Data power composite plug and method of manufacturing the same

Abstract

The application belongs to the field of plugs, in particular to a data power composite plug and a manufacturing method thereof, comprising a positive copper bar, a negative copper bar, a signal transmission assembly and a plastic shell body, the side walls of the positive copper bar and the negative copper bar are provided with positioning grooves; the signal transmission assembly comprises a flexible circuit board; the two side edges of the flexible circuit board are respectively inserted into the positioning grooves of the side walls of the positive copper bar and the negative copper bar, and an annular grounding shielding shell body is arranged around the flexible circuit board; the first welding point, the second welding point and the insertion position of the flexible circuit board are all covered with a low-pressure injection protection layer; an air cavity is arranged between the two side surfaces of the flexible circuit board and the grounding shielding shell body. The application solves the problems of strong magnetic field generated by a large current loop seriously interfering with the differential signal integrity of a signal line, high-temperature and high-pressure injection damaging the small signal line insulation layer and the welding point, the change of the plastic dielectric constant causing the characteristic impedance of the signal wire to drift, and causing signal reflection and delay jitter.

Description

Technical Field

[0001] This invention belongs to the field of plugs, and in particular to a data power composite plug and its manufacturing method. Background Technology

[0002] With the rapid development of high-performance computing devices, artificial intelligence servers, data centers, drone fast charging base stations, and intelligent power supply systems for power tools, higher composite performance requirements are being placed on power connectors: In terms of current carrying capacity, a single contact needs to carry a large current of 10 to 50 amps, and the overall power can reach 100 watts to over 1 kilowatt; in terms of signal delay, the power management system needs to monitor indicators such as voltage, current, and temperature in real time, and the signal transmission delay is required to be no more than 10 microseconds; in terms of transmission loss, the total power path loss is required to be no more than 3%, and the signal path insertion loss is required to be no more than 0.5 dB.

[0003] Existing power and signal composite connectors typically integrate power and signal lines. The signal lines can be conventional signal cables, such as twisted-pair cables or ribbon cables. Flexible printed circuit boards (FPCs), due to their thinness and flexibility, have been widely used for signal transmission within electronic devices. However, traditional FPC applications often use them only as independent signal transmission media or simply physically bundled alongside power lines. When applied to high-current transmission scenarios, the lack of effective spatial electromagnetic shielding between the power and signal lines allows the strong alternating magnetic field generated by the high-current loop to directly penetrate the FPC's insulating substrate, causing severe electromagnetic interference (EMI) to the internal high-speed differential signals and resulting in a sharp decline in signal integrity.

[0004] Furthermore, existing power and signal composite connectors are all injection-molded integrated plugs. During the manufacturing process, high-temperature and high-pressure injection molding can damage the insulation layer of the delicate signal lines and the solder joints, leading to cracking of the solder joints. In addition, the plastic covers the main body of the power and signal lines. Under high current conditions, the temperature of the plastic can reach more than 60 degrees Celsius. The dielectric constant of the plastic changes with temperature, causing the characteristic impedance of the signal lines to drift, resulting in signal reflection and delay jitter. Summary of the Invention

[0005] The technical problem to be solved by this invention is to provide a data power composite plug and its manufacturing method, while also solving the following problems: the strong magnetic field generated by the high current circuit seriously interferes with the differential signal integrity of the signal line; high temperature and high pressure injection molding damages the insulation layer and solder joints of the fine signal line; and the change in the dielectric constant of the plastic causes the characteristic impedance of the signal line to drift, resulting in signal reflection and delay jitter.

[0006] To solve the above problems, the technical solution adopted by the present invention is: a data power composite plug, including a positive copper busbar, a negative copper busbar, a signal transmission component and a plastic shell, wherein one end of the positive copper busbar and the negative copper busbar are provided with a contact, and the other end is connected to a power cord through a first solder point; The positive and negative copper busbars have positioning grooves on their opposite sidewalls; the signal transmission component includes a flexible circuit board, one end of which has a plug-in terminal and the other end is connected to a signal line via a second solder joint; the flexible circuit board is located between the positive and negative copper busbars, and its two sides are respectively plugged into the positioning grooves on the sidewalls of the positive and negative copper busbars, and an annular grounding shielding shell is provided around the flexible circuit board. The first solder joint, the second solder joint, and the flexible circuit board insertion point are all covered with an injection-molded protective layer; The plastic shell covers the main body of the positive and negative copper busbars, the first solder joint, and the outer wall of the grounding shield shell. The contacts and plug terminals are exposed, and an air cavity is provided between the two sides of the flexible circuit board and the grounding shield shell.

[0007] Furthermore, the plastic housing is provided with a detachable outer shell.

[0008] Furthermore, the outer wall of the plastic housing is provided with a mounting groove, and a comparator circuit board is disposed in the mounting groove; The positive copper busbar is provided with a surface-mount sampling resistor and a temperature sensor on its sidewall. The surface-mount sampling resistor and temperature sensor are connected to the input terminal of the comparator circuit board via enameled wire. The output terminal of the comparator circuit board is connected to a shielded cable.

[0009] Furthermore, the grounding shield housing is made of stainless steel, and an insulating pad is provided between the positive and negative copper busbars and the grounding shield housing.

[0010] Furthermore, the outer wall of the grounding shield housing is provided with a conductive spring, the outer shell is a conductive shell, and the conductive spring penetrates the plastic shell and contacts the outer shell.

[0011] Furthermore, the injection molding protective layer is a polyetheretherketone layer with an injection molding pressure of 15MPa-25MPa.

[0012] The manufacturing method of the above-mentioned data power composite plug includes the following steps: S1. Positioning grooves are made on the opposite side walls of the positive and negative copper busbars; S2. The grounding shield housing includes two flat plates and two connecting slots that are adapted to the positioning slots. The connecting slots are installed into the positioning slots of the positive copper busbar and the negative copper busbar. Then, the two sides of the flexible circuit board are inserted into the connecting slots respectively to ensure that the contacts of the positive copper busbar, the contacts of the negative copper busbar and the plug-in terminals of the flexible circuit board are located at the same end. S3. Solder the signal line to the flexible circuit board to form the second solder joint; solder the power line to the positive copper busbar and the negative copper busbar to form the first solder joint; S4. An injection molding process with an injection pressure of 15MPa-25MPa is adopted to cover the first solder joint, the second solder joint, and the flexible circuit board insertion point with an injection molding protective layer. S5. Weld the two sides of the plate to the connecting groove to form a grounding shield shell surrounding the flexible circuit board. There is an air cavity between the two sides of the flexible circuit board and the plate. S6. A plastic shell is formed by injection molding process with an injection pressure of 80MPa-120MPa. The plastic shell covers the main body of the positive and negative copper busbars, the first solder joint, and the outer wall of the grounding shield shell, while the contacts and plug terminals are exposed.

[0013] Furthermore, in step S6, an installation hole is pre-drilled in the side wall of the positive electrode copper busbar to penetrate the plastic shell; After step S6, a surface-mount sampling resistor and a temperature sensor are installed on the side wall of the positive copper busbar through the mounting hole, and one end of the enameled wire is soldered to the surface-mount sampling resistor and the temperature sensor; then, a plastic plug is inserted into the mounting hole, and the enameled wire passes through the plastic plug; a mounting slot is reserved at the opening of the mounting hole, the comparator circuit board is installed into the mounting slot, and the enameled wire is soldered to the input end of the comparator circuit board; and a shielded cable is soldered to the output end of the comparator circuit board.

[0014] Furthermore, prior to step S6, conductive springs are welded to the outer wall of the plate; In step S6, the conductive spring penetrates the plastic shell; After step S6, a conductive outer shell is fitted over the plastic shell, and the inner wall of the outer shell is pressed into contact with the conductive spring.

[0015] The beneficial effects of this invention are: 1. The positive copper busbar, negative copper busbar, and flexible circuit board form a sandwich-layer structure, which arranges the power path and high-speed signal path in layers, realizing the integration of power and signal dual channels. This solves the defects of traditional composite connectors, such as messy arrangement of power and signal lines, low space utilization, and inability to simultaneously handle high-power and high-speed signal transmission.

[0016] 2. The positive and negative copper busbars are parallel to each other, with the same current magnitude and opposite directions. According to the right-hand rule and Ampere's circuital law, the magnetic fields generated by the positive and negative copper busbars are in opposite directions and cancel each other out in the plane containing their center lines. This invention places the flexible circuit board between the positive and negative copper busbars, precisely in the region where the magnetic fields cancel each other out. This effectively weakens the interference caused by the strong magnetic field generated by the high-current loop, ensuring the integrity of the differential signal in the signal line.

[0017] Furthermore, by setting a grounded shielding shell on the outside of the flexible circuit board, the grounded shielding shell can form a Faraday cage, completely shielding the entire flexible circuit board. When external high-frequency electromagnetic waves propagate to the surface of the grounded shielding shell, they are reflected or absorbed by the conductive material and eventually conducted to the ground through the grounding path, thus ensuring that the electric field inside the cage is zero. This solves the problem of stray electromagnetic fields outside the high-power copper busbar and external electromagnetic noise penetrating the signal area, causing jitter, bit errors, and excessive insertion loss in high-speed differential signals.

[0018] 3. An air cavity is provided between the two sides of the flexible circuit board and the grounding shield shell. This means the two sides of the flexible circuit board do not directly contact the plastic shell, but rather are in contact with air. The dielectric constant of air is stable and unaffected by temperature. Even under temperature rise conditions, the differential impedance remains stable, with no signal drift or delay jitter, ensuring the consistency and reliability of high-speed signal transmission. This completely solves the problem of traditional plastic-encased structures where the dielectric constant of the plastic drifts with temperature under high current and temperature rise conditions, leading to signal line characteristic impedance shift, signal reflection, phase jitter, and unstable delay. Furthermore, because the flexible circuit board is not encased in a plastic shell, the risk of deformation during high-pressure injection molding is avoided.

[0019] 4. The flexible circuit board connection is a stress concentration point, and the first and second solder joints are weak points. This invention uses a low-pressure injection molding process to cover the first solder joint, the second solder joint, and the flexible circuit board connection with an injection molding protective layer. Low-pressure injection molding will not damage the equipment and can protect the first solder joint, the second solder joint, and the flexible circuit board connection, preventing the solder joint from cracking due to cable pulling or vibration. At the same time, it can prevent the first solder joint from cracking due to high pressure and high temperature during secondary injection molding. It can also improve the dust and moisture protection effect of the first solder joint and the flexible circuit board connection. Attached Figure Description

[0020] Figure 1 This is a top cross-sectional view of the data power composite plug of the present invention; Figure 2 yes Figure 1 Schematic diagram of the AA section; Figure 3 This is a top-down view after completing step S3; Figure 4 yes Figure 3 Schematic diagram of the BB section; Figure 5 This is a top view of the first lower mold; Figure 6 yes Figure 5 Schematic diagram of the CC section; Figure 7 This is a top view of the plug assembly after it has been placed into the lower mold; Figure 8This is a schematic diagram of the first injection molding process; Figure 9 This is a partial cross-sectional view of the second upper mold during injection molding; Figure 10 This is a schematic diagram of the third upper mold injection process; Figure 11 This is a diagram after completing step S5; Figure 12 This is a schematic diagram of the injection molding process in step S6; Figure 13 yes Figure 12 Schematic diagram of the cross section of the middle DD; Figure 14 This is a schematic diagram of the sealing plate; Reference numerals: 1—Positive copper busbar; 2—Negative copper busbar; 3—Plastic housing; 4—Contact; 5—First solder joint; 6—Power cord; 7—Flexible circuit board; 8—Plug-in terminal; 9—Second solder joint; 10—Signal line; 11—Injection molding protective layer; 12—Air cavity; 13—Outer shell; 14—Grounding shield housing; 141—Plate; 142—Connecting groove; 15—Mounting groove; 16—Comparator circuit board; 17—Surface mount sampling resistor; 18—Temperature sensor; 19—Enamelled wire; 20—Shielded cable; 21—Insulating pad; 22—Conductive spring; 23—Plastic plug; 101—First lower mold; 102—First upper mold; 103—Second upper mold; 104— Third upper mold; 105—Positive electrode copper busbar support groove; 106—Negative electrode copper busbar support groove; 107—Circuit board support plane; 108—Lower cavity of positive electrode solder joint; 109—Lower cavity of negative electrode solder joint; 110—Notch; 111—Injection port; 112—First injection channel; 113—Second cavity; 114—Second injection channel; 115—Upper cavity; 116—Third injection channel; 201—Second lower mold; 202—Fourth upper mold; 203—First positioning hole; 204—Second positioning hole; 205—Support plate; 206—Sealing plate; 207—Fourth wire hole; 208—Fourth injection channel; 209—Mounting hole forming post; 210—Conductive spring hole. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0022] The data power composite plug of the present invention, such as Figure 1 and Figure 2As shown, the device includes a positive copper busbar 1, a negative copper busbar 2, a signal transmission component, and a plastic housing 3. One end of the positive copper busbar 1 and the negative copper busbar 2 is provided with a contact 4, and the other end is connected to a power line 6 via a first solder joint 5. The positive copper busbar 1 and the negative copper busbar 2 are used to supply power to the device and can be rectangular in cross-section. The contact 4 is used for plug-in connection with the device, enabling communication between the power line 6 and the device. The shape of the contact 4 is adapted to the shape of the socket on the device and can be any existing shape. The signal transmission component is used for the input and output of device data and signals.

[0023] The signal transmission component includes a flexible circuit board 7, which can be made using existing technology. One end of the flexible circuit board 7 is provided with a plug-in terminal 8, and the other end is connected to a signal line 10 through a second solder point 9. The plug-in terminal 8 is used to connect to the device and can be made using existing structure. The signal line 10 is used to connect to the control device to realize the communication connection between the device and the control device.

[0024] Positioning grooves are provided on the opposite sidewalls of the positive copper busbar 1 and the negative copper busbar 2. The length direction of the positioning grooves is consistent with the axial direction of the positive copper busbar 1 and the negative copper busbar 2, and the cross-section of the positioning grooves can be rectangular. The flexible circuit board 7 is located between the positive copper busbar 1 and the negative copper busbar 2. The positive copper busbar 1 and the negative copper busbar 2 are symmetrically distributed with respect to the flexible circuit board 7. The two sides of the flexible circuit board 7 are respectively inserted into the positioning grooves on the sidewalls of the positive copper busbar 1 and the negative copper busbar 2.

[0025] The positive copper busbar 1, the negative copper busbar 2, and the flexible circuit board 7 form a sandwich-layer structure, which arranges the power path and the high-speed signal path in layers, realizing the integration of power and signal dual channels. This solves the shortcomings of traditional composite connectors, such as messy power and signal lines, low space utilization, and inability to simultaneously handle high-power and high-speed signal transmission.

[0026] Furthermore, the positive copper busbar 1 and the negative copper busbar 2 are parallel to each other. When energized, the currents are of the same magnitude but opposite in direction. According to the right-hand rule and Ampere's circuital law, on the plane containing the center lines of the positive and negative copper busbars, the magnetic fields generated by the positive and negative copper busbars are in opposite directions and cancel each other out. This invention places the flexible circuit board 7 between the positive and negative copper busbars 1 and 2, precisely in the region where the magnetic fields cancel each other out. This effectively weakens the interference caused by the strong magnetic field generated by the high-current loop, ensuring the integrity of the differential signal in the signal line.

[0027] Meanwhile, an annular grounding shield housing 14 is provided around the flexible circuit board 7. Specifically, the grounding shield housing 14 includes two flat plates 141 and two connecting slots 142 adapted to the positioning slots. The connecting slots 142 are inserted into the positioning slots, and the two sides of the flat plates 141 are connected to the slot openings of the connecting slots 142. The two sides of the flexible circuit board 7 are inserted into the connecting slots 142.

[0028] The grounding shield housing 14 forms a Faraday cage, completely shielding the entire flexible circuit board 7. When external high-frequency electromagnetic waves propagate to the surface of the grounding shield housing 14, they are reflected or absorbed by the conductive material and ultimately conducted to the ground through the grounding path, thus ensuring that the electric field inside the cage is zero. This solves the problem of stray electromagnetic fields outside the high-power copper busbar and external electromagnetic noise penetrating the signal area, causing high-speed differential signal jitter, bit errors, and excessive insertion loss.

[0029] The first solder joint 5, the second solder joint 9, and the insertion points of the flexible circuit board 7 and the positioning groove are all covered with an injection-molded protective layer 11. The insertion points on both sides of the flexible circuit board 7 are stress concentration areas. During vibration, the sides of the flexible circuit board 7 may undergo reciprocating deformation, affecting the stability of the flexible circuit board 7 installation and leading to fatigue damage on both sides. The first solder joint 5 and the second solder joint 9 are weak points, prone to cracking under vibration, high temperature, and high pressure injection molding. Therefore, covering the first solder joint 5, the second solder joint 9, and the insertion points of the flexible circuit board 7 with the injection-molded protective layer 11 can improve the stability of the flexible circuit board 7 installation and its resistance to fatigue damage on the sides, preventing the solder joints from cracking due to cable pulling or vibration, preventing the first solder joint 5 from cracking due to high pressure and high temperature during secondary injection molding, and improving the dust and moisture protection of the first solder joint 5 and the flexible circuit board 7. The injection-molded protective layer 11 can be applied to the insertion point on one side of the flexible circuit board 7.

[0030] The plastic housing 3 covers the main body of the positive copper busbar 1 and the negative copper busbar 2, the first solder joint 5, and the outer wall of the grounding shield housing 14. The injection-molded protective layer 11 outside the first solder joint 5 and the second solder joint 9 is covered by the plastic housing 3, while the injection-molded protective layer 11 of the flexible circuit board 7 is exposed. The plug-in contacts 4 and plug-in terminals 8 are exposed, and an air cavity 12 is provided between the two sides of the flexible circuit board 7 and the grounding shield housing 14.

[0031] The two sides of the flexible circuit board 7 are not in direct contact with the plastic shell 3 or other materials, but are in contact with the air. The dielectric constant of air is stable and unaffected by temperature. Even under temperature rise conditions, the differential impedance remains stable, with no signal drift or delay jitter, ensuring the consistency and reliability of high-speed signal transmission. This completely solves the problem of traditional plastic-encased structures where the dielectric constant of the plastic drifts with temperature under high current and temperature rise conditions, leading to impedance shifts, signal reflections, phase jitter, and unstable delays in the signal lines. Furthermore, since the flexible circuit board 7 is not encased in a plastic shell, the risk of deformation and damage to the flexible circuit board 7 during high-pressure injection molding is avoided.

[0032] In this invention, the plastic shell 3 is provided with a detachable outer shell 13, which can enhance protection.

[0033] In high-current, high-speed signal applications, power connectors for data systems suffer from wear, oxidation, and dust contamination from prolonged plugging and unplugging. This increases contact resistance and heat generation, potentially burning out the connector or even causing a fire. Furthermore, monitoring whether the connector is fully inserted, whether it achieves effective electrical connection and mechanical locking, and whether any faults are present can prevent malfunctions caused by poor contact. It can also proactively identify cable kinks, breaks, or power outages, allowing for early detection of potential problems and timely replacement and preventative maintenance. Additionally, in scenarios such as AI servers, data centers, and drone fast charging, the connector itself is a power management node requiring real-time control. The device needs to adjust power output at the microsecond level based on load conditions. Therefore, real-time monitoring of the connector's status is essential. Current technologies typically rely on a single temperature sensor for passive monitoring in power connectors. The analog signal collected by the sensor must be sampled by the backend controller's ADC, processed by software, and encapsulated via a protocol before being transmitted through a slow bus. This inherent millisecond-level transmission and processing delay cannot meet the microsecond-level real-time response and rapid fault protection requirements of high-power systems. Meanwhile, weak analog sensing signals need to be transmitted to a remote processor via long-distance wires. Under high-power conditions, they are easily affected by noise coupling interference from the alternating magnetic field of the power supply, resulting in distorted sampling signals, reduced monitoring accuracy, and false triggering of protection.

[0034] In this invention, the outer wall of the plastic housing 3 is provided with a mounting groove 15, and a comparator circuit board 16 is provided in the mounting groove 15.

[0035] A surface-mount sampling resistor 17 and a temperature sensor 18 are mounted on the side wall of the positive copper busbar 1. The surface-mount sampling resistor 17 and the temperature sensor 18 are connected to the input terminal of a comparator circuit board 16 via enameled wire 19. A shielded cable 20 is connected to the output terminal of the comparator circuit board 16. The surface-mount sampling resistor 17 is used to monitor the current flowing through the positive copper busbar 1, and the temperature sensor 18 is used to monitor the temperature of the positive copper busbar 1. Specifically, the surface-mount sampling resistor 17 can be an alloy surface-mount resistor of model ULR1S-R003FT2 or FCSL32R003GER, laser-welded onto the positive copper busbar 1. The temperature sensor 18 can be a surface-mount NTC thermistor or a surface-mount thermocouple, with its bottom pad fixed to the side wall of the positive copper busbar 1 by thermocompression welding. Before welding, flux is applied to the surface of the positive copper busbar 1, and after welding, a polyimide insulating coating is applied to the solder joint and the sensor body to ensure electrical insulation between them and the positive copper busbar 1.

[0036] This invention integrates the current and temperature sensing acquisition unit into the plug power circuit. The detection signal is directly connected to the comparator circuit board 16 built into the plug through the enameled wire 19. The comparator circuit board 16 performs signal discrimination and threshold comparison on the spot, converts the analog detection signal into a standard TTL digital level signal in real time, and finally transmits it directly to the device main control through an independent shielded cable 20.

[0037] This invention eliminates the need for any protocol chip decoding, slow bus encapsulation transmission, and backend MCU software polling and AD sampling calculations, completely eliminating millisecond-level delays caused by software processing and protocol interaction. It controls the total signal transmission and response delay to within 1μs, achieving hardware-level edge-triggered ultra-fast fault response. Simultaneously, the monitoring signal is transmitted via an independent shielded cable 20, isolating electromagnetic crosstalk from high-power circuits, improving monitoring accuracy and stability, and meeting the stringent requirements of microsecond-level dynamic power adjustment and ultra-fast overcurrent and overheat protection in high-end equipment.

[0038] In this invention, the grounding shield housing 14 is made of stainless steel. Although stainless steel has poor electrical conductivity, it has high magnetic permeability and can effectively absorb electromagnetic waves. An insulating pad 21 is provided between the positive copper busbar 1 and the negative copper busbar 2 and the grounding shield housing 14 to achieve insulation between the grounding shield housing 14 and the copper busbars.

[0039] To achieve grounding of the grounding shield housing 14, a conductive spring 22 is provided on the outer wall of the grounding shield housing 14. The conductive spring 22 can be welded to the outer wall of the plate 141. The outer shell 13 is a conductive shell, which can be a metal shell. The conductive spring 22 penetrates the plastic shell 3 and contacts the outer shell 13. Current and static charge generated by electromagnetic interference are transmitted to the outer shell 13 through the conductive spring 22. Generally, the power plug shell is grounded, and the outer shell 13 conducts the current and static charge into the ground.

[0040] In this invention, the injection-molded protective layer 11 is a polyetheretherketone (PEEK) layer with an injection pressure of 15 MPa-25 MPa. PEEK has high fluidity to fill microstructures, low dielectric constant and low dielectric loss factor, high temperature resistance, and low stress bonding properties.

[0041] The manufacturing method of the above-mentioned data power composite plug includes the following steps: S1. A positioning groove is made on the opposite side wall of the positive copper busbar 1 and the negative copper busbar 2. The positioning groove can be made by milling.

[0042] S2. Prepare a grounding shield housing 14, which includes two flat plates 141 and two connecting slots 142 that are adapted to the positioning slots.

[0043] Insert the insulating pad 21 into the positioning grooves of the positive copper busbar 1 and the negative copper busbar 2, then insert the connecting groove 142 into the positioning grooves of the positive copper busbar 1 and the negative copper busbar 2, and then insert both sides of the flexible circuit board 7 into the connecting groove 142 respectively. Ensure that the contacts 4 of the positive copper busbar 1, the contacts 4 of the negative copper busbar 2, and the plug-in terminals 8 of the flexible circuit board 7 are located at the same end, and that the ends of the plug-in terminals 8 and the contacts 4 are basically flush. During insertion, the plug-in terminals 8 and the contacts 4 can be stably connected to the equipment socket simultaneously.

[0044] S3. Solder signal line 10 to flexible circuit board 7 to form second solder joint 9; solder power line 6 to positive copper busbar 1 and negative copper busbar 2 to form first solder joint 5. Solder positive copper busbar 1 to the positive power line, and negative copper busbar 2 to the negative power line. Conventional soldering processes are sufficient. Figure 3 and Figure 4 As shown.

[0045] S4. An injection molding process with an injection pressure of 15MPa-25MPa is adopted, and an injection molding protective layer 11 is covered at the first solder point 5, the second solder point 9, and the insertion point of the flexible circuit board 7.

[0046] The injection pressure is controlled between 15MPa and 25MPa, which is about one-third to one-fifth of that of traditional injection molding processes. This will not cause cracking or damage to the solder joints, nor will it damage the flexible circuit board. The injection temperature is controlled between 330℃ and 360℃, the mold is preheated to 120℃ to 150℃, and the holding pressure time is two to four seconds.

[0047] Because the first solder point 5, the second solder point 9, and the flexible circuit board 7 are distributed in a dispersed manner and have different shapes and sizes, conventional injection molds (such as upper molds and lower molds) are difficult to meet the function of dispersed injection molding.

[0048] In this invention, during injection molding, a first injection mold is used, which includes a first lower mold 101, a first upper mold 102, a second upper mold 103, and a third upper mold 104. Wherein, as... Figure 5 and Figure 6 As shown, the top of the first lower mold 101 is provided with a positive copper busbar support groove 105, a negative copper busbar support groove 106, a circuit board support plane 107, a positive solder joint lower cavity 108, and a negative solder joint lower cavity 109. The positive copper busbar support groove 105 is used to support and position the positive copper busbar 1, and the negative copper busbar support groove 106 is used to support and position the negative copper busbar 2. The positive copper busbar support groove 105 passes through the positive solder joint lower cavity 108, and the negative copper busbar support groove 106 passes through the negative solder joint lower cavity 109. After the positive copper busbar 1 enters the positive copper busbar support groove 105 and the negative copper busbar 2 enters the negative copper busbar support groove 106, the first solder joint 5 is located in the middle position between the positive solder joint lower cavity 108 and the negative solder joint lower cavity 109.

[0049] The components completed in step S3 are installed into the first lower mold 101, and the flexible circuit board 7 is horizontal, as shown in the figure. Figure 7 As shown, the positive copper busbar 1 enters the positive copper busbar support groove 105, the negative copper busbar 2 enters the negative copper busbar support groove 106, the first solder point 5 is located in the cavity 108 below the positive solder point and the cavity 109 below the negative solder point, and the flexible circuit board 7 is supported by the circuit board support plane 107.

[0050] like Figure 8 As shown, a strip-shaped notch 110 is provided on one side of the lower surface of the first upper mold 102. When the lower end of the first upper mold 102 presses against the side of the flexible circuit board 7, and the side wall with the notch 110 is in close contact with the side wall of the connecting groove 142, the notch 110 becomes the first cavity located between the first upper mold 102 and the flexible circuit board 7, as shown. Figure 6 As shown. The top of the first upper mold 102 is provided with an injection port 111, which is connected to the notch 110 through the first injection channel 112. By connecting the injection head of the injection molding machine to the injection port 111, molten polyetheretherketone (PEEK) can be injected into the first cavity. After the PEEK cools, the first upper mold 102 is removed to obtain the injection-molded protective layer 11 at the insertion point of the flexible circuit board 7.

[0051] like Figure 9 As shown, the lower surface of the second upper mold 103 is provided with a hemispherical second cavity 113. The side wall of the second cavity 113 is reserved with a first wire-passing hole for the signal line 10 to pass through. The top of the second upper mold 103 is provided with an injection port 111, which is connected to the second cavity 113 through a second injection channel 114. When the lower end of the second upper mold 103 is pressed against the flexible circuit board 7 and the second solder point 9 is located in the middle of the second cavity 113, the injection head of the injection molding machine can be connected to the injection port 111. After injection molding is completed, an injection protective layer 11 covering the second solder point 9 is obtained.

[0052] like Figure 10 As shown, the lower surface of the third upper mold 104 is provided with a cuboid upper cavity 115, and the top of the third upper mold 104 is provided with an injection port 111, which is connected to the upper cavity 115 through the third injection channel 116. When the lower end of the third upper mold 104 presses against the first lower mold 101, the upper cavity 115 and the lower cavity 108 of the positive electrode solder joint or the lower cavity 109 of the negative electrode solder joint form a complete cavity. The cavity is reserved with a second wire hole for the power cord 6 to pass through. The injection head of the injection molding machine is connected to the injection port 111. After injection molding is completed, an injection protective layer 11 covering the first solder joint 5 is obtained.

[0053] The injection ports 111 at the top of the first upper mold 102, the second upper mold 103, and the third upper mold 104 have the same structure and size, and can all cooperate with the injection head of the injection molding machine to complete the injection of different parts. Compared with using a single mold, this reduces the complexity of the mold structure and shortens the length of the injection channel.

[0054] Elastic pads can be provided on the lower surfaces of the first upper mold 102 and the second upper mold 103 to prevent damage to the flexible circuit board 7.

[0055] S5. Weld the two sides of the plate 141 to the connecting groove 142 to form a grounding shield shell 14 surrounding the flexible circuit board 7. An air cavity 12 is formed between the two sides of the flexible circuit board 7 and the plate 141.

[0056] Next, conductive spring contacts 22 are welded to the outer wall of the plate 141. There can be two conductive spring contacts 22, which are made of conductive thin sheets, such as... Figure 11 As shown.

[0057] S6. The plastic shell 3 is formed by injection molding process with an injection pressure of 80MPa-120MPa, injection temperature of 280℃-300℃, and holding time of 5s-10s. The plastic shell 3 covers the main body of the positive copper busbar 1 and the negative copper busbar 2, the first solder point 5, the outer wall of the grounding shield shell 14, and the contacts 4 and plug terminals 8 are exposed.

[0058] In step S6, a mounting hole is pre-drilled in the side wall of the positive copper busbar 1 to penetrate the plastic housing 3. After step S6, a surface-mount sampling resistor 17 and a temperature sensor 18 are installed on the side wall of the positive copper busbar 1 through the mounting hole, and one end of the enameled wire 19 is soldered to the surface-mount sampling resistor 17 and the temperature sensor 18. Then, a plastic plug 23 is inserted into the mounting hole. The plastic plug 23 has a third through hole, and the enameled wire 19 passes through the third through hole of the plastic plug 23. A mounting slot 15 is pre-drilled at the opening of the mounting hole. The comparator circuit board 16 is installed into the mounting slot 15, and the enameled wire 19 is soldered to the input end of the comparator circuit board 16. A shielded cable 20 is soldered to the output end of the comparator circuit board 16.

[0059] Simultaneously, in step S6, the conductive spring 22 penetrates the plastic shell 3. After step S6, a conductive outer shell 13 is fitted over the plastic shell 3, with the inner wall of the outer shell 13 pressed tightly against the conductive spring 22. Since the conductive spring 22 is a thin sheet, after the plastic shell 3 is formed, the conductive spring 22 located outside the plastic shell 3 can be bent, so that the conductive spring 22 located outside the plastic shell 3 fits against the outer wall of the plastic shell 3. After the outer shell 13 is installed, the inner wall of the outer shell 13 can effectively contact the conductive spring 22. The outer shell 13 can be snapped into the plastic shell 3.

[0060] In step S6, injection molding is performed using a second injection mold, such as... Figure 12 and 13As shown, the second injection mold includes a second lower mold 201 and a fourth upper mold 202. During this injection molding, the plug-in end of the plug (i.e., the end with the plug terminal 8 and the contact 4) faces downwards, and the other end faces upwards. The top of the second lower mold 201 is provided with a lower molding cavity. The bottom of the lower molding cavity is provided with two first positioning holes 203 for accommodating the contact 4 and two second positioning holes 204 for accommodating the plug terminal 8. The bottom of the lower molding cavity is provided with two support plates 205 for supporting the inner wall of the plate 141. The top of the two support plates 205 is provided with a sealing plate 206 for sealing the upper port of the air cavity 12. The sealing plate 206 is made of a high-temperature resistant insulating material, preferably, such as... Figure 14 As shown, the sealing plate 206 includes an upper insulating layer, a middle high-temperature resistant layer, and a lower insulating layer. The upper and lower insulating layers are made of the same material as the plastic shell 3. The middle high-temperature resistant layer can be fiberglass. The middle high-temperature resistant layer has multiple through holes. The upper and lower insulating layers are connected by connecting posts that pass through the through holes. The connecting posts, the upper insulating layer, and the lower insulating layer are integrally molded by injection molding. The sealing plate 206 is detachably connected to the support plate 205. Specifically, a limiting boss can be provided on the upper surface of the support plate 205, and a limiting groove can be provided on the lower surface of the sealing plate 206. The limiting boss extends into the limiting groove to prevent the sealing plate 206 from moving horizontally. Under the weight of the sealing plate 206 itself and the injection pressure, the sealing performance between the sealing plate 206 and the support plate 205, as well as the stability of the sealing plate 206, can be guaranteed. The side wall of the lower molding cavity is provided with a pluggable mounting hole molding post 209.

[0061] The bottom of the fourth upper mold 202 is provided with an upper molding cavity. The top wall of the upper molding cavity is provided with a fourth wire-passing hole 207 for the power line 6 and signal line 10 to pass through and a fourth injection channel 208 for injection molding. The parting surface of the second lower mold 201 is provided with a vertically downward extending groove, and the parting surface of the fourth upper mold 202 is provided with a vertically downward extending boss. The boss cooperates with the groove to form a conductive spring hole 210 at the bottom of the groove.

[0062] During injection molding Figure 11The plug's contact 4 is inserted downwards into the second lower mold 201, allowing it to enter the first positioning hole 203 in the bottom wall of the lower molding cavity. Simultaneously, the plug terminal 8 enters the second positioning hole 204, and the two support plates 205 enter the air cavity 12, with the sidewalls of the support plates 205 adhering to the inner wall of the support plate 141. At this time, the lower port of the air cavity 12 is sealed by the bottom wall of the lower molding cavity, while the upper port remains open. Then, the sealing plate 206 is installed on top of the support plate 205, sealing the upper port of the air cavity 12. Next, the mounting hole forming post 209 is inserted, with its end adhering to the sidewall of the positive copper busbar 1. Then, the power line 6 and signal line 10 are passed through the corresponding fourth wire hole 207, and the mold is closed, forming a complete cavity with the upper and lower molding cavities. The conductive spring 22 is located in the conductive spring hole 210. Molten glass fiber reinforced nylon is then injected through the fourth injection channel 208. Because the support plate 205 supports the inner wall of the plate 141, it can effectively prevent the thin plate 141 from deforming under injection pressure. Since the upper and lower insulating layers are made of the same material as the plastic shell 3, when the molten material comes into contact with the upper insulating layer, it causes the upper insulating layer to melt, thus becoming integrated with the plastic shell 3. Due to the short injection time and rapid cooling after injection, the upper insulating layer will not completely melt. After cooling, the sealing plate 206 is integrally integrated with the plastic shell 3, resulting in high connection strength. During demolding, the support plate 205 can be directly pulled out, while the sealing plate 206 remains inside the plug and does not need to be removed.

[0063] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A data power composite plug, comprising a positive copper busbar (1), a negative copper busbar (2), a signal transmission component, and a plastic housing (3), wherein one end of the positive copper busbar (1) and the negative copper busbar (2) is provided with a contact (4), and the other end is connected to a power cord (6) through a first solder joint (5), characterized in that: The positive copper busbar (1) and the negative copper busbar (2) are provided with positioning grooves on their opposite sidewalls; the signal transmission component includes a flexible circuit board (7), one end of the flexible circuit board (7) is provided with a plug-in terminal (8), and the other end is connected to a signal line (10) through a second solder point (9); the flexible circuit board (7) is located between the positive copper busbar (1) and the negative copper busbar (2), and the two sides of the flexible circuit board (7) are respectively plugged into the positioning grooves on the sidewalls of the positive copper busbar (1) and the negative copper busbar (2), and an annular grounding shield shell (14) is provided around the flexible circuit board (7); The first solder joint (5), the second solder joint (9), and the flexible circuit board (7) are all covered with an injection molding protective layer (11). The plastic shell (3) covers the main body of the positive copper busbar (1) and the negative copper busbar (2), the first solder joint (5) and the grounding shield shell (14), the contact (4) and the plug-in terminal (8) are exposed, and an air cavity (12) is provided between the two sides of the flexible circuit board (7) and the grounding shield shell (14).

2. The data and power composite plug as described in claim 1, characterized in that: The plastic housing (3) is provided with a detachable outer housing (13).

3. The data and power composite plug as described in claim 2, characterized in that: The outer wall of the plastic housing (3) is provided with a mounting groove (15), and a comparator circuit board (16) is provided in the mounting groove (15). The positive copper busbar (1) is provided with a patch sampling resistor (17) and a temperature sensor (18) on its side wall. The patch sampling resistor (17) and the temperature sensor (18) are connected to the input terminal of the comparator circuit board (16) through an enameled wire (19). The output terminal of the comparator circuit board (16) is connected to a shielded cable (20).

4. The data and power composite plug as described in claim 2, characterized in that: The grounding shield housing (14) is made of stainless steel, and an insulating pad (21) is provided between the positive copper busbar (1) and the negative copper busbar (2) and the grounding shield housing (14).

5. The data and power composite plug as described in claim 4, characterized in that: The outer wall of the grounding shield housing (14) is provided with a conductive spring (22), the outer shell (13) is a conductive shell, and the conductive spring (22) penetrates the plastic shell (3) and contacts the outer shell (13).

6. The data and power composite plug as described in claim 1, characterized in that: The injection protective layer (11) is a polyether ether ketone layer with an injection pressure of 15MPa-25MPa.

7. The method for manufacturing the data power composite plug according to claim 1, characterized in that: Includes the following steps: S1. A positioning groove is made on the opposite side wall of the positive copper busbar (1) and the negative copper busbar (2); S2. The grounding shield housing (14) includes two flat plates (141) and two connecting slots (142) that are adapted to the positioning slots. The connecting slots (142) are installed into the positioning slots of the positive copper busbar (1) and the negative copper busbar (2). Then, the two sides of the flexible circuit board (7) are inserted into the connecting slots (142) respectively, ensuring that the contacts (4) of the positive copper busbar (1), the contacts (4) of the negative copper busbar (2) and the plug-in terminals (8) of the flexible circuit board (7) are located at the same end. S3. Solder the signal line (10) to the flexible circuit board (7) to form the second solder joint (9); solder the power line (6) to the positive copper busbar (1) and the negative copper busbar (2) to form the first solder joint (5). S4. Using an injection molding process with an injection pressure of 15MPa-25MPa, an injection protective layer (11) is covered at the first solder point (5), the second solder point (9), and the insertion point of the flexible circuit board (7). S5. Weld the two sides of the plate (141) to the connecting groove (142) to form a grounding shield shell (14) surrounding the flexible circuit board (7). There is an air cavity (12) between the two sides of the flexible circuit board (7) and the plate (141). S6. A plastic shell (3) is formed by injection molding process with an injection pressure of 80MPa-120MPa. The plastic shell (3) covers the main body of the positive copper busbar (1) and the negative copper busbar (2), the first solder point (5), the outer wall of the grounding shield shell (14), and the contacts (4) and plug terminals (8) are exposed.

8. The manufacturing method according to claim 7, characterized in that: In step S6, an installation hole is pre-drilled in the side wall of the positive copper busbar (1) to penetrate the plastic shell (3); After step S6, a surface-mount sampling resistor (17) and a temperature sensor (18) are installed on the side wall of the positive copper busbar (1) through the mounting hole, and one end of the enameled wire (19) is soldered to the surface-mount sampling resistor (17) and the temperature sensor (18); then a plastic plug (23) is inserted into the mounting hole, and the enameled wire (19) passes through the plastic plug (23); a mounting slot (15) is reserved at the opening of the mounting hole, and the comparator circuit board (16) is installed into the mounting slot (15), and the enameled wire (19) is soldered to the input end of the comparator circuit board (16); and a shielded cable (20) is soldered to the output end of the comparator circuit board (16).

9. The manufacturing method according to claim 7, characterized in that: Before step S6, a conductive spring sheet (22) is welded to the outer wall of the plate (141). In step S6, the conductive spring (22) penetrates the plastic shell (3). After step S6, a conductive outer shell (13) is fitted over the plastic shell (3), and the inner wall of the outer shell (13) is pressed into contact with the conductive spring sheet (22).

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