A high-thermal-conductivity high-shear-strength low-viscosity silicone adhesive as well as a preparation method and application thereof

Abstract

The present application relates to a kind of high thermal conductivity high shear strength low viscosity silicone adhesive and its preparation method and application, belong to the technical field of heat-conducting silicone adhesive.To solve the problem that existing heat-conducting silicone adhesive is difficult to consider high thermal conductivity, low viscosity and high room temperature shear strength, the present application provides a kind of high thermal conductivity high shear strength low viscosity silicone adhesive, including silicone main body and heat-conducting filler;Silicone main body is formed by mixing component A and component B;Component A contains end vinyl silicone oil, silicone resin, coupling agent and Pt catalyst;Component B contains end vinyl siloxane, silicone resin, inhibitor and hydrogen-containing silicone oil;Heat-conducting filler is JT-M147.The present application realizes the improvement of heat-conducting performance, the maintenance of construction viscosity and the stability of room temperature shear strength under the premise that no additional surface modification treatment is needed to filler, can be applied to electronic components heat dissipation bonding or potting protection, with good industrialization popularization prospect and economic and social benefits.

Description

Technical Field

[0001] This invention belongs to the field of thermally conductive silicone adhesive technology, and particularly relates to a high thermal conductivity, high shear strength, and low viscosity silicone adhesive, its preparation method, and its application. Background Technology

[0002] With the rapid development of electronic components towards higher integration and higher power density, the heat flux density generated during their operation is increasing dramatically. Thermal management has become a key bottleneck determining the reliability and lifespan of these devices. Silicone adhesives, due to their excellent high and low temperature resistance, electrical insulation properties, and good adhesion to various substrates, have become the preferred material system for heat dissipation bonding and potting protection of electronic components. However, the intrinsic thermal conductivity of unmodified silicone matrix is ​​extremely low, only 0.15~0.20 W / (m·K), far from meeting the urgent heat dissipation requirements of modern power electronic devices, high-power LEDs, new energy vehicle power batteries, and 5G communication base stations. Therefore, it is necessary to improve its thermal conductivity through highly thermally conductive fillers.

[0003] Alumina (Al2O3) has become the most widely used filler in the field of thermally conductive silicone adhesives due to its high thermal conductivity, good electrical insulation, and moderate cost. However, the introduction of thermally conductive fillers inevitably brings new technical challenges: on the one hand, to achieve an effective thermally conductive network, the filler addition level usually needs to reach an extremely high level, but a high filling level leads to an increase in system viscosity, loss of self-leveling properties of the adhesive, and inability to meet the process requirements of precision potting, slot filling, etc.; on the other hand, the filling of a large number of inorganic rigid particles destroys the cross-linking network between silicone molecular chains, resulting in increased brittleness of the cured product, which macroscopically manifests as a significant deterioration in adhesive strength, especially room temperature shear strength.

[0004] To alleviate the aforementioned contradictions, existing technologies employ various strategies, including modifying the filler surface with coupling agents to improve interfacial compatibility, optimizing packing density using filler gradations with different particle sizes, and adding tackifying resins to adjust the system's rheological behavior. However, these methods often suffer from complex processes, low modification efficiency, and mutual constraints between tackifying agents and thermal conductivity, making it difficult to achieve synergistic optimization of thermal conductivity, low viscosity, and high shear strength. Furthermore, some high-end products utilize fillers with special morphologies such as spherical alumina and boron nitride flakes, which significantly improve thermal conductivity, but also substantially increase raw material costs, hindering industrial-scale promotion. Therefore, how to obtain silicone adhesives with high thermal conductivity, suitable application viscosity, and excellent room-temperature shear strength without complex surface modification processes, through reasonable component design and preparation process control, remains a pressing technical challenge in this field. Summary of the Invention

[0005] To address the challenge of existing thermally conductive silicone adhesives simultaneously achieving high thermal conductivity, low viscosity, and high room temperature shear strength, this invention provides a high thermal conductivity, high shear strength, and low viscosity silicone adhesive, along with its preparation method and applications.

[0006] The technical solution of this invention:

[0007] A high thermal conductivity, high shear strength, and low viscosity silicone adhesive includes a silicone matrix and a thermally conductive filler.

[0008] The organosilicon matrix is ​​composed of component A and component B mixed in a mass ratio of 1:1;

[0009] Component A contains the following raw materials in parts by weight: 80-100 parts of vinyl-terminated silicone oil, 1-10 parts of silicone resin, 0.5-5 parts of coupling agent, and 0.0005-0.005 parts of Pt catalyst;

[0010] Component B contains the following raw materials in parts by weight: 80-100 parts of terminal vinyl siloxane, 1-10 parts of silicone resin, 0.001-0.01 parts of inhibitor, and 1-8 parts of hydrogen-containing silicone oil;

[0011] The thermally conductive filler is JT-M147, which contains the following raw materials in parts by weight: 89-95 parts of aluminum oxide and 3-5 parts of vinyl silicone oil;

[0012] The mass ratio of JT-M147 to the organosilicon matrix is ​​1.25:1 to 25:1.

[0013] Furthermore, in component A, the viscosity of the vinyl-terminated silicone oil is 900~1100 mPa·s, and the vinyl content is 0.20~0.40 mol%; the silicone resin is a vinyl-containing MQ silicone resin with a vinyl content of 1~5 wt%; the coupling agent is vinyltrimethoxysilane or vinyltriethoxysilane; and the effective concentration of the Pt catalyst, calculated as platinum, is 2000 × 10⁻⁶. -6 ~5000×10 -6 .

[0014] Furthermore, in component B, the viscosity of the terminal vinyl siloxane is 900~1100 mPa·s, and the vinyl content is 0.20~0.40 mol%; the silicone resin is a vinyl-containing MQ silicone resin with a vinyl content of 1~5 wt%; the inhibitor is ethynylcyclohexanol; and the hydrogen-containing silicone oil is a side-chain hydrogen-containing silicone oil with an active hydrogen content of 0.10~0.30 wt%.

[0015] Furthermore, the viscosity of the vinyl silicone oil in JT-M147 is 80~110 mPa·s; the thermal conductivity of the powder-colloid of JT-M147 is 4.8~5.2 W / (m·K), and the viscosity is 12000~18000 mPa·s.

[0016] Furthermore, the mass ratio of JT-M147 to the organosilicon body is 7.5:1.

[0017] A method for preparing a high thermal conductivity, high shear strength, and low viscosity silicone adhesive includes the following steps:

[0018] Step 1: Preparation of Component A: Add the vinyl-terminated silicone oil, silicone resin, and coupling agent to a mixer according to the mass ratio, heat to 110~130℃, and degas under vacuum negative pressure. After the temperature drops to room temperature, add the Pt catalyst and mix evenly to obtain Component A.

[0019] Step 2: Preparation of Component B: Add the terminal vinyl siloxane, silicone resin, inhibitor, and hydrogen-containing silicone oil to a mixer according to the mass ratio, heat to 110~130℃, and degas under vacuum negative pressure. After the material cools to room temperature, Component B is obtained.

[0020] Step 3: Preparation of silicone adhesive: Mix component A obtained in step 1 and component B obtained in step 2 at a mass ratio of 1:1 to obtain a silicone matrix; add JT-M147 thermally conductive filler to the silicone matrix at a mass ratio, stir to disperse the filler evenly, and degas under vacuum to obtain the silicone adhesive.

[0021] Furthermore, the vacuum negative pressure conditions described in steps one and two are both -0.08 to -0.1 MPa, and the degassing treatment time is both 0.5 to 2 hours.

[0022] Furthermore, in step three, the stirring speed is 400~600 r / min, the stirring time is 4~10 min, and the supplementary stirring time is 10~20 min; the vacuum degassing temperature is 20~25℃, the vacuum negative pressure is -0.08~-0.1 MPa, and the degassing time is 0.5~2 h.

[0023] Application of a high thermal conductivity, high shear strength, and low viscosity silicone adhesive in the heat dissipation bonding or potting protection of electronic components.

[0024] Furthermore, the curing process of the silicone adhesive is as follows: heating from room temperature to 70-90°C at a heating rate of 1-3°C / min, holding at 70-90°C for 0.5-2 hours, continuing to heat to 140-160°C, holding at 140-160°C for 2-4 hours, and then naturally cooling to room temperature.

[0025] The beneficial effects of this invention are:

[0026] This invention uses JT-M147 pre-dispersed thermally conductive filler and controls the mass ratio of JT-M147 to the silicone matrix. Without requiring additional surface modification of the filler, it effectively suppresses the sharp increase in system viscosity under high filling amounts, while reducing the degree of damage to the silicone crosslinking network by inorganic rigid particles. Thus, it simultaneously achieves improved thermal conductivity, maintained application viscosity, and stable room temperature shear strength, solving the technical problem of difficulty in achieving all three in existing thermally conductive silicone adhesives.

[0027] Experiments show that the adhesive of this invention, with a JT-M147 to silicone bulk mass ratio of 1.25:1 to 25:1, exhibits a thermal conductivity of 0.56 to 2.51 W / (m·K), a room temperature shear strength of 1.29 to 5.80 MPa, and a viscosity of 3000 to 15000 mPa·s. The performance can be flexibly adjusted by selecting the filler addition amount according to the actual needs of different application scenarios. The optimal overall performance is achieved at a mass ratio of 7.5:1, with a thermal conductivity of 1.2658 W / (m·K), a room temperature shear strength of 5.686 MPa, and a viscosity of 11000 mPa·s, combining excellent heat dissipation, good self-leveling workability, and reliable adhesive strength.

[0028] The preparation method of this invention is simple to operate, requires no complex equipment, allows for easy control of stirring parameters, ensures uniform dispersion of fillers, and results in high product stability, making it suitable for industrial mass production. The silicone adhesive prepared by this invention possesses excellent heat dissipation capabilities, good workability, and reliable bonding strength, and can be widely used in the thermal bonding or potting protection of electronic components, such as high-power LEDs, new energy vehicle power batteries, 5G communication base stations, and highly integrated power electronic devices, demonstrating promising prospects for industrial application and significant economic and social benefits. Detailed Implementation

[0029] The technical solution of the present invention will be further described below with reference to embodiments, but it is not limited thereto. Any modifications or equivalent substitutions to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention should be covered within the protection scope of the present invention. In the following embodiments, the process equipment or apparatus not specifically specified are all conventional equipment or apparatus in the art. Unless otherwise specified, the raw materials used in the embodiments of the present invention are all commercially available; unless otherwise specified, the technical means used in the embodiments of the present invention are all conventional means well known to those skilled in the art.

[0030] Example 1

[0031] This embodiment provides a method for preparing a high thermal conductivity, high shear strength, and low viscosity silicone adhesive, comprising the following steps:

[0032] Step 1: Prepare component A:

[0033] By weight, take 95 parts of vinyl-terminated silicone oil, 3 parts of vinyl-containing MQ silicone resin, and 2 parts of coupling agent vinyltrimethoxysilane, wherein the viscosity of the vinyl-terminated silicone oil is 1000 mPa·s and the vinyl content is 0.30 mol; the vinyl content of the vinyl-containing MQ silicone resin is 2.5 wt%.

[0034] The above three raw materials were added to a mixer and heated to 120°C. Degassing was then performed for 1 hour under a vacuum of -0.1 MPa. After the temperature cooled to room temperature, 0.002 parts of Pt catalyst were added. The effective concentration of the Pt catalyst used in this embodiment, calculated as platinum, was 3000 × 10⁻⁶. -6 Mix the catalyst with the aforementioned materials thoroughly and set aside for later use;

[0035] Step 2: Preparation of Component B:

[0036] By weight, 95 parts of terminal vinyl siloxane, 2 parts of vinyl-containing MQ silicone resin, 0.003 parts of inhibitor ethynylcyclohexanol, and 3 parts of side-chain hydrogen-containing silicone oil were taken. The viscosity of the terminal vinyl siloxane was 1000 mPa·s and the vinyl content was 0.30 mol; the vinyl content of the vinyl-containing MQ silicone resin was 2.5 wt%; and the active hydrogen content of the side-chain hydrogen-containing silicone oil was 0.15 wt%.

[0037] Add the above four raw materials to a mixer, heat to 120°C, degas for 1 hour under a vacuum of -0.1MPa, and wait for the material to cool to room temperature before use.

[0038] Step 3: Prepare the silicone adhesive:

[0039] Weigh 2g of component A obtained in step one and 2g of component B obtained in step two, place them in a stirring container, and stir at room temperature for 15 minutes until they are mixed evenly to obtain the organosilicon matrix.

[0040] At a mass ratio of JT-M147 to the silicone matrix of 7.5:1, 30g of JT-M147 thermally conductive filler was weighed and added to the silicone matrix. The mixture was stirred at 500 rpm for 8 minutes to ensure uniform dispersion and prevent agglomeration. After stirring for an additional 15 minutes, the mixture was degassed at 24℃ under a vacuum of -0.1 MPa for 1 hour to obtain a high thermal conductivity, high shear strength, and low viscosity silicone adhesive.

[0041] The JT-M147 thermally conductive filler used in this embodiment is a commercially available product, purchased from Guangdong Jingge New Material Co., Ltd., model JT-M147. It contains aluminum oxide and vinyl silicone oil, with an aluminum oxide content of 89%–95% and a vinyl silicone oil content of 3%–5%. The viscosity of the vinyl silicone oil in this filler is 80–110 mPa·s. The filler itself has a powder-colloidal thermal conductivity of 4.8–5.2 W / (m·K) and a viscosity of 12000–18000 mPa·s.

[0042] Pour the silicone adhesive obtained in this embodiment into the test mold or apply it to the shear sheet, and follow the curing procedure: raise the temperature from room temperature to 80°C at a rate of 2°C / min, keep it at 80°C for 1 hour, continue to raise the temperature to 150°C, keep it at 150°C for 3 hours for curing, and then let it cool naturally to room temperature.

[0043] The silicone adhesive obtained in this embodiment has a Shore D hardness of 38, a thermal conductivity of 1.2658 W / (m·K), a viscosity of 11000 mPa·s, and a room temperature shear strength of 5.686 MPa, according to the test results.

[0044] The test methods for each performance item in this embodiment are as follows: Thermal conductivity was tested using a DRL-III / V thermal conductivity meter, manufactured by Xiangtan Xiangyi Instrument Co., Ltd., with a testing standard of GB / T 5598-2015. The sample size was 30 mm in diameter and 3-5 mm in thickness. Tensile shear strength was tested using a microcomputer-controlled electronic universal testing machine, manufactured by Shenzhen Sansi Zongheng Technology Co., Ltd., with a testing standard of GB / T 7124-2008. Shore hardness was tested according to GB / T2411-2008. Viscosity was tested using a single-cylinder rotational viscometer method, with a testing standard of GB / T 2794-2022. The performance test methods in subsequent embodiments are the same as those in this embodiment; therefore, the test methods will not be repeated in subsequent embodiments.

[0045] Example 2

[0046] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 5g, and the mass ratio of JT-M147 to the organosilicon substrate is 1.25:1. All other operations are the same as in Embodiment 1.

[0047] The silicone adhesive obtained in this embodiment has a Shore D hardness of 22, a thermal conductivity of 0.5556 W / (m·K), a viscosity of 3000 mPa·s, and a room temperature shear strength of 5.798 MPa, according to the test results.

[0048] Example 3

[0049] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 10g, and the mass ratio of JT-M147 to the silicone substrate is 2.5:1. All other operations are the same as in Embodiment 1.

[0050] The silicone adhesive obtained in this embodiment has a Shore D hardness of 28, a thermal conductivity of 0.8148 W / (m·K), a viscosity of 6000 mPa·s, and a room temperature shear strength of 5.629 MPa, according to the test results.

[0051] Example 4

[0052] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 20g, and the mass ratio of JT-M147 to the silicone substrate is 5:1. All other operations are the same as in Embodiment 1.

[0053] The silicone adhesive obtained in this embodiment has a Shore D hardness of 35, a thermal conductivity of 1.2216 W / (m·K), a viscosity of 9000 mPa·s, and a room temperature shear strength of 5.548 MPa, according to the test results.

[0054] Example 5

[0055] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 25g, and the mass ratio of JT-M147 to the silicone substrate is 6.25:1. All other operations are the same as in Embodiment 1.

[0056] The silicone adhesive obtained in this embodiment has a Shore D hardness of 37, a thermal conductivity of 1.195 W / (m·K), a viscosity of 10000 mPa·s, and a room temperature shear strength of 5.260 MPa, according to the test results.

[0057] Example 6

[0058] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 35g, and the mass ratio of JT-M147 to the silicone substrate is 8.75:1. All other operations are the same as in Embodiment 1.

[0059] The silicone adhesive obtained in this embodiment has a Shore D hardness of 39, a thermal conductivity of 1.4599 W / (m·K), a viscosity of 12000 mPa·s, and a room temperature shear strength of 5.456 MPa, according to the test results.

[0060] Example 7

[0061] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 40g, and the mass ratio of JT-M147 to the silicone substrate is 10:1. All other operations are the same as in Embodiment 1.

[0062] The silicone adhesive obtained in this embodiment has a hardness of Shore D 40, a thermal conductivity of 1.5802 W / (m·K), a viscosity of 13000 mPa·s, and a room temperature shear strength of 5.167 MPa, according to the test results.

[0063] Example 8

[0064] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 50g, and the mass ratio of JT-M147 to the silicone substrate is 12.5:1. All other operations are the same as in Embodiment 1.

[0065] The silicone adhesive obtained in this embodiment has a Shore D hardness of 40, a thermal conductivity of 1.9364 W / (m·K), a viscosity of 14000 mPa·s, and a room temperature shear strength of 4.349 MPa, according to the test results.

[0066] Example 9

[0067] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 60g, and the mass ratio of JT-M147 to the silicone substrate is 15:1. All other operations are the same as in Embodiment 1.

[0068] The silicone adhesive obtained in this embodiment has a Shore D hardness of 39, a thermal conductivity of 1.9526 W / (m·K), a viscosity of 14000 mPa·s, and a room temperature shear strength of 3.907 MPa, according to the test results.

[0069] Example 10

[0070] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 70g, and the mass ratio of JT-M147 to the silicone substrate is 17.5:1. All other operations are the same as in Embodiment 1.

[0071] The silicone adhesive obtained in this embodiment has a Shore D hardness of 37, a thermal conductivity of 2.1227 W / (m·K), a viscosity of 14000 mPa·s, and a room temperature shear strength of 2.899 MPa, according to the test results.

[0072] Example 11

[0073] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 80g, and the mass ratio of JT-M147 to the silicone substrate is 20:1. All other operations are the same as in Embodiment 1.

[0074] The silicone adhesive obtained in this embodiment has a Shore D hardness of 35, a thermal conductivity of 2.1159 W / (m·K), a viscosity of 14000 mPa·s, and a room temperature shear strength of 2.440 MPa, according to the test results.

[0075] Example 12

[0076] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 90g, and the mass ratio of JT-M147 to the silicone substrate is 22.5:1. All other operations are the same as in Embodiment 1.

[0077] The silicone adhesive obtained in this embodiment has a Shore D hardness of 32, a thermal conductivity of 2.3511 W / (m·K), a viscosity of 15000 mPa·s, and a room temperature shear strength of 2.1268 MPa, according to the test results.

[0078] Example 13

[0079] The only difference between this embodiment and Embodiment 1 is that in step three, the amount of JT-M147 thermally conductive filler added is 100g, and the mass ratio of JT-M147 to the silicone substrate is 25:1. All other operations are the same as in Embodiment 1.

[0080] The silicone adhesive obtained in this embodiment has a Shore D hardness of 27, a thermal conductivity of 2.5059 W / (m·K), a viscosity of 15000 mPa·s, and a room temperature shear strength of 1.2918 MPa, according to the test results.

Claims

1. A high thermal conductivity, high shear strength, and low viscosity silicone adhesive, characterized in that, Includes an organosilicon matrix and thermally conductive fillers; The organosilicon matrix is ​​composed of component A and component B mixed in a mass ratio of 1:1; Component A contains the following raw materials in parts by weight: 80-100 parts of vinyl-terminated silicone oil, 1-10 parts of silicone resin, 0.5-5 parts of coupling agent, and 0.0005-0.005 parts of Pt catalyst; Component B contains the following raw materials in parts by weight: 80-100 parts of terminal vinyl siloxane, 1-10 parts of silicone resin, 0.001-0.01 parts of inhibitor, and 1-8 parts of hydrogen-containing silicone oil; The thermally conductive filler is JT-M147, which contains the following raw materials in parts by weight: 89-95 parts of aluminum oxide and 3-5 parts of vinyl silicone oil; The mass ratio of JT-M147 to the organosilicon matrix is ​​1.25:1 to 25:

1.

2. The silicone adhesive according to claim 1, characterized in that, In component A, the viscosity of the vinyl-terminated silicone oil is 900~1100 mPa·s, and the vinyl content is 0.20~0.40 mol%; the silicone resin is a vinyl-containing MQ silicone resin with a vinyl content of 1~5%; the coupling agent is vinyltrimethoxysilane or vinyltriethoxysilane; and the effective concentration of the Pt catalyst, calculated as platinum, is 2000 × 10⁻⁶. -6 ~5000×10 -6 .

3. The silicone adhesive according to claim 1, characterized in that, In component B, the viscosity of the terminal vinyl siloxane is 900~1100 mPa·s, and the vinyl content is 0.20~0.40 mol%; the silicone resin is a vinyl-containing MQ silicone resin with a vinyl content of 1~5%; the inhibitor is ethynylcyclohexanol; and the hydrogen-containing silicone oil is a side-chain hydrogen-containing silicone oil with an active hydrogen content of 0.10~0.30%.

4. The silicone adhesive according to claim 2 or 3, characterized in that, The vinyl silicone oil in JT-M147 has a viscosity of 80~110 mPa·s; the powder of JT-M147 has a thermal conductivity of 4.8~5.2 W / (m·K) and a viscosity of 12000~18000 mPa·s.

5. The silicone adhesive according to claim 4, characterized in that, The mass ratio of JT-M147 to the organosilicon matrix is ​​7.5:

1.

6. A method for preparing a high thermal conductivity, high shear strength, and low viscosity silicone adhesive as described in any one of claims 1-5, characterized in that, Includes the following steps: Step 1: Preparation of Component A: Add the vinyl-terminated silicone oil, silicone resin, and coupling agent to a mixer according to the mass ratio, heat to 110~130℃, and degas under vacuum negative pressure. After the temperature drops to room temperature, add the Pt catalyst and mix evenly to obtain Component A. Step 2: Preparation of Component B: Add the terminal vinyl siloxane, silicone resin, inhibitor, and hydrogen-containing silicone oil to a mixer according to the mass ratio, heat to 110~130℃, and degas under vacuum negative pressure. After the material cools to room temperature, Component B is obtained. Step 3: Preparation of silicone adhesive: Mix component A obtained in step 1 and component B obtained in step 2 at a mass ratio of 1:1 to obtain a silicone matrix; add JT-M147 thermally conductive filler to the silicone matrix at a mass ratio, stir to disperse the filler evenly, and degas under vacuum to obtain the silicone adhesive.

7. The preparation method according to claim 6, characterized in that, The vacuum negative pressure conditions described in steps one and two are both -0.08 to -0.1 MPa, and the degassing treatment time is both 0.5 to 2 hours.

8. The preparation method according to claim 6 or 7, characterized in that, In step three, the stirring speed is 400~600 r / min, the stirring time is 4~10 min, and the supplementary stirring time is 10~20 min; the vacuum degassing temperature is 20~25℃, the vacuum negative pressure is -0.08~-0.1 MPa, and the degassing time is 0.5~2 h.

9. The application of a high thermal conductivity, high shear strength, and low viscosity silicone adhesive as described in any one of claims 1-5 in the heat dissipation bonding or potting protection of electronic components.

10. The application according to claim 9, characterized in that, The curing procedure for the silicone adhesive is as follows: heat from room temperature to 70-90°C at a heating rate of 1-3°C / min, hold at 70-90°C for 0.5-2 hours, continue heating to 140-160°C, hold at 140-160°C for 2-4 hours, and then cool naturally to room temperature.