An adaptive flow control method for ultrasonic atomized flux coating of photovoltaic solder ribbon

Abstract

The application discloses a self-adaptive flow control method for ultrasonic atomization flux coating of photovoltaic welding strips, and comprises the following steps: visually identifying the photovoltaic welding strip and a flux supply device, calibrating and aligning the spatial positions of the photovoltaic welding strip and the flux supply device; adjusting the output valve operating state of the flux supply device according to the spatial position alignment state of the flux supply device; dynamically identifying the photovoltaic welding strip to obtain the transmission motion characteristics of the photovoltaic welding strip, so as to determine the flux coating characteristics of the photovoltaic welding strip; adjusting the ultrasonic atomization coating operation of the flux supply device on the photovoltaic welding strip according to the flux coating characteristics, so as to set the working parameters of the flux supply device; obtaining the coating characteristics of the surface of the photovoltaic welding strip, so as to determine the coating defects, and thus the ultrasonic atomization coating operation is adjusted. By aligning the photovoltaic welding strip and the flux supply device, combining the transmission motion of the photovoltaic welding strip and the physical state of the flux, the flux is fully and uniformly coated, and the quality of the photovoltaic welding strip is improved.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic solder ribbon processing, and in particular to an adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon. Background Technology

[0002] As a key material for current collection in photovoltaic (PV) soldering, the fatigue resistance of PV soldering ribbon needs to be optimized through tinning as PV soldering ribbons develop towards higher power outputs. In actual production, surface crystallization and coarsening occur on the PV soldering ribbon during cooling, affecting the tinning quality. After tinning, the PV soldering ribbon needs to transmit electricity to the junction box. To reduce the surface tension and contact angle of the PV soldering ribbon, thereby improving welding quality and reducing post-weld cleaning requirements, precise application of flux is necessary. Current flux application methods primarily involve directly coating the PV soldering ribbon surface with flux. However, this method cannot guarantee uniform and complete flux coverage, leading to issues such as missed or insufficient flux application, affecting the mechanical properties and corrosion resistance of the PV soldering ribbon, and failing to achieve the goal of cleaning-free PV soldering ribbons. Summary of the Invention

[0003] Considering that the existing flux coating operation on the surface of photovoltaic welding ribbon cannot guarantee that the flux is evenly and completely covered on the surface of the photovoltaic welding ribbon, resulting in problems such as missed flux coating or insufficient coating amount, the mechanical properties and corrosion resistance of the photovoltaic welding ribbon are affected.

[0004] In view of the above problems, the present invention provides an adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon, comprising: Visual recognition of photovoltaic soldering strip and flux supply equipment; calibration and alignment of the spatial positions of the photovoltaic soldering strip and flux supply equipment; adjustment of the operating state of the output valve of the flux supply equipment according to the alignment status of the spatial position of the flux supply equipment. The photovoltaic solder ribbon is dynamically identified to obtain its transmission motion characteristics; based on the transmission motion characteristics, the flux coating characteristics of the photovoltaic solder ribbon are determined. Based on the flux coating characteristics, adjust the ultrasonic atomization coating operation of the flux supply equipment on the photovoltaic solder ribbon; based on the ultrasonic atomization coating operation, set the operating parameters of the flux supply equipment; The coating characteristics of the photovoltaic ribbon surface are obtained to determine coating defects; the ultrasonic atomization coating operation is adjusted according to the coating defects.

[0005] Optionally, visual recognition of the photovoltaic solder ribbon and flux supply equipment, and marking and aligning the spatial positions of the photovoltaic solder ribbon and the flux supply equipment, includes: First and second images of the photovoltaic solder strip and the flux supply equipment are acquired respectively. The morphological features of the photovoltaic solder strip and the flux supply equipment are extracted from the first and second images respectively. The morphological features of the photovoltaic solder strip include the geometric features of the solder strip boundary space. The morphological features of the flux supply equipment include the sliding trajectory features of the supply equipment. By comparing the spatial position deviations between the geometric features of the solder strip boundary space and the sliding trajectory features, a spatial alignment strategy for the photovoltaic solder strip and the flux supply device is determined based on the spatial position deviations, thereby aligning the photovoltaic solder strip and the flux supply device.

[0006] Optionally, adjusting the operating state of the output valve of the flux supply device according to its spatial alignment includes: The execution progress of the spatial alignment strategy is obtained, and the trend of spatial position deviation between the photovoltaic ribbon and the flux supply device is determined based on the execution progress. Based on the trend of the spatial position deviation, determine the time required for the photovoltaic welding strip and the flux supply equipment to be aligned. According to the required time, adjust the operating state of the output valve of the flux supply equipment; wherein, adjusting the operating state of the output valve includes switching the output valve of the flux supply equipment from the closed state to the open state.

[0007] Optionally, the photovoltaic ribbon is dynamically identified to obtain its transmission motion characteristics, including: The transmission dynamic image of the photovoltaic ribbon is acquired, and the transmission dynamic image is processed by frame segmentation and frame-by-frame spatial position change recognition to obtain the transmission speed of the photovoltaic ribbon along the corresponding direction.

[0008] Optionally, based on the transmission motion characteristics, the flux coating characteristics of the photovoltaic ribbon are determined, including: Based on the surface material properties and flux composition formulation of the photovoltaic solder ribbon, the adhesion contact characteristics of the flux on the photovoltaic solder ribbon are determined; wherein, the adhesion contact characteristics include the adhesion contact angle of the flux on the surface of the photovoltaic solder ribbon; Based on the transmission speed and the adhesion characteristics, the flux coating flow rate required to form a preset flux distribution density on the photovoltaic solder ribbon surface is determined; wherein, the preset flux distribution density refers to the volume of flux adhering to a unit area on the photovoltaic solder ribbon surface; and the flux coating flow rate refers to the volume of flux coated onto the photovoltaic solder ribbon surface by the flux supply equipment per unit time.

[0009] Optionally, adjusting the ultrasonic atomization coating operation of the flux supply device on the photovoltaic ribbon according to the flux coating characteristics includes: Based on the flux coating characteristics, the size of the atomized flux droplets and the output flow rate of the atomized flux droplets are adjusted corresponding to the ultrasonic atomization coating operation of the flux supply device on the surface of the photovoltaic solder ribbon.

[0010] Optionally, the operating parameters of the flux supply device are set according to the ultrasonic atomization coating operation, including: The ultrasonic oscillation power of the flux supply device is set according to the size of the atomized flux droplets. The valve opening of the flux supply device is set according to the output flow rate of the atomized flux droplets.

[0011] Optionally, the ultrasonic oscillation power of the flux supply device is set according to the size of the atomized flux droplets, including: Real-time acquisition of the current spatial alignment deviation between the photovoltaic welding strip and the flux supply device; Real-time acquisition of the average surface roughness in the morphological characteristics of the current photovoltaic ribbon; The dynamic correction factor corresponding to the ultrasonic oscillation power setting is obtained using the current spatial alignment deviation and average surface roughness. The dynamic correction factor is obtained by the following formula: ; Where S represents the dynamic correction factor; e 01 and e 02 ΔL represents the preset weighting coefficient, with values ​​ranging from [0.2, 0.5] to [0.1, 0.3]; ΔL represents the current spatial alignment deviation between the photovoltaic solder ribbon and the flux supply device; L represents the maximum permissible alignment deviation; R represents the average surface roughness; λ represents the ultrasonic wavelength in the flux. The average diameter of the target droplet and the surface tension of the flux are retrieved from the atomized flux droplet size, and the average diameter of the target droplet and the surface tension of the flux are normalized to obtain the normalized average diameter of the target droplet and the surface tension of the flux. The real-time transmission speed and flux density in the transmission motion characteristics of the photovoltaic ribbon are retrieved, and the real-time transmission speed and flux density are normalized to obtain the normalized real-time transmission speed and flux density. The ultrasonic oscillation power of the flux supply device is set by combining the normalized average diameter of the target droplets, the surface tension of the flux, the normalized real-time transmission speed, and the flux density with a dynamic correction factor. The ultrasonic oscillation power of the flux supply device is obtained by the following formula: ; Wherein, P represents the ultrasonic oscillation power of the flux supply equipment; P0 represents the preset reference ultrasonic oscillation power; v represents the real-time transmission speed after normalization; ρ represents the density of the flux after normalization; D represents the average diameter of the target droplet; A represents the surface tension of the flux; α represents the fluid property coupling correction index, with a value range of 0.4-0.6; β represents the transmission speed correction index, with a value range of 0.2-0.4; and k represents the atomization difficulty coefficient, with a value range of 0.8-1.2.

[0012] Optionally, the coating characteristics of the photovoltaic ribbon surface are obtained to determine coating defects, including: Surface images of the photovoltaic solder ribbon during ultrasonic atomization flux coating are acquired, and flux coating status is identified on the surface images to determine flux coating defect areas on the photovoltaic solder ribbon surface; wherein, the flux coating defect areas include areas of the photovoltaic solder ribbon surface that are not coated with flux and areas of the photovoltaic solder ribbon surface where the flux coating thickness does not meet the preset thickness condition.

[0013] Optionally, adjusting the ultrasonic atomization coating operation according to the coating defects includes: The coating direction of the ultrasonic atomization coating operation is adjusted according to the distribution of the areas on the surface of the photovoltaic ribbon that are not coated with flux. The duration of the ultrasonic atomization coating operation is adjusted based on the actual flux coating thickness in areas where the flux coating thickness on the photovoltaic ribbon surface does not meet the preset thickness condition.

[0014] Optionally, the coating direction of the ultrasonic atomization coating operation is adjusted according to the distribution of areas on the photovoltaic ribbon surface that are not coated with flux, including: Obtain the boundary position of the area on the surface of the photovoltaic ribbon that is not coated with flux, map the boundary position to the action space coordinate system of the ultrasonic atomization coating operation, and generate the coating operation constraint boundary. The coating direction angle of the ultrasonic atomization coating operation is adjusted according to the coating operation constraint boundary.

[0015] The beneficial effects of the above-mentioned technical solutions provided in the embodiments of the present invention include at least the following: This invention provides an adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbons. The method involves visually recognizing the photovoltaic solder ribbon and flux supply equipment to calibrate and align their spatial positions. Based on the alignment of the flux supply equipment, the method adjusts the operating state of its output valve. Dynamic recognition of the photovoltaic solder ribbon is performed to obtain its transmission motion characteristics, thereby determining the flux coating characteristics. Based on these characteristics, the method adjusts the ultrasonic atomization coating operation of the flux supply equipment to set its operating parameters. The method also acquires the coating characteristics of the photovoltaic solder ribbon surface to identify coating defects and adjust the ultrasonic atomization coating operation accordingly. By aligning the photovoltaic solder ribbon and flux supply equipment, accurate flux output is ensured. Furthermore, by combining the transmission motion of the photovoltaic solder ribbon and the physical state of the flux, a suitable ultrasonic atomization coating operation is determined, achieving comprehensive and uniform flux coating and improving the quality of the photovoltaic solder ribbon.

[0016] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings.

[0017] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic flowchart of an adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon provided in an embodiment of the present invention.

[0019] Figure 2 It is the process of spatial positioning and alignment.

[0020] Figure 3 It is the process of determining the characteristics of flux coating.

[0021] Figure 4 It is the adjustment process of ultrasonic atomization coating operation. Detailed Implementation

[0022] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0023] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "far," "near," "front," and "rear," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0025] Please see Figure 1 As shown, an embodiment of this application provides an adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon. This adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon includes: Visual recognition of photovoltaic soldering ribbon and flux supply equipment; calibration and alignment of the spatial position of photovoltaic soldering ribbon and flux supply equipment; adjustment of the operating status of the output valve of flux supply equipment according to the alignment status of the spatial position of flux supply equipment. The photovoltaic solder ribbon is dynamically identified to obtain its transmission motion characteristics; based on these characteristics, the flux coating characteristics of the photovoltaic solder ribbon are determined. Based on the characteristics of flux coating, adjust the ultrasonic atomization coating operation of the flux supply equipment on the photovoltaic solder ribbon; based on the ultrasonic atomization coating operation, set the working parameters of the flux supply equipment. The coating characteristics of the photovoltaic ribbon surface are obtained to identify coating defects; the ultrasonic atomization coating operation is adjusted according to the coating defects.

[0026] The beneficial effects of the above embodiments are that the adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon ensures accurate flux output by aligning the photovoltaic solder ribbon and flux supply equipment; it also determines the appropriate ultrasonic atomization coating operation by combining the transmission motion of the photovoltaic solder ribbon and the physical state of the flux, so as to achieve comprehensive and uniform flux coating and improve the quality of photovoltaic solder ribbon.

[0027] In another embodiment, visual recognition of the photovoltaic solder ribbon and flux supply equipment, and marking and aligning the spatial position of the photovoltaic solder ribbon and flux supply equipment, includes: First and second images of the photovoltaic soldering strip and the flux supply equipment were acquired respectively. The morphological features of the photovoltaic soldering strip and the flux supply equipment were extracted from the first and second images. The morphological features of the photovoltaic soldering strip include the geometric features of the soldering strip boundary space. The morphological features of the flux supply equipment include the sliding trajectory features of the supply equipment. By comparing the spatial positional deviations of the boundary geometric features and sliding trajectory features of the solder strip, a spatial alignment strategy for the photovoltaic solder strip and the flux supply equipment is determined based on the spatial positional deviations, thereby aligning the photovoltaic solder strip and the flux supply equipment.

[0028] The flux coating operation on the surface of photovoltaic solder ribbons utilizes a flux supply device to apply flux to the surface using ultrasonic atomization spraying, ensuring uniform and comprehensive flux coating. The flux supply device mainly includes a flux container, an ultrasonic atomizing sprayer, a guide rail, and a driver. The flux container is connected to the ultrasonic atomizing sprayer and is used to supply flux to it. The ultrasonic atomizing sprayer is used to ultrasonically atomize and spray the flux onto the photovoltaic solder ribbon surface. The driver drives the ultrasonic atomizing sprayer to slide along the guide rail, thereby aligning the sprayer with the photovoltaic solder ribbon surface. For precise alignment of the flux supply device with the photovoltaic solder ribbon surface, the flux supply device and the photovoltaic solder ribbon surface must be aligned. (See also...) Figure 2First and second images of the photovoltaic solder ribbon and flux supply equipment are acquired respectively, and the boundary spatial geometric features of the photovoltaic solder ribbon and the sliding trajectory features of the flux supply equipment are identified and extracted from them. The boundary spatial geometric features may be, but are not limited to, the geometric boundary trajectory shapes on both sides of the photovoltaic solder ribbon; the sliding trajectory features may be, but are not limited to, the sliding trajectory of the ultrasonic atomizing sprayer along the guide rail. The spatial positional deviations of the solder ribbon boundary spatial geometric features and the sliding trajectory features are then compared to determine the spatial alignment strategy between the photovoltaic solder ribbon and the flux supply equipment. This spatial alignment strategy may include, but is not limited to, the relative motion direction and displacement planning required for precise alignment of the photovoltaic solder ribbon and the flux supply equipment. According to the above spatial alignment strategy, aligning the photovoltaic solder ribbon and the flux supply equipment ensures that their spatial positions are pre-aligned before the flux spraying operation, avoiding spatial positional misalignment that could lead to incorrect flux spraying.

[0029] In another embodiment, adjusting the operating state of the output valve of the flux supply device according to the spatial alignment of the flux supply device includes: The execution progress of the spatial alignment strategy is obtained, and the trend of spatial position deviation between the photovoltaic welding strip and the flux supply equipment is determined based on the execution progress. Based on the trend of spatial position deviation, determine the time required for the photovoltaic welding strip and flux supply equipment to be aligned. Adjust the operating status of the output valve of the flux supply equipment according to the required time; wherein, adjusting the operating status of the output valve includes switching the output valve of the flux supply equipment from the closed state to the open state.

[0030] The aforementioned spatial alignment strategy includes planning the relative movement direction and displacement of the photovoltaic solder ribbon and flux supply equipment to ensure precise alignment. During the execution of this strategy, the flux supply equipment needs to be moved, and as it moves, the spatial deviation between the photovoltaic solder ribbon and the flux supply equipment gradually decreases. Based on the trend of this deviation, the time required for the photovoltaic solder ribbon and flux supply equipment to transition from a state of spatial deviation to an aligned state is determined. Then, based on this required time, the output valve of the flux supply equipment is switched from closed to open. That is, when the photovoltaic solder ribbon is aligned with the flux supply equipment, the output valve of the flux supply equipment (e.g., an ultrasonic atomizing sprayer) is switched to open to prevent premature flux application.

[0031] In another embodiment, dynamic identification of the photovoltaic ribbon is performed to obtain the transmission motion characteristics of the photovoltaic ribbon, including: The transmission dynamic image of the photovoltaic welding ribbon is acquired, and the transmission dynamic image is processed by frame segmentation and frame-by-frame spatial position change recognition to obtain the transmission speed of the photovoltaic welding ribbon along the corresponding direction.

[0032] In another embodiment, determining the flux coating characteristics of the photovoltaic ribbon based on the transmission motion characteristics includes: Based on the surface material properties of the photovoltaic solder ribbon and the flux composition formulation, the adhesion contact characteristics of the flux on the photovoltaic solder ribbon are determined; wherein, the adhesion contact characteristics include the adhesion contact angle of the flux on the surface of the photovoltaic solder ribbon; Based on the transmission speed and adhesion characteristics, the required flux coating flow rate corresponding to the preset flux distribution density on the photovoltaic ribbon surface is determined; wherein, the preset flux distribution density refers to the volume of flux adhering to a unit area on the photovoltaic ribbon surface; and the flux coating flow rate refers to the volume of flux coated onto the photovoltaic ribbon surface by the flux supply equipment per unit time.

[0033] During flux spraying, the photovoltaic solder ribbon moves at a constant speed along its length, ensuring that the flux supply equipment can evenly coat the entire surface of the photovoltaic solder ribbon with flux. The speed of the photovoltaic solder ribbon's movement directly affects the contact and adhesion of the flux droplets formed by ultrasonic atomization on the photovoltaic solder ribbon surface. When the photovoltaic solder ribbon moves at a high speed, the flux supply equipment has less time to align with each grid area on the photovoltaic solder ribbon surface. If the flux supply equipment sprays flux at a low flow rate during this time, it cannot guarantee a sufficiently uniform coating of flux on the photovoltaic solder ribbon surface. Conversely, when the photovoltaic solder ribbon moves at a low speed, the flux supply equipment has more time to align with each grid area on the photovoltaic solder ribbon surface. If the flux supply equipment sprays flux at a high flow rate during this time, it may result in a thicker flux coating on the photovoltaic solder ribbon surface. Therefore, it can be seen that the transmission speed of the photovoltaic ribbon directly affects the physical state of flux coating on the surface of the photovoltaic ribbon. To this end, we first acquire the transmission dynamic image of the photovoltaic ribbon, perform frame-by-frame processing and frame-by-frame spatial position change recognition on the transmission dynamic image to obtain the transmission speed of the photovoltaic ribbon along the corresponding direction, which provides a basis for subsequently determining the flux coating state on the surface of the photovoltaic ribbon.

[0034] Please see Figure 3 Based on the surface material properties of the photovoltaic solder ribbon (such as the surface energy of the surface material) and the flux composition formula (such as the weight and content ratio of the flux components), the adhesion contact angle of the flux on the surface of the photovoltaic solder ribbon is determined. Then, based on simulation analysis of the transmission speed and adhesion contact angle of the photovoltaic solder ribbon, the flux coating flow rate required to form a preset flux distribution density on the surface of the photovoltaic solder ribbon is determined. This accurately quantifies the volume of flux coated onto the surface of the photovoltaic solder ribbon by the flux supply equipment per unit time, providing a basis for forming a uniform flux on the surface of the photovoltaic solder ribbon.

[0035] In another embodiment, adjusting the ultrasonic atomization coating operation of the flux supply equipment on the photovoltaic ribbon according to the flux coating characteristics includes: Based on the flux coating characteristics, adjust the atomized flux droplet size and atomized flux droplet output flow rate corresponding to the ultrasonic atomization coating operation on the surface of the photovoltaic solder ribbon by adjusting the flux supply equipment.

[0036] In another embodiment, the operating parameters of the flux supply equipment are set according to the ultrasonic atomization coating operation, including: The ultrasonic oscillation power of the flux supply equipment is set according to the size of the atomized flux droplets; The valve opening of the flux supply device is set according to the output flow rate of the atomized flux droplets.

[0037] As discussed above, the flux coating characteristics of photovoltaic solder ribbons refer to the volume of flux applied to the surface of the photovoltaic solder ribbon by the flux supply equipment per unit time. To ensure uniform and tight flux coating on the photovoltaic solder ribbon surface, the size of the atomized flux droplets and the output flow rate of the atomized flux droplets during the ultrasonic atomization coating operation of the flux supply equipment on the photovoltaic solder ribbon surface are adjusted based on the aforementioned flux coating characteristics. Furthermore, the ultrasonic oscillation power of the flux supply equipment is set according to the flux droplet size, and the valve opening of the flux supply equipment is set according to the output flow rate of the atomized flux droplets to ensure uniform and tight flux coating on the photovoltaic solder ribbon surface.

[0038] In another embodiment, setting the ultrasonic oscillation power of the flux supply device according to the size of the atomized flux droplets includes: Real-time acquisition of the current spatial alignment deviation between the photovoltaic welding strip and the flux supply device; Real-time acquisition of the average surface roughness in the morphological characteristics of the current photovoltaic ribbon; The dynamic correction factor corresponding to the ultrasonic oscillation power setting is obtained using the current spatial alignment deviation and average surface roughness. The dynamic correction factor is obtained by the following formula: ; Where S represents the dynamic correction factor; e 01 and e 02 ΔL represents the preset weighting coefficient, with values ​​ranging from [0.2, 0.5] to [0.1, 0.3]; ΔL represents the current spatial alignment deviation between the photovoltaic solder ribbon and the flux supply device; L represents the maximum permissible alignment deviation; R represents the average surface roughness; λ represents the ultrasonic wavelength in the flux. The average diameter of the target droplet and the surface tension of the flux are retrieved from the atomized flux droplet size, and the average diameter of the target droplet and the surface tension of the flux are normalized to obtain the normalized average diameter of the target droplet and the surface tension of the flux. The real-time transmission speed and flux density in the transmission motion characteristics of the photovoltaic ribbon are retrieved, and the real-time transmission speed and flux density are normalized to obtain the normalized real-time transmission speed and flux density. The ultrasonic oscillation power of the flux supply device is set by combining the normalized average diameter of the target droplets, the surface tension of the flux, the normalized real-time transmission speed, and the flux density with a dynamic correction factor. The ultrasonic oscillation power of the flux supply device is obtained by the following formula: ; Wherein, P represents the ultrasonic oscillation power of the flux supply equipment; P0 represents the preset reference ultrasonic oscillation power; v represents the real-time transmission speed after normalization; ρ represents the density of the flux after normalization; D represents the average diameter of the target droplet; A represents the surface tension of the flux; α represents the fluid property coupling correction index, with a value range of 0.4-0.6; β represents the transmission speed correction index, with a value range of 0.2-0.4; and k represents the atomization difficulty coefficient, with a value range of 0.8-1.2.

[0039] The above technical solution, by introducing a dynamic correction factor, achieves real-time compensation for equipment alignment deviations and solder strip surface conditions. This solves the problems of poor atomization uniformity and uneven droplet size distribution caused by spatial offset and surface roughness fluctuations in traditional open-loop control, significantly improving flux atomization consistency under different operating conditions and providing a stable flux coating foundation for subsequent welding processes. Secondly, by coupling the flux's surface tension, density, and other fluid properties with the target droplet diameter and transmission velocity in a model, the synergistic effect of the property coupling term and the exponential decay term achieves a nonlinear match between ultrasonic power and atomization requirements. This avoids over-atomization or under-atomization under fixed power settings, effectively reducing the ineffective consumption of ultrasonic energy, improving flux atomization efficiency and material utilization, and reducing flux waste and pollution emissions during production. Meanwhile, this technical solution achieves adaptive control under multiple operating conditions. It can dynamically adjust the ultrasonic oscillation power based on real-time data collected from equipment alignment deviation, solder ribbon surface condition, transmission speed, and fluid properties. This significantly improves the system's adaptability and robustness to complex operating conditions, reduces manual intervention and parameter adjustment costs, and ensures the stability and consistency of flux coating quality during the production of photovoltaic solder ribbons of different batches and specifications. This provides crucial assurance for the welding reliability of photovoltaic modules and also offers a feasible technical path for the standardization and intelligent control of flux atomization processes. Finally, the above solution, through a variable exponent nested structure, adaptively adjusts the power sensitivity to droplet size with the solder ribbon speed, while the surface tension exponent dynamically changes with density, forming a nonlinear synergistic compensation. Within the solder ribbon speed range of 0.05–0.5 m / s, it effectively improves the uniformity of flux coating; even when the spatial alignment deviation reaches 0.3 mm, it can still effectively reduce the deviation of the target droplet size. Furthermore, it eliminates the need for recalibration for different flux formulations, significantly improving production line switching efficiency.

[0040] In another embodiment, obtaining coating characteristics on the surface of the photovoltaic solder ribbon to determine coating defects includes: Surface images of the photovoltaic solder ribbon during ultrasonic atomization flux coating are acquired, and flux coating status is identified from the surface images to determine the flux coating defect areas on the photovoltaic solder ribbon surface. The flux coating defect areas include areas on the photovoltaic solder ribbon surface that are not coated with flux and areas on the photovoltaic solder ribbon surface where the flux coating thickness does not meet the preset thickness conditions.

[0041] In another embodiment, adjusting the ultrasonic atomization coating operation based on coating defects includes: Adjust the coating direction of the ultrasonic atomization coating operation according to the distribution of the areas on the photovoltaic ribbon surface that are not coated with flux; Adjust the coating duration of the ultrasonic atomization coating operation based on the actual flux coating thickness in areas where the flux coating thickness on the photovoltaic ribbon surface does not meet the preset thickness conditions.

[0042] In another embodiment, adjusting the coating direction of the ultrasonic atomization coating operation based on the distribution of areas on the photovoltaic ribbon surface not coated with flux includes: Obtain the boundary position of the area on the photovoltaic ribbon surface that is not coated with flux, map the boundary position to the action space coordinate system of the ultrasonic atomization coating operation, and generate the coating operation constraint boundary; Adjust the coating action direction angle of the ultrasonic atomization coating operation according to the coating operation constraint boundary.

[0043] During the flux application process on photovoltaic solder ribbons, defects such as missed areas and uneven coating thickness are unavoidable. In such cases, adjustments to the flux application equipment's operation are necessary. Specifically, surface images of the photovoltaic solder ribbon during ultrasonic atomization flux application are acquired, and the flux coating status is identified to determine areas on the photovoltaic solder ribbon surface not coated with flux and areas where the flux coating thickness does not meet preset thickness requirements. Please refer to [link to relevant documentation]. Figure 4 Based on the distribution of areas on the photovoltaic solder ribbon surface not coated with flux, the coating direction of the ultrasonic atomization coating operation is adjusted. Based on the actual flux coating thickness in areas where the flux coating thickness on the photovoltaic solder ribbon surface does not meet the preset thickness condition, the coating duration of the ultrasonic atomization coating operation is adjusted, considering both the coating area and coating time. Furthermore, the boundary positions of the areas on the photovoltaic solder ribbon surface not coated with flux are obtained and mapped to the action space coordinate system of the ultrasonic atomization coating operation to generate coating operation constraint boundaries. These boundaries are then used to adjust the coating action direction angle of the ultrasonic atomization coating operation, ensuring that the flux supply equipment is aimed at the photovoltaic solder ribbon surface to apply flux, achieving comprehensive and uniform flux coating and improving the quality of the photovoltaic solder ribbon.

[0044] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. This disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims. Thus, if these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is also intended to include these modifications and variations.

Claims

1. An adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon, characterized in that, include: Visual recognition of photovoltaic solder ribbon and flux supply equipment to calibrate and align the spatial positions of the photovoltaic solder ribbon and flux supply equipment; Adjust the operating state of the output valve of the flux supply device according to the spatial alignment of the flux supply device; The photovoltaic solder ribbon is dynamically identified to obtain its transmission motion characteristics; based on the transmission motion characteristics, the flux coating characteristics of the photovoltaic solder ribbon are determined. Based on the flux coating characteristics, adjust the ultrasonic atomization coating operation of the flux supply equipment on the photovoltaic solder ribbon; based on the ultrasonic atomization coating operation, set the operating parameters of the flux supply equipment; The coating characteristics of the photovoltaic ribbon surface are obtained to determine coating defects; the ultrasonic atomization coating operation is adjusted according to the coating defects. Based on the flux coating characteristics, adjusting the ultrasonic atomization coating operation of the flux supply equipment on the photovoltaic ribbon includes: Based on the flux coating characteristics, adjust the atomized flux droplet size and atomized flux droplet output flow rate corresponding to the ultrasonic atomization coating operation of the flux supply device on the surface of the photovoltaic solder ribbon; Based on the ultrasonic atomization coating operation, the operating parameters of the flux supply equipment are set, including: The ultrasonic oscillation power of the flux supply device is set according to the size of the atomized flux droplets. The valve opening of the flux supply device is set according to the output flow rate of the atomized flux droplets; Based on the size of the atomized flux droplets, the ultrasonic oscillation power of the flux supply device is set, including: Real-time acquisition of the current spatial alignment deviation between the photovoltaic welding strip and the flux supply device; Real-time acquisition of the average surface roughness in the morphological characteristics of the current photovoltaic ribbon; The dynamic correction factor corresponding to the ultrasonic oscillation power setting is obtained using the current spatial alignment deviation and average surface roughness. The dynamic correction factor is obtained by the following formula: ； Where S represents the dynamic correction factor; e 01 and e 02 The preset weighting coefficients are defined, with values ​​ranging from [0.2, 0.5] to [0.1, 0.3]. ΔL represents the current spatial alignment deviation between the photovoltaic ribbon and the flux supply device. L represents the maximum permissible alignment deviation. R represents the average surface roughness. λ represents the ultrasonic wavelength in the flux. The average diameter of the target droplet and the surface tension of the flux are retrieved from the atomized flux droplet size, and the average diameter of the target droplet and the surface tension of the flux are normalized to obtain the normalized average diameter of the target droplet and the surface tension of the flux. The real-time transmission speed and flux density in the transmission motion characteristics of the photovoltaic ribbon are retrieved, and the real-time transmission speed and flux density are normalized to obtain the normalized real-time transmission speed and flux density. The ultrasonic oscillation power of the flux supply device is set by combining the normalized average diameter of the target droplets, the surface tension of the flux, the normalized real-time transmission speed, and the flux density with a dynamic correction factor. The ultrasonic oscillation power of the flux supply device is obtained by the following formula: ； Wherein, P represents the ultrasonic oscillation power of the flux supply equipment; P0 represents the preset reference ultrasonic oscillation power; v represents the real-time transmission speed after normalization; ρ represents the density of the flux after normalization; D represents the average diameter of the target droplet; A represents the surface tension of the flux; α represents the fluid property coupling correction index, with a value range of 0.4-0.6; β represents the transmission speed correction index, with a value range of 0.2-0.4; and k represents the atomization difficulty coefficient, with a value range of 0.8-1.

2.

2. The adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon as described in claim 1, characterized in that: Visual recognition of photovoltaic solder ribbon and flux supply equipment, calibrating and aligning the spatial positions of the photovoltaic solder ribbon and flux supply equipment, including: First and second images of the photovoltaic solder strip and the flux supply equipment are acquired respectively. The morphological features of the photovoltaic solder strip and the flux supply equipment are extracted from the first and second images respectively. The morphological features of the photovoltaic solder strip include the geometric features of the solder strip boundary space. The morphological features of the flux supply equipment include the sliding trajectory features of the supply equipment. By comparing the spatial position deviations between the geometric features of the solder strip boundary space and the sliding trajectory features, a spatial alignment strategy for the photovoltaic solder strip and the flux supply device is determined based on the spatial position deviations, thereby aligning the photovoltaic solder strip and the flux supply device.

3. The adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon as described in claim 2, characterized in that: Adjusting the operating state of the output valve of the flux supply device according to its spatial alignment includes: The execution progress of the spatial alignment strategy is obtained, and the trend of spatial position deviation between the photovoltaic ribbon and the flux supply device is determined based on the execution progress. Based on the trend of the spatial position deviation, determine the time required for the photovoltaic welding strip and the flux supply equipment to be aligned. According to the required time, adjust the operating state of the output valve of the flux supply equipment; wherein, adjusting the operating state of the output valve includes switching the output valve of the flux supply equipment from the closed state to the open state.

4. The adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon as described in claim 1, characterized in that: Dynamic identification of the photovoltaic ribbon yields its transmission motion characteristics, including: The transmission dynamic image of the photovoltaic ribbon is acquired, and the transmission dynamic image is processed by frame segmentation and frame-by-frame spatial position change recognition to obtain the transmission speed of the photovoltaic ribbon along the corresponding direction.

5. The adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon as described in claim 4, characterized in that: Based on the transmission motion characteristics, the flux coating characteristics of the photovoltaic ribbon are determined, including: Based on the surface material properties and flux composition formulation of the photovoltaic solder ribbon, the adhesion contact characteristics of the flux on the photovoltaic solder ribbon are determined; wherein, the adhesion contact characteristics include the adhesion contact angle of the flux on the surface of the photovoltaic solder ribbon; Based on the transmission speed and the adhesion contact characteristics, the flux coating flow rate required to form a preset flux distribution density on the photovoltaic solder ribbon surface is determined; wherein, the preset flux distribution density refers to the volume of flux adhering to a unit area on the photovoltaic solder ribbon surface; and the flux coating flow rate refers to the volume of flux coated onto the photovoltaic solder ribbon surface by the flux supply equipment per unit time.

6. The adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon as described in claim 1, characterized in that: Obtaining the coating characteristics of the photovoltaic ribbon surface to determine coating defects includes: Surface images of the photovoltaic solder ribbon during ultrasonic atomization flux coating are acquired, and flux coating status is identified on the surface images to determine flux coating defect areas on the photovoltaic solder ribbon surface; wherein, the flux coating defect areas include areas of the photovoltaic solder ribbon surface that are not coated with flux and areas of the photovoltaic solder ribbon surface where the flux coating thickness does not meet the preset thickness condition.

7. The adaptive flow control method for ultrasonic atomization flux coating of photovoltaic solder ribbon as described in claim 6, characterized in that: Adjusting the ultrasonic atomization coating operation according to the coating defects includes: The coating direction of the ultrasonic atomization coating operation is adjusted according to the distribution of the areas on the surface of the photovoltaic ribbon that are not coated with flux. The duration of the ultrasonic atomization coating operation is adjusted based on the actual flux coating thickness in areas where the flux coating thickness on the photovoltaic ribbon surface does not meet the preset thickness condition.

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