A defect detection system and inkjet printing system

Abstract

The application relates to the technical field of display panel processing, in particular to a defect detection system and an inkjet printing system, which comprise a machine table and the following components on the machine table: a conveying assembly, the conveying assembly comprising a bearing table and a conveying driving element; the bearing table comprising a mounting plate, a bearing plate and a supporting assembly; the mounting plate supporting the bearing plate through the supporting assembly, the supporting assembly comprising a plurality of push-up elements, the plurality of push-up elements being evenly distributed below the bearing plate, and the plurality of push-up elements being suitable for adjusting the height of each part of the bearing plate; and a detection device, the detection device comprising a plurality of detection assemblies, the plurality of detection assemblies being arranged in sequence in a detection direction, and the conveying assembly conveying a substrate to each detection assembly. The application supports the substrate through the bearing table, avoids deformation of the substrate, guarantees the reliability of detection, detects different defects of the surface film layer of the substrate through the plurality of detection assemblies, improves the defect detection rate, guarantees the quality of the film layer, adapts to the defect detection requirements of different film layers, and widens the application range of the detection system.

Description

Technical Field

[0001] This application relates to the field of display panel processing technology, and in particular to a defect detection system and an inkjet printing system. Background Technology

[0002] Inkjet printing is finding increasingly widespread applications in several emerging fields, such as new displays, RFID, thin-film solar cells, wearable flexible devices, PCBs, and smart skins. Inkjet printing technology offers advantages such as high material utilization, no need for photomasks, low equipment cost, and ease of large-size manufacturing. It enables low-cost, large-area printing of new display devices such as OLEDs and QLEDs, making it one of the most promising processes for fabricating new display devices.

[0003] In related technologies, when inspecting the film layer on the substrate surface, multiple line scanning cameras arranged in multiple rows with staggered positioning are usually used to achieve continuous scanning in the width direction of the substrate. Alignment correction is combined to ensure that the substrate is centered. The target defects are identified by matching the stitched images with the feature model, and the defect images are verified a second time using a re-inspection device to reduce misjudgment.

[0004] However, after a film is formed on the substrate surface using printing technology, there are many types of defects in the film layer, such as impurities, missed prints, and mura. Moreover, different film layers require different types of defects to be detected during inspection. Therefore, inspection using only a line scan camera cannot identify all defects in the film layer, affecting the reliability of the inspection and failing to guarantee the quality of the film formation. In addition, the number of detectable defect types is limited, making it unable to handle the inspection of different film layers and resulting in a narrow applicability.

[0005] Furthermore, when the substrate size is large, the support platform is also large, and the flatness of the support platform is difficult to guarantee directly through processing. This causes various parts of the substrate to deform due to lack of support, which affects the reliability of defect detection. Summary of the Invention

[0006] This application provides a defect detection system and an inkjet printing system to solve the technical problems in related technologies, such as the inability to identify all defects in the film layer, affecting detection reliability, failing to guarantee film quality, having a limited range of detectable defect types, being unable to handle the detection of different film layers, having narrow applicability, and poor detection reliability.

[0007] Firstly, a defect detection system is provided, including a machine base and components arranged on the machine base: A conveying assembly includes a support platform and a conveying drive. The support platform carries a substrate, and the conveying drive drives the support platform and the substrate to move in a detection direction. The support platform includes a mounting plate, a support plate, and a support assembly. The support plate is located above the mounting plate and carries the substrate. The mounting plate supports the support plate via the support assembly. The support assembly includes multiple pushers evenly distributed below the support plate, and the pushers are adapted to adjust the height of each point on the support plate. A detection device, comprising multiple sets of detection components arranged sequentially in the detection direction, wherein a conveying component delivers the substrate to each of the detection components. The multiple sets of detection components detect different defects in the film layer on the substrate surface.

[0008] In some embodiments, the fixed end of the pusher is mounted on the mounting plate, and the movable end of the pusher is connected to the bottom surface of the support plate; the operating end of the pusher is located at the top of the movable end of the pusher, and the surface of the support plate is provided with a plurality of through adjustment holes, and the movable ends of the plurality of pushers are respectively mounted at the plurality of adjustment holes of the support plate; The operating end of the pusher, which passes through the adjustment hole, is used to adjust the height of the movable end of the pusher, thereby changing the height of the corresponding position of the support plate.

[0009] In some embodiments, the pusher includes: A push-top flange, which is fixed to the bottom surface of the bearing plate; The mounting sleeve is connected to the mounting plate; An adjusting screw is provided, which passes through the push flange and the mounting sleeve, and is threadedly connected to both the push flange and the mounting sleeve; the top of the adjusting screw is aligned with the adjusting hole. The adjusting screw is rotated through the adjusting hole to cause the mounting sleeve to move up and down, thereby adjusting the local height of the support plate.

[0010] In some embodiments, the pusher further includes a fixing sleeve, which is fixed to the mounting plate. The mounting sleeve passes through the fixing sleeve and is threadedly connected to the fixing sleeve. The height of the top of the mounting sleeve can be adjusted by twisting the mounting sleeve relative to the fixing sleeve.

[0011] In some embodiments, the support platform further includes a base and a rotating assembly, the mounting plate being mounted on the base via the rotating assembly, the rotating assembly comprising: A rotating base, wherein the fixed end of the rotating base is mounted on the base, and the rotating end of the rotating base is connected to the mounting plate; Multiple arc-shaped guide rail groups are evenly arranged around the rotation axis of the mounting plate. The track portion of the arc-shaped guide rail group is installed on the base, and the sliding portion of the arc-shaped guide rail group is connected to the mounting plate. A correction drive component is connected to the mounting plate to drive the mounting plate to rotate; The rotating base supports the bottom center of the mounting plate, and the multiple arc-shaped guide rails support multiple edges of the bottom of the mounting plate.

[0012] In some embodiments, the rotating assembly further includes multiple multi-axis support platforms disposed between the mounting plate and the base, and the multiple multi-axis support platforms respectively support multiple corners of the mounting plate; the multi-axis support platforms include: The fixing seat is fixed to the base; A first sliding plate is slidably arranged on the fixed base; A second sliding plate is slidably arranged on the first sliding plate; A rotating plate, which is rotatably connected to the second sliding plate and connected to the mounting plate, to support the edges and corners of the mounting plate; The sliding directions of the first sliding plate and the second sliding plate are arranged at an angle. As the mounting plate rotates, the first sliding plate and the second sliding plate slide adaptively, and the rotating plate rotates adaptively.

[0013] In some embodiments, the detection device includes: A first detection component, comprising a plurality of first imaging modules arranged side-by-side perpendicular to the detection direction; The second detection component is arranged sequentially with the first detection component in the detection direction. The second detection component includes multiple line scanning cameras arranged side by side perpendicular to the detection direction. The imaging direction of the line scanning cameras is arranged at an angle to the detection direction on the horizontal plane, and the imaging direction of the line scanning cameras is also arranged at an angle to the vertical direction in the vertical plane.

[0014] In some embodiments, the first detection component further includes: Multiple first lifting drive components are respectively connected to multiple first imaging modules to adjust the height of the multiple first imaging modules respectively; Multiple rangefinders are arranged to correspond to multiple first imaging modules, and the rangefinders are used to measure the vertical distance between the first imaging module and the substrate. The substrate is driven to pass under the multiple ranging elements to determine the height of the substrate at various points. When a portion of the substrate moves into the field of view of the first imaging module, the height of the corresponding first imaging module is adjusted to ensure that the portion of the substrate located below the first imaging module is within the focal plane of the first imaging module.

[0015] In some embodiments, the detection device further includes a re-inspection component located behind the first detection component, the re-inspection component comprising: A re-inspection vision module, wherein the re-inspection vision module is used to image the surface of the substrate; A re-inspection lifting drive is connected to the re-inspection vision module to drive the re-inspection vision module to move up and down. A re-inspection lateral movement drive is provided, which is connected to the re-inspection vision module to drive the re-inspection vision module to move perpendicular to the detection direction.

[0016] In some embodiments, the defect detection system further includes a first correction component, the first correction component comprising: Multiple positioning components are arranged on adjacent sides and in the middle of the support platform, and the positioning components are lower than the support surface of the support platform. Each positioning component includes a positioning rod and a positioning drive, and the positioning drive drives the positioning rod to extend above the support platform. Multiple abutting components are arranged on opposite sides of the support platform, and the positioning component and the abutting component are respectively arranged on opposite sides of the support platform; the abutting components are adapted to push the substrate so that the substrate abuts against the positioning rod.

[0017] In some embodiments, the defect detection system further includes a second correction component for capturing marker points on the substrate to determine the position of the substrate on the support platform, the second correction component being located on one side of the support platform; the second correction component includes: The first capture component includes a first capture driver and a first capture camera. The first capture driver is driven to drive the first capture camera to move in a direction perpendicular to the detection direction, so that the first capture camera is positioned above the support platform. As the support platform moves in the detection direction, the first capture camera captures the marking points on the substrate. A second capture assembly is arranged at a distance from the first capture assembly in the detection direction, with the second capture assembly located behind the first capture assembly. The second capture assembly includes a second capture drive, a repositioning capture drive, and a second capture camera. The second capture drive is driven by the second capture camera to move the second capture camera perpendicular to the detection direction, positioning it above the support platform. As the support platform moves in the detection direction, the second capture camera captures marker points on the substrate. The repositioning capture drive is also driven by the second capture camera to move it in the detection direction. The beneficial effects of the technical solution provided in this application include: This application provides a defect detection system. When detecting defects in the film layer on the surface of a substrate, the substrate is placed on a support platform and driven by a conveying drive to move the substrate in the detection direction, so that the substrate passes under multiple detection components. Different detection components detect different defects in the film layer on the substrate surface, thereby ensuring the reliability of substrate detection. Furthermore, at least one detection component can be selected to detect different film layers, thereby meeting the detection requirements of different film layers and broadening the applicability of film layer detection.

[0018] During substrate defect inspection, the flatness of the support plate must be checked before the substrate is placed on it to ensure uniform support of the substrate and to avoid unevenness on the surface. Multiple pushers are used to support different positions on the support plate, and the height of these pushers is adjusted to ensure consistent height across the support plate. This guarantees uniform support of the substrate and prevents deformation. Ensuring consistent height across the substrate not only prevents deformation but also ensures consistent distance between the substrate and the inspection components above it, guaranteeing consistent processing and reliable inspection, and ensuring the quality of the functional layers on the surface of large-size substrates.

[0019] Secondly, an inkjet printing system is provided, including the defect detection system described above.

[0020] Another embodiment of this application provides an inkjet printing system. Since the inkjet printing system includes the above-mentioned defect detection system, the beneficial effects of the inkjet printing system are the same as those of the above-mentioned defect detection system, and will not be repeated here. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 A schematic diagram of the defect detection system provided in the embodiments of this application; Figure 2 A partial schematic diagram of the first detection component provided in an embodiment of this application; Figure 3 A schematic diagram of the third detection component and the re-inspection component provided in the embodiments of this application; Figure 4 A schematic diagram of the support platform provided in an embodiment of this application; Figure 5 This is a schematic diagram of the internal structure of the support platform provided in an embodiment of this application; Figure 6 A longitudinal sectional view of the pusher provided in the embodiments of this application; Figure 7 A schematic diagram of the pusher provided in an embodiment of this application; Figure 8 A schematic diagram of the base and mounting plate provided in the embodiments of this application; Figure 9 A schematic diagram of the base and rotating assembly provided in an embodiment of this application; Figure 10 A schematic diagram of a multi-axis support platform provided in an embodiment of this application; Figure 11 A schematic diagram of the correction drive provided in an embodiment of this application; Figure 12 A schematic diagram of the first correction component provided in an embodiment of this application; Figure 13 A schematic diagram of the second correction component provided in an embodiment of this application; Figure 14 A schematic diagram of the ejector pin assembly provided in an embodiment of this application; Figure 15 A schematic diagram of the ejector pin provided in the embodiments of this application; Figure 16 This is a schematic diagram of the adsorption element provided in the embodiments of this application.

[0023] In the diagram: 1. Machine base; 11. First gantry frame; 12. Second gantry frame; 2. Support platform; 21. Base; 22. Mounting plate; 23. Support plate; 23a. Adjustment hole; 24. Support assembly; 241. Pushing component; 2411. Pushing flange; 2412. Mounting sleeve; 2413. Adjusting screw; 2414. Elastic element; 2415. Fixing sleeve; 2416. Locking nut; 242. Support column; 25. Rotating assembly; 251. Rotary seat; 252. Arc-shaped guide rail Group; 253, Correction drive component; 254, Multi-axis support platform; 2541, Fixed base; 2542, First sliding plate; 2543, Second sliding plate; 2544, Rotating plate; 3, First detection assembly; 31, First imaging module; 32, First lifting drive component; 33, Rangefinder; 34, First lateral movement drive component; 4, Second detection assembly; 41, Line scan camera; 42, Second lateral movement drive component; 5, Re-inspection assembly; 51, Re-inspection vision module; 52, Re-inspection lifting drive component 53. Re-inspection transverse drive; 6. Third detection component; 61. Film thickness detection component; 611. Film thickness detector; 612. Rotation drive; 62. Overflow detection imaging module; 63. Third transverse drive; 64. Third lifting drive; 7. First correction component; 71. Positioning component; 711. Positioning rod; 712. Positioning drive; 72. Abutment component; 721. Abutment rod; 722. Abutment lifting drive; 723. Abutment pushing drive; 8. Second correction component 81. First capture assembly; 811. First capture camera; 812. First capture drive; 82. Second capture assembly; 821. Second capture camera; 822. Second capture drive; 823. Position capture drive; 9. Ejector pin assembly; 91. Ejector pin holder; 92. Ejector pin component; 921. Ejector rod; 922. Ball bearing; 93. Lifting drive; 94. Adsorption component; 941. Adsorption rod; 942. Adsorption drive; 10. Conveying drive; a. Substrate. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] This application provides a defect detection system and an inkjet printing system. A support platform flattens and supports the substrate, preventing substrate deformation and ensuring detection reliability. Multiple detection components are used to detect different defects in the substrate surface film, ensuring all defects are detected to guarantee film quality. This system adapts to the defect detection needs of different film layers, broadening its applicability. This application solves the technical problems of related technologies, such as the inability to identify all defects in the film layer, affecting detection reliability, failing to guarantee film quality, having a limited range of detectable defect types, being unable to handle the detection of different film layers, having narrow applicability, and poor detection reliability.

[0026] Reference Figure 1 A defect detection system includes a machine base 1 and a conveying assembly and a detection device arranged on the machine base 1. The conveying assembly is used to carry a substrate a and drive the substrate a to move in the detection direction. The substrate a is conveyed by the conveying assembly, passes through the detection device, and the detection device detects the film layer on the surface of the substrate a.

[0027] The detection device includes multiple sets of detection components arranged sequentially in the detection direction. A conveying component delivers the substrate a to each detection component. The multiple sets of detection components detect different defects in the film layer on the surface of the substrate a.

[0028] Reference Figure 1 Specifically, the detection device includes a first detection component 3 and a second detection component 4. The first detection component 3 and the second detection component 4 are arranged at intervals in the detection direction, and the detection ends of both the first detection component 3 and the second detection component 4 are located above the machine base 1. The conveying component is used to carry the substrate a and drive the substrate a to be conveyed in the detection direction, so that the substrate a passes under the detection ends of the first detection component 3 and the second detection component 4. As the substrate a is conveyed, the detection process of the film layer on the surface of the substrate a can be completed.

[0029] The first detection component 3 and the second detection component 4 detect different types of defects, respectively. The first detection component 3 is used to detect the first defects of the film layer, including missed defects, impurities, etc.; the second detection component 4 is used to detect the second defects of the film layer, including MURA, etc.

[0030] This configuration allows the first detection component 3 and the second detection component 4 to detect different defects in the film layer on the surface of substrate a, avoiding the possibility of missing certain defects and ensuring the reliability of the detection of substrate a. Furthermore, for different film layers, at least one of the first detection component 3 and the second detection component 4 can be selected to detect the film layer, thereby meeting the detection requirements of different film layers and broadening the applicability of film layer detection.

[0031] Reference Figure 1In this embodiment, the first detection component 3 is located in front of the second detection component 4, meaning that as the substrate a is transported, the substrate a first passes under the first detection component 3 and then under the second detection component 4. In other embodiments, the first detection component 3 may also be located behind the second detection component 4, meaning that as the substrate a is transported, the substrate a first passes under the second detection component 4 and then under the first detection component 3.

[0032] It should be noted that the front and rear directions in this embodiment are based on the movement direction of substrate a. That is, after substrate a is loaded, when substrate a approaches various detection components along the detection direction, the detection components that substrate a passes through first are located in front, and the detection components that substrate a passes through later are located in rear.

[0033] Reference Figure 1 The machine tool 1 is equipped with a first gantry frame 11, and the first detection component 3 is mounted on the first gantry frame 11. The substrate a passes under the first gantry frame 11.

[0034] The first detection component 3 includes multiple first imaging modules 31, which are arranged side-by-side perpendicular to the detection direction. In this embodiment, each first imaging module 31 includes a camera, and correspondingly, the first detection component 3 also includes a supplementary light for illuminating the first imaging module 31.

[0035] With this configuration, as substrate a passes under the first detection component 3, multiple first imaging modules 31 respectively perform imaging detection on different positions of the film layer on the surface of substrate a, meeting the detection requirements of large-size substrates and improving detection efficiency. By detecting a portion of the film layer by each first imaging module 31, it is ensured that first-type defects such as impurities and missed spots on the film layer surface are identified, thereby guaranteeing the quality of the film layer.

[0036] Reference Figure 1 and Figure 2 The first detection component 3 further includes a first transverse drive component 34, which is driven to connect with the first detection component 3 to drive the first detection component 3 to move in a direction perpendicular to the detection direction.

[0037] Reference Figure 1 and Figure 2 Specifically, the first transverse drive 34 is mounted on the first gantry 11, and multiple first imaging modules 31 are mounted on the drive end of the first transverse drive 34. The first transverse drive 34 synchronously drives the multiple first imaging modules 31 to move in a direction perpendicular to the detection direction, thereby changing the position of all the first imaging modules 31. In this embodiment, the first transverse drive 34 includes a linear motor or a lead screw mechanism.

[0038] With this configuration, when the width of the imaging field of view formed by all the first imaging modules 31 is narrower than the width of the film layer on the surface of substrate a, substrate a first passes under the first detection component 3, and then all the first imaging modules 31 scan and detect a portion of the film layer on the surface of substrate a. Then, by changing the position of all the first imaging modules 31, substrate a passes under the first detection component 3 again, thereby ensuring comprehensive detection of the film layer on the surface of large-size substrates. Therefore, this configuration is suitable for the detection requirements of large-size substrates. In this embodiment, the large-size substrate includes substrate a dimensions processed by G6 or G8.5 generation lines.

[0039] Reference Figure 1 and Figure 2 The first detection component 3 also includes multiple first lifting drive components 32 and multiple rangefinders 33.

[0040] Multiple first lifting drive components 32 are respectively driven and connected to multiple first imaging modules 31 to adjust the height of the multiple first imaging modules 31 respectively. In this embodiment, the first lifting drive component 32 is installed on the drive end of the first lateral drive component 34. The first lifting drive component 32 includes a lead screw mechanism or a linear motor.

[0041] Multiple rangefinders 33 are arranged corresponding to multiple first imaging modules 31, and the rangefinders 33 are used to measure the vertical distance between the first imaging module 31 and the substrate a. In this embodiment, the rangefinder 33 includes a laser rangefinder.

[0042] The substrate a is driven to pass under multiple ranging elements 33 to determine the height of each part of the substrate a. When part of the substrate a moves into the field of view of the first imaging module 31, the height of the corresponding first imaging module 31 is adjusted to ensure that the part of the substrate a located below the first imaging module 31 is within the focal plane of the first imaging module 31.

[0043] Understandably, since substrate a is not completely flat, the height of the film layer on the surface of substrate a also varies. By measuring the height of various positions on substrate a using the ranging device 33, and adjusting the height of the first imaging module 31 accordingly, the substrate a is ensured to be within the field of view of the first imaging module 31 and also within the focal plane of the first imaging module 31, thus ensuring a clear image of the film layer on the surface of substrate a.

[0044] The ranging device 33 is located in front of or behind the first imaging module 31. As the substrate a is transported, the ranging device 33 scans various points on the surface of the substrate a to obtain height data for each point on the surface of the substrate a. Subsequently, the height of the first imaging module 31 can be adjusted according to the specific imaging position of the substrate a.

[0045] Preferably, the ranging element 33 is located in front of the first imaging module 31, and the substrate a passes through the ranging element 33 before passing through the first imaging module 31. Therefore, by measuring the surface height of the substrate a in advance, the first lifting drive element 32 can be provided with the height information of the required imaging position of the substrate a in advance, and the height of the first imaging module 31 can be adjusted quickly and timely, so that the substrate a completes accurate imaging detection after passing through the ranging element 33 and the first imaging module 31. This optimizes the detection cycle and improves detection efficiency.

[0046] Reference Figure 1 and Figure 3 The detection device further includes a re-inspection component 5, which is located behind the first detection component 3. In this embodiment, the re-inspection component 5 is installed on the side of the first gantry frame 11, and the re-inspection component 5 and the first detection component 3 are located on opposite sides of the first gantry frame 11, respectively.

[0047] Reference Figure 1 and Figure 3 The re-inspection component 5 includes a re-inspection vision module 51, a re-inspection lifting drive 52, and a re-inspection lateral movement drive 53. The re-inspection vision module 51 is used to image the surface of the substrate a. In this embodiment, the re-inspection vision module 51 includes a camera.

[0048] Reference Figure 1 and Figure 3 The re-inspection lifting drive 52 is driven by the re-inspection vision module 51 to drive the re-inspection vision module 51 to move up and down. The re-inspection lateral movement drive 53 is driven by the re-inspection vision module 51 to drive the re-inspection vision module 51 to move perpendicular to the detection direction. In this embodiment, both the re-inspection lateral movement drive 53 and the re-inspection lifting drive 52 include a lead screw mechanism or a linear motor.

[0049] Reference Figure 1 and Figure 3 Specifically, the re-inspection vision module 51 is installed on the drive end of the re-inspection lifting drive 52, the re-inspection lifting drive 52 is installed on the drive end of the re-inspection lateral movement drive 53, and the re-inspection lateral movement drive 53 is installed on the first gantry 11.

[0050] With this configuration, after the first detection component 3 identifies a first defect in the film layer on the surface of substrate a, as substrate a is transported, the re-inspection vision module 51 is moved to the location of the first defect on the surface of substrate a using the re-inspection lateral drive 53. Then, the height of the re-inspection vision module 51 is adjusted using the re-inspection lifting drive 52, so that the first defect on the surface of substrate a detected by the first detection component 3 is within the focal plane of the re-inspection vision module 51. This allows for the re-inspection of the first defect on the surface of substrate a detected by the first detection component 3, reducing the possibility of misjudgment by the first detection component 3.

[0051] Reference Figure 1 and Figure 3 In this embodiment, the second detection component 4 is arranged sequentially with the first detection component 3 in the detection direction. The second detection component 4 is located behind the first detection component 3. The substrate a passes through the first detection component 3 and the re-inspection component 5 first, and then passes under the second detection component 4.

[0052] Reference Figure 1 A second gantry frame 12 is fixed on the machine base 1, and the base plate a is adapted to pass through the second gantry frame 12. The second detection component 4 is installed on the second gantry frame 12.

[0053] Reference Figure 1 The second detection component 4 includes multiple line scan cameras 41, which are arranged side by side perpendicular to the detection direction. The imaging direction of the line scan cameras 41 is arranged at an angle to the detection direction on the horizontal plane, and the imaging direction of the line scan cameras 41 is arranged at an angle to the vertical direction in the vertical plane.

[0054] With this configuration, the second detection component 4 scans and images the film layer on the surface of substrate a using multiple line scan cameras 41. As substrate a is transported along the detection direction, the multiple line scan cameras 41 can complete a full scan of the surface of substrate a. The second detection component 4 can identify secondary defect types such as MURA defects in the film layer to ensure the quality of the film layer. By limiting the imaging direction of the line scan cameras 41, the influence of light fluctuations and moiré patterns on defect identification during the imaging process is avoided, ensuring that all defects are identified, thereby guaranteeing detection reliability and ensuring the quality of film layer formation.

[0055] Reference Figure 1 Furthermore, the second detection component 4 also includes a second lateral movement drive 42, which is driven by the line scan camera 41 to move the line scan camera 41 perpendicular to the detection direction. In this embodiment, the second lateral movement drive 42 is mounted on the second gantry 12. The second lateral movement drive 42 includes a linear motor or a lead screw mechanism.

[0056] With this configuration, the second lateral drive 42 moves the line scan camera 41 perpendicular to the detection direction. When the substrate a is too large, the entire substrate a can be inspected by moving the line scan camera 41 and scanning it multiple times. When the substrate a is placed at a designated position on the transport assembly, the scanning position of the line scan camera 41 can be changed by moving it, ensuring that the substrate a passes through the field of view of the line scan camera 41, thereby meeting the inspection requirements of substrates a of different sizes.

[0057] Reference Figure 1 and Figure 3The detection device further includes a third detection component 6, which is arranged at a distance from the first detection component 3 and the second detection component 4 in the detection direction. In this embodiment, the third detection component 6 is arranged behind the first detection component 3 and is mounted on the first gantry 11, with the third detection component 6 and the re-inspection component 5 located on the same side of the first gantry 11. When the substrate a passes under the third detection component 6, the third detection component 6 detects defects in the surface film layer of the substrate a.

[0058] Reference Figure 1 and Figure 3 The third detection component 6 includes a film thickness detection component 61 and a third transverse drive component 63. The film thickness detection component 61 is used to detect the film thickness on the surface of substrate a to determine whether the film layer on the surface of substrate a is uniform.

[0059] Reference Figure 1 and Figure 3 The third transverse drive 63 is mounted on the first gantry 11, and the film thickness detection component 61 is mounted on the third transverse drive 63. The third transverse drive 63 drives the film thickness detection component 61 to move perpendicular to the detection direction. In this embodiment, the third transverse drive 63 includes a linear motor or a lead screw mechanism.

[0060] Therefore, as the substrate a is conveyed in the detection direction, the film thickness detection component 61 can scan the film layer on the surface of the substrate a in the detection direction. The third transverse drive 63 can then scan the film layer on the surface of the substrate a perpendicular to the detection direction, thus achieving comprehensive detection of the film layer.

[0061] Reference Figure 1 and Figure 3 The third detection component 6 further includes a third lifting drive 64, which is mounted on the third transverse drive 63. The film thickness detection component 61 is mounted on the drive end of the third lifting drive 64. The third lifting drive 64 drives the film thickness detection component 61 to move vertically, thereby changing the distance between the film thickness detection component 61 and the substrate a, and achieving accurate measurement. In this embodiment, the third lifting drive 64 includes a linear motor or a lead screw mechanism.

[0062] Reference Figure 1 and Figure 3 The film thickness detection assembly 61 includes a rotary drive 612 and a film thickness detector 611. The rotary drive 612 is driven to rotate the film thickness detector 611 in a horizontal plane. In this embodiment, the rotary drive 612 includes a motor. The film thickness detector 611 includes an interferometer.

[0063] It should be noted that the detection range of the film thickness gauge 611 is rectangular. By rotating the film thickness gauge 611 in the horizontal plane, the length direction of the detection range of the film thickness gauge 611 can be changed.

[0064] Generally, uneven film thickness is prone to occur at the edges of the film layer on the surface of substrate a. When detecting the film layer edge extending along the detection direction, the length direction of the detection range of the film thickness detector 611 is arranged perpendicular to the detection direction. At this time, as the substrate a is conveyed in the detection direction, the film layer edge extending along the detection direction can be detected. When detecting the film layer edge extending perpendicular to the detection direction, the length direction of the detection range of the film thickness detector 611 is arranged along the detection direction. At this time, as the third transverse drive 63 drives the film thickness detection assembly 61 to move perpendicular to the detection direction, the film layer edge extending perpendicular to the detection direction can be detected.

[0065] Reference Figure 1 and Figure 3 Furthermore, the third detection component 6 also includes an overflow detection imaging module 62, which is used to image the edge of the printed area on the substrate a to detect whether functional liquid overflows from the printed area on the surface of the substrate a. The overflow detection imaging module 62 is mounted on the driving end of the third lifting drive 64. In this embodiment, the overflow detection imaging module 62 includes a camera.

[0066] With this configuration, the edge of the film layer on the surface of the substrate a can be imaged by the overflow detection imaging module 62, and the substrate a can be transported in the detection direction by the transport component and the overflow detection imaging module 62 can be moved in the vertical detection direction by the third transverse drive 63, so that the entire edge of the film layer on the substrate a can be detected.

[0067] The overflow detection imaging module 62 and the film thickness detection component 61 are both arranged at the driving end of the third transverse drive 63. The overflow detection imaging module 62, the film thickness detection component 61, and the re-inspection vision module 51 are all arranged on the same side of the first gantry 11. In this embodiment, the stroke of the third transverse drive 63 and the stroke of the re-inspection transverse drive 53 are both greater than the width of the substrate a that the conveying component can carry (here, the width of substrate a is the dimension of substrate a perpendicular to the detection direction). Therefore, when the re-inspection component 5 is working, the overflow detection imaging module 62 and the film thickness detection component 61 move to the outermost edge to avoid interfering with the movement of the re-inspection vision module 51. When either the overflow detection imaging module 62 or the film thickness detection component 61 is working, the re-inspection vision module 51 moves to the outermost edge to avoid interfering with the movement of the overflow detection imaging module 62 and the film thickness detection component 61.

[0068] In this embodiment, the re-inspection lateral movement drive 53 and the third lateral movement drive 63 are both the same linear motor. By arranging two sets of moving parts inside the linear motor, and using the two sets of moving parts as the drive ends of the re-inspection lateral movement drive 53 and the third lateral movement drive 63 respectively, the structure on the first gantry 11 can be simplified.

[0069] It is important to note that, depending on the requirements of different film layers, one or more of the first detection component 3, the second detection component 4, and the third detection component 6 can be adaptively selected for defect detection. This allows for the detection of different defects in the film layers on the surface of substrate a, ensuring the reliability of the detection of substrate a. Furthermore, it meets the detection requirements of different film layers, broadening the applicability of film layer detection.

[0070] Reference Figure 1 and Figure 4 The conveying assembly includes a support platform 2 and a conveying drive 10. The support platform 2 supports the substrate a. The conveying drive 10 drives the support platform 2 and the substrate a to move in the detection direction. In this embodiment, the conveying drive 10 includes a lead screw mechanism or a linear motor.

[0071] Reference Figure 4 and Figure 5 The support platform 2 includes a mounting plate 22, a support plate 23, and a support assembly 24. The support plate 23 is located above the mounting plate 22 and is used to support the substrate a. The mounting plate 22 supports the support plate 23 via the support assembly 24. The support assembly 24 includes multiple pushers 241, which are evenly distributed below the support plate 23. The multiple pushers 241 are adapted to adjust the height of each point on the support plate 23. In this embodiment, the multiple pushers 241 are arranged in a rectangular array.

[0072] Reference Figures 4-7 Specifically, the fixed end of the pusher 241 is mounted on the mounting plate 22, the movable end of the pusher 241 is connected to the bottom surface of the support plate 23, and the operating end of the pusher 241 is located at the top of the movable end of the pusher 241. The support plate 23 has multiple through adjustment holes 23a on its surface, and the movable ends of the multiple pushers 241 are respectively installed at the multiple adjustment holes 23a of the support plate 23.

[0073] This configuration allows for adjustment of the height of the movable end of the pusher 241 by acting through the adjustment hole 23a, thereby changing the height of the support plate 23 at that position. When dealing with large substrates, the size of the support plate 23 also varies significantly, making it more prone to unevenness. By arranging multiple pushers 241 and providing adjustment holes 23a on the support plate 23, the height of all pushers 241 can be easily adjusted from above the support plate 23, thus leveling the support plate 23. Therefore, adjusting the support plate 23 does not require operation from below, making it easier to adjust the height of various parts of the support plate 23 and ensuring the flatness of large-size support plates 23.

[0074] Reference Figures 4-7 It should be noted that by adjusting the height of the pusher 241, the support plate 23 deforms, thereby adjusting the height of the support plate 23 at corresponding positions. Generally, the height difference at various points on the support plate 23 is small, so the range required for adjusting the height at various points on the support plate 23 is small, and it can be achieved by utilizing the deformation of the support plate 23.

[0075] By using the pusher 241, the surface height difference of the large-sized carrier plate 23 can be kept within 1-5 micrometers. This ensures the height consistency of the substrate a surface when carrying the substrate a, thus guaranteeing the quality of the film deposition process on the substrate a surface.

[0076] Reference Figures 4-7 In this embodiment, preferably, the support plate 23 is spliced ​​from multiple single plates, which not only reduces the processing cost of the support plate 23, but also avoids the support plate 23 from being too large and easily deformed by arranging the support plate 23 separately, and makes it easier to ensure the flatness of the surface of the support plate 23.

[0077] The support plate 23 has multiple air-float holes on its surface. Through an external air supply device, the support plate 23 can provide air-float support for the substrate a.

[0078] Reference Figures 4-7 The pusher component 241 includes a pusher flange 2411, a mounting sleeve 2412, and an adjusting screw 2413. The pusher flange 2411 is fixed to the bottom surface of the support plate 23 by bolts. The mounting sleeve 2412 is connected to the mounting plate 22. The adjusting screw 2413 passes through the pusher flange 2411 and the mounting sleeve 2412, and is threadedly connected to both the pusher flange 2411 and the mounting sleeve 2412. The top of the adjusting screw 2413 is aligned with the adjusting hole 23a.

[0079] Reference Figures 4-7Specifically, the adjusting screw 2413 includes a first connecting section and a second connecting section. The first connecting section is threadedly connected to the push flange 2411, and the second connecting section is threadedly connected to the mounting sleeve 2412. The threads of the first and second connecting sections have the same direction of rotation, and the pitch of the thread of the first connecting section is smaller than the pitch of the thread of the second connecting section. Therefore, when the adjusting screw 2413 is rotated, the change distance of the adjusting screw 2413 relative to the mounting sleeve 2412 is greater than the change distance of the adjusting screw 2413 relative to the push flange 2411. Thus, by rotating the adjusting screw 2413, the push flange 2411 can be driven to move up and down, thereby driving part of the lifting of the bearing plate 23.

[0080] In another embodiment, the threads of the first connecting section and the second connecting section are in opposite directions, and the lifting and lowering of the push flange 2411 can be achieved by rotating the adjusting screw 2413.

[0081] The top surface of the adjusting screw 2413 is provided with an operating groove to allow external tools to drive the adjusting screw 2413 to rotate. The operating groove includes hexagonal grooves, Phillips head grooves, slotted grooves, etc.

[0082] With this configuration, the local height of the support plate 23 can be adjusted by rotating the adjusting screw 2413 through the adjusting hole 23a with an external tool, causing the mounting sleeve 2412 to move up and down. Therefore, it is not necessary to adjust the local height of the support plate 23 from below.

[0083] It should be noted that, due to the large size of the bearing plate 23 and the presence of numerous pushers 241, air-floating structures, and other structures beneath it, it is difficult to adjust the flatness of the large bearing plate 23 from below.

[0084] In this embodiment, the support platform 2 is adapted to the processing of substrate a in G6 and G8.5 production lines. Since substrate a is relatively large, the support plate 23 is also relatively large.

[0085] Reference Figure 6 and Figure 7 Furthermore, the pusher 241 also includes an elastic element 2414, which is arranged between the mounting sleeve 2412 and the pusher flange 2411. The elastic force of the elastic element 2414 causes its two ends to abut against the pusher flange 2411 and the mounting sleeve 2412, respectively.

[0086] This configuration utilizes the elastic force of the elastic element 2414 to push the mounting sleeve 2412 and the push flange 2411 against each other, thereby increasing the damping of the adjusting screw 2413 and preventing it from loosening. This ensures the adjusted position height of the push flange 2411 while maintaining the local height of the bearing plate 23. Furthermore, it makes it easier to control the rotation angle of the adjusting screw 2413 when rotating, thus improving the movement accuracy of the push flange 2411. Therefore, it can improve the height adjustment accuracy of the bearing plate 23 at a specific position.

[0087] Specifically, the elastic element 2414 includes a spring, which is sleeved on the adjusting screw 2413.

[0088] Reference Figures 4-7 The pusher 241 also includes a fixing sleeve 2415, which is fixed to the mounting plate 22. The mounting sleeve 2412 passes through the fixing sleeve 2415 and is threadedly connected to the fixing sleeve 2415. The height of the top of the mounting sleeve 2412 can be adjusted by turning the mounting sleeve 2412 relative to the fixing sleeve 2415.

[0089] Specifically, the fixing sleeve 2415 is fixed to the mounting plate 22 by bolts. Before the bearing plate 23 is installed, the height of the mounting sleeve 2412 relative to the fixing sleeve 2415 is adjusted by rotating the mounting sleeve 2412. The adjustment makes the top height of the push flanges 2411 on all the mounting sleeves 2412 consistent, so as to facilitate the fixing of the bearing plate 23 to multiple push flanges 2411 and ensure that multiple push flanges 2411 support the bearing plate 23.

[0090] This configuration allows for adjustments to the height of the mounting sleeve 2412 relative to the fixed sleeve 2415. On one hand, it allows for adjustments to the installation height of the bearing plate 23 relative to the mounting plate 22, accommodating installation requirements at different heights of the bearing plate 23. On the other hand, by adjusting the height of the mounting sleeve 2412 before installing the bearing plate 23, it ensures that all pushing components 241 support the bearing plate 23, facilitating subsequent adjustments to the flatness of the bearing plate 23 by fine-tuning the height of the pushing flange 2411.

[0091] Reference Figure 6 and Figure 7 The pusher 241 also includes a locking nut 2416, which is threaded onto the mounting sleeve 2412 and is adapted to press against the end face of the fixing sleeve 2415 to lock the mounting sleeve 2412 and prevent relative movement between the mounting sleeve 2412 and the fixing sleeve 2415.

[0092] Reference Figure 5 In addition, the support assembly 24 also includes a plurality of support columns 242, which are arranged along the edge of the mounting plate 22 and are used to support the edge of the bearing plate 23.

[0093] Reference Figure 4 , Figure 8 and Figure 9 Furthermore, the support platform 2 also includes a base 21 and a rotating assembly 25, with the mounting plate 22 mounted on the base 21 via the rotating assembly 25. In this embodiment, the base 21 is mounted on the drive end of the conveying drive component 10.

[0094] This configuration, by arranging the rotating component 25, satisfies the rotation requirements of the support plate 23 in the horizontal plane, allowing the substrate a to rotate within the horizontal plane. After the substrate a is loaded onto the support table 2, the rotary table drives the support table 2 and the substrate a to rotate in the horizontal plane, thereby arranging the substrate a along the detection direction in either the length or width direction to achieve positioning of the substrate a. Subsequently, it can be easily positioned to various locations on the substrate a, thus facilitating the location of defects. The conveying drive component 10 drives the support table 2 and the substrate a to move in the detection direction, so that the substrate a sequentially passes through different detection components.

[0095] Reference Figure 4 , Figure 8 and Figure 9 Specifically, the rotating assembly 25 includes a rotating base 251, a correction drive component 253, and multiple arc-shaped guide rails 252. The fixed end of the rotating base 251 is fixedly mounted on the base 21, and the rotating end of the rotating base 251 is fixedly connected to the mounting plate 22. The rotating base 251 enables the mounting plate 22 to rotate with high precision relative to the base 21. The rotating base 251 supports the bottom center of the mounting plate 22 and is located at the center of gravity of the mounting plate 22 to prevent the mounting plate 22 from tilting. Therefore, ensuring the levelness of the support plate 23 on the mounting plate 22 ensures the height consistency of the surface of the support plate 23.

[0096] Reference Figure 4 , Figure 8 and Figure 9 Multiple arc-shaped guide rails 252 are evenly arranged around the rotation axis of the mounting plate 22, with the center line of the arc-shaped guide rails 252 coinciding with the rotation axis of the rotating seat 251. The track portion of the arc-shaped guide rails 252 is fixedly mounted to the base 21, and the sliding portion of the arc-shaped guide rails 252 is fixedly connected to the mounting plate 22. The multiple arc-shaped guide rails 252 are arranged close to multiple edges of the bottom of the mounting plate 22. The multiple arc-shaped guide rails 252 support multiple edges of the bottom of the mounting plate 22. Therefore, the edges of the mounting plate 22 are all supported, and the mounting plate 22 is less likely to deform due to being suspended, thus ensuring the levelness and upper surface height consistency of the bearing plate 23 and the base plate a.

[0097] This configuration, with the rotating seat 251 and multiple arc-shaped guide rails 252 supporting the mounting plate 22, provides large-scale support for the bottom of the mounting plate 22, preventing the mounting plate 22 from being suspended and deformed. As a result, local collapse of the mounting plate 22 is less likely, thus ensuring the flatness of the support plate 23 and the substrate a on the support plate 23, and ensuring the film formation quality on the surface of the substrate a.

[0098] The correction drive component 253 is connected to the mounting plate 22 to drive the mounting plate 22 to rotate.

[0099] With this configuration, the mounting plate 22 can be rotated by the correction drive 253, thereby adjusting the length direction of the substrate a.

[0100] Specifically, the correction drive 253 includes either a linear drive or a rotational drive. Both can achieve the rotation of the mounting plate 22, and no limitation is made here.

[0101] Reference Figure 4 , Figures 8-10 Furthermore, the rotating assembly 25 also includes multiple multi-axis support platforms 254, which are located between the mounting plate 22 and the base 21. The multiple multi-axis support platforms 254 support multiple corners of the mounting plate 22 respectively, and the moving end of the multi-axis support platform 254 moves with the movement of the mounting plate 22 to maintain support for the corners of the mounting plate 22.

[0102] This configuration, with the multi-axis support platform 254 supporting the corners of the mounting plate 22, prevents deformation at the corners of the mounting plate 22, thus ensuring the flatness of the mounting plate 22, the carrier plate 23, and the substrate a.

[0103] It is important to note that in the processing of large-size substrates, the mounting plate 22 is relatively large, and deformation of any part of the mounting plate 22 will affect the flatness of the support plate 23, and thus the flatness of substrate a. In actual mass production, even if the flatness of the support plate 23 is adjusted to the process requirements during the debugging phase, because the support stage 2 needs to work for a long time, if some parts of the mounting plate 22 lack support, deformation can easily accumulate during processing, which will affect the flatness of the support plate 23 and ultimately affect the flatness of substrate a.

[0104] Reference Figure 9 and Figure 10Specifically, the multi-axis support platform 254 includes a fixed base 2541, a first sliding plate 2542, a second sliding plate 2543, and a rotating plate 2544. The fixed base 2541 is fixed to the base 21 by bolts. The first sliding plate 2542 is slidably arranged on the fixed base 2541, the second sliding plate 2543 is slidably arranged on the first sliding plate 2542, and the rotating plate 2544 is rotatably connected to the second sliding plate 2543, and the rotating plate 2544 is fixedly connected to the mounting plate 22. Thus, the corners of the mounting plate 22 can be supported by the fixed base 2541, the first sliding plate 2542, the second sliding plate 2543, and the rotating plate 2544.

[0105] Reference Figure 9 and Figure 10 The sliding directions of the first sliding plate 2542 and the second sliding plate 2543 are arranged at an angle. In this embodiment, the sliding directions of the first sliding plate 2542 and the second sliding plate 2543 are arranged perpendicularly.

[0106] As the mounting plate 22 rotates, the first sliding plate 2542 and the second sliding plate 2543 slide adaptively, and the rotating plate 2544 rotates adaptively. Therefore, during the rotation of the mounting plate 22, the corners of the mounting plate 22 can still be supported, preventing deformation at the corners of the mounting plate 22.

[0107] It should be noted that when the mounting plate 22 is used to rotate the support plate 23 and the substrate a to correct the deviation of the substrate a, the deviation angle of the substrate a is generally small during loading, and the rotation angle of the mounting plate 22 is also small. Therefore, the rotation angle requirement of the mounting plate 22 can be met by using the multi-axis support stage 254.

[0108] When the mounting plate 22 rotates, the rotating end of the rotating seat 251 rotates synchronously. As the mounting plate 22 rotates, the rotating plate 2544 of the multi-axis support platform 254 rotates because it supports the corners of the mounting plate 22, and the second sliding plate 2543 and the first sliding plate 2542 both slide to support the rotation of the mounting plate 22.

[0109] Correspondingly, by causing the first sliding plate 2542 to slide, the second sliding plate 2543 will slide due to the change in the position of the first sliding plate 2542, and the rotating plate 2544 will rotate, so as to realize the rotation of the mounting plate 22.

[0110] This configuration utilizes a rotating base 251, multiple arc-shaped guide rail assemblies 252, and multiple multi-axis support platforms 254 to rotatably connect the mounting plate 22 to the base 21, providing all-around support for the mounting plate 22. This greatly reduces the possibility of deformation of the mounting plate 22 during long-term processing, ensuring that the flatness of the bearing plate 23 and the substrate a is not affected, and guaranteeing the film formation quality on the surface of the substrate a.

[0111] Reference Figures 9-11 In this embodiment, the correction drive 253 includes a linear module and an additional multi-axis support platform 254. The linear module is driven to the mounting plate 22 via the multi-axis support platform 254. The linear module is driven to the first sliding plate 2542, causing the first sliding plate 2542 to slide, thereby synchronously driving the mounting plate 22 to rotate. Specifically, the linear module includes a lead screw mechanism or a linear motor.

[0112] This configuration, by driving the first sliding plate 2542 to slide and transmitting power to the mounting plate 22, allows the mounting plate 22 to rotate, resulting in higher rotational precision. A larger displacement of the first sliding plate 2542 will only cause the mounting plate 22 to rotate by a smaller angle, thus achieving higher positional adjustment accuracy for the mounting plate 22.

[0113] In some embodiments, the correction drive 253 includes a linear module for driving a first sliding plate 2542 to slide, thereby synchronously driving the mounting plate 22 to rotate. Specifically, the linear module includes a lead screw mechanism or a linear motor.

[0114] Reference Figure 4 , Figure 5 and Figure 12 The defect detection system also includes a first correction component 7, which corrects the substrate a on the support platform 2 by mechanical positioning to ensure that the substrate a is completely located on the support platform 2.

[0115] The first correction component 7 corrects the alignment of substrate a, thereby determining its actual position on the support stage 2 and facilitating accurate subsequent determination of the specific location of detected defects. Furthermore, the first correction component 7 ensures that substrate a is completely positioned on the support stage 2, preventing any gaps or sags on the substrate a, thus preventing deformation and guaranteeing the film quality on the substrate a surface.

[0116] Reference Figure 5 and Figure 12 Specifically, the first correction component 7 includes multiple positioning components 71 and multiple abutment components 72.

[0117] Reference Figure 5 and Figure 12 Multiple positioning components 71 are arranged on adjacent sides of the support platform 2. The positioning components 71 are mounted on the mounting plate 22 and are lower than the support plate 23. Each positioning component 71 includes a positioning rod 711 and a positioning drive 712. The positioning drive 712 drives the positioning rod 711 to extend above the support plate 23. In this embodiment, the positioning drive 712 includes a cylinder.

[0118] Multiple abutment components 72 are arranged on opposite sides of the support platform 2, and positioning components 71 and abutment components 72 are respectively arranged on opposite sides of the support platform 2. The abutment components 72 are adapted to push the substrate a so that the substrate a abuts against the positioning rod 711.

[0119] With this configuration, by pushing the substrate a in the detection direction and perpendicular to the detection direction by the abutting component 72, the substrate a abuts against the positioning rod 711 in the detection direction and perpendicular to the detection direction, thereby achieving the positioning of the substrate a and ensuring that the substrate a is completely located on the carrier plate 23.

[0120] Reference Figure 5 and Figure 12 Specifically, the abutment assembly 72 includes an abutment rod 721, an abutment lifting drive 722, and an abutment pushing drive 723. Both the abutment lifting drive 722 and the abutment pushing drive 723 are driven to the abutment rod 721. Specifically, the abutment pushing drive 723 is mounted on the mounting plate 22, and the abutment lifting drive 722 is mounted on the drive end of the abutment pushing drive 723. The abutment lifting drive 722 is driven to the abutment rod 721, thus enabling the abutment rod 721 to move up and down and horizontally. Therefore, the abutment lifting drive 722 causes the abutment rod 721 to extend above or retract below the support plate 23, and the abutment pushing drive 723 causes the abutment rod 721 to move closer to or away from the support platform 2. In this embodiment, both the abutment lifting drive 722 and the abutment pushing drive 723 include a lead screw mechanism, a linear motor, a cylinder, or an electric cylinder.

[0121] With this configuration, after substrate a is loaded onto the support plate 23, both the positioning rod 711 and the abutment rod 721 rise, and the abutment rod 721 moves toward the positioning rod 711. Thus, the abutment rod 721 pushes the substrate a toward the positioning rod 711, and the substrate a is initially positioned by mechanically abutting the edge.

[0122] Furthermore, multiple positioning components 71 are also arranged in the middle of the support platform 2. These positioning components 71 are arranged in groups, with each group of multiple positioning components 71 arranged perpendicular to the detection direction, and the multiple groups of positioning components 71 are spaced apart in the detection direction. The positioning rod 711 of the positioning component 71 located in the middle of the support platform 2 can extend above the support plate 23.

[0123] With this configuration, when inspecting substrates a of different sizes, the positioning rods 711 of the different positioning components 71 are raised to position the substrate a, so as to meet the inspection requirements of substrates a of different sizes and broaden the application range of the defect detection system.

[0124] Reference Figure 1 and Figure 13The defect detection system also includes a second correction component 8, which is used to capture the marking points on the substrate a to determine the position of the substrate a on the support stage 2, thereby feeding back to the rotary table to drive the substrate a to rotate, thereby realizing the correction of the substrate a.

[0125] It should be noted that due to factors such as cutting precision, the accuracy of the edges of substrate a is difficult to guarantee, and the length direction of the printed area on the surface of substrate a may also differ from the actual length direction of substrate a. Therefore, at least two marking points are generally arranged on the surface of substrate a, and the position of the printed area on the surface of substrate a is determined by the position of the marking points.

[0126] Specifically, the second correction component 8 is located on one side of the support stage 2. The second correction component 8 includes a first capture component 81 and a second capture component 82, which are arranged at intervals in the detection direction. Two marker points on the substrate a are arranged at intervals in the detection direction. As the substrate a is transported, the first capture component 81 and the second capture component 82 capture the positions of the two marker points respectively, thereby improving the capture efficiency of the marker points.

[0127] In this embodiment, since the substrate a is mechanically corrected by the first correction component 7 after being loaded onto the carrier stage 2, it can be ensured that when the substrate a is transported in the detection direction, the marked point of the substrate a passes through the field of view of the first capture component 81 and the second capture component 82.

[0128] It should be noted that if only one capture component is used, if the substrate a is not captured by the mark point during the transport in the detection direction, the substrate a needs to be moved back as a whole so that the substrate a passes through the capture component again, resulting in low detection efficiency.

[0129] Reference Figure 1 and Figure 13 In this embodiment, the first capturing component 81 and the second capturing component 82 respectively capture two marker points on the substrate a, which facilitates the quick capture of the marker points on the substrate a and the positioning of the substrate a.

[0130] Reference Figure 1 and Figure 13 Specifically, the first capture assembly 81 includes a first capture drive 812 and a first capture camera 811. The first capture drive 812 is driven to the first capture camera 811 to move the first capture camera 811 in a direction perpendicular to the detection direction, so that the first capture camera 811 is positioned above the support stage 2. As the support stage 2 moves in the detection direction, the first capture camera 811 captures the marked points on the substrate a.

[0131] By arranging the first capture drive unit 812, the first capture camera 811 can be moved away from above the support platform 2 to avoid interference with the loading and unloading of the substrate a. The first capture drive unit 812 includes a cylinder, a lead screw mechanism, or a linear motor.

[0132] Reference Figure 1 and Figure 13 Specifically, the second capture assembly 82 is located behind the first capture assembly 81. The second capture assembly 82 includes a second capture drive 822, a displacement capture drive 823, and a second capture camera 821. The second capture drive 822 is driven to move the second capture camera 821 perpendicular to the detection direction, positioning the second capture camera 821 above the support stage 2. As the support stage 2 moves in the detection direction, the second capture camera 821 captures the marked points on the substrate a.

[0133] By arranging the second capture drive 822, the second capture camera 821 can be moved away from above the support platform 2 to avoid interference with the loading and unloading of the substrate a. The second capture drive 822 includes a cylinder, a lead screw mechanism, or a linear motor.

[0134] Reference Figure 1 and Figure 13 Furthermore, the position capture drive 823 is driven by the second capture camera 821 to move the second capture camera 821 in the detection direction. In this embodiment, the second capture drive 822 is mounted on the drive end of the position capture drive 823, and the second capture camera 821 is mounted on the drive end of the second capture drive 822. Thus, the position capture drive 823 can drive the second capture camera 821 to move in the detection direction. The position capture drive 823 includes a cylinder, a lead screw mechanism, or a linear motor.

[0135] This configuration, when inspecting substrates a of different sizes, ensures simultaneous capture of two marker points on substrates a of different sizes by changing the distance between the first capture camera 811 and the second capture camera 821 in the detection direction. This broadens the applicability of the defect detection system.

[0136] Reference Figure 5 and Figure 14The support platform 2 further includes a ejector pin assembly 9, which comprises an ejector pin frame 91, a lifting drive 93, and multiple ejector pins 92. The ejector pin frame 91 moves up and down between the mounting plate 22 and the support plate 23 via a slide rail. Multiple ejector pins 92 are mounted on the ejector pin frame 91, and the support plate 23 has multiple through holes for the ejector pins 92 to pass through. The lifting drive 93 is driven by the ejector pin frame 91 to move the ejector pin frame 91 and all the ejector pins 92 up and down, allowing the ejector pins 92 to pass through the through holes and extend above the support plate 23. In this embodiment, the lifting drive 93 includes a lead screw mechanism, a linear motor, a cylinder, or an electric cylinder.

[0137] With this configuration, when the substrate a is loaded and unloaded, the ejector pin 92 rises above the support plate 23, and multiple ejector pins 92 support the substrate a, thereby leaving space between the substrate a and the support plate 23, and leaving space for the external robot arm to facilitate the loading and unloading of the substrate a.

[0138] Reference Figure 14 and Figure 15 Specifically, the ejector pin 92 includes an ejector rod 921.

[0139] Reference Figure 14 and Figure 15 Furthermore, the ejector pin 92 also includes a ball 922, which is mounted on the top of the ejector rod 921, and the ejector rod 921 supports the substrate a through the ball 922.

[0140] With this configuration, when substrate a is being loaded or unloaded, since substrate a is in contact with ball bearing 922, there is rolling friction between ball bearing 922 and substrate a, so substrate a is not easily damaged.

[0141] Reference Figure 14 and Figure 16 The ejector pin assembly 9 also includes multiple adsorption elements 94, which are fixed on the ejector pin holder 91 and are used to adsorb and support the substrate a.

[0142] Reference Figure 14 and Figure 16 Specifically, the adsorption member 94 includes an adsorption rod 941 and an adsorption drive member 942. The top of the adsorption rod 941 is adapted to adsorb the substrate a, and the adsorption drive member 942 drives the adsorption rod 941 to move up and down. The adsorption rod 941 is adapted to extend through the through hole to the top of the support plate 23 or retract to the bottom of the support plate 23. In this embodiment, the adsorption drive member 942 includes a lead screw mechanism, a linear motor, a cylinder, or an electric cylinder.

[0143] With this configuration, when the substrate a is being loaded or unloaded, the adsorption rod 941 rises together with the ejector pin frame 91 and extends above the support plate 23. The adsorption drive member 942 drives the adsorption rod 941 to move further, so that the adsorption rod 941 adsorbs onto the bottom surface of the substrate a, thereby adsorbing and fixing the substrate a onto the adsorption rod 941. Therefore, when the substrate a moves up and down with the ejector pin member 92, it is not easy for it to move arbitrarily in the horizontal direction, ensuring that the position of the substrate a in the horizontal plane does not change.

[0144] It should be noted that when the substrate a is fed to the top of the support plate 23 and supported by multiple ejector pins 92, the substrate a is initially positioned by the first correction component 7, so that the substrate a moves relative to the ejector pins 92. After the initial positioning is completed, the ejector pins 92 descend and place the initially positioned substrate a on the support table 2.

[0145] This avoids damaging substrate a by friction on carrier plate 23, and also prevents wear on carrier plate 23.

[0146] This application provides a defect detection system. When detecting defects in the film layer on the surface of substrate a, substrate a is placed on a support stage 2, and a conveying drive 10 drives substrate a to move in the detection direction so that substrate a passes under multiple detection components. Different detection components detect different defects in the film layer on the surface of substrate a, thereby ensuring the reliability of the detection of substrate a. Furthermore, at least one detection component can be selected to detect different film layers, thereby meeting the detection requirements of different film layers and broadening the applicability of film layer detection.

[0147] During defect detection of substrate a, before placing substrate a onto the support plate 23, the flatness of the support plate 23 needs to be checked to avoid unevenness on its surface and ensure uniform support for substrate a. Multiple pushers 241 are used to support different positions on the support plate 23. By adjusting the height of different pushers 241, the height of different positions on the support plate 23 is adjusted to ensure consistent height across all positions. This guarantees uniform support for substrate a and prevents deformation of substrate a on the support plate 23. Therefore, ensuring consistent height across substrate a not only prevents deformation but also ensures consistent distance between substrate a and the detection components above it, guaranteeing consistent processing and reliable detection, and ensuring the molding quality of the functional layers on the surface of large-size substrates.

[0148] Secondly, an inkjet printing system is provided, including the defect detection system described above.

[0149] Another embodiment of this application provides an inkjet printing system. Since the inkjet printing system includes the above-mentioned defect detection system, the beneficial effects of the inkjet printing system are the same as those of the above-mentioned defect detection system, and will not be repeated here.

[0150] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0151] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0152] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A defect detection system, characterized in that, It includes the machine base and the components arranged on the machine base: A conveying assembly includes a support platform and a conveying drive. The support platform carries a substrate, and the conveying drive moves the support platform and the substrate in a detection direction. The support platform includes a mounting plate, a support plate, and a support assembly. The support plate is located above the mounting plate and carries the substrate. The mounting plate supports the support plate via the support assembly. The support assembly includes multiple pushers evenly distributed below the support plate, and the pushers are adapted to adjust the height of each point on the support plate. A detection device, comprising multiple sets of detection components arranged sequentially in the detection direction, wherein a conveying component delivers the substrate to each of the detection components. The multiple sets of detection components detect different defects in the film layer on the substrate surface.

2. The defect detection system according to claim 1, characterized in that, The fixed end of the pusher is installed on the mounting plate, and the movable end of the pusher is connected to the bottom surface of the support plate; the operating end of the pusher is located at the top of the movable end of the pusher, and the surface of the support plate is provided with a plurality of through adjustment holes, and the movable ends of the plurality of pushers are respectively installed at the plurality of adjustment holes of the support plate; The operating end of the pusher, which passes through the adjustment hole, is used to adjust the height of the movable end of the pusher, thereby changing the height of the corresponding position of the support plate.

3. The defect detection system according to claim 2, characterized in that, The pusher includes: A push-top flange, which is fixed to the bottom surface of the bearing plate; The mounting sleeve is connected to the mounting plate; An adjusting screw is provided, which passes through the push flange and the mounting sleeve, and is threadedly connected to both the push flange and the mounting sleeve; the top of the adjusting screw is aligned with the adjusting hole. The adjusting screw is rotated through the adjusting hole to cause the mounting sleeve to move up and down, thereby adjusting the local height of the support plate.

4. The defect detection system according to claim 3, characterized in that, The pusher also includes a fixing sleeve, which is fixed to the mounting plate. The mounting sleeve passes through the fixing sleeve and is threadedly connected to the fixing sleeve. The height of the top of the mounting sleeve can be adjusted by twisting the mounting sleeve relative to the fixing sleeve.

5. The defect detection system according to claim 1, characterized in that, The support platform further includes a base and a rotating assembly. The mounting plate is mounted on the base via the rotating assembly, and the rotating assembly includes: A rotating base, wherein the fixed end of the rotating base is mounted on the base, and the rotating end of the rotating base is connected to the mounting plate; Multiple arc-shaped guide rail groups are evenly arranged around the rotation axis of the mounting plate. The track portion of the arc-shaped guide rail group is installed on the base, and the sliding portion of the arc-shaped guide rail group is connected to the mounting plate. A correction drive component is connected to the mounting plate to drive the mounting plate to rotate; The rotating base supports the bottom center of the mounting plate, and the multiple arc-shaped guide rails support multiple edges of the bottom of the mounting plate.

6. The defect detection system according to claim 5, characterized in that, The rotating assembly also includes multiple multi-axis support platforms, which are disposed between the mounting plate and the base, and the multiple multi-axis support platforms respectively support multiple corners of the mounting plate; The multi-axis support platform includes: The fixing seat is fixed to the base; A first sliding plate is slidably arranged on the fixed base; A second sliding plate is slidably arranged on the first sliding plate; A rotating plate, which is rotatably connected to the second sliding plate and connected to the mounting plate, to support the edges and corners of the mounting plate; The sliding directions of the first sliding plate and the second sliding plate are arranged at an angle. As the mounting plate rotates, the first sliding plate and the second sliding plate slide adaptively, and the rotating plate rotates adaptively.

7. The defect detection system according to claim 1, characterized in that, The detection device includes: A first detection component, comprising a plurality of first imaging modules arranged side-by-side perpendicular to the detection direction; The second detection component is arranged sequentially with the first detection component in the detection direction. The second detection component includes multiple line scanning cameras arranged side by side perpendicular to the detection direction. The imaging direction of the line scanning cameras is arranged at an angle to the detection direction in the horizontal plane, and the imaging direction of the line scanning cameras is arranged at an angle to the vertical direction in the vertical plane.

8. The defect detection system according to claim 7, characterized in that, The first detection component also includes: Multiple first lifting drive components are respectively connected to multiple first imaging modules to adjust the height of the multiple first imaging modules respectively; Multiple rangefinders are arranged to correspond to multiple first imaging modules, and the rangefinders are used to measure the vertical distance between the first imaging module and the substrate. The substrate is driven to pass under the multiple ranging elements to determine the height of the substrate at various points. When a portion of the substrate moves into the field of view of the first imaging module, the height of the corresponding first imaging module is adjusted to ensure that the portion of the substrate located below the first imaging module is within the focal plane of the first imaging module.

9. The defect detection system according to claim 7, characterized in that, The detection device further includes a re-inspection component, which is located behind the first detection component. The re-inspection component includes: A re-inspection vision module, wherein the re-inspection vision module is used to image the surface of the substrate; A re-inspection lifting drive is connected to the re-inspection vision module to drive the re-inspection vision module to move up and down. A re-inspection lateral movement drive is provided, which is connected to the re-inspection vision module to drive the re-inspection vision module to move perpendicular to the detection direction.

10. The defect detection system according to claim 1, characterized in that, It also includes a first correction component, which comprises: Multiple positioning components are arranged on adjacent sides and in the middle of the support platform, and the positioning components are lower than the support surface of the support platform. Each positioning component includes a positioning rod and a positioning drive, and the positioning drive drives the positioning rod to extend above the support platform. Multiple abutting components are arranged on opposite sides of the support platform, and the positioning component and the abutting component are respectively arranged on opposite sides of the support platform; the abutting components are adapted to push the substrate so that the substrate abuts against the positioning rod.

11. The defect detection system according to claim 10, characterized in that, It also includes a second correction component, which is used to capture the marking points on the substrate to determine the position of the substrate on the support platform. The second correction component is located on one side of the support platform. The second correction component includes: The first capture component includes a first capture driver and a first capture camera. The first capture driver is driven to drive the first capture camera to move in a direction perpendicular to the detection direction, so that the first capture camera is positioned above the support platform. As the support platform moves in the detection direction, the first capture camera captures the marking points on the substrate. A second capture assembly is arranged at a distance from the first capture assembly in the detection direction, with the second capture assembly located behind the first capture assembly. The second capture assembly includes a second capture drive, a transposition capture drive, and a second capture camera. The second capture drive is driven to the second capture camera to move the second capture camera perpendicular to the detection direction, so that the second capture camera is positioned above the support platform. As the support platform moves in the detection direction, the second capture camera captures the marker points on the substrate. The transposition capture drive is driven to the second capture camera to move the second capture camera in the detection direction.

12. An inkjet printing system, characterized in that, Includes the defect detection system as described in any one of claims 1 to 11.

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