Foldable vapor chamber and electronic device

Abstract

The present disclosure relates to a foldable vapor chamber and an electronic device, wherein the foldable vapor chamber comprises a first vapor chamber and a second vapor chamber, the first vapor chamber is used to be connected with a heat generating element; the second vapor chamber comprises a first vapor area, a second vapor area and a bending area connecting the first vapor area and the second vapor area, and the first vapor area is connected with the first vapor chamber. In this way, the assembly of the foldable vapor chamber is more flexible, and the connection position of the first vapor area connected with the first vapor chamber can be changed according to the needs, so as to reduce the occupation of the foldable vapor chamber to the internal space of the electronic device, thereby making the structure of the electronic device more compact, and being beneficial to the miniaturization design of the electronic device.

Description

Technical Field

[0001] This disclosure relates to the field of electronic devices, and more particularly to a foldable heat spreader and electronic device. Background Technology

[0002] With the continuous development of technology, foldable electronic devices are becoming increasingly popular, and vapor chambers used to dissipate heat from internal heat-generating components in these devices have also evolved into foldable forms. However, current electronic devices using foldable vapor chambers suffer from inflexible assembly and the vapor chambers occupying a significant amount of internal space. Summary of the Invention

[0003] To overcome the problems existing in the related technologies, this disclosure provides a foldable heat spreader and an electronic device.

[0004] According to a first aspect of this disclosure, a foldable heat spreader is provided, the foldable heat spreader comprising: a first heat spreader for connection to a heating element; and a second heat spreader including a first heat spreader area, a second heat spreader area, and a bending area connecting the first heat spreader area and the second heat spreader area, wherein the first heat spreader area is connected to the first heat spreader.

[0005] In some embodiments of this disclosure, the first heat spreader includes a first surface and a second surface that are opposite to each other, the first surface being connected to the heating element, and the second surface being connected to the first heat spreader area.

[0006] In some embodiments of this disclosure, the first heat spreader has a recessed portion that is recessed from the second surface toward the first surface, the first surface located in the recessed portion is used to connect with the heating element, and the first heat spreader extends into the recessed portion.

[0007] In some embodiments of this disclosure, a groove is provided on the first surface corresponding to the position of the first temperature uniform zone, the groove is connected to the recessed portion, and a portion of the first temperature uniform zone is embedded in the groove.

[0008] In some embodiments of this disclosure, the first heat exchange plate includes a first upper cover plate and a first lower cover plate, and a first sealed cavity is formed between the first upper cover plate and the first lower cover plate. A first capillary structure and a first heat exchange medium are disposed in the first sealed cavity.

[0009] In some embodiments of this disclosure, the first temperature distribution plate further includes: a plurality of first support structures disposed separately in the first sealed cavity, one end of the first support structure being connected to the first upper cover plate, and the other end of the first support structure extending toward the first capillary structure.

[0010] In some embodiments of this disclosure, the first support structure and the first upper cover plate are integrally formed.

[0011] In some embodiments of this disclosure, the first support structure is formed by stamping or etching the first upper cover plate; and / or, the height of the first support structure is 0.08 mm to 0.5 mm; and / or, the thickness of the first capillary structure is 0.04 mm to 0.2 mm; and / or, the thickness of both the first upper cover plate and the first lower cover plate is 0.02 mm to 0.2 mm.

[0012] In some embodiments of this disclosure, the first support structure includes one of a columnar structure, a frustum-shaped structure, and a hemispherical structure; and / or, the first heat spreader further includes a second support structure disposed at a position corresponding to the sidewall of the recess, the second support structure being an elongated strip extending along the sidewall of the recess.

[0013] In some embodiments of this disclosure, the second heat exchange plate includes a second upper cover plate and a second lower cover plate, and a second sealed cavity is formed between the second upper cover plate and the second lower cover plate. A second capillary structure and a second heat exchange medium are disposed in the second sealed cavity.

[0014] In some embodiments of this disclosure, both the second upper cover plate and the second lower cover plate include a first metal layer, a second metal layer, and a flexible layer stacked together, wherein the flexible layer is located between the first metal layer and the second metal layer.

[0015] In some embodiments of this disclosure, the second metal layer is closer to the second sealing cavity than the first metal layer, and a first hollow structure is provided on the first metal layer corresponding to the bending area.

[0016] In some embodiments of this disclosure, the first metal layer and the second metal layer are metal foils; and / or, the thickness of the first metal layer and the second metal layer is 5 μm to 30 μm; and / or, the thickness of the flexible layer is 10 μm to 50 μm; and / or, the thickness of the second capillary structure is 0.04 mm to 0.2 mm.

[0017] In some embodiments of this disclosure, the second temperature distribution plate further includes: a plurality of third support structures, which are dispersedly disposed in the second sealed cavity located in the first temperature distribution zone and the second temperature distribution zone, and one end of the third support structure is connected to the second upper cover plate, and the other end of the third support structure extends toward the second capillary structure.

[0018] In some embodiments of this disclosure, the second upper cover plate and the second lower cover plate located in the bending area are both wavy.

[0019] In some embodiments of this disclosure, the second heat spreader further includes a third capillary structure disposed in a second sealed cavity located in the bending region portion, the third capillary structure being disposed opposite to the second capillary structure.

[0020] In some embodiments of this disclosure, the third capillary structure is provided with a plurality of second hollow structures, and the plurality of second hollow structures penetrate the second capillary structure, and the extending direction of the plurality of second hollow structures is parallel to the extending direction of the bending area.

[0021] In some embodiments of this disclosure, the second temperature distribution plate further includes a redundant portion disposed between the first temperature distribution zone and the bending zone, and between the second temperature distribution zone and the bending zone.

[0022] According to a second aspect of this disclosure, an electronic device is provided, the electronic device comprising: a foldable heat spreader as described in the first aspect; a foldable assembly, the foldable assembly including a hinge assembly and a first folding portion and a second folding portion connected to the hinge assembly, the first folding portion and the second folding portion being movable relative to the hinge assembly to fold and unfold relative to each other, a heating element being disposed on the first folding portion, the foldable heat spreader being disposed on the front side of the hinge assembly, and a first heat spreader of the foldable heat spreader being disposed on the first folding portion and connected to the heating element, a second heat spreader area of ​​the second heat spreader of the foldable heat spreader being disposed on the second folding portion, and a bending area of ​​the second heat spreader being opposite to the hinge assembly.

[0023] In some embodiments of this disclosure, the heating element is disposed on the back of the first folded portion, and the middle frame is provided with a third hollow structure corresponding to the recessed portion of the first heat spreader. The recessed portion is located within the third hollow structure, and the recessed portion is connected to the heating element through an adhesive layer.

[0024] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0025] The foldable heat spreader disclosed herein comprises two parts: a first heat spreader and a second heat spreader. The first heat spreader is used to connect to a heating element. The second heat spreader includes a first heat spreader area, a second heat spreader area, and a bending area connecting the first and second heat spreader areas. The first heat spreader area is connected to the first heat spreader, and the heat generated by the heating element can be conducted to the second heat spreader area through the second heat spreader, thereby improving the heat distribution effect. This design makes the assembly of the foldable heat spreader more flexible, and the connection position between the first heat spreader area and the first heat spreader can be changed according to requirements to reduce the space occupied by the foldable heat spreader inside the electronic device, thereby making the structure of the electronic device more compact and facilitating the miniaturization design of the electronic device.

[0026] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0027] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0028] Figure 1 This is a schematic diagram of the structure of an electronic device according to an exemplary embodiment;

[0029] Figure 2 yes Figure 1 Sectional view along the middle AA direction;

[0030] Figure 3 yes Figure 2 A magnified view of a section at point B in the middle;

[0031] Figure 4 yes Figure 2 A magnified view of a section at point C;

[0032] Figure 5 This is a schematic diagram of the structure of a first heat spreader according to an exemplary embodiment;

[0033] Figure 6 This is a schematic diagram of the structure of a first heat spreader according to another exemplary embodiment;

[0034] Figure 7 This is a cross-sectional schematic diagram of a first heat exchanger plate according to an exemplary embodiment;

[0035] Figure 8 This is a schematic diagram of the structure of a second heat exchanger according to an exemplary embodiment;

[0036] Figure 9 This is an exploded schematic diagram of a second heat spreader according to an exemplary embodiment;

[0037] Figure 10 This is a schematic diagram of the structure of the second upper cover and the second lower cover according to an exemplary embodiment;

[0038] Figure 11 This is a schematic diagram of the structure of the first and second uniform temperature zones of the second uniform temperature plate according to an exemplary embodiment.

[0039] Figure 12 This is a schematic diagram of the structure of the bent area portion of the second heat exchanger according to an exemplary embodiment;

[0040] Figure 13This is a schematic diagram of the weaving pattern of a second capillary structure according to an exemplary embodiment.

[0041] In the picture:

[0042] 10-Foldable heat spreader; 11-First heat spreader; 111-Recess; 112-Groove; 113-First surface; 114-Second surface; 115-First upper cover; 116-First lower cover; 117-First capillary structure; 118-First support structure; 119-Second support structure; 12-Second heat spreader; 1201-First heat spreader zone; 1202-Second heat spreader zone; 1203-Bending zone; 121-Second upper cover; 122-Second lower cover; 123-Second capillary structure; 124-Third capillary structure; 125-First metal layer; 1251-First hollow structure; 126-Second metal layer; 127-Flexible layer; 128-Second hollow structure; 129-Third support structure; 13-Redundant part; 20-Electronic device; 21-First folding part; 211-Third hollow structure; 22-Second folding part; 23-Hinge assembly; 24-Heat insulation layer; 25-Heating element; 26-Adhesive layer; 3-Metal wire. Detailed Implementation

[0043] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0044] With the continuous development of technology, foldable electronic devices are becoming increasingly popular, and vapor chambers used to dissipate heat from internal heat-generating components have also evolved into foldable forms. However, current electronic devices using foldable vapor chambers suffer from inflexible assembly and significant space occupation within the device's internal space. For example, the foldable vapor chamber in related technologies is a single, integral structure. Therefore, when assembling it into an electronic device, a continuous and relatively large installation space is required, making it difficult to adjust the vapor chamber's position. This results in reduced installation space for other components, hindering the miniaturization design of the electronic device.

[0045] To address the aforementioned technical issues, this disclosure provides a foldable heat spreader, comprising a first heat spreader and a second heat spreader. The first heat spreader is connected to a heating element, and the second heat spreader includes a first heat spreader area, a second heat spreader area, and a bending area connecting the first and second heat spreader areas. The first heat spreader area is connected to the first heat spreader, and the heat generated by the heating element can be conducted to the second heat spreader area through the second heat spreader, thereby improving the heat spreader's uniformity. This design allows for more flexible assembly of the foldable heat spreader, enabling the connection position of the first heat spreader area to the first heat spreader to be changed as needed, thereby reducing the space occupied by the foldable heat spreader within the electronic device and making the electronic device more compact, which is beneficial for miniaturization design.

[0046] An exemplary embodiment of this disclosure provides a foldable heat spreader, such as Figures 1 to 3 As shown, the foldable heat spreader 10 includes a first heat spreader 11 and a second heat spreader 12. The first heat spreader 11 is used to connect with the heating element 25. For example, the heating element 25 may be a motherboard, chip, battery, etc. inside the electronic device 20. The heating element 25 and the first heat spreader 11 can be connected by thermally conductive gel, for example, to reduce contact thermal resistance and thus improve heat transfer efficiency; or the connection between the first heat spreader 11 and the heating element 25 can be achieved indirectly through structural components such as a mid-frame. The second heat spreader 12 includes a first heat spreader area 1201, a second heat spreader area 1202, and a bending area 1203 connecting the first heat spreader area 1201 and the second heat spreader area 1202. The first heat spreader area 1201 is connected to the first heat spreader 11, for example, by bonding with thermally conductive gel, thermally conductive double-sided adhesive, etc., or by welding, etc.

[0047] Exemplarily, the electronic device 20 includes a hinge assembly 23 and two folding portions connected to the hinge assembly 23, the two folding portions being foldable and unfoldable relative to the hinge assembly 23. A first heat spreader 11 is disposed within one of the two folding portions, for example, within the folding portion containing the motherboard. A second heat spreader 12 with a second heat spreader 12 having a second heat spreader area 1202 disposed within the other of the two folding portions to contact another heating element 25, such as a small board in the electronic device 20. A bending area 1203 of the second heat spreader 12 is disposed at the hinge assembly 23, so that the bending area 1203 can rotate with the hinge assembly 23, thereby achieving the bending performance of the foldable heat spreader 10. In this way, heat can be conducted sequentially along the first heat spreader 11, the first heat spreader zone 1201, the bending zone 1203, and the second heat spreader zone 1202, forming a heat flow path that can cross both sides of the hinge assembly 23, thereby effectively improving the heat spreader effect of the foldable heat spreader 10 and enhancing the heat spreader effect and heat dissipation effect of the electronic device 20.

[0048] This configuration allows for greater flexibility in assembling the foldable heat spreader 10. The connection position between the first heat spreader zone 1201 and the first heat spreader 11 can be adjusted as needed, reducing the space occupied by the foldable heat spreader 10 within the electronic device 20. This results in a more compact structure for the electronic device 20, facilitating miniaturization. Furthermore, even if repeated folding causes the bending area 1203 of the second heat spreader 12 to fail, the first heat spreader 11 can still maintain the temperature of the heating element 25, ensuring the electronic device 20 retains some heat dissipation capacity. This enhances the reliability of the electronic device 20 and improves the user experience.

[0049] In this embodiment, the first heat exchange plate 11 is not bendable and has a certain rigidity to improve the reliability of the foldable heat exchange plate 10.

[0050] Combination Figure 3 In one embodiment, the first heat spreader 11 includes a first surface 113 and a second surface 114 that are opposite to each other. The first surface 113 is used to connect with the heating element 25, and the second surface 114 is connected with the first heat spreader area 1201. Thus, by reasonably arranging the connection positions of the heating element 25 and the first heat spreader area 1201 on the first heat spreader 11, sufficient contact area is ensured between the heating element 25 and the first heat spreader 11, and between the first heat spreader area 1201 and the first heat spreader 11, without increasing the area of ​​the first heat spreader 11. This effectively improves the stability of the connection between the heating element 25 and the first heat spreader 11, and between the first heat spreader area 1201 and the first heat spreader 11, further enhancing the reliability of the electronic device 20.

[0051] Combination Figure 3 , Figure 5 and Figure 6 In one embodiment, the first heat spreader 11 has a recessed portion 111, which is recessed from the second surface 114 toward the first surface 113. The first surface 113 located in the recessed portion 111 is used to connect with the heating element 25. This design reduces the distance between the first heat spreader 11 and the heating element 25, facilitating their connection, and also makes the structure of the electronic device 20 more compact, thus contributing to the thinning design of the electronic device 20. The first heat spreader area 1201 extends into the recessed portion 111 and is fitted to the second surface 114 of the first heat spreader 11. This allows the first heat spreader area 1201 to be closer to the heat source, thereby improving the heat spreader efficiency. Furthermore, it increases the connection area between the first heat spreader area 1201 and the first heat spreader 11, further improving the reliability of the foldable heat spreader 10.

[0052] Combination Figure 1 and Figure 5 In one embodiment, a groove 112 is provided on the first surface 113 corresponding to the position of the first temperature equalization zone 1201. The groove 112 is connected to the recessed portion 111, and the portion of the first temperature equalization zone 1201 that contacts the first temperature equalization plate 11 is embedded in the groove 112. With this arrangement, the overall thickness of the foldable temperature equalization plate 10 can be reduced, further reducing the space occupied inside the electronic device 20.

[0053] Combination Figure 7 In one embodiment, the first heat spreader 11 includes a first upper cover plate 115 and a first lower cover plate 116, forming a first sealed cavity between the first upper cover plate 115 and the first lower cover plate 116. A first capillary structure 117 is disposed within the first sealed cavity. After evacuating the first sealed cavity, a certain amount of a first heat exchange medium, such as water, is injected. The first heat exchange medium can be adsorbed within the first capillary structure 117. When heat is conducted to the first upper cover plate 115 and / or the first lower cover plate 116, the first heat exchange medium within the first capillary structure 117 absorbs heat and begins to evaporate and boil in a low-vacuum environment, changing from a liquid phase to a gas phase. The gaseous first heat exchange medium fills the entire first sealed cavity. When the gaseous first heat exchange medium comes into contact with a relatively cold area, it condenses into a liquid first heat exchange medium and returns to the heat source under the adsorption of the first capillary structure 117. In this way, heat dissipation is achieved for the heat generated by the heating element 25. This configuration simplifies the structure of the first heat spreader 11, making it easy to manufacture and process. Its excellent thermal conductivity and temperature uniformity effectively improve the heat dissipation of the electronic device 20. Furthermore, the temperature uniformity process is noise-free and does not increase the power consumption of the electronic device 20.

[0054] For example, the first capillary structure 117 may be any one or a combination of several of the following: metal mesh, etched grooves, printed capillaries, foamed metal, and sintered metal powder.

[0055] For example, the material of the first upper cover plate 115 and / or the first lower cover plate 116 can be any one of copper, aluminum, stainless steel, titanium alloy, copper-aluminum composite plate, or copper-steel composite plate.

[0056] Combination Figure 7In one embodiment, the first heat exchanger 11 further includes a plurality of first support structures 118, which are dispersedly disposed within the first sealed cavity. One end of each first support structure 118 is connected to the first upper cover plate 115, and the other end extends toward the first capillary structure 117. This improves the tightness of the fit between the first capillary structure 117 and the first lower cover plate 116. On the one hand, this ensures sufficient space within the first sealed cavity for the flow of the gaseous first heat exchange medium. On the other hand, it effectively prevents the first capillary structure 117 from shifting or shaking within the first sealed cavity, thereby avoiding noise and further improving the reliability of the foldable heat exchanger 10.

[0057] In one embodiment, the first support structure 118 and the first upper cover plate 115 are integrally formed. This facilitates the processing of the first heat spreader 11, improves the production efficiency of the first heat spreader 11, and enhances the connection strength between the first support structure 118 and the first upper cover plate 115, thereby further improving the reliability of the foldable heat spreader 10.

[0058] In one embodiment, the first support structure 118 is formed by stamping or etching a first upper cover plate 115. This simplifies the processing of the first support structure 118.

[0059] In one embodiment, the height of the first support structure 118 is 0.08 mm to 0.5 mm. The thickness of the first capillary structure 117 is 0.04 mm to 0.2 mm. The thickness of the first upper cover plate 115 and the first lower cover plate 116 is 0.02 mm to 0.2 mm. This design ensures the structural strength and temperature uniformity of the first heat spreader 11 while reducing the increase in the thickness of the first heat spreader 11, thereby facilitating the thinning design of the electronic device 20.

[0060] In one embodiment, the first support structure 118 includes one of a columnar structure, a frustum-shaped structure, and a hemispherical structure. This avoids damage to the first capillary structure 117 by the first support structure 118, thereby further improving the reliability of the foldable heat spreader 10.

[0061] Combination Figure 7In another embodiment, the first heat spreader 11 further includes a second support structure 119 disposed at a position corresponding to the sidewall of the recess 111. The second support structure 119 is an elongated strip extending along the sidewall of the recess 111. For example, the elongated second support structure 119 may wrap around the sidewall of the recess 111, or multiple elongated second support structures 119 may be disposed at intervals along the sidewall of the recess 111. In this way, the tightness of the fit between the first capillary structure 117 at the sidewall of the recess 111 and the first lower cover plate 116 is improved, which facilitates the processing of the recess 111 and can improve the structural strength of the recess 111 area, thereby further improving the reliability of the foldable heat spreader 10.

[0062] Combination Figure 8 and Figure 9 In one embodiment, the second heat exchange plate 12 includes a second upper cover plate 121 and a second lower cover plate 122, forming a second sealed cavity between the second upper cover plate 121 and the second lower cover plate 122. A second capillary structure 123 is disposed within the second sealed cavity. After evacuating the second sealed cavity, a certain amount of a second heat exchange medium, such as water, is injected. The second heat exchange medium can be adsorbed within the second capillary structure 123. When heat is conducted to the second upper cover plate 121 and / or the second lower cover plate 122, the second heat exchange medium within the second capillary structure 123 absorbs heat and begins to evaporate and boil in a low-vacuum environment, changing from a liquid phase to a gas phase. The gaseous second heat exchange medium fills the entire second sealed cavity. When the gaseous second heat exchange medium comes into contact with a relatively cold area, it condenses into a liquid phase and returns to the heat source under the adsorption of the second capillary structure 123. This achieves heat dissipation. This configuration makes the structure of the second heat spreader 12 easy to manufacture and process, and its excellent thermal conductivity and temperature uniformity effectively improve the heat dissipation of the electronic device 20. Furthermore, the temperature uniformity process is noise-free and does not increase the power consumption of the electronic device 20.

[0063] For example, the second capillary structure 123 can be any one or a combination of several of the following: metal mesh, etched grooves, printed capillaries, foamed metal, and sintered metal powder. For example, Figure 13 As shown, when a metal mesh is used as the second capillary structure 123, the metal wires 3 are woven in a twill weave, that is, when the second heat spreader 12 is installed inside the electronic device 20, the length direction of the metal wires 3 and the hinge assembly 23 of the electronic device 20 (e.g., ...) Figure 13 The direction L shown in the figure is at a preset angle, such as 45°, which can improve the bending resistance of the second capillary structure 123, thereby further improving the reliability of the second heat spreader 12.

[0064] Combination Figure 10 In one embodiment, both the second upper cover plate 121 and the second lower cover plate 122 include a first metal layer 125, a second metal layer 126, and a flexible layer 127 stacked together, with the flexible layer 127 located between the first metal layer 125 and the second metal layer 126. By using the second upper cover plate 121 and the second lower cover plate 122 as composite materials, the bending resistance and ductility of the second upper cover plate 121 and the second lower cover plate 122 can be effectively improved. This facilitates bending along with the electronic device 20 while avoiding the influence of the second heat spreader 12 on the folding of the electronic device 20, thus improving the folding effect of the electronic device 20.

[0065] For example, the flexible layer 127 may be either a polyimide (PI) film or a polyethylene terephthalate (PET) film.

[0066] Combination Figure 10 In one embodiment, the second metal layer 126 is closer to the second sealing cavity than the first metal layer 125. Corresponding to the bending area 1203, the first metal layer 125 has a first perforated structure 1251. Exemplarily, the first perforated structure 1251 can be formed by etching the first metal layer 125. By removing the outermost first metal layer 125 of the second upper cover plate 121 and the second lower cover plate 122 located in the bending area 1203, the bending resistance and ductility of the bending area 1203 can be further improved, thereby further enhancing the folding effect and the reliability of the second heat spreader 12.

[0067] In one embodiment, the first metal layer 125 and the second metal layer 126 are metal foils. Exemplarily, the metal foil is, for example, copper foil, which can be, for example, rolled copper foil, electrolytic copper foil, or high-ductility electrolytic copper foil. Thus, while improving the bending resistance and ductility of the second upper cover plate 121 and the second lower cover plate 122, the structural strength of the second upper cover plate 121 and the second lower cover plate 122 is ensured, thereby improving the reliability of the second heat spreader 12.

[0068] In one embodiment, the thickness of the first metal layer 125 and the second metal layer 126 is 5 μm to 30 μm. The thickness of the flexible layer 127 is 10 μm to 50 μm. The thickness of the second capillary structure 123 is 0.04 mm to 0.2 mm. This design, while ensuring the structural strength and temperature uniformity of the second heat spreader 12, reduces the increase in the thickness of the second heat spreader 12, thereby facilitating the thinning design of the electronic device 20.

[0069] Combination Figure 8 and Figure 11In one embodiment, the second heat exchange plate 12 further includes a plurality of third support structures 129, which are dispersedly disposed within the second sealed cavity located in the first heat exchange zone 1201 and the second heat exchange zone 1202. One end of each third support structure 129 is connected to the second upper cover plate 121, and the other end extends toward the second capillary structure 123. This design improves the tightness of the fit between the second capillary structure 123 and the second lower cover plate 122 in the first heat exchange zone 1201 and the second heat exchange zone 1202. On the one hand, it provides sufficient space within the second sealed cavity for the flow of the gaseous second heat exchange medium. On the other hand, it effectively prevents the second capillary structure 123 from shifting or shaking within the second sealed cavity, thereby avoiding noise and further improving the reliability of the foldable heat exchange plate 10.

[0070] In one embodiment, the plurality of third support structures 129 are integrally formed with the second upper cover plate 121 and are formed by stamping the second upper cover plate 121. Exemplarily, the height of the third support structure 129 is 0.08 mm to 0.5 mm. This simplifies the processing of the third support structure 129, improves the production efficiency of the second heat exchanger plate 12, and enhances the connection strength between the third support structure 129 and the second upper cover plate 121, thereby further improving the reliability of the foldable heat exchanger plate 10.

[0071] Combination Figure 8 and Figure 12 In one embodiment, the second upper cover plate 121 and the second lower cover plate 122 located in the bending area 1203 are both wavy. With this arrangement, when the bending area 1203 is bent, the wavy second upper cover plate 121 and the second lower cover plate 122 can be stretched or compressed, reducing the bending stress of the second upper cover plate 121 and the second lower cover plate 122, thereby further improving the bending resistance of the bending area 1203.

[0072] Combination Figure 9 and Figure 12In one embodiment, the second heat spreader 12 further includes a third capillary structure 124 disposed within the second sealed cavity located in the bending region 1203, the third capillary structure 124 being disposed opposite to the second capillary structure 123. This design, on the one hand, improves the heat distribution performance of the second heat exchange medium in the liquid phase by adding a third capillary structure 124 to the bending region 1203, since the second upper cover plate 121 and the second lower cover plate 122 in the bending region 1203 are wavy. On the other hand, the addition of the third capillary structure 124 increases the thickness of the bending region 1203, providing support for the second sealed cavity in the bending region 1203, thereby improving the bending resistance of the bending region 1203 and further enhancing the reliability of the second heat spreader 12.

[0073] For example, the third capillary structure 124 can be any one or a combination of several of the following: metal mesh, etched grooves, printed capillaries, foamed metal, and sintered metal powder. The thickness of the third capillary structure 124 is 0.04 mm to 0.2 mm.

[0074] Combination Figure 9 In one embodiment, the third capillary structure 124 is provided with a plurality of second perforated structures 128, and the plurality of second perforated structures 128 penetrate the second capillary structure 123. The extending direction of the plurality of second perforated structures 128 is parallel to the extending direction of the bending region 1203. With this arrangement, the cavity volume in the second sealed cavity of the bending region 1203 can be increased. The gaseous second heat exchange medium can flow through the second perforated structures 128, and the liquid second heat exchange medium can flow through the second capillary structure 123. This can effectively increase the flow rate of the second heat exchange medium in the second sealed cavity of the bending region 1203, and further improve the temperature uniformity of the second heat exchange plate 12.

[0075] Combination Figure 4 and Figure 8 In one embodiment, since the second heat spreader 12 requires a certain amount of expansion and contraction during folding and unfolding, the second heat spreader 12 further includes a redundant portion 13 disposed between the first heat spreader 1201 and the bending area 1203, and between the second heat spreader 1202 and the bending area 1203, so as to reserve the redundant length required for folding and unfolding the second heat spreader 12 in advance, thereby improving the folding effect of the second heat spreader 12 while avoiding affecting the folding of the electronic device 20, thereby further ensuring the folding effect of the electronic device 20.

[0076] Combination Figure 1 and Figure 3In one embodiment, the foldable heat spreader 10 further includes a heat insulation layer 24, which is disposed on the first heat spreader 11 in the area opposite to the heating element 25. The first heat spreader area 1201 is located between the heat insulation layer 24 and the first heat spreader 11. By providing the heat insulation layer 24, heat from the heating element 25 is prevented from being conducted to the screen module of the electronic device 20, thus avoiding local hot spots on the screen module and improving the performance of the screen module. Exemplarily, the heat insulation layer 24 can be any one of boron nitride, aerogel, or foam.

[0077] In one embodiment, the foldable heat exchange plate 10 may be manufactured using the following processing steps. Since the processing steps for the first heat exchange plate 11 and the second heat exchange plate 12 are the same, they are described together here. The first upper cover plate 115 and the second upper cover plate 121 are collectively referred to as the upper cover plate, the first lower cover plate 116 and the second lower cover plate 122 are collectively referred to as the lower cover plate, the first capillary structure 117 and the second capillary structure 123 are collectively referred to as the capillary structure, and the first heat exchange medium and the second heat exchange medium are collectively referred to as the heat exchange medium.

[0078] The upper cover plate and the lower cover plate are cut and the supporting structure is stamped out to obtain the upper cover plate and the lower cover plate.

[0079] To prepare a capillary structure, taking a metal wire mesh as an example, the metal wire mesh is first cut into a preset size, and the wires of the metal wire mesh are pre-fixed by welding, bonding and other methods.

[0080] The upper and lower cover plates are cleaned to improve the connection strength of subsequent welding.

[0081] The capillary structure is assembled with the upper and lower cover plates and then edge-sealed. Since the upper and lower cover plates of the second heat spreader 12 are three-layer composite materials, the internal flexible layer 127 cannot withstand high temperatures. Therefore, during the welding process, a low-temperature diffusion method is used for sealing, with a welding temperature of less than 320°C. The low-temperature diffusion method is, for example, diffusion welding or ultrasonic welding.

[0082] The capillary structure is subjected to oxidation-reduction treatment to enhance its liquid absorption capacity, thereby improving the temperature uniformity of the foldable heat spreader 10.

[0083] A liquid injection port is usually formed between the upper and lower cover plates. A liquid injection pipe is inserted into the liquid injection port and the liquid injection pipe at the liquid injection port is sealed and fixed, for example by adhesive bonding. Then, liquid injection, that is, the injection of heat exchange medium, is carried out.

[0084] The sealed cavity between the upper and lower cover plates is evacuated.

[0085] Seal the injection port, for example, by ultrasonic welding.

[0086] Remove at least part of the injection port to avoid the injection port being too long and affecting the aesthetics.

[0087] The outermost metal layer of the upper and lower cover plates in the bending area 1203 is removed by etching to form the first hollow structure 1251. This forms the first heat spreader 11 and the second heat spreader 12.

[0088] The first heat exchange plate 11 and the second heat exchange plate 12 were subjected to performance testing and appearance inspection respectively.

[0089] Assemble the first heat exchanger plate 11 and the second heat exchanger plate 12 to obtain the foldable heat exchanger plate 10.

[0090] An exemplary embodiment of this disclosure provides an electronic device, which, exemplarily, may be a foldable electronic device such as a mobile phone or a computer.

[0091] like Figures 1 to 4 As shown, the electronic device 20 includes a foldable component and a foldable heat spreader 10 as described above. The foldable heat spreader 10 includes a first heat spreader 11 and a second heat spreader 12. The second heat spreader 12 includes a first heat spreader area 1201, a second heat spreader area 1202, and a bending area 1203 connecting the first heat spreader area 1201 and the second heat spreader area 1202. The first heat spreader area 1201 is connected to the first heat spreader 11.

[0092] The foldable assembly includes a hinge assembly 23 and a first folding portion 21 and a second folding portion 22 connected to the hinge assembly 23. The first folding portion 21 and the second folding portion 22 are movable relative to the hinge assembly 23 to fold and unfold relative to each other. Exemplarily, the first folding portion 21 and the second folding portion 22 may be composed of a first middle frame and a second middle frame, respectively. A foldable screen is provided on the front side of the hinge assembly 23. A heating element 25 is provided on the first folding portion 21. Exemplarily, the heating element 25 may be, for example, a motherboard, a chip, a battery, or other components. A foldable heat spreader 10 is provided on the front side of the hinge assembly 23 to avoid interference between the foldable heat spreader 10 and the hinge assembly 23, thereby effectively ensuring the folding effect of the electronic device 20.

[0093] The first heat-dissipating plate 11 of the foldable heat-dissipating plate 10 is disposed on the first folding portion 21 and connected to the heating element 25. The second heat-dissipating zone 1202 of the second heat-dissipating plate 12 is disposed on the second folding portion 22, and the bending zone 1203 of the second heat-dissipating plate 12 is opposite to the hinge assembly 23. The two redundant portions 13 of the second heat-dissipating plate 12 are respectively located in the gap between the first folding portion 21 and the hinge assembly 23 and the gap between the second folding portion 22 and the hinge assembly 23.

[0094] In this way, the foldable heat spreader 10 rotates along with the hinge assembly 23 via the bending area 1203, thereby achieving the bending performance of the foldable heat spreader 10. The heat from the heating element 25 can be conducted sequentially along the first heat spreader 11, the first heat spreader 1201, the bending area 1203, and the second heat spreader 1202, thereby effectively improving the temperature uniformity of the foldable heat spreader 10 and enhancing the heat dissipation and heat dissipation effects of the electronic device 20.

[0095] This configuration allows for greater flexibility in assembling the foldable heat spreader 10. The connection position between the first heat spreader zone 1201 and the first heat spreader 11 can be adjusted as needed, reducing the space occupied by the foldable heat spreader 10 within the electronic device 20. This results in a more compact structure for the electronic device 20, facilitating miniaturization. Furthermore, even if repeated folding causes the bending area 1203 of the second heat spreader 12 to fail, the first heat spreader 11 can still maintain the temperature of the heating element 25, ensuring the electronic device 20 retains some heat dissipation capacity. This enhances the reliability of the electronic device 20 and improves the user experience.

[0096] Combination Figure 3 In one embodiment, the heating element 25 is disposed on the back side of the first folded portion 21. A third hollow structure 211 is provided in the middle frame corresponding to the recess 111 of the first heat spreader 11. The recess 111 is located within the third hollow structure 211, and the recess 111 is connected to the heating element 25 via an adhesive layer 26. For example, the adhesive layer 26 may be a thermally conductive gel. This arrangement improves the efficiency of heat transfer between the heating element 25 and the first heat spreader 11, thereby effectively improving the heat dissipation effect of the heating element 25. Furthermore, it makes the structure of the electronic device 20 more compact, reducing the increase in the thickness of the electronic device 20, thus facilitating the thinning design of the electronic device 20.

[0097] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0098] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A foldable heat spreader, characterized in that, The foldable temperature distribution plate includes: The first heat spreader plate is used to connect to the heating element; The second temperature distribution plate includes a first temperature distribution area, a second temperature distribution area, and a bending area connecting the first temperature distribution area and the second temperature distribution area. The first temperature distribution area is connected to the first temperature distribution plate.

2. The foldable heat spreader according to claim 1, characterized in that, The first heat spreader includes a first surface and a second surface that are opposite to each other. The first surface is used to connect with the heating element, and the second surface is connected with the first heat spreader area.

3. The foldable temperature equalizer plate according to claim 2, characterized in that, The first heat spreader has a recessed portion that is recessed from the second surface toward the first surface. The first surface located in the recessed portion is used to connect with the heating element, and the first heat spreader extends into the recessed portion.

4. The foldable heat spreader according to claim 3, characterized in that, The first surface has a groove corresponding to the position of the first temperature uniform zone. The groove is connected to the recessed portion, and part of the first temperature uniform zone is embedded in the groove.

5. The foldable temperature equalizer according to claim 3, characterized in that, The first heat exchange plate includes a first upper cover plate and a first lower cover plate, and a first sealed cavity is formed between the first upper cover plate and the first lower cover plate. A first capillary structure and a first heat exchange medium are disposed in the first sealed cavity.

6. The foldable temperature equalizer plate according to claim 5, characterized in that, The first heat spreader also includes: Multiple first support structures are dispersedly disposed within the first sealed cavity. One end of each first support structure is connected to the first upper cover plate, and the other end of each first support structure extends toward the first capillary structure.

7. The foldable heat spreader according to claim 6, characterized in that, The first support structure and the first upper cover plate are integrally formed.

8. The foldable heat spreader according to claim 6, characterized in that, The first support structure is formed by stamping or etching the first upper cover plate; and / or, The height of the first support structure is 0.08 mm to 0.5 mm; and / or, The thickness of the first capillary structure is 0.04 mm to 0.2 mm; and / or, The thickness of both the first upper cover plate and the first lower cover plate is 0.02 mm to 0.2 mm.

9. The foldable heat spreader according to claim 6, characterized in that, The first supporting structure includes one of the following: a columnar structure, a frustum-shaped structure, and a hemispherical structure; and / or, The first heat spreader also includes a second support structure disposed at the side wall position corresponding to the recessed portion, the second support structure being an elongated strip extending along the side wall of the recessed portion.

10. The foldable heat spreader according to any one of claims 1 to 9, characterized in that, The second heat exchange plate includes a second upper cover plate and a second lower cover plate, and a second sealed cavity is formed between the second upper cover plate and the second lower cover plate. A second capillary structure and a second heat exchange medium are disposed in the second sealed cavity.

11. The foldable heat spreader according to claim 10, characterized in that, Both the second upper cover plate and the second lower cover plate include a first metal layer, a second metal layer and a flexible layer stacked together, with the flexible layer located between the first metal layer and the second metal layer.

12. The foldable heat spreader according to claim 11, characterized in that, Compared to the first metal layer, the second metal layer is closer to the second sealing cavity. Corresponding to the bending area, the first metal layer is provided with a first hollow structure.

13. The foldable heat spreader according to claim 11, characterized in that, The first metal layer and the second metal layer are metal foils; and / or, The thicknesses of the first metal layer and the second metal layer are 5 μm to 30 μm; and / or, The thickness of the flexible layer is 10 μm to 50 μm; and / or, The thickness of the second capillary structure is 0.04 mm to 0.2 mm.

14. The foldable heat spreader according to claim 10, characterized in that, The second heat spreader also includes: Multiple third support structures are dispersedly disposed within the second sealed cavity located in the first and second temperature equalization zones, with one end of each third support structure connected to the second upper cover plate and the other end of each third support structure extending toward the second capillary structure.

15. The foldable heat spreader according to claim 10, characterized in that, The second upper cover plate and the second lower cover plate located in the bending area are both wavy.

16. The foldable heat spreader according to claim 10, characterized in that, The second heat spreader also includes a third capillary structure disposed in the second sealed cavity located in the bending area, the third capillary structure being disposed opposite to the second capillary structure.

17. The foldable heat spreader according to claim 16, characterized in that, The third capillary structure is provided with a plurality of second hollow structures, and the plurality of second hollow structures penetrate the second capillary structure, and the extension direction of the plurality of second hollow structures is parallel to the extension direction of the bending area.

18. The foldable heat spreader according to any one of claims 1 to 9, characterized in that, The second temperature distribution plate also includes a redundant portion disposed between the first temperature distribution zone and the bending zone, and between the second temperature distribution zone and the bending zone.

19. An electronic device, characterized in that, The electronic device includes: The foldable heat spreader as described in any one of claims 1 to 18; A foldable assembly includes a hinge assembly and a first folding portion and a second folding portion connected to the hinge assembly. The first folding portion and the second folding portion are movable relative to the hinge assembly to fold and unfold with each other. A heating element is disposed on the first folding portion. A foldable heat spreader is disposed on the front side of the hinge assembly. The first heat spreader of the foldable heat spreader is disposed on the first folding portion and connected to the heating element. The second heat spreader of the second heat spreader is disposed on the second folding portion. The bending area of ​​the second heat spreader is opposite to the hinge assembly.

20. The electronic device according to claim 19, characterized in that, The heating element is disposed on the back of the first folded part, and the middle frame is provided with a third hollow structure corresponding to the recessed part of the first heat spreader. The recessed part is located in the third hollow structure, and the recessed part is connected to the heating element through an adhesive layer.

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