A power chip embedded PCB assembly and a preparation method thereof

Abstract

The application relates to the technical field of PCB assemblies, and discloses a power chip embedded PCB assembly and a preparation method, which comprises a substrate and electronic elements arranged above the substrate; a chip groove is formed in the substrate; a power chip is embeddedly arranged in the chip groove; a chip fixing mechanism, a pin fixing mechanism and an ejection mechanism are arranged on the substrate. Through the arrangement of the chip fixing mechanism, two chip fixing mechanisms form a detachable locking structure, the power chip is fixed in the chip groove, and the chip fixing mechanism has bidirectional working states of locking and unlocking; the power chip can be stably locked after assembly, the long-term working stability requirement of the embedded PCB assembly is met, the fixed state can be manually released according to the maintenance requirement, a structural basis is provided for the separate disassembly and replacement of the power chip, and the problem that the traditional embedded chip is difficult to disassemble is solved from the structural level.

Description

Technical Field

[0001] This invention relates to the field of PCB assembly technology, and specifically to a power chip embedded PCB assembly and its fabrication method. Background Technology

[0002] Existing embedded PCB assemblies for power chips generally adopt an integrated packaging structure with embedded slots, in which the power chip is directly embedded into the pre-set slots of the PCB substrate. The chip is fixed by pressing, potting, and encapsulation curing. With its advantages of high integration, low parasitic parameters, and excellent vibration resistance, it is widely used in various power electronic devices and can effectively improve the overall operating stability and heat dissipation performance of the circuit.

[0003] Chinese patent CN217693819U discloses a "high-frequency circuit board with an embedded chip," comprising a shielding cover, a perforated cover, and two unit circuit boards. One end of each unit circuit board is fixedly connected to the left inner wall of the perforated cover, and the other end is fixedly connected to the right inner wall of the perforated cover. A high-frequency board is provided between the two unit circuit boards, and a mounting groove is embedded in the high-frequency board, in which a chip is installed. A shielding layer is provided on the inner wall of the mounting groove. Each unit circuit board includes a substrate, an upper circuit layer on top of the substrate, and a lower circuit layer on the bottom of the substrate. A thermally conductive adhesive layer is provided between the upper and lower circuit layers and the substrate. The shielding cover is fitted over the perforated cover. Multiple cooling fans are provided on the inner wall of the shielding cover. This design can shield against external electromagnetic interference, preventing external electromagnetic interference from affecting the chip and ensuring the normal operation of the chip. It also has good heat dissipation effect, improving the service life of the high-frequency circuit board.

[0004] However, the existing technology has the following problems: In existing technologies, chips are fixed by a curing method. The chips are solidified inside the PCB slot and do not have independent disassembly capabilities. When the chip is damaged or fails, it is difficult to disassemble and replace the chip separately. Forcibly removing the chip can easily damage the substrate circuitry and the slot structure. If the entire substrate is replaced directly, it will result in material waste. Summary of the Invention

[0005] The purpose of this invention is to provide a power chip embedded PCB assembly and its manufacturing method to solve the above-mentioned problems, thereby overcoming the difficulty in disassembling existing embedded chips, as detailed below.

[0006] To achieve the above objectives, the present invention provides the following technical solution: This invention provides a power chip embedded PCB assembly, including a substrate and electronic components disposed thereon. The substrate has a chip slot, in which a power chip is embedded. The substrate has a chip fixing mechanism for fixing the power chip to the substrate, and the chip fixing mechanism is capable of being released from its fixing state. The substrate also has a pin fixing mechanism, which, when fixing the power chip, is triggered to fix the pins of the power chip. Finally, the substrate has an ejection mechanism, which, when the chip fixing mechanism is released from its fixing state, is triggered to eject the power chip.

[0007] Preferably, the substrate has two circular grooves, each containing a positioning groove. The two positioning grooves are connected to the chip slots, and the power chip has positioning blocks connected to both ends. The two positioning blocks are respectively matched with the two positioning grooves.

[0008] Preferably, there are two chip fixing mechanisms, each located in one of the two circular grooves.

[0009] Preferably, the chip fixing mechanism includes a fixing plate, which is rotatably mounted in a circular groove. The fixing plate has a slot, and the bottom surface of the fixing plate can abut against the top surface of the positioning block embedded in the positioning groove. The range of the slot is larger than the positioning groove.

[0010] Preferably, a slider and a locking block are slidably mounted on the fixing plate, a pull rod is hinged between the slider and the locking block, an elastic reset member is provided between the slider and the fixing plate, the sliding trajectory of the locking block on the fixing plate is inclined upward, the locking block can move upward when it slides towards the fixing plate, and a locking groove matching the locking block is opened in the circular groove, the locking block can disengage from the locking groove after moving upward.

[0011] Preferably, the slider has a protrusion, and the protrusion has a flat groove.

[0012] Preferably, the pin fixing mechanism includes a pressure foot bracket, the substrate is provided with multiple pin slots, after the power chip is installed into the chip slot, its pins are embedded one-to-one into the multiple pin slots, the pressure foot bracket is provided with multiple pressure blocks corresponding one-to-one with the multiple pin slots, the pressure foot bracket is connected to two protrusions, and the fixing plate is equipped with a retaining block, the two retaining blocks can press the pressure foot bracket tightly through the two protrusions.

[0013] Preferably, the buckle block is provided with a flange, and when the buckle block rotates, it passes over the protruding rod and presses the protruding rod tightly through the flange. The flange has chamfers at both ends.

[0014] Preferably, the ejection mechanism includes two slide blocks, both of which are slidably mounted on the substrate. A connecting rod is connected to the bottom of each slide block, and a flexible belt is connected between the two connecting rods. The flexible belt passes through the chip slot and is located between the bottom of the power chip and the chip slot. A protrusion is connected to the fixing plate at the position opposite to the slot opening. A triangular block is provided at the top of the slide block, and two triangular blocks are respectively located on the movement trajectory of two protrusions. When the two protrusions contact the two triangular blocks, they cause the two triangular blocks to move away from each other.

[0015] A method for fabricating an embedded PCB assembly for a power chip includes the following steps: Step 1: Substrate processing and shaping, preparing PCB substrate, cutting and leveling the substrate, and completing the overall grooving process of the substrate; Step 2: Assemble the basic components on the substrate. Perform circuit etching, solder masking, and surface treatment on the processed substrate. Step 3: Pre-assembly of functional mechanisms, including pre-fabrication of chip fixing mechanisms, pin fixing mechanisms, and ejection mechanisms; Step 4: Assemble the functional mechanism by rotating and installing the two pre-assembled chip fixing mechanisms into the two circular slots on the substrate. Step 5: Pre-positioning and assembly of power chips, vertically embedding the power chips into the chip slots from top to bottom; Step 6: Lock the chip and fix the pins to complete the embedded and stable assembly of the power chip.

[0016] The beneficial effects are: 1. This power chip embedded PCB assembly, through the setting of the chip fixing mechanism, makes the two chip fixing mechanisms form a detachable locking structure, fixing the power chip in the chip slot. The chip fixing mechanism has a two-way working state of locking and unlocking. It can not only achieve a stable locking of the power chip after assembly to meet the long-term working stability requirements of the embedded PCB assembly, but also manually release the fixing state according to maintenance needs, providing a structural basis for the individual disassembly and replacement of the power chip. It solves the problem of traditional embedded chips being difficult to disassemble from a structural level.

[0017] 2. The embedded PCB assembly for the power chip uses a pin fixing mechanism that works in conjunction with the chip fixing mechanism. This mechanism automatically clamps and locks the pins while the power chip is being locked in place. The multi-point clamping block structure of the pressure foot bracket clamps the power chip pins as a whole, ensuring that the pins are in close contact with the circuit inside the pin slot of the substrate, thus ensuring the stability and continuity of the circuit conduction.

[0018] 3. The embedded PCB assembly of the power chip, through the setting of the ejection mechanism, enables the ejection mechanism to be mechanically triggered by the unlocking action of the chip fixing mechanism. The power chip is smoothly ejected through the deformation and flattening action of the flexible belt, making the upper part of the power chip easier to remove after exposure, reducing the difficulty of disassembly. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the substrate structure of the present invention; Figure 3 This is a schematic diagram of the chip slot structure of the present invention; Figure 4 This is a schematic diagram of the power chip structure of the present invention; Figure 5 This is a schematic diagram of the chip fixing mechanism of the present invention; Figure 6 This is a schematic diagram of the fixing plate structure of the present invention; Figure 7 This is a schematic diagram of the slider structure of the present invention; Figure 8 This is a schematic diagram of the card block structure of the present invention; Figure 9 This is a schematic diagram of the pin fixing mechanism of the present invention; Figure 10 This is a schematic diagram of the presser foot bracket structure of the present invention; Figure 11 This is a schematic diagram of the ejection mechanism structure of the present invention; Figure 12 This is a schematic diagram of the flexible strip structure of the present invention.

[0021] The annotations in the attached figures are explained as follows: 1. Substrate; 11. Chip slot; 12. Circular groove; 13. Positioning groove; 14. Card slot; 2. Power chip; 21. Positioning block; 3. Chip fixing mechanism; 31. Fixing plate; 32. Slider; 33. Locking block; 34. Pull rod; 4. Pin fixing mechanism; 41. Pressure foot bracket; 42. Protruding rod; 43. Buckling block; 5. Ejection mechanism; 51. Protrusion; 52. Slide; 53. Connecting rod; 54. Flexible belt. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0023] In the following description, certain specific details are set forth for the purpose of illustrating various disclosed embodiments in order to provide a thorough understanding of the various disclosed embodiments. However, those skilled in the art will recognize that embodiments may be practiced without one or more of these specific details. In other instances, well-known apparatuses, structures, and techniques associated with this application may not have been shown or described in detail to avoid unnecessarily obscuring the description of the embodiments.

[0024] Throughout this specification, references to "one embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in one embodiment" or "in another embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0025] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0026] In the description of this application, "multiple" means two or more, unless otherwise expressly and specifically defined.

[0027] To address the problem of the difficulty in disassembling the embedded power chip 2, this application proposes the following first embodiment: Please see Figure 1 - Figure 10An embedded PCB assembly for a power chip includes a substrate 1 and electronic components disposed on it. The substrate 1 has a chip slot 11, in which a power chip 2 is embedded. The substrate 1 has two circular slots 12, in which positioning slots 13 are formed. The two positioning slots 13 are connected to the chip slot 11. Positioning blocks 21 are connected to both ends of the power chip 2. The two positioning blocks 21 are matched with the two positioning slots 13 respectively. In the initial assembly state, the two positioning slots 13 provide alignment space for the vertical assembly of the power chip 2. When the operator places the power chip 2 vertically into the chip slot 11 from top to bottom, the positioning blocks 21 fixed at both ends of the power chip 2 will be simultaneously embedded into the corresponding connected positioning slots 13. Through the precise matching and cooperation between the positioning slots 13 and the positioning blocks 21, the horizontal positioning of the power chip 2 in the chip slot 11 is achieved, ensuring the positional accuracy of the embedded installation of the power chip 2 and preventing the power chip 2 from loosening or shifting during the assembly process.

[0028] Furthermore, a chip fixing mechanism 3 is provided on the substrate 1 to fix the power chip 2 on the substrate 1. The chip fixing mechanism 3 can be released from the fixing state. There are two chip fixing mechanisms 3, which are located in two circular grooves 12 respectively. The two chip fixing mechanisms 3 form a detachable locking structure and adopt a double-set symmetrical arrangement. It can fix the power chip 2 in the chip groove 11. Compared with the traditional one-piece sealed structure, the chip fixing mechanism 3 has a two-way working state of locking and unlocking. It can not only achieve a stable lock of the power chip 2 after assembly to meet the long-term working stability requirements of embedded PCB components, but also manually release the fixing state according to maintenance needs, providing a structural basis for the individual disassembly and replacement of the power chip 2. It solves the problem of traditional embedded chips being difficult to disassemble from a structural perspective.

[0029] Specifically, the chip fixing mechanism 3 includes a fixing piece 31, which is rotatably installed in the circular groove 12. The fixing piece 31 has a slot, and the bottom surface of the fixing piece 31 can abut against the top surface of the positioning block 21 embedded in the positioning groove 13. The slot is larger than the positioning groove 13. In the initial assembly state, the slot of the fixing piece 31 faces the top of the positioning groove 13, and the size of the slot is larger than the positioning groove 13, completely exposing the area of ​​the positioning groove 13. It will not block the vertical assembly path of the power chip 2 and the positioning block 21. After the power chip 2 is pre-positioned, the fixing piece 31 is rotated to offset the slot from the positioning groove 13. At this time, the solid part of the fixing piece 31 completely covers the top of the positioning groove 13, and the bottom surface of the fixing piece 31 presses tightly against the top surface of the positioning block 21 to achieve the longitudinal limitation of the positioning block 21. With the planar limitation of the positioning groove 13, the locking and fixing of the power chip 2 is completed.

[0030] In addition, a slider 32 and a locking block 33 are slidably mounted on the fixing plate 31. A pull rod 34 is hinged between the slider 32 and the locking block 33. An elastic reset element is provided between the slider 32 and the fixing plate 31. The elastic reset element is preferably a spring or leaf spring. The slider 32 has a protrusion with a flat groove. The sliding trajectory of the locking block 33 on the fixing plate 31 is inclined upward. The locking block 33 is slidably mounted on the fixing plate 31 through the cooperation of the slide rail and the slide tongue. The slide rail is inclined, so the locking block 33 slides downward along the trajectory when it moves away from the slider 32 and upward along the trajectory when it moves closer to the slider 32. When the locking block 33 slides towards the fixing plate 31, it can move upward. A locking groove 14 matching the locking block 33 is provided in the circular groove 12. After the locking block 33 moves upward, it can disengage from the locking groove 14. The slider 32, the locking block 33, the pull rod 34, and the elastic reset member constitute the self-locking limiting assembly of the fixing piece 31. During the rotation and locking process of the fixing piece 31, the locking block 33 slides along the circular groove 12. At this time, the elastic reset member remains in a stored state. When the fixing piece 31 rotates to the position, the locking block 33 is just aligned with the slot 14 in the circular groove 12. The elastic reset member releases its elastic force, pushing the slider 32 to slide. The slider 32 pushes the locking block 33 to move through the hinged pull rod 34. Due to the limitation of the inclined sliding trajectory, the locking block 33 moves down synchronously and is locked into the slot 14. Through the locking engagement between the locking block 33 and the slot 14, the circumferential rotation of the fixing piece 31 is limited, which prevents the fixing piece 31 from loosening due to vibration during subsequent operation of the substrate 1, and ensures the long-term stability of the chip fixing mechanism 3.

[0031] It is worth mentioning that the flat groove of the protrusion of the slider 32 can be used with tools such as flathead screwdrivers to apply force, providing an operating structure for subsequent manual unlocking. During disassembly, the flathead screwdriver or other compatible tools are inserted into the flat groove of the protrusion, and the two sliders 32 are pushed in opposite directions from both sides at the same time, causing the two sliders 32 to slide towards each other. During the sliding process, the slider 32 compresses the elastic reset member to store force again. At the same time, the slider 32 pulls the locking block 33 to move synchronously through the hinged pull rod 34. Constrained by the upward sliding trajectory of the locking block 33, the locking block 33 slides upward with the pulling action, gradually disengaging from the locking groove 14 inside the circular groove 12, completely releasing the locking and limiting relationship between the locking block 33 and the locking groove 14, and eliminating the circumferential locking constraint of the fixing plate 31. At this time, a tool can be used to apply an oblique rotational torque to the fixing plate 31, causing the fixing plate 31 to rotate, so that the groove of the fixing plate 31 returns to the position directly above the positioning groove 13, releasing the vertical pressure fixing of the bottom of the fixing plate 31 against the positioning block 21.

[0032] It is worth noting that the substrate 1 is provided with a pin fixing mechanism 4. When the chip fixing mechanism 3 fixes the power chip 2, it triggers the pin fixing mechanism 4 to fix the pins of the power chip 2. The pin fixing mechanism 4 includes a pressure foot bracket 41. The substrate 1 is provided with multiple pin slots. After the power chip 2 is installed into the chip slot 11, its pins are embedded into the multiple pin slots one by one. The pressure foot bracket 41 is provided with multiple pressure blocks that correspond one by one to the multiple pin slots. Two protrusions 42 are connected to the pressure foot bracket 41. A retaining block 43 is installed on the fixing plate 31. The retaining block 43 is provided with a flange. When the retaining block 43 rotates, it passes over the protrusion 42 and presses the protrusion 42 through the flange. The flange has chamfers at both ends. The two retaining blocks 43 can press the pressure foot bracket 41 through the two protrusions 42. After the power chip 2 is assembled into the chip slot 11, its pins are accurately embedded into the pin slots of the substrate 1, ensuring that the pins are in contact with the PCB substrate. Precise alignment of the internal circuitry of board 1 provides the foundation for circuit conduction. In the initial state, the pressure foot bracket 41 can be flipped upwards. After assembly, the pressure foot bracket 41 is manually pressed down so that the pressure block at the bottom of the pressure foot bracket 41 presses against the pins in the pin slots, achieving initial pin positioning. During the process of the fixing plate 31 rotating to lock the chip, the locking block 43 is rotated synchronously. The flange of the locking block 43 rotates to the top of the protrusion 42. The chamfers at both ends of the flange can play a guiding transition role, avoiding rigid compression and jamming. Finally, the flange presses against the protrusion 42, achieving overall locking and fixing of the pressure foot bracket 41, thereby firmly pressing the pins and preventing pins from becoming loose or having poor connections. This ensures that the pins are stably attached to the PCB circuitry, guaranteeing the continuity and stability of circuit conduction. Conversely, when the fixing plate 31 is rotated to release the fixation, the locking block 43 disengages from the protrusion 42, and the pressure foot bracket 41 can be lifted upwards, allowing the power chip 2 to be removed.

[0033] Since the power chip 2 is embedded in the chip slot 11, it is inconvenient to remove it. Therefore, a second embodiment is proposed based on the first embodiment: Please see Figure 3 , Figure 11 , Figure 12The substrate 1 is provided with an ejection mechanism 5. When the chip fixing mechanism 3 is released from its fixed state, the ejection mechanism 5 is triggered to eject the power chip 2. The ejection mechanism 5 includes two slides 52, both of which are slidably mounted on the substrate 1. A connecting rod 53 is connected to the bottom of the slide 52, and a flexible strip 54 is connected between the two connecting rods 53. The flexible strip 54 passes through the chip slot 11 and is located between the bottom of the power chip 2 and the chip slot 11. A protrusion 51 is connected to the fixing piece 31 at the position opposite to the slot opening. A triangular block is provided at the top of the slide 52. The two triangular blocks are located on the movement trajectory of the two protrusions 51, respectively. When the two protrusions 51 contact the two triangular blocks, they cause the two triangular blocks to move away from each other. The chip slot 11 has a pre-set strip groove that matches the flexible strip 54. When the chip is in normal working condition, the flexible strip 54 is housed inside the strip groove and is recessed to fit the bottom of the power chip 2, completely fitting the slot structure. It does not raise the power chip 2 and does not affect the fitting accuracy between the power chip 2 and the chip slot 11. During the process of installing the power chip 2 into the chip slot 11, the power chip 2 first applies pressure to the flexible strip 54 to embed it into the strip groove. The flexible strip 54 pulls the two connecting rods 53 towards the middle through its two ends, so that the triangular blocks of the two slides 52 are respectively located on the movement trajectory of the two protrusions 51. The flexible strip 54 has a certain elastic tensile deformation capability to avoid rigid movement interference.

[0034] When the power chip 2 needs to be disassembled and the two fixing plates 31 are rotated to unlock, the fixing plates 31 synchronously drive the protrusions 51 at the ends to rotate. When the slot of the fixing plate 31 is about to be directly above the positioning block 21, that is, when the slot of the fixing plate 31 is about to be aligned with the positioning block 21, the protrusion 51 contacts the triangular block at the top of the slide block 52 during the subsequent rotation. Using the inclined plane transmission principle of the triangular block, the rotational force of the fixing plate 31 is converted into the lateral separation thrust of the two triangular blocks, which drives the two slide blocks 52 to slide away from each other. When the two slots are aligned with the two positioning blocks 21, the two slide blocks 52 move away from each other. When the slide blocks 52 slide, they synchronously drive the connecting rod 53 at the bottom to move, which in turn pulls the flexible band 54 in the middle, so that the flexible band 54, which was originally concave and attached to the bottom of the chip, is gradually flattened. Using the deformation thrust of the flexible band 54, the power chip 2 is smoothly pushed upward out of the chip slot 11, so that the bottom of the power chip 2 is separated from the chip slot 11 and the upper part of the power chip 2 is exposed, which makes it convenient for the staff to pick up and disassemble directly, greatly improving the disassembly efficiency.

[0035] A third embodiment, a method for fabricating a power chip embedded PCB assembly, applied to the power chip embedded PCB assembly described in the above embodiments, further includes the following steps: Step 1: Substrate processing and forming. Prepare PCB substrate 1. Cut and flatten the substrate 1. According to the design dimensions, open a chip slot 11 in the middle of the substrate 1 for embedding power chip 2. Open two circular slots 12 symmetrically on the left and right sides of the chip slot 11. Process a positioning slot 13 that communicates with the chip slot 11 inside the circular slot 12. At the same time, open a card slot 14 inside the circular slot 12. Pre-fabricate a strip groove with matching flexible strip 54 at the bottom of the chip slot 11 to complete the overall slotting process of substrate 1. Step 2: Assemble basic components on the substrate. Perform circuit etching, solder masking, and surface treatment on the processed substrate 1. Arrange and solder conventional electronic components on the surface of substrate 1. At the same time, process multiple pin slots at the corresponding pin positions of power chip 2 on substrate 1 to ensure that the pin slots are accurately aligned with the pins of subsequent chips. Step 3: Pre-assemble the functional mechanism, pre-assemble the chip fixing mechanism 3, the pin fixing mechanism 4 and the ejection mechanism 5, assemble the slider 32, the locking block 33, the elastic reset part, the buckling block 43 and the protrusion 51 into the corresponding positions on the fixing plate 31, the pull rod 34 is hinged between the slider 32 and the locking block 33, and assemble the pressure foot bracket 41 and the protrusion rod 42 into one piece. Step 4: Assemble the functional mechanism. Rotate the two pre-assembled chip fixing mechanisms 3 into the two circular grooves 12 of the substrate 1, so that the fixing piece 31 can rotate freely. Rotate the pressure foot bracket 41 above the corresponding pin slot of the substrate 1. Embed the two slide blocks 52 of the ejection mechanism 5 into the preset sliding position of the substrate 1. Pass the flexible strip 54 through the bottom of the chip slot 11 and align it with the strip groove. Then connect the two ends through the connecting rod 53 and then dock the connecting rod 53 with the two slide blocks 52 respectively. Step 5: Pre-positioning and assembly of power chip 2. Align the positioning blocks 21 at both ends of power chip 2 with the positioning grooves 13 of substrate 1. Vertically embed power chip 2 into chip groove 11 from top to bottom, so that positioning blocks 21 are completely inserted into positioning groove 13, thus completing the horizontal pre-positioning of power chip 2. At the same time, press the flexible strip 54 at the bottom of power chip 2 to embed it into the strip groove and make it in a concave and fitted state. Step Six: Chip Locking and Pin Fixing. Rotate the two fixing plates 31 to misalign the slot with the positioning slot 13. Use the bottom surface of the fixing plate 31 to press the positioning block 21 to complete the longitudinal locking. The elastic reset member stores and releases force to push the card block 33 into the card slot 14, realizing the circumferential self-locking of the fixing plate 31. Press down the pressure foot bracket 41 to press the pressure block to press the pin of the power chip 2. The rotation of the fixing plate 31 synchronously drives the buckle block 43 to press the protrusion 42, locking and fixing the pressure foot bracket 41, completing the embedded and stable assembly of the power chip 2.

[0036] When assembling the power chip 2 in the embedded PCB assembly, the slot of the fixing piece 31 is aligned with the top of the positioning slot 13. The power chip 2 is vertically inserted into the chip slot 11 of the substrate 1 from top to bottom. The positioning blocks 21 at both ends of the power chip 2 are embedded in the positioning slots 13 connected to the inner side of the circular slots 12 of the substrate 1, completing the horizontal alignment and pre-limiting of the power chip 2. After the power chip 2 is in place, the fixing pieces 31 in the circular slots 12 on both sides are rotated to misalign the slots of the fixing pieces 31 with the positioning slots 13. The bottom surface of the fixing pieces 31 presses against the top surface of the positioning blocks 21 to achieve vertical limiting and locking. During the rotation of the fixing pieces 31, the locking blocks 33 slide along the circular slots 12. At this time, the elastic reset member remains in a stored state. When the fixing pieces 31 are rotated into place, the locking blocks 33 are exactly aligned with the locking slots 14 in the circular slots 12. The elastic reset member releases its elastic force, pushing the slider 32 to slide. The slider 32 pushes the locking block 32 through the hinged pull rod 34. As block 33 moves, restricted by the inclined sliding trajectory, block 33 moves down synchronously and engages with slot 14. Through the engagement of block 33 and slot 14, the circumferential rotation limit of fixing piece 31 is achieved. At the same time, fixing piece 31 drives buckling block 43 to rotate synchronously, so that the flange of buckling block 43 presses against the protrusion 42 of presser foot bracket 41, locking and fixing the pre-pressed presser foot bracket 41. The pressing block at the bottom of presser foot bracket 41 presses against the pin of power chip 2 embedded in the pin slot of substrate 1, achieving stable pin pressing and stable electrical conduction. In the assembled state, the flexible strip 54 of ejection mechanism 5 is pressed into the strip groove of chip slot 11 by power chip 2 and is in a concave shape to fit the bottom of power chip 2. Slide 52 and connecting rod 53 are pulled by flexible strip 54 and move to a position close to chip slot 11. At this time, the two triangular blocks of the two slides 52 are respectively located on the movement trajectory of the two protrusions 51.

[0037] When disassembling power chip 2, a flathead screwdriver is inserted into the flat groove of the protrusion of slider 32 to apply opposing pushing force to both sides of slider 32. This causes slider 32 to slide closer together and compress the elastic reset member to store force. Slider 32 pulls the locking block 33 upward along the inclined slide rail via pull rod 34, causing the locking block 33 to disengage from the locking groove 14 in the circular groove 12, releasing the circumferential self-locking limit of fixing piece 31. Subsequently, a rotational torque is applied to fixing piece 31, rotating it in the opposite direction so that the groove of fixing piece 31 is realigned above the positioning groove 13, releasing the vertical pressing and fixing of positioning block 21. At the same time, fixing piece 31 drives the buckle block 43 to rotate, and the flange disengages from the protrusion rod 42. Release the lock on the pressure foot bracket 41, and the pressure foot bracket 41 can be flipped up to release the clamping limit on the pin of the power chip 2; when the slot of the fixing plate 31 is about to be directly above the positioning block 21, the protrusion 51 on the fixing plate 31 contacts the triangular block at the top of the slide block 52 during rotation. Through the inclined plane transmission, the two triangular blocks and the slide block 52 are driven to slide away from each other. The slide block 52 drives the bottom connecting rod 53 to move synchronously, pulling the flexible strip 54 inside the chip slot 11 from the concave state to gradually flatten it. Using the deformation and pushing force of the flexible strip 54, the power chip 2 is smoothly pushed upward out of the chip slot 11, so that the upper part of the power chip 2 is exposed. Finally, it can be directly picked up to complete the disassembly operation.

[0038] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A power chip embedded PCB assembly, comprising a substrate (1) and electronic components disposed thereon, characterized in that: A chip slot (11) is provided on the substrate (1), and a power chip (2) is embedded in the chip slot (11). The substrate (1) is provided with a chip fixing mechanism (3) for fixing the power chip (2) on the substrate (1), and the chip fixing mechanism (3) can be released from the fixing state. The substrate (1) is provided with a pin fixing mechanism (4). When the chip fixing mechanism (3) fixes the power chip (2), it triggers the pin fixing mechanism (4) to fix the pins of the power chip (2). The substrate (1) is provided with an ejection mechanism (5). When the chip fixing mechanism (3) is released from its fixed state, the ejection mechanism (5) is triggered to eject the power chip (2).

2. The power chip embedded PCB assembly according to claim 1, characterized in that: Two circular grooves (12) are formed on the substrate (1), and positioning grooves (13) are formed in the circular grooves (12). The two positioning grooves (13) are connected to the chip groove (11). Positioning blocks (21) are connected to both ends of the power chip (2), and the two positioning blocks (21) are matched with the two positioning grooves (13) respectively.

3. The power chip embedded PCB assembly according to claim 2, characterized in that: The chip fixing mechanism (3) has two parts, and is located in the two circular grooves (12) respectively.

4. The power chip embedded PCB assembly according to claim 3, characterized in that: The chip fixing mechanism (3) includes a fixing piece (31), which is rotatably installed in a circular groove (12). The fixing piece (31) has a slot, and the bottom surface of the fixing piece (31) can abut against the top surface of the positioning block (21) embedded in the positioning groove (13). The range of the slot is larger than that of the positioning groove (13).

5. The power chip embedded PCB assembly according to claim 4, characterized in that: A slider (32) and a locking block (33) are slidably mounted on the fixing plate (31). A pull rod (34) is hinged between the slider (32) and the locking block (33). An elastic reset member is provided between the slider (32) and the fixing plate (31). The sliding trajectory of the locking block (33) on the fixing plate (31) is inclined upward. When the locking block (33) slides towards the fixing plate (31), it can move upward. A locking groove (14) matching the locking block (33) is opened in the circular groove (12). After the locking block (33) moves upward, it can disengage from the locking groove (14).

6. The power chip embedded PCB assembly according to claim 5, characterized in that: The slider (32) is provided with a protrusion, and a flat groove is provided on the protrusion.

7. The power chip embedded PCB assembly according to claim 5, characterized in that: The pin fixing mechanism (4) includes a pressure foot bracket (41). The substrate (1) is provided with multiple pin slots. After the power chip (2) is installed into the chip slot (11), its pins are embedded into the multiple pin slots one by one. The pressure foot bracket (41) is provided with multiple pressure blocks that correspond one by one to the multiple pin slots. Two protrusions (42) are connected to the pressure foot bracket (41). A retaining block (43) is installed on the fixing plate (31). The two retaining blocks (43) can press the pressure foot bracket (41) tightly through the two protrusions (42).

8. The power chip embedded PCB assembly according to claim 7, characterized in that: The buckle block (43) is provided with a flange. When the buckle block (43) rotates, it passes over the protruding rod (42) and presses the protruding rod (42) tightly through the flange. The flange has chamfers at both ends.

9. The power chip embedded PCB assembly according to claim 5, characterized in that: The ejection mechanism (5) includes two slides (52), both slides (52) are slidably mounted on the substrate (1), the bottom of the slides (52) is connected to a connecting rod (53), and a flexible strip (54) is connected between the two connecting rods (53). The flexible strip (54) passes through the chip slot (11) and is located between the bottom of the power chip (2) and the chip slot (11). The fixing piece (31) is connected to a protrusion (51) at the position opposite to the slot. The top of the slide (52) is provided with a triangular block. The two triangular blocks are respectively located on the movement trajectory of the two protrusions (51). When the two protrusions (51) contact the two triangular blocks, they drive the two triangular blocks to move away from each other.

10. A method for fabricating an embedded PCB assembly for a power chip, characterized in that: The power chip embedded PCB assembly according to claim 8 or 9 further includes the following steps: Step 1: Substrate processing and forming, prepare PCB substrate (1), cut and flatten the substrate (1) to complete the overall grooving process of substrate (1); Step 2: Assemble the basic components of the substrate. Perform circuit etching, solder masking, and surface treatment on the processed substrate (1). Step 3: Pre-assembly of functional mechanisms, including pre-assembly of chip fixing mechanism (3), pin fixing mechanism (4) and ejection mechanism (5); Step 4: Assemble the functional mechanism and rotate the two pre-assembled chip fixing mechanisms (3) into the two circular grooves (12) on the substrate (1); Step 5: Pre-positioning and assembly of power chip (2): Vertically embed power chip (2) into chip slot (11) from top to bottom; Step 6: Lock the chip and fix the pins to complete the embedded and stable assembly of the power chip (2).

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