Network communication chip processing equipment and processing method thereof

Abstract

The application relates to the technical field of semiconductor processing equipment, and discloses a network communication chip processing equipment and a processing method thereof. In order to solve the problem that tin balls are easy to be missed from ball grooves, a ball planting box is internally provided with ball grooves corresponding to semiconductor chips, a one-way air inlet valve communicated with an air pump is fixedly connected to the top of the ball planting box, when the ball scraping claw sweeps the tin balls from the ball grooves, the airflow input by the one-way air inlet valve is discharged from the ball grooves after flowing along the inner cavity of the ball planting box, in this way, when the tin balls pass through the ball grooves, the airflow flow direction guides the tin balls to move into the ball grooves, the airflow is used for guiding the movement direction of the tin balls, the problem of missing ball arrangement is avoided, and the purpose of airflow guiding tin ball arrangement is achieved.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor processing equipment, and in particular to a network communication chip processing equipment and its processing method. Background Technology

[0002] In the packaging process of network communication chips, the ball bonding process is the core step to achieve reliable interconnection between the chip and the packaging substrate. Its function is to form uniform solder ball bumps on the substrate pads, providing electrical connection channels, mechanical fixing support and heat dissipation paths for subsequent chip flip-chip soldering.

[0003] Traditionally, in the ball-mounting process for network communication chips, solder paste is first printed to ensure good wetting and adhesion of the pads. Then, a ball-mounting tray is aligned with the chip, and the solder balls are precisely delivered onto the chip pads via ball grooves on the tray. Finally, a hot air gun is used to heat the solder balls, firmly soldering them onto the chip. However, in practical applications, existing technologies typically use tools such as scrapers or brushes to sweep the solder balls into the ball grooves of the tray. Because this method relies on a large-scale sweeping motion to transport the solder balls, it is difficult for operators to detect in real time when solder balls fail to fall accurately into the grooves. Often, the defect of improperly placed solder balls is only discovered during subsequent optical image recognition inspection, leading to reduced product yield and increased rework costs. Therefore, there is an urgent need for a ball-mounting process that can effectively prevent solder balls from being lost from the ball grooves. Summary of the Invention

[0004] This invention proposes a network communication chip processing equipment and method, which has the advantage of airflow-guided solder ball arrangement, thereby solving the problem mentioned in the background art that solder balls are easily leaked from the ball groove.

[0005] To achieve the above objectives, this application adopts the following technical solution: a network communication chip processing equipment, comprising: a ball-mounting box, with a control center unit for overall machine control mounted on its surface, a ball-mounting cavity for accommodating solder balls inside, and a ball groove communicating with the ball-mounting cavity at the bottom; a ball-scraping motor, fixed to the bottom of the ball-mounting box and located on one side above the ball groove, with a ball-scraping claw fixedly mounted on the rotating shaft of the ball-scraping motor; when the ball-scraping motor drives the ball-scraping claw to rotate, the ball-scraping claw scoops up the solder balls in the ball-mounting cavity and pours them into the ball groove, where the solder balls flow along the surface of the ball groove under gravity, thus moving the solder balls into the ball groove; and a one-way air inlet valve, fixed to the top of the ball-mounting box and connected to an air pump, where airflow is blown into the ball-mounting cavity from the one-way air inlet valve and then discharged outward from the ball groove, the airflow path guiding the solder balls, thus moving the solder balls towards the ball groove.

[0006] Furthermore, a guide nozzle communicating with the ball planting cavity is provided on one side of the ball planting box surface, and the ball groove is aligned with the guide nozzle.

[0007] Furthermore, the ball groove is a stepped through hole, and the stepped area is arc-shaped, with a rubber ring fixedly connected to the arc-shaped stepped area.

[0008] Furthermore, a cylinder is fixedly installed on the back of the ball planting box, and a needle plate is fixedly installed on the output end of the cylinder. The cylinder drives the needle plate to move, so that the needle plate is pushed into / released from the ball groove.

[0009] Furthermore, mounting brackets are fixedly installed on both sides of the bulb-planting box, which allows the bulb-planting box to be arranged at an angle.

[0010] Furthermore, the surface of the ball planting box has a stop cover installed by a horizontal guide rail. The stop cover and the top of the guide nozzle are movably sealed. A servo motor is fixedly installed on the side of the ball planting box, and the output shaft of the servo motor is fixedly installed with a lead screw that is threadedly connected to the stop cover.

[0011] Furthermore, a ball collecting seat is installed in the ball planting box in a sealed manner. A spring is installed between the bottom of the ball collecting seat and the bottom of the inner side of the ball planting box. The bottom of the ball collecting seat and the area inside the ball planting box is set as a damping cavity. A damping hole and a one-way air return valve are provided at the bottom of the ball planting box, which are connected to the damping cavity. The one-way air return valve realizes the one-way flow of external airflow into the damping cavity. A positioning detection switch is fixedly installed at the bottom of the ball planting box.

[0012] Furthermore, a pressure sensor is fixedly installed on the top of the planting box, located on the side of the one-way air intake valve.

[0013] Furthermore, a locking frame is fixedly installed at the bottom of the ball collecting seat, and an "L"-shaped groove is opened on the inner side of the locking frame. A limiting shaft rod that is inserted into the "L"-shaped groove is fixedly installed at one end of the stop cover, and a guide sealing cover plate is movably installed on the surface of the ball planting box.

[0014] A method for fabricating a network communication chip includes the following steps:

[0015] S1. The control center unit regulates the servo motor to drive the stop cover to block the guide nozzle, so that the planting cavity of the planting box is connected to the outside only through the ball groove.

[0016] S2. The control center unit regulates the solenoid valve so that the air pump inputs continuous airflow into the ball planting cavity through the one-way air intake valve, and the airflow is discharged outward from the ball groove.

[0017] S3. The control center unit regulates the scraper motor to drive the scraper claw to rotate and scoop up the solder balls in the ball-planting cavity. Under the combined guidance of gravity and airflow, the solder balls flow along the scraper claw and enter the ball groove.

[0018] S4. The control center unit stops the air pump from supplying air and the scraper motor from working. The scraper claw deflects downward under the action of gravity.

[0019] S5. The control center unit regulates the servo motor to drive the stop cover away from the guide nozzle via the lead screw. The robot arm sends the chip printed with solder paste into the ball-planting cavity through the guide nozzle, so that the chip is aligned with the ball groove and attached to one side of the ball groove.

[0020] S6. The control center unit regulates the solenoid valve to supply air to the cylinder. The cylinder pushes the needle plate through the ball groove, and the solder ball in the ball groove is pressed against the solder paste on the chip, so that the solder ball is connected to the chip.

[0021] S7. After the chip is loaded with the ball, it is discharged from the guide nozzle. The control center unit adjusts the servo motor to make the stop cover seal the guide nozzle again, and returns to step one to execute the cycle.

[0022] The beneficial effects of this invention are as follows:

[0023] In the core electronics industry, to effectively avoid solder ball leakage during the ball placement process of semiconductor components, this invention provides a network communication chip processing equipment and method. The equipment features ball grooves inside a ball placement box, each corresponding to a semiconductor chip pad. A one-way air inlet valve connected to an air pump is fixedly connected to the top of the ball placement box. During operation, when the scraping claw sweeps the solder ball across the surface of the ball groove, the airflow input through the one-way air inlet valve flows along the inner cavity of the ball placement box and exits from the opening of the ball groove. The solder ball, guided by the airflow as it passes through the ball groove, accurately falls into the groove along a preset path, thus avoiding solder ball leakage caused by the large-scale sweeping motion of the scraping claw. This invention replaces the traditional purely mechanical sweeping method with airflow guidance, fundamentally reducing the probability of solder ball leakage defects, thereby improving the yield rate of the network communication chip ball placement process and providing an effective dedicated equipment solution for the packaging and manufacturing of high-end semiconductor devices in the core electronics industry. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort:

[0025] Figure 1 This is a schematic diagram of the overall external three-dimensional structure of the present invention;

[0026] Figure 2 This is a schematic diagram of the overall internal three-dimensional structure of the present invention;

[0027] Figure 3 This is a three-dimensional structural diagram of the back of the planting box of the present invention;

[0028] Figure 4This is a three-dimensional structural diagram of the front of the ball-planting box of the present invention;

[0029] Figure 5 This is a three-dimensional structural diagram of the side of the baffle cover of the present invention;

[0030] Figure 6 This is a schematic diagram of the overall side planar cross-sectional structure of the present invention;

[0031] Figure 7 For the present invention Figure 6 Enlarged structural diagram of the area at point E in the middle.

[0032] In the diagram: 1. Ball planting box; 101. Guide nozzle; 2. One-way air intake valve; 3. Control center unit; 4. Damping orifice; 5. One-way air return valve; 6. Baffle cover; 7. Servo motor; 8. Lead screw; 9. Guide sealing cover plate; 10. Movement limiting shaft; 11. Ball groove; 110. Rubber ring sleeve; 12. Scraper claw; 13. Scraper motor; 14. Ball collecting seat; 15. Locking frame; 16. Position detection switch; 17. Needle plate; 18. Cylinder. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Example 1, please refer to Figures 1-4 It can be seen that a control center unit 3 for regulating the entire machine is fixedly installed on the surface of the ball-planting box 1. The ball-planting box 1 has a ball-planting cavity for accommodating solder balls inside. A guide nozzle 101 communicating with the ball-planting cavity is provided on one side of the surface of the ball-planting box 1. Generally, the guide nozzle 101 is rectangular in shape, and its inner area is consistent with the size of the semiconductor network communication chip to be planted, thus ensuring that after the chip is fed into the inner cavity of the ball-planting box 1, the chip can be effectively positioned according to the guide nozzle 101. In this embodiment, the guide nozzle 101 is mainly fixedly connected to the ball-planting box 1. In practical applications, a detachable fixing method is preferred, so that different sizes of chips can be accommodated for ball-planting by changing different guide nozzles 101. A ball groove 11 communicating with the ball-planting cavity is provided at the bottom of the ball-planting box 1. The ball groove 11 is aligned with the guide nozzle 101. The ball groove 11 is preferably also provided on the board material for easy replacement. More detailed, combined with... Figure 6 and Figure 7 It can be seen that the ball groove 11 is a stepped through hole, and the stepped area is arc-shaped, which corresponds to the solder ball. The solder ball is like... Figure 7The black-filled area is shown. A rubber ring 110 is preferably fixedly connected to the arc-shaped stepped area. When the solder ball is pressed into the ball groove 11, the rubber ring 110 not only compresses and limits the solder ball, but also, due to the contact between the solder ball and the rubber ring 110, prevents the external area from communicating with the inner cavity of the ball-planting box 1. Correspondingly, from... Figure 3 , Figure 6 and Figure 7 It can be seen that a cylinder 18 is fixedly installed on the back of the ball-mounting box 1, and a pin plate 17 is fixedly installed on the output end of the cylinder 18. The pin plate 17 can only perform unidirectional reciprocating motion. The cylinder 18 is connected to an air pump through a solenoid valve. The air pump controls the cylinder 18, thereby causing the cylinder 18 to drive the pin plate 17 to push / remove into the ball groove 11. After the pin plate 17 extends into the ball groove 11, it can push the solder ball back into the ball-mounting cavity of the ball-mounting box 1. During this process, the chip is placed on one side of the ball groove 11, and the solder ball can be moved towards the chip by the push of the pin plate 17.

[0035] As the focus of this implementation, combined with Figure 1 , Figure 2 and Figure 6 It can be seen that mounting brackets, secured with bolts, are fixedly installed on both sides of the ball-planting box 1. These brackets allow the ball-planting box 1 to be tilted, with the tilt angle ranging from 10° to 90°. The advantage of this design is that when the ball-planting box 1 is tilted, the solder balls stored inside can accumulate at the bottom under the influence of gravity. Based on this, from... Figure 2 and Figure 3 It can be seen that a scraper motor 13 is fixedly installed at the bottom of the ball planting box 1, located on one side above the ball groove 11. A scraper claw 12, located in the ball planting cavity, is fixedly installed on the rotating shaft of the scraper motor 13. The scraper claw 12 is L-shaped. Thus, when the control center unit 3 intelligently controls the scraper motor 13, the scraper motor 13 drives the scraper claw 12 to rotate counterclockwise, with the direction referenced... Figure 2 When the scraper claw 12 rotates, it can scoop up the solder balls in the ball placement cavity. As the scraper claw 12 continues to rotate, the solder balls are guided along the scraper claw 12 and flow along the surface of the ball groove 11. When the solder balls pass through the ball groove 11, some of them can directly enter the ball groove 11, so that each ball groove 11 can accommodate one solder ball.

[0036] More importantly, combining Figure 1It can be seen that the surface of the planting box 1 has a stop cover 6 installed horizontally guided by a dovetail track, and the stop cover 6 can move horizontally back and forth along the track. The stop cover 6 and the top of the guide nozzle 101 are sealed, for example, by a sealing ring on the top of the guide nozzle 101. Thus, when the stop cover 6 moves above the guide nozzle 101, it can effectively seal the guide nozzle 101, ensuring that the planting cavity of the planting box 1 can only communicate with the outside through the ball groove 11. Furthermore, from... Figure 1 and Figure 5 It can be clearly seen that a servo motor 7, which is electrically connected to the control center unit 3, is fixedly installed on the side of the ball planting box 1, and a lead screw 8, which is threadedly connected to the stop cover 6, is fixedly installed on the output shaft of the servo motor 7. When the control center unit 3 controls the servo motor 7 to rotate forward and backward, the lead screw 8 can be used to push the stop cover 6 to move left and right along the track.

[0037] from Figure 2 and Figure 3 It can be seen that a one-way air inlet valve 2 is fixedly installed on the top of the ball planting box 1 and communicates with the top of the ball planting cavity. The one-way air inlet valve 2 is connected to the air pump through the solenoid valve. During the arrangement of solder balls, when the baffle cover 6 blocks the guide nozzle 101, the airflow is blown into the ball planting cavity from the one-way air inlet valve 2 and finally flows outward in one direction from the ball groove 11.

[0038] In practical application of this embodiment, the bulb planting box 1 is fixedly installed in the required area using a mounting bracket. The servo motor 7 is intelligently controlled by the control center unit 3, causing the stop cover 6 to block the guide nozzle 101. At this time, the bulb planting chamber of the bulb planting box 1 is only connected to the outside via the ball groove 11. Then, the control center unit 3 regulates the solenoid valve to allow the air pump to input continuous airflow into the bulb planting chamber of the bulb planting box 1 through the one-way air inlet valve 2. The airflow enters the bulb planting chamber from the one-way air inlet valve 2 and then exits from the ball groove 11.

[0039] Subsequently, the control center unit 3 regulates the scraper motor 13 to drive the scraper claw 12 to rotate. During the counterclockwise rotation of the scraper claw 12, it scoops up the solder balls in the ball-planting cavity. As the scraper claw 12 continuously deflects upward counterclockwise, the solder balls flow down along the scraper claw 12 and from above the ball groove 11. During this process, the solder balls flow down the ball-planting cavity under the action of gravity and enter the ball groove 11 when passing through it. On the other hand, since the airflow also exits from the ball groove 11, the solder balls are guided by the airflow as they flow along the ball-planting cavity, allowing them to flow more accurately into the ball groove 11. At this point, the solder balls have entered the ball groove 11, but because the stepped area in the middle of the ball groove 11 is provided with a rubber ring 110, the solder balls are blocked by the rubber ring 110, and part of the solder balls will still protrude from the ball groove 11. When the scraper claw 12 sweeps across the ball groove 11, a bevel is provided on one side of the scraper claw 12. As the scraper claw 12 sweeps across the ball groove 11, the solder ball will completely enter the ball groove 11. By applying pressure to the solder ball, the solder ball is forced to be in the rubber ring 110. The outer part of the solder ball is wrapped by the rubber ring 110, thereby relatively completely blocking the ball groove 11 and making it impossible for the ball placement cavity to communicate with the outside.

[0040] Finally, after the balls are placed on the ball groove 11, the control center unit 3 stops the air pump from supplying air to the one-way air inlet valve 2, and the control center unit 3 stops the scraper motor 13 from working. Under the action of gravity, the scraper claw 12 will deflect downward, so that the scraper claw 12 will not block the ball groove 11. Next, the control center unit 3 controls the servo motor 7 to drive the lead screw 8 to rotate, causing the stop cover 6 to move away from the guide nozzle 101. Then, the robot arm uses a suction cup to send the solder paste-printed chip from the guide nozzle 101 into the ball-placement cavity. During this process, the guide nozzle 101 guides the chip so that the chip entering the ball-placement cavity corresponds exactly to the ball groove 11, and the chip is attached to one side of the ball groove 11. Then, the control center unit 3 controls the air pump to supply air to the cylinder 18 through the solenoid valve. The cylinder 18 pushes the needle plate 17 to move towards the back of the ball-placement box 1. When the needle plate 17 passes through the ball groove 11, it can press the solder ball in the ball groove 11 onto the chip. The solder ball is attracted by the solder paste on the chip, so that the solder ball and the chip are connected. Finally, the chip with the solder ball is discharged from the guide nozzle 101 and enters the subsequent hot air blowing process. The control center unit 3 uses the servo motor 7 to make the stop cover 6 close the guide nozzle 101 again, and then repeats the above process to arrange the solder balls.

[0041] Example 2 is a further improvement on Example 1, from... Figure 2 and Figure 6It can be seen that a ball collecting seat 14 is installed in the ball collecting box 1 in a sealed and movable manner. The ball collecting seat 14 can only move up and down along the inner side of the ball collecting box 1. The top of the ball collecting seat 14 is arc-shaped, and the center point of the arc coincides with the central axis of the ball scraping motor 13. In this way, after the solder balls fall into the top of the ball collecting seat 14, they will be gathered, and after the ball scraping claw 12 passes through the ball collecting seat 14, it can scrape up the solder balls to a greater extent.

[0042] Furthermore, a spring is installed between the bottom of the ball collecting seat 14 and the bottom of the inner side of the ball planting box 1. The bottom of the ball collecting seat 14, located within the inner cavity of the ball planting box 1, is designated as a damping cavity, and the spring is located within this cavity. The bottom of the ball planting box 1 is provided with a damping hole 4 communicating with the damping cavity and a one-way return air valve 5. The one-way return air valve 5 enables unidirectional airflow from the outside into the damping cavity. Additionally, a position detection switch 16 is fixedly installed at the bottom of the ball planting box 1. When the ball collecting seat 14 descends along the ball planting box 1 to the bottom, it will touch the position detection switch 16. At this time, there is also a certain distance between the solder balls gathered above the ball collecting seat 14 and the scraping claw 12.

[0043] The advantage of this design in Embodiment 2 is that when airflow is supplied into the ball-planting cavity through the one-way air inlet valve 2, the ball-laying method in Embodiment 1 is achieved. At the same time, when the air pressure in the ball-planting cavity of the ball-planting box 1 increases, the ball-collecting seat 14 will tend to move downward. The bottom of the ball-collecting seat 14 will squeeze the damping cavity and cause the airflow to slowly discharge outward from the damping hole 4, thereby ensuring that the ball-collecting seat 14 moves slowly downward along the ball-planting box 1.

[0044] As the ball holder 14 slowly descends, it gradually moves away from the scraper claw 12. During this process, the scraper claw 12 rotates continuously, causing the solder balls gathered above the ball holder 14 to flow from the surface of the ball groove 11. When the ball holder 14 moves the solder balls downwards and no longer contacts the scraper claw 12, it continues to descend and approach the positioning detection switch 16. During this process, the scraper motor 13 drives the scraper claw 12 to continue rotating, thereby throwing out excess solder balls. The solder balls eventually fall above the ball holder 14. At this point, the area above the ball placement cavity in the ball placement box 1 only retains the solder balls from the ball groove 11, ensuring that no other solder balls in the ball placement cavity interfere with the chip placement process when the chip is subsequently pressed onto the ball groove 11.

[0045] More importantly, as the ball collector 14 descends and contacts the positioning detection switch 16, the positioning detection switch 16 closes the solenoid valve, preventing airflow from entering the ball-planting cavity in the ball-planting box 1. Afterwards, the ball collector 14, pushed by the spring, tends to move upwards. Since the ball groove 11 contains solder balls and prevents communication between the ball-planting cavity and the outside, the ball-planting cavity is essentially a sealed chamber. Therefore, during the upward movement of the ball collector 14, the air pressure in the ball-planting cavity remains at a certain level, preventing the ball collector 14 from rising further. Thus, by detecting changes in the air pressure within the ball-planting cavity of the ball-planting box 1, it can be determined whether the ball groove 11 is in a sealed state. For more details, combine... Figure 1 and Figure 2 It can be seen that a pressure sensor is fixedly installed on the top of the ball-planting box 1, located on one side of the one-way air inlet valve 2. This sensor is connected to the control center unit 3. The pressure sensor can effectively determine the pressure change in the ball-planting cavity, thereby determining whether the ball groove 11 is properly ball-planted. Specifically, if the pressure sensor detects that the pressure in the ball-planting cavity remains unchanged, it means that the ball groove 11 has been completely filled with solder balls; otherwise, there may be missed areas, and the balls need to be placed again.

[0046] This third embodiment, as a supplement to the second embodiment, serves as another method for detecting whether the implantation cavity leaks using time, combined with... Figure 2 and Figure 5 It can be seen that a locking frame 15 is fixedly installed at the bottom of the ball collecting seat 14, and an "L"-shaped groove is opened on the inner side of the locking frame 15. Correspondingly, a limiting shaft 10 is fixedly installed at one end of the stop cover 6, and a guide sealing cover 9 is movably installed on the surface of the ball planting box 1. Thus, when the limiting shaft 10 drives the guide sealing cover 9 to move left and right along the ball planting box 1, the damping cavity in the ball planting box 1 will not communicate with the outside through the surface area of ​​the ball planting box 1.

[0047] In practical applications, the limiting shaft 10 is inserted into the "L"-shaped groove of the locking frame 15. By inserting the limiting shaft 10 into different areas, the limiting shaft 10 can be restricted to move horizontally along the ball planting box 1.

[0048] Under normal conditions, the limiting shaft 10 is located on the left side of the locking frame 15, that is... Figure 2 As shown in the state, the locking frame 15 restricts the movement of the limiting shaft 10 from moving left and right. As the pressure in the ball-planting cavity above the ball-planting box 1 increases, when the ball-collecting seat 14 contacts the positioning detection switch 16, the limiting shaft 10 has entered the corner of the "L" shaped groove. At this time, the locking frame 15 will no longer restrict the movement of the limiting shaft 10 from moving left and right.

[0049] In this way, when the ball holder 14 contacts the positioning detection switch 16, the control center unit 3 controls the servo motor 7 to start after a delay. During this delay, if the ball groove 11 has a defect of missing solder balls, the ball holder 14 will push the locking frame 15 upward, thereby causing the limiting shaft 10 to disengage from the corner of the "L"-shaped groove and restricting the left and right movement of the limiting shaft 10 again. If the position of the ball holder 14 changes after the delay timer stops, the guide nozzle 101 will not open when the servo motor 7 drives the stop cover 6 to open the guide nozzle 101. Similarly, if there is no defect in the ball placement in the ball groove 11, the guide nozzle 101 can open. Ultimately, this ensures that the guide nozzle 101 can only open normally when the balls are properly placed in the ball groove 11.

[0050] It should be noted that the horizontal groove inside the locking frame 15 has a certain width, so that the corner of the "L" shaped groove is within a certain range, thereby ensuring that when the ball collecting seat 14 moves upward and squeezes the air in the ball planting cavity of the ball planting box 1, the limiting shaft 10 is still in the corner area.

[0051] Furthermore, as the minimum setting for the delayed start time of the servo motor 7, the ball groove 11 can be blocked first, while one of them remains connected. Then, when the ball holder 14 moves to the position detection switch 16, the timing starts to determine when the ball holder 14 can move up to the initial state. This is used as the minimum limit for the delayed start time, thereby ensuring that the device can perform detection even if only one ball groove 11 is not filled with solder balls.

[0052] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A network communication chip processing device, characterized in that, include: The ball-planting box (1) has a control center unit (3) for regulating the whole machine installed on its surface, and a ball-planting cavity for accommodating solder balls is opened inside. A ball groove (11) communicating with the ball-planting cavity is opened at the bottom. The scraper motor (13) is fixed at the bottom of the ball-planting box (1) and located on one side above the ball groove (11). The scraper claw (12) is fixedly installed on the rotating shaft of the scraper motor (13). When the scraper motor (13) drives the scraper claw (12) to rotate, the scraper claw (12) scoops up the solder balls in the ball-planting cavity and pours them into the ball groove (11). The solder balls flow along the surface of the ball groove (11) under gravity, thus realizing the movement of the solder balls into the ball groove (11). One-way air inlet valve (2) is fixed on the top of the ball planting box (1) and connected to the air pump. After the airflow is blown into the ball planting cavity from the one-way air inlet valve (2), the airflow is discharged outward from the ball groove (11). The airflow path guides the solder ball, so that the solder ball moves towards the ball groove (11).

2. The network communication chip processing equipment according to claim 1, characterized in that, The ball planting box (1) has a guide nozzle (101) on one side of its surface that communicates with the ball planting cavity, and the ball groove (11) is aligned with the guide nozzle (101).

3. The network communication chip processing equipment according to claim 2, characterized in that, The ball groove (11) is a stepped through hole, and the stepped area is arc-shaped. The arc-shaped stepped area is fixedly connected with a rubber ring (110).

4. The network communication chip processing equipment according to claim 2 or 3, characterized in that, A cylinder (18) is fixedly installed on the back of the ball planting box (1), and a needle plate (17) is fixedly installed at the output end of the cylinder (18). The cylinder (18) drives the needle plate (17) to move, so that the needle plate (17) is pushed into / released from the ball groove (11).

5. The network communication chip processing equipment according to claim 4, characterized in that, The planting box (1) is fixedly installed on both sides with mounting brackets, which can tilt the planting box (1).

6. The network communication chip processing equipment according to claim 5, characterized in that, The surface of the ball planting box (1) has a stop cover (6) installed by a horizontal guide rail. The stop cover (6) and the top of the guide nozzle (101) are movably sealed. A servo motor (7) is fixedly installed on the side of the ball planting box (1), and the output shaft of the servo motor (7) is fixedly installed with a screw (8) that is threadedly connected to the stop cover (6).

7. The network communication chip processing equipment according to claim 6, characterized in that, A ball collecting seat (14) is installed in the ball planting box (1) in a sealed and movable manner. A spring is installed between the bottom of the ball collecting seat (14) and the bottom of the inner side of the ball planting box (1). The bottom of the ball collecting seat (14) and the area inside the ball planting box (1) are set as a damping cavity. A damping hole (4) and a one-way return air valve (5) are provided at the bottom of the ball planting box (1) and communicate with the damping cavity. The one-way return air valve (5) enables the external airflow to flow unidirectionally into the damping cavity. A position detection switch (16) is fixedly installed at the bottom of the ball planting box (1).

8. The network communication chip processing equipment according to claim 7, characterized in that, A pressure sensor is fixedly installed on the top of the planting box (1) on one side of the one-way air inlet valve (2).

9. The network communication chip processing equipment according to claim 7 or 8, characterized in that, A locking frame (15) is fixedly installed at the bottom of the ball collecting seat (14), and an "L"-shaped groove is opened on the inner side of the locking frame (15). A limiting shaft (10) inserted into the "L"-shaped groove is fixedly installed at one end of the stop cover (6), and a guide sealing cover (9) is movably installed on the surface of the ball planting box (1).

10. A method for fabricating a network communication chip, using the network communication chip fabrication equipment as described in claim 6, characterized in that, Includes the following steps: S1. The control center unit (3) regulates the servo motor (7) to drive the baffle cover (6) to block the guide nozzle (101), so that the ball planting cavity of the ball planting box (1) is connected to the outside only through the ball groove (11); S2. The control center unit (3) regulates the electromagnetic valve so that the air pump inputs continuous airflow into the ball planting cavity through the one-way air inlet valve (2), and the airflow is discharged outward from the ball groove (11); S3. The control center unit (3) regulates the scraper motor (13) to drive the scraper claw (12) to rotate and scrape up the solder ball in the ball-planting cavity. Under the combined guidance of gravity and airflow, the solder ball flows along the scraper claw (12) and enters the ball groove (11). S4. The control center unit (3) stops the air pump supply and the scraper motor (13) from working, and the scraper claw (12) deflects downward under the action of gravity. S5. The control center unit (3) regulates the servo motor (7) to drive the stop cover (6) away from the guide nozzle (101) via the lead screw (8). The robot arm sends the chip printed with solder paste into the ball-planting cavity through the guide nozzle (101), so that the chip is aligned with the ball groove (11) and attached to one side of the ball groove (11). S6. The control center unit (3) regulates the electromagnetic valve to supply air to the cylinder (18) by the air pump. The cylinder (18) pushes the needle plate (17) through the ball groove (11) and pushes the solder ball in the ball groove (11) to the solder paste on the chip, so that the solder ball is connected to the chip. S7. After the chip is loaded, it is discharged from the guide nozzle (101). The control center unit (3) regulates the servo motor (7) to make the stop cover (6) block the guide nozzle (101) again, and returns to step one to execute the cycle.

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