Chip motherboard system, electronic device, and manufacturing method

Abstract

The present disclosure relates to a chip motherboard system, an electronic device, and a method for manufacturing a chip motherboard system. The chip motherboard system includes a printed circuit board; a chip disposed on the printed circuit board; a power supply assembly at least partially disposed on or in the printed circuit board and electrically connected to the chip; a heat sink thermally coupled to the power supply assembly; and a power conversion assembly electrically connected to the power supply assembly, and at least a portion of the power conversion assembly is thermally coupled to the heat sink. In some embodiments, the power supply assembly can be disposed on a side of the printed circuit board distal from the chip or on the same side as the chip. Furthermore, the power supply assembly can also be disposed in a hollowed-out portion of the printed circuit board. In this way, by disposing the power supply assembly and the power conversion assembly to share the same heat sink, a heat sink dedicated to the power conversion assembly is eliminated, thereby reducing the thickness of the chip motherboard.

Description

Technical Field

[0001] This disclosure relates to the field of electronic technology. In particular, this disclosure relates to chip motherboard systems, electronic devices, and methods for manufacturing chip motherboard systems. Background Technology

[0002] With the rapid development of artificial intelligence (AI) technology, the power consumption of AI chips continues to rise, and their current density has now reached 2-3 A / mm². 2 The sheer scale of computing power presents new challenges to the load-bearing capacity of power supply systems. Simultaneously, the market's focus on computing density is driving AI hardware products towards higher integration levels. For example, a standard 1U height and 1-meter depth chassis often requires the integration of several to dozens of high-performance AI chips. This high-power, high-density hardware configuration places new demands on the adaptability of traditional power supply architectures in terms of current transmission, power distribution, and efficiency. Summary of the Invention

[0003] In a first aspect of this disclosure, a chip motherboard system is provided. The chip motherboard system includes a printed circuit board; a chip disposed on the printed circuit board; a power supply component at least partially disposed on or in the printed circuit board and electrically connected to the chip; a heat sink thermally coupled to the power supply component; and a power conversion component electrically connected to the power supply component, with at least a portion of the power conversion component thermally coupled to the heat sink. In some embodiments, the power supply component may be disposed on a side of the printed circuit board away from the chip or on the same side as the chip. Furthermore, the power supply component may also be disposed in a cutout portion of the printed circuit board.

[0004] According to embodiments of this disclosure, by setting the power supply component and the power conversion component to share the same heat sink, a dedicated heat sink for the power conversion component is eliminated, achieving vertical integration of the power supply system and the heat dissipation system, thereby reducing the thickness of the chip motherboard. This improves the power handling capacity and heat dissipation efficiency per unit area of ​​the motherboard, shortens the power supply path from the power source to the chip, and reduces transmission loss and thermal resistance, thus providing a feasible physical basis for integrating more high-performance chips within a limited space (such as a chassis).

[0005] In a second aspect of this disclosure, an electronic device is provided. This electronic device includes a chip motherboard system according to a first aspect of this disclosure. According to an embodiment of the second aspect of this disclosure, by setting the power supply component and the power conversion component to share the same heat sink, a dedicated heat sink for the power conversion component is eliminated, achieving vertical integration of the power supply system and the heat dissipation system, thereby reducing the thickness of the chip motherboard. This allows for the integration of more high-performance chips within the electronic device. The principles and effects of the various embodiments of the chip motherboard system according to the first aspect of this disclosure also apply to the various embodiments of the electronic device of the second aspect of this disclosure.

[0006] In a third aspect of this disclosure, a method for manufacturing a chip motherboard system is provided. The method includes: providing a printed circuit board; disposing a chip on the printed circuit board; configuring a power supply component at least partially opposite and electrically connected to the chip in the thickness direction of the printed circuit board; configuring a heat sink thermally coupled to the power supply component; and configuring a power conversion component such that the power conversion component is electrically connected to the power supply component, and at least a portion of the power conversion component is thermally coupled to the heat sink. According to embodiments of the third aspect of this disclosure, by integrating the power supply component, heat sink, and power conversion component, such that the power supply component and power conversion component share a heat sink, a process flow for manufacturing a high-density chip motherboard system is provided. Using this manufacturing method, motherboards with shorter power supply paths and more compact heat dissipation structures can be produced, which helps to improve the power density and heat dissipation efficiency of the product, and provides manufacturing feasibility for integrating high-performance chips in a limited space. The principles and effects of the various embodiments of the chip motherboard system according to the first aspect of this disclosure are also applicable to various embodiments of the electronic device according to the third aspect of this disclosure.

[0007] It should be understood that the description in the Summary of the Invention section is not intended to limit the key or essential features of the embodiments of this disclosure, nor is it intended to restrict the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0008] To better understand the above and other objects, features, advantages, and functions of this disclosure, reference can be made to the preferred embodiments shown in the accompanying drawings. Like reference numerals in the drawings refer to like parts. Those skilled in the art should understand that the drawings are intended to schematically illustrate preferred embodiments of this disclosure and are not intended to limit the scope of this disclosure; the parts in the drawings are not drawn to scale.

[0009] Figure 1 A schematic diagram of an example data center server according to some embodiments of the present disclosure is shown;

[0010] Figure 2A schematic diagram of an example chip motherboard system according to some embodiments of the present disclosure is shown;

[0011] Figures 3A to 3B A schematic diagram of an example chip motherboard system according to some embodiments of the present disclosure is shown;

[0012] Figures 4A to 4B A schematic diagram of an example chip motherboard system according to some embodiments of the present disclosure is shown;

[0013] Figure 5A A schematic cross-sectional view of an example chip motherboard system according to some embodiments of the present disclosure is shown;

[0014] Figure 5B It shows Figure 5A The example chip motherboard system shown is a schematic bottom view; and

[0015] Figure 6 A flowchart illustrating an example method for manufacturing a chip motherboard system according to an embodiment of this disclosure is shown. Detailed Implementation

[0016] Various embodiments will now be described with reference to the accompanying drawings, wherein similar reference numerals are used throughout to denote similar elements. In the following description, numerous specific details are set forth for purposes of explanation in order to facilitate a thorough understanding of one or more embodiments. However, it may be apparent in some or all cases that any of the embodiments described below can be practiced without employing the specific design details described below. In other instances, well-known structures and devices are illustrated in block diagram form to facilitate the description of one or more embodiments. A simplified overview of one or more embodiments is given below to provide a basic understanding of the embodiments. This overview is not an exhaustive summary of all contemplated embodiments, is not intended to identify key or essential elements of all embodiments, nor is it intended to define the scope of any or all embodiments.

[0017] References to “embodiment” or “one embodiment” within the framework of this description are intended to indicate that a particular configuration, structure, or feature described with respect to an embodiment is included in at least one embodiment. Therefore, phrases such as “in an embodiment” or “in one embodiment” that may appear at one or more points in this description do not necessarily refer to the same embodiment. Furthermore, in one or more embodiments, particular constructions, structures, or features may be combined in any suitable manner.

[0018] In the following disclosure, unless otherwise indicated, references to absolute positional modifiers (such as the terms “front,” “back,” “top,” “bottom,” “left,” “right,” etc.) or relative positional modifiers (such as the terms “above,” “below,” “higher,” “lower,” etc.), or references to orientational modifiers (such as “horizontal,” “vertical,” etc.), refer to the orientation shown in the figure.

[0019] Depending on the context, the word "if" as used herein can be interpreted as "when," "when," "in response to determination," or "in response to detection." Similarly, depending on the context, the phrases "if determination" or "if detection (of the stated condition or event)" can be interpreted as "when determination," "in response to determination," "when detection (of the stated condition or event)," or "in response to detection (of the stated condition or event)." In the description of this invention, it should be understood that the terms "comprising" and "including" indicate the described features, the whole, the part,

[0020] The presence of steps, operations, elements, and / or components does not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or collections thereof. It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0021] An integrated circuit (IC) is a miniature structure with a predetermined circuit function, formed by integrating transistors, resistors, capacitors, inductors, and other components and interconnections required for a circuit onto a semiconductor wafer or substrate using specific processes. The scope of integrated circuits is broad, encompassing various semiconductor devices such as processors, microprocessors, field-programmable gate arrays (FPGAs), and microcontrollers. In this disclosure, the packaged integrated circuit structure is collectively referred to as a chip.

[0022] The bottom of the chip has contacts that serve as circuit input / output terminals. These contacts are soldered to a printed circuit board, enabling the chip to make electrical connections with other devices and transmit signals. These contacts have different functions, mainly including signal contacts for transmitting signals and power supply contacts for transmitting electrical energy.

[0023] As the foundation for chips, printed circuit boards (PCBs) form a complete physical path for current to flow from the power supply to the chip and back. This network includes components such as voltage regulation modules, vias, traces, power layers, ground layers, and connectors. The voltage regulation module integrates transistors that act as switches and inductors that regulate voltage.

[0024] If the significant heat generated by high-power chips during operation is not dissipated effectively and promptly, it can affect system stability and reliability, and even lead to performance degradation or hardware damage. Therefore, achieving a synergistic design of efficient power supply and effective heat dissipation within a limited space has become a key focus in the development of high-power, high-density AI products. Currently, the industry has proposed several technological approaches to address these challenges. Within the limits of integrated circuit process technology, AI chips can be designed using more advanced semiconductor process nodes to reduce power consumption while maintaining computing power, thus providing some room for increasing product density. In terms of power supply, the application of high-density multiphase power modules (such as four-phase or, in the future, eight-phase modules) can improve power supply capacity per unit area to some extent. Regarding heat dissipation technology, optimization of heat dissipation materials, improved airflow design, or the introduction of liquid cooling can enhance heat dissipation efficiency. Furthermore, new power supply architectures, such as vertical power supply, are being gradually introduced. Their design aims to shorten power supply paths and reduce parasitic losses, thereby helping to improve chip-side voltage regulation and control overall thermal load.

[0025] However, these solutions still face certain limitations in practical applications. For example, upgrades in chip manufacturing processes are often affected by technology acquisition conditions and policy environment, making it difficult to achieve widespread improvements in the short term. Furthermore, performance improvements in power supply devices (such as power MOSFETs and inductors) typically rely on long R&D cycles, resulting in a relatively slow pace of power supply capacity enhancement. The development of heat dissipation technology is also constrained by physical limitations and cost factors.

[0026] Traditional solutions typically employ a planar discrete design, where power conversion components, power distribution networks, and heat dissipation components are spatially independent. This not only occupies a large amount of layout space and limits further increases in single-board chip density, but also leads to problems such as long power supply paths, high losses, and concentrated local hot spots.

[0027] In view of this, the present disclosure proposes an architecture scheme in which a power supply component and a power conversion component share a heat dissipation device. In this scheme, the chip motherboard system includes a chip disposed on a printed circuit board and a power supply component disposed on or within the printed circuit board. The chip motherboard system includes a heat sink, which is thermally coupled to both the power supply component and the power conversion component to dissipate heat from them.

[0028] According to embodiments of this disclosure, by setting the power supply component and the power conversion component to share the same heat sink, a dedicated heat sink for the power conversion component is eliminated, achieving vertical integration of the power supply system and the heat dissipation system, thereby reducing the thickness of the chip motherboard. This improves the power handling capacity and heat dissipation efficiency per unit area of ​​the motherboard, shortens the power supply path from the power source to the chip, and reduces transmission loss and thermal resistance, thus providing a feasible physical basis for integrating more high-performance chips within a limited space (such as a chassis).

[0029] The following will combine Figures 1 to 6 This describes a chip motherboard architecture in which the power supply components and power conversion components share a heat dissipation device according to embodiments of the present disclosure. Figure 1 A schematic diagram of an example data center server 10 according to some embodiments of the present disclosure is shown. The data center server 10 is used to house a large number of computer servers, network devices, storage systems, and related auxiliary infrastructure, with the core purpose of centrally processing, storing, and distributing massive amounts of data. The data center server 10 may, for example, include a processor for performing server operations supporting the parallel processing of a large number of tasks. The data center server 10 may also include storage devices for storing data. The data center server 10 may also include a motherboard for connecting all hardware components. The motherboard may, for example, provide interfaces such as PCIe expansion slots, memory slots, etc. Furthermore, the data center server 10 may also include power and cooling, and input / output (I / O) interfaces.

[0030] like Figure 1 As shown, the data center server 10 includes a chip motherboard system 100. According to embodiments of this disclosure, the chip motherboard system 100 may include, for example, a printed circuit board and chips and power supply components disposed on the printed circuit board. For example, a cutout may be formed on the second side of the printed circuit board, the power contacts of the chip are disposed in an area aligned with the cutout, and the power supply component is embedded in the cutout so that its power contacts can be electrically connected to the chip power contacts. By arranging the chip's power contacts in a predetermined area and creating a slot in the area projected onto the chip on the other side of the circuit board, the power supply component can be connected to the chip through a circuit board with reduced thickness, thereby constructing a shortened vertical power supply path. By reducing the vertical power supply path, the length of the conductor used to connect the chip and the power supply component is shortened, thereby reducing power loss and improving overall power supply efficiency. Reference will be made below. Figures 2 to 5B This describes the structure and operating principle of the chip motherboard system 100.

[0031] Figure 2 A schematic diagram of an example chip motherboard system 100 according to some embodiments of the present disclosure is shown. Figure 2As shown, the chip motherboard system 100 includes a printed circuit board 110 that provides support for other devices. The printed circuit board 110 includes a first surface 111 for mounting a chip 120, and a second surface 112 opposite to the first surface 111 in the thickness direction of the printed circuit board 110. The chip motherboard system 100 also includes a chip 120 electrically connected to the first surface 111 of the printed circuit board 110. In some embodiments, the chip may be, for example, any one of a computing processing unit (CPU), a graphics processing unit (GPU), a tensor processing unit (TPU), or a neural network processing unit (NPU).

[0032] The chip motherboard system 100 also includes a power supply component 130 for supplying power to the chip 120. The power supply component 130 includes, for example, a voltage regulator module (VRM) that can further step down an intermediate voltage to a lower voltage required by components such as the chip 120, thereby completing the power supply link. The power supply component 130 is aligned with the chip 120 in the thickness direction of the printed circuit board 110. The power supply component 130 can be electrically connected to the power contacts of the chip 120, for example, through vias. The chip motherboard system 100 also includes a heat sink 140 for dissipating heat from the power supply component 130. In some embodiments, the heat sink 140 may be a cooling plate, or also referred to as a cold plate. The heat sink 140 includes a third side away from the chip 120 and a fourth side facing the chip 120. The fourth side of the heat sink 140 is thermally coupled to the side of the power supply component 130 away from the chip 120. Furthermore, a power conversion component 150 is disposed on the third side of the heat sink 140. Power conversion component 150 may be, for example, an intermediate bus converter (IBC). An intermediate bus converter is a DC / DC converter used to convert electrical energy to be transmitted to power supply component 130. Power conversion component 150 may, for example, step down the high voltage of the system central power supply (such as 48V or 400V commonly used in data centers) to an intermediate voltage such as 12V, 8V, or 5V. A second printed circuit board 160 is also provided on the side of power conversion component 150 away from chip 120. The second printed circuit board 160 is electrically connected to power conversion component 150. The second printed circuit board 160 may, for example, be used for bus power output.

[0033] Conventionally, a printed circuit board 40 extends beyond the printed circuit board 110 to support the power conversion component 20. Furthermore, a dedicated heatsink 30 is provided on the side of the power conversion component 20 away from the printed circuit board 40. According to an embodiment of this disclosure, the power conversion component 150 and the second printed circuit board 160 are disposed at the heatsink 140 for the power supply component 130, replacing the power conversion component 20 and the printed circuit board. This allows the power conversion component 150 to share a heatsink 140 with the power supply component 130, thus eliminating the need for a dedicated heatsink 30 for the power conversion component. Since the heatsink 30 is larger than other components, the chip motherboard system 100 according to an embodiment of this disclosure has a reduced thickness. This improves the power handling capacity and heat dissipation efficiency per unit area of ​​the motherboard, shortens the power supply path from the power source to the chip, and reduces transmission loss and thermal resistance, thereby providing a feasible physical basis for integrating more high-performance chips within a limited space (such as a chassis).

[0034] Figure 3A A schematic diagram of an example chip motherboard system 100 according to some embodiments of the present disclosure is shown. Figure 3A As shown, a cooling groove is formed on the third side of the heat sink 140 away from the chip. The power conversion component 150 is at least partially embedded in the cooling groove. The size of the cooling groove corresponds to the power conversion component 150, that is, the cross-section of the power conversion component 150 in the thickness direction corresponds to the opening of the cooling groove. Thus, after the power conversion component 150 is embedded in the cooling groove, the top of the power conversion component 150 contacts the bottom of the cooling groove, and the sidewall of the power conversion component 150 contacts the sidewall of the cooling groove. In this embodiment, the embedded physical structure increases the contact area between the power conversion component 150 and the heat sink 140, improving its heat dissipation conditions and contributing to the stable operation of the power conversion component. At the same time, this structure further reduces the overall thickness.

[0035] Figure 3B A schematic diagram of an example chip motherboard system 100 according to some embodiments of the present disclosure is shown. Figure 3BAs shown, in addition to the power conversion component 150, the chip motherboard system 100 also includes a second power conversion component 310 disposed on the third surface of the heat sink 140 away from the chip 120. Correspondingly, the heat sink 140 also includes a second cooling recess. The second power conversion component 310 is at least partially embedded in the second cooling recess. The size of the second cooling recess corresponds to the second power conversion component 310, that is, the cross-section of the second power conversion component 310 in the thickness direction corresponds to the opening of the second cooling recess. Thus, after the second power conversion component 310 is embedded in the second cooling recess, the top of the second power conversion component 310 contacts the bottom of the second cooling recess, and the sidewall of the second power conversion component 310 contacts the sidewall of the second cooling recess. In this embodiment, by integrating multiple cooling recesses on the same heat sink to accommodate multiple power conversion components, the sharing of heat dissipation resources and the expansion of power supply capacity are achieved. This supports flexible power supply configuration according to power consumption requirements, improves the scalability of the power supply system, and helps manage the heat dissipation requirements arising from the addition of power supply units. It should be understood that... Figure 3B The chip motherboard system shown in the embodiment includes two power conversion components and is merely exemplary. The chip motherboard system may also include other numbers of power conversion components. This disclosure is not intended to be limiting.

[0036] Figure 3A and Figure 3B The illustrated embodiment describes a scheme to further reduce the overall thickness by at least partially embedding the power conversion components into the cooling recess. Furthermore, the overall thickness can be further reduced by reducing the thickness of the printed circuit board. This scheme will be discussed below. Figure 4A and Figure 4B To describe.

[0037] Figure 4A A schematic diagram of an example chip motherboard system 100 according to some embodiments of the present disclosure is shown. Figure 4AAs shown, the printed circuit board 110 includes a first surface 111 for mounting the chip 120, and a second surface 112 opposite to the first surface 111 in the thickness direction of the printed circuit board 110. Furthermore, the printed circuit board 110 includes a cutout 410 formed in the second surface 112. The projection of the cutout 410 in a plane parallel to the first surface can be rectangular, and the size of this rectangle is related to the operating current of the chip 120. The cutout 410 extends from the second surface 112 toward the first surface 111 and does not penetrate the printed circuit board 110. Corresponding vias are provided in the circuit board portion between the cutout 410 and the chip 120. The power supply contacts of the power supply assembly 130 can be connected to these vias in the cutout 410, for example, via solder balls. At the first surface 111, the power contacts of the chip 120 can be connected to the vias in the circuit board portion, for example, via solder balls, thereby achieving electrical connection with the power supply contacts of the power supply assembly 130. In this embodiment, a vertical power supply implementation is achieved by providing a cutout 410 in the printed circuit board 110 to accommodate part of the power supply component 130. This shortens the interconnection distance between the power supply component 130 and the chip 120, helping to reduce the impedance and losses caused by traditional long-distance traces.

[0038] The fourth side of the heat sink 140 facing the chip 120 is thermally coupled to the side of the power supply assembly 130 away from the chip 120. Furthermore, a cooling recess is formed on the third side of the heat sink 140 away from the chip. The power conversion assembly 150 is at least partially embedded in the cooling recess. The size of the cooling recess corresponds to the power conversion assembly 150, that is, the cross-section of the power conversion assembly 150 in the thickness direction corresponds to the opening of the cooling recess. Thus, after the power conversion assembly 150 is embedded in the cooling recess, the top of the power conversion assembly 150 contacts the bottom of the cooling recess, and the sidewall of the power conversion assembly 150 contacts the sidewall of the cooling recess. A second printed circuit board 160 is also provided on the side of the power conversion assembly 150 away from the chip 120. The second printed circuit board 160 is electrically connected to the power conversion assembly 150. The second printed circuit board 160 can be used, for example, for bus power output.

[0039] Figure 4B A schematic diagram of an example printed circuit board 110 according to some embodiments of the present disclosure is shown. Figure 4BAs shown, the printed circuit board 110 includes a cutout 410 formed on a second surface 112. The cutout 410 extends from the second surface 112 toward the first surface 111 and penetrates the printed circuit board 110. The fourth surface of the heat sink 140 facing the chip 120 is thermally coupled to the side of the power supply assembly 130 away from the chip 120. Furthermore, a cooling recess is formed on the third surface of the heat sink 140 away from the chip. The power conversion assembly 150 is at least partially embedded in the cooling recess. A second printed circuit board 160 is also provided on the side of the power conversion assembly 150 away from the chip 120. The second printed circuit board 160 is electrically connected to the power conversion assembly 150. The second printed circuit board 160 can be used, for example, for bus power output.

[0040] The projection of the cutout 410 onto a plane parallel to the first surface can be rectangular. Since there is no circuit board between the cutout 410 and the chip 120, the power supply component 130 is directly electrically connected to the chip 120. For example, the power supply contacts of the power supply component 130 can be directly electrically connected to the power supply contacts of the chip 120 via solder balls. In this embodiment, defining the cutout as a through-hole structure allows the power supply component to form a more direct electrical connection with the chip. This further shortens the interconnect path and helps reduce the impedance of the power supply network.

[0041] It should be understood that, although in Figure 4A and Figure 4B In the illustrated embodiment, the following methods are utilized simultaneously: Figure 3A and Figure 3B The heat sink embedding structure and the printed circuit board cutout structure are shown, but the printed circuit board cutout structure can also be used alone without using the heat sink embedding structure.

[0042] Figure 5A A schematic cross-sectional view of an example chip motherboard system 100 according to some embodiments of the present disclosure is shown. Figure 5A As shown, the chip motherboard system 100 includes a printed circuit board 110. The printed circuit board 110 includes a first surface 111 for mounting the chip 120, and a second surface 112 opposite to the first surface 111 in the thickness direction of the printed circuit board 110. Furthermore, the printed circuit board 110 includes a cutout 410 formed in the second surface 112. The cutout 410 extends from the second surface 112 toward the first surface 111 and penetrates the printed circuit board 110. Since there is no circuit board between the cutout 410 and the chip 120, the power supply assembly 130 is directly electrically connected to the chip 120.

[0043] like Figure 5AAs shown, the power supply assembly 130 includes a power module 531 and an intermediate adapter board 532. The side of the intermediate adapter board 532 facing the chip 120 is electrically connected to the chip 120, and the power module 531 is disposed on the other side away from the chip 120. The power module 531 may be, for example, a voltage regulation module for voltage conversion and power supply stabilization, such as converting the medium voltage (e.g., 12V, 5V) input from the printed circuit board 110 into the low voltage (typically 0.8V-1.8V) required by the chip.

[0044] A cooling recess is formed on the third side of the heat sink 140 away from the chip. A power conversion assembly 150 is at least partially embedded in the cooling recess. After the power conversion assembly 150 is embedded in the cooling recess, the top of the power conversion assembly 150 contacts the bottom of the cooling recess, and the sidewall of the power conversion assembly 150 contacts the sidewall of the cooling recess. Furthermore, the chip motherboard system 100 also includes a second power conversion assembly 310 disposed on the third side of the heat sink 140 away from the chip 120. Correspondingly, the heat sink 140 also includes a second cooling recess. The second power conversion assembly 310 is at least partially embedded in the second cooling recess. After the second power conversion assembly 310 is embedded in the second cooling recess, the top of the second power conversion assembly 310 contacts the bottom of the second cooling recess, and the sidewall of the second power conversion assembly 310 contacts the sidewall of the second cooling recess.

[0045] A second printed circuit board 160 is also provided on the side of the power conversion assembly 150 away from the chip 120. The second printed circuit board 160 is electrically connected to the power conversion assembly 150. Furthermore, the second printed circuit board 160 is also electrically connected to an intermediate adapter board 532 via electrical connectors 510-1 and 510-2, thereby electrically connecting the intermediate adapter board 532 (i.e., the power supply assembly 130) to the power conversion assembly 150. Figure 5A As shown, electrical connectors 510-1 and 510-2 originate from the intermediate adapter plate 532, extend beyond the sidewall of the power module 531, and continue extending through the heat sink 140, ultimately reaching and electrically connecting to the second printed circuit board 160. In this embodiment, the use of connectors that penetrate the heat sink ensures a shorter connector length, which is beneficial for reducing energy consumption. Electrical connectors 510-1 and 510-2 can be, for example, pogo pins.

[0046] Figure 5B It shows Figure 5A The example chip motherboard system shown is a schematic bottom view. Figure 5BAs shown, the heat sink 140, power conversion assembly 150, and second printed circuit board 160 are transparent, and the printed circuit board 110 includes a cutout 410 in the middle. The cutout 410 has a rectangular shape. A power supply assembly 130 is disposed in the cutout 410. A power module 531 is disposed on the side of the intermediate adapter plate 532 in the power supply assembly 130 away from the chip 120. The area of ​​the intermediate adapter plate 532 is larger than the area of ​​the power module 531, such that the intermediate adapter plate 532 includes an area for disposing of electrical connectors in addition to the area where the power module 531 is disposed. In this area, electrical connectors 510-1 and 510-2 are respectively disposed on both sides of the power module 531. Electrical connector 510-1 includes a plurality of spring pins, and electrical connector 510-2 includes a corresponding number of spring pins.

[0047] according to Figure 5A and Figure 5B The illustrated embodiment integrates the power conversion components directly into the integrated cold plate for cooling the main chip via vertical integration, and utilizes vertical interconnect technology through cutouts in the printed circuit board to achieve an ultra-short path connection between the chip and the power supply system. This deeply coupled design achieves efficient reuse and superposition of the power supply and cooling systems in physical space, thereby providing higher power output and stronger heat dissipation capabilities per unit area. Compared to traditional planar discrete architectures, this solution significantly improves the product's space utilization efficiency and thermal management performance. Actual measurements and applications show that the hardware integration of the chip motherboard system according to the embodiments of this disclosure can be increased by approximately 20%, the thermal design difficulty of the system power supply section can be reduced by approximately 10%, and the overall energy efficiency can be improved by approximately 10%, providing a practical solution for the development of next-generation high-power-density AI computing products.

[0048] Figure 6 A flowchart illustrating an example method for manufacturing a chip motherboard system according to an embodiment of this disclosure is shown. Figure 6 As shown, a printed circuit board is provided at 602. At 602, a chip is disposed on the printed circuit board. For example, the printed circuit board may include a first surface and a second surface in the thickness direction. In such an embodiment, the chip can be disposed on the first surface by soldering. At 602, a power supply component is at least partially disposed on or in the printed circuit board and electrically connected to the chip. In some embodiments, the power supply component may be disposed on the second surface of the printed circuit board opposite to the chip, realizing a vertical power supply structure. In some alternative embodiments, a cutout may be formed in the printed circuit board extending from the second surface toward the first surface, and the power supply component may be at least partially disposed in the cutout.

[0049] At 604, a heat sink is provided and thermally coupled to the power supply component. In some embodiments, the heat sink can be adhered to the side of the power supply component away from the chip using thermal gel. At 606, a power conversion component is provided such that the power conversion component is electrically connected to the power supply component, and at least a portion of the power conversion component is thermally coupled to the heat sink. In some embodiments, a cooling recess can be formed on a third side of the heat sink away from the chip, and the power conversion component can be embedded in the cooling recess.

[0050] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical applications, or improvements to the technology in the market, or to enable others skilled in the art to understand the various implementations disclosed herein.

Claims

1. A chip motherboard system (100), comprising: Printed circuit board (110); A chip (120) is disposed on the printed circuit board (110); A power supply component (130) is at least partially disposed on or in the printed circuit board (110) and electrically connected to the chip (120); The heat sink (140) is thermally coupled to the power supply component (130); as well as A power conversion assembly (150) is electrically connected to the power supply assembly (130), and at least a portion of the power conversion assembly (150) is thermally coupled to the heat sink (140).

2. The chip motherboard system (100) according to claim 1, wherein the printed circuit board (110) includes a first surface (111) and a second surface (112) opposite each other in the thickness direction and a cutout (410) formed in the second surface (112), wherein the power supply component (130) is at least partially housed in the cutout (410) and electrically connected to the chip (120) via the cutout (410).

3. The chip motherboard system (100) according to claim 2, wherein the cutout (410) is configured to extend from the first surface (111) through the printed circuit board (110) to the second surface (112), such that the power supply component (130) is directly electrically connected to the chip (120).

4. The chip motherboard system (100) according to claim 1, wherein the heat sink (140) is disposed on the side of the power supply component (130) away from the chip (120), and a cooling groove is formed on the third side of the heat sink (140) away from the power supply component (130), and the power conversion component (150) is at least partially embedded in the cooling groove.

5. The chip motherboard system (100) according to claim 4 further includes a second power conversion component (310) disposed on the third surface, and the heat sink (140) further includes a second cooling recess, wherein the second power conversion component (310) is at least partially embedded in the second cooling recess.

6. The chip motherboard system (100) according to claim 1, wherein the power supply component (130) comprises: The intermediate adapter board (532) is electrically connected to the chip (120); as well as The power module (531) is disposed on the side of the intermediate adapter plate (532) away from the chip (120) and is thermally coupled to the heat sink (140).

7. The chip motherboard system (100) according to claim 6 further includes: The second printed circuit board (160) is disposed on the side of the power conversion assembly (150) away from the chip (120) and is electrically connected to the power conversion assembly (150). as well as An electrical connector (510) extends from the intermediate adapter plate (532), passes through the heat sink (140), and is electrically connected to the second printed circuit board (160).

8. The chip motherboard system (100) according to claim 7, wherein the electrical connector (510) comprises a plurality of spring pins.

9. The chip motherboard system (100) according to claim 1, wherein the heat sink (140) includes a cooling plate.

10. An electronic device comprising a chip motherboard system (100) according to any one of claims 1 to 9.

11. The electronic device according to claim 10, wherein the electronic device comprises a server (10).

12. A method for manufacturing a chip motherboard system, comprising: Provide printed circuit boards (110); The chip (120) is disposed on the printed circuit board; The power supply component (130) is at least partially disposed on or in the printed circuit board (110) and electrically connected to the chip (120); A heat sink (140) is provided, thermally coupled to the power supply assembly (130); and A power conversion component (150) is provided such that the power conversion component (150) is electrically connected to the power supply component (130), and at least a portion of the power conversion component (150) is thermally coupled to the heat sink (140).

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