A lightweight photovoltaic multilayer structure assembly and a process for its production

Abstract

The present application relates to photovoltaic module preparation technical field, disclose a kind of lightweight photovoltaic multilayer structure module and preparation process thereof.Lightweight photovoltaic multilayer structure module includes front plate, upper layer adhesive film layer, cell piece, conductive composite layer, lower layer adhesive film layer, third double-sided adhesive layer and bottom plate, which are sequentially stacked from top to bottom.The conductive composite layer is composed of double-sided adhesive, tin paste layer and copper foil layer.The size of the bottom plate is greater than or equal to the overall size of the conductive composite layer, the size of the lower layer adhesive film layer is greater than or equal to the size of the bottom plate, and the size of the front plate is greater than or equal to the size of the bottom plate.By using the multilayer composite structure and copper foil conductive layer, the chemical etching process is eliminated, and the technical problems of waste, pollution, brittleness and low yield in traditional process are solved.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic module manufacturing technology, and in particular to a lightweight photovoltaic multilayer structure module and its manufacturing process. Background Technology

[0002] As a core component of photovoltaic power generation, the manufacturing process of small photovoltaic modules for consumer electronics directly affects product performance and production efficiency. Traditional small photovoltaic modules for consumer electronics are generally manufactured using conventional PCB rigid board etching and stringing processes. The substrate is copper-clad laminate, and excess copper is removed through chemical etching, retaining only local conductive lines. This traditional process has significant technical drawbacks: First, the process suffers from significant material waste, low production efficiency, and pollution. The etching process requires the corrosion of large quantities of copper, resulting in low copper utilization and incomplete recycling. The etching process uses highly corrosive chemical solutions, leading to high wastewater treatment costs and significant environmental pollution risks. Furthermore, the etching process is cumbersome, has low automation, slow mass production cycle, and low production efficiency.

[0003] Secondly, the product structure is brittle and has poor damage resistance. Traditional rigid plate structures directly attach battery cells, which are only a few hundred micrometers thick, to the surface of a rigid substrate. The battery cells lack a flexible buffer covering structure, resulting in high overall hardness and poor toughness. Even slight pressure or bending can produce structural noise, and the battery cells are extremely prone to microcracks and breakage. Minor deformations can directly lead to product scrap.

[0004] Third, the production yield is low and the overall cost is high. The defect rate of traditional etching process is as high as 20% to 30%. In the process of processing, the cells need to be reflowed or serially soldered before lamination. The processing steps are complicated, and the serial soldering process inevitably produces defects such as poor soldering, desoldering, short circuit of solder balls, and high temperature burn of cells, resulting in extremely low first-pass yield. Finished products are very easy to be bumped and damaged during transportation, assembly and assembly, which further increases the end-user loss. The industry's products are generally priced high, and the cost of use for customers is expensive.

[0005] Fourth, application scenarios are limited. Traditional rigid boards cannot be bent or deformed, and are only suitable for flat, rigid installation. They cannot adapt to complex working conditions such as irregular assembly, dynamic pressing, and fitting in narrow spaces in consumer electronics, resulting in poor adaptability.

[0006] In summary, existing PCB-etched rigid photovoltaic modules suffer from numerous industry pain points, including significant material waste, severe pollution, low efficiency, high brittleness, easy breakage, low yield, and poor adaptability. Therefore, there is an urgent need to develop a lightweight photovoltaic module with a novel structure and manufacturing process. Summary of the Invention

[0007] The main objective of this invention is to provide a lightweight photovoltaic multilayer structure module and its manufacturing process. The module adopts a multilayer composite bonding structure with a copper foil conductive layer, eliminating the chemical etching process and solving the technical problems of high waste, high pollution, high brittleness, and low yield of traditional processes.

[0008] To achieve the above objectives, in a first aspect, the present invention provides a lightweight photovoltaic multilayer structure module, comprising a front panel, an upper adhesive film layer, a solar cell, a conductive composite layer, a lower adhesive film layer, a third double-sided adhesive layer, and a base plate stacked sequentially from top to bottom; Both the upper and lower surfaces of the battery cell are fitted with anti-microcrack film, which is made of synthetic glass fiber material; the conductive composite layer is composed of double-sided adhesive, solder paste layer and copper foil layer; the size of the base plate is greater than or equal to the overall size of the conductive composite layer, the size of the lower adhesive film layer is greater than or equal to the size of the base plate, and the size of the front plate is greater than or equal to the size of the base plate.

[0009] Optionally, in a first implementation of the first aspect of the present invention, the conductive composite layer includes a first double-sided adhesive, a solder paste layer, a copper foil layer, and a second double-sided adhesive that are sequentially bonded together.

[0010] Optionally, in a second implementation of the first aspect of the present invention, the thickness of the first double-sided adhesive and the second double-sided adhesive are each independently set to 0.03-0.2 mm; the thickness of the solder paste layer is 0.01-0.5 mm; and the thickness of the copper foil layer is 0.01-0.05 mm.

[0011] Optionally, in a third implementation of the first aspect of the present invention, the front panel material is any one of ETFE, PET, glass, CPC or fiberglass board, and the thickness of the front panel is set to 0.1 to 5 mm.

[0012] Optionally, in a fourth implementation of the first aspect of the present invention, the base plate is made of any one of PET, CPC, fiberglass board, non-woven fabric, metal plate or glass, and the thickness of the base plate is set to 0.1 to 5 mm.

[0013] Optionally, in a fifth implementation of the first aspect of the present invention, the basis weight of both the upper adhesive film layer and the lower adhesive film layer is 100-600 g / m³. 2 .

[0014] Optionally, in a sixth implementation of the first aspect of the present invention, the front plate, the upper adhesive film layer, the battery cell, the conductive composite layer, the lower adhesive film layer, and the bottom plate are integrally laminated into an integrated structure.

[0015] Optionally, in the seventh implementation of the first aspect of the present invention, the conductive composite layer is a pre-cut integral die-cut part, which is integrally bonded and assembled between the battery cell and the lower adhesive film layer.

[0016] Secondly, the present invention also provides a manufacturing process for a lightweight photovoltaic multilayer structure module, used to prepare any of the above-mentioned lightweight photovoltaic multilayer structure modules, comprising the following steps: S100 Base Plate Pretreatment: Select a base plate of specified material and thickness, and pre-set an opening area in the base plate; S200 conductive composite layer prefabrication: with copper foil as the core, double-sided adhesive is applied to the top and bottom and a solder paste layer is applied. The resulting semi-finished product is protected by release film on the top and bottom surfaces. S300 battery cell mounting: Peel off the release liner of the conductive composite layer, sequentially attach the lower adhesive layer and the die-cut conductive composite layer on the substrate, and use double-sided adhesive for positioning. Then, mount the battery cell onto the solder paste printing area so that the positive and negative electrodes of the battery cell pass through the opening area to the reverse side of the substrate; wherein, anti-microcrack film is attached to both the upper and lower surfaces of the battery cell. S400 Multi-layer sequential lamination: The upper adhesive film layer and the front panel are sequentially laminated to the semi-finished product to form an integrated multi-layer laminated part; S500 Lamination Conductivity and Shaping: The multi-layered laminate is transferred to the lamination platform and vacuum-laminated as a whole at a high temperature of 140-150℃; after vacuum lamination, it is naturally cooled and shaped. S600 post-processing and forming: After cooling, the components are trimmed and the electrode bonding wires are led out. They are then installed into the outer shell to form a photovoltaic module with a shell, thus completing the finished product preparation.

[0017] Optionally, in the first implementation of the second aspect of the present invention, step S200 adopts a synchronous operation mode of simultaneous die cutting, waste removal and alignment, with each layer of independent molds opening holes in stages to achieve one-time composite molding of multi-layer structures.

[0018] In summary, the lightweight photovoltaic multilayer structure module and its manufacturing process provided by this invention, by employing a multilayer composite bonding structure combined with a copper foil conductive layer, has the following significant advantages compared to existing traditional etched rigid photovoltaic modules: (1) The process is green and environmentally friendly, with high material utilization and significantly improved mass production efficiency. This invention eliminates the strong acid and strong alkali chemical etching process, with no corrosive waste liquid or waste residue discharge, making production green and environmentally friendly; it adopts whole copper foil die-cutting, and the excess copper material is neatly disposed of and can be directly recycled, with a copper material utilization rate far higher than that of traditional etching processes; the entire process of bonding, die-cutting, and laminating is fully automated, with compact processes, suitable for large-scale industrial production.

[0019] (2) Multi-layer composite buffer structure with excellent mechanical properties. The present invention sets two layers of anti-microcrack film and two or more layers of adhesive film to cover the battery cell, and forms a flexible buffer structure with multiple sets of double-sided adhesive layers; it completely changes the traditional rigid and brittle structure of hard plate, and the finished product can be bent and pressed moderately without cracking or internal noise, and the battery cell is not prone to microcracks; the structure has strong impact resistance and can pass the drop test, and is not easily damaged by bumps during transportation and assembly.

[0020] (3) The graded size encapsulation design provides stronger sealing and protection. The present invention limits the layer size: front plate ≥ bottom plate, bottom plate ≥ conductive composite layer, and lower adhesive film layer encapsulates the bottom plate, forming a tiered encapsulation structure with larger outer layers and smaller inner layers. It has excellent dustproof, moisture-proof, insulation, and short-circuit protection performance, and stronger overall structural integrity. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0023] Figure 1 These are schematic diagrams of a lightweight photovoltaic multilayer structure module according to an embodiment of the present invention from two different perspectives; Figure 2 This is a left-side layered schematic diagram of a lightweight photovoltaic multilayer structure module according to an embodiment of the present invention; Figure 3 This is a process flow diagram of the fabrication process of a lightweight photovoltaic multilayer structure module according to an embodiment of the present invention; Figure 4 This is a schematic diagram illustrating the fabrication process of the multilayer bonding component in a lightweight photovoltaic multilayer structure module according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the fabrication process of a lightweight photovoltaic multilayer structure module according to an embodiment of the present invention.

[0024] Illustration: 1. Front panel; 2. Upper adhesive film layer; 3. Battery cell; 31. Anti-microcrack film; 4. First double-sided adhesive; 5. Solder paste layer; 6. Copper foil layer; 7. Second double-sided adhesive; 8. Lower adhesive film layer; 9. Third double-sided adhesive layer; 10. Base plate.

[0025] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0027] Reference Figure 1 and Figure 2 This embodiment provides a lightweight photovoltaic multilayer structure module, including a front panel 1, an upper adhesive film layer 2, a battery cell 3, a conductive composite layer, a lower adhesive film layer 8, a third double-sided adhesive layer 9, and a base plate 10 stacked from top to bottom. Both the upper and lower surfaces of the battery cell 3 are fitted with anti-microcrack membranes 31, which are made of synthetic glass fiber material. The conductive composite layer is composed of double-sided adhesive, solder paste layer 5, and copper foil layer 6. The dimensions of the base plate 10 are greater than or equal to the overall dimensions of the conductive composite layer, the dimensions of the lower adhesive film layer 8 are greater than or equal to the dimensions of the base plate 10, and the dimensions of the front plate 1 are greater than or equal to the dimensions of the base plate 10. This achieves full-circumference sealing, improving the overall structural integrity and protection.

[0028] In this embodiment, by employing a multi-layer composite bonding structure with a copper foil conductive layer, the strong acid and alkali chemical etching process is eliminated, resulting in no corrosive waste liquid or residue discharge, making production green and environmentally friendly. The use of whole-sheet copper foil die-cutting ensures that excess copper is neatly disposed of and directly recycled, resulting in a copper utilization rate far exceeding that of traditional etching processes. The entire process of bonding, die-cutting, and laminating is automated, with a compact workflow suitable for large-scale industrial production. Simultaneously, by setting two layers of anti-microcrack film 31 and two layers of adhesive film to cover the battery cell 3, combined with a double-sided adhesive layer, a flexible buffer structure is formed. This completely changes the traditional rigid and brittle structure of hard boards, allowing the finished product to be moderately bent and pressed without deformation or internal noise, and the battery cell 3 is less prone to microcracks. The structure has strong impact resistance, passing drop tests, and is not easily damaged during transportation and assembly. Furthermore, by strictly defining the layer dimensions: front plate 1 ≥ bottom plate 10, bottom plate 10 ≥ conductive composite layer, and lower adhesive film layer 8 covering bottom plate 10, a tiered covering structure with larger outer layers and smaller inner layers is formed, resulting in excellent dustproof, moisture-proof, insulation, and short-circuit protection performance, and stronger overall structural integrity.

[0029] In one embodiment, both the front plate 1 and the bottom plate 10 are made of weather-resistant insulating material with a thickness ranging from 0.02 to 5 mm. The front plate 1 is made of any one of ETFE, PET, glass, CPC, or fiberglass board, and its thickness is set to 0.1 to 5 mm. The bottom plate 10 is made of any one of PET, CPC, fiberglass board, non-woven fabric, metal plate, or glass, and its thickness is set to 0.1 to 5 mm.

[0030] Among them, ETFE material has the best weather resistance and strong UV resistance, making it suitable for outdoor use; PET material has uniform light transmission, low cost, and good flexibility, making it suitable for mass production of consumer electronics; glass has the highest light transmittance and is scratch and wear resistant; fiberglass board has high rigidity and high insulation level, making it suitable for high protection level products.

[0031] The base plate 10 is made of any one of PET, CPC, fiberglass board, non-woven fabric, metal plate or glass, and the thickness of the base plate 10 is set to 0.1 to 5 mm. As the bottom load-bearing substrate, the base plate 10 mainly plays the roles of support, waterproofing and moisture-proofing, insulation, bearing the printed solder paste, and bearing the pressure of multi-layer bonding. Therefore, the base plate 10 should preferably be made of board material with high flatness, low shrinkage rate, and high temperature resistance without deformation.

[0032] This invention limits the thickness of the front plate 1 and the bottom plate 10 to the range of 0.1 to 5 mm, which is different from the traditional rigid plate design with a single fixed thickness. The wide thickness range can adapt to the different product requirements such as thin and portable, thick protection, and high strength and drop resistance. At the same time, with the layered size structure design of this invention, the front plate 1 and the bottom plate 10, together with the adhesive film layer, form a protective system that covers the product from the outside to the inside, further improving the overall structural sealing, impact resistance and structural flatness, ensuring that the laminated product is free from warping, delamination and bubbles, and greatly improving batch consistency.

[0033] In one embodiment, the basis weight of both the upper adhesive film layer 2 and the lower adhesive film layer 8 is 100–600 g / m². 2 Specifically, the upper and lower two or more layers of the adhesive film are made of photovoltaic-specific ethylene-vinyl acetate copolymer material, i.e., EVA, with an areal density of 100–600 g / m³. 2 It is a solid, non-adhesive film at room temperature, and achieves bonding and encapsulation through high-temperature lamination and melting. It should be noted that the number of upper and lower adhesive film layers can be adjusted according to the specific requirements of different application scenarios, which is also within the scope of patent protection of this invention.

[0034] Furthermore, this invention adds a microcrack prevention film 31 to the upper and lower surfaces of the battery cell 3, respectively. The microcrack prevention film 31 is made of synthetic glass fiber material. The synthetic glass fiber film has a dense, interwoven glass fiber structure, and the material itself has both fiber toughness and rigid support characteristics. Unlike ordinary soft adhesive films, this material has excellent tensile strength, deformation resistance, and impact resistance. The microcrack prevention film 31 is tightly adhered to both sides of the battery cell 3. After high-temperature lamination, the outer adhesive film layer melts and covers the microcrack prevention film 31, and the microcrack prevention film 31 tightly covers the battery cell 3. The rigid fiber structure of the glass fiber itself forms a flexible support and protection for the battery cell 3, limiting local deformation of the battery cell 3, buffering external impact pressure, and reducing the risk of microcracks and breakage during bending, pressure, and drops of the battery cell 3.

[0035] Specifically, the synthetic glass fiber material is composed of any one or more of the following: alkali-free E glass fiber, modified silicate glass fiber, polymer-impregnated modified glass fiber, and continuous filament glass fiber. This type of synthetic glass fiber material has high insulation, good light transmittance, high temperature resistance, stable fiber interwoven structure, is suitable for vacuum high-temperature lamination process, and has excellent compatibility with EVA film adhesion.

[0036] In one embodiment, the conductive composite layer comprises a first double-sided adhesive 4, a solder paste layer 5, a copper foil layer 6, and a second double-sided adhesive 7, which are sequentially bonded together. Specifically, the conductive composite layer is composed of the first double-sided adhesive 4, the solder paste layer 5, the copper foil layer 6, and the second double-sided adhesive 7. The copper foil thickness is 0.01–0.05 mm, the thickness of the first double-sided adhesive 4 and the second double-sided adhesive 7 are each independently set to 0.03–0.2 mm, and the thickness of the solder paste layer 5 is 0.01–0.05 mm. The parameters of each layer are precisely matched, taking into account adhesion, conductivity, and insulation protection performance.

[0037] Furthermore, the conductive composite layer is a pre-cut integral die-cut part, which is integrally bonded and assembled between the battery cell 3 and the lower adhesive film layer 8.

[0038] Unlike traditional photovoltaic modules that use a piecemeal assembly method involving layered bonding, manual alignment, and step-by-step stacking, this invention pre-composite the copper foil layer 6, solder paste layer 5, and multiple layers of adhesive into a single structure. A specialized precision die-cutting mold is then used for one-time integral die-cutting, resulting in high dimensional accuracy. The production process relies on real-time positioning with double-sided adhesive to prevent misalignment of the solar cells 3 and copper foil layer 6. The die-cutting process precisely controls the outline of the conductive composite layer, the conductive opening area, the insulating shielding boundary, and the electrode lead-out position, ensuring high consistency in dimensional accuracy and boundary flatness. Simultaneously, excess material is removed during die-cutting, eliminating redundant adhesive and copper materials and avoiding defects such as adhesive overflow, bubbling, misalignment, rough edges, and localized wrinkles during bonding. The conductive composite layer is prefabricated as a single-piece integral component, allowing for direct whole-piece bonding and installation during the final assembly process. This eliminates the need for layer-by-layer bonding of copper foil, adhesive film, and solder paste, greatly simplifying the assembly process, shortening the bonding cycle, and reducing the difficulty of multi-layer alignment. The integral die-cut structure ensures that the internal copper foil circuit is flat without stretching, bubbling, or twisting, avoiding material misalignment, air bubble inclusion, and interlayer misalignment caused by manual layer bonding. Moreover, the integral die-cut part has higher structural strength and greater integrity. During high-temperature lamination, bending tests, and drop impacts, the internal conductive layer is less prone to delamination or localized debonding, ensuring long-term stability and reliability of the conductive circuit.

[0039] In one embodiment, the front panel 1, the upper adhesive film layer 2, the battery cell 3, the conductive composite layer, the lower adhesive film layer 8, and the bottom plate 10 are integrally laminated into an integrated structure.

[0040] This invention employs a one-time, high-temperature lamination process, unlike the traditional rigid board assembly method which involves step-by-step curing, multiple pressing, and the addition of external adhesives. All functional layers complete the entire process of degassing, bonding, welding, melting, curing, and shaping within the same constant temperature and pressure environment. During lamination, the adhesive film layer gradually melts and flows under heat, uniformly filling the gaps around the battery cell 3, the adhesive layer gaps, and the interlayer micropores, expelling air from the interlayer and preventing defects such as bubbles, voids, and delamination. Under the combined action of temperature and pressure, the adhesive layers undergo interfacial wetting, resulting in a tight bond between adjacent materials, forming a seamless, integrated composite structure. This one-time lamination process simultaneously achieves multiple effects: insulation encapsulation, physical bonding, metallurgical conductivity, and structural shaping, eliminating the need for secondary curing, additional welding, and post-reinforcement. The absence of additional welding steps effectively avoids defects such as incomplete soldering, solder detachment, short circuits in solder beads, and high-temperature burns to the battery cell 3, resulting in higher electrical stability. After lamination, the bonding strength between each layer is high, the overall structure is not loose or slipped, and the finished product has excellent resistance to bending, peeling and impact. At the same time, the integrated sealing structure can prevent external moisture, dust and corrosive gases from entering the interior, improve the aging resistance, damp heat resistance and environmental corrosion resistance of the battery cell, and extend the product's service life.

[0041] Furthermore, in this embodiment, the copper foil layer 6 is laid out in a single sheet, with a 3mm conductive substrate width reserved. A 0.5-1mm conductive contact area is exposed through openings in the double-sided adhesive, while the remaining area is insulated and shielded. Multiple BC solar cells are arranged in an array, with the seams concealed by double-sided adhesive to form a black hidden seam structure. Each functional layer is equipped with an independent die-cutting mold, allowing for layered openings and precise alignment. The conductive composite layer semi-finished product is equipped with upper and lower release films, achieving protection throughout the entire production process. The lightweight photovoltaic multilayer structure module provided by this invention possesses drop resistance, compression resistance, and slight deformation tolerance, making it suitable for irregularly shaped installations, curved surface fitting, and assembly in confined spaces in consumer electronics. The process is simplified, material consumption is low, and there are no high environmental treatment costs, resulting in controllable mass production costs.

[0042] Optionally, in the embodiments of this application, the first double-sided adhesive layer 4, the second double-sided adhesive layer 7, and the third double-sided adhesive layer 9 are all pressure-sensitive insulating adhesive layers, using any one of the following equivalent adhesive materials: double-sided adhesive, PI film, acrylic pressure-sensitive adhesive film, cotton paper double-sided adhesive, and silicone film; their thicknesses are all independently set to 0.03–0.2 mm. In this invention, each double-sided adhesive layer is not limited to ordinary double-sided adhesive; it can be replaced by an equivalent pressure-sensitive insulating adhesive film with the same function and operating conditions. The material selection is flexible and adaptable to mass production requirements with different temperature resistance, aging resistance, and insulation levels.

[0043] See Figures 3-5 This application also provides a manufacturing process for a lightweight photovoltaic multilayer structure module.

[0044] The manufacturing process of this invention comprises six core steps: pretreatment of the substrate 10, prefabrication of the conductive composite layer, mounting of the battery cells 3, multi-layer sequential lamination, lamination for conductivity and shaping, and post-processing molding. The entire process utilizes an automated assembly line, eliminating chemical etching and separate soldering steps. It employs an integrated operation mode that combines die-cutting, waste removal, and lamination, relying on double-sided adhesive to prevent chip misalignment and using high-temperature lamination at 140–150°C to achieve metallurgical conductivity through solder paste, simplifying the production process and reducing production costs.

[0045] S100 Base plate 10 pretreatment: Select a base plate 10 with specified material and thickness, and pre-set an opening area in the base plate 10.

[0046] The base plate 10 is made of weather-resistant insulating material with high flatness, high temperature resistance and low shrinkage rate to ensure that the printed surface is free from warping, unevenness and impurities. The pre-set opening area on the base plate can be pre-drilled or positioned. By setting the opening area on the base plate 10, the positive and negative copper foils pass through the opening area and are attached to the base plate 10 during the bonding process, and then pass out from the back of the base plate 10. This provides a structural basis for the subsequent passage of the three electrodes of the battery cell and the lead-out of the positive and negative electrodes to the back of the base plate 10, ensuring that the electrode lead-out is smooth, without short circuit and without damage.

[0047] S200 conductive composite layer prefabrication: With copper foil as the core, double-sided adhesive is bonded on the top and bottom and solder paste layer 5 is laminated. The resulting semi-finished product is protected by release film on the top and bottom surfaces.

[0048] Specifically, multiple independent molds are used to simultaneously die-cut, open holes, and automatically remove waste from each layer. The conductive composite layer is pre-formed in the preceding process, making the copper foil, solder paste, and upper and lower adhesive layers a single integrated component, avoiding alignment deviations caused by later layer bonding. The resulting semi-finished product is coated with release films on both sides, which can isolate dust during transportation, die-cutting, and storage, prevent the adhesive layers from sticking prematurely, and prevent copper foil oxidation and discoloration, ensuring material cleanliness and interface activity. Independent die-cutting molds are configured for the copper foil, adhesive layer, and insulation area to achieve layered opening, differentiated cutting, and simultaneous automatic waste removal, accurately reserving conductive contact areas and insulating shielding areas, and removing excess edge waste, making the composite layer boundary flat, burr-free, and free from stretching deformation, improving bonding accuracy and product consistency.

[0049] In one embodiment, step S200 employs a simultaneous operation method of die-cutting, waste removal, and alignment. Each layer's independent mold is used for step-by-step opening, achieving a multi-layer structure in a single composite molding process. During the prefabrication of the conductive composite layer, due to differences in the material characteristics, thickness, hardness, and die-cutting performance of the copper foil, double-sided adhesive, solder paste layer 5, and release film, traditional one-time die-cutting can easily lead to problems such as cut-through, burrs, adhesion, and misalignment. This invention sets up independent dedicated molds for different functional layers within the conductive composite layer, performing step-by-step die-cutting and layer-by-layer cutting according to the preset contour and opening positions, ensuring precise matching of the opening positions, dimensions, and insulation clearance areas of each functional layer. Simultaneously with die-cutting, waste ejection, automatic waste removal, position correction, and online alignment detection are completed, achieving simultaneous execution of the three processes of die-cutting, waste removal, and alignment, avoiding defects such as waste residue, adhesive adhesion, and interlayer misalignment. By combining synchronous operation with step-by-step drilling, multi-layer composite molding can be completed in one go while ensuring die-cutting accuracy, which greatly improves prefabrication efficiency and dimensional consistency, and makes the conductive composite layer have higher structural stability and assembly versatility in subsequent bonding and lamination processes.

[0050] S300 Cell 3 Mounting: Peel off the release liner of the conductive composite layer, sequentially attach the lower adhesive layer 8 and the die-cut conductive composite layer on the base plate 10, and use double-sided adhesive for positioning. Then mount the cell 3 onto the solder paste printing area so that the positive and negative electrodes of the cell 3 pass through the opening area to the reverse side of the base plate 10. Anti-microcrack film 31 is attached to both the upper and lower surfaces of the cell 3. During the mounting process, anti-microcrack film 31 is attached to both the front and back sides of the cell 3, ensuring complete coverage of the light-receiving and back-lighting surfaces. The film is positioned synchronously with the cell 3 during mounting, and after lamination, it is wrapped and cured by the adhesive layer to form an integrated anti-microcrack protection structure.

[0051] Specifically, double-sided adhesive is used to bond and position the base plate 10 and the lower adhesive film layer 8, and also to bond and position the lower adhesive film layer 8 and the conductive composite layer. Further, a pick-and-place machine picks up the cells from the tray and precisely mounts the monocrystalline BC solar cells onto the solder paste printing area of ​​the base plate 10, utilizing the adhesive properties of the double-sided adhesive for immediate positioning and preventing misalignment. This step uses an automated pick-and-place machine to complete the picking, alignment, and bonding of the solar cells 3, ensuring precise and controllable placement. Utilizing the room-temperature pressure-sensitive adhesive layer, the solar cells 3 can be temporarily fixed without heating, maintaining a constant position before entering the lamination process and preventing slippage, misalignment, or rotation caused by production line vibration or multi-layer lamination compression. Compared to traditional non-positioning bonding processes, this positioning method requires no adhesive curing, no heating for shaping, and no auxiliary fixtures. It has a simple structure and high positioning reliability, effectively reducing the defect rate of chip misalignment and improving production first-pass yield.

[0052] S400 Multi-layer sequential lamination: The upper adhesive film layer 2 and the front panel 1 are sequentially laminated to the obtained semi-finished product to form an integrated multi-layer laminated part.

[0053] During the lamination process, each layer is precisely pressed and laminated in sequence from bottom to top, from soft to hard, and from functional layer to protective layer, with air venting layer by layer. Peeling off the release liner on one side allows the upper protective film to continuously protect the conductive composite layer, preventing dust adsorption, adhesive contamination, and copper foil oxidation during lamination. The multi-layer sequential lamination method releases interlayer air layer by layer, avoiding air bubbles caused by large-area lamination. The uniform lamination pressure and precise alignment of each layer effectively eliminate lamination defects such as wrinkles, misalignment, excess adhesive, and voids, ensuring a flat and dense laminated structure.

[0054] S500 Lamination Conductive Shaping: The multi-layered laminate is transferred to the lamination platform and vacuum-laminated as a whole under high temperature conditions of 140-150℃; after vacuum lamination, it is naturally cooled and shaped.

[0055] The high temperature and pressure of lamination enable reliable electrical conductivity between solder paste, copper foil, and battery cell 3, eliminating the need for a separate traditional soldering process. This temperature range is the optimal process range for solder paste melting and activation, and for the adhesive film layer softening and flowing. It avoids burning the ultra-thin battery cell 3 due to excessively high temperatures, and prevents poor adhesion and conductivity due to excessively low temperatures. Under constant temperature conditions, the solder paste melts uniformly and wets the metal interface, forming a dense metallurgical conductive structure between the battery cell 3 electrodes, solder paste, and copper foil, exhibiting strong conductivity stability and low contact resistance. Simultaneously, the adhesive film layer melts and flows, filling the tiny gaps between layers, expelling residual air, and forming a high-strength sealed and insulating structure after cooling and solidification. A single lamination process simultaneously achieves electrical conductivity, structural bonding, sealing encapsulation, and shape shaping, simplifying the process flow, replacing traditional soldering processes, and completely avoiding the risks of soldering defects.

[0056] S600 post-processing and forming: After cooling, the components are trimmed and the electrode bonding wires are led out. They are then installed into the outer shell to form a photovoltaic module with a shell, thus completing the finished product preparation.

[0057] Specifically, after lamination and cooling, the finished product has a dense and rigid structure with strong interlayer bonding. Excess adhesive is removed from the edges through trimming and excess material removal, resulting in a neat shape and smooth edges. The conductive electrodes are bent and shaped to facilitate later assembly, insertion, and circuit connection. Finally, the outer shell is assembled and neatly stored, completing the finished product packaging. These post-processing steps further optimize the product's appearance, improve assembly versatility, and enhance structural protection, making the finished product suitable for automated assembly, mass production, and complex operating conditions in consumer electronics.

[0058] It should be noted that the solder paste printing machine, automatic chip mounter, precision bonding machine, laminator and other processing equipment used in this invention are all existing mature processing equipment in the field. The structure, working principle and control method of the equipment itself are common knowledge and will not be described in detail in this invention. The improvement of this invention focuses on the stacked structure of photovoltaic modules, material matching, layer size relationship and exclusive manufacturing process.

[0059] In this embodiment, the specific implementation and structural parameters of each step in the above method embodiment are as described in the above structural embodiment, and will not be repeated here.

[0060] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, apparatus, article, or method. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, apparatus, article, or method that includes that element.

[0061] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A lightweight photovoltaic multilayer structure module, characterized in that, It includes a front panel, an upper adhesive film layer, a battery cell, a conductive composite layer, a lower adhesive film layer, a third double-sided adhesive layer, and a bottom plate, which are stacked sequentially from top to bottom. Both the upper and lower surfaces of the battery cell are fitted with anti-microcrack film, which is made of synthetic glass fiber material; the conductive composite layer is composed of double-sided adhesive, solder paste layer and copper foil layer; the size of the base plate is greater than or equal to the overall size of the conductive composite layer, the size of the lower adhesive film layer is greater than or equal to the size of the base plate, and the size of the front plate is greater than or equal to the size of the base plate.

2. The lightweight photovoltaic multilayer structure module according to claim 1, characterized in that, The conductive composite layer comprises a first double-sided adhesive, a solder paste layer, a copper foil layer, and a second double-sided adhesive, which are sequentially bonded together.

3. The lightweight photovoltaic multilayer structure module according to claim 2, characterized in that, The thickness of the first double-sided adhesive and the second double-sided adhesive are each independently set to 0.03-0.2 mm; the thickness of the solder paste layer is 0.01-0.5 mm; and the thickness of the copper foil layer is 0.01-0.05 mm.

4. The lightweight photovoltaic multilayer structure module according to claim 1, characterized in that, The front panel is made of any one of ETFE, PET, glass, CPC, or fiberglass, and the thickness of the front panel is set to 0.1-5mm.

5. The lightweight photovoltaic multilayer structure module according to claim 1, characterized in that, The base plate is made of any one of PET, CPC, fiberglass board, non-woven fabric, metal plate or glass, and the thickness of the base plate is set to 0.1-5mm.

6. A lightweight photovoltaic multilayer structure module according to claim 1, characterized in that, The weight of both the upper and lower adhesive film layers is 100–600 g / m². 2 .

7. A lightweight photovoltaic multilayer structure module according to claim 1, characterized in that, The front panel, upper adhesive film layer, battery cell, conductive composite layer, lower adhesive film layer, and bottom plate are integrally laminated into an integrated structure.

8. A lightweight photovoltaic multilayer structure module according to claim 2, characterized in that, The conductive composite layer is a pre-cut integral die-cut part, which is integrally bonded and assembled between the battery cell and the lower adhesive film layer.

9. A fabrication process for a lightweight photovoltaic multilayer structure module, characterized in that, The method for preparing the lightweight photovoltaic multilayer structure module according to any one of claims 1 to 8 comprises the following steps: S100 Base Plate Pretreatment: Select a base plate of specified material and thickness, and pre-set an opening area in the base plate; S200 conductive composite layer prefabrication: with copper foil as the core, double-sided adhesive is applied to the top and bottom and a solder paste layer is applied. The resulting semi-finished product is protected by release film on the top and bottom surfaces. S300 battery cell mounting: Peel off the release liner of the conductive composite layer, sequentially attach the lower adhesive layer and the die-cut conductive composite layer on the substrate, and use double-sided adhesive for positioning. Then, mount the battery cell onto the solder paste printing area so that the positive and negative electrodes of the battery cell pass through the opening area to the reverse side of the substrate; wherein, anti-microcrack film is attached to both the upper and lower surfaces of the battery cell. S400 Multi-layer sequential lamination: The upper adhesive film layer and the front panel are sequentially laminated to the semi-finished product to form an integrated multi-layer laminated part; S500 Lamination Conductive Shaping: The multi-layered laminate is transferred to the lamination platform and vacuum laminated as a whole under a high temperature of 140-150℃. After vacuum lamination, it is naturally cooled and shaped. S600 post-processing and forming: After cooling, the components are trimmed and the electrode bonding wires are led out. They are then installed into the outer shell to form a photovoltaic module with a shell, thus completing the finished product preparation.

10. The fabrication process of the lightweight photovoltaic multilayer structure module according to claim 9, characterized in that, In step S200, a simultaneous operation method of die-cutting, waste removal and alignment is adopted, and the independent molds of each layer are opened step by step to realize the one-time composite molding of multi-layer structure.

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