Display panel and display device

Abstract

The application provides a display panel and a display device. The display panel comprises: a substrate having a first surface, a second surface and a side surface connecting the first surface and the second surface; a driving circuit layer arranged on the first surface of the substrate and extending from a display area to a non-display area; a side edge wire arranged on the side surface of the substrate and electrically connected with the driving circuit layer; a protection layer covering the side edge wire; a pad layer arranged on one side of the first surface of the substrate and located at least in the display area; the thickness of the part of the pad layer in the display area and the thickness of the part of the driving circuit layer in the display area are summed to be a first thickness; the thickness of the protection layer and the thickness of the side edge wire are summed to be a second thickness; and the difference between the first thickness and the second thickness is less than or equal to 1 micrometer. The display panel reduces the height difference between the protection layer and the display area of the display panel, and improves the pressing effect of the LED.

Description

Technical Field

[0001] This invention relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0002] Display panels, such as Micro-LED displays, are considered the mainstream of future displays due to their advantages such as wide color gamut, high pixel density (Pixels Per Inch, PPI), high brightness, and long lifespan. However, during the LED transfer process, there is a problem with poor LED mounting. Summary of the Invention

[0003] The display panel and display device provided in this application are intended to solve the problem of poor LED pressing during LED transfer in existing display panels.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: providing a display panel having a display area and a non-display area, wherein the non-display area is at least disposed on one side of the display area; the display panel includes:

[0005] The substrate has a first surface and a second surface facing away from each other, and a side surface connecting the first surface and the second surface;

[0006] A driving circuit layer is disposed on the first surface of the substrate and extends from the display area to the non-display area;

[0007] Side traces are provided on the side of the substrate and are electrically connected to the driving circuit layer;

[0008] A protective layer covers the side traces;

[0009] A padding layer is disposed on one side of the first surface of the substrate and is located at least in the display area; wherein, the sum of the thickness of the portion of the padding layer in the display area and the thickness of the portion of the driving circuit layer in the display area is a first thickness; the sum of the thickness of the protective layer and the thickness of the side trace is a second thickness; the difference between the first thickness and the second thickness is less than or equal to 1 micrometer.

[0010] In some embodiments of this application, the padding layer is disposed between the substrate and the driving circuit layer;

[0011] Preferably, the surface of the driving circuit layer facing away from the substrate is flush with the surface of the protective layer facing away from the substrate.

[0012] In some embodiments of this application, the padding layer is disposed on the side of the driving circuit layer opposite to the substrate;

[0013] Preferably, the surface of the padding layer facing away from the substrate is flush with the surface of the protective layer facing away from the substrate.

[0014] In some embodiments of this application, the padding layer is disposed within the driving circuit layer;

[0015] Preferably, the surface of the driving circuit layer facing away from the substrate is flush with the surface of the protective layer facing away from the substrate.

[0016] In some embodiments of this application, the padding layer includes at least one sub-padding layer; the driving circuit layer includes multiple conductive layers and at least one dielectric layer; a dielectric layer is provided between every two adjacent conductive layers; wherein, the at least one sub-padding layer is spaced between the conductive layers and the dielectric layer along the stacking direction of the display panel;

[0017] Preferably, the number of layers of the sub-pad high layer is one layer, and the layer of the sub-pad high layer is located between the conductive layer closest to the substrate and the dielectric layer closest to the substrate;

[0018] Preferably, the driving circuit layer includes an adjacent first conductive layer and a second conductive layer, and a first dielectric layer disposed between the first conductive layer and the second conductive layer, and the sub-pad is disposed between the first conductive layer and the first dielectric layer, or between the first dielectric layer and the second conductive layer.

[0019] In some embodiments of this application, the first thickness is equal to the second thickness, and the thickness of the portion of the padding layer located in the display area is the same as the thickness of the protective layer;

[0020] Preferably, the padding layer includes one sub-padding layer; the thickness of the sub-padding layer is the same as the thickness of the protective layer; or, the padding layer includes multiple sub-padding layers; the sum of the thicknesses of the multiple sub-padding layers is the same as the sum of the thicknesses of the protective layer.

[0021] In some embodiments of this application, the raised layer includes a raised portion and an edge portion; the raised portion is located in the display area; the edge portion is connected to the raised portion and extends into the non-display area, and the thickness of the edge portion gradually decreases in the direction away from the raised portion.

[0022] In some embodiments of this application, a portion of the protective layer extends to one side of the first surface of the substrate and covers the edge portion;

[0023] Preferably, the protective layer is disposed adjacent to or spaced apart from the raised portion in a direction perpendicular to the stacking direction of the display panel.

[0024] In some embodiments of this application, the padding layer includes an organic layer; and / or the protective layer includes an ink layer;

[0025] Preferably, the padding layer and the dielectric layer are made of the same material.

[0026] To solve the above-mentioned technical problems, one technical solution adopted in this application is to provide a display device, which includes the display panel mentioned above.

[0027] The beneficial effects of the embodiments of this application, which differ from the prior art, are as follows: The display panel provided in the embodiments of this application adds a pad layer on one side of the first surface of the substrate, and the pad layer is located at least in the display area; wherein, the sum of the thickness of the portion of the pad layer in the display area and the thickness of the portion of the driving circuit layer in the display area is the first thickness; the sum of the thickness of the protective layer and the thickness of the side trace is the second thickness; the difference between the first thickness and the second thickness is less than or equal to 1 micrometer; in this way, the side trace can be protected by the protective layer, and the height difference between the side surface of the protective layer away from the substrate and the side surface of the driving circuit layer or the pad layer away from the substrate can be reduced by adding the pad layer, so as to reduce the influence of the height difference on the LED transfer when the display panel is transferred, thereby improving the LED pressing effect. Attached Figure Description

[0028] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiments below. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0029] Figure 1 A cross-sectional view of a display panel provided in an embodiment of this application;

[0030] Figure 2 This is a schematic diagram of the stacked structure of the driving circuit layer provided in an embodiment of this application;

[0031] Figure 3 A cross-sectional view of a display panel provided in another embodiment of this application;

[0032] Figure 4 A cross-sectional view of a display panel provided in yet another embodiment of this application;

[0033] Figure 5 A schematic diagram showing the location of the padding layer within the drive circuit layer according to an embodiment of this application;

[0034] Figure 6 A schematic diagram showing the location of the padding layer within the drive circuit layer, as provided in another embodiment of this application;

[0035] Figure 7 A schematic diagram showing the location of the padding layer within the drive circuit layer, as provided in yet another embodiment of this application;

[0036] Figure 8 A cross-sectional view of a display panel provided in another embodiment of this application;

[0037] Figure 9 This is a schematic diagram of the structure of a display device provided in an embodiment of this application.

[0038] Explanation of reference numerals in the attached figures

[0039] 10 Display panel; aa- Display area; bb Non-display area; 1 Substrate; 2 Driving circuit layer; 21 Conductive layer; 22 Dielectric layer; 23 Planarization layer; 3 Light-emitting unit; 31 Micro light-emitting device; 4 Side trace; 5 Protective layer; 6 Pad layer; 61 Sub-pad layer; 62 Pad portion; 63 Edge portion; 7 Circuit layer. Detailed Implementation

[0040] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0041] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0042] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0043] Currently, Micro-LEDs typically use ink to encapsulate the side traces. However, after encapsulation, the height of the ink is higher than the height of the Micro-LED's display area aa. Therefore, during LED transfer, the height difference between the ink and the display area aa can lead to poor LED adhesion and ineffective electrical connection between the LED and the driver circuit layer.

[0044] To address this issue, this application provides a novel display panel. This display panel further designs a high-layer pad in the display area aa, ensuring that the height of the display area aa is consistent with the encapsulation ink. This reduces the impact of height differences on LED pressing, thereby improving the LED pressing effect and enabling effective electrical connection between the LED and the driving circuit layer after LED transfer.

[0045] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0046] Please see Figure 1 , Figure 1 This is a cross-sectional view of a display panel provided in an embodiment of this application; the dashed lines in the figures represent only schematic lines indicating the boundary between the display area aa and the non-display area bb, and do not represent the actual structure of the display panel 10. In this embodiment, a display panel 10 is provided, which includes a display area aa and a non-display area bb. The display area aa is used to display an image; the non-display area bb is at least disposed on one side of the display area aa, serving as the frame of the display panel 10 for wiring. Specifically, the non-display area bb can be disposed around the display area aa; or the non-display area bb can be disposed on opposite sides of the display area aa. The display panel 10 can be a Micro-LED display panel. The display panel 10 includes a substrate 1, a driving circuit layer 2, a light-emitting unit 3, side wiring 4, a protective layer 5, and a padding layer 6.

[0047] The substrate 1 has a first surface and a second surface facing away from each other, and a side surface connecting the first surface and the second surface. Exemplarily, the material of the substrate 1 can be glass or polyimide (PI). The first surface of the substrate 1 faces the display surface of the display panel 10, and the second surface of the substrate 1 faces the non-display surface of the display panel 10.

[0048] A driving circuit layer 2 is disposed on the first surface of the substrate 1 and extends from the display area aa to the non-display area bb. A driving circuit for controlling the light-emitting unit 3 to emit light is disposed within the driving circuit layer 2. The driving circuit layer 2 forms a driving circuit for controlling the light-emitting unit 3 to emit light.

[0049] The light-emitting unit 3 is disposed on the side of the driving circuit layer 2 away from the substrate 1 and is electrically connected to the driving circuit layer 2. Each light-emitting unit 3 includes multiple micro light-emitting devices 31. The micro light-emitting devices 31 can be micro light-emitting diodes (LEDs), using LED crystals of 1 to micrometer size to realize a display screen with pixel particles of 0.05 mm or smaller. In this embodiment, the light-emitting unit 3 includes micro light-emitting devices 31 with red, green, and blue light-emitting colors. Three micro light-emitting devices 31 with different colors can be arranged in an array to form a light-emitting unit 3, and multiple light-emitting units 3 can also be arranged in an array on the substrate 1.

[0050] In some embodiments, the display panel 10 further includes a circuit layer 7 disposed on the second surface of the substrate 1 and connectable to a driver chip (not shown). Side traces 4 are disposed on the side surface of the substrate 1, with one end electrically connected to the driver circuit layer 2 and the other end connected to the circuit layer 7, such that the circuit layer 7 and the driver circuit layer 2 are electrically connected via the side traces 4, thereby enabling the driver chip to provide drive signals to the driver circuit layer 2 via the side traces 4. A portion of the side traces 4 may overlap with the driver circuit layer 2. A protective layer 5 covers the side traces 4 to protect them. The protective layer 5 may include an ink layer.

[0051] Among them, see Figure 2 , Figure 2 This is a schematic diagram of the stacked structure of the driving circuit layer 2 provided in an embodiment of this application; the driving circuit layer 2 includes multiple conductive layers 21 and at least one dielectric layer 22. The at least one conductive layer 21 extends from the display area aa to the non-display area bb and is connected to the driving chip to receive the driving signal provided by the driving chip. A dielectric layer 22 is provided between every two adjacent conductive layers 21.

[0052] In one example, the driving circuit layer 2 further includes a planarization layer 23, which is disposed on the side surface of the conductive layer 21 that is furthest from the substrate 1 in the multilayer conductive layers 21, and is used to planarize the side surface of the driving circuit layer 2 that is furthest from the substrate 1.

[0053] Combination Figure 1The padding layer 6 is disposed on one side of the first surface of the substrate 1, and at least in the display area aa, to increase the overall thickness of the display area aa of the display panel 10. The padding layer 6 being disposed on one side of the first surface of the substrate 1 includes at least three cases: First case: as follows Figure 3 As shown, the padding layer 6 is located on the side of the drive circuit layer 2 facing away from the substrate 1. Second type: as follows Figure 4 As shown, the padding layer 6 is located within the drive circuit layer 2. Third type: As shown... Figure 1 As shown, the padding layer 6 is disposed between the substrate 1 and the driving circuit layer 2. These three cases will be described in detail later.

[0054] The padding layer 6 can be made of an organic layer; organic layers have good uniformity during formation, which can improve the thickness uniformity of the organic layer at various locations. Specifically, the material of the padding layer 6 can be the same as that of the dielectric layer 22. In this way, the padding layer 6 can be further formed using the existing process for preparing the dielectric layer 22, without the need for additional processes and materials, making the process simple and cost-effective.

[0055] Of course, in other embodiments, the padding layer 6 can also be other insulating layers.

[0056] The thickness of the portion of the padding layer 6 located in the display area aa, combined with the thickness of the portion of the driving circuit layer 2 located in the display area aa, constitutes the first thickness H1; the thickness of the protective layer 5, combined with the thickness of the side trace 4, constitutes the second thickness H2; the difference between the first thickness H1 and the second thickness H2 is less than or equal to 1 micrometer. For example, this difference can be 0 micrometers, 0.2 micrometers, 0.4 micrometers, 0.6 micrometers, 0.8 micrometers, or 1 micrometer. All thicknesses mentioned in this application refer to the dimension along the stacking direction Y of the display panel 10.

[0057] In other words, the height difference between the side surface of the structural layer used for bonding with the LED and the side surface of the protective layer 5 that is away from the substrate 1 is less than or equal to 1 micrometer; this height difference is small. In this way, the side trace 4 can be protected by the protective layer 5, and the height difference between the side surface of the protective layer 5 away from the substrate 1 and the side surface of the driving circuit layer 2 or the side surface of the padding layer 6 away from the substrate 1 can be reduced by adding the padding layer 6. Therefore, when the display panel 10 is transferring LEDs, the impact of the height difference between the side surface of the protective layer 5 away from the substrate 1 and the side surface of the driving circuit layer 2 or the side surface of the padding layer 6 away from the substrate 1 on the LED transfer can be reduced, the LED pressing effect can be improved, and the LED can be pressed well on the driving circuit layer 2, so that the LED can be effectively electrically connected to the driving circuit layer 2.

[0058] It should be noted that the protective layer 5 mentioned in this application refers to the part of the protective layer 5 located on the side of the first surface of the substrate 1 that is away from the substrate 1.

[0059] In one embodiment, such as Figure 1 As shown, the padding layer 6 is disposed between the substrate 1 and the driving circuit layer 2. In this way, the padding layer 6 will not affect the distance between two adjacent conductive layers 21 in the driving circuit layer 2, will not increase the depth of the metal interconnect holes between the conductive layers 21, and will not increase the depth of the metal interconnect holes between the LED and the topmost conductive layer 21 in the driving circuit layer 2. The electrical connection between each conductive layer 21 in the driving circuit layer 2 and the lead-out of the topmost conductive layer 21 can still be achieved using the original process, which can save costs.

[0060] It is understood that in this embodiment, the driving circuit layer 2 is used to bond with the LED.

[0061] In this embodiment, the height difference between the side surface of the driving circuit layer 2 facing away from the substrate 1 and the side surface of the protective layer 5 facing away from the substrate 1 is less than or equal to 1 micrometer. Thus, during the LED transfer process, because the height difference between the side surface of the driving circuit layer 2 facing away from the substrate 1 and the side surface of the protective layer 5 facing away from the substrate 1 is small, this height difference has a minimal impact on the LED's adhesion to the driving circuit layer 2, allowing the LED to effectively adhere to the driving circuit layer 2 and achieve effective electrical connection with it.

[0062] As an example, the thickness of the padding layer 6 in the display area aa is the same as the thickness of the protective layer 5 on the side where the first surface of the substrate 1 is located; thus, the side surface of the driving circuit layer 2 facing away from the substrate 1 is flush with the side surface of the protective layer 5 facing away from the substrate 1, so that the LED can be well pressed onto the driving circuit layer 2. It can be understood that in this embodiment, the first thickness H1 is equal to the second thickness H2.

[0063] In another embodiment, see Figure 3 , Figure 3 A cross-sectional view of a display panel 10 provided in another embodiment of this application; another display panel 10 is provided, which is similar to the one described above. Figure 1 The difference between the display panel 10 provided in the corresponding embodiment is that the padding layer 6 is disposed on the side of the driving circuit layer 2 away from the substrate 1, and the height difference between the surface of the padding layer 6 away from the substrate 1 and the surface of the protective layer 5 away from the substrate 1 is less than or equal to 1 micrometer. It can be understood that in this embodiment, the padding layer 6 is used to bond with the LED.

[0064] Specifically, the padding layer 6 can be disposed on the side surface of the planarization layer 23 facing away from the substrate 1.

[0065] In this embodiment, the same applies as described above. Figure 1 In the corresponding embodiment, the padding layer 6 will not affect the distance between two adjacent conductive layers 21 in the drive circuit layer 2; moreover, the padding layer 6 can provide a certain degree of protection for the drive circuit layer 2.

[0066] As an example, the thickness of the pad layer 6 in the display area aa is the same as the thickness of the protective layer 5 on the side where the first surface of the substrate 1 is located; thus, the side surface of the pad layer 6 facing away from the substrate 1 is flush with the side surface of the protective layer 5 facing away from the substrate 1, so that the LED can be well pressed onto the driving circuit layer 2. It can be understood that in this embodiment, the first thickness H1 is equal to the second thickness H2.

[0067] In yet another embodiment, see Figure 4 , Figure 4 This is a cross-sectional view of a display panel 10 provided in another embodiment of this application; yet another display panel 10 is provided, which differs from the display panel 10 provided in any of the above embodiments in that: the padding layer 6 is disposed within the driving circuit layer 2. Thus, in the event that the dielectric layer 22 between two adjacent conductive layers 21 is damaged, potentially leading to a short circuit between the two adjacent conductive layers 21, the padding layer 6 can provide a certain degree of isolation, reducing the risk of a short circuit between the two adjacent conductive layers 21.

[0068] It is understood that in this embodiment, the driving circuit layer 2 is used to bond with the LED.

[0069] In this embodiment, the side surface of the driving circuit layer 2 facing away from the substrate 1 can be flush with the side surface of the protective layer 5 facing away from the substrate 1.

[0070] In this embodiment, the thickness of the padding layer 6 in the display area aa is the same as the thickness of the protective layer 5 on the side where the first surface of the substrate 1 is located. It can be understood that in this embodiment, the first thickness H1 is equal to the second thickness H2.

[0071] As an example, see Figure 5 , Figure 5 This is a schematic diagram showing the position of the padding layer 6 within the driving circuit layer 2 according to an embodiment of this application; the padding layer 6 includes a sub-padding layer 61; the sub-padding layer 61 is disposed between the conductive layer 21 and the dielectric layer 22 along the stacking direction Y of the display panel 10.

[0072] In one specific embodiment, the sub-pad high layer 61 is located between the conductive layer 21 closest to the substrate 1 and the dielectric layer 22 closest to the substrate 1. In this way, the sub-pad high layer 61 can be closer to the substrate 1, so that the sub-pad high layer 61 can transition more smoothly to the edge of the substrate 1, thereby increasing the contact area between the subsequent sub-pad high layer 61 and other structural layers and enhancing the bonding force between the sub-pad high layer 61 and other structural layers.

[0073] In this example, the first thickness H1 can be equal to the second thickness H2, and the thickness of the sub-pad layer 61 can be the same as the thickness of the protective layer 5.

[0074] As another example, see Figure 6 , Figure 6 This is a schematic diagram showing the position of the padding layer 6 within the driving circuit layer 2, according to another embodiment of this application. The padding layer 6 includes multiple sub-padding layers 61. All sub-padding layers 61 are spaced apart along the stacking direction Y of the display panel 10 between the conductive layer 21 and the dielectric layer 22. That is, at least one conductive layer 21 or dielectric layer 22 is provided between two adjacent sub-padding layers 61. In this example, by including multiple sub-padding layers 61 in the padding layer 6, the thickness of a single sub-padding layer 61 can be reduced while ensuring that the overall thickness of the padding layer 6 meets certain requirements. This reduces the influence of the sub-padding layers 61 on the thickness between two adjacent conductive layers 21, ensuring that the thickness between two adjacent conductive layers 21 is within a preset range, guaranteeing effective electrical connection between two adjacent conductive layers 21, and reducing the difficulty of opening metal interconnect holes on two adjacent dielectric layers 22 and sub-padding layers 61.

[0075] In some specific embodiments, see Figure 7 , Figure 7 This is a schematic diagram showing the position of the padding layer 6 within the driving circuit layer 2, according to another embodiment of this application. Two adjacent conductive layers 21 in the driving circuit layer 2 are defined as the first conductive layer and the second conductive layer, respectively, and the dielectric layer 22 disposed between the first conductive layer and the second conductive layer is the first dielectric layer. The sub-padding layer 61 can be disposed between the first conductive layer and the first dielectric layer, or between the first dielectric layer and the second conductive layer.

[0076] In this example, the first thickness H1 can be equal to the second thickness H2, and the sum of the thicknesses of all sub-pad layers 61 is the same as the sum of the thicknesses of the protective layer 5.

[0077] In any of the above embodiments, it can be combined with Figure 3The padding layer 6 may include a raised portion 62 and an edge portion 63. The raised portion 62 is located in the display area aa. The edge portion 63 is connected to the raised portion 62 and extends into the non-display area bb, and the thickness of the edge portion 63 gradually decreases along the direction X away from the raised portion 62. In this way, the padding layer 6 can be smoothly transitioned to better interface with other film layers / protective layers of the display panel 10; and compared with right-angle transitions or solutions with large slopes, the risk of other film layers provided on the side surface of the padding layer 6 away from the substrate 1 cracking or breaking at the turning point of the padding layer 6 due to large slopes can be reduced.

[0078] The protective layer 5 extends to the side of the first surface of the substrate 1 and covers the edge portion 63. That is, the orthographic projection of the protective layer 5 on the substrate 1 covers at least a portion of the orthographic projection of the edge portion 63 on the substrate 1. In this way, during packaging, it is beneficial to eliminate or reduce the height difference between the side surface of the protective layer 5 facing away from the substrate 1 and the side surface of the drive circuit layer 2 or the pad layer 6 facing away from the substrate 1.

[0079] In some embodiments, see Figure 8 , Figure 8 This is a cross-sectional view of a display panel provided in another embodiment of the present application; the protective layer 5 can be disposed adjacent to the raised portion 62 along a direction X perpendicular to the stacking direction Y of the display panel 10. Adjacent disposal means that the protective layer 5 can contact the raised portion 62. In other embodiments, such as... Figure 3 As shown, the protective layer 5 can also be spaced apart from the raised portion 62 along the direction X perpendicular to the stacking direction Y of the display panel 10.

[0080] The display panel 10 provided in this embodiment has a display area aa and a non-display area bb. The display panel 10 includes a substrate 1, a driving circuit layer 2, side traces 4, a protective layer 5, and a padding layer 6. The substrate 1 has a first surface and a second surface facing away from each other, and a side surface connecting the first surface and the second surface. The driving circuit layer 2 is disposed on the first surface of the substrate 1 and extends from the display area aa to the non-display area bb. The side traces 4 are disposed on the side surface of the substrate 1 and are electrically connected to the driving circuit layer 2. The protective layer 5 covers the side traces 4. The padding layer 6 is disposed on the side of the first surface of the substrate 1 and is located at least in the display area aa. The sum of the thickness of the portion of the padding layer 6 in the display area aa and the thickness of the portion of the driving circuit layer 2 in the display area aa is the first thickness H1. The sum of the thickness of the protective layer 5 and the thickness of the side traces 4 is the second thickness H2. The difference between the first thickness H1 and the second thickness H2 is less than or equal to 1 micrometer. In this way, the side traces 4 can be protected by the protective layer 5, and the height difference between the protective layer 5 and the side surface of the driving circuit layer 2 or the side surface of the padding layer 6 away from the substrate 1 can be reduced by the added padding layer 6. This reduces the impact of the height difference on the LED transfer when the display panel 10 is transferring LEDs, thereby improving the LED pressing effect.

[0081] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure of a display device provided in one embodiment of this application. In this embodiment, a display device is provided, which can be a mobile phone, computer, laptop, smartwatch, etc. The display device includes the display panel 10 involved in any of the above embodiments to display an image. The specific structure and function of the display panel 10 can be found in the above descriptions, and can achieve the same or similar technical effects, which will not be repeated here.

[0082] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A display panel, characterized in that, The display panel has a display area and a non-display area, wherein the non-display area is at least located on one side of the display area; the display panel includes: The substrate has a first surface and a second surface facing away from each other, and a side surface connecting the first surface and the second surface; A driving circuit layer is disposed on the first surface of the substrate and extends from the display area to the non-display area; Side traces are provided on the side of the substrate and are electrically connected to the driving circuit layer; A protective layer covers the side traces; A padding layer is disposed on one side of the first surface of the substrate and is located at least in the display area; wherein, the sum of the thickness of the portion of the padding layer in the display area and the thickness of the portion of the driving circuit layer in the display area is a first thickness; the sum of the thickness of the protective layer and the thickness of the side trace is a second thickness; the difference between the first thickness and the second thickness is less than or equal to 1 micrometer.

2. The display panel according to claim 1, characterized in that, The padding layer is disposed between the substrate and the driving circuit layer; Preferably, the surface of the driving circuit layer facing away from the substrate is flush with the surface of the protective layer facing away from the substrate.

3. The display panel according to claim 1, characterized in that, The padding layer is disposed on the side of the drive circuit layer away from the substrate; Preferably, the surface of the padding layer facing away from the substrate is flush with the surface of the protective layer facing away from the substrate.

4. The display panel according to claim 1, characterized in that, The padding layer is disposed within the drive circuit layer; Preferably, the surface of the driving circuit layer facing away from the substrate is flush with the surface of the protective layer facing away from the substrate.

5. The display panel according to claim 4, characterized in that, The padding layer includes at least one sub-padding layer; the driving circuit layer includes multiple conductive layers and at least one dielectric layer; a dielectric layer is provided between each two adjacent conductive layers; wherein, the at least one sub-padding layer is spaced between the conductive layers and the dielectric layer along the stacking direction of the display panel. Preferably, the number of layers of the sub-pad high layer is one layer, and the layer of the sub-pad high layer is located between the conductive layer closest to the substrate and the dielectric layer closest to the substrate; Preferably, the driving circuit layer includes an adjacent first conductive layer and a second conductive layer, and a first dielectric layer disposed between the first conductive layer and the second conductive layer, and the sub-pad is disposed between the first conductive layer and the first dielectric layer, or between the first dielectric layer and the second conductive layer.

6. The display panel according to any one of claims 1-5, characterized in that, The first thickness is equal to the second thickness, and the thickness of the portion of the padding layer located in the display area is the same as the thickness of the protective layer; Preferably, the padding layer includes one sub-padding layer; the thickness of the sub-padding layer is the same as the thickness of the protective layer; or, the padding layer includes multiple sub-padding layers; the sum of the thicknesses of the multiple sub-padding layers is the same as the sum of the thicknesses of the protective layer.

7. The display panel according to any one of claims 1-5, characterized in that, The raised layer includes a raised portion and an edge portion; the raised portion is located in the display area; the edge portion is connected to the raised portion and extends into the non-display area, and the thickness of the edge portion gradually decreases in the direction away from the raised portion.

8. The display panel according to claim 7, characterized in that, A portion of the protective layer extends to one side of the first surface of the substrate and covers the edge portion; Preferably, the protective layer is disposed adjacent to or spaced apart from the raised portion in a direction perpendicular to the stacking direction of the display panel.

9. The display panel according to claim 5, characterized in that, The padding layer includes an organic layer; and / or the protective layer includes an ink layer; Preferably, the padding layer and the dielectric layer are made of the same material.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1-9.

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