A SIP module and vehicle

Abstract

The application relates to a SIP module and a vehicle, and relates to the technical field of integrated circuits.The SIP module can improve the signal transmission efficiency between internal devices, reduce the cost, and ensure normal operation under complex working conditions.The application provides a SIP module, which comprises a plurality of functional elements, the plurality of functional elements are sequentially and layerwisely arranged along a first direction, at least two functional elements in the plurality of functional elements are arranged in a staggered and overlapped mode in the first direction, and the first direction is the thickness direction of the plurality of functional elements; each functional element comprises a functional island and a substrate, the functional island is arranged on the substrate, and the functional island and the substrate are alternately arranged along the first direction.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, specifically to a SIP module and a vehicle. Background Technology

[0002] With the development of intelligent connected new energy vehicles, automotive electronic and electrical architectures are evolving towards centralized computing integration, placing increasingly higher demands on chip performance. For the needs of automotive intelligence, fast signal transmission and processing speeds are crucial for intelligent driving and smart cockpits to make rapid decisions; therefore, chip performance is a core capability ensuring safe vehicle operation. However, with increasingly limited planar space and ever-growing computing power demands, horizontal expansion has reached its bottleneck. With ample space in automobiles, the need for a more dimensional structure has shifted, making SiP (System-in-Package) 3D packaging technology the mainstream approach.

[0003] Current SIP (System-in-Package) 3D packaging technology is generally used in conventional electronic device applications, and it is difficult to adapt well to the special working conditions and complex functional integration requirements of automotive applications. Summary of the Invention

[0004] This application provides a SIP module and a vehicle. The SIP module improves signal transmission efficiency between internal components, reduces costs, and ensures normal operation under complex working conditions. The technical solution of this application is as follows:

[0005] In a first aspect, this application provides a SIP module, which includes: a plurality of functional elements, which are stacked sequentially along a first direction, and at least two of the functional elements are staggered and overlapped in the first direction, wherein the first direction is the thickness direction of the plurality of functional elements; each functional element includes a functional island and a substrate, wherein the functional island is disposed on the substrate and the functional island and the substrate are alternately disposed along the first direction.

[0006] Based on the above solutions, some embodiments of this application provide a SIP module in which multiple functional components are stacked, improving space utilization. At least two of the functional components are staggered and overlapped in a first direction, which improves heat dissipation efficiency between the components and facilitates wiring connections, shortens signal transmission paths, and reduces signal transmission delay. The alternating arrangement of functional islands and the substrate reduces signal interference between adjacent functional islands, thereby ensuring stable operation under complex conditions.

[0007] In one possible implementation, the system includes a first functional element, a second functional element, and a first connecting line. The first functional element includes a storage island and a storage island substrate. The second functional element includes a computing island and a computing island substrate. The second functional element is disposed on the side of the storage island away from the storage island substrate, and the first functional element and the second functional element are offset and overlapped in a first direction. The first connecting line extends along the first direction and electrically connects the computing island and the storage island by passing through the computing island substrate.

[0008] According to the above technical means, the first connecting line in this application realizes the signal transmission between the computing island and the storage island, and the first connecting line extends along the first direction, and the first direction is perpendicular to the plane where the computing island and the storage island are located. The first functional element and the second functional element are staggered and overlapped in the first direction. That is to say, the position where the first connecting line connects to the computing island and the storage island is located in the area where the first functional element and the second functional element overlap. The signal transmission distance between the computing island and the storage island along the first connecting line is the shortest, which can ensure the real-time integrity of the signal transmission.

[0009] In one possible implementation, a third functional element and a second connecting line are also included. The third functional element is disposed on the side of the first functional element away from the second functional element. The first functional element and the third functional element are offset and overlapped in a first direction. The third functional element includes a security island and a security island substrate. The second connecting line extends along the first direction and electrically connects the security island and the storage island by passing through the storage island substrate.

[0010] According to the above technical means, in this application, the first functional element and the third functional element are staggered and overlapped in the first direction, and the second connecting line extends along the first direction. The first direction is perpendicular to the plane where the security island and the storage island are located. That is to say, the position where the second connecting line connects to the security island and the storage island is located in the area where the first functional element and the third functional element overlap. The signal transmission distance between the security island and the storage island along the second connecting line is the shortest, which can ensure the real-time integrity of the signal transmission.

[0011] In one possible implementation, a fourth functional element and a third connecting line are further included. The fourth functional element is disposed on the side of the third functional element away from the first functional element. The fourth functional element is offset from and overlaps with the first, second, and third functional elements in a first direction. The fourth functional element includes a power management island and a power management substrate. The third connecting line extends along the first direction and includes a first sub-connecting line, a second sub-connecting line, and a third sub-connecting line. The first sub-connecting line electrically connects the power management island to the computing island by passing through the computing island substrate. The second sub-connecting line electrically connects the power management island to the storage island by passing through the storage island substrate. The third sub-connecting line electrically connects the power management island to the security island by passing through the security island substrate.

[0012] Based on the aforementioned technical means, in this application, the fourth functional element is staggered and overlapped with the first, second, and third functional elements in the first direction. The third connecting line extends along the first direction. As described above, the first sub-connecting line connects to the computing island and the power management island in the area where the second and fourth functional elements overlap, resulting in the shortest signal transmission distance between the computing island and the power management island along the first sub-connecting line. Similarly, the second sub-connecting line connects to the storage island and the power management island in the area where the first and fourth functional elements overlap, resulting in the shortest signal transmission distance between the storage island and the power management island along the second sub-connecting line. The third sub-connecting line connects to the security island and the power management island in the area where the third and fourth functional elements overlap, resulting in the shortest signal transmission distance between the security island and the power management island along the third sub-connecting line. This avoids signal delay and ensures the real-time integrity of signal transmission.

[0013] In one possible implementation, the first sub-connecting line does not overlap with the first functional element and the third functional element in the first direction, and the second sub-connecting line does not overlap with the third functional element in the first direction.

[0014] Based on the above technical means, the first sub-connecting line and the second sub-connecting line in this application adopt the above configuration, which can ensure that the first sub-connecting line and the second sub-connecting line extend along the first direction during the connection process, avoid the phenomenon of winding or bending, and make the transmission distance between the islands connected by the first sub-connecting line and the second sub-connecting line the shortest.

[0015] In one possible implementation, the computing island includes at least a first interface circuit and a second interface circuit, the first interface circuit being electrically connected to a first connection line, and the second interface circuit being used to connect external devices.

[0016] Based on the above technical means, this application provides a first interface circuit for processing and converting signals transmitted by the first connection line between the computing island and the storage island, and a second interface circuit for processing and converting signals transmitted by external devices.

[0017] In one possible implementation, the computing island includes a first processing circuit, wherein the first processing circuit is coupled to a first interface circuit and a second interface circuit, and the first processing circuit is used to perform data interaction with the first interface circuit and the second interface circuit.

[0018] According to the above-mentioned technical means, the first processing circuit in this application is used to perform data interaction with the first interface circuit and the second interface circuit.

[0019] In one possible implementation, the storage island includes a plurality of memories stacked in a first direction, and each memory is coupled to a first connection line and a second connection line, respectively.

[0020] Based on the aforementioned technical means, this application incorporates multiple memories, the number of which depends on the requirements and is not specifically limited. Each memory is coupled to a first connection line and a second connection line, meaning that the first and second connection lines can transmit data from the security island or computing island to the memories, enabling the storage and reading / writing of the SIP module.

[0021] In one possible implementation, the security island includes a second processing circuit and a third interface circuit. The second processing circuit is coupled to the third interface circuit, and the third interface circuit is electrically connected to a second connection line. The second processing circuit is used to process the data transmitted by the third interface circuit.

[0022] Based on the above-mentioned technical means, the second processing circuit is provided in this application, which can improve data processing capabilities on the one hand, and perform real-time data monitoring on the other hand, to ensure the safe operation of the functional island.

[0023] In one possible implementation, the power management island includes a third processing circuit for supplying power to the computing island, storage island, and security island.

[0024] Based on the above-mentioned technical means, the third processing circuit in this application can monitor the power supply demand and ensure the normal operation of each functional component.

[0025] In one possible implementation, a heat dissipation structure is also included, which is disposed on the side of the computing island away from the computing island substrate and is in contact with the computing island.

[0026] According to the above technical means, the heat dissipation structure in this application is located on the side of the computing island away from the computing island substrate. Since the computing island will generate a lot of heat during operation, setting the heat dissipation structure to contact the computing island is beneficial to the rapid heat dissipation of the computing island, so as to avoid failure due to overheating of the computing island.

[0027] In one possible implementation, a shielding cover is also included, which covers multiple functional modules and a heat dissipation structure, and is used to shield multiple functional components from electromagnetic interference between them and the external environment.

[0028] Based on the above-mentioned technical means, the shielding cover provided in this application can reduce electromagnetic interference between multiple functional components and the external environment, thereby ensuring the stable operation of the vehicle electronic system in a complex electromagnetic environment.

[0029] Secondly, this application provides a vehicle that includes the SIP module described in the first aspect.

[0030] The beneficial effects of this invention are:

[0031] (1) In this application, according to the specific needs of different functional modules of the automotive electronic system, multiple functional elements with different functions are set in the SIP module, such as the first functional element responsible for data processing, the second functional element responsible for data access, the third functional element responsible for the safe operation of each functional element, and the fourth functional element responsible for power management, which can realize the variability of multiple functions (such as computing power, storage, and communication).

[0032] (2) In this application, at least two of the multiple functional elements are staggered and overlapped in the first direction, which can improve the heat dissipation efficiency between the functional elements and facilitate circuit connection. The alternating arrangement of the functional islands and the substrate can reduce signal interference between adjacent functional islands, thereby ensuring stable operation under complex working conditions.

[0033] (3) The arrangement of the first connecting line, the second connecting line and the third connecting line in this application extending along the first direction can shorten the signal transmission path, reduce the signal transmission delay, improve the signal transmission efficiency, and ensure the efficient operation of the SIP module.

[0034] It should be understood that the above general description and the following detailed description are merely exemplary and explanatory, and do not limit this application. Beneficial effects of the present invention: Attached Figure Description

[0035] Figure 1 This is a structural diagram of a SIP module shown according to some embodiments;

[0036] Figure 2This is a structural diagram of another SIP module shown according to some embodiments;

[0037] Figure 3 This is a structural diagram of the computing island shown according to some embodiments;

[0038] Figure 4 This is a structural diagram of a storage island shown according to some embodiments;

[0039] Figure 5 This is a structural diagram of a safety island shown according to some embodiments.

[0040] Wherein, 1-functional island; 2-substrate; 10-functional element; 11-first functional element; 111-memory island; 112-memory island substrate; 110-memory; 12-second functional element; 121-computing power island; 122-computing power island substrate; 13-third functional element; 131-security island; 132-security island substrate; 14-fourth functional element; 141-power management island; 142-power management island substrate; 21-first connecting line; 22-second connecting line; 23-third connecting line; 231-first sub-connecting line; 232-second sub-connecting line; 233-third sub-connecting line; 31-first interface circuit; 32-second interface circuit; 33-third interface circuit; 41-first processing circuit; 42-second processing circuit; 43-third processing circuit; 5-heat dissipation structure; 6-shielding cover; X-first direction. Detailed Implementation

[0041] The embodiments of the present invention will be described below with reference to the accompanying drawings and preferred embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be understood that the preferred embodiments are only for illustrating the present invention and not for limiting the scope of protection of the present invention.

[0042] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0043] To enable those skilled in the art to better understand the technical solutions of this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.

[0044] It should be noted that the terms "first," "second," etc., used in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0045] With the development of intelligent connected new energy vehicles, automotive electronic and electrical architectures are evolving towards centralized computing integration, placing increasingly higher demands on chip performance. For the needs of automotive intelligence, fast signal transmission and processing speeds are crucial for intelligent driving and smart cockpits to make rapid decisions; therefore, chip performance is a core capability ensuring safe vehicle operation. However, with increasingly limited planar space and ever-growing computing power demands, horizontal expansion has reached its bottleneck. With ample space in automobiles, the need for a more dimensional structure has shifted, making SiP (System-in-Package) 3D packaging technology the mainstream approach.

[0046] Current SiP (System-in-Package) 3D packaging technology focuses on conventional electronic device applications and is difficult to adapt well to the unique operating conditions and complex functional integration requirements of automotive applications. For example, with the increasing demands of automotive applications, the requirements for variable storage, variable computing power, and variable communication in vehicles are becoming a development trend.

[0047] Based on this, this application provides a SIP module. For example... Figure 1 As shown, the SIP module includes multiple functional elements 10, which are stacked sequentially along a first direction X. At least two of the multiple functional elements 10 are staggered and overlapped in the first direction X, which is the thickness direction of the multiple functional elements 10. Each functional element 10 includes a functional island 1 and a substrate 2. The functional island 1 is disposed on the substrate 2, and the functional island 1 and the substrate 2 are alternately arranged along the first direction X.

[0048] Based on the above solutions, some embodiments of this application provide a SIP module. The SIP module, through the stacking of multiple functional elements 10, can improve space utilization. Simultaneously, at least two functional elements 10 are staggered and overlapped in the first direction X. This improves heat dissipation efficiency between the functional elements 10, facilitates wiring connections, reduces manufacturing costs, shortens signal transmission paths, and reduces signal transmission delay. The alternating arrangement of the functional islands 1 and the substrate 2 reduces signal interference between adjacent functional islands 1, thereby ensuring stable operation under complex working conditions.

[0049] For example, the above-mentioned multiple functional elements 10 can realize the requirements of variable computing power, multi-dimensional communication, and diversified power supply of the SIP module. That is, a SIP module can realize the variability of multiple functions. It should be noted that the functions here are not limited to the above functions. The specific types of functional elements 10 can be set according to the specific needs of different functional modules of the automotive electronic system.

[0050] The functional islands 1 and the substrate 2 are arranged alternately to avoid the problem of signal interference caused by the functional islands 1 of two adjacent functional elements 10 being too close to each other, thus affecting the transmission efficiency.

[0051] like Figure 2 As shown, in one possible implementation, the SIP module includes a first functional element 11, a second functional element 12, and a first connecting line 21. The first functional element 11 includes a storage island 111 and a storage island substrate 112. The second functional element 12 includes a computing island 121 and a computing island substrate 122. The second functional element 12 is disposed on the side of the storage island 111 away from the storage island substrate 112, and the first functional element 11 and the second functional element 12 are offset and overlapped in the first direction X. The first connecting line 21 extends along the first direction X and electrically connects the computing island 121 and the storage island 111 by passing through the computing island substrate 122.

[0052] According to the above technical means, the first connecting line 21 realizes the signal transmission between the computing island 121 and the storage island 111. The first connecting line 21 extends along the first direction X, and the first direction X is perpendicular to the plane where the computing island 121 and the storage island 111 are located. The first functional element 11 and the second functional element 12 are staggered and overlapped in the first direction X. That is to say, the position where the first connecting line 21 connects to the computing island 121 and the storage island 111 is located in the area where the first functional element 11 and the second functional element 12 overlap. The signal transmission distance between the computing island 121 and the storage island 111 along the first connecting line 21 is the shortest. The first connecting line 21 can ensure the real-time integrity of the signal transmission.

[0053] Continue to refer to Figure 2 In one possible implementation, it further includes a third functional element 13 and a second connecting line 22. The third functional element 13 is disposed on the side of the first functional element 11 away from the second functional element 12. The first functional element 11 and the third functional element 13 are offset and overlapped in the first direction X. The third functional element 13 includes a security island 131 and a security island substrate 132. The second connecting line 22 extends along the first direction X and electrically connects the security island 131 and the storage island 111 by passing through the storage island substrate 112.

[0054] According to the above technical means, the first functional element 11 and the third functional element 13 are staggered and overlapped in the first direction X. The second connecting line 22 extends along the first direction X, and the first direction X is perpendicular to the plane where the security island 131 and the storage island 111 are located. That is to say, the position where the second connecting line 22 connects to the security island 131 and the storage island 111 is located in the area where the first functional element 11 and the third functional element 13 overlap. The signal transmission distance between the security island and the storage island 111 along the second connecting line 22 is the shortest, and the second connecting line 22 can ensure the real-time integrity of the signal transmission.

[0055] Continue to refer to Figure 2 It also includes a fourth functional element 14 and a third connecting line 23. The fourth functional element 14 is disposed on the side of the third functional element 13 away from the first functional element 11. The fourth functional element 14 is offset and overlapped with the first functional element 11, the second functional element 12, and the third functional element 13 in the first direction X. The fourth functional element 14 includes a power management island 141 and a power management island substrate 142.

[0056] The third connecting line 23 extends along the first direction X. The third connecting line 23 includes a first sub-connecting line 231, a second sub-connecting line 232, and a third sub-connecting line 233. The first sub-connecting line 231 passes through the computing island substrate 122 and electrically connects the power management island 141 to the computing island 121. The second sub-connecting line 232 passes through the storage island substrate 112 and electrically connects the power management island 141 to the storage island 111. The third sub-connecting line 233 passes through the security island substrate 132 and electrically connects the power management island 141 to the security island 131.

[0057] According to the above technical means, in this application, the fourth functional element 14 is staggered and overlapped with the first functional element 11, the second functional element 12, and the third functional element 13 in the first direction X. The third connecting line 23 extends along the first direction X. As described above, the first sub-connecting line 231 is located in the area where the second functional element 12 and the fourth functional element 14 overlap, and the signal transmission distance between the computing island 121 and the power management island 141 along the first sub-connecting line 231 is the shortest. Similarly, the second sub-connecting line 232 is located in the area where the second functional element 12 and the fourth functional element 14 overlap, and the signal transmission distance between the computing island 121 and the power management island 141 along the first sub-connecting line 231 is the shortest. The location where the storage island 141 is connected is in the area where the first functional element 11 and the fourth functional element 14 overlap. The signal transmission distance between the storage island 111 and the power management island 141 is the shortest along the second sub-connection line 232. The location where the third sub-connection line 233 connects to the security island 131 and the power management island 141 is in the area where the third functional element 13 and the fourth functional element 14 overlap. The signal transmission distance between the security island 131 and the power management island 141 is the shortest along the third sub-connection line 233. The above-mentioned setting of the third connection line 23 can avoid signal delay and ensure the real-time integrity of signal transmission.

[0058] It should be noted that the above-mentioned arrangement of the first connecting line 21, the second connecting line 22, and the third connecting line 23 extending along the first direction X can, on the one hand, ensure the efficient operation of the SIP module and the high-speed, high-capacity data transmission between different islands, thereby improving signal transmission efficiency; on the other hand, it can shorten the signal transmission path and reduce signal transmission delay. In other words, under complex working conditions such as vibration and temperature changes in the automotive environment, the first connecting line 21, the second connecting line 22, and the third connecting line 23 can ensure the real-time integrity of the signal, that is, even when the vehicle is on a bumpy road, it can still ensure stable data signal transmission between different islands.

[0059] In one possible implementation, combined with Figure 1 and Figure 2 The first sub-connecting line 231 does not overlap with the first functional element 11 and the third functional element 13 in the first direction X, and the second sub-connecting line 232 does not overlap with the third functional element 13 in the first direction X.

[0060] For example, refer to Figure 1 and Figure 2 The first sub-connecting line 231 and the second sub-connecting line 232 are configured as described above to ensure that both the first sub-connecting line 231 and the second sub-connecting line 232 extend along the first direction X during the connection process, avoiding wire wrapping or bending, so that the transmission distance between the different islands connected by the first sub-connecting line 231 and the second sub-connecting line 232 is minimized, thereby improving signal transmission efficiency and improving the working efficiency of the functional element 10.

[0061] In some embodiments, refer to Figure 3 The computing island 121 includes at least a first interface circuit 31 and a second interface circuit 32, combined with Figure 2 The first interface circuit 31 is electrically connected to the first connecting line 21, and the second interface circuit 32 is used to connect external devices.

[0062] For example, the first interface circuit 31 is used to process the signals of the first connection line 21. For instance, the first interface circuit 31 can convert the serial signals transmitted by the first connection line 21 into high-speed parallel signals.

[0063] For example, the second interface circuit 32 may include a camera interface and / or a screen interface, wherein the camera interface is used to connect a camera, and the screen interface is used to connect a screen. For example, the camera interface adopts the MIPICSI protocol interface, and the screen interface adopts the MIPIDSI protocol interface.

[0064] The MIPI CSI (Mobile Industry Processor Interface Camera Serial Interface) interface is a high-speed, low-power interface standard used to connect image sensors and processors.

[0065] MIPIDSI (Mobile Industry Processor Interface Display Serial Interface) is an open standard interface designed specifically for mobile application processors, primarily used to connect processors and displays.

[0066] In some embodiments, refer to Figure 3 The computing island 121 includes a first processing circuit 41, wherein the first processing circuit 41 is coupled to a first interface circuit 31 and a second interface circuit 32, and the first processing circuit 41 is used to perform data interaction with the first interface circuit 31 and the second interface circuit 32.

[0067] For example, the first processing circuit 41 includes a graphics processing sub-circuit, a central processing sub-circuit, and a neural network processing sub-circuit, wherein the first output terminal of the central processing sub-circuit is connected to the control terminal of the graphics processing sub-circuit; and the second output terminal of the central processing sub-circuit is connected to the control terminal of the neural network processing sub-circuit.

[0068] For example, the graphics processing sub-circuit is used to process data from the screen interface, and the neural network processing module is used to process data from the camera interface.

[0069] It should be noted that the graphics processing subcircuit is configured to render images and perform calculations; the central processing subcircuit is configured to perform complex logic operations and issue decision instructions; and the neural network processing subcircuit is configured to accelerate the operation of neural networks.

[0070] The graphics processing subcircuit is relatively simple in structure, with numerous computing units and a very long pipeline, making it particularly suitable for processing large amounts of uniform data. The graphics processor cannot operate independently; it requires control and invocation from the central processing subcircuit to function.

[0071] The neural network processing sub-circuit can also solve the problem of low efficiency of traditional chips in neural network operations, and is particularly good at processing massive multimedia data such as video and images.

[0072] Reference Figure 4 In some embodiments, the storage island 111 includes a plurality of memory 110, which are stacked in a first direction X, and each memory 110 is coupled to a first connection line 21 and a second connection line 22 respectively.

[0073] For example, the memory 110 is configured to store data and perform read and write operations; the memory 110 is coupled to the first connection line 21 and the second connection line 22 respectively, and the memory 110 is capable of storing and reading / writing the data transmitted by the first connection line 21 and the second connection line 22.

[0074] It should be noted that the specific number of the aforementioned memory 110 is not limited. Stacking multiple memory units 110 can improve space utilization.

[0075] Reference Figure 5 In some embodiments, the security island 131 includes a second processing circuit 42 and a third interface circuit 33. The second processing circuit 42 is coupled to the third interface circuit 33, and the third interface circuit 33 is electrically connected to the second connection line 22. The second processing circuit 42 is used to process the data transmitted by the third interface circuit 33.

[0076] For example, the second processing circuit 42 can be a microcontroller unit (MCU), and the second processing circuit 42 includes an encryption authentication sub-circuit, a secure startup sub-circuit, a fault detection and diagnosis sub-circuit, a data backup and recovery sub-circuit, a memory protection sub-circuit, and a secure timer sub-circuit.

[0077] The encryption and authentication sub-circuit is used for encrypting program code and authenticating communication identities, ensuring the confidentiality and authenticity of data.

[0078] The secure bootloader circuit ensures that only authorized and verified software can start and run, preventing the loading of malware.

[0079] The fault detection and diagnosis sub-circuit is used to monitor the internal status in real time, quickly detect faults, and issue alarms.

[0080] The data backup and recovery subcircuit is used to regularly back up critical data for recovery in the event of a failure.

[0081] The memory protection sub-circuit is used to protect the memory.

[0082] The safety timer sub-circuit is used to prevent the program from crashing or entering an infinite loop.

[0083] The second processing circuit 42 is provided in the aforementioned safety island 131, which can improve data processing capabilities on the one hand, and perform real-time data monitoring on the other hand, to ensure the safe operation of the functional island 1.

[0084] In one possible implementation, the power management island 141 includes a third processing circuit 43 for supplying power to the computing island 121, the storage island 111, and the security island 131.

[0085] For example, the third processing circuit 43 may be a power management integrated circuit (PMIC).

[0086] Power management integrated circuits are responsible for the conversion, distribution, detection, and other power management functions of electrical energy in electronic equipment systems. They are the heart of the power supply for all electronic equipment.

[0087] Reference Figure 1 In some embodiments, a heat dissipation structure 5 is also included. The heat dissipation structure 5 is disposed on the side of the computing island 121 away from the computing island substrate 122, and the heat dissipation structure 5 is in contact with the computing island 121.

[0088] For example, the heat dissipation structure 5 is disposed on the side of the computing island 121 away from the computing island substrate 122. Since the computing island 121 generates a lot of heat during operation, the heat dissipation structure 5 is disposed in contact with the computing island 121, which is conducive to the rapid heat dissipation of the computing island 121, so as to avoid failure due to overheating of the computing island 121.

[0089] Reference Figure 1 In some embodiments, a shielding cover 6 is also included, which covers multiple functional modules and heat dissipation structure 5. The shielding cover 6 is used to shield multiple functional components 10 from electromagnetic interference between them and the external environment.

[0090] For example, by providing a shield 6, electromagnetic interference between multiple functional components 10 and the external environment can be reduced, thereby ensuring the stable operation of the vehicle electronic system in a complex electromagnetic environment.

[0091] This application also provides a vehicle that includes the SIP module of any of the above embodiments. Therefore, the vehicle provided by this application has all the beneficial effects of the SIP module provided by any of the above embodiments, which will not be elaborated here.

[0092] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A SIP module, characterized in that, include: Multiple functional elements (10) are stacked sequentially along a first direction (X). At least two functional elements (10) are staggered and overlapped in the first direction (X). The first direction (X) is the thickness direction of the multiple functional elements (10). Each of the functional elements (10) includes a functional island (1) and a substrate (2), wherein the functional island (1) is disposed on the substrate (2) and is disposed alternately with respect to the first direction (X).

2. The SIP module according to claim 1, characterized in that, include: The first functional element (11) includes a memory island (111) and a memory island substrate (112); The second functional element (12) includes a computing island (121) and a computing island substrate (122). The second functional element (12) is disposed on the side of the storage island (111) away from the storage island substrate (112), and the first functional element (11) and the second functional element (12) are offset and overlapped in the first direction (X). A first connecting line (21) extends along the first direction (X) and electrically connects the computing island (121) to the storage island (111) by passing through the computing island substrate (122).

3. The SIP module according to claim 2, characterized in that, Also includes: The third functional element (13) is disposed on the side of the first functional element (11) away from the second functional element (12). The first functional element (11) and the third functional element (13) are offset and overlapped in the first direction (X). The third functional element (13) includes a safety island (131) and a safety island substrate (132). A second connecting line (22) extends along the first direction (X) and electrically connects the security island (131) to the storage island (111) by passing through the storage island substrate (112).

4. The SIP module according to claim 3, characterized in that, Also includes: A fourth functional element (14) is disposed on the side of the third functional element (13) away from the first functional element (11). The fourth functional element (14) is offset and overlapped with the first functional element (11), the second functional element (12), and the third functional element (13) in the first direction (X). The fourth functional element (14) includes a power management island (141) and a power management island substrate (142). The third connecting line (23) extends along the first direction (X). The third connecting line (23) includes a first sub-connecting line (231), a second sub-connecting line (232), and a third sub-connecting line (233). The first sub-connecting line (231) electrically connects the power management island (141) to the computing island (121) by passing through the computing island substrate (122). The second sub-connecting line (232) electrically connects the power management island (141) to the storage island (111) by passing through the storage island substrate (112). The third sub-connecting line (233) electrically connects the power management island (141) to the security island (131) by passing through the security island substrate (132).

5. The SIP module according to claim 4, characterized in that, The first sub-connecting line (231) does not overlap with the first functional element (11) and the third functional element (13) in the first direction (X), and the second sub-connecting line (232) does not overlap with the third functional element (13) in the first direction (X).

6. The SIP module according to claim 5, characterized in that, The computing island (121) includes at least a first interface circuit (31) and a second interface circuit (32). The first interface circuit (31) is electrically connected to the first connecting line (21), and the second interface circuit (32) is used to connect external devices.

7. The SIP module according to claim 6, characterized in that, The computing island (121) includes a first processing circuit (41), wherein the first processing circuit (41) is coupled to the first interface circuit (31) and the second interface circuit (32), and the first processing circuit (41) is used to process the data transmitted by the first interface circuit (31) and the second interface circuit (32).

8. The SIP module according to claim 4, characterized in that, The storage island (111) includes a plurality of memory (110), which are stacked in the first direction (X), and each memory (110) is coupled to the first connecting line (21) and the second connecting line (22).

9. The SIP module according to claim 4, characterized in that, The security island (131) includes a second processing circuit (42) and a third interface circuit (33). The second processing circuit (42) is coupled to the third interface circuit (33), and the third interface circuit (33) is electrically connected to the second connecting line (22). The second processing circuit (42) is used to process the data transmitted by the third interface circuit (33).

10. The SIP module according to claim 4, characterized in that, The power management island (141) includes a third processing circuit (43) for supplying power to the computing island (121), the storage island (111), and the security island (131).

11. The SIP module according to any one of claims 2 to 10, characterized in that, It also includes a heat dissipation structure (5), which is disposed on the side of the computing island (121) away from the computing island substrate (122) and is in contact with the computing island (121).

12. The SIP module according to claim 11, characterized in that, Also includes: A shielding cover (6) covers the plurality of functional modules and the heat dissipation structure (5). The shielding cover (6) is used to shield the plurality of functional components (10) from electromagnetic interference between them and the external environment.

13. A vehicle, characterized in that, The SIP module includes any one of claims 1 to 12 above.

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