Packaging equipment motion actuator multi-axis micro-drive compensation method and device

Abstract

The present application relates to the field of integrated circuit manufacturing technology, and particularly relates to a packaging equipment motion execution mechanism multi-axis micro drive compensation method and device. First, a packaging equipment coordinate system is established, and an output vector of a multi-axis micro drive compensation platform is constructed; an XY macro motion device drives a bond head to move to a target position, and a bearing device drives a chip to move to a target height; a lateral inherent offset amount generated by the bond head swinging around a fixed rotation shaft and a posture deviation at a contact instant are calculated, and an output vector of displacement compensation is obtained; at least the multi-axis micro drive compensation platform performs displacement compensation according to the obtained output vector; a comparison is made between an actual position of the bond head end and a theoretical target position, and when a position error is less than or equal to a preset threshold, a bonding action is performed; otherwise, the output vector is iterated. With the multi-axis micro drive compensation platform having arc compensation, the arc motion error generated at the end during the up-and-down swinging of the bond head can be effectively reduced or eliminated, the bond head can realize normal bonding contact to the chip pad, and the wire precision is significantly improved.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to a multi-axis micro-drive compensation method and device for the motion actuator of packaging equipment. Background Technology

[0002] Packaging equipment such as wire bonders / bonding machines use ultra-fine metal wires to connect chip pads to substrates / frames, achieving electrical conductivity and mechanical fixation, completing one of the packaging steps in integrated circuit manufacturing. The welding accuracy, solder joint consistency, and stability of wire bonders directly affect the reliability and yield of packaged devices. As integrated circuits develop towards higher density, miniaturization, and higher reliability, the wire bonding process places higher demands on welding position accuracy and repeatability. The bonding head of a wire bonder is connected to a wedge at its end, used to bond ultra-fine metal wires to chip pads and substrates. The bonding head often uses a swinging motion mechanism around a fixed axis to achieve downward pressure during the welding process. For example, in the bonding head component motion mechanism of a wire bonder disclosed in CN121061451A, in addition to Z-axis movement during the downward and upward processes, horizontal displacement is also inevitable, causing a difference between the actual landing point and the ideal landing point of the bonding head, thus resulting in welding errors and reducing wire bonding accuracy.

[0003] A common solution in existing technologies is to offset the tangential force of the bonding head by using the lateral movement of the wire bonding machine's motion platform. However, this can also cause operational instability, as illustrated in the solder joint enhancement type wire bonding device disclosed in CN116013827A. Other improvements involve reducing the oscillation angle of the bonding head or increasing its length to decrease the horizontal displacement of the bonding head. This method, through geometric adjustments, mitigates the impact of circular motion on welding accuracy to some extent, but it doesn't fundamentally change the oscillation motion of the bonding head around its axis; the circular motion error still objectively exists. When welding accuracy requirements increase further, the compensation capability of this method is significantly limited. Existing micro-drive compensation devices utilize voice coil motors or piezoelectric ceramics for precise displacement compensation. These devices are mainly used in precision positioning, optical alignment, and scanning platforms, but they do not compensate for the circular coupling error generated during the pressing / lifting of the wire bonding head or the tangential force component caused by the included angle. Summary of the Invention

[0004] The purpose of this invention is to propose a multi-axis micro-drive compensation method and device for the motion actuator of packaging equipment. With a multi-axis micro-drive compensation platform with arc compensation, it can effectively reduce or eliminate the arc motion error generated at the end of the bonding head during the up and down swinging process, realize the positive bonding contact between the bonding head and the chip pad, and significantly improve the bonding accuracy.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A multi-axis micro-drive compensation method for a packaging equipment motion actuator, the packaging equipment including a bearing head, the bearing head swinging around a fixed axis, the bearing head being mounted on a multi-axis micro-drive compensation platform, the multi-axis micro-drive compensation platform including an XY-axis compensation mechanism, a Z-axis compensation mechanism, a circular arc compensation mechanism and an end platform, the end platform being fixed to the output end of the circular arc compensation mechanism, the circular arc compensation mechanism being fixed to the output end of the Z-axis compensation mechanism, the bearing head being fixed to the end platform, and the multi-axis micro-drive compensation platform being fixed to the motion end of the XY macro-drive device;

[0007] The method includes the following steps:

[0008] S1: Establish the coordinate system of the packaging equipment and construct the output vector of the multi-axis micro-drive compensation platform;

[0009] S2: The XY macro-motion device moves the solder head to the target position, and the carrier device moves the chip to the target height. The target position is located directly above the solder joint.

[0010] S3: Calculate the lateral inherent offset generated by the swing of the head around the fixed axis and the attitude deviation at the moment of contact to obtain the displacement compensation output vector;

[0011] S4: At least the multi-axis micro-drive compensation platform performs displacement compensation based on the obtained output vector;

[0012] S5: Collect the actual position of the end of the bonding head after displacement compensation and compare it with the theoretical target position. If the position error is less than or equal to the preset threshold, perform the bonding action; otherwise, iteratively execute steps S3 and S4.

[0013] Furthermore, in step S1, the normal direction of the solder pad is taken as the Z-axis, and the direction of the solder wire exit is taken as the X-axis. t axis, and X t The direction that is perpendicular to the axis and lies within the tangent plane of the pad is Y. t axis;

[0014] The output vector of the multi-axis micro-drive compensation platform is u=[ux,uy,uz,uΦy]. T Where ux, uy, and uz are the three-dimensional micro-displacements around the Xt, Yt, and Z axes, respectively, and uΦy are the three-dimensional micro-displacements around the Yt axis, respectively. t Micro-attitude correction in the axial direction.

[0015] Furthermore, in step S3, the equivalent length of the head is L, and the swing axis of the head is taken relative to the Σb system around Y. t The oscillation angle of the axis is θ, and the center of the oscillation axis is... The theoretical position of the macro-motion end is:

[0016] ;

[0017] Using the nominal solder joint position corresponding to the reference swing angle θ0 as the zero point, the reference swing angle θ for ideal bonding 0= 0, the inherent lateral offset at the end caused by the circular arc swing is:

[0018] ,

[0019] Where Δxarc is the lateral drift term caused by the inherent circular arc trajectory of the swing mechanism, i.e., X t The arc offset of the axis, Δyarc is the Y t The radius of the axis;

[0020] Calculate the current swing angle: h is the expected downward pressure on the head (h > 0).

[0021] Therefore, the lateral displacement of the geometric feedforward compensation is: ;

[0022] The feedforward compensation amount is: ;

[0023] Additional height deviation introduced by attitude correction performed by the circular arc compensation mechanism: r is the radius of rotation of the circular arc device;

[0024] The resulting output vector is: .

[0025] Furthermore, step S3 also includes considering assembly eccentricity and / or the positioning error of the XY macro-motion device, superimposing the assembly eccentricity error and / or the positioning error of the XY macro-motion device with the head swing deviation, and calculating the output vector of the multi-axis micro-drive compensation platform.

[0026] Furthermore, the calculation method for compensation when considering assembly eccentricity includes:

[0027] The selection matrix for projecting assembly eccentricity e=(ex,ey,ez) onto the pad plane is obtained. The end-effector lateral drift caused by assembly eccentricity is:

[0028] , Rotation θ about the Yt axis k The rotation matrix of the angle;

[0029] Expanded to:

[0030] ;

[0031] Compensation is achieved by using an industrial computer to drive a multi-axis micro-drive device. The micro-drive compensation amount is:

[0032] , ;

[0033] The resulting output vector is: .

[0034] Furthermore, methods for considering the positioning error of the XY macro-motion device include:

[0035] The motion error of the XY macro-motion device in real time is ΔX m ΔY m ΔZ m ;

[0036] Then, X t Macroscopic error compensation amount ;

[0037] Yt direction macro motion error compensation amount ;

[0038] Z-axis macroscopic error compensation ;

[0039] The output vector obtained by superimposing the assembly eccentricity error, the positioning error of the XY macro-motion device, and the swing deviation of the assembly head is:

[0040] .

[0041] Furthermore, in step S5, the theoretical target position of the end of the plug after displacement compensation on the Xt axis is x, and the actual position is x1.

[0042] Set the preset threshold condition as |x1-x|≤ε.

[0043] A multi-axis micro-drive compensation device for the motion actuator of packaging equipment includes a control device and a multi-axis micro-drive compensation platform, used to implement the above-mentioned multi-axis micro-drive compensation method for the motion actuator of packaging equipment.

[0044] The packaging equipment includes a connector, which swings around a fixed axis. The connector is mounted on a multi-axis micro-drive compensation platform. The multi-axis micro-drive compensation platform includes an XY-axis compensation mechanism, a Z-axis compensation mechanism, an arc compensation mechanism, and an end platform. The connector is fixed to the end platform, and the multi-axis micro-drive compensation platform is fixed to the moving end of the XY macro-drive device.

[0045] The Z-axis compensation mechanism is located at the motion output end of the XY-axis compensation mechanism, the circular arc compensation mechanism is located at the motion output end of the Z-axis compensation mechanism, and the end platform is located at the motion output end of the circular arc compensation mechanism.

[0046] The control device is used to calculate the output vector of displacement compensation and issue motion commands to the XY macro actuator, the multi-axis micro-drive compensation platform and / or the load-bearing device.

[0047] Furthermore, the arc compensation mechanism includes a driving component and an arc-shaped cross roller guide rail, the end platform is mounted on the arc-shaped cross roller guide rail, and the arc-shaped cross roller guide rail is mounted on the motion output end of the Z-axis compensation mechanism;

[0048] The drive component is used to drive the end platform along the arc-shaped cross roller guide and around the Y-shaped cross roller guide. t When the shaft rotates, the equivalent rotation center axis of the arc compensation mechanism coincides with the center axis of the fixed rotation axis of the head.

[0049] The technical solution provided by this invention may include the following beneficial effects:

[0050] This solution establishes a geometric feedforward compensation model based on the bonding machine's dedicated coordinate system. It calculates the lateral offset and attitude deviation introduced by the arc motion of the bonding head in real time, and drives the micro-drive unit to output equal-amplitude reverse compensation, enabling the bonding head end to achieve linear motion and positive vertical bonding. This accurately eliminates the lateral displacement and tangential force caused by the traditional arc motion of the bonding head, achieving vertical positive bonding and significantly improving solder joint consistency and bonding quality.

[0051] This solution eliminates the displacement error of the packaging head by adding a multi-axis micro-drive compensation platform, without changing the original macroscopic high-speed motion characteristics of the packaging equipment. It balances high cycle time and high precision, and has low modification and usage costs. This invention also incorporates assembly eccentricity compensation and XY macro-motion platform positioning error compensation functions, comprehensively improving system accuracy.

[0052] The modular design of the system in this invention is easy to integrate, highly adaptable, and can be quickly applied to different models of wire bonding machines / bonding machines, making it highly valuable for engineering applications. Attached Figure Description

[0053] Figure 1 This is a flowchart illustrating a multi-axis micro-drive compensation method for a motion actuator in a packaging device according to an embodiment of the present invention.

[0054] Figure 2 This is a control schematic diagram of a multi-axis micro-drive compensation method for the motion actuator of a packaging equipment according to another embodiment of the present invention;

[0055] Figure 3 yes Figure 3 A schematic diagram of a multi-axis micro-drive compensation platform installed on a packaging device in one embodiment of the present invention;

[0056] Figure 4 This is a schematic diagram showing the cooperation between the multi-axis micro-drive compensation platform and the bearing device;

[0057] Figure 5 This is a schematic diagram of the coordinate system Σb of the encapsulated equipment;

[0058] Among them, XY macro-motion device 1, bearing device 2, head 3, splitting blade 31, chip 4, multi-axis micro-drive compensation platform 5, XY axis compensation mechanism 51, motion output end of XY axis compensation mechanism 511, motion output end of Z axis compensation mechanism 521, arc-shaped cross roller guide rail 531, and end platform 53. Detailed Implementation

[0059] The present invention will be further illustrated below with reference to specific embodiments. It should be understood that the specific embodiments described herein are for illustrative and explanatory purposes only and are not intended to limit the present invention.

[0060] Reference Figure 1-5 An embodiment of the present invention provides a multi-axis micro-drive compensation method for a packaging equipment motion actuator. The packaging equipment includes a header 3, which swings around a fixed axis. The header 3 is mounted on a multi-axis micro-drive compensation platform 5. The multi-axis micro-drive compensation platform 5 includes an XY-axis compensation mechanism 51, a Z-axis compensation mechanism, an arc compensation mechanism, and an end platform 53. The header 3 is fixed to the end platform 53. The multi-axis micro-drive compensation platform 5 is fixed to the motion end of the XY macro-motion device 1.

[0061] The method includes the following steps:

[0062] S1: Establish the coordinate system Σb of the packaging equipment and construct the output vector of the multi-axis micro-drive compensation platform 5;

[0063] S2: The XY macro-motion device 1 drives the solder head 3 to the target position, and the carrier device 2 drives the chip 4 to the target height. The target position is located directly above the solder joint.

[0064] S3: Calculate the lateral inherent offset generated by the swing of the head 3 around the fixed axis and the attitude deviation at the moment of contact to obtain the displacement compensation output vector;

[0065] S4: At least the multi-axis micro-drive compensation platform 5 performs displacement compensation based on the obtained output vector;

[0066] S5: Collect the actual position of the end of the connector 3 after displacement compensation and compare it with the theoretical target position. If the position error is less than or equal to the preset threshold, perform the bonding action; otherwise, iteratively execute steps S3 and S4.

[0067] This solution compensates for the lateral coupling error and tangential force generated by the arc motion of the bonding head 3 through geometric feedforward and closed-loop control, achieving positive vertical bonding and significantly improving weld consistency and bonding quality, while also increasing welding precision. Specifically, the multi-axis micro-drive compensation platform 5 is rigidly connected to the bonding head 3. A geometric feedforward compensation model is established based on the bonding machine's dedicated coordinate system to calculate the lateral offset and attitude deviation introduced by the arc motion in real time. The micro-drive unit of the multi-axis micro-drive compensation platform 5 outputs a constant amplitude reverse compensation amount, enabling the end of the bonding head 3 to achieve linear motion and positive vertical bonding. This invention can effectively improve the arc characteristics of the bonding head 3 in the small displacement process of the traditional bonding head 3 structure, reduce the elastic deformation and hysteresis caused by the flexible fulcrum / leaf spring, and improve the overall welding precision and process stability of the wire bonding machine.

[0068] The XY macro-motion device 1 is used to realize the positioning movement of the connector 3 in the plane, the end platform 53 is used to support the connector 3, and the support device 2 is used to transport the chip 4 to the specified height (target height). The multi-axis micro-motion compensation platform is used to provide micro-displacement compensation for the connector 3 and / or for fine pressure control near the contact point. The arc compensation mechanism has an angle compensation function, which compensates for the tangential angle θ to reduce or eliminate the tangential force generated by the arc movement of the connector 3. The XY axis compensation mechanism 51 is used to compensate for the lateral micro-displacement error generated by the connector 3, reducing or eliminating the error caused by the movement of the connector 3. In another embodiment, it can also be used to compensate for the displacement compensation of the XY macro-motion end, improve the accuracy of the XY motion platform, and ultimately make the composite motion trajectory of the connector 3 meet the straightness requirements, thereby reducing the lateral coupling error caused by the Z-axis swing of the traditional rocker arm / swing type connector 3. The Z-axis compensation mechanism is used to compensate for the Z-axis error caused by the support device and / or the swing of the connector. The connector 3 is fixedly installed on the end platform 53 of the multi-axis micro-drive compensation platform 5. The two are rigidly connected so that the end of the connector 3 can make deterministic movements with the multi-axis micro-drive compensation platform 5, thereby improving the accuracy and repeatability of the movement.

[0069] In one embodiment of the present invention, in step S1, the normal direction of the solder pad is taken as the Z-axis, and the direction of the solder wire exit is taken as the X-axis. t axis, and X t The direction that is perpendicular to the axis and lies within the tangent plane of the pad is Y. t axis;

[0070] The output vector of the multi-axis micro-drive compensation platform 5 is u=[ux,uy,uz,uΦy]. T Where ux, uy, and uz are the three-dimensional micro-displacements along the Xt, Yt, and Z axes, respectively, and uΦy are the three-dimensional micro-displacements along the Yt, Yt, and Z axes, respectively. t Micro-attitude correction in the axial direction.

[0071] The coordinate system Σb (Xt axis, Yt axis, Z axis) is a dedicated process coordinate system for the bonding machine, strictly aligned with the pad plane and the wire exit direction to ensure that the error calculation matches the actual solder joint position. The output vector contains 3 translational degrees of freedom and 1 rotational degree of freedom, covering all coupling errors generated by the arc motion of the bonding head 3. The micro-attitude correction uΦy is specifically used to eliminate the tangential tilt angle and tangential force when the bonding head 3 is pressed down. This scheme achieves synchronous compensation of displacement and attitude by constructing a four-dimensional output vector, which can completely eliminate the lateral offset and tilt angle errors caused by the arc motion. Through multi-axis decoupling output, the control logic is clear, facilitating real-time calculation and high-speed drive, and adapting to high-cycle bonding conditions.

[0072] Specifically, in step S3, the equivalent length of the head 3 is L, and the swing axis of the head 3 is taken relative to the Σb system around Y. t The oscillation angle of the axis is θ, and the center of the oscillation axis is... The theoretical position of the macro-motion end is:

[0073] ;

[0074] Using the nominal solder joint position corresponding to the reference swing angle θ0 as the zero point, the reference swing angle θ for ideal bonding 0= 0, the inherent lateral offset at the end caused by the circular arc swing is:

[0075] ,

[0076] Where Δxarc is the lateral drift term caused by the inherent circular arc trajectory of the swing mechanism, i.e., X t The arc offset of the axis, Δyarc is the Y t The radius of the axis;

[0077] Calculate the current swing angle: h is the expected downward pressure of Bangtou 3 (h>0).

[0078] Therefore, the lateral displacement of the geometric feedforward compensation is: ;

[0079] The feedforward compensation amount is: ;

[0080] Additional height deviation introduced by attitude correction performed by the circular arc compensation mechanism: Δuz=r(1-cosθ) k ), where r is the radius of rotation of the circular arc device;

[0081] The resulting output vector is: u=[ ,0,-Δuz, ] T .

[0082] Among them, the equivalent length L of the swivel head 3 is the effective length from the swing center to the tip of the chopping blade 31, and is the core parameter of geometric compensation. The swing axis rotates around the Yt axis, so there is no inherent circular arc offset in the Yt and Z directions, only Δxarc exists in the Xt direction. The geometric feedforward compensation is equal amplitude reverse compensation, that is... This corrects the trajectory of the end of the bond head 3 from a circular arc to a straight line. Based on a pure geometric model, this method solves errors with low computational cost and strong real-time performance, making it suitable for high-speed dynamic compensation. It eliminates the lateral coupling error of the circular arc at the root of the motion, enabling the bond head 3 to achieve pure vertical positive bonding without altering the original macro-motion structure, preserving high speed and high rigidity, while simultaneously achieving high-precision compensation.

[0083] In one embodiment of the present invention, step S3 further includes considering assembly eccentricity and / or the positioning error of the XY macro-motion device 1, superimposing the assembly eccentricity error and / or the positioning error of the XY macro-motion device 1 with the swing deviation of the head 3, and calculating the output vector of the multi-axis micro-drive compensation platform 5.

[0084] Assembly eccentricity stems from systematic deviations during installation, machining, and fastening, and is a deterministic systematic error. XY macro-positioning errors originate from the platform's lead screw, guide rails, and servo lag, and are dynamic motion errors. This solution unifies and superimposes these three types of errors, outputting them in a single step to achieve global error compensation. This integrated compensation of multi-source errors significantly improves overall positioning accuracy.

[0085] Specifically, the calculation methods for compensation when considering assembly eccentricity include:

[0086] The assembly eccentricity is obtained as e = [ex, ey, ez]. T Selection matrix projected onto the pad plane The end-effector lateral drift caused by assembly eccentricity is:

[0087] , Rotation θ about the Yt axis k The rotation matrix of the angle;

[0088] Expanded to:

[0089] ;

[0090] Compensation is achieved by using an industrial computer to drive a multi-axis micro-drive device. The micro-drive compensation amount is:

[0091] , ;

[0092] The resulting output vector is: .

[0093] Rotation matrix Matrix modeling is used to describe the spatial position change of the eccentricity during the oscillation process. The matrix St is selected to project the three-dimensional error onto the pad plane, retaining only the lateral component that affects the bonding, so that the compensation is more rigorous, closer to the actual structure, and has higher compensation accuracy.

[0094] Specifically, methods for considering the positioning error of the XY macro-motion device 1 include:

[0095] Then, X t Macroscopic error compensation amount ;

[0096] Yt direction macro motion error compensation amount ;

[0097] Z-axis macroscopic error compensation ;

[0098] The output vector obtained by superimposing the assembly eccentricity error, the positioning error of the XY macro-motion device 1, and the swing deviation of the connector 3 is:

[0099] .

[0100] In this solution, the macro-motion error is acquired in real time by the grating ruler, forming a "macro-motion + micro-motion" dual closed loop. The compensation components in the Xt, Yt, and Z directions are calculated independently and output synchronously without mutual interference. The micro-motion platform simultaneously undertakes the error compensation of the Bangtou 3 and the macro-motion error compensation, comprehensively improving the three-axis positioning accuracy.

[0101] Furthermore, in step S5, the theoretical target position of the end of the connector 3 on the Xt axis after displacement compensation is x, and the actual position is x1; a preset threshold condition is set as |x1-x|≤ε. ε is the allowable process error, typically 0.1–0.5μm, which can be adjusted for fine pitch or micro solder joints.

[0102] Reference Figure 3-5 Accordingly, the present invention also provides a multi-axis micro-drive compensation device for the motion actuator of packaging equipment, including a control device and a multi-axis micro-drive compensation platform 5, for implementing the above-mentioned multi-axis micro-drive compensation method for the motion actuator of packaging equipment.

[0103] The packaging equipment includes a connector 3, which swings around a fixed axis. The connector 3 is mounted on a multi-axis micro-drive compensation platform 5. The multi-axis micro-drive compensation platform 5 includes an XY-axis compensation mechanism 51, a Z-axis compensation mechanism, an arc compensation mechanism, and an end platform 53. The connector 3 is fixed to the end platform 53. The multi-axis micro-drive compensation platform 5 is fixed to the moving end of the XY macro-drive device 1.

[0104] The circular arc compensation mechanism is disposed at the motion output end 521 of the Z-axis compensation mechanism, and the end platform 53 is disposed at the motion output end of the circular arc compensation mechanism;

[0105] The control device is used to calculate the output vector of displacement compensation and issue motion commands to the XY macro-motion device 1, the multi-axis micro-drive compensation platform 5 and / or the load-bearing device 2.

[0106] The multi-axis micro-drive compensation platform 5 can be directly installed at the end of the motion platform of the packaging equipment, and the bonding head 3 is installed on the multi-axis micro-drive compensation platform 5 to achieve macro-motion coarse positioning superimposed with micro-motion fine compensation. No modification to the original equipment body is required, making the modification convenient. When the bonding head 3 moves, the appropriate micro-motion compensation parameters are obtained using the above method. The micro-drive and the bonding head 3 are rigidly connected, with fast dynamic response. The high-speed response characteristic of micro-motion is used to quickly compensate for the reverse offset, so that the end of the bonding head 3 can achieve a straight line motion trajectory during the up and down movement. This reduces or eliminates the lateral displacement and tangential force caused by the arc motion, improves the accuracy and repeatability of the contact position between the wire bonding tool and the pad, and enhances the positional accuracy and solder joint stability during the welding process, in order to meet the higher requirements of high-density packaging and fine welding processes for wire bonding equipment.

[0107] Reference Figure 2 As an example, the control device uses an industrial computer, which controls the XY macro motion device 1, the multi-axis micro-drive compensation platform 5 and / or the carrier device 2 to move the end of the connector 3 to the target position and the carrier device 2 to transport the chip 4 to the target position. Then, the multi-axis micro-drive compensation platform 5 is controlled to perform displacement compensation for positioning error and arc motion error.

[0108] Reference Figure 4 Furthermore, the arc compensation mechanism includes a driving component and an arc-shaped cross roller guide 531, the end platform 53 is mounted on the arc-shaped cross roller guide 531, and the arc-shaped cross roller guide 531 is mounted on the motion output end 521 of the Z-axis compensation mechanism;

[0109] The driving component is used to drive the end platform 53 along the arc-shaped slide rail and around the Y-shaped rail. t When the shaft rotates, the equivalent rotation center axis of the arc compensation mechanism coincides with the center axis of the fixed rotation axis of the head.

[0110] As an example, the center of the arc-shaped cross roller guide 531 is made completely coaxial with the swing axis of the head 3 to ensure precise coaxial attitude compensation. The driving component uses a piezoelectric motor or voice coil motor, which has large output torque, fast response, and accuracy down to the micro-radius level. As an example, both the X-axis compensation mechanism and the Y-axis compensation mechanism in the XY-axis compensation mechanism 51 use a cross roller guide structure, with the output end driven to move on the guide by a piezoelectric motor or voice coil motor.

[0111] As an example, the executable instructions in the method of the present invention can be deployed to be executed on a single computing device, or on multiple computing devices located at one location, or on multiple computing devices distributed across multiple locations and interconnected via a communication network.

[0112] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0113] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0114] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as read-only memory / random access memory, magnetic disk, optical disk) and includes several instructions to cause a multimedia terminal device (which may be a mobile phone, computer, television receiver, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0115] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A multi-axis micro-drive compensation method for a motion actuator in packaging equipment, characterized in that, The packaging equipment includes a mounting head that swings around a fixed axis. The mounting head is mounted on a multi-axis micro-drive compensation platform. The multi-axis micro-drive compensation platform includes an XY-axis compensation mechanism, a Z-axis compensation mechanism, a circular arc compensation mechanism, and an end platform. The end platform is fixed to the output end of the circular arc compensation mechanism, the circular arc compensation mechanism is fixed to the output end of the Z-axis compensation mechanism, the mounting head is fixed to the end platform, and the multi-axis micro-drive compensation platform is fixed to the moving end of the XY macro-motion device. The method includes the following steps: S1: Establish the coordinate system of the packaging equipment and construct the output vector of the multi-axis micro-drive compensation platform; S2: The XY macro-motion device moves the solder head to the target position, and the carrier device moves the chip to the target height. The target position is located directly above the solder joint. S3: Calculate the lateral inherent offset generated by the swing of the head around the fixed axis and the attitude deviation at the moment of contact to obtain the displacement compensation output vector; S4: At least the multi-axis micro-drive compensation platform performs displacement compensation based on the obtained output vector; S5: Collect the actual position of the end of the bonding head after displacement compensation and compare it with the theoretical target position. If the position error is less than or equal to the preset threshold, perform the bonding action; otherwise, iteratively execute steps S3 and S4.

2. The method according to claim 1, characterized in that, In step S1, the normal direction of the solder pad is taken as the Z-axis, and the direction of the solder wire exit is taken as the X-axis. t axis, and X t The direction that is perpendicular to the axis and lies within the tangent plane of the pad is Y. t axis; The output vector of the multi-axis micro-drive compensation platform is u=[ux,uy,uz,uΦy]. T Where ux, uy, and uz are the three-dimensional micro-displacements along the Xt, Yt, and Z axes, respectively, and uΦy is the displacement around the Y-axis. t Micro-attitude correction in the axial direction.

3. The method according to claim 1, characterized in that, In step S3, the equivalent length of the shank is L, and the swing axis of the shank is taken relative to the Σb system around Y. t The oscillation angle of the axis is θ, and the center of the oscillation axis is... The theoretical position of the macro-motion end is: ； Using the nominal solder joint position corresponding to the reference swing angle θ0 as the zero point, the reference swing angle θ for ideal bonding 0= 0, the inherent lateral offset at the end caused by the circular arc swing is: ， Where Δxarc is the lateral drift term caused by the inherent circular arc trajectory of the swing mechanism, i.e., X t The arc offset of the axis, Δyarc is the Y t The arc offset of the axis; Calculate the current swing angle: h represents the expected downward pressure on the head, and h > 0; Therefore, the lateral displacement of the geometric feedforward compensation is: ; The feedforward compensation amount is: ; Additional height deviation introduced by attitude correction performed by the circular arc compensation mechanism: r is the radius of rotation of the circular arc device; The resulting output vector is: .

4. The method according to claim 3, characterized in that, Step S3 further includes considering assembly eccentricity and / or the positioning error of the XY macro-motion device, superimposing the assembly eccentricity error and / or the positioning error of the XY macro-motion device with the head swing deviation, and calculating the output vector of the multi-axis micro-drive compensation platform.

5. The method according to claim 4, characterized in that, The calculation methods for compensation when considering assembly eccentricity include: The selection matrix for projecting assembly eccentricity e=(ex,ey,ez) onto the pad plane is obtained. The end-effector lateral drift caused by assembly eccentricity is: , Rotation θ about the Yt axis k The rotation matrix of the angle; Expanded to: ; Compensation is achieved by using an industrial computer to drive a multi-axis micro-drive device. The micro-drive compensation amount is: ， ； The resulting output vector is: .

6. The method according to claim 3, characterized in that, Methods for considering the positioning error of the XY macro actuator include: The motion error of the XY macro-motion device in real time is ΔX m ΔY m ΔZ m ; Then, X t Macroscopic error compensation amount ; Yt direction macro motion error compensation amount ; Z-axis macroscopic error compensation ; The output vector obtained by superimposing the assembly eccentricity error, the positioning error of the XY macro-motion device, and the swing deviation of the assembly head is: 。 7. The method according to claim 3, characterized in that, In step S5, the theoretical target position of the end of the plug after displacement compensation on the Xt axis is x, and the actual position is x1. Set the preset threshold condition as |x1-x|≤ε.

8. A multi-axis micro-drive compensation device for a motion actuator in packaging equipment, characterized in that, Includes a control device and a multi-axis micro-drive compensation platform, used to implement the multi-axis micro-drive compensation method for the motion actuator of the packaging equipment as described in any one of claims 1-7; The packaging equipment includes a connector, which swings around a fixed axis. The connector is mounted on a multi-axis micro-drive compensation platform. The multi-axis micro-drive compensation platform includes an XY-axis compensation mechanism, a Z-axis compensation mechanism, an arc compensation mechanism, and an end platform. The connector is fixed to the end platform, and the multi-axis micro-drive compensation platform is fixed to the moving end of the XY macro-drive device. The Z-axis compensation mechanism is located at the motion output end of the XY-axis compensation mechanism, the circular arc compensation mechanism is located at the motion output end of the Z-axis compensation mechanism, and the end platform is located at the motion output end of the circular arc compensation mechanism. The control device is used to calculate the output vector of displacement compensation and issue motion commands to the XY macro actuator, the multi-axis micro-drive compensation platform and / or the load-bearing device.

9. The system according to claim 8, characterized in that, The circular arc compensation mechanism includes a driving component and an arc-shaped cross roller guide rail. The end platform is mounted on the arc-shaped cross roller guide rail, and the arc-shaped cross roller guide rail is mounted on the motion output end of the Z-axis compensation mechanism. The driving component is used to drive the end along the arc-shaped slide rail and around the Y-shaped rail. t When the shaft rotates, the equivalent rotation center axis of the arc compensation mechanism coincides with the center axis of the fixed rotation axis of the head.

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