application does not impose specific restrictions on this. Furthermore, the placement position for static material receiving by the moving submodule and the placement position for dynamic material receiving by the moving submodule can be the same or different; this application does not impose specific restrictions on the placement position settings corresponding to different material receiving methods.

[0045] In some embodiments, when the first material is cut, the second material has completely detached from the first material. At this time, at least part of the second material falls onto the moving sub-module. After the second material has completely fallen onto the moving sub-module, the moving sub-module is controlled to increase its movement speed so that the moving sub-module carries the first material into the next process faster, thereby shortening the dwell time of the moving sub-module at the placement position and improving processing efficiency.

[0046] For example, Figure 2 This is a schematic diagram of the position of the moving submodule in the motion control method for the moving submodule provided in the embodiments of this application, as shown below. Figure 2 As shown, the cutting device 20 along the Figure 2 The dotted line shown in the figure cuts the first material 10. When the cutting equipment starts cutting the first material 10, there is a moving part at the placement position. The moving part module is equipped with a carrier 31. When the cutting equipment 20 is cutting the first material 10, the moving part module used to receive the second material is controlled to stay at the placement position, or the moving part module used to receive the second material is controlled to move away from the placement position, so that the carrier 31 of the moving part module can receive the second material. Figure 3 This is a schematic diagram of the moving submodule carrying the second material in the motion control method for the moving submodule provided in the embodiments of this application. Figure 1 , combined Figure 2 and Figure 3 When the cutting device 20 cuts the first material 10, the second material 11 detaches from the first material 10 and falls downwards, where it is caught by the carrier 31 located on the moving part. It should be noted that, for ease of understanding and to simplify the complexity of the scenario, Figure 2 and Figure 3 Only a portion of the cutting device 20 is shown, and the moving submodule is not shown.

[0047] By keeping the moving submodule stationary during cutting or matching its speed to the cutting speed of the first material, and controlling its acceleration after cutting, the system ensures that the second material can be received by the moving submodule after detaching from the first material, and shortens the dwell time of the moving submodule at the placement position, thus improving the overall processing efficiency of the material.

[0048] Optionally, the material processing scenario includes at least one cutting device for cutting the first material, and each second material has an irregular shape. The method further includes: before starting to cut the first material, obtaining the identification information of each moving sub-module moving towards the placement position; based on the real-time position information of each moving sub-module, sending at least the identification information of the moving sub-module closest to the placement position to the cutting device, so that the cutting device selects the direction that matches the identification information of the moving sub-module as the cutting direction, wherein the cutting device selects different directions in two adjacent steps.

[0049] In some embodiments, the cutting direction is used to control the movement direction of the cutting tool of the cutting device when cutting the first material, and the cutting direction determines the edge shape and orientation of the second material. Different cutting directions can produce second materials with different edge shapes and orientations.

[0050] For irregularly shaped second materials (such as second materials with inconsistent lengths on opposite sides, or second materials with irregular shapes), cutting the first material in the same cutting direction will result in waste of the first material. By changing the cutting direction, the waste of the first material can be reduced.

[0051] For example, Figure 4 This is a schematic diagram of the moving submodule carrying the second material in the motion control method for the moving submodule provided in the embodiments of this application. Figure 2 ,refer to Figure 4 As shown, the first material 10 is cut according to the first cutting and forming direction to obtain the desired result. Figure 4 The second material 11, located at the top, is obtained by cutting the first material 10 according to the second cutting and forming direction. Figure 4 The second material 11 located below is cut in opposite directions. The resulting second material 11 has the same shape but faces opposite directions. Compared to using the same cutting direction, using opposite cutting directions reduces the blank area in the first material, thus minimizing waste. For ease of understanding, Figure 4 Taking a triangle as an example, the actual shape of the second material can be other irregular shapes, and there are no restrictions on this.

[0052] In some embodiments, if further operations (such as processing, unloading, etc.) are subsequently performed on the second material, the subsequent operations may differ for second materials with different orientations. Changes in the cutting direction can lead to ambiguity regarding the orientation of the second material received by different moving sub-modules, resulting in errors in subsequent operations on the second material. To avoid this problem, the cutting direction can be adapted to the identification information of the moving sub-modules. Specifically, before starting to cut the first material, the identification information of each moving sub-module needs to be obtained. Based on the moving direction of the moving sub-modules, the identification information of at least the moving sub-module closest to the placement position and moving towards that position is sent to the cutting device. The cutting device selects the direction matching the identification information of that moving sub-module as the cutting direction, thus establishing a correspondence between the identification information of the moving sub-modules and the orientation of the second material received by the moving sub-modules. Based on the identification information of the moving sub-modules, the orientation of the received second material can be determined, making the orientation of the second material carried by each moving sub-module clear, thereby avoiding failures in subsequent processes involving the second material.

[0053] By selecting the direction that matches the identification information of the moving submodule as the cutting direction before the first material is cut, the orientation of the second material on the moving submodule can be clearly determined without additional manual intervention or the addition of a second material orientation detection process, which is beneficial to improving the material processing efficiency.

[0054] Optionally, the material processing scenario includes at least one cutting device for cutting the first material, and the shape of each second material is irregular; before controlling at least one moving submodule to be in the placement position, the moving submodule motion control method further includes: determining the moving submodule with matching identification information based on the cutting forming direction of the cutting device, wherein the cutting device selects different directions in two adjacent steps.

[0055] In some embodiments, as described above, changes in the cutting direction can lead to unclear orientation of the second material carried by different moving sub-modules, resulting in subsequent operational errors with the second material. To avoid this problem, the moving sub-modules can be adapted to the cutting direction of the cutting equipment. Specifically, before controlling at least one moving sub-module to be positioned, based on the cutting direction selected by the cutting equipment, a moving sub-module with identification information matching the cutting direction is selected as the target moving sub-module expected to be positioned at the current placement location. This ensures a correspondence between the identification information of the moving sub-module and the orientation of the second material carried by the moving sub-module. Based on the identification information of the moving sub-module, the orientation of the carried second material can be determined, making the orientation of the second material carried by each moving sub-module clear and avoiding rework or scrap due to uncertain orientation.

[0056] For example, the identification information of the moving module includes the moving module number, which can be represented by numbers, and the moving module number is unique for different moving modules. The cutting equipment is configured to alternately perform cutting in the first cutting direction and the second cutting direction. The identification information of odd-numbered moving module numbers matches the first cutting direction, and the identification information of even-numbered moving module numbers matches the second cutting direction. The parity of the moving module number can be identified by methods such as taking a mold of the moving module number. (Illustratively, refer to...) Figure 4 Assuming Figure 4 The mover of the upper mover module 30 is numbered 21. Figure 4 If the mover number of the lower mover module 30 is 22, then... Figure 4 The upper moving sub-module (i.e., moving sub-module number 21) is matched with the first cutting and forming direction. Figure 4The lower moving sub-module (i.e., moving sub-module number 22) is matched with the second cutting and forming direction, thus establishing a correspondence between the identification information of the moving sub-module and the orientation of the second material received by the moving sub-module. Based on the identification information of the moving sub-module, the orientation of the received second material can be determined. For example, based on the parity of the moving sub-module's moving sub-number, the orientation of the second material received by the moving sub-module (such as...) can be determined. Figure 4 The two second materials 11 shown in the figure are oriented in opposite directions.

[0057] By determining the moving sub-module with matching identification information based on the cutting direction of the cutting equipment before controlling at least one moving sub-module to be in the placement position, it is ensured that the moving sub-module matching the cutting direction receives the cut second material. The orientation of the received second material can be determined according to the identification information of the moving sub-module. The orientation of the second material in the moving sub-module can be clearly determined without additional manual intervention or additional second material orientation detection process, which is conducive to improving the overall processing efficiency of the material.

[0058] Optionally, the motion control method for the moving submodule further includes at least one of the following: determining the orientation information of the second material based on the identification information of the moving submodule, and sending the orientation information of the second material to the processing equipment that processes the second material; sending the identification information of the moving submodule carrying the second material to the processing equipment that processes the second material, so that the processing equipment determines the orientation information of the second material. Wherein, the orientation information of the second material is used to represent the orientation of the second material.

[0059] In some embodiments, at least one processing device for processing the second material received by the mover module is also distributed around the stator track. For example, the processing device may be a dispensing machine, a folding robot, etc.

[0060] In some embodiments, a mapping relationship between the identification information of the moving submodule and the orientation information of the second material can be pre-configured. After the moving submodule receives the second material, the orientation information of the second material corresponding to the identification information of the moving submodule can be determined according to the mapping relationship and the identification information of the moving submodule. The orientation information is then sent to the processing equipment of the subsequent process, so that the processing equipment can know the orientation of the second material without visual recognition, so as to accurately execute the processing action.

[0061] In some embodiments, the mapping relationship between the identification information of the moving submodule and the orientation information of the second material can be pre-stored in the processing equipment. Thus, the processing equipment can determine the orientation information of the second material based on the mapping relationship and the identification information simply by sending the identification information of the moving submodule carrying the second material to the processing equipment that processes the second material.

[0062] For example, the identification information of the moving sub-module includes the moving sub-number, which can be represented by numbers, and the moving sub-number of different moving sub-modules is unique. The orientation information of the second material can be the orientation after cutting in the first cutting and forming direction and the orientation after cutting in the second cutting and forming direction. The identification information of odd-numbered moving sub-modules has a mapping relationship with the orientation after cutting in the first cutting and forming direction, and the identification information of even-numbered moving sub-modules has a mapping relationship with the orientation after cutting in the second cutting and forming direction. When the moving sub-module has an odd number (e.g., 21), the orientation information of the second material it carries can be determined according to the above mapping relationship as the orientation after cutting in the first cutting and forming direction. When the moving sub-module has an even number (e.g., 22), the orientation information of the second material it carries can be determined according to the above mapping relationship as the orientation after cutting in the second cutting and forming direction. That is, according to the parity of the moving sub-module's moving sub-number, the orientation information determined by the processing equipment is opposite, so that the processing equipment can perform the correct processing on the second material according to the orientation information.

[0063] By sending the identification information of the moving submodule or the orientation information of the second material to the processing equipment, the processing equipment can perform correct processing on the second material based on the orientation information.

[0064] Optionally, the motion control method for the moving submodule further includes: after the moving submodule exists at the placement position, controlling at least one moving submodule to move toward the placement position, so that when the external signal indicating the start of cutting the first material is obtained in the next parsing, the moving submodule moving toward the placement position is located at the placement position.

[0065] In some embodiments, a moving submodule existing at the placement position refers to a moving submodule currently receiving the second material at the placement position (such as moving submodule No. 1), which has been confirmed to be carrying the material and is about to enter the next process (such as dispensing), and is about to leave the placement position; controlling at least one moving submodule to move to the placement position means that before the aforementioned moving submodule receiving the second material has left the placement position, another idle moving submodule (such as moving submodule No. 2) is scheduled in advance to move from its current position to the placement position, and serves as a preparatory receiving unit for the next cut; the moving speed of the moving submodule moving to the placement position matches the cutting speed of the first material means that the moving speed is such that when the external signal indicating the start of cutting the first material is obtained in the next analysis, the moving submodule moving to the placement position is exactly at the placement position.

[0066] For example, after a moving sub-module is present at the placement position, another idle moving sub-module is controlled to move towards the placement position, and the running speed of the idle moving sub-module is adjusted so that it arrives at the placement position at the moment the next cutting is started, and is completely synchronized with the cutting action in time and space. This achieves the adaptation of the cutting frequency to the frequency at which the moving sub-module arrives at the placement position, the matching of cutting and load-bearing, and the seamless connection of the load-bearing of different moving sub-modules.

[0067] By controlling at least one moving submodule to move toward the placement position after the presence of the moving submodule, in preparation for the next cutting of the first material, it is beneficial to seamlessly connect and support multiple second materials, thereby improving the material processing efficiency.

[0068] Optionally, the material processing scenario includes an adhesive device for performing at least one adhesive operation, namely dispensing and coating. The motion control method for the moving submodule further includes at least one of the following: acquiring real-time temperature data of the adhesive device and dynamically adjusting the real-time temperature of the adhesive device based on the real-time temperature data to keep the adhesive in a liquid state; controlling the moving submodule carrying the material to be adhesive to move toward the adhesive device, wherein the material to be adhesive is an unprocessed second material or a processed second material.

[0069] In some embodiments, a temperature sensor installed on the adhesive chamber, nozzle, or heating block of the adhesive device is used to collect the actual temperature value of the adhesive in the working state in real time, and the heating power is adjusted based on the actual temperature value to ensure that the adhesive is always in a liquid state (that is, the adhesive has good fluidity) and to avoid excessive viscosity due to low temperature or thermal degradation due to high temperature.

[0070] In some embodiments, the material to be glued can refer to a second material that needs to be subjected to the gluing operation. The material to be glued can be an unprocessed second material, such as a piece of fabric that has just fallen from the cutting process and has not yet undergone any subsequent processing (such as attaching a lining or folding); the material to be glued can also be a processed second material, such as a piece of fabric that has already been liningd or folded and needs to be glued at specific locations (such as edges or seams). The moving submodule carrying the second material is controlled to move to the working area of ​​the gluing equipment (such as below the glue gun), and the second material carried by the moving submodule is kept relatively stationary or moves synchronously with the glue gun.

[0071] For example, Figure 5 This is a schematic diagram of the second material processing process in the motion control method for the moving submodule provided in the embodiments of this application, with reference to... Figure 5The moving module 30 moves on the stator track 40 (the stator track 40 can be of other shapes). During the movement, the moving module 30 first passes through the cutting device 20 to carry the second material 11. Then, the unprocessed second material 11 is used as the material to be glued, and so on... Figure 5 As shown by the dotted line on the left, the moving submodule 30 can move along... Figure 5 The movement proceeds in the direction of the arrow shown, so as to perform an adhesive bonding operation on the second material 11 via the adhesive bonding device 50.

[0072] By dynamically adjusting the real-time temperature of the adhesive bonding equipment based on real-time temperature data, the adhesive in the adhesive bonding equipment is kept in a liquid state, which is beneficial to the success rate of adhesive bonding operations on the second material; and by controlling the movement of the moving sub-module carrying the material to be bonded toward the adhesive bonding equipment, the overall processing efficiency of the material is improved.

[0073] Optionally, the motion control method for the moving sub-module further includes: after the external signal indicating that the adhesive operation is completed is analyzed, controlling the actuator of the moving sub-module assembly to perform a folding operation on the adhesive material carried by the moving sub-module, and controlling the actuator to restore the original state after the folding operation is completed.

[0074] In some implementations, adhesive application completion means that the adhesive application equipment has applied adhesive to a designated location on the material to be bonded (such as the edge, corner, or center of the material) and completed the bonding action. The adhesive application equipment can send signals to indicate the progress of its operations. Upon receiving an external signal from the adhesive application equipment, the signal is parsed. If the external signal indicates that adhesive application is complete, the actuator of the moving submodule assembly can be controlled to fold the bonded material carried by the moving submodule. For example, refer to... Figure 5 After the second material 11 carried by the moving submodule 30 is glued at the adhesive bonding device 50, the moving submodule 30 carries the glued second material 11 (i.e., the glued material) to... Figure 5 The lower dashed line position shown in the diagram allows the actuator 60 (which can be an actuator assembled in the moving submodule 30 or an actuator of an external device) to perform a folding operation on the second material 11.

[0075] In some embodiments, the actuator of the moving submodule assembly can be a folding execution unit integrated on the moving submodule body, such as a servo motor-driven flipping gripper. The folding operation performed by the actuator on the glued material can be a fold, inward fold, edge curling, or flipping, to form a preset structure as the basis for subsequent material cutting. After the folding operation is completed, the actuator returns to its initial position and posture to receive the next material to be glued or to avoid interfering with subsequent processes.

[0076] By controlling the actuator of the moving sub-module assembly based on external signals to fold the glued material, and then controlling the actuator to restore it to its original state after the folding operation, the automatic integration of gluing and folding is achieved, which helps to improve the processing efficiency of materials.

[0077] Optionally, the material processing scenario includes at least one unloading device, and the motion control method for the moving submodule further includes at least one of the following: controlling the moving submodule carrying the material to be unloaded to move to the unloading device, wherein the material to be unloaded is an unprocessed second material or a second material after completing at least one processing step; obtaining the processing result information of the material to be unloaded based on the identification information of the moving submodule carrying the material to be unloaded, and controlling the moving submodule carrying the material to be unloaded to move to the unloading device that matches the processing result information; sending the identification information of the moving submodule carrying the material to be unloaded to the unloading device so that the unloading device determines the processing result of the material to be unloaded and performs the corresponding unloading operation based on the processing result.

[0078] In some embodiments, the material to be unloaded is a second material that has completed the current process and is ready for unloading. That is, the second material can be either an unprocessed second material (such as a second material that needs to be reworked after cutting, or a second material that can be unloaded directly after cutting) or a second material that has completed at least one processing step (such as completing folding, gluing, etc.).

[0079] In some embodiments, based on the processing results, the materials to be unloaded can be divided into qualified or unqualified products, and qualified and unqualified products can be unloaded by a single unloading device. Alternatively, unloading can be performed by a first unloading device for acquiring qualified products and a second unloading device for collecting unqualified products. Based on the identification information of the moving submodule carrying the materials to be unloaded, the processing result information of the materials to be unloaded is obtained, thereby determining whether the materials to be unloaded are qualified or unqualified. The moving submodule carrying the materials to be unloaded is then controlled to move to the receiving area corresponding to the matching unloading device, thereby achieving automatic delivery of the materials to be unloaded. The aforementioned second material, which is a qualified product, can be transported to other processing areas for further processing, or it can be directly transported out as a finished product. For example, refer to... Figure 5 The feeding equipment can provide Figure 5 The first feeding device 71 or the second feeding device 72 shown in the figure correspond to different channels on the moving track.

[0080] In some embodiments, the identification information (e.g., the actuator number) of the actuator is read, and the processing status log recorded by the actuator in the whole process is queried from the database. Based on the processing status log, the processing result information (e.g., processing successful or processing failed) of the current material to be unloaded is determined, and a matching unloading device is selected according to the processing result information, and the material to be unloaded is moved to the unloading device.

[0081] In some embodiments, the identification information of the moving submodule carrying the material to be unloaded is sent to the unloading device. The unloading device determines the processing result based on a mapping table between the identification information and the processing result, and performs the corresponding unloading operation according to the processing result. The mapping table between the identification information and the processing result can be stored locally on the unloading device, in the cloud, or on a host computer. When the mapping table is stored in the cloud or on a host computer, the unloading device obtains the mapping table via communication to determine the processing result. Based on the processing result, the unloading device can perform a qualified product unloading operation or a non-qualified product unloading operation, thereby placing the qualified or non-qualified products in the corresponding area (e.g., qualified products are placed in a qualified product collection box, and non-qualified products are placed in a non-qualified product collection box).

[0082] By controlling the movement of the moving submodule carrying the material to be unloaded to the feeding equipment, the processing result information or the identification information of the moving submodule carrying the material to be unloaded is sent to the feeding equipment, realizing intelligent decision-making for the feeding operation of the material to be unloaded, which is conducive to improving the overall processing efficiency of the material.

[0083] Optionally, the second material is a sheet material, and / or, the second material is a flexible material, and the method further includes at least one of the following: after determining that a moving sub-module exists at the placement position, controlling the adsorption mechanism assembled on the moving sub-module at the placement position to start the adsorption operation; when the external signal indicating air pressure information is obtained, determining whether the second material is in contact with the adsorption mechanism based on the air pressure information; when the external signal indicating that the first material has been cut is obtained, determining whether the second material is fixed to the moving sub-module based on the obtained air pressure information; after the actuator assembled on the moving sub-module performs a folding operation on the adhesive finished material carried by the moving sub-module and before the actuator returns to its original state, controlling the first adsorption area of ​​the adsorption mechanism to stop the adsorption operation and controlling the second adsorption area of ​​the adsorption mechanism to maintain the adsorption operation, so that after the actuator returns to its original state, the folded adhesive finished material is located in the second adsorption area of ​​the adsorption mechanism; before the moving sub-module is located at the unloading position and the unloading device corresponding to the unloading position performs the unloading operation, controlling the adsorption mechanism to stop adsorption.

[0084] For example, Figure 6 This is a schematic diagram of the motion control method for the moving submodule provided in the embodiments of this application, in which the moving submodule carries the second material by adsorption. Figure 1,refer to Figure 6 As shown, during the movement of the moving sub-module 30 in the stator track 40, the moving sub-module 30 is equipped with a carrier 31, a wireless processing module 32, a motor shaft 33, an air pump 34, an air pipe 35, and an air hole 36. The wireless processing module 32 is used to receive signals (e.g., external signals) and send signals. The motor shaft 33 can be used to drive the carrier 31 to rotate, so as to freely control the relative position of the air hole 36 and the cutting device 20. An adsorption mechanism is formed by the air pump 34, the air pipe 35, and the air hole 36. Based on the adsorption effect of the adsorption mechanism, the second material cut by the cutting device 20 is adsorbed onto the carrier 31 of the moving sub-module 30.

[0085] Figure 7 This is a schematic diagram of the motion control method for the moving submodule provided in the embodiments of this application, in which the moving submodule carries the second material by adsorption. Figure 2 ,refer to Figure 6 , 7 As shown, the motor shaft 33 can drive the carrier 31 to rotate, thereby adjusting the orientation of the second material 11 carried by the carrier 31. For example, Figure 8 This is a schematic diagram of rotating the second material in the motion control method of the moving submodule provided in the embodiments of this application, specifically for... Figure 4 The second material 11 with two orientations shown in the figure, such as Figure 8 As shown, the motor shaft 33 can be used to... Figure 4 The second material 11 located above (i.e. Figure 8 The second material 11 shown on the left is rotated (e.g., according to...). Figure 8 The arrow shown is rotated 180° to obtain... Figure 8 The second material 11, shown on the right side, is oriented in a certain direction, thus allowing... Figure 4 The two second materials 11 shown in the figure are rotated to the same orientation, so that the subsequent processing equipment does not need to adjust the operation according to the different orientations of the materials, which helps to simplify the processing operation of the processing equipment and improve the processing efficiency.

[0086] In some embodiments, the second material is a sheet material and / or a flexible material. The sheet material is a material whose thickness is much smaller than its length and width dimensions (e.g., the thickness is less than a preset ratio of length or width) (e.g., fabric cut pieces, film), and the flexible material is a variable and stretchable material (e.g., knitted fabric, elastic fabric).

[0087] In some embodiments, a position sensor determines that a certain moving sub-module is located at the placement position. The moving sub-module is about to receive the newly cut second material. Specifically, the second material obtained by cutting falls onto the moving sub-module by natural gravity after it falls off the first material. At the same time, the adsorption mechanism assembled on the moving sub-module located at the placement position is controlled to start adsorption, so as to establish a negative pressure environment to provide adsorption force for the second material. This avoids problems such as material displacement, flipping or falling based on the mode of first dropping and then adsorption.

[0088] In some embodiments, the external signal represents air pressure information. The source of the external signal can be a pressure sensor on the moving module, which is used to collect air pressure information within the adsorption chamber. The air pressure information is used to determine whether the second material has settled and formed an effective seal, thereby forming a non-visual perception of the second material.

[0089] In some embodiments, after the actuator of the moving submodule performs a folding operation on the adhesive finished material carried by the moving submodule and before the actuator returns to its original state, the first adsorption area of ​​the adsorption mechanism is controlled to stop the adsorption operation, and the second adsorption area of ​​the adsorption mechanism is controlled to maintain the adsorption operation. The first adsorption area refers to the area where the folded adhesive finished material is prohibited from being located after the folding operation; the second adsorption area refers to the area where the folded adhesive finished material needs to be located after the folding operation. Therefore, by setting different adsorption operations for the first and second adsorption areas, after the actuator returns to its original state, the folded adhesive finished material can be accurately located in the second adsorption area of ​​the adsorption mechanism, thereby facilitating subsequent processing or unloading.

[0090] For example, Figure 9 This is a schematic diagram of the folding of the second material by the moving submodule in the motion control method of the moving submodule provided in the embodiments of this application, as shown below. Figure 9 As shown, Figure 9 The vehicle 31 in the middle has a foldable structure, and the vehicle 31 can be folded down. Figure 9 The dotted lines in the diagram indicate that the central axes are brought closer together to achieve a folding effect. Figure 9 The central axis shown in the diagram is hinged to the two carrier plates on either side of the central axis, thus forming a foldable carrier 31. Exemplarily, the moving submodule may include a drive mechanism containing a drive motor. The drive motor drives transmission components (such as telescopic rods, rotating shafts, etc.) to move, thereby causing the multiple folding components (such as the aforementioned carrier plates) in the carrier 31 to change angles. When the carrier 31 is folded, its top view of the folded effect can be seen as follows... Figure 9 As shown in the intermediate schematic diagram, the second material 11 on the carrier 31 is folded along the central axis. This second material 11 is the aforementioned adhesive-finished material, and the folded surface is the adhesive surface of the adhesive-finished material. When the carrier 31 is unfolded from its folded shape, as shown in the diagram... Figure 9 As shown in the schematic diagram on the right, the folded adhesive material is fixed to one side of the carrier 31. During the aforementioned folding process, air holes can be provided on the two plates of the carrier 31 to achieve the adsorption function in conjunction with an air pump and air pipes. Figure 9 The region above the central axis can be understood as the first adsorption region. Figure 9 The region below the central axis can be understood as the second adsorption region.

[0091] In some implementations... Figure 9 The folding operation shown can also be implemented by two or more moving submodules. For example, Figure 9 The vehicle above the central axis is the carrier of moving submodule A, and the vehicle below the central axis is the carrier of moving submodule B. The folding process will not be described here.

[0092] In some embodiments, after the cutting device has cut the first material and the second material has been separated and fallen, the cutting device sends the aforementioned external signal. The external signal is interpreted to indicate that the first material has been cut. Based on the air pressure information, it is determined whether the second material is adsorbed onto the moving submodule. Being fixed onto the moving submodule means that the second material is adsorbed and has no relative displacement. When the moving submodule has moved to the feeding position (i.e., the receiving area of ​​the feeding device), the adsorption mechanism is controlled to stop adsorbing the second material to actively release the adsorption vacuum, avoiding interference between the adsorption force and the feeding device during subsequent feeding operations, thereby facilitating safe feeding.

[0093] By utilizing the adsorption mechanism to initiate adsorption, it is beneficial to ensure that the second material is stably placed on the moving module under the action of gravity. By controlling the adsorption mechanism to stop adsorption, safe material unloading is achieved. Differentiated control of the adsorption operation in different adsorption areas of the adsorption mechanism helps to improve the accuracy of fixing the folded adhesive material in place and improve the precision of material processing.

[0094] Optionally, the motion control method for the moving sub-modules further includes: controlling multiple moving sub-modules to be located at corresponding placement positions and adsorbing the same second material, wherein the multiple moving sub-modules are located on the same stator track, or the multiple moving sub-modules are located on different stator tracks.

[0095] In some embodiments, before the second material is cut and separated, multiple moving sub-modules are synchronously scheduled to stop at preset placement positions. The placement positions corresponding to these multiple moving sub-modules are spatially aligned with the long side or symmetrical structure of the second material, ensuring that these multiple moving sub-modules can share the weight of the second material during adsorption. The multiple moving sub-modules can be located on the same stator track (e.g., arranged one after the other on the same stator track) or on different stator tracks (e.g., on at least two parallel independent stator tracks to achieve coordinated adsorption of the second material in the width direction).

[0096] The adsorption mechanism of multiple moving modules can be controlled to act on the same piece of second material simultaneously, forming synergistic adsorption rather than single-point adsorption. This makes it suitable for large-sized, thin, and highly flexible second materials, avoiding warping, curling, or deformation of the second material under single-point adsorption.

[0097] By controlling multiple moving sub-modules to be located at their respective placement positions and adsorbing the same second material, it is beneficial to achieve safe loading of the second material.

[0098] Optionally, at least one image detection device is configured in the material processing scenario, and the motion control method of the moving submodule further includes: acquiring an image of the material to be detected, wherein the material to be detected is an unprocessed second material, or the material to be detected is a second material after completing at least one processing step; acquiring a template image corresponding to the material to be detected; after the image of the material to be detected and the template image are successfully matched, determining the detection result as qualified, otherwise determining the detection result as abnormal; and controlling the moving submodule carrying the detected material to move based on the detection result.

[0099] In some embodiments, an image acquisition device (e.g., a camera) can be used to acquire images of the material to be inspected, thereby obtaining an image of the material to be inspected. The material to be inspected is an unprocessed second material (e.g., a second material that needs to be reworked after cutting, or a second material that can be directly cut after cutting), or the material to be inspected is a second material that has completed at least one processing step (e.g., folding, gluing, etc.).

[0100] In some embodiments, the template image corresponding to the material to be tested is a preset image, which may also be called a reference image or a baseline image. The template image can be used to represent the appearance characteristics of qualified materials. In some embodiments, a correspondence between the material processing steps, the initial material shape (e.g., the shape of an unprocessed second material) and the template image can be preset, so that the template image corresponding to the material to be tested can be determined based on the correspondence, the initial material shape, and the material processing steps of the material to be tested.

[0101] After determining the template image corresponding to the material to be inspected, the image of the material to be inspected and the template image are matched. For example, an image inspection device can be used to match the image of the material to be inspected and the template image. The image inspection device can calculate the similarity between the image of the material to be inspected and the template image. If the similarity is greater than a preset similarity, the match is considered successful and the inspection result is qualified. Conversely, if the similarity is less than or equal to the preset similarity, the match is considered unsuccessful and the inspection result is abnormal.

[0102] In some embodiments, the movement of the moving submodule carrying the detected material is controlled based on the detection results. For example, a feeding track is determined according to the detection results. The feeding track can be a qualified product channel or a non-qualified product channel, and the moving submodule can be controlled to enter the corresponding feeding track according to the detection results to move to the corresponding feeding device.

[0103] By detecting the material to be detected based on its image and corresponding template image, the efficiency and accuracy of material detection can be improved. By determining the movement state of the moving submodule based on the detection results, it is possible to distinguish and process materials with different detection results, thereby improving the overall processing efficiency of materials.

[0104] The motion control method for moving sub-modules provided in this application obtains the real-time position information of each moving sub-module; after receiving an external signal, it parses the external signal; when the parsed external signal indicates that the cutting of the first material has begun, it controls at least one moving sub-module to be positioned at the placement position based on the real-time position information of each moving sub-module, so as to receive a piece of second material obtained by cutting the first material, thereby solving the technical problem of low overall material processing efficiency in related technologies.

[0105] It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions, and although a logical order is shown in the flowchart, in some cases the steps shown or described may be executed in a different order than that shown here.

[0106] This application also provides a motion control device for a moving submodule. It should be noted that this motion control device can be used to execute the motion control method for a moving submodule provided in this application. The following describes the motion control device for a moving submodule provided in this application.

[0107] According to an embodiment of this application, a motion control device for implementing the above-described motion control method for a moving submodule is also provided, such as... Figure 10As shown, the device includes: a memory 1001 storing an executable program; and a processor 1002 for running the program, wherein the program executes the motion control method of the aforementioned motion submodule during runtime.

[0108] Those skilled in the art will understand that Figure 10 The structure shown is for illustrative purposes only. The motion control device for the moving submodule can also be an electronic device such as a host computer, industrial control computer, or computer. Figure 10 This does not limit the structure of the aforementioned electronic device. For example, electronic devices may also include components that are more... Figure 10 The more or fewer components shown (such as network interfaces, display devices, etc.), or having the same Figure 10 The different configurations shown.

[0109] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be implemented by a program instructing the hardware related to the terminal device. The program can be stored in a computer-readable storage medium, which may include: flash drive, read-only memory (ROM), random access memory (RAM), disk or optical disk, etc.

[0110] According to embodiments of this application, a material processing system is also provided, such as... Figure 11 As shown, the material processing system includes a moving sub-module 30, a stator track 40, a cutting device 20, and a control device 80. The cutting device 20 is distributed along the stator track 40. The control device 80 is used to control the moving sub-modules 30 to move along the stator track 40, acquire the real-time position information of each moving sub-module 30, and, when the external signal indicates that the cutting of the first material has started, control at least one moving sub-module 30 to be positioned at the placement position based on the real-time position information of each moving sub-module 30, so as to receive a piece of second material obtained by the cutting device 20 from the cutting of the first material.

[0111] In some embodiments, the control device 80 is used to execute the steps in the motion control method for the moving submodule provided in the above embodiments.

[0112] The control device acquires the real-time position information of each moving submodule, and when the external signal indicates that the cutting of the first material has started, it controls at least one moving submodule to be in the placement position to receive a piece of second material obtained from the cutting of the first material, which helps to improve the overall processing efficiency of the material.

[0113] Embodiments of this application also provide a computer-readable storage medium. Optionally, in embodiments of this application, the storage medium can be used to store the program code executed by the motion control method for the moving submodule provided in Embodiment 1.

[0114] Optionally, in the embodiments of this application, the storage medium may be located in any computer terminal in a group of computer terminals in a computer network, or in any mobile terminal in a group of mobile terminals.

[0115] This application also provides a computer program product, which, when executed on a data processing device, is suitable for performing the motion control method steps of a motion submodule.

[0116] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0117] In the above embodiments of this application, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0118] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. The device embodiments described above are merely illustrative; for example, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of units or modules may be electrical or other forms.

[0119] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of the embodiments of this application, depending on actual needs.

[0120] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0121] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard drive, magnetic disk, or optical disk.

[0122] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A motion control method for a moving submodule, characterized in that, Applied to material processing scenarios, the method includes: Obtain the real-time position information of each moving submodule; After receiving an external signal, the external signal is analyzed; When the external signal indicating the start of cutting the first material is obtained, at least one moving submodule is controlled to be positioned at the placement position based on the real-time position information of each moving submodule to receive a piece of second material obtained from cutting the first material.

2. The method according to claim 1, characterized in that, The method further includes at least one of the following: When the external signal indicating that the first material is being cut is obtained, the moving submodule receiving the second material is controlled to remain stationary; or, based on the received external signal indicating that the first material is being cut, the moving speed of the moving submodule receiving the second material is controlled so that the moving speed of the moving submodule matches the speed of cutting the first material. After the external signal indicating that the first material has been cut is obtained, the moving submodule carrying the second material is controlled to accelerate.

3. The method according to claim 1, characterized in that, The material processing scenario includes at least one cutting device for cutting the first material, and each of the second materials has an irregular shape. The method further includes: Before starting to cut the first material, obtain the identification information of each moving sub-module that moves toward the placement position; Based on the real-time position information of each of the moving sub-modules, at least the identification information of the moving sub-module closest to the placement position is sent to the cutting device, so that the cutting device selects the direction that matches the identification information of the moving sub-module as the cutting direction, wherein the cutting device selects different directions in two consecutive steps.

4. The method according to claim 1, characterized in that, The material processing scenario includes at least one cutting device for cutting the first material, and each of the second materials has an irregular shape; before controlling at least one moving submodule to be in the placement position, the method further includes: Based on the cutting direction of the cutting device, a moving sub-module matching the identification information is determined, wherein the cutting device selects different directions in two consecutive steps.

5. The method according to claim 1, characterized in that, The method further includes at least one of the following: Based on the identification information of the moving submodule, the orientation information of the second material is determined, and the orientation information of the second material is sent to the processing equipment that processes the second material; The identification information of the moving submodule carrying the second material is sent to the processing equipment that processes the second material, so that the processing equipment can determine the orientation information of the second material.

6. The method according to claim 1, characterized in that, The method further includes: After a moving submodule is present at the placement position, at least one moving submodule is controlled to move toward the placement position so that when the external signal indicating the start of cutting the first material is obtained in the next parsing, the moving submodule that moved toward the placement position is located at the placement position.

7. The method according to claim 1, characterized in that, The material processing scenario includes an adhesive bonding device, which is used to perform at least one adhesive bonding operation, namely, dispensing and coating. The method further includes at least one of the following: The real-time temperature data of the adhesive bonding equipment is obtained, and the real-time temperature of the adhesive bonding equipment is dynamically adjusted based on the real-time temperature data so that the adhesive of the adhesive bonding equipment is kept in a liquid state. The moving submodule carrying the material to be glued is controlled to move toward the adhesive device. The material to be glued is an unprocessed second material or a processed second material.

8. The method according to claim 7, characterized in that, The method further includes: After the external signal indicating that the adhesive operation is completed is analyzed, the actuator of the moving sub-module assembly is controlled to fold the adhesive material carried by the moving sub-module, and after the folding operation is completed, the actuator is controlled to restore the original state.

9. The method according to claim 1, characterized in that, The material processing scenario includes at least one unloading device, and the method further includes at least one of the following: The control module carrying the material to be unloaded moves toward the unloading device. The material to be unloaded is an unprocessed second material or a second material that has completed at least one processing step. Based on the identification information of the moving submodule carrying the material to be unloaded, the processing result information of the material to be unloaded is obtained, and the moving submodule carrying the material to be unloaded is controlled to move towards the unloading device that matches the processing result information; The identification information of the moving submodule carrying the material to be unloaded is sent to the unloading equipment so that the unloading equipment can determine the processing result of the material to be unloaded and perform the corresponding unloading operation based on the processing result.

10. The method according to claim 1, characterized in that, The second material is a sheet material, and / or the second material is a flexible material, and the method further includes at least one of the following: After determining that a moving sub-module exists at the placement location, the adsorption mechanism assembled on the moving sub-module at the placement location is controlled to start the adsorption operation; When the external signal representing the air pressure information is obtained through analysis, it is determined whether the second material is in contact with the adsorption mechanism based on the air pressure information; When the external signal indicates that the first material has been cut, the system determines whether the second material is fixed to the moving submodule based on the obtained air pressure information. After the actuator assembled in the moving sub-module performs a folding operation on the adhesive finished material carried by the moving sub-module and before the actuator returns to its original state, the first adsorption area of ​​the adsorption mechanism is controlled to stop the adsorption operation and the second adsorption area of ​​the adsorption mechanism is controlled to maintain the adsorption operation, so that after the actuator returns to its original state, the folded adhesive finished material is located in the second adsorption area of ​​the adsorption mechanism. Before the moving submodule is in the feeding position and the feeding device corresponding to the feeding position performs the feeding operation, the adsorption mechanism is controlled to stop adsorption.

11. The method according to claim 10, characterized in that, The method further includes: Multiple moving sub-modules are controlled to be located at corresponding placement positions and to adsorb the same second material. The multiple moving sub-modules are located on the same stator track, or at least some of the multiple moving sub-modules are located on different stator tracks.

12. The method according to claim 1, characterized in that, The material processing scenario is equipped with at least one image detection device, and the method further includes: Acquire an image of the material to be inspected, wherein the material to be inspected is an unprocessed second material, or the material to be inspected is a second material after completing at least one processing step; Obtain the template image corresponding to the material to be inspected; If the image of the material to be inspected and the template image are successfully matched, the inspection result is determined to be qualified; otherwise, the inspection result is determined to be abnormal. Based on the detection results, the movement of the moving submodule carrying the detected material is controlled.

13. A motion control device for a moving sub-module, characterized in that, The device includes: Memory, which stores executable programs; A processor for running the program, wherein the program executes the motion control method of the moving submodule according to any one of claims 1 to 12 when it runs.

14. A material processing system, characterized in that, The system includes a moving submodule, a stator track, cutting equipment, and a control device, wherein: The cutting equipment is distributed along the stator track; The control device is used to control the moving sub-module to move along the stator track, obtain the real-time position information of each moving sub-module, and, when the external signal indicates that the cutting of the first material has started, control at least one moving sub-module to be positioned at the placement position based on the real-time position information of each moving sub-module, so as to receive a piece of second material obtained by the cutting device from the first material.

Images