Display module and display device

Abstract

The display module and the display device are provided, the display module comprises a display panel, a driving chip, a protective layer and a heat dissipation layer, the display panel comprises a display area and a binding area located on one side of the display area, the driving chip is located on the binding area of the display panel and is electrically connected to the binding area of the display panel, the protective layer comprises a first protective layer arranged on the side, away from the display panel, of the driving chip and a second protective layer at least surrounding the four sides of the driving chip, a plurality of through holes penetrating the first protective layer in the direction perpendicular to the surface of the display panel are arranged on the first protective layer, and the heat dissipation layer is filled in the through holes, the driving chip is wrapped by the first protective layer and the second protective layer, the driving chip is protected, the heat dissipation layer is arranged to facilitate the heat dissipation of the protective layer, the working efficiency and the service life of the driving chip can be prolonged, and the flatness of the heat dissipation layer during solidification is facilitated due to the arrangement of the heat dissipation layer in the through holes.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the development of display technology, flat panel display devices such as liquid crystal displays (LCDs) and OLED (Organic Light-Emitting Diode) display panels are widely used in various electronic products and have become the mainstream of display devices. However, display devices (such as mobile phones and computers) may be in extremely harsh environments during use. Summary of the Invention

[0003] In view of this, the purpose of this disclosure is to provide a display module and display device that can solve at least one of the above-mentioned technical problems.

[0004] For the purposes described above, this disclosure discloses a display module comprising:

[0005] The display panel includes a display area and a binding area located on one side of the display area.

[0006] The driver chip is located in the bonding area of ​​the display panel;

[0007] The protective layer includes a first protective layer disposed on the side of the driver chip away from the display panel, and a second protective layer at least surrounding the driver chip. The first protective layer has a plurality of through holes that penetrate the first protective layer in a direction perpendicular to the surface of the display panel.

[0008] A heat dissipation layer is provided, filling multiple through holes. By encapsulating the driver chip with a first protective layer and a second protective layer, the driver chip is protected, its operating efficiency and lifespan are extended, thereby improving the quality of the display module. Furthermore, since the heat dissipation layer is located within the through holes, it helps ensure the flatness of the heat dissipation layer during curing.

[0009] In one embodiment, in a direction parallel to the surface of the display panel, there is a gap between the second protective layer and the driving chip, and the heat dissipation layer fills the gap;

[0010] Preferably, the gap communicates with the through hole in the first protective layer.

[0011] In one embodiment, the cross-section of the through hole is rectangular or trapezoidal in the direction perpendicular to the surface of the display panel;

[0012] Preferably, in the direction perpendicular to the surface of the display panel, the cross-section of the second protective layer is trapezoidal or rectangular.

[0013] In one embodiment, the spacing between adjacent through holes is equal in a direction parallel to the surface of the display panel;

[0014] Preferably, each of the through holes has the same diameter;

[0015] Preferably, the diameter of the through hole gradually increases in the direction away from the display panel.

[0016] In one embodiment, the surface of the first protective layer away from the display panel is flush with the surface of the second protective layer away from the display panel;

[0017] Preferably, the surface of the heat dissipation layer away from the display panel is flush with the surface of the first protective layer away from the display panel.

[0018] In one embodiment, the material of the protective layer includes either hot melt adhesive or UV adhesive;

[0019] Preferably, the material of the heat dissipation layer includes thermal adhesive.

[0020] In one embodiment, the height of the first protective layer is greater than the height of the driver chip in a direction perpendicular to the surface of the display panel.

[0021] Preferably, in a direction perpendicular to the surface of the display panel, the height of the second protective layer is equal to the height difference between the first protective layer and the driver chip.

[0022] In one embodiment, the surface of the heat dissipation layer closest to the driver chip is attached to the driver chip.

[0023] In one embodiment, it further includes:

[0024] A flexible circuit board is located on the side of the driver chip away from the display area, and the flexible circuit board is electrically connected to the display panel in the bonding area.

[0025] Based on the same inventive concept, this disclosure also discloses a display device, which includes a display module as described above.

[0026] Compared with the prior art, the display module and display device provided in this disclosure protect the driver chip by enclosing it with a first protective layer and a second protective layer. The heat dissipation layer helps to dissipate heat from the protective layer, thereby extending the working efficiency and service life of the driver chip and improving the quality of the display module. At the same time, since the heat dissipation layer is located in the through hole, it helps to ensure the flatness of the heat dissipation layer during curing. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a top view of a display module in the prior art;

[0029] Figure 2 for Figure 1 An enlarged schematic diagram of part A in the middle;

[0030] Figure 3 for Figure 1 Side view of part A in the middle;

[0031] Figure 4 This is a top view of the display module provided in an embodiment of this application;

[0032] Figure 5 for Figure 4 Partial cross-section diagram of section B Figure 1 ;

[0033] Figure 6 for Figure 4 Partial cross-section diagram of section B Figure 2 . Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0035] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0036] refer to Figures 1-3 ,in Figure 1 This is a top view of a display module in the prior art; Figure 2 for Figure 1 An enlarged schematic diagram of part A in the middle; Figure 3 for Figure 1 Side view of part A in the middle;

[0037] In related technologies, an integrated circuit chip 200 (IC) is disposed in the bonding area of ​​the display panel 100. The integrated circuit chip 200 is electrically connected to the display panel 100. To prevent the integrated circuit chip 200 from failing due to insufficient protection, it needs to be protected. Generally, a transparent protective adhesive 300 (BPL adhesive) is placed on both sides of the integrated circuit chip 200. The height of the protective adhesive 300 does not exceed the height of the integrated circuit chip 200 (e.g., ...). Figure 3 As shown in the figure, since the protective adhesive 300 in the prior art is a single layer of dispensing, the protective adhesive 300 has good fluidity, is not easy to stack, and has poor shape retention. In addition, the side of the integrated circuit chip 200 facing away from the display panel 100 is not provided with protective adhesive 300, that is, the surface of the integrated circuit chip 200 facing away from the display panel 100 is exposed. Therefore, there is a failure caused by insufficient protection of the integrated circuit chip. At the same time, since the protective adhesive 300 is placed around the integrated circuit chip 300 in the prior art, it is not conducive to the heat dissipation of the integrated circuit chip 300. Excessive temperature will affect the service life of the integrated circuit chip 300.

[0038] For the reasons mentioned above, this application provides a display module and a display device. The display module includes a display panel 10, a driver chip 20, a protective layer 30, and a heat dissipation layer 40. The display panel 10 includes a display area AA and a bonding area BA1 located on one side of the display area AA. The driver chip 20 is located in the bonding area BA1 of the display panel 10 and is electrically connected to the bonding area BA1 of the display panel 10. The protective layer 30 includes a first protective layer 31 disposed on the side of the driver chip 20 away from the display panel 10 and a second protective layer 32 at least surrounding the driver chip 20. The first protective layer 31 has a plurality of through holes 3. 11. The through hole 311 penetrates the first protective layer 31 in a direction perpendicular to the surface of the display panel 10 (Z direction). The heat dissipation layer 40 is filled in the through hole 311. In this embodiment, the driver chip 20 is wrapped by the first protective layer 31 and the second protective layer 32, which protects the driver chip 20. By setting the heat dissipation layer 40, it is beneficial to conduct heat out of the protective layer 30, thereby extending the working efficiency and service life of the driver chip 20 and improving the quality of the display module. At the same time, since the heat dissipation layer 40 is set in the through hole 311, it is beneficial to ensure the flatness of the heat dissipation layer 40 during curing.

[0039] Next, combine Figures 4-6 This application describes a display module provided in an embodiment. Figure 4 This is a top view of the display module provided in an embodiment of this application; Figure 5 for Figure 4 Partial cross-section diagram of section B Figure 1 ; Figure 6 for Figure 4 Partial cross-section diagram of section B Figure 2 .

[0040] refer to Figure 4 In one embodiment, the display module includes a display panel 10, which includes a display area AA and a non-display area BAA. The non-display area BAA includes a bonding area BA1 located on one side of the display area AA and a bending area BA2 connecting the display area AA and the bonding area BA1. The display area AA is used for display, and the bending area BA2 is the area where the display panel 10 realizes the bending function. The bonding area BA1 can be used to bond areas such as integrated circuit chips (IC), flexible printed circuit boards (FPC), etc., to realize connection and communication with other components. The bending area BA2 is used to bend the bonding area BA1 to the backlight side of the display panel 10.

[0041] refer to Figures 4-6In this embodiment, the driving chip 20 includes an integrated circuit (IC) chip. The driving chip 20 is located in the bonding area BA1 of the display panel 10 and is bonded and connected (electrically connected) to the bonding area BA1 of the display panel 10. The driving chip 20 located in the bonding area BA1 of the display panel 10 is bent to the backlight side of the display panel 10 via the bending area BA2.

[0042] refer to Figures 5-6 In one embodiment, the display module further includes a protective layer 30 for mechanical protection of the driver chip 20, preventing mechanical impact to the edges of the driver chip 20 during manufacturing, transportation, assembly, and bending, thereby improving electrical performance. Further, the protective layer 30 includes a first protective layer 31 located on the side of the driver chip 20 facing away from the display panel 10 and a second protective layer 32 located around the perimeter of the driver chip 20. That is, the first protective layer 31 and the second protective layer 32 enclose the driver chip 20, providing protection.

[0043] For example, in this embodiment, the first protective layer 31 and the second protective layer 32 are integrally formed, that is, the protective layer 30 in this embodiment is an integral structure.

[0044] For example, in this embodiment, the material of the protective layer 30 includes either hot melt adhesive or photosensitive adhesive (UV adhesive), both of which are adhesives that can cure in a short time and easily maintain their shape.

[0045] For example, in this embodiment, the material of the heat dissipation layer 40 includes thermal adhesive, which achieves heat dissipation of the driver chip 20 while fixing the heat dissipation layer 40 and the driver chip 20.

[0046] Furthermore, since the driver chip 20 generates a large amount of heat after prolonged operation, if the heat inside the protective layer 30 cannot dissipate, the driver chip 20 within the protective layer 30 will malfunction. Therefore, this application provides multiple through holes 311 on the first protective layer 31. These through holes 311 penetrate the first protective layer 31 along a direction perpendicular to the surface of the display panel 10 (Z direction), and a heat dissipation layer 40 is filled within each through hole 311. By providing the heat dissipation layer 40, it is beneficial to dissipate the heat within the protective layer 30, thereby extending the working efficiency and lifespan of the driver chip 20, and ultimately improving the quality of the display module. Simultaneously, since the heat dissipation layer 40 is located within the through holes 311, it helps to ensure the flatness of the heat dissipation layer 40 during curing.

[0047] refer to Figures 5-6In one embodiment, the surface 312 of the first protective layer 31 facing away from the display panel 10 is flush with the surface 322 of the second protective layer 32 facing away from the display panel 10, and the surface 41 of the heat dissipation layer 40 facing away from the driver chip 20 is flush with the surface 312 of the first protective layer 31 facing away from the display panel 10. This design ensures the flatness of the protective layer 30 and the heat dissipation layer 40 on the side away from the display panel 10.

[0048] refer to Figures 5-6 In one embodiment, both the first protective layer 31 and the second protective layer 32 are formed using a multi-layer dispensing process. This design ensures that, in the direction perpendicular to the surface of the display panel 10, the height d3 of the first protective layer 31 is higher than the height d4 of the driver chip 20, and the height d2 of the second protective layer 32 is equal to the height difference d1 between the first protective layer 31 and the driver chip 20. This effectively protects the four edges of the driver chip 20 and the side of the driver chip 20 that faces away from the display panel 10.

[0049] refer to Figures 5-6 In one embodiment, in the direction parallel to the surface of the display panel 10 (X direction), there is a gap H between the second protective layer 32 and the driver chip 20, that is, there is a gap H between the four edges of the driver chip 20 and the second protective layer 32. The gap is connected to the through hole 311 of the first protective layer 31, and the gap is filled with a heat dissipation layer 40. This design allows the four edges of the driver chip 20 to also be provided with a heat dissipation layer 40. As a result, the heat generated at the four edges of the driver chip 20 can be quickly dissipated through the heat dissipation layer 40, thereby improving the heat dissipation efficiency of the driver chip 20.

[0050] For example, in this embodiment, the spacing between adjacent through holes 311 is equal, that is, the multiple through holes 311 provided on the first protective layer 31 are equally spaced. Furthermore, the diameter of each through hole 311 is the same.

[0051] refer to Figures 5-6 In one embodiment, the cross-section of the through hole 311 is rectangular or trapezoidal in the direction perpendicular to the surface of the display panel 10, and the cross-section of the second protective adhesive layer is also rectangular or trapezoidal. For example, the cross-section of the through hole 311 in the direction perpendicular to the surface of the display panel 10 (Z direction) is rectangular (e.g.,...). Figure 5 As shown in the figure, in a preferred embodiment, the cross-section of the through hole 311 in the direction perpendicular to the surface of the display panel 10 (Z direction) is trapezoidal (e.g., Figure 6As shown in the figure, this design maximizes the surface area of ​​the heat dissipation layer 40 away from the driver chip 20, resulting in relatively better heat dissipation. For example, the cross-section of the through hole 311 in the direction perpendicular to the surface of the display panel 10 (Z direction) is trapezoidal, which can be interpreted as the diameter of the through hole 311 gradually increasing along the direction away from the display panel 10, thereby maximizing the surface area of ​​the heat dissipation layer 40 away from the driver chip 20 and improving the heat dissipation effect of the heat dissipation layer 40.

[0052] refer to Figures 5-6 In one embodiment, the surface 42 of the heat dissipation layer 40 near the driver chip 20 is attached to the driver chip 20. This design allows the heat generated by the driver chip 20 to be directly dissipated through the heat dissipation layer 40.

[0053] refer to Figure 4 In one embodiment, the display module further includes a flexible circuit board 50, which is located on the side of the driver chip 20 away from the display area AA, and the flexible circuit board 50 is electrically connected to the display panel 10 in the bonding area BA1 (bonding connection).

[0054] Based on the same inventive concept, this disclosure also provides a display device that includes the display module described in this disclosure. The display device may include devices with image processing capabilities, such as mobile phones, tablets, wearable devices, servers, personal computers, laptops, etc. Because this display device includes the display module described in this application, its display effect is better.

[0055] It should be noted that the above description describes some embodiments of this disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0056] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A display module, characterized in that, include: The display panel includes a display area and a binding area located on one side of the display area. The driver chip is located in the bonding area of ​​the display panel; The protective layer includes a first protective layer disposed on the side of the driver chip away from the display panel, and a second protective layer at least surrounding the driver chip. The first protective layer has a plurality of through holes that penetrate the first protective layer in a direction perpendicular to the surface of the display panel. A heat dissipation layer is filled with multiple through holes.

2. The display module as described in claim 1, characterized in that, In a direction parallel to the surface where the display panel is located, there is a gap between the second protective layer and the driving chip, and the heat dissipation layer fills the gap; Preferably, the gap communicates with the through hole in the first protective layer.

3. The display module as described in claim 1, characterized in that, In the direction perpendicular to the surface of the display panel, the cross-section of the through hole is rectangular or trapezoidal; Preferably, in the direction perpendicular to the surface of the display panel, the cross-section of the second protective layer is trapezoidal or rectangular.

4. The display module as described in claim 1, characterized in that, In a direction parallel to the surface of the display panel, the spacing between adjacent through holes is equal; Preferably, each of the through holes has the same diameter; Preferably, the diameter of the through hole gradually increases in the direction away from the display panel.

5. The display module as described in claim 1, characterized in that, The surface of the first protective layer away from the display panel is flush with the surface of the second protective layer away from the display panel; Preferably, the surface of the heat dissipation layer away from the display panel is flush with the surface of the first protective layer away from the display panel.

6. The display module as described in claim 1, characterized in that, In a direction perpendicular to the surface of the display panel, the height of the first protective layer is greater than the height of the driver chip; Preferably, in a direction perpendicular to the surface of the display panel, the height of the second protective layer is equal to the height difference between the first protective layer and the driver chip.

7. The display module as described in claim 1, characterized in that, The material of the protective layer includes either hot melt adhesive or UV adhesive; Preferably, the material of the heat dissipation layer includes thermal adhesive.

8. The display module as described in claim 1, characterized in that, The heat dissipation layer is attached to the side of the driver chip closest to the driver chip.

9. The display module as described in claim 1, characterized in that, Also includes: A flexible circuit board is located on the side of the driver chip away from the display area, and the flexible circuit board is electrically connected to the display panel in the bonding area.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1-9.

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