An on-line vacuum defoaming device and defoaming method for layered storage printed circuit boards

Abstract

The application discloses an online vacuum defoaming device and method for layered storage of printed circuit boards, which comprises a printed circuit board storage assembly, a vacuum pumping assembly and a loading and unloading assembly. The printed circuit board storage assembly comprises a plurality of mutually isolated vacuum storage chambers, each of which is provided with a loading and unloading opening and a sealing door matched with the loading and unloading opening. Each vacuum storage chamber is provided with a plurality of layered storage positions along a first direction for mutually spaced storage of a plurality of printed circuit boards, and the loading and unloading side of the layered storage positions is opposite to the loading and unloading opening. The vacuum pumping assembly is connected with the interiors of the plurality of vacuum storage chambers for vacuum pumping of any one or more vacuum storage chambers. The loading and unloading assembly is used for receiving the printed circuit boards in the previous process and feeding them into the layered storage positions, and conveying the printed circuit boards in the layered storage positions to the next process. In the application, online continuous defoaming operation is realized, production efficiency is improved, and labor cost is reduced.

Description

Technical Field

[0001] This application relates to the field of printed circuit board processing technology, and more specifically, to an online vacuum defoaming device and defoaming method for layered storage of printed circuit boards. Background Technology

[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.

[0003] With the rapid development of printed circuit board (PCB) technology, the line density of HDI boards in the consumer electronics field is increasing daily, with line spacing reduced to below 50 micrometers. Simultaneously, the copper layer thickness of power boards and server boards is constantly increasing, with some products reaching 5 ounces of copper thickness. In the solder mask printing process for these high-density, fine-line, and thick-copper boards, the ink can trap air bubbles between the lines during printing. The smaller the line spacing and the thicker the copper layer, the more difficult it is for these bubbles to escape automatically after printing. These residual air bubbles eventually form voids between the lines, leading to decreased insulation performance and severely affecting the electrical reliability and lifespan of the product.

[0004] To address the issue of residual air bubbles between circuit lines after solder mask printing, independent vacuum defoaming equipment has emerged in the industry. The working principle of this equipment is as follows: the circuit board after solder mask printing is manually moved by the operator into the vacuum defoaming machine for defoaming treatment in a vacuum environment. After defoaming is completed, the operator manually removes the circuit board and sends it to the next baking process.

[0005] However, existing vacuum defoaming equipment has the following technical shortcomings: First, the equipment is a stand-alone offline device and has not been integrated into the solder resist printing production line. This results in the need for manual handling between the screen printing machine and the oven, increasing the number of manual operation steps and labor intensity, and causing a waste of manpower.

[0006] Secondly, due to the use of manual loading and unloading, production efficiency is limited by the speed of the operators' handling, making it difficult to achieve high-speed continuous production.

[0007] Third, during manual handling, circuit boards may collide or rub against each other, which can easily cause ink scratches or circuit damage, affecting the yield of finished products.

[0008] Fourth, manual operation is difficult to precisely match with the production rhythm of upstream and downstream equipment, which can easily cause production line blockage or idleness, reducing overall production efficiency. Summary of the Invention

[0009] The main objective of this application is to provide an online vacuum defoaming device and defoaming method for layered storage printed circuit boards, so as to solve the technical problem of low production efficiency of existing offline operation equipment and achieve the technical effect of improving productivity.

[0010] To achieve the above objectives, a first aspect of this application proposes an online vacuum defoaming device for layered storage printed circuit boards, comprising: A printed circuit board storage assembly includes multiple isolated vacuum storage chambers, each vacuum storage chamber having a loading / unloading port and a sealing door adapted to the loading / unloading port, and each vacuum storage chamber having multiple storage positions arranged along a first direction for storing multiple printed circuit boards at intervals, wherein the loading / unloading side of the multiple storage positions is opposite to the loading / unloading port. A vacuum pumping assembly, which is connected to the interior of the plurality of vacuum storage chambers, is used to evacuate any one or more of the vacuum storage chambers. The loading and unloading assembly is used to receive the printed circuit board from the previous process and deliver it into the multi-layer storage location, and to transport the printed circuit board in the multi-layer storage location to the next process.

[0011] By setting up multiple isolated vacuum storage chambers and multiple storage positions within each chamber, multiple printed circuit boards can be stored simultaneously while maintaining spacing between them to prevent ink smudging. The vacuuming component can independently evacuate any vacuum storage chamber, and the loading and unloading component enables automatic loading and unloading, thereby achieving continuous online defoaming operations, improving production efficiency and reducing labor costs.

[0012] In this application, the online vacuum defoaming device for layered storage printed circuit boards can be connected online with screen printing machines and ovens to realize automatic reception, automatic vacuum defoaming, and automatic conveying of circuit boards after solder resist printing, so as to improve production efficiency, reduce labor costs, and ensure defoaming quality.

[0013] The loading and unloading assembly is connected online to the screen printing machine and the oven, respectively, to receive the printed circuit board from the screen printing machine in the previous process and send it into the multi-layer storage location, and to transport the printed circuit board from the multi-layer storage location to the oven in the next process.

[0014] In one embodiment of the online vacuum defoaming device for layered storage of printed circuit boards of this application, each of the vacuum storage chambers is provided with a layered storage structure; the layered storage structure is stacked along the first direction with a plurality of storage positions, each of the storage positions being used to store a printed circuit board.

[0015] By stacking multiple storage locations along the first direction using a layered storage structure, multiple printed circuit boards can be arranged in an orderly manner, ensuring a fixed interval between boards and preventing adjacent printed circuit boards from contacting or colliding during storage, thereby protecting the integrity of the ink on the board surface.

[0016] In one embodiment of the online vacuum defoaming device for layered storage of printed circuit boards in this application, the layered storage structure includes two support frames arranged opposite to each other, and each support frame is provided with a plurality of support members spaced apart along the conveying direction of the printed circuit board, the plurality of support members being used to support the edge area of ​​the printed circuit board.

[0017] By using two opposing support frames and support members spaced apart along the conveying direction, the printed circuit board can be stably supported from both sides of the edge, avoiding contact between the support members and the effective area of ​​the board surface, reducing damage to the ink layer, and facilitating the smooth entry and exit of the printed circuit board from the storage location.

[0018] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, each of the support members has a support surface and a limiting surface arranged at an angle, and the support surface and the limiting surface together form a support structure for supporting the edge of the printed circuit board.

[0019] The support structure formed by the angled arrangement of the support surface and the limiting surface can both support the edge of the printed circuit board upwards and limit the position of the printed circuit board from the side, preventing the printed circuit board from shifting or slipping during transportation or storage, thereby improving positioning accuracy and storage stability.

[0020] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, the layered storage structure further includes a first lifting drive mechanism, which is connected to the two support frames and is used to drive the two support frames to move along the first direction.

[0021] The support frame is driven to move along the first direction by the first lifting drive mechanism, which can automatically adjust the height of the storage position after each printed circuit board is stored, so that the loading and unloading components are always aligned with the empty storage station, realizing continuous automated layered storage and improving feeding efficiency.

[0022] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, the loading and unloading assembly includes a feeding mechanism and a discharging mechanism, and the loading and unloading port includes a feeding port and a discharging port. The feeding mechanism is located on one side of the printed circuit board storage assembly and is used to receive the printed circuit board from the previous process and feed it into the multi-layer storage location through the feeding port. The discharge mechanism is located on the other side of the printed circuit board storage assembly and is used to remove the printed circuit board from the multi-layer storage location through the discharge port and send it to the next process.

[0023] By setting the feeding mechanism and the discharging mechanism on opposite sides of the printed circuit board storage component, the feeding and discharging channels are separated, avoiding interference between loading and unloading paths. This facilitates feeding and discharging operations in different storage chambers at the same time, improving the parallelism of the assembly line operation.

[0024] In one embodiment of the online vacuum defoaming device for layered storage of printed circuit boards according to this application, a printed circuit board conveying assembly is also included. The printed circuit board conveying assembly has two conveying units arranged opposite each other, and the distance between the two conveying units is adjustable to accommodate printed circuit boards of different widths. The multi-layer storage location is provided with the printed circuit board conveying assembly, and / or the feeding mechanism is provided with the printed circuit board conveying assembly, and / or the discharging mechanism is provided with the printed circuit board conveying assembly.

[0025] With two adjustable-pitch conveyor units, the equipment can accommodate printed circuit boards of different widths, improving its versatility. Conveying components in the storage location, feeding mechanism, and / or discharging mechanism ensure smooth transport of printed circuit boards at each stage, reducing manual intervention.

[0026] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, each of the conveying units includes a plurality of rollers, which are arranged at intervals along the conveying direction of the printed circuit board to support and drive the printed circuit board to move.

[0027] By using multiple spaced rollers to support and drive the movement of printed circuit boards, smooth transport of the printed circuit boards can be achieved, frictional resistance can be reduced, the risk of scratching the ink on the board surface can be lowered, and automated control can be easily achieved.

[0028] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, a flipping cylinder is further included, which is used to drive two rolling wheels at the edge.

[0029] By using a rotating cylinder to drive the rolling wheels at the edge, additional guidance or pushing force can be provided when printed circuit boards enter or leave the storage position. This is especially suitable for wider or heavier printed circuit boards, preventing board edge jamming and ensuring smooth transport.

[0030] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, the rolling wheel is provided with a driving surface, which is used to support the edge of the printed circuit board and drive the printed circuit board to move.

[0031] By setting a special driving surface on the roller, the contact area and friction with the edge of the printed circuit board can be increased, improving driving efficiency. At the same time, the roller is prevented from directly contacting the effective area of ​​the board surface, protecting the ink layer from damage.

[0032] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, the multi-layer storage position is provided with the plurality of rollers, and the plurality of support members are provided along the moving direction of the printed circuit board. The rollers are provided between two adjacent support members, and the rollers and the support members are alternately arranged in the horizontal direction. The rollers are used to drive the printed circuit board to move into or out of the storage position.

[0033] By alternating the arrangement of supports and rollers in the horizontal direction, the supports provide stable support for the edges of the printed circuit board, while the rollers drive the printed circuit board to move. The two work together to allow the printed circuit board to move smoothly in and out of the storage location, while maintaining interlayer isolation and avoiding scratches.

[0034] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, the feeding mechanism and the discharging mechanism further include a second lifting drive mechanism, which is connected to the conveying unit for adjusting the position of the conveying unit in a first direction.

[0035] By adjusting the position of the conveying unit in the first direction through the second lifting drive mechanism, the conveying unit can be precisely aligned with the different layer heights of the storage position, which facilitates the feeding and retrieval of any layer in the multi-layer storage mechanism and improves the alignment accuracy of loading and unloading.

[0036] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, both the feeding mechanism and the discharging mechanism include a movable base, a displacement driving unit, and a guide extending along the arrangement direction of the plurality of vacuum storage chambers. The movable base is disposed on the guide, and the printed circuit board conveying assembly is connected to the movable base. The displacement drive unit is used to drive the movable base to move along the guide so that the printed circuit board conveying assembly can selectively engage with any of the loading / unloading ports.

[0037] By combining the movable base, displacement drive unit, and guide components, the printed circuit board conveying assembly can move along the arrangement direction of the vacuum storage chambers, selectively docking with the loading and unloading port of any storage chamber, enabling a single loading and unloading assembly to serve multiple storage chambers, simplifying the equipment structure and reducing manufacturing costs.

[0038] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, the guide extends along a straight line, or the guide extends along a curve.

[0039] By setting the guide to extend in a straight line or a curve, it is possible to adapt to different equipment layout space requirements. Straight guides are suitable for compactly arranged storage rooms, while curved guides are suitable for ring or irregular layouts, improving the flexibility of equipment arrangement.

[0040] In one embodiment of the online vacuum defoaming device for layered storage of printed circuit boards in this application, the number of vacuum storage chambers is at least three; wherein, one vacuum storage chamber is used to load multiple printed circuit boards, one vacuum storage chamber is used to perform vacuum defoaming on the multiple printed circuit boards, and one vacuum storage chamber is used to send the defoamed printed circuit boards to the next process.

[0041] By setting up at least three vacuum storage chambers and having them respectively perform the functions of feeding, defoaming, and discharging, three-station parallel operation can be achieved. At any given time, a storage chamber is performing feeding, defoaming, and discharging, thus forming a continuous and uninterrupted production line and greatly improving the overall operating efficiency.

[0042] In one embodiment of the online vacuum defoaming device for layered storage printed circuit boards of this application, the sealing door is a lift-type sealing door, including a door panel body and a pressing assembly. The pressing assembly is used to press the door panel body against the loading and unloading port edge of the vacuum storage chamber after the door panel body is in place, so as to achieve vacuum sealing.

[0043] The lifting sealing door and its clamping components can apply clamping force after the door panel body is in place, ensuring the sealing of the loading and unloading port edge, preventing vacuum leakage, and ensuring a stable and reliable vacuum environment required for the defoaming process.

[0044] The second aspect of this application provides an online vacuum defoaming method applied to an online vacuum defoaming device for layered storage of printed circuit boards as described in any of the preceding claims, wherein each vacuum storage chamber is provided with a layered storage structure for stacking and storing multiple printed circuit boards, comprising the following steps: Step 1: Control the loading and unloading assembly to dock with the first vacuum storage chamber and send a printed circuit board into the layered storage structure of the first vacuum storage chamber; Step 2: After each printed circuit board is fed in, control the layered storage structure to rise or fall by one station height to prepare for receiving the next printed circuit board. Repeat Step 1 and Step 2 until the first vacuum storage chamber is full. Step 3: Seal the first vacuum storage chamber, which is now full, and evacuate it to perform vacuum defoaming treatment; Step 4: During the vacuum defoaming process in the first vacuum storage chamber, control the loading and unloading assembly to switch to the second vacuum storage chamber, and repeat Step 1 and Step 2 to start feeding into the second vacuum storage chamber; Step 5: After the first vacuum storage chamber has completed the vacuum defoaming treatment, control the loading and unloading assembly to dock with the first vacuum storage chamber, and take out the printed circuit boards in its layered storage structure in sequence and transport them to the downstream equipment. Step 6: Control at least three vacuum storage chambers to cycle through the feeding state, vacuum defoaming state, and discharging state, so that each vacuum storage chamber is in a different operating stage at the same time, achieving continuous and uninterrupted online defoaming operation.

[0045] By receiving printed circuit boards one by one and lifting them layer by layer through a layered storage structure, batch storage is achieved. By rotating the feeding, defoaming, and discharging steps between multiple storage chambers, the feeding, defoaming, and discharging processes overlap in time, eliminating equipment waiting idle periods, thereby achieving continuous and uninterrupted online vacuum defoaming and significantly improving the processing capacity per unit time.

[0046] In one embodiment of the online vacuum defoaming method of this application, the number of vacuum storage chambers is three, and "step six" further includes: First stage: The first vacuum storage chamber is in the feeding state, the second vacuum storage chamber is in the vacuum defoaming state, and the third vacuum storage chamber is in the discharging state; Second period: The first vacuum storage chamber switches to vacuum defoaming state, the second vacuum storage chamber switches to discharge state, and the third vacuum storage chamber switches to feeding state; Third time period: The first vacuum storage chamber switches to the discharge state, the second vacuum storage chamber switches to the feeding state, and the third vacuum storage chamber switches to the vacuum defoaming state; The first time period, the second time period, and the third time period are repeated to form a cyclical rotation.

[0047] By cyclically rotating three vacuum storage chambers in a fixed sequence of three time periods, each storage chamber sequentially undergoes the entire process of feeding, defoaming, and discharging. At any given time, the three storage chambers are in different stages, forming a stable, continuous operation. This facilitates the standardized setting of process parameters and simplifies the equipment control logic.

[0048] In one embodiment of the online vacuum defoaming method of this application, before the printed circuit board is fed into the layered storage structure, the method further includes: adjusting the width of the printed circuit board transport component of the loading and unloading assembly to adapt to the current size of the printed circuit board.

[0049] By adjusting the width of the conveyor components before feeding, it can accommodate printed circuit boards of different sizes and specifications without the need to replace hardware or make manual adjustments, thereby improving the equipment's flexible production capacity and automation level.

[0050] In one embodiment of the online vacuum defoaming method of this application, the layered storage structure moves step by step, transferring the printed circuit boards at each storage location to the loading and unloading assembly in sequence.

[0051] By moving the tiered storage structure step by step, the printed circuit boards at each storage location are sequentially transferred to the loading and unloading components, which can realize the automation and sequencing of the unloading process, avoid mutual interference between printed circuit boards, and ensure the timing coordination of unloading, feeding, and defoaming processes. Attached Figure Description

[0052] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application. In the drawings: Figure 1 This is a schematic diagram of the structure of an online vacuum defoaming device for a layered storage printed circuit board according to an embodiment of this application; Figure 2 This is a schematic diagram of the online vacuum defoaming device for a layered storage printed circuit board according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of an online vacuum defoaming device for layered storage printed circuit boards according to an embodiment of this application, showing the connection relationship between the vacuuming component and the printed circuit board storage component; Figure 4 This is a schematic diagram of the loading and unloading assembly of an online vacuum defoaming device for a layered storage printed circuit board according to an embodiment of this application; Figure 5 This is a schematic diagram of the printed circuit board storage assembly of an online vacuum defoaming device for layered storage of printed circuit boards according to an embodiment of this application, which illustrates three vacuum storage chambers; Figure 6 This is a schematic diagram of the feeding and discharging mechanisms of an online vacuum defoaming device for layered storage printed circuit boards, according to an embodiment of this application, including a printed circuit board conveying assembly; Figure 7 The printed circuit board conveying assembly of the online vacuum defoaming device for layered storage printed circuit boards is an embodiment of this application; Figure 8 This is a partial schematic diagram of the printed circuit board transport assembly of the online vacuum defoaming device for layered storage printed circuit boards, as described in an embodiment of this application. Figure 9 This is a schematic diagram of the width adjustment component structure of the online vacuum defoaming device for a layered storage printed circuit board according to an embodiment of this application; Figure 10 This is a schematic diagram of the layered storage structure of the online vacuum defoaming device for layered storage printed circuit boards, which is an embodiment of this application. Figure 11 This is a schematic diagram of the layered storage structure of the online vacuum defoaming device for the layered storage printed circuit board, which is an embodiment of this application, from another perspective. Figure 12 for Figure 11 Enlarged view of point B; Figure 13 This is a schematic diagram of the layered storage structure and the printed circuit board conveying unit of the online vacuum defoaming device for layered storage of printed circuit boards, which is an embodiment of this application.

[0053] The attached figures are labeled as follows: 100. Online vacuum defoaming device for layered storage printed circuit boards; 200. Printed circuit board storage components; 210. Vacuum storage chamber; 220. Lift-type sealed door; 231. First lifting drive mechanism; 232. Support frame; 233. Support component; 234. Support surface; 235. Limiting surface; 300. Loading / unloading assembly; 310. Feeding mechanism; 320. Discharging mechanism; 330. Moving base; 340. Displacement drive unit; 350. Guide component; 400. Printed circuit board conveying assembly; 410. Second lifting drive mechanism; 420. Conveying unit; 421. Rolling wheel; 423. Tilting cylinder; 430. Stop assembly; 440. Width adjustment component; 500. Vacuum assembly; 600. Printed circuit boards; A. First direction. Detailed Implementation

[0054] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0055] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0056] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0057] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0058] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linked," and "socketing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0059] The following embodiments of the online vacuum defoaming device and defoaming method for layered storage printed circuit boards of this application are given with reference to the accompanying drawings. The drawings and embodiments are only used to explain this application and should not be construed as limiting this application.

[0060] Combination Figures 1 to 13 The embodiments of this application are as follows: Figure 1 This is a schematic diagram of the online vacuum defoaming device for a layered storage printed circuit board according to an embodiment of this application, as shown below. Figure 1As shown, the online vacuum defoaming device 100 for layered storage of printed circuit boards of this application includes: a printed circuit board storage assembly 200, which includes a plurality of mutually isolated vacuum storage chambers 210 for independently performing feeding, defoaming and discharging processes in different vacuum storage chambers 210.

[0061] The vacuum assembly 500 is connected to the interior of multiple vacuum storage chambers 210 so as to independently evacuate any one or more vacuum storage chambers 210, thereby maintaining different vacuum levels in different storage chambers to meet the needs of different processes.

[0062] The loading and unloading assembly 300 is disposed on at least one side of the printed circuit board storage assembly 200 for feeding printed circuit boards into or removing printed circuit boards from the vacuum storage chamber 210.

[0063] The vacuuming assembly 500 is located below the printed circuit board storage assembly 200 to save equipment space by utilizing gravity and to facilitate pipeline connection. The loading and unloading assembly 300 is located to the side of the printed circuit board storage assembly 200. The vacuuming assembly 500 and the loading and unloading assembly 300 are spatially separated to avoid the vibration during vacuuming being transmitted to the loading and unloading assembly 300 and affecting the positioning accuracy.

[0064] In one embodiment, the vacuum assembly 500 is integrated into the back of the printed circuit board storage assembly 200 and connected to each vacuum storage chamber 210 via a flexible bellows to absorb vibrations generated during vacuuming and reduce the overall height of the equipment, while facilitating maintenance operations from the front of the equipment.

[0065] In another embodiment, the vacuum assembly 500 also includes a vibration damping base composed of damping rubber and springs, which is used to isolate high-frequency vibrations generated during vacuum pump operation and prevent vibrations from being transmitted through the frame to the loading / unloading assembly 300 and the layered storage structure.

[0066] In one embodiment, a heat insulation shielding layer is provided between the vacuum pump assembly 500 and the loading and unloading assembly 300 to prevent the heat generated by the vacuum pump from radiating to the loading and unloading assembly 300, thereby avoiding a decrease in the alignment accuracy of the loading and unloading assembly 300 due to thermal expansion.

[0067] In one embodiment, the online vacuum defoaming device 100 further includes casters and adjustable feet. The casters are located at the bottom of the frame for moving the device, and the adjustable feet are used to level and fix the device after it is in place, so as to ensure that the vertical direction of the layered storage structure is consistent with the direction of gravity, and to prevent the printed circuit boards from sliding laterally due to tilting when stacked.

[0068] Figure 2This is a schematic diagram of the online vacuum defoaming device for a layered storage printed circuit board according to an embodiment of this application, as shown below. Figure 2 As shown, the printed circuit board storage component 200 is rectangular, and multiple vacuum storage chambers 210 are arranged side by side in the horizontal direction to form a straight pipeline layout.

[0069] The loading and unloading assembly 300 includes a feeding mechanism 310 and a discharging mechanism 320 respectively disposed on opposite sides of the printed circuit board storage assembly 200. The feeding mechanism 310 is located on one side of the storage assembly and is used to feed in the printed circuit board to be defoamed, while the discharging mechanism 320 is located on the opposite side of the storage assembly and is used to discharge the defoamed printed circuit board, thereby achieving physical isolation between the feeding channel and the discharging channel and avoiding cross-interference of printed circuit boards during loading and unloading.

[0070] The vacuum assembly 500 is connected to the bottom of each vacuum storage chamber 210 via pipes, so that the gas can be accelerated to be discharged by utilizing the pressure gradient from top to bottom inside the vacuum storage chamber 210 during vacuuming.

[0071] In another embodiment, multiple vacuum storage chambers 210 are stacked vertically to form a vertical layout to further reduce the footprint of the equipment. The loading and unloading assembly 300 is equipped with a multi-degree-of-freedom articulated robotic arm that can move up and down vertically and extend and retract horizontally to achieve alignment of storage chambers at different heights.

[0072] In another embodiment, the feeding mechanism 310 and the discharging mechanism 320 are located on the same side of the printed circuit board storage assembly 200 and are staggered in the vertical direction, with the feeding mechanism 310 located above and the discharging mechanism 320 located below, to form a double-layer channel, which is suitable for scenarios where workshop space is limited.

[0073] In another embodiment, the vacuum assembly 500 is connected to the top of each vacuum storage chamber 210 via a pipe, and a filter screen is provided at the pipe inlet to prevent ink particles or dust on the surface of the printed circuit board from being sucked into the vacuum pump, thereby extending the service life of the vacuum pump.

[0074] Figure 3 This is a schematic diagram of the online vacuum defoaming device for layered storage printed circuit boards according to an embodiment of this application, showing the connection relationship between the vacuuming component and the printed circuit board storage component, as follows: Figure 3 As shown, the vacuum assembly 500 includes a vacuum pump and multiple branch lines, each of which is independently and sealed to a vacuum storage chamber 210 to ensure that the storage chambers do not interfere with each other during vacuuming.

[0075] The branch pipeline is equipped with control valves for selectively evacuating one or more vacuum storage chambers 210, thereby keeping the storage chamber in the feeding state at normal pressure or low vacuum, the storage chamber in the defoaming state at high vacuum, and the storage chamber in the discharging state at normal pressure after the vacuum is broken, so as to achieve independent control of the vacuum degree of each storage chamber.

[0076] In another embodiment, a vacuum sensor and a flow regulating valve are also provided on the branch pipeline. The controller dynamically adjusts the opening of the flow regulating valve according to the feedback signal of the vacuum sensor so that the vacuum degree of each storage chamber changes according to the preset S-shaped curve, avoiding pressure sudden changes from impacting the ink on the surface of the printed circuit board.

[0077] In another embodiment, the vacuum assembly 500 further includes a buffer tank disposed between the vacuum pump and the branch pipeline for storing vacuum energy. When rapid vacuuming is required, the negative pressure in the buffer tank is released, shortening the evacuation time and improving production efficiency.

[0078] In another embodiment, the control valve is a high-frequency solenoid valve, and the controller controls the opening duty cycle of the solenoid valve in a pulse width modulation manner to achieve precise adjustment of the pumping rate. This is suitable for using different pumping rates for printed circuit boards with inks of different thicknesses to prevent ink bubbling.

[0079] Figure 4 This is a schematic diagram of the loading and unloading assembly of the online vacuum defoaming device for a layered storage printed circuit board according to an embodiment of this application. Figure 4 As shown, the loading and unloading assembly 300 includes a feeding mechanism 310 and a discharging mechanism 320, which are arranged opposite each other and have the same structure to reduce manufacturing and maintenance costs.

[0080] The movable base 330, the feeding mechanism 310 and the discharging mechanism 320 are respectively mounted on their respective movable bases 330, so that each mechanism can move independently.

[0081] The displacement drive unit 340 is connected to the movable base 330 to provide the power for movement.

[0082] The guide member 350 extends along the arrangement direction of the multiple vacuum storage chambers, and the movable base 330 is slidably disposed on the guide member 350 to limit the direction of movement and ensure docking accuracy.

[0083] The displacement drive unit 340 drives the moving base 330 to move along the guide member 350 so that the feeding mechanism 310 or the discharging mechanism 320 can selectively connect with the loading and unloading port of the target vacuum storage chamber 210, thereby enabling a single feeding mechanism to serve multiple vacuum storage chambers and reducing the number of components.

[0084] In another embodiment, the feeding mechanism 310 and the discharging mechanism 320 share the same movable base 330. The two mechanisms are installed back to back at both ends of the same base. The working position can be switched by rotating the base or moving the base, which further saves the length of the guide and the number of drive units.

[0085] In one embodiment, the guide 350 has a dual-rail structure, including two parallel linear guide rails. The movable base 330 is connected to the two guide rails by four sliders to improve rigidity and anti-overturning ability during movement, and to ensure the repeatability of the loading and unloading assembly 300 when docking with the loading and unloading port.

[0086] In one embodiment, the displacement drive unit 340 is a linear motor.

[0087] In another embodiment, the guide member 350 is provided with a buffer and a limit switch at both ends. The buffer is used to absorb the impact energy of the movable base 330 when it is in the extreme position, and the limit switch is used to provide feedback on the position of the movable base 330 to the controller to prevent overtravel collision.

[0088] Figure 5 This is a schematic diagram of the printed circuit board storage assembly of the online vacuum defoaming device for layered storage of printed circuit boards according to an embodiment of this application. It illustrates three vacuum storage chambers, such as... Figure 5 As shown, the printed circuit board storage assembly 200 includes three mutually isolated vacuum storage chambers 210 arranged side by side in the horizontal direction. The three vacuum storage chambers 210 are used to perform feeding, vacuum defoaming and discharging processes at the same time, forming a three-station parallel production line.

[0089] Each vacuum storage chamber 210 has a loading and unloading port on the same side so that the loading and unloading assembly 300 can be loaded and unloaded from the same direction.

[0090] Each loading / unloading port is equipped with a lifting sealing door 220, which forms a vacuum seal with the edge of the loading / unloading port when closed; each vacuum storage chamber 210 is provided with a layered storage structure, which has multiple storage positions stacked vertically to store multiple printed circuit boards 600 at intervals, thereby processing a batch of printed circuit boards in a single vacuum defoaming cycle.

[0091] In another embodiment, there are four vacuum storage chambers 210, two of which perform the defoaming process simultaneously to extend the defoaming time without reducing the overall cycle time, and the other two chambers perform the feeding and discharging processes respectively, which is suitable for special ink processes that require a longer holding time.

[0092] In another embodiment, there are five vacuum storage chambers 210, one of which serves as a backup storage chamber. When the main storage chamber needs maintenance or cleaning, the system switches to the backup storage chamber to achieve maintenance without shutting down the system and improve equipment availability.

[0093] In another embodiment, the three vacuum storage chambers 210 are arranged in a fan shape, and the loading and unloading assembly 300 is located at the center of the fan shape. It docks with different storage chambers by rotating to shorten the travel distance of the loading and unloading assembly 300 and improve the docking speed.

[0094] Figure 6 This is a schematic diagram of the feeding and discharging mechanisms of the online vacuum defoaming device for layered storage printed circuit boards according to an embodiment of this application, including a printed circuit board conveying assembly, such as... Figure 6 As shown, both the feeding mechanism 310 and the discharging mechanism 320 include: a second lifting drive mechanism 410; and a printed circuit board conveying assembly 400, which is connected to the second lifting drive mechanism 410 in a transmission manner. The second lifting drive mechanism 410 is used to drive the printed circuit board conveying assembly 400 to move up and down in the vertical direction so that the printed circuit board conveying assembly 400 is aligned with the storage positions at different heights in the layered storage structure.

[0095] When the printed circuit board conveying assembly 400 of the feeding mechanism 310 is raised and lowered to the target height, the roller 421 on it is activated, pushing the printed circuit board 600 from the conveying assembly 400 into the storage position of the corresponding layer.

[0096] Similarly, after the printed circuit board conveying assembly 400 of the unloading mechanism 320 is raised to the target height, it receives the printed circuit board 600 exiting from the storage position. Through the precise control of the second lifting drive mechanism 410, automated loading and unloading of multiple storage positions is achieved.

[0097] In another embodiment, the second lifting drive mechanism 410 uses a servo motor in conjunction with an absolute encoder to record the absolute height of each storage position. After the equipment restarts, it can be directly positioned without returning to zero, thus shortening the production preparation time.

[0098] In another embodiment, the second lifting drive mechanism 410 of the feeding mechanism 310 and the discharging mechanism 320 are independently controlled. While the feeding mechanism 310 is feeding into a certain layer, the discharging mechanism 320 can take out the defoamed printed circuit board from another layer of another storage chamber, realizing parallel feeding and discharging operations.

[0099] Figure 7 The printed circuit board conveying assembly of the online vacuum defoaming device for layered storage printed circuit boards in this application embodiment, such as... Figure 7As shown, the printed circuit board transport assembly 400 includes two transport units 420 arranged opposite each other, the distance between the two transport units 420 being adjustable to accommodate printed circuit boards 600 of different widths, thereby allowing product specifications to be switched without replacing parts.

[0100] Each conveying unit 420 includes multiple rollers 421, which are spaced apart along the conveying direction of the printed circuit board to form multiple points of support under the printed circuit board 600 and reduce local pressure.

[0101] The roller 421 is provided with a driving surface, which contacts the edge area of ​​the printed circuit board 600 to support the edge of the printed circuit board 600 and drive the printed circuit board 600 to move, thereby avoiding the roller 421 from contacting the effective circuit area or ink area of ​​the printed circuit board 600 and protecting the board surface quality.

[0102] In another embodiment, the drive surface is covered with an elastic friction material, which is polyurethane or silicone, to increase the friction between the roller 421 and the edge of the printed circuit board 600 and to buffer impacts, while preventing the hard roller from scratching the edge of the printed circuit board.

[0103] In another embodiment, some of the multiple rollers 421 are driven by independent motors, while others are unpowered driven rollers that only serve as supports between the drive rollers, in order to reduce the number of motors and control complexity.

[0104] In another embodiment, the rotational speed of the roller 421 is adjustable, with a higher rotational speed during feeding to quickly deliver the printed circuit board into the storage position, and the rotational speed reduced as it approaches the target position to achieve a soft landing and reduce impact.

[0105] Figure 8 This is a partial schematic diagram of the printed circuit board transport assembly of the online vacuum defoaming device for layered storage printed circuit boards according to an embodiment of this application, as shown. Figure 8 As shown, the printed circuit board conveying assembly 400 also includes a stop assembly 430, which is disposed at the end of the conveying unit 420. The stop assembly 430 has a blocking position and a releasing position. In the blocking position, the stop assembly 430 extends upward to prevent the printed circuit board 600 from moving forward, thereby accurately positioning the printed circuit board 600 at a predetermined handover position, awaiting removal by the layered storage structure or loading / unloading assembly. In the releasing position, the stop assembly 430 retracts downward to allow the printed circuit board 600 to pass through, enabling the printed circuit board 600 to smoothly enter the next process. The coordinated start and stop control of the stop assembly 430 and the roller 421 enables the separation and precise positioning of printed circuit boards one by one.

[0106] In another embodiment, a flexible buffer pad is provided at the end of the stop component 430. The flexible buffer pad is made of silicone or polyurethane material and is used to absorb the kinetic energy of the printed circuit board 600 when it is impacted, so as to avoid the printed circuit board 600 from rebounding or edge damage due to the impact.

[0107] In another embodiment, a photoelectric sensor is integrated on the stop assembly 430. The photoelectric sensor is used to detect whether the printed circuit board 600 has come into contact with the stop assembly 430 and send a signal to the controller. Upon receiving the signal, the controller immediately stops the drive of the roller 421 to prevent excessive compression.

[0108] In another embodiment, the stop component 430 is a bidirectional stop structure, that is, a set of stop components is provided at each end of the conveying unit 420 to achieve the same positioning function when the feeding direction is opposite (such as feeding out from the storage position).

[0109] In another embodiment, the lifting and lowering of the stop assembly 430 is driven by a miniature cylinder. The inlet and outlet of the miniature cylinder are equipped with speed control valves to adjust the speed at which the stop assembly 430 extends and retracts, thereby avoiding impact noise.

[0110] Figure 9 This is a schematic diagram of the width adjustment component structure of the online vacuum defoaming device for a layered storage printed circuit board according to an embodiment of this application. Figure 9 As shown, the printed circuit board conveying assembly 400 also includes a width adjustment assembly 440; the width adjustment assembly 440 includes a bidirectional lead screw or synchronous belt mechanism, which is connected to the two conveying units 420 respectively, and is used to synchronously adjust the distance between the two conveying units 420.

[0111] When the bidirectional lead screw is rotated or the synchronous belt is driven, the two conveying units 420 move closer or further apart, but their centerline remains unchanged, thus ensuring that the printed circuit board 600 always moves along the centerline of the conveying assembly and avoids offset. The width adjustment assembly 440 can be driven by a manual crank or automatically by a motor to achieve quick changeover.

[0112] In another embodiment, the width adjustment component 440 also includes a position sensor and a controller. The controller automatically drives the motor to adjust the spacing based on the width data of the printed circuit board 600, and records the width parameters of different product models to achieve one-click model change.

[0113] In another embodiment, the transmission mechanism of the width adjustment component 440 adopts a gear and rack structure, with two racks connected to two conveying units 420 respectively. The intermediate gear meshes with both racks simultaneously. When the gear is rotated, the two racks move in opposite directions to achieve synchronous centering adjustment.

[0114] In another embodiment, the width adjustment assembly 440 is also provided with a locking mechanism, which is a pneumatic clamp or an electromagnetic brake, used to lock the position of the conveying unit 420 after the spacing adjustment is completed, so as to prevent the spacing from changing due to vibration during the conveying process.

[0115] In another embodiment, the maximum adjustment range of the width adjustment component 440 covers from the minimum plate width to the maximum plate width. A mechanical limit is provided at the minimum plate width position, and a photoelectric limit is provided at the maximum plate width position to prevent over-travel damage to the lead screw or timing belt.

[0116] Figure 10 This is a schematic diagram of the layered storage structure of the online vacuum defoaming device for layered storage printed circuit boards according to an embodiment of this application. Figure 10 As shown, the layered storage structure includes: a first lifting drive mechanism 231; two oppositely arranged support frames 232, which are connected to the first lifting drive mechanism 231 in a transmission manner. The first lifting drive mechanism 231 drives the two support frames 232 to lift synchronously to ensure the horizontality of the storage position.

[0117] Each support frame 232 has multiple support members 233 spaced apart along the printed circuit board conveying direction; the support member 233 has a support surface 234 and a limiting surface 235 arranged at an angle. The support surface 234 is generally horizontal to lift the edge of the printed circuit board 600 upward, and the limiting surface 235 is generally vertical to restrict the movement of the printed circuit board 600 in the width direction. The support surface 234 and the limiting surface 235 together form an L-shaped support structure for supporting the edge of the printed circuit board.

[0118] This support structure prevents the printed circuit board 600 from sliding laterally during lifting and lowering, and also prevents the printed circuit board from shifting due to the suction force generated by the pressure difference in a vacuum environment.

[0119] In another embodiment, the surfaces of the support surface 234 and the limiting surface 235 are coated with a low coefficient of friction material, such as polytetrafluoroethylene or diamond-like coating, to reduce the frictional resistance when the printed circuit board 600 moves in and out, thereby reducing the load on the drive motor.

[0120] In another embodiment, the support member 233 is connected to the support frame 232 via a dovetail groove or a T-groove. The installation position of the support member 233 can be adjusted along the conveying direction according to the size of the printed circuit board 600 to change the spacing between adjacent support members 233 and adapt to printed circuit boards of different lengths.

[0121] In another embodiment, the height of the limiting surface 235 is adjustable. The extension height of the limiting surface 235 relative to the supporting surface 234 can be changed by rotating the adjusting screw on the back of the limiting surface 235 to accommodate printed circuit boards of different thicknesses, ensuring that the limiting function is effective without damaging the board edge.

[0122] Figure 11 This is a schematic diagram of the layered storage structure of the online vacuum defoaming device for the layered storage printed circuit board according to an embodiment of this application, from another perspective. Figure 11 As shown, the first lifting drive mechanism 231 includes a drive motor and a lead screw transmission assembly. The drive motor is fixedly installed at the bottom or top of the vacuum storage chamber 210 to reduce the inertia of the moving parts. The lead screw transmission assembly includes a lead screw and a lead screw nut. The lead screw is connected to the output shaft of the drive motor, and the lead screw nut is connected to two support frames 232. The drive motor drives the two support frames 232 to lift synchronously through the lead screw transmission assembly. Due to the high stepping accuracy of the lead screw transmission, after each printed circuit board 600 is stored or retrieved, the first lifting drive mechanism 231 can drive the support frame 232 to move precisely one workstation height, so that the next vacant storage position or the next storage position to be retrieved is accurately aligned with the loading and unloading port, thereby realizing the automated control of layered storage.

[0123] In another embodiment, the first lifting drive mechanism 231 adopts a linear motor, a permanent magnet array is provided on the support frame 232, and a stator coil is provided on the side wall of the vacuum storage chamber 210. The linear motor directly drives the support frame 232 to lift, without mechanical transmission parts, and has a fast response speed and no wear.

[0124] In another embodiment, the first lifting drive mechanism 231 also includes a grating ruler for measuring the lifting position of the support frame 232. The reading head of the grating ruler is fixed to the support frame 232, and the scale is fixed to the side wall of the vacuum storage chamber 210, forming a closed-loop position control to compensate for positioning errors caused by lead screw wear or temperature deformation.

[0125] In another embodiment, the lead screw drive assembly is a double lead screw structure, with the two lead screws respectively connected to the two support frames 232 and driven synchronously by the same drive motor through a synchronous belt or gear, so as to ensure the synchronicity of the lifting and lowering of the two support frames 232 and prevent the storage position from tilting.

[0126] In another embodiment, the first lifting drive mechanism 231 is also provided with a manual crank wheel, which is connected to the lead screw transmission assembly via a clutch. In the event of a power outage or maintenance, the operator can engage the clutch and rotate the crank wheel to manually lift the support frame 232 in order to pick up or put down a stuck printed circuit board.

[0127] Figure 12 for Figure 11 Enlarged view of point B, as shown Figure 12As shown, the printed circuit board conveying assembly 400 also includes a tilting cylinder 423; the tilting cylinder 423 is disposed at the edge of the conveying unit 420, and its output end is connected to two rolling wheels 421 at the edge; the tilting cylinder 423 is used to drive the rolling wheels 421 at the edge to tilt between a horizontal position and an inclined position.

[0128] When the printed circuit board 600 enters or exits the storage position, the edge roller 421 flips upward to the inclined position, forming a guide slope, which guides the edge of the printed circuit board 600 to smoothly pass over the limiting surface 235 of the support 233, avoiding jamming.

[0129] Once the printed circuit board 600 is fully in the storage position, the edge rollers 421 return to a horizontal position, serving as support rollers for subsequent printed circuit board transport. This flipping mechanism is particularly suitable for thicker or less rigid printed circuit boards, preventing their edges from impacting the support and causing damage.

[0130] In another embodiment, a magnetic switch is provided at the end of the stroke of the tilting cylinder 423. The magnetic switch is used to provide feedback on the position status of the rolling wheel 421 to the controller. The controller confirms that the rolling wheel 421 is in position based on the feedback signal before proceeding to the next step, so as to prevent the conveying failure due to the rolling wheel not being in position.

[0131] In another embodiment, the controller automatically adjusts the tilting angle of the tilting cylinder 423 according to the thickness parameter of the printed circuit board 600. Thicker printed circuit boards require a larger guide angle, while thinner printed circuit boards require a smaller guide angle, thus achieving adaptive guidance.

[0132] In another embodiment, two rollers 421 at the edge flip independently, and when one side of the printed circuit board 600 enters the storage position first, the roller 421 on that side returns to horizontal first, while the other side remains flipped, so as to allow the printed circuit board 600 to automatically adjust its posture during entry.

[0133] In another embodiment, a pilot-operated check valve is provided on the air supply line of the tilting cylinder 423. When the power or air supply is cut off, the pilot-operated check valve locks the compressed air in the cylinder, maintains the current state of the rolling wheel 421, and prevents the rolling wheel 421 from accidentally falling and damaging the printed circuit board due to loss of power.

[0134] Figure 13 This is a schematic diagram of the layered storage structure and the printed circuit board conveying unit of the online vacuum defoaming device for layered storage of printed circuit boards according to an embodiment of this application. Figure 13 As shown, the support members 233 of the layered storage structure and the rollers 421 of the printed circuit board conveying assembly 400 are arranged alternately in the horizontal direction; along the moving direction of the printed circuit board, a roller 421 is provided between two adjacent support members 233.

[0135] That is, multiple support members 233 and multiple rollers 421 are arranged in sequence along the conveying direction: rollers 421, support members 233, rollers 421, support members 233; the highest point of the rollers 421 is higher than the support surface 234, so that when the rollers 421 rotate, the printed circuit board 600 is lifted by the rollers 421 and detached from the support surface 234, thereby moving forward under the drive of the rollers 421.

[0136] When the roller 421 stops rotating, the printed circuit board 600 falls down by gravity and lands back on the support surface 234, where it is supported by the support member 233.

[0137] This alternating arrangement structure allows the printed circuit board 600 to be in a rolling friction state during transportation, resulting in low resistance. When stored at rest, it is in a static friction state, resulting in high stability. Furthermore, the rolling wheel 421 only contacts the edge of the printed circuit board at the moment of transportation, minimizing friction on the ink layer.

[0138] In another embodiment, the height difference between the roller 421 and the support 233 is adjustable. By setting shims of different thicknesses under the support 233 or using a lifting support, it can be adapted to printed circuit boards of different thicknesses or hardnesses, ensuring that the printed circuit board can be fully lifted during transport without scratching the board surface.

[0139] In another embodiment, the driving surface of the roller 421 is provided with raised textures distributed in the circumferential direction. These raised textures are used to increase the gripping force with the edge of the printed circuit board 600 and prevent slippage during transport. They are particularly suitable for printed circuit boards with relatively smooth surfaces.

[0140] In another embodiment, along the direction of movement of the printed circuit board, the density of the rollers 421 gradually decreases from the inlet end to the inlet end. The rollers near the inlet end have a smaller pitch to provide sufficient driving force, while the rollers far from the inlet end have a larger pitch to reduce the contact points with the printed circuit board and further protect the ink layer.

[0141] In another embodiment, a pressure sensor is embedded in the support surface 234 of the support member 233. The pressure sensor is used to detect whether the printed circuit board 600 has been completely placed on the support surface 234 and sends the detection signal to the controller. The controller determines whether the conveying is completed based on the signal and decides whether to perform the next lifting and lowering.

[0142] This application also provides an online vacuum defoaming method, applied to the online vacuum defoaming device for layered storage of printed circuit boards as described in any of the above embodiments, wherein each vacuum storage chamber is provided with a layered storage structure for stacking and storing multiple printed circuit boards, including the following steps: Step 1: Control the loading and unloading assembly to dock with the first vacuum storage chamber and send a printed circuit board into the layered storage structure of the first vacuum storage chamber; This step defines the initial actions of the feeding operation. First, the controller issues a command to move the loading and unloading assembly (specifically the feeding mechanism) along the guide to the loading and unloading port position of the first vacuum storage chamber, completing the mechanical docking.

[0143] After docking is completed, the conveying components (such as rollers) on the loading and unloading assembly are activated to transport a printed circuit board from the loading and unloading assembly to the layered storage structure in the first vacuum storage chamber.

[0144] The term "one piece" here indicates that this method uses a piece-by-piece feeding method, rather than feeding the entire stack, in order to facilitate subsequent layered storage.

[0145] Step 2: After each printed circuit board is fed in, control the layered storage structure to rise or fall by one station height to prepare for receiving the next printed circuit board. Repeat Step 1 and Step 2 until the first vacuum storage chamber is full. This step is one of the key differences in this application. After each printed circuit board is fed in, the first lifting drive mechanism of the layered storage structure immediately drives the support frame to move one station height, so that the next vacant storage position is aligned with the loading and unloading port.

[0146] Then, the feeding operation in step one is repeated, and this cycle continues until all storage positions in the vacuum storage chamber are filled. This "feeding and lifting simultaneously" mechanism allows multiple printed circuit boards to be automatically and orderly stored at different heights while maintaining spacing between them.

[0147] Step 3: Seal the first vacuum storage chamber, which is now full, and evacuate it to perform vacuum defoaming treatment; Once the first vacuum storage chamber is full, the controller closes the lifting and sealing door to seal the loading and unloading port.

[0148] Subsequently, the vacuum pumping unit is activated, and the vacuum storage chamber is evacuated independently through the branch pipeline, reducing the internal pressure to the preset defoaming vacuum level and maintaining it for the preset pressure holding time.

[0149] During this period, air bubbles in the ink on the surface of the printed circuit board expand and escape under negative pressure, thus achieving the purpose of defoaming.

[0150] Step 4: During the vacuum defoaming process in the first vacuum storage chamber, control the loading and unloading assembly to switch to the second vacuum storage chamber, and repeat Step 1 and Step 2 to start feeding into the second vacuum storage chamber; This step demonstrates the ability to operate in parallel across multiple vacuum storage chambers. While the defoaming process, which takes a relatively long time, is being performed in the first vacuum storage chamber, the loading and unloading of components does not wait. Instead, they are moved to the second vacuum storage chamber, where the feeding and stratified storage operations of steps one and two are repeated.

[0151] In this way, the defoaming and feeding processes are carried out on the same time axis without blocking each other.

[0152] Step 5: After the first vacuum storage chamber has completed the vacuum defoaming treatment, control the loading and unloading assembly to dock with the first vacuum storage chamber, and take out the printed circuit boards in its layered storage structure in sequence and transport them to the downstream equipment. When the pressure holding time in the first vacuum storage chamber ends and defoaming is completed, the controller controls the loading and unloading component (specifically the discharge mechanism) to move back to the first vacuum storage chamber and dock with it.

[0153] Then, the hierarchical storage structure moves step by step, transferring the printed circuit boards at each storage location to the loading and unloading assembly, which then transports them to the downstream baking process.

[0154] The removal process also employs a piece-by-piece and layer-by-layer method to ensure orderly material output.

[0155] Step 6: Control at least three vacuum storage chambers to cycle through the feeding state, vacuum defoaming state, and discharging state, so that each vacuum storage chamber is in a different operating stage at the same time, achieving continuous and uninterrupted online defoaming operation.

[0156] The controller schedules at least three vacuum storage chambers so that they are simultaneously in three different operating phases: feeding, defoaming, and discharging.

[0157] When a storage chamber completes its current stage of operation, the controller switches it to the next stage (e.g., from feeding to defoaming) while simultaneously switching other storage chambers accordingly.

[0158] Through this cyclical rotation, the equipment has a storage chamber performing feeding, a storage chamber performing defoaming, and a storage chamber performing discharging at any given time, forming a continuous and uninterrupted production line operation, eliminating the waiting time caused by process switching in traditional single-compartment equipment.

[0159] In one embodiment of this application, the number of vacuum storage chambers is three.

[0160] The specific number of vacuum storage chambers is limited to three, and the specific rotation sequence of the three storage chambers is given.

[0161] First stage: The first vacuum storage chamber is in the feeding state, the second vacuum storage chamber is in the vacuum defoaming state, and the third vacuum storage chamber is in the discharging state; In the first phase, the three storage chambers each perform three different processes: the first storage chamber receives printed circuit boards from upstream and performs layered storage; the second storage chamber is in a closed vacuum state and performs defoaming treatment on the full printed circuit boards; the third storage chamber removes the defoamed printed circuit boards one by one and sends them downstream.

[0162] Second period: The first vacuum storage chamber switches to vacuum defoaming state, the second vacuum storage chamber switches to discharge state, and the third vacuum storage chamber switches to feeding state; Once the first phase of the process is completed (i.e., the first storage chamber is full, the second storage chamber has completed defoaming, and the third storage chamber has completed discharging), the controller triggers a state switch. The first storage chamber stops feeding and closes, and begins vacuum defoaming; the second storage chamber breaks the vacuum and opens its sealed door, and begins outputting defoamed printed circuit boards; after the third storage chamber is emptied, it begins receiving new printed circuit boards and performing layered storage.

[0163] Third time period: The first vacuum storage chamber switches to the discharge state, the second vacuum storage chamber switches to the feeding state, and the third vacuum storage chamber switches to the vacuum defoaming state; After the second phase of the process is completed, the switchover is triggered again. The first storage chamber completes defoaming and begins outputting printed circuit boards; the second storage chamber is sealed after being full and begins vacuum defoaming; the third storage chamber is being fed but is not yet full, and continues to receive printed circuit boards.

[0164] The first time period, the second time period, and the third time period are repeated to form a cyclical rotation.

[0165] The three time periods cycle sequentially, with each storage chamber experiencing a complete cycle of feeding, defoaming, and discharging in turn. At any given time, the three storage chambers are in different stages of the process. This three-time period cyclical rotation is the simplest and most efficient parallel operation mode, with clear control logic and easy implementation.

[0166] In one embodiment of this application, before the printed circuit board is fed into the layered storage structure, the method further includes: adjusting the width of the conveying component of the loading and unloading assembly to fit the current size of the printed circuit board.

[0167] In actual production, the width of printed circuit boards (PCBs) may vary between different batches. Before feeding, the controller drives the width adjustment component (such as a bidirectional lead screw or synchronous belt mechanism) to adjust the spacing between the two conveying units in the loading and unloading assembly according to the current PCB width parameters, so that it matches the width of the PCB. After the width adjustment is completed, the PCB is then fed in.

[0168] This step ensures that the method can adapt to printed circuit boards of different sizes without requiring manual component replacement or adjustment, thus improving the equipment's flexible production capacity and automation level. Width adjustment can be performed once at the beginning of each batch or automatically when a change in printed circuit board dimensions is detected.

[0169] In one embodiment of this application, the hierarchical storage structure moves step by step, transferring the printed circuit boards at each storage location to the loading and unloading assembly in sequence.

[0170] When the vacuum storage chamber that has completed defoaming needs to be unloaded, the layered storage structure does not push out all the printed circuit boards at once, but moves them step by step: First, the layered storage structure moves to the bottom (or top) storage position and hands over the printed circuit board at that position to the loading and unloading assembly; after the handover is completed, the layered storage structure moves one station height so that the next storage position is aligned with the loading and unloading port, and then hands over the next printed circuit board; this is repeated until all the printed circuit boards in all storage positions have been handed over.

[0171] This "step-by-step movement and sequential handover" method has the following advantages: First, it avoids the collision or scratching that may occur when multiple printed circuit boards are pushed out at the same time; second, it only hands over one printed circuit board at a time, which makes it easier for downstream equipment to receive and process them one by one; third, it forms a symmetrical operation with the step-by-step feeding and step-by-step lifting during material feeding, and the control logic is unified, making it easy to program and debug.

[0172] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An online vacuum defoaming device for layered storage of printed circuit boards, characterized in that, include: A printed circuit board storage assembly includes multiple isolated vacuum storage chambers, each vacuum storage chamber having a loading / unloading port and a sealing door adapted to the loading / unloading port, and each vacuum storage chamber having a layered storage structure, the layered storage structure having multiple storage positions stacked along a first direction for storing multiple printed circuit boards at intervals, wherein each storage position is used to store one printed circuit board, and the loading / unloading side of the multi-layer storage position is opposite to the loading / unloading port; A vacuum pumping assembly, which is connected to the interior of the plurality of vacuum storage chambers, is used to evacuate any one or more of the vacuum storage chambers. The loading and unloading assembly is connected online to both the screen printing machine and the oven. The loading and unloading assembly includes a feeding mechanism and a discharging mechanism, and the loading and unloading port includes a feeding port and a discharging port. The feeding mechanism is located on one side of the printed circuit board storage assembly and is used to receive the printed circuit boards from the screen printing machine in the previous process and feed them into the multi-layer storage location through the feeding port. The discharging mechanism is located on the other side of the printed circuit board storage assembly and is used to remove the printed circuit boards from the multi-layer storage location through the discharging port and send them to the oven in the next process. It also includes a printed circuit board conveying assembly, which has two conveying units arranged opposite each other, and the distance between the two conveying units is adjustable to accommodate printed circuit boards of different widths; the printed circuit board conveying assembly is provided in the multi-layer storage position, and / or the printed circuit board conveying assembly is provided in the feeding mechanism, and / or the printed circuit board conveying assembly is provided in the discharging mechanism; The feeding mechanism and the discharging mechanism further include a second lifting drive mechanism, which is connected to the conveying unit and is used to adjust the position of the conveying unit in a first direction. Both the feeding mechanism and the discharging mechanism include a movable base, a displacement driving unit, and a guide extending along the arrangement direction of the plurality of vacuum storage chambers. The movable base is disposed on the guide, and the printed circuit board conveying assembly is connected to the movable base. The displacement drive unit is used to drive the movable base to move along the guide so that the printed circuit board conveying assembly can selectively engage with any of the loading / unloading ports.

2. The online vacuum defoaming device for layered storage printed circuit boards according to claim 1, characterized in that, The layered storage structure includes two support frames arranged opposite each other. Each support frame has multiple support members spaced apart along the printed circuit board conveying direction. The multiple support members are used to support the edge area of ​​the printed circuit board.

3. The online vacuum defoaming device for layered storage printed circuit boards according to claim 2, characterized in that, Each of the support members has an angled support surface and a limiting surface, which together form a support structure for supporting the edge of the printed circuit board.

4. The online vacuum defoaming device for layered storage printed circuit boards according to claim 2, characterized in that, The hierarchical storage structure further includes a first lifting drive mechanism, which is connected to the two support frames and is used to drive the two support frames to move along the first direction.

5. The online vacuum defoaming device for layered storage printed circuit boards according to claim 1, characterized in that, Each of the conveying units includes multiple rollers, which are spaced apart along the conveying direction of the printed circuit board to support and drive the printed circuit board to move.

6. The online vacuum defoaming device for layered storage printed circuit boards according to claim 5, characterized in that, It also includes a tilting cylinder for driving the two rolling wheels at the edge.

7. The online vacuum defoaming device for layered storage printed circuit boards according to claim 5, characterized in that, The roller is provided with a driving surface, which is used to support the edge of the printed circuit board and drive the printed circuit board to move.

8. The online vacuum defoaming device for layered storage printed circuit boards according to claim 2, characterized in that, The multi-layer storage location is provided with multiple rollers, and multiple support members are provided along the moving direction of the printed circuit board. The rollers are provided between two adjacent support members, and the rollers and support members are arranged alternately in the horizontal direction. The rollers are used to drive the printed circuit board to move into or out of the multi-layer storage location.

9. The online vacuum defoaming device for layered storage printed circuit boards according to claim 1, characterized in that, The guide member extends along a straight line, or the guide member extends along a curve.

10. The online vacuum defoaming device for layered storage printed circuit boards according to any one of claims 1-8, characterized in that, The number of vacuum storage chambers is at least three; wherein, one vacuum storage chamber is used to load multiple printed circuit boards, one vacuum storage chamber is used to perform vacuum defoaming on the multiple printed circuit boards, and one vacuum storage chamber is used to send the defoamed printed circuit boards to the next process.

11. The online vacuum defoaming device for layered storage printed circuit boards according to any one of claims 1-8, characterized in that, The sealing door is a lift-type sealing door, including a door panel body and a pressing assembly. The pressing assembly is used to press the door panel body against the loading and unloading port edge of the vacuum storage chamber after the door panel body is in place, so as to achieve vacuum sealing.

12. An online vacuum defoaming method, applied to the online vacuum defoaming device for layered storage of printed circuit boards according to any one of claims 1 to 11, wherein each vacuum storage chamber is provided with a layered storage structure for stacking and storing multiple printed circuit boards, characterized in that, Includes the following steps: Step 1: Control the loading and unloading assembly to dock with the first vacuum storage chamber and send a printed circuit board into the layered storage structure of the first vacuum storage chamber; Step 2: After each printed circuit board is fed in, control the layered storage structure to rise or fall by one station height to prepare for receiving the next printed circuit board. Repeat Step 1 and Step 2 until the first vacuum storage chamber is full. Step 3: Seal the first vacuum storage chamber, which is now full, and evacuate it to perform vacuum defoaming treatment; Step 4: During the vacuum defoaming process in the first vacuum storage chamber, control the loading and unloading assembly to switch to the second vacuum storage chamber and repeat the same steps as in Step 1 and Step 2 to start feeding into the second vacuum storage chamber; Step 5: After the first vacuum storage chamber has completed the vacuum defoaming treatment, control the loading and unloading assembly to dock with the first vacuum storage chamber, and take out the printed circuit boards in its layered storage structure in sequence and transport them to the oven; Step 6: Control at least three vacuum storage chambers to cycle through the feeding state, vacuum defoaming state, and discharging state, so that each vacuum storage chamber is in a different operating stage at the same time, achieving continuous and uninterrupted online defoaming operation.

13. The online vacuum defoaming method according to claim 12, characterized in that, The number of vacuum storage chambers is three, and "Step Six" further includes: First stage: The first vacuum storage chamber is in the feeding state, the second vacuum storage chamber is in the vacuum defoaming state, and the third vacuum storage chamber is in the discharging state; Second period: The first vacuum storage chamber switches to vacuum defoaming state, the second vacuum storage chamber switches to discharge state, and the third vacuum storage chamber switches to feeding state; Third time period: The first vacuum storage chamber switches to the discharge state, the second vacuum storage chamber switches to the feeding state, and the third vacuum storage chamber switches to the vacuum defoaming state; The first time period, the second time period, and the third time period are repeated to form a cyclical rotation.

14. The online vacuum defoaming method according to claim 12, characterized in that, In step one, before the printed circuit board is fed into the layered storage structure, the following steps are also included: adjusting the width of the printed circuit board transport component of the loading and unloading assembly to fit the current size of the printed circuit board.

15. The online vacuum defoaming method according to claim 12, characterized in that, In step five, the hierarchical storage structure moves step by step, transferring the printed circuit boards at each storage location to the loading and unloading assembly in sequence.

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