Display module, preparation method of display module and display device
Patent Information
- Application Number
- CN202510187471.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-19
- Publication Date
- 2026-08-21
AI Technical Summary
[0003]但目前的显示产品的工艺性能有待提升
[0037]在本申请实施例提供的一种显示模组中,显示模组具有显示区以及非显示区,显示模组包括显示面板与第二遮光结构。显示面板包括基板以及设置于基板一侧的发光器件,发光器件设置于显示区,使得显示区内的显示模组可用于发光显示。第二遮光结构设置于非显示区并位于显示面板的出光测,显示面板还包括设置于非显示区并与发光器件位于基板同一侧的第一遮光结构,第一遮光结构与第二遮光结构均可用于遮挡光线,能够较好的限制非显示区中漏光的现象。
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Figure CN122622518A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of display technology, and in particular relates to a display module, a method for preparing the display module, and a display device. Background Technology
[0002] Liquid crystal display (LCD) panels, organic light-emitting diode (OLED) panels, and display panels using light-emitting diode (LED) devices are widely used in various consumer electronics products such as mobile phones, televisions, personal digital assistants, digital cameras, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.
[0003] However, the current display products' manufacturing processes need improvement. Summary of the Invention
[0004] This application provides a display module, a method for manufacturing the display module, and a display device, aiming to improve the structural stability of the display module.
[0005] An embodiment of the first aspect of this application provides a display module having a display area and a non-display area. The display module includes: a display panel, including a substrate, a light-emitting device and a first light-shielding structure located on the same side of the substrate, the light-emitting device being disposed in the display area, and the first light-shielding structure being disposed in the non-display area; and a second light-shielding structure being disposed in the non-display area and located on the light-emitting side of the display panel, wherein the orthographic projection of the first light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap.
[0006] According to an embodiment of the first aspect of this application, the maximum thickness of the first light-shielding structure is greater than the maximum thickness of the second light-shielding structure, and / or the maximum light density of the first light-shielding structure is greater than the maximum light density of the second light-shielding structure.
[0007] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the first light-shielding structure is not less than 2 micrometers and not more than 6 micrometers, and / or the maximum thickness of the second light-shielding structure is not less than 0.8 micrometers and not more than 1.2 micrometers.
[0008] According to any of the foregoing embodiments of the first aspect of this application, the maximum light density of the first light-shielding structure is not less than 3.6, and / or the maximum light density of the second light-shielding structure is not less than 0.8.
[0009] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer disposed on one side of the substrate. The pixel definition layer located in the display area has a pixel opening, and at least a portion of the light-emitting devices are located in the pixel opening. The first light-shielding structure includes a first sub-light-shielding structure disposed on the same layer as the pixel definition layer. The orthographic projection of the first sub-light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap.
[0010] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the first sub-shielding structure is greater than the maximum thickness of the second shielding structure, and / or the maximum light density of the first sub-shielding structure is greater than the maximum light density of the second shielding structure.
[0011] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the first sub-shading structure is not less than 1 micrometer and not more than 3 micrometers, and / or the maximum thickness of the second shading structure is not less than 0.8 micrometers and not more than 1.2 micrometers.
[0012] According to any of the foregoing embodiments of the first aspect of this application, the maximum light density of the first light-shielding structure is not less than 1.8, and / or the maximum light density of the second light-shielding structure is not less than 0.8.
[0013] According to any of the foregoing embodiments of the first aspect of this application, the materials of the first sub-shielding structure and the second shielding structure are different.
[0014] According to any of the foregoing embodiments of the first aspect of this application, the pixel definition layer and the first sub-shading structure are made of the same material.
[0015] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the pixel definition layer is less than the maximum thickness of the first sub-shading structure.
[0016] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the pixel definition layer is not less than 0.8 micrometers and not more than 1.2 micrometers.
[0017] According to any of the foregoing embodiments of the first aspect of this application, the first sub-light-shielding structure is disposed at a distance from the pixel definition layer, and the side of the first sub-light-shielding structure facing the display area has a first side surface, which is gradually inclined toward the substrate in the direction away from the substrate.
[0018] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a pixel definition layer disposed on one side of the substrate and a support pillar disposed on the side of the pixel definition layer opposite to the substrate. The first light-shielding structure includes a second sub-light-shielding structure disposed on the same layer as the support pillar. The orthographic projection of the second sub-light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap.
[0019] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the second sub-shading structure is greater than the maximum thickness of the second shading structure, and / or the maximum light density of the second sub-shading structure is greater than the maximum light density of the second shading structure.
[0020] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the second sub-shading structure is not less than 1 micrometer and not more than 3 micrometers, and / or the maximum thickness of the second light-shielding structure is not less than 0.8 micrometers and not more than 1.2 micrometers.
[0021] According to any of the foregoing embodiments of the first aspect of this application, the maximum light density of the second light-shielding structure is not less than 1.8, and / or the maximum light density of the second light-shielding structure is not less than 0.8.
[0022] According to any of the foregoing embodiments of the first aspect of this application, the second sub-shielding structure is made of a different material than the second shielding structure.
[0023] According to any of the foregoing embodiments of the first aspect of this application, the support column and the second sub-shading structure are made of the same material.
[0024] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the support column is less than the maximum thickness of the second sub-shading structure.
[0025] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the support column is not less than 0.8 micrometers and not more than 1.2 micrometers.
[0026] According to any of the foregoing embodiments of the first aspect of this application, the first light-shielding structure further includes a first sub-light-shielding structure disposed on the same layer as the pixel definition layer, wherein the orthographic projection of the first sub-light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap, and the second sub-light-shielding structure is disposed on the side of the first sub-light-shielding structure away from the substrate.
[0027] According to any of the foregoing embodiments of the first aspect of this application, the maximum thickness of the first sub-shading structure is the same as the maximum thickness of the second sub-shading structure, and / or the maximum light density of the first sub-shading structure is the same as the maximum light density of the second sub-shading structure.
[0028] According to any of the foregoing embodiments of the first aspect of this application, the first sub-shading structure and the second sub-shading structure are made of the same material.
[0029] According to any of the foregoing embodiments of the first aspect of this application, the substrate includes a substrate and a driving circuit located on the side of the substrate facing the light-emitting device. The orthographic projection of at least a portion of the driving circuit in the non-display area onto the substrate is located within the orthographic projection of the first light-shielding structure and / or the second light-shielding structure onto the substrate. And / or, the display panel further includes a touch layer located on the side of the light-emitting device away from the substrate. The orthographic projection of the touch layer in the non-display area onto the substrate at least partially overlaps with the orthographic projection of the second light-shielding structure onto the substrate.
[0030] An embodiment of the second aspect of this application provides a method for manufacturing a display module, the display module having a display area and a non-display area, the manufacturing method comprising:
[0031] At least a portion of a first light-shielding structure located in a non-display area and a functional structure located in a display area are prepared on a substrate using a halftone mask, wherein the maximum thickness of the at least portion of the first light-shielding structure is greater than the maximum thickness of the functional structure.
[0032] Fabricate and form a light-emitting device located within the display area;
[0033] A display panel is prepared, and a second light-shielding structure is prepared on the light-emitting side of the display panel, wherein the orthographic projection of the first light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap.
[0034] According to an embodiment of the second aspect of this application, in the step of preparing at least a portion of a first light-shielding structure located in a non-display area and a functional structure located in a display area on a substrate using a halftone mask:
[0035] A first light-shielding structure located in the non-display area and a functional structure located in the display area are prepared on the substrate using a halftone mask. The functional structure includes a pixel definition layer and a support pillar. The first light-shielding structure includes a first sub-light-shielding structure disposed in the same layer and material as the pixel definition layer and a second sub-light-shielding structure disposed in the same layer and material as the support pillar. The maximum thickness of the pixel definition layer is less than the maximum thickness of the first sub-light-shielding structure, and the maximum thickness of the support pillar is less than the maximum thickness of the second sub-light-shielding structure.
[0036] An embodiment of the third aspect of this application provides a display device, including a display module of any of the above embodiments, or a display module prepared by the preparation method of any of the above embodiments.
[0037] In a display module provided in this application embodiment, the display module has a display area and a non-display area, and includes a display panel and a second light-shielding structure. The display panel includes a substrate and a light-emitting device disposed on one side of the substrate. The light-emitting device is disposed in the display area, so that the display module in the display area can be used for light-emitting display. The second light-shielding structure is disposed in the non-display area and located on the light-emitting side of the display panel. The display panel also includes a first light-shielding structure disposed in the non-display area and located on the same side of the substrate as the light-emitting device. Both the first light-shielding structure and the second light-shielding structure can be used to block light, which can effectively limit the phenomenon of light leakage in the non-display area.
[0038] By setting the orthographic projection of the first light-shielding structure on the substrate to at least partially overlap with the orthographic projection of the second light-shielding structure on the substrate, the light-shielding effects of the first and second light-shielding structures can be superimposed at the overlap position to meet the light-shielding requirements in the non-display area. This means that the thickness of the first and second light-shielding structures does not need to be set too large, which facilitates the fabrication of the first and second light-shielding structures and makes the fabricated first and second light-shielding structures have good structural stability, thereby improving the overall structural stability of the display module. Attached Figure Description
[0039] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0040] Figure 1 This is a schematic diagram of the structure of a display module provided in an embodiment of this application;
[0041] Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application;
[0042] Figure 3 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;
[0043] Figure 4 This is a partial cross-sectional view of a display panel provided in another embodiment of this application;
[0044] Figure 5 This is a schematic flowchart of a method for manufacturing a display module provided in an embodiment of this application;
[0045] Figures 6 to 10 This is a schematic diagram of the fabrication process of a display module fabrication method provided in an embodiment of this application.
[0046] Explanation of reference numerals in the attached figures:
[0047] 10. Display module;
[0048] 100. Display panel; 110. Substrate; 111. Substrate; 112. First insulating layer; 113. Second insulating layer; 114. Third insulating layer; 115. Driving circuit; 115a. Transistor; 115aa. Gate; 115ab. Source / drain; 115b. Storage capacitor; 115ba. First electrode; 115bb. Second electrode; 120. Light-emitting device; 121. First electrode; 122. Light-emitting function Layer; 123, Second electrode; 130, First light-shielding structure; 131, First sub-light-shielding structure; 131a, First side surface; 132, Second sub-light-shielding structure; 140, Pixel definition layer; 140a, Pixel aperture; 150, Support pillar; 160, Encapsulation layer; 170, Touch layer; 171, Touch signal line; 172, Touch electrode; 173, Bridging electrode portion; 180, First interlayer layer; 190, Second interlayer layer
[0049] 200. Second light-shielding structure;
[0050] 300. Polarizing film;
[0051] 400. Cover plate;
[0052] 500. Third light-shielding structure;
[0053] 600, Mid-frame. Detailed Implementation
[0054] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.
[0055] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.
[0056] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.
[0057] This application provides a display module, a method for preparing the display module, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display module, the method for preparing the display module, and the display device.
[0058] Figure 1 This is a schematic diagram of the structure of a display module 10 provided in an embodiment of this application. Figure 2 This is a partial cross-sectional view of a display module 10 provided in an embodiment of this application. Exemplary, Figure 2 Can be Figure 1 A partial cross-sectional view of one embodiment at point A.
[0059] like Figure 1 and Figure 2 As shown, an embodiment of the first aspect of this application provides a display module 10, which has a display area and a non-display area. The display module 10 includes: a display panel 100, including a substrate 110 and a light-emitting device 120 and a first light-shielding structure 130 located on the same side of the substrate 110. The light-emitting device 120 is disposed in the display area, and the first light-shielding structure 130 is disposed in the non-display area; and a second light-shielding structure 200 is disposed in the non-display area and located on the light-emitting side of the display panel 100, wherein the orthographic projection of the first light-shielding structure 130 on the substrate 110 and the orthographic projection of the second light-shielding structure 200 on the substrate 110 at least partially overlap.
[0060] In a display module 10 provided in this application embodiment, the display module 10 has a display area and a non-display area, and the display module 10 includes a display panel 100 and a second light-shielding structure 200. The display panel 100 includes a substrate 110 and a light-emitting device 120 disposed on one side of the substrate 110. The light-emitting device 120 is disposed in the display area, so that the display module 10 in the display area can be used for light-emitting display.
[0061] Optionally, the light-emitting device 120 may include a first electrode 121, a light-emitting functional layer 122, and a second electrode 123. The light-emitting functional layer 122 may be located on the side of the first electrode 121 away from the substrate 110, and the second electrode 123 may be located on the side of the light-emitting functional layer 122 away from the substrate 110.
[0062] Optionally, the light-emitting functional layer 122 may include a hole injection layer (HIL), a hole transport layer (HTL), a light-emitting structure, an electron injection layer (EIL), and an electron transport layer (ETL).
[0063] Optionally, the first electrode 121 and the second electrode 123 can serve as pixel electrodes, with one of them serving as an anode and the other as a cathode to drive the light-emitting functional layer 122 to emit light. This embodiment uses the first electrode 121 as the anode and the second electrode 123 as the cathode for illuminating purposes.
[0064] Optionally, the substrate 110 can be configured in various ways. The substrate 110 may include, for example, a substrate 111 and a driving circuit 115 located on the side of the substrate 111 facing the light-emitting device 120. Exemplarily, the driving circuit 115 may include a transistor 115a, a storage capacitor 115b, and driving signal lines for connecting the various devices. The transistor 115a may include a semiconductor, a gate 115aa, and source / drain electrodes 115ab. The storage capacitor 115b includes a first electrode 115ba and a second electrode 115bb.
[0065] Optionally, the substrate 110 includes a first insulating layer 112, a second insulating layer 113, and a third insulating layer 114 stacked together. As an example, the gate 115aa and the first electrode 115ba may be located on the side of the first insulating layer 112 facing the substrate 111, the second electrode 115bb may be located between the first insulating layer 112 and the second insulating layer 113, and the source / drain electrodes 115ab may be located between the second insulating layer 113 and the third insulating layer 114.
[0066] The second light-shielding structure 200 is disposed in the non-display area and located at the light-emitting side of the display panel 100. The display panel 100 also includes a first light-shielding structure 130 disposed in the non-display area and located on the same side of the substrate 110 as the light-emitting device 120. Both the first light-shielding structure 130 and the second light-shielding structure 200 can be used to block light, which can effectively limit the phenomenon of light leakage in the non-display area.
[0067] Optionally, the second light-shielding structure 200 is located on the light-emitting side of the display panel 100, which can mean that the second light-shielding structure 200 is located outside the display panel 100 and on the side of the light-emitting device 120 away from the substrate 110.
[0068] Optionally, the first light-blocking structure 130 and the second light-blocking structure 200 can block light by absorbing light.
[0069] Optionally, both the materials of the first light-shielding structure 130 and the second light-shielding structure 200 may include opaque materials, so that both the first light-shielding structure 130 and the second light-shielding structure 200 can effectively block light. For example, both the materials of the first light-shielding structure 130 and the second light-shielding structure 200 may include black organic materials (e.g., black organic adhesive), so that the first light-shielding structure 130 and the second light-shielding structure 200 can effectively block light by absorbing it.
[0070] By setting the orthographic projection of the first light-shielding structure 130 on the substrate 110 and the orthographic projection of the second light-shielding structure 200 on the substrate 110 to at least partially overlap, the light-shielding effects of the first light-shielding structure 130 and the second light-shielding structure 200 at the overlap position can be superimposed to meet the light-shielding requirements in the non-display area. This allows the thicknesses of the first light-shielding structure 130 and the second light-shielding structure 200 to be less than necessary, facilitating the fabrication of the first light-shielding structure 130 and the second light-shielding structure 200, and ensuring that the fabricated first light-shielding structure 130 and second light-shielding structure 200 are sufficiently large. The structure 200 has good structural stability. (For example, during the preparation process, the curing degree and efficiency of the materials of the first light-shielding structure 130 and the second light-shielding structure 200 with a small thickness are high, so that the first light-shielding structure 130 and the second light-shielding structure 200 formed are not easily affected by the developing solution and other materials in the preparation process, thus making the first light-shielding structure 130 and the second light-shielding structure 200 formed have good structural stability and making the first light-shielding structure 130 and the second light-shielding structure 200 less likely to lift relative to the underlying film layer.) This can improve the overall structural stability of the display module 10.
[0071] For example, since there are many metal structures in the substrate 110 of the display panel 100 in the display module 10, that is, since the metal structures in the substrate 110 account for a large proportion of all the metal structures in the display module 10, by setting the second light-shielding structure 200 in the non-display area and located on the light-emitting side of the display panel 100, and setting the first light-shielding structure 130 in the non-display area and located on the same side of the substrate 110 as the light-emitting device 120, both the first light-shielding structure 130 and the second light-shielding structure 200 can be used to block the light reflected from the metal structures in the substrate 110 in the non-display area.
[0072] Meanwhile, by providing a first light-shielding structure 130 within the display panel 100, the first light-shielding structure 130 can be positioned close to the substrate 110, allowing it to effectively block light reflected from the metal structure in the substrate 110. Furthermore, by ensuring that the orthographic projection of the first light-shielding structure 130 on the substrate 110 at least partially overlaps with the orthographic projection of the second light-shielding structure 200 on the substrate 110, the light-shielding effect of the first light-shielding structure 130 is enhanced at the overlap point. The light-blocking effect of the first light-blocking structure 130 and the light-blocking effect of the second light-blocking structure 200 can be superimposed to meet the requirements of blocking light reflected from the metal structure in the substrate 110 in the non-display area. As a result, the thickness of the first light-blocking structure 130 and the second light-blocking structure 200 does not need to be set too large, which facilitates the fabrication of the first light-blocking structure 130 and the second light-blocking structure 200. Furthermore, the fabricated first light-blocking structure 130 and the second light-blocking structure 200 have good structural stability, thereby improving the overall structural stability of the display module 10.
[0073] As an example, the first light-shielding structure 130 and the second light-shielding structure 200 can be used to block light reflected from the driving circuit 115 in the non-display area. For example, the first light-shielding structure 130 and the second light-shielding structure 200 can be used to block light reflected from the metal structure in the driving circuit 115 (e.g., the metal structure in the transistor 115a, the storage capacitor 115b, and the driving signal line) in the non-display area, making the driving circuit 115 in the display module 10 less likely to be exposed and identified by the user, so that the display module 10 can have a better appearance.
[0074] Optionally, the orthographic projection of the first light-shielding structure 130 on the substrate 110 may be located within the orthographic projection of the second light-shielding structure 200 on the substrate 110. Optionally, the orthographic projection of the first light-shielding structure 130 on the substrate 110 overlaps with the orthographic projection of the second light-shielding structure 200 on the substrate 110.
[0075] Optionally, at least a portion of the driving circuit 115 in the non-display area has its orthographic projection on the substrate 111 located within the orthographic projection of the first light-shielding structure 130 and / or the second light-shielding structure 200 on the substrate 111, so that the first light-shielding structure 130 and the second light-shielding structure 200 can effectively block the light reflected from the driving circuit 115 in the non-display area.
[0076] In some alternative embodiments, the maximum thickness of the first light-shielding structure 130 is greater than the maximum thickness of the second light-shielding structure 200, and / or the maximum light density of the first light-shielding structure 130 is greater than the maximum light density of the second light-shielding structure 200.
[0077] Optionally, the maximum thickness of the first light-shielding structure 130 is not less than 2 micrometers and not more than 6 micrometers, and / or the maximum thickness of the second light-shielding structure 200 is not less than 0.8 micrometers and not more than 1.2 micrometers.
[0078] For example, the maximum thickness of the first light-shielding structure 130 can be 2 micrometers, 2.4 micrometers, 2.8 micrometers, 3.2 micrometers, 3.6 micrometers, 4 micrometers, 4.4 micrometers, 4.8 micrometers, 5.2 micrometers, 5.6 micrometers, or 6 micrometers. The maximum thickness of the second light-shielding structure 200 can be 0.8 micrometers, 1 micrometer, or 1.2 micrometers.
[0079] Optionally, the maximum optical density of the first light-shielding structure 130 is not less than 3.6, and / or the maximum optical density of the second light-shielding structure 200 is not less than 0.8. Further, the maximum optical density of the first light-shielding structure 130 may be not less than 4, and the maximum optical density of the second light-shielding structure 200 may be not less than 1.
[0080] Optionally, the light density at the location with the maximum thickness in the first light-shielding structure 130 can be the maximum light density of the first light-shielding structure 130. The light density at the location with the maximum thickness in the second light-shielding structure 200 can be the maximum light density of the second light-shielding structure 200.
[0081] In these optional embodiments, since the first light-shielding structure 130 is closer to the substrate 110 than the second light-shielding structure 200, the first light-shielding structure 130 has a more significant blocking effect on the light reflected from the metal structure in the substrate 110 than the second light-shielding structure 200. Therefore, by increasing the thickness and light density of the first light-shielding structure 130 adjacent to the substrate 110, the blocking effect on the light reflected from the metal structure in the substrate 110 can be improved more efficiently. This also allows the second light-shielding structure 200 to undertake a smaller blocking task on the light reflected from the metal structure in the display module 10, and makes it easier to reduce the thickness of the second light-shielding structure 200.
[0082] In some embodiments of this application, the first light-shielding structure 130 may be disposed in the same layer as at least a portion of the film layer in the display panel 100, so that there is no need to add a new film layer structure in the display panel 100 to facilitate the placement of the first light-shielding structure 130, thereby reducing the thickness of the display panel 100.
[0083] In some optional embodiments, the display panel 100 further includes a pixel definition layer 140 disposed on one side of the substrate 110. The pixel definition layer 140 located in the display area has a pixel opening 140a. At least a portion of the light-emitting devices 120 are located within the pixel opening 140a. The first light-shielding structure 130 includes a first sub-light-shielding structure 131 disposed on the same layer as the pixel definition layer 140. The orthographic projection of the first sub-light-shielding structure 131 on the substrate 110 at least partially overlaps with the orthographic projection of the second light-shielding structure 200 on the substrate 110.
[0084] Optionally, the pixel definition layer 140 may be in the form of a grid, and the cutout areas in the grid-shaped pixel definition layer 140 may be pixel openings 140a.
[0085] Optionally, the pixel definition layer 140 may partially cover the end of the first electrode 121, and at least part of the light-emitting device 120 may be located within the pixel opening 140a. This may mean that the light-emitting functional layer 122 of the light-emitting device 120 and the second electrode 123 may be partially located within the pixel opening 140a.
[0086] In these optional embodiments, the pixel definition layer 140 can be used to participate in dividing the sub-pixels of the display panel 100. At the overlap position of the first sub-light-shielding structure 131 and the second light-shielding structure 200, the light-shielding effect of the first sub-light-shielding structure 131 and the light-shielding effect of the second light-shielding structure 200 can be superimposed to meet the light-shielding requirements in the non-display area. By setting the first sub-light-shielding structure 131 and the pixel definition layer 140 to be arranged in the same layer, the space between the film layers in the display panel 100 used to arrange the pixel definition layer 140 can be better utilized to arrange the first sub-light-shielding structure 131, thereby helping to reduce the thickness of the display panel 100.
[0087] In some alternative embodiments, the maximum thickness of the first sub-shading structure 131 is greater than the maximum thickness of the second shaded structure 200, and / or the maximum light density of the first sub-shading structure 131 is greater than the maximum light density of the second shaded structure 200.
[0088] Optionally, the maximum thickness of the first sub-shading structure 131 is not less than 1 micrometer and not more than 3 micrometers, and / or the maximum thickness of the second shading structure 200 is not less than 0.8 micrometers and not more than 1.2 micrometers.
[0089] For example, the maximum thickness of the first sub-shading structure 131 can be 1 micrometer, 1.2 micrometer, 1.4 micrometer, 1.6 micrometer, 1.8 micrometer, 2 micrometer, 2.2 micrometer, 2.4 micrometer, 2.6 micrometer, 2.8 micrometer, or 2 micrometer. The maximum thickness of the second shading structure 200 can be 0.8 micrometer, 1 micrometer, or 1.2 micrometer.
[0090] Optionally, the maximum optical density of the first light-shielding structure 130 is not less than 1.8, and / or the maximum optical density of the second light-shielding structure 200 is not less than 0.8. Further, the maximum optical density of the first light-shielding structure 130 may be not less than 2, and the maximum optical density of the second light-shielding structure 200 may be not less than 1.
[0091] Optionally, the light density at the location with the maximum thickness in the first sub-shading structure 131 can be the maximum light density of the first sub-shading structure 131.
[0092] In these alternative embodiments, the blocking effect on light reflected from the metal structure in the substrate 110 can be improved more efficiently by increasing the thickness and light density of the first sub-shielding structure 131 adjacent to the substrate 110. This also allows the second light-shielding structure 200 to undertake a smaller blocking task on light reflected from the metal structure in the display module 10, and facilitates the reduction of the thickness of the second light-shielding structure 200.
[0093] In some alternative embodiments, the pixel definition layer 140 is made of the same material as the first sub-shading structure 131.
[0094] Optionally, the first sub-shading structure 131 and the second shader structure 200 may be made of different materials. Since the first sub-shading structure 131 may be made of the same material as the pixel definition layer 140, by making the materials of the first sub-shading structure 131 and the second shader structure 200 different, the material of the first sub-shading structure 131 can be set according to meet the working requirements of the pixel definition layer 140.
[0095] Optionally, both the pixel definition layer 140 and the first sub-light-shielding structure 131 may be made of opaque materials. For example, both the pixel definition layer 140 and the first sub-light-shielding structure 131 may be made of black organic materials. For instance, both the pixel definition layer 140 and the first sub-light-shielding structure 131 may consist of a mixed resin containing cardo and acrylic acid, and a black organic pigment.
[0096] Optionally, the material of the second light-shielding structure 200 may include acrylic resin and carbon black inorganic pigment, and the curing temperature of the second light-shielding structure 200 may not exceed 85 degrees Celsius.
[0097] In these optional embodiments, by using the same material for the pixel definition layer 140 and the first sub-light-shielding structure 131, the same fabrication equipment can be used to complete the fabrication of the pixel definition layer 140 and the first sub-light-shielding structure 131 in the same process step, which can significantly improve the fabrication efficiency of the display panel 100. Furthermore, by using the same material for the pixel definition layer 140 and the first sub-light-shielding structure 131, the pixel definition layer 140 located in the display area can also effectively block light, thus better limiting light reflection in the display area and effectively limiting light leakage.
[0098] In some alternative embodiments, the maximum thickness of the pixel definition layer 140 may be less than the maximum thickness of the first sub-shading structure 131.
[0099] Optionally, the maximum thickness of the pixel definition layer 140 is not less than 0.8 micrometers and not more than 1.2 micrometers. For example, the maximum thickness of the pixel definition layer 140 may be 0.8 micrometers, 1 micrometer, or 1.2 micrometers.
[0100] In these optional embodiments, by setting the maximum thickness of the pixel definition layer 140 to be less than the maximum thickness of the first sub-light-shielding structure 131, the pixel definition layer 140 is less likely to have an excessive thickness, thereby reducing the light-emitting blocking effect of the pixel definition layer 140 on the light-emitting device 120 within the pixel opening 140a, and thus improving the light-emitting display effect of the display panel 100.
[0101] For example, during the fabrication of the display panel 100, a halftone mask can be used to fabricate pixel definition layers 140 and a first sub-shading structure 131 with different thicknesses in the same fabrication process.
[0102] Figure 3 This is a partial cross-sectional view of a display panel 100 provided in another embodiment of this application. Exemplary, Figure 3 Can be Figure 1 A partial cross-sectional view of another embodiment at point A.
[0103] like Figure 3 As shown, in some optional embodiments, the first sub-light-shielding structure 131 is spaced apart from the pixel definition layer 140. The side of the first sub-light-shielding structure 131 facing the display area may have a first side surface 131a. In the direction away from the substrate 110, the first side surface 131a may be gradually tilted toward the substrate 110.
[0104] Optionally, the cross-sectional area of the first sub-shielding structure 131 gradually increases in the direction away from the substrate 110.
[0105] In these optional embodiments, by setting the first side surface 131a to gradually slope towards the substrate 110, the end of the first sub-light-shielding structure 131 facing the substrate 110 can have a smaller width. This facilitates the arrangement of other device structures around the first sub-light-shielding structure 131, thereby reducing the size of the non-display area and decreasing the bezel of the display module 10. For example, it allows the first sub-light-shielding structure 131 to be positioned closer to the display area without affecting the arrangement of device structures between the pixel definition layer 140 and the first sub-light-shielding structure 131, thus effectively reducing the size of the non-display area.
[0106] In some optional embodiments, the display panel 100 further includes a support pillar 150 disposed on the side of the pixel definition layer 140 away from the substrate 110, and the first light-shielding structure 130 includes a second sub-light-shielding structure 132 disposed on the same layer as the support pillar 150, and the orthographic projection of the second sub-light-shielding structure 132 on the substrate 110 at least partially overlaps with the orthographic projection of the second light-shielding structure 200 on the substrate 110.
[0107] In this optional embodiment, the support pillar 150 can be used to support a photomask during the fabrication of the display panel 100. For example, the support pillar 150 can be used to support the photomask used when depositing the vapor-emitting light-emitting functional layer 122 or the second electrode 123 during the fabrication of the display panel 100. At the overlap position of the second sub-shielding structure 132 and the second light-shielding structure 200, the light-shielding effect of the second sub-shielding structure 132 and the light-shielding effect of the second light-shielding structure 200 can be superimposed to meet the light-shielding requirements in the non-display area. By setting the second sub-shielding structure 132 and the support pillar 150 in the same layer, the space between the film layers in the display panel 100 used to arrange the support pillar 150 can be better utilized to arrange the second sub-shielding structure 132, thereby helping to reduce the thickness of the display panel 100.
[0108] In some optional embodiments, the maximum thickness of the second sub-shading structure 132 is greater than the maximum thickness of the second light-shading structure 200, and / or the maximum light density of the second sub-shading structure 132 is greater than the maximum light density of the second light-shading structure 200.
[0109] Optionally, the maximum thickness of the second sub-shading structure 132 is not less than 1 micrometer and not more than 3 micrometers, and / or the maximum thickness of the second shading structure 200 is not less than 0.8 micrometers and not more than 1.2 micrometers.
[0110] For example, the maximum thickness of the second sub-shading structure 132 can be 1 micrometer, 1.2 micrometer, 1.4 micrometer, 1.6 micrometer, 1.8 micrometer, 2 micrometer, 2.2 micrometer, 2.4 micrometer, 2.6 micrometer, 2.8 micrometer, or 2 micrometer. The maximum thickness of the second light-shading structure 200 can be 0.8 micrometer, 1 micrometer, or 1.2 micrometer.
[0111] Optionally, when the first light-shielding structure 130 includes a first sub-light-shielding structure 131 and a second sub-light-shielding structure 132, the maximum thickness of the second sub-light-shielding structure 132 is the same as the maximum thickness of the first sub-light-shielding structure 131.
[0112] Optionally, the maximum optical density of the second light-shielding structure 200 is not less than 1.8, and / or, the maximum optical density of the second light-shielding structure 200 is not less than 0.8. Further, the maximum optical density of the second light-shielding structure 200 may be not less than 2. The maximum optical density of the second light-shielding structure 200 may be not less than 1.
[0113] Optionally, the light density at the location with the maximum thickness in the second sub-shading structure 132 can be the maximum light density of the second sub-shading structure 132.
[0114] In these alternative embodiments, the blocking effect on light reflected from the metal structure in the substrate 110 can be improved more efficiently by increasing the thickness and light density of the second sub-shielding structure 132 adjacent to the substrate 110. This also allows the second light-shielding structure 200 to undertake a smaller blocking task on light reflected from the metal structure in the display module 10, and facilitates the reduction of the thickness of the second light-shielding structure 200.
[0115] In some alternative embodiments, the support column 150 and the second sub-shading structure 132 are made of the same material.
[0116] Optionally, the second sub-shading structure 132 may be made of a different material than the second sub-shading structure 200. Since the second sub-shading structure 132 may be made of the same material as the support column 150, by making the second sub-shading structure 132 and the second sub-shading structure 200 different materials, the material of the second sub-shading structure 132 can be set according to the working requirements of the support column 150.
[0117] Optionally, both the support column 150 and the second sub-light-shielding structure 132 can be made of opaque materials. For example, both the support column 150 and the second sub-light-shielding structure 132 can be made of black organic materials. For instance, both the support column 150 and the second sub-light-shielding structure 132 can be made of a mixed resin containing cardo and acrylic acid, and a black organic pigment.
[0118] Optionally, the material of the second light-shielding structure 200 may include acrylic resin and carbon black inorganic pigment, and the curing temperature of the second light-shielding structure 200 may not exceed 85 degrees Celsius.
[0119] In these optional embodiments, by using the same material for the support column 150 and the second sub-light-shielding structure 132, the same fabrication equipment can be used to complete the fabrication of the support column 150 and the second sub-light-shielding structure 132 in the same process step, which can significantly improve the fabrication efficiency of the display panel 100. Furthermore, by using the same material for the support column 150 and the second sub-light-shielding structure 132, the support column 150 located in the display area can also effectively block light, thus better limiting light reflection in the display area and effectively limiting light leakage.
[0120] In some alternative embodiments, the maximum thickness of the support column 150 is less than the maximum thickness of the second sub-shading structure 132.
[0121] Optionally, the maximum thickness of the support column 150 is not less than 0.8 micrometers and not more than 1.2 micrometers. For example, the maximum thickness of the support column 150 may be 0.8 micrometers, 1 micrometer, or 1.2 micrometers.
[0122] In these alternative embodiments, by setting the maximum thickness of the support column 150 to be less than the maximum thickness of the second sub-light-shielding structure 132, the support column 150 is less likely to have an excessive thickness, thereby reducing the light-emitting blocking effect of the support column 150 on the light-emitting device 120 within the pixel opening 140a, and thus improving the light-emitting display effect of the display panel 100.
[0123] For example, during the fabrication of the display panel 100, a halftone mask can be used to fabricate support pillars 150 and a second sub-shading structure 132 with different thicknesses in the same fabrication process.
[0124] In some optional embodiments, when the first light-shielding structure 130 includes a first sub-light-shielding structure 131 and a second sub-light-shielding structure 132, the orthographic projection of the first sub-light-shielding structure 131 on the substrate 110 and the orthographic projection of the second light-shielding structure 200 on the substrate 110 at least partially overlap, and the second sub-light-shielding structure 132 is disposed on the side of the first sub-light-shielding structure 131 away from the substrate 110.
[0125] Optionally, the orthographic projection of the second sub-shielding structure 132 on the substrate 110 may be located within the orthographic projection of the first sub-shielding structure 131 on the substrate 110.
[0126] Optionally, the maximum thickness of the first sub-shading structure 131 and the maximum thickness of the second sub-shading structure 132 may be the same, and / or the maximum light density of the first sub-shading structure 131 and the maximum light density of the second sub-shading structure 132 may be the same, so that the light-blocking ability of the first sub-shading structure 131 and the light-blocking ability of the second sub-shading structure 132 may be approximate.
[0127] Optionally, the first sub-shading structure 131 and the second sub-shading structure 132 are made of the same material.
[0128] In these optional embodiments, by setting the orthographic projection of the first sub-light-shielding structure 131 on the substrate 110 to at least partially overlap with the orthographic projection of the second light-shielding structure 200 on the substrate 110, and by setting the second sub-light-shielding structure 132 on the side of the first sub-light-shielding structure 131 away from the substrate 110, the light-shielding effect of the first sub-light-shielding structure 131 and the light-shielding effect of the second sub-light-shielding structure 132 can be superimposed at the overlapping position of the first sub-light-shielding structure 131 and the second sub-light-shielding structure 132 in order to meet the light-shielding requirements in the non-display area, so that the first light-shielding structure 130 as a whole can have a more suitable thickness and light density to block light, thereby making it easier to reduce the thickness of the second light-shielding structure 200.
[0129] In some embodiments of this application, the second light-shielding structure 200 can be positioned in various ways. The second light-shielding structure 200 can be positioned below any film layer structure on the light-emitting side of the display panel 100 in the display module 10. The second light-shielding structure 200 can be used to block light reflected from any metal structure in the display panel 100 in the non-display area.
[0130] For example, the display module 10 may also include a cover plate 400 disposed on the light-emitting side of the display panel 100, and the second light-shielding structure 200 may be disposed between the cover plate 400 and the display panel 100.
[0131] Optionally, the display module 10 may also include a polarizer 300 disposed on the side of the cover plate 400 facing the display panel 100, and a second light-shielding structure 200 may be disposed between the polarizer 300 and the display panel 100, so that the second light-shielding structure 200 can be closer to the display panel 100, so that the second light-shielding structure 200 can block the light reflected from the metal structure in the display panel 100 in the non-display area.
[0132] In some optional embodiments, the display panel 100 further includes a touch layer 170 located on the side of the light-emitting device 120 away from the substrate 110, wherein the orthographic projection of the touch layer 170 in the non-display area onto the substrate 110 at least partially overlaps with the orthographic projection of the second light-shielding structure 200 onto the substrate 110.
[0133] Optionally, the display panel 100 may further include an encapsulation layer 160 disposed on the side of the light-emitting device 120, the pixel definition layer 140, the support pillar 150, and the first light-shielding structure 130 facing away from the substrate 110. The encapsulation layer 160 may be used to participate in the encapsulation protection of the display panel 100. For example, the touch layer 170 may be disposed on the side of the encapsulation layer 160 facing away from the substrate 110.
[0134] Optionally, the touch layer 170 can be used to implement the touch function of the display panel 100, and the touch implementation of the touch layer 170 can be self-capable or mutual-capable.
[0135] For example, when the touch layer 170 is a mutual capacitance touch layer 170, the touch layer 170 may include a touch signal line 171, a touch electrode 172, and a bridging electrode portion 173 disposed at a different layer from the touch electrode 172. The display panel 100 may also include a first interlayer layer 180 disposed between the bridging electrode portion 173 and the touch electrode 172. A portion of the touch electrode 172 may be used as a touch driving electrode, and another portion of the touch electrode 172 may be used as a touch sensing electrode. One of the touch driving electrode and the touch sensing electrode may be electrically connected to the bridging electrode portion 173, and the other of the touch driving electrode and the touch sensing electrode may be insulated from the bridging electrode portion 173 through the first interlayer layer 180.
[0136] Optionally, the orthographic projection of the touch layer 170 in the non-display area onto the substrate 110 and the orthographic projection of the second light-shielding structure 200 onto the substrate 110 may at least partially overlap. This can mean that the orthographic projection of at least one of the touch signal line 171, touch electrode 172, and bridging electrode portion 173 in the non-display area onto the substrate 110 may at least partially overlap with the orthographic projection of the second light-shielding structure 200 onto the substrate 110.
[0137] Optionally, the display panel 100 may also include a second interlayer 190 disposed on the side of the touch layer 170 opposite to the substrate 110, and the second light-shielding structure 200 may be disposed on the side of the second interlayer 190 opposite to the substrate 110.
[0138] In these optional embodiments, by setting the orthographic projection of the touch layer 170 in the non-display area onto the substrate 110 to at least partially overlap with the orthographic projection of the second light-shielding structure 200 on the substrate 110, the second light-shielding structure 200 can be used to block light reflected from the metal structure in the touch layer 170 in the non-display area. Since the light reflected from the metal structure in the touch layer 170 in the non-display area is weaker than that reflected from the metal structure in the substrate 110, the thickness of the second light-shielding structure 200 does not need to be excessive to adequately meet the blocking requirements of light reflected from the metal structure in the touch layer 170 in the non-display area. This facilitates the fabrication of the second light-shielding structure 200 and ensures that the fabricated second light-shielding structure 200 has good structural stability, thereby improving the overall structural stability of the display module 10.
[0139] Figure 4 This is a partial cross-sectional view of a display panel 100 provided in another embodiment of this application, exemplarily. Figure 4 Can be Figure 1 A partial cross-sectional view of another embodiment at point A.
[0140] like Figure 4 As shown, in some optional embodiments, the display module 10 may further include a middle frame 600 disposed around the display panel 100 and a third light-shielding structure 500 disposed between the middle frame 600 and the display panel 100.
[0141] Optionally, the third light-shielding structure 500 may also extend to the periphery of the second light-shielding structure 200 and the polarizer 300.
[0142] Optionally, the third light-shielding structure 500 may be connected to the first light-shielding structure 130 and the second light-shielding structure 200.
[0143] Optionally, the third light-blocking structure 500 can block light by absorbing it.
[0144] Optionally, the material of the third light-shielding structure 500 may include an opaque material, so that the third light-shielding structure 500 can effectively block light. For example, the material of the third light-shielding structure 500 may include a black organic material (e.g., black organic adhesive), so that the third light-shielding structure 500 can effectively block light by absorbing light.
[0145] For example, the third light-shielding structure 500 may be made of the same material as the first light-shielding structure 130 or the second light-shielding structure 200, or the materials of the first light-shielding structure 130, the second light-shielding structure 200 and the third light-shielding structure 500 may be different. This application does not make any specific limitations on it.
[0146] In these optional embodiments, the third light-shielding structure 500 disposed around the display panel 100 can be used to block light reflected from the side of the display panel 100, reduce the possibility of side light leakage, and improve the overall appearance of the display module 10.
[0147] Figure 5 This is a schematic flowchart of a method for manufacturing a display module 10 according to an embodiment of this application. Figures 6 to 10 This is a schematic diagram illustrating the preparation process of a display module 10 provided in an embodiment of this application.
[0148] The second aspect of this application provides a method for manufacturing a display module 10. The display module 10 manufactured by this method can be any of the display modules 10 provided in the first aspect of the application described above. Please refer to [link to relevant documentation]. Figures 5 to 10 and combined Figures 1 to 4 The display module 10 has a display area and a non-display area, and the manufacturing method includes:
[0149] Step S10: As Figure 6 As shown, at least a portion of the first light-shielding structure 130 located in the non-display area and a functional structure located in the display area are formed on the substrate 110 using a halftone mask, wherein the maximum thickness of the at least portion of the first light-shielding structure 130 is greater than the maximum thickness of the functional structure.
[0150] Optionally, before step S10, a first electrode 121 may be formed on the substrate 110.
[0151] Optionally, the functional structure may include either the pixel definition layer 140 or the support pillar 150. For example, when the functional structure includes the pixel definition layer 140, the first light-shielding structure 130 may include the first sub-light-shielding structure 131 in any of the foregoing embodiments; when the functional structure includes the support pillar 150, the first light-shielding structure 130 may include the second sub-light-shielding structure 132 in any of the foregoing embodiments.
[0152] In some embodiments, in step S10: a first sub-light-shielding structure 131 located in the non-display area and a pixel definition layer 140 located in the display area can be formed on the substrate 110 using a halftone mask, wherein the maximum thickness of the first sub-light-shielding structure 131 formed is greater than the maximum thickness of the pixel definition layer 140.
[0153] In some other embodiments, in step S10: a second sub-light-shielding structure 132 located in the non-display area and a support pillar 150 located in the display area can be formed on the substrate 110 using a halftone mask, wherein the maximum thickness of the formed second sub-light-shielding structure 132 is greater than the maximum thickness of the support pillar 150.
[0154] In some other embodiments, in step S10: a first light-shielding structure 130 located in the non-display area and a functional structure located in the display area can be formed on the substrate 110 using a halftone mask. The functional structure includes a pixel definition layer 140 and a support pillar 150. The first light-shielding structure 130 includes a first sub-light-shielding structure 131 disposed in the same layer and material as the pixel definition layer 140 and a second sub-light-shielding structure 132 disposed in the same layer and material as the support pillar 150. The maximum thickness of the pixel definition layer 140 is less than the maximum thickness of the first sub-light-shielding structure 131, and the maximum thickness of the support pillar 150 is less than the maximum thickness of the second sub-light-shielding structure 132.
[0155] Step S20: As Figure 7 As shown, a light-emitting device 120 is fabricated and formed within the display area.
[0156] Step S30: As Figures 8 to 10 As shown, a display panel 100 is fabricated, and a second light-shielding structure 200 is fabricated on the light-emitting side of the display panel 100, wherein the orthographic projection of the first light-shielding structure 130 on the substrate 110 and the orthographic projection of the second light-shielding structure 200 on the substrate 110 at least partially overlap.
[0157] Optionally, step S30 may include:
[0158] Step S31: As Figure 8 As shown, an encapsulation layer 160 is formed.
[0159] Step S32: As Figure 9 As shown, a touch layer 170 and a second interlayer 190 are formed on the encapsulation layer 160 to complete the fabrication of the display panel 100.
[0160] Step S33: As Figure 10 As shown, a second light-shielding structure 200 is prepared on the light-emitting side of the display panel 100, and the orthographic projection of the touch layer 170 in the non-display area on the substrate 110 at least partially overlaps with the orthographic projection of the second light-shielding structure 200 on the substrate 110.
[0161] In the fabrication method provided in this application embodiment, the first light-shielding structure 130, the second light-shielding structure 200, and the functional structure can all be used to limit the light reflected from the metal structure in the display module 10. By setting the orthographic projection of the first light-shielding structure 130 on the substrate 110 and the orthographic projection of the second light-shielding structure 200 on the substrate 110 to at least partially overlap, the light-shielding effects of the first light-shielding structure 130 and the second light-shielding structure 200 at the overlap position can be superimposed to meet the light-shielding requirements in the non-display area. This allows the thickness of the first light-shielding structure 130 and the second light-shielding structure 200 to be less than necessary, facilitating the fabrication of the first light-shielding structure 130 and the second light-shielding structure 200, and ensuring that the fabricated first light-shielding structure 130 and the second light-shielding structure 200 have good structural stability, thereby improving the overall structural stability of the display module 10.
[0162] By using a halftone mask to fabricate at least a portion of the first light-shielding structure 130 located in the non-display area and the functional structure located in the display area, it is easier to fabricate the first light-shielding structure 130 and the functional structure with different thicknesses, which can significantly improve the fabrication efficiency of the display module 10.
[0163] Since the thickness of the first light-shielding structure 130 is greater than the thickness of the functional structure, the functional structure located in the display area is less likely to have an excessive thickness. For example, the first light-shielding structure 130, which is closer to the substrate 110, can have a more suitable thickness, which can better improve the blocking effect of the first light-shielding structure 130 on the light reflected from the metal structure in the substrate 110. It also makes it less likely that the pixel definition layer 140 and the support pillar 150 located in the display area will have an excessive thickness, thereby reducing the light-emitting blocking effect of the functional structure in the display area on the light-emitting device 120 and better improving the light-emitting display effect of the display panel 100.
[0164] An embodiment of the third aspect of this application provides a display device, which includes a display module 10 of any of the above embodiments, or a display module 10 prepared by the preparation method of any of the above embodiments. Since the display device provided by the third aspect of this application includes the display module 10 of any of the first aspects, or a display module 10 prepared by the preparation method of any of the second aspects, the display device provided by the third aspect of this application has the beneficial effects of the display module 10 of any of the first aspects or the display module 10 prepared by the preparation method of any of the second aspects, which will not be elaborated further here.
[0165] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.
[0166] The embodiments described above are not exhaustive and do not limit the invention to specific examples. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.
Claims
1. A display module, characterized in that, The display module has a display area and a non-display area, and the display module includes: The display panel includes a substrate, a light-emitting device and a first light-shielding structure located on the same side of the substrate, wherein the light-emitting device is disposed in the display area and the first light-shielding structure is disposed in the non-display area; The second light-shielding structure is disposed in the non-display area and located on the light-emitting side of the display panel. Wherein, the orthographic projection of the first light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap.
2. The display module according to claim 1, characterized in that, The maximum thickness of the first light-shielding structure is greater than the maximum thickness of the second light-shielding structure, and / or the maximum light density of the first light-shielding structure is greater than the maximum light density of the second light-shielding structure; Preferably, the maximum thickness of the first light-shielding structure is not less than 2 micrometers and not more than 6 micrometers, and / or the maximum thickness of the second light-shielding structure is not less than 0.8 micrometers and not more than 1.2 micrometers; Preferably, the maximum light density of the first light-shielding structure is not less than 3.6, and / or the maximum light density of the second light-shielding structure is not less than 0.
8.
3. The display module according to claim 1, characterized in that, The display panel further includes a pixel definition layer disposed on one side of the substrate. The pixel definition layer located in the display area has a pixel opening. At least a portion of the light-emitting devices are located in the pixel opening. The first light-shielding structure includes a first sub-light-shielding structure disposed on the same layer as the pixel definition layer. The orthographic projection of the first sub-light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap. Preferably, the maximum thickness of the first sub-shading structure is greater than the maximum thickness of the second shading structure, and / or the maximum light density of the first sub-shading structure is greater than the maximum light density of the second shading structure; Preferably, the maximum thickness of the first sub-shading structure is not less than 1 micrometer and not more than 3 micrometers, and / or the maximum thickness of the second light-shielding structure is not less than 0.8 micrometers and not more than 1.2 micrometers; Preferably, the maximum light density of the first light-shielding structure is not less than 1.8, and / or the maximum light density of the second light-shielding structure is not less than 0.8; Preferably, the first sub-shielding structure and the second shielding structure are made of different materials; Preferably, the pixel definition layer and the first sub-light-shielding structure are made of the same material; Preferably, the maximum thickness of the pixel definition layer is less than the maximum thickness of the first sub-shading structure; Preferably, the maximum thickness of the pixel definition layer is not less than 0.8 micrometers and not more than 1.2 micrometers.
4. The display module according to claim 3, characterized in that, The first sub-light-shielding structure is spaced apart from the pixel definition layer. The first sub-light-shielding structure has a first side surface on the side facing the display area. In the direction away from the substrate, the first side surface is gradually inclined toward the substrate.
5. The display module according to claim 1, characterized in that, The display panel further includes a pixel definition layer disposed on one side of the substrate and a support column disposed on the side of the pixel definition layer opposite to the substrate. The first light-shielding structure includes a second sub-light-shielding structure disposed on the same layer as the support column. The orthographic projection of the second sub-light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap. Preferably, the maximum thickness of the second sub-shading structure is greater than the maximum thickness of the second light-shielding structure, and / or, the maximum light density of the second sub-shading structure is greater than the maximum light density of the second light-shielding structure; Preferably, the maximum thickness of the second sub-shading structure is not less than 1 micrometer and not more than 3 micrometers, and / or the maximum thickness of the second light-shielding structure is not less than 0.8 micrometers and not more than 1.2 micrometers; Preferably, the maximum light density of the second light-shielding structure is not less than 1.8, and / or the maximum light density of the second light-shielding structure is not less than 0.8; Preferably, the second sub-shielding structure is made of a different material than the second shielding structure; Preferably, the support column and the second sub-shading structure are made of the same material; Preferably, the maximum thickness of the support column is less than the maximum thickness of the second sub-shading structure; Preferably, the maximum thickness of the support column is not less than 0.8 micrometers and not more than 1.2 micrometers.
6. The display module according to claim 5, characterized in that, The first light-shielding structure further includes a first sub-light-shielding structure disposed on the same layer as the pixel definition layer. The orthographic projection of the first sub-light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap, and the second sub-light-shielding structure is disposed on the side of the first sub-light-shielding structure away from the substrate. Preferably, the maximum thickness of the first sub-shading structure is the same as the maximum thickness of the second sub-shading structure, and / or, the maximum optical density of the first sub-shading structure is the same as the maximum optical density of the second sub-shading structure. Preferably, the first sub-shading structure and the second sub-shading structure are made of the same material.
7. The display module according to any one of claims 1 to 6, characterized in that, The substrate includes a substrate and a driving circuit located on the side of the substrate facing the light-emitting device. At least a portion of the driving circuit in the non-display area has its orthographic projection on the substrate located within the orthographic projection of the first light-shielding structure and / or the second light-shielding structure on the substrate. And / or, the display panel further includes a touch layer located on the side of the light-emitting device away from the substrate, wherein the orthographic projection of the touch layer in the non-display area onto the substrate at least partially overlaps with the orthographic projection of the second light-shielding structure onto the substrate.
8. A method for manufacturing a display module, characterized in that, The display module has a display area and a non-display area, and the manufacturing method includes: At least a portion of a first light-shielding structure located in the non-display area and a functional structure located in the display area are prepared on a substrate using a halftone mask, wherein the maximum thickness of the at least portion of the first light-shielding structure is greater than the maximum thickness of the functional structure. Fabricate and form a light-emitting device located within the display area; A display panel is prepared, and a second light-shielding structure is prepared on the light-emitting side of the display panel, wherein the orthographic projection of the first light-shielding structure on the substrate and the orthographic projection of the second light-shielding structure on the substrate at least partially overlap.
9. The preparation method according to claim 8, characterized in that, In the step of fabricating at least a portion of the first light-shielding structure located in the non-display area and the functional structure located within the display area on the substrate using a halftone mask: A first light-shielding structure located in the non-display area and a functional structure located in the display area are fabricated on a substrate using a halftone mask. The functional structure includes a pixel definition layer and a support pillar. The first light-shielding structure includes a first sub-light-shielding structure disposed in the same layer and material as the pixel definition layer and a second sub-light-shielding structure disposed in the same layer and material as the support pillar. The maximum thickness of the pixel definition layer is less than the maximum thickness of the first sub-light-shielding structure, and the maximum thickness of the support pillar is less than the maximum thickness of the second sub-light-shielding structure.
10. A display device, characterized in that, It includes the display module as described in any one of claims 1 to 7, or the display panel prepared by the preparation method as described in any one of claims 8 or 9.