Crimping terminal structure and crimping method thereof

Abstract

The application relates to the technical field of electric machines, and particularly discloses a crimping terminal structure and a crimping method thereof. A wire assembly is installed in a containing groove, plastic deformation of an opening portion blocks the installation opening and makes the enameled wire abut against the inner wall of the containing groove, a bare wire gap is formed, the bare wire of the lead-out wire is extruded into the bare wire gap and tightly abuts against the enameled wire group or the inner wall of the containing groove, during the hot-pressing process, the insulating paint of the enameled wire is vaporized, the insulating paint of the enameled wire group does not need to be treated in advance, and the process is simplified. A metal plating layer is arranged on the side of the terminal body where the containing groove is formed, a molten conductive area is formed at the position where the enameled wire group and the terminal body are in conduction, the metal plating layer in the molten conductive area is melted and flows to both sides of the molten conductive area under the extrusion of the enameled wire group, and after solidification, the metal plating layer provides support for the corresponding enameled wire. The bare wire can be embedded into the molten metal plating layer, the adhesion with the terminal body is increased, wire breakage, loose connection or loosening is avoided, and good connection between the lead-out wire and the enameled wire is ensured.

Description

Technical Field

[0001] This invention relates to the field of motor technology, and in particular to a crimping terminal structure and crimping method thereof. Background Technology

[0002] Both lead wires and enameled wires are conductive components of a motor, and their structures differ depending on their respective positions. Lead wires have an insulating sheath covering the bare conductor, while enameled wires have an insulating varnish coating on the conductor. When connecting enameled wires and lead wires, the insulation of the lead wires needs to be stripped, and the insulating varnish of the enameled wires needs to be removed before the two are connected. In existing technology, the insulating varnish of the enameled wires is usually removed by burning, scraping, or chemical soaking. After removing the insulating varnish, the lead wires and enameled wires are inserted into terminals, crimped, and soldered. This process is relatively cumbersome, and the soldering process can easily burn through the bare conductor of the lead wire, leading to poor contact or even disconnection of the joint. Summary of the Invention

[0003] The purpose of this invention is to provide a crimp terminal structure and crimping method, which ensures a good connection between the lead wire and the enameled wire while simplifying the process.

[0004] This invention provides a crimp terminal structure, comprising: The terminal body has a main body and an opening. The main body has a receiving groove, and the opening is connected to the main body. The opening is able to undergo plastic deformation relative to the main body and block the installation opening. A metal plating layer is provided on the side of the terminal body that forms the receiving groove. The conductor assembly includes an enameled wire group and a lead wire. Both the enameled wire group and the lead wire are disposed in the receiving groove. The enameled wire group abuts against the inner wall of the receiving groove and forms a plurality of bare wire gaps. The lead wire includes a plurality of bare conductors. The plurality of bare conductors are distributed in at least a portion of the bare wire gaps and abut against the inner wall of the enameled wire group or the receiving groove.

[0005] As a preferred technical solution for the crimp terminal structure, the enameled wire group includes multiple first enameled wires, which are arranged along the width direction of the terminal body, and a number of bare conductors are located above the multiple first enameled wires.

[0006] As a preferred technical solution for the crimp terminal structure, a gap is formed between the first enameled wire and the inner wall of the top of the receiving groove. The gap communicates with part of the bare wire gap to form a bare wire space, which is used to accommodate the bare wire.

[0007] As a preferred technical solution for the crimp terminal structure, the enameled wire group includes multiple rows of enameled wires, each row of enameled wires includes multiple first enameled wires, the multiple first enameled wires are arranged along the width direction of the terminal body, the multiple rows of enameled wires are arranged along the height direction of the terminal body, and a bare wire gap is formed between adjacent rows of enameled wires, and a number of bare wires are located between the multiple rows of enameled wires and above the top row of enameled wires.

[0008] As a preferred technical solution for the crimp terminal structure, a row of enameled wires at the top is spaced apart from the inner wall of the top and at least one side of the receiving groove and a gap is formed. The gap communicates with part of the bare wire gap and forms a bare wire space, which is used to accommodate the bare wire.

[0009] As a preferred technical solution for the crimp terminal structure, the enameled wire group includes a first wire group and a second wire group. The first wire group includes multiple first enameled wires, and the second wire group includes multiple second enameled wires. Both the multiple first enameled wires and the multiple second enameled wires are arranged along the width direction of the terminal body. The second wire group is located above the first wire group. The diameter of the second enameled wire is smaller than the diameter of the first enameled wire. A bare wire gap is formed between the second wire group and the first wire group. A plurality of bare conductors are located between the first wire group and the second wire group and above the second wire group.

[0010] As a preferred technical solution for the crimp terminal structure, the second wire group is spaced apart from the inner wall of the top and at least one side of the receiving groove and a gap is formed therein. The gap communicates with part of the bare wire gap and forms a bare wire space, which is used to accommodate the bare wire.

[0011] As a preferred technical solution for the crimp terminal structure, the sum of the cross-sectional areas of the multiple bare conductors of the lead wire is greater than the sum of the cross-sectional areas of the multiple conductor portions of the enameled wire group.

[0012] A crimping method for a crimp terminal structure, applicable to any of the above-mentioned crimp terminal structures, wherein the crimping method for the crimp terminal structure includes: Place the wire assembly into the receiving groove of the terminal body and seal the installation opening with a crimping opening; The terminal body is heated for a first preset time, and pressure is maintained on the terminal body.

[0013] As a preferred embodiment of the crimping method for the crimped terminal structure, the terminal body has a metal plating layer on one side forming the receiving groove, and after heating the terminal body for a first preset time, it further includes: After the terminal body has cooled for a second preset time, the pressure on the terminal body is removed.

[0014] The beneficial effects of this invention are as follows: This invention provides a crimp terminal structure in which a wire assembly is installed in a receiving groove through an installation opening. The installation opening is sealed by plastic deformation of the opening, and the enameled wire abuts against the inner wall of the receiving groove, forming a bare wire gap. The bare wire of the lead wire is squeezed into the bare wire gap and pressed against the inner wall of the enameled wire assembly or the receiving groove. During the hot pressing process, the insulating varnish of the multiple enameled wires of the enameled wire assembly vaporizes, realizing reliable conductivity between the enameled wire assembly, the lead wire, and the terminal body. This eliminates the need to pre-treat the insulating varnish of the enameled wire assembly, simplifying the process. A metal plating layer is formed on one side of the terminal body that forms a receiving groove. A molten conductive zone is formed at the conductive position between the enameled wire assembly and the terminal body. The metal plating layer within the molten conductive zone melts and flows to both sides of the molten conductive zone under the pressure of the enameled wire assembly. After hot pressing, the molten metal plating layer flows to both sides of the molten conductive zone and cools and solidifies, providing support for the corresponding enameled wire. This prevents the enameled wire from being loosely connected or disconnected from the terminal due to insufficient pressure during hot pressing, thus improving the reliability of the conductivity between the enameled wire and the terminal body. In addition, the bare wire that is pressed against the inner wall of the terminal body can be embedded in the molten metal plating layer, thereby increasing the adhesion between the metal plating layer and the terminal body, preventing the bare wire from breaking, further preventing loose connections or disconnection, and ensuring a good connection between the lead wire and the enameled wire. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the crimp terminal in the embodiment of the present invention during the crimping heating process; Figure 2 This is a schematic diagram showing the first enameled wire conducting with the terminal body in an embodiment of the present invention; Figure 3 This is a schematic diagram of the wire assembly assembled into the terminal body in Embodiment 1 of the present invention; Figure 4 This is a schematic diagram of the crimp terminal in Embodiment 1 of the present invention; Figure 5 This is a schematic diagram of the wire assembly assembled into the terminal body in Embodiment 2 of the present invention; Figure 6 This is a schematic diagram of the crimp terminal in Embodiment 2 of the present invention; Figure 7 This is a schematic diagram of the wire assembly assembled into the terminal body in Embodiment 3 of the present invention; Figure 8 This is a schematic diagram of the crimp terminal in Embodiment 3 of the present invention.

[0016] In the picture: 100. Upper heating head; 200. Lower heating head; 300. Cutting blade; 10. Terminal body; 101. Receiving groove; 102. Bare wire gap; 1. Terminal bottom; 2. Terminal side; 3. Terminal top; 31. First deformed part; 4. Overlapping part; 41. Second deformed part; 51. First enameled wire; 52. Second enameled wire; 53. Lead wire; 531. Bare conductor; 6. Metal plating; 61. Molten conductive area; 62. Solidified support area. Detailed Implementation

[0017] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Furthermore, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0019] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0020] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] Example 1 like Figures 1-4 As shown, this embodiment of the invention provides a crimp terminal structure, which includes a terminal body 10 and a wire assembly for connecting the stator winding of a motor to an external power supply. The terminal body 10 has a main body and an opening. The main body forms a receiving groove 101, and an installation opening is formed between the opening and the main body, communicating with the receiving groove 101. The opening can undergo plastic deformation relative to the main body and seal the installation opening. A metal plating layer 6 is provided on one side of the terminal body 10 forming the receiving groove 101. The wire assembly includes an enameled wire group and a lead wire 53. The enameled wire group is electrically connected to the external power supply through the lead wire 53. Both the enameled wire group and the lead wire 53 are disposed within the receiving groove 101. The enameled wire group abuts against the inner wall of the receiving groove 101, forming multiple bare wire gaps 102. The lead wire 53 includes a plurality of bare conductors 531, which are distributed within at least a portion of the bare wire gaps 102 and abut against the inner wall of the enameled wire assembly or the receiving groove 101. In this embodiment, the crimp terminal structure installs the conductor assembly into the receiving groove 101 through an installation opening. Plastic deformation of the opening seals the installation opening and causes the enameled wire to abut against the inner wall of the receiving groove 101, simultaneously forming bare wire gaps 102. The bare conductors 531 of the lead wire 53 are squeezed into these gaps and abut against the inner wall of the enameled wire assembly or the receiving groove 101. During the hot-pressing process, the insulating varnish of the multiple enameled wires in the enameled wire assembly vaporizes, achieving reliable conductivity between the enameled wire assembly, the lead wire 53, and the terminal body 10. This eliminates the need for pre-treatment of the insulating varnish of the enameled wire assembly, simplifying the process. A metal plating layer 6 is provided on one side of the terminal body 10 forming the receiving groove 101. A molten conductive area 61 is formed at the conductive position between the enameled wire assembly and the terminal body 10. The metal plating layer 6 in the molten conductive area 61 formed by the enameled wire assembly and the terminal body 10 melts and flows to both sides of the molten conductive area 61 under the pressure of the enameled wire assembly. After hot pressing, the molten metal plating layer 6 in the molten conductive area 61 flows to both sides of the molten conductive area 61 and cools and solidifies, providing support for the corresponding enameled wire. This prevents the enameled wire from being loosely connected or disconnected from the terminal due to low pressure during hot pressing, thus improving the reliability of the conduction between the enameled wire and the terminal body 10. In addition, the bare wire 531 of the lead wire 53, which is pressed against the inner wall of the terminal body 10, can be embedded in the molten metal plating layer 6. This increases the adhesion between the lead wire 531 and the terminal body 10 through the metal plating layer 6, preventing the bare wire 531 from breaking, further preventing loose connections or disconnection, and ensuring a good connection between the lead wire 53 and the enameled wire.

[0022] Specifically, such as Figure 1 , Figure 3 and Figure 4 As shown, the terminal body 10 includes a terminal bottom 1, a terminal top 3, an overlapping portion 4, a first deformable portion 31, a second deformable portion 41, and two terminal side portions 2. The terminal top 3 is connected to one of the terminal side portions 2 via the first deformable portion 31, and the overlapping portion 4 is connected to the other terminal side portion 2 via the second deformable portion 41. Both the first deformable portion 31 and the second deformable portion 41 are capable of plastic deformation, and both terminal side portions 2 are connected to the terminal bottom 1. That is, the main body in this embodiment includes the terminal bottom 1 and two terminal side portions 2, and the opening includes the terminal top 3, the overlapping portion 4, the first deformable portion 31, and the second deformable portion 41. The terminal top 3 and the overlapping portion 4 form an installation opening, and the first deformable portion 31 and the second deformable portion 41 undergo plastic deformation, causing the terminal top 3 and the overlapping portion 4 to seal the installation opening. The terminal bottom 1, the terminal top 3, the terminal overlapping portion 4, the first deformable portion 31, the second deformable portion 41, and the two terminal side portions 2 together form a receiving groove 101. In this embodiment, the receiving groove 101 is rectangular or square. In other embodiments, the receiving groove 101 may also be configured as a semi-circle, etc., as needed. By providing the first deformable portion 31 and the second deformable portion 41, the terminal body 10 has two states. The first state of the terminal body 10 is that the receiving groove 101 is connected to the outside through the mounting opening. In this state, the enameled wire assembly and the lead wire 53 are placed into the receiving groove 101 through the mounting opening between the terminal top 3 and the terminal overlap portion 4. The second state of the terminal body 10 is that the mounting opening is closed. In this state, the enameled wire assembly is pressed against and connected to the inner wall of the receiving groove 101. Simultaneously, the enameled wire assembly and the inner wall of the receiving groove 101 form multiple bare wire gaps 102 to fix the bare wire 531 and connect it to the bare wire 531. Please refer to... Figure 1 and Figure 3As shown, the initial state of the terminal body 10 in this embodiment is the first state. After installing the enameled wire assembly and the lead wire 53, the terminal body 10 with the wire assembly installed is placed in a hot pressing device. The bottom 1 of the terminal is placed under the lower hot pressing head 200, and the top 3 of the terminal is located below the upper hot pressing head 100. As the upper hot pressing head 100 presses down, the first deformation part 31 undergoes plastic deformation. The installation opening between the top 3 of the terminal and the overlapping part 4 gradually decreases until the top 3 of the terminal contacts the overlapping part 4. The upper hot pressing head 100 continues to press down, and the first deformation part 31 continues to undergo plastic deformation. At the same time, the top 3 of the terminal overlaps with the overlapping part 4 and moves downward. The second deformation part 41 undergoes plastic deformation at the same time until the top 3 of the terminal and the overlapping part 4 are pressed against the wire assembly in the receiving groove 101. The enameled wire assembly and the bare wire 531 are squeezed against each other under the action of the top 3 of the terminal and the overlapping part 4, and are pressed against the corresponding inner wall of the receiving groove 101. Finally, the upper heating head 100 and the lower heating head 200 simultaneously heat the terminal body 10, causing the insulation layer of the enameled wire assembly inside the terminal body 10 to vaporize, thus establishing electrical conductivity between the enameled wire assembly, the bare conductor 531, and the terminal body 10. After hot pressing, a cutting blade 300 mounted on the lower heating head 200 cuts off the enameled wire assembly and bare conductor 531 extending from one end of the terminal body 10, resulting in a smooth interface. The specific structure of the hot pressing equipment and the cutting blade 300 is prior art in this field and will not be described in detail here.

[0023] Furthermore, such as Figures 3-4 As shown, the enameled wire assembly includes multiple first enameled wires 51, which are arranged along the width of the terminal body 10. Several bare conductors 531 are located above the first enameled wires 51. After crimping, the bare conductors 531 are distributed in multiple bare wire gaps 102 formed by the first enameled wires 51 and the inner wall of the top of the receiving groove 101. This arrangement facilitates the installation of the enameled wire assembly and the lead wires 53. Simultaneously, during crimping, as the installation opening gradually decreases, the bare conductors 531 are gradually squeezed and moved into the corresponding bare wire gaps 102, avoiding excessive pressure in a short time and reducing the risk of wire breakage.

[0024] Specifically, such as Figure 4 As shown, after crimping, a gap is formed between the first enameled wire 51 and the inner wall of the top of the receiving groove 101. The gap is connected to a portion of the bare wire gap 102 to form a bare wire space. The bare wire space is continuous along the width direction of the receiving groove 101 and is used to accommodate the bare wire 531, thereby avoiding the bare wire 531 that has not moved to the corresponding bare wire gap 102 in time due to excessive extrusion pressure being crushed.

[0025] Optionally, the metal plating 6 includes a tin plating, a nickel plating, or a copper plating, etc. The bare conductor 531 is a copper conductor, the terminal body 10 is a copper component, and the inner core of the enameled wire assembly is a copper core. The melting point of the metal plating 6 is lower than that of the terminal body 10. During the hot pressing process, the enameled wire assembly and the bare conductor 531 conduct heat from the hot pressing equipment to the metal plating 6 in the melting conductive zone 61, thereby melting the metal plating 6. Under the pressure of the enameled wire assembly, it flows to the solidification support zone 62 outside the melting conductive zone 61. After flowing to the solidification support zone 62, the metal plating 6 in the melting conductive zone 61 accumulates and cools and solidifies, simultaneously solidifying on the terminal body 10 and the enameled wire assembly. This forms a support near the conductive position between the enameled wire assembly and the terminal body 10, thereby reducing the probability of a loose connection or disconnection between the enameled wire assembly and the terminal, and improving the reliability of the conductivity between the enameled wire assembly and the terminal body 10. Meanwhile, the bare wire 531 near the inner wall of the receiving groove 101 can be partially embedded in the molten metal plating layer 6, which strengthens the adhesion with the terminal body 10 and can also release the stress during the crimping process to a certain extent, avoiding stress damage that could lead to wire breakage or loosening.

[0026] Optionally, the sum of the cross-sectional areas of the multiple bare conductors 531 of the lead wire 53 is greater than the sum of the cross-sectional areas of the multiple conductor portions of the enameled wire group, so that the current density of the lead wire 53 can also meet the requirements while the enameled wire group meets the current density requirements during motor operation.

[0027] Furthermore, such as Figure 3 and Figure 4 As shown, the bottom 1 of the terminal can undergo plastic deformation, and the top 3 of the terminal can overlap the side of the overlapping portion 4 away from the receiving groove 101, so that the overlapping portion 4 occupies the space inside the receiving groove 101, further strengthening the pressure on the wire assembly, while avoiding excessive pressure on the wire assembly that could cause some enameled wire or bare wire 531 to break. The sum of the width of the overlapping portion 4 and the width of the top 3 of the terminal is greater than the width of the bottom 1 of the terminal, thereby ensuring that there is a certain overlap width between the top 3 of the terminal and the overlapping portion 4. This avoids the re-creation of gaps between the top 3 of the terminal and the overlapping portion 4 due to springback after hot pressing. In the first state of the terminal body 10, the bottom 1 of the terminal is arc-shaped so that the enameled wire group can be relatively evenly arranged in the receiving groove 101, while several bare wires 531 of the lead wire 53 are evenly distributed above the enameled wire group. In the second state of the terminal body 10, the bottom 1 of the terminal undergoes plastic deformation and is set flat. During this process, since multiple enameled wires are relatively evenly arranged and several bare conductors 531 are evenly spread above the enameled wire group, the stress difference of each enameled wire during the crimping process is not significant. This also avoids excessive stress on the bare conductors 531 in local areas, which could lead to wire breakage. This also avoids one or several enameled wires from breaking or significantly reducing their diameter due to excessive stress.

[0028] This invention provides a crimping method for a crimp terminal structure, applied to the crimp terminal structure in this embodiment. The crimping method for the crimp terminal structure includes: Place the wire assembly into the receiving groove 101 of the terminal body 10, and press the opening to seal the installation opening; The terminal body 10 is heated for a first preset time, and pressure is maintained on the terminal body 10.

[0029] Specifically, during the crimping process of the crimp terminal structure in this embodiment, the corresponding number of enameled wires and lead wires 53 are first placed in the receiving groove 101 of the terminal body 10 in a certain order according to requirements. Then, the upper hot pressing head 100 of the hot pressing equipment moves down to crimp the top 3 of the terminal with the opening, causing the first deformable part 31 to undergo plastic deformation. At the same time, the installation opening is reduced. Then, the top 3 of the terminal contacts the overlapping part 4. As the upper hot pressing head 100 continues to move down, both the first deformable part 31 and the second deformable part 41 undergo plastic deformation until the installation opening is blocked. At this time, the enameled wires, lead wires 53 and the inner wall of the receiving groove 101 are squeezed against each other. At this time, the upper hot pressing head 100 and / or the lower hot pressing head 200 heat the terminal body 10 and continue for a first preset time. The first preset time is determined according to actual needs and is not specifically limited here. While maintaining pressure on the terminal body 10, the insulating varnish of the enameled wire vaporizes, and the metal plating 6 softens or melts. At the same time, the enameled wire, the lead wire 53 and the terminal body 10 become conductive. Meanwhile, the softened or melted part of the metal plating 6 flows to the edge of the conductive position of the enameled wire under the pressure of the enameled wire, that is, the solidification support area 62. Under the action of pressure, the bare conductor 531 of the lead wire 53 is partially embedded in the metal plating 6, increasing the contact area and adhesion with the terminal body 10. At the same time, it also releases the compressive stress of the lead wire 53 to a certain extent and reduces the risk of wire breakage.

[0030] Furthermore, after heating the terminal body 10 for a first preset time, heating the terminal body 10 is stopped. After the terminal body 10 cools for a second preset time, the pressure on the terminal body 10 is removed. The cooling of the terminal body 10 can be achieved through natural air cooling or air blowing. The second preset time is determined according to actual needs and is not specifically limited here. After the terminal body 10 cools for the second preset time, the metal plating 6 flowing to the solidification support area 62 simultaneously solidifies on the enameled wire and the terminal body 10, forming a support near the conduction position between the enameled wire assembly and the terminal body 10, thereby reducing the probability of a loose connection or disconnection between the enameled wire assembly and the terminal, and improving the reliability of the conduction between the enameled wire assembly and the terminal body 10. At the same time, the bare wire 531 embedded in the metal plating 6 is integrated with the terminal body 10 as the metal plating 6 re-solidifies. During this process, pressure is maintained on the terminal body 10 to prevent springback deformation during cooling.

[0031] This invention provides a motor, including the crimp terminal structure or crimping method described in this embodiment. By setting the crimp terminal structure or applying the crimping method described in this embodiment, the performance and reliability of the motor are improved.

[0032] Example 2 To avoid repetitive description, this embodiment will only describe the differences from Embodiment 1. The difference between this embodiment and Embodiment 1 is that the enameled wire group in this embodiment is different from the enameled wire group in Embodiment 1.

[0033] like Figures 5-6 As shown, in this embodiment, the enameled wire assembly includes multiple rows of enameled wires, each row including multiple first enameled wires 51. The multiple first enameled wires 51 are arranged along the width direction of the terminal body 10, the multiple rows of enameled wires are arranged along the width direction of the terminal body 10, and the multiple rows of enameled wires are arranged along the height direction of the terminal body 10. Bare wire gaps 102 are formed between adjacent rows of enameled wires. Several bare wires 531 are located between the multiple rows of enameled wires and above the top row of enameled wires. After crimping, the several bare wires 531 are distributed in the multiple bare wire gaps 102 formed by adjacent rows of first enameled wires 51 and in the multiple bare wire gaps 102 formed by the top row of first enameled wires 51 and the inner wall of the top of the receiving groove 101. After crimping, gaps may exist between the first enameled wires 51 located outside the bottom, depending on the distribution of the bare conductors 531. This allows the bare conductors 531 to enter the bare wire gaps 102 formed by two adjacent rows of first enameled wires 51, ensuring a more uniform distribution of the bare conductors 531 within the receiving groove 101 while meeting conductivity requirements. This arrangement facilitates the installation of the enameled wire group and the lead wires 53. Furthermore, during crimping, as the installation opening gradually decreases, the bare conductors 531 are gradually squeezed and moved into the corresponding bare wire gaps 102, avoiding excessive pressure in a short period and reducing the risk of wire breakage.

[0034] Specifically, such as Figure 6 As shown, after crimping, the first row of enameled wires 51 at the top is spaced apart from the inner wall of the top and at least one side of the receiving groove 101, forming a gap. The gap communicates with the bare wire gap 102 to form a bare wire space. The bare wire space is continuous along the width direction of the receiving groove 101 and is used to accommodate the bare wire 531, thereby avoiding the bare wire 531 that has not moved to the corresponding bare wire gap 102 in time due to excessive extrusion pressure being crushed.

[0035] Specifically, in this embodiment, there are 8 first enameled wires 51, with 4 first enameled wires 51 arranged in a row. The two rows of first enameled wires 51 are staggered. There are gaps between the multiple first enameled wires 51 in the upper row. There are gaps between the upper row of first enameled wires 51 and the top and side inner wall of the receiving groove 101. Thus, several bare conductors 531 are arranged around the multiple first enameled wires 51 in the upper row, which is more evenly distributed and has a larger contact area with the enameled wires and the terminal body 10.

[0036] Example 3 To avoid repetitive description, this embodiment will only describe the differences from Embodiment 1. The difference between this embodiment and Embodiment 1 is that the enameled wire group in this embodiment is different from the enameled wire group in Embodiment 1.

[0037] like Figures 7-8 As shown, in this embodiment, the enameled wire assembly includes a first wire assembly and a second wire assembly. The first wire assembly includes multiple first enameled wires 51, and the second wire assembly includes multiple second enameled wires 52. Both the multiple first enameled wires 51 and the multiple second enameled wires 52 are arranged along the width direction of the terminal body 10. The second wire assembly is located above the first wire assembly, and the diameter of the second enameled wires 52 is smaller than the diameter of the first enameled wires 51. A bare wire gap 102 is formed between the second wire assembly and the first wire assembly. Adjacent second enameled wires 52 are spaced apart along the width direction of the receiving groove 101. A plurality of bare conductors 531 are located between the first wire assembly and the second wire assembly, and above the second wire assembly. After crimping, the plurality of bare conductors 531 are distributed in the plurality of bare wire gaps 102 between the first wire assembly and the second wire assembly, and in the plurality of bare wire gaps 102 formed between the second wire assembly and the inner wall of the top of the receiving groove 101. The adjacent second enameled wires 52 of the second wire group are spaced apart to facilitate the entry of bare wires 531 into the bare wire gaps 102 formed by the first and second wire groups. This ensures that the bare wires 531 are distributed more evenly within the receiving groove 101 while meeting conductivity requirements. This arrangement facilitates the installation of the enameled wire groups and the lead wires 53. Furthermore, during the crimping process, as the installation opening gradually decreases, several bare wires 531 are gradually squeezed and moved into the corresponding bare wire gaps 102, avoiding excessive pressure in a short period and reducing the risk of wire breakage.

[0038] Specifically, such as Figure 8 As shown, after crimping, the second enameled wire 52 of the second wire group is spaced apart from the inner wall of the top and at least one side of the receiving groove 101, forming a gap. The gap communicates with the bare wire gap 102 to form a bare wire space. The bare wire space is continuous along the width direction of the receiving groove 101 and is used to accommodate the bare wire 531, thereby avoiding the bare wire 531 that has not moved to the corresponding bare wire gap 102 in time due to excessive extrusion pressure being crushed.

[0039] In this embodiment, the number of the first enameled wire 51 and the second enameled wire 52 is four. In other embodiments, the number of the first enameled wire 51 and the second enameled wire 52 can be adjusted as needed, for example, the number of the first enameled wire 51 and the second enameled wire 52 can be set to three.

[0040] The above description is merely a preferred embodiment of the present invention and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of disclosure in this invention is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the above-disclosed concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this invention.

[0041] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A crimp terminal structure, characterized in that, include: The terminal body (10) is provided with a main body and an opening. The main body forms a receiving groove (101). An installation opening is formed between the opening and the main body. The installation opening communicates with the receiving groove (101). The opening can undergo plastic deformation relative to the main body and block the installation opening. A metal plating layer (6) is provided on one side of the terminal body (10) forming the receiving groove (101). The conductor assembly includes an enameled wire group and a lead wire (53). The enameled wire group and the lead wire (53) are both disposed in the receiving groove (101). The enameled wire group abuts against the inner wall of the receiving groove (101) and forms a plurality of bare wire gaps (102). The lead wire (53) includes a plurality of bare conductors (531). The plurality of bare conductors (531) are distributed in at least a portion of the bare wire gaps (102) and abut against the enameled wire group or the inner wall of the receiving groove (101).

2. The crimp terminal structure according to claim 1, characterized in that, The enameled wire assembly includes multiple first enameled wires (51), which are arranged along the width direction of the terminal body (10), and a plurality of bare conductors (531) are located above the multiple first enameled wires (51).

3. The crimp terminal structure according to claim 2, characterized in that, A gap is formed between the first enameled wire (51) and the inner wall of the top of the receiving groove (101). The gap communicates with part of the bare wire gap (102) to form a bare wire space, which is used to accommodate the bare conductor (531).

4. The crimp terminal structure according to claim 1, characterized in that, The enameled wire assembly includes multiple rows of enameled wires, each row of enameled wires including multiple first enameled wires (51), the multiple first enameled wires (51) are arranged along the width direction of the terminal body (10), the multiple rows of enameled wires are arranged along the height direction of the terminal body (10), and a bare wire gap (102) is formed between adjacent rows of enameled wires. Several bare conductors (531) are located between the multiple rows of enameled wires and above the top row of enameled wires.

5. The crimp terminal structure according to claim 4, characterized in that, A row of enameled wires located at the top is spaced apart from the inner wall of the top and at least one side of the receiving groove (101) and forms a gap. The gap communicates with part of the bare wire gap (102) and forms a bare wire space for accommodating the bare conductor (531).

6. The crimp terminal structure according to claim 1, characterized in that, The enameled wire group includes a first wire group and a second wire group. The first wire group includes multiple first enameled wires (51), and the second wire group includes multiple second enameled wires (52). The multiple first enameled wires (51) and the multiple second enameled wires (52) are arranged along the width direction of the terminal body (10). The second wire group is located above the first wire group. The diameter of the second enameled wires (52) is smaller than the diameter of the first enameled wires (51). A bare wire gap (102) is formed between the second wire group and the first wire group. A plurality of bare conductors (531) are located between the first wire group and the second wire group and above the second wire group.

7. The crimp terminal structure according to claim 6, characterized in that, The second wire group is spaced apart from the inner wall of the top and at least one side of the receiving groove (101) and a gap is formed therein. The gap communicates with part of the bare wire gap (102) and forms a bare wire space for accommodating the bare wire (531).

8. The crimp terminal structure according to any one of claims 1-7, characterized in that, The sum of the cross-sectional areas of the multiple bare conductors (531) of the lead wire (53) is greater than the sum of the cross-sectional areas of the multiple conductor portions of the enameled wire group.

9. A crimping method for a crimp terminal structure, characterized in that, The crimping terminal structure described in any one of claims 1-8 is applied, wherein the crimping method of the crimping terminal structure comprises: Place the wire assembly into the receiving groove (101) of the terminal body (10), and press the opening to seal the installation opening; The terminal body (10) is heated for a first preset time and pressure is maintained on the terminal body (10).

10. The crimping method for the crimp terminal structure according to claim 9, characterized in that, After heating the terminal body (10) for a first preset time, it also includes: After the terminal body (10) has cooled for a second preset time, the pressure on the terminal body (10) is removed.

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