A battery information collector, a battery and an electric device

Abstract

Embodiments of the present application provide a battery information collector, a battery and a power consumption device. The battery information collector comprises an integrated packaging circuit assembly. The integrated packaging circuit assembly comprises a carrier plate, a first wafer and a first electronic component. The carrier plate comprises an internal circuit and a first surface, and the first surface has a first pad, a second pad, a third pad and a fourth pad. The first wafer has a fifth pad and a sixth pad. The first electronic component has a seventh pad and an eighth pad. The first pad and the fifth pad are electrically connected, the second pad and the sixth pad are electrically connected, the third pad and the seventh pad are electrically connected, the fourth pad and the eighth pad are electrically connected, and the sixth pad and the eighth pad are connected through the internal circuit. By directly connecting the wafer and the peripheral electronic component on the carrier plate, the circuit design layout of the PCB can be simplified, the area occupied by the circuit layout is reduced, and thus the overall size of the BIC is reduced.

Description

Technical Field

[0001] This application relates to the field of vehicle technology, and in particular to a battery information collector, battery, and electrical equipment. Background Technology

[0002] In a vehicle's Battery Management System (BMS), the Battery Information Collector (BIC) typically integrates numerous electronic components (such as chips, resistors, capacitors, inductors, diodes, transistors, etc.) on a printed circuit board (PCB) to collect and process key parameters such as battery voltage, current, and temperature, providing data support for real-time monitoring and safety management of the battery status.

[0003] Since the electronic components integrated on a PCB are standardized finished products from different suppliers, their size and layout are basically fixed during the design phase. When a large number of components (usually 500 to 1500) are integrated on a PCB, the size of the PCB cannot be compressed or adjusted indefinitely due to the inherent size and layout requirements of these components, which makes it difficult to flexibly change the overall size of the BIC.

[0004] However, the space inside a battery pack is often quite limited, which places higher demands on the size and installation method of the BIC. This size limitation makes the design and integration of BICs a significant challenge, especially when it is necessary to adapt to different vehicle models or battery pack structures, making it difficult to achieve optimal space utilization and system integration. Summary of the Invention

[0005] This application provides a battery information collector, a battery, and an electrical device, which can simplify the circuit layout on the PCB and reduce the area occupied by the circuit layout.

[0006] To achieve the above objectives, according to a first aspect of this application, a battery information acquisition device (BIC) is provided, comprising: an integrated packaged circuit assembly. The integrated packaged circuit assembly includes a carrier board, a first wafer, and a first electronic component. The carrier board includes internal circuitry and a first surface, the first surface having a first pad, a second pad, a third pad, and a fourth pad. The first wafer has a fifth pad and a sixth pad. The first electronic component has a seventh pad and an eighth pad. The first pad and the fifth pad are electrically connected, the second pad and the sixth pad are electrically connected, the third pad and the seventh pad are electrically connected, the fourth pad and the eighth pad are electrically connected, and the sixth pad and the eighth pad are connected via the internal circuitry.

[0007] Optionally, the integrated packaged circuit assembly includes a molding compound, in which the carrier board, the first wafer, and the first electronic component are encapsulated together.

[0008] Optionally, the first wafer is used to generate the first chip, and the integrated packaging circuit assembly includes a first interface for transmitting data from the first chip.

[0009] Optionally, the carrier plate includes a second side, which is electrically connected to the first interface.

[0010] Optionally, the carrier board includes a second side having a ninth pad, and the integrated package circuit assembly includes a second wafer having a tenth pad, the ninth pad and the tenth pad being electrically connected.

[0011] Optionally, the second surface has an eleventh pad, a twelfth pad, and a thirteenth pad. The second wafer has a fourteenth pad. The integrated package circuit assembly includes a second electronic component having a fifteenth pad and a sixteenth pad. The eleventh and fourteenth pads are electrically connected, the twelfth and fifteenth pads are electrically connected, the thirteenth and sixteenth pads are electrically connected, and the fourteenth and sixteenth pads are connected via the internal circuitry.

[0012] Optionally, the integrated packaged circuit assembly includes a frame, the frame including a third side and a fourth side, the distance between the third side and the fourth side being greater than or equal to a first threshold, the fourth side being electrically connected to the first interface, and the third side being electrically connected to the second side through a second interface.

[0013] Optionally, the second wafer, the second electronic component, and the frame are encapsulated together in the plastic package.

[0014] Optionally, the BIC includes an isolation device and a printed circuit board (PCB), the isolation device being electrically connected to the PCB, and the integrated package circuit assembly being electrically connected to the PCB.

[0015] Optionally, the surface of the integrated packaged circuit assembly is not coated with conformal coating.

[0016] Optionally, the PCB is electrically connected to multiple battery cells to collect data from the multiple battery cells.

[0017] According to a second aspect of this application, a battery management system (BMS) is provided. The BMS includes a battery integrated circuit (BIC) as described in any of the first aspects.

[0018] According to a third aspect of this application, a battery is provided, including a battery management system (BMS) and a battery cell, wherein the BMS is used to collect data from the battery cell, the BMS is the BMS described in the second aspect, and the battery is any one of a single cell, a battery module, and a battery pack.

[0019] According to a fourth aspect of this application, an electrical device is provided, including a battery as described in the third aspect.

[0020] The BIC in this embodiment directly connects the wafer used to generate the chip and the electronic components connected to it onto the carrier board, reducing the need for independent packaging of electronic components. This simplifies the circuit design and layout of the PCB, reduces the area occupied by the circuit layout, and thus reduces the overall size of the BIC. Moreover, by integrating the wafer and peripheral electronic components into a highly unified standard device (i.e., an integrated packaged circuit assembly), when upgrading or replacing the BIC, such as switching the integrated chip IC in the BIC, there is no need to spend a lot of time redeveloping, designing, and laying out the circuit on the PCB. The surface-mount integrated packaged circuit assembly can be directly replaced, which can shorten the development cycle of the BIC.

[0021] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0024] Figure 1 This is a simplified circuit diagram of a BIC (Block Component Interchange) according to an embodiment of this application;

[0025] Figure 2 This is a rendering of a finished BIC according to an embodiment of this application;

[0026] Figure 3 This is a simplified circuit diagram of a BIC provided in an embodiment of this application;

[0027] Figure 4 This is a cross-sectional view of an integrated packaged circuit assembly provided in an embodiment of this application;

[0028] Figure 5This is a cross-sectional view of another integrated packaged circuit assembly provided in an embodiment of this application;

[0029] Figure 6 This is a rendering of an integrated packaged circuit assembly provided in an embodiment of this application.

[0030] Figure 7 This is a rendering of a finished BIC provided in an embodiment of this application;

[0031] Figure 8 This is a schematic diagram of the production process of a BMS provided in an embodiment of this application. Detailed Implementation

[0032] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0033] See Figure 1 , Figure 1 This is a simplified circuit diagram of an existing BIC. For example... Figure 1 As shown, existing BICs contain a large number of different types of electronic components, including sampling chip 101, power device (diode) 102, resistor 103, capacitor 104, isolation device (transformer) 105, connector 106 (the interface for external electrical interaction of the BIC), etc. These electronic components must be connected to the printed circuit board (PCB) 107 by surface mount or wave soldering in order to enable the BIC to collect and process key parameters such as battery voltage, current, and temperature, and provide data support for real-time monitoring and safety management of battery status.

[0034] However, the electronic components integrated on the PCB107 are standardized finished products from different suppliers, and their size and layout are basically fixed during the design phase. When a large number of components (typically 500 to 1500) are integrated on the PCB107, the size of the PCB107 cannot be compressed or adjusted indefinitely due to the inherent size and layout requirements of these components. This results in the overall size of the BIC being difficult to change flexibly and requiring a large area. However, the space inside the battery pack is often quite narrow, which makes circuit layout on the PCB107 extremely difficult.

[0035] Furthermore, in a Business Management System (BMS), various electronic components are constantly updated and replaced as technology advances and market demands change. Simultaneously, the BMS itself needs adjustments based on requirements such as functional upgrades, cost control, and performance optimization, potentially necessitating frequent replacements of electronic components, especially those in the Business Intelligence Block (BIC). However, each replacement of an electronic component typically requires a complete redesign of the circuit layout on the PCB107, including signal routing, power distribution, and interface definitions. If a company has dozens or even hundreds of projects or products, each with subtle differences in hardware design layout, size, and interfaces, then applying the same component replacement solution to all these projects necessitates repeating the PCB107 circuit design and layout work for each project. This repetitive work not only consumes significant time and manpower but also leads to low BIC development efficiency, impacting the overall product development and production schedule. Figure 2 As shown, there are a large number of electronic components in the existing BIC. When it is necessary to replace the electronic components on PCB107, the complex circuit on PCB107 needs to be redesigned and relaid.

[0036] In addition, in the existing BIC production, after all electronic components are soldered onto PCB107, they are sprayed with conformal coating for certain protection and shielding. However, condensation may occur inside the battery pack, or electrolyte may leak out when the battery cell malfunctions, which may drip onto PCB107. In this case, conformal coating cannot prevent condensation or electrolyte penetration, which can easily cause the BIC to short-circuit and burn out.

[0037] To address the aforementioned technical challenges, this solution directly integrates the chip wafer and passive components onto a carrier board and encapsulates them in a plastic package. This simplifies the circuit layout on the PCB, ensures a compact PCB layout, shortens the BIC development cycle, and improves the BIC's operational reliability. Detailed specifications will be provided below.

[0038] See Figure 3 , Figure 3 This is a simplified circuit diagram of a BIC provided in an embodiment of this application. For example... Figure 3 As shown, the BIC provided in this application includes an isolation device (transformer) 205, a connector 206, a PCB 207, and an integrated package circuit assembly 210.

[0039] In the integrated packaged circuit assembly 210, a large number of wafers, as well as passive devices such as resistors, capacitors, diodes, transistors, inductors or ferrite beads that need to be connected to each wafer, are connected to the same side of a carrier board using surface mount / connection technology, so that the chip and peripheral electronic components are integrated into a highly unified standard device (i.e., integrated packaged circuit assembly 210).

[0040] An example is provided showing the integration of a first wafer and a first electronic component connected to the first wafer on a carrier board. The carrier board includes internal circuitry, a first surface, and a second surface. The first surface has a first pad, a second pad, a third pad, and a fourth pad. The first wafer has a fifth pad and a sixth pad. The first electronic component has a seventh pad and an eighth pad. The first and fifth pads are electrically connected, the second and sixth pads are electrically connected, the third and seventh pads are electrically connected, and the fourth and eighth pads are electrically connected. The sixth and eighth pads are connected through the internal circuitry of the carrier board, allowing the first wafer and the first electronic component to be electrically connected via the internal circuitry of the carrier board. The carrier board can be, for example, an FR4 PCB or a BT PCB. The first and second surfaces of the carrier board can be adjacent or opposite surfaces. The first electronic component specifically refers to resistors, capacitors, diodes, transistors, inductors, or ferrite beads, etc.

[0041] In some embodiments, the integrated circuit package (BIC) includes a molding compound. The carrier board, the first wafer, and the first electronic components are encapsulated together within the molding compound. This technical solution uses a molding compound to tightly encapsulate multiple electronic components, completely isolating them from interference from liquids such as condensate and electrolyte, thus improving the reliability of the BIC under extreme operating conditions.

[0042] In some embodiments, the first wafer is used to fabricate the first chip. The integrated packaged circuit assembly includes a first interface. The first interface is used to transmit data from the first chip and other electronic components.

[0043] In some embodiments, the second side of the carrier board is electrically connected to the first interface, so that electronic components such as chips, capacitors, and resistors on the carrier board can communicate with the outside of the integrated package circuit assembly through the first interface. This can significantly reduce the complexity of the circuit layout on PCB207, avoid signal interference and wiring chaos between multiple interfaces, greatly reduce the area occupied by the circuit layout on PCB207, and also help to achieve higher integration of BIC.

[0044] The following is combined Figure 4 The process of integrating the wafer and its connected electronic components in the integrated packaged circuit assembly 210 is further described above.

[0045] See Figure 4 , Figure 4 This is a cross-sectional view of an integrated packaged circuit assembly provided in an embodiment of this application. Figure 4 In this configuration, chip wafer 2101 or power semiconductor wafer 2102 corresponds to the first wafer, electronic component 2103 corresponds to the first electronic component, the upper surface of carrier 2106 corresponds to the first side of the carrier, and the lower surface of carrier 2106 corresponds to the second side of the carrier.

[0046] like Figure 4 As shown, the chip wafer 2101 and the power semiconductor wafer 2102 are bonded to the upper surface of the carrier plate 2106, and then the chip wafer 2101, the power semiconductor wafer 2102 and the upper surface of the carrier plate 2106 are electrically connected by bonding to form a wafer interconnect line 2104. The electronic components 2103 are connected to the upper surface of the carrier plate 2106 by surface mount soldering.

[0047] exist Figure 4 In this integrated packaged circuit assembly 210, a molding compound 2105 is also included. The molding compound 2105 encapsulates the carrier board 2106, the chip wafer 2101, the power semiconductor wafer 2102, and the electronic components 2103. Furthermore, the lower surface of the carrier board 2106 electrically interacts with the outside world through an interface 2108, for example, transmitting data from the chip made of the chip wafer 2101 and the electronic components 2103 to the outside world via the interface 2108. The connection between the lower surface of the carrier board 2106 and the interface 2108 can be achieved by using solder balls or metal leads.

[0048] For scenarios where a large number of chips and their associated peripheral components need to be integrated on a BIC, this application provides another integrated packaged circuit assembly to achieve integrated packaging of more wafers.

[0049] In the integrated packaged circuit assembly 210, a large number of wafers, as well as passive devices such as resistors, capacitors, diodes, transistors, inductors or ferrite beads that need to be connected to each wafer, are connected to both sides of a carrier board using surface mount / connection technology, so that the chip and peripheral electronic components are integrated into a highly unified standard device (i.e., integrated packaged circuit assembly 210).

[0050] An example is provided where a first wafer and a first electronic component connected to the first wafer are integrated on a first side of a carrier board, and a second wafer and a second electronic component connected to the second wafer are integrated on a second side of the carrier board. The carrier board includes internal circuitry, a first side, and a second side. The first side has a first pad, a second pad, a third pad, and a fourth pad. The first wafer has a fifth pad and a sixth pad. The first electronic component has a seventh pad and an eighth pad. The first and fifth pads are electrically connected, the second and sixth pads are electrically connected, the third and seventh pads are electrically connected, the fourth and eighth pads are electrically connected, and the sixth and eighth pads are connected through the internal circuitry of the carrier board, allowing the first wafer and the first electronic component to be electrically connected via the internal circuitry of the carrier board. The second side has a ninth pad, an eleventh pad, a twelfth pad, and a thirteenth pad. The second wafer has a tenth pad and a fourteenth pad. The second electronic component has a fifteenth pad and a sixteenth pad. Specifically, the ninth and tenth pads are electrically connected, the eleventh and fourteenth pads are electrically connected, the twelfth and fifteenth pads are electrically connected, and the thirteenth and sixteenth pads are electrically connected. The fourteenth and sixteenth pads are connected through the internal circuitry of the carrier board, enabling the second wafer and the second electronic components to be electrically connected through the internal circuitry of the carrier board. The first and second surfaces of the carrier board can be adjacent or opposite surfaces. The second electronic components specifically refer to resistors, capacitors, diodes, transistors, inductors, or ferrite beads, etc.

[0051] In some embodiments, a first wafer is used to fabricate a first chip. A second wafer is used to fabricate a second chip. The integrated packaged circuit assembly includes a first interface. The first interface is used to transmit data from the first chip and / or the second chip.

[0052] In some embodiments, the integrated packaged circuit assembly includes a frame. The frame has a certain thickness, specifically, the distance between two opposing surfaces of the frame—a third surface and a fourth surface—is greater than or equal to a first threshold (e.g., 0.2 mm, 0.3 mm, or 0.5 mm). Furthermore, the fourth surface of the frame is electrically connected to a first interface of the integrated packaged circuit assembly, and the third surface of the frame is electrically connected to a second surface of the carrier board via a second interface. This technical solution expands the deployment space on the second surface of the carrier board by adding a frame. Optionally, when the second surface is the lower surface of the carrier board, adding a frame can raise the vertical space at the bottom of the carrier board, thereby enabling more wafers and their associated peripheral components to be connected to both the upper and lower surfaces of the carrier board, making full use of the space. Electrically connecting the fourth surface of the frame to the first interface of the integrated packaged circuit assembly and electrically connecting the third surface of the frame to the second surface of the carrier board via the second interface ensures that the chips and their peripheral components on the carrier board can communicate with the outside of the integrated packaged circuit assembly through the first interface.

[0053] In some embodiments, the integrated packaged circuit assembly includes a molding compound. A carrier board, a first wafer, a first electronic component, a second wafer, a second electronic component, and a frame are encapsulated together within the molding compound. By tightly encapsulating as many electronic components as possible within the molding compound, the integrated packaged circuit assembly can significantly improve the integration density, reliability, and electrical performance of the BIC.

[0054] The following is combined Figure 5 The process of integrating the wafer and its connected electronic components in the integrated packaged circuit assembly 210 is further described above.

[0055] See Figure 5 , Figure 5 This is a cross-sectional view of another integrated packaged circuit component provided in an embodiment of this application.

[0056] exist Figure 5 In this configuration, chip wafer 2101 or power semiconductor wafer 2102 corresponds to the first wafer, electronic component 2103 corresponds to the first electronic component and the second electronic component, the upper surface of carrier 2106 corresponds to the first side of carrier 2106, the lower surface of carrier 2106 corresponds to the second side of carrier 2106, the upper surface of frame 2107 corresponds to the third side of frame 2107, and the lower surface of frame 2107 corresponds to the fourth side of frame 2107.

[0057] like Figure 5 As shown, chip wafer 2101 and power semiconductor wafer 2102 are bonded to the upper surface of carrier plate 2106. Then, the chip wafer 2101, power semiconductor wafer 2102, and the upper surface of carrier plate 2106 are electrically connected by bonding to form wafer interconnects 2104. Electronic components 2103 are connected to the upper surface of carrier plate 2106 by surface mount soldering. In addition to surface mount connections on the upper surface of carrier plate 2106, electronic components 2103 are also surface mount connected to the lower surface of carrier plate 2106.

[0058] exist Figure 5 In the integrated packaged circuit assembly 210, a molding compound 2105 is also included. The molding compound 2105 encapsulates the carrier 2106, the chip wafer 2101, the power semiconductor wafer 2102, and the electronic components 2103.

[0059] exist Figure 5 In this design, the lower surface of the carrier board 2106 is electrically connected to the upper surface of the frame 2107 via a second interface, which can be achieved by using solder balls or pins. The lower surface of the frame 2107 is electrically connected to the interface 2108, which can also be achieved by using solder balls or pins. The carrier board 2106 can then electrically interact with the outside world through the interface 2108, for example, transmitting data of the chip fabricated from the chip wafer 2101 and the electronic components 2103 to the outside world via the interface 2108.

[0060] See Figure 6 , Figure 6 This is a rendering of a finished integrated packaged circuit assembly provided in an embodiment of this application. Figure 6 As shown, the connection method inside the integrated packaged circuit assembly (including chip wafer 2101, electronic components 2103, carrier board 2106, etc.) is similar to that of PCB connection, but the integrated packaged circuit assembly is completely wrapped by the plastic package 2105.

[0061] See Figure 7 , Figure 7 This is a rendering of a finished BIC provided in an embodiment of this application. Figure 7 As shown, the BIC includes an isolation device 205 (such as a transformer), a connector 206, a PCB 207, and an integrated package circuit assembly 210. The isolation device 205 is electrically connected to the PCB 207, the connector 206 is electrically connected to the PCB 207, and the integrated package circuit assembly 210 is electrically connected to the PCB 207. The isolation device 205 in the BIC is mainly used to achieve electrical isolation and voltage transformation, reducing circuit failures caused by high voltage, current fluctuations, or external interference, thereby improving the stability and reliability of the BIC. In practical applications, the isolation device 205, due to its large package size, cannot be encapsulated within the integrated package circuit assembly 210.

[0062] In some embodiments, PCB207 is electrically connected to multiple battery cells via leads (such as nickel or aluminum sheets), wire harnesses, etc., to collect key parameters such as voltage, current, and temperature of these battery cells. In a BIC, connecting one PCB207 to multiple battery cells enables a single BIC to collect data from multiple battery cells, resulting in high integration and reducing the area occupied by the BIC.

[0063] In some embodiments, the surfaces of the isolator 205, connector 206, and PCB 207 are coated with conformal coating, while the surface of the integrated packaged circuit assembly 210 is not coated with conformal coating. Existing products typically apply conformal coating to all components on the PCB.

[0064] Compared to Figure 2 , Figure 7The types and number of components have been significantly reduced, simplifying the original 500-1500 surface-mount electronic components to only 20-50 surface-mount electronic components and integrated packaged circuit assemblies. This greatly simplifies the circuit design and layout of the PCB207, reduces the area occupied by the circuit layout, and shrinks the overall size of the BIC. Moreover, by integrating the wafer and peripheral electronic components into a highly standardized device (i.e., an integrated packaged circuit assembly), when upgrading or replacing the BIC, such as switching the integrated chip IC in the BIC, there is no need to spend a lot of time redeveloping, designing, and laying out the circuit on the PCB. You can directly replace the surface-mount integrated packaged circuit assembly, which can shorten the development cycle of the BIC.

[0065] According to one aspect of this application, a battery management system (BMS) is provided, which includes the aforementioned BIC. This BMS possesses all the beneficial effects of the aforementioned BIC, which will not be elaborated further herein.

[0066] The BMS production process provided in this application is as follows: Figure 8 As shown. See also Figure 8 , Figure 8 This is a schematic diagram of the production process of a BMS provided in an embodiment of this application.

[0067] First, because the wafer bonding and packaging processes in semiconductor device manufacturing are similar to and repetitive with the chip mounting and offline testing processes in BMS manufacturing, it is possible to combine and simplify this part of the manufacturing process. After executing S101 "Acquire wafers and passive devices", execute S102 "Place / connect wafers and passive devices on the carrier board".

[0068] Next, step S103, "Packaging into an Integrated Package Circuit Assembly," is performed, which fully encapsulates the wafer and its peripheral electronic components. If the number of chips and their connected peripheral electronic components in the BMS is small, multiple wafers can be bonded to the upper surface of the carrier board using a single-sided connection method, and then electrically connected to the carrier board via bonding soldering. If the number of chips and their connected peripheral components in the BMS is large, space can be fully utilized using a double-sided connection method. In addition to surface mount connections on the upper surface of the carrier board, multiple wafers and their connected peripheral components can also be surface mount connections on the lower surface of the carrier board. Then, steps S104, "Integrated Package Circuit Assembly Offline Testing," and S105, "Forming the Finished Integrated Package Circuit Assembly," are performed. After completing S106, "Other Material Production," step S107, "Battery Management System Surface Mounting - Simplification," is performed, followed by S108, "Battery Management System Coating," and then S109, "Battery Management System Offline Testing - Simplification," to verify the normal functioning of the BMS. This step simplifies the process from requiring 20-50 test items and taking approximately 5-15 minutes per piece of product to only 5-15 test items and taking 30-60 seconds per piece of product. Finally, S110, "forming the finished battery management system," is completed. It can be seen that the BMS production process provided in this application can leverage the advantages of high-volume production in semiconductor manufacturing, reducing production time and cost by more than 90%.

[0069] The existing battery management system (BMS) production process requires semiconductor devices such as chips to undergo semiconductor wafer fabrication, wafer interconnection, packaging, and testing to produce the finished semiconductor product. Other types of electronic components also have their own distinct manufacturing processes. After all materials are prepared, the production of the BMS involves mounting the electronic components (approximately 500-1500 pieces) onto a PCB, applying conformal coating for masking (providing some protection to the electronic components and PCB), conducting BMS off-line testing (typically requiring 20-50 tests, taking 1-5 minutes per piece), and finally producing the finished battery management system. The entire production process for the battery management system is highly complex, incurring significant costs in equipment wear and tear, manpower, and time.

[0070] In some embodiments, other components in the BMS provided in this application besides the BIC can also be developed with reference to the integration and packaging process of the integrated packaged circuit components in the BIC. This can optimize the design and integration process of the BMS, further reduce the size of the BMS, and enable it to adapt to more vehicle models or battery pack structures.

[0071] According to one aspect of this application, a battery is provided. The battery includes a battery management system (BMS) and a battery cell. The BMS is adopted as described above. Figure 8 The battery is obtained through a specific production method. The BMS includes the BIC provided in this application. The BMS is used to collect data from the battery cells. The battery can be any of a single cell, a battery module, or a battery pack.

[0072] According to one aspect of this application, an electrical appliance is provided that includes the aforementioned BIC. This electrical appliance possesses all the beneficial effects of the aforementioned BIC, which will not be elaborated further herein.

[0073] It should be noted that the electronic device can be any conventional device that requires electricity, including but not limited to vehicles (gasoline cars, plug-in hybrid electric vehicles or new energy vehicles, etc.), skateboard chassis, ships, drones, mobile phones, computers, air conditioners, refrigerators, washing machines, microwave ovens, printers, fax machines, etc. This application does not make any specific limitations in this regard.

[0074] In the description of this application, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0075] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0076] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0077] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A battery information collector (BIC), characterized in that, The BIC includes an integrated packaged circuit assembly, which includes: A carrier board, the carrier board including internal circuitry and a first surface, the first surface having a first pad, a second pad, a third pad and a fourth pad; The first wafer has a fifth pad and a sixth pad; The first electronic component has a seventh pad and an eighth pad; wherein... The first pad and the fifth pad are electrically connected. The second pad and the sixth pad are electrically connected. The third pad and the seventh pad are electrically connected. The fourth pad and the eighth pad are electrically connected. The sixth pad and the eighth pad are connected through the internal circuit.

2. The BIC according to claim 1, characterized in that, The integrated packaged circuit assembly includes a plastic package, in which the carrier board, the first wafer, and the first electronic component are encapsulated together.

3. The BIC according to claim 2, characterized in that, The first wafer is used to produce the first chip. The integrated packaged circuit assembly includes a first interface for transmitting data from the first chip.

4. The BIC according to claim 5, characterized in that, The carrier plate includes a second side, which is electrically connected to the first interface.

5. The BIC according to claim 3, characterized in that, The carrier board includes a second side having a ninth pad. The integrated packaged circuit assembly includes a second wafer having a tenth pad, the ninth pad and the tenth pad being electrically connected.

6. The BIC according to claim 5, characterized in that, The second side has an eleventh pad, a twelfth pad, and a thirteenth pad. The second wafer has a fourteenth pad. The integrated packaged circuit assembly includes a second electronic component, the second electronic component having a fifteenth pad and a sixteenth pad, wherein... The eleventh pad and the fourteenth pad are electrically connected. The twelfth pad and the fifteenth pad are electrically connected. The thirteenth pad and the sixteenth pad are electrically connected. The fourteenth pad and the sixteenth pad are connected through the internal circuit.

7. The BIC according to claim 6, characterized in that, The integrated packaged circuit assembly includes a frame, the frame having a third surface and a fourth surface, the distance between the third surface and the fourth surface being greater than or equal to a first threshold. The fourth surface is electrically connected to the first interface. The third surface is electrically connected to the second surface via a second interface.

8. The BIC according to claim 7, characterized in that, The second wafer, the second electronic component, and the frame are encapsulated together in the plastic package.

9. The BIC according to any one of claims 1-8, characterized in that, The BIC includes an isolation device and a printed circuit board (PCB). The isolation device is electrically connected to the PCB, and the integrated package circuit assembly is electrically connected to the PCB.

10. The BIC according to claim 9, characterized in that, The surface of the integrated packaged circuit assembly is not coated with conformal coating.

11. The BIC according to claim 9, characterized in that, The PCB is electrically connected to multiple battery cells to collect data from the multiple battery cells.

12. A battery management system (BMS), characterized in that, Includes the BIC as described in any one of claims 1-11.

13. A battery, characterized in that, It includes a battery management system (BMS) and a battery cell. The BMS is used to collect data from the battery cell. The BMS is the BMS described in claim 12. The battery is any one of a single cell, a battery module, and a battery pack.

14. An electrical appliance, characterized in that, Includes the battery as described in claim 13.

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