Micro-channel liquid cooling plate and preparation method and application thereof

Abstract

The application belongs to the technical field of electronic equipment thermal management, and particularly relates to a micro-channel liquid cooling plate and a preparation method and application thereof. The micro-channel liquid cooling plate comprises a bottom plate, a metal paste layer and a top plate; the metal paste layer is arranged between the top plate and the bottom plate; the material of the bottom plate and the top plate is metal; the raw material of the metal paste layer comprises a high polymer material, a metal salt, a mixed metal powder, polyvinyl alcohol, ethylene glycol, a reducing agent and a dispersing agent; the high polymer material is a light-cured high polymer material and / or a heat-cured high polymer material. Compared with the prior art, the application adopts the mode of brushing the metal paste, pre-solidification, micro-nano imprinting and sintering, so that complex channels such as curves can be constructed, and the heat exchange efficiency is improved.

Description

Technical Field

[0001] This invention relates to a microchannel liquid cooling plate, its preparation method and application, belonging to the field of thermal management technology for electronic devices. Background Technology

[0002] Technologies such as AI and big data are driving a surge in computing power density, leading to a significant increase in chip and server rack power. Traditional air cooling, limited by the low thermal conductivity of air, suffers from insufficient heat dissipation efficiency and a high Power Usage Effectiveness (PUE) value, making it difficult to meet the demands of high-power scenarios. Microchannel cooling has become a core thermal management solution for high heat flux density chips (such as AI / GPUs), achieving heat flux densities of 100W-2000W / cm². It is moving from the laboratory to small-scale commercial applications, but large-scale adoption is still constrained by multiple issues such as manufacturing, cost, and system integration.

[0003] Metals, as excellent thermal conductors, are the preferred raw materials for microchannel heat dissipation technology. However, for complex metal microchannels with strong heat dissipation capabilities, especially copper microchannels, there is a lack of technologies and processes for mass production. This is because copper is soft, sticky, and easily deformed, making traditional machining processes prone to tool sticking, difficult to control dimensions, and resulting in poor precision in etching sidewalls. Furthermore, copper's high thermal conductivity and high reflectivity lead to unstable 3D printing molten pools, numerous defects, and difficulty in cleaning residual powder from microchannels. Both processes suffer from low yields and low efficiency, making mass production difficult. Most current microchannels are manufactured through extrusion molding. For example, CN121339861A discloses a method for preparing a microchannel tube structure for a liquid cooling plate, including the following steps: S1: preparing raw materials for the liquid cooling plate; S2: roll bending the upper wall plate raw material; S3: roll bending the lower wall plate raw material; S4: roll bending the microchannel tube raw material; S5: connecting and fixing the roll-bent upper wall plate structure, lower wall plate structure, and microchannel tube structure by brazing to assemble the final three-layer structure; S6: installing cooling water nozzles at the microchannel tube structure. The minimum hydraulic diameter of this type of microchannel is in the millimeter range, and the flow channel can only be a straight line.

[0004] Therefore, how to provide a method for preparing a microchannel liquid cooling plate that is compatible with high thermal conductivity metal materials such as copper and has fine and complex microchannels is one of the important research issues in this field. Summary of the Invention

[0005] This invention addresses the problems mentioned in the background art by providing a microchannel liquid cooling plate, its preparation method, and its application. A micro / nano imprinting method is used to imprint complex microchannels from metal paste, which are then fixed and shaped using UV curing or thermal curing. Further sintering then forms complex microchannels with minimal impurities. Finally, the metal paste layer channels are electroplated and bonded to a metal top plate using composite diffusion welding, and then encapsulated using laser welding to form a metal cooling plate with precise and complex microchannels.

[0006] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: A microchannel liquid cooling plate includes a base plate, a metal paste layer, and a top plate; The metal slurry layer is disposed between the top plate and the bottom plate; Both the base plate and the top plate are made of metal. The metal slurry layer is made from raw materials including polymer materials, metal salts, mixed metal powders, ethylene glycol, reducing agents, and dispersants. The polymer material is a photocurable polymer material and / or a thermocurable polymer material.

[0007] Preferably, the base plate is made of copper or aluminum and has a thickness of 0.5-5mm.

[0008] Preferably, the forming control method of the base plate is selected from one or both of wire cutting and saw blade cutting.

[0009] Preferably, the base plate has its surface roughness increased by grinding.

[0010] More preferably, the base plate is ultrasonically cleaned with ethanol.

[0011] More preferably, the base plate is surface modified by a plasma machine.

[0012] Plasma treatment is a general technique used to increase the adhesion of hydroxyl groups on the surface of materials, thereby enhancing the adhesion between the substrate and the metal paste layer.

[0013] Preferably, the top plate is made of copper or aluminum and has a thickness of 0.1-2 mm.

[0014] Preferably, the channel width of the microchannel liquid cooling plate is 50nm-5000μm, and the aspect ratio of the channel is ≥0.2.

[0015] Preferably, the forming control method of the top plate is selected from one or both of wire cutting and saw blade cutting.

[0016] More preferably, the top plate is cleaned in 4%-15% dilute hydrochloric acid for 5 minutes.

[0017] More preferably, the top plate is ultrasonically cleaned with ethanol.

[0018] Preferably, the mass ratio of polymeric materials in the raw materials of the metal slurry layer is 5-12%.

[0019] Preferably, the mass ratio of metal salt in the raw material of the metal slurry layer is 0.2-1.6%.

[0020] Preferably, the mass ratio of mixed metal powder in the raw material of the metal slurry layer is 80-86%.

[0021] Preferably, the mass ratio of the reducing agent in the raw material of the metal slurry layer is 0.5-2%.

[0022] Preferably, the mass ratio of dispersant in the raw material of the metal slurry layer is 0.4-2%.

[0023] Preferably, the metal slurry further includes polyvinyl alcohol.

[0024] Preferably, the metal slurry further includes one of a thickener and a defoamer.

[0025] Preferably, the reducing agent is selected from one or more of ascorbic acid, ammonium formate, formic acid, and oxalic acid.

[0026] More preferably, the top plate is surface modified by a plasma machine.

[0027] Preferably, the photocurable polymer material includes one of aliphatic polyurethane acrylate, isoborneol methacrylate homopolymer, and trimethylolpropane triacrylate oligomer resin.

[0028] Preferably, the thermosetting polymer material includes one of epoxy resin, highly cross-linked / free phenolic special phenolic resin, and sintering resin.

[0029] Preferably, the thermal decomposition temperature of the photocurable polymer material and the thermocurable polymer material is below 600°C.

[0030] Preferably, the metal salt is selected from one of copper sulfate, copper acetylacetonate, copper hydroxide, aluminum trimethylamine hydride, and copper formate tetrahydrate.

[0031] Preferably, the dispersant is selected from ammonium oxalate.

[0032] Preferably, the mixed metal powder includes nano-sized metal particles and micro-sized metal particles, wherein the mass content of the nano-sized metal particles in the mixed metal powder is 1-5%; and the mass content of the micro-sized metal particles in the mixed metal powder is 95-99%.

[0033] The present invention also provides a method for preparing the above-mentioned microchannel liquid cooling plate, comprising the following steps: (1) Mix the raw materials of the metal slurry layer to form a metal slurry; (2) Apply the metal paste from step (1) to the base plate, pre-cur it with heat or light, and construct channels on the metal paste by micron imprinting and / or nano imprinting to obtain the part to be heated; (3) Sinter the part to be heated obtained in step (2), cool it down, and obtain an intermediate part; (4) The top plate is attached to the metal paste layer of the intermediate component, vacuum diffusion welding is performed, and the microchannel liquid cooling plate is encapsulated.

[0034] Preferably, in step (2), the environment for the micron imprinting is a vacuum degree ≤ 0.08 MPa; The pressure environment for the nanoimprint is a vacuum degree ≤ 0.08 MPa.

[0035] More preferably, the pressure of the micron imprint is 0.1-1 MPa; The pressure of the nanoimprint is 0.1-1 MPa.

[0036] Preferably, the top plate of the microchannel liquid cooling plate is provided with a water inlet and a water outlet.

[0037] More preferably, in step (2), the metal slurry layer channel of the microchannel liquid cooling plate is provided with an inlet and an outlet.

[0038] More preferably, the water inlet of the top plate is matched with the water inlet of the metal slurry layer channel; The water outlet of the top plate is matched with the water outlet of the metal slurry layer channel.

[0039] Preferably, the channel in step (2) is cured by heating or light.

[0040] Preferably, in step (2), a release agent is added between the imprinting mold and the metal paste during the nanoimprinting or microimprinting process.

[0041] Preferably, step (2) further includes a heating step after constructing channels on the metal slurry.

[0042] More preferably, the temperature adjustment method of the heating step is as follows: the temperature is increased in a gradient at a rate of 1-6℃ / min, and the temperature is maintained at 100℃-140℃ for 20-60min.

[0043] The purpose of the heating step is to evaporate excess volatile solvents such as ethylene glycol to prevent the formation of through-pores.

[0044] More preferably, before the heating step, a pretreatment step is further included, wherein the environment for the pretreatment step is selected from one of the following configurations: ① Introduce a mixture of argon and formic acid; ② Maintain a vacuum; ③ Inert atmosphere.

[0045] Preferably, the sintering temperature control method in step (3) is as follows: the temperature is increased by gradient at a rate of 3-8℃ / min, and the temperature is held at 280-600℃ for 8-50min.

[0046] Preferably, the cooling rate in step (3) is 8°C / min.

[0047] More preferably, the cooling atmosphere is a mixture of argon and formic acid.

[0048] Preferably, the channels of the metal paste layer in the intermediate part in step (3) are electroplated.

[0049] More preferably, the electroplating method includes the following steps: S1. Degrease, derust, and remove oxide layer from the electroplating channel to obtain a pre-treated channel; S2. Place the pretreatment channel obtained in step S1 in the electrolyte as the cathode and the plating metal as the anode. Apply current to deposit the plating metal onto the pretreatment channel to obtain a metal slurry layer electroplating enhancement channel.

[0050] More preferably, the electroplating further includes a post-processing step, including cleaning, neutralization and drying steps.

[0051] Preferably, the vacuum degree of the vacuum diffusion welding is 0.01-0.26 MPa.

[0052] Preferably, in step (4), the encapsulation step is performed by laser welding.

[0053] Preferably, in step (4), the temperature of diffusion welding is 50-80% of the melting point of the top plate base material.

[0054] More preferably, the pressure for diffusion welding is controlled at 0.1-10 MPa.

[0055] The present invention also provides the application of the above-mentioned microchannel liquid cooling plate in the fabrication of thermally conductive devices.

[0056] The beneficial effects of this invention are as follows: (1) The present invention uses micro-nano imprinting to solve the problems of soft and sticky texture and easy deformation of copper material in the construction of microchannels in the prior art; and avoids the many defects of 3D printing. It can construct a precise microchannel structure while using copper material, which can effectively improve liquid cooling efficiency. (2) The present invention uses micro-nano imprinting to construct complex channels such as curves. Attached Figure Description

[0057] Figure 1 The schematic diagram of the microchannel liquid cooling plate provided by the present invention includes a bottom plate, a metal slurry layer and a top plate, wherein complex microchannels are provided in the metal slurry layer; Figure 2 This is a schematic diagram of the microchannel liquid cooling plate preparation method provided by the present invention; Figure 3 This diagram illustrates the design and physical comparison of an embodiment of the microchannel liquid cooling plate provided by the present invention. It shows the steps of base plate treatment, slurry preparation, uniform coating, controlling the thickness of the metal slurry, vacuum micro-nano imprinting, heat curing / UV curing, gradient heat curing, solvent evaporation at a medium-temperature platform in the vacuum chamber, high-temperature sintering above 280°C, top plate treatment, electroplating, and diffusion welding / laser welding encapsulation. Detailed Implementation

[0058] The principles and features of the present invention are described below. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0059] Unless otherwise specified, all raw materials used in this invention are commercially available products.

[0060] Example 1: Microchannel liquid cooling plate and its preparation method (1) The metal paste is composed of the following components in terms of mass content: 5% bis(3,4-epoxycyclohexylmethyl) adipate 1% copper sulfate The mixed metal powder contains 82% metal powder, which is composed of the following components by mass content: 1% nano-sized copper powder and 99% micron-sized copper powder.

[0061] Ascorbic acid 0.8% Ammonium oxalate 1.2% 6% ethylene glycol; Polyvinyl alcohol 4%; The above raw materials are mixed evenly using a homogenizer to obtain a metal slurry.

[0062] (2) After mixing the uniformly stirred metal slurry with photoinitiator, place it in an inert gas incubator for storage. Take out a 0.5mm thick copper plate. The size of the copper plate is controlled by wire cutting. Use sandpaper to polish to increase the surface roughness. The sandpaper specification is fine grinding P180. Place the polished metal sheet in ethanol for ultrasonic cleaning for 10 minutes. Then perform surface modification by plasma machine. Power: 200W, time: 20 seconds. (3) Apply metal paste to the polished surface of the copper plate in step (2) using a scraper. Adjust the thickness of the coating by adjusting the height of the scraper. The thickness is controlled at 5 micrometers. A copper plate coated with metal paste is placed in a vacuum chamber. After curing the paste with a UV lamp, the vacuum level is reduced to 0.08 MPa. The paste is then pressed in using a micro-nano imprinting mold at a controlled pressure of 0.1 MPa. The imprinting mold is then removed, and after demolding, a complex microchannel is formed. The width of the microchannel is 1 micrometer, and the aspect ratio is 0.25.

[0063] (4) Place the copper plate with the complex microchannel metal paste imprinted on it in an inert gas high-temperature chamber and introduce a mixture of argon and formic acid in a ratio of 1:2; or use a vacuum method to ensure that the chamber is free of oxygen. Use a gradient heating rate of 3℃ / min and hold at 100℃ for 20min to evaporate excess volatile gases such as ethylene glycol and avoid the formation of through pores.

[0064] (5) After the heat preservation is completed, the temperature is gradually increased at a rate of 5℃ / min until it reaches 380℃, and then kept warm for 20min. After the heat preservation is completed, continue to introduce a mixture of argon and formic acid gas, and perform gradient cooling at a rate of 8℃ / min. When the temperature drops to room temperature, remove the plate and degrease, remove rust, remove oxide layer, electroplate copper, clean, neutralize and dry to obtain a base plate with a metal layer.

[0065] (6) The top plate is a 0.1mm thick copper plate. The size of the copper plate is controlled by wire cutting. The top plate is placed in 10% dilute hydrochloric acid for 5 minutes to clean it. Then, the polished metal sheet is placed in ethanol for ultrasonic cleaning. Then, the surface is modified by plasma machine to enhance the adhesion between the top plate and the metal paste layer.

[0066] (7) The sintered metal paste layer bottom plate and top plate are bonded together, and the sides are coated with sealing solder paste. The vacuum degree of vacuum diffusion welding is 0.26MPa, the temperature is 780℃, and the pressure of diffusion welding machine is controlled at 0.1MPa. After welding, a sealed complex microchannel is formed, and a liquid cooling plate with complex microchannel is prepared.

[0067] Example 2 Microchannel liquid cooling plate and its preparation method (1) The metal paste is composed of the following components in terms of mass content: Polyethylene glycol diglycidyl ether 7.4%; Trimethylamine combined with aluminum hydride 1.6%; The mixed metal powder comprises 80% by weight, and consists of the following components by mass: 1% nano-sized aluminum particles; 99% micron-sized aluminum particles. Ascorbic acid 0.8%; Ammonium oxalate 1.2%; 5% ethylene glycol; Polyvinyl alcohol 4%; The above raw materials are mixed evenly using a homogenizer to obtain a metal slurry; (2) After mixing the metal slurry with the curing agent, place it in an inert gas insulated box for storage. Take out a 2mm thick aluminum plate. The size of the aluminum plate is controlled by the saw blade cutting method. Use sandpaper to polish to increase the surface roughness. The sandpaper specification is fine grinding P220. Place the polished aluminum plate in ethanol for ultrasonic cleaning for 10 minutes. Then perform surface modification through a plasma machine. Power: 240W, time: 100 seconds. (3) Apply metal paste to the polished surface of aluminum plate using a scraper. Adjust the thickness of the coating by adjusting the height of the scraper. The thickness is controlled at 400 micrometers. An aluminum plate coated with metal paste is heated to 80°C and maintained for 7 minutes. The paste is pressed into the plate using a micro-nano imprinting mold at a controlled pressure of 0.2 MPa. Microchannels are imprinted on the pre-cured paste. After demolding, complex microchannels are formed with a width of 300 micrometers and an aspect ratio of 0.4.

[0068] (4) Place the aluminum plate with the complex microchannel metal paste imprinted on it in an inert gas high-temperature chamber and introduce a mixture of argon and formic acid in a ratio of 1:3; or use a vacuum method to ensure that the chamber is free of oxygen. Use a gradient heating rate of 1℃ / min and hold at 120℃ for 30min to evaporate excess volatile gases such as ethylene glycol and avoid the formation of through pores.

[0069] (5) After the heat preservation is completed, the temperature is gradually increased at a rate of 3℃ / min until it reaches 350℃, and then kept warm for 30min. After the heat preservation is completed, continue to introduce a mixture of argon and formic acid gas, and perform gradient cooling at a rate of 8℃ / min. When the temperature drops to room temperature, remove the plate and degrease, remove rust, remove oxide layer, electroplate aluminum, clean, neutralize and dry to obtain a base plate with a metal layer.

[0070] (6) The top plate is a 0.5mm thick aluminum plate. The size of the aluminum plate is controlled by wire cutting. The top plate is placed in 5% dilute hydrochloric acid for 5 minutes to clean it. Then, the polished aluminum plate is placed in ethanol for ultrasonic cleaning. Then, the surface is modified by plasma machine to enhance the adhesion between the top plate and the metal paste layer.

[0071] (7) The sintered metal paste layer bottom plate and top plate are bonded together, and the sides are coated with sealing solder paste. The vacuum degree of vacuum diffusion welding is 0.03MPa, the temperature is 450℃, and the pressure of diffusion welding machine is controlled at 1MPa. After welding, a sealed complex microchannel is formed, and a liquid cooling plate with complex microchannel is prepared.

[0072] Comparative Example 1: Microchannel liquid cooling plate and its preparation method (1) The metal paste is composed of the following components in terms of mass content: 4% bis(3,4-epoxycyclohexylmethyl) adipate Copper sulfate 2%; The mixture contains 80% metal powder, which is composed of the following components by mass: 6% nano-sized copper powder and 94% micron-sized copper powder. Ascorbic acid 0.5%; Ammonium oxalate 2%; Ethylene glycol 6.5%; Polyvinyl alcohol 5%; The above raw materials are mixed evenly using a homogenizer to obtain a metal slurry.

[0073] (2) After mixing the uniformly stirred metal slurry with photoinitiator, place it in an inert gas incubator for storage. Take out a 0.5mm thick copper plate. The size of the copper plate is controlled by wire cutting. Use sandpaper to polish to increase the surface roughness. The sandpaper specification is fine grinding P180. Place the polished metal sheet in ethanol for ultrasonic cleaning for 10 minutes. Then perform surface modification by plasma machine. Power: 200W, time: 20 seconds. (3) Apply metal paste to the polished surface of the copper plate in step (2) using a scraper. Adjust the thickness of the coating by adjusting the height of the scraper. The thickness is controlled at 5 micrometers. A copper plate coated with metal paste is placed in a vacuum chamber. When the vacuum level is reduced to 0.08 MPa, the paste is pressed in using a micro-nano imprinting mold. The pressure is controlled at 0.1 MPa. After the paste is cured using a UV lamp, the imprinting mold is removed. After demolding, a complex microchannel is formed. The width of the microchannel is 1 micrometer and the aspect ratio is 0.25.

[0074] (4) Place the copper plate with the complex microchannel metal paste imprinted on it in an inert gas high-temperature chamber and introduce a mixture of argon and formic acid in a ratio of 1:2; or use a vacuum method to ensure that the chamber is free of oxygen. Use a gradient heating rate of 3℃ / min and hold at 100℃ for 20min.

[0075] (5) After the heat preservation is completed, the temperature is gradually increased at a rate of 5℃ / min until it reaches 380℃, and then kept warm for 20min. After the heat preservation is completed, continue to introduce a mixture of argon and formic acid gas, and perform gradient cooling at a rate of 8℃ / min. When the temperature drops to room temperature, remove the plate and degrease, remove rust, remove oxide layer, electroplate copper, clean, neutralize and dry to obtain a base plate with a metal layer.

[0076] (6) The top plate is a 0.1mm thick copper plate. The size of the copper plate is controlled by wire cutting. The top plate is placed in 10% dilute hydrochloric acid for 5 minutes to clean it. Then, the polished metal sheet is placed in ethanol for ultrasonic cleaning. Then, the surface is modified by plasma machine to enhance the adhesion between the top plate and the metal paste layer.

[0077] (7) The sintered metal paste layer bottom plate and top plate are bonded together, and the sides are coated with sealing solder paste. The vacuum degree of vacuum diffusion welding is 0.26MPa, the temperature is 780℃, and the pressure of diffusion welding machine is controlled at 0.1MPa. After welding, a sealed complex microchannel is formed, and a liquid cooling plate with complex microchannel is prepared.

[0078] Disassembly and inspection of the liquid cooling plate obtained in Example 1 revealed that the flow channels were blocked and distorted over a large area, making it impossible to achieve any effective heat dissipation; the warping of the metal layer resulted in extremely poor weld airtightness and caused the metal layer to easily delaminate and fall off, which was equivalent to scrapping it directly after sintering.

[0079] The liquid cooling plate with complex microchannels obtained in Embodiments 1 and 2 of the present invention has a continuous and unobstructed flow channel, smooth inner wall without burrs, and metallurgical bonding without delamination or incomplete welding, which fully demonstrates the effectiveness of the method provided by the present invention.

[0080] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A microchannel liquid cooling plate, characterized in that, Includes the base plate, the metal slurry layer, and the top plate; The metal slurry layer is disposed between the top plate and the bottom plate; Both the base plate and the top plate are made of metal. The raw materials for the metal slurry layer include polymer materials, metal salts, mixed metal powders, ethylene glycol, polyvinyl alcohol, reducing agents, and dispersants; The polymer material is a photocurable polymer material and / or a thermocurable polymer material.

2. The microchannel liquid cooling plate according to claim 1, characterized in that, The microchannel liquid cooling plate has a channel width of 50nm-5000μm and an aspect ratio of ≥0.

2.

3. The microchannel liquid cooling plate according to claim 1, characterized in that, In the raw materials of the metal slurry layer: The mass proportion of polymer materials is 5-12%; The mass ratio of metal salt is 0.2-1.6%; The mass ratio of the mixed metal powder is 80-86%; The mass ratio of the reducing agent is 0.5-2%; The mass ratio of the dispersant is 0.4-2%.

4. The method for preparing a microchannel liquid-cooled plate according to any one of claims 1-3, characterized in that, Includes the following steps: (1) Mix the raw materials of the metal slurry layer to form a metal slurry; (2) Apply the metal paste from step (1) to the base plate, pre-cur it with heat or light, and construct channels on the metal paste by micron imprinting and / or nano imprinting to obtain the part to be heated; (3) Sinter the part to be heated obtained in step (2), cool it down, and obtain an intermediate part; (4) The top plate is attached to the metal paste layer of the intermediate component, vacuum diffusion welding is performed, and the microchannel liquid cooling plate is encapsulated.

5. The preparation method according to claim 4, characterized in that, The top plate of the microchannel liquid cooling plate is provided with an inlet and an outlet; The channel constructed by the metal slurry in step (2) is provided with an inlet and an outlet; The water inlet of the top plate is matched with the water inlet of the metal slurry layer channel; The water outlet of the top plate is matched with the water outlet of the metal slurry layer channel.

6. The preparation method according to claim 4, characterized in that, Step (2) includes a heating step after constructing channels on the metal slurry; Before the heating step, a pretreatment step is also included, and the environment of the pretreatment step is selected from one of the following construction methods: ① Introduce a mixture of argon and formic acid; ② Maintain a vacuum; ③ Inert atmosphere.

7. The preparation method according to claim 4, characterized in that, The temperature control method for sintering in step (3) is as follows: the temperature is increased in a gradient at a rate of 3-8℃ / min, and the temperature is held at 280-600℃ for 8-50min.

8. The preparation method according to claim 4, characterized in that, Electroplating is performed on the channels of the metal paste layer in the intermediate component in step (3); The electroplating method includes the following steps: S1. Degrease, derust, and remove oxide layer from the electroplating channel to obtain a pre-treated channel; S2. Place the pretreatment channel obtained in step S1 in the electrolyte as the cathode and the plating metal as the anode. Apply current to deposit the plating metal onto the pretreatment channel to obtain a metal slurry layer electroplating enhancement channel.

9. The preparation method according to claim 4, characterized in that, In step (4), the diffusion welding temperature is 50-80% of the melting point of the top plate base material.

10. The application of the microchannel liquid cooling plate according to any one of claims 1-3 in the fabrication of thermally conductive devices.

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