Heat plate, heat dissipation module and electronic device

Abstract

The application relates to the technical field of heat equalizing plates, and provides a heat equalizing plate, a heat dissipation module and electronic equipment, which can solve the problem of low working medium circulation speed of a heat equalizing plate in related technologies. The heat equalizing plate comprises a shell, a capillary structure, working medium and a piezoelectric vibrator; the capillary structure and the working medium are arranged in the shell; the shell has an evaporation area and a condensation area; the capillary structure comprises a first capillary structure; the first capillary structure comprises a first part located in the evaporation area and a second part located in the condensation area; the shell has a containing space; the containing space is in communication with the first part and the second part respectively; at least the containing space and the capillary structure form a circulation channel of the working medium; the piezoelectric vibrator comprises a base and a vibrator connected with the base; the base is installed on the shell; the vibrator is located in the containing space and is used for driving the gaseous working medium in the containing space to flow to the second part. The application can be used in electronic equipment such as mobile phones.

Description

Technical Field

[0001] This application relates to the field of heat spreader technology, and more particularly to a heat spreader, a heat dissipation module, and an electronic device. Background Technology

[0002] With the rapid development of modern technology, the performance of electronic devices is continuously improving. At the same time, to meet the market's stringent demands for portability, electronic devices such as mobile phones and tablets are becoming thinner and smaller. This trend has led to an increase in the density of internal components, resulting in a significant increase in power consumption. Consequently, the heat generated per unit volume continues to rise, posing a serious challenge to the heat dissipation of electronic devices.

[0003] To effectively address the heat dissipation problem inside electronic devices, vapor chambers have emerged. Vapor chambers are highly efficient heat dissipation components, possessing significant advantages such as multi-dimensional horizontal heat conduction, excellent heat dissipation performance, and thinness, making them highly promising for heat dissipation design in slim and lightweight electronic devices. Therefore, how to design vapor chambers to improve their heat dissipation performance has become one of the important research topics in the industry. Summary of the Invention

[0004] Embodiments of this application provide a heat spreader, a heat dissipation module, and an electronic device to solve the problem of low circulation speed of the working fluid in the heat spreader in the related art.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] In a first aspect, embodiments of this application provide a heat spreader, including a shell, a capillary structure, a working fluid, and a piezoelectric vibrator; the capillary structure and the working fluid are disposed within the shell, the shell having an evaporation zone and a condensation zone, the capillary structure including a first capillary structure, the first capillary structure including a first part located in the evaporation zone and a second part located in the condensation zone; the shell has a receiving space, the receiving space being located outside the capillary structure and communicating with the first part and the second part respectively, at least the receiving space and the capillary structure forming a circulation channel for the working fluid; wherein, the working fluid can be converted between a liquid state and a gaseous state, the capillary structure is used to transport the liquid working fluid, and the receiving space is used to transport the gaseous working fluid; the piezoelectric vibrator includes a base and a vibrator connected to the base, the base being mounted on the shell, the vibrator being located in the receiving space, and used to drive the gaseous working fluid in the receiving space to flow to the second part.

[0007] In this embodiment of the heat spreader, a piezoelectric vibrator is provided, and the vibrator is located in the containment space. In this way, the piezoelectric vibrator acts as a pump. When the vibrator vibrates in the containment space, it can disturb the gaseous working fluid in the containment space, so as to provide pressure for the working fluid to circulate in the circulation channel. This can overcome the problems of excessive resistance to the flow of gaseous working fluid in the containment space and insufficient capillary force for the return flow of liquid working fluid in the capillary structure. This is beneficial to improving the gas-liquid circulation speed of the working fluid in the circulation channel inside the heat spreader, and thus improving the heat dissipation performance of the heat spreader.

[0008] In some embodiments of the first aspect, a working fluid partition is provided inside the housing. The working fluid partition has a first side and a second side opposite to each other. A first capillary structure is located on the first side of the working fluid partition, and at least a portion of the accommodating space is located on the second side of the working fluid partition. The working fluid partition has a through hole in the area corresponding to the first part, and the through hole is connected to the first part. An opening is formed between the edge of the working fluid partition and the shell wall of the housing, and the opening is connected to the second part. The through hole and the opening allow gaseous working fluid to pass through.

[0009] This configuration increases the pressure in the space containing the oscillator during vibration, which in turn improves the gas-liquid circulation speed of the working fluid in the circulation channel, thereby further enhancing the heat dissipation performance of the heat spreader.

[0010] In some embodiments of the first aspect, the oscillator is a sheet-like structure and includes a central region disposed opposite to the through hole and a peripheral region disposed around the central region. The central region is connected to the base, and a first gap is formed between the peripheral region and the working fluid partition, the first gap allowing the gaseous working fluid to pass through.

[0011] This design facilitates the efficient intake of gaseous working fluid into the containment space through the through-hole, and reduces the risk of the gaseous working fluid being fanned back into the first part by the oscillator.

[0012] In some embodiments of the first aspect, the aperture d of the through hole and the radial dimension L1 of the oscillator in the through hole satisfy: L1≥1.2d.

[0013] This configuration helps to increase the pressure generated by the oscillator during vibration, thereby efficiently driving the gaseous working fluid to the condensation zone and increasing the circulation speed.

[0014] In some embodiments of the first aspect, the aperture d of the through hole and the radial dimension L1 of the oscillator in the through hole satisfy: L1≤1.3d.

[0015] This configuration reduces the space occupied by the oscillator, allowing it to efficiently drive the gaseous working fluid to the condensation zone, thereby increasing the circulation speed.

[0016] In some embodiments of the first aspect, the aperture d of the through hole and the radial dimension L2 of the working fluid partition in the through hole satisfy: d ≥ 0.2L2.

[0017] This configuration helps to increase the speed at which the gaseous working fluid enters the containment space, thereby enabling the oscillator to efficiently drive the gaseous working fluid to the condensation zone and improve the circulation speed.

[0018] In some embodiments of the first aspect, the aperture d of the through hole and the radial dimension L2 of the working fluid partition in the through hole satisfy: d ≤ 0.3L2.

[0019] This configuration helps to increase the pressure generated by the oscillator during vibration, which in turn helps the oscillator to efficiently drive the gaseous working fluid to the condensation zone, thereby increasing the circulation speed.

[0020] In some embodiments of the first aspect, the dimensions L1 of the oscillator and L3 of the evaporation zone in the radial direction of the through hole satisfy: L1 > L3.

[0021] This configuration allows more gaseous working fluid from the first part to be drawn into the containment space during oscillation, thereby improving the circulation efficiency of the working fluid in the circulation channel.

[0022] In some embodiments of the first aspect, the shell wall of the housing includes a first shell wall, the accommodating space is at least partially located between the first shell wall and the working fluid partition, and a second gap is formed between the first shell wall and the oscillator; the width w2 of the second gap and the width w1 of the first gap satisfy: w1 > w2.

[0023] With this setup, the first gap has enough space for the oscillator to vibrate, and the amplitude of the oscillator can be designed to be relatively large, so that the oscillator generates greater pressure when vibrating. This is beneficial for the oscillator to efficiently drive the gaseous working fluid to the condensation zone, thereby increasing the circulation speed.

[0024] In some embodiments of the first aspect, the shell wall of the housing includes a first shell wall, the accommodating space is at least partially located between the first shell wall and the working fluid partition, and a second gap is formed between the first shell wall and the oscillator; the width w2 of the second gap satisfies: 0.05mm≤w2≤0.1mm.

[0025] This configuration not only allows the oscillator to generate greater pressure during vibration, thus efficiently driving the gaseous working fluid to flow towards the condensation zone, but also prevents interference between the oscillator and the first shell wall.

[0026] In some embodiments of the first aspect, the capillary structure further includes a second capillary structure located in the condensation zone, the second capillary structure being connected to the second portion, the second capillary structure extending toward the second side of the working fluid partition and communicating with the opening and the second portion respectively; a third gap is formed between the edge of the working fluid partition and the second capillary structure, allowing gaseous working fluid to pass through, the third gap being connected to the second portion.

[0027] This configuration helps improve the reflux efficiency of the liquid working fluid, which in turn improves the heat dissipation performance of the heat exchanger.

[0028] In some embodiments of the first aspect, the accommodating space includes a first space and a second space. The first space is located on the second side of the working fluid partition, and the second space is located on the periphery of the first capillary structure and in the condensation zone. The second space is connected to the first space through an opening and is connected to the second part. The oscillator is located in the second space.

[0029] This configuration reduces the backflow of gaseous working fluid into the first part of the first capillary structure under the action of the oscillator, thereby improving the circulation efficiency of the working fluid and thus improving the heat dissipation performance of the heat spreader.

[0030] In some embodiments of the first aspect, the shell wall of the housing includes a second shell wall, a first capillary structure covers the second shell wall, the oscillator is a sheet structure and has a first side disposed close to the first capillary structure and a second side disposed away from the first capillary structure, the second side is connected to the base, the first side is freely disposed and forms a fourth gap between it and the edge of the first capillary structure for the passage of gaseous working fluid, the fourth gap being connected to the second part and the opening respectively.

[0031] This configuration helps to increase the pressure generated in the space below the oscillator during vibration, thereby enabling the oscillator to efficiently drive the gaseous working fluid to the condensation zone and improve the circulation efficiency of the working fluid.

[0032] In some embodiments of the first aspect, the edge of the first capillary extends beyond the edge of the working fluid partition to connect the first space with a second portion located at the edge of the first capillary.

[0033] This configuration helps improve the reflux efficiency of the liquid working fluid, which in turn improves the heat dissipation performance of the heat exchanger.

[0034] In some embodiments of the first aspect, the width w4 of the fourth gap and the distance w3 from the edge of the first capillary structure beyond the edge of the working fluid partition satisfy: w4 < w3.

[0035] This configuration helps improve the reflux efficiency of the liquid working fluid, which in turn improves the heat dissipation performance of the heat exchanger.

[0036] In some embodiments of the first aspect, the distance h from the oscillator to the second shell wall and the distance w3 from the edge of the first capillary structure beyond the edge of the working fluid partition satisfy: w3 > h.

[0037] This configuration helps improve the reflux efficiency of the liquid working fluid, which in turn improves the heat dissipation performance of the heat exchanger.

[0038] In some embodiments of the first aspect, the distance h from the oscillator to the second shell wall and the distance w3 from the edge of the first capillary structure beyond the edge of the working fluid partition satisfy: 1.5h ≤ w3 ≤ 4h.

[0039] This setup can further improve the reflux efficiency of the liquid working fluid, which in turn helps to improve the heat dissipation performance of the heat exchanger.

[0040] In some embodiments of the first aspect, the width w4 of the fourth gap satisfies: 0.05mm ≤ w4 ≤ 0.2mm.

[0041] This configuration allows the oscillator to generate greater pressure during vibration while reducing the impact on the flow rate of the gaseous working fluid, thereby improving the circulation efficiency of the working fluid.

[0042] In some embodiments of the first aspect, the surface of the oscillator away from the second shell wall is flush with the surface of the first capillary structure away from the second shell wall.

[0043] This configuration helps to increase the volume of the lower space of the oscillator, thereby liquefying the gaseous working fluid entering the lower space of the oscillator into a larger amount of liquid working fluid to enter the first capillary structure, thus helping to ensure the circulation efficiency of the working fluid.

[0044] In some embodiments of the first aspect, there are multiple oscillators arranged circumferentially along the first capillary structure.

[0045] This configuration allows the working fluid to diffuse more evenly in the circumferential direction of the first capillary structure, which in turn helps to improve the heat dissipation performance of the heat exchanger.

[0046] In some embodiments of the first aspect, the oscillator is a ring structure surrounding the first capillary structure.

[0047] This configuration allows the working fluid to diffuse more evenly in the circumferential direction of the first capillary structure, thereby improving the heat dissipation performance of the heat exchanger.

[0048] In some embodiments of the first aspect, the capillary structure is a three-dimensional porous structure having multiple cavities, with adjacent cavities connected to each other, and each cavity being surrounded by a minimal surface.

[0049] This configuration reduces the backflow resistance of the liquid working fluid in the capillary structure.

[0050] In some embodiments of the first aspect, the shell wall of the housing includes a first shell wall and a second shell wall disposed opposite to each other, and a shell sidewall connected between the first shell wall and the second shell wall. The first shell wall is provided with a mounting hole that communicates with the receiving space. The base includes a seat body and a stop portion connected to the seat body. A portion of the seat body is embedded in the mounting hole, and another portion of the seat body is located in the receiving space and connected to the vibrator. The stop portion is located outside the housing and stops at the edge of the mounting hole.

[0051] With this configuration, the stop part can abut against the edge of the mounting hole to control the length of the seat extending into the receiving space, thereby controlling the installation position of the oscillator in the receiving space and preventing the oscillator from interfering with other structures in the receiving space when vibrating.

[0052] In some embodiments of the first aspect, the shell wall of the housing includes a first shell wall and a second shell wall disposed opposite to each other, and a shell sidewall connected between the first shell wall and the second shell wall. The first shell wall is provided with a mounting hole that communicates with the receiving space. The base includes a base body and a support member. A portion of the base body is embedded in the mounting hole, and another portion of the base body is located in the receiving space and connected to the oscillator. The support member is supported between the oscillator and the second shell wall.

[0053] With this configuration, the support components can support and limit the oscillator, thereby controlling the installation position of the oscillator in the housing space to prevent the oscillator from interfering with other structures in the housing space when it vibrates.

[0054] In some embodiments of the first aspect, the shell wall of the housing includes a first shell wall and a second shell wall disposed opposite to each other, and a shell sidewall connected between the first shell wall and the second shell wall, and a base is disposed in the housing and supported between the first shell wall and the second shell wall.

[0055] This design can improve the rigidity of the shell at the edges and prevent the edges of the first or second shell wall from denting inward under the action of external forces.

[0056] Secondly, embodiments of this application provide a heat dissipation module, including a heat source and a heat spreader as described in any embodiment of the first aspect, wherein the shell of the heat spreader is thermally connected to the heat source, and the evaporation zone of the heat spreader is the orthographic projection of the heat source onto the shell of the heat spreader.

[0057] The beneficial effects of the heat dissipation module in this embodiment are the same as those of the heat spreader in the first aspect, and will not be repeated here.

[0058] In some embodiments of the second aspect, the heat source is the processor.

[0059] In some embodiments of the second aspect, the heat dissipation module further includes a carrier substrate, a heat sink, and a cooling fan; the heat source, heat sink, and cooling fan are all disposed on the carrier substrate, and the heat spreader is disposed on the side of the heat source away from the carrier substrate; the housing includes a first housing and a second housing connected to the edge of the first housing, the second housing is located in the condensation area of ​​the heat spreader and is connected to the first housing, the first housing is thermally connected to the heat source, and both the first housing and the second housing are provided with a first capillary structure; there is a placement space between the second housing and the carrier substrate, the air outlet of the cooling fan is directly opposite the placement space, and the heat sink is disposed in the placement space.

[0060] With this configuration, the heat dissipated by the heat sink in the condensation zone (i.e., the second shell) of the heat spreader can be carried away by the air blown out by the cooling fan 330 in a timely manner, which helps to improve the heat dissipation effect of the heat spreader.

[0061] In some embodiments of the second aspect, there are two second housings, which extend to opposite sides of the first housing. The first housing and the two second housings together form a T-shaped structure. Each second housing is provided with a heat sink in the placement space between it and the support substrate. There are two cooling fans, which are located on opposite sides of the heat source of the first housing. The exhaust end of each cooling fan is directly opposite the corresponding placement space.

[0062] This setup can further improve the heat dissipation effect of the vapor chamber.

[0063] Thirdly, embodiments of this application provide an electronic device, including a device housing and a heat dissipation module as described in any embodiment of the second aspect, wherein the heat dissipation module is disposed in the device housing.

[0064] The beneficial effects of the electronic device in this embodiment are the same as those of the heat spreader in the first aspect, and will not be repeated here.

[0065] In some embodiments of the third aspect, the electronic device is a mobile phone, a tablet computer, or a laptop computer. Attached Figure Description

[0066] Figure 1 This is a schematic diagram of the back of an electronic device (mobile phone) in some embodiments of this application;

[0067] Figure 2 for Figure 1 A cross-sectional view of the electronic equipment in the picture;

[0068] Figure 3 This is a top view of the heat dissipation module in the first embodiment of this application;

[0069] Figure 4 for Figure 3 The BB cross-sectional view of the heat dissipation module shown;

[0070] Figure 5 for Figure 4 A schematic diagram showing the connection between the heat exchange plate and the heat source;

[0071] Figure 6 for Figure 5 The working principle diagram of the piezoelectric vibrator in the heat spreader shown in the figure;

[0072] Figure 7 for Figure 5 CC cross-sectional view of the heat spreader shown;

[0073] Figure 8 for Figure 5 The first shell wall of the heat spreader and the piezoelectric vibrator are shown in the bottom view;

[0074] Figure 9 for Figure 5 A magnified view of a portion of the capillary structure shown;

[0075] Figure 10 for Figure 9 A schematic diagram of a single cavity in the capillary structure shown;

[0076] Figure 11 This is a top view of the heat dissipation module in the second embodiment of this application;

[0077] Figure 12 This is a top view of the heat dissipation module in the third embodiment of this application;

[0078] Figure 13 for Figure 12 The diagram shows a DD cross-sectional view of the heat dissipation module.

[0079] Figure 14 This is a top view of the heat dissipation module in the fourth embodiment of this application;

[0080] Figure 15 for Figure 14 The diagram shows a cross-sectional view of the heat dissipation module.

[0081] Figure 16 for Figure 15 The FF cross-sectional view of the heat spreader shown;

[0082] Figure 17 for Figure 15 Another FF cross-sectional view of the heat spreader shown;

[0083] Figure 18 This is a top view of the heat dissipation module in the fifth embodiment of this application;

[0084] Figure 19 for Figure 18 Left view of the heat dissipation module shown;

[0085] Figure 20 for Figure 18 The GG cross-sectional view of the heat dissipation module shown;

[0086] Figure 21 for Figure 20 The HH cross-sectional view of the heat spreader shown.

[0087] Figure 22 for Figure 20 Section II of the heat spreader shown. Detailed Implementation

[0088] With the rapid development of modern technology, the performance of electronic devices is continuously improving. At the same time, to meet the market's stringent demands for portability, electronic devices such as mobile phones and tablets are becoming increasingly thinner and smaller. This trend leads to a continuous increase in the density of internal components, resulting in a significant increase in power consumption. Consequently, the heat generated per unit volume continues to rise, posing a serious challenge to heat dissipation. Heat dissipation has a crucial impact on the performance and reliability of electronic devices. Related research shows that for every 10°C increase in the temperature of internal electronic components, system reliability decreases by 50%.

[0089] To effectively solve the heat dissipation problem inside electronic devices, vapor chambers (VCs) have emerged. Vapor chambers, also known as heat spreaders, are a type of high-efficiency heat dissipation component. They have significant advantages such as multi-dimensional horizontal heat conduction, good heat dissipation effect, and thinness, and have great application potential in the heat dissipation design of thin and light electronic devices.

[0090] The vapor chamber has an internal cavity, which can be sealed by two layers of thin metal plates (such as stainless steel or copper). The cavity contains a capillary structure, commonly including metal mesh, fibrous structure, and columnar structure. Simultaneously, a suitable working fluid, typically water or other low-boiling-point liquid, is injected into the cavity.

[0091] When the heat-receiving surface of the vapor chamber comes into contact with the heat source, the working fluid absorbs heat and boils, vaporizing into steam. The steam quickly diffuses to the lower-temperature area. In the low-temperature region, the steam condenses into liquid upon cooling, releasing its latent heat of vaporization. The condensed liquid, under the capillary force generated by the capillary structure, flows back to the heat-receiving surface, continues to absorb heat and vaporize, and so on, achieving efficient heat transfer and uniform distribution.

[0092] However, in order to meet the design requirements of thinner and lighter electronic devices, the thickness of the heat spreader is becoming smaller and smaller, resulting in a narrower inner cavity. This narrow inner cavity is prone to problems such as excessive working fluid vapor resistance and insufficient capillary force for working fluid reflux. These problems will interfere with the normal gas-liquid circulation of the working fluid inside the heat spreader, reduce the circulation speed of the working fluid, and cause the heat dissipation performance of the heat spreader to decline.

[0093] To address this, this application provides a heat spreader, a heat dissipation module, and an electronic device. By setting a piezoelectric vibrator on the heat spreader, which acts as a pump, the piezoelectric vibrator can drive the movement of the working fluid vapor inside the heat spreader. This overcomes problems such as insufficient capillary force for working fluid reflux and excessive vapor resistance, thereby improving the circulation speed of the working fluid and thus improving the heat dissipation performance of the heat spreader.

[0094] The electronic devices in this application embodiment can be mobile phones, tablets, laptops, game consoles (such as home game consoles and handheld game consoles), servers, industrial control computers, wearable devices, etc. The structure and installation position of the heat sink in the electronic device are described below using a mobile phone as an example. Other types of electronic devices can be set up with reference to the structure of the mobile phone embodiment, and will not be described in detail here.

[0095] Figure 1 This is a schematic diagram of the back of an electronic device (mobile phone) in some embodiments of this application. Figure 2 for Figure 1 A cross-sectional view (AA) of the electronic equipment in the image. Figure 1 and Figure 2 As shown, the electronic device includes a device housing 500, a heat dissipation module 400, and a display screen 600. The heat dissipation module 400 is disposed in the device housing 500, and the display screen 600 is mounted on the device housing 500.

[0096] The display screen 600 can be a liquid crystal display screen, an OLED (Organic Light-Emitting Diode) display screen, a QLED (Quantum Dot Light-Emitting Diode) display screen, a Micro LED display screen, an electronic ink display screen, etc., without any specific limitations.

[0097] In some embodiments, such as Figure 1 and Figure 2 As shown, the device housing 500 includes a mid-frame 510 (also called a front shell or front frame) and a rear cover 520 (also called a battery cover), with the mid-frame 510 disposed between the display 600 and the rear cover 520.

[0098] The mid-frame 510 has an H-shaped cross-section and includes a bottom wall 511 and a side wall 512 located at the edge of the bottom wall 511. The edge of the display screen 600 is connected to the side wall 512, for example, by bonding. The display screen 600, the bottom wall 511, and the side wall 512 form a first receiving space 530, which is used to house accessories of the display screen 600. For example, when the display screen 600 is a liquid crystal display, the first receiving space 530 is used to house accessories of the display screen 600 such as a backlight; or, when the display screen 600 is an OLED display, the first receiving space 530 is used to house accessories of the display screen 600 such as a support film and a heat dissipation film.

[0099] The edge of the back cover 520 is connected to the side wall 512 of the middle frame, for example, by snap-fit. The back cover 520, the bottom wall 511 of the middle frame, and the side wall 512 of the middle frame form a second receiving space 540, which is used to house the heat dissipation module 400.

[0100] Of course, the mid-frame 510 is not limited to Figure 2 The structure shown can also be configured as other structures according to actual conditions. For example, the middle frame 510 can only include the middle frame side wall 512 and not the middle frame bottom wall 511. The display screen 600, the middle frame 510 and the back cover 520 form the cavity of the device housing 500. The accessories of the display screen 600 and the heat dissipation module 400 are set in the cavity of the device housing 500.

[0101] Figure 3 This is a top view of the heat dissipation module 400 in the first embodiment of this application. Figure 4 for Figure 3 The image shows a BB cross-sectional view of the heat dissipation module 400. (See image for details.) Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation module 400 includes a heat source 200 and a heat spreader 100, and the heat spreader 100 is thermally connected to the heat source 200.

[0102] The method of thermally connecting the heat spreader 100 and the heat source 200 is not unique; in some embodiments, such as... Figure 2 and Figure 4 As shown, the heat spreader 100 is in direct contact with the heat source 200 to achieve a thermally conductive connection between them. The heat spreader 100 and the heat source 200 can be in surface contact to ensure efficient heat transfer. In some embodiments, a thermally conductive layer is provided between the heat spreader 100 and the heat source 200 to achieve a thermally conductive connection. This thermally conductive layer can be a thermally conductive silicone grease (also known as thermal paste) layer or a thermally conductive gel layer; no specific limitation is made here.

[0103] The type of heat source 200 is not unique, such as Figure 3 and Figure 4 As shown, heat source 200 can be a processor, such as a CPU (Central Processing Unit) chip, GPU (Graphics Processing Unit) chip, etc.; in addition, heat source 200 can also be a power amplifier.

[0104] In some embodiments, such as Figure 2 , Figure 3 and Figure 4 As shown, the heat dissipation module 400 also includes a carrier substrate 310, and the heat source 200 is disposed on the carrier substrate 310. The carrier substrate 310 can be a circuit board.

[0105] The location of the carrier substrate 310 within the device housing 500 is not unique; in some embodiments, such as... Figure 2 As shown, the carrier substrate 310 can be disposed between the heat source 200 and the bottom wall 511 of the middle frame, and the heat dissipation plate 100 is disposed between the rear cover 520 and the heat source 200.

[0106] In other embodiments, the carrier substrate 310 may be disposed between the heat source 200 and the rear cover 520, and the heat spreader 100 may be disposed between the bottom wall 511 of the middle frame and the heat source 200.

[0107] Figure 5 for Figure 4 A schematic diagram showing the connection between the central heat exchange plate 100 and the heat source 200. (See diagram below.) Figure 5 As shown, the heat spreader 100 includes a shell 1, a capillary structure 2, a working fluid 3, and a piezoelectric vibrator 4.

[0108] like Figure 3 and Figure 5 As shown, the shell 1 has a rectangular outline, and the shell wall of the shell 1 includes first shell walls 12 spaced apart along the thickness direction H of the shell 1 (e.g., ...). Figure 5 The top shell wall shown) and the second shell wall 13 (e.g. Figure 5 The shell includes the bottom wall (as shown) and the side wall 14 connecting the first shell wall 12 and the second shell wall 13. The first shell wall 12, the second shell wall 13, and the side wall 14 form the shell cavity of the shell 1. The side wall 14 and the first shell wall 12 can be an integral structure or separate structures, which is not specifically limited here.

[0109] Of course, the outline of the shell 1 can be rectangular, circular, or other irregular shapes, depending on the actual situation.

[0110] like Figure 5As shown, the capillary structure 2 and the working fluid 3 are disposed within the housing 1. The housing 1 has an evaporation zone 1a, a condensation zone 1b, and a transport zone 1c located between the evaporation zone 1a and the condensation zone 1b. The capillary structure 2 includes a first capillary structure 21, which includes a first portion 211 located in the evaporation zone 1a, a second portion 212 located in the condensation zone 1b, and a third portion 213 located in the transport zone 1c. The housing 1 has a receiving space 11, which is connected to the first portion 211 and the second portion 212, respectively. At least the receiving space 11 and the capillary structure 2 form a circulation channel for the working fluid 3.

[0111] The working fluid 3 can switch between gaseous and liquid states and has the characteristics of low boiling point, high latent heat of vaporization, stable chemical properties, and good compatibility with the material of the heat spreader 100. The working fluid 3 can be water, methanol, ethanol, Freon, acetone, etc., and is not specifically limited here.

[0112] The capillary structure 2 primarily utilizes capillary force to allow the working fluid 3, liquefied in the condensation zone 1b, to flow back to the evaporation zone 1a. There are many types of capillary structures 2, such as... Figure 4 and Figure 5 As shown, the capillary structure 2 can be a sintered body covering the shell wall of the shell 1, such as a copper powder sintered body; or, for example, the capillary structure 2 can be a metal mesh covering the shell wall of the shell 1, such as a copper mesh or a stainless steel mesh; or, for example, the capillary structure 2 can be a groove provided on the inner surface of the shell wall of the shell 1.

[0113] Evaporation zone 1a is the orthographic projection of heat source 200 onto shell 1, for example... Figure 3 The area defined by the dashed box 'a', and Figure 4 and Figure 5 The region between the dashed lines a1 and a2. For example... Figure 5 As shown, when the heat source 200 generates heat and transfers it to the evaporation zone 1a, the liquid working fluid 3 in the first part 211 absorbs the heat, reaches its boiling point, and begins to boil and vaporize, changing from a liquid state to a gaseous state. The gaseous working fluid 3 then enters the containing space 11 from the first part 211. During this process, the working fluid 3 absorbs a large amount of heat, thereby carrying away the heat from the heat source 200.

[0114] The condensation zone 1b is located in the area of ​​the casing 1 far from the heat source 200, or in the area in close contact with external heat dissipation components (such as heat sinks), for example... Figure 3 The middle shell 1 is located in the area outside the dashed frame b, and Figure 4 and Figure 5 The middle shell 1 is located in the region to the left of dashed line b1 and the region to the right of dashed line b2. For example... Figure 5As shown, when the gaseous working fluid 3 flows through the containment space 11 to the condensation zone 1b, the gaseous working fluid 3 will liquefy upon cooling due to the lower temperature of the condensation zone 1b, and will return to a liquid state. During this process, the gaseous working fluid 3 releases the heat absorbed in the evaporation zone 1a. This heat is dissipated through the shell wall of the shell 1. At the same time, the liquid working fluid 3 flows back to the first part 211 through the second part 212.

[0115] The transfer zone 1c is a transition zone between the evaporation zone 1a and the condensation zone 1b, used to transfer gaseous working fluid 3 to the condensation zone 1b and to transfer liquid working fluid 3 back to the evaporation zone 1a. The transfer zone 1c can be... Figure 3 The area between dashed box a and dashed box b, and Figure 4 and Figure 5 The area between dashed line a1 and dashed line b1 and the area between dashed line a2 and dashed line b2.

[0116] Figure 6 for Figure 5 The diagram shows the working principle of the piezoelectric vibrator 4 in the heat spreader 100. Figure 5 and Figure 6 As shown, the piezoelectric oscillator 4 is an electronic component that operates based on the piezoelectric effect. The piezoelectric oscillator 4 includes a base 41 and an oscillator 42 connected to the base 41. The base 41 is mounted on the housing 1, and the oscillator 42 is located in the housing space 11 and is used to drive the gaseous working fluid 3 in the housing space 11 to flow to the second part 212.

[0117] The base 41 can be installed on the first shell wall 12, specifically as follows: Figure 3 , Figure 4 and Figure 5 As shown, the first shell wall 12 is provided with a mounting hole 121, which communicates with the receiving space 11. The base 41 includes a seat body 411 and a stop part 412 connected to the seat body 411. A part of the seat body 411 is embedded in the mounting hole 121, and the other part of the seat body 411 is located in the receiving space 11 and connected to the vibrator 42. The stop part 412 is located outside the shell 1 and stops at the edge of the mounting hole 121. By providing the stop part 412 on the seat body 411, the stop part 412 can abut against the edge of the mounting hole 121 to control the length of the seat body 411 extending into the receiving space 11, thereby controlling the installation position of the vibrator 42 in the receiving space 11 and preventing the vibrator 42 from interfering with other structures in the receiving space 11 when vibrating.

[0118] The aforementioned seat 411 can be a columnar structure, such as a cylindrical structure, and the stop 412 can be a disc-shaped structure, such as a disc-shaped structure. Of course, the seat 411 and the stop 412 are not limited to the above structures, and the seat 411 and the stop 412 can be designed into other shapes according to the actual situation.

[0119] The oscillator 42 may include a piezoelectric ceramic sheet and electrodes covering the piezoelectric ceramic sheet. When an alternating electric field is applied to the electrodes of the oscillator 42, according to the inverse piezoelectric effect, the piezoelectric ceramic sheet will undergo mechanical deformation, that is, generate mechanical vibration with the same frequency as the electric field. If the frequency of the applied electrical signal is equal to the natural vibration frequency of the oscillator 42, the elastic deformation of the oscillator 42 is at its maximum, resonance occurs, and electrical energy can be converted into mechanical energy more effectively.

[0120] The principle by which the piezoelectric vibrator 4 drives the working fluid 3 to flow is as follows: Figure 6 As shown in (a), when the oscillator 42 oscillates upward, the volume of the lower space of the oscillator 42 (part of the containment space 11) increases and the pressure decreases. The gaseous working fluid 3 in the first part 211 of the first capillary structure 21 flows to the lower space of the oscillator 42 under the action of the pressure difference, thereby accelerating the flow of the gaseous working fluid 3 into the containment space 11.

[0121] like Figure 6 As shown in (b), when the oscillator 42 oscillates downward, the space below the oscillator 42 decreases, increasing the pressure in the space below the oscillator 42. The gaseous working fluid 3 flows rapidly to the condensation zone 1b under the fanning of the oscillator 42, and after condensation, it enters the second part 212 of the first capillary structure 21. In this way, the oscillator 42 drives the gaseous working fluid 3 in the accommodating space 11 to flow to the second part 212.

[0122] In this embodiment, the heat spreader 100 is equipped with a piezoelectric vibrator 4, and the vibrator 42 of the piezoelectric vibrator 4 is located in the accommodating space 11. In this way, the piezoelectric vibrator 4 acts as a driving pump. When the vibrator 42 of the piezoelectric vibrator 4 vibrates in the accommodating space 11, it can disturb the gaseous working fluid 3 in the accommodating space 11, so as to provide pressure for the working fluid 3 to circulate in the circulation channel. This can overcome the problems of excessive resistance to the flow of gaseous working fluid 3 in the accommodating space 11 and insufficient capillary force for the return flow of liquid working fluid 3 in the capillary structure 2. This is beneficial to improving the gas-liquid circulation speed of the working fluid 3 inside the heat spreader 100 in the circulation channel, and thus improving the heat dissipation performance of the heat spreader 100.

[0123] To further improve the heat dissipation performance of the heat spreader 100, in some embodiments, such as Figure 5 and Figure 7 As shown, Figure 7 for Figure 5The image shows a CC cross-sectional view of the heat spreader 100. A working fluid baffle 5 is provided within the housing 1. The working fluid baffle 5 has opposing first and second sides, and a first capillary structure 21 is located on the first side of the working fluid baffle 5 (e.g., ...). Figure 5 As shown below), at least a portion of the accommodating space 11 is located on the second side of the working fluid partition 5 (e.g., the lower side). Figure 5 (as shown on the upper side).

[0124] The working fluid partition 5 has a through hole 51 in the area corresponding to the first part 211. The through hole 51 is connected to the first part 211. An opening 6 is formed between the edge of the working fluid partition 5 and the shell wall of the shell 1. The opening 6 is connected to the second part 212. The through hole 51 and the opening 6 allow the gaseous working fluid 3 to pass through.

[0125] Among them, such as Figure 5 As shown, the region on the working fluid partition 5 corresponding to the first part 211 is specifically such that the orthographic projection of this region onto the second shell wall 13 overlaps with the orthographic projection of the first part 211 onto the second shell wall 13. The opening 6 can be located between the edge of the working fluid partition 5 and the first shell wall 12.

[0126] By setting the working fluid partition 5, the working fluid partition 5 can separate at least a portion of the accommodating space 11 from the first capillary structure 21 to form independent working fluid gas / liquid chambers. This can increase the pressure in the accommodating space 11 (i.e., the gas chamber) when the oscillator 42 vibrates, thereby improving the gas-liquid circulation speed of the working fluid 3 in the circulation channel, and further improving the heat dissipation performance of the heat spreader 100.

[0127] In some embodiments, the oscillator 42 of the piezoelectric oscillator 4 may be partially aligned with the through hole 51, specifically as follows: Figure 5 and Figure 8 As shown, Figure 8 for Figure 5 The image shows a bottom view of the first shell wall 12 of the heat spreader 100 and the piezoelectric vibrator 4. The vibrator 42 has a sheet-like structure and includes a central region 421 and a peripheral region 422 surrounding the central region 421. The central region 421 is connected to the base 41 and is positioned directly opposite the through hole 51. A first gap 71 is formed between the peripheral region 422 and the working fluid partition 5, allowing the gaseous working fluid 3 to pass through.

[0128] Among them, such as Figure 5 As shown, the central region 421 is positioned directly opposite the through hole 51, specifically meaning that the orthographic projection of the central region 421 on the second shell wall 13 overlaps with the orthographic projection of the through hole 51 on the second shell wall 13.

[0129] By connecting the central region 421 of the oscillator 42 to the base 41 and positioning it directly opposite the through hole 51, a first gap 71 is formed between the outer region 422 and the working fluid partition 5. Thus, as... Figure 6 As shown in (a), when the oscillator 42 vibrates upward (i.e., the edge of the oscillator 42 vibrates in a direction away from the working fluid partition 5), the pressure generated by the volume change of the first gap 71 can efficiently draw the gaseous working fluid 3 into the receiving space 11 through the through hole 51; as Figure 6 As shown in (b), when the oscillator 42 vibrates downward (i.e., the edge of the oscillator 42 vibrates towards the working fluid partition 5), the pressure generated by the volume change of the first gap 71 can easily drive the gaseous working fluid 3 to flow towards the condensation zone 1b, thereby reducing the risk of the gaseous working fluid 3 being fanned back into the first part 211 by the oscillator 42.

[0130] In some embodiments, such as Figure 4 As shown, the diameter d of the through hole 51 and the radial dimension L1 of the oscillator 42 in the through hole 51 satisfy the following:

[0131] L1≥1.2d.

[0132] The radial direction of the through hole 51 can be perpendicular to the thickness direction H of the shell 1 of the heat spreader 100. For example, the radial direction of the through hole 51 can be... Figure 4 The length direction X of the shell 1 shown can also be Figure 4 The width direction Y of the housing 1 shown; as Figure 1 , Figure 2 and Figure 3 As shown, the length direction X of the housing 1 can be parallel to the width direction of the device housing 500 of the electronic device, and the width direction Y of the housing 1 can be parallel to the length direction of the device housing 500 of the electronic device.

[0133] This design avoids the oscillator 42 having an excessively small size L1. If the oscillator 42's size L1 is too small, the length of the first gap 71 will be small. When the oscillator 42 vibrates, the pressure generated by the volume change of the first gap 71 will be small, which is not conducive to the oscillator 42 efficiently driving the gaseous working fluid 3 to flow to the condensation zone 1b. By setting the oscillator 42's size L1 to L1≥1.2d, it is beneficial to increase the pressure generated by the oscillator 42 during vibration, thereby efficiently driving the gaseous working fluid 3 to flow to the condensation zone 1b and improving the circulation speed.

[0134] In some embodiments, such as Figure 4 As shown, the diameter d of the through hole 51 and the radial dimension L1 of the oscillator 42 in the through hole 51 satisfy the following:

[0135] L1≤1.3d.

[0136] This configuration avoids the oscillator 42 having an excessively large size L1. If the oscillator 42 has an excessive size L1, it will occupy too much of the accommodating space 11, reducing the amount of gaseous working fluid 3 that the accommodating space 11 can hold. This would hinder the oscillator 42 from efficiently driving the gaseous working fluid 3 to flow to the condensation zone 1b. By setting the size L1 of the oscillator 42 to L1 ≤ 1.3d, the oscillator 42's occupation of the accommodating space 11 can be reduced, which is beneficial for increasing the amount of gaseous working fluid 3 that the accommodating space 11 can hold. This allows the oscillator 42 to efficiently drive the gaseous working fluid 3 to flow to the condensation zone 1b, thereby increasing the circulation speed.

[0137] In some embodiments, such as Figure 4 As shown, the diameter d of the through hole 51 and the radial dimension L2 of the working fluid partition 5 in the through hole 51 satisfy the following:

[0138] d≥0.2L2.

[0139] This design avoids the orifice diameter d of the through hole 51 being too small. If the orifice diameter d of the through hole 51 is too small, it will affect the speed at which the gaseous working fluid 3 enters the containing space 11, which is not conducive to the oscillator 42 efficiently driving the gaseous working fluid 3 to flow to the condensation zone 1b. By setting the orifice diameter d of the through hole 51 to d≥0.2L2, it is beneficial to increase the speed at which the gaseous working fluid 3 enters the containing space 11, thereby enabling the oscillator 42 to efficiently drive the gaseous working fluid 3 to flow to the condensation zone 1b and improving the circulation speed.

[0140] In some embodiments, such as Figure 4 As shown, the diameter d of the through hole 51 and the radial dimension L2 of the working fluid partition 5 in the through hole 51 satisfy the following:

[0141] d≤0.3L2.

[0142] This setting avoids the orifice diameter d of the through hole 51 being too large. If the orifice diameter d of the through hole 51 is too large, it will affect the pressure generated by the oscillator 42 during vibration, which is not conducive to the oscillator 42 efficiently driving the gaseous working fluid 3 to flow to the condensation zone 1b. By setting the orifice diameter d of the through hole 51 to d≤0.3L2, it is beneficial to increase the pressure generated by the oscillator 42 during vibration, thereby enabling the oscillator 42 to efficiently drive the gaseous working fluid 3 to flow to the condensation zone 1b and improve the circulation speed.

[0143] In some embodiments, such as Figure 4 As shown, in the radial direction of the through hole 51, the dimensions L1 of the oscillator 42 and L3 of the evaporation zone 1a satisfy:

[0144] L1 > L3.

[0145] This configuration allows the oscillator 42 to cover the evaporation zone 1a, thereby drawing more gaseous working fluid 3 from the first part 211 into the containment space 11 when the oscillator 42 vibrates, thus improving the circulation efficiency of the working fluid 3 in the circulation channel.

[0146] In some embodiments, such as Figure 4 As shown, the accommodating space 11 is at least partially located between the first shell wall 12 and the working fluid partition 5, and a second gap 72 is formed between the first shell wall 12 and the oscillator 42; the width w2 of the second gap 72 and the width w1 of the first gap 71 satisfy:

[0147] w1 > w2.

[0148] This configuration avoids the width w1 of the first gap 71 being too small. In this way, the first gap 71 has enough space for the oscillator 42 to vibrate, and the amplitude of the oscillator 42 can be designed to be relatively large, so that the oscillator 42 generates greater pressure when vibrating. This is beneficial for the oscillator 42 to efficiently drive the gaseous working fluid 3 to the condensation zone 1b, thereby improving the circulation speed.

[0149] In some embodiments, such as Figure 4 As shown, the width w2 of the second gap 72 satisfies:

[0150] 0.05mm≤w2≤0.1mm.

[0151] This setting avoids the second gap 72's width w2 being too large or too small. If the second gap 72's width w2 is too large, it will reduce the width w1 of the first gap 71, making it difficult for the oscillator 42 to generate greater pressure during vibration to drive the gaseous working fluid 3 to flow towards the condensation zone 1b. If the second gap 72's width w2 is too small, the oscillator 42 is prone to interference with the first shell wall 12 during vibration. By setting the width w2 of the second gap 72 to 0.05mm ≤ w2 ≤ 0.1mm, not only is it possible to avoid the first gap 71's width w1 becoming too small, which is beneficial for the oscillator 42 to generate greater pressure during vibration to efficiently drive the gaseous working fluid 3 to flow towards the condensation zone 1b, but it also avoids interference between the oscillator 42 and the first shell wall 12.

[0152] To improve the reflux efficiency of the liquid working fluid 3 in the condensation zone 1b, in some embodiments, such as... Figure 5 As shown, the capillary structure 2 also includes a second capillary structure 22 located in the condensation zone 1b. The second capillary structure 22 is connected to the second part 212, and the second capillary structure 22 extends towards the second side of the working fluid partition 5 (e.g., Figure 5 It extends in the direction of the upper side shown in the figure and is connected to the opening 6 and the second part 212 respectively.

[0153] A third gap 73 is formed between the edge of the working fluid partition 5 and the second capillary structure 22, allowing the gaseous working fluid 3 to pass through. The third gap 73 is connected to the second part 212.

[0154] With this configuration, when the gaseous working fluid 3 condenses into a liquid working fluid 3 in the condensation zone 1b, it can flow back to the evaporation zone 1b through two paths. One path is: the second capillary structure 22 - the second part 212 of the first capillary structure 21 - the third part 213 - the first part 211; the other path is: the third gap 73 - the second part 212 of the first capillary structure 21 - the third part 213 - the first part 211. By setting two return paths, the return of the liquid working fluid 3 at different locations can be facilitated, thereby improving the return efficiency of the liquid working fluid 3 and thus improving the heat dissipation performance of the heat spreader 100.

[0155] To reduce the backflow resistance of the liquid working fluid 3 in the capillary structure 2, in some embodiments, such as Figure 9 and Figure 10 As shown, Figure 9 for Figure 5 The enlarged view of a portion of capillary structure 2 shown. Figure 10 for Figure 9 The diagram shows a schematic of a single cavity 20 of the capillary structure 2. The capillary structure 2 is a three-dimensional porous structure with multiple cavities 20. Adjacent cavities 20 are interconnected, and each cavity 20 is formed by a minimal surface, meaning the inner wall of the cavity 20 is a minimal surface. The capillary structure 2 can be a sintered body, such as a copper sintered body.

[0156] By configuring each cavity 20 to be surrounded by minimal curved surfaces, the liquid working fluid 3 enters the cavity 20 and contacts the minimal curved surfaces. Since the average curvature of the minimal curved surfaces is zero, this means that their principal curvatures at each point are opposite and equal. This minimizes the resistance experienced by the liquid working fluid 3 as it flows on its surface, thus reducing backflow resistance. Furthermore, the design of the minimal curved surfaces optimizes the path of the liquid working fluid 3, reducing the occurrence of eddies and turbulence, thereby further reducing backflow resistance and improving the circulation efficiency of the working fluid 3, thereby enhancing the heat dissipation performance of the heat spreader 100.

[0157] In some embodiments, such as Figure 9 and Figure 10 As shown, multiple cavities 20 of the three-dimensional porous structure are arranged in a spatial array. Each cavity 20 has six openings 201. The six openings 201 are divided into three groups. The first group includes two openings 201 that are arranged opposite each other along the first direction X. The second group includes two openings 201 that are arranged opposite each other along the second direction Y. The third group includes two openings 201 that are arranged opposite each other along the height direction H of the shell 1. The openings 201 on the corresponding sides of two adjacent cavities 20 are connected.

[0158] Figure 11 This is a top view of the heat dissipation module 400 in the second embodiment of this application. Figure 11 The heat dissipation module 400 shown is Figures 3 to 10 The main difference between the heat dissipation module 400 shown is that the composition of the capillary structure 2 of the heat spreader 100 is different. Figure 11 The heat spreader 100 shown includes only the first capillary structure 21 and does not include the second capillary structure 22.

[0159] The circulation process of the working fluid 3 in the heat spreader 100 is as follows: Figure 11 As shown, when the heat source 200 generates heat and transfers it to the evaporation zone 1a, the liquid working fluid 3 in the first part 211 of the first capillary structure 21 absorbs the heat, reaches the boiling point and begins to boil and vaporize, changing from liquid to gas. The gaseous working fluid 3 enters the containment space 11 from the first part 211.

[0160] When the gaseous working fluid 3 flows along the containment space 11 to the condensation zone 1b, the gaseous working fluid 3 will liquefy upon cooling and return to the liquid state. The liquid working fluid 3 enters the second part 212 of the first capillary structure 21 through the opening 6, and flows back to the first part 211 under the action of the capillary force of the first capillary structure 21.

[0161] Among them, such as Figure 11 As shown, the opening 6 can be located between the edge of the working fluid partition 5 and the shell sidewall 14.

[0162] As for Figure 11 For details of the other structures of the heat dissipation module 400 shown, please refer to [reference needed]. Figures 3 to 10 The structure of the heat dissipation module 400 shown is configured as described above, and will not be elaborated further here.

[0163] Figure 12 This is a top view of the heat dissipation module 400 in the third embodiment of this application. Figure 13 for Figure 12 The DD cross-sectional view of the heat dissipation module 400 shown. Figure 12 , Figure 13 The heat dissipation module 400 shown is Figures 3 to 10 The main difference between the heat dissipation module 400 shown is that the structure of the base 41 of the piezoelectric vibrator 4 is different, as shown below:

[0164] like Figure 11As shown, the first shell wall 12 is provided with a mounting hole 121, which is connected to the receiving space 11; the base 41 includes a seat body 411 and a support member 413. A part of the seat body 411 is embedded in the mounting hole 121, and the other part of the seat body 411 is located in the receiving space 11 and connected to the oscillator 42. The support member 413 is supported between the oscillator 42 and the second shell wall 13.

[0165] By supporting the oscillator 42 between the oscillator 42 and the second shell wall 13, the oscillator 413 can support and limit the oscillator 42, thereby controlling the installation position of the oscillator 42 in the receiving space 11, so as to avoid the oscillator 42 interfering with other structures in the receiving space 11 when vibrating.

[0166] Among them, such as Figure 13 As shown, the support member 413 can be a columnar structure, such as a cylindrical structure; however, it is not limited to this, and the support member 413 can also be designed as other structures, such as a plate-like structure, a block-like structure, etc. Figure 13 As shown, the base 411 can be a columnar structure, such as a cylindrical structure, but it is not limited to this. The base 411 can also be designed as other structures.

[0167] In some embodiments, such as Figure 13 As shown, the first capillary structure 21 is provided with a clearance hole 214, and the support member 413 extends into the clearance hole 214 and abuts against the second shell wall 13.

[0168] In some embodiments, such as Figure 13 As shown, the oscillator 42 is positioned between the support member 413 and the base 411. This arrangement allows the support member 413 and the base 411 to limit the movement of the oscillator 42 on both sides, thus making the oscillator 42 more securely installed.

[0169] In some embodiments, such as Figure 13 As shown, the side surface of the seat 411 away from the support member 413 (e.g.) Figure 13 The upper surface of the middle support member 413 is flush with the outer surface of the first shell wall 12, or the side surface of the seat body 411 away from the support member 413 is recessed into the outer surface of the first shell wall 12. This arrangement can prevent the seat body 411 from protruding outside the first shell wall 12 and occupying the space outside the shell 1, thereby helping to reduce the thickness of the heat spreader 100.

[0170] As for Figure 12 , Figure 13 For details of the other structures of the heat dissipation module 400 shown, please refer to [reference needed]. Figures 3 to 10 The structure of the heat dissipation module 400 shown is configured as described above, and will not be elaborated further here.

[0171] Figure 14This is a top view of the heat dissipation module 400 in the fourth embodiment of this application. Figure 15 for Figure 14 The EE cross-sectional view of the heat dissipation module 400 shown. Figure 14 , Figure 15 The heat dissipation module 400 shown is Figures 3 to 10 The main difference between the heat dissipation module 400 shown is the mounting position of the piezoelectric vibrator 4. Figure 14 and Figure 15 The piezoelectric vibrator 4 of the heat spreader 100 shown is mounted on the periphery of the first capillary structure 21, as detailed below:

[0172] like Figure 14 and Figure 15 As shown, the accommodating space 11 includes a first space 111 and a second space 112. The first space 111 is located on the second side of the working fluid partition 5, and the second space 112 is located on the periphery of the first capillary structure 21 and in the condensation zone 1b. The second space 112 is connected to the first space 111 through the opening 6 and is connected to the second part 212. The oscillator 42 is located in the second space 112.

[0173] By placing the oscillator 42 in the second space 112, the distance between the oscillator 42 and the through hole 51 is relatively large. When the oscillator 42 vibrates, the flow of gaseous working fluid 3 back to the first part 211 of the first capillary structure 21 under the action of the oscillator 42 through the through hole 51 can be greatly reduced, thereby improving the circulation efficiency of the working fluid 3 and thus improving the heat dissipation performance of the heat spreader 100.

[0174] In some embodiments, the vibrator 42 may adopt a cantilever mounting structure, specifically as follows: Figure 15 As shown, the first capillary structure 21 covers the second shell wall 13. The oscillator 42 is a sheet structure and has a first side 423 located close to the first capillary structure 21 and a second side 424 located away from the first capillary structure 21. The second side 424 is connected to the base 41. The first side 423 is freely arranged and forms a fourth gap 74 between itself and the edge of the first capillary structure 21, through which the gaseous working fluid 3 can pass. The fourth gap 74 is connected to the second part 212 and the opening 6 respectively.

[0175] By configuring the oscillator 42 as a cantilever structure with the second side 424 connected to the base 41 and the first side 423 freely arranged, this installation method allows the vibrating end of the oscillator 42 to be close to the through hole 51. This facilitates the oscillator 42 to efficiently drive the gaseous working fluid 3 to flow towards the condensation zone 1b, thereby improving the circulation efficiency of the working fluid 3. Simultaneously, a fourth gap 74 is formed between the first side 423 and the edge of the first capillary structure 21, making the lower space of the oscillator 42 relatively "closed" in the thickness direction H of the housing 1. This helps to increase the pressure generated in the lower space of the oscillator 42 during vibration, thus facilitating the oscillator 42 to efficiently drive the gaseous working fluid 3 to flow towards the condensation zone 1b, thereby improving the circulation efficiency of the working fluid 3.

[0176] In some embodiments, such as Figure 15 As shown, the edge of the first capillary structure 21 extends beyond the edge of the working fluid partition 5 (that is, the working fluid partition 5 does not cover the edge of the first capillary structure 21) so that the first space 111 is connected to the second part 212 located at the edge of the first capillary structure 21.

[0177] With this setting, such as Figure 15 As shown, after the gaseous working fluid 3 enters the condensation zone 1b through the first space 111, the working fluid 3 condensed into liquid at the edge of the working fluid partition 5 can enter the second part 212 through the upper surface of the first capillary structure 21 and flow back to the first part 211; the working fluid 3 condensed into liquid in the second space 112 (e.g., the space below the oscillator 42) can enter the second part 212 through the side of the first capillary structure 21 and flow back to the first part 211. In this way, the return of liquid working fluid 3 at different locations can be facilitated, thereby improving the return efficiency of liquid working fluid 3 and thus improving the heat dissipation performance of the heat spreader 100.

[0178] In some embodiments, such as Figure 15 As shown, the width w4 of the fourth gap 74 satisfies:

[0179] 0.05mm≤w4≤0.2mm.

[0180] This setting avoids making the width w4 of the fourth gap 74 too large or too small. If the width w4 of the fourth gap 74 is too large, the upper "opening" of the space below the oscillator 42 will be too large, which is not conducive to the oscillator 42 generating greater pressure during vibration. If the width w4 of the fourth gap 74 is too small, it will affect the flow rate of the gaseous working medium 3, which is not conducive to improving the circulation efficiency of the working medium 3. By setting the width w4 of the fourth gap 74 to 0.05mm≤w4≤0.2mm, it is beneficial to generate greater pressure during vibration of the oscillator 42 while reducing the impact on the flow rate of the gaseous working medium 3, thereby improving the circulation efficiency of the working medium 3.

[0181] In some embodiments, such as Figure 15 As shown, the width w4 of the fourth gap 74 and the distance w3 from the edge of the first capillary structure 21 beyond the edge of the working fluid partition 5 satisfy the following:

[0182] w4 < w3.

[0183] This configuration optimizes the ratio of the amount of liquid working fluid 3 entering the first capillary structure 21 at the edge of the working fluid partition 5 and the lower space of the oscillator 42. This ensures that the amount of liquid working fluid 3 entering the first capillary structure 21 from the edge of the working fluid partition 5 is greater than the amount entering the first capillary structure 21 from the lower space of the oscillator 42 (i.e., the space between the oscillator 41 and the second shell wall 13). This improves the reflux efficiency of the liquid working fluid 3 and, consequently, enhances the heat dissipation performance of the heat spreader 100.

[0184] In some embodiments, such as Figure 15 As shown, the distance h from the oscillator 42 to the second shell wall 13, and the distance w3 from the edge of the first capillary structure 21 beyond the edge of the working fluid partition 5, satisfy the following:

[0185] w3 > h.

[0186] This configuration allows for a larger area of ​​the first capillary structure 21 that is not covered by the working fluid partition 5. This optimizes the ratio of the amount of liquid working fluid 3 entering the first capillary structure 21 at the edge of the working fluid partition 5 and the lower space of the oscillator 42. This ensures that the amount of liquid working fluid 3 entering the first capillary structure 21 from the edge of the working fluid partition 5 is greater than the amount entering the first capillary structure 21 from the lower space of the oscillator 42, thereby improving the reflux efficiency of the liquid working fluid 3 and thus improving the heat dissipation performance of the heat spreader 100.

[0187] In some embodiments, such as Figure 15 As shown, the distance h from the oscillator 42 to the second shell wall 13, and the distance w3 from the edge of the first capillary structure 21 beyond the edge of the working fluid partition 5, satisfy the following:

[0188] 1.5h≤w3≤4h.

[0189] This configuration can further optimize the proportion of liquid working fluid 3 entering the first capillary structure 21 at the edge of the working fluid partition 5 and the lower space of the oscillator 42, thereby further improving the reflux efficiency of the liquid working fluid 3 and thus improving the heat dissipation performance of the heat spreader 100.

[0190] In some embodiments, such as Figure 15 As shown, the oscillator 42 is located away from the surface of the second shell wall 13 (e.g., Figure 15The upper surface shown) and the surface of the first capillary structure 21 away from the second shell wall 13 (e.g., the surface shown) Figure 15 The upper surface shown is flush with the upper surface. This arrangement allows the distance between the oscillator 42 and the second shell wall 13 to be relatively large, which is beneficial to increasing the volume of the lower space of the oscillator 42. This allows the gaseous working fluid 3 entering the lower space of the oscillator 42 to liquefy into more liquid working fluid 3 so that it can enter the first capillary structure 21, thereby helping to ensure the circulation efficiency of the working fluid 3.

[0191] In some embodiments, the base 41 may be mounted on the housing 1 in the following manner, such as... Figure 15 As shown, the base 41 is disposed in the housing 1 and supported between the first housing wall 12 and the second housing wall 13. Since the base 41 is disposed in the housing 1, it avoids occupying space outside the housing 1, thereby allowing the heat spreader 100 to be thinner; since the base 41 is supported between the first housing wall 12 and the second housing wall 13, it can improve the rigidity of the housing 1 at the edge, preventing the edge portion of the first housing wall 12 or the second housing wall 13 from being recessed inward under the action of external force.

[0192] The arrangement of the oscillators 42 in the circumferential direction of the first capillary structure 21 is not unique; in some embodiments, such as... Figure 16 As shown, Figure 16 for Figure 15 The image shows a cross-sectional view (FF) of the heat spreader 100. Multiple oscillators 42 are arranged circumferentially along the first capillary structure 21. This arrangement allows the working fluid 3 to diffuse more evenly along the circumferential direction of the first capillary structure 21, thereby improving the heat dissipation performance of the heat spreader 100.

[0193] Among them, such as Figure 16 As shown, multiple bases 41 can be correspondingly provided, and multiple oscillators 42 are respectively connected to multiple bases 41 in a one-to-one correspondence; for example, as Figure 16 As shown, there can be four oscillators 42; two oscillators 42 are located on opposite sides of the first capillary structure 21 along the length X of the shell 1; the other two oscillators 42 are located on opposite sides of the first capillary structure 21 along the width Y of the shell 1. There are also four bases 41; two bases 41 are located on opposite sides of the first capillary structure 21 along the length X of the shell 1; the other two bases 41 are located on opposite sides of the first capillary structure 21 along the width Y of the shell 1. The four oscillators 42 are connected to the four bases 41 in a one-to-one correspondence.

[0194] In other embodiments, such as Figure 17 As shown, Figure 17 for Figure 15Another FF cross-sectional view of the heat spreader 100 shown. The oscillator 42 is an annular structure surrounding the first capillary structure 21, and the base 41 is correspondingly configured as an annular structure. The second side 424 (i.e., the outer side) of the oscillator 42 is connected to the base 41. This configuration allows the working fluid 3 to diffuse more uniformly in the circumferential direction of the first capillary structure 21, thereby improving the heat dissipation performance of the heat spreader 100.

[0195] As for Figures 14-17 For details of the other structures of the heat dissipation module 400 shown, please refer to [reference needed]. Figures 3 to 10 The structure of the heat dissipation module 400 shown is configured as described above, and will not be elaborated further here.

[0196] Figure 18 This is a top view of the heat dissipation module 400 in the fifth embodiment of this application. Figure 19 for Figure 18 The left view of the heat dissipation module 400 shown. Figure 20 for Figure 18 The GG cross-sectional view of the heat dissipation module 400 shown is shown. Figure 21 for Figure 20 The HH cross-sectional view of the heat spreader 100 shown is shown. Figure 22 for Figure 20 Section II of the heat spreader 100 shown.

[0197] Figures 18-22 The heat dissipation module 400 shown is Figures 3 to 10 The main difference between the heat dissipation module 400 shown is that: (1) the composition of the heat dissipation module 400 is different. Figures 18-22 The heat dissipation module 400 shown is equipped with a heat dissipation fan 330 and a heat sink 320; (2) the outline shape of the heat dissipation plate 100 is different. Figures 18-22 The heat spreader 100 shown has a T-shaped outline, as described below:

[0198] like Figure 18 , Figure 19 and Figure 20 As shown, the heat dissipation module 400 includes a heat spreader 100, a heat source 200, a support substrate 310, a heat sink 320, and a cooling fan 330.

[0199] The heat spreader 100 includes a shell 1, a capillary structure 2, a working fluid 3, and a piezoelectric vibrator 4, with the capillary structure 2 and the working fluid 3 disposed inside the shell 1.

[0200] like Figure 18 , Figure 20 as well as Figure 21As shown, the shell 1 has an evaporation zone 1a, a condensation zone 1b, and a transport zone 1c located between the evaporation zone 1a and the condensation zone 1b. The capillary structure 2 includes a first capillary structure 21, which includes a first portion 211 located in the evaporation zone 1a, a second portion 212 located in the condensation zone 1b, and a third portion 213 located in the transport zone 1c. The shell 1 has a receiving space 11, which is connected to the first portion 211 and the second portion 212 respectively. At least the receiving space 11 and the capillary structure 2 form a circulation channel for the working fluid 3.

[0201] The housing 1 includes a first housing 15 and a second housing 16 connected to the edge of the first housing 15. The second housing 16 is connected to the first housing 15 and is located in the condensation zone 1b of the heat spreader 100. The first housing 15 is thermally connected to the heat source 200. The evaporation zone 1b is the orthographic projection of the heat source 200 onto the first housing 15. Both the first housing 15 and the second housing 16 are provided with a first capillary structure 21.

[0202] In some embodiments, such as Figure 20 and Figure 21 As shown, the shell wall of the housing 1 includes first shell walls 12 spaced apart along the thickness direction H of the housing 1 (e.g., ...). Figure 20 The top shell wall shown) and the second shell wall 13 (e.g. Figure 20 The shell bottom wall shown, and the shell side wall 14 connecting the first shell wall 12 and the second shell wall 13, the first shell wall 12, the second shell wall 13 and the shell side wall 14 form the shell cavity of the first shell 15 and the second shell 16.

[0203] In some embodiments, such as Figure 20 and Figure 22 As shown, a working fluid partition 5 is provided inside the first housing 15. The working fluid partition 5 has a first side and a second side, and the first capillary structure 21 is located on the first side of the working fluid partition 5 (e.g., Figure 20 As shown below), a portion of the accommodating space 11 is located on the second side of the working fluid partition 5 (e.g., the lower side). Figure 20 As shown in the upper part), another part of the accommodating space 11 is located in the second housing 16. The working fluid partition 5 is provided with a through hole 51, which is connected to the first part 211 (for example, the through hole 51 is set directly opposite the first part 211). An opening 6 is formed between the edge of the working fluid partition 5 and the shell wall of the housing 1 (for example, the first shell wall 12). The opening 6 is connected to the second part 212. The through hole 51 and the opening 6 allow the gaseous working fluid 3 to pass through.

[0204] like Figure 18 , Figure 19 as well as Figure 20As shown, the heat source 200, heat sink 320, and cooling fan 330 are all disposed on the carrier substrate 310, and the heat spreader 100 is disposed on the side of the heat source 200 away from the carrier substrate 310.

[0205] The second housing 16 of the heat spreader 100 has a placement space 340 between it and the support substrate 310. The air outlet of the cooling fan 330 is directly opposite to the placement space 340, and the heat sink 320 is disposed in the placement space 340.

[0206] The number of heat sinks 320 can be multiple, and the multiple heat sinks 320 are arranged along the extension direction X of the second housing 16. A heat dissipation channel is formed between two adjacent heat sinks 320, and the heat dissipation channel is located on the air outlet path of the cooling fan 330.

[0207] like Figure 18 and Figure 20 As shown, the carrier substrate 310 may include a first substrate 311 and a second substrate 312. The second substrate 312 is disposed on the first substrate 311, and the heat source 200 is disposed on the second substrate 312. The second substrate 312 may be a circuit board. The heat sink 320 and the cooling fan 330 are both disposed on the first substrate 311 and located around the second substrate 312.

[0208] When the heat dissipation module 400 is working, such as Figure 18 and Figure 20 As shown, when the heat source 200 generates heat and transfers it to the evaporation zone 1a, the liquid working fluid 3 in the first part 211 absorbs the heat, reaches its boiling point, and begins to boil and vaporize, changing from a liquid state to a gaseous state. The gaseous working fluid 3 then enters the containing space 11 from the first part 211. During this process, the working fluid 3 absorbs a large amount of heat, thereby carrying away the heat from the heat source 200.

[0209] When the gaseous working fluid 3 flows through the containment space 11 to the condensation zone 1b (i.e., the second shell 15), the gaseous working fluid 3 will liquefy upon cooling and return to a liquid state. During this process, the gaseous working fluid 3 releases the heat absorbed in the evaporation zone 1a. This heat is dissipated through the second shell 16 and the heat sink 320, and then carried away by the air blown out by the cooling fan 330. At the same time, the liquid working fluid 3 flows back to the first part 211 through the second part 212.

[0210] In this embodiment, the heat dissipation module 400 is equipped with a cooling fan 330 and a heat sink 320. In this way, the heat dissipated by the heat sink 320 in the condensation zone 1b (i.e. the second housing 16) of the heat dissipation plate 100 can be carried away by the air blown out by the cooling fan 330 in a timely manner, thereby improving the heat dissipation effect of the heat dissipation plate 100.

[0211] To further improve the heat dissipation effect of the heat spreader 100, in some embodiments, such as Figure 18 , Figure 19 as well as Figure 20 As shown, there are two second housings 16, which extend to opposite sides of the first housing 15. The first housing 15 and the two second housings 16 together form a T-shaped structure. Each second housing 16 is provided with a heat sink 320 in the placement space 340 between it and the support substrate 310.

[0212] There are two cooling fans 330, which are located on opposite sides of the heat source 200 of the first housing 15. The exhaust end of each cooling fan 330 is directly opposite the corresponding placement space 340.

[0213] By setting two corresponding second housings 16 and cooling fans 330, the area of ​​the condensation zone 1b of the heat spreader 200 is increased. This allows the gaseous working fluid 3 to quickly dissipate the heat absorbed in the evaporation zone 1a through the heat sink 320 in the condensation zone 1b. The dissipated heat is then carried away by the air blown out by the corresponding cooling fan 330, which further improves the heat dissipation effect of the heat spreader 100.

[0214] In some embodiments, the cooling fan 330 may be one of a centrifugal fan, an axial fan, or a cross-flow fan.

[0215] As for Figures 18-22 For details of the other structures of the heat dissipation module 400 shown, please refer to [reference needed]. Figures 3 to 10 The structure of the heat dissipation module 400 shown is configured as described above, and will not be elaborated further here.

[0216] The types of cross-sectional lines in the accompanying drawings are for distinguishing different components and should not be construed as limiting the materials of the components. The accompanying drawings are for illustrating structural composition and are not shown to scale of the actual product.

[0217] While the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of describing the application in conjunction with embodiments is to cover other options or modifications that may arise based on the claims of this application. To provide a thorough understanding of this application, many specific details are included in the above description. This application may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0218] In the embodiments of this application, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include one or more of that feature.

[0219] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0220] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "left," "right," "inner," and "outer," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. "Multiple" refers to at least two.

[0221] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0222] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat spreader, characterized in that, It includes a shell (1), a capillary structure (2), a working fluid (3), and a piezoelectric vibrator (4); The capillary structure (2) and the working fluid (3) are disposed in the shell (1). The shell (1) has an evaporation zone (1a) and a condensation zone (1b). The capillary structure (2) includes a first capillary structure (21). The first capillary structure (21) includes a first part (211) located in the evaporation zone (1a) and a second part (212) located in the condensation zone (1b). The housing (1) has a receiving space (11), which is connected to the first part (211) and the second part (212) respectively. At least the receiving space (11) and the capillary structure (2) form a circulation channel for the working fluid (3). The piezoelectric vibrator (4) includes a base (41) and a vibrator (42) connected to the base (41). The base (41) is mounted on the housing (1). The vibrator (42) is located in the accommodating space (11) and is used to drive the gaseous working fluid (3) in the accommodating space (11) to flow to the second part (212).

2. The heat spreader according to claim 1, characterized in that, The housing (1) is provided with a working fluid partition (5), the working fluid partition (5) has a first side and a second side opposite to each other, the first capillary structure (21) is located on the first side of the working fluid partition (5), and at least a portion of the accommodating space (11) is located on the second side of the working fluid partition (5). The working fluid partition (5) has a through hole (51) in the area corresponding to the first part (211). The through hole (51) is connected to the first part (211). An opening (6) is formed between the edge of the working fluid partition (5) and the shell wall of the housing (1). The opening (6) is connected to the second part (212). The through hole (51) and the opening (6) allow the gaseous working fluid (3) to pass through.

3. The heat spreader according to claim 2, characterized in that, The oscillator (42) includes a central region (421) facing the through hole (51) and a peripheral region (422) surrounding the central region (421). The central region (421) is connected to the base (41), and a first gap (71) is formed between the peripheral region (422) and the working fluid partition (5). The first gap (71) allows the gaseous working fluid (3) to pass through.

4. The heat spreader according to claim 3, characterized in that, The aperture d of the through hole (51) and the radial dimension L1 of the oscillator (42) in the through hole (51) satisfy the following: L1≤1.3d, and / or L1≥1.2d.

5. The heat spreader according to claim 3 or 4, characterized in that, The aperture d of the through hole (51) and the radial dimension L2 of the working fluid partition (5) in the through hole (51) satisfy the following: d≤0.3L2, and / or d≥0.2L2.

6. The heat spreader according to any one of claims 3 to 5, characterized in that, In the radial direction of the through hole (51), the dimensions L1 of the oscillator (42) and L3 of the evaporation zone (1a) satisfy: L1 > L3.

7. The heat spreader according to any one of claims 3 to 6, characterized in that, The shell wall of the housing (1) includes a first shell wall (12), the accommodating space (11) is at least partially located between the first shell wall (12) and the working fluid partition (5), and a second gap (72) is formed between the first shell wall (12) and the oscillator (42); The width w2 of the second gap (72) and the width w1 of the first gap (71) satisfy: w1 > w2; And / or, the width w2 of the second gap (72) satisfies: 0.05mm≤w2≤0.1mm.

8. The heat spreader according to any one of claims 2 to 7, characterized in that, The capillary structure (2) further includes a second capillary structure (22) located in the condensation zone (1b). The second capillary structure (22) is connected to the second part (212). The second capillary structure (22) extends toward the second side of the working fluid partition (5) and is connected to the opening (6) and the second part (212) respectively. A third gap (73) is formed between the edge of the working fluid partition (5) and the second capillary structure (22), allowing the gaseous working fluid (3) to pass through. The third gap (73) is connected to the second part (212).

9. The heat spreader according to claim 2, characterized in that, The accommodating space (11) includes a first space (111) and a second space (112). The first space (111) is located on the second side of the working fluid partition (5). The second space (112) is located on the periphery of the first capillary structure (21) and in the condensation zone (1b). The second space (112) is connected to the first space (111) through the opening (6). The second space (112) is connected to the second part (212). The oscillator (42) is located in the second space (112).

10. The heat spreader according to claim 9, characterized in that, The shell wall of the housing (1) includes a second shell wall (13), the first capillary structure (21) covers the second shell wall (13), the oscillator (42) has a first side (423) disposed near the first capillary structure (21) and a second side (424) disposed away from the first capillary structure (21), the second side (424) is connected to the base (41), the first side (423) is freely disposed, and a fourth gap (74) is formed between the first capillary structure (21) and the edge thereto, allowing the gaseous working fluid (3) to pass through, the fourth gap (74) is connected to the second part (212) and the opening (6) respectively.

11. The heat spreader according to claim 10, characterized in that, The edge of the first capillary structure (21) extends beyond the edge of the working fluid partition (5) so that the first space (111) communicates with the second portion (212) located at the edge of the first capillary structure (21).

12. The heat spreader according to claim 11, characterized in that, The width w4 of the fourth gap (74) and the distance w3 of the edge of the first capillary structure (21) beyond the edge of the working fluid partition (5) satisfy: w4 < w3.

13. The heat spreader according to claim 11 or 12, characterized in that, The distance h from the oscillator (42) to the second shell wall (13) and the distance w3 from the edge of the first capillary structure (21) beyond the edge of the working fluid partition (5) satisfy: w3 > h.

14. The heat spreader according to claim 13, characterized in that, The distance h from the oscillator (42) to the second shell wall (13) and the distance w3 from the edge of the first capillary structure (21) beyond the edge of the working fluid partition (5) satisfy: 1.5h≤w3≤4h.

15. The heat spreader according to any one of claims 10 to 14, characterized in that, The width w4 of the fourth gap (74) satisfies: 0.05mm≤w4≤0.2mm.

16. The heat spreader according to any one of claims 10 to 15, characterized in that, The surface of the oscillator (42) away from the second shell wall (13) is flush with the surface of the first capillary structure (21) away from the second shell wall (13).

17. The heat spreader according to any one of claims 9 to 16, characterized in that, The number of oscillators (42) is multiple, and the multiple oscillators (42) are arranged circumferentially along the first capillary structure (21); or, the oscillators (42) are annular structures surrounding the first capillary structure (21).

18. The heat spreader according to any one of claims 1 to 17, characterized in that, The capillary structure (2) is a three-dimensional porous structure with multiple cavities (20). Two adjacent cavities (20) are connected, and each cavity (20) is surrounded by a tiny curved surface.

19. The heat spreader according to any one of claims 1 to 18, characterized in that, The shell wall of the shell (1) includes a first shell wall (12) and a second shell wall (13) disposed opposite to each other, and a shell sidewall (14) connected between the first shell wall (12) and the second shell wall (13). The first shell wall (12) is provided with a mounting hole (121), which is connected to the accommodating space (11). The base (41) includes a seat body (411) and a stop (412) connected to the seat body (411). A portion of the seat body (411) is embedded in the mounting hole (121), and another portion of the seat body (411) is located in the receiving space (11) and connected to the vibrator (42). The stop (412) is located outside the housing (1) and stops at the edge of the mounting hole (121). Alternatively, the base (41) includes a seat (411) and a support (413), with a portion of the seat (411) embedded in the mounting hole (121), and another portion of the seat (411) located in the receiving space (11) and connected to the vibrator (42), and the support (413) supported between the vibrator (42) and the second shell wall (13).

20. The heat spreader according to any one of claims 1 to 18, characterized in that, The shell wall of the housing (1) includes a first shell wall (12) and a second shell wall (13) disposed opposite to each other, and a shell sidewall (14) connecting the first shell wall (12) and the second shell wall (13). The base (41) is disposed in the housing (1) and supported between the first shell wall (12) and the second shell wall (13).

21. A heat dissipation module, characterized in that, It includes a heat source (200) and a heat spreader (100) according to any one of claims 1 to 20, wherein the shell (1) of the heat spreader (100) is thermally connected to the heat source (200), and the evaporation zone (1a) of the heat spreader (100) is the orthographic projection of the heat source (200) onto the shell (1) of the heat spreader (100).

22. The heat dissipation module according to claim 21, characterized in that, The heat dissipation module further includes a carrier substrate (310), a heat sink (320), and a cooling fan (330); the heat source (200), the heat sink (320), and the cooling fan (330) are all disposed on the carrier substrate (310), and the heat spreader (100) is disposed on the side of the heat source (200) away from the carrier substrate (310); The housing (1) includes a first housing (15) and a second housing (16) connected to the edge of the first housing (15). The second housing (16) is located in the condensation zone (1b) of the heat spreader (100) and is connected to the first housing (15). The first housing (15) is thermally connected to the heat source (200). The first housing (15) and the second housing (16) are both provided with the first capillary structure (21). There is a placement space (340) between the second housing (16) and the support substrate (310). The air outlet of the cooling fan (330) is directly opposite to the placement space (340). The heat sink (320) is disposed in the placement space (340).

23. The heat dissipation module according to claim 22, characterized in that, There are two second housings (16), and the two second housings (16) extend to opposite sides of the first housing (15). The first housing (15) and the two second housings (16) together form a T-shaped structure. The heat sink (320) is provided in the placement space (340) between each second housing (16) and the support substrate (310). There are two cooling fans (330), which are located on opposite sides of the heat source (200) of the first housing (15), and the air outlet of each cooling fan (330) is directly opposite the corresponding placement space (340).

24. An electronic device, characterized in that, It includes a device housing (500) and a heat dissipation module (400) according to any one of claims 21 to 23, wherein the heat dissipation module (400) is disposed in the device housing (500).

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