Ccs integrated busbar, battery module and manufacturing method

Abstract

The application belongs to the technical field of new energy batteries, and discloses a CCS integrated busbar, a battery module and a manufacturing method. The CCS integrated busbar comprises a back pad arranged on the back surface of a ceramic substrate, and the back pad is welded to a busbar; a conductive layer is arranged on the front surface of the ceramic substrate; a conductive connecting part is arranged between the back pad and the conductive layer, and is used for electrically connecting the conductive layer and the back pad; and a signal acquisition assembly is electrically connected with the conductive layer, and is used for acquiring a voltage signal and / or a temperature signal of a battery cell. Under the action of the conductive connecting part, the conductive layer on the front surface of the ceramic substrate and the back pad on the back surface are electrically connected, the back pad is welded to the busbar, and then the communication among the busbar, the back pad, the conductive connecting part, the conductive layer and the signal acquisition assembly is realized, and the independent nickel sheet part in the prior art is completely omitted. The nickel sheet does not need to be subjected to mold opening, stamping, electroplating and incoming material management, and the material types and supply chain costs are significantly reduced.

Description

Technical Field

[0001] This invention relates to the field of new energy battery technology, and in particular to a CCS integrated busbar, battery module and manufacturing method. Background Technology

[0002] In the power batteries and energy storage systems of new energy vehicles, the CCS (Cells Contact System) integrated busbar is a key component for realizing the series and parallel connection of cells and the acquisition of voltage and temperature signals. In a common CCS structure, the aluminum busbar (aluminum bar) serves as the connecting conductor of the cell electrodes, and needs to lead the voltage signal to the acquisition harness. At the same time, temperature sensors (NTC) and other components need to be integrated on the aluminum bar.

[0003] In the existing technology, the manufacturing scheme of CCS integrated busbar is as follows: first, a nickel sheet is welded onto the aluminum busbar, and then the acquisition wire harness is welded onto the nickel sheet. The nickel sheet is set between the aluminum busbar and the wire harness as a nickel transition structure, thereby realizing the electrical connection between the aluminum busbar and the wire harness (copper).

[0004] However, this existing solution has the following shortcomings in actual production and application:

[0005] First, the nickel sheet, as an independent intermediate component, requires separate mold making, stamping, electroplating, and incoming material management. During CCS assembly, the nickel sheet must first be welded to the aluminum busbar, and then the wire harness must be welded to the nickel sheet. This involves two independent welding processes and two positioning operations, resulting in a long process flow and limited production efficiency.

[0006] Second, the development of molds, stamping and electroplating of nickel sheets all increase material costs; at the same time, the two welding processes increase labor or equipment time costs.

[0007] Therefore, the above problems urgently need to be solved. Summary of the Invention

[0008] The purpose of this invention is to provide a CCS integrated busbar, battery module and manufacturing method to reduce production costs and improve production quality and efficiency.

[0009] To achieve this objective, the present invention adopts the following technical solution:

[0010] CCS integrated busbar, which includes:

[0011] Busbar;

[0012] A ceramic substrate having a back pad on its back side, the back pad being soldered to the bus;

[0013] A conductive layer is disposed on the front side of the ceramic substrate;

[0014] A conductive connection portion is disposed between the back pad and the conductive layer for electrically connecting the conductive layer and the back pad;

[0015] A signal acquisition component, electrically connected to the conductive layer, is used to acquire the voltage signal and / or temperature signal of the battery cell.

[0016] Preferably, the signal acquisition component includes an acquisition element and an acquisition harness, with one end of the acquisition harness connected to the acquisition element and the other end soldered to the conductive layer.

[0017] Preferably, the acquisition element includes a temperature sensor and / or an FPC.

[0018] Preferably, the signal acquisition component further includes a fuse connected in series between the acquisition harness and the conductive layer.

[0019] Preferably, the conductive connection portion is a through-hole that penetrates the ceramic substrate.

[0020] Preferably, the conductive layer is a metal plating layer.

[0021] A battery module comprising multiple battery cells and a CCS integrated busbar as described above.

[0022] A method for manufacturing a CCS integrated busbar includes the following steps:

[0023] Provide ceramic substrates;

[0024] A conductive layer is formed on the front side of the ceramic substrate, and a back pad is formed on the back side of the ceramic substrate.

[0025] The conductive layer is electrically connected to the back pad via a conductive connection portion;

[0026] Solder the back pads to the busbar;

[0027] The signal acquisition component is electrically connected to the conductive layer.

[0028] Preferably, forming a conductive layer on the front side of the ceramic substrate includes:

[0029] A conductive layer is formed on the front side of a ceramic substrate using a thick film process or an electroplating process.

[0030] Preferably, forming a back pad on the back side of the ceramic substrate includes:

[0031] Back pads are formed on the back side of a ceramic substrate using a thick film process or electroplating process.

[0032] The beneficial effects of this invention are:

[0033] This invention proposes a CCS integrated busbar, a battery module, and a manufacturing method. In the production of this integrated busbar, the separate preparation and management of nickel sheets are eliminated, significantly shortening the production cycle and increasing output per unit time. Furthermore, since the ceramic substrate has a built-in conductive layer, the coordinates of the conductive layer are known after the ceramic substrate is positioned, eliminating the need for secondary positioning and further improving the production efficiency of the integrated busbar. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of the ceramic substrate in this invention;

[0035] Figure 2 This is a flowchart of the CCS integrated busbar manufacturing method in this invention.

[0036] In the picture:

[0037] 1. Ceramic substrate; 2. Conductive layer; 3. Conductive connection part. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0039] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0040] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0042] Please see Figure 1 and Figure 2 This embodiment proposes a manufacturing method for a CCS integrated busbar, which includes the following steps:

[0043] Provide ceramic substrate 1;

[0044] A conductive layer 2 is formed on the front side of the ceramic substrate 1, and a back pad is formed on the back side of the ceramic substrate 1.

[0045] The conductive layer 2 is electrically connected to the back pad via the conductive connection part 3;

[0046] Solder the back pads to the busbar;

[0047] The signal acquisition component is electrically connected to the conductive layer 2.

[0048] Understandably, eliminating the need for independent nickel sheet preparation and management processes during the production of this integrated busbar significantly shortens the production cycle and increases output per unit time. Traditionally, when using nickel sheets as a transition structure, two independent positioning processes are required: one between the nickel sheet and the busbar, and the other between the nickel sheet and the signal acquisition component. The reference points used for these two positioning processes are different. Even a small error between the nickel sheet and the busbar can easily lead to increased assembly errors in the signal acquisition component. Therefore, repeated corrections are necessary during positioning, resulting in reduced overall production efficiency.

[0049] In this embodiment, since the conductive layer 2 is integrated on the ceramic substrate 1, the coordinates of the conductive layer 2 on the ceramic substrate 1 are known after the ceramic substrate 1 is positioned, and no secondary positioning is required, thereby improving the production efficiency of the integrated busbar.

[0050] The formation of the conductive layer 2 on the front side of the ceramic substrate 1 includes:

[0051] A conductive layer 2 is formed on the front side of the ceramic substrate 1 using a thick film process or an electroplating process.

[0052] This configuration enables the construction of a complete signal acquisition network on the ceramic substrate 1, allowing multiple lines, such as voltage sampling lines, temperature sampling lines, and micro fuses, to be arranged on the ceramic substrate 1 simultaneously, thereby improving the integration of the CCS integrated busbar.

[0053] When using a thick film process, the conductive paste (such as silver paste or copper paste) is printed, dried, and sintered at high temperature to form a dense thick film conductor with the ceramic substrate 1. The bonding strength is high, and the film thickness is preferably 5 to 10 μm.

[0054] When using electroplating, a seed layer is first deposited on the front side of the ceramic substrate 1 (using methods such as sputtering or chemical plating), and then electroplated to thicken it, which can obtain a high-purity, high-conductivity metal layer (such as copper, nickel, gold).

[0055] It should be noted that, depending on actual production needs, the conductive layer 2 can be selected as a specific pattern to form a specific connection area on the ceramic substrate 1, thereby improving the adaptability of the integrated busbar.

[0056] The formation of back pads on the back side of the ceramic substrate 1 as described above includes:

[0057] Back pads are formed on the back side of the ceramic substrate 1 using a thick film process or an electroplating process.

[0058] It is understandable that a back pad is formed directly on the back of the ceramic substrate 1 using a thick film process (such as printing aluminum or silver paste and then sintering) or an electroplating process (such as electroless nickel / copper plating followed by electroplating to thicken the back). The back pad serves as a welding metal layer, replacing the traditional nickel sheet, so that the ceramic substrate 1 can be connected to the bus by welding. This prevents the back pad from falling off from the bus and ensures the long-term reliability of the fixation and electrical connection between the back pad and the bus.

[0059] For thick-film processes, metal pastes that match the bus material can be selected (e.g., aluminum paste for aluminum buses and silver paste for copper buses). After sintering, a dense metal layer is formed as the back pad. The coefficient of thermal expansion can be adjusted by the paste formulation to reduce the difference with the bus. For electroplating processes, multiple layers of metal (e.g., a bottom nickel barrier, a middle copper conductive layer, and a top tin or silver solderable layer) can be deposited as the back pad.

[0060] Whether it is a thick film process or an electroplating process, the materials used are the same or similar to those used in the busbar, so that the coefficients of thermal expansion of the two are almost the same, thereby eliminating the thermal stress caused by the difference in thermal expansion between the two.

[0061] It should be noted that, depending on actual production needs, the back pads can be selected as a specific pattern. When in contact with the bus, the two form a surface-to-surface contact, ensuring the fixing strength between the ceramic substrate 1 and the bus.

[0062] Based on the above, this embodiment proposes a CCS integrated busbar including a busbar, a ceramic substrate 1, a conductive layer 2, a conductive connection part 3, and a signal acquisition component. The back side of the ceramic substrate 1 is provided with a back pad, which is soldered to the busbar. The conductive layer 2 is disposed on the front side of the ceramic substrate 1. The conductive connection part 3 is disposed between the back pad and the conductive layer for electrically connecting the conductive layer and the back pad. The signal acquisition component is electrically connected to the conductive layer 2 for acquiring the voltage signal and / or temperature signal of the battery cell.

[0063] With the help of the conductive connection part 3, the conductive layer 2 on the front side of the ceramic substrate 1 can be electrically connected to the back pad on the back side. After the back pad is soldered to the bus, the connection between the bus, the back pad, the conductive connection part 3, the conductive layer 2, and the signal acquisition component can be realized, completely eliminating the need for the separate nickel sheet parts in the prior art. There is no need for mold making, stamping, electroplating, and incoming material management for the nickel sheet, which significantly reduces the types of materials and supply chain costs.

[0064] The back pads, conductive layer 2, and conductive connection part 3 are all integrated on the ceramic substrate 1. Compared with the traditional method of using nickel sheet as a transition structure, it does not require two independent positioning operations. After the positioning between the ceramic substrate 1 and the busbar is completed, the position information of the conductive layer 2 can be obtained. The process steps are shortened, the number of positioning times is reduced, the assembly efficiency is improved, and the labor or equipment time cost is reduced.

[0065] The conductive layer 2 is a metal plating layer, which is a continuous metal thin film formed on the front side of the ceramic substrate 1 through atomic-level or grain boundary-level deposition. Compared with the existing technology of using pressure-sensitive adhesive to bond copper foil or printing conductive paste, the adhesion between the metal plating layer and the ceramic substrate 1 is significantly higher. Under the conditions of power battery vibration, temperature cycling, and mechanical shock, the conductive layer 2 will not warp, blister, or detach, ensuring the long-term conductivity reliability of the signal acquisition circuit.

[0066] Metal coatings can be copper, silver, nickel, or a composite layer formed by chemical plating, electroplating, sputtering, or evaporation plating.

[0067] The conductive layer 2 is preferably a silver-plated layer. Depending on actual production needs, the silver plating layer can form silver-plated circuitry on the ceramic substrate 1, allowing the Bluetooth or WiFi radio frequency chip (SoC) to be soldered onto the ceramic substrate 1. The converted digital signal is transmitted to the chip using the silver circuitry. The chip modulates the signal to the 2.4GHz or 5GHz microwave frequency band via a microstrip antenna structure and radiates it outwards through the antenna. The high radiation efficiency (up to 75% or more) of the silver-plated ceramic antenna ensures that the microwave signal can be transmitted stably and with low loss, thereby achieving wireless signal acquisition.

[0068] The vias on the ceramic substrate 1 serve as the conductive connection portions 3 of the integrated busbar. The ceramic substrate 1 possesses extremely high insulation resistance and breakdown strength (alumina breakdown field strength > 10kV / mm), and can withstand the operating temperature range of the power battery (-40℃ to 125℃ or even higher) for extended periods without thermal deformation, softening, or decomposition. Under conditions where the busbar may encounter transient overvoltages or high temperatures, the ceramic substrate effectively prevents leakage or breakdown between the conductive layer 2 and the busbar, ensuring the electrical safety of the CCS integrated busbar. Simultaneously, the ceramic substrate is corrosion-resistant and moisture-resistant, exhibiting long-term reliability in humid and salt spray environments in automotive or energy storage systems.

[0069] Furthermore, the ceramic substrate can quickly and evenly conduct the heat from the battery cell or bus to the area where the temperature sensor is located in the signal acquisition component, reducing heat transfer delay and making the acquired temperature signal more accurately reflect the real-time temperature of the battery cell, thereby improving the accuracy of the signal acquisition component in judging the risk of thermal runaway.

[0070] The via penetrates the ceramic substrate 1, with one end directly electrically connected to the conductive layer 2 and the other end directly electrically connected to the back pad. This configuration creates the shortest vertical conduction path from the bus to the conductive layer 2, reducing connection resistance. In voltage signal acquisition, this reduces line voltage drop errors; in high-current scenarios, it reduces heat generation and energy loss, improving the accuracy of signal acquisition and system efficiency.

[0071] Vias can be formed through processes such as laser drilling, mechanical drilling followed by hole wall metallization, or direct filling with conductive paste and sintering, eliminating the need for additional transition structures like nickel sheets. This eliminates the separate processes of mold making, stamping, electroplating, incoming material management, and soldering the nickel sheets to the busbar. During CCS integrated busbar assembly, only the ceramic substrate 1 with vias (which already includes the conductive layer 2 and back pads) needs to be connected to the busbar, simplifying the process flow.

[0072] Furthermore, the back pads can be formed by copper plating, printing conductive paste, or sputtering a metal layer. The material selection for the back pads is related to the bus. For example, if the bus is aluminum, the back pads can be made of aluminum; if the bus is copper, the back pads can be made of copper. These back pads can be directly and firmly connected to the bus using conventional welding processes (such as laser welding, ultrasonic welding, and reflow soldering).

[0073] In this embodiment, the signal acquisition component includes a acquisition harness, a pressure measuring structure such as an FPC (Flexible Printed Circuit), and a temperature measuring structure such as a temperature sensor (such as an NTC). The acquisition harness is used to connect the pressure measuring structure and the temperature measuring structure to the conductive layer 2. The connection method is preferably brazing or ultrasonic welding.

[0074] Furthermore, to ensure the safety of the pressure measurement structure during the measurement process, the CCS integrated busbar also includes a fuse, which is connected in series between the signal acquisition component and the conductive layer 2. Once the abnormal current exceeds the rated fusing value of the fuse, the fuse will quickly trip, cutting off the fault path and protecting the safety of the CCS integrated busbar.

[0075] Because the normal operating current of the signal acquisition components is extremely small (milliamperes or even microamperes), a fast-blow fuse with a small rated current (such as 50mA or 100mA) can be selected to ensure that the voltage drop is negligible during normal signal transmission and does not affect the accuracy of voltage measurement. In the event of a short circuit, even if the short-circuit current is only a few amperes, it can quickly blow away the fuse.

[0076] Furthermore, this embodiment also proposes a battery module comprising multiple battery cells and a CCS integrated busbar as described above. This configuration not only enables rapid assembly of the battery module but also ensures faster response speed of the signal acquisition components and more accurate signal acquisition.

[0077] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. CCS integrated busbar, characterized in that, include: Busbar; A ceramic substrate (1) has a back pad on its back side, and the back pad is soldered to the bus. A conductive layer (2) is disposed on the front side of the ceramic substrate (1); A conductive connection portion (3) is disposed between the back pad and the conductive layer (2) for electrically connecting the conductive layer (2) and the back pad; The signal acquisition component is electrically connected to the conductive layer (2) and is used to acquire the voltage signal and / or temperature signal of the battery cell.

2. The CCS integrated busbar according to claim 1, characterized in that, The signal acquisition component includes an acquisition element and an acquisition harness. One end of the acquisition harness is connected to the acquisition element, and the other end is soldered to the conductive layer (2).

3. The CCS integrated busbar according to claim 2, characterized in that, The data acquisition element includes a temperature sensor and / or an FPC.

4. The CCS integrated busbar according to claim 2, characterized in that, The signal acquisition component also includes a fuse, which is connected in series between the acquisition harness and the conductive layer (2).

5. The CCS integrated busbar according to claim 1, characterized in that, The conductive connection part (3) is a through hole that penetrates the ceramic substrate (1).

6. The CCS integrated busbar according to claim 1, characterized in that, The conductive layer (2) is a metal plating layer.

7. A battery module, characterized in that, It includes multiple battery cells and a CCS integrated busbar as described in any one of claims 1 to 6.

8. A method for manufacturing a CCS integrated busbar, characterized in that, Includes the following steps: Provide a ceramic substrate (1); A conductive layer (2) is formed on the front side of the ceramic substrate (1), and a back pad is formed on the back side of the ceramic substrate (1). The conductive layer (2) is electrically connected to the back pad via the conductive connection portion (3); Solder the back pads to the busbar; The signal acquisition component is electrically connected to the conductive layer (2).

9. The manufacturing method of the CCS integrated busbar according to claim 8, characterized in that, The formation of a conductive layer (2) on the front side of the ceramic substrate (1) includes: A conductive layer (2) is formed on the front side of a ceramic substrate (1) using a thick film process or an electroplating process.

10. The manufacturing method of the CCS integrated busbar according to claim 8, characterized in that, The formation of back pads on the back side of the ceramic substrate (1) includes: Back pads are formed on the back side of the ceramic substrate (1) using a thick film process or an electroplating process.

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