Ground ring, semiconductor device, and method for disassembling the same

Abstract

The application discloses a grounding ring, a semiconductor device and a dismounting method thereof, and relates to the technical field of semiconductor devices. The grounding ring is arranged below a chuck of the semiconductor device. The grounding ring comprises at least two grounding sections which are arranged separately and detachably connected with the chuck so that the grounding sections can be taken out from a window of a side wall of a cavity shell of the semiconductor device after being dismounted, and the grounding sections are arranged along a periphery of the chuck, and one end of one of the two adjacent grounding sections is connected with one end of the other of the two adjacent grounding sections along a circumferential direction of the grounding ring. When the grounding ring needs to be maintained, the grounding sections dismounted from the chuck can be removed from the semiconductor device through the window, and the maintenance efficiency of the grounding ring is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a grounding ring, a semiconductor device, and a method for disassembling the same. Background Technology

[0002] Semiconductor equipment is used in the semiconductor manufacturing process to perform processes such as etching, thin film deposition, and ion implantation. Its performance directly determines the chip manufacturing precision and yield. As process complexity increases, semiconductor equipment needs to operate continuously for extended periods. The maintenance efficiency of semiconductor equipment directly impacts capacity utilization and operating costs; for example, every hour of extended downtime can result in significant capacity loss. Currently, the mean time to repair (MTTR) of semiconductor equipment occupies a long production cycle, which is particularly disadvantageous in the semiconductor wafer manufacturing environment.

[0003] Therefore, how to solve the problem of low maintenance efficiency of existing semiconductor equipment is an urgent problem to be solved by those skilled in the art. Summary of the Invention

[0004] This application discloses a grounding ring, a semiconductor device, and a method for disassembling the same, which addresses the problem of low maintenance efficiency of semiconductor devices.

[0005] In a first aspect, one embodiment of this application provides a grounding ring for use in a chuck of a semiconductor device. The grounding ring includes at least two separable grounding segments, which are detachably connected to the chuck so that they can be removed from a window in the side wall of the semiconductor device housing after disassembly. The grounding segments are arranged along the periphery of the chuck, and one end of one of two adjacent grounding segments is connected to one end of the other of the two adjacent grounding segments circumferentially to the grounding ring.

[0006] On the one hand, traditional methods require opening one end of the semiconductor equipment along its height, i.e., opening the cavity cover, and then using lifting fixtures to remove various components (such as adapters, process kits, etc.) located above the grounding ring before the grounding ring can be disassembled and maintained. This application allows for the installation and removal of the grounding section through a side window of the cavity shell, eliminating the need for lifting fixtures to remove the various components above the grounding ring, thus improving the maintenance efficiency of the grounding ring and consequently the maintenance efficiency of the semiconductor equipment. Furthermore, this application does not increase the internal maintenance space of the semiconductor equipment cavity, does not affect the stability of the internal processes of the semiconductor equipment, and meets the high maintenance space requirements of semiconductor equipment.

[0007] On the other hand, this application also improves the maintenance efficiency of the chuck, especially in scenarios where there is interference between the adapter and the grounding section. If there is interference between the adapter and the grounding section, the adapter must be removed before the chuck can be maintained, as the grounding section is located on the chuck. Removing the adapter requires multiple people and hoisting equipment. With this application, after removing the grounding section from the chuck through a window, since there is generally no interference between the adapter and the chuck, the adapter does not need to be removed; the chuck can be disassembled directly through the port on the second end of the adapter. Because chuck maintenance can be performed without removing the adapter, the steps for disassembling and assembling the chuck are simplified, and a single person can operate it, improving the maintenance efficiency of semiconductor equipment chucks, reducing maintenance costs, and increasing equipment uptime. Furthermore, since removing the adapter and hoisting it requires workers to crawl into the semiconductor equipment, posing a safety risk, this application also helps to reduce maintenance safety risks.

[0008] In one possible implementation, the grounding section includes a first connection portion and a second connection portion. The first connection portion is located on the side of the grounding section closer to the center of the grounding ring. The thickness of the first connection portion is greater than the thickness of the second connection portion. The first connection portion is used for detachable connection with the chuck.

[0009] In this possible implementation, the thickness of the first connecting part is greater than the thickness of the second connecting part, which helps to improve the strength of the first connecting part and also improves the connection stability between the first connecting part and the chuck. In addition, since the thickness of the second connecting part is greater than the thickness of the first connecting part, it is easier for the user to see the first connecting part through the window, thus improving the convenience of the user in assembling and disassembling the first connecting part.

[0010] In one possible implementation, the grounding ring further includes a heightening element, which is annular and both the heightening element and the grounding segment are made of conductive material. The heightening element and the grounding segment are stacked in the height direction of the grounding segment. The heightening element is used to connect with the chuck. When the grounding ring is installed on the chuck, the heightening element is located between the chuck and the grounding segment in the height direction of the grounding segment.

[0011] In this possible implementation, if the height in the vertical direction is insufficient, an extension member can be added to the grounding ring to increase its height, allowing the user to see the grounding section through a window. The extension member is made of the same material as the grounding section and therefore also has grounding functionality.

[0012] In one possible implementation, the grounding ring further includes at least one lug for connection to a chuck, wherein at least a portion of each lug is located on the side of at least one grounding segment opposite to the chuck in the height direction of the grounding segment, and the lug is used to support the grounding segment after it has been removed from the chuck to limit separation of the grounding segment from the lug.

[0013] In this possible implementation, since at least a portion of the grounding segment is located on the side of the grounding segment away from the chuck in the height direction, after the grounding segment is removed from the chuck, the lug can provide support for the grounding segment in the height direction, reducing the possibility of the grounding segment falling onto other components inside the semiconductor device.

[0014] In one possible implementation, the lug includes a first part and a second part for connection, the first part for connection with a chuck, at least a portion of a grounding section located between the chuck and the second part, the first part, the second part, and the chuck forming an opening that is disposed away from the center of the grounding ring.

[0015] In this possible implementation, the opening is positioned away from the center of the grounding ring, i.e., the opening faces the sidewall. The grounding segment can be directly removed from the opening in the radial direction of the grounding ring from the first part toward the sidewall, which saves time and effort and improves the disassembly efficiency of the grounding segment.

[0016] In one possible implementation, the outer surface of the grounding section is provided with a positioning opening, the shape of which matches the shape of the ear, and at least a portion of the ear is received within the positioning opening.

[0017] In this possible implementation, the shape of the positioning port matches the shape of the lug, thus the positioning port can be used to position and limit the lug. When the grounding segment needs to be assembled to the chuck, at least a portion of the lug can be placed into the positioning port of the grounding segment first, achieving pre-assembly of the grounding segment to the lug. This improves the assembly accuracy between the grounding segment and the chuck, and also enhances the user's ease of operation in connecting the grounding segment to the chuck. Furthermore, since the inner wall of the positioning port limits the lug, the positional stability between the grounding segment and the chuck is improved.

[0018] In one possible implementation, the grounding ring further includes at least one retaining member, which is a captive screw, and the grounding section is detachably connected to the chuck via the at least one retaining member. When the grounding section is separated from the riser, the retaining member is connected to the grounding section containing the retaining member.

[0019] In this possible implementation, since the fixing member can be a non-removable screw, the fixing member will not fall off the grounding section after the connection between the grounding section and the raising member is released, which facilitates the disassembly between the grounding section and the chuck.

[0020] In one possible implementation, the fastener includes a sheath and a screw body, the sheath being fixed to the grounding section. The screw body includes a nut and a screw shank, the nut being located on the side of the grounding section opposite to the riser, the outer diameter of the nut being larger than the inner diameter of the sheath, the screw shank including a first shank portion and a second shank portion, the first shank portion being located between the nut and the second shank portion and passing through the sheath, the diameter of the second shank portion being larger than the inner diameter of the sheath, the sheath being located between the nut and the second shank portion, and the second shank portion being connected to a chuck.

[0021] In this possible implementation, since the sheath is fixed to the grounding section, the outer diameter of the nut and the diameter of the second rod are larger than the inner diameter of the sheath. This means the fastener can be pre-installed on the grounding section through the sheath, facilitating the connection between the grounding section and the extension member. When the second rod is separated from the extension member, because the inner diameter of the sheath is smaller than the diameter of the second rod, the screw body cannot detach from the sheath, ensuring the fastener remains connected to its grounding section and does not fall into the semiconductor device.

[0022] Secondly, one embodiment of this application provides a semiconductor device, which includes a cavity, a chuck, and a grounding ring according to the first aspect. The cavity has a window on its side wall. The chuck is housed in the cavity and is used to carry a wafer. The grounding ring is disposed on the chuck, and a grounding section is detachably connected to the chuck, the grounding section being disposed along the periphery of the chuck.

[0023] The semiconductor device provided in this application includes a grounding ring comprising at least two separable grounding segments. Due to the small size of these grounding segments, access is convenient via a window. When maintenance of the grounding ring is required, the grounding segments can be removed from the chuck through the window, and then the cavity housing can be moved out through the window. The repaired or new grounding segment can then be installed back into the chuck through the window, thus enabling maintenance of the grounding ring from the side of the semiconductor device. Since it eliminates the need to open one end of the semiconductor device in the vertical direction or for personnel to crawl inside, the maintenance process for the grounding ring is simplified, improving maintenance efficiency and reducing maintenance safety risks.

[0024] In one possible implementation, the grounding segment includes an arc structure, the diameter of the grounding ring is greater than the length of the window, and the chord length of each grounding segment is less than the length of the window, the length direction of the window being perpendicular to the height direction of the semiconductor device.

[0025] In one possible implementation, since the chord length of the grounding segment is less than the length of the window, after the grounding segment is removed from the chuck, there is no need to significantly adjust the placement direction of the grounding segment, which helps to further improve the disassembly efficiency of the grounding ring.

[0026] In one possible implementation, at least a portion of the orthographic projection of the grounding ring onto the sidewall can be located within the window.

[0027] In this possible implementation, since at least a portion of the orthographic projection of the grounding ring onto the side wall is located in the window, the grounding ring is easily visible to the user through the window, thus improving the user's operational convenience.

[0028] In one possible implementation, the semiconductor device further includes an adapter, a cavity cover, and a process lamp. A first end of the adapter is connected to the cavity cover in the height direction of the semiconductor device. The inner wall of the first end of the adapter has a reflective surface extending circumferentially along the adapter, surrounding the chuck. The cavity cover is used to cover a second end of the adapter. The process lamp is disposed within the adapter and is used to provide thermal radiation to the wafer supported by the chuck; the reflective surface reflects this thermal radiation. A grounding section is located below the adapter, and at least a portion of the grounding section's orthographic projection along the height direction of the semiconductor device lies on the reflective surface.

[0029] The grounding section is located below the adapter, meaning that the grounding section is located on the side of the adapter's first terminal away from the second terminal.

[0030] The adapter has a reflective surface arranged around the chuck, which helps to fully reflect heat radiation, reduce energy loss, and thus improve process efficiency.

[0031] Specifically, the inventors discovered that when depositing metal (e.g., copper) in trenches or vias of a wafer, if the trench or via size is very small, for example, less than 5 nm, voids can easily form within the metal, leading to increased resistance of the deposited metal. Using the semiconductor equipment of this application, after metal is deposited on the wafer, the wafer is heated by a process lamp to melt the metal. The molten metal is then reflowed into the trenches or vias. Through repeated metal deposition and reflow, void-free metal deposition within the trenches or vias is ultimately achieved, reducing resistance. The reflective surface can reflect some of the heat radiation back to the wafer, accelerating the wafer's heating rate and thus improving process efficiency.

[0032] However, since the portion of the grounding segment projected along the height direction of the semiconductor device is located on the reflective surface of the adapter, interference exists between the grounding segment and the first end of the adapter. Therefore, the grounding segment is not easily removed directly along the height direction of the semiconductor device. In related technologies, if there is interference between the grounding ring and the adapter, multiple components such as the adapter must be removed before the grounding segment can be removed. This application eliminates the need to remove multiple components such as the adapter first, allowing the grounding segment to be removed directly from the window on the side wall, which is beneficial to improving the maintenance efficiency of the grounding segment.

[0033] When maintaining the chuck, after disconnecting the grounding section from the chuck through the window, there is no interference between the adapter and the chuck. Therefore, it is not necessary to remove the adapter; the chuck can be directly disassembled through the port on the second end of the adapter. Since chuck maintenance can be performed without removing the adapter, the steps for disassembling and assembling the chuck are simplified, improving the maintenance efficiency of semiconductor equipment chucks. Secondly, since there is no need to remove the adapter, lifting fixtures are not required, and multiple people are not needed for operation; a single person can perform the operation, reducing maintenance labor costs and increasing equipment uptime. Finally, since removing and lifting the adapter requires personnel to crawl into the semiconductor equipment, posing a safety risk, this application also helps to reduce maintenance safety risks.

[0034] In one possible implementation, the semiconductor device further includes a lift structure connected to the cavity housing. The lift structure is vertically and movably mounted through a chuck and supports a wafer such that there is a gap between the wafer and the side of the chuck facing the cavity cover when thermal radiation is emitted by the process lamps. At least a portion of the orthographic projection of the lift structure along a first direction is located at a window, the first direction being perpendicular to the height direction of the semiconductor device.

[0035] In this possible implementation, when the process lamp emits heat radiation, there is a gap between the wafer and the side of the chuck facing the cavity cover; that is, the side of the wafer facing the chuck is not covered by the chuck. When the process lamp emits heat radiation, the heat radiation can effectively cover the entire side of the wafer facing the chuck, which helps to increase the area of ​​the wafer exposed to heat radiation and accelerate the wafer's heating rate. The portion of the lifting structure projected along the first direction is located in the window, allowing the user to directly see the lifting structure through the window, facilitating maintenance of the lifting structure.

[0036] In one possible implementation, the semiconductor device further includes a baking lamp disposed within a cavity housing for heating the cavity housing. At least a portion of the orthographic projection of the baking lamp along a first direction is located at a window, the first direction being perpendicular to the height direction of the semiconductor device.

[0037] In this possible implementation, the baking lamp is used to heat the cavity housing to maintain the temperature of the chamber enclosed by the cavity housing, adapter, and cavity cover, thereby improving semiconductor process efficiency. At least a portion of the orthographic projection of the baking lamp along the first direction is located in the window, allowing the user to directly see the baking lamp through the window for convenient maintenance.

[0038] In one possible implementation, the semiconductor device further includes a cooling conduit, at least a portion of which is disposed on the outer surface of the cavity housing, with portions of the cooling conduit disposed along the periphery of the window.

[0039] In this possible implementation, the cooling pipes are used to circulate the cooling medium to dissipate heat from the cavity enclosed by the housing, adapter, cavity cover, etc., thereby improving the stability of the semiconductor process.

[0040] For the beneficial effects of features not described below, please refer to the description of the beneficial effects of the corresponding features in the first or second aspect, which will not be repeated here.

[0041] Thirdly, one embodiment of this application also provides a method for disassembling a semiconductor device, applicable to the semiconductor device as described in the second aspect. The disassembly method includes: Disconnect the grounding section from the chuck; The grounding section, after being separated from the chuck, is removed from the cavity through the window.

[0042] In one possible implementation, the semiconductor device further includes an adapter, a cavity cover, and a process lamp. A first end of the adapter is connected to the cavity cover in the height direction of the semiconductor device. The inner wall of the first end of the adapter has a reflective surface extending circumferentially around the chuck. The cavity cover is disposed on a second end of the adapter. The process lamp is disposed on the adapter and is used to provide thermal radiation to the wafer supported by the chuck; the reflective surface reflects the thermal radiation. A grounding section is located below the adapter facing the cavity cover, and at least a portion of the grounding section's orthographic projection along the height direction of the semiconductor device is located on the reflective surface. The disassembly method further includes: Open the cavity cover to expose the port at the second end; After opening the cavity cover and removing the grounding section separated from the chuck through the window from the cavity shell, the disassembly method also includes: removing the chuck and removing it through the port at the second end.

[0043] In one possible implementation, the disassembly method further includes: disassembling the baking lamp disposed inside the cavity through a window, and removing the baking lamp from the cavity through the window.

[0044] In one possible implementation, the disassembly method further includes: disassembling the lifting structure located inside the cavity through a window, and removing the lifting structure from the cavity through the window. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a three-dimensional schematic diagram of a semiconductor device provided in one embodiment of this application.

[0047] Figure 2A This is a partial structural schematic diagram of a semiconductor device provided in one embodiment of this application.

[0048] Figure 2B for Figure 2A The diagram shows an exploded three-dimensional view of the semiconductor device.

[0049] Figure 3 For along Figure 2A The cross-sectional view obtained from line II shows the semiconductor device without a cover plate and cooling pipes.

[0050] Figure 4 for Figure 2A The side view of the semiconductor device shown.

[0051] Figure 5 This is a three-dimensional schematic diagram of the chuck and grounding ring assembled together.

[0052] Figure 6 This is a three-dimensional exploded view of part of the structure of the chuck and grounding ring.

[0053] Figure 7 This is a schematic diagram of a semiconductor processing system provided in one embodiment of this application.

[0054] Figure 8 This is a planar schematic diagram of part of the grounding ring structure.

[0055] Figure 9 This is a side view of the chuck and grounding ring assembled together.

[0056] Figure 10 for Figure 9 A sectional view of a local area II.

[0057] Figure 11A A cross-sectional view showing the fastener passing through the grounding section and assembled together with the heightening component.

[0058] Figure 11B A cross-sectional view of the fastener passing through the grounding section and detached from the heightening member.

[0059] Figure 12 A flowchart of a method for disassembling a semiconductor device provided in one embodiment of this application.

[0060] Figure 13 A three-dimensional schematic diagram showing the second end port exposed when the cavity cover is opened.

[0061] Figure 14 A schematic diagram illustrating the removal of the insulating ring and process kit from the cavity and adapter via the port.

[0062] Figure 15This provides users with a cross-sectional view of the fastener through a window.

[0063] Figure 16 This is a schematic diagram showing the grounding section, after being separated from the chuck, being removed from the cavity shell through a window.

[0064] Figure 17 This is a schematic diagram showing how the user separates the grounding section from the mounting lug.

[0065] Figure 18 This is a schematic diagram of removing the chuck from the adapter and cavity housing via the port.

[0066] Figure 19 This is a cross-sectional schematic diagram of the chuck being removed from the adapter and housing via the port.

[0067] Explanation of reference numerals in the attached figures: 100 - Semiconductor equipment; 11-Cavity shell; 111 - Window; 12-Adapter; 121 - Reflective surface; 13-Cavity cover; 14-Cover plate; 15-Drive shaft; 31-Chuck; 311 - First surface; 312 - Second surface; 32-Grounding ring; 321 - Grounding section; 3211 - First connecting part; 3212 - Second connecting part; 3213 - Positioning port; 323 - Heightening component; 324 - Ear loops; 3241 - Part One; 3242 - Part Two; 325 - Fastener; 3251 - Sheath; 3252 - Screw body; 32521 - Nut; 32522 - Screw; 325221 - First section of the club; 325222 - Second section of the club; 41 - Insulating ring; 42-Craft Kit; 43-Craft lamps; 44-Baking lamp; 45 - Lifting structure; 46 - Cooling piping; Z - Height direction; X - First direction; Y - Second direction; 200-Wafer; 300 - Operation bit. Detailed Implementation

[0068] Example 1 Please see Figure 1 This application provides a semiconductor device 100 according to one embodiment. The semiconductor device 100 is an apparatus used in the semiconductor manufacturing process to perform processes such as etching, thin film deposition, or ion implantation. The semiconductor device 100 can be a deposition apparatus, an etching apparatus, an epitaxial apparatus, etc. This application takes a deposition apparatus as an example. The deposition apparatus can be a thin film deposition apparatus. The thin film deposition apparatus can be a physical vapor deposition (PVD) apparatus, a chemical vapor deposition (CVD) apparatus, a plasma-enhanced chemical vapor deposition (PECVD) apparatus, or a plasma-enhanced atomic layer deposition (PEALD) apparatus, etc.

[0069] Please see Figure 2A and Figure 2B The semiconductor device 100 includes a housing 11, a chuck 31, and a grounding ring 32.

[0070] The cavity housing 11 has a window 111 on its side wall, which is used to facilitate user maintenance of the components inside the semiconductor device 100. The number of windows 111 is exemplary, but this application does not limit the number of windows 111. This application does not limit the shape of the windows 111; exemplaryly, the windows 111 may be generally rectangular.

[0071] The chuck 31 can be housed within the cavity 11. The chuck 31 is used to carry the wafer 200. In this embodiment, the chuck 31 is supported by a drive shaft 15, which drives the movement of the chuck 31. Please refer to... Figure 3 The chuck 31 includes a first surface 311 and a second surface 312 in the height direction Z of the semiconductor device 100. The second surface 312 can be connected to the drive shaft 15. The first surface 311 is the side of the chuck 31 that is away from the drive shaft.

[0072] Please refer to the following: Figure 1 , Figure 2A , Figure 2B and Figure 3The semiconductor device 100 may further include an adapter 12 and a cavity cover 13. The first end of the adapter 12 is connected to the cavity housing 11 in the height direction Z of the semiconductor device 100. The cavity cover 13 is used to cover the second end of the adapter 12. The adapter 12, cavity housing 11, chuck 31, and cavity cover 13 can form a processing chamber. The processing chamber can be a location for thin film growth on the wafer 200. The cavity cover 13 can also be referred to as a source stage, and components such as a target material can be disposed on the cavity cover 13. When the cavity cover 13 covers the second end of the adapter 12, the first surface 311 faces the cavity cover 13. The adapter 12 shown exemplary in the accompanying drawings is a single component; the adapter 12 may also include multiple components. For example, the adapter 12 may include an upper adapter, a collar, a middle adapter, and a lower adapter, etc. This application does not limit the structure of the adapter 12.

[0073] A grounding ring 32 may be disposed on the chuck 31. For example, the grounding ring 32 may be disposed on the second surface 312 of the chuck 31. The grounding ring 32 is used to ground the chuck 31 to improve the distribution of electric field and / or plasma on the wafer surface, thereby ensuring the quality, efficiency and stability of the semiconductor process.

[0074] The semiconductor device 100 may also include a cover plate 14, which covers the window 111. The cover plate 14 helps reduce the entry of dust and other contaminants into the interior of the semiconductor device 100 through the window 111. The cover plate 14 can be detachably connected to the cavity housing 11. When maintenance of the semiconductor device 100 is required, the cover plate 14 can be removed. The cover plate 14 can also be slidably connected to the cavity housing 11.

[0075] The semiconductor device 100 may further include an insulating ring 41 and a process kit 42. Both the insulating ring 41 and the process kit 42 are housed in the adapter 12, with the insulating ring 41 disposed on the process kit 42. The process kit 42 may be, but is not limited to, an ion filter. Both the insulating ring 41 and the process kit 42 are disposed on one side of the first surface 311 of the chuck 31, i.e., both the insulating ring 41 and the process kit 42 are disposed above the chuck 31.

[0076] Specifically, the inventors discovered that in metal deposition processes such as trench or via deposition of metal (e.g., copper) on a 200-mesh wafer, if the size of the trench or via is very small, for example, less than 5 nm, voids can easily form in the metal within the trench or via, leading to an increase in the resistance of the deposited metal. To solve this problem, voids can be eliminated by heating the wafer and using high-temperature melting.

[0077] As some implementation methods, please refer to the following: Figure 2B and Figure 3The semiconductor device 100 may also include a process lamp 43. The process lamp 43 is disposed within the adapter 12 and is used to provide thermal radiation to the wafer 200 supported by the chuck 31. Using the semiconductor device 100 of this application, after metal is plated onto the wafer 200, the process lamp 43 heats the wafer 200, causing the metal to melt. The molten metal flows back into the trenches or vias. Through repeated metal plating and heating reflow, metal voids in the trenches or vias are ultimately reduced or even eliminated, thus lowering the metal resistance.

[0078] Furthermore, the inner wall of the first end of the adapter 12 is provided with a reflective surface 121 extending circumferentially along the adapter 12, the reflective surface 121 being disposed around the chuck 31. The reflective surface 121 is used to reflect thermal radiation. The adapter 12 having a reflective surface 121 disposed around the chuck 31 is beneficial for fully reflecting thermal radiation, reducing energy dissipation, thereby improving process efficiency, and further reducing metal voids in trenches or vias, further reducing metal resistance. The reflective surface 121 may be, but is not limited to, a plane (e.g., an inclined plane) or a curved surface (e.g., an arc surface). The reflective surface 121 may extend as far as possible toward the center of the chuck 31 to more fully reflect thermal radiation. For example, the orthographic projection of the grounding ring 32 along the height direction Z of the semiconductor device 100 may be at least partially located on the reflective surface 121.

[0079] In some embodiments, the semiconductor device 100 may further include a baking lamp 44 disposed within the cavity housing 11. The baking lamp 44 is used to maintain the temperature within the processing cavity at a preset process temperature until the process is completed, thereby improving semiconductor process efficiency and / or ensuring semiconductor process quality. At least a portion of the orthographic projection of the baking lamp 44 along a first direction X may, but is not limited to, being located in window 111, where the first direction X is perpendicular to the height direction Z of the semiconductor device 100. Since the portion of the orthographic projection of the baking lamp 44 along the first direction X is located in window 111, the user can directly see the baking lamp 44 through window 111, facilitating maintenance of the baking lamp 44. The baking lamp 44 may, but is not limited to, be U-shaped.

[0080] The first direction X can be the length direction of the semiconductor device 100, and the second direction Y can be the width direction of the semiconductor device 100. The first direction X is perpendicular to the second direction Y, and the second direction Y is perpendicular to the height direction Z of the semiconductor device 100. It can be understood that the first direction X can be the width direction of the semiconductor device 100, and the second direction Y can be the length direction of the semiconductor device 100.

[0081] Please refer to the following: Figure 2B , Figure 3 and Figure 4The semiconductor device 100 may further include a lifting structure 45 connected to the cavity housing 11. The lifting structure 45 is vertically and movably mounted on the chuck 31. The lifting structure 45 supports the wafer 200 so that, when the process lamp 43 emits heat radiation, there is a gap between the wafer 200 and the side of the chuck 31 facing the cavity cover 13. That is, the lifting structure 45 lifts the wafer 200, creating a gap between the wafer 200 and the first surface 311 of the chuck 31. At least a portion of the orthographic projection of the lifting structure 45 along the first direction X is located in the window 111. The first direction X is perpendicular to the height direction Z of the semiconductor device 100. The gap between the wafer 200 and the side of the chuck 31 facing the cavity cover 13 means that the wafer 200 and the chuck 31 are separated in the height direction Z of the semiconductor device 100, and there is a gap between the lower surface of the wafer 200 and the first surface 311 of the chuck 31. There is a gap between the wafer 200 and the side of the chuck 31 facing the cavity cover 13, and the side of the wafer 200 facing the chuck 31 is not covered by the chuck 31. When the process lamp 43 emits heat radiation, the heat radiation of the process lamp 43 can effectively cover at least a portion of the side of the wafer 200 facing the chuck 31, which is beneficial to increasing the area of ​​the wafer 200 exposed to heat radiation and accelerating the heating rate of the wafer 200. At least a portion of the orthographic projection of the lifting structure 45 along the first direction X is located in the window 111, and the user can directly see the lifting structure 45 through the window 111, which is convenient for maintenance of the lifting structure 45.

[0082] The semiconductor device 100 also includes a cooling conduit 46, at least a portion of which may be disposed on the outer surface of the cavity housing 11, and another portion of which may be disposed along the periphery of the window 111. The cooling conduit 46 is used to circulate a cooling medium to dissipate heat from the cavity housing 11, adapter 12, cavity cover 13, etc., thereby improving the stability of the semiconductor process. The cooling medium may be, but is not limited to, water. Furthermore, given the constraints of the placement of the cooling conduit 46, the window 111 can be made as large as possible to enhance heat dissipation.

[0083] Example 2 like Figure 3 As shown in the first embodiment above, the orthographic projection of the grounding ring 32 along the height direction Z of the semiconductor device 100 may at least partially lie within the reflective surface 121 of the first end of the adapter 12, meaning that there is interference between the grounding ring 32 and the first end of the adapter 12. The chuck 31 and the wafer 200 may frequently need to be removed from the semiconductor device 100 due to particulate contamination or other reasons. Whether maintaining the chuck 31 or the wafer 200, the chuck 31 must be removed or detached from the semiconductor device 100.

[0084] In related technologies, due to interference between the grounding ring and the adapter, when the chuck needs to be disassembled, the cavity cover must be opened first. This requires multiple operators and the assistance of lifting equipment to remove the adapter before the grounding ring and chuck can be taken out. This results in a long Mean Time To Repair (MTTR) within the production cycle, severely impacting the efficiency of chuck disassembly and maintenance, and consequently affecting the maintenance efficiency of semiconductor equipment. Chuck maintenance requires at least three operators working together. The process is roughly as follows: opening the cavity cover, disconnecting cooling lines and other pipelines, removing the insulating ring, disassembling the process kit, using lifting equipment to disassemble the upper adapter, collar, middle adapter, and lower adapter, and finally removing the grounding ring and chuck. Chuck maintenance typically takes about two days, including pressure holding, lifting, and process debugging. Furthermore, during adapter disassembly, the need for lifting equipment requires operators to enter the semiconductor equipment cavity to connect the adapter components to the lifting equipment using accessories. This not only affects maintenance efficiency but also poses safety risks. Based on this, one embodiment of this application provides a grounding ring 32, which can be referred to in conjunction with the above. Figure 3 , Figure 5 and Figure 6 A grounding ring 32 is disposed on the chuck 31 of the semiconductor device 100. The grounding ring 32 includes at least two separable grounding segments 321. The grounding segments 321 are detachably connected to the chuck 31 so that the grounding segments 321 can be removed from the window 111 on the side wall of the cavity 11 of the semiconductor device 100 after disassembly. The grounding segments 321 are arranged along the periphery of the chuck 31. One end of one of the two adjacent grounding segments 321 is connected to one end of the other of the two adjacent grounding segments 321 along the circumference of the grounding ring 32.

[0085] The grounding ring 32 provided in this application and the semiconductor device 100 include at least two grounding segments 321 that can be separated in the circumferential direction. When the grounding ring 32 needs to be maintained, the grounding segments 321 that are removed from the chuck 31 can be moved out of the semiconductor device 100 through the window 111, that is, the grounding ring 32 can be removed from the side of the semiconductor device 100.

[0086] On the one hand, in the traditional method, the semiconductor device 100 needs to be opened at one end in the height direction Z, i.e., the cavity cover 13 needs to be opened, and then various components (such as adapter 12, process kits, etc.) located on the grounding ring 32 need to be removed using lifting tools before the grounding ring 32 can be disassembled and maintained. This application allows for the disassembly and assembly of the grounding section 321 through the side window 111 of the cavity shell 11, eliminating the need to remove various components located on the grounding ring 32 using lifting tools, thus improving the maintenance efficiency of the grounding ring 32 and consequently improving the maintenance efficiency of the semiconductor device 100. The window 111 for maintaining the grounding ring 32 can also be called side maintenance or side-maintenance grounding ring 32 structure. This method does not increase the maintenance space inside the semiconductor device 100 cavity, does not affect the stability of the in-cavity process of the semiconductor device 100, and meets the high maintenance space requirements of the semiconductor device 100.

[0087] On the other hand, this application also improves the maintenance efficiency of the chuck, especially in scenarios where there is interference between the adapter 12 and the grounding section 321. If there is interference between the adapter 12 and the grounding section 321, the adapter 12 must be removed before the chuck 31 can be maintained, since the grounding section is located on the chuck. Removing the adapter 12 requires multiple people and lifting equipment. With this application, when maintaining the chuck 31, after removing the grounding section 321 from the chuck 31 through window 111, since there is generally no interference between the adapter 12 and the chuck 31, it is not necessary to remove the adapter 12. The chuck 31 can be disassembled directly through the port on the second end of the adapter 12. Since the chuck 31 can be maintained without removing the adapter 12, the steps for disassembling and assembling the chuck 31 are simplified. This allows for operation by a single person, improving the maintenance efficiency of the chuck 31 of the semiconductor equipment 100, reducing maintenance costs, and increasing equipment uptime. In addition, since removing adapter 12 and hoisting adapter 12 requires workers to crawl into semiconductor equipment 100 to perform the operation, which poses a safety risk, this application also helps to reduce maintenance safety risks.

[0088] In one possible application scenario of the semiconductor device 100, the semiconductor processing system includes one or more devices, which may include the semiconductor device 100 of this application. The space of the operating bits 300 between adjacent devices is very limited. Figure 7The circle indicates that the maximum width of the operating position 300 may only be 350 mm, requiring operators to squeeze in sideways for maintenance, making the maintenance space extremely narrow. The process of removing or disassembling the chuck 31 may include: opening the cavity cover 13, removing the insulating ring 41, removing the process light 43, removing the cover plate 14, removing the grounding section 321, and removing the chuck 31. Since the adapter 12 does not need to be removed, the maintenance steps for the chuck 31 are reduced, significantly shortening the maintenance time; for example, the maintenance time can be reduced to one day. The elimination of the need to remove the adapter 12 also reduces the operator's time spent in the operating position 300, reducing operator fatigue.

[0089] Please refer to the following: Figure 3 , Figure 5 , Figure 6 One end of one of the two adjacent grounding segments 321 is connected to one end of the other of the two adjacent grounding segments 321 along the circumference of the grounding ring 32. The "connection" can be direct contact or indirect connection.

[0090] At least a portion of the orthographic projection of the grounding segment 321 onto the side wall can be located in the window 111. Since at least a portion of the orthographic projection of the grounding segment 321 onto the side wall of the cavity 11 is located in the window 111, the grounding ring 32 can be easily seen by the user through the window 111, i.e., it is visually accessible to the user, thus improving the user's operational convenience.

[0091] In some embodiments of this application, the ground segment 321 is located on the side of the adapter 12 facing the cavity housing 11, and at least a portion of the ground segment 321's orthographic projection along the height direction Z of the semiconductor device 100 is located on the reflective surface 121. In this embodiment, the number of ground segments 321 is three. The three ground segments 321 are used to form an open ring structure. The dimensions of the three ground segments 321 can be the same or different from each other; for example, the central angle of the first ground segment 321 can be 122 degrees, the central angle of the second ground segment 321 can be 90 degrees, and the central angle of the third ground segment 321 can be 148 degrees. The number of ground segments 321 can also be two, four, or more. In some embodiments, the number of ground segments 321 is less than or equal to a preset threshold (e.g., 6, 8) to improve maintenance efficiency.

[0092] For example, the grounding segment 321 includes a first connecting portion 3211 and a second connecting portion 3212. The first connecting portion 3211 is located on the side of the grounding segment 321 closer to the center of the grounding ring 32. The thickness of the first connecting portion 3211 is greater than the thickness of the second connecting portion 3212. The first connecting portion 3211 is used for detachable connection with the chuck 31. When the grounding segment 321 is connected to the chuck 31, the first connecting portion 3211 protrudes from the side of the second connecting portion 3212 facing away from the chuck 31. The center of the grounding ring 32 can refer to the location of the center of the ring structure formed by all the grounding segments 321.

[0093] The thickness of the first connecting portion 3211 is greater than the thickness of the second connecting portion 3212, which helps to improve the strength of the first connecting portion 3211 and also improves the connection stability between the first connecting portion 3211 and the chuck 31. Furthermore, since the thickness of the first connecting portion 3211 is greater than the thickness of the second connecting portion 3212, when the grounding section 321 is connected to the chuck 31, the first connecting portion 3211 protrudes from the side of the second connecting portion 3212 facing away from the chuck 31, making it easier for the user to see the first connecting portion 3211 through the window 111 and facilitating the user's disassembly and assembly operations. In some other embodiments, the thickness of the first connecting portion 3211 may be the same as the thickness of the second connecting portion 3212.

[0094] In some embodiments, the ground segment 321 includes an arc structure, the diameter of the ground ring 32 is greater than the length of the window 111, and the chord length of each ground segment 321 is less than the length of the window 111. The length direction of the window 111 is perpendicular to the height direction Z of the semiconductor device 100. Since the chord length of the ground segment 321 is less than the length of the window 111, after the ground segment 321 is removed from the chuck 31, it can be taken out from the window 111 without significantly adjusting its orientation, which helps to further improve the disassembly efficiency of the ground ring 32. The length direction of the window 111 may, but is not limited to, be perpendicular to the height direction Z of the semiconductor device 100. The chord lengths of the three ground segments 321 may be different or the same. In one scenario, when the three ground segments 321 are installed in the chuck 31, for example, as shown... Figure 8 As shown, a window 111 extends along a first direction X, with a length of L in the first direction X. The diameter of the grounding ring 32 is D. The length of the first grounding segment 321 in the first direction X is A1, the length of the second grounding segment 321 in the first direction X is A2, and the length of the third grounding segment 321 in the first direction X is A3. D is greater than the length of the window 111, and A1, A2, and A3 are all less than D and less than L. All three grounding segments 321 can easily enter and exit through the window 111.

[0095] In other embodiments, the diameter of the grounding ring 32 may be smaller than the length of the window 111; or, the diameter of the grounding ring 32 may be larger than the length of the window 111 and the chord length of the grounding segment 321 may be greater than the length of the window 111.

[0096] Please refer to the following: Figure 5 , Figure 6 , Figure 9 , Figure 10 The grounding ring 32 may also include a riser 323, which is annular, and both the riser 323 and the grounding section 321 are made of conductive material. The riser 323 and the grounding section 321 are stacked in the height direction Z of the grounding section 321. The height direction Z of the grounding section 321 may be the same as the height direction Z of the semiconductor device 100. The riser 323 is in contact with the grounding section 321. The riser 323 is used to connect to the chuck 31. When the grounding ring 32 is provided in the chuck 31, the riser 323 is located between the chuck 31 and the grounding section 321 in the height direction Z of the grounding section 321. Considering the chamber layout, the grounding ring 32 is usually located above the window 111 in the height direction Z, and the user may have difficulty seeing the grounding section 321 through the window 111, or may need a specific angle to see the grounding section 321. The grounding ring 32 can be equipped with a heightening element 323 to lower the grounding section 321 so that the user can see the grounding section 321 through the window 111. Both the heightening element 323 and the grounding section 321 are made of conductive materials, so they also have a grounding function, allowing the charge on the chuck 31 to be released through the heightening element 323 and the grounding section 321.

[0097] In some possible implementations, the riser 323 and the grounding section 321 can be made of the same material, which makes the riser 323 and the grounding section 321 have the same conductivity and resistivity, thereby improving the stability of the grounding path.

[0098] In some other possible implementations, the materials of the raising member 323 and the grounding section 321 may also be different.

[0099] The extension member 323 can be detachably connected to the chuck 31. For example, the extension member 323 can be detachably connected to the chuck 31 by screws to facilitate maintenance of the extension member 323 and the chuck 31. In some possible embodiments, the extension member 323 can also be non-detachably connected to the chuck 31.

[0100] In some possible implementations, at least a portion of the orthographic projection of the ground segment 321 along the height direction Z of the semiconductor device 100 lies within the reflective surface 121 of the adapter 12, and the thickness of the riser 323 in the height direction Z is greater than the thickness of the ground segment 321 in the height direction Z. As previously mentioned, to improve process efficiency, the reflective surface 121 of the adapter 12 can extend inward, causing interference between the ground segment 321 and the adapter 12 (i.e., at least a portion of the orthographic projection of the ground segment 321 along the height direction Z of the semiconductor device 100 lies within the reflective surface 121 of the adapter 12). In this case, making the riser 323 thicker and the ground segment 321 thinner helps to reduce the difficulty for the user to remove the ground segment 321.

[0101] In some possible implementations, at least a portion of the orthographic projection of the ground segment 321 along the height direction Z of the semiconductor device 100 lies within the reflective surface 121 of the adapter 12, and the orthographic projection of the riser 323 along the height direction Z of the semiconductor device 100 does not lie within the reflective surface 121 of the adapter 12. This avoids interference between the riser 323 and the adapter 12. Thus, before disassembling the chuck, only the ground segment 321 that interferes with the adapter 12 needs to be removed, without disassembling the riser 323. The riser 323 can be removed together with the chuck, which further improves maintenance efficiency.

[0102] After removing the grounding section 321 from the riser 323, there is a risk that the grounding section 321 may fall into the semiconductor device 100 and damage the internal components. Therefore, please refer to [further details needed]. Figure 5 , Figure 6 , Figure 9 , Figure 10 The grounding ring 32 also includes at least one lug 324 for connection to the chuck 31. In some embodiments, when a riser 323 is provided, the lug 324 can be connected to the chuck 31 via the riser 323. In the height direction Z of the grounding segment 321, at least a portion of each lug 324 is located on at least one side of the grounding segment 321 opposite to the riser 323 or the chuck 31. The lug 324 supports the grounding segment 321 after it has been removed from the riser 323 or the chuck 31, thus limiting separation of the grounding segment 321 from the lug 324. Since at least a portion of the lug 324 is located on the side of the grounding segment 321 opposite to the chuck 31 in the height direction Z of the semiconductor device 100, the lug 324 can provide support for the grounding segment 321 in the height direction Z after it has been removed from the riser 323 or the chuck 31, reducing the possibility of the grounding segment 321 falling onto other components within the semiconductor device 100. In addition, because of the lug 324, the user does not need to hold the grounding section 321 by hand when removing the grounding section 321 from the chuck 31, which improves the user's convenience.

[0103] For example, the lug 324 is generally L-shaped. The lug 324 includes a first portion 3241 and a second portion 3242 connected together. The first portion 3241 is used to connect to the chuck 31. As in some embodiments, when a riser 323 is provided, the lug 324 can be connected to the chuck 31 via the riser 323. The first portion 3241 of the lug 324 can be detachably connected to the riser 323 or not. At least a portion of the grounding section 321 is located between the chuck 31 (or the riser 323) and the second portion 3242. The first portion 3241, the second portion 3242, and the chuck 31 (or the riser 323) form an opening that is located away from the center of the grounding ring 32. Since the opening is away from the center of the grounding ring 32, that is, facing the side wall, the grounding section 321 can be directly taken out from the opening in the radial direction of the grounding ring 32 from the first part 3241 toward the side wall, which saves time and effort and helps to improve the disassembly efficiency of the grounding section 321.

[0104] For example, such as Figure 6 As shown, the outer surface of the grounding section 321 may be provided with a positioning port 3213. At least a portion of the hanging ear 324 is received in the positioning port 3213. The shape of the positioning port 3213 matches the shape of the hanging ear 324, so that the positioning port 3213 positions and / or limits the hanging ear 324. When the grounding section 321 needs to be assembled to the elevating member 323, at least a portion of the hanging ear 324 can be placed into the positioning port 3213 of the grounding section 321 first, so that the grounding section 321 is pre-installed to the hanging ear 324. This helps to improve the assembly accuracy between the grounding section 321 and the chuck 31, and also improves the user's operational convenience in connecting the grounding section 321 and the chuck 31. In addition, since the inner wall of the positioning port 3213 can also limit the hanging ear 324, the positional stability between the grounding section 321 and the elevating member 323 is improved.

[0105] In some embodiments of this application, the positioning port 3213 can penetrate the first connecting portion 3211 away from the outer surface of the chuck 31 in the height direction Z of the grounding section 321, and the second connecting portion 3212 has a limiting effect on the second part 3242 of the lug 324 in the height direction Z, thereby improving the positional stability of the grounding section 321 and the chuck 31 in the height direction Z. The positioning port 3213 can also penetrate the first connecting portion 3211 away from the outer surface of the second connecting portion 3212 in the radial direction of the grounding section 321, so that the second connecting portion 3212 has a limiting effect on the first part 3241 of the lug 324 in the circumferential direction of the grounding ring 32, thereby improving the positional stability of the grounding section 321 and the chuck 31 in the height direction Z.

[0106] This application does not limit the shape and structure of the lug 324. The lug 324 can be a regular or irregular structure. For example, the lug 324 can be a straight strip structure. The grounding section 321 and the peripheral wall of the chuck 31 are connected radially to the chuck 31. The lug 324 can be disposed on the second surface 312 of the chuck 31. The lug 324 is located below the grounding section 321.

[0107] The grounding ring 32 also includes at least one retaining member 325. The retaining member 325 is a captive screw, and the grounding section 321 is detachably connected to the chuck 31 via at least one retaining member 325. When a riser 323 is provided, the grounding section can be detachably connected to the riser 323 via the retaining member 325, thereby detachably connecting to the chuck 31. When the grounding section 321 is separated from the chuck 31 (or the riser 323), the retaining member 325 is connected to the grounding section 321 containing the retaining member 325. Because the retaining member 325 can be a captive screw, after the connection between the grounding section 321 and the riser 323 is released, the retaining member 325 will not fall off the grounding section 321 containing it, facilitating the disassembly of the grounding section 321 and the riser 323 and preventing the retaining member 325 from falling into the cavity and affecting subsequent semiconductor processes.

[0108] For example, please refer to Figure 11A and Figure 11B The fastener 325 includes a sleeve 3251 and a screw body 3252. The sleeve 3251 is fixed to the grounding section 321. The screw body 3252 includes a nut 32521 and a screw 32522. The nut 32521 is located on the side of the grounding section 321 opposite to the raising member 323. In other words, the nut 32521 protrudes from the side of the grounding section 321 opposite to the raising member 323, so that the user can easily see the nut 32521 through the window 111. The outer diameter of the nut 32521 is larger than the inner diameter of the sleeve 3251. The screw 32522 includes a first rod portion 325221 and a second rod portion 325222. The first rod portion 325221 is located between the nut 32521 and the second rod portion 325222, and passes through the sleeve 3251. The diameter of the second rod portion 325222 is larger than the inner diameter of the sleeve 3251. The sleeve 3251 is located between the nut 32521 and the second rod portion 325222. The second rod portion 325222 is used for connection with the chuck 31. In this embodiment, the second rod portion 325222 is threadedly connected to the extension member 323. Without the extension member 323, the second rod portion 325222 can be threadedly connected to the chuck 31.

[0109] Since the sheath 3251 is fixed to the grounding section 321, and the outer diameter of the nut 32521 and the diameter of the second rod portion 325222 are larger than the inner diameter of the sheath 3251, the fixing member 325 can be pre-installed on the grounding section 321 through the sheath 3251, facilitating the connection between the grounding section 321 and the extension member 323. When the second rod portion 325222 is separated from the extension member 323, since the inner diameter of the sheath 3251 is smaller than the diameter of the second rod portion 325222, the screw body 3252 cannot detach from the sheath 3251, ensuring that the fixing member 325 remains connected to the grounding section 321 and does not fall into the interior of the semiconductor device 100.

[0110] For example, the first connecting portion 3211 may be provided with a mounting hole that extends through the first connecting portion 3211 in the height direction Z of the grounding section 321. The mounting hole is used to accommodate the sheath 3251. The sheath 3251 is fixedly accommodated in the first mounting hole, and the sheath 3251 can be hidden inside the grounding section 321 without occupying space outside the grounding section 321.

[0111] For example, the orthographic projection of the nut 32521 of at least one fastener 325 along the first direction X is located in window 111, and at least a portion of the fastener 325 along the first direction X is located in window 111. That is, a portion of the fastener 325 protrudes from the side of the first connecting portion 3211 facing away from the raising member 323, so that the user can directly see a portion of the fastener 325 through window 111. The fastener 325 is visually accessible, solving the problems of difficult alignment and blind operation, and improving maintenance efficiency. When disassembling the grounding section 321, the user can directly see the position of the fastener 325 on the grounding section 321 through window 111, loosen the fastener 325, and then remove the grounding section 321 from window 111. The entire disassembly process requires no auxiliary tools, realizing a quick three-step disassembly: "look, loosen, and remove". This application does not limit the orthographic projection of the nut 32521 of at least one fastener 325 along the first direction X to be located in window 111. That is, the orthographic projection of the fastener 325 along the first direction X may not be located in window 111. The user can obtain the position of the fastener 325 by adjusting the posture or other means and perform disassembly and assembly operations on the fastener 325.

[0112] This application does not limit the structure of the lock-up screw. For example, the lock-up screw may also include an elastic element, which may be sleeved on the first shank 325221. The elastic element may be located between the sheath 3251 and the second shank 325222. When the second shank 325222 is connected to the extension member 323, the elastic element is used to provide elastic force to the second shank 325222 to press the second shank 325222 onto the extension member 323, which helps to improve the connection stability between the screw body 3252 and the extension member 323.

[0113] In some embodiments, the fixing member 325 can be a conventional screw. This application does not limit the connection method between the grounding section 321 and the raising member 323. The grounding section 321 and the raising member 323 can also be detachably connected by snap-fit, adhesive or other means. For example, the fixing member 325 can be omitted, the grounding section 321 is provided with a first snap-fit ​​structure, and the raising member 323 can be provided with a second snap-fit ​​structure. The first snap-fit ​​structure and the second snap-fit ​​structure are snap-fit ​​connected.

[0114] Example 3 This application also provides a disassembly method for a semiconductor device 100, please refer to [link to relevant documentation]. Figure 12 ,include: 101, please refer to Figure 13 Open the cavity cover 13 to expose the port of the second end of the adapter 12.

[0115] 102, please refer to Figure 14 Remove the insulating ring 41 and process kit 42 and remove them from the cavity 11 and adapter 12 through the port at the second end.

[0116] 103, please refer to Figure 14 Remove the cover plate 14 from the window 111.

[0117] The cover plate 14 can be connected to the cavity shell 11 by screws. When the cover plate 14 needs to be removed from the window 111, the screws on the cover plate 14 should be removed.

[0118] 104. Disconnect the grounding section 321 from the chuck 31.

[0119] Disconnecting the ground segment 321 from the chuck 31 includes: as follows Figure 15 As shown, the position of the fastener 325 is obtained. For example, the user can see the position of the fastener 325 through the window 111; loosen the fastener 325, and the grounding section 321 is supported by the lug 324.

[0120] 105, please refer to Figure 16 The grounding section 321, after being separated from the chuck 31, is removed from the cavity shell 11 through the window 111.

[0121] The grounding section 321, after being separated from the chuck 31, is removed from the cavity shell 11 through the window 111, and the process also includes: Figure 17 As shown, the grounding section 321 is separated from the lug 324.

[0122] 106, please refer to Figure 18 and Figure 19 Disassemble the chuck 31 and remove it from the adapter 12 and the cavity 11 through the port at the second end.

[0123] 107. The baking lamp 44 installed inside the cavity shell 11 is disassembled through window 111 and removed from the cavity shell 11 through window 111.

[0124] 108. The lifting structure 45 located inside the cavity shell 11 is disassembled through window 111 and removed from the cavity shell 11 through window 111.

[0125] The disassembly method provided in this application allows the removed grounding segment 321 to be directly removed from the window 111 on the side wall of the cavity housing 11, thus enabling maintenance of the grounding ring 32 from the side of the semiconductor device 100. After separating the grounding segment 321 from the chuck 31, the chuck 31 can be removed from the port at the second end of the adapter 12 for maintenance. Additionally, the baking lamp 44 and the lifting structure 45 can be directly disassembled through the window 111 for maintenance of these components.

[0126] This application does not limit the order of the disassembly steps, and the order of steps can be adjusted, deleted, or added. For example, steps 103, 104, and 105 can be executed first, followed by steps 101 and 102; or steps 103, 107, and 108 can be executed first, followed by steps 104 and 105, and then steps 101, 102, and 103, etc.; or, the cover plate 14 can be omitted from the semiconductor device 100, and steps 101, 102, 103, 106, 107, and 108 can be omitted from the disassembly method.

[0127] In some possible implementations, the semiconductor device 100 includes a housing 11, a chuck 31, and a grounding ring 32. The housing 11 has a window 111 on its sidewall. The chuck 31 is housed within the housing 11 and is used to carry a wafer 200. The grounding ring 32 is disposed on the chuck 31. The grounding ring 32 includes at least two separable grounding sections 321, which are detachably connected to the chuck 31. The grounding sections 321 are disposed along the periphery of the chuck 31. This application also provides a disassembly method for the semiconductor device 100, comprising: separating the grounding section 321 from the chuck 31; and removing the grounding section 321, after separation from the chuck 31, from the housing 11 through the window 111.

[0128] The disassembly method provided in this application allows the removed grounding segment 321 to be directly removed from the window 111 on the side wall of the cavity 11, thus enabling maintenance of the grounding ring 32 from the side of the semiconductor device 100. Since it eliminates the need to open the semiconductor device 100 at one end in the height direction Z, and personnel do not need to crawl inside the semiconductor device 100 for operation, the steps for maintaining the grounding ring 32 are simplified, improving the maintenance efficiency of the semiconductor device 100 and reducing maintenance safety risks.

[0129] In some possible implementations, if maintenance of the chuck 31 is still required and the window 111 is not covered by a cover plate 14, the disassembly method may also include: Open the cavity cover 13 to expose the port at the second end; Disassemble the chuck 31 and remove it from the adapter 12 and the cavity 11 through the port at the second end; After opening the cavity cover 13 and removing the grounding section 321, which has been separated from the chuck 31, from the cavity shell 11 through the window 111, the chuck 31 is disassembled and the adapter 12 and cavity shell 11 are removed through the port.

[0130] In some possible implementations, if the window 111 is provided with a cover plate 14, the disassembly method may further include removing the cover plate 14 from the window 111 before separating the grounding section 321 from the chuck 31.

[0131] In some possible implementations, if it is necessary to disassemble the baking lamp 44, the disassembly method further includes: disassembling the baking lamp 44 disposed inside the cavity housing 11 through the window 111, and removing the baking lamp 44 from the cavity housing 11 through the window 111. Disassembling the baking lamp 44 can enable maintenance of the baking lamp 44.

[0132] In some possible implementations, if it is necessary to disassemble the lifting structure 45, the disassembly method further includes: disassembling the lifting structure 45 located inside the cavity shell 11 through the window 111, and removing the lifting structure 45 from the cavity shell 11 through the window 111. Disassembling the lifting structure 45 can enable maintenance of the lifting structure 45.

[0133] The foregoing preferred embodiments have further illustrated the objectives, technical solutions, and advantages of the present invention. It should be understood that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A grounding ring (32), characterized in that, The grounding ring (32) is used to be installed on the chuck (31) of the semiconductor device (100); The grounding ring (32) includes at least two separable grounding segments (321), which are detachably connected to the chuck (31) so that the grounding segments (321) can be removed from the window (111) on the side wall of the cavity (11) of the semiconductor device (100) after disassembly. The grounding segments (321) are arranged along the periphery of the chuck (31), and one end of one of the two adjacent grounding segments (321) is connected to one end of the other of the two adjacent grounding segments (321) along the circumference of the grounding ring (32).

2. The grounding ring (32) according to claim 1, characterized in that, The grounding section (321) includes a first connecting part (3211) and a second connecting part (3212). The first connecting part (3211) is located on the side of the grounding section (321) closer to the center of the grounding ring (32). The thickness of the first connecting part (3211) is greater than the thickness of the second connecting part (3212). The first connecting part (3211) is used for detachable connection with the chuck (31).

3. The grounding ring (32) according to claim 1 or 2, characterized in that, The grounding ring (32) also includes a heightening member (323), which is annular and both the heightening member and the grounding segment (321) are made of conductive material. The heightening member (323) and the grounding segment (321) are stacked in the height direction (Z) of the grounding segment (321). The heightening member (323) is used to connect with the chuck (31). When the grounding ring (32) is disposed in the chuck (31), the heightening member (323) is located between the chuck (31) and the grounding segment (321) in the height direction (Z) of the grounding segment (321).

4. The grounding ring (32) according to any one of claims 1-3, characterized in that, The grounding ring (32) further includes at least one lug (324) for connection to the chuck (31). In the height direction (Z) of the grounding segment (321), at least a portion of each lug (324) is located on the side of at least one grounding segment (321) facing away from the chuck (31). The lug (324) is used to support the grounding segment (321) after it is detached from the chuck (31) to limit separation of the grounding segment (321) from the lug (324).

5. The grounding ring (32) according to claim 4, characterized in that, The lug (324) includes a first part (3241) and a second part (3242) connected together. The first part (3241) is used to connect with the chuck (31). At least a portion of the grounding section (321) is located between the chuck (31) and the second part (3242). The first part (3241), the second part (3242), and the chuck (31) form an opening, which is located away from the center of the grounding ring (32).

6. The grounding ring (32) according to claim 4 or 5, characterized in that, The outer surface of the grounding section (321) is provided with a positioning port (3213), the shape of the positioning port (3213) matches the shape of the hanging ear (324), and at least a portion of the hanging ear (324) is received in the positioning port (3213).

7. The grounding ring (32) according to any one of claims 1-6, characterized in that, The grounding ring (32) also includes at least one fixing member (325), the fixing member (325) being a non-detachable screw, and the grounding section (321) being detachably connected to the chuck (31) through at least one of the fixing members (325); When the grounding section (321) is separated from the chuck (31), the fixing member (325) is connected to the grounding section (321) where the fixing member (325) is located.

8. The grounding ring (32) according to claim 7, characterized in that, The fastener (325) includes a sheath (3251) and a screw body (3252), wherein the sheath (3251) is fixed to the grounding section (321); The screw body (3252) includes a nut (32521) and a screw (32522). The nut (32521) is located on the side of the grounding section (321) away from the raising member (323). The outer diameter of the nut (32521) is larger than the inner diameter of the sheath (3251). The screw (32522) includes a first shank (325221) and a second shank (325222). The first shank (325221) is located on the side of the grounding section (321) away from the raising member (323). Between the nut (32521) and the second rod (325222), the first rod (325221) passes through the sleeve (3251), the diameter of the second rod (325222) is larger than the inner diameter of the sleeve (3251), the sleeve (3251) is located between the nut (32521) and the second rod (325222), and the second rod (325222) is used to connect with the chuck (31).

9. A semiconductor device (100), characterized in that, The semiconductor device (100) includes a housing (11), a chuck (31), and a grounding ring (32) according to any one of claims 1-8; The cavity shell (11) has a window (111) on its side wall; The chuck (31) is housed in the cavity (11) and is used to carry the wafer (200); The grounding ring (32) is disposed on the chuck (31), the grounding section (321) is detachably connected to the chuck (31), and the grounding section (321) is disposed along the periphery of the chuck (31).

10. The semiconductor device (100) according to claim 9, characterized in that, The grounding segment (321) includes an arc structure, the diameter of the grounding ring (32) is greater than the length of the window (111), and the chord length of each grounding segment (321) is less than the length of the window (111). The length direction of the window (111) is perpendicular to the height direction (Z) of the semiconductor device (100).

11. The semiconductor device (100) according to claim 9 or 10, characterized in that, At least a portion of the orthographic projection of the grounding ring (32) onto the sidewall can be located in the window (111).

12. The semiconductor device (100) according to any one of claims 9-11, characterized in that, The semiconductor device (100) also includes an adapter (12), a cavity cover (13), and a process lamp (43); The first end of the adapter (12) is connected to the cavity shell (11) in the height direction (Z) of the semiconductor device (100). The inner wall of the first end of the adapter (12) is provided with a reflective surface (121) extending circumferentially along the adapter (12). The reflective surface (121) is arranged around the chuck (31). The cavity cover (13) is used to cover the second end of the adapter (12); The process lamp (43) is disposed in the adapter (12). The process lamp (43) is used to provide thermal radiation to the wafer (200) supported by the chuck (31). The reflective surface (121) is used to reflect the thermal radiation. The grounding segment (321) is located below the adapter (12), and at least a portion of the grounding segment (321) is located on the reflective surface (121) along the orthographic projection of the semiconductor device (100) in the height direction (Z).

13. The semiconductor device (100) according to claim 12, characterized in that, The semiconductor device (100) further includes a lifting structure (45) connected to the cavity shell (11), the lifting structure (45) being vertically and vertically mounted on the chuck (31), the lifting structure (45) being used to support the wafer (200) so that, when the process lamp (43) emits heat radiation, there is a gap between the wafer (200) and the side of the chuck (31) facing the cavity cover (13); At least a portion of the orthographic projection of the lifting structure (45) along a first direction (X) is located in the window (111), the first direction (X) being perpendicular to the height direction (Z) of the semiconductor device (100).

14. The semiconductor device (100) according to any one of claims 9-13, characterized in that, The semiconductor device (100) further includes a baking lamp (44), which is disposed inside the cavity (11) and is used to heat the cavity (11); At least a portion of the orthographic projection of the baking lamp (44) along a first direction (X) is located in the window (111), the first direction (X) being perpendicular to the height direction (Z) of the semiconductor device (100).

15. The semiconductor device (100) according to any one of claims 9-14, characterized in that, The semiconductor device (100) further includes a cooling conduit (46), at least a portion of which is disposed on the outer surface of the cavity (11), and a portion of which is disposed along the periphery of the window (111).

16. A method for disassembling a semiconductor device (100), characterized in that, Applied to the semiconductor device (100) as described in any one of claims 9-15, The disassembly method includes: Disconnect the grounding section (321) from the chuck (31); The grounding segment (321), after being separated from the chuck (31), is removed from the cavity shell (11) through the window (111).

17. The disassembly method according to claim 16, characterized in that, The semiconductor device (100) also includes an adapter (12), a cavity cover (13), and a process lamp (43); The first end of the adapter (12) is connected to the cavity shell (11) in the height direction (Z) of the semiconductor device (100). The inner wall of the first end of the adapter (12) is provided with a reflective surface (121) extending circumferentially along the adapter (12). The reflective surface (121) is used to surround the chuck (31). The cavity cover (13) is placed over the second end of the adapter (12); The process lamp (43) is disposed on the adapter (12), the process lamp (43) is used to provide thermal radiation to the wafer (200) supported by the chuck (31), and the reflective surface (121) is used to reflect the thermal radiation; The grounding segment (321) is located below the adapter (12), and at least a portion of the grounding segment (321) is located on the reflective surface (121) along the orthographic projection of the semiconductor device (100) in the height direction (Z). The disassembly method further includes: Open the cavity cover (13) to expose the port at the second end; After the grounding segment (321) that has been separated from the chuck (31) is removed from the cavity (11) through the window (111), the chuck (31) is disassembled and removed through the port at the second end.

18. The disassembly method according to claim 16 or 17, characterized in that, The disassembly method further includes: The baking lamp (44) disposed inside the cavity (11) can be disassembled through the window (111) and removed from the cavity (11) through the window (111).

19. The disassembly method according to any one of claims 16-18, characterized in that, The disassembly method further includes: The lifting structure (45) located inside the cavity (11) is disassembled through the window (111) and removed from the cavity (11) through the window (111).

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