A multifunctional carrier suitable for micro-assembly

Abstract

The application discloses a multifunctional carrier suitable for micro-assembly and belongs to the field of advanced packaging integration. The carrier comprises a base and a multifunctional pressing block assembly; the front face of the base is provided with array-distributed cylindrical grooves and long groove, the back face is provided with a connecting groove, the long groove and the connecting groove are orthogonally distributed and a through hole is arranged at the intersection, and the end of the connecting groove is connected with a negative pressure generator; the multifunctional pressing block assembly comprises a pressing block, a top block, a mechanical column and a spring, the mechanical column is connected with the top block by penetrating through the pressing block and the spring, the outer side of the pressing block is provided with a positioning column, the positioning column is matched with the cylindrical groove to realize rapid positioning and model changing, and the front face of the base is further provided with a replaceable organic film. The end face of the top block is a 15-30 degree inclined plane and is provided with a soft gasket. The application supports rapid model changing operation of multi-specification products, significantly improves the stability and universality of product positioning, transmission and fixation in the micro-assembly process, and effectively reduces the tooling development cycle and cost.

Description

Technical Field

[0001] This invention belongs to the field of advanced packaging integration, specifically a multi-functional carrier tooling with adaptable structure for the precise positioning, transmission and fixation of miniaturized components (such as chip carriers, SIP, sensors and other miniaturized modules). Background Technology

[0002] Currently, electronic systems in aerospace, consumer electronics, automotive electronics, and medical fields are rapidly evolving towards higher integration, multi-functionality, miniaturization, and diverse specifications and appearances. However, given the sheer variety and diversity of traditional products, existing tooling fixtures are often limited to a single "specialized" model, resulting in a lengthy and complex cycle from solution design and production to tooling debugging. Therefore, the industry is generally forced to adopt multi-category tooling fixture solutions for diverse products. Looking at the current market, the mainstream tooling fixture technology systems can be mainly divided into two categories. The first type of technology (see patent: "A limiting device, restraint frame, and synchronous packaging and stable mounting method for semiconductors in advanced semiconductor packaging") mainly adopts a fixing method of "groove positioning combined with mechanical external force to clamp the product appearance." This type of tooling has the limitation of relatively single function and must rely on specialized machining processes to customize fixtures to match specific products and equipment. Its significant drawbacks are the high difficulty of manufacturing processes, long development cycles, and high manufacturing costs. The second type of technical approach (see patent: "Ultra-thin TGV through-hole glass fixture, air cushion mechanism and non-contact suction cup support for glass substrate in advanced semiconductor packaging process") utilizes the principle of bottom-surface vacuum adsorption to fix the product on top. However, this method has extremely high requirements for the flatness of the bottom surface of the product, ensuring that the contact surface is seamless and free of holes; in addition, such solutions generally lack rapid changeover design, resulting in them only being able to adapt to a single product specification, and performing poorly in terms of versatility and flexibility. Regardless of the production task of any specific tooling fixture, a huge investment of labor and time costs is required. In summary, how to develop a solution that can adapt to every product, support rapid changeover and diversified production, and ensure stable and reliable performance in multi-device interconnect packaging applications, while ensuring the stability and uniformity of the tooling fixing and positioning fixture, has become a major challenge facing the industry. Summary of the Invention

[0003] In view of this, the present invention aims to provide a universal tooling fixture suitable for micro-assembly processes. This fixture possesses excellent compatibility and flexibility, and can be widely adapted to various types of system-in-package (SIP), diverse specifications, and miniaturized modules. Its core feature lies in the integration of a dual-mode clamping mechanism combining "adjustable mechanical clamping" and "vacuum adsorption," and it supports rapid changeover operations for multiple product types, thereby effectively solving the pain points of existing technologies.

[0004] To achieve the above objectives, the present invention is implemented as follows: A multi-functional carrier suitable for micro-assembly includes a base (1) and a multi-functional pressure block assembly; The base (1) has an array of cylindrical grooves (7) on its front side. The multi-functional pressure block assembly includes a pressure block (3), a top block (5), a mechanical column (2), and a spring (4). One end of the mechanical column (2) passes through the pressure block (3) and the spring (4) and is connected to the top block (5). The mechanical column (2) has the freedom to slide along the central axis of the pressure block. The outer side of the pressure block (3) is provided with a positioning post (12); the multi-functional pressure block assembly is connected to the base through the cooperation of the cylindrical groove (7) and the positioning post (12); The base has a long groove (8) on the front and a connecting groove (15) on the back; the long groove (8) and the connecting groove (15) are orthogonally distributed and a through hole (10) is provided at the intersection point; the long groove (8) and the connecting groove (15) are connected through the through hole (10); the end of the connecting groove is connected to a negative pressure generator; The base also has a replaceable organic film on its front side.

[0005] Furthermore, the end face of the top block (5) is a slope with an angle of 15°-30°, and the end face of the top block (5) has a soft pad (13).

[0006] Furthermore, both the base (1) and the multifunctional pressure block assembly are made of materials with a coefficient of thermal expansion of less than 19.5 × 10⁻⁶. -6 Metals at / ℃.

[0007] Furthermore, a positioning frame (6) is provided on the upper right side of the base (1), and a round hole (11) is provided at the top corner of the positioning frame (6).

[0008] Furthermore, the multifunctional pressing block assembly is inserted into the array of cylindrical grooves (7) using positioning pins (12) to adjust its relative position.

[0009] By implementing the above technical solution, the present invention has achieved significant beneficial effects, specifically in the following four aspects: Compared to the inherent limitations of existing technologies that rely excessively on a single clamping mode, this invention innovatively integrates a dual-mode clamping mechanism of flexible clamping and vacuum adsorption. This dual-synergistic guarantee mechanism breaks free from the constraints of traditional single-operation methods. Through the complementary and redundant design of the two modes, it significantly enhances the operational stability of the product throughout the entire manufacturing process and greatly improves the reliability of the product's transfer and transmission between different devices. To address the issue of delays in existing technologies where drawing design and process manufacturing can only commence after module materials arrive, this invention optimizes the process: after module materials arrive, pre-set tooling fixtures can be directly called up for operation, eliminating the need to wait for additional design and processing steps, thereby effectively shortening the overall project cycle.

[0010] Compared to existing technologies, this invention innovatively introduces a pressure-driven mechanism for components, performing efficient one-step assembly and disassembly operations, thereby enabling rapid replacement of packaged products. This design not only significantly simplifies the overall process flow and greatly improves the product's adaptability to diverse scenarios, but also effectively reduces overall operating costs. This invention successfully achieves seamless switching and tight connection of the entire process of advanced packaging micro-assembly, completely eliminating the time loss caused by tooling replacement and model switching between different equipment, thereby significantly improving the continuous operation efficiency of the production line. Attached Figure Description

[0011] Figure 1 This is a top view in an embodiment of the present invention.

[0012] Figure 2 This is a bottom view in an embodiment of the present invention.

[0013] Figure 3 This is a side view of the multifunctional combined pressure block in an embodiment of the present invention.

[0014] Figure 4 It is a mechanical column in the embodiment of the present invention.

[0015] In the diagram: 1. Base; 2. Mechanical column; 3. Multiple pressure blocks; 4. Structural spring; 5. Top block; 6. Positioning frame; 7. Cylindrical groove; 8. Long groove; 9. Base step; 10. Through hole; 11. Round hole; 12. Positioning column; 13. Organic membrane. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention.

[0017] like Figures 1 to 4 As shown, this embodiment provides a multifunctional carrier suitable for micro-assembly processes. The carrier mainly includes a base 1 and at least one multifunctional pressing block assembly.

[0018] I. Base Structure See Figure 1 and Figure 2The base 1 is generally rectangular in shape, with multiple cylindrical grooves 7 precisely machined in an array on its front (upper surface). In this embodiment, the array is specifically a matrix distribution of 7 rows × 12 columns, but it is not limited to this and can be adjusted according to actual needs. The front of the base 1 also has multiple elongated grooves 8, specifically arranged in a matrix of 1 row × 13 columns. A connecting groove 15 is formed on the back (lower surface) of the base 1. The elongated grooves 8 and the connecting groove 15 are orthogonally distributed in space, and at each intersection, a through hole 10 is perpendicularly formed, thereby connecting the elongated grooves 8 on the front of the base with the connecting groove 15 on the back. The end of the connecting groove 15 is designed with an interface for connecting an external negative pressure generator (such as a vacuum pump).

[0019] In addition, a positioning frame 6 is provided on the upper right side of the front of the base 1. Each of the top corners of the positioning frame 6 has a round hole 11 for assisting positioning or docking with other equipment and to avoid damaging the corners of the workpiece. The edge of the base 1 is also provided with a base step 9 for installation with external tooling or equipment platform.

[0020] II. Multifunctional briquetting assembly structure like Figure 1 and Figure 3 As shown, the multi-functional pressing block assembly consists of a pressing block 3, a top block 5, a mechanical column 2, and a spring 4. The pressing block 3 has four positioning columns 12 protruding outwards from its main body bottom (see [reference]). Figure 3 One end (the inner end) of the mechanical column 2 passes through the through hole in the pressure block 3 and the spring 4 fitted on the mechanical column 2, and is then fixedly connected to the top block 5 by a threaded connection. The outer end of the mechanical column 2 protrudes from the outside of the pressure block 3 for easy operation and force application. Through this assembly relationship, the mechanical column 2 can slide back and forth relative to the pressure block 3 along the central axis of the pressure block 3, and compress or release the spring 4. The end face of the top block 5 (i.e., the end face that contacts the product to be clamped) is designed as a slope, and the angle α of the slope is 15° to 30°. A soft pad 13 is also adhered to the slope of the top block 5. The soft pad 13 can be made of organic film (such as high-temperature resistant tape, polyethylene film, etc.) or rubber elastic material to prevent damage to the product and increase friction.

[0021] III. Material Selection To ensure dimensional stability during temperature variations in the micro-assembly process and to avoid positioning errors due to thermal expansion, the main components of the base 1 and the multi-functional pressure block assembly (including the pressure block 3, mechanical column 2, and top block 5) are all made of materials with a thermal expansion coefficient of less than 19.5 × 10⁻. 6 Made of metallic materials at / ℃, preferably stainless steel or copper.

[0022] IV. Usage Methods and Working Process The multi-functional vehicle provided in this embodiment can be operated in actual use according to the following steps: Laying the organic film: First, lay a replaceable organic film (not shown in the figure) directly above the base 1. This organic film can be high-temperature resistant tape, polyethylene film, or other general-purpose film.

[0023] Constructing a vacuum channel: Based on the actual dimensions of the product module to be processed, use a cutting tool to cut the organic film at the positions corresponding to the long groove 8 and through hole 10 of the base 1, removing part of the film so that the long groove 8 forms a complete and unobstructed negative pressure adsorption airflow channel through the through hole 10 and the connecting groove 15 on the back.

[0024] Vacuum adsorption fixation of products: Place the circuit module to be processed (such as chip carrier, SIP module, sensor, etc.) on the laid and cut organic film and position it in the desired location. Activate the negative pressure generator connected to the end of the connecting groove 15. The vacuum suction is transmitted to the bottom of the product through the connecting groove 15, through hole 10, elongated groove 8, and the opening cut in the film, thereby stably and tightly adsorbing the product onto the surface of the base 1.

[0025] Mechanical clamping assisted fixation: Based on the product's dimensions and position, select the appropriate cylindrical groove 7 on the base 1. Insert the multi-functional clamping block assembly into these cylindrical grooves 7 via its four positioning pins 12 at the bottom for quick positioning and installation. Then, the operator presses or pushes the outer end of the mechanical pin 2 with their fingers. The mechanical pin 2 moves the top block 5 forward, compressing the spring 4. When the inclined end face of the top block 5 (with soft pad 13) contacts the side of the product, adjust the extension of the mechanical pin 2 appropriately, using the rebound force of the spring 4 to apply a flexible and adjustable lateral clamping force to the product. Since the positioning pins 12 and the cylindrical grooves 7 are arranged in an array, the user can insert the multi-functional clamping block assembly into different cylindrical grooves 7 according to the size of different products to achieve quick change clamping of products of different specifications.

[0026] Multi-process switching: After positioning and fixing, the entire multi-functional carrier (carrying the product) can be directly transferred between different devices in the micro-assembly production line to sequentially complete key processes such as dispensing, chip mounting, sintering, cleaning, automated optical inspection (AOI), and wire bonding. During this process, the dual modes of vacuum adsorption and flexible mechanical clamping work together to ensure the positional stability and reliability of the product during transfer and processing.

[0027] V. Working Principle and Verification of Beneficial Effects Through the above structure and usage method, this embodiment achieves the following technical effects: First, the vacuum adsorption mode is suitable for products with flat bottom surfaces, while the flexible mechanical clamping mode can be used for products with holes, gaps, or irregular bottom surfaces. The two complement each other, significantly enhancing the adaptability to products with different shapes. Second, the cooperation between the arrayed cylindrical grooves 7 and the positioning posts 12 allows for quick adjustment of the position of the multi-functional pressure block assembly, realizing "one-step" disassembly and assembly when switching product models, without the need to replace the entire base. Finally, all structures are integrated on the same base 1, avoiding the operation of transferring products between different tooling fixtures, thereby greatly shortening the production cycle and reducing labor and time costs.

Claims

1. A multifunctional carrier suitable for micro-assembly, comprising a base (1) and a multifunctional pressure block assembly; characterized in that, The base (1) has an array of cylindrical grooves (7) on its front side. The multi-functional pressure block assembly includes a pressure block (3), a top block (5), a mechanical column (2), and a spring (4). One end of the mechanical column (2) passes through the pressure block (3) and the spring (4) and is connected to the top block (5). The mechanical column (2) has the freedom to slide along the central axis of the pressure block. The outer side of the pressure block (3) is provided with a positioning post (12); the multi-functional pressure block assembly is connected to the base through the cooperation of the cylindrical groove (7) and the positioning post (12); The base has a long groove (8) on the front and a connecting groove (15) on the back; the long groove (8) and the connecting groove (15) are orthogonally distributed and a through hole (10) is provided at the intersection point; the long groove (8) and the connecting groove (15) are connected through the through hole (10); the end of the connecting groove is connected to a negative pressure generator; The base also has a replaceable organic film on its front side.

2. A multifunctional vehicle suitable for micro-assembly according to claim 1, characterized in that, The end face of the top block (5) is a slope with an angle of 15°-30°, and the end face of the top block (5) has a soft pad (13).

3. A multifunctional vehicle suitable for micro-assembly according to claim 1, characterized in that, Both the base (1) and the multi-functional pressure block assembly are made of materials with a coefficient of thermal expansion of less than 19.5 × 10⁻⁶. -6 Metals at / ℃.

4. A multifunctional vehicle suitable for micro-assembly according to claim 1, characterized in that, The base (1) has a positioning frame (6) on the upper right side, and the positioning frame (6) has a round hole (11) at the top corner.

5. A multifunctional vehicle suitable for micro-assembly according to claim 1, characterized in that, The multifunctional pressing block assembly uses positioning pins (12) to be inserted into the array of cylindrical grooves (7) for relative position adjustment.

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