Automatic material replacement system and method based on multi-dimensional parameter matching

Abstract

The application discloses an automatic material replacement system and method based on multi-dimension parameter matching, and realizes high-precision automatic replacement of electronic components through encapsulation standardization, intelligent parameter matching and similarity calculation.

Description

Technical Field

[0001] This invention relates to the field of electronic component matching and replacement technology, specifically to an automated material replacement system and method based on multi-dimensional parameter matching. Background Technology

[0002] In the processes of electronic manufacturing, procurement, supply chain management, and hardware design, it is often necessary to find compatible and alternative materials for selected electronic components to cope with scenarios such as supply shortages, cost control, manufacturer shutdowns, or model updates. Traditional material replacement relies on manual experience to verify key parameters, which is inefficient, error-prone, and prone to errors. Furthermore, different manufacturers have different packaging naming and parameter labeling methods, which can easily lead to replacement mistakes, affecting product reliability and production schedules.

[0003] While some material lookup systems exist in the existing technology, most only support simple model searches and lack dedicated matching logic for different component types (such as MOSFET, BJT, TVS / ESD, SSD, PRD, etc.). They also fail to standardize package names and automatically calculate and sort multi-dimensional parameters, making it difficult to meet the industrial-grade requirements for high-precision and high-consistency replacement.

[0004] Therefore, there is an urgent need for an automated, standardized, and parameterized material replacement and matching scheme that can execute dedicated matching rules according to different component types, automatically complete package normalization, parameter tolerance judgment, multi-dimensional similarity calculation, and output the optimal replacement scheme to improve the efficiency and reliability of material replacement. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide an automated material replacement system and method based on multi-dimensional parameter matching, which realizes automated judgment, standardized packaging, special parameter matching and multi-dimensional similarity ranking of electronic component replacement, thereby improving replacement accuracy, reducing manual dependence and improving supply chain efficiency.

[0006] To achieve the above objectives, the present invention adopts the following technical solution.

[0007] An automated material replacement method includes the following steps: Data loading steps: Load electronic component data from at least one data source, including competitor component data and replacement component data, and the data includes model, manufacturer, package information and multiple electrical parameters; Packaging standardization steps: Based on a predefined packaging mapping rule library, convert the non-standard packaging names of competing components and replacement components into standard packaging names; Parameter matching step: Based on at least one matching parameter selected by the user, candidate replacement parts are selected from the replacement part component data; Output steps: Output the information of successfully matched candidate replacement materials to the user.

[0008] The parameter matching step further includes a basic condition filtering mechanism: Perform a package consistency screening, selecting only replacement parts whose standard package names are consistent with those of competing components; Perform AEC-Q qualification consistency screening, and select replacement parts with the same AEC-Q qualification based on the AEC-Q status of competing components.

[0009] In one implementation, the parameter matching step further includes a dedicated matching mechanism based on material type: When the competing component is a MOSFET, the following procedure is executed: a. Type Consistency Screening: Screen for replacement materials with the same channel type as competitors; b. VDS voltage priority matching: First, screen for replacement materials with VDS voltage exactly equal to that of the competitor; if no equal materials are found, select the replacement material with VDS voltage greater than and closest to that of the competitor. c. ID Current Tolerance Screening: Screen replacement materials whose ID_MAX current is in the range of 70% to 130% of the competitor's ID_MAX.

[0010] When the competing components are SSDs or TVS & ESDs, execute the following procedure: a. Forced matching of key voltage parameters: The difference between the VZ_IZT_NOM or VWM voltage of the selected replacement material and the corresponding value of the competitor is within a predetermined tolerance range; b. Family consistency screening: If a competitor's product contains "Schottky", then only the replacement material that also contains "Schottky" will be screened.

[0011] When the competitor's component is a BJT, execute the following procedure: a. Polarity consistency screening: Screening for replacement materials with the same polarity as competing products; b. Precise VCEO voltage matching: Select replacement materials whose VCEO voltage differs from that of competitors by less than 5%.

[0012] In one implementation, the parameter matching step further includes a multi-dimensional similarity calculation and ranking mechanism: For multiple candidate replacement materials that have passed the screening, calculate their comprehensive similarity score with competing products in multiple electrical parameters; The similarity contribution of numerical parameters is 1 / (1 + relative difference); if character parameters are completely identical, the contribution is 1, otherwise it is 0. Sort the candidates by comprehensive similarity score in descending order, and output the candidate replacement material with the highest score as the final result.

[0013] In one implementation, the packaging standardization step uses regular expression pattern matching to identify and convert non-standard packaging names.

[0014] In one implementation, the dedicated matching mechanism further includes a matching process for PRD materials: screening replacement materials whose VRRM voltage is in the range of 100% to 125% of the competitor's VRRM voltage.

[0015] In one implementation, the method further includes a batch matching step: Receive a list containing multiple competitor component models; For each model in the list, automatically perform data loading, encapsulation standardization, and parameter matching; Summarize all results and output them to a structured file.

[0016] The present invention also provides an automated material replacement system, comprising: The data loading module is used to load electronic component data from at least one data source; Encapsulate standardized modules to convert non-standard package names into standard package names; The parameter matching engine is used to perform basic condition filtering, dedicated matching logic, and multi-dimensional similarity calculation and sorting. The graphical user interface module is used to receive user input and display the matching process and results; The batch processing module is used to handle batch matching tasks for multiple models.

[0017] In one implementation, the parameter matching engine further includes a configuration saving and loading module, which saves commonly used parameter combinations and loads them with one click in subsequent matching.

[0018] The present invention also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps of the above-described automated material replacement method. Attached Figure Description

[0019] Figure 1 is an architecture block diagram of the automated material replacement system provided in an embodiment of the present invention; Figure 2 is a general flowchart of the automated material replacement method provided in an embodiment of the present invention; Figure 3 is a detailed flowchart of the parameter matching steps in an embodiment of the present invention; Figure 4 is a schematic diagram of the graphical user interface in an embodiment of the present invention. Detailed Implementation

[0020] The present invention will be further described in detail below with reference to the accompanying drawings. Example

[0021] Referring to Figure 1, this embodiment provides an automated material replacement system based on multi-dimensional parameter matching, including: The module includes a data loading module, a standardization module, a parameter matching engine, a graphical user interface module, and a batch processing module.

[0022] The data loading module is used to read external data sources and load information such as the model, package, manufacturer, and electrical parameters of competing and replacement materials.

[0023] The standardized packaging module converts non-standard package names from different manufacturers into standard names, avoiding matching failures due to inconsistent package descriptions.

[0024] The parameter matching engine includes a basic condition filter, a dedicated matching logic unit, and a multi-dimensional similarity calculator and sorter, which can execute corresponding matching rules according to different component types.

[0025] The graphical user interface module is used to receive user input, display the matching process, and the final result.

[0026] The batch processing module supports importing batch part number lists, enabling automated matching of multiple models and report export. Example

[0027] Referring to Figure 2, this embodiment provides an automated material replacement method, the process of which is as follows: S201: System initialization, loading all data sources; S202: Receive user input, including material type, manufacturer, and matching parameter selection; S203: Users can choose single query or batch processing mode, enter competitor product models or upload a batch part number table; S204: Execution parameter matching, including encapsulation filtering, AEC-Q filtering, type-specific matching, and similarity calculation; S205: Output matching results, show the optimal replacement material and support report export. Example

[0028] Referring to Figure 3, the detailed process of parameter matching is as follows: Begin parameter matching; Perform basic condition screening: determine whether the packaging is consistent and whether the AEC-Q is consistent; Those that do not meet the criteria are excluded from the candidate set; Determine the material type: MOSFET, BJT, TVS & ESD, SSD / ZENER, or others; Enter the corresponding dedicated matching logic according to the type; After completing the dedicated matching, the process proceeds to multi-dimensional similarity calculation and ranking; Return the Top N best matching results. Example

[0029] Referring to Figure 4, this embodiment provides a graphical user interface layout, including a model input area, a parameter selection area, a matching result display area, a batch import area, and an export button, which supports users to perform visual operations, view the matching process in real time, and export structured reports.

[0030] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An automated material replacement method, characterized in that, Includes the following steps: Data loading steps: Load electronic component data from at least one data source, the electronic component data including competitor component data and replacement component data, the data including model, manufacturer, package information and multiple electrical parameters; Packaging standardization steps: Based on a predefined packaging mapping rule library, convert the non-standard packaging names of the competing components and the replacement components into standard packaging names; Parameter matching step: Based on at least one matching parameter selected by the user, candidate replacement parts are selected from the replacement part component data; Result output steps: Output the information of successfully matched candidate replacement materials to the user; The parameter matching step further includes a basic condition filtering mechanism: Perform a packaging consistency screening, selecting only replacement parts whose standard packaging name matches the standard packaging name of the competing component; Perform AEC-Q qualification consistency screening, and select replacement parts with the same AEC-Q qualification based on the AEC-Q status of the competing components.

2. The method according to claim 1, characterized in that, The parameter matching step also includes a dedicated matching mechanism based on material type: When the competing component is a MOSFET, the following process is executed: a. Type consistency screening: Screen for replacement parts with the same channel type as the competing components; b. VDS voltage priority matching: First, screen for replacement materials whose VDS voltage values ​​are exactly the same as those of competitors; if no equal values ​​are found, screen for replacement materials whose VDS voltage values ​​are greater than and closest to those of competitors. c. ID Current Tolerance Screening: Screen replacement materials whose ID_MAX current value is within 70% to 130% of the competitor's ID_MAX.

3. The method according to claim 2, characterized in that, When the competing component is an SSD or TVS & ESD, the following process is executed: a. Forced matching of key voltage parameters: Select replacement materials whose relative differences between the VZ_IZT_NOM or VWM voltage values ​​and the corresponding values ​​of competing products are within a predetermined tolerance range; b. Family Consistency Screening: When a competitor's family contains "Schottky", only substitute materials that also contain "Schottky" will be screened.

4. The method according to claim 2, characterized in that, When the competing component is a BJT, the following process is executed: a. Polarity consistency screening: Screening for replacement materials with the same polarity type as competing products; b. Precise VCEO voltage matching: Select replacement materials whose VCEO voltage value differs from that of competitors by less than 5%.

5. The method according to claim 1, characterized in that, The parameter matching step also includes a multi-dimensional similarity calculation and ranking mechanism: For multiple candidate replacement materials that have passed the screening, calculate the comprehensive similarity score between each replacement material and the competing product on multiple electrical parameters; The similarity contribution of numerical parameters is 1 / (1+relative difference); If the character parameters are exactly the same, contribute 1; otherwise, contribute 0. Sort the candidates in descending order of their overall similarity scores, and output the best candidate replacement material as the final result.

6. The method according to claim 1, characterized in that, The standardization process for packaging uses regular expression pattern matching to identify and convert non-standard packaging names.

7. The method according to claim 2, characterized in that, The dedicated matching mechanism also includes a matching process for PRD materials: The replacement materials are selected based on their VRRM voltage values, which are within 100% to 125% of the VRRM voltage values ​​of the competing products.

8. The method according to claim 1, characterized in that, The method also includes a batch matching step: Receive a list containing multiple competitor component models; For each model in the list, automatically perform data loading, encapsulation standardization, and parameter matching steps; All matching results are summarized and output to a structured file.

9. An automated material replacement system for implementing the method according to any one of claims 1 to 4, characterized in that, include: The data loading module is used to load electronic component data from at least one data source; Encapsulate a standardization module to convert non-standard encapsulation names into standard encapsulation names based on a predefined encapsulation mapping rule base; The parameter matching engine is used to perform basic condition filtering mechanisms, material type-based dedicated matching mechanisms, and multi-dimensional similarity calculation and sorting mechanisms. The graphical user interface module is used to receive user input and display the matching process and results; The batch processing module is used to handle batch matching tasks for multiple competing product models.

10. The system according to claim 9, characterized in that, The parameter matching engine also includes a configuration saving and loading module, which is used to save commonly used parameter matching combinations and load them with one click in subsequent matching.

11. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 4.

Images