A selective wave soldering apparatus

Abstract

The application provides a selective wave-soldering device, and belongs to the technical field of selective wave-soldering, which comprises a tin material box, a lifting assembly, a carrying box and a material pressing assembly, a through opening is formed in the top wall of the tin material box, a top plate is fixedly arranged on the upper portion of the tin material box through a plurality of vertical rods, the carrying box is movably arranged in the tin material box, a plurality of ejection pipes which are in communication with the inner cavity of the carrying box are arranged on the upper portion of the carrying box, the plurality of ejection pipes correspond to a plurality of plug-in holes on a PCB plug-in board one by one, the lifting assembly is installed at the bottom of the top plate and is used for driving the carrying box to move up and down. Compared with the prior art, when wave-soldering components on the PCB plug-in board, the embodiment of the application can form a columnar tin material wave peak at the component hole position corresponding to the component pin at the bottom of the PCB plug-in board, thereby effectively avoiding the bridging phenomenon between adjacent pins and improving the welding quality.

Description

Technical Field

[0001] This invention belongs to the field of selective wave soldering technology, specifically a selective wave soldering device. Background Technology

[0002] Selective wave soldering is a type of equipment used in the soldering of component holes on PCB plug-in boards. Due to its different soldering advantages, it has gradually become a popular trend in the field of PCB plug-in board component hole soldering in recent years, with a wide range of applications.

[0003] Currently, when selectively wave soldering the pins of components to the holes of PCB components, a stirrer is needed to agitate the molten solder in the solder bath, causing the molten solder to form a wave pattern below the PCB. In this way, the molten solder at the crest of the wave acts on the pins at the bottom of the PCB, thus completing the soldering of the component pins to the holes. However, since the components are usually small in size, the distance between the component pins is small. When using the above wave soldering method, bridging can easily occur between adjacent pins, thus affecting the soldering quality. Summary of the Invention

[0004] In view of the shortcomings of the prior art, the technical problem to be solved by the embodiments of the present invention is to provide a selective wave soldering device.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0006] A selective wave soldering apparatus includes a solder tub, a lifting assembly, a carrying case, and a pressing assembly.

[0007] An opening is provided on the top wall of the solder box, and a top plate is fixedly installed on the upper part of the solder box by several uprights.

[0008] The carrying case is movably disposed inside the solder box. The upper part of the carrying case is provided with several outflow tubes communicating with the inner cavity of the carrying case. Each of the outflow tubes corresponds one-to-one with a plurality of insertion holes on the PCB board.

[0009] The lifting assembly is installed at the bottom of the top plate and is used to move the carrying case up and down. When the carrying case moves upward, it causes several of the outflowing pipes to extend from the opening to above the solder box and contact the bottom wall of the PCB board.

[0010] The pressing assembly is disposed on the side wall of the carrying case. When the plurality of the ejector tubes come into contact with the bottom wall of the PCB board, the pressing assembly is used to press the molten solder inside the carrying case onto the bottom wall of the PCB board through the plurality of ejector tubes.

[0011] As a further improvement of the present invention: the pressing assembly includes a connecting rod, a base plate, and a pressure plate.

[0012] The pressure plate is movably disposed inside the carrying case. One end of the connecting rod is fixedly connected to the bottom wall of the pressure plate, and the other end extends to the bottom of the carrying case and is fixedly connected to the bottom plate.

[0013] The lifting assembly includes a lifting hydraulic cylinder, a lifting plate, and a lifting rod.

[0014] The lifting hydraulic cylinder is fixedly installed on the bottom wall of the top plate, the lifting plate is located at the output end of the lifting hydraulic cylinder, one end of the lifting rod is fixedly connected to the lifting plate, and the other end extends from the opening into the inside of the solder box and is connected to the bottom plate.

[0015] As a further improvement of the present invention: a slider is fixedly provided on the side wall of the carrying case, and a first guide rod is fixedly provided on the bottom wall of the top plate. The end of the first guide rod away from the top plate extends into the interior of the solder box and is fixedly connected to the inner bottom wall of the solder box. The slider is slidably sleeved on the outside of the first guide rod.

[0016] As a further improvement of the present invention: a first limiting block is fixedly provided on the first guide rod, and the first limiting block is located above the slider.

[0017] As a further improvement of the present invention: a second limiting block is also fixedly provided on the first guide rod, and the second limiting block is located below the slider.

[0018] As a further improvement to the present invention: the side wall of the carrying case is also provided with a movable limiting component.

[0019] When the lifting rod moves the base plate, connecting rod, and pressure plate upward, the movable limiting component is used to limit the pressure plate and the carrying case to form a single unit.

[0020] When the slider slides up along the first guide rod and comes into contact with the first limiting block, the movable limiting component releases the limiting state between the pressure plate and the carrying case.

[0021] As a further improvement of the present invention: a lifting block is fixedly provided on the lifting rod, and the side wall of the lifting block is provided with a first inclined surface and a first vertical plane.

[0022] The movable limiting component includes a limiting rod, a support, and an elastic element.

[0023] The support is fixedly installed on the side wall of the carrying case, and the limiting rod is slidably installed on the side wall of the carrying case. One end of the limiting rod is provided with a second inclined surface that cooperates with the first inclined surface and a second vertical plane that cooperates with the first vertical plane. The other end of the limiting rod is connected to the support through the elastic element, and the elastic element is used to provide elastic support for the limiting rod.

[0024] As a further improvement of the present invention: a second guide rod is fixedly provided on one side of the support, and a guide hole is provided inside the limiting rod. The end of the second guide rod away from the support extends into the guide hole and is movably engaged with the limiting rod.

[0025] As a further improvement of the present invention: the second guide rod and the guide hole are mutually adapted square structures.

[0026] As a further improvement of the present invention: the elastic element is a spring or a metal sheet.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] Compared with the prior art, the embodiments of the present invention can form a columnar solder wave at the component hole position corresponding to the component pin at the bottom of the PCB board when performing wave soldering on the components on the PCB board, thereby effectively avoiding bridging between adjacent pins and improving the soldering quality. Attached Figure Description

[0029] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0030] Figure 1 A schematic diagram of the structure of a selective wave soldering device. Figure 1 ;

[0031] Figure 2 A schematic diagram of the structure of a selective wave soldering device. Figure 2 ;

[0032] Figure 3 This is a schematic diagram of a selective wave soldering equipment in operation.

[0033] Figure 4 A schematic diagram of the lifting block in a selective wave soldering device;

[0034] Figure 5A schematic diagram of a limiting rod in a selective wave soldering device;

[0035] Figure 6 for Figure 1 Enlarged view of region A in the middle;

[0036] Figure 7 for Figure 1 Enlarged view of region B in the middle;

[0037] In the diagram: 10-Solder box, 101-Opening, 102-Upright pole, 103-Top plate, 104-First guide rod, 1041-First limiting block, 1042-Second limiting block, 20-Lifting assembly, 201-Lifting hydraulic cylinder, 202-Lifting plate, 203-Lifting rod, 204-Lifting block, 2041-First inclined plane, 2042-First vertical plane, 30-Carrying case, 301-Outlet pipe, 302-Slider, 40-Pressure assembly, 401-Connecting rod, 402-Base plate, 403-Pressure plate, 50-Modible limiting assembly, 501-Limiting rod, 5011-Second inclined plane, 5012-Second vertical plane, 502-Second guide rod, 503-Support, 504-Elastic component, 60-PCB insertion board. Detailed Implementation

[0038] The technical solution of the present invention will be further described in detail below with reference to specific embodiments.

[0039] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0040] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0041] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection or setting, a detachable connection or setting, or an integral connection or setting. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0042] Please see Figure 1 , Figure 2 as well as Figure 3 This embodiment provides a selective wave soldering device, including a solder tub 10, a lifting assembly 20, a carrying case 30, and a pressing assembly 40. The solder tub 10 has an opening 101 on its top wall. A top plate 103 is fixedly mounted on the upper part of the solder tub 10 by several uprights 102. The carrying case 30 is movably disposed inside the solder tub 10. Several outflow pipes 301 communicating with the inner cavity of the carrying case 30 are provided on the upper part of the carrying case 30. Each of the outflow pipes 301 corresponds one-to-one with a plurality of insertion holes on a PCB insertion board 60. The lifting assembly... Component 20 is installed at the bottom of the top plate 103 and is used to drive the carrying case 30 to move up and down. When the carrying case 30 moves up, it drives several of the outflow tubes 301 to extend from the opening 101 to the top of the solder box 10 and to contact the bottom wall of the PCB insertion board 60. The pressing component 40 is disposed on the side wall of the carrying case 30. When several of the outflow tubes 301 contact the bottom wall of the PCB insertion board 60, the pressing component 40 is used to press the molten solder inside the carrying case 30 to the bottom wall of the PCB insertion board 60 through several of the outflow tubes 301.

[0043] Initially, the carrying case 30 and several outflow pipes 301 are immersed in the molten solder inside the solder tub 10. At this time, some of the molten solder enters the carrying case 30 through the outflow pipes 301. When wave soldering the components on the PCB board 60, a cable chain (not shown in the figure) can be used to move the PCB board 60 horizontally above the solder tub 10 (e.g., Figure 3As shown, when the PCB board 60 moves horizontally to a position above the port 101, several component holes on the PCB board 60 correspond vertically to several ejector tubes 301. At this time, the lifting assembly 20 moves the carrying box 30 upward, and the carrying box 30 moves the ejector tubes 301 upward. When the ejector tubes 301 move upward, they extend from the port 101 to above the solder box 10 and contact the bottom wall of the PCB board 60. Since the ejector tubes 301 correspond vertically to several component holes on the PCB board 60, when the ejector tubes 301 contact the bottom wall of the PCB board 60, the ejector tubes... The 301 tubes act one-to-one with the exterior of several component holes, and the component leads inserted into these holes extend one-to-one into the interior of several ejector tubes 301. At this time, the pressing assembly 40 presses the molten solder inside the carrying case 30 through the ejector tubes 301 onto the bottom wall of the PCB board 60. When the molten solder acts on the bottom wall of the PCB board 60, it can enter the component holes along the gap between the leads and the holes, thus completing the soldering between the component leads and the PCB board 60. During the soldering process, the contact between the ejector tubes 301 and the bottom wall of the PCB board 60 allows for soldering on the PCB board... A columnar solder peak is formed at the location of the bottom wall pins of 60, effectively preventing bridging after component pin soldering and thus improving soldering quality. Furthermore, due to the pressure applied during soldering, the molten solder can easily enter the gap between the component pins and the component holes, thereby increasing the soldering strength of the component pins. After the current PCB board 60 is soldered, the lifting assembly 20 moves the carrying box 30 downwards. The carrying box 30 and several outflow pipes 301 are re-immersed in the molten solder inside the solder box 10. Some of the molten solder inside the solder box 10 then flows through the several outflow pipes again. 301 enters the carrying box 30 to automatically replenish the molten solder. When the lifting component 20 moves the carrying box 30 downward, the cable chain moves the current PCB board 60 horizontally, thereby removing the current PCB board 60 from above the port 101 and moving the next set of PCB boards 60 to be soldered to above the port 101. Then, the lifting component 20 moves the carrying box 30 upward again, and several outflow tubes 301 extend from the port 101 to above the solder box 10 and contact the bottom wall of the next set of PCB boards 60, thereby soldering the components on the next set of PCB boards 60.

[0044] Please see Figure 1 as well as Figure 2In one embodiment, the pressing assembly 40 includes a connecting rod 401, a base plate 402, and a pressure plate 403. The pressure plate 403 is movably disposed inside the carrying case 30. One end of the connecting rod 401 is fixedly connected to the bottom wall of the pressure plate 403, and the other end extends to the bottom of the carrying case 30 and is fixedly connected to the base plate 402. The lifting assembly 20 includes a lifting hydraulic cylinder 201, a lifting plate 202, and a lifting rod 203. The lifting hydraulic cylinder 201 is fixedly installed on the bottom wall of the top plate 103. The lifting plate 202 is disposed at the output end of the lifting hydraulic cylinder 201. One end of the lifting rod 203 is fixedly connected to the lifting plate 202, and the other end extends from the opening 101 into the interior of the solder box 10 and is connected to the base plate 402.

[0045] When the PCB board 60 moves horizontally above the port 101, the lifting hydraulic cylinder 201 drives the lifting plate 202 to move upward. The lifting plate 202 drives the lifting rod 203 to move upward. When the lifting rod 203 moves upward, it drives the base plate 402, connecting rod 401, pressure plate 403, carrying case 30, and several outflow pipes 301 to move upward as a whole. When the several outflow pipes 301 extend from the port 101 and act on the bottom wall of the PCB board 60, the several outflow pipes 301 and the carrying case 30 stop moving upward. The lowering plate 202, the lifting rod 203, the base plate 402, the connecting rod 401, and the pressure plate 403 continue to move upward. When the pressure plate 403 moves upward, it presses against the molten solder inside the carrying case 30, causing the molten solder to enter into several outflow pipes 301. Then, the several outflow pipes 301 act on the bottom wall of the PCB plug-in board 60. After the molten solder acts on the bottom wall of the PCB plug-in board 60, it enters the component hole through the gap between the component pin and the component hole, thereby soldering the component.

[0046] Please see Figure 1 , Figure 2 as well as Figure 7 In one embodiment, a slider 302 is fixedly provided on the side wall of the carrying case 30, and a first guide rod 104 is fixedly provided on the bottom wall of the top plate 103. The end of the first guide rod 104 away from the top plate 103 extends into the interior of the solder box 10 and is fixedly connected to the inner bottom wall of the solder box 10. The slider 302 is slidably sleeved on the outside of the first guide rod 104.

[0047] When the lifting hydraulic cylinder 201 drives the lifting plate 202, lifting rod 203, base plate 402, connecting rod 401, pressure plate 403, carrying case 30 and several outflow tubes 301 to move upward, the slider 302 slides upward along the first guide rod 104. Through the sliding cooperation between the slider 302 and the first guide rod 104, the carrying case 30 and several outflow tubes 301 can be moved upward smoothly, so that when the several outflow tubes 301 act on the bottom wall of the PCB plug-in board 60, they can be accurately aligned with several component holes.

[0048] Please see Figure 7 In one embodiment, a first limiting block 1041 is fixedly disposed on the first guide rod 104, and the first limiting block 1041 is located above the slider 302.

[0049] When the several outflow tubes 301 act on the bottom wall of the PCB plug-in board 60, the slider 302 slides up along the first guide rod 104 until it contacts the first limiting block 1041. At this time, the first limiting block 1041 restricts the upward sliding of the slider 302, and in turn restricts the upward movement of the carrying case 30 and the several outflow tubes 301. After the upward movement of the carrying case 30 and the several outflow tubes 301 is restricted, as the pressure plate 403 continues to move upward, the pressure plate 403 presses the molten solder inside the carrying case 30 into the several outflow tubes 301, and then the several outflow tubes 301 act on the bottom wall of the PCB plug-in board 60 to solder the component pins.

[0050] Please see Figure 7 In one embodiment, a second limiting block 1042 is also fixedly disposed on the first guide rod 104, and the second limiting block 1042 is located below the slider 302.

[0051] After the components on the current PCB board 60 are soldered, the lifting hydraulic cylinder 201 moves the lifting plate 202 and the lifting rod 203 downwards. The lifting rod 203 moves the base plate 402, connecting rod 401, pressure plate 403, carrying box 30, and several outflow tubes 301 downwards. At this time, the slider 302 slides down along the outside of the first guide rod 104. After the carrying box 30 and several outflow tubes 301 are re-immersed in the molten solder inside the solder box 10, the slider 302 slides down to contact the second limit block 1042. The second limiting block 1042 restricts the downward movement of the slider 302, and in turn restricts the downward movement of the carrying box 30 and the several outflow pipes 301. After the downward movement of the carrying box 30 and the several outflow pipes 301 is restricted, as the base plate 402, the connecting rod 401 and the pressure plate 403 continue to move downward, the pressure plate 403 draws part of the molten solder inside the solder box 10 into the carrying box 30 through the several outflow pipes 301, thereby realizing the automatic replenishment of molten solder, so as to facilitate the subsequent soldering of the PCB plug-in board 60.

[0052] When the lifting hydraulic cylinder 201 moves the lifting plate 202 and lifting rod 203 upward, thereby moving the base plate 402, connecting rod 401, pressure plate 403, carrying box 30, and several ejector tubes 301 upward, the molten solder inside the carrying box 30 is under pressure. Therefore, the molten solder inside the carrying box 30 is easily forced out through the ejector tubes 301 prematurely. This results in insufficient molten solder being pressed into the component holes after the ejector tubes 301 act on the bottom wall of the PCB board 60, thus affecting the soldering effect of the component leads. Based on this, please refer to... Figure 1 In one embodiment, the side wall of the carrying case 30 is also provided with a movable limiting component 50. When the lifting rod 203 drives the base plate 402, connecting rod 401 and pressure plate 403 to move upward, the movable limiting component 50 is used to limit the pressure plate 403 and the carrying case 30 to be integrated, so that the molten solder inside the carrying case 30 is in an unpressurized state, thereby avoiding premature extrusion of the molten solder. When the slider 302 slides upward along the first guide rod 104 and contacts the first limiting block 1041, the movable limiting component 50 releases the limiting state between the pressure plate 403 and the carrying case 30, so that the pressure plate 403 can smoothly press the molten solder inside the carrying case 30 into the several outflow tubes 301 during the subsequent upward movement, and then press it onto the bottom wall of the PCB plug-in board 60 by the several outflow tubes 301, so that the molten solder can smoothly enter the gap between the component hole and the component pin.

[0053] Please see Figure 4 , Figure 5 Figure 6 In one embodiment, a lifting block 204 is fixedly disposed on the lifting rod 203. The lifting block 204 has a first inclined surface 2041 and a first vertical plane 2042 on its side wall. The movable limiting component 50 includes a limiting rod 501, a support 503, and an elastic element 504. The support 503 is fixedly installed on the side wall of the carrying case 30. The limiting rod 501 is slidably installed on the side wall of the carrying case 30. One end of the limiting rod 501 has a second inclined surface 5011 that cooperates with the first inclined surface 2041 and a second vertical plane 5012 that cooperates with the first vertical plane 2042. The other end of the limiting rod 501 is connected to the support 503 through the elastic element 504. The elastic element 504 is used to provide elastic support for the limiting rod 501.

[0054] When the lifting rod 203 moves the base plate 402, connecting rod 401, and pressure plate 403 upward, the lifting rod 203 moves the lifting block 204 upward synchronously. Under the elastic support of the elastic element 504, the second inclined surface 5041 at one end of the limiting rod 501 is in contact with the first inclined surface 2041. When the lifting block 204 moves upward, it provides an upward lifting force to the limiting rod 501 through the first inclined surface 2041 and the second inclined surface 5041, thereby driving the carrying box 30 and several outlet pipes 301 and the pressure plate 403 to be bound together and move upward synchronously. At this time, the molten solder in the carrying box 30 is in an unpressurized state. When the slider 302 and the first limiting block 10 When contact occurs at point 41, several outflow tubes 301 act on the bottom wall of the PCB insertion board 60. As the lifting rod 203 and the lifting block 204 move further upward, the first inclined surface 2041 slides upward relative to the second inclined surface 5011. The limiting rod 501 slides horizontally along the side wall of the carrying case 30, the elastic element 504 is compressed, the limiting state between the pressure plate 403 and the carrying case 30 is released, and the pressure plate 403 moves upward along the inside of the carrying case 30 to press the molten solder into the several outflow tubes 301. Then, the several outflow tubes 301 act on the bottom wall of the PCB insertion board 60 to realize the soldering of the component leads. After the component leads are soldered, the first inclined surface... 2041 and the second inclined plane 5011 are completely offset. Under the support of the elastic element 504, the second vertical plane 5012 at one end of the limiting rod 501 abuts against the first vertical plane 2042 on the lifting block 204. Then, the lifting hydraulic cylinder 201 drives the lifting plate 202 and the lifting rod 203 to move down. The carrying box 30, several outlet pipes 301, pressure plate 403, connecting rod 401, base plate 402 and lifting block 204 move down synchronously. When the carrying box 30 and several outlet pipes 301 are immersed in the molten solder inside the solder box 10, the slider 302 contacts the second limiting block 1042, and the carrying box 30 and several outlet pipes 301 move down. 01 Stop moving downwards, lifting block 204 moves downwards relative to limit rod 501, second vertical plane 5012 is offset from first vertical plane 2042, limit rod 501 slides horizontally in the opposite direction along the side wall of carrying case 30 under the support of elastic member 504, second inclined surface 5011 and first inclined surface 2041 re-fit. After carrying case 30 and several outflow pipes 301 stop moving downwards, as lifting rod 203, base plate 402, connecting rod 401 and pressure plate 403 continue to move downwards, pressure plate 403 draws part of the molten solder inside solder box 10 into carrying case 30 through several outflow pipes 301, realizing automatic replenishment of molten solder.

[0055] Please see Figure 6 In one embodiment, a second guide rod 502 is fixedly provided on one side of the support 503, and a guide hole (not shown in the figure) is provided inside the limiting rod 501. The end of the second guide rod 502 away from the support 503 extends into the guide hole and is movably engaged with the limiting rod 501.

[0056] When the slider 302 contacts the first limiting block 1041, causing the carrying case 30 and several outlet pipes 301 to stop moving upward, the lifting block 204 continues to move upward relative to the limiting rod 501. The first inclined surface 2041 pushes the second inclined surface 5011, thereby causing the limiting rod 501 to overcome the elastic support force of the elastic element 504 and slide horizontally along the second guide rod 502. When the slider 302 contacts the second limiting block 1042, causing the carrying case 30 and several outlet pipes 301 to stop moving downward, the lifting block 204 continues to move downward relative to the limiting rod 501. The first vertical plane 2042 and the second vertical plane 5012 are misaligned. The elastic element 504 pushes the limiting rod 501, causing the limiting rod 501 to slide horizontally in the opposite direction along the second guide rod 502.

[0057] In one embodiment, the second guide rod 502 has a square structure, and correspondingly, the guide hole also has a square structure. The square structure of the second guide rod 502 and the square structure of the guide hole cooperate with each other to prevent the limiting rod 501 from rotating when sliding along the second guide rod 502, so that the first inclined surface 2041 and the second inclined surface 5011 can fit smoothly together, and at the same time, the first vertical plane 2042 and the second vertical plane 5012 can abut smoothly.

[0058] In one embodiment, the elastic element 504 can be a spring or a metal sheet, and there is no limitation on this.

[0059] In this embodiment of the invention, initially, the carrying case 30 and several outflow pipes 301 are immersed in the molten solder inside the solder tub 10. At this time, some of the molten solder enters the carrying case 30 through the several outflow pipes 301. When wave soldering the components on the PCB board 60, a cable chain (not shown in the figure) can be used to move the PCB board 60 horizontally above the solder tub 10 (e.g., Figure 3As shown), when the PCB board 60 moves horizontally to a position above the port 101, several component holes on the PCB board 60 correspond vertically to several ejector tubes 301. At this time, the lifting assembly 20 moves the carrying box 30 upward, and the carrying box 30 moves the ejector tubes 301 upward. When the ejector tubes 301 move upward, they extend from the port 101 to above the solder box 10 and contact the bottom wall of the PCB board 60. Since the ejector tubes 301 correspond vertically to several component holes on the PCB board 60, when the ejector tubes 301 contact the bottom wall of the PCB board 60, the ejector tubes 301 act on the outside of several component holes and are inserted into several... The component leads in the component holes extend one-to-one into several ejector tubes 301. At this time, the molten solder inside the carrying case 30 is pressed through the ejector tubes 301 to the bottom wall of the PCB board 60 by the pressing assembly 40. When the molten solder acts on the bottom wall of the PCB board 60, it can enter the component hole along the gap between the lead and the component hole, thus completing the soldering between the component lead and the PCB board 60. During the soldering process, the contact between the ejector tubes 301 and the bottom wall of the PCB board 60 creates a columnar solder peak at the location of the lead on the bottom wall of the PCB board 60, effectively preventing bridging after component lead soldering and thus improving solderability. The welding quality is improved because the molten solder, under pressure during welding, can easily enter the gap between the component leads and the component holes, thus improving the welding strength of the component leads. After the current PCB board 60 is welded, the lifting assembly 20 moves the carrying box 30 downwards. The carrying box 30 and several outflow pipes 301 are re-immersed in the molten solder inside the solder box 10. Some of the molten solder inside the solder box 10 re-enters the carrying box 30 through the outflow pipes 301, achieving automatic replenishment of molten solder. As the lifting assembly 20 moves the carrying box 30 downwards, the cable chain moves the current PCB board 60 horizontally, thereby increasing the welding strength of the current PCB board 60. The insertion board 60 is removed from above the port 101, and the next set of PCB insertion boards 60 to be soldered is moved above the port 101. Then, the lifting assembly 20 moves the carrying box 30 upward again, and several outflow tubes 301 extend from the port 101 to above the solder box 10 and contact the bottom wall of the next set of PCB insertion boards 60, thereby soldering the components on the next set of PCB insertion boards 60. Compared with the prior art, when wave soldering the components on the PCB insertion board 60, a columnar solder wave peak can be formed separately at the component hole position corresponding to the component pin at the bottom of the PCB insertion board 60, thereby effectively avoiding bridging between adjacent pins and improving the soldering quality.

[0060] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention, and no reference numerals in the claims should be construed as limiting the scope of the claims.

[0061] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity, and those skilled in the art should consider the specification as a whole.

Claims

1. A selective wave soldering device, characterized in that, It includes a solder box (10), a lifting assembly (20), a carrying case (30), and a pressing assembly (40). The tin box (10) has an opening (101) on its top wall, and a top plate (103) is fixedly installed on the upper part of the tin box (10) by several uprights (102). The carrying case (30) is movably disposed inside the solder box (10). The upper part of the carrying case (30) is provided with a plurality of outflow tubes (301) communicating with the inner cavity of the carrying case (30). The plurality of outflow tubes (301) correspond one-to-one with a plurality of plug-in holes on the PCB plug-in board (60). The lifting assembly (20) is installed at the bottom of the top plate (103) and is used to drive the carrying box (30) to move up and down. When the carrying box (30) moves up, it drives several of the outflow pipes (301) to extend from the opening (101) to above the solder box (10) and to contact the bottom wall of the PCB board (60). The pressing assembly (40) is disposed on the side wall of the carrying case (30). When the plurality of the ejector tubes (301) come into contact with the bottom wall of the PCB plug-in board (60), the pressing assembly (40) is used to press the molten solder inside the carrying case (30) onto the bottom wall of the PCB plug-in board (60) through the plurality of ejector tubes (301).

2. The selective wave soldering equipment according to claim 1, characterized in that, The pressing assembly (40) includes a connecting rod (401), a base plate (402), and a pressure plate (403). The pressure plate (403) is movably disposed inside the carrying case (30). One end of the connecting rod (401) is fixedly connected to the bottom wall of the pressure plate (403), and the other end extends to the bottom of the carrying case (30) and is fixedly connected to the bottom plate (402). The lifting assembly (20) includes a lifting hydraulic cylinder (201), a lifting plate (202), and a lifting rod (203). The lifting hydraulic cylinder (201) is fixedly installed on the bottom wall of the top plate (103). The lifting plate (202) is located at the output end of the lifting hydraulic cylinder (201). One end of the lifting rod (203) is fixedly connected to the lifting plate (202), and the other end extends from the opening (101) into the interior of the tin box (10) and is connected to the bottom plate (402).

3. A selective wave soldering device according to claim 2, characterized in that, A slider (302) is fixedly installed on the side wall of the carrying case (30), and a first guide rod (104) is fixedly installed on the bottom wall of the top plate (103). The end of the first guide rod (104) away from the top plate (103) extends into the interior of the solder box (10) and is fixedly connected to the inner bottom wall of the solder box (10). The slider (302) is slidably sleeved on the outside of the first guide rod (104).

4. A selective wave soldering device according to claim 3, characterized in that, A first limiting block (1041) is fixedly installed on the first guide rod (104), and the first limiting block (1041) is located above the slider (302).

5. A selective wave soldering apparatus according to claim 3, characterized in that, A second limiting block (1042) is also fixedly installed on the first guide rod (104), and the second limiting block (1042) is located below the slider (302).

6. A selective wave soldering apparatus according to claim 4, characterized in that, The side wall of the carrying case (30) is also provided with a movable limiting component (50). When the lifting rod (203) moves the base plate (402), connecting rod (401), and pressure plate (403) upward, the movable limiting component (50) is used to limit the pressure plate (403) and the carrying case (30) into one unit. When the slider (302) slides up along the first guide rod (104) and comes into contact with the first limiting block (1041), the active limiting component (50) releases the limiting state between the pressure plate (403) and the carrying case (30).

7. A selective wave soldering apparatus according to claim 6, characterized in that, A lifting block (204) is fixedly installed on the lifting rod (203). The lifting block (204) has a first inclined surface (2041) and a first vertical plane (2042) on its side wall. The movable limiting component (50) includes a limiting rod (501), a support (503), and an elastic element (504). The support (503) is fixedly installed on the side wall of the carrying case (30), and the limiting rod (501) is slidably installed on the side wall of the carrying case (30). One end of the limiting rod (501) is provided with a second inclined surface (5011) that cooperates with the first inclined surface (2041) and a second vertical plane (5012) that cooperates with the first vertical plane (2042). The other end of the limiting rod (501) is connected to the support (503) through the elastic element (504). The elastic element (504) is used to provide elastic support for the limiting rod (501).

8. A selective wave soldering apparatus according to claim 7, characterized in that, A second guide rod (502) is fixedly provided on one side of the support (503). A guide hole is provided inside the limiting rod (501). The end of the second guide rod (502) away from the support (503) extends into the guide hole and is movably engaged with the limiting rod (501).

9. A selective wave soldering apparatus according to claim 8, characterized in that, The second guide rod (502) and the guide hole are square structures that are compatible with each other.

10. A selective wave soldering apparatus according to claim 7, characterized in that, The elastic element (504) is a spring or a metal sheet.

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