Preparation method of high-definition high-anti-glare transparent substrate

Abstract

This invention discloses a method for preparing a high-definition, high-anti-glare transparent substrate in the field of glass surface treatment technology. The method includes: providing a transparent substrate; electrostatically atomizing and spraying a SiO2-based liquid composition onto the substrate surface to form an anti-glare layer; curing the anti-glare layer; and micro-polishing the cured anti-glare layer using a nano-pulse laser to selectively melt, flow, and reconstruct the surface microstructure, eliminating spikes and burrs while retaining microstructural undulations. This invention, through environmentally friendly spraying combined with nano-laser micro-polishing technology, precisely controls the microscopic uneven structure of the anti-glare layer, achieving high anti-glare standards in reflected light diffusion factor (RDF) while maintaining an image clarity modulation transmission factor (MTF) ≥99% and a flash point S ≤1%, approaching the original display effect of the transparent substrate. This overcomes the technical contradiction between anti-glare and clarity, supports custom RDF value adjustment, is compatible with 2D / 2.5D / 3D and flexible substrates, and is suitable for various scenarios such as automotive displays and high-end commercial displays.

Description

Technical Field

[0001] This invention relates to the field of glass surface treatment technology, and in particular to a method for preparing a high-definition, high-anti-glare transparent substrate. Background Technology

[0002] Glare, a core visual interference problem in the display field, is caused by light sources reflecting off a smooth, transparent substrate surface and then entering the human eye. It severely reduces the accuracy and comfort of screen viewing in scenarios such as automotive and commercial displays, becoming a key bottleneck restricting the upgrade of high-definition display experiences. Existing anti-glare technologies present an inherent technical contradiction between anti-glare effectiveness and image clarity: the stronger the diffuse reflection effect of the anti-glare layer, the greater the scattering interference on the original image on the screen, and the lower the image clarity. Currently, the industry generally achieves a compromise by sacrificing some anti-glare effect or image clarity. For example, a glass for eliminating reflected images disclosed in patent document CN105731824A mainly involves coating a glass substrate with a silicon dioxide anti-reflection layer to reduce the interference of virtual images caused by reflections from people or objects inside the vehicle under light illumination, but this results in a certain degree of reduction in the resolution of the in-vehicle screen. Therefore, existing anti-glare structures cannot meet the integrated requirements of high anti-glare, high definition, and low flicker in automotive displays, high-end commercial displays, and other fields. Summary of the Invention

[0003] To overcome the shortcomings of existing anti-glare methods for displays, such as reduced screen clarity, the technical problem to be solved by this invention is to provide a method for preparing a high-definition, high-anti-glare transparent substrate that can achieve synergistic optimization of high anti-glare and high definition.

[0004] The technical solution adopted by this invention to solve its technical problem is: A method for preparing a high-definition, high-anti-glare transparent substrate includes the following steps: S1: Provides a transparent substrate; S2: Spray the SiO2-based liquid composition onto the surface of the transparent substrate to form an anti-glare layer; S3: Curing treatment is performed on the anti-glare layer; S4: The surface of the cured anti-glare layer is micro-polished using a nano-pulse laser, which causes selective melting, flow and reconstruction of the microstructure of the anti-glare layer surface to eliminate micro-peaks and burr defects while retaining microstructure undulations.

[0005] Furthermore, after step S1 and before step S2, a plasma cleaning step is included to activate the silanol bonds on the substrate surface.

[0006] Furthermore, the SiO2-based liquid composition in step S2 is a mixture of SiO2 and one or more solvents selected from methanol, ethanol, isopropanol, methyl acetal, and acetone.

[0007] Furthermore, in step S2, the transparent substrate is preheated at a temperature of 20℃ to 120℃ for 10s to 60s. Then, an anti-glare layer is formed on the transparent substrate using electrostatic atomization spraying. The distance between the spray gun and the transparent substrate is 40mm to 150mm, and the atomization pressure is 0.20MPa to 0.50MPa.

[0008] Furthermore, during the spraying process, the spray gun performs a contour-following reciprocating spraying motion while the transparent substrate moves forward. Each time the spray gun sprays, the substrate moves forward by 4mm to 8mm. The amount of spraying material is 1g / min to 20g / min. After spraying, the substrate is left to stand for 0 to 30 minutes before proceeding to step 3.

[0009] Furthermore, in step S3, the anti-glare layer is cured by heating at a temperature of 150℃ to 400℃ for a time of 30 min to 60 min.

[0010] Furthermore, in step S4, the wavelength of the nanopulse laser is 1000 nm to 1200 nm, the pulse width is 10 to 50 ns, the spot diameter is 5 mm to 10 mm, the energy density is 500 to 2000 W / cm², and the scanning speed is 200 to 500 mm / s.

[0011] Furthermore, for 2D planar substrates, reciprocating scanning is used for micro-polishing; for curved or irregularly shaped 3D transparent substrates, a multi-axis linkage platform drives the laser scanning head to move along a preset path, and adjusts the laser incident angle and focal length in real time according to the curved shape of the transparent substrate to ensure that the laser spot is always focused on the surface of the anti-glare layer.

[0012] Furthermore, after step S4, a baking annealing process is included, with the annealing temperature being 150℃±10℃.

[0013] Furthermore, step S5 is included after step S4. After micro-polishing, the workpiece is first inspected for optical data and appearance. If the inspection is qualified, the workpiece is transferred to the anti-reflective coating and anti-fouling film processing process. Defective products are returned to step S2 or step S4 for local secondary micro-polishing repair according to the defect type.

[0014] The beneficial effects of this invention are as follows: This invention adopts an environmentally friendly electrostatic atomization spraying process combined with nano-laser micro-polishing technology. By precisely controlling the microscopic concave-convex structure of the anti-glare layer, the reflected light diffusion factor (RDF) reaches a high anti-glare standard while the image clarity modulation transmission factor (MTF) is ≥99%, approaching the original display effect of a transparent substrate. This solves the trade-off between anti-glare effect and image clarity in existing technologies, meeting the integrated needs of high anti-glare and high clarity in fields such as automotive displays and high-end commercial displays. At the same time, nano-laser micro-polishing can eliminate microscopic defects that cause flash points, flares, and uneven scattering from the root, making the flash point S≤1%, achieving a visually flare-free level, eliminating local flare interference, and significantly improving visual comfort. In addition, nano-laser micro-polishing has no mechanical stress, no abrasive residue, does not damage the film layer and substrate, has a high yield and good consistency, and the microscopic morphology can be designed and reproduced, resulting in strong stability in mass production. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the finished product structure of the present invention; Figure 2 This is a schematic diagram of the structure of the anti-glare layer before micro-polishing in this invention; Figure 3 This is a schematic diagram of the structure of the anti-glare layer after micro-polishing in this invention.

[0016] The markings in the diagram are as follows: 1-Transparent substrate; 2-Ink layer; 3-Finished anti-glare layer; 4-Functional film layer one; 5-Functional film layer two; 6-Anti-glare layer before micro-polishing; 7-Laser energy beam; 8-Laser polishing head; 9-Anti-glare layer after micro-polishing. Detailed Implementation

[0017] The invention will be further described below with reference to the accompanying drawings.

[0018] like Figure 1 As shown, the high-definition, high-anti-glare transparent substrate of the present invention includes a transparent substrate 1, an ink layer 2, a finished anti-glare layer 3, a functional film layer 4, and a functional film layer 5. The finished anti-glare layer 3 is located between the transparent substrate 1 and the ink layer 2, and the functional film layer 4 and the functional film layer 5 are sequentially disposed on top of the finished anti-glare layer 3, forming a multi-layered composite functional structure.

[0019] Specifically, the preparation method used in preparing the above-mentioned high-definition, high-anti-glare transparent substrate includes the following steps: S1: Provide a transparent substrate 1. The transparent substrate 1 can be a variety of transparent substrates such as glass, and there are no shape restrictions. It can be used for 2D planes, 2.5D / 3D curved surfaces, and ultra-thin flexible glass, and can meet the high-end display needs of multiple scenarios.

[0020] S2: The SiO2-based liquid composition is sprayed onto the surface of the transparent substrate 1 to form an anti-glare layer. The effective component of the SiO2-based liquid composition is mainly SiO2 in the form of hydrolyzable hydrocarbon silanes that can chemically bond with silicon atoms. The auxiliary solvent can be one or a mixture of methanol, ethanol, isopropanol, methyl acetal, and acetone. Before spraying, the transparent substrate 1 is first subjected to plasma cleaning to fully activate the silanol bonds of SiO2 on the glass substrate surface, so that it has a better bonding strength with the nano-SiO2 in the spraying material. The water droplet angle of the glass surface after plasma bombardment is <20°, thereby significantly improving the adhesion between the anti-glare layer and the substrate. After cleaning, the transparent substrate 1 is preheated at a temperature of 20℃ to 120℃ for 10s to 60s. Then, the liquid material is atomized and applied to the substrate surface by a multi-axis electrostatic atomizing spray gun to form a surface uneven microstructure.

[0021] S3: Curing the anti-glare layer. The anti-glare layer is cured by heating at a temperature of 150℃ to 400℃ for 30 to 60 minutes, allowing the effective components in the SiO2-based liquid composition to fully cross-link and form a stable anti-glare film structure.

[0022] S4: The surface of the cured anti-glare layer is micro-polished using a nano-pulse laser, causing selective melting, flow, and reconstruction of the microstructure on the surface of the anti-glare layer to eliminate microscopic peaks and burrs while retaining microstructural undulations. For example... Figure 2 As shown, the surface of the anti-glare layer 6 before micro-polishing after spraying and curing exhibits a disordered and non-uniform microstructure, including nanoscale defects such as spikes, burrs, stacked particles, and irregular edges. During micro-polishing, the laser energy beam 7 is emitted from the laser polishing head 8 and acts on the surface of the anti-glare layer. The laser energy is selectively absorbed by the micro-protrusions on the surface of the anti-glare layer, generating localized high temperatures in a very short time. This causes the defective microstructures to melt, flow, and self-level due to surface tension, forming a structure resembling... Figure 3 The anti-glare layer 9 shown in the diagram has a relatively regular shape and size microstructure. Nanopulse laser micro-polishing eliminates adverse factors affecting MTF and flash point at the nanoscale microstructure level, while retaining sufficient microstructure undulations to maintain high anti-glare capability, achieving a precise balance between clarity and anti-glare effect.

[0023] When applying the anti-glare coating, the following process can be followed: The real-time distance between the spray gun and the transparent substrate can be selected from 40mm to 150mm. Spraying distance is a key geometric parameter affecting coating uniformity, film thickness, and electrostatic adsorption efficiency. Too close a distance can easily lead to uneven film thickness, sagging, and abnormal microstructure stacking; too far a distance will reduce the electrostatic field's adsorption force on charged droplets, resulting in increased paint rebound, dry spray powdering, and material waste. This distance range matches the electrostatic atomization characteristics, ensuring deposition efficiency while maintaining suitable wettability and kinetic energy of the droplets upon reaching the substrate surface, which is beneficial for forming a uniform and controllable uneven microstructure.

[0024] The atomization pressure is 0.20 MPa to 0.50 MPa. This parameter directly determines the degree of atomization and droplet size of the SiO2-based liquid composition. Within this pressure range, the liquid kinetic energy is sufficient to overcome surface tension and viscous resistance, allowing the coating to be fully sheared and broken into fine, uniform droplets with high uniformity of mist field distribution. This results in a fine and regular microstructure on the substrate surface, providing a consistent and defect-free initial morphology for subsequent nano- and micro-polishing. If the pressure is below 0.20 MPa, the atomization is coarse, the droplets are large and unevenly distributed, and liquid column spillage and uneven coating are likely to occur. If the pressure is above 0.50 MPa, the droplets may be too fine, which may cause the solvent to evaporate too quickly, and excessive turbulence may cause droplet aggregation, which will damage the electrostatic adsorption effect and the continuity of the film.

[0025] The mist pressure is 0.20 MPa to 0.50 MPa. Mist pressure, also known as fan pressure, is the air pressure that controls the width of the spray fan. This parameter controls the width and geometry of the spray fan and works in conjunction with the atomization pressure. Appropriate fan pressure ensures a reasonable overlap between adjacent spray paths (typically 1 / 2 to 1 / 3) during contour spraying, avoiding paint waste and edge dispersion caused by excessive coverage in a single pass, while also preventing undercoverage leading to exposed substrate and uneven film thickness. This pressure range matches the atomization pressure, ensuring that the mist width is coordinated with the substrate's forward speed and the spray gun's reciprocating motion, guaranteeing the lateral continuity and longitudinal uniformity of the anti-glare layer's surface microstructure, and reducing localized glare defects caused by poor overlap.

[0026] During the spraying process, the spray gun performs a contour-following reciprocating spraying motion while the transparent substrate 1 advances forward. Each spray gun stroke advances the substrate by 4mm to 8mm. This forward distance, combined with the fan-shaped pressure control of the mist width, determines the overlap rate of adjacent sprayed zones. A suitable overlap rate ensures uniform coating thickness and eliminates missed spray streaks, while avoiding excessive overlap that could lead to uneven film thickness, sagging, or abnormal microstructure stacking. This ensures the consistency of the overall microstructure and the stability of the optical performance of the anti-glare layer.

[0027] The spraying material rate is 1g / min to 20g / min. This parameter determines the amount of paint supplied per unit time, directly affecting film thickness and spraying efficiency. The material rate must be matched with the atomization pressure, fan-shaped pressure, and gun distance: if the material rate is too high and atomization is insufficient, it can easily cause sagging, excessive film thickness, and disordered microstructure stacking; if the material rate is too low, it can easily result in exposed substrate and discontinuous film. This range can be flexibly adjusted according to the target anti-glare layer thickness and microstructure depth to ensure that the anti-glare layer has a complete and uniform uneven microstructure.

[0028] After spraying, allow the coating to stand for 0–30 minutes as the flash-drying and leveling stage. This standing time allows the auxiliary solvents (methanol, ethanol, isopropanol, methyl acetal, acetone, etc.) to fully evaporate, and the coating to initially level under surface tension, thus initially setting the anti-glare layer. Appropriate standing time can reduce curing defects (such as bubbles and pinholes) caused by solvent residue, improve film density and surface continuity, prevent solvent boiling from damaging the formed microstructure, provide a stable pre-formed morphology for subsequent curing, and reduce the risk of stress cracking during rapid temperature curing.

[0029] The following process can be used when performing micro-polishing of the anti-glare layer: The wavelength of the nanopulsed laser is selected from the near-infrared band (1000nm–1200nm), which has a high absorption rate for SiO2 materials, with 1100nm being preferred. This band matches the intrinsic absorption characteristics of the SiO2-based anti-glare layer, ensuring that the laser energy is efficiently and selectively absorbed by the surface of the anti-glare layer, generating localized high temperatures in a very short time, achieving only surface micro-melting without damaging the deeper film layers and the transparent substrate. If the wavelength deviates from this range, the material absorption rate decreases significantly, leading to reduced energy utilization, an expanded heat-affected zone, or a need to significantly increase the energy density to be effective, increasing the risk of thermal damage to the film layer and deformation of the substrate.

[0030] The pulse width is on the nanosecond scale (10–50 ns). This pulse timing characteristic can generate instantaneous high temperatures at the micro-protrusions on the surface of the anti-glare layer, causing nanoscale defects such as peaks, burrs, and irregular edges to melt, flow, and self-level due to surface tension. This is followed by rapid cooling and solidification, achieving only surface micro-melting without causing deep thermal diffusion or substrate thermal damage. If the pulse width is too short, the single-pulse energy deposition is insufficient, making it difficult to overcome surface tension and achieve effective melting and flow. If it is too long, the thermal diffusion depth increases, easily leading to overall over-melting of the anti-glare layer, excessive planarization of the microstructure, or even substrate thermal damage, thus compromising the anti-glare performance.

[0031] The laser spot diameter is focused to 5mm–10mm. This spot size ensures that the laser energy density is concentrated on the anti-glare layer surface while balancing the coverage area and processing efficiency of a single scan. Appropriate spot diameter combined with scanning speed allows for a reasonable spot overlap rate, ensuring smooth transitions between adjacent scan trajectories and avoiding localized under-polishing or energy accumulation over-polishing. If the spot is too small, although the energy is concentrated, the scanning efficiency is low, and periodic scanning marks are easily generated due to insufficient overlap; if the spot is too large, the energy density is dispersed, making it difficult to reach the micro-melting threshold of the SiO2 surface, thus weakening the polishing effect.

[0032] The energy density ranges from 500 to 2000 W / cm². This energy density range, combined with nanosecond-level pulse width and near-infrared wavelength, precisely matches the surface micro-melting threshold of the SiO2-based anti-glare layer. The energy density is sufficient to selectively melt, flow, and reconstruct surface micro-protrusions, eliminating undesirable microstructures that affect MTF and flash point, while retaining sufficient microstructure undulations to maintain high anti-glare capability. If the energy density is below 500 W / cm², the surface micro-protrusions do not absorb enough energy, resulting in incomplete melting, and the peaks and burrs cannot be effectively leveled, leading to insignificant MTF improvement and flash point reduction. If the energy density is above 2000 W / cm², the optimal micro-polishing window is exceeded, and the anti-glare layer microstructure is over-melted or even vaporized and ablated, resulting in a significant reduction in RDF and deterioration of anti-glare performance. It may also cause thermal stress damage and micro-cracks.

[0033] The scanning speed is 200–500 mm / s. This speed range, matched with the energy density and spot diameter, determines the energy accumulation and spot overlap rate of the laser beam on the anti-glare layer surface. Within this range, the laser energy deposition rate and the material thermal diffusion rate are essentially balanced, ensuring sufficient melting and smoothing of surface micro-protrusions while avoiding localized over-melting, recast layer buildup, or microstructure damage due to excessive energy accumulation. If the scanning speed is too low, the spot overlap rate is too high, and energy accumulation is severe, easily leading to overall over-polishing of the anti-glare layer, excessive planarization of the microstructure, and a significant decrease in RDF. If the scanning speed is too high, the energy input is insufficient, the micro-protrusions are not fully melted, the polishing effect is reduced, and the improvement in surface roughness and flash point is not significant.

[0034] For 2D planar substrates, reciprocating scanning is used for micro-polishing. For 2.5D / 3D curved surfaces or irregularly shaped transparent substrates, a six-axis linkage platform is used. First, a three-dimensional coordinate system of the workpiece is established. Through program control of multi-axis linkage, the laser incident angle and focal length are adjusted in real time to ensure that the laser beam is perpendicular to the processing point throughout the entire process. The spot is always focused on the surface of the anti-glare layer, and the energy density is constant, avoiding local over-polishing or under-polishing caused by defocusing or off-focusing, and achieving uniform laser energy reception on the curved surface. The motion axis drives the laser scanning head to move at a constant speed along a preset path, and the beam forms a continuous and uniform scanning trajectory on the workpiece surface.

[0035] After micro-polishing, the workpiece undergoes baking and annealing in a tunnel oven at 150℃±10℃. This temperature range is lower than the curing temperature of the anti-glare layer but sufficient to promote thermal relaxation and stress release of surface molecules after micro-polishing. This further stabilizes the rapidly cooled and solidified molten microstructure while preventing stress cracking or secondary deformation of the microstructure caused by rapid temperature differences. Annealing eliminates residual thermal stress generated during laser micro-polishing, improves the bonding stability between the film and the substrate, and provides a denser and more continuous high-quality substrate for subsequent anti-reflective and anti-reflective coatings and antifouling films.

[0036] After baking and cooling to room temperature, the workpiece undergoes optical data inspection and appearance inspection: MTF, flash point (S), and RDF are tested using an SMS-1000 device; microstructure is observed using a scanning electron microscope (SEM); and film adhesion is tested using a cross-cut adhesion tester. Once the inspection is passed, the workpiece proceeds to the anti-reflective coating and antifouling film processing steps. Defective products are returned to step S2 for recoating or to step S4 for localized secondary polishing repair, significantly improving the yield rate.

[0037] The functional film layer described in this invention can be selected according to actual needs: this anti-glare coating can be used directly, exhibiting high adhesion and anti-aging capabilities; it can also be used in combination with an anti-fouling film layer, where an anti-fouling film is further processed on the anti-glare film layer to obtain better resistance to dirt, scratches, and aging; it can be used in combination with an anti-reflective coating to simultaneously achieve anti-glare and anti-reflective effects; or it can be used in combination with both an anti-reflective coating and an anti-fouling film to simultaneously achieve anti-glare, anti-reflective, dirt-resistant, and anti-aging effects. After micro-polishing, the surface of the anti-glare layer becomes denser and more continuous, providing a better substrate for subsequent functional film layers, resulting in stronger bonding and more stable performance of the composite film layer.

[0038] To further verify the effectiveness of the nano-micro-polishing technology, this invention conducted multiple sets of control experiments, and the results are shown in the table below:

[0039] The Distinctness of Image (DOI) evaluation method assesses the penetrating image sharpness of the anti-glare substrate using the modulation transfer factor (MTF). The test principle is as follows: Simulating a display pixel size such as 190ppi or 260ppi (selected according to display requirements), a transparent substrate without an anti-glare layer is placed on the pixel display, and the modulation transfer factor M0 of the transparent substrate without an anti-glare layer is measured; the anti-glare transparent substrate is placed on the pixel display, and the modulation transfer factor M_AG of the anti-glare transparent substrate is measured. The calculation formula is: MTF = M_AG / M0 × 100%. A higher MTF indicates that the image sharpness of the anti-glare transparent substrate is closer to that of the transparent substrate itself, indicating a better display effect of the anti-glare transparent substrate.

[0040] Flash point refers to the bright flare that appears at certain locations when the anti-glare substrate is transmitted through a display. The testing principle is to divide the standard deviation of the grayscale distribution of the captured image by the average speckle contrast. The flash point test formula is: S = σ / μ, where σ is the standard deviation and μ is the average brightness. Within the captured sample area, the more uniform the grayscale, the smaller the flash point; the more flares with abnormal grayscale, the higher the flash point. Comparison of flash point test data with human visual observation shows that: when the flash point S ≤ 1%, there is no visible flash point; when 1 < S ≤ 3%, the visible flash point has a small impact on the display; when 3 < S ≤ 5%, the visible flash point is high and has a significant impact on the display; when S > 5%, the visible flash point is severe and causes great disturbance to the display.

[0041] The anti-glare effect is characterized by the reflection light diffusion effect (Reflection Distribution Function / RDF). Reflection diffusion refers to the scattering of reflected light by the AG surface after the substrate anti-glare microstructure treatment, reducing the intensity of the central mirror reflection and enhancing diffuse reflection to scatter reflected light at various angles. The proportion of this scattering determines the magnitude of the anti-glare effect.

[0042] As shown in the table above, Scheme 1 is a conventional spray coating of an anti-glare layer without nano-micro polishing. The measured sharpness MTF is 78.2%, and the flash point S is 5.24%, indicating a significant decrease in sharpness and a high flash point, which greatly affects the display. Scheme 2 involves nano-micro polishing with an energy density of 1000W / cm², a speed of 500mm / s, and a focusing distance of 120mm. The measured sharpness MTF is 99.5%, and the flash point S is 0.56%, very close to the original display effect. The anti-glare layer has little impact on image sharpness, resulting in a clear and transparent image. Comparing Schemes 1 and 2, the addition of nano-micro polishing technology significantly increases the sharpness MTF and significantly reduces the flash point S, while having a relatively small impact on the anti-glare performance RDF. This demonstrates the effectiveness of nano-micro polishing technology in improving the sharpness and flash point of the anti-glare layer. Comparing Scheme 2 and Scheme 7, Scheme 2 has an MTF of 99.5% and an RDF of 2.9, while Scheme 7 has an MTF of 98.1% and an RDF of 0.5. Analysis of Option 7 revealed that excessive laser micro-polishing energy damaged the microstructure of the anti-glare layer, leading to a significant decrease in the anti-glare performance RDF. Therefore, Option 2, with its nanometer micro-polishing parameters, yielded the best results in this study, achieving a synergistic optimization of high definition, low flash point, and high anti-glare effect.

[0043] This invention only lists high-definition solutions with high anti-glare effects and comparative solutions with obvious differences. Specific examples of adjustable resolution MTF and anti-glare effect RDF are provided only individually and are not listed one by one. By adjusting the combination of parameters such as the energy density and scanning speed of the nanopulse laser, flexible control can be achieved between high resolution (MTF≥99%) and different RDF anti-glare levels to meet the needs of different scenarios such as automotive, commercial displays, and industrial control.

Claims

1. A method for preparing a high-definition, high-anti-glare transparent substrate, characterized in that, Includes the following steps: S1: Provides a transparent substrate; S2: Spraying the SiO2-based liquid composition onto the surface of the transparent substrate to form an anti-glare layer; S3: Curing treatment is performed on the anti-glare layer; S4: The surface of the cured anti-glare layer is micro-polished using a nano-pulse laser, which causes selective melting, flow and reconstruction of the microstructure of the anti-glare layer surface to eliminate micro-peaks and burr defects while retaining microstructure undulations.

2. The method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 1, characterized in that, After step S1 and before step S2, a plasma cleaning step is also included to activate the silanol bonds on the substrate surface.

3. The method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 1, characterized in that, The SiO2-based liquid composition in step S2 is a mixture of SiO2 and one or more solvents selected from methanol, ethanol, isopropanol, methyl acetal, and acetone.

4. The method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 1, characterized in that, In step S2, the transparent substrate is preheated at a temperature of 20℃ to 120℃ for 10s to 60s. Then, an anti-glare layer is formed on the transparent substrate by electrostatic atomization spraying. The distance between the spray gun and the transparent substrate is 40mm to 150mm, and the atomization pressure is 0.20MPa to 0.50MPa.

5. The method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 4, characterized in that, During the spraying process, the spray gun makes a contour reciprocating spraying motion while the transparent substrate moves forward. Each time the spray gun sprays, the substrate moves forward by 4mm to 8mm. The amount of spray material is 1g / min to 20g / min. After spraying, let it stand for 0 to 30 minutes before proceeding to step 3.

6. The method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 1, characterized in that, In step S3, the anti-glare layer is cured by heating at a temperature of 150℃ to 400℃ for a time of 30 min to 60 min.

7. A method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 1, characterized in that, In step S4, the wavelength of the nanopulse laser is 1000 nm to 1200 nm, the pulse width is 10 to 50 ns, the spot diameter is 5 mm to 10 mm, the energy density is 500 to 2000 W / cm², and the scanning speed is 200 to 500 mm / s.

8. The method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 7, characterized in that, For 2D planar substrates, reciprocating scanning is used for micro-polishing; for curved or irregularly shaped 3D transparent substrates, a multi-axis linkage platform drives the laser scanning head to move along a preset path, and adjusts the laser incident angle and focal length in real time according to the curved shape of the transparent substrate to ensure that the laser spot is always focused on the surface of the anti-glare layer.

9. The method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 1, characterized in that, After step S4, the process further includes a baking and annealing process on the workpiece, with an annealing temperature of 150℃±10℃.

10. The method for preparing a high-definition, high-anti-glare transparent substrate as described in claim 9, characterized in that, Step S4 is followed by step S5, in which the workpiece is first inspected for optical data and appearance after micro-polishing. If the inspection is qualified, the workpiece is transferred to the anti-reflective coating and anti-fouling film processing process. Defective products are returned to step S2 or step S4 for local secondary micro-polishing repair according to the defect type.

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